Antenna device

Abstract

An antenna device is provided with: a base (4b) having a mounting part (pad (16a)); and a chip electronic component (capacitor chip (12)). The pad (16a) has at least one pair of mounting terminals (16c) for mounting the capacitor patch (12). The base (4b) has a concave-convex portion (20) formed at an edge portion (4g) of the opening (4e). The concave-convex portion (20) is composed of a concave portion (21) and a convex portion (22), and protrudes and is recessed at an edge portion (4g) of the opening portion (4e) in an arrangement direction of the paired mounting terminals (16c). The projection (22) defines a mounting space for at least one pair of terminals (12a) of the capacitor patch (12) at a position facing the paired mounting terminals (16c).

Description

Technical Field

[0001] The invention relates to an antenna device equipped with a patch electronic component. Background Art

[0002] In recent years, keyless entry systems that can transmit and receive radio wave signals when locking and unlocking doors provided in vehicles, houses, etc. have been put into practical use.

[0003] Furthermore, in order to realize the keyless entry system, an antenna device such as an LF (Low Frequency) transmission antenna capable of transmitting and receiving radio wave signals is often used.

[0004] For example, the antenna device disclosed in Patent Document 1 includes: a base having a through opening; a coil; a terminal member; and a capacitor. The terminal member has a patch support piece part of which a portion is exposed from the opening of the base. The capacitor is mounted on the patch support piece by reflow soldering.

[0005] Furthermore, in order to prevent the capacitor from being displaced during reflow (in order to maintain physical and electrical connection with the mounting terminal), a plurality of protrusions are provided on the terminal member itself.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2017-103549 Summary of the invention

[0009] Problem that the invention aims to solve

[0010] However, in the antenna device disclosed in Patent Document 1, in order to provide the protrusion on the terminal member, it is necessary to select a material having appropriate plasticity and toughness, and the thickness of the material itself is also required.

[0011] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an antenna device capable of maintaining a good physical connection and an electrical connection with a mounting terminal.

[0012] Solutions for solving problems

[0013] According to the present invention, an antenna device comprises: a base having an opening portion, a mounting portion in the opening portion; and a chip electronic component mounted on the mounting portion, the antenna device being characterized in that the mounting portion has at least one pair of mounting terminals for mounting the chip electronic component, the base having a concave-convex portion formed on an edge portion of the opening portion, the concave-convex portion being composed of a concave portion and a convex portion, and protruding and recessed on the edge portion of the opening portion in the arrangement direction of the paired mounting terminals, the convex portion defining a mounting space for the chip electronic component, and the at least one pair of terminals of the chip electronic component defining the mounting space at a position relative to the paired mounting terminals.

[0014] Effects of the Invention

[0015] According to the present invention, there is provided an antenna device in which, by providing the protrusion on the base portion, the chip electronic component can be positioned and the physical and electrical connections with the mounting terminals can be preferably maintained. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a perspective view of an antenna device.

[0017] Figure 2 Yes Figure 1 The enlarged view of part II is a front view showing the opening.

[0018] Figure 3 It is a front view showing the opening of the capacitor chip in a state where the opening is provided inside and located at a position abutting against the convex portion.

[0019] Figure 4 Yes means Figure 2 Schematic cross-sectional view of section IV-IV.

[0020] Figure 5 This is a front view of the opening portion showing a state in which a solder fillet is formed between a terminal of the capacitor chip and a mounting terminal.

[0021] Figure 6 It is a front view showing an opening portion in which a convex portion according to the first modification is provided.

[0022] Figure 7 is a diagram showing the convex portion of the second variant. Figure 4 Corresponding schematic cross-sectional view. DETAILED DESCRIPTION

[0023] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0024] In addition, the embodiment described below is only an example for easy understanding of the present invention, and does not limit the present invention. That is, the shape, size, configuration, etc. of the member described below can be changed and improved without departing from the gist of the present invention, and of course its equivalent is included in the present invention.

[0025] In addition, the various constituent elements of the present invention do not need to exist independently, and it is allowed that multiple constituent elements are constituted as a single constituent element, one constituent element is divided into multiple constituent elements, a certain constituent element is part of other constituent elements, a part of a certain constituent element overlaps with a part of other constituent elements, etc.

[0026] In addition, in all the drawings, the same reference numerals are used for the same components, and repeated descriptions are appropriately omitted. In addition, in this specification, sometimes the upper and lower directions are specified for description, but this is appropriately set to illustrate the relative relationship of the components and does not limit the direction of the product of the present invention when it is manufactured or used.

[0027] <Overview of Antenna Device>

[0028] First, the main reference Figure 1 and Figure 2 The outline of the antenna device 1 will be described.

[0029] Figure 1 is a perspective view of the antenna device 1, Figure 2 Yes Figure 1 The enlarged view of part II of FIG. 4 is a front view showing the opening 4e. Figure 2 and the following Figure 3 In, omitted Figure 5 An illustration of solder foot 19 is shown.

[0030] The antenna device 1 includes a base 4b having a mounting portion (pad 16a) in an opening 4e and a chip electronic component (capacitor chip 12) mounted on the pad 16a. The pad 16a has at least a pair of mounting terminals 16c for mounting the capacitor chip 12.

[0031] The base 4b has a concavoconvex portion 20 formed at the edge portion 4g of the opening 4e. The concavoconvex portion 20 is composed of a concave portion 21 and a convex portion 22, and is protruded and recessed at the edge portion 4g of the opening 4e in the arrangement direction of the paired mounting terminals 16c.

[0032] The protrusion 22 defines a mounting space for the capacitor chip 12 , and defines the mounting space at a position where at least a pair of terminals 12 a of the capacitor chip 12 and a pair of mounting terminals 16 c face each other.

[0033] Regarding the relative position of a pair of terminals 12a and a pair of mounting terminals 16c, specifically, any position is sufficient as long as a portion of one of the pair of mounting terminals 16c contacts a portion of one of the pair of terminals 12a of the capacitor patch 12, and a portion of the other of the pair of mounting terminals 16c contacts a portion of the other of the pair of terminals 12a of the capacitor patch 12.

[0034] like Figure 2 As shown, specifically, the concavo-convex portions 20 are provided on the respective opposing surfaces of the edge portion 4g of the opening portion 4e that are opposed to each other in the arrangement direction of the paired mounting terminals 16c.

[0035] In the present specification, “opposed to” is not limited to the case where the two devices are opposed to each other so as to extend in parallel, but also includes the case where the two devices are opposed to each other with an inclination of not less than 0 degrees and less than ±90 degrees when the parallel state is set to 0 degrees.

[0036] The recess 21 is recessed away from the center of the opening 4e relative to the protrusion 22 in the arrangement direction of the paired mounting terminals 16c. On the other hand, the protrusion 22 protrudes toward the center of the opening 4e relative to the recess 21 in the arrangement direction of the paired mounting terminals 16c.

[0037] As chip electronic components, there are, for example, resistor chips, in addition to the capacitor chip 12 described in this embodiment.

[0038] According to the above structure, by providing the protrusion 22 on the base 4b, each terminal 12a of a pair of terminals 12a provided on the chip electronic component (capacitor chip 12) can be preferably arranged at a position relative to each mounting terminal 16c in the pair of mounting terminals 16c.

[0039] Furthermore, since the concavo-convex portion 20 is provided not on the mounting terminal 16c but on a part of the base 4b, the material of the mounting terminal 16c can be freely selected from the conductive material, and the material can be made thinner to reduce the material cost.

[0040] [Overall structure]

[0041] Next, the overall structure of the antenna device 1 will be described. Figure 1 As shown, the antenna device 1 mainly includes: a longitudinally long plate-shaped magnetic core 3; a base portion 4 that holds the magnetic core 3; a plurality of coils 5 that are spirally wound around the base portion 4 at intervals; and a capacitor chip 12.

[0042] The core 3 amplifies the magnetic field generated by the coil 5 and is housed in the base 4 (the bobbin 4a described later) with a portion thereof exposed. The core 3 is formed longitudinally and has a flat cross-sectional shape (rectangular shape) in a cross section perpendicular to the longitudinal direction.

[0043] As materials for the magnetic core 3, there can be cited a magnetic core made of ceramics with iron oxide as the main component (ferrite core), a magnetic core made of an amorphous alloy (amorphous core), a magnetic core formed by compressing metal powder (powder core), and a magnetic core formed by electrically insulating multiple electromagnetic steel plates in a stacked structure (stacked core).

[0044] The coil 5 is an element that is a main part of the inductance element in the series resonant circuit of the antenna device 1. The coil 5 of this embodiment is spirally wound around the base portion 4 (the bobbin 4a described later) at four intervals. Figure 1 The lead frame 16 is shown connected.

[0045] The base portion 4 of this embodiment is formed of an insulating material such as resin. Figure 1 As shown, the magnetic core 3 housed therein and the coil 5 wound around the bobbin 4a are insulated.

[0046] The base portion 4 is connected to: a winding tube 4a, which is located in the central portion in the longitudinal direction and is used for the coil 5 to be spirally wound; and a base 4b, which is formed on both sides of the winding tube 4a, and the base 4b has an opening portion 4e on one side and a capacitor patch 12 is installed in the opening portion 4e.

[0047] [Opening]

[0048] Next, the opening 4 e provided in the base portion 4 will be described in detail.

[0049] In the antenna device 1 of the present embodiment, in order to expose the mounting terminal 16c (pad 16a) from the base 4b and mount the capacitor patch 12, an opening 4e is provided in the base 4b. The opening 4e is not formed to penetrate the base 4b in the thickness direction of the base 4b. In other words, the opening 4e is formed as a thin wall thinner than the surrounding in the base 4b, and the pad 16a is exposed to form a mounting space for the capacitor patch 12.

[0050] In the present embodiment, the opening 4e is formed in a double rectangular shape in a plan view, and is formed so as to increase in depth as it approaches the opening end ( Figure 2 The front side (in the direction of the paper) of the device is opened in a trumpet shape.

[0051] That is, the edge portion 4g of the opening 4e is formed to be inclined with respect to the opening and a pad 16a described later located on the opposite side of the opening.

[0052] In a plan view, a pair of pads 16a described later are provided on the bottom surface of the opening 4e.

[0053] [Concave and convex part]

[0054] Next, regarding the concave-convex portion 20 which defines the mounting position of the capacitor chip 12 and ensures the formation area of ​​the solder fillet 19, in addition to referring to Figure 1 and Figure 2 In addition, the main reference Figure 3 and Figure 4 Provide explanation.

[0055] Figure 3 1 is a front view showing a state in which the opening 4 e of the capacitor chip 12 is provided inside and located at a position abutting against the protrusion 22 . Figure 4 Yes means Figure 2 Schematic cross-sectional view of section IV-IV.

[0056] In addition, Figure 4 and the following Figure 7 In the figure, the capacitor patch 12 is shown in simplified cross section and is Figure 2 and Figure 3 Differently, the figure shows a solder foot 19 .

[0057] like Figure 2 to Figure 4 As shown, the concave-convex portion 20 is provided on each surface of the edge portion 4g of the opening 4e that faces each other in the arrangement direction of the paired mounting terminals 16c. The convex portion 22 of the concave portion 21 and the convex portion 22 constituting the concave-convex portion 20 functions as a positioning portion for defining the position of the capacitor patch 12.

[0058] In this specification, "concave and convex" are relative. When only convex is formed on the side (or surface, to be exact) when the opening 4e is viewed from above, the portion other than the convex is called concave. On the contrary, when only concave is formed on the side (or surface, to be exact), the portion other than the concave is called convex. That is, there is no such a situation that only one of the concave and convex is formed.

[0059] The concave-convex portion 20 may also be provided on one of the surfaces facing each other in the arrangement direction of the paired mounting terminals 16c. Even in such a case, the chip electronic component (capacitor chip 12) can be positioned on the side provided with the concave-convex portion 20, thereby ensuring that the chip electronic component (capacitor chip 12) is positioned properly. Figure 5 The formation area of ​​the solder fillet 19 is shown.

[0060] However, by providing the concavo-convex portions 20 on the opposing surfaces, that is, on both sides, the capacitor chip 12 can be positioned on both sides in the arrangement direction of the paired mounting terminals 16 c.

[0061] Therefore, the formation area of ​​the solder fillets 19 provided on both sides of the capacitor patch 12 can be ensured, thereby preventing the capacitor from becoming in a monumental state (one side joined and the other side separated) due to the tensile force generated from one side during reflow soldering due to deviation in the solder amount, which is more preferable.

[0062] In the present embodiment, the projection 22 is disposed at the center portion of the mounting surface 16e in a direction (width direction) perpendicular to the arrangement direction of the paired mounting terminals 16c when the opening 4e is viewed from above.

[0063] The "central portion of the mounting surface 16e in a direction perpendicular to the arrangement direction of the paired mounting terminals 16c" where the protrusions 22 are provided refers to, for example, a 40 percent area on the central side with respect to the entire length of the mounting surface 16e in the perpendicular direction.

[0064] According to the above structure, by arranging the protrusion 22 in the central part of the mounting surface 16e, it is possible to form solder fillets 19 on both sides of the protrusion 22 of the mounting surface 16e, thereby improving the bonding strength between the terminal 12a of the capacitor chip 12 and the mounting terminal 16c.

[0065] In particular, Figure 3 In the embodiment, a pair of protrusions 22 are formed in the center of the mounting area in the width direction, and the width dimension of the capacitor patch 12 is larger than half of the opening 4e. With such a configuration, no matter how the capacitor patch 12 moves in the left-right direction (width direction), the upper side of the capacitor patch 12 abuts against the protrusions 22, and the capacitor patch 12 can be positioned using the protrusions 22.

[0066] However, the present invention is not limited to such a structure. As described above, it is preferable as long as the protrusions 22 are provided on the respective opposing surfaces that are opposed to each other in the arrangement direction of the paired mounting terminals 16 c , and the arrangement and number thereof can be arbitrarily set.

[0067] However, by reducing the number of the protrusions 22, a larger area for forming the fillet 19 can be ensured, and the occurrence of welding cracks can be suppressed.

[0068] By forming the recess 21 at the edge 4g of the opening 4e, the solder fillet 19 is smoothly and continuously formed in a manner that it becomes thinner as it slopes gently from the terminal 12a of the capacitor patch 12 toward the edge 4g of the opening 4e at the pad 16a. By forming the solder fillet 19 in this way, stress concentration is reduced, and solder cracks are less likely to occur.

[0069] The convex portion 22 is formed so as to become narrower in width on the protruding side when the opening 4e is viewed from above.

[0070] In the present embodiment, the protruding end of the convex portion 22 is formed in a semicircular shape when the opening 4e is viewed from above, and thus the convex portion 22 is formed so that the width thereof becomes narrower on the protruding side.

[0071] However, as long as the width becomes narrower on the protruding side, the structure is not limited to this, and may be formed in a step shape.

[0072] According to the above configuration, as the width of the protrusion 22 is narrowed, the solder fillet 19 formed between the terminal 12 a of the chip electronic component (capacitor chip 12 ) and the mounting terminal 16 c can be made larger in the width direction of the protrusion 22 .

[0073] Furthermore, it is preferable that the convex portion 22 of the present embodiment is formed so that the width gradually narrows on the protruding side when the opening portion 4e is viewed from above.

[0074] As described above, in the plan view of the opening 4 e , the protruding portion of the convex portion 22 of the present embodiment that protrudes from the concave portion 21 is formed in a semicircular shape, and is formed so that the width thereof gradually narrows on the protruding side.

[0075] The above-mentioned “the width gradually narrows” means that the width narrows smoothly, and is not limited to the case where the surface on the protruding side is formed in a curved shape like the semicircular protrusion 22 .

[0076] The gradually narrowing convex portion 22 also includes a convex portion formed in a trapezoidal shape, for example, which is formed to be inclined so as to become narrower in the protruding direction of the convex portion 22 when the opening portion 4e is viewed in a plan view.

[0077] According to the above configuration, the width of the protrusion 22 is gradually narrowed on the protruding side, so that the solder fillet 19 formed between the terminal 12a of the chip electronic component (capacitor chip 12) and the mounting terminal 16c can be easily formed continuously along the protrusion 22.

[0078] like Figure 4 As shown, the upper surface 22a of the protrusion 22 (the surface on the side opposite to the mounting surface 16e) is inclined in a hypothetical plane that is perpendicular to the mounting surface 16e of the mounting terminal 16c and includes the arrangement direction of the paired mounting terminals 16c, so as to approach the mounting surface 16e as it moves toward the center side of the opening 4e.

[0079] The “upper surface” refers to the surface on the opposite side to the surface facing the mounting terminal 16 c , and “upper and lower” has nothing to do with the direction of gravity.

[0080] According to the above configuration, it is possible to prevent the protrusion 22 from becoming an obstacle when the chip electronic component (capacitor chip 12) is arranged on the center side of the opening 4e.

[0081] Specifically, by inclining the upper surface 22a of the protrusion 22 downward so as to approach the mounting surface 16e as it goes toward the center of the opening 4e as described above, the capacitor chip 12 can be moved toward the center of the opening 4e.

[0082] More specifically, even if the capacitor patch 12 falls on the upper surface 22a of the protrusion 22, the reaction force applied to the capacitor patch 12 from the protrusion 22 toward the center side of the opening 4e or the self-weight of the capacitor patch 12 can cause the capacitor patch 12 to slide on the upper surface 22a of the protrusion 22, and move the capacitor patch 12 to the center side of the opening 4e where the mounting terminal 16c is exposed.

[0083] like Figure 3 As shown, in a direction perpendicular to the arrangement direction of the paired mounting terminals 16 c when the opening 4 e is viewed from above, the length W1 of the protrusion 22 is shorter than the length W2 of the mounting terminals 16 c.

[0084] According to the above configuration, the area for solder fillet 19 provided between terminal 12a of the chip electronic component (capacitor chip 12) and mounting terminal 16c can be ensured in the portion of mounting terminal 16c that does not overlap with protrusion 22.

[0085] [Installation Department]

[0086] Next, regarding the mounting portion (pad 16a, mounting terminal 16c), in addition to referring to Figure 3 and Figure 4 In addition, the main reference Figure 5 Provide explanation. Figure 5 It is a front view showing the opening 4e in a state where the solder fillet 19 is formed between the terminal 12a of the capacitor chip 12 and the mounting terminal 16c.

[0087] The pads 16a are part of the lead frame 16 and are mounting terminals 16c to which the terminals 12a of the capacitor chip 12 are joined by solder. Another part of the lead frame 16 is disposed inside the base portion 4, and a pair of pads 16a are exposed from the base portion 4 to the outside.

[0088] The paired mounting terminals 16c are arranged with gaps 16d between them. Figure 3 As shown, the total length L1 of the protruding length of the protrusion 22 from the recess 21 to the installation space and the length direction dimension of the chip electronic component (capacitor chip 12) is longer than the shortest length L2 from the recess 21 to the mounting terminal 16c in the pair of mounting terminals 16c located at a position farther from the gap 16d.

[0089] The "lengthwise dimension of the chip electronic component" referred to herein refers to the length from the end of the chip electronic component (capacitor chip 12) that contacts the protrusion 22 to the distal end of the terminal 12a on the distal side ( Figure 3 The size of the lower end of the

[0090] The relationship between the length L1 and the length L2 is not only Figure 3This holds true for the relationship between the upper protrusion 22 and the lower mounting terminal 16 c shown, and also holds true for the relationship between the lower protrusion 22 and the upper lower mounting terminal 16 c.

[0091] In the above, the mounting terminal 16 c located on the “far side” for defining the length L2 refers to the mounting terminal 16 c located on the side away from the recessed portion 21 serving as a reference when defining the length L1.

[0092] According to the above structure, by making the chip electronic component (capacitor chip 12), the concave-convex portion 20 (the concave portion 21 and the convex portion 22) and the mounting terminal 16c be in the above-mentioned length relationship, a pair of terminals 12a of the capacitor chip 12 positioned by the convex portion 22 must be located on the mounting terminal 16c.

[0093] The mounting terminal 16c is preferably a metal terminal that is insert-molded in the base 4b.

[0094] According to the above configuration, the mounting terminal 16 c is formed by insert molding during the injection molding of the base portion 4 , and thus the mounting terminal 16 c can be easily arranged in the opening portion 4 e .

[0095] The mounting terminal 16c may be a film-like conductive material printed and formed on the base 4b.

[0096] According to the above structure, since the protrusion 22 is formed on the base 4b, it is not necessary to form a part of the mounting terminal 16c thick for positioning, and the mounting terminal 16c can be formed into a thin film by printing. For example, the mounting terminal 16c can be formed into a thin film by forming a pad pattern including the mounting terminal 16c with a conductive paste and performing resin plating on the base 4b, and the manufacturing method is not limited.

[0097] (First Modification)

[0098] Next, refer to Figure 6 The convex portion 32 according to the first modification will be described. Figure 6 It is a front view showing an opening 4e in which a convex portion 32 according to a first modification is provided.

[0099] When the opening 4e is viewed from above, the convex portion 22 of this example has a rectangular protrusion with a width narrower than that of the base end at the protruding end, so that the convex portion 22 is formed to be narrower on the protruding side. That is, when the opening 4e is viewed from above, the convex portion 32 is narrowed in a stepwise manner on the protruding side.

[0100] According to the above configuration, as the width of the protrusion 22 is narrowed, the solder fillet 19 formed between the terminal 12 a of the chip electronic component (capacitor chip 12 ) and the mounting terminal 16 c can be made larger in the width direction of the protrusion 22 .

[0101] Furthermore, the number of steps of the convex portion 22 may be further increased.

[0102] (Second Modification)

[0103] Next, refer to Figure 7 The convex portion 42 according to the second modification will be described. Figure 7 The convex portion 42 of the second modification example is shown in FIG. Figure 4 Corresponding schematic cross-sectional view.

[0104] like Figure 7 As shown, the protrusion 42 of this example is arranged apart from the mounting terminal 16c in the mounting direction (direction perpendicular to the mounting surface 16e).

[0105] Specifically, a gap 42a is formed between the protrusion 42 and the mounting terminal 16c. Solder penetrates into the gap 42a to form a solder fillet 19, and the protrusion 42 and the mounting terminal 16c are joined and integrated via the solder fillet 19 located in the gap 42a.

[0106] In this way, by making the protrusion 42 separate from the mounting terminal 16 c (protruding in an eaves shape), it is possible to prevent the protrusion 42 separate from the mounting terminal 16 c from interfering with the formation of the solder fillet 19 .

[0107] In particular, since the solder fillet 19 is biased toward the mounting terminal 16 c due to its own weight, providing the gap 42 a between the protrusion 42 and the mounting terminal 16 c can effectively prevent the gap 42 a from becoming an obstacle to the formation of the solder fillet 19 .

[0108] Furthermore, if it is difficult to form the protrusion 42 during injection molding of the base 4b, the protrusion 42 may be attached to another portion of the base 4b later.

[0109] The above-described embodiment and modified examples include the following technical ideas.

[0110] (1) An antenna device, comprising: a base having an opening portion, a mounting portion in the opening portion; and a chip electronic component mounted on the mounting portion, wherein the mounting portion has at least one pair of mounting terminals for mounting the chip electronic component, the base having a concave-convex portion formed on an edge portion of the opening portion, the concave-convex portion being composed of a concave portion and a convex portion and protruding and recessed on the edge portion of the opening portion in an arrangement direction of the paired mounting terminals, the convex portion defining a mounting space for the chip electronic component, and the at least one pair of terminals of the chip electronic component defining the mounting space at a position relative to the paired mounting terminals.

[0111] (2) An antenna device according to (1), wherein the paired mounting terminals are arranged with a gap therebetween, and the total length of the protruding length of the protrusion from the recess toward the mounting space and the length direction dimension of the chip electronic component is longer than the shortest length from the recess to the mounting terminal in the paired mounting terminals that is located farther from the gap.

[0112] (3) The antenna device according to (1) or (2), wherein the concavo-convex portion is provided on surfaces of the edge portion of the opening that are opposed to each other in the arrangement direction of the paired mounting terminals.

[0113] (4) The antenna device according to any one of (1) to (3), wherein the convex portion is formed so as to become narrower in width on a protruding side when the opening portion is viewed from above.

[0114] (5) The antenna device according to (4), wherein the convex portion is formed so as to gradually narrow in width on a protruding side when the opening portion is viewed from above.

[0115] (6) An antenna device according to any one of (1) to (5), wherein the upper surface of the protrusion is inclined downward in a manner approaching the mounting surface as it moves toward the center side of the opening portion within an imaginary plane that is perpendicular to the mounting surface of the mounting terminals and includes the arrangement direction of the paired mounting terminals.

[0116] (7) The antenna device according to any one of (1) to (6), wherein the protrusion is arranged apart from the mounting terminal in the mounting direction.

[0117] (8) The antenna device according to any one of (1) to (7), wherein the length of the protrusion is shorter than the length of the mounting terminal in a direction perpendicular to the arrangement direction of the paired mounting terminals when the opening is viewed from above.

[0118] (9) The antenna device according to (8), wherein the protrusion is provided at a central portion of a mounting surface of the pair of mounting terminals in a direction perpendicular to an arrangement direction of the pair of mounting terminals when the opening is viewed from above.

[0119] (10) The antenna device according to any one of (1) to (9), wherein the mounting terminal is a metal terminal insert-molded in the base.

[0120] (11) The antenna device according to any one of (1) to (10), wherein the mounting terminal is a film-shaped conductive material formed by printing on the base.

[0121] Description of Reference Numerals

[0122] 1. Antenna device; 3. Magnetic core; 4. Base portion; 4a. Coil bobbin; 4b. Base; 4e. Opening portion; 4g. Edge portion; 5. Coil; 12. Capacitor chip (chip electronic component); 12a. Terminal; 16. Lead frame; 16a. Pad (mounting portion); 16c. Mounting terminal; 16d. Gap; 16e. Mounting surface; 19. Solder foot; 20. Concave and convex portion; 21. Concave portion; 22, 32, 42, convex portion; 22a. Upper surface; 42a. Gap.

Claims

1. An antenna device, comprising: a base having an opening, a mounting portion in the opening; and a chip electronic component mounted on the mounting portion, wherein: The mounting portion has at least one pair of mounting terminals for mounting the chip electronic component. The base has a concave-convex portion formed at an edge of the opening, The concavo-convex portion is composed of a concave portion and a convex portion, and is protruded and recessed at the edge of the opening portion in the arrangement direction of the paired mounting terminals. The protrusion defines a mounting space for the chip electronic component, and at least one pair of terminals of the chip electronic component defines the mounting space at a position opposite to the pair of mounting terminals.

2. The antenna device according to claim 1, wherein: The paired mounting terminals are arranged with gaps therebetween. The total length of the protrusion of the protrusion from the recess into the mounting space and the longitudinal dimension of the chip electronic component is longer than the shortest length from the recess to the mounting terminal of the pair located farther from the gap.

3. The antenna device according to claim 1 or 2, wherein: The concavo-convex portions are provided on surfaces of the edge portion of the opening that are opposed to each other in the arrangement direction of the paired mounting terminals.

4. The antenna device according to any one of claims 1 to 3, wherein: The convex portion is formed so as to be narrower in width on a protruding side when the opening portion is viewed from above.

5. The antenna device according to claim 4, wherein: The convex portion is formed so that the width thereof gradually narrows on the protruding side when the opening portion is viewed from above.

6. The antenna device according to any one of claims 1 to 5, wherein: The upper surface of the protrusion is inclined downwardly so as to approach the mounting surface as it goes toward the center side of the opening in a virtual plane that is perpendicular to the mounting surface of the mounting terminals and includes the arrangement direction of the paired mounting terminals.

7. The antenna device according to any one of claims 1 to 6, wherein: The protrusion is arranged apart from the mounting terminal in the mounting direction.

8. The antenna device according to any one of claims 1 to 7, wherein: The length of the protrusion is shorter than the length of the mounting terminal in a direction perpendicular to an arrangement direction of the paired mounting terminals when the opening is viewed from above.

9. The antenna device according to claim 8, wherein: The convex portion is disposed at a central portion of a mounting surface of the pair of mounting terminals in a direction perpendicular to an arrangement direction of the pair of mounting terminals when the opening portion is viewed in a plan view.

10. The antenna device according to any one of claims 1 to 9, wherein: The mounting terminal is a metal terminal that is insert-molded in the base.

11. The antenna device according to any one of claims 1 to 10, wherein: The mounting terminal is a film-shaped conductive material that is printed and formed on the base.

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