Solid State Relay

The vertical arrangement of power and control modules with via-in-pad structure and conductive pillars in the solid state relay addresses space utilization and parasitic inductance issues, enhancing assembly efficiency and service life through reduced area occupation and improved current transmission.

JP3256106UActive Publication Date: 2026-06-05TOWARD TECHNOLOGIES INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Utility models
Current Assignee / Owner
TOWARD TECHNOLOGIES INC
Filing Date
2026-01-19
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Conventional solid state relays face challenges in optimizing their shape and reducing parasitic inductance while ensuring efficient space utilization and assembly convenience.

Method used

The solid state relay features a vertical arrangement of power and control modules on separate circuit boards, utilizing a via-in-pad structure and conductive pillars to reduce area occupation and parasitic inductance, with a conductive layer or filled via for conductivity, and a housing or glue material for insulation and heat dissipation.

Benefits of technology

This design reduces the occupied area, enhances assembly efficiency, and extends service life by facilitating easier stacking, assembly, and maintenance, while significantly minimizing parasitic inductance and improving current transmission efficiency.

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Abstract

This invention provides a solid-state relay whose volume and circuit layout meet the space utilization requirements of the operating environment, and which can effectively reduce parasitic inductance. [Solution] The solid-state relay comprises a power module, a control module, and a connecting component. The power module includes a first circuit board, at least one power element, and a plurality of conductive pads. The power element and the conductive pads are electrically connected and arranged on opposing surfaces of the first circuit board. The control module includes a second circuit board and control elements, the control elements being electrically connected and arranged on the second circuit board. The connecting component is electrically connected to the first and second circuit boards, penetrates the first and second circuit boards, and the second circuit board is supported above the first circuit board by the connecting component.
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