Thermosetting resin composition, thermosetting resin sheet, electronic component, and electronic device

Abstract

Provided are: a thermosetting resin composition, for use in an organic material suited to high frequency use, that has outstanding low dielectric tangent, heat resistance, flexibility, and ease of workability; a thermosetting resin sheet; an electronic component; and an electronic device. The present invention is a thermosetting resin composition that includes the following constituents (A1)–(C). (A1) Polyimide resin: a polyimide resin including a diamine residue with formula (8) and / or formula (9) (in formula (8), a, b, c, and d are integers 1 or greater that meet the conditions a + b = 6–17 and c + d = 8–19, and the dashed lines denote carbon–carbon single bonds or carbon–carbon double bonds) (in formula (9), e, f, g, and h are integers 1 or greater that meet the conditions e + f = 5–16 and g + h = 8–19, and the dashed lines denote carbon–carbon single bonds or carbon–carbon double bonds). (B) Phenylene ether resin: a phenylene ether resin that has a number average molecular weight of 500–5000 and, at a terminal of a molecular chain, includes at least one cross-linked functional group selected from the group consisting of a phenolic hydroxyl group, an acryl group, a vinyl group, and an epoxy group. (C) Maleimide resin: a maleimide resin.

Description

[Technical field]

[0001] The present invention relates to a thermosetting resin composition, a thermosetting resin sheet, an electronic component, and an electronic device. [Background technology]

[0002] Currently, the amount of data communication worldwide is increasing year by year, and data processing methods are becoming more complex with the practical application of AI and big data. For this reason, it is essential to improve data communication speeds and data processing speeds, and increasing the communication frequency and the frequency of signals within electronic devices is being considered as one solution. There are various measures to deal with the high frequencies of electronic devices that actually handle data, such as the electrical properties of materials, circuit design, and signal processing methods, but it is particularly effective to reduce the dielectric tangent of organic materials used as insulating layers and protective layers.

[0003] On the other hand, conventional organic materials, particularly thermosetting resins that are highly durable and easy to process, contain many polar functional groups that exert intermolecular cohesive forces and adhesive properties, which results in a relatively large dielectric tangent, making it difficult to support high frequencies.

[0004] In response to this, the following methods have been proposed: (1) a method of blending a thermosetting resin with a thermoplastic resin having few polar functional groups as the main component (Patent Document 1), (2) a method of using a thermosetting resin that does not leave any polar functional groups after the reaction (Patent Document 2), and (3) a method of blending inorganic particles with a low dielectric tangent (Patent Document 3). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2004-161828 A [Patent Document 2] JP 2003-252957 A [Patent Document 3] JP 2002-100238 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, method (1) has problems with heat resistance and adhesive strength, for example, as shown by dynamic viscoelasticity measurement. Methods (2) and (3) have problems with low film strength before and after curing, limiting the applications and conditions in which they can be used in terms of flexibility and strength and elongation. Furthermore, method (3) limits the fine processing of via holes and the like due to the inorganic particles. In other words, no conventional technology has been found that satisfies low dielectric tangent, heat resistance, flexibility, and ease of processing.

[0007] Therefore, an object of the present invention is to solve the above problems and to provide a thermosetting resin composition that is used in organic materials suitable for high frequencies and has low dielectric tangent, excellent heat resistance, flexibility, and ease of processability, as well as a thermosetting resin sheet, electronic component, and electronic device each using the same. [Means for solving the problem]

[0008] In order to solve the above problems, the present inventors conducted extensive research into a thermosetting resin composition having good characteristics at high frequencies, and as a result, they found that a highly reliable thermosetting resin composition having low dielectric tangent, heat resistance, flexibility, and ease of processability can be obtained by combining a polyimide resin, a thermosetting resin, and a phenylene ether resin having a specific structure, thereby completing the present invention.

[0009] That is, a first aspect of the present invention is as follows.

[0010] A thermosetting resin composition comprising the following (A1), (B), and (C):

[0011] (A1) Polyimide resin: A polyimide resin containing a diamine residue of the formula (8) and / or the formula (9).

[0012] [ka]

[0013] (In formula (8), a, b, c, and d are integers of 1 or more that satisfy a+b=6 to 17 and c+d=8 to 19, and the dashed lines represent carbon-carbon single bonds or carbon-carbon double bonds.)

[0014] [ka]

[0015] (In formula (9), e, f, g, and h are integers of 1 or more that satisfy e+f=5 to 16 and g+h=8 to 19, and the dashed lines represent carbon-carbon single bonds or carbon-carbon double bonds.) (B) Phenylene ether resin: a phenylene ether resin having a number average molecular weight of 500 or more and 5,000 or less, and containing at least one crosslinkable functional group selected from the group consisting of a phenolic hydroxyl group, an acrylic group, a vinyl group, and an epoxy group at the molecular chain terminal.

[0016] (C) Maleimide resin: Maleimide resin.

[0017] Alternatively, a second aspect of the present invention is as follows.

[0018] A thermosetting resin composition comprising the following (A2), (B), and (C):

[0019] (A2) Polyimide resin: A polyimide resin containing a diamine residue of formula (1).

[0020] [ka]

[0021] (In formula (1), m represents an integer of 1 to 60. R 5 and R 6 R may be the same or different and represents an alkylene group or a phenylene group having 1 to 30 carbon atoms. 1 ~R 4 may be the same or different and represent an alkyl group having 1 to 30 carbon atoms, a phenyl group, or a phenoxy group.) (B) Phenylene ether resin: a phenylene ether resin having a number average molecular weight of 500 or more and 5,000 or less, and containing at least one crosslinkable functional group selected from the group consisting of a phenolic hydroxyl group, an acrylic group, a vinyl group, and an epoxy group at the molecular chain terminal.

[0022] (C) Maleimide resin: Maleimide resin. Effect of the Invention

[0023] The present invention can provide a thermosetting resin composition, a thermosetting resin sheet, an electronic component, and an electronic device that are used in organic materials suitable for high frequencies and have low dielectric tangent, excellent heat resistance, flexibility, and ease of processability. [Brief description of the drawings]

[0024] [Figure 1] FIG. 1 is a schematic diagram of a coplanar-fed microstrip antenna, which is a type of planar antenna. [Diagram 2] FIG. 2 is a schematic diagram showing a cross section of a semiconductor package including an IC chip (semiconductor element), rewiring, a sealing resin, and an antenna element. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] The thermosetting resin composition of the present invention contains the following (A1), (B), and (C):

[0026] (A1) Polyimide resin: a polyimide resin containing a diamine residue of formula (8) and / or formula (9) (B) Phenylene ether resin: A phenylene ether resin having a number average molecular weight of 500 or more and 5,000 or less, and containing at least one crosslinkable functional group selected from the group consisting of a phenolic hydroxyl group, an acrylic group, a vinyl group, and an epoxy group at the molecular chain terminal. (C) Maleimide resin: Maleimide resin.

[0027] The polyimide resin (A1) in the present invention is not particularly limited as long as it is a polyimide resin containing the diamine residues of formula (8) and / or formula (9), but it is preferable that it is obtained mainly by the reaction of a tetracarboxylic dianhydride with a diamine and has a tetracarboxylic dianhydride residue and a diamine residue. Here, the polyimide resin (A1) in the present invention contains the diamine residues of formula (8) and / or formula (9).

[0028] [ka]

[0029] (In formula (8), a, b, c, and d are integers of 1 or more that satisfy a+b=6 to 17 and c+d=8 to 19, and the dashed lines represent carbon-carbon single bonds or carbon-carbon double bonds.)

[0030] [ka]

[0031] (In formula (9), e, f, g, and h are integers of 1 or more that satisfy e+f=5 to 16 and g+h=8 to 19, and the dashed lines represent carbon-carbon single bonds or carbon-carbon double bonds.) The structures represented by formula (8) or (9) have a skeleton of a dimer acid, which is a dimer of an unsaturated fatty acid such as linoleic acid or oleic acid. From the viewpoint of the reliability of the resulting cured film, structures that do not contain a double bond are preferred. The structure represented by formula (10) is particularly preferred from the viewpoints of economy and the elongation of the resulting cured film.

[0032] [ka]

[0033] Specific examples of diamines having the structure represented by formula (8) include commercially available dimer diamines such as "Versamine (registered trademark)" 551 and "Versamine (registered trademark)" 552 manufactured by BASF Ltd., and "Priamine (registered trademark)" 1073, "Priamine (registered trademark)" 1074, and "Priamine (registered trademark)" 1075 manufactured by Croda Japan Ltd. Here, "Versamine (registered trademark)" 551 and "Priamine (registered trademark)" 1074 are all dimer diamine compounds containing a compound represented by formula (11), and "Versamine (registered trademark)" 552, "Priamine (registered trademark)" 1073, and "Priamine (registered trademark)" 1075 are all dimer diamine compounds containing a compound represented by formula (10).

[0034] [ka]

[0035] A mixture of trimer triamine and dimer diamine may also be used. Commercially available products of trimer triamine and dimer diamine include "Priamine (registered trademark)" 1071 manufactured by Croda Japan Co., Ltd.

[0036] In the (A1) polyimide resin, the content of the dimer acid structure in the diamine residue having the structure represented by formula (8) and / or formula (9) is preferably 1 mol% or more and 30 mol% or less, more preferably 1 mol% or more and 15 mol% or less. By making it 1 mol% or more, the relative dielectric constant and the dielectric loss tangent can be reduced. Also, by making it 30 mol% or less, the heat resistance can be increased.

[0037] Alternatively, the thermosetting resin composition of the present invention contains the following (A2), (B), and (C): (A2) Polyimide resin: a polyimide resin containing a diamine residue of formula (1) (B) Phenylene ether resin: A phenylene ether resin having a number average molecular weight of 500 or more and 5,000 or less, and containing at least one crosslinkable functional group selected from the group consisting of a phenolic hydroxyl group, an acrylic group, a vinyl group, and an epoxy group at the molecular chain terminal. (C) Maleimide resin: Maleimide resin.

[0038] The polyimide resin (A2) in the present invention is not particularly limited as long as it is a polyimide resin containing the diamine residue of formula (1), but it is preferable that it is obtained mainly by the reaction of a tetracarboxylic dianhydride with a diamine and contains a tetracarboxylic dianhydride residue and a diamine residue. Here, the polyimide resin (A2) in the present invention contains the diamine residue of the above formula (1).

[0039] [ka]

[0040] (In formula (1), m represents an integer of 1 to 60. R 5 and R 6 R may be the same or different and represents an alkylene group or a phenylene group having 1 to 30 carbon atoms. 1 ~R 4 may be the same or different and represent an alkyl group having 1 to 30 carbon atoms, a phenyl group, or a phenoxy group.) R 1 ~R 4 The alkyl group having 1 to 30 carbon atoms is not particularly limited, but a methyl group, an ethyl group, a propyl group, and a butyl group are preferable. 5 Or R 6 The alkylene group having 1 to 30 carbon atoms is not particularly limited, but a methylene group, an ethylene group, a propylene group, or a butylene group is preferable. The alkyl group and the alkylene group do not necessarily have a linear structure.

[0041] The number of bonds in the siloxane structure, that is, m in formula (1), is preferably 1 to 60, and more preferably 1 to 40. By making it 60 or less, the heat resistance can be improved.

[0042] Specific examples of diamines having the structure represented by formula (1) include 1,1,3,3-tetramethyl-1,3-bis(4-aminophenyl)disiloxane, 1,1,3,3-tetraphenoxy-1,3-bis(4-aminoethyl)disiloxane, 1,1,3,3,5,5-hexamethyl-1,5-bis(4-aminophenyl)trisiloxane, 1,1,3,3-tetraphenyl-1,3-bis(2-aminoethyl)disiloxane, 1,1,3,3-tetraphenyl-1,3-bis(2-aminoethyl)disiloxane, and 1,1,3,3-tetraphenyl-1,3-bis(2-aminoethyl)disiloxane. 1,1,5,5-tetraphenyl-3,3-dimethyl-1,5-bis(3-aminopropyl)trisiloxane, 1,1,5,5-tetraphenyl-3,3-dimethoxy-1,5-bis(4-aminobutyl)trisiloxane, 1,1,5,5-tetraphenyl-3,3-dimethoxy-1,5-bis(5-aminopentyl)trisiloxane, 1,1,3,3-tetramethyl-1,3-bis(2-aminoethyl)disiloxane, 1,1 ,3,3-Tetramethyl-1,3-bis(3-aminopropyl)disiloxane, 1,1,3,3-tetramethyl-1,3-bis(4-aminobutyl)disiloxane, 1,3-dimethyl-1,3-dimethoxy-1,3-bis(4-aminobutyl)disiloxane, 1,1,5,5-tetramethyl-3,3-dimethoxy-1,5-bis(2-aminoethyl)trisiloxane, 1,1,5,5-tetramethyl-3,3-dimethoxy-1,5-bis(4-aminobutyl)trisiloxane Examples of diamines include, but are not limited to, 1,1,5,5-tetramethyl-3,3-dimethoxy-1,5-bis(5-aminopentyl)trisiloxane, 1,1,3,3,5,5-hexamethyl-1,5-bis(3-aminopropyl)trisiloxane, 1,1,3,3,5,5-hexaethyl-1,5-bis(3-aminopropyl)trisiloxane, 1,1,3,3,5,5-hexapropyl-1,5-bis(3-aminopropyl)trisiloxane, etc. Examples of products corresponding to these diamines include LP7100, PAM-E, KF8010, X-22-161A, X-22-161B, KF8012, KF8008, etc. manufactured by Shin-Etsu Chemical Co., Ltd.

[0043] When the (A2) polyimide resin contains a diamine residue of formula (1), the content of the siloxane structure of formula (1) is preferably 20 mol% or more and 80 mol% or less, more preferably 30 mol% or more and 70 mol% or less. By making it 20 mol% or more, the number of structures with low polarity increases, and the relative dielectric constant and dielectric loss tangent can be reduced. Also, by making it 80 mol% or less, the elastic modulus at high temperatures can be improved, and heat resistance can be increased.

[0044] The polyimide resin is preferably the polyimide resin (A1) and the polyimide resin (A2). By containing the diamine residues of the formula (1) and the formula (8) and / or the formula (9), the relative dielectric constant and the dielectric loss tangent can be further reduced.

[0045] It is preferred that the (A2) polyimide resin contains 20 to 80 mol % of diamine residues of formula (1) in 100 mol % of all diamine residues in the polyimide, and contains 1 to 30 mol % of the total of diamine residues of formulas (8) and (9) in 100 mol % of all diamine residues in the (A1) polyimide.

[0046] The imide group equivalent of the polyimide resin (A1) and the polyimide resin (A2) is preferably 350 or more and 1000 or less. More preferably, it is 380 or more and 900 or less. The imide group equivalent after imidization is preferably in the range of 350 or more and 1000 or less. The imide group equivalent is the molecular weight per mole of imide group in the polyimide resin. The imide group equivalent is calculated in units from the molecular weights of the tetracarboxylic dianhydride and the diamine. For example, in the case of a polyimide resin represented by the following formula (2), 2 moles of imide group exist per unit, and the molecular weight of the polyimide resin is 684.71, so the imide group equivalent is 342.36. By making the imide group equivalent of the polyimide resin (A1) and the polyimide resin (A2) 350 or more, the imide group concentration is reduced, and the polarity is reduced, so that the dielectric loss tangent can be reduced. In addition, by making the imide group equivalent of 1000 or less, the heat resistance can be improved due to the molecular aggregation effect of the imide group.

[0047] [ka]

[0048] The polyimide resin (A1) and the polyimide resin (A2) preferably have a diamine residue having a structure represented by formula (3). In formula (3), R 7 and R 8 may be the same or different and represent an alkyl group, an alkoxy group, a fluoroalkyl group, a phenyl group, or a phenoxy group having 1 to 30 carbon atoms.

[0049] [ka]

[0050] By containing the diamine residue having the structure represented by formula (3) in the polyimide resin (A1) and the polyimide resin (A2), the structure has a high linearity and becomes rigid, and the mechanical strength of the resin is increased. From the viewpoint of improving the mechanical strength, the content of the diamine residue having the structure represented by formula (3) is preferably 30 mol % or more of the total diamine residues, and more preferably 40 mol % or more. Also, from the viewpoint of improving the adhesion and improving the adhesive strength with metals such as copper, it is preferably 70 mol % or less, and more preferably 60 mol % or less. R 7 and R 8 is not particularly limited as long as it is an alkyl group, an alkoxy group, a fluoroalkyl group, a phenyl group, or a phenoxy group having 1 to 30 carbon atoms. Among these, R 7 and R 8is preferably a trifluoromethyl group. The trifluoromethyl group has a large atomic radius of fluorine and has the effect of expanding the free volume, so that the relative dielectric constant and the dielectric loss tangent can be reduced. Specific examples of the diamine represented by formula (3) include 2,2'-bis(trifluoromethyl)benzidine, 2,2'-dimethylbiphenyl-4,4'-diamine, 2,2'-diethylbiphenyl-4,4'-diamine, 2,2'-dimethoxybiphenyl-4,4'-diamine, and 2,2'-diethoxybiphenyl-4,4'-diamine, but are not limited thereto.

[0051] The glass transition temperature (hereinafter sometimes referred to as Tg) of the polyimide resin (A1) and the polyimide resin (A2) is preferably 100°C or higher and 200°C or lower, more preferably 110°C or higher and 180°C or lower. By setting the Tg at 100°C or higher, the heat resistance is improved, and peeling during the solder reflow process can be prevented. By setting the Tg of the polyimide resin (A1) and the polyimide resin (A2) at 200°C or lower, the heat / pressure flowability of the thermosetting composition before curing is improved, and the adhesion to the substrate can be improved. The Tg referred to in the present invention is calculated from the peak value of tan δ when a test piece obtained by molding the polyimide resin or the thermosetting resin composition to a thickness of about 20 to 100 μm and heat curing it at a predetermined temperature is measured using a dynamic viscoelasticity measuring device in a tensile mode under the conditions of a frequency of 1 Hz and a heating rate of 5°C / min.

[0052] The polyimide resin (A1) and the polyimide resin (A2) preferably contain an acid dianhydride residue represented by the following formula (4). Such an acid dianhydride residue has a large molecular weight, which can reduce the imide group concentration of the polyimide resin, and has an alicyclic structure, which can reduce polarity and therefore can reduce the relative dielectric constant and dielectric loss tangent. Furthermore, the presence of an alicyclic structure can suppress molecular motion and improve heat resistance. From the viewpoint of reducing the relative dielectric constant and dielectric loss tangent, the acid dianhydride residue represented by the following formula (4) is preferably 50 mol % or more, and more preferably 70 mol % or more, of the total acid dianhydride residues.

[0053] [ka]

[0054] In the present invention, the weight average molecular weight of the polyimide resin (A1) and the polyimide resin (A2) is preferably 5,000 or more and 1,000,000 or less. When two or more kinds of polyimide resins are contained, it is sufficient that the weight average molecular weight of at least one of them is within the above range. If the weight average molecular weight is 5,000 or more, the decrease in mechanical strength is less, and the decrease in adhesive strength is less. It is preferably 10,000 or more. On the other hand, if the weight average molecular weight is 1,000,000 or less, the melt viscosity during heating does not become high, and the decrease in adhesive strength is less. It is preferably 500,000 or less. The weight average molecular weight in the present invention is measured by gel permeation chromatography (GPC) and calculated in terms of polystyrene.

[0055] The polyimide resin in the present invention may contain, in addition to the above diamine residues, other diamine residues to the extent that the effects of the present invention are not impaired. For example, diamines containing one benzene ring such as 1,4-diaminobenzene, 1,3-diaminobenzene, 2,4-diaminotoluene, and 1,4-diamino-2,5-dihalogenobenzene; diamines containing two benzene rings such as bis(4-aminophenyl)ether, bis(3-aminophenyl)ether, bis(4-aminophenyl)sulfone, bis(3-aminophenyl)sulfone, bis(4-aminophenyl)methane, bis(3-aminophenyl)methane, bis(4-aminophenyl)sulfide, bis(3-aminophenyl)sulfide, 2,2-bis(4-aminophenyl)propane, 2,2-bis(3-aminophenyl)propane, 2,2-bis(4-aminophenyl)hexafluoropropane, o-dianisidine, o-tolidine, and tolidinesulfonic acids; 1,4-bis(4-aminophenoxy)benzene Examples of the diamine residue include diamines containing three benzene rings such as 1,4-bis(3-aminophenoxy)benzene, 1,4-bis(4-aminophenyl)benzene, 1,4-bis(3-aminophenyl)benzene, α,α'-bis(4-aminophenyl)-1,4-diisopropylbenzene, and α,α'-bis(4-aminophenyl)-1,3-diisopropylbenzene, and diamines containing four or more benzene rings such as 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, 2,2-bis[4-(4-aminophenoxy)phenyl]sulfone, 4,4'-(4-aminophenoxy)biphenyl, 9,9-bis(4-aminophenyl)fluorene, and 5,10-bis(4-aminophenyl)anthracene. However, examples of the diamine residue are not limited to these.

[0056] In addition to the above-mentioned acid dianhydride residues, the polyimide resin in the present invention may contain other acid dianhydride residues to the extent that the effects of the present invention are not impaired. The acid dianhydride residues contained are not particularly limited, and examples thereof include pyromellitic anhydride (PMDA), oxydiphthalic dianhydride (ODPA), 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride (DSDA), 2,2'-bis[(dicarboxyphenoxy)phenyl]propane dianhydride (BSAA), 4,4'-hexafluoroisopropylidenediphthalic anhydride (6FDA), and 1,2-ethylenebis(anhydrotrimellitate) (TMEG). Examples of acid dianhydride residues are not limited to these.

[0057] The method for producing the polyimide resin (A1) and the polyimide resin (A2) is not particularly limited, but a method is preferred in which, by utilizing the good solubility of the dimer acid structure and the siloxane structure, an acid anhydride monomer and a diamine monomer are dissolved and mixed in an appropriate solvent by a conventional method, reacted, and then synthesized by thermal ring closure or chemical ring closure.

[0058] Among the above, the tetracarboxylic dianhydride residues and diamine residues preferably have a structure that (1) has few benzene rings, (2) has a large molecular weight and is bulky, or (3) has low polarity such as an aliphatic group or a siloxane group. By having such a structure, the concentration of imide groups with high polarity can be reduced, and the free volume between molecular chains can be increased, thereby reducing the relative dielectric constant and dielectric loss tangent.

[0059] The polyimide resin in the present invention may be composed only of polyimide structural units, or may be a copolymer having other structures as copolymerization components in addition to the polyimide structural units. It may also contain a precursor of the polyimide structural unit (polyamic acid structure). It may also be a mixture of these. Furthermore, any of these may be mixed with a polyimide resin represented by another structure. When a polyimide resin represented by another structure is mixed, it is preferable that the polyimide resin in the present invention is contained in an amount of 50 mol % or more. The type and amount of the structure used for copolymerization or mixing are preferably selected within a range that does not impair the effects of the present invention.

[0060] The synthesis method of the (A1) polyimide resin and (A2) polyimide resin used in the present invention is not particularly limited, and they are synthesized by a known method using a diamine and a tetracarboxylic dianhydride. For example, (1) a method of reacting a tetracarboxylic dianhydride with a diamine compound (which may be partially substituted with an aniline derivative) at low temperature, (2) a method of reacting a tetracarboxylic dianhydride with an alcohol to obtain a diester, and then reacting it with a diamine (which may be partially substituted with an aniline derivative) in the presence of a condensing agent, or (3) a method of reacting a tetracarboxylic dianhydride with an alcohol to obtain a diester, and then converting the remaining two carboxyl groups into acid chlorides and reacting them with a diamine (which may be partially substituted with an aniline derivative), to obtain a polyimide precursor, which can be synthesized by a known imidization method.

[0061] When applied to a thermosetting composition, it may be added in the form of a polyamic acid and imidized during heat curing, or it may be imidized after polymerization of the polyamic acid and added as an already-closed ring structure.

[0062] The content of the polyimide resin in the thermosetting composition of the present invention is preferably 30% by weight or more and less than 90% by weight, more preferably 40% by weight or more and 80% by weight or less, based on 100% by weight of the thermosetting composition. By making it 30% by weight or more, the amount of the polymer component increases, thereby improving flexibility. By making it 90% by weight or less, the amount of the thermosetting resin component increases, thereby lowering the melt viscosity during hot pressing, and improving the adhesive strength of the adhesive composition to the laminate.

[0063] The thermosetting resin composition of the present invention contains a phenylene ether resin (B), which is a phenylene ether resin having a number average molecular weight of 500 or more and 5000 or less, and containing at least one crosslinkable functional group selected from the group consisting of a phenolic hydroxyl group, an acrylic group, a vinyl group, and an epoxy group at the molecular chain end. The phenylene ether resin referred to in the present invention is not particularly limited as long as it is a resin in which the structure represented by formula (5) is repeatedly contained in the resin structure, but is preferably an embodiment in which the structure represented by formula (5) is contained multiple times in the resin structure, and is particularly preferably an embodiment in which the structure represented by formula (5) is contained most frequently as the number of repeating units in the resin structure. Note that the phenylene ether resin referred to in the present invention may be a copolymer with other structures as long as it is a resin in which the structure represented by formula (5) is contained in the resin structure.

[0064] [ka]

[0065] In formula (5), R 9 ~R 12 may be the same or different and represent a hydrogen atom, a halogen atom, or an alkyl group, alkoxy group, fluoroalkyl group, phenyl group, or phenoxy group having 1 to 30 carbon atoms.

[0066] The (B) phenylene ether resin alone exhibits a low dielectric tangent, and by adding it to a thermosetting resin composition, it has the effect of reducing the dielectric tangent. The number average molecular weight of the (B) phenylene ether resin is 500 or more and 5000 or less. The number average molecular weight of the (B) phenylene ether resin is more preferably 1000 or more and 4000 or less. By making the number average molecular weight 500 or more, the crosslink density can be reduced and the toughness of the thermosetting resin composition can be improved. By making it 5000 or less, the compatibility with other components such as polyimide can be improved, and the thermosetting resin composition can have a uniform structure and stabilize the physical properties. The (B) phenylene ether resin in the present invention contains at least one crosslinkable functional group selected from the group consisting of a phenolic hydroxyl group, an acrylic group, a vinyl group, and an epoxy group at the molecular chain end. These crosslinkable functional groups are preferably attached to both ends of the molecular chain, but may be attached to only one end. The (B) phenylene ether resin contains these crosslinkable functional groups, which form a crosslinked structure by thermal curing, thereby improving mechanical strength, heat resistance, and adhesion. The crosslinkable functional groups contained in the (B) phenylene ether resin are preferably vinyl groups among these crosslinkable functional groups. Since the thermosetting resin composition thermally crosslinked with the vinyl group has low polarity, it is possible to reduce the relative dielectric constant and the dielectric loss tangent. Examples of such resins include OPE-2st manufactured by Mitsubishi Gas Chemical Co., Ltd.

[0067] The content of the (B) phenylene ether resin is not particularly limited, but is preferably 5% by weight or more and 50% by weight or less, more preferably 10% by weight or more and 40% by weight or less, based on 100% by weight of the thermosetting resin composition. By making it 5% by weight or more, the relative dielectric constant and the dielectric loss tangent can be lowered. Also, by making it 50% by weight or less, the toughness and adhesion can be improved.

[0068] The thermosetting resin composition of the present invention contains a maleimide resin (C). By containing the maleimide resin (C), heat resistance can be improved, and adhesive strength can be improved. In addition, when a phenylene ether resin having a vinyl group as a crosslinkable functional group at the molecular chain end is used as the phenylene ether resin (B), the maleimide resin (C) interacts with the phenylene ether resin (B) to lower the thermosetting reaction temperature to 180° C. or lower. The maleimide resin (C) is not particularly limited as long as it is a maleimide resin that dissolves in an organic solvent from the viewpoint of lowering the viscosity of the thermosetting resin composition solution. Examples of the (C) maleimide resin include phenylmethane maleimide, metaphenylene bismaleimide, 4,4'-diphenylmethane bismaleimide, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, 2,2'-bis[4-(4-maleimidophenoxy)phenyl]propane, 4-methyl-1,3-phenylene bismaleimide, 1,6-bismaleimide-(2,2,4-trimethyl)hexane, 4,4-diphenylether bismaleimide, 4,4-diphenylsulfone bismaleimide, polyphenylmethane maleimide, novolac-type maleimide compounds, biphenylaralkyl-type maleimide compounds, and prepolymers of these maleimide resins.

[0069] The content of the maleimide resin (C) is not particularly limited, but is preferably 1% by weight or more and 50% by weight or less, more preferably 3% by weight or more and 40% by weight or less, based on 100% by weight of the entire thermosetting resin. By making it 1% by weight or more, the crosslinking reaction of the phenylene ether resin having a vinyl group at the molecular chain terminal can be promoted, and the heat resistance can be improved. Furthermore, by making it 50% by weight or less, the elastic modulus can be suppressed, and the toughness can be improved. These maleimide resins (C) can be used alone or in a mixture of two or more kinds.

[0070] The maleimide resin (C) is preferably a polymaleimide resin having N maleimide groups (N is an integer whose average value is greater than 2 and less than 30). When the number of maleimide groups is greater than 2, the crosslinking density increases and the adhesive strength can be improved. When the number of maleimide groups is less than 30, the compatibility with other resins can be improved. An example of the polymaleimide resin is a maleimide resin represented by the following formula (6).

[0071] [ka]

[0072] The thermosetting resin composition of the present invention preferably contains an epoxy resin (D). The epoxy resin (D) used in the present invention is not particularly limited, but is preferably an epoxy resin that is liquid at room temperature from the viewpoints of flexibility in the B stage and adhesive strength to a substrate.

[0073] Here, liquid epoxy resin is defined as a resin with a viscosity of 1.013 x 10 at 25°C. 5 N / m 2 The epoxy resin (D) has a viscosity of 150 Pa·s or less. Examples of liquid epoxy resins suitable for the epoxy resin include bisphenol A type epoxy resins, bisphenol F type epoxy resins, alkylene oxide modified epoxy resins, and glycidyl amine type epoxy resins. Examples of products corresponding to such epoxy resins include JER825, JER827, JER828, JER806, JER807, JER801N, JER802, JER604, JER630, and JER630LSD manufactured by Mitsubishi Chemical Corporation, Epicron 840S, Epicron 850S, Epicron 830S, Epicron 705, and Epicron 707 manufactured by DIC Corporation, YD127, YD128, PG207N, and PG202 manufactured by Nippon Steel Chemical Co., Ltd., TEPIC-PAS B22, TEPIC-VL, TEPIC-FL, FOLDI E101, and FOLDI E201 manufactured by Nissan Chemical Co., Ltd., and A1, A2, and A3 manufactured by Croda Ltd.

[0074] The content of the (D) epoxy resin is not particularly limited, but is preferably 1% by weight or more and 50% by weight or less, more preferably 3% by weight or more and 40% by weight or less, based on 100% by weight of the entire thermosetting resin composition. By making it 1% by weight or more, the melt viscosity of the B-stage sheet during heating can be reduced, and the adhesion to the substrate can be improved. These (D) epoxy resins can be used alone or in combination of two or more kinds.

[0075] The thermosetting resin composition of the present invention preferably contains (E) a curing accelerator. By combining (D) the epoxy resin with (E) the curing accelerator, the curing of the epoxy resin can be accelerated and cured in a short time. The (E) curing accelerator is not particularly limited, but imidazoles, polyhydric phenols, acid anhydrides, amines, hydrazides, polymercaptans, Lewis acid-amine complexes, latent curing agents, etc. can be used. Among them, imidazoles, polyhydric phenols, and latent curing accelerators, which have excellent storage stability and heat resistance of the cured product, are preferably used. These can be used alone or in combination of two or more.

[0076] Examples of imidazoles include "Curezol (registered trademark)" 2MZ, "Curezol (registered trademark)" 2PZ, "Curezol (registered trademark)" 2MZ-A, and "Curezol (registered trademark)" 2MZ-OK (all trade names, manufactured by Shikoku Kasei Corporation). Examples of polyhydric phenols include "SUMILITE RESIN (registered trademark)" PR-HF3, "SUMILITE RESIN (registered trademark)" PR-HF6 (all trade names, manufactured by Sumitomo Bakelite Co., Ltd.), "KAYAHARD (registered trademark)" KTG-105, "KAYAHARD (registered trademark)" NHN (all trade names, manufactured by Nippon Kayaku Co., Ltd.), "Phenolite (registered trademark)" TD2131, "Phenolite (registered trademark)" TD2090, "Phenolite (registered trademark)" VH-4150, "Phenolite (registered trademark)" KH-6021, "Phenolite (registered trademark)" KA-1160, and "Phenolite (registered trademark)" KA-1165 (all trade names, manufactured by DIC Corporation). Examples of the latent curing accelerator include dicyandiamide-type latent curing agents, amine adduct-type latent curing agents, organic acid hydrazide-type latent curing agents, aromatic sulfonium salt-type latent curing agents, microcapsule-type latent curing agents, and photocurable latent curing agents.

[0077] Examples of dicyandiamide-type latent hardeners include DICY7, DICY15, and DICY50 (all trade names, manufactured by Japan Epoxy Resins Co., Ltd.), Amicure (registered trademark) AH-154, and Amicure (registered trademark) AH-162 (all trade names, manufactured by Ajinomoto Fine-Techno Co., Ltd.). Examples of amine adduct-type latent hardeners include Amicure (registered trademark) PN-23, Amicure (registered trademark) PN-40, Amicure (registered trademark) MY-24, and Amicure (registered trademark) MY-H (all trade names, manufactured by Ajinomoto Fine-Techno Co., Ltd.), and Fujicure (registered trademark) FXR-1030 (trade name, manufactured by Fuji Kasei Co., Ltd.). Examples of organic acid hydrazide type latent curing agents include "Amicure (registered trademark)" VDH and "Amicure (registered trademark)" UDH (all trade names, manufactured by Ajinomoto Fine-Techno Co., Ltd.). Examples of aromatic sulfonium salt type latent curing agents include "Sanaide (registered trademark)" SI100, "Sanaide (registered trademark)" SI150, "Sanaide (registered trademark)" SI180, "Sanaide (registered trademark)" SI-B3, and "Sanaide (registered trademark)" SI-B4 (all trade names, manufactured by Sanshin Chemical Industry Co., Ltd.). Examples of microcapsule type latent curing agents include those in which the above-mentioned curing agents are encapsulated with a vinyl compound, a urea compound, or a thermoplastic resin. Among them, examples of microcapsule-type latent curing agents in which an amine adduct-type latent curing agent is treated with an isocyanate include "Novacure (registered trademark)" HX-3941HP, "Novacure (registered trademark)" HXA3922HP, "Novacure (registered trademark)" HXA3932HP, and "Novacure (registered trademark)" HXA3042HP (all trade names, manufactured by Asahi Kasei Chemicals Corporation). Examples of photocurable latent curing agents include "Optomer (registered trademark)" SP and "Optomer (registered trademark)" CP (manufactured by ADEKA Corporation).

[0078] The content of the (E) curing accelerator is not particularly limited, but is preferably 0.1 parts by weight or more and 35 parts by weight or less relative to 100 parts by weight of the (D) epoxy resin.

[0079] The thermosetting resin composition of the present invention may contain an organic peroxide. By containing an organic peroxide, the curing of the vinyl group-containing phenylene ether resin (B) and the maleimide resin (C) can be accelerated, and mechanical strength and heat resistance can be improved. Examples of the organic peroxide include benzoyl peroxide, cumene hydroperoxide, dicumyl peroxide, diisopropylbenzene hydroperoxide, t-butyl hydroperoxide, t-butyl peroxy acetate, t-butyl peroxy benzoate, t-butyl isopropyl carbonate, di-t-butyl peroxide, t-butyl peroctate, 1,1-bis(t-butylperoxy)3,3,5-trimethylcyclohexane, 1,1-bis(t-butylperoxy)cyclohexane, and t-butylperoxy-2-ethylhexanoate. The content of the organic peroxide is preferably 0.1 part by weight or more and 35 parts by weight or less based on 100 parts by weight of the phenylene ether resin (B) having a vinyl group and the maleimide resin (C).

[0080] The thermosetting resin composition of the present invention may contain inorganic particles as necessary. By containing inorganic particles, the physical properties of the resin composition can be adjusted, such as lowering the thermal expansion coefficient of the heat curing. As the material of the inorganic particles, silica, hollow silica, alumina, titania, silicon nitride, boron nitride, aluminum nitride, iron oxide, glass, other metal oxides, metal nitrides, metal carbonates, metal sulfates such as barium sulfate, etc. can be used alone or in combination of two or more. Among these, silica can be preferably used in terms of low thermal expansion, heat dissipation, and low moisture absorption. Hollow silica can also be preferably used in terms of low dielectric loss tangent.

[0081] When the thermosetting resin composition of the present invention contains inorganic particles, the content is preferably 10% by weight or more and 90% by weight or less with respect to 100% by weight of the entire resin composition containing the inorganic particles. From the viewpoints of low thermal expansion, thermal diffusivity, low moisture absorption rate, low dielectric constant, and low dielectric loss tangent of the resin composition, the inorganic particles are preferably 10% by weight or more, more preferably 20% by weight or more. In addition, from the viewpoints of improving the thermocompression bondability with the substrate during thermal curing and improving the mechanical strength after thermal curing, the inorganic particles are preferably 90% by weight or less, more preferably 80% by weight or less. The average particle size of the inorganic particles is preferably 0.1 μm or more and 10 μm or less. From the viewpoints of improving the low thermal expansion and thermal diffusivity of the resin composition, it is preferably 0.1 μm or more, more preferably 0.5 μm or more. In addition, from the viewpoint of smoothing the surface of the thermosetting resin sheet, it is preferably 10 μm or less, more preferably 5 μm or less.

[0082] The thermosetting resin composition of the present invention may contain a surfactant as required, which can improve the wettability with a substrate.

[0083] The thermosetting resin composition of the present invention preferably contains a silane coupling agent (F), particularly preferably a silane coupling agent represented by formula (12).

[0084] [ka]

[0085] In formula (12), X represents a divalent aliphatic or aromatic hydrocarbon group having 1 to 30 carbon atoms or a single bond; R 13 may be the same or different, and each represents a halogen, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenyl group, a hydroxyl group, or a phenoxy group, and i represents an integer of 1 to 3. 13 At least one of them is a halogen or an alkoxy group having 1 to 6 carbon atoms.

[0086] Examples of the silane coupling agent include trimethoxyaminopropylsilane, trimethoxycyclohexylepoxyethylsilane, trimethoxyvinylsilane, triethoxyvinylsilane, trimethoxythiolpropylsilane, trimethoxyglycidyloxypropylsilane, tris(trimethoxysilylpropyl)isocyanurate, triethoxyaminopropylsilane, 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, p-styryltrimethoxysilane, and a reaction product of trimethoxyaminopropylsilane with an acid anhydride. In particular, trimethoxyvinylsilane, triethoxyvinylsilane, 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, and p-styryltrimethoxysilane are preferred, with p-styryltrimethoxysilane being more preferred.

[0087] The content of the (F) silane coupling agent is not particularly limited, but is preferably 0.01% by weight or more and 10% by weight or less, more preferably 0.5% by weight or more and 5% by weight or less, based on 100% by weight of the entire thermosetting resin composition. By making the content 0.01% by weight or more, the adhesion to the substrate can be improved. By making the content 10% by weight or less, the storage stability is improved. These (F) silane coupling agents can be used alone or in combination of two or more kinds. In addition, a titanium chelating agent or the like may be contained in the resin composition in an amount of 0.5 to 10% by weight.

[0088] Next, the thermosetting resin sheet of the present invention, which is formed by forming a layer of the thermosetting resin composition of the present invention on a support in an uncured state, will be described. Such a thermosetting resin sheet of the present invention can be used as an adhesive sheet or the like. To process the thermosetting resin composition of the present invention into a sheet, for example, the resin composition can be mixed in a solvent on a support film to form a varnish, which can be applied and dried to form a sheet.

[0089] The solvent used here may be appropriately selected from those that dissolve the above-mentioned components, and examples of such solvents include ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, and cyclohexanone, ether solvents such as 1,4-dioxane, tetrahydrofuran, and diglyme, glycol ether solvents such as methyl cellosolve, ethyl cellosolve, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monobutyl ether, and diethylene glycol methyl ethyl ether, as well as benzyl alcohol, propanol, N-methylpyrrolidone, γ-butyrolactone, ethyl acetate, and N,N-dimethylformamide. In particular, if the solvent contains one having a boiling point of 120° C. or less under atmospheric pressure, the solvent can be removed at a low temperature in a short time, making it easy to form the solvent into a sheet.

[0090] The method for making the adhesive composition into a varnish is not particularly limited, but it is preferable to mix the polyimide resin, (B) the phenylene ether resin, (C) the maleimide resin, and other components that are included as necessary in the above-mentioned solvent using a propeller stirrer, homogenizer, kneader, or the like, and then, from the viewpoint of improving the dispersibility of the inorganic particles as necessary, mix them using a bead mill, ball mill, three-roll mill, or the like.

[0091] Methods for applying the varnish to the support film include rotational application using a spinner, spray application, roll coating, screen printing, or application methods using a blade coater, die coater, calendar coater, meniscus coater, bar coater, roll coater, comma roll coater, gravure coater, screen coater, slit die coater, etc.

[0092] As the coater, a roll coater, a comma roll coater, a gravure coater, a screen coater, a slit die coater, etc. can be used, but a slit die coater is preferably used because the solvent volatilizes less during coating and the coating property is stable. The thickness of the sheeted thermosetting resin composition, i.e., the thermosetting resin sheet, is not particularly limited, but is preferably in the range of 10 to 400 μm from the viewpoints of embedding in a wiring board having irregularities, insulating property, etc.

[0093] For drying, an oven, a hot plate, infrared rays, etc. can be used. The drying temperature and drying time may be within a range that allows the organic solvent to volatilize, and it is preferable to set the range appropriately so that the adhesive sheet is in an uncured or semi-cured state (B stage state). Specifically, it is preferable to hold the adhesive sheet at a temperature in the range of 40°C to 120°C for one minute to several tens of minutes. In addition, the temperature may be increased stepwise by combining these temperatures, and for example, the adhesive sheet may be heat-treated at 70°C, 80°C, and 90°C for one minute each.

[0094] The support film is not particularly limited, and various types of films that are usually commercially available, such as a polyethylene terephthalate (PET) film, a polyphenylene sulfide film, and a polyimide film, can be used.

[0095] In order to improve adhesion and peelability, the surface of the support film to be bonded to the adhesive composition may be surface-treated with silicone, a silane coupling agent, an aluminum chelating agent, polyurea, etc. The thickness of the support film is not particularly limited, but is preferably in the range of 10 to 100 μm from the viewpoint of workability.

[0096] The thermosetting resin sheet may have a protective film to protect its surface, which can protect the adhesive sheet surface from contaminants such as dust and dirt in the air.

[0097] Examples of the protective film include a polyethylene film, a polypropylene (PP) film, a polyester film, etc. It is preferable that the protective film has a small adhesive strength with the adhesive sheet.

[0098] Next, a method for bonding a substrate or a member using the thermosetting resin composition or the thermosetting resin sheet of the present invention will be described with examples. The resin composition is preferably used in the form of a varnish as described above. First, a resin composition coating is formed on a printed circuit board on which wiring is formed on a glass substrate or a glass epoxy substrate using the resin composition varnish. Examples of a method for applying the resin composition varnish include spin coating using a spinner, spray coating, roll coating, and screen printing. In addition, the coating thickness varies depending on the coating method, the solid content concentration and the viscosity of the resin composition, and generally, it is preferable to apply the resin composition varnish so that the film thickness after drying is 10 μm or more and 400 μm or less. Next, the substrate on which the resin composition varnish is applied is dried to obtain a resin composition coating. For drying, an oven, a hot plate, infrared rays, etc. can be used. The drying temperature and drying time may be within a range that allows the organic solvent to volatilize, and it is preferable to appropriately set a range in which the resin composition coating is in an uncured or semi-cured state. Specifically, it is preferable to perform the drying at a temperature in the range of 50 to 150°C for 1 minute to several hours.

[0099] On the other hand, when the thermosetting resin sheet has a protective film, the protective film is peeled off, and the thermosetting resin sheet and the printed circuit board are placed opposite each other and bonded together by thermocompression bonding. Thermocompression bonding can be performed by heat pressing, heat lamination, heat vacuum lamination, etc. The bonding temperature is preferably 40°C or higher in terms of adhesion to the board and embeddability. In addition, if the temperature is high during bonding, the time required for the thermosetting resin sheet to harden will be shortened and workability will decrease, so the bonding temperature is preferably 250°C or lower. When the thermosetting resin sheet has a support film, the support film may be peeled off before bonding, or may be peeled off at any point in the thermocompression bonding process or after thermocompression bonding.

[0100] The printed circuit board thus obtained, on which the resin composition coating is formed, is thermocompression bonded to a resin film such as polyimide or liquid crystal polymer, a printed circuit board, or other member. The thermocompression temperature is not limited as long as it is equal to or higher than the glass transition temperature of the resin, and is preferably in the range of 100 to 400°C. The pressure during the thermocompression bonding is preferably in the range of 0.01 to 10 MPa. The time is preferably from 1 second to several minutes.

[0101] After the thermocompression bonding, a temperature of 120°C to 400°C is applied to form a cured product, thereby obtaining a cured film. This heat treatment is carried out by selecting a temperature and gradually increasing the temperature, or by selecting a certain temperature range and continuously increasing the temperature for 5 minutes to 5 hours. As an example, heat treatment is carried out at 130°C and 200°C for 30 minutes each. Alternatively, a method of linearly increasing the temperature from room temperature to 250°C over 2 hours can be mentioned. In this case, the heating temperature is preferably 150°C or higher and 300°C or lower, and more preferably 180°C or higher and 250°C or lower. The adhesive obtained by thermocompression bonding in this manner preferably has a peel strength of 4N / cm or higher from the viewpoint of adhesion reliability. More preferably, it is 6N / cm or higher.

[0102] The glass transition temperature (Tg) of the cured film obtained by thermocompression bonding is preferably 100°C or higher from the viewpoint of being able to withstand a reliability test of a semiconductor device, and more preferably 120°C or higher. The dielectric constant of the cured film obtained is preferably 3.0 or lower at 10 GHz from the viewpoint of reducing the dielectric loss of an electric signal, and more preferably 2.8 or lower. Similarly, the dielectric tangent of the cured film obtained is preferably 0.01 or lower at 10 GHz from the viewpoint of reducing the dielectric loss of an electric signal, and more preferably 0.008 or lower. The thickness of the cured film can be set arbitrarily, but is preferably 10 μm or more and 400 μm or less.

[0103] The cured film of the present invention can be obtained by curing the thermosetting resin composition or the thermosetting resin sheet by heat treatment. The heat treatment temperature may be 150°C to 350°C. For example, a certain temperature is selected and the temperature is raised stepwise, or a certain temperature range is selected and the temperature is raised continuously for 5 minutes to 5 hours. As an example, heat treatment is performed at 130°C and 200°C for 30 minutes each. The lower limit of the curing conditions in the present invention is preferably 170°C or more, and more preferably 180°C or more in order to sufficiently proceed with curing. In addition, there is no particular limit to the upper limit of the curing conditions, but from the viewpoint of suppressing film shrinkage and stress, it is preferably 280°C or less, more preferably 250°C or less, and even more preferably 230°C or less.

[0104] The electronic component of the present invention is an electronic component comprising a cured product obtained by thermally curing the thermosetting resin composition or the thermosetting resin sheet of the present invention, and more preferably, is an electronic component disposed on an adherend.

[0105] An antenna element using a cured film obtained by curing the thermosetting resin composition of the present invention will be described. FIG. 1 is a schematic diagram of a coplanar feed type microstrip antenna, which is a type of planar antenna. 1a shows a cross-sectional view, and 1b shows a top view. First, a formation method will be described. The thermosetting resin composition of the present invention is applied onto a copper foil, and pre-baked, or an uncured thermosetting resin sheet is laminated onto the copper foil. Next, copper foil is laminated and thermally cured to form a cured film having copper foil on both sides. After that, patterning is performed by a subtractive method, and an antenna element having an antenna pattern of copper wiring of a microstrip line (MSL) shown in FIG. 1 is obtained.

[0106] Next, the antenna pattern in Fig. 1 will be described. In 1a, 15 denotes the ground (all over), and 16 denotes an insulating film that becomes the substrate of the antenna. The upper layers 11 to 13 denote the cross section of the antenna wiring obtained by the above-mentioned patterning. The ground wiring thickness J and the antenna wiring thickness K can be any thickness depending on the impedance design, but are generally 2 to 20 µm. In 1b, 11 denotes the antenna part, 12 denotes a matching circuit, 13 denotes an MSL feed line, and 14 denotes a feed point. To match the impedance of the antenna part 11 and the MSL feed line 13, the length M of the matching circuit 12 is 1 / 4 λr (λr = (wavelength of transmitted radio wave) / (dielectric constant of insulating material) 1 / 2 ). The width W and length L of the antenna portion 11 are designed to be 1 / 2 λr. The antenna portion length L may be set to 1 / 2 λr or less depending on the impedance design. The cured film of the present invention has a low dielectric constant and a low dielectric tangent, so that an antenna element with high efficiency and high gain can be provided. In addition, due to these characteristics, an antenna element using the insulating film of the present invention is suitable as a high frequency antenna, and the area (= L × W) of the antenna portion can be set to 1000 mm 2 By making the dimensions as follows, a small antenna element can be formed. In this way, a high-efficiency, high-gain, small-sized antenna element for high frequencies can be obtained.

[0107] Next, a semiconductor package including an IC chip (semiconductor element), a rewiring layer, a sealing resin, and an antenna wiring will be described. FIG. 2 is a schematic diagram of a cross section of a semiconductor package including an IC chip (semiconductor element), a rewiring, a sealing resin, and an antenna element. On an electrode pad 202 of an IC chip 201, a rewiring layer (two copper layers, three insulating layers) is formed by copper wiring 209 and an insulating film 210 formed by the cured film of the present invention. A barrier metal 211 and a solder bump 212 are formed on the pad of the rewiring layer (copper wiring 209 and insulating film 210). In order to seal the IC chip, a first sealing resin 208 made of the cured film of the present invention is formed, and a copper wiring 209 serving as a ground for an antenna is further formed thereon. A first via wiring 207 is formed to connect a ground 206 and the rewiring layer (copper wiring 209 and insulating film 210) through a via hole formed in the first sealing resin 208. A second sealing resin 205 made of the cured film of the present invention is formed on the first sealing resin 208 and the ground 206, and a planar antenna wiring 204 is formed thereon. A second via wiring 203 is formed through a via hole formed in the first sealing resin 208 and the second sealing resin 205 to connect the planar antenna wiring 204 and the rewiring layer (copper wiring 209 and insulating film 210). The thickness of each layer of the insulating film 210 is preferably 10 to 20 μm, and the first sealing resin and the second sealing resin are preferably 50 to 200 μm and 100 to 400 μm, respectively. Since the cured film of the present invention has a low dielectric constant and a low dielectric loss tangent, a semiconductor package having the obtained antenna element is highly efficient, has a high gain, and has a small transmission loss within the package.

[0108] That is, the electronic component of the present invention is an electronic component including at least one antenna element having an antenna wiring and the cured film of the present invention, the antenna wiring including at least one antenna selected from the group consisting of a meandering loop antenna, a coiled loop antenna, a meandering monopole antenna, a meandering dipole antenna, and a microstrip antenna, and the area occupied by each antenna part of the antenna wiring is 1000 mm2 or less. 2The cured film is preferably an insulating film that provides insulation between the ground and the antenna wiring.

[0109] Furthermore, the electronic component of the present invention is an electronic component including a semiconductor package having at least a semiconductor element, a redistribution layer, a sealing resin, and an antenna wiring, and it is preferable that the insulating layer of the redistribution layer and / or the sealing resin includes the cured film of the present invention, and that the sealing resin is located between the ground and the antenna wiring.

[0110] Furthermore, the electronic component of the present invention is an electronic component having an antenna element obtained by laminating an antenna wiring and the cured film of the present invention, and it is preferable that the height of the antenna wiring is 50 to 200 μm and the thickness of the cured film is 80 to 300 μm. By laminating the antenna wiring and the cured film and setting the height of the antenna wiring and the thickness of the cured film within the above ranges, it becomes possible to transmit and receive signals in a small size over a wide range, and since the cured film of the present invention has a low dielectric constant and a low dielectric loss tangent, it is possible to provide an antenna element with high efficiency and high gain.

[0111] The electronic device of the present invention is an electronic device using the electronic component of the present invention. In the following, an example of the use of the resin composition of the present invention including the electronic device will be described, but the use of the thermosetting resin composition of the present invention is not limited to the following.

[0112] The thermosetting resin composition of the present invention can be widely used as an adhesive or insulating resin for semiconductor devices, but is preferably used in RF modules used in wireless communication devices such as mobile terminals that process large-capacity electrical signals at high speed, and in millimeter-wave radars for vehicles. An RF module is a multi-functional product used in wireless communication devices, and is a module in which a plurality of ICs and passive components (SAW filters, capacitors, resistors, coils) are mounted on a substrate. A substrate mounted with passive components is formed in a multilayer structure of an insulating layer and a copper wiring layer, and the thermosetting resin composition of the present invention can be preferably used for the insulating layer. An insulating layer is formed by attaching a thermosetting resin sheet to a printed circuit board or by applying a varnish of a resin composition and drying it. Then, a copper wiring is formed on the surface of the insulating layer by electroplating, and a thermosetting resin sheet is further attached thereon or a varnish of a resin composition is applied thereon to create a multilayer substrate. Note that the semiconductor device referred to in the present invention refers not only to a device in which a semiconductor element is connected to a substrate, or to a device in which semiconductor elements or substrates are connected to each other, but also to a device in general that can function by utilizing the characteristics of a semiconductor element, and electro-optical devices, semiconductor circuit boards, and electronic components including these are all included in the semiconductor device. Thus, the electronic component of the present invention has excellent characteristics at high frequencies and can be used in the electronic device of the present invention, which requires operational reliability at high frequencies. EXAMPLES

[0113] The present invention will be described in detail below with reference to examples, but the present invention is not limited thereto. Details of the raw materials indicated by abbreviations in each example are shown below.

[0114] <Raw material for polyimide resin> BSAA: 2,2'-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride TBIS-DMPN: 5-isobenzofurancarboxylic acid, 1,3-dihydro, 1,3-dioxo-5,5'-[cyclododecylidenebis(2-methyl-4,1-phenylene)] ester (Taoka Chemical Co., Ltd.) ODPA: 4,4'-oxydiphthalic dianhydride (manufactured by Manac Corporation) TFMB: 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl (Wakayama Seika Kogyo Co., Ltd.) mTB: 4,4'-diamino-2,2'-dimethylbiphenyl (Wakayama Seika Kogyo Co., Ltd.) LP7100: Bis(3-aminopropyl)tetramethyldisiloxane (Shin-Etsu Chemical Co., Ltd.) X-22-9409: Diaminopolysiloxane (amine equivalent: 670) (manufactured by Shin-Etsu Chemical Co., Ltd.) X-22-1660B-3: Diaminopolysiloxane (amine equivalent: 2170) (manufactured by Shin-Etsu Chemical Co., Ltd.) Versamine 551: a dimer diamine compound containing a compound represented by formula (11) (trade name, manufactured by BASF Ltd.) (average amine value: 205) Priamine 1075: a dimer diamine compound containing a compound represented by formula (10) (trade name, manufactured by Croda Japan Co., Ltd.) (average amine value: 205).

[0115] <(B) Phenylene ether resin> OPE-2st-1200: Oligophenylene ether (chain end: vinyl group) (number average molecular weight: 1200) (manufactured by Mitsubishi Gas Chemical Co., Inc.) OPE-2st-2200: Oligophenylene ether (chain end: vinyl group) (number average molecular weight: 2200) (manufactured by Mitsubishi Gas Chemical Co., Inc.) SA-90: Low molecular weight polyphenylene ether (chain end: phenolic hydroxyl group) (number average molecular weight: 1700) (SABIC Japan LLC).

[0116] <(C) Maleimide resin> BMI-4000: 2,2'-bis[4-(4-maleimidophenoxy)phenyl]propane (manufactured by Daiwa Chemical Industry Co., Ltd.) MIR-3000-70MT: Biphenyl aralkyl type maleimide compound (manufactured by Nippon Kayaku Co., Ltd.)

[0117] [ka]

[0118] <(D) Epoxy resin> JER828: Bisphenol A type liquid epoxy resin (manufactured by Mitsubishi Chemical Corporation) E101: Branched alkyl group-containing epoxy resin (Nissan Chemical Co., Ltd.)

[0119] [ka]

[0120] TEPIC-FL: Isocyanuric acid modified epoxy resin (Nissan Chemical Co., Ltd.)

[0121] [ka]

[0122] <(E) Curing accelerator> 2P4MZ: 2-phenyl-4-methylimidazole SI-150: Dimethyl-p-acetoxyphenylsulfonium hexafluoroantimonate (manufactured by Sanshin Chemical Industry Co., Ltd.).

[0123] <Organic peroxide> DCP: Dicumyl peroxide (NOF Corporation) <Adhesion improver> KBM1003: Vinyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd.) KBM1403: p-styryltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd.).

[0124] <Solvent> γBL: γ-butyrolactone The evaluation methods used in the examples and comparative examples are as follows.

[0125] <Tg of synthesized polyimide resin> A solution of 30% by weight of solid content obtained by dissolving polyimide resin in γBL was applied onto a copper foil having a thickness of 18 μm, and dried in an oven at 100° C.×30 minutes, 120° C.×30 minutes, and 180° C.×30 minutes. The coating was performed so that the thickness of the polyimide resin after drying was 50 μm. The copper foil of the laminate thus obtained was etched off with an aqueous solution of ferric chloride to obtain a polyimide film. The polyimide film was cut into a size of 5 mm×30 mm, and measured with a dynamic viscoelasticity measuring device DVA-200 (manufactured by IT Measurement and Control Co., Ltd.) at a heating rate of 5° C. / min and a frequency of 1 Hz, and the peak value of Tanδ was taken as Tg.

[0126] <Number average molecular weight of phenylene ether resin (B)> (B) A solution of phenylene ether resin dissolved in tetrahydrofuran (hereinafter referred to as THF) with a solid content concentration of 0.1% by weight was used to calculate the weight average molecular weight in terms of polystyrene using a GPC apparatus WAters2690 (manufactured by WAters Co., Ltd.) with the configuration shown below. The GPC measurement conditions were THF as the mobile phase and a development speed of 0.4 ml / min.

[0127] Detector: WAters996 System controller: WAters2690 Column oven: WAters HTR-B Thermocontroller: WAters TCM Column: TOSOH grade comn Column: TOSOH TSK-GEL α-2500H Column: TOSOH TSK-GEL α-4000H.

[0128] <Weight average molecular weight of the synthesized polyimide resin> A polyimide resin was dissolved in N-methyl-2-pyrrolidone (hereinafter referred to as NMP) to obtain a solution with a solid content concentration of 0.1% by weight, and the weight average molecular weight in terms of polystyrene was calculated using a GPC apparatus WAters2690 (manufactured by WAters Co., Ltd.) with the configuration shown below. The GPC measurement conditions were as follows: the mobile phase was NMP in which LiCl and phosphoric acid were dissolved at a concentration of 0.05 mol / l, and the development speed was 0.4 ml / min.

[0129] Detector: WAters996 System controller: WAters2690 Column oven: WAters HTR-B Thermocontroller: WAters TCM Column: TOSOH grade comn Column: TOSOH TSK-GEL α-4000 Column: TOSOH TSK-GEL α-2500.

[0130] <Imidization rate of synthesized polyimide resin> First, the infrared absorption spectrum of the polymer was measured, and the absorption peak of the imide structure due to polyimide (1780 cm -1 Near, 1377cm -1 Next, the polymer was heat-treated at 350°C for 1 hour, and the infrared absorption spectrum was measured again. -1 The imidization rate of the polymer before the heat treatment was calculated by assuming the imidization rate of the polymer after the heat treatment to be 100%.

[0131] <Copper foil adhesive strength> The resin composition prepared in each Example and Comparative Example was applied to a PET film having a thickness of 38 μm as a support film using a comma roll coater, and dried at 100° C. for 30 minutes, and then a PP film having a thickness of 10 μm was laminated as a protective film to obtain an adhesive sheet. Coating was performed so that the thickness of the thermosetting resin sheet in the adhesive sheet was 50 μm. Thereafter, the protective film was peeled off, and the peeled surface was pressed on a copper foil (NA-VLP thickness 15 μm: manufactured by Mitsui Kinzoku Co., Ltd.) using a hot plate press at a press temperature of 120° C., a pressure of 1 MPA, and a press time of 5 minutes. Then, after peeling off the support film, a copper foil was further laminated on the resin composition, and pressed at a press temperature of 180° C., a pressure of 1 MPA, and a press time of 10 minutes. Then, it was thermally cured for 1 hour in a hot air circulation type dryer at 180° C. The copper foil of the laminate thus obtained was etched off only on one side with an aqueous solution of ferric chloride, and a circuit processing with a line width of 2 mm was performed. Thereafter, a 2 mm wide copper foil was raised in a direction at 90° to the laminate using a push gel gauge and pulled to measure the adhesive strength.

[0132] <Solder heat resistance> The laminate (copper foil 15 μm / resin 50 μm / copper foil 15 μm) obtained in the same manner as above was cut to a size of 50 mm × 50 mm and immersed for 2 minutes in a solder bath heated to 260° C. After immersion, those that showed no peeling or foaming of the copper foil and were unchanged from the initial state were rated as good, and those that showed peeling or foaming were rated as bad.

[0133] <tg> The copper foil of the laminate obtained by the above method was removed by etching with an aqueous solution of ferric chloride to obtain a cured product. This was cut to a width of 5 mm x 30 mm and measured from -50°C to 300°C with a dynamic viscoelasticity measuring device DVA-200 manufactured by IT Measurement and Control Co., Ltd., with a grip distance of 15 mm, a heating rate of 5°C / min, and a frequency of 1 Hz. The temperature at which Tan δ showed a peak value was defined as Tg.

[0134] <Dielectric constant, dielectric loss tangent> The cured thermosetting resin sheet obtained in the same manner as above was cut to 60 x 100 mm and conditioned for 24 hours in an atmosphere of 22°C / 60% RH. The relative dielectric constant and dielectric loss tangent were measured using a cylindrical cavity resonator method. The measurements were performed using a VECTOR NETWORK ANALYZER HP8510C manufactured by Agilent Technologies, Inc., at a frequency of 10 GHz and in an environment of 22°C / 60% RH.

[0135] Example 1 A 300 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a dropping funnel, and 112.47 g of γBL and 31.21 g of BSAA were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 9.61 g of TFMB and 7.46 g of LP7100 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution A (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 36,400, the Tg was measured to be 125°C, and the imidization rate was measured to be 100%.

[0136] 1.54g (solid content 1.0g) of OPE-2st-1200 (solid content 65% by weight: toluene solution), 0.2g of BMI4000, 1.2g of TEPIC-FL, and 0.06g of 2P4MZ were added to 12.0g (solid content 3.6g) of the polyimide solution A obtained by the above method, and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above method.

[0137] Example 2 A 300 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a dropping funnel, and 141.64 g of γBL and 43.73 g of TBIS-DMPN were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 9.61 g of TFMB and 7.46 g of LP7100 were added while stirring at 60°C, and the mixture was stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution B (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 43,210, the Tg was measured to be 168°C, and the imidization rate was measured to be 100%.

[0138] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution B thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0139] Example 3 A 300 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a dropping funnel, and 82.05 g of γBL and 18.61 g of ODPA were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 9.61 g of TFMB and 7.46 g of LP7100 were added while stirring at 60°C, and the mixture was stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution B (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 41,630, the Tg was measured to be 178°C, and the imidization rate was measured to be 100%.

[0140] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution C thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0141] Example 4 A 500 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a dropping funnel, and 215.43 g of γBL and 43.73 g of TBIS-DMPN were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 9.61 g of TFMB and 40.20 g of X-22-9409 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution D (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 33,400, the Tg was measured to be 65°C, and the imidization rate was measured to be 100%.

[0142] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution D thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0143] Example 5 A 500 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a dropping funnel, and 211.06 g of γBL and 21.86 g of TBIS-DMPN were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 4.80 g of TFMB and 65.10 g of X-22-1660B-3 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution E (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 29,540, the Tg was measured to be -5°C, and the imidization rate was measured to be 100%.

[0144] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution E thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0145] Example 6 A 500 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a dropping funnel, and 142.99 g of γBL and 43.73 g of TBIS-DMPN were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 10.99 g of BAHF and 7.46 g of LP7100 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution F (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 28,580, the Tg was measured to be 164°C, and the imidization rate was measured to be 100%.

[0146] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution E thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0147] Example 7 A 500 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube and a dropping funnel, and 198.55 g of γBL and 65.59 g of TBIS-DMPN were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 9.55 g of mTB and 11.18 g of LP7100 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution G (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 44,590, the Tg was measured to be 169°C, and the imidization rate was measured to be 100%.

[0148] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution G thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0149] Example 8 A 300 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a dropping funnel, and 141.70 g of γBL and 31.02 g of ODPA were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 25.62 g of TFMB and 4.97 g of LP7100 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution H (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 43,200, the Tg was measured to be 208°C, and the imidization rate was measured to be 100%.

[0150] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution H thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0151] Example 9 A 300 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a dropping funnel, and 105.46 g of γBL and 26.02 g of BSAA were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 11.21 g of TFMB and 7.96 g of Versamine 551 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution J (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 32,100, the Tg was measured to be 139°C, and the imidization rate was measured to be 100%.

[0152] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution J thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the methods described above.

[0153] Example 10 A 300 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a dropping funnel, and 105.60 g of γBL and 26.02 g of BSAA were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 11.21 g of TFMB and 8.02 g of Priamine 1075 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution K (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 31,200, the Tg was measured to be 134°C, and the imidization rate was measured to be 100%.

[0154] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution K thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0155] Example 11 A 300 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a dropping funnel, and 101.84 g of γBL and 26.02 g of BSAA were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 13.61 g of TFMB and 4.01 g of Priamine 1075 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution L (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 36,800, the Tg was measured to be 162°C, and the imidization rate was measured to be 100%.

[0156] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution L thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0157] Example 12 A 300 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube and a dropping funnel, and 104.76 g of γBL and 26.02 g of BSAA were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 9.61 g of TFMB, 8.02 g of Priamine 1075 and 1.24 g of LP7100 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain a polyimide solution M (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 30,100, the Tg was measured to be 124°C, and the imidization rate was measured to be 100%.

[0158] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution M thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0159] Example 13 A 300 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube and a dropping funnel, and 103.93 g of γBL and 26.02 g of BSAA were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 8.01 g of TFMB, 8.02 g of Priamine 1075 and 2.49 g of LP7100 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution N (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 28,200, the Tg was measured to be 114°C, and the imidization rate was measured to be 100%.

[0160] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution N thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0161] Example 14 A 300 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube and a dropping funnel, and 100.17 g of γBL and 26.02 g of BSAA were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 10.41 g of TFMB, 4.01 g of Priamine 1075 and 2.49 g of LP7100 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain a polyimide solution O (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 29,800, the Tg was measured to be 149°C, and the imidization rate was measured to be 100%.

[0162] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution O thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0163] Example 15 A 300 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube and a dropping funnel, and 99.33 g of γBL and 26.02 g of BSAA were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, 8.81 g of TFMB, 4.01 g of Priamine 1075 and 3.73 g of LP7100 were added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain a polyimide solution P (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 29,100, the Tg was measured to be 131°C, and the imidization rate was measured to be 100%.

[0164] A resin composition was obtained by mixing 12.0 g (solid content 3.6 g) of the polyimide solution P thus obtained with each component shown in Table 2 in the same manner as in Example 1. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0165] Example 16 To 10.67 g (solid content 3.2 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g), 0.2 g of BMI4000, 1.2 g of TEPIC-FL, and 0.06 g of 2P4MZ were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned methods.

[0166] Example 17 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g), 0.4 g of BMI4000, 1.2 g of TEPIC-FL, and 0.06 g of 2P4MZ were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned methods.

[0167] Example 18 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g), 0.4 g of BMI4000, 1.2 g of TEPIC-FL, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0168] Example 19 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g) of OPE-2st-1200 (solid content 65% by weight: toluene solution), 0.59 g (solid content 0.4 g) of MIR-3000-70MT (solid content 68.2% by weight: toluene solution), 1.2 g of TEPIC-FL, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0169] Example 20 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g) of OPE-2st-1200 (solid content 65 wt%: toluene solution), 0.59 g (solid content 0.4 g) of MIR-3000-70MT (solid content 68.2 wt%: toluene solution), 1.2 g of TEPIC-FL, 0.06 g of SI-B4, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0170] Example 21 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g) of OPE-2st-1200 (solid content 65% by weight: toluene solution), 1.17 g (solid content 0.8 g) of MIR-3000-70MT (solid content 68.2% by weight: toluene solution), 0.8 g of TEPIC-FL, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0171] Example 22 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g) of OPE-2st-1200 (solid content 65% by weight: toluene solution), 1.47 g (solid content 1.0 g) of MIR-3000-70MT (solid content 68.2% by weight: toluene solution), 0.6 g of TEPIC-FL, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0172] Example 23 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g) of OPE-2st-1200 (solid content 65% by weight: toluene solution), 1.47 g (solid content 1.0 g) of MIR-3000-70MT (solid content 68.2% by weight: toluene solution), 0.6 g of TEPIC-FL, 0.06 g of SI-B4, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0173] Example 24 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.21 g (solid content 1.4 g) of OPE-2st-2200 (solid content 63.4 wt%: toluene solution), 1.47 g (solid content 1.0 g) of MIR-3000-70MT (solid content 68.2 wt%: toluene solution), 0.6 g of TEPIC-FL, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0174] Example 25 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 1.4 g of SA-90, 1.47 g (solid content 1.0 g) of MIR-3000-70MT (solid content 68.2 wt %: toluene solution), 0.6 g of TEPIC-FL, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned methods.

[0175] Example 26 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g) of OPE-2st-1200 (solid content 65 wt%: toluene solution), 1.47 g (solid content 1.0 g) of MIR-3000-70MT (solid content 68.2 wt%: toluene solution), 0.6 g of JER825, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0176] Example 27 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g) of OPE-2st-1200 (solid content 65 wt%: toluene solution), 1.47 g (solid content 1.0 g) of MIR-3000-70MT (solid content 68.2 wt%: toluene solution), 0.6 g of E101, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0177] Example 28 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g) of OPE-2st-1200 (solid content 65% by weight: toluene solution), 1.47 g (solid content 1.0 g) of MIR-3000-70MT (solid content 68.2% by weight: toluene solution), 0.3 g of JER825, 0.3 g of E101, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0178] Example 29 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g), 0.4 g of BMI4000, 1.2 g of JER825, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0179] Example 30 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g), 0.4 g of BMI4000, 1.2 g of E101, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0180] Example 31 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g), 0.4 g of BMI4000, 0.6 g of JER825, 0.6 g of E101, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0181] Example 32 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.62 g (solid content 1.7 g) of OPE-2st-1200 (solid content 65% by weight: toluene solution), 1.91 g (solid content 1.3 g) of MIR-3000-70MT (solid content 68.2% by weight: toluene solution), and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned methods.

[0182] Example 33 To 3.33 g (solid content 1.0 g) of the polyimide solution B obtained in Example 2, 5.38 g (solid content 3.5 g) of OPE-2st-1200 (solid content 65 wt%: toluene solution), 1.47 g (solid content 1.0 g) of MIR-3000-70MT (solid content 68.2 wt%: toluene solution), 0.5 g of TEPIC-FL, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0183] Example 34 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 0.31 g (solid content 0.2 g) of OPE-2st-1200 (solid content 65% by weight: toluene solution), 0.15 g (solid content 0.1 g) of MIR-3000-70MT (solid content 68.2% by weight: toluene solution), 2.7 g of TEPIC-FL, 0.3 g of E101, 0.06 g of 2P4MZ, and 0.06 g of DCP were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0184] Example 35 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g) of OPE-2st-1200 (solid content 65% by weight: toluene solution), 1.47 g (solid content 1.0 g) of MIR-3000-70MT (solid content 68.2% by weight: toluene solution), 0.6 g of TEPIC-FL, 0.06 g of 2P4MZ, 0.06 g of DCP, and 0.3 g of KBM1003 were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0185] Example 36 To 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, 2.15 g (solid content 1.4 g) of OPE-2st-1200 (solid content 65% by weight: toluene solution), 1.47 g (solid content 1.0 g) of MIR-3000-70MT (solid content 68.2% by weight: toluene solution), 0.6 g of TEPIC-FL, 0.06 g of 2P4MZ, 0.06 g of DCP, and 0.3 g of KBM1403 were added and mixed and stirred to obtain a resin composition. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned method.

[0186] Comparative Example 1 A 500 ml four-neck flask was equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a dropping funnel, and 145.00 g of γBL and 31.02 g of ODPA were charged under a nitrogen atmosphere and stirred and dissolved at 60°C. Then, TFMB32.02 was added while stirring at 60°C and stirred for 1 hour. The mixture was then heated to 180°C and stirred for 3 hours, and then cooled to room temperature to obtain polyimide solution I (solid concentration 30.0 wt%). The weight average molecular weight of the polyimide was measured to be 47,310, the Tg was measured to be 226°C, and the imidization rate was measured to be 100%.

[0187] 10.0 g (solid content 3.0 g) of the polyimide solution I thus obtained was mixed with each component shown in Table 4 in the same manner as in Example 19 to obtain a resin composition. The copper foil adhesive strength, soldering heat resistance, Tg, relative dielectric constant, and dielectric loss tangent of the obtained resin composition were measured by the above-mentioned methods.

[0188] Comparative Example 2 A resin composition was obtained by adding 4.62 g (solid content 3.0 g) of OPE-2st-1200 (solid content 65 wt%: toluene solution) and 0.06 g of DCP to 10.00 g (solid content 3.0 g) of the polyimide solution B obtained in Example 2, and mixing and stirring. The obtained resin composition was measured for copper foil adhesive strength, solder heat resistance, Tg, relative dielectric constant, and dielectric loss tangent by the above-mentioned methods.

[0189] [Table 1]

[0190] [Table 2]

[0191] [Table 3]

[0192] [Table 4]

[0193] [Table 5]

[0194] [Table 6]

[0195] [Table 7] [Explanation of symbols]

[0196] 11 Antenna section 12 Matching Circuit 13 MSL power supply line 14 Power supply point 15 Grand 16 Insulating film J Ground wiring thickness K Antenna wiring thickness M Matching circuit length L Antenna length W Antenna width 201 IC chip 202 Electrode Pads 203 Second via wiring 204 Planar antenna wiring 205 Second sealing resin 206 Grand 207 First via wiring 208 First sealing resin 209 Copper wiring 210 Insulating film 211 Barrier Metal 212 Solder Bump< / tg>

Claims

1. A thermosetting resin composition comprising (F) a silane coupling agent represented by the following (A1), (B), (C), and formula (12): (A1) Polyimide resin: A polyimide resin containing a diamine residue of the formula (8) and / or the formula (9). 【Chemistry 1】 (In formula (8), a, b, c, and d are integers of 1 or more that satisfy a+b=6 to 17 and c+d=8 to 19, and the dashed lines represent carbon-carbon single bonds or carbon-carbon double bonds.) 【Chemistry 2】 (In formula (9), e, f, g, and h are integers of 1 or more satisfying e+f=5 to 16 and g+h=8 to 19, and the dashed lines represent carbon-carbon single bonds or carbon-carbon double bonds.) (B) Phenylene ether resin: a phenylene ether resin having a number average molecular weight of 500 or more and 5,000 or less, and containing at least one crosslinkable functional group selected from the group consisting of a phenolic hydroxyl group, an acrylic group, a vinyl group, and an epoxy group at a molecular chain terminal. (C) Maleimide resin: A polymaleimide resin having N maleimide groups, where N is an integer and the average value thereof is greater than 2 and less than 30. 【Chemistry 3】 In formula (12), X represents an aromatic divalent hydrocarbon group, R １３ may be the same or different, and each represents a halogen, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenyl group, a hydroxyl group, or a phenoxy group, and i represents an integer of 1 to 3. １３ At least one of the groups is a halogen or an alkoxy group having 1 to 6 carbon atoms.

2. A thermosetting resin composition comprising the following (A2), (B), (C), and (F) a silane coupling agent represented by formula (12): (A2) Polyimide resin: A polyimide resin containing a diamine residue of formula (1). 【Chemistry 4】 (In formula (1), m represents an integer of 1 to 60. R ５ and R ６ may be the same or different and represent an alkylene group or a phenylene group having 1 to 30 carbon atoms. １ ~R ４ may be the same or different and represent an alkyl group having 1 to 30 carbon atoms, a phenyl group, or a phenoxy group. (B) Phenylene ether resin: a phenylene ether resin having a number average molecular weight of 500 or more and 5,000 or less, and containing at least one crosslinkable functional group selected from the group consisting of a phenolic hydroxyl group, an acrylic group, a vinyl group, and an epoxy group at a molecular chain terminal. (C) Maleimide resin: A polymaleimide resin having N maleimide groups, where N is an integer and the average value thereof is greater than 2 and less than 30. 【Chemistry 5】 In formula (12), X represents an aromatic divalent hydrocarbon group, R １３ may be the same or different, and each represents a halogen, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenyl group, a hydroxyl group, or a phenoxy group, and i represents an integer of 1 to 3. １３ At least one of the groups is a halogen or an alkoxy group having 1 to 6 carbon atoms.

3. The thermosetting resin composition described in claim 1, further containing the following (A2) polyimide resin: (A2) Polyimide resin: A polyimide resin containing a diamine residue of formula (1). 【Chemistry 6】 (In formula (1), m represents an integer of 1 to 60. R 5 and R 6 may be the same or different and represent an alkylene group or a phenylene group having 1 to 30 carbon atoms. R 1 to R 4 may be the same or different and represent an alkyl group, a phenyl group or a phenoxy group having 1 to 30 carbon atoms.)

4. The thermosetting resin composition according to claim 3, wherein the polyimide resin (A2) contains diamine residues of formula (1) in a range of 20 to 80 mol % based on 100 mol % of all diamine residues in the polyimide, and the polyimide resin (A1) contains diamine residues of formulas (8) and (9) in a range of 1 to 30 mol % in total based on 100 mol % of all diamine residues in the polyimide. 【Chemistry 7】 (In formula (1), m represents an integer of 1 to 60. R ５ and R ６ may be the same or different and represent an alkylene group or a phenylene group having 1 to 30 carbon atoms. １ ~R ４ may be the same or different and represent an alkyl group having 1 to 30 carbon atoms, a phenyl group, or a phenoxy group. 【Chemistry 8】 (In formula (8), a, b, c, and d are integers of 1 or more that satisfy a+b=6 to 17 and c+d=8 to 19, and the dashed lines represent carbon-carbon single bonds or carbon-carbon double bonds.) 【Chemistry 9】 (In formula (9), e, f, g, and h are integers of 1 or more satisfying e+f=5 to 16 and g+h=8 to 19, and the dashed lines represent carbon-carbon single bonds or carbon-carbon double bonds.)

5. The thermosetting resin composition according to any one of claims 1 to 4, further comprising (D) an epoxy resin and (E) a curing accelerator.

6. 6. The thermosetting resin composition according to claim 1, wherein the polyimide resin (A1) and the polyimide resin (A2) have an imide group equivalent of 350 or more and 1,000 or less.

7. The thermosetting resin composition according to any one of claims 1 to 6, wherein the polyimide resin (A1) and the polyimide resin (A2) have a diamine residue having a structure represented by formula (3). 【Chemistry 10】 (In formula (3), R ７ and R ８ may be the same or different and represent an alkyl group, an alkoxy group, a fluoroalkyl group, a phenyl group, or a phenoxy group having 1 to 30 carbon atoms.

8. The thermosetting resin composition according to any one of claims 1 to 7, wherein the polyimide resin (A1) and the polyimide resin (A2) have a glass transition temperature (Tg) of 100°C or higher and 200°C or lower.

9. The thermosetting resin composition according to any one of claims 1 to 8, wherein the content of the phenylene ether resin (B) is 5% by weight or more and 50% by weight or less based on 100% by weight of the thermosetting resin composition.

10. 10. A thermosetting resin sheet comprising the thermosetting resin composition according to claim 1 in an uncured state formed as a layer on a support.

11. A cured film obtained by curing the thermosetting resin composition according to any one of claims 1 to 9 or the thermosetting resin sheet according to claim 10.

12. An electronic component comprising the cured film according to claim 11.

13. An electronic component including at least one antenna element having one or more antenna wirings and the cured film according to claim 11, The antenna wiring includes at least one antenna selected from the group consisting of a meandering loop antenna, a coiled loop antenna, a meandering monopole antenna, a meandering dipole antenna, and a microstrip antenna, and the area occupied by each antenna portion in the antenna wiring is 1000 mm ２ 13. The electronic component according to claim 12, wherein the cured film is an insulating film that provides insulation between a ground and an antenna wiring.

14. An electronic component including a semiconductor package having at least a semiconductor element, a rewiring layer, a sealing resin, and an antenna wiring, 14. The electronic component according to claim 12, wherein the insulating layer of the rewiring layer and / or the sealing resin comprises the cured film according to claim 11, and the sealing resin is located between the ground and the antenna wiring.

15. An electronic component comprising an antenna wiring and an antenna element obtained by laminating the cured film according to claim 11, The electronic component according to any one of claims 12 to 14, wherein the height of the antenna wiring is 50 to 200 µm, and the thickness of the cured film is 80 to 300 µm.

16. An electronic device using the electronic component according to any one of claims 12 to 15.

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