Power Conversion Equipment

Abstract

To provide a power converter having high freedom in arrangement of switching components, and having high operation accuracy.SOLUTION: A high-voltage board 510 has a P-busbar 601, an N-busbar 602, and an output busbar 603. The P-busbar 601, N-busbar 602, and output busbar 603 extend in a circumferential direction CD. On the output busbar 603, output currents IoA and IoB flow from an upper arm switch portion 530A toward a lower arm switch portion 530B to an overlapping area AO. On the P-busbar 601, P-currents IpA and IpB flow from a smoothing capacitor portion 580 toward the upper arm switch portion 530A in a direction opposite to the output current IoA to the overlapping area AO. On the N-busbar 602, N-currents InA and InB flow from the lower arm switch portion 530B toward the smoothing capacitor portion 580 in a direction opposite to the output current IoA to the overlapping area AO.SELECTED DRAWING: Figure 19

Description

[Technical field]

[0001] The disclosure herein relates to power conversion devices. [Background technology]

[0002] Patent Document 1 describes a power conversion device. The power conversion device has a positive conductor on the positive side, a negative conductor on the negative side, an output conductor on the output side, and a semiconductor device. The semiconductor device has an upper arm and a lower arm of an upper and lower arm circuit. The semiconductor device has a positive external terminal, a negative external terminal, and an output external terminal. The positive external terminal is connected to the input side of the upper arm, and the negative external terminal is connected to the output side of the lower arm. The output external terminal is connected to the output side of the upper arm and the input side of the lower arm. In the semiconductor device, the positive external terminal is connected to the positive conductor, the negative external terminal is connected to the negative conductor, and the output external terminal is connected to the output conductor. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-35112 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the above-mentioned Patent Document 1, the upper arm and the lower arm are integrated by the semiconductor device serving as the switch component, which reduces the degree of freedom in terms of the arrangement of the switch component.

[0005] Therefore, a method is conceivable in which the upper arm and the lower arm are formed from separate switch components, thereby increasing the degree of freedom in arranging the switch components. However, in a configuration in which the upper switch component forming the upper arm and the lower switch component forming the lower arm are provided at positions spaced apart from each other, it is considered that the parasitic inductance increases by the distance between the upper switch component and the lower switch component. For example, in the space between the upper switch component and the lower switch component, the magnetic field generated by the current passing through the positive conductor and the magnetic field generated by the current passing through the negative conductor are not canceled, and the parasitic inductance is likely to increase. If the parasitic inductance increases in this way, there is a concern that the operating accuracy of the power conversion device will decrease.

[0006] A main object of the present disclosure is to provide a power conversion device that has a high degree of freedom in terms of the arrangement of switch components and has high operational accuracy. [Means for solving the problem]

[0007] The various aspects disclosed in this specification employ different technical means to achieve their respective objectives. The reference symbols in parentheses in the claims and in this section are merely examples showing the correspondence with the specific means described in the embodiments below as one aspect, and do not limit the technical scope.

[0008] In order to achieve the above object, the first aspect disclosed herein is A power conversion device (80) for converting electric power, A high potential conductor (601) extending in the extension direction (CD) and supplied with power; A low potential conductor (602) extending in a direction parallel to the high potential conductor and supplied with power; an output conductor (603) extending along the high potential conductor and the low potential conductor for outputting electric power; An upper switch component (530A) on the high potential side that switches to convert power; A lower switch component (530B) on the low potential side that switches to convert power; A capacitor component (580, 580A, 580B) electrically connected in parallel to the upper switch component and the lower switch component; Equipped with the upper switch component and the lower switch component are connected to the output conductor at positions spaced apart from each other in the extension direction such that output currents (IoA, IoB) flow through the output conductor in the extension direction from the upper switch component to the lower switch component; A capacitor component and an upper switch component are connected to the high potential conductor such that a high potential current (IpA, IpB) flows in the high potential conductor from the capacitor component toward the upper switch component in a direction opposite to the direction of the output current in an overlapping area (AO) that overlaps with the output current in the extension direction, This is a power conversion device in which a lower switch component and a capacitor component are connected to the low potential conductor in the overlap region so that a low potential current (InA, InB) flows from the lower switch component to the capacitor component in the opposite direction to the output current through the low potential conductor.

[0009] According to the first aspect, the upper switch component and the lower switch component are connected to the output conductor at positions spaced apart from each other in the extension direction. This configuration makes it possible to change the distance between the upper switch component and the lower switch component, thereby increasing the degree of freedom in the arrangement of these switch components.

[0010] Moreover, in the overlapping region, the high potential current flowing through the high potential conductor and the low potential current flowing through the low potential conductor flow in the opposite direction to the output current flowing through the output conductor. In this configuration, the magnetic fields generated by the high potential current and the low potential current and the magnetic field generated by the output current cancel each other out, which makes it easier to reduce the parasitic inductance generated in the high potential conductor, the low potential conductor, and the output conductor. This makes it possible to prevent the operational accuracy of the upper switch component and the lower switch component from decreasing.

[0011] As a result, it is possible to increase the degree of freedom regarding the arrangement of switch components and to improve the operational accuracy of the power conversion device.

[0012] The second aspect is A power conversion device (80) for converting electric power, A high potential conductor (601) extending in the extension direction (CD) and supplied with power; A low potential conductor (602) extending in a direction parallel to the high potential conductor and supplied with power; an output conductor (603) extending along the high potential conductor and the low potential conductor for outputting electric power; an upper switch component (530A) having an upper input terminal (532A) connected to a high potential conductor and an upper output terminal (533A) connected to an output conductor, and switching for converting electric power; a lower switch component (530B) having a lower input terminal (532B) connected to an output conductor and a lower output terminal (533B) connected to a low potential conductor, the lower switch component (530B) switching to convert power; a capacitor component (580, 580A, 580B) having a high capacitor terminal (582) connected to a high potential conductor and a low capacitor terminal (583) connected to a low potential conductor, the capacitor component (580, 580A, 580B) being electrically connected in parallel to the upper switch component and the lower switch component; Equipped with An upper output terminal and a lower input terminal are connected to the output conductor at positions spaced apart from each other in the extension direction, the high potential conductor is connected such that at least one of the upper input terminal and the high capacitor terminal is located between the upper output terminal and the lower input terminal, and such that the upper input terminal and the high capacitor terminal are spaced apart in the extension direction; This is a power conversion device in which the low potential conductor is arranged so that at least one of the lower output terminal and the low capacitor terminal is located between the upper output terminal and the lower input terminal, and so that the lower output terminal and the low capacitor terminal are spaced apart in the extension direction.

[0013] According to the second aspect, the upper output terminal and the lower input terminal are connected to the output conductor at positions spaced apart from each other in the extension direction. With this configuration, it is possible to change the distance between the upper output terminal and the lower input terminal. This increases the degree of freedom in the arrangement of the upper switch component and the lower switch component.

[0014] Moreover, between the upper output terminal and the lower input terminal in the extension direction, at least one of the upper input terminal and the high capacitor terminal, and at least one of the lower output terminal and the low capacitor terminal are provided. In this configuration, between the upper output terminal and the lower input terminal in the extension direction, the current flowing from the high capacitor terminal to the upper input terminal in the high potential conductor is opposite to the output current flowing from the upper output terminal to the lower input terminal in the output conductor. Also, between the upper output terminal and the lower input terminal in the extension direction, the current flowing from the lower output terminal to the low capacitor terminal in the low potential conductor is opposite to the output current. Therefore, the magnetic field generated by the current flowing in the output conductor and the magnetic field generated by the current flowing in the high potential conductor and the low potential conductor cancel each other out, which makes it easier to reduce the parasitic inductance generated in the output conductor, the high potential conductor, and the low potential conductor.

[0015] As a result, similarly to the first aspect, it is possible to achieve both an increased degree of freedom in terms of the arrangement of switch components and an increased operational accuracy of the power conversion device.

[0016] The third aspect is A power conversion device (80) for converting electric power, power conductors (601, 602) extending in an extension direction (CD) and through which power is supplied; An output conductor (603) extending in an extension direction along the power conductor for outputting electric power; An upper switch component (530A) on the high potential side that switches to convert power; A lower switch component (530B) on the low potential side that switches to convert power; Parallel components (580, 580A, 580B) electrically connected in parallel to the upper switch component and the lower switch component; Equipped with the upper switch component and the lower switch component are connected to the output conductor at positions spaced apart from each other in the extension direction such that output currents (IoA, IoB) flow through the output conductor in the extension direction from the upper switch component to the lower switch component; This is a power conversion device in which the parallel components and one of the upper switch components and the lower switch components are connected to the power conductor in an overlap area (AO) that overlaps with the output current in the extension direction, so that a parallel current (IpA, IpB, InA, InB) flows in the power conductor between the parallel components and one of the upper switch components and the lower switch components in the opposite direction to the output current.

[0017] According to the third aspect, the upper switch component and the lower switch component are connected to the output conductor at positions spaced apart in the extension direction, so that the degree of freedom in terms of the arrangement of these switch components can be increased.

[0018] Moreover, in the overlapping region, the parallel current flowing through the power conductors is in the opposite direction to the output current flowing through the output conductors, and in this configuration, the magnetic fields generated by the parallel currents and the output current cancel each other out, which tends to reduce the parasitic inductance generated in the power conductors and the output conductors.

[0019] As a result, similarly to the first and second aspects, it is possible to achieve both an increased degree of freedom in terms of the arrangement of switch components and an increased operational accuracy of the power conversion device. [Brief description of the drawings]

[0020] [Figure 1] FIG. 2 is a diagram showing the electrical configuration of the drive system according to the first embodiment. [Diagram 2] Oblique view of the EPU. [Diagram 3] FIG. 2 is a perspective view of a motor device and an inverter device. [Figure 4] FIG. 2 is a schematic front view of the motor device and the inverter device. [Diagram 5] FIG. 13 is a plan view of the inside of the inverter device in configuration group A, seen from the high voltage side. [Figure 6] FIG. 4 is a plan view of the inside of the inverter device as viewed from the low-voltage side. [Figure 7] Cross-sectional view taken along line VII-VII in Figure 6. [Figure 8]FIG. 4 is a plan view of the inverter housing and the arm switch portion as viewed from the high voltage side. [Figure 9] FIG. 4 is a plan view of the inverter housing and the arm switch portion as viewed from the low-voltage side. [Figure 10] FIG. 2 is a schematic vertical cross-sectional view of the periphery of an arm switch in the inverter device. [Figure 11] FIG. 13 is a perspective view showing the internal structure of the high-voltage substrate in configuration group B as viewed from the low-voltage side. [Figure 12] FIG. 1 is a plan view showing a configuration of a P bus bar and an N bus bar in an inverter device; [Figure 13] FIG. 1 is a plan view showing a configuration of an output bus bar in an inverter device; [Figure 14] FIG. 1 is a plan view showing a configuration of an earth bus bar in an inverter device; [Figure 15] FIG. 11 is a circuit diagram for explaining parasitic inductance of a bus bar. [Figure 16] FIG. 4 is a schematic perspective view of the arm switch portion and its surroundings in the high-voltage board. [Figure 17] FIG. [Figure 18] FIG. 2 is a circuit diagram for explaining an output current, a P current, and an N current. [Figure 19] FIG. 4 is an exploded plan view of a high-voltage board for explaining an output current, a P current, and an N current. [Figure 20] FIG. 11 is a circuit diagram for explaining a current imbalance. [Figure 21] FIG. 13 is a diagram showing switch currents for explaining current imbalance. [Figure 22] FIG. 11 is a circuit diagram for explaining a second comparative example. [Diagram 23] FIG. 13 is a plan view of the inside of the inverter device in configuration group C, viewed from the high voltage side. [Figure 24] FIG. [Diagram 25] FIG. 4 is a view of the arm switch portion and its periphery viewed from the circumferential outside. [Figure 26] FIG. 13 is a plan view of the inside of the inverter device in configuration group D, viewed from the high voltage side. [Figure 27] FIG. 4 is a schematic vertical cross-sectional view for explaining a heat dissipation path of the arm switch portion. [Figure 28] FIG. 4 is a schematic plan view for explaining a heat dissipation path of the arm switch portion. [Figure 29] FIG. 13 is a schematic perspective view of the periphery of an arm switch portion of a high-voltage board in the second embodiment and configuration group B. [Diagram 30] FIG. [Diagram 31] Circuit diagram showing output current, P current and N current. [Diagram 32] FIG. 4 is an exploded plan view of a high-voltage board for explaining an output current, a P current, and an N current. [Diagram 33] FIG. 11 is an exploded plan view of a high-voltage board in a third embodiment. [Diagram 34] FIG. 4 is an exploded plan view of a high-voltage board for explaining an output current, a P current, and an N current. [Diagram 35] FIG. 13 is a perspective view showing the internal structure of a high-voltage board as viewed from the low-voltage side in the fourth embodiment. [Diagram 36] FIG. 13 is a schematic vertical cross-sectional view of the periphery of the arm switch portion in the fifth embodiment and configuration group C. [Figure 37] FIG. 13 is a view of the arm switch portion and its periphery in the sixth embodiment, viewed from the circumferential outside. [Figure 38] FIG. 13 is a view of the arm switch portion and its periphery in the seventh embodiment, viewed from the circumferential outside. [Figure 39] FIG. 23 is a view of the arm switch portion and its periphery in the eighth embodiment, viewed from the circumferential outside. [Diagram 40] FIG. 13 is a perspective view showing a modified example of the EPU. [Diagram 41] FIG. 13 is a perspective view showing a modified example of the EPU. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, a number of embodiments for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, the same reference numerals may be used to designate parts corresponding to matters described in the preceding embodiment, and duplicated descriptions may be omitted. In each embodiment, when only a part of the configuration is described, other embodiments described previously may be applied to other parts of the configuration. In addition to combinations of parts that are specifically indicated as being possible in each embodiment, it is also possible to partially combine embodiments even if not indicated, as long as there is no particular problem with the combination.

[0022] First Embodiment The drive system 30 shown in FIG. 1 is mounted on a moving object such as a vehicle or an aircraft. Vehicles on which the drive system 30 is mounted include, for example, electric vehicles (EVs), hybrid vehicles (HVs), and fuel cell vehicles. Aircraft include aircraft such as vertical take-off and landing aircraft, rotorcraft, and fixed-wing aircraft. These aircraft are sometimes called electric aircraft. An example of a vertical take-off and landing aircraft is the eVTOL. eVTOL is an abbreviation for electric Vertical Take-Off and Landing aircraft.

[0023] The drive system 30 is a system that drives the moving body to move it. If the moving body is a vehicle, the drive system 30 drives the vehicle to run, and if the moving body is an aircraft, the drive system 30 drives the aircraft to fly.

[0024] The drive system 30 has a battery 31 and an EPU 50. The battery 31 is electrically connected to the EPU 50. The battery 31 is a power supply unit that supplies power to the EPU 50, and corresponds to a power supply unit. The battery 31 is a DC voltage source that applies a DC voltage to the EPU 50. The battery 31 has a secondary battery that can be charged and discharged. Examples of this secondary battery include a lithium ion battery and a nickel-metal hydride battery. Note that a fuel cell, a generator, or the like may be used as the power supply unit in addition to or instead of the battery 31.

[0025] The EPU 50 is a driving device for moving a moving body, and is a rotating electric machine unit consisting of a motor electric magnetic circuit 61 and an inverter device 80. The EPU 50 mounted on a vehicle drives and rotates, for example, wheels as a driving object. The EPU 50 mounted on an aircraft drives and rotates, for example, rotors as a driving object. This EPU 50 is sometimes called an electric drive device, a propulsion device that propels an aircraft, etc.

[0026] The EPU 50 has a motor device 60 (see FIG. 2) and an inverter device 80. For example, the EPU 50 has one motor device 60 and one inverter device 80. The motor device 60 has a motor electric magnetic circuit 61. The inverter device 80 has an inverter main circuit 81 composed of a plurality of switch elements. The motor device 60 corresponds to a rotating electric machine, and the inverter device 80 corresponds to a power conversion device. The battery 31 is electrically connected to the motor electric magnetic circuit 61 via the inverter main circuit 81. The motor electric magnetic circuit 61 is supplied with power in accordance with the voltage and current supplied from the battery 31 to the inverter main circuit 81.

[0027] The motor electric magnetic circuit 61 is a multi-phase AC motor. The motor electric magnetic circuit 61 is, for example, a three-phase AC motor, and a brushless motor having U, V, and W phases is used. The motor electric magnetic circuit 61 functions as a generator during regeneration. The coils of the motor electric magnetic circuit 61 usually have three phases, U, V, and W, but the number of phases and the wiring method are not limited.

[0028] The inverter main circuit 81 converts the power supplied to the motor electric magnetic circuit 61 from DC to AC by a high-speed switch. The inverter main circuit 81 is a power conversion unit that converts power. The inverter main circuit 81 performs power conversion for each of the multiple phases.

[0029] The inverter device 80 has a P line 141 and an N line 142. The P line 141 and the N line 142 electrically connect the battery 31 and the inverter main circuit 81. The P line 141 is electrically connected to the positive electrode of the battery 31. The N line 142 is electrically connected to the negative electrode of the battery 31. The battery 31 has a function of supplying or charging power.

[0030] In addition to the inverter main circuit 81, the inverter device 80 has a smoothing capacitor 145 and an EMI filter 150. The smoothing capacitor 145 is made up of a plurality of capacitors connected in parallel, and is connected to the P line 141 and the N line 142. The smoothing capacitor 145 smoothes current ripples that flow due to the intermittent operation of the inverter main circuit 81, and stabilizes the current supplied from the battery 31.

[0031] The EMI filter 150 is a filter circuit that reduces electromagnetic noise generated from the EPU 50, and is located between the battery 31 and the inverter main circuit 81. The EMI filter 150 is connected to the P line 141, the N line 142, and the ground earth of the EPU. The EMI filter 150 may be omitted in an EPU system in which the case and wiring are sufficiently shielded.

[0032] EMI filter 150 has components such as common mode coil 151, normal mode coil 152, Y capacitor 153, X capacitor 154, and varistor 155. In EMI filter 150, the number of stages of common mode coil 151, normal mode coil 152, Y capacitor 153, and X capacitor 154, the circuit configuration, and circuit component constants are designed in accordance with the required EMI standard. Varistor 155 absorbs external surges such as lightning surges, and protects electronic components and electric equipment in EPU 50 from surges.

[0033] If a set of upper arm 84 and lower arm 85 is referred to as one phase leg, inverter main circuit 81 configures a circuit corresponding to the number of phases of the motor, such as U phase, V phase, W phase, etc., by connecting multiple legs in parallel. The high potential side of upper arm 84 is connected to P line 141, and the low potential side of lower arm 85 is connected to N line 142. Furthermore, the low potential side of upper arm 84 and the high potential side of lower arm 85 of each leg are connected to output line 143.

[0034] The upper arm 84 and the lower arm 85 each have an arm switch 86 that can select a conductive state or a non-conductive state and perform switch control, and a diode 87 that can pass a current from the low potential side to the high potential side even in the non-conductive state. The arm switch 86 is, for example, a transistor such as a MOSFET or an RC-IGBT. The arm switch 86 is configured as a single component that combines the arm switch 86 and the diode 87. The arm switch 86 is sometimes called a transistor switch.

[0035] Each of the upper arm 84 and the lower arm 85 is composed of at least one arm switch 86 and one diode 87. In the upper arm 84 and the lower arm 85, each element may be connected in parallel in multiples. Note that in Fig. 1 and Fig. 11, three parallel connections are shown as an example. In Fig. 5 and other figures, six parallel connections are shown as an example.

[0036] The inverter device 80 includes a drive circuit 160 and a control circuit 161. In Fig. 1, the drive circuit 160 is indicated as DD, and the control circuit 161 is indicated as CD.

[0037] The control circuit 161 is a control device such as an ECU, and controls the switch elements of the inverter main circuit 81. ECU is an abbreviation for Electronic Control Unit. The control circuit 161 is mainly composed of a microcomputer circuit including, for example, a processor, a memory, an I / O, a power supply circuit, and wiring connecting these.

[0038] The control circuit 161 executes a control program stored in the memory to determine the conductive state of the arm switch 86 of the inverter main circuit 81. The control circuit 161 is also electrically connected to an external device and various sensors. The external device is, for example, a higher-level ECU such as an integrated ECU mounted on a moving body. The external device has the role of issuing commands for the drive torque and rotation speed of the EPU 50 and monitoring the state of the EPU 50. The various sensors are signal sources required by the control program, such as the temperature, current, voltage, angle, and speed of each part.

[0039] The drive circuit 160 is electrically connected to each of the multiple arm switches 86 in the inverter main circuit 81. The drive circuit 160 drives the gates of the arm switches 86 to a conductive state and a non-conductive state by using the functions of insulation, level conversion, and amplification of a command signal from the control circuit 161. The drive circuit 160 is sometimes referred to as a driver. The conductive state is sometimes referred to as an on state, and the non-conductive state is sometimes referred to as an off state.

[0040] Examples of various sensors built into inverter device 80 include a motor current sensor 146 and a battery current sensor 147. The motor current sensor 146 is electrically connected to the control circuit 161, and is installed, for example, for each of the U phase, V phase, and W phase, to detect the current flowing in the output line 143. The battery current sensor 147 is provided, for example, on the P line 141, and is electrically connected to the control circuit 161, to detect the current flowing in the battery 31.

[0041] 2, 3, and 4, in the EPU 50, the inverter device 80 is arranged along the motor axis Cm of the motor device 60, overlapped in the axial direction AD, and fixed to each other by fasteners such as bolts. The motor device 60 and the inverter device 80 are each formed into a cylindrical shape as a whole. Hereinafter, the directions of the cylindrical shape will be described in terms of the axial direction AD, the radial direction RD, and the circumferential direction CD, which are perpendicular to each other.

[0042] The motor device 60 has at least one stator 200 and at least one rotor 300 that rotates around a motor axis Cm, which constitute a motor electric magnetic circuit 61. The motor device 60 is, for example, an axial gap type motor, and is arranged in the axial direction AD. For example, the stator 200 is provided between two rotors 300.

[0043] 3, the motor housing 70 is, for example, cylindrical, and houses the motor device 60. The motor housing 70 is made of a metal material or the like, and has thermal conductivity.

[0044] The motor housing 70 has a motor outer peripheral wall 71 and motor fins 72. The motor outer peripheral wall 71 is annular in the circumferential direction CD and has an outer peripheral surface 70a for cooling the motor device 60. The motor fins 72 are cooling fins provided on the outer peripheral surface 70a to enhance the heat dissipation effect, protruding radially outward to increase the surface area and extending in the axial direction AD. A plurality of motor fins 72 are arranged in the circumferential direction CD.

[0045] The inverter housing 90 is, for example, cylindrical, and houses the inverter device 80 including the inverter main circuit 81. The inverter axis Ci is the center line of the inverter housing 90 and coincides with the motor axis Cm. The inverter housing 90 is made of a metal material or the like and has thermal conductivity. The inverter housing 90 has an inverter outer peripheral wall 91 and inverter fins 92.

[0046] The inverter outer peripheral wall 91 is annular in the circumferential direction CD, and has an outer peripheral surface 90a and an inner peripheral surface 90b (see FIG. 5) for mainly cooling the inverter main circuit 81. The inverter fins 92 are heat dissipation fins provided on the outer peripheral surface 90a to enhance the heat dissipation effect, protruding radially outward to increase the surface area and extending in the axial direction AD. A plurality of inverter fins 92 are arranged in the circumferential direction CD.

[0047] If the motor outer peripheral wall 71 and the inverter outer peripheral wall 91 have the same shape and size in plan view in the axial direction AD, fixing the motor device 60 and the inverter device 80 in the axial direction AD makes it easy to efficiently flow cooling air in the axial direction AD. However, as long as it is possible to fix the motor device 60 and the inverter device 80 in the axial direction AD, the motor outer peripheral wall 71 and the inverter outer peripheral wall 91 may have different shapes and sizes in plan view.

[0048] As described above, in the case of an air-cooled type, the EPU 50 cools the motor device 60 and the inverter device 80 by air flowing from the blower fan along the plate surfaces of the motor fins 72 and the inverter fins 92 in the axial direction AD.

[0049] 2, the EPU 50 has a unit duct 100 formed in a cylindrical shape as a whole to allow the cooling air in the axial direction AD from the blower fan to flow efficiently along the plate surfaces of the motor fins 72 and the inverter fins 92. The unit duct 100 covers the motor housing 70 and the inverter housing 90 from the outer periphery, and has openings formed on both ends in the axial direction AD.

[0050] An even better shape is one in which the inner circumferential surface of the unit duct 100 is close to or in contact with the tip surfaces of the motor fins 72 and the inverter fins 92. In this configuration, most of the cooling air passing in the axial direction AD passes between the motor fins 72 and the inverter fins 92, improving the heat dissipation effect.

[0051] 4, the motor device 60 includes a shaft 340, a first bearing 360, a second bearing 361, and a rotation angle resolver 421. The shaft 340 is a rotating shaft that rotates together with the rotor 300.

[0052] The first bearing 360 and the second bearing 361 are aligned in the axial direction AD and support the rotor 300 and the shaft 340 to enable them to rotate. The first bearing 360 is provided closer to the inverter device 80 than the second bearing 361 in the axial direction AD. The first bearing 360 is provided, for example, at a position recessed inside the inverter device 80. At least a portion of the first bearing 360 is accommodated in the inverter housing 90. The first bearing 360 is fixed to an end plate fixed to the motor housing 70 or an end plate sandwiched between the inverter housing 90 and the motor housing 70.

[0053] The rotation angle resolver 421 is a sensor that detects the rotation angle of the motor electric magnetic circuit 61. The rotation angle resolver 421 is electrically connected to the control circuit 161, and outputs a SIN / COS detection signal in response to an excitation signal from the control circuit 161. The control circuit 161 measures the rotation angle and rotation speed from the SIN / COS detection signal. The control circuit 161 may detect the rotation from another sensor. The control circuit 161 may estimate the rotation angle by a method that does not use a rotation angle sensor, such as a motor current.

[0054] The rotation angle resolver 421 is provided, for example, at a position inside the inverter device 80. The rotation angle resolver 421 is provided, for example, on the inverter device 80 side relative to the first bearing 360 in the axial direction AD.

[0055] In the motor housing 70, the stator 200 and the rotor 300 are housed in the internal space of a motor outer peripheral wall 71. The motor outer peripheral wall 71 is arranged in the axial direction AD next to an inverter outer peripheral wall 91. The inverter outer peripheral wall 91 corresponds to the device outer peripheral wall, and the motor outer peripheral wall 71 corresponds to the electric machine outer peripheral wall.

[0056] The motor device 60 has a rear end plate 62 and a front end plate 63 in addition to the motor housing 70. The end plates 62, 63 are made of a metal material or the like and have thermal conductivity. The end plates 62, 63 extend in a plate shape in a direction perpendicular to the axial direction AD. The end plates 62, 63 are arranged in the axial direction AD via the motor housing 70. The end plates 62, 63 are fixed to the motor outer peripheral wall 71 in a state where they cover the internal space of the motor outer peripheral wall 71.

[0057] The rear end plate 62 is provided between the motor housing 70 and the inverter housing 90. The rear end plate 62 is sandwiched, for example, between the motor outer peripheral wall 71 and the inverter outer peripheral wall 91. The rear end plate 62 covers the stator 200 and the rotor 300 from the inverter device 80 side. The rear end plate 62 is formed in an annular shape and is provided radially outside the first bearing 360. The rear end plate 62 corresponds to a cover portion.

[0058] The inverter device 80 has a heat insulating section 545. The heat insulating section 545 has heat insulating properties and is an insulating layer and an air layer, etc. The heat insulating layer is formed of a material having heat insulating properties. The heat insulating section 545 extends in a plate shape in a direction perpendicular to the axial direction AD. The heat insulating section 545 is provided between the rear end plate 62 and the high voltage board 510 in the axial direction AD. The heat insulating section 545 extends along the rear end plate 62. The heat insulating section 545 is provided on the opposite side of the rear end plate 62 via the rotation angle resolver 421, for example.

[0059] The EPU 50 is provided with a reducer 53. The reducer 53 mechanically connects the motor electric magnetic circuit 61 to an external device. For example, the external device is mechanically connected to a rotating shaft of the motor electric magnetic circuit 61 via the reducer 53. The reducer 53 reduces the rotation of the motor electric magnetic circuit 61 and transmits it to the external device. Examples of the external device include wheels and rotors. The reducer 53 includes a plurality of gears and is sometimes referred to as a reduction gear. The reducer 53 has a structure that matches the motor characteristics of the motor electric magnetic circuit 61. The reducer 53 is provided on the opposite side of the inverter device 80 via the motor device 60 in the axial direction AD, for example.

[0060] <Composition group A> As shown in FIG. 4, the inverter device 80 has an inverter lid 99 in addition to the inverter housing 90. The inverter lid 99 is made of a metal material or the like, has thermal conductivity, and can dissipate heat inside the inverter device 80 to the outside. The inverter lid 99 closes the opening of the inverter housing 90 and prevents foreign matter from entering the inside of the inverter. The inverter lid 99 is provided on the opposite side of the motor device 60 via the inverter housing 90 in the axial direction AD. The inverter lid 99 has a shape that bulges toward the opposite side of the motor device 60 in the axial direction AD. The inverter lid 99 has a flat plate portion extending in a direction perpendicular to the motor axis Cm and an annular wall portion extending in an annular shape along the outer periphery of the flat plate portion. In addition, the inverter lid 99 has a function of sealing a gap with the inverter housing 90, a function of joining with the inverter housing 90, and a function of reducing electromagnetic radiation or intrusion.

[0061] Inverter device 80 has a high-voltage board 510, a drive board 550, and a control board 560. High-voltage board 510 is a circuit board on which inverter main circuit 81, smoothing capacitor 145, and EMI filter 150 are mounted. Drive board 550 is a circuit board on which drive circuit 160 is mounted. Control board 560 is a circuit board on which control circuit 161 is mounted.

[0062] The drive board 550 and the control board 560 are low-voltage boards to which a low voltage is applied. The low voltage is a voltage for driving the drive circuit 160 and the control circuit 161. In the inverter device 80, the voltage applied to the drive circuit 160 and the control circuit 161 is a low voltage. The boards 510, 550, 560 are sometimes referred to as electric wiring boards and circuit boards.

[0063] 5 and 6, high-voltage board 510, drive board 550, and control board 560 have inner circumferential ends 511, 551, 561 and outer circumferential ends 512, 552, 562. Control board 560 may not have inner circumferential end 561. Drive board 550 and control board 560 may be integrated. In high-voltage board 510 and drive board 550, outer circumferential ends 512, 552 are located at positions spaced radially inward from inner circumferential surface 90b of inverter outer circumferential wall 91, forming gaps.

[0064] 5, the inverter device 80 includes a plurality of inverter fins 92 arranged in the circumferential direction CD to form an inverter fin group 93. The inverter fin group 93 is included in an inverter housing 90.

[0065] The flanges 94, 95 are convex portions provided on the outer peripheral surface 90a, and protrude radially outward from the inverter outer peripheral wall 91. The flanges 94, 95 are provided between two adjacent inverter fin groups 93 in the circumferential direction CD. The high-pressure side flange 94 and the low-pressure side flange 95 are aligned in the axial direction AD. For example, the motor housing 70 is fixed to the high-pressure side flange 94 by a fastener such as a bolt. For example, the inverter lid portion 99 is fixed to the low-pressure side flange 95 by a fastener.

[0066] The insides of the inverter housing 90 and the motor housing 70 are cylindrical, and an O-ring 98 is sandwiched between each housing and an internal cylinder (not shown). The O-ring 98 seals the joint between the inverter housing 90 and the motor housing 70.

[0067] The inverter device 80 has a smoothing capacitor section 580 and a filter component 524. The smoothing capacitor section 580 and the filter component 524 are provided on the high-voltage board 510 and are mechanically and electrically connected to each other. The smoothing capacitor section 580 is formed by distributing and mounting a plurality of smoothing capacitors 145 of FIG. 1.

[0068] The multiple filter components 524 include a common mode coil section 525, a normal mode coil section 526, a Y capacitor section 527, and an X capacitor section 528. The common mode coil section 525 has a common mode coil 151. The normal mode coil section 526 has a normal mode coil 152. The Y capacitor section 527 has a Y capacitor 153. The X capacitor section 528 has an X capacitor 154.

[0069] A plurality of motor current sensors 146 are provided corresponding to the U-phase, V-phase, and W-phase. Battery current sensor 147 is provided on one or both of P line 141 and N line 142. Current sensors 146 and 147 are provided on high voltage board 510.

[0070] The inverter device 80 has an arm switch section 530. The arm switch section 530 has the functions of the arm switch 86 and the diode 87 of the inverter main circuit 81. A plurality of arm switch sections 530 are arranged and fixed in the circumferential direction CD along the inner circumferential surface 90b of the inverter housing 90. The plurality of arm switch sections 530 are arranged along the outer circumferential ends 512, 552 of the high-voltage board 510 and the control board 560.

[0071] The inverter device 80 has a fan device 540. The fan device 540 cools high-temperature parts inside the inverter device 80 by circulating air inside the inverter device 80. The fan device 540 is an electric fan or a fan rotated by a motor shaft.

[0072] 7, the fan device 540 is provided at a position aligned with the board openings 513, 553, 563 in the axial direction AD. To promote air circulation between the boards, the board openings 513, 553, 563 may be shaped to block part of the air in the fan device 540. The air that passes through the board openings 513, 553, 563 passes between the boards 510, 550, 560 and the inverter lid 99, between the outer casing and the inner surface of the case, and returns to the fan from between the components mounted on the high-voltage board 510. The circulation path may be reversed.

[0073] As shown in Figs. 7 to 9, the inverter housing 90 has a component support portion 500 on the inner diameter side of the inverter outer peripheral wall 91. The component support portion 500 is composed of a plurality of beam portions 501 in the circumferential direction CD along the inner peripheral surface 90b. The beam portion 501 is a portion that does not interfere with the arm switch portion 530 of the inverter outer peripheral wall 91, and is provided between the high-pressure side flange 94 and the low-pressure side flange 95 in the axial direction AD. The inverter fin group 93 is between two adjacent beam portions 501 in the circumferential direction CD. The beam portions 501 are arranged to extend radially in the radial direction RD from the inner peripheral surface 90b toward the center, or radially outward from the inverter axis Ci. The inverter housing 90 has a beam connecting portion 502 on the center side to connect the beam portions 501. The beam connecting portion 502 has one or more connecting openings 504. The beam portion 501 extends in a frame-like manner in the radial direction RD, and is sometimes referred to as a support frame. The inverter outer peripheral wall 91 corresponds to an outer peripheral wall, and the inverter housing 90 corresponds to a case.

[0074] In component support part 500, substrates 510, 550, and 560 are arranged in the axial direction AD. Component support part 500 is provided between high-voltage substrate 510 and drive substrate 550 in the axial direction AD. Component support part 500, high-voltage substrate 510, and control substrate 560 form a sandwich structure via multiple beam parts 501, thereby achieving a lightweight and strong structure.

[0075] The inverter housing 90 is made of a material having thermal conductivity and electrical conductivity, and therefore has a heat dissipation path and an electrical conduction path.

[0076] The heat dissipation path is formed to include, for example, the inverter outer peripheral wall 91, the inverter fins 92, and the component support portion 500. In the heat dissipation path, for example, heat from the component support portion 500 is dissipated from the inverter fins 92 via the inverter outer peripheral wall 91 to the outside.

[0077] The conductive path is a ground path, which is the ground or earth. The inverter housing 90 is formed including the inverter outer peripheral wall 91, the high-voltage side flange 94, the low-voltage side flange 95, and the component support part 500, and connects the grounds of the Y capacitor part 527 and the circuit boards 510, 550, 560, etc. with low impedance. The motor housing 70 and the inverter lid part 99 form a ground path via the flanges 94, 95.

[0078] In component support portion 500, a fan unit 540 can be mounted on beam connection portion 502 to promote cooling inside the inverter. Beam opening 503 can be provided in beam portion 501. Beam opening 503 is an opening provided for bolting a component to be mounted on high-voltage board 510 from the beam portion 501 side. For example, beam opening 503 is an opening for bolting a bus bar or a stud for passing a current from high-voltage board 510 to multiple motor current sensors 146.

[0079] Beam portion 501 and beam connecting portion 502 of component support portion 500 have screw holes 505 for fixing high-voltage board 510, as shown in Fig. 8. Beam portion 501 and beam connecting portion 502 also have a plurality of screw holes 506 for fixing drive board 550 and control board 560, as shown in Fig. 9. The plurality of screw holes 505 include screw hole 505a for fixing only the board, screw hole 505b for fastening together, for example, a current sensor and a board, and screw hole 505c for fixing only, for example, fan device 540.

[0080] The high voltage board 510 and the drive board 550 correspond to plate members. The high voltage board 510 corresponds to a first plate member, and the drive board 550 corresponds to a second plate member.

[0081] As shown in Figs. 5 and 6, the inverter device 80 has a switch group 530G consisting of a plurality of arm switch units 530. The switch group 530G is arranged in a line in the circumferential direction CD so that the plurality of arm switch units 530 are closely packed together. The switch groups 530G are arranged in a plurality in the circumferential direction CD along the inner peripheral surface 90b. It is also possible that the inner peripheral surface 90b is polygonal and the plurality of switch groups 530G are arranged on the same plane. The plurality of switch groups 530G are arranged along the outer peripheral ends 512, 552 of the high-voltage substrate 510 and the drive substrate 550.

[0082] The switch group 530G has a plurality of arm switch units 530 connected in parallel, and corresponds to the upper arm 84 and the lower arm 85 of the inverter main circuit 81 in the circuit diagram. For example, if one upper arm 84 in the circuit diagram has six arm switches 86, the switch group 530G in the embodiment corresponding to this upper arm 84 has six arm switch units 530. Similarly, one lower arm 85 in the circuit diagram also forms a switch group 530G having six arm switch units 530.

[0083] For example, two switch groups 530G adjacent to each other in the circumferential direction CD are arranged such that an upper arm 84 and a lower arm 85 constituting one phase are paired. A point for extracting a motor current is provided on the high voltage board 510 close to the middle position of these switch groups 530G. Of the arms 84 and 85 of one upper and lower arm circuit 83, the switch group 530G corresponding to the upper arm 84 and the switch group 530G corresponding to the lower arm 85 are two switch groups 530G adjacent to each other in the circumferential direction CD.

[0084] 8 and 9, the switch group 530G is provided between two adjacent beam portions 501 along the circumferential direction CD of the inner circumferential surface 90b of the inverter outer circumferential wall 91. The switch group 530G is located between two adjacent flanges 94, 95 in the circumferential direction CD. The switch group 530G is located so as to overlap the inverter fin group 93 in the axial direction AD. The switch group 530G and the inverter fin group 93 are aligned in the axial direction AD with the inverter outer circumferential wall 91 interposed therebetween.

[0085] As shown in Fig. 10, the arm switch unit 530 has a switch body 531. The switch body 531 is provided on the inner circumferential surface 90b, which is the cooling surface, and is fixed to the inner circumferential surface 90b, for example. The switch body 531 has an element such as a MOSFET and a protection unit. The switch body 531 has a first plate surface 531a and a second plate surface 531b. The first plate surface 531a and the second plate surface 531b extend in a direction perpendicular to the radial direction RD.

[0086] The arm switch section 530 has four terminals, terminals 532 to 535, and is a four-terminal type switch module. The terminals 532 to 535 are a drain terminal 532, a source terminal 533, a gate terminal 534, and a driver source terminal 535. The driver source terminal 535 is sometimes called a Kelvin source terminal. The terminals 532 to 535 correspond to switch terminals.

[0087] The drain terminal 532 and the source terminal 533 are power terminals and are connected to the high voltage substrate 510. The gate terminal 534 and the driver source terminal 535 are control terminals and are connected to the control substrate 560. The terminals 532 to 535 extend from the switch body 531. The terminals 532 to 535 are arranged in the width direction of the switch body 531.

[0088] The switch body 531 is located at a position spaced apart from the outer peripheral end faces of the substrates 510, 550, and 560. The switch body 531 is located at a position spaced apart from the beam portion 501 in the axial direction AD. The drain terminal 532 and the source terminal 533 are bridged between the switch body 531 and the high-voltage substrate 510 on the high-voltage side of the beam portion 501. The gate terminal 534 and the driver source terminal 535 are bridged between the switch body 531 and the drive substrate 550 so as to pass through the beam portion 501 and extend in the axial direction AD.

[0089] 5, the inverter device 80 has an inverter connector 96 and power lines 570, 571. The inverter connector 96 connects the inverter device 80 to an external battery 31 and the like. A power cable can be connected to the inverter connector 96. The inverter connector 96 protrudes radially outward from the inverter housing 90. It is also possible to have a configuration in which the inverter connector 96 is not provided and the power lines 570, 571 extend to the outside.

[0090] Power supply lines 570, 571 are electrically connected to high voltage board 510. Power supply lines 570, 571 are connected from high voltage board 510 through filter component 524 to arm switch section 530 and smoothing capacitor section 580. Power supply line 570 is an electrical wiring that forms P line 141. Power supply line 571 is an electrical wiring that forms N line 142. Battery current sensor 147 is provided for either or both of power supply line 570 and power supply line 571. Motor current sensor 146 is provided on a bus bar drawn out from high voltage board 510. This bus bar is connected to the motor.

[0091] <Composition group B> 4 to 6, the substrates 510, 550, and 560 each have an insulating substrate and a wiring pattern. The insulating substrate has electrical insulation properties and is formed into a plate shape from a resin material or the like. The wiring pattern has conductivity and is formed from a conductive material such as copper or aluminum.

[0092] The high-voltage board 510, the drive board 550, and the control board 560 are all formed in a plate shape and extend in a direction perpendicular to the axial direction AD. The boards 510, 550, and 560 extend in an annular shape centered on the inverter axis Ci. The boards 510, 550, and 560 are formed in a disk shape as a whole. The boards 510, 550, and 560 are arranged in the axial direction AD with their respective plate surfaces facing each other. In the axial direction AD, the drive board 550 is provided between the high-voltage board 510 and the control board 560. In the inverter device 80, the high-voltage board 510 side is referred to as the high-voltage side in the axial direction AD, and the drive board 550 side is referred to as the low-voltage side. The motor device 60 is provided, for example, on the high-voltage side of the inverter device 80.

[0093] As shown in FIG. 11, the high-voltage board 510 has a P bus bar 601, an N bus bar 602, an output bus bar 603, and an earth bus bar 604. The bus bars 601 to 604 are included in a wiring pattern of the high-voltage board 510. The bus bars 601 to 604 are formed in a plate shape and extend in a direction perpendicular to the axial direction AD. The bus bars 601 to 604 are conductive conductors and correspond to plate-shaped conductors. The bus bars 601 to 604 extend in a circumferential direction CD as a whole. The circumferential direction CD corresponds to the extension direction. The bus bars 601 to 604 are provided inside the high-voltage board 510. In the high-voltage board 510, for example, the bus bars 601 to 604 and a plurality of insulating boards are alternately stacked. The bus bars 601 to 604 are sometimes referred to as board conductors. The high-voltage board 510 corresponds to a power board.

[0094] In FIG. 12, the P bus bar 601 forms at least a part of the P line 141. The P bus bar 601 corresponds to a high potential conductor and a power conductor, and may be referred to as a high potential bus bar and a power bus bar. The P bus bar 601 has an outer peripheral P bus bar 601a and an inner peripheral P bus bar 601b. The P bus bars 601a and 601b are conductive members such as bus bar members formed of a conductive material. The P bus bars 601a and 601b extend in an annular shape centered on the inverter axis Ci, similar to the high voltage board 510. The P bus bars 601a and 601b are formed in a disk shape as a whole. The outer peripheral P bus bar 601a and the inner peripheral P bus bar 601b are arranged in the radial direction RD. The outer peripheral P bus bar 601a is provided radially outward of the inner peripheral P bus bar 601b.

[0095] The outer periphery P bus bar 601a extends along the outer periphery end 512 of the high-voltage substrate 510. The outer periphery P bus bar 601a is provided at a position aligned with the smoothing capacitor unit 580 in the axial direction AD. The outer periphery P bus bar 601a extends in the circumferential direction CD along the capacitor row 580R. The smoothing capacitor unit 580 may be provided at a position protruding from the outer periphery P bus bar 601a to at least one of the radially outer side and the radially inner side, or may be provided at a position not protruding.

[0096] The inner periphery P bus bar 601b extends along the inner periphery end 511 of the high voltage substrate 510. The inner periphery P bus bar 601b is provided at a position aligned with the filter component 524 in the axial direction AD. The inner periphery P bus bar 601b extends in the circumferential direction CD along the filter row 524R. The filter component 524 may be provided at a position protruding from the inner periphery P bus bar 601b to at least one of the radially outer side and the radially inner side, or may be provided at a position not protruding.

[0097] The outer circumferential P bus bar 601a and the inner circumferential P bus bar 601b are electrically connected to the power supply line 570 via electrical wiring or the like. The P bus bar 601 may have three or more bus bar members such as the P bus bars 601a and 601b, or may have only one bus bar member.

[0098] The N bus bar 602 forms at least a part of the N line 142. The N bus bar 602 corresponds to a low potential conductor and a power conductor, and may be referred to as a low potential bus bar and a power bus bar. The N bus bar 602 has an outer peripheral N bus bar 602a and an inner peripheral N bus bar 602b. The N bus bars 602a and 602b are conductive members such as bus bar members formed of a conductive material. The N bus bars 602a and 602b extend in an annular shape centered on the inverter axis Ci, similar to the high voltage board 510. The N bus bars 602a and 602b are formed in a disk shape as a whole. The outer peripheral N bus bar 602a and the inner peripheral N bus bar 602b are arranged in the radial direction RD. The outer peripheral N bus bar 602a is provided radially outward of the inner peripheral N bus bar 602b.

[0099] The outer periphery N bus bar 602a extends along the outer periphery end 512 on the high-voltage substrate 510. The outer periphery N bus bar 602a is provided at a position aligned with the smoothing capacitor section 580 in the axial direction AD. The outer periphery N bus bar 602a extends in the circumferential direction CD along the capacitor row 580R. The smoothing capacitor section 580 may be provided at a position protruding from the outer periphery N bus bar 602a to at least one of the radially outer side and the radially inner side, or may be provided at a position not protruding.

[0100] The inner periphery N bus bar 602b extends along the inner periphery end 511 of the high voltage substrate 510. The inner periphery N bus bar 602b is provided at a position aligned with the filter component 524 in the axial direction AD. The inner periphery N bus bar 602b extends in the circumferential direction CD along the filter row 524R. The filter component 524 may be provided at a position protruding from the inner periphery N bus bar 602b to at least one of the radially outer side and the radially inner side, or may be provided at a position not protruding.

[0101] The outer circumferential N bus bar 602a and the inner circumferential N bus bar 602b are electrically connected to a power supply line 571 via electrical wiring or the like. The N bus bar 602 may have three or more bus bar members such as the N bus bars 602a and 602b, or may have only one bus bar member.

[0102] In FIG. 13, the output bus bar 603 forms at least a part of the output line 143. The output bus bar 603 corresponds to an output conductor. The output bus bar 603 is a conductive member such as a bus bar member made of a conductive material. The output bus bar 603 is formed in a plate shape so as to be curved in the circumferential direction CD. A plurality of the output bus bars 603 are arranged in the circumferential direction CD along the outer circumferential end 512. Two output bus bars 603 adjacent to each other in the circumferential direction CD are spaced apart in the circumferential direction CD.

[0103] The output bus bar 603 extends along the outer peripheral end 512 of the high voltage substrate 510. The output bus bar 603 is provided at a position aligned with the smoothing capacitor unit 580 in the axial direction AD. The output bus bar 603 extends in the circumferential direction CD along the capacitor row 580R. The smoothing capacitor unit 580 may be provided at a position protruding from the output bus bar 603 to at least one of the radially outer side and the radially inner side, or may be provided at a position not protruding. The output bus bar 603 is provided radially outer than the filter component 524. The output bus bar 603 may be provided at a position aligned with the filter component 524 in the axial direction AD. The output bus bar 603 may also be provided at a position spanning the outer peripheral P bus bar 601a and the inner peripheral P bus bar 601b in the radial direction RD.

[0104] The output bus bars 603 are provided corresponding to each of the multiple phases. The multiple output bus bars 603 include output bus bars 603 corresponding to the U phase, the V phase, and the W phase, respectively. For example, the U phase output bus bar 603 is connected to the U phase coil of the motor electric magnetic circuit 61 so as to be electrically conductive.

[0105] The high voltage board 510 has an output connection portion 514. The output connection portion 514 is electrically connected to the output bus bar 603. The output connection portion 514 is provided individually for each of the multiple output bus bars 603. An output cable such as an electric wiring is connected to the output connection portion 514. This output cable and the output connection portion 514 form an output line 143 together with the output bus bar 603. A current sensor 147 is provided for at least one of the output cable and the output connection portion 514. The output connection portion 514 is provided, for example, between two switch groups 530G adjacent to each other in the circumferential direction CD.

[0106] In FIG. 14, earth bus bar 604 forms at least a part of the ground path. Earth bus bar 604 corresponds to a ground conductor and may be referred to as an earth conductor. Earth bus bar 604 is a bus bar member formed of a conductive material. Earth bus bar 604 is connected to a case ground. Earth bus bar 604 is connected to inverter housing 90 so as to be conductive to ground GND. For example, a fastener that fixes high voltage board 510 to component support portion 500 penetrates earth bus bar 604 and is screwed into screw hole 505. Earth bus bar 604 is conductive to component support portion 500 via this fastener. By providing a plurality of these fasteners, earth bus bar 604 and component support portion 500 are conductive at a plurality of locations.

[0107] The earth bus bar 604 extends in an annular shape centered on the inverter axis Ci, similar to the P bus bar 601 and the N bus bar 602. The earth bus bar 604 is formed in a disk shape as a whole. The earth bus bar 604 extends in the radial direction RD so as to span between the inner peripheral end 511 and the outer peripheral end 512. The earth bus bar 604 is in a state of spanning between the outer peripheral P bus bar 601a and the inner peripheral P bus bar 601b in the radial direction RD, for example.

[0108] The earth bus bar 604 is provided at a position aligned with both the smoothing capacitor section 580 and the filter component 524 in the axial direction AD. The earth bus bar 604 extends in the circumferential direction CD along both the capacitor row 580R and the filter row 524R. The smoothing capacitor section 580 may be provided at a position protruding radially outward from the earth bus bar 604, or at a position not protruding. The filter component 524 may be provided at a position protruding radially inward from the earth bus bar 604, or at a position not protruding.

[0109] As shown in FIG. 11, high voltage board 510 has a plurality of plate-shaped conductors such as bus bars 601-604. In high voltage board 510, the plurality of plate-shaped conductors includes bus bars 601-604. The plurality of plate-shaped conductors includes a plurality of bus bars 601-604 each. The plurality of plate-shaped conductors includes, for example, two bus bars 601-604 each. The plurality of plate-shaped conductors are stacked in the axial direction AD. In the plurality of plate-shaped conductors, an earth bus bar 604 is provided at each of a pair of outermost positions. One of the pair of outermost positions is the position on the highest voltage side in the axial direction AD. The other outermost position is the position on the lowest voltage side in the axial direction AD.

[0110] In the axial direction AD, a plurality of bus bars 601-603 are provided between a pair of earth bus bars 604. For example, two bus bars 601-603 are provided between a pair of earth bus bars 604. The output bus bar 603 is provided between the P bus bar 601 and the N bus bar 602 in the axial direction AD. The output bus bar 603 is located adjacent to each of the P bus bar 601 and the N bus bar 602 in the axial direction AD. Of the P bus bar 601 and the N bus bar 602 adjacent to the output bus bar 603 in the axial direction AD, the P bus bar 601 corresponds to the first plate portion, and the N bus bar 602 corresponds to the second plate portion.

[0111] The high-voltage board 510 has a first bus bar set 611 and a second bus bar set 612. These bus bar sets 611, 612 each have one bus bar 601 to 603. The bus bar sets 611, 612 are provided between a pair of earth bus bars 604 in the axial direction AD. The first bus bar set 611 and the second bus bar set 612 are overlapped in the axial direction AD. The first bus bar set 611 is provided on the high-voltage side of the second bus bar set 612 in the axial direction AD. In both the first bus bar set 611 and the second bus bar set 612, an output bus bar 603 is provided between the P bus bar 601 and the N bus bar 602. The arrangement order of the bus bars 601 to 603 is the same in the first bus bar set 611 and the second bus bar set 612. For example, from the high voltage side to the low voltage side, the P bus bar 601, the output bus bar 603, and the N bus bar 602 are arranged in this order.

[0112] Smoothing capacitor section 580 has a capacitor body 581 and capacitor terminals 582, 583. Capacitor body 581 is provided on high-voltage board 510 and fixed to high-voltage board 510. Capacitor body 581 has elements and a protective section that form smoothing capacitor 145. Capacitor body 581 is formed into a rectangular parallelepiped shape as a whole. Capacitor body 581 is provided on a first high-voltage surface 510a of high-voltage board 510.

[0113] The capacitor terminals 582, 583 are a P capacitor terminal 582 and an N capacitor terminal 583. The P capacitor terminal 582 is a terminal connected to the P bus bar 601. The N capacitor terminal 583 is a terminal connected to the N bus bar 602. The capacitor terminals 582, 583 extend in the same direction from the capacitor body 581. The capacitor terminals 582, 583 extend from a surface of the capacitor body 581 that overlaps with the first high-voltage surface 510a toward the low-voltage side in the axial direction AD. The P capacitor terminal 582 corresponds to a high capacitor terminal, and the N capacitor terminal 583 corresponds to a low capacitor terminal.

[0114] 15, the upper and lower arm circuit 83 has an upper arm switch 86A and a lower arm switch 86B. The upper arm switch 86A is an arm switch 86 included in the upper arm 84. The lower arm switch 86B is an arm switch 86 included in the lower arm 85.

[0115] As shown in Figures 15 and 16, the multiple arm switch units 530 include an upper arm switch unit 530A and a lower arm switch unit 530B. The upper arm switch unit 530A has an upper arm switch 86A and corresponds to an upper switch component on the high potential side. The upper arm switch unit 530A is electrically connected to the P bus bar 601 and the output bus bar 603. The lower arm switch unit 530B has a lower arm switch 86B and corresponds to a lower switch component on the low potential side. The lower arm switch unit 530B is electrically connected to the output bus bar 603 and the N bus bar 602.

[0116] The multiple switch groups 530G include an upper switch group 530GA and a lower switch group 530GB. The upper switch group 530GA has multiple upper arm switch units 530A, but does not have a lower arm switch unit 530B. In the upper switch group 530GA, multiple upper arm switch units 530A are arranged in the circumferential direction CD. The lower switch group 530GB has multiple lower arm switch units 530B, but does not have an upper arm switch unit 530A. In the lower switch group 530GB, multiple lower arm switches 86B are arranged in the circumferential direction CD.

[0117] The upper arm switch section 530A and the lower arm switch section 530B constituting one upper and lower arm circuit 83 are included in an upper switch group 530GA and a lower switch group 530GB adjacent to each other in the circumferential direction CD. The upper switch group 530GA and the lower switch group 530GB are included in one phase. For example, the upper switch group 530GA of the U-phase and the lower switch group 530GB of the U-phase are adjacent to each other in the circumferential direction CD.

[0118] An output connection unit 514 is provided for the upper switch group 530GA and the lower switch group 530GB included in one phase. The output connection unit 514 is provided between the upper switch group 530GA and the lower switch group 530GB included in one phase in the circumferential direction CD. The output connection unit 514 is connected to the output bus bar 603 between the multiple upper source terminals 533A and the multiple lower drain terminals 532B in the circumferential direction CD.

[0119] The smoothing capacitor unit 580 is electrically connected in parallel to the upper arm switch unit 530A and the lower arm switch unit 530B. The smoothing capacitor unit 580 is electrically connected to the P bus bar 601 and the N bus bar 602. The smoothing capacitor unit 580 corresponds to a capacitor component and a parallel component.

[0120] As shown in Figs. 12 to 14, the inverter device 80 has a capacitor group 580G. The capacitor group 580G has a plurality of smoothing capacitor sections 580. In the capacitor group 580G, the plurality of smoothing capacitor sections 580 are closely spaced and aligned in a line in the circumferential direction CD along the outer circumferential end 512. The capacitor groups 580G are aligned in the circumferential direction CD along the outer circumferential end 512. The capacitor groups 580G are aligned with the switch groups 530G in the radial direction RD. For example, one capacitor group 580G and one switch group 530G are aligned in the radial direction RD.

[0121] As shown in Fig. 16, the smoothing capacitor sections 580 include an upper capacitor section 580A and a lower capacitor section 580B. The upper capacitor section 580A is provided at a position aligned with the upper arm switch section 530A in the radial direction RD. The upper capacitor section 580A is located at a position spaced radially inward from the upper arm switch section 530A. The upper capacitor section 580A is located at a position aligned with the upper switch group 530GA in the radial direction RD and at a position spaced radially inward from the upper switch group 530GA. The upper capacitor section 580A corresponds to an upper capacitor component and a first capacitor component. The radial direction RD corresponds to an orthogonal direction perpendicular to the alignment direction.

[0122] The lower capacitor unit 580B is provided at a position aligned with the lower arm switch unit 530B in the radial direction RD. The lower capacitor unit 580B is located at a position spaced radially inward from the lower arm switch unit 530B. The lower capacitor unit 580B is located at a position aligned with the lower switch group 530GB in the radial direction RD and spaced radially inward from the lower switch group 530GB. The lower capacitor unit 580B corresponds to a lower capacitor component and a second capacitor component.

[0123] The upper condenser section 580A and the lower condenser section 580B are opposite in the installation orientation in the radial direction RD. In one of the upper condenser section 580A and the lower condenser section 580B, the P capacitor terminal 582 is located at a position spaced radially outward from the N capacitor terminal 583. In the other, the N capacitor terminal 583 is located at a position spaced radially outward from the P capacitor terminal 582. For example, in the upper condenser section 580A, the P capacitor terminal 582 is located at a position spaced radially outward from the N capacitor terminal 583. In the lower condenser section 580B, the N capacitor terminal 583 is located at a position spaced radially outward from the P capacitor terminal 582.

[0124] In high-voltage board 510, P capacitor terminal 582 of upper capacitor section 580A and N capacitor terminal 583 of lower capacitor section 580B are aligned in circumferential direction CD. Similarly, N capacitor terminal 583 of upper capacitor section 580A and P capacitor terminal 582 of lower capacitor section 580B are aligned in circumferential direction CD.

[0125] The plurality of capacitor groups 580G include an upper capacitor group 580GA and a lower capacitor group 580GB. The upper capacitor group 580GA has a plurality of upper capacitor parts 580A, but does not have a lower capacitor part 580B. The upper capacitor group 580GA is aligned with the upper switch group 530GA in the radial direction RD and is spaced radially inward from the upper switch group 530GA. The lower capacitor group 580GB has a plurality of lower capacitor parts 580B, but does not have an upper capacitor part 580A. The lower capacitor group 580GB is aligned with the lower switch group 530GB in the radial direction RD and is spaced radially inward from the lower switch group 530GB. The upper capacitor group 580GA corresponds to a first capacitor group, and the lower capacitor group 580GB corresponds to a second capacitor group.

[0126] As shown in Fig. 15, in the inverter device 80, inductances L601 to L603 tend to occur as parasitic inductances parasitic on the bus bars 601 to 603. The inductances L601 to L603 can also be said to be parasitic on the lines 141 to 143. The inductances L601 to L603 are P inductance L601, N inductance L602, and output inductance L603. The P inductance L601 is a parasitic inductance occurring in the P bus bar 601. The N inductance L602 is a parasitic inductance occurring in the N bus bar 602. The output inductance L603 is a parasitic inductance occurring in the output bus bar 603.

[0127] When inductances L601-L603 are parasitic on bus bars 601-603, a voltage drop occurs in inductances L601-L603. In this case, a potential difference occurs in arm switch section 530 by the voltage generated in inductances L601-L603. For example, when inductance L601 occurs between two drain terminals 532 connected to P bus bar 601, a potential difference occurs between the two drain terminals 532 by the voltage generated in inductance L601. Therefore, a potential difference occurs between two arm switch sections 530 having these two drain terminals 532.

[0128] 15, for convenience of illustration, a plurality of inductances L601-L603 are illustrated lined up along the bus bars 601-603. Also, Y capacitors 153 are connected to the earth bus bar 604. The Y capacitors 153 include a Y capacitor 153 connected to the earth bus bar 604 and the P bus bar 601, and a Y capacitor 153 connected to the earth bus bar 604 and the N bus bar 602. The Y capacitor section 527 is connected to the P bus bar 601 or the N bus bar 602 so as to be conductive, and is connected to the earth bus bar 604 so as to be conductive to the ground GND.

[0129] In the inverter device 80, inductance L580 is likely to occur as a parasitic inductance parasitic on the smoothing capacitor section 580. The inductance L580 occurs in the smoothing capacitor section 580. For example, the inductance L580 occurs in a current path connected to the smoothing capacitor 145 in the smoothing capacitor section 580. The inductance L580 occurs in the current path between the smoothing capacitor 145 and the P bus bar 601, and between the smoothing capacitor 145 and the N bus bar 602.

[0130] In the arm switch section 530, inductance L530 is likely to occur as a parasitic inductance parasitic on the arm switch 86. The inductance L530 occurs in the arm switch section 530. For example, the inductance L530 occurs in a current path connected to the arm switch 86 in the arm switch section 530. The inductance L530 occurs in the current path between the arm switch 86 and the P bus bar 601 or the N bus bar 602, and between the arm switch 86 and the output bus bar 603.

[0131] As shown in Figs. 11 and 17, a plurality of through holes 515 are provided in high voltage board 510. Arm switch section 530 and smoothing capacitor section 580 are electrically connected to bus bars 601-603 by through holes 515. In arm switch section 530, drain terminal 532 and source terminal 533 are inserted into through holes 515, respectively. These drain terminal 532 and source terminal 533 are connected to one of bus bars 601-603. In smoothing capacitor section 580, P capacitor terminal 582 and N capacitor terminal 583 are inserted into through holes 515, respectively. P capacitor terminal 582 and N capacitor terminal 583 are connected to P bus bar 601 or N bus bar 602.

[0132] The multiple through holes 515 include an upper switch hole 515a, a lower switch hole 515b, an upper capacitor hole 515c, and a lower capacitor hole 515d. The switch holes 515a, 515b are arranged in groups along the outer peripheral edge 512 of the high-voltage board 510. Terminals 532, 533 of the upper arm switch unit 530A are inserted into the upper switch hole 515a. The upper switch hole 515a is provided at a position overlapping the upper arm switch unit 530A in the axial direction AD. Terminals 532, 533 of the lower arm switch unit 530B are inserted into the lower switch hole 515b. The lower switch hole 515b is provided at a position overlapping the lower arm switch unit 530B in the axial direction AD.

[0133] The capacitor holes 515c, 515d are arranged in groups of two in the radial direction RD and in groups of two in the circumferential direction CD. Capacitor terminals 582, 583 of the smoothing capacitor section 580 are inserted into the upper capacitor hole 515c. The upper capacitor hole 515c is provided at a position overlapping with the upper capacitor section 580A in the axial direction AD. The capacitor terminals 582, 583 of the smoothing capacitor section 580 are inserted into the lower capacitor hole 515d. The lower capacitor hole 515d is provided at a position overlapping with the lower capacitor section 580B in the axial direction AD.

[0134] As shown in Fig. 17, in the upper arm switch section 530A, the upper drain terminal 532A and the upper source terminal 533A are individually inserted into the upper switch hole 515a. The upper drain terminal 532A and the upper source terminal 533A are the drain terminal 532 and the source terminal 533 of the upper arm switch section 530A. The upper drain terminal 532A is electrically connected to the P bus bar 601 by the upper switch hole 515a. The upper source terminal 533A is electrically connected to the output bus bar 603 by the upper switch hole 515a. The upper drain terminal 532A corresponds to the upper input terminal, and the upper source terminal 533A corresponds to the upper output terminal.

[0135] In the lower arm switch section 530B, the lower drain terminal 532B and the lower source terminal 533B are individually inserted into the lower switch hole 515b. The lower drain terminal 532B and the lower source terminal 533B are the drain terminal 532 and the source terminal 533 of the lower arm switch section 530B. The lower drain terminal 532B is electrically connected to the output bus bar 603 by the lower switch hole 515b. The lower source terminal 533B is electrically connected to the N bus bar 602 by the lower switch hole 515b. The lower drain terminal 532B corresponds to a lower input terminal, and the lower source terminal 533B corresponds to a lower output terminal.

[0136] In the upper capacitor section 580A, the upper P capacitor terminal 582A and the upper N capacitor terminal 583A are individually inserted into the upper capacitor holes 515c. The upper P capacitor terminal 582A and the upper N capacitor terminal 583A are the P capacitor terminal 582 and the N capacitor terminal 583 of the upper capacitor section 580A. The upper P capacitor terminal 582A is electrically connected to the P bus bar 601 by the upper capacitor hole 515c. The upper N capacitor terminal 583A is electrically connected to the N bus bar 602 by the upper capacitor hole 515c.

[0137] In the lower capacitor section 580B, the lower P capacitor terminal 582B and the lower N capacitor terminal 583B are individually inserted into the lower capacitor holes 515d. The lower P capacitor terminal 582B and the lower N capacitor terminal 583B are the P capacitor terminal 582 and the N capacitor terminal 583 of the lower capacitor section 580B. The lower P capacitor terminal 582B is electrically connected to the P bus bar 601 by the lower capacitor hole 515d. The lower N capacitor terminal 583B is electrically connected to the N bus bar 602 by the lower capacitor hole 515d.

[0138] In the high voltage board 510, the terminals 532A, 533A of the upper arm switch section 530A and the terminals 582A, 583A of the upper capacitor section 580A are arranged in the radial direction RD as a whole. The terminals 582A, 583A of the upper capacitor section 580A are located at a position spaced radially inward from the terminals 532A, 533A of the upper arm switch section 530A. Similarly, the terminals 532B, 533B of the lower arm switch section 530B and the terminals 582B, 583B of the lower capacitor section 580B are arranged in the radial direction RD. The terminals 582B, 583B of the lower capacitor section 580B are located at a position spaced radially inward from the terminals 532B, 533B of the lower arm switch section 530B.

[0139] The arm switch section 530 and the smoothing capacitor section 580 are connected to the bus bars 601-603 in the first bus bar set 611 and the second bus bar set 612, respectively. The connection configuration between the arm switch section 530 and the smoothing capacitor section 580 and the bus bars 601-603 is the same in the first bus bar set 611 and the second bus bar set 612. In Figs. 16-19, the second bus bar set 612 is omitted from illustration. In Fig. 7, a plan view of the high voltage board 510, a plan view of the P bus bar 601, a plan view of the output bus bar 603, and a plan view of the N bus bar 602 are arranged in order from top to bottom.

[0140] 18 and 19, currents IpA, IpB, InA, InB, IoA, and IoB flow in the high-voltage substrate 510. The currents IpA, IpB, InA, InB, IoA, and IoB flow in the same manner in the first bus bass set 611 and the second bus bass set 612. In this embodiment, the currents IpA, IpB, InA, InB, IoA, and IoB flowing in the first bus bass set 611 will be described. A description of the currents IpA, IpB, InA, InB, IoA, and IoB flowing in the second bus bass set 612 will be omitted.

[0141] In the output bus bar 603, an upper output current IoA and a lower output current IoB flow. The output currents IoA and IoB flow in the circumferential direction CD as a whole. The output currents IoA and IoB flow from the upper switch group 530GA to the lower switch group 530GB as a whole in one phase. In detail, the upper output current IoA flows in the circumferential direction CD from the upper source terminal 533A to the output connection portion 514. The lower output current IoB flows in the circumferential direction CD from the output connection portion 514 to the lower drain terminal 532B. The upper output current IoA and the lower output current IoB correspond to output currents.

[0142] The high voltage substrate 510 has an overlapping area AO. The overlapping area AO is an area overlapping the output currents IoA and IoB flowing through the output bus bar 603. The overlapping area AO exists separately for each of the multiple phases. For example, the overlapping area AO exists separately for each of the multiple output bus bars 603. The overlapping area AO is an area overlapping the upper switch group 530GA and the lower switch group 530GB included in one phase in the bus bars 601-603. The overlapping area AO includes the entire bus bars 601-603 in the radial direction RD. The overlapping area AO also includes an area in which the arm switch unit 530 and the smoothing capacitor unit 580 are provided in the circumferential direction CD.

[0143] The overlapping area AO extends in the circumferential direction CD so as to span the farthest upper component 530Af and the farthest lower component 530Bf. The farthest upper component 530Af is the upper arm switch unit 530A located farthest from the lower switch group 530GB among the multiple upper arm switch units 530A included in the upper switch group 530GA. The farthest upper component 530Af is located at the end position opposite the lower switch group 530GB in the upper switch group 530GA. The farthest lower component 530Bf is the lower arm switch unit 530B located farthest from the upper switch group 530GA among the multiple lower arm switch units 530B included in the lower switch group 530GB. The farthest lower component 530Bf is located at the end position opposite the upper switch group 530GA in the lower switch group 530GB.

[0144] The overlapping region AO is in a state of spanning between the terminals 532A, 533A of the farthest upper component 530Af and the terminals 532B, 533B of the farthest lower component 530Bf. The overlapping region AO includes these terminals 532A, 533A, 532B, 533B. The overlapping region AO includes at least the upper source terminal 533A of the farthest upper component 530Af and the lower drain terminal 532B of the farthest lower component 530Bf.

[0145] In the P bus bar 601, the upper P current IpA and the lower P current IpB flow. The P currents IpA and IpB flow in the circumferential direction CD as a whole. The P currents IpA and IpB flow from the upper capacitor group 580GA and the lower capacitor group 580GB toward the upper switch group 530GA in one phase as a whole. The P currents IpA and IpB flow in the opposite direction to the output currents IoA and IoB in the circumferential direction CD as a whole. In detail, the upper P current IpA flows in the circumferential direction CD from the upper P capacitor terminal 582A toward the upper drain terminal 532A. The lower P current IpB flows in the circumferential direction CD from the lower P capacitor terminal 582B toward the upper drain terminal 532A. The lower P current IpB flows in the opposite direction to the output currents IoA and IoB in the circumferential direction CD. The P currents IpA and IpB correspond to a high potential current and a parallel current.

[0146] In the N bus bar 602, the upper N current InA and the lower N current InB flow. The N currents InA and InB flow in the circumferential direction CD as a whole. The N currents InA and InB flow from the lower switch group 530GB to the upper capacitor group 580GA and the lower capacitor group 580GB as a whole in one phase. The N currents InA and InB flow in the opposite direction to the output currents IoA and IoB in the circumferential direction CD as a whole. In detail, the upper N current InA flows in the circumferential direction CD from the lower source terminal 533B to the upper N capacitor terminal 583A. The lower N current InB flows in the circumferential direction CD from the lower source terminal 533B to the lower N capacitor terminal 583B. The lower N current InB flows in the opposite direction to the output currents IoA and IoB in the circumferential direction CD. The N currents InA and InB correspond to the low potential current and the parallel current.

[0147] The P currents IpA, IpB and the N currents InA, InB generally flow in the same direction in the circumferential direction CD, but flow in opposite directions in the radial direction RD. This is because the P capacitor terminals 582A, 582B and the N capacitor terminals 583A, 583B are arranged in the radial direction RD in both the upper capacitor section 580A and the lower capacitor section 580B. For example, the lower P current IpB flows from the lower P capacitor terminal 582B toward the upper drain terminal 532A in the circumferential direction CD and radially outward. The lower N current InB flows from the lower source terminal 533B toward the upper N capacitor terminal 583A in the circumferential direction CD and radially inward.

[0148] In the P bus bar 601, the upper P current IpA flows from the upper P capacitor terminal 582A, which is radially outer than the upper N capacitor terminal 583A, to the upper drain terminal 532A. The lower P current IpB flows from the lower P capacitor terminal 582B, which is radially inner than the lower N capacitor terminal 583B, to the upper drain terminal 532A. As described above, the distance over which the upper P current IpA flows in the radial direction RD is different from the distance over which the lower P current IpB flows in the radial direction RD. In this embodiment, the distance over which the upper P current IpA flows radially outward is shorter than the distance over which the lower P current IpB flows radially outward.

[0149] In the N bus bar 602, the lower N current InB flowing out from the lower source terminal 533B flows into the lower N capacitor terminal 583B located radially outward from the lower P capacitor terminal 582B. Also, the upper N current InA flowing out from the lower source terminal 533B flows into the upper N capacitor terminal 583A located radially inward from the upper P capacitor terminal 582A. As described above, the distance over which the lower N current InB flows in the radial direction RD is different from the distance over which the upper N current InA flows in the radial direction RD. In this embodiment, the distance over which the lower N current InB flows radially inward is shorter than the distance over which the upper N current InA flows radially inward.

[0150] 19, for convenience of illustration, each of currents IpA, IpB, InA, InB, IoA, and IoB is illustrated with a plurality of arrows. In reality, currents IpA, IpB, InA, InB, IoA, and IoB flow collectively through bus bars 601-603.

[0151] For example, the lower P current IpB flows through the P bus bar 601 from the multiple lower P capacitor terminals 582B toward the multiple upper drain terminals 532A. For this reason, the lower P current IpB becomes larger as it approaches the output connection part 514 in the circumferential direction CD. The lower P current IpB becomes smaller as it passes through the output connection part 514 and moves away from the output connection part 514. Like the lower P current IpB, the upper N current InA becomes larger as it approaches the output connection part 514 in the circumferential direction CD. The upper N current InA becomes smaller as it passes through the output connection part 514 and moves away from the output connection part 514.

[0152] The upper output current IoA becomes larger as it approaches the output connection portion 514 in the circumferential direction CD, and reaches the output connection portion 514. The lower output current IoB becomes smaller as it moves away from the output connection portion 514 in the circumferential direction CD. In the high-voltage substrate 510, a region where the upper output current IoA becomes larger as it approaches the output connection portion 514 and a region where the lower P current IpB and the upper N current InA become larger as they approach the output connection portion 514 overlap in the axial direction AD. For this reason, it is likely that the magnetic field generated by the upper output current IoA, the magnetic field generated by the lower P current IpB, and the magnetic field generated by the upper N current InA cancel each other out.

[0153] In addition, a region where the lower output current IoB becomes smaller the farther it is from the output connection portion 514 and a region where the lower P current IpB and the upper N current InA become smaller the farther it is from the output connection portion 514 overlap in the axial direction AD. For this reason, the magnetic field generated by the lower output current IoB, the magnetic field generated by the lower P current IpB, and the magnetic field generated by the upper N current InA tend to cancel each other out. Therefore, the inductances L601-L603 generated in the bus bars 601-603 tend to be reduced.

[0154] As described above, in the high-voltage board 510, the flows of the currents IpA, IpB, InA, InB, IoA, and IoB are set so as to reduce the inductances L601-L603. By reducing the inductances L601-L603 occurring in the bus bars 601-603, it is possible to prevent problems such as a decrease in the switching accuracy of the arm switch section 530 caused by the inductances L601-L603.

[0155] In addition to the decrease in switching accuracy, the inductances L601 to L603 cause problems such as current imbalance. Current imbalance occurs when a difference in switch current Id occurs in the arm switch sections 530 in a configuration in which the arm switch sections 530 are connected in parallel. The switch current Id is a current that flows through the arm switch section 530 as shown in FIG. 18. The switch current Id is a current that flows through the drain of the arm switch 86 in the arm switch section 530, and is sometimes referred to as a drain current.

[0156] Regarding the current imbalance, a portion in which two upper arm switch units 530A are connected in parallel in the inverter device 80 will be described as an example. As shown in Fig. 20, a first switch unit 530A1 and a second switch unit 530A2 are connected in parallel as the two upper arm switch units 530A. Note that Fig. 20 illustrates only one of the multiple upper and lower arm circuits 83 included in the inverter device 80. Also, of the multiple upper arms 84 and multiple lower arms 85 included in one upper and lower arm circuit 83, only two upper arms 84 and two lower arms 85 are illustrated.

[0157] The inverter device 80 has a driving power supply 620. The driving power supply 620 applies a control voltage to the arm switch section 530 for controlling switching of the arm switch section 530. The driving power supply 620 is provided in, for example, the driving circuit 160. The driving power supply 620 is electrically connected to a gate terminal 534 and a driver source terminal 535. The driving power supply 620 is connected to the gate terminal 534 via, for example, a gate resistor R534. A parasitic inductance occurring in the driver source path is referred to as an inductance L534. The driver source path is a current path connecting the driving power supply 620 and the driver source terminal 535.

[0158] In the arm switch section 530, a control voltage from the drive power supply 620 is input to a gate terminal 534. The gate terminal 534 corresponds to an input control terminal. A gate voltage Vg of the gate terminal 534 has a value according to the control voltage. The gate voltage Vg is the potential of the gate terminal 534. In the arm switch section 530, a current is output from a driver source terminal 535 in response to the input of the control voltage to the gate terminal 534. The driver source terminal 535 corresponds to an output control terminal.

[0159] The driver source voltage Vks of the driver source terminal 535 increases or decreases according to the source voltage Vs of the source terminal 533. The driver source voltage Vks is the potential of the driver source terminal 535. The source voltage Vs is the potential of the source terminal 533. In the arm switch section 530, a parasitic inductance occurring in the conduction path between the drain terminal 532 and the arm switch 86 is referred to as an inductance L530d. Also, a parasitic inductance occurring in the conduction path between the arm switch 86 and the source terminal 533 is referred to as an inductance L530S. The driver source voltage Vks becomes a potential higher than the source voltage Vs by the amount of the inductance L530S.

[0160] The source voltage Vs is higher than the potential of the output line 143 by at least the inductance voltage Vl. The inductance voltage Vl is a voltage generated in the inductance Ls. The inductance Ls is a parasitic inductance generated in the source path. The source path is a current path connecting the source terminal 533 and the output line 143. At least a part of the source path is formed by the output bus bar 603. The inductance Ls includes an inductance L603 generated in the output bus bar 603. Therefore, the larger the inductance L603 generated in the output bus bar 603, the larger the inductance Ls generated in the source path, and the greater the inductance voltage Vl.

[0161] For example, consider Comparative Example 1, in which the currents IpA, IpB, InA, InB, IoA, and IoB do not flow in a manner that reduces the inductances L601 to L603, unlike the present embodiment. In Comparative Example 1, the inductance L603 generated in the output bus bar 603 is large, and therefore the inductance Ls generated in the source path is large. This increases the inductance voltage Vl, and the source voltage Vs becomes high. In the arm switch section 530, when the source voltage Vs becomes high, the driver source voltage Vks also becomes high.

[0162] In the comparative example 1, the source voltage Vs of the first switch section 530A1 and the source voltage Vs of the second switch section 530A2 are likely to differ. For example, if the distance between the second switch section 530A2 and the output connection section 514 is greater than the distance between the first switch section 530A1 and the output connection section 514, the source path of the first switch section 530A1 becomes longer than the source path of the second switch section 530A2. Then, the inductance Ls2 for the second switch section 530A2 becomes greater than the inductance Ls1 for the first switch section 530A1. As a result, the inductance voltage Vl2 for the second switch section 530A2 becomes greater than the inductance voltage Vl1 for the first switch section 530A1. Then, the source voltage Vs of the second switch section 530A2 becomes higher than the source voltage Vs of the first switch section 530A1, and the driver source voltage Vks of the second switch section 530A2 becomes higher than the driver source voltage Vks of the first switch section 530A1.

[0163] When a potential difference occurs in the driver source voltage Vks between the first switch section 530A1 and the second switch section 530A2, a circulating current Ik flows between the first switch section 530A1 and the second switch section 530A2. This potential difference is sometimes referred to as a source potential difference.

[0164] In the arm switch section 530, a switch current Id flows according to a gate-source voltage Vgs. The gate-source voltage Vgs is a potential difference between the gate voltage Vg and the driver source voltage Vks. For example, the larger the gate-source voltage Vgs is, the larger the switch current Id tends to be.

[0165] As described above, when the circulating current Ik flows in Comparative Example 1, the gate-source voltage Vgs2 in the second switch section 530A2 is smaller than the gate-source voltage Vgs1 in the first switch section 530A1. This is because while the gate voltages Vg are the same in the first switch section 530A1 and the second switch section 530A2, the driver source voltage Vks in the second switch section 530A2 is higher than the driver source voltage Vks in the first switch section 530A1.

[0166] 21, the first switch section 530A1 and the second switch section 530A2 are likely to have different switch currents Id1 and Id2 due to the difference in gate-source voltages Vgs1 and Vgs2. As described above, when the inductance Ls2 is larger than the inductance Ls1, the gate-source voltage Vgs2 in the second switch section 530A2 is likely to be smaller than the gate-source voltage Vgs1 in the first switch section 530A1. Therefore, the switch current Id2 in the second switch section 530A2 is likely to be smaller than the switch current Id1 in the first switch section 530A1. In this way, a current imbalance occurs between the first switch section 530A1 and the second switch section 530A2.

[0167] When a current imbalance occurs among the multiple arm switch sections 530, it is considered that differences in the degree of deterioration due to aging and the like occur. That is, the degree of deterioration varies among the multiple arm switch sections 530. For example, as in Comparative Example 1, when the switch current Id1 is larger than the switch current Id2, the first switch section 530A1 is more likely to deteriorate than the second switch section 530A2 due to the fact that a larger current always flows.

[0168] In contrast to this, in this embodiment, the flows of currents IpA, IpB, InA, InB, IoA, and IoB are such that the inductances L601 to L603 are reduced.

[0169] In addition, in this embodiment, the arm switch section 530 has a driver source terminal 535. Furthermore, in this embodiment, in the first switch section 530A1 and the second switch section 530A2 shown in FIG. 20, the inductance L603 includes the inductances Ls1 and Ls2. Therefore, by reducing the inductance L603, the inductances Ls1 and Ls2 can be reduced. The smaller the inductances Ls1 and Ls2 are, the smaller the difference between the inductances Ls1 and Ls2 is, and the smaller the circulating current Ik is. And, the smaller the circulating current Ik is, the smaller the difference between the switch currents Id1 and Id2 is, and the less likely the current imbalance is to occur. Also, the smaller the circulating current Ik is, the smaller the difference between the switch currents Id1 and Id2 is. For example, if the difference between the inductances Ls1 and Ls2 can be made zero, the circulating current Ik can be made as small as possible, and the current imbalance is almost never generated. This makes it difficult for the deterioration degree of the first switch section 530A1 and the second switch section 530A2 to differ from each other.

[0170] For example, consider Comparative Example 2, which is different from the present embodiment and in which the arm switch unit 530 does not have the driver source terminal 535. In Comparative Example 2, as shown in Fig. 22, the driving power supply 620 is electrically connected to the gate terminal 534 and the source terminal 533. Therefore, in Comparative Example 2, the circulating current Ik does not flow through the inductance L530S. The circulating current Ik becomes a current corresponding to the inductance Ls out of the inductance Ls and the inductance L530S.

[0171] <Composition group C> 23, the arm switch units 530 are arranged in the circumferential direction CD along the outer circumferential end 512 with respect to the high-voltage substrate 510. These arm switch units 530 are also arranged in the circumferential direction CD along the outer circumferential end 552 with respect to the drive substrate 550. The arm switch units 530 are provided on the inner circumferential surface 90b with respect to the inverter outer circumferential wall 91. The arm switch row 530R extends in the circumferential direction CD along the outer circumferential ends 512, 552 and is annular. In the high-voltage substrate 510 and the drive substrate 550, the outer circumferential ends 512, 552 extend continuously in the circumferential direction CD.

[0172] As shown in Figs. 24 and 25, the switch body 531 has a body base 537 and a body heat dissipation part 538. The body base 537 is formed of a resin material or the like and has electrical insulation properties. The body base 537 is, for example, a molded resin. The body base 537 forms the outer periphery of the switch body 531. The body base 537 forms at least a part of each of the first plate surface 531a, the second plate surface 531b, the body base end part 531c, and the body tip part 531d.

[0173] The main body heat dissipation section 538 is formed of a metal material or the like and has thermal conductivity. The main body heat dissipation section 538 has higher thermal conductivity than, for example, the main body base 537. The main body heat dissipation section 538 is, for example, a metal plate formed into a plate shape. The main body heat dissipation section 538 is embedded in the main body base 537. In the switch main body 531, the terminals 532 to 535, etc. and the main body heat dissipation section 538 are electrically insulated by the main body base 537.

[0174] In the switch body 531, the heat dissipation of the second plate surface 531b is enhanced by the body heat dissipation part 538. The heat dissipation of the second plate surface 531b is higher than that of the first plate surface 531a. When heat is generated in the switch body 531, the heat dissipation from the second plate surface 531b is greater than that from the first plate surface 531a. The body heat dissipation part 538 is exposed from the second plate surface 531b, but is not exposed from the first plate surface 531a. At least a part of the body heat dissipation part 538 forms the second plate surface 531b. For example, the second plate surface 531b includes a portion formed by the body base 537 and a portion formed by the body heat dissipation part 538. The body heat dissipation part 538 is in contact with the inner peripheral surface 90b at the second plate surface 531b. The first plate surface 531a corresponds to an inner plate surface, and the second plate surface 531b corresponds to an outer plate surface.

[0175] In the arm switch section 530, power from the battery 31 is supplied to the drain terminal 532 and the source terminal 533. The drain terminal 532 and the source terminal 533 are power terminals to which power is supplied, and correspond to power terminals. The drain terminal 532 and the source terminal 533 are electrically connected to the high-voltage substrate 510. The high-voltage substrate 510 corresponds to the power connection target and the power substrate, and the outer circumferential end 512 corresponds to the power outer circumferential end. The drain terminal 532 is electrically connected to the P bus bar 601 or the output bus bar 603. The source terminal 533 is connected to the output bus bar 603 or the N bus bar 602. In FIG. 24, the P bus bar 601, the N bus bar 602, and the output bus bar 603 are illustrated collectively, and the illustration of the earth bus bar 604 is omitted.

[0176] 24, in the high-voltage substrate 510, the drain terminal 532 and the source terminal 533 are connected to the through-holes 515. The drain terminal 532 and the source terminal 533 are connected to the P bus bar 601, the N bus bar 602, or the output bus bar 603 in a conductive manner while being inserted into the through-holes 515. A plurality of through-holes 515 are arranged in the circumferential direction CD along at least the outer circumferential end 512 in the high-voltage substrate 510. The through-holes 515 are included in each of the connection portion between the drain terminal 532 and the high-voltage substrate 510 and the connection portion between the source terminal 533 and the high-voltage substrate 510. The P bus bar 601, the N bus bar 602, and the output bus bar 603 correspond to power bus bars.

[0177] The gate terminal 534 and the driver source terminal 535 are terminals for controlling the conversion of power by switching of the arm switch 86, and correspond to control terminals. The gate terminal 534 and the driver source terminal 535 are electrically connected to a drive substrate 550. The drive substrate 550 corresponds to a control connection target and a target substrate, and the outer periphery end 552 corresponds to a control outer periphery end. The gate terminal 534 and the driver source terminal 535 are electrically connected to a wiring pattern of the drive substrate 550, for example.

[0178] In the drive substrate 550, the gate terminal 534 and the driver source terminal 535 are connected to through holes 555. The gate terminal 534 and the driver source terminal 535 are electrically connected to the wiring pattern of the drive substrate 550 while inserted into the through holes 555. A plurality of through holes 555 are arranged in the circumferential direction CD along the outer circumferential end 552 of the drive substrate 550. The through holes 555 are included in each of the connection portion between the gate terminal 534 and the drive substrate 550 and the connection portion between the driver source terminal 535 and the drive substrate 550.

[0179] The high-voltage substrate 510 and the drive substrate 550 are opposed to each other. In the high-voltage substrate 510 and the drive substrate 550, the second high-voltage surface 510b and the first control surface 550a are opposed to each other. The high-voltage substrate 510 has a first high-voltage surface 510a and a second high-voltage surface 510b as a pair of plate surfaces. In the high-voltage substrate 510, the first high-voltage surface 510a faces the high-voltage side, and the second high-voltage surface 510b faces the drive substrate 550 side. The drive substrate 550 has a first control surface 550a and a second control surface 550b as a pair of plate surfaces. In the drive substrate 550, the first control surface 550a faces the high-voltage substrate 510 side, and the second control surface 550b faces the low-voltage side.

[0180] Switch body 531 is provided at a position closer to high voltage board 510 than drive board 550. The separation distance between switch body 531 and high voltage board 510 is smaller than the separation distance between switch body 531 and drive board 550. The shortest distance between switch body 531 and high voltage board 510 is the separation distance, and the shortest distance between switch body 531 and drive board 550 is the separation distance.

[0181] At least a portion of switch body 531 is provided between first high pressure surface 510a and second control surface 550b in the axial direction AD. In switch body 531, at least body base end portion 531c is provided between first high pressure surface 510a and second control surface 550b in the axial direction AD. The region between first high pressure surface 510a and second control surface 550b in the axial direction AD is a substrate region in which high voltage substrate 510 and drive substrate 550 are provided. At least body base end portion 531c of switch body 531 is included in a projection region obtained by projecting the substrate region radially outward.

[0182] The switch body 531 is located on the high pressure side of the substrate midline Cmid. In the switch body 531, the body base end 531c is located between the substrate midline Cmid and the first high pressure surface 510a in the axial direction AD. The body base end 531c is located closer to the first high pressure surface 510a than the substrate midline Cmid in the axial direction AD. The switch body 531 extends toward the high pressure side of the high voltage substrate 510 in the axial direction AD.

[0183] The substrate midline Cmid is an imaginary line that passes through the middle between the high-voltage substrate 510 and the drive substrate 550. The middle between the high-voltage substrate 510 and the drive substrate 550 is, for example, the middle between the plate surfaces of the high-voltage substrate 510 and the drive substrate 550 that face each other. The substrate midline Cmid extends, for example, parallel to each plate surface of the high-voltage substrate 510 and the drive substrate 550. In the axial direction AD, the position through which the substrate midline Cmid passes is the middle position between the high-voltage substrate 510 and the drive substrate 550.

[0184] The drain terminal 532 has a drain exposed portion 532ex. The drain exposed portion 532ex is an exposed portion of the drain terminal 532 that spans between the switch body 531 and the high-voltage substrate 510. The drain exposed portion 532ex connects the switch body 531 and the high-voltage substrate 510, and corresponds to a power connecting portion. If the drain exposed portion 532ex has a curved shape, the length dimension of the drain exposed portion 532ex is greater than the distance between the switch body 531 and the high-voltage substrate 510.

[0185] The source terminal 533 has a source exposed portion 533ex. The source exposed portion 533ex is an exposed portion of the source terminal 533 that spans between the switch body 531 and the high-voltage substrate 510. The source exposed portion 533ex connects the switch body 531 and the high-voltage substrate 510, and corresponds to a power connecting portion. If the source exposed portion 533ex has a bent shape, the length dimension of the source exposed portion 533ex is greater than the distance between the switch body 531 and the high-voltage substrate 510.

[0186] The gate terminal 534 has a gate exposed portion 534ex. The gate exposed portion 534ex is an exposed portion of the gate terminal 534 that spans between the switch body 531 and the drive substrate 550. The gate exposed portion 534ex connects the switch body 531 and the drive substrate 550, and corresponds to a control connection portion. If the gate exposed portion 534ex has a bent shape, the length dimension of the gate exposed portion 534ex becomes larger than the distance between the switch body 531 and the drive substrate 550.

[0187] The driver source terminal 535 has a drain source exposed portion 535ex. The drain source exposed portion 535ex is an exposed portion of the driver source terminal 535 that spans between the switch body 531 and the drive substrate 550. The drain source exposed portion 535ex connects the switch body 531 and the drive substrate 550, and corresponds to a control connection portion. If the drain source exposed portion 535ex has a bent shape, the length dimension of the drain source exposed portion 535ex is greater than the distance between the switch body 531 and the drive substrate 550.

[0188] The terminals 532 to 535 have a base end extension 536a, a tip end extension 536b, and an extension connection portion 536c. The base end extension 536a is a portion extending from the base end of the terminals 532 to 535. The base end extension 536a extends from the main body base end 531c in the axial direction AD. The tip extension 536b is a portion extending from the tip of the terminals 532 to 535. The tip extension 536b extends from the high voltage board 510 or the drive board 550 in the axial direction AD along the base end extension 536a. The tip extension 536b is inserted into the through hole 515, 555, and is fixed to the high voltage board 510 or the drive board 550. The extending connection portion 536c is a portion where the base end extending portion 536a and the tip end extending portion 536b of the terminals 532-535 are connected.

[0189] The drain terminal 532 and the source terminal 533 are bent to form a U-shape as a whole. The drain terminal 532 and the source terminal 533 are bent back so as to extend from the switch body 531 in the axial direction AD away from the high voltage board 510 and to extend toward the high voltage board 510. In the drain terminal 532 and the source terminal 533, a base end extension portion 536a and a tip end extension portion 536b extend in the same direction from an extension connection portion 536c. The drain terminal 532 and the source terminal 533 are bent back so as to extend from the switch body 531, make a U-turn, and return.

[0190] The gate terminal 534 and the driver source terminal 535 are bent to form a Z-shape as a whole. The gate terminal 534 and the driver source terminal 535 extend in the axial direction AD from the switch body 531 toward the drive substrate 550 as a whole, including a portion extending in the radial direction RD. In the gate terminal 534 and the driver source terminal 535, a base end extension portion 536a and a tip end extension portion 536b extend in opposite directions from an extension connection portion 536c.

[0191] <Configuration group D> Arm switch section 530 generates heat when energized and corresponds to a heat-generating component. Smoothing capacitor section 580 and filter component 524 generate heat when energized similarly to arm switch section 530, but the heat generated by energization is smaller than that of arm switch section 530. In other words, the heat generated by energization of smoothing capacitor section 580 and the heat generated by energization of filter component 524 are smaller than the heat generated by energization of arm switch section 530. Smoothing capacitor section 580 and filter component 524 correspond to low-heat generating components.

[0192] In this embodiment, for an energized component such as the arm switch unit 530 that generates heat when energized, a component that generates a large amount of heat and / or a large controlled temperature is said to generate a large amount of heat. For example, in an energized component, the larger the amount of heat generated, the larger the rate of temperature rise tends to be. Also, in an energized component, the higher the controlled temperature, the higher the heat resistance tends to be.

[0193] At least one of the heat generation amount and the management temperature of the arm switch section 530 is greater than those of the smoothing capacitor section 580 and the filter component 524, and thus the arm switch section 530 generates more heat due to energization than the smoothing capacitor section 580 and the filter component 524. For example, the heat generation amount of the arm switch section 530 is greater than both the heat generation amount of the smoothing capacitor section 580 and the heat generation amount of the filter component 524. In addition, the management temperature of the arm switch section 530 is higher than both the management temperature of the smoothing capacitor section 580 and the management temperature of the filter component 524. Among all the components constituting the inverter device 80, the arm switch section 530 is the component that generates the greatest amount of heat due to energization.

[0194] Filter component 524 generates less heat when energized than smoothing capacitor section 580. That is, the heat generated by energizing filter component 524 is less than the heat generated by energizing smoothing capacitor section 580. Smoothing capacitor section 580 corresponds to a first small heat component, and filter component 524 corresponds to a second small heat component.

[0195] As shown in FIG. 26, the inverter device 80 has a capacitor row 580R, a filter row 524R, and an arm switch row 530R. All of these rows 580R, 524R, and 530R extend in an annular shape in the circumferential direction CD. The arm switch row 530R is located at a position spaced radially outward from the capacitor row 580R. The filter row 524R is located at a position spaced radially inward from the capacitor row 580R. The capacitor row 580R is provided between the arm switch row 530R and the filter row 524R in the radial direction RD. In FIG. 26, the rows 580R, 524R, and 530R are represented by dashed lines.

[0196] The arm switch row 530R has a plurality of arm switch sections 530. In the arm switch row 530R, a plurality of arm switch sections 530 are arranged in the circumferential direction CD. For example, one arm switch row 530R extends in the circumferential direction CD. In the one arm switch row 530R, the arm switch sections 530 are arranged in the circumferential direction CD one by one throughout the entire circumferential direction CD. The arm switch row 530R extends along the inner peripheral surface 90b with respect to the inverter outer peripheral wall 91. The arm switch row 530R includes a plurality of switch groups 530G. The arm switch row 530R corresponds to a heat-generating component row.

[0197] The arm switch row 530R is generally annular. In the arm switch row 530R, the arm switch units 530 are arranged in a mixture of equal intervals and unequal intervals. In the arm switch row 530R, the separation distance between two arm switch units 530 adjacent to each other in the circumferential direction CD is not uniform in the circumferential direction CD. For example, the separation distance between two switch groups 530G adjacent to each other in the circumferential direction CD is greater than the separation distance between two arm switch units 530 adjacent to each other in the circumferential direction CD in one switch group 530G. In the arm switch row 530R, a component other than the arm switch unit 530, such as the motor current sensor 146, may be inserted between two arm switch units 530 adjacent to each other in the circumferential direction CD.

[0198] The capacitor row 580R has a plurality of smoothing capacitor sections 580. In the capacitor row 580R, the plurality of smoothing capacitor sections 580 are arranged in the circumferential direction CD. For example, one capacitor row 580R extends in the circumferential direction CD. In the one capacitor row 580R, the smoothing capacitor sections 580 are arranged in the circumferential direction CD one by one throughout the entire circumferential direction CD. The capacitor row 580R extends along the outer circumferential end 512 with respect to the high-voltage substrate 510. The capacitor row 580R includes a plurality of capacitor groups 580G. The capacitor row 580R corresponds to the small heat component row and the first component row.

[0199] The capacitor array 580R is generally annular. In the capacitor array 580R, the smoothing capacitor sections 580 are arranged in a mixture of equal intervals and unequal intervals. In the capacitor array 580R, the distance between two adjacent smoothing capacitor sections 580 in the circumferential direction CD is not uniform in the circumferential direction CD. For example, the distance between two adjacent capacitor groups 580G in the circumferential direction CD is greater than the distance between two adjacent smoothing capacitor sections 580 in one capacitor group 580G in the circumferential direction CD. In the capacitor array 580R, a component other than the smoothing capacitor section 580, such as the motor current sensor 146, may be inserted between two adjacent smoothing capacitor sections 580 in the circumferential direction CD.

[0200] The filter row 524R has a plurality of filter components 524. In the filter row 524R, a plurality of smoothing capacitor units 580 are arranged in the circumferential direction CD. For example, one filter row 524R extends in the circumferential direction CD. In the one filter row 524R, the filter components 524 are arranged in the circumferential direction CD one by one in at least a part of the circumferential direction CD. The filter row 524R extends along the inner circumferential end 511 with respect to the high-voltage board 510. The filter row 524R corresponds to the small heat component row and the second component row.

[0201] The filter row 524R has an annular shape as a whole. In the filter row 524R, the filter components 524 are not arranged at equal intervals in the circumferential direction CD. In the filter row 524R, the common mode coil sections 525, the normal mode coil sections 526, the Y capacitor sections 527, and the X capacitor sections 528 are arranged in a mixed manner. Note that in the filter row 524R, a component other than the filter components 524, such as the current sensor 147, may be inserted between two filter components 524 adjacent to each other in the circumferential direction CD.

[0202] The smoothing capacitor units 580 include a group-aligned component 580c. The filter components 524 include a group-aligned component 524a. The group-aligned components 580c and 524a are arranged in positions aligned in the radial direction RD with respect to the switch group 530G. At least a part of the group-aligned components 580c and 524a is aligned in the radial direction RD with respect to the switch group 530G. For example, among the filter components 524, the filter component 524 between two switch groups 530G adjacent to each other in the circumferential direction CD is not the group-aligned component 580c. The switch group 530G corresponds to a heat generation group.

[0203] The group aligned components 580c, 524a are provided at projection positions projected onto the arm switch section 530 in the radial direction RD. The projection positions are positions where at least a part of a projection surface of the group aligned components 580c, 524a projected radially outward overlaps with the arm switch section 530. The group aligned components 580c, 524a at the projection positions and the arm switch section 530 where the projection surfaces of the group aligned components 580c, 524a overlap are aligned in the radial direction RD.

[0204] The inverter device 80 has a switch area Asw1 and an intermediate area Asw2. The switch area Asw1 is an area in which the switch group 530G is provided, and extends in the circumferential direction CD along the inner peripheral surface 90b. A plurality of switch areas Asw1 are arranged in the circumferential direction CD. One switch area Asw1 is an area in which one switch group 530G is provided. In the switch area Asw1, a plurality of arm switches 86 of the switch group 530G are provided so as to be densely packed. The switch area Asw1 corresponds to a densely packed area.

[0205] The intermediate region Asw2 is a region provided between two switch regions Asw1 adjacent to each other in the circumferential direction CD. The intermediate region Asw2 is in a state of bridging between the two switch regions Asw1 adjacent to each other in the circumferential direction CD, and extends in the circumferential direction CD along the inner circumferential surface 90b. The intermediate region Asw2 is a region in which the switch group 530G is not provided, and is a region in which the arm switch unit 530 is not provided. A plurality of intermediate regions Asw2 are arranged in the circumferential direction CD along the inner circumferential surface 90b. The switch regions Asw1 and the intermediate regions Asw2 are arranged alternately in the circumferential direction CD.

[0206] The inverter device 80 includes components and parts that are aligned in the radial direction RD with respect to the switch region Asw1. For example, the inverter fin group 93 and group arrangement components 580c and 524a are aligned in the radial direction RD with respect to the switch region Asw1. The inverter device 80 also includes components and parts that are aligned in the radial direction RD with respect to the intermediate region Asw2. For example, the flanges 94 and 95, the inverter connector 96, and the connector arrangement component 524b are aligned in the radial direction RD with respect to the intermediate region Asw2.

[0207] The connector array part 524b is included in the multiple filter parts 524. The connector array part 524b is provided at a position aligned in the radial direction RD with respect to the inverter connector 96. At least a portion of the connector array part 524b is aligned in the radial direction RD with the inverter connector 96. For example, the group array part 524a of the multiple filter parts 524 is not the connector array part 524b.

[0208] The inverter connector 96 is a connector for electrically connecting the arm switch 86 to the battery 31. The battery 31 corresponds to an external device, and the inverter connector 96 corresponds to an external connector.

[0209] As shown in FIG. 27, the inverter device 80 has a switch pressing portion 539. The switch pressing portion 539 presses the arm switch portion 530 toward the inverter outer peripheral wall 91. The switch pressing portion 539 is an elastically deformable member, and is formed by a biasing member such as a leaf spring. The switch pressing portion 539 is fixed to the inverter outer peripheral wall 91 in an elastically deformed state, and presses the switch main body 531 toward the inner peripheral surface 90b radially outward by a restoring force. In the switch pressing portion 539, for example, one end is fixed to the inverter outer peripheral wall 91 by a fastener such as a bolt, and the other end is hooked on the first plate surface 531a.

[0210] The switch body 531 is in contact with the inner peripheral surface 90b and is fixed to the inverter outer peripheral wall 91 by adhesive or the like. The switch body 531 may be in direct contact with the inner peripheral surface 90b or indirect contact with the inner peripheral surface 90b. Whether the switch body 531 and the inner peripheral surface 90b are in direct or indirect contact, it is sufficient that heat is transferred between the switch body 531 and the inner peripheral surface 90b. For example, a configuration in which the switch body 531 is in indirect contact with the inner peripheral surface 90b includes a configuration in which the switch body 531 is layered on the inner peripheral surface 90b via a thermally conductive member. The thermally conductive member is a member having thermal conductivity, such as gel, grease, adhesive, or the like. In this configuration, heat transfer between the switch body 531 and the inverter outer peripheral wall 91 is performed via the thermally conductive member.

[0211] The switch body 531 is in contact with the inner peripheral surface 90b and is further pressed against the inner peripheral surface 90b by the switch pressing portion 539. In the switch body 531, the second plate surface 531b is easily brought into close contact with the inner peripheral surface 90b by the pressing force of the switch pressing portion 539. This makes it easier for heat from the switch body 531 to be transferred to the switch outer peripheral wall. The second plate surface 531b may be directly or indirectly superimposed on the inner peripheral surface 90b. The switch body 531 corresponds to a component body, and the terminals 532 to 535 correspond to component terminals.

[0212] The high-voltage board 510 and the drive board 550 have thermal conductivity and can transfer heat to the arm switch section 530 and the component support section 500. The terminals 532 to 535 are connected to the boards 510 and 550, so that the boards 510 and 550 can transfer heat to the arm switch section 530. The heat transfer between the boards 510 and 550 and the component support section 500 is performed through the contact portion where the boards 510 and 550 contact the component support section 500. The contact portion between the boards 510 and 550 and the component support section 500 includes the high-voltage fixing section 507 and the drive fixing section 508. The high-voltage board 510 and the drive board 550 correspond to the connection board, and the component support section 500 corresponds to the board support section.

[0213] High voltage fixing part 507 is included in component support part 500. High voltage fixing part 507 is provided on at least one of beam part 501 and beam connecting part 502. High voltage board 510 is fixed to component support part 500 while in contact with high voltage fixing part 507. High voltage fixing part 507 is, for example, a convex part protruding from beam part 501 to the high voltage side. High voltage fixing part 507 is provided with screw hole 505. Drain terminal 532 and source terminal 533 are capable of thermally transferring to inverter outer peripheral wall 91 via high voltage board 510 and component support part 500.

[0214] The drive fixing portion 508 is included in the component support portion 500. The drive fixing portion 508 is provided on at least one of the beam portion 501 and the beam connecting portion 502. The drive board 550 is fixed to the component support portion 500 in a state of contact with the drive fixing portion 508. The drive fixing portion 508 is, for example, a convex portion protruding from the beam portion 501 toward the low voltage side. The drive fixing portion 508 is provided with a screw hole 506. The gate terminal 534 and the driver source terminal 535 are capable of thermally transferring to the inverter outer peripheral wall 91 via the drive board 550 and the component support portion 500.

[0215] As shown in FIG. 27 and FIG. 28, the heat dissipation path for dissipating the heat of the arm switch unit 530 to the outside of the inverter device 80 includes heat dissipation paths PH1 to PH3. The first heat dissipation path PH1 is a path for dissipating the heat of the switch body 531 from the inverter outer peripheral wall 91 to the outside. In the first heat dissipation path PH1, the heat of the switch body 531 is directly transferred to the inner peripheral surface 90b, and the heat is dissipated to the outside from the outer peripheral surface 90a via the inverter fins 92. The outer peripheral surface 90a corresponds to a heat dissipation surface that dissipates the heat transferred to the inner peripheral surface 90b to the outside. The heat transferred through the first heat dissipation path PH1 is easily dissipated from a portion of the outer peripheral surface 90a aligned in the radial direction RD to the switch area Asw1. The outer peripheral surface 90a may be referred to as a heat dissipation end. In particular, the portion of the outer peripheral surface 90a aligned in the radial direction RD to the switch area Asw1 may be referred to as a first heat dissipation end.

[0216] In the arm switch row 530R, heat is dissipated from each of the multiple arm switch units 530 through the first heat dissipation path PH1. In this case, in the inverter device 80, heat from the multiple arm switch units 530 is radially dissipated from the outer circumferential surface 90a toward the outside in the radial direction, as in the multiple first heat dissipation paths PH1 shown in FIG. 28. In this way, the first heat dissipation paths PH1 corresponding to the multiple arm switch units 530 are unlikely to overlap with each other. That is, the heat from the multiple arm switch units 530 is likely to be dissipated to the outside through different paths.

[0217] The second heat dissipation path PH2 is a path that dissipates heat from the drain terminal 532 and the source terminal 533 from the inverter outer peripheral wall 91 to the outside via the high-voltage board 510 and the component support part 500. In the second heat dissipation path PH2, the heat from the drain terminal 532 and the source terminal 533 is transferred to the high-voltage board 510, and then transferred to the inverter outer peripheral wall 91 via the component support part 500 and is dissipated to the outside from the outer peripheral surface 90a. The heat that has been transferred through the second heat dissipation path PH2 is likely to be dissipated from a portion of the outer peripheral surface 90a that is aligned in the radial direction RD in the intermediate region Asw2. The portion of the outer peripheral surface 90a that is aligned in the radial direction RD in the intermediate region Asw2 is sometimes referred to as a second heat dissipation end.

[0218] The third heat dissipation path PH3 is a path that dissipates heat from the gate terminal 534 and the driver source terminal 535 from the inverter outer peripheral wall 91 to the outside via the drive substrate 550 and the component support portion 500. In the third heat dissipation path PH3, the heat from the gate terminal 534 and the driver source terminal 535 is transferred to the drive substrate 550, and then transferred to the inverter outer peripheral wall 91 via the component support portion 500 and is dissipated to the outside from the outer peripheral surface 90a. The heat that has been transferred through the third heat dissipation path PH3 is likely to be dissipated from portions of the outer peripheral surface 90a that are aligned in the radial direction RD in the intermediate region Asw2.

[0219] <Composition group A> According to the present embodiment described so far, the mounted components of the inverter device 80 are fixed to the beam portion 501 via plate members, namely, the high-voltage board 510 and the drive board 550. In this configuration, the multiple beam portions 501, the high-voltage board 510, and the drive board 550 mutually regulate the stress applied in the XYZ directions. In other words, the structure in which the mounted components are sandwiched between the plate members on which the multiple lightweight beam portions 501 are placed and fixed is a lightweight, vibration-resistant, and high-strength shape. In this way, even if vibration is transmitted from the inverter outer peripheral wall 91 to the beam portion 501, the mounted components are prevented from vibrating significantly, and the vibration resistance of the inverter device 80 can be improved.

[0220] In the EPU 50, the inverter outer peripheral wall 91 is fixed to the motor outer peripheral wall 71 of the motor device 60, which vibrates relatively little, by a high-pressure side flange 94 or the like. That is, in order to support the rotor 300 of the motor device 60, the inverter device 80 is coupled to the motor outer peripheral wall 71, which holds the stator 200 and vibrates little, rather than to the rear end plate 62, which vibrates a lot. This reduces the effect of vibration on the inverter device 80. Furthermore, since the mounted components of the inverter device 80 are fixed to the beam portion 501 via the plate members, namely the high-voltage board 510 and the drive board 550, the vibration resistance of the inverter device 80 can be improved as described above. Furthermore, if the rear end plate 62 of the motor device 60 is not sufficiently cooled, the rear end plate 62 will become hot, but since an air layer is interposed between the rear end plate 62 and the mounted components of the inverter device 80, it is possible to prevent heat damage to the mounted components.

[0221] According to this embodiment, the high-voltage substrate 510 is provided on one side of the beam portion 501 in the axial direction AD, and the drive substrate 550 is provided on the opposite side of the beam portion 501 to the high-voltage substrate 510. In this configuration, the two plate members, the high-voltage substrate 510 and the drive substrate 550, restrict the multiple beam portions 501 from vibrating individually from one side and the other side in the axial direction AD, respectively. Therefore, a configuration in which the beam portion 501 is less likely to vibrate can be realized by the high-voltage substrate 510 and the drive substrate 550.

[0222] In addition, in inverter device 80, a sandwich structure is formed by multiple beams 501, high voltage board 510, and drive board 550. In this way, the support structure that supports the mounted components has a sandwich structure, so the strength of the support structure can be increased. Therefore, the sandwich structure can enhance the effect of suppressing vibration of the mounted components. Moreover, the sandwich structure can reduce the weight of the support structure.

[0223] According to this embodiment, the plate members that regulate the vibration of the beam portion 501 are the high-voltage board 510 and the drive board 550. In this configuration, it is not necessary to use a dedicated plate member to regulate the vibration of the beam portion 501. For example, unlike this embodiment, in a configuration in which a dedicated plate member is stretched across and fixed to the multiple beam portions 501, there is a concern that the electrical wiring and wiring work for energizing the mounted components will become complicated. In contrast, in this embodiment, the high-voltage board 510 and the drive board 550 can both simplify the electrical wiring and regulate the vibration of the beam portion 501. In addition, by using multilayer wiring for the high-voltage board 510 and the drive board 550, the electrical characteristics of the inverter device 80 can be improved.

[0224] In this embodiment, the beam portion 501 between the high-voltage board 510 and the drive board 550 is grounded to the ground earth. In this configuration, the beam portion 501 prevents the electromagnetic field generated by the current passing through the high-voltage components such as the high-voltage board 510 from being applied to the low-voltage components such as the drive board 550. In this manner, the influence of the electromagnetic field from the high-voltage components is reduced by the beam portion 501, so that the inverter device 80 is resistant to noise. In addition, a ground path grounded to the ground earth is formed including the beam portion 501. Therefore, it is not necessary to use a dedicated ground wire for grounding the high-voltage components and the low-voltage components to the ground earth. Therefore, by arranging the ground earth on the surface layer or inner layer of the high-voltage board 510 and the drive board 550 and passing current through the multiple beam portions 501, it becomes easy to ground the noise from the high-voltage components and the low-voltage components to the ground earth with low impedance.

[0225] According to this embodiment, the arm switch units 530 are fixed to the inner peripheral surface 90b in the inverter outer peripheral wall 91, and are arranged in the circumferential direction CD along the inner peripheral surface 90b. In this configuration, when the arm switch unit 530 generates heat as the inverter device 80 is driven, the heat is easily released to the outside through the inverter outer peripheral wall 91. This makes it possible to prevent the temperature of the arm switch unit 530 from becoming excessively high and to prevent the heat of the arm switch unit 530 from being trapped inside the inverter housing 90. Therefore, it is possible to give priority to reducing vibrations of the mounted components among the current-carrying components, and to give priority to dissipating heat of the arm switch unit 530 among the current-carrying components. This makes it possible to both increase the vibration resistance of the inverter device 80 and increase the heat dissipation of the inverter device 80.

[0226] Furthermore, the multiple arm switch units 530 are arranged along the outer circumferential end 512 with respect to the high voltage board 510 and the control board 560. In this configuration, the distance between the arm switch unit 530 and the high voltage board 510 and the control board 560 in the radial direction RD can be made uniform by the multiple arm switch units 530. Therefore, it is possible to suppress excessive variation in the length of the terminals 532 to 535 extending from the arm switch unit 530 toward the boards 510 and 550 among the multiple arm switch units 530. Furthermore, by connecting the multiple arm switch units 530 in parallel, it is possible to reduce the inductance and the thermal resistance by dispersing the heat source. In addition, by connecting the arm switch units 530 in parallel, the effect of the heat spreader in the inverter outer circumferential wall 91 between the arm switch unit 530 and the inverter fins 92 can be reduced, so that the cooling effect can be improved and the inverter outer circumferential wall 91 can be made thin and lightweight.

[0227] According to the present embodiment, the beam portion 501 extends radially inward from the inverter outer peripheral wall 91 between two switch groups 530G adjacent to each other in the circumferential direction CD. In this configuration, the beam portion 501 can be disposed at a position where it does not interfere with the arm switch portion 530.

[0228] According to this embodiment, switch body 531 of arm switch section 530 is provided at a position separated from beam section 501, high-voltage board 510, and drive board 550. In this configuration, heat generated in switch body 531 is likely to be conducted directly to inverter outer peripheral wall 91 without passing through beam section 501, high-voltage board 510, and drive board 550. Therefore, it is possible to suppress a rise in temperature of beam section 501, high-voltage board 510, and drive board 550 due to the heat of switch body 531.

[0229] According to this embodiment, the arm switch section 530 is provided at a position where the inverter fins 92 are lined up in the radial direction RD. In this configuration, the inverter fin 92 is located at a position on the outer circumferential surface 90a formed by the inverter outer circumferential wall 91 that is closest to the arm switch section 530. Therefore, the inverter fin 92 can be arranged at a position where the heat dissipation effect of the arm switch section 530 is maximized.

[0230] According to this embodiment, multiple beams 501 are connected by beam connectors 502. In this configuration, the multiple beams 501 are prevented from vibrating individually by the beam connectors 502. Therefore, the strength of the structure consisting of the high-voltage board 510, the drive board 550, and the multiple beams 501 is increased, and the vibration transmitted to the mounted components can be reduced.

[0231] According to this embodiment, the high voltage board 510 and the drive board 550 are opened in a doughnut shape on the inside of the beam connecting portion 502. The weight near the center is lighter. This increases the resonance frequency of the beam portion 501 and the beam connecting portion 502, thereby realizing a configuration in which the beam portion 501 and the beam connecting portion 502 are less likely to resonate with vibrations from the motor device 60 and the like. This increases the strength of the inverter housing 90 against vibrations.

[0232] According to this embodiment, heat can be transferred between beam portion 501 and inverter outer peripheral wall 91. Therefore, even if heat is generated in current-carrying components such as smoothing capacitor section 580 and high-voltage board 510, this heat is likely to be dissipated from beam portion 501 to the outside via inverter outer peripheral wall 91. Since the connection portion between beam portion 501 and inverter outer peripheral wall 91 is not provided with arm switch section 530, the temperature of the connection portion between beam portion 501 and inverter outer peripheral wall 91 becomes lower than that of arm switch section 530, and heat dissipation can be improved.

[0233] According to this embodiment, beam portion 501 and inverter outer peripheral wall 91 are electrically connected. Therefore, filter components 524, high voltage board 510, and the like can be grounded to the ground via a conductive path including beam portion 501 and inverter outer peripheral wall 91. Therefore, beam portion 501 can improve the EMC performance of inverter device 80. In addition, the configuration for grounding filter components 524, high voltage board 510, and the like to the ground can be simplified, making it easy to arrange electrical safety components such as varistor 155.

[0234] According to the present embodiment, the heat insulating section 545 is provided between the high voltage board 510 and the rear end plate 62, and extends along the rear end plate 62. In this configuration, the heat insulating section 545 is provided between the mounted components of the inverter device 80, which have a low heat resistance temperature, and the rear end plate 62. Therefore, even if the rear end plate 62 becomes hot due to heat from the stator 200 or the like in the motor device 60, it is possible to prevent heat damage in the inverter device 80.

[0235] <Composition group B> According to this embodiment, the upper arm switch unit 530A and the lower arm switch unit 530B are connected to the output bus bar 603 at positions spaced apart in the circumferential direction CD. In this configuration, it is possible to change the distance between the upper arm switch unit 530A and the lower arm switch unit 530B. Therefore, compared to a configuration in which the upper arm switch unit 530A and the lower arm switch unit 530B are integrated, for example, it is possible to increase the degree of freedom in terms of the arrangement of the arm switch units 530A and 530B.

[0236] Moreover, in the overlapping area AO, the P currents IpA, IpB flowing through the P bus bar 601 and the N currents InA, InB flowing through the N bus bar 602 flow in the opposite direction in the circumferential direction CD to the output currents IoA, IoB flowing through the output bus bar 603. In this configuration, the magnetic field generated by the P currents IpA, IpB and the magnetic field generated by the N currents InA, InB and the magnetic field generated by the output currents IoA, IoB tend to cancel each other out. This makes it easier to reduce the inductances L601-L603 parasitic on the bus bars 601-603. This makes it possible to suppress a decrease in the operating accuracy of the upper arm switch unit 530A and the lower arm switch unit 530B.

[0237] As a result, it is possible to improve both the degree of freedom in terms of the arrangement of the arm switch portions 530A, 530B and the operational accuracy of the inverter device 80.

[0238] According to this embodiment, a plurality of upper arm switch units 530A included in one phase are connected in parallel to each other in the P bus bar 601 and the output bus bar 603. Also, a plurality of lower arm switch units 530B included in one phase are connected in parallel to each other in the N bus bar 602 and the output bus bar 603. In this configuration, it is easy to arrange the plurality of upper arm switch units 530A and the plurality of lower arm switch units 530B in the circumferential direction CD along the bus bars 601-603.

[0239] The upper arm switch section 530A and the lower arm switch section 530B have a driver source terminal 535 different from the source terminal 533. When a plurality of arm switch sections 530A, 530B having the driver source terminal 535 are connected in parallel, there is a concern that a current imbalance may occur due to the inductances L601 to L603 parasitic on the bus bars 601 to 603. In contrast, according to the present embodiment, the flows of the currents IpA, IpB, InA, InB, IoA, and IoB are set in the bus bars 601 to 603 so as to reduce the inductances L601 to L603. Therefore, the reduction in the inductances L601 to L603 can suppress the current imbalance. Therefore, it is possible to suppress the variation in the degree of deterioration in the plurality of arm switch sections 530A, 530B connected in parallel to each other.

[0240] In this embodiment, the upper arm switch units 530A included in one phase and the lower arm switch units 530B included in one phase are arranged in the circumferential direction CD along the bus bars 601-603. In this configuration, the bus bars 601-603 tend to extend in the circumferential direction CD in a long shape in accordance with the range in which the arm switch units 530A, 530B are arranged. If the bus bars 601-603 are lengthened in this way, there is a concern that the inductances L601-L603 parasitic to the bus bars 601-603 may become large.

[0241] In contrast, in this embodiment, the flows of the currents IpA, IpB, InA, InB, IoA, and IoB are set so as to reduce the inductances L601-L603. Therefore, even if the bus bars 601-603 extend elongatedly in the circumferential direction CD, the inductances L601-L603 parasitic to the bus bars 601-603 can be reduced.

[0242] According to this embodiment, the arm switch parts 530A, 530B included in one phase are arranged in the circumferential direction CD along the inner circumferential surface 90b. In this configuration, the heat of each of the arm switch parts 530A, 530B is easily transferred to the inverter outer circumferential wall 91. This makes it possible to suppress the temperature of the arm switch parts 530A, 530B from becoming excessively high, and to suppress the heat of one arm switch part 530A, 530B from being transferred to the other arm switch part 530A, 530B. Therefore, the arrangement of the arm switch parts 530A, 530B can enhance the heat dissipation effect of the inverter device 80. As described above, in the inverter device 80, it is possible to realize both a reduction in parasitic inductance and an improvement in the heat dissipation effect.

[0243] Moreover, since the bus bars 601-603 extend in the circumferential direction CD along the inner peripheral surface 90b, the arm switch units 530A, 530B are arranged in the circumferential direction CD along the bus bars 601-603. In this configuration, the current path connecting the upper arm switch unit 530A to the P bus bar 601 and the output bus bar 603 can be shortened as much as possible in the radial direction RD. In this way, the current path leading to the upper arm switch unit 530A can be shortened as much as possible, thereby reducing the parasitic inductance generated in this current path. Similarly, the current path connecting the lower arm switch unit 530B to the N bus bar 602 and the output bus bar 603 can be shortened as much as possible in the radial direction RD. In this way, the current path leading to the lower arm switch unit 530B can be shortened as much as possible, thereby reducing the parasitic inductance generated in this current path.

[0244] According to this embodiment, the arm switch units 530A, 530B are provided on the inner circumferential surface 90b at positions spaced radially outward from the bus bars 601-603. In this configuration, heat from the arm switch units 530A, 530B is directly transferred to the inner circumferential surface 90b. Therefore, the heat dissipation effect of the arm switch units 530A, 530B can be enhanced by the inverter outer circumferential wall 91. Therefore, in the inverter device 80, it is possible to achieve both improved electrical characteristics, such as reduced parasitic inductance, and improved heat dissipation.

[0245] According to this embodiment, in one of the upper capacitor section 580A and the lower capacitor section 580B, the P capacitor terminal 582 is located radially outside the N capacitor terminal 583, and in the other, the N capacitor terminal 583 is located radially outside the P capacitor terminal 582. In this configuration, the distance in the P bus bar 601 where one of the upper P current IpA and the lower P current IpB flows in the radial direction RD is shorter than the distance where the other flows in the radial direction RD. Similarly, in the N bus bar 602, the distance where one of the upper N current InA and the lower N current InB flows in the radial direction RD is shorter than the distance where the other flows in the radial direction RD. Therefore, it is possible to suppress an excessively large difference between the total distance where the P currents IpA and IpB flow in the radial direction RD in the P bus bar 601 and the total distance where the N currents InA and InB flow in the radial direction RD in the N bus bar 602.

[0246] When the total distance in the P bus bar 601 and the total distance in the N bus bar 602 are equalized in this way, the inductance L601 parasitic on the P bus bar 601 and the inductance L602 parasitic on the N bus bar 602 are easily equalized. Therefore, it is possible to suppress the P currents IpA and IpB from flowing out of the P bus bar 601 and the N currents InA and InB from flowing out of the N bus bar 602. For example, it is possible to suppress the P currents IpA and IpB and the N currents InA and InB flowing through the P bus bar 601 and the N bus bar 602 as normal mode currents from flowing out to the earth bus bar 604 and becoming common mode currents. In other words, it is possible to suppress the occurrence of mode conversion of currents in the bus bars 601 to 604.

[0247] For example, unlike this embodiment, assume a configuration in which the positional relationship between the P capacitor terminal 582 and the N capacitor terminal 583 is the same in the upper capacitor section 580A and the lower capacitor section 580B. In this configuration, the distance in which the upper P current IpA flows in the circumferential direction CD and the distance in which the lower P current IpB flows in the circumferential direction CD are longer or shorter than the distance in which the upper N current InA flows in the circumferential direction CD and the distance in which the lower N current InB flows in the circumferential direction CD. For this reason, the difference between the total distance in the P bus bar 601 and the total distance in the N bus bar 602 is likely to become large. In that case, the difference between the inductance L601 parasitic to the P bus bar 601 and the inductance L602 parasitic to the N bus bar 602 becomes large, and there is a concern that a mode conversion of the current will occur.

[0248] According to this embodiment, the overlapping area AO extends in the circumferential direction CD so as to span the farthest upper component 530Af included in the upper switch group 530GA and the farthest lower component 530Bf included in the lower switch group 530GB. In this configuration, it is possible to extend the overlapping area AO as long as possible in the circumferential direction CD. Therefore, the range in which the P currents IpA, IpB and the N currents InA, InB and the output currents IoA, IoB flow so as to overlap with each other tends to expand in the circumferential direction CD. That is, the range in which the magnetic fluxes generated by the P currents IpA, IpB and the magnetic fluxes generated by the N currents InA, InB and the magnetic fluxes generated by the output currents IoA, IoB cancel each other out tends to expand in the circumferential direction CD. Therefore, the range in which the parasitic inductance is reduced by the cancellation of the magnetic fluxes can be expanded in the circumferential direction CD, and as a result, the parasitic inductance can be reduced as a whole in the bus bars 601 to 603.

[0249] According to this embodiment, the plurality of upper capacitor parts 580A and the plurality of lower capacitor parts 580B are arranged in the circumferential direction CD. In this configuration, heat generated from the plurality of upper capacitor parts 580A is easily dispersed. Therefore, the arrangement of the capacitor parts 580A, 580B can enhance the heat dissipation effect of the inverter device 80.

[0250] Moreover, the overlapping area AO extends in the circumferential direction CD so as to span the upper capacitor group 580GA and the lower capacitor group 580GB. Therefore, in the P bus bar 601, the overlapping range of the P currents IpA, IpB flowing from the capacitor groups 580GA, 580GB to the upper switch group 530GA and the output currents IoA, IoB flowing through the output bus bar 603 can be extended as much as possible in the circumferential direction CD. Similarly, in the N bus bar 602, the overlapping range of the N currents InA, InB flowing from the lower switch group 530GB to the capacitor groups 580GA, 580GB and the output currents IoA, IoB flowing through the output bus bar 603 can be extended as much as possible in the circumferential direction CD. Therefore, in the bus bars 601 to 603, the range in which the parasitic inductance can be reduced by the flow of the currents IpA, IpB, InA, InB, IoA, and IoB can be extended as much as possible.

[0251] According to this embodiment, the bus bars 601 to 603 are stacked so that their plate surfaces face each other. In this configuration, the bus bars 601 to 603 can be arranged as close as possible to each other. This makes it possible to realize a configuration in which the magnetic fields generated by the P currents IpA, IpB and the N currents InA, InB and the magnetic fields generated by the output currents IoA, IoB tend to cancel each other out.

[0252] According to this embodiment, the output bus bar 603 is provided between the P bus bar 601 and the N bus bar 602. In this configuration, the P bus bar 601 and the N bus bar 602 can suppress the emission of radiation noise caused by electrostatic induction due to potential fluctuations accompanying power conversion in the output bus bar 603. Moreover, since potential fluctuations are relatively small in the P bus bar 601 and the N bus bar 602, radiation noise caused by electrostatic induction is unlikely to be emitted. Therefore, it is effective to shield the emission noise of the output bus bar 603 by the P bus bar 601 and the N bus bar 602, which are unlikely to emit radiation noise. As described above, the EMC performance of the inverter device 80 can be improved by the arrangement of the bus bars 601 to 603.

[0253] According to this embodiment, the earth bus bar 604 is provided at the outermost position of the bus bars 601 to 604. Therefore, the earth bus bar 604 can suppress the emission of radiation noise due to electrostatic induction or the like from the P bus bar 601, the N bus bar 602, and the output bus bar 603.

[0254] In addition, the earth bus bar 604 is overlapped with the P bus bar 601, the N bus bar 602, and the output bus bar 603. In this configuration, the components connected to the P bus bar 601, the N bus bar 602, and the output bus bar 603 can be disposed in positions close to the earth bus bar 604. This allows the connection path between these components and the earth bus bar 604 to be shortened. For example, the Y capacitor section 527 can be connected to the earth bus bar 604 so as to reduce the ESL. ESL is equivalent series inductance.

[0255] Furthermore, since earth bus bar 604 extends along the plate surface of high-voltage board 510, Y capacitor section 527 can be connected to earth bus bar 604 anywhere on high-voltage board 510. This increases the degree of freedom regarding the installation position of Y capacitor section 527. In addition, earth bus bar 604 is electrically connected to component support section 500 via a plurality of fasteners for fixing high-voltage board 510 to component support section 500. This reduces the parasitic impedance of the ground path including earth bus bar 604. This makes it possible to both improve EMC performance by earth bus bar 604 and increase the protective effect of protecting inverter device 80 from surges by earth bus bar 604.

[0256] According to this embodiment, there are provided a plurality of P bus bars 601, N bus bars 602, and output bus bars 603. Therefore, magnetic fields due to currents IpA, IpB, InA, InB, IoA, and IoB are generated in each of the plurality of bus bars 601 to 603, and a configuration can be realized in which these magnetic fields tend to cancel each other out.

[0257] Moreover, the P bus bar 601 and the N bus bar 602 extend in an annular shape in the circumferential direction CD. In this configuration, the P bus bar 601 and the N bus bar 602 extend along the outer circumferential end 512 of the high-voltage substrate 510, so that the P line 141 and the N line 142 can form a closed circuit. When the P line 141 and the N line 142 form a closed circuit in this manner, the parasitic inductance occurring between the upper arm 84 and the lower arm 85 tends to decrease. As a result, the loss occurring in the P line 141 and the N line 142 can be reduced.

[0258] According to this embodiment, the output currents IoA and IoB flowing in the overlapping region AO are currents flowing between the upper arm switch section 530A and the lower arm switch section 530B that form one upper and lower arm circuit 83. Therefore, the parasitic inductance generated in one upper and lower arm circuit 83 can be reduced by the flow of the currents IpA, IpB, InA, InB, IoA, and IoB.

[0259] According to this embodiment, the upper source terminal 533A and the lower drain terminal 532B are connected to the output bus bar 603 at positions spaced apart in the circumferential direction CD. In this configuration, it is possible to change the distance between the upper source terminal 533A and the lower drain terminal 532B. This increases the degree of freedom in the arrangement of the upper arm switch section 530A having the upper source terminal 533A and the lower arm switch section 530B having the lower drain terminal 532B.

[0260] Moreover, at least one of the upper drain terminal 532A and the P capacitor terminal 582, and at least one of the lower source terminal 533B and the low capacitor terminal are provided between the upper source terminal 533A and the lower drain terminal 532B in the circumferential direction CD. In this configuration, the P currents IpA and IpB flow in the opposite direction to the output currents IoA and IoB between the upper source terminal 533A and the lower drain terminal 532B in the circumferential direction CD. Furthermore, the N currents InA and InB flow in the opposite direction to the output currents IoA and IoB between the upper source terminal 533A and the lower drain terminal 532B in the circumferential direction CD. Therefore, the magnetic fields generated by the output currents IoA and IoB and the magnetic fields generated by the P currents IpA and IpB and the N currents InA and InB cancel each other out, so that the inductances L601 to L603 parasitic on the bus bars 601 to 603 can be reduced.

[0261] <Composition group C> According to this embodiment, the multiple arm switch units 530 are arranged in the circumferential direction CD along the outer circumferential ends 512, 552 with respect to the high-voltage substrate 510 and the drive substrate 550. In this configuration, the positions of the multiple arm switch units 530 are aligned in the axial direction AD and the radial direction RD. Therefore, the positional relationship between the arm switch unit 530 and the high-voltage substrate 510 and the drive substrate 550 is unlikely to vary among the multiple arm switch units 530. For example, the separation distance between the switch body 531 and the high-voltage substrate 510 in the radial direction RD tends to be the same for each of the multiple arm switch units 530. Similarly, the separation distance between the switch body 531 and the drive substrate 550 in the radial direction RD tends to be the same for each of the multiple arm switch units 530.

[0262] Therefore, it is unlikely that the parasitic inductance occurring in the current path including the terminals 532-533 varies among the arm switch sections 530, causing the switching accuracy to vary among the arm switch sections 530. For example, it is unlikely that the switching timing at which the arm switch 86 opens and closes varies among the upper arm 84 and the lower arm 85, and varies among the upper and lower arm circuits 83. In this way, the operational accuracy of the arm switch 86 is prevented from decreasing, and therefore the operational accuracy of the inverter device 80 can be improved.

[0263] As described above, the positions of the multiple arm switch parts 530 are aligned in the axial direction AD and the radial direction RD. Therefore, the distance between the switch body 531 and the substrates 510, 550 can be easily uniformed among the multiple arm switch parts 530. Therefore, it is possible to prevent the distance between the switch body 531 and the substrates 510, 550 from being excessively large. In other words, the wiring length between the switch body 531 and the substrates 510, 550 can be reduced. The wiring length is, for example, the length of the exposed parts 532ex to 535ex. When the wiring length is reduced, the parasitic inductance generated in the wiring is reduced. In the wiring, the surge voltage can be reduced by reducing the parasitic inductance. Then, the switching speed of the arm switch 86 can be increased by the amount of the reduced surge voltage, so that it is possible to reduce losses.

[0264] In an inverter device 80 in which a plurality of arm switches 86 are connected in parallel, a phenomenon in which the gate voltage Vg oscillates may occur. When the balance of the current flowing through the arm switches 86 is lost in the plurality of arm switches 86 connected in parallel, the gate voltage Vg is more likely to be transmitted. In addition, the faster the switching speed of the arm switches 86, the more likely it is that the gate voltage Vg will be transmitted. On the other hand, the smaller the parasitic inductance of the wiring, the less likely the gate voltage Vg will oscillate, and therefore the switching speed of the arm switches 86 can be increased. Therefore, by reducing the parasitic inductance occurring in the wiring, it is possible to increase the switching speed of the arm switches 86 and reduce losses.

[0265] In the inverter device 80, the higher the applied voltage from the battery 31, the more likely loss due to parasitic inductance is to occur. Also, the faster the switching of the arm switch 86, the more likely loss due to parasitic inductance is to occur. Therefore, even if at least one of the higher voltage and the higher switching speed of the inverter device 80 is implemented, by arranging the multiple arm switch parts 530 in the circumferential direction CD along the outer circumferential ends 512, 552, loss due to parasitic inductance can be reduced.

[0266] According to this embodiment, the switch body 531 is provided at a position closer to the high voltage substrate 510 than the drive substrate 550. Therefore, it is easy to realize a configuration in which the drain terminal 532 and the source terminal 533 are shorter than the gate terminal 534 and the driver source terminal 535. By shortening the power terminals such as the drain terminal 532 and the source terminal 533 in this way, the parasitic inductance generated by the power terminals can be reduced. Therefore, the loss generated by the power terminals can be reduced.

[0267] According to this embodiment, the drain exposed portion 532ex and the source exposed portion 533ex are shorter than the gate exposed portion 534ex and the driver source terminal 535. Therefore, it is possible to reduce the parasitic inductance caused by the power connection portion such as the drain exposed portion 532ex and the source exposed portion 533ex. In this way, by shortening the power connection portion to reduce the parasitic inductance of the wiring, it is possible to increase the switching speed of the arm switch 86 and reduce losses.

[0268] According to this embodiment, the drain terminal 532 and the source terminal 533 are folded back. In this configuration, the magnetic fields generated by energization at the two folded back portions of the drain terminal 532 and the source terminal 533 cancel each other out. This reduces the parasitic inductance generated in the drain terminal 532 and the source terminal 533. For example, in the drain terminal 532 and the source terminal 533, the direction of the current flowing through the base end extension 536a is opposite to the direction of the current flowing through the tip extension 536b. This causes the magnetic flux generated by the current flowing through the base end extension 536a and the magnetic flux generated by the current flowing through the tip extension 536b to cancel each other out. This reduces the parasitic inductance generated in the base end extension 536a and the tip extension 536b.

[0269] According to this embodiment, the connection targets of the terminals 532-535 are the substrates 510, 550, which simplifies the connection structure between the terminals 532-535 and the substrates 510, 550. Also, since the substrates 510, 550 are plate-shaped, it is possible to easily realize a configuration in which a plurality of arm switch portions 530 are arranged in the circumferential direction CD along the outer circumferential ends 512, 552.

[0270] According to this embodiment, the drain terminal 532 and the source terminal 533 are provided at a position spaced away from the substrate midline Cmid toward the high voltage substrate 510. In this configuration, the drain terminal 532 and the source terminal 533 can be spaced as far away as possible from the drive substrate 550. This makes it possible to suppress the generation of noise and the like in the drive substrate 550 due to the current flowing through the drain terminal 532 and the source terminal 533. This makes it possible to improve the operating accuracy of the drive substrate 550.

[0271] According to this embodiment, the high-voltage substrate 510 has power bus bars such as a P bus bar 601, an N bus bar 602, and an output bus bar 603. Therefore, a configuration in which power terminals such as a drain terminal 532 and a source terminal 533 are electrically connected to the power bus bars can be realized by simply connecting the power terminals to the high-voltage substrate 510. Therefore, the configuration for connecting the power terminals and the power bus bars can be simplified.

[0272] According to this embodiment, the outer circumferential ends 512, 552 and the arm switch row 530R all extend annularly in the circumferential direction CD. Therefore, at any position in the circumferential direction CD, the terminals 532-535 can be extended in the radial direction RD from the arm switch portion 530 to connect to the high voltage substrate 510 and the drive substrate 550. Therefore, variation in the length dimension of the terminals 532-535 can be suppressed throughout the entire circumferential direction CD.

[0273] Moreover, since the arm switch row 530R extends in an annular shape in the circumferential direction CD, the heat of the arm switch units 530 in the arm switch row 530R can be released radially outward in the entire circumferential direction CD. This makes it possible to prevent the heat generated from the arm switch units 530 from accumulating in a part of the inverter outer peripheral wall 91 and a part of the interior of the inverter housing 90.

[0274] According to the present embodiment, switch body 531 is provided on inner circumferential surface 90b. With this configuration, it is not necessary to mount switch body 531 on high-voltage board 510 and drive board 550. Therefore, high-voltage board 510 and drive board 550 can be made smaller by the amount that switch body 531 is not mounted. That is, the board area of ​​high-voltage board 510 and drive board 550 can be reduced. By thus reducing the size of high-voltage board 510 and drive board 550 in radial direction RD, the inner diameter of inverter housing 90 can be shortened. That is, inverter housing 90 and inverter device 80 can be made smaller.

[0275] In addition, since the switch body 531 is provided on the inner circumferential surface 90b, heat from the switch body 531 is easily transferred to the inner circumferential surface 90b. Therefore, the heat dissipation effect of the switch body 531 can be improved by the inverter outer circumferential wall 91.

[0276] According to this embodiment, in the switch body 531, the heat dissipation from the second plate surface 531b is greater than the heat dissipation from the first plate surface 531a. In this configuration, the heat dissipated from the first plate surface 531a toward the inside in the radial direction is reduced, so that heat is less likely to accumulate inside the inverter housing 90. Moreover, the heat dissipated from the second plate surface 531b toward the outside in the radial direction is likely to be large. Therefore, the heat dissipated from the switch body 531 to the outside through the inverter outer peripheral wall 91 is likely to be large. Therefore, the heat dissipation effect of the inverter device 80 can be improved by the second plate surface 531b.

[0277] <Configuration group D> According to this embodiment, the arm switch units 530 are arranged in the circumferential direction CD with respect to the inverter outer peripheral wall 91 and are in contact with the inner peripheral surface 90b. In this configuration, the heat generated in each of the arm switch units 530 is easily transferred directly from the switch body 531 to the inner peripheral surface 90b. Moreover, since the inverter outer peripheral wall 91 has the outer peripheral surface 90a, the heat transferred from the arm switch unit 530 to the inverter outer peripheral wall 91 is easily released to the outside from the outer peripheral surface 90a. For this reason, it is possible to suppress the temperature of the arm switch unit 530 from becoming excessively high, the heat generated from one arm switch unit 530 from being applied to another arm switch unit 530, and the like. Therefore, it is possible to enhance the heat dissipation effect of the inverter device 80. As a result, it is possible to suppress, for example, the temperature of the inverter device 80 from rising excessively and causing an abnormality.

[0278] According to this embodiment, the smoothing capacitor section 580 and the filter component 524, which generate less heat due to energization than the arm switch section 530, are provided radially inward of the arm switch section 530. In this configuration, it is possible to prevent the heat traveling radially outward from the arm switch section 530 from being applied to the smoothing capacitor section 580 and the filter component 524. In this case, it is unlikely that the heat of the arm switch section 530 will cause the temperatures of the smoothing capacitor section 580 and the filter component 524 to rise. In addition, in this case, it is unlikely that the smoothing capacitor section 580 and the filter component 524 will prevent the heat of the arm switch section 530 from reaching the inverter outer peripheral wall 91. Therefore, the heat dissipation effect can be improved for each of the arm switch section 530, the smoothing capacitor section 580, and the filter component 524.

[0279] According to this embodiment, the arm switch row 530R extends annularly in the circumferential direction CD. In this configuration, heat from the multiple arm switch units 530 of the arm switch row 530R can be released to the outside from the entire inverter outer peripheral wall 91 in the circumferential direction CD. This makes it difficult for heat to accumulate in a part of the inverter outer peripheral wall 91 and a part of the internal space of the inverter housing 90. This makes it possible to suppress, for example, an excessive rise in temperature in a part of the inverter device 80, which would cause an abnormality.

[0280] Moreover, the capacitor row 580R and the filter row 524R extend in an annular shape in the circumferential direction CD radially inward from the arm switch row 530R. With this configuration, the heat of the smoothing capacitor unit 580 and the heat of the filter component 524 are less likely to accumulate in a portion in the circumferential direction CD. For this reason, it is possible to suppress an abnormality in the inverter device 80 caused by an excessive rise in temperature in a portion at a position radially inward from the arm switch row 530R, for example.

[0281] According to this embodiment, the filter component 524, which generates less heat due to energization than the smoothing capacitor section 580, is provided radially inward of the smoothing capacitor section 580. In this configuration, the positional relationship between the smoothing capacitor section 580 and the filter component 524 is set so that the heat generated at the center of the inverter device 80 is minimized. This makes it difficult for heat to accumulate at the center of the inverter device 80. This makes it possible to prevent, for example, the temperature at the center of the inverter device 80 from excessively increasing, causing an abnormality.

[0282] According to the present embodiment, the filter row 524R extends annularly in the circumferential direction CD radially inside the capacitor row 580R. With this configuration, heat from the filter component 524 is less likely to accumulate in a portion of the circumferential direction CD radially inside the capacitor row 580R. This makes it possible to suppress, for example, an excessive rise in temperature in a portion on the central side of the inverter device 80, which would cause an abnormality in the inverter device 80.

[0283] According to the present embodiment, high-voltage substrate 510 as a plate member is provided at a position spaced radially inward from inner circumferential surface 90b with respect to inverter outer circumferential wall 91. For this reason, smoothing capacitor section 580 and filter component 524 are fixed to high-voltage substrate 510, whereby a configuration in which smoothing capacitor section 580 and filter component 524 are provided radially inward from arm switch section 530 can be easily realized.

[0284] According to this embodiment, the group-aligned components 580c of the smoothing capacitor units 580 are arranged in a position aligned in the radial direction RD in the switch group 530G. In this configuration, the group-aligned components 580c are arranged radially inward from the arm switch unit 530, thereby enhancing the heat dissipation effect of the group-aligned components 580c, and the distance between the switch group 530G and the group-aligned components 580c can be shortened as much as possible. Therefore, the current path that connects the arm switch unit 530 and the group-aligned components 580c of the switch group 530G in a conductive manner can be shortened as much as possible, such as by making it the shortest path. Therefore, the loss caused by parasitic inductance in the current path between the arm switch unit 530 and the group-aligned components 580c can be reduced.

[0285] According to this embodiment, the inverter connector 96 is provided in the intermediate region Asw2 of the inverter outer peripheral wall 91. This makes it possible to prevent the inverter connector 96 from impeding heat dissipation from the arm switch section 530 from the inverter outer peripheral wall 91 in the switch region Asw1. This makes it possible to prevent the inverter connector 96 from reducing the heat dissipation effect of the inverter outer peripheral wall 91.

[0286] Moreover, the connector-arranged part 524b of the multiple filter parts 524 is provided at a position aligned with the inverter connector 96 in the radial direction RD. In this configuration, since the arm switch portion 530 is not provided radially outside the connector-arranged part 524b, heat from the connector-arranged part 524b is easily dissipated radially outward toward the inverter connector 96. For this reason, it is possible to prevent heat from accumulating in the filter part 524 radially inside the arm switch portion 530.

[0287] In addition, in this configuration, the distance between the inverter connector 96 and the connector-arranged component 524b can be made as short as possible. This makes it possible to extract the power lines 570, 571 connected to the connector-arranged component 524b from the inverter connector 96 via the shortest possible route, such as the shortest possible route. In this way, the current paths such as the lines 141, 142 formed by the power lines 570, 571 can be made as short as possible, thereby reducing losses in the lines 141, 142 caused by parasitic inductance and the like.

[0288] According to this embodiment, in the arm switch section 530, the second plate surface 531b of the switch body 531 is overlapped on the inner circumferential surface 90b. In this configuration, the heat transfer area through which heat is transferred from the switch body 531 to the inverter outer circumferential wall 91 can be maximized. This makes it easier for heat from the switch body 531 to be transferred to the inverter outer circumferential wall 91. This can improve the heat transfer effect of transferring heat from the switch body 531 to the inverter outer circumferential wall 91.

[0289] According to this embodiment, in the switch body 531, heat dissipation from the second plate surface 531b is greater than heat dissipation from the first plate surface 531a, so that as much heat as possible generated in the switch body 531 can be transferred to the inverter outer peripheral wall 91. Therefore, a configuration in which heat can be easily transferred from the switch body 531 to the inverter outer peripheral wall 91 can be realized.

[0290] According to this embodiment, in the arm switch section 530, heat from the switch body 531 is released to the outside through the first heat dissipation path PH1, and heat from the terminals 532 to 535 is released to the outside through the second heat dissipation path PH2 and the third heat dissipation path PH3. In this way, the heat from the arm switch section 530 is released to the outside of the inverter outer peripheral wall 91 through a plurality of paths, thereby improving the heat dissipation effect of the inverter device 80.

[0291] <Composition group B> <Second embodiment> In the above-described first embodiment, the output bus bar 603 is provided between the P bus bar 601 and the N bus bar 602. In contrast, in the second embodiment, the output bus bar 603 is not provided between the P bus bar 601 and the N bus bar 602. The configurations, actions, and effects of the second embodiment that are not particularly described are the same as those of the above-described first embodiment. The second embodiment will be described mainly with respect to the points that are different from the above-described first embodiment.

[0292] 29, a P bus bar 601 is provided between an N bus bar 602 and an output bus bar 603. The P bus bar 601 is provided between the N bus bar 602 and the output bus bar 603 in each of a first bus bar set 611 and a second bus bar set 612. For example, the output bus bar 603 included in the first bus bar set 611 is provided between the earth bus bar 604 and the P bus bar 601. The N bus bar 602 included in the second bus bar set 612 is provided between the P bus bar 601 and the earth bus bar 604.

[0293] In the present embodiment, the connection relationship between the arm switch section 530 and the smoothing capacitor section 580 and the bus bars 601-603 is the same as that in the first embodiment, as shown in Fig. 30. Moreover, the flows of currents IpA, IpB, InA, InB, IoA, and IoB in the bus bars 601-603 are the same as those in the first embodiment, as shown in Figs. 31 and 32.

[0294] The order of the P bus bar 601, the N bus bar 602, and the output bus bar 603 may be any order. For example, the order of the bus bars 601 to 603 may be different between the first bus bar set 611 and the second bus bar set 612. Furthermore, the bus bars adjacent to each other in the axial direction AD may be the same type of bus bar. For example, two P bus bars 601 may be provided at positions adjacent to each other in the axial direction AD. Furthermore, only one bus bar set 611, 612 may be provided, or three or more bus bars may be provided. In addition, at least one of the P bus bar 601, the N bus bar 602, and the output bus bar 603 may be provided in plurality.

[0295] <Third embodiment> In the first embodiment, the upper condenser section 580A and the lower condenser section 580B are installed in opposite directions in the radial direction RD. In contrast, in the third embodiment, the upper condenser section 580A and the lower condenser section 580B are installed in the same direction in the radial direction RD. Configurations, actions, and effects not particularly described in the third embodiment are similar to those in the first and second embodiments. The third embodiment will be described mainly with respect to differences from the first and second embodiments.

[0296] 33, in both upper condenser section 580A and lower condenser section 580B, P capacitor terminal 582 is provided at a position spaced radially outward from N capacitor terminal 583. Upper P capacitor terminal 582A and lower P capacitor terminal 582B are both located at a position spaced radially outward from upper N capacitor terminal 583A and lower N condenser terminal 583B.

[0297] In this embodiment, the distance over which the P currents IpA, IpB and the N currents InA, InB flow in the radial direction RD is different from that in the first embodiment. As shown in Fig. 34, in the P bus bar 601, the upper P current IpA and the lower P current IpB both flow from the P capacitor terminal 582 located radially outward of the N capacitor terminal 583 to the upper drain terminal 532A. In the N bus bar 602, the upper N current InA and the lower N current InB flowing out from the lower source terminal 533B both flow into the N capacitor terminal 583 located radially inward of the P capacitor terminal 582. For this reason, the total distance over which the P currents IpA, IpB flow in the radial direction RD in the P bus bar 601 is shorter than the total distance over which the N currents InA, InB flow in the radial direction RD in the N bus bar 602.

[0298] The installation orientation of the smoothing capacitor section 580 may be different for the multiple smoothing capacitor sections 580 in one capacitor group 580G. For example, in one upper capacitor group 580GA, the installation orientation may be different for the multiple upper capacitor sections 580A. Furthermore, the installation orientation of the smoothing capacitor section 580 may be different for each phase. For example, the installation orientation of the smoothing capacitor section 580 of the U phase and the installation orientation of the smoothing capacitor section 580 of the V phase may be different. Furthermore, the installation orientation of all the smoothing capacitor sections 580 in the inverter device 80 may be the same.

[0299] In the smoothing capacitor section 580, the P capacitor terminal 582 and the N capacitor terminal 583 do not have to be aligned in the radial direction RD. For example, the P capacitor terminal 582 and the N capacitor terminal 583 may be aligned in the circumferential direction CD or in the axial direction AD. Furthermore, the direction in which the P capacitor terminal 582 and the N capacitor terminal 583 extend from the capacitor body 581 does not have to be the axial direction AD. For example, the capacitor terminals 582, 583 may extend in the circumferential direction CD or in the radial direction RD. Furthermore, the directions in which the P capacitor terminal 582 and the N capacitor terminal 583 extend from the capacitor body 581 may be different.

[0300] <Fourth embodiment> In the first embodiment, a plurality of earth bus bars 604 are provided for the bus bars 601 to 603. In contrast, in the fourth embodiment, only one earth bus bar 604 is provided for the bus bars 601 to 603. Configurations, actions, and effects that are not particularly described in the fourth embodiment are similar to those in the first and second embodiments. The fourth embodiment will be described mainly with respect to differences from the first and second embodiments.

[0301] 35, earth bus bar 604 is provided at only one of a pair of outermost positions included in a plurality of plate-shaped conductors. Earth bus bar 604 is provided, for example, only on the low-voltage side of bus bars 601-603 in the axial direction AD. Earth bus bar 604 is not provided between bus bars 601-603 and capacitor body 581. Earth bus bar 604 is provided on the opposite side to capacitor body 581 via bus bars 601-603 in the axial direction AD.

[0302] The earth bus bar 604 may be provided between the bus bars 601 to 603. For example, the earth bus bar 604 may be provided between the P bus bar 601 and the N bus bar 602. The earth bus bar 604 may be provided between a plurality of bus bar sets 611, 612. For example, the earth bus bar 604 may be provided between the first bus bar set 611 and the second bus bar set 612.

[0303] <Composition group C> <Fifth embodiment> In the first embodiment, the second plate surface 531b of the switch body 531 is overlapped with the inner peripheral surface 90b. In contrast, in the second embodiment, the body base end portion 531c of the switch body 531 is overlapped with the inner peripheral surface 90b. The configurations, actions, and effects of the fifth embodiment that are not particularly described are the same as those of the first embodiment. The fifth embodiment will be described mainly with respect to the points that are different from the first embodiment.

[0304] 36, a plate-shaped switch body 531 extends in a direction perpendicular to the axial direction AD. In the switch body 531, a body base end portion 531c is in contact with the inner circumferential surface 90b.

[0305] The switch body 531 is provided between the high-voltage substrate 510 and the drive substrate 550 in the axial direction AD. In the axial direction AD, the switch body 531 is located at a position separated from both the high-voltage substrate 510 and the drive substrate 550. In the present embodiment, the switch body 531 is located closer to the high-voltage substrate 510 than the drive substrate 550. Note that the switch body 531 may be located astride the substrate midline Cmid in the axial direction AD, or may be located at a position separated from the substrate midline Cmid in the axial direction AD.

[0306] The entirety of switch body 531 is provided between first high pressure surface 510a and second control surface 550b in the axial direction AD. Switch body 531 does not protrude from first high pressure surface 510a to the high pressure side in the axial direction AD, and does not protrude from second control surface 550b to the low pressure side. The entirety of switch body 531 is included in a projection area obtained by projecting the substrate area radially outward.

[0307] The terminals 532 to 535 are bent to form an L-shape as a whole. In the terminals 532 to 535, the base end extension 536a extends from the switch body 531 toward the inside in the radial direction. In the drain terminal 532 and the source terminal 533, the tip extension 536b extends from the base end extension 536a toward the high voltage side in the axial direction AD. In the gate terminal 534 and the driver source terminal 535, the tip extension 536b extends from the base end extension 536a toward the low voltage side in the axial direction AD.

[0308] Sixth Embodiment In the first embodiment, the arm switch section 530 is a four-terminal type switch module. In contrast, in the second embodiment, the arm switch sections 530 include a four-terminal type switch module and a six-terminal type switch module. The configurations, actions, and effects not specifically described in the sixth embodiment are the same as those in the first embodiment. The sixth embodiment will be described mainly with respect to the points that are different from the first embodiment.

[0309] As shown in FIG. 37, a four-terminal arm switch section 530 and a six-terminal arm switch section 530 are included in a plurality of arm switch sections 530. In this embodiment, a four-terminal type switch module is referred to as a four-terminal arm switch section 530. Similarly, a six-terminal type switch module is referred to as a six-terminal arm switch section 530. The four-terminal arm switch section 530 and the six-terminal arm switch section 530 are included in one switch group 530G. In one switch group 530G, the four-terminal arm switch section 530 and the six-terminal arm switch section 530 are electrically connected in parallel. One switch group 530G includes, for example, a plurality of four-terminal arm switch sections 530 and a plurality of six-terminal arm switch sections 530.

[0310] The six-terminal arm switch section 530 has an anode terminal 591 and a cathode terminal 592 in addition to the terminals 532 to 535. The six-terminal arm switch section 530 has a temperature-sensitive diode (not shown). The temperature-sensitive diode is a temperature sensor that detects the temperature of the arm switch 86. The temperature-sensitive diode can detect the temperature of the arm switch section 530. The anode terminal 591 is connected to the anode of the temperature-sensitive diode. The cathode terminal 592 is connected to the cathode of the temperature-sensitive diode. The anode terminal 591 and the cathode terminal 592 are detection terminals, and are electrically connected to the drive substrate 550.

[0311] The anode terminal 591 and the cathode terminal 592 are arranged in the width direction of the switch body 531 together with the terminals 532 to 535. In this embodiment, the anode terminal 591 and the cathode terminal 592 are arranged in the circumferential direction CD together with the terminals 532 to 535. The terminals 532 to 535, 591, 592 may or may not be shifted in the radial direction RD.

[0312] Seventh embodiment In the sixth embodiment, a four-terminal arm switch section 530 and a six-terminal arm switch section 530 are mixed in one switch group 530G. In contrast, in the second embodiment, one switch group 530G includes only one of a four-terminal arm switch section 530 and a six-terminal arm switch section 530. The configurations, actions, and effects not specifically described in the seventh embodiment are the same as those in the sixth embodiment. The seventh embodiment will be described mainly with respect to the differences from the sixth embodiment.

[0313] As shown in FIG. 38, of the four-terminal arm switch section 530 and the six-terminal arm switch section 530, only the six-terminal arm switch section 530 is included in one switch group 530G.

[0314] All of the multiple arm switch units 530 included in the inverter device 80 may be six-terminal arm switch units 530. Also, the multiple switch groups 530G included in the inverter device 80 may include a switch group 530G having only four-terminal arm switch units 530 and a switch group 530G having only six-terminal arm switch units 530. Furthermore, the multiple switch groups 530G may include a switch group 530G having only one of the four-terminal and six-terminal arm switch units 530 and a switch group 530G having both the four-terminal and six-terminal arm switch units 530.

[0315] Eighth embodiment In the sixth embodiment, the multiple arm switch units 530 include a six-terminal type switch module. In contrast, in the eighth embodiment, the multiple arm switch units 530 include a seven-terminal type switch module. Configurations, actions, and effects that are not specifically described in the eighth embodiment are similar to those in the first embodiment. The eighth embodiment will be described mainly with respect to the differences from the first embodiment.

[0316] 39, a seven-terminal arm switch section 530 is included in a plurality of arm switch sections 530. In this embodiment, a seven-terminal type switch module is referred to as a seven-terminal arm switch section 530. A plurality of seven-terminal arm switch sections 530 are included in one switch group 530G. For example, one switch group 530G includes only the seven-terminal arm switch section 530.

[0317] The seven-terminal arm switch section 530 has a sense source terminal 593 in addition to terminals 532 to 535, 591, and 592. The seven-terminal arm switch section 530 has a current detection section (not shown). This current detection section is capable of detecting a current flowing through the arm switch 86. The sense source terminal 593 is connected to the current detection section. The sense source terminal 593 is a detection terminal, and is electrically connected to the drive substrate 550.

[0318] The sense source terminal 593 is arranged in the width direction of the switch body 531 together with the terminals 532 to 535, 591, and 592. In this embodiment, the sense source terminal 593 is arranged in the circumferential direction CD together with the terminals 532 to 535, 591, and 592. The terminals 532 to 535, 591 to 593 may or may not be shifted in the radial direction RD.

[0319] All of the multiple arm switch units 530 in the inverter device 80 may be seven-terminal arm switch units 530. The multiple arm switch units 530 in the inverter device 80 may include multiple types of arm switch units 530. For example, the multiple arm switch units 530 may include at least one each of four-terminal, six-terminal, and seven-terminal arm switch units 530. Furthermore, one switch group 530G may include multiple types of arm switch units 530. For example, one switch group 530G may include at least one each of four-terminal, six-terminal, and seven-terminal arm switch units 530.

[0320] <Other embodiments> The disclosure of this specification is not limited to the exemplified embodiments. The disclosure includes the exemplified embodiments and modifications by those skilled in the art based thereon. For example, the disclosure is not limited to the combination of parts and elements shown in the embodiments, and can be implemented in various modifications. The disclosure can be implemented by various combinations. The disclosure can have additional parts that can be added to the embodiments. The disclosure includes those in which parts and elements of the embodiments are omitted. The disclosure includes the replacement or combination of parts and elements between one embodiment and another embodiment. The disclosed technical scope is not limited to the description of the embodiments. The disclosed technical scope is indicated by the description of the claims, and should be interpreted as including all modifications within the meaning and scope equivalent to the description of the claims.

[0321] <Composition group A> In each of the above-described embodiments, the beam portions 501 may be located at any position in the circumferential direction CD and the axial direction AD as long as they are arranged in the circumferential direction CD. For example, the beam portions 501 may be located closer to the low-voltage side end than to the high-voltage side end in the inverter outer peripheral wall 91, or closer to the high-voltage side end than to the low-voltage side end. The beam portions 501 may also be located so as to overlap the inverter fins 92 in the radial direction RD.

[0322] In each of the above embodiments, the beam connecting portion 502 may not be annular as long as it connects the multiple beam portions 501. For example, the beam connecting portion 502 may not be provided with the connecting opening 504. A plate member such as the high-voltage board 510 may not be fixed to the beam connecting portion 502 as long as it is fixed to the beam portion 501. The component support portion 500 may not have the beam connecting portion 502 as long as it has the beam portion 501. For example, the component support portion 500 may have multiple beam portions 501 independent of each other. Even in this case, it is sufficient that the plate member such as the high-voltage board 510 is fixed in a state of being stretched across the multiple beam portions 501. It is sufficient that the plate member is fixed to at least one beam portion 501.

[0323] In each of the above embodiments, the beam portion 501 and the inverter outer peripheral wall 91 do not have to be integrally formed. For example, the beam portion 501 may be attached to the inverter outer peripheral wall 91 later. Furthermore, the beam portion 501 and the inverter outer peripheral wall 91 do not have to be electrically conductive. For example, at least one of the beam portion 501 and the inverter outer peripheral wall 91 may have no electrical conductivity or low electrical conductivity. Furthermore, the beam portion 501 and the inverter outer peripheral wall 91 do not have to be capable of transferring heat. For example, at least one of the beam portion 501 and the inverter outer peripheral wall 91 may have no thermal conductivity or low thermal conductivity.

[0324] In each of the above embodiments, the two plate members facing each other across the beam portion 501 may be circuit boards. For example, the control board 560 may be bridged across the beam portions 501 and fixed to the beam portions 501. In addition, both of the two plate members facing each other across the beam portion 501 may be high-voltage boards 510 or low-voltage boards such as the drive board 550. The drive board 550 and the control board 560 may be integrated.

[0325] In each of the above embodiments, the plate member that is stretched across and fixed to the beams 501 does not have to be a circuit board such as the high-voltage board 510. For example, an insulating glass plate member may be stretched across and fixed to the beams 501. Furthermore, at least one of the first plate member such as the high-voltage board 510 and the second plate member such as the drive board 550 may be a plate member that is not a circuit board.

[0326] In each of the above embodiments, the plate member such as the high-voltage substrate 510 fixed to the beam portion 501 does not have to be annular. For example, the plate member may not have an opening such as the substrate opening 513. Also, the plate member such as the high-voltage substrate 510 may be provided only on one side of the beam portion 501 in the axial direction AD. On at least one side of the beam portion 501 in the axial direction AD, a plurality of plate members may be arranged along the beam portion 501 in at least one of the radial direction RD and the circumferential direction CD.

[0327] In each of the above embodiments, the arm switch unit 530 may be provided on the lower voltage side of the beam unit 501, so long as it is provided at a position shifted from the beam unit 501 in the axial direction AD. The arm switch unit 530 may also be provided at a position overlapping the beam unit 501 in the axial direction AD. For example, the arm switch unit 530 and the beam unit 501 may be aligned in the circumferential direction CD. Furthermore, at least a part of the arm switch unit 530 may be provided at a position overlapping a plate member such as the high-voltage substrate 510 in the axial direction AD. For example, a part of the arm switch unit 530 may be in a state of being inserted between the high-voltage substrate 510 and the drive substrate 550.

[0328] In each of the above-described embodiments, the switch body 531 does not necessarily have to have the plate surfaces 531a and 531b oriented perpendicular to the radial direction RD. For example, the switch body 531 may be provided with the plate surfaces 531a and 531b oriented perpendicular to the axial direction AD. The switch body 531 may also be provided with the plate surfaces 531a and 531b oriented perpendicular to the circumferential direction CD.

[0329] In each of the above embodiments, the switch body 531 may be fixed to at least one of a plate member such as the high-voltage board 510 and the inverter outer peripheral wall 91. For example, the switch body 531 may be fixed to the high-voltage board 510. The switch body 531 may also be provided at a position spaced radially inward from the inverter outer peripheral wall 91. Even in these configurations, if a plurality of arm switch units 530 are arranged along the inner peripheral surface 90b, the heat of the arm switch unit 530 is easily transferred to the inverter outer peripheral wall 91.

[0330] In each of the above embodiments, the arm switch units 530 may be arranged in multiple rows in the circumferential direction CD instead of in a single row. The multiple rows may be arranged in the axial direction AD or in the radial direction RD. For example, the arm switch units 530 of one switch group 530G may be arranged in two rows. Also, two switch groups 530G having the arm switch units 530 arranged in a row may be arranged in the axial direction AD. Also, the arm switch units 530 may be arranged on a plane formed on the inner circumferential surface 90b as a power module in which the arm switch units 530 are assembled on a plane.

[0331] In each of the above-described embodiments, the switch group 530G may be provided at a position overlapping the beam portion 501 in the circumferential direction CD. For example, one switch group 530G may be provided at a position straddling the beam portion 501 in the circumferential direction CD. Also, one switch group 530G may be in a state of spanning two beam portions 501 adjacent to each other in the circumferential direction CD.

[0332] <Composition group B> In each of the above embodiments, the upper arm switch section 530A and the lower arm switch section 530B may not have output control terminals such as the driver source terminal 535. For example, as shown in FIG. 22, the drive power supply 620 may apply a control voltage to the source terminal 533 and the gate terminal 534. That is, the arm switch section 530 may be a three-terminal type switch module. This arm switch section 530 has a drain terminal 532, a source terminal 533, and a gate terminal 534, but does not have a driver source terminal 535. Even if the first switch section 530A1 and the second switch section 530A2 are of the three-terminal type, as in the first embodiment, if a difference occurs between the inductance Ls1 and the inductance Ls2, a current imbalance is likely to occur. Therefore, even if the first switch section 530A1 and the second switch section 530A2 are of the three-terminal type, the current imbalance can be suppressed by reducing the inductance L603, as in the first embodiment.

[0333] In each of the above embodiments, the upper arm switch unit 530A and the lower arm switch unit 530B may be provided in any manner as long as a high potential current such as the upper P current IpA, a low potential current such as the upper N current InA, and an output current such as the upper output current IoA flow in the overlapping area AO. For example, the upper arm switch unit 530A and the lower arm switch unit 530B may be provided at positions shifted in the axial direction AD and the radial direction RD. Also, the upper arm switch unit 530A and the lower arm switch unit 530B may be provided one by one instead of a plurality of each. The upper arm switch unit 530A and the lower arm switch unit 530B may be provided on the substrate 510, 550, 560, the component support unit 500, etc. The upper arm switch unit 530A and the lower arm switch unit 530B may be provided at a position spaced radially inward from the inner circumferential surface 90b.

[0334] In each of the above embodiments, as long as a high potential current such as the upper P current IpA, a low potential current such as the upper N current InA, and an output current such as the upper output current IoA flow in the overlapping area AO, the capacitor components such as the smoothing capacitor unit 580 may be provided in any manner. For example, the smoothing capacitor unit 580 may be provided at a position spaced apart from the upper arm switch unit 530A and the lower arm switch unit 530B in the circumferential direction CD and the axial direction AD. The smoothing capacitor unit 580 may be provided at a position spaced apart from the overlapping area AO. Only one smoothing capacitor unit 580 may be provided for the upper arm switch unit 530A and the lower arm switch unit 530B. The capacitor component may not be the smoothing capacitor unit 580. For example, the X capacitor unit 528 may be provided as the capacitor component.

[0335] In each of the above-described embodiments, the direction in which the bus bars 601-603 extend does not have to be the circumferential direction CD. For example, if the bus bars 601-603 are provided on a portion of the inverter outer peripheral wall 91 that extends linearly in a predetermined direction, the direction in which the bus bars 601-603 extend is the predetermined direction. The direction in which the bus bars 601-603 are stacked may be the circumferential direction CD and the radial direction RD, for example.

[0336] In each of the above embodiments, the high potential conductor, the low potential conductor, and the output conductor do not have to be bus bars as long as they are conductors. Also, the high potential conductor, the low potential conductor, and the output conductor do not have to be plate-shaped as long as they extend along each other.

[0337] In each of the above embodiments, at least one of the high potential conductor and the low potential conductor may extend along the output conductor. For example, assume a configuration in which only one of the high potential conductor and the low potential conductor extends along the output conductor. Even in this configuration, in the overlapping area AO in which the output currents IoA and IoB flow, one of the P currents IpA and IpB and the N currents InA and InB may flow in the opposite direction to the output currents IoA and IoB in the circumferential direction CD. In this configuration, the smoothing capacitor unit 580 corresponds to a parallel component, and one of the P currents IpA and IpB and the N currents InA and InB corresponds to a parallel current. Also, one of the P bus bar 601 and the N bus bar 602 corresponds to a power conductor.

[0338] According to this configuration, in the overlapping area AO, the parallel current flowing through one of the P bus bar 601 and the N bus bar 602 is in the opposite direction in the circumferential direction CD to the output currents IoA and IoB flowing through the output bus bar 603. Therefore, the magnetic field generated by the parallel current and the magnetic field generated by the output currents IoA and IoB cancel each other out, thereby reducing the parasitic inductance generated in one of the P bus bar 601 and the N bus bar 602 and the output bus bar 603.

[0339] <Composition group C> In each of the above-described embodiments, main body heat dissipation section 538 may be provided at any portion of switch main body 531. Note that main body heat dissipation section 538 is preferably provided at a portion of switch main body 531 that is in contact with inverter outer peripheral wall 91. For example, in a configuration in which main body base end section 531c of switch main body 531 is in contact with inner peripheral surface 90b, main body heat dissipation section 538 is preferably provided at main body base end section 531c so as to be in contact with inner peripheral surface 90b.

[0340] In each of the above embodiments, the power terminals such as the drain terminal 532 may be in a state of straddling the substrate midline Cmid in the axial direction AD. For example, in a configuration in which the switch body 531 is on the lower voltage side of the substrate midline Cmid, the power terminals are in a state of straddling the substrate midline Cmid in the axial direction AD. In addition, the control terminals such as the gate terminal 534 do not need to be in a state of straddling the substrate midline Cmid in the axial direction AD. For example, in a configuration in which the switch body 531 is on the lower voltage side of the substrate midline Cmid, the control terminals can be disposed on the lower voltage side of the substrate midline Cmid.

[0341] In each of the above-described embodiments, the switch body 531 may be provided in any orientation. For example, as shown in Fig. 36, the switch body 531 may be provided in an orientation perpendicular to the axial direction AD, or in an orientation perpendicular to the circumferential direction CD.

[0342] In each of the above embodiments, the position where switch body 531 is provided does not have to be closer to high voltage substrate 510 than drive substrate 550. For example, switch body 531 may be provided at a position closer to drive substrate 550 than high voltage substrate 510. Furthermore, the portion of switch body 531 provided between first high pressure surface 510a and second control surface 550b in the axial direction AD does not have to be body base end portion 531c. For example, at least body tip portion 531d may be included in a projection area obtained by projecting the substrate area radially outward.

[0343] In each of the above-described embodiments, as long as the arm switch portions 530 are arranged in the circumferential direction CD along the outer circumferential ends 512, 552, the switch body 531 does not have to be provided on the inner circumferential surface 90b. For example, the switch body 531 may be provided at a position spaced radially inward from the inner circumferential surface 90b. The switch body 531 may also be provided on at least one of the high-voltage board 510 and the drive board 550. From the viewpoint of suppressing a decrease in the operational accuracy of the drive board 550 due to noise from the switch body 531, it is preferable that the switch body 531 is not provided on the drive board 550.

[0344] In each of the above embodiments, the power outer peripheral end such as the outer peripheral end 512 and the control outer peripheral end such as the outer peripheral end 552 may extend intermittently in the circumferential direction CD. As an example of a configuration in which the power outer peripheral end and the control outer peripheral end extend intermittently in the circumferential direction CD, there is a configuration in which a plurality of recesses recessed toward the radially inward direction are arranged in the circumferential direction CD at the power outer peripheral end and the control outer peripheral end. Even in this configuration, if the power terminal such as the drain terminal 532 is connected between two recesses adjacent to each other in the circumferential direction CD at the power connection object such as the high voltage substrate 510, the length of the plurality of power terminals can be suppressed from varying. Similarly, if the control terminal such as the gate terminal 534 is connected between two recesses adjacent to each other in the circumferential direction CD at the control connection object such as the drive substrate 550, the length of the plurality of control terminals can be suppressed from varying.

[0345] In each of the above embodiments, the power outer peripheral end and the control outer peripheral end do not have to be annular as long as they extend in the circumferential direction CD. For example, the power outer peripheral end and the control outer peripheral end may be arranged in a plurality of rows in the circumferential direction CD. Similarly, the arm switch row 530R does not have to be annular as long as they extend in the circumferential direction CD. For example, the arm switch row 530R may be arranged in a plurality of rows in the circumferential direction CD.

[0346] In each of the above embodiments, the power connection object and the control connection object do not have to be a circuit board. For example, the P bus bar 601, the N bus bar 602, and the output bus bar 603 as the power connection object may be provided independently from the high voltage board 510. In addition, the power connection object and the control connection object do not have to be arranged in the axial direction AD. For example, the control connection object may be provided radially inside the power connection object.

[0347] <Configuration group D> In each of the above-described embodiments, as long as the arm switch section 530 and the inverter outer peripheral wall 91 are capable of transferring heat, any portion of the arm switch section 530 may be fixed to the inverter outer peripheral wall 91. For example, in the switch main body 531, at least one of the main body base end section 531c and the main body tip section 531d may be fixed to the inner peripheral surface 90b. In the arm switch section 530, the terminals 532 to 535 may be fixed to the inverter outer peripheral wall 91.

[0348] In each of the above embodiments, in one arm switch row 530R, a predetermined number of arm switch units 530 may be arranged in the circumferential direction CD at least in a part of the circumferential direction CD. The arm switch row 530R may be a plurality of rows instead of a single row. For example, two arm switch rows 530R may be arranged in the axial direction AD. In the arm switch row 530R, a plurality of arm switch units 530 may be arranged at equal intervals. For example, the arm switch units 530 may be arranged regardless of the positions of the inverter fins 92 and the beam portion 501. The arm switch row 530R may not be annular. For example, the arm switch row 530R may be provided only in a part of the circumferential direction CD with respect to the inverter outer peripheral wall 91. Furthermore, as long as a plurality of arm switch units 530 are arranged in the circumferential direction CD, the arm switch row 530R may not be formed by these arm switch units 530.

[0349] These modified examples regarding the arm switch array 530R may be similarly used for the capacitor array 580R and the filter array 524R. For example, in a configuration in which the capacitor array 580R has two rows, the two rows of the capacitor arrays 580R may be arranged in the radial direction RD.

[0350] In each of the above embodiments, the arm switch section 530 may be directly or indirectly fixed to the inverter outer peripheral wall 91 as long as it is in contact with the inner peripheral surface 90b. An example of a configuration in which the arm switch section 530 is directly fixed to the inverter outer peripheral wall 91 is a configuration in which the switch body 531 is fixed to the inner peripheral surface 90b with an adhesive or the like, as in the first embodiment. Even if the switch body 531 is not fixed to the inner peripheral surface 90b, it is fixed to the inverter outer peripheral wall 91 via the terminals 532 to 535, the boards 510 and 550, and the component support section 500. That is, the arm switch section 530 is indirectly fixed to the inverter outer peripheral wall 91 via the high-voltage board 510, the drive board 550, and the component support section 500.

[0351] In each of the above embodiments, the filter row 524R may include at least one type of filter component 524. For example, the filter row 524R may be formed to include at least one of a common mode coil section 525, a normal mode coil section 526, a Y capacitor section 527, and an X capacitor section 528.

[0352] In each of the above embodiments, in the small heat component row, the filter row 524R may be provided radially outward of the capacitor row 580R. In addition, in one small heat component row, the smoothing capacitor section 580 and the filter components 524 may be mixed. Furthermore, the plate member on which the small heat component row such as the capacitor row 580R is provided does not have to be the high voltage board 510 as long as it is a circuit board, and does not have to be a circuit board. For example, the capacitor row 580R may be provided on a glass plate.

[0353] <Common> In each of the above embodiments, the cover member such as the inverter lid portion 99 may be provided on at least one of the high-voltage side and the low-voltage side of the inverter housing 90. The cover member may be formed of a thick plate material or a thin plate material. The cover member may have thermal insulation properties. For example, in a configuration in which a cover member having thermal insulation properties is provided between the motor housing 70 and the inverter housing 90, the cover member prevents the heat of the motor device 60 from being transmitted to the inverter device 80. If the cover member on the opposite side of the motor housing 70 is a material with good thermal conductivity, such as aluminum, it can promote heat dissipation to the outside of the inverter. In this configuration, the cover member can enhance the cooling effect of the inverter device 80. Furthermore, the cover member does not have to be provided on either the high-voltage side or the low-voltage side of the inverter housing 90.

[0354] In each of the above embodiments, the inverter fins 92 may not be provided on the inverter outer peripheral wall 91 as long as heat is released to the outside from the outer peripheral surface 90a or the cover member. Alternatively, a water-cooling passage may be provided instead of the inverter fins 92. Also, the inverter housing 90 does not have to be annular as long as it is formed annularly as a whole. For example, the inverter outer peripheral wall 91 may be formed in a polygonal shape in plan view instead of annular in plan view. This polygon is preferably a polygon with, for example, pentagons or more sides.

[0355] In each of the above embodiments, the EPU 50 may have at least one of the motor devices 60 and the inverter devices 80 in a plurality of units. For example, as shown in FIG. 40, one EPU 50 may have two motor devices 60 and two inverter devices 80. In a configuration in which the EPU 50 has at least one of the motor devices 60 and the inverter devices 80 in a plurality of units, all the motor devices 60 and all the inverter devices 80 may be arranged in the axial direction AD. In this configuration, for example, as shown in FIG. 40, the motor devices 60 and the inverter devices 80 may be arranged alternately. In this configuration, two motor devices 60 may be arranged adjacent to each other in the axial direction AD, or two inverter devices 80 may be arranged adjacent to each other in the axial direction AD. In addition, the inverter device 80 may be sandwiched between the plurality of motor devices 60, or one or more motor devices 60 may be sandwiched between the plurality of inverter devices 80.

[0356] It is preferable that the motor device 60 and the inverter device 80 are configured to be easily stacked in the axial direction AD. For example, in a configuration in which a plurality of inverter devices 80 are stacked in the axial direction AD, it is preferable that the inverter outer peripheral walls 91 of each have the same shape and size in a plan view. This makes it possible for the motor device 60 and the inverter device 80 to respond to design changes such as improved redundancy, increased output, and multi-phase configuration of the EPU 50. Furthermore, in the EPU 50, the motor device 60 and the inverter device 80 may be arranged in the radial direction RD.

[0357] In each of the above embodiments, at least one EPU 50 may be provided for a driven object such as a wheel and a rotor. For example, a plurality of EPUs 50 may be provided for one driven object. As shown in Fig. 41, two EPUs 50 may be provided for one reducer 53. The plurality of EPUs 50 may be arranged side by side in the radial direction RD.

[0358] In each of the above embodiments, the motor electric magnetic circuit 61 may be a radial gap type motor. In this motor electric magnetic circuit 61, for example, a stator is provided radially outside the rotor. The rotor may be either an inner type or an outer type.

[0359] [Feature A1] A power conversion device (80) for converting electric power, A case (90) having an annularly extending outer peripheral wall (91); A plurality of beam portions (501) extending inward from the outer peripheral wall in a radial direction (RD) of the outer peripheral wall and arranged in a circumferential direction (CD) of the outer peripheral wall; A plate member (510, 550) extending in a plate shape in a direction perpendicular to the axial direction (AD) of the outer peripheral wall and fixed to the plurality of beam portions in a state of being stretched across the plurality of beam portions; A mounting part (146, 147, 525 to 528, 580) that can be energized and is mounted on a plate member; A power conversion device comprising:

[0360] [Feature A2] As a plate member, a first plate member (510) is provided on one side of the beam portion in the axial direction; As a plate member, a second plate member (550) is provided on the opposite side of the first plate member in the axial direction via a beam portion; The power conversion device according to feature A1,

[0361] [Feature A3] The first plate member is a high-voltage substrate (510) to which a high voltage is applied, The power conversion device according to feature A2, wherein the second plate member is a low-voltage substrate (550) to which a low voltage lower than the high voltage is applied.

[0362] [Feature A4] The power conversion device according to any one of features A1 to A3, comprising a switch component (530) having a conversion switch (86) for converting electric power, arranged in a circumferential direction along the outer peripheral end (512, 552) of the plate member, and fixed to the inner surface (90b) of the outer peripheral wall.

[0363] [Feature A5] A switch group (539) having a plurality of switch parts arranged in a circumferential direction and arranged in a circumferential direction along an outer peripheral edge of the plate member, The power conversion device according to feature A4, wherein the beam portion extends inward from the outer peripheral wall between two circumferentially adjacent switch groups.

[0364] [Feature A6] The switch component includes a switch body (531) having a switch element, and switch terminals (532-535) extending from the switch body. The power conversion device according to feature A4 or A5, wherein the switch body is provided at a position spaced apart from the beam portion and the plate member.

[0365] [Feature A7] A heat dissipation fin (92) extends radially outward from the outer circumferential wall and dissipates heat to the outside. The power converter according to any one of Features A4 to A6, wherein the switch component is provided at a position aligned with the heat dissipation fin in the radial direction.

[0366] [Feature A8] The power converter according to any one of Features A1 to A7, further comprising a beam connecting portion (502) provided at a position spaced radially inward from the outer circumferential wall and connecting the plurality of beam portions.

[0367] [Feature A9] The power conversion device according to feature A8, wherein the beam connection portion extends annularly in the circumferential direction.

[0368] [Feature A10] The power converter according to any one of Features A1 to A9, wherein heat is transferable between the beam portion and the outer peripheral wall.

[0369] [Feature A11] The power converter according to any one of Features A1 to A10, wherein the beam portion and the outer peripheral wall are electrically connected to each other.

[0370] [Feature A12] A rotating electric machine unit (50) driven by a supply of electric power, A rotating electric machine (60) having a rotor (300) and a stator (200); a power converter (80) that converts power supplied to a rotating electric machine; Equipped with The power conversion device is A case (90) having an annular outer peripheral wall (91) and fixed to a rotating electric machine; A plurality of beam portions (501) extending inward from the outer peripheral wall in a radial direction (RD) of the outer peripheral wall and arranged in a circumferential direction (CD) of the outer peripheral wall; A plate member (510, 550) extending in a plate shape in a direction perpendicular to the axial direction (AD) of the outer peripheral wall and fixed to the plurality of beam portions in a state of being stretched across the plurality of beam portions; A mounting part (146, 147, 525 to 528, 580) that can be energized and is mounted on a plate member; A rotating electric unit having the above structure.

[0371] [Feature A13] In the power converter, the outer circumferential wall is an outer circumferential wall (91), Rotating electric machines are An electric machine outer peripheral wall (71) extending annularly, housing a rotor and a stator, and aligned in the axial direction with the device outer peripheral wall; a cover portion (62) fixed to the outer peripheral wall of the electric machine and covering the rotor and the stator from the outer peripheral wall side of the device; It has The power conversion device is The rotating electrical unit according to feature A12, further comprising: a heat insulating portion (545) provided between the plate member and the cover portion, extending along the cover portion, and having heat insulating properties.

[0372] [Feature A14] A power conversion device or inverter device (80) for converting electric power, The case (90) has an annular outer wall (91), a transistor switch (530) on the inside of the outer wall, and a cooling fin (92) on the outside of the outer wall. A plurality of beam portions (501) extending inward from the outer peripheral wall in a radial direction (RD) of the outer peripheral wall and arranged in a circumferential direction (CD) of the outer peripheral wall; A plate member (510, 550) extending in a plate shape in a direction perpendicular to the axial direction (AD) of the outer peripheral wall and fixed to the plurality of beam portions in a state of being stretched across the plurality of beam portions; A mounting part (146, 147, 525 to 528, 580) mounted on a plate member; The power conversion device is provided with:

[0373] [Feature A15] A rotating electric machine unit (50) driven by a supply of electric power, A rotating electric machine (60) having a rotor (300) and a stator (200); a power converter (80) that converts power supplied to a rotating electric machine; Equipped with The power conversion device is A power conversion device or inverter device (80) for converting electric power, The case (90) has an annular outer wall (91), a transistor switch (530) on the inside of the outer wall, and a cooling fin (92) on the outside of the outer wall. A plurality of beam portions (501) extending inward from the outer peripheral wall in a radial direction (RD) of the outer peripheral wall and arranged in a circumferential direction (CD) of the outer peripheral wall; A plate member (510, 550) extending in a plate shape in a direction perpendicular to the axial direction (AD) of the outer peripheral wall and fixed to the plurality of beam portions in a state of being stretched across the plurality of beam portions; A mounting part (146, 147, 525 to 528, 580) mounted on a plate member; The rotating electrical machine unit is provided with the above.

[0374] [Feature B1] A power conversion device (80) for converting electric power, A high potential conductor (601) extending in the extension direction (CD) and supplied with power; A low potential conductor (602) extending in a direction parallel to the high potential conductor and supplied with power; an output conductor (603) extending along the high potential conductor and the low potential conductor for outputting electric power; An upper switch component (530A) on the high potential side that switches to convert power; A lower switch component (530B) on the low potential side that switches to convert power; A capacitor component (580, 580A, 580B) electrically connected in parallel to the upper switch component and the lower switch component; Equipped with the upper switch component and the lower switch component are connected to the output conductor at positions spaced apart from each other in the extension direction such that output currents (IoA, IoB) flow through the output conductor in the extension direction from the upper switch component to the lower switch component; A capacitor component and an upper switch component are connected to the high potential conductor such that a high potential current (IpA, IpB) flows in the high potential conductor from the capacitor component toward the upper switch component in a direction opposite to the direction of the output current in an overlapping area (AO) that overlaps with the output current in the extension direction, A power conversion device in which a lower switch component and a capacitor component are connected to the low potential conductor in the overlap region so that a low potential current (InA, InB) flows from the lower switch component to the capacitor component in the opposite direction to the output current through the low potential conductor.

[0375] [Feature B2] A power conversion device described in feature B1, in which a plurality of upper switch components included in one phase and a plurality of lower switch components included in one phase are arranged in an extension direction along the high potential conductor, the low potential conductor, and the output conductor.

[0376] [Feature B3] The present invention relates to a case (90) having an outer peripheral wall (91) extending annularly in a circumferential direction (CD) as an extension direction, The high potential conductor, the low potential conductor, and the output conductor extend in a circumferential direction along the inner peripheral surface (90b) of the outer peripheral wall, The power conversion device according to feature B1 or B2, wherein the plurality of upper switch components included in one phase and the plurality of lower switch components included in one phase are arranged in a circumferential direction along the inner circumferential surface.

[0377] [Feature B4] A power conversion device according to feature B3, wherein the upper switch component and the lower switch component are located at a position spaced apart radially outward from the high potential conductor, the low potential conductor and the output conductor in the radial direction (RD) and are provided on the inner circumferential surface.

[0378] [Feature B5] As a capacitor component, an upper capacitor component (580A) is provided at a position aligned with the upper switch component in the radial direction (RD) of the outer peripheral wall and spaced radially inward from the upper switch component; As a capacitor component, a lower capacitor component (580B) is provided at a position aligned with the lower switch component in the radial direction and spaced radially inward from the lower switch component; Equipped with The upper and lower capacitor components each have a high capacitor terminal (582) connected to a high potential conductor and a low capacitor terminal (583) connected to a low potential conductor; A power conversion device described in feature B3 or B4, wherein in one of the upper capacitor component and the lower capacitor component, the high capacitor terminal is provided radially outward from the low capacitor terminal, and in the other of the upper capacitor component, the low capacitor terminal is provided radially outward from the high capacitor terminal.

[0379] [Feature B6] An upper switch group (530GA) including a plurality of upper switch parts included in one phase and arranged in an extension direction; A lower switch group (530GB) including a plurality of lower switch components arranged in the extension direction of the upper switch group, the plurality of upper switch components being included in the same phase as the plurality of upper switch components of the upper switch group and arranged in the extension direction; Equipped with A power conversion device described in any one of features B1 to B5, wherein the overlapping area is an area extending in the extension direction so as to span between the farthest upper component (530Af) that is located farthest from the lower switch group among the multiple upper switch components that the upper switch group has, and the farthest lower component (530Bf) that is located farthest from the upper switch group among the multiple lower switch components that the lower switch group has.

[0380] [Feature B7] a first capacitor group (580GA) including a plurality of first capacitor components (580A) arranged on the upper switch component in a perpendicular direction (RD) perpendicular to the extension direction and arranged in the extension direction; a second capacitor group (580GB) including a plurality of second capacitor components (580B) arranged in the extension direction and aligned with the lower switch component in the perpendicular direction; Equipped with The power conversion device according to any one of features B1 to B6, wherein the overlapping region extends in the extension direction so as to span the first capacitor group and the second capacitor group.

[0381] [Feature B8] The power conversion device according to any one of Features B1 to B7, wherein the high potential conductor, the low potential conductor and the output conductor are each formed in a plate shape and are stacked so that their plate surfaces face each other.

[0382] [Feature B9] A plurality of plate-shaped conductors (601 to 604) are electrically conductive, formed in a plate shape, and stacked so that their plate surfaces face each other; The plurality of plate-like conductors include a high potential conductor, a low potential conductor, and an output conductor; The power converter according to any one of Features B1 to B8, wherein the output conductor is provided between the first plate portion (601) and the second plate portion (602) of the plurality of plate-shaped conductors.

[0383] [Feature B10] The plurality of plate-like conductors include a ground conductor (604) that extends in a direction along the high potential conductor, the low potential conductor, and the output conductor and is grounded; The power conversion device according to feature B9, wherein the ground conductor is provided at least at one of a pair of outermost positions on the plurality of plate-shaped conductors.

[0384] [Feature B11] A plurality of high potential conductors, a plurality of low potential conductors, and a plurality of output conductors are provided. the upper switch element is connected to each of the plurality of high potential conductors and to each of the plurality of output conductors; the lower switch component is connected to each of the plurality of output conductors and to each of the plurality of low potential conductors; The power converter according to any one of Features B1 to B10, wherein the capacitor component is connected to each of the plurality of high potential conductors and is connected to each of the plurality of low potential conductors.

[0385] [Feature B12] An upper and lower arm circuit (83) electrically connected between the high potential conductor and the low potential conductor, The upper switch component has an upper arm switch (86A) included in the upper arm (84) of the upper and lower arm circuit, The power converter according to any one of Features B1 to B11, wherein the lower switch component has a lower arm switch (86B) included in a lower arm (85) of the upper and lower arm circuits.

[0386] [Feature B13] A power conversion device (80) for converting electric power, A high potential conductor (601) extending in the extension direction (CD) and supplied with power; A low potential conductor (602) extending in a direction parallel to the high potential conductor and supplied with power; an output conductor (603) extending along the high potential conductor and the low potential conductor for outputting electric power; an upper switch component (530A) having an upper input terminal (532A) connected to a high potential conductor and an upper output terminal (533A) connected to an output conductor, and switching for converting electric power; a lower switch component (530B) having a lower input terminal (532B) connected to an output conductor and a lower output terminal (533B) connected to a low potential conductor, the lower switch component (530B) switching to convert power; a capacitor component (580, 580A, 580B) having a high capacitor terminal (582) connected to a high potential conductor and a low capacitor terminal (583) connected to a low potential conductor, the capacitor component (580, 580A, 580B) being electrically connected in parallel to the upper switch component and the lower switch component; Equipped with An upper output terminal and a lower input terminal are connected to the output conductor at positions spaced apart from each other in the extension direction, the high potential conductor is connected such that at least one of the upper input terminal and the high capacitor terminal is located between the upper output terminal and the lower input terminal, and such that the upper input terminal and the high capacitor terminal are spaced apart in the extension direction; A power conversion device in which the low potential conductor is arranged so that at least one of the lower output terminal and the low capacitor terminal is located between the upper output terminal and the lower input terminal, and so that the lower output terminal and the low capacitor terminal are spaced apart in the extension direction.

[0387] [Feature B14] A power conversion device (80) for converting electric power, power conductors (601, 602) extending in an extension direction (CD) and through which power is supplied; An output conductor (603) extending in an extension direction along the power conductor for outputting electric power; An upper switch component (530A) on the high potential side that switches to convert power; A lower switch component (530B) on the low potential side that switches to convert power; Parallel components (580, 580A, 580B) electrically connected in parallel to the upper switch component and the lower switch component; Equipped with the upper switch component and the lower switch component are connected to the output conductor at positions spaced apart from each other in the extension direction such that output currents (IoA, IoB) flow through the output conductor in the extension direction from the upper switch component to the lower switch component; A power conversion device in which a parallel component and one of an upper switch component and a lower switch component are connected to a power conductor in an overlap area (AO) where the power conductor overlaps with an output current in the extension direction, so that a parallel current (IpA, IpB, InA, InB) flows in the power conductor between the parallel component and one of the upper switch component and the lower switch component in the opposite direction to the output current.

[0388] [Feature C1] A power conversion device (80) for converting electric power, A case (90) having an annularly extending outer peripheral wall (91); a switch component (530) that has power terminals (532, 533) to which power is supplied, control terminals (534, 535) for controlling the conversion of the power, and a switch body (531) supporting the power terminals and the control terminals, and that performs switching to convert the power; a power connection object (510) having a power outer peripheral end (512) extending in a circumferential direction (CD) of the outer peripheral wall along an inner peripheral surface (90b) of the outer peripheral wall and electrically connected to a power terminal; A control connection object (550) having a control outer peripheral end (552) extending in a circumferential direction along an inner peripheral surface thereof and having a control terminal electrically connected thereto; Equipped with A power conversion device in which a plurality of switch components are arranged in a circumferential direction along the power outer periphery edge and the control outer periphery edge.

[0389] [Feature C2] The power conversion device according to feature C1, wherein the switch body is provided at a position closer to the power connection object than to the control connection object.

[0390] [Feature C3] The control terminal has a control connection part (534ex, 535ex) that connects the switch body and the control connection object, The power conversion device according to feature C1 or C2, wherein the power terminal has a power connection portion (532ex, 533ex) that is shorter than the control connection portion and connects the switch main body and the power connection target.

[0391] [Feature C4] A power conversion device described in any one of features C1 to C3, wherein the power terminal extends from the switch body in the axial direction (AD) of the outer peripheral wall in a direction away from the power connection target and has a folded-back shape so as to extend in a direction toward the power connection target.

[0392] [Feature C5] The power connection target is a power board (510) extending in a direction perpendicular to the axial direction (AD) of the outer peripheral wall, The control connection target is a target substrate (550) extending in a direction perpendicular to the axial direction, The power converter according to any one of Features C1 to C4, wherein the power board and the target board are aligned in the axial direction.

[0393] [Feature C6] The power conversion device according to feature C5, wherein the power terminal is provided at a position spaced from a midpoint between the power board and the target board in the axial direction toward the power board.

[0394] [Feature C7] The power board has a power bus bar (601, 602, 603) extending along a control outer peripheral edge which is an outer peripheral edge of the power board, The power conversion device according to feature C5 or C6, wherein the power terminal is connected to the power bus bar and thereby electrically connected to the power board.

[0395] [Feature C8] The power outer peripheral end and the control outer peripheral end extend annularly in the circumferential direction, The power converter according to any one of features C1 to C7, wherein a switch row (530R) including a plurality of switch components arranged in the circumferential direction extends annularly in the circumferential direction.

[0396] [Feature C9] The power converter according to any one of Features C1 to C8, wherein the switch body is provided on an inner circumferential surface.

[0397] [Feature C10] The switch body has a pair of plate surfaces, that is, an inner plate surface (531a) facing inward in a radial direction (RD) of an outer peripheral wall, and an outer plate surface (531b) facing outward in the radial direction, The power conversion device according to feature C9, wherein heat dissipation from the outer plate surface is greater than heat dissipation from the inner plate surface.

[0398] [Feature D1] A power conversion device (80) for converting electric power, A case (90) having an annularly extending outer peripheral wall (91); a plurality of heat generating components (530) arranged in a circumferential direction (CD) of the outer peripheral wall, in contact with an inner peripheral surface (90b) of the outer peripheral wall, and generating heat when energized; Equipped with An outer peripheral surface (90a) of the outer peripheral wall is a heat dissipation surface that dissipates heat transferred from the heat-generating component to the inner peripheral surface to the outside.

[0399] [Feature D2] A power conversion device described in feature D1, which is provided with multiple small heat-generating components (524, 580) arranged circumferentially and located inside the heat-generating component (530) in the radial direction (RD) of the outer peripheral wall, and which generate less heat when current is applied than the heat-generating component.

[0400] [Feature D3] A heat generating component row (530R) including a plurality of heat generating components arranged in a circumferential direction extends in a ring shape in the circumferential direction, The power conversion device according to feature D2, wherein a small heat generating component row (524R, 580R) including a plurality of small heat generating components arranged in a circumferential direction extends in an annular shape in the circumferential direction radially inward of the heat generating component row.

[0401] [Feature D4] As the small heating components, a plurality of first small heating components (580) are arranged in the circumferential direction; As a small heating component, a second small heating component (524) is provided radially inward of the first small heating component, is arranged in a circumferential direction, and generates less heat when energized than the first small heating component; The power conversion device according to feature D2 or D3, comprising:

[0402] [Feature D5] A first component row (580R) including a plurality of first small thermal components arranged in the circumferential direction extends in an annular shape in the circumferential direction, The power conversion device according to feature D4, wherein a second component row (524R) including a plurality of second small heat components arranged in the circumferential direction extends annularly in the circumferential direction radially inward of the first component row.

[0403] [Feature D6] a plate member (510) provided at a position spaced radially inward from the inner circumferential surface and extending in a plate shape in a direction perpendicular to the axial direction (AD) of the outer circumferential wall; The power converter according to any one of Features D2 to D5, wherein the plurality of small heat generating components are fixed to a plate member.

[0404] [Feature D7] A heating group (530G) having a plurality of heating components arranged in a circumferential direction, the heating group (530G) being arranged in a plurality of circumferential directions; As a small heat generating component, a group arranging component (580c) is provided at a position radially aligned with the heat generating group; The power conversion device according to any one of features D2 to D6, further comprising:

[0405] [Feature D8] A dense region (Asw1) in which a plurality of heat generating components are arranged in a circumferential direction and densely packed together; An intermediate region (Asw2) in which no heat generating component is provided, which is arranged in a circumferential direction and is provided between two adjacent dense regions in the circumferential direction; an external connector (96) provided in an intermediate region of the outer peripheral wall for electrically connecting the heat generating component to an external device (31); As a small heat component, a connector aligning component (524b) is provided at a position radially aligned with the external connector; The power conversion device according to any one of features D2 to D7, further comprising:

[0406] [Feature D9] The heat-generating component has a plate-shaped component body (531) and component terminals (532-535) extending from the component body, and an outer plate surface (531b) of the component body is superimposed on the inner circumferential surface and in contact with the outer circumferential wall. A power conversion device according to any one of Features D1 to D8.

[0407] [Feature D10] The power conversion device according to feature D9, wherein in the component body, heat dissipation from the outer plate surface is greater than heat dissipation from an inner plate surface (531a) facing opposite to the outer plate surface.

[0408] [Feature D11] A connection board (510, 550) to which component terminals are connected; A substrate support portion (500) fixed to the outer peripheral wall and supporting a connection substrate; Equipped with A power conversion device described in feature D9 or D10, in which in a heat-generating component, heat from the component body is released to the outside from the outer peripheral surface through the outer peripheral wall, and heat from the component terminals is released to the outside from the outer peripheral surface through the connection board, the board support portion, and the outer peripheral wall. [Explanation of symbols]

[0409] <Composition group A> 50...EPU as a rotating electric machine unit, 60...motor device as a rotating electric machine, 62...end plate as a cover portion, 71...motor outer peripheral wall as an electric machine outer peripheral wall, 80...inverter device as a power conversion device, 86...arm switch as a conversion switch, 90...inverter housing as a case, 90b...inner peripheral surface, 91...inverter outer peripheral wall as an outer peripheral wall and an apparatus outer peripheral wall, 92...inverter fin as a heat dissipation fin, 146...motor current sensor as a mounted component, 147...battery current sensor as a mounted component, 200...stator as a stator, 300...rotor as a rotor, 501...beam portion, 502...beam connecting portion, 510...high voltage board as a plate member and a first plate member, 512... Outer peripheral end, 525...common mode coil section as mounted component, 526...normal mode coil section as mounted component, 527...Y capacitor section as mounted component, 528...X capacitor section as mounted component, 530...arm switch section as switch component, 531...switch main body, 532...source terminal as switch terminal, 533...drain terminal as switch terminal, 534...gate terminal as switch terminal, 535...driver source terminal as switch terminal, 539...switch group, 545...insulating section, 550...driver board as plate member, second plate member and low-voltage board, 552...outer peripheral end, 580...smoothing capacitor section as mounted component, AD...axial direction, CD...circumferential direction, RD...radial direction.

[0410] <Composition group B> 80... inverter device as power conversion device, 83... upper and lower arm circuits, 84... upper arm, 85... lower arm, 86A... upper arm switch, 86B... lower arm switch, 530A... upper arm switch section as upper switch component, 530Af... farthest upper component, 530B... lower arm switch section as lower switch component, 530Bf... farthest lower component, 530GA... upper switch group, 530GB... lower switch group, 532A... upper drain terminal as upper input terminal, 532B... lower input terminal 533A...lower drain terminal as upper output terminal, 533B...lower source terminal as lower output terminal, 533...drain terminal as terminal, 534...gate terminal as input control terminal, 535...driver source terminal as output control terminal, 580...smoothing capacitor section as capacitor component and parallel component, 580A...capacitor component, upper capacitor component, upper capacitor section as first capacitor component and parallel component, 580B...lower capacitor section as capacitor component, lower capacitor component, second capacitor component and parallel component, 580GA...upper capacitor group as first capacitor group, 580GB...lower capacitor group as second capacitor group, 582...P capacitor terminal as high capacitor terminal, 583...N capacitor terminal as low capacitor terminal, 601...P bus bar as high potential conductor, plate conductor, first plate portion and power conductor, 602...N bus bar as low potential conductor, plate conductor, second plate portion and power conductor, 603... Output bus bar as output conductor and plate-shaped conductor, 604...earth bus bar as plate-shaped conductor and ground conductor, AO...overlapping area, IoA...upper output current as output current, IoB...lower output current as output current, IpA...upper P current as high potential current and parallel current, IpB...lower P current as high potential current and parallel current, InA...upper N current as low potential current and parallel current, InB...lower N current as low potential current and parallel current, CD...circumferential direction as extension direction, RD...radial direction as perpendicular direction.

[0411] <Composition group C> 60...motor device as a rotating electric machine, 80...inverter device as a power conversion device, 90...inverter housing as a case, 90b...inner peripheral surface, 91...inverter outer peripheral wall as an outer peripheral wall, 510...power connection target and high voltage board as a power board, 512...outer peripheral end as a power outer peripheral end, 530...arm switch part as a switch part, 530R...arm switch row as a switch row, 531...switch main body, 531a...first plate surface as an inner plate surface, 531b...second plate surface as an outer plate surface, 532...source terminal as a power terminal, 532ex...source as a power connection part source exposed portion, 533...drain terminal as power terminal, 533ex...drain exposed portion as power connection portion, 534...gate terminal as control terminal, 534ex...gate exposed portion as control connection portion, 535...driver source terminal as control terminal, 535ex...driver source exposed portion as control connection portion, 550...driver board as control connection target and target board, 552...outer peripheral end as control outer peripheral end, 601...P bus bar as power bus bar, 602...N bus bar as power bus bar, 603...output bus bar as power bus bar, AD...axial direction, CD...circumferential direction, RD...radial direction.

[0412] <Configuration group D> 31...battery as external device, 80...inverter device as power conversion device, 90...inverter housing as case, 90a...outer peripheral surface as heat dissipation surface, 90b...inner peripheral surface, 91...inverter outer peripheral wall as outer peripheral wall, 96...inverter connector as external connector, 500...component support portion as board support portion, 510...high voltage board as plate member and connection board, 524...filter component as small heat component and second small heat component, 524b...connector and components, 524R...filter row as small heat component row and second component row, 530...arm switch portion as heat generating component, 530G...switch group as heat generating group , 530R...arm switch row as heat-generating component row, 531...switch body as component body, 531b...second plate surface as plate surface, 532...source terminal as component terminal, 533...drain terminal as component terminal, 534...gate terminal as component terminal, 535...driver source terminal as component terminal, 550...driver board as connection board, 580...smoothing capacitor section as small heat component and first small heat component, 580c...group arranged components, 580R...smoothing capacitor row as small heat component row and first component row, Asw1...switch area as dense area, Asw2...intermediate area, AD...axial direction, CD...circumferential direction, RD...radial direction.

Claims

1. A power conversion device (80) for converting electric power, A high-potential conductor (601) extending in the extension direction (CD) and supplied with power; A low potential conductor (602) extending in the extension direction along the high potential conductor and supplied with power; an output conductor (603) extending in the extension direction along the high potential conductor and the low potential conductor for outputting electric power; A high-potential side upper switch component (530A) that switches to convert power; A lower switch component (530B) on the low potential side that switches to convert power; a capacitor component (580, 580A, 580B) electrically connected in parallel to the upper switch component and the lower switch component; Equipped with the upper switch component and the lower switch component are connected to the output conductor at positions spaced apart from each other in the extension direction such that output currents (IoA, IoB) flow through the output conductor in the extension direction from the upper switch component to the lower switch component, the capacitor component and the upper switch component are connected to the high potential conductor such that a high potential current (IpA, IpB) flows from the capacitor component to the upper switch component in a direction opposite to the direction of the output current in an overlapping area (AO) that overlaps with the output current in the extension direction of the high potential conductor; A power conversion device in which the lower switch component and the capacitor component are connected to the low potential conductor in the overlap region such that a low potential current (InA, InB) flows from the lower switch component to the capacitor component in the opposite direction to the output current through the low potential conductor.

2. The power conversion device according to claim 1 , wherein the plurality of upper switch components included in one phase and the plurality of lower switch components included in one phase are arranged in the extension direction along the high potential conductor, the low potential conductor, and the output conductor.

3. The present invention is provided with a case (90) having an outer peripheral wall (91) extending annularly in a circumferential direction (CD) as the extension direction, The high potential conductor, the low potential conductor, and the output conductor extend in the circumferential direction along an inner circumferential surface (90b) of the outer circumferential wall, The power conversion device according to claim 1 , wherein the upper switch components included in one phase and the lower switch components included in one phase are arranged in the circumferential direction along the inner circumferential surface.

4. The power conversion device according to claim 3, wherein the upper switch component and the lower switch component are located at a position spaced apart from the high potential conductor, the low potential conductor, and the output conductor outside the radial direction (RD) of the outer circumferential wall, and are provided on the inner circumferential surface.

5. As the capacitor component, an upper capacitor component (580A) is provided at a position aligned with the upper switch component in the radial direction (RD) of the outer peripheral wall and spaced apart from the upper switch component to the inside in the radial direction; As the capacitor component, a lower capacitor component (580B) is provided at a position aligned with the lower switch component in the radial direction and spaced apart from the lower switch component on the inner side in the radial direction; Equipped with The upper capacitor component and the lower capacitor component have a high capacitor terminal (582) connected to the high potential conductor and a low capacitor terminal (583) connected to the low potential conductor, 4. The power conversion device according to claim 3, wherein in one of the upper capacitor component and the lower capacitor component, the high capacitor terminal is provided radially outwardly of the low capacitor terminal, and in the other of the upper capacitor component, the low capacitor terminal is provided radially outwardly of the high capacitor terminal.

6. An upper switch group (530GA) including a plurality of the upper switch parts included in one phase and arranged in the extension direction; A lower switch group (530 GB) including a plurality of lower switch components arranged in the extension direction in the upper switch group, the plurality of upper switch components being included in the same phase as the plurality of upper switch components of the upper switch group and arranged in the extension direction; Equipped with 2. The power conversion device according to claim 1, wherein the overlapping region is a region extending in the extension direction so as to span between a farthest upper component (530Af) of the plurality of upper switch components of the upper switch group that is located farthest from the lower switch group, and a farthest lower component (530Bf) of the plurality of lower switch components of the lower switch group that is located farthest from the upper switch group.

7. a first capacitor group (580GA) including a plurality of first capacitor components (580A) arranged on the upper switch component in a perpendicular direction (RD) perpendicular to the extension direction and arranged in the extension direction; a second capacitor group (580GB) including, as the capacitor components, a plurality of second capacitor components (580B) arranged on the lower switch component in the orthogonal direction and arranged in the extension direction; Equipped with The power conversion device according to claim 1 , wherein the overlapping region extends in the extension direction so as to span the first capacitor group and the second capacitor group.

8. The power conversion device according to claim 1 , wherein the high potential conductor, the low potential conductor, and the output conductor are each formed in a plate shape and are stacked such that their plate surfaces face each other.

9. The device includes a plurality of plate-shaped conductors (601 to 604) that are conductive, formed in a plate shape, and stacked so that their plate surfaces face each other; the plurality of plate-shaped conductors include the high potential conductor, the low potential conductor, and the output conductor; The power conversion device according to claim 1 , wherein the output conductor is provided between a first plate portion (601) and a second plate portion (602) of the plurality of plate-shaped conductors.

10. The plurality of plate-shaped conductors include a ground conductor (604) that extends in the extension direction along the high potential conductor, the low potential conductor, and the output conductor and is grounded; The power conversion device according to claim 9 , wherein the ground conductor is provided at least at one of a pair of outermost positions on the plurality of plate-shaped conductors.

11. The high potential conductor, the low potential conductor, and the output conductor are provided in plurality, the upper switch component is connected to each of the plurality of high potential conductors and to each of the plurality of output conductors; the lower switch component is connected to each of the plurality of output conductors and to each of the plurality of low potential conductors; The power conversion device according to claim 1 , wherein the capacitor component is connected to each of the plurality of high potential conductors and is connected to each of the plurality of low potential conductors.

12. an upper and lower arm circuit (83) electrically connected between the high potential conductor and the low potential conductor; The upper switch component has an upper arm switch (86A) included in the upper arm (84) of the upper and lower arm circuit, 2. The power conversion device according to claim 1, wherein the lower switch component has a lower arm switch (86B) included in a lower arm (85) of the upper and lower arm circuit.

13. A power conversion device (80) for converting electric power, A high-potential conductor (601) extending in the extension direction (CD) and supplied with power; A low potential conductor (602) extending in the extension direction along the high potential conductor and supplied with power; an output conductor (603) extending in the extension direction along the high potential conductor and the low potential conductor for outputting electric power; an upper switch component (530A) having an upper input terminal (532A) connected to the high potential conductor and an upper output terminal (533A) connected to the output conductor, and switching to convert power; a lower switch component (530B) having a lower input terminal (532B) connected to the output conductor and a lower output terminal (533B) connected to the low potential conductor, and switching to convert power; a capacitor component (580, 580A, 580B) having a high capacitor terminal (582) connected to the high potential conductor and a low capacitor terminal (583) connected to the low potential conductor, and electrically connected in parallel to the upper switch component and the lower switch component; Equipped with the upper output terminal and the lower input terminal are connected to the output conductor at positions spaced apart from each other in the extension direction, the high potential conductor is connected such that at least one of the upper input terminal and the high capacitor terminal is located between the upper output terminal and the lower input terminal, and the upper input terminal and the high capacitor terminal are spaced apart from each other in the extension direction; a power conversion device in which the low potential conductor is provided so that at least one of the lower output terminal and the low capacitor terminal is located between the upper output terminal and the lower input terminal, and so that the lower output terminal and the low capacitor terminal are spaced apart in the extension direction.

14. A power conversion device (80) for converting electric power, power conductors (601, 602) extending in an extension direction (CD) and supplied with power; an output conductor (603) extending in the extension direction along the power conductor for outputting electric power; A high-potential side upper switch component (530A) that switches to convert power; A lower switch component (530B) on the low potential side that switches to convert power; a parallel component (580, 580A, 580B) electrically connected in parallel to the upper switch component and the lower switch component; Equipped with the upper switch component and the lower switch component are connected to the output conductor at positions spaced apart from each other in the extension direction such that output currents (IoA, IoB) flow through the output conductor in the extension direction from the upper switch component to the lower switch component, a power conversion device in which the power conductor is connected to the parallel component and one of the upper switch component and the lower switch component in an overlapping area (AO) that overlaps with the output current in the extension direction, so that a parallel current (IpA, IpB, InA, InB) flows in the power conductor between the parallel component and one of the upper switch component and the lower switch component in a direction opposite to the output current.

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