Equipment that uses high pressure air

Abstract

To provide a device that monitors supplied high-pressure air and reports that the high-pressure air is contaminated with oil.SOLUTION: A device 2 (2a) that uses high-pressure air internally includes a body 4, air pipes 44 (44a, 44b) that are supplied with high-pressure air from a high-pressure air supply source 42 (42a, 42b) and that supply high-pressure air to the interior of the body 4, filters 46 (46a, 46b) that remove oil contained in the high-pressure air that passes through the air pipes, gas detectors 48 (48a, 48b) that detect organic gases contained in the high-pressure air after it has passed through the filter, and a notification unit 50 that reports the presence of oil in the high-pressure air when the gas detector detects organic gases contained in the high-pressure air.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an apparatus that is connected to a pipe that serves as a supply path for high-pressure air and that utilizes high-pressure air inside. [Background technology]

[0002] Device chips used in electronic devices such as mobile phones and computers are manufactured from wafers made of materials such as silicon and silicon carbide. First, multiple dividing lines that intersect with each other are set on the surface of the wafer, and devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed in each area defined by the dividing lines on the surface of the wafer. Next, the wafer is ground from the back side to thin it, and then divided along the dividing lines to form individual device chips.

[0003] In the process of forming individual device chips from a wafer, equipment such as a grinding device for grinding the wafer, a cutting device for dividing the wafer, and a laser processing device are used (see Patent Documents 1 to 3). These devices use high-pressure air for various purposes, such as driving the suction source of the chuck table that holds the wafer, cleaning the processed wafer, and as a bearing for the rotating spindle. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-246098 A [Patent Document 2] JP 2010-36275 A [Patent Document 3] JP 2012-2604 A Summary of the Invention [Problem to be solved by the invention]

[0005] An air compressor or the like is provided outside the device as a high-pressure air supply source. The air compressor, functioning as the high-pressure air supply source, compresses air and supplies the high-pressure air to the device through piping. At this time, there is a risk that oil such as lubricating oil used inside the air compressor may be mixed into the high-pressure air.

[0006] If oil is mixed in the high-pressure air supplied to the equipment, the oil may adhere to the wafers processed by the equipment, causing a deterioration in the quality of the wafers, or adhere to the optical system used in the equipment, causing deterioration, or adhere to the drive mechanism, causing malfunction. Therefore, a measure is taken to install a filter inside the piping through which the high-pressure air passes, and to use the filter to remove the oil mixed in with the high-pressure air.

[0007] However, as oil contamination of the filter progresses, there are cases where the filter is unable to remove the oil contained in the high-pressure air, or where the oil trapped in the filter is released from the filter. In these cases, if the equipment continues to operate as is, the oil problem may grow without the equipment manager noticing, resulting in significant losses.

[0008] The present invention has been made in consideration of such problems, and its object is to provide a device that can monitor the high-pressure air being supplied and can alert when oil has become mixed into the high-pressure air. [Means for solving the problem]

[0009] According to one aspect of the present invention, an apparatus that utilizes high-pressure air internally includes a main body, an air pipe that receives high-pressure air from a high-pressure air supply source and supplies the high-pressure air to the inside of the main body, a filter that removes oil contained in the high-pressure air passing through the air pipe, a gas detector that detects organic gas contained in the high-pressure air after it has passed through the filter, and an alarm unit that notifies the user that the high-pressure air contains oil when the gas detector detects the organic gas contained in the high-pressure air. The air piping is further provided with an auxiliary gas detector for detecting the organic gas contained in the high-pressure air before passing through the filter, and when the organic gas contained in the high-pressure air is detected by the gas detector but not by the auxiliary gas detector, it is possible to confirm that contamination of the filter is progressing. An apparatus is provided comprising:

[0010] Preferably, the high pressure air supply source that supplies the high pressure air to the air pipe is an air compressor.

[0011] Further, preferably, the device further comprises a shutoff valve which shuts off the high-pressure air flowing through the air piping when the alarm unit alarms that the high-pressure air contains oil.

[0012] According to another aspect of the present invention, there is provided an apparatus that utilizes high pressure air internally, comprising a main body, an air piping to which high pressure air is supplied from a high pressure air supply source and which supplies the high pressure air into the inside of the main body, a filter to remove oil contained in the high pressure air passing through the air piping, a gas detector to detect organic gas contained in the high pressure air after it has passed through the filter, an alarm unit that alerts the presence of oil in the high pressure air when the gas detector detects organic gas contained in the high pressure air, and a shut-off valve that is provided on the air piping downstream of the filter and shuts off the high pressure air flowing through the air piping, wherein the shut-off valve shuts off the high pressure air flowing through the air piping when the alarm unit alerts the presence of oil in the high pressure air. According to yet another aspect of the present invention, there is provided a device that utilizes high pressure air internally, comprising a main body, a first air pipe to which high pressure air is supplied from a first high pressure air supply source and which supplies the high pressure air to the inside of the main body, a filter to remove oil contained in the high pressure air passing through the first air pipe, a gas detector to detect organic gases contained in the high pressure air after it has passed through the filter, and a second air pipe to which high pressure air is supplied and which supplies the high pressure air to the inside of the main body. a second filter for removing oil contained in the high-pressure air passing through the second air pipe; and a second gas detector for detecting an organic gas contained in the high-pressure air after passing through the second filter. a three-way valve connected to the downstream side of the first air pipe and the downstream side of the second air pipe; an internal pipe connected to the three-way valve and leading to the inside of the main body; and a gas detector that notifies the fact that the oil is mixed into the high-pressure air inside the first air pipe when the gas detector detects an organic gas contained in the high-pressure air. When the second gas detector detects an organic gas contained in the high-pressure air, the detector notifies the user that the oil is mixed into the high-pressure air inside the second air pipe.and an alarm unit which notifies the operator when the organic gas contained in the high-pressure air is detected by the gas detector while the first air piping and the internal piping are connected by the three-way valve, and which switches the three-way valve to disconnect the first air piping and the internal piping and connect the second air piping and the internal piping. Effect of the Invention

[0013] An apparatus according to one aspect of the present invention includes a filter that removes oil contained in high-pressure air passing through an air pipe, and a gas detector that detects organic gas contained in the high-pressure air after passing through the filter. The apparatus further includes an alarm unit that notifies the user that the high-pressure air contains oil when the gas detector detects the organic gas contained in the high-pressure air.

[0014] When the high-pressure air after passing through the filter contains organic gas, it is understood that the filter is contaminated and oil is mixed in the high-pressure air. If left as is, the high-pressure air mixed with oil will be supplied to the inside of the device, so for example, by blocking the air piping, the oil mixed in the high-pressure air can be prevented from entering the inside of the device. Then, by replacing the highly contaminated filter, the oil mixed in the high-pressure air can be sufficiently removed by the filter.

[0015] In this way, in the device according to one aspect of the present invention, the alarm unit notifies the user so that the oil problem can be dealt with before it becomes serious, thereby reducing the time and financial costs required for recovery work.

[0016] Therefore, according to the present invention, there is provided a device that can monitor the high pressure air being supplied and can provide an indication when oil has become mixed into the high pressure air. [Brief description of the drawings]

[0017] [Figure 1] FIG. 2 is a perspective view showing a schematic diagram of a device to which high-pressure air is supplied and a high-pressure air supply source. [Diagram 2] FIG. 2(A) is a schematic diagram showing an example of air piping incorporated in the device, and FIG. 2(B) is a schematic diagram showing another example of air piping incorporated in the device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view that typically illustrates an apparatus 2 according to this embodiment. Fig. 1 includes a perspective view that typically illustrates a frame unit 11 that includes a wafer 1 to be processed by the apparatus 2. The frame unit 11 includes an annular frame 7 that has an opening, a dicing tape 9 that is attached to the frame 7 so as to close the opening, and a wafer 1 that is disposed on the dicing tape 9 inside the opening.

[0019] The wafer 1 is, for example, a substantially disk-shaped substrate made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor material, or a material such as sapphire, glass, or quartz.

[0020] The surface of the wafer 1 is divided by a number of dividing lines that intersect with each other. Devices such as ICs, LSIs, and LEDs (Light Emitting Diodes) are formed in each area divided by the dividing lines on the surface of the wafer 1. When the wafer 1 is divided along the dividing lines, individual device chips are formed.

[0021] The device 2 according to this embodiment is, for example, a cutting device equipped with an annular cutting blade. The division of the wafer 1 is performed, for example, by the cutting device. However, the device according to this embodiment is not limited to this, and may be a laser processing device that applies a laser beam to a workpiece such as the wafer 1, or a grinding device that grinds the workpiece with a grinding wheel. Below, a case where the device 2 according to this embodiment is a cutting device will be described as an example.

[0022] The wafer 1 may be integrated with the dicing tape 9 and the frame 7 before being carried into the apparatus 2, and a frame unit 11 may be formed including the wafer 1, the dicing tape 9, and the frame 7. In this case, the individual device chips formed by dividing the wafer 1 are supported by the dicing tape 9. Thereafter, the dicing tape 9 is expanded to widen the spaces between the device chips, making it easier to pick up the device chips.

[0023] As shown in Fig. 1, a cassette table 6 on which a cassette 13 is placed is provided at a corner of the main body 4 of the device 2. The cassette table 6 can be raised and lowered in the vertical direction (Z-axis direction) by a lifting mechanism (not shown). In Fig. 1, the outline of the cassette 13 placed on the cassette table 6 is indicated by a two-dot chain line.

[0024] A temporary placement table 10 including a pair of guide rails 8 which move toward and away from each other while maintaining a parallel state in the Y-axis direction (left-right direction, indexing feed direction) is provided on the upper surface of the main body 4 at a position adjacent to the temporary placement table 10. Also, a carry-out unit 12 which carries out, from the cassette 13, the frame unit 11 housed in the cassette 13 placed on the cassette table 6, is provided on the front surface of the main body 4.

[0025] When unloading the frame unit 11 housed in the cassette 13, the unloading unit 12 is moved toward the cassette 13 and grips the frame 7 with its gripping portion, and then the unloading unit 12 is moved in a direction away from the cassette 13. Then, the frame unit 11 is pulled out from the cassette 13 to the temporary placement table 10. At this time, the pair of guide rails 8 are moved in an interlocking manner in a direction approaching each other in the X-axis direction, and the frame 7 is sandwiched between the pair of guide rails 8, whereby the frame unit 11 is positioned at a predetermined position.

[0026] An opening 4a that is long in the X-axis direction (front-rear direction, processing feed direction) is formed at a position adjacent to the cassette table 6 on the top surface of the main body 4. A ball screw type X-axis movement mechanism (processing feed unit) (not shown) and a bellows-shaped dust-proof and drip-proof cover 26 that covers the upper part of the X-axis movement mechanism are disposed in the opening 4a.

[0027] The X-axis movement mechanism is connected to the lower part of the X-axis movement table 16, and has a function of moving the X-axis movement table 16 in the X-axis direction. For example, the X-axis movement table 16 moves between a carry-in / out area adjacent to the cassette table 6 and a processing area below the cutting unit 32 described below.

[0028] A table base 18 and a chuck table 20 mounted on the table base 18 are provided on the X-axis moving table 16. The chuck table 20 has a function of holding the frame unit 11 including the wafer 1, and its upper surface serves as a holding surface 22. A clamp 24 for gripping the frame 7 is provided on the radial outer side of the chuck table 20. The chuck table 20 moves in the X-axis direction by the above-mentioned X-axis moving mechanism.

[0029] The chuck table 20 has a porous member exposed on the holding surface 22. A suction path (not shown) is disposed inside the chuck table 20, one end of which is connected to the porous member and the other end of which is connected to a suction source (not shown). For example, the suction source is an aspirator, which generates a suction force by supplying high-pressure air.

[0030] The frame unit 11 is transported from the temporary placement table 10 to the chuck table 20 by a first transport unit 14 provided at a position adjacent to the temporary placement table 10 and the opening 4a on the upper surface of the main body 4. The first transport unit 14 has a shaft portion that protrudes upward from the upper surface of the main body 4 and is movable up and down and rotatable, an arm portion that extends horizontally from the upper end of the shaft portion, and a holding portion provided below the tip of the arm portion. The holding portion generates a suction force by using, for example, high-pressure air, and holds the frame unit 11 by the suction force.

[0031] When the frame unit 11 is transported by the first transport unit 14 from the temporary placement table 10 to the chuck table 20, the X-axis moving table 16 is moved to position the chuck table 20 in the carry-in / out area. Then, the frame 7 of the frame unit 11 temporarily placed on the temporary placement table 10 is held by the holding portion, the frame unit 11 is lifted, and the shaft portion is rotated to move the frame unit 11 above the chuck table 20.

[0032] Thereafter, the frame unit 11 is lowered and placed on the holding surface 22 of the chuck table 20. Then, the frame 7 is fixed by the clamps 24, and the wafer 1 is suction-held by the chuck table 20 via the dicing tape 9 of the frame unit 11.

[0033] The device 2 includes a support structure 28 disposed across the opening 4a above the movement path of the X-axis moving table 16 from the carry-in / out area to the processing area. The support structure 28 is provided with an imaging unit 30 facing downward. The imaging unit 30 images the surface of the wafer 1 held by suction on the chuck table 20 moving to the processing area below the cutting unit 32, and detects the position and orientation of the planned division lines 3 provided on the surface.

[0034] The processing area is provided with a cutting unit (processing unit) 32 that cuts (processes) the wafer 1 of the frame unit 11 held by the chuck table 20. The cutting unit 32 includes a cutting blade 34 having an annular grinding wheel portion on its outer periphery, and a spindle 36 along the Y-axis direction, with the cutting blade 34 attached to its tip, which serves as the rotation axis of the cutting blade 34. High-pressure air is used for the bearing of the rotating spindle 36.

[0035] A rotation drive source (not shown) such as a motor is connected to the base end side of the spindle 36. The wafer 1 included in the frame unit 11 held by the chuck table 20 can be cut (processed) by causing a rotating cutting blade 34 to cut into the wafer 1. When the wafer 1 is cut along all of the planned division lines, the wafer 1 is divided into individual device chips. The chuck table 20 is then moved to the load / unload area by the X-axis movement mechanism.

[0036] An opening 4b is formed on the top surface of the main body 4 at a position adjacent to the temporary placement table 10 and the opening 4a, and the opening 4b houses a cleaning unit 38 that cleans the frame unit 11 after processing. The cleaning unit 38 includes a spinner table that holds the frame unit 11. A rotation drive source (not shown) that rotates the spinner table at a predetermined speed is connected to the lower part of the spinner table.

[0037] The apparatus 2 includes a second transport unit 40 that transports the frame unit 11 from the chuck table 20 positioned in the loading / unloading area to the cleaning unit 38. The second transport unit 40 has an arm that is movable along the Y-axis direction, and a holder provided below the tip of the arm.

[0038] When the second transport unit 40 transports the frame unit 11 from the chuck table 20 to the cleaning unit 38, first, the frame unit 11 is held by the holding portion. Then, the arm portion is moved along the Y-axis direction to place the frame unit 11 on the spinner table of the cleaning unit 38. Thereafter, the frame unit 11 is held by the spinner table and the wafer 1 is cleaned.

[0039] When cleaning the wafer 1 in the cleaning unit 38, a cleaning fluid (typically a mixed fluid of water and high-pressure air) is sprayed toward the surface of the wafer 1 while rotating the spinner table. Then, high-pressure air is supplied to the surface of the wafer 1 to dry the wafer 1. Then, the frame unit 11 cleaned in the cleaning unit 38 is stored in the cassette 13 placed on the cassette table 6.

[0040] When storing the frame unit 11 in the cassette 13, the frame unit 11 is transported from the cleaning unit 38 to the temporary placement table 10 using the first transport unit 14. Then, the carry-out unit 12 is moved toward the cassette 13 to push the frame unit 11 into the cassette 13.

[0041] In this manner, in the apparatus 2, the frame unit 11 is carried out of the cassette 13, the frame unit 11 is suction-held by the chuck table 20, and the wafers 1 contained in the frame unit 11 are processed by the cutting unit 32. Thereafter, the frame unit 11 is cleaned by the cleaning unit 38 and stored again in the cassette 13. In the apparatus 2, the frame units 11 are carried out one after another from the cassette 13, and the wafers 1 are cut one after another by the cutting unit 32 on the chuck table 20.

[0042] The device 2 includes a control unit 60 that controls each component of the device 2. The control unit is configured by a computer including a processing device such as a CPU (Central Processing Unit) and a storage device such as a flash memory. By operating the processing device according to software such as a program stored in the storage device, the control unit 60 functions as a concrete means in which the software and the processing device (hardware resource) work together.

[0043] As described above, high-pressure air is used for various purposes at various locations in the device 2. Fig. 2(A) is a schematic diagram showing the connection between the high-pressure air supply source 42 and the device 2. High-pressure air is generated, for example, by compressing air with a compressor functioning as the high-pressure air supply source 42. The high-pressure air is then supplied to the device 2 through air piping 44, such as a pressure-resistant tube made of urethane, polyvinyl chloride, or the like.

[0044] At this time, oil such as lubricating oil used inside the air compressor may be mixed into the high-pressure air. If oil is mixed into the high-pressure air supplied to the equipment 2, the oil may adhere to the wafer 1 processed by the equipment 2, causing electrical characteristic defects in the device chips manufactured from the wafer 1.

[0045] Also, oil may adhere to the imaging unit 30, causing the imaging unit 30 to be unable to properly detect the planned dividing lines of the wafer 1. Furthermore, oil may adhere to the driving mechanism, causing malfunction. Therefore, a measure is taken in which a filter 46 is provided inside the air pipe 44 through which the high pressure air passes, and the filter 46 removes the oil contained in the high pressure air passing through the high pressure air supply source 42.

[0046] However, when the device 2 is operated for a long period of time, the filter 46 may become contaminated with oil, and oil may be released from the filter 46. Also, the filter 46 may become unable to sufficiently remove oil that has become mixed in with the high-pressure air supplied from the high-pressure air supply source 42 to the air piping 44. Therefore, the device 2 according to this embodiment is made capable of monitoring the supplied high-pressure air and detecting that oil has become mixed in the high-pressure air.

[0047] When contamination of the filter 46 progresses and oil is mixed into the high-pressure air after passing through the filter 46, organic gases derived from the oil also become contained in the high-pressure air. Therefore, in the device 2 according to the present embodiment, the high-pressure air after passing through the filter 46 is monitored, and the organic gases contained in the high-pressure air are detected and the presence of oil in the high-pressure air is detected and reported.

[0048] 2(A), the device 2 according to this embodiment includes a gas detector 48 that detects organic gases contained in the high-pressure air after it has passed through the filter 46. The gas detector 48 is installed on the inner wall surface of the air pipe 44. The gas detector 48 has a function of monitoring the high-pressure air passing through the air pipe 44, and outputting information regarding various components contained in the high-pressure air to an alarm unit 50, which will be described next. For example, the gas detector 48 can be a gas sensor "SGP30" manufactured by Sensirion Co., Ltd.

[0049] Furthermore, the device 2 according to this embodiment includes an alarm unit 50 that notifies the user that oil is mixed in the high-pressure air when the gas detector 48 detects an organic gas contained in the high-pressure air. The alarm unit 50 is realized, for example, by the function of the control unit 60 of the device 2. Here, the alarm unit 50 may notify the user that an organic gas is contained in the high-pressure air, instead of notifying the user that oil is mixed in the high-pressure air.

[0050] 1, the device 2 may include a display monitor 52 capable of displaying various information. The device 2 may also include an alarm lamp 54 that lights up a lamp of a predetermined color according to the state of the device 2. Alternatively, the device 2 may include a speaker (not shown) that can emit an alarm sound.

[0051] When the gas detector 48 detects that the high-pressure air supplied to the apparatus 2 from the high-pressure air supply source 42 contains an organic gas, the notification unit 50, for example, displays warning information on the display monitor 52. Alternatively, it turns on a red warning lamp 54 indicating an abnormal state. Alternatively, it causes the speaker to emit an alarm sound. In this way, the notification unit 50 notifies the user of the apparatus 2, etc. that the high-pressure air contains an organic gas and that oil has been mixed in.

[0052] The apparatus 2 may further include a shutoff valve 56 that stops the flow of high-pressure air inside the air pipe 44. For example, the shutoff valve 56 is a solenoid valve electrically connected to the alarm unit 50, and can be opened and closed in response to a command from the alarm unit 50. When the gas detector 48 detects that the high-pressure air supplied to the apparatus 2 from the high-pressure air supply source 42 contains an organic gas, the alarm unit 50 operates the shutoff valve 56 to shut off the flow of high-pressure air, thereby preventing oil from entering the inside of the apparatus 2.

[0053] Furthermore, when an organic gas mixed in the high-pressure air is detected, the notification unit 50 realized by the control unit 60 stops the operation of the device 2 as soon as possible to prevent the problem from progressing to each part of the device 2. Then, an operator inspects the high-pressure air supply source 42 or takes measures such as replacing the filter 46, and restarts the device 2.

[0054] If the operation of the device 2 is stopped while the supply of high pressure air is stopped, the processing performed by the device 2 will stop, and the processing efficiency of the workpiece will decrease. Therefore, while the supply of high pressure air is stopped, high pressure air may be supplied to the device 2 from a separate supply source to continue the operation of the device 2.

[0055] Fig. 2(B) is a schematic diagram showing the configuration of an apparatus 2a according to this embodiment in which high-pressure air is supplied from two systems. The apparatus 2a shown in Fig. 2(B) includes a first air pipe 44a to which high-pressure air is supplied from a first high-pressure air supply source 42a, and a second air pipe 44b to which high-pressure air is supplied from a second high-pressure air supply source 42b.

[0056] The first air pipe 44a is provided with a first filter 46a for removing oil contained in the high-pressure air supplied from the first high-pressure air supply source 42a, and a first gas detector 48a for detecting organic gas contained in the high-pressure air after passing through the first filter 46a. The first gas detector 48a is electrically connected to an alarm unit 50.

[0057] The second air pipe 44b is provided with a second filter 46b for removing oil contained in the high-pressure air supplied from the second high-pressure air supply source 42b, and a second gas detector 48b for detecting organic gases contained in the high-pressure air after passing through the second filter 46b. The second gas detector 48b is electrically connected to the alarm unit 50.

[0058] A three-way valve 58 is connected to the downstream side of the first air pipe 44a and the downstream side of the second air pipe 44b. The three-way valve 58 is connected to an internal pipe 44c leading to the inside of the main body 4 of the device 2a, and switchably connects one of the first air pipe 44a and the second air pipe 44b to the internal pipe 44c.

[0059] For example, the first air pipe 44a and the internal pipe 44c are connected by the three-way valve 58, and high-pressure air supplied from the first high-pressure air supply source 42a is supplied to the device 2a. At this time, the high-pressure air is monitored by the first gas detector 48a. When the first gas detector 48a detects an organic gas contained in the high-pressure air, the alarm unit 50 notifies the operator that oil has been mixed into the high-pressure air, and switches the three-way valve 58. That is, high-pressure air supplied from the second high-pressure air supply source 42b is supplied to the device 2a.

[0060] In this case, high pressure air continues to be supplied to the device 2a even while performing the work of replacing the first filter 46a, inspecting the first high pressure air supply source 42a, etc. Therefore, it is not necessary to stop processing in the device 2a while performing the work of restoring the first high pressure air supply source 42a, etc.

[0061] Thereafter, the high-pressure air flowing through the second air pipe 44b is monitored by the second gas detector 48b, and when the organic gas contained in the high-pressure air is detected by the second gas detector 48b, the three-way valve 58 is switched again. That is, the high-pressure air supplied from the first high-pressure air supply source 42a is supplied to the device 2a.

[0062] In this way, even if a problem occurs in one of the high-pressure air supply systems, the other high-pressure air supply system can continue to supply high-pressure air to the device 2a while the other high-pressure air supply system is being restored. Note that the number of high-pressure air supply systems may exceed two, and three or more high-pressure air supply systems may be provided.

[0063] As described above, the device according to this embodiment can monitor the supplied high-pressure air and detect organic gases contained in the high-pressure air. Therefore, even if oil such as lubricating oil used in the high-pressure air supply sources 42, 42a, 42b gets mixed into the high-pressure air, the operator can deal with the problem before it becomes more serious.

[0064] In the above embodiment, a case has been described in which the gas detector 48 is provided in the air pipe 44 downstream of the filter 46 that removes oil mixed into the high-pressure air, but the device 2 according to one aspect of the present invention is not limited to this. That is, in the device 2, in addition to the gas detector 48, an auxiliary gas detector may be provided upstream of the filter 46 inside the air pipe 44. In this case, the high-pressure air can be monitored before and after the filter 46, making it easier to identify the source of the oil.

[0065] For example, if the gas detector 48 detects an organic gas contained in the high-pressure air, but the auxiliary gas detector does not detect the organic gas, it can be confirmed that contamination of the filter 46 has progressed and oil has been mixed into the high-pressure air that has passed through the filter 46. In addition, if the auxiliary gas detector detects an organic gas, it can be understood that some kind of malfunction has occurred in the high-pressure air supply source 42.

[0066] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0067] 1 wafer 3. Planned division line 9 Dicing Tape 7 Frame 11 Frame unit 13 Cassette 2,2a equipment 4. Main unit 4a,4b opening 6 Cassette Table 8 Guide rail 10 Temporary table 12 Unloading unit 14,40 Transport unit 16 Mobile Table 18 Table Base 20 Chuck table 22 Holding surface 24 Clamp 26 Dust-proof / water-proof cover 28 Support structure 30 Imaging unit 32 Cutting unit 34 Cutting blade 36 Spindle 38 Cleaning Unit 42, 42a, 42b High pressure air supply source 44, 44a, 44b Air piping 44c Internal piping 46,46a,46b Filter 48, 48a, 48b Gas detectors 50 Notification Unit 52 Display Monitor 54 Alarm lamp 56 Shut-off valve 58 Three-way valve 60 Control Unit

Claims

1. A device that uses high-pressure air internally, The main body, an air pipe through which high-pressure air is supplied from a high-pressure air supply source and which supplies the high-pressure air to the inside of the main body; a filter for removing oil contained in the high-pressure air passing through the air piping; a gas detector that detects organic gases contained in the high-pressure air after passing through the filter; an alarm unit that notifies the presence of the oil in the high-pressure air when the gas detector detects an organic gas contained in the high-pressure air; Equipped with the air pipe is further provided with an auxiliary gas detector for detecting the organic gas contained in the high-pressure air before passing through the filter; This device is characterized in that it can confirm that the filter is becoming increasingly contaminated when the organic gas contained in the high-pressure air is detected by the gas detector while the organic gas is not detected by the auxiliary gas detector.

2. 2. The apparatus of claim 1, wherein the high pressure air source supplying the high pressure air to the air line is an air compressor.

3. 3. The device according to claim 1, further comprising a shutoff valve for shutting off the high-pressure air flowing through the air piping when the alarm unit alarms that the high-pressure air contains oil.

4. A device that uses high-pressure air internally, The main body, an air pipe through which high-pressure air is supplied from a high-pressure air supply source and which supplies the high-pressure air to the inside of the main body; a filter for removing oil contained in the high-pressure air passing through the air piping; a gas detector that detects organic gases contained in the high-pressure air after passing through the filter; an alarm unit that notifies the presence of the oil in the high-pressure air when the gas detector detects an organic gas contained in the high-pressure air; a shutoff valve provided on the air piping downstream of the filter and configured to shut off the high-pressure air flowing through the air piping; Equipped with The shutoff valve shuts off the high-pressure air flowing through the air piping when the alarm unit alarms that the high-pressure air contains oil.

5. A device that uses high-pressure air internally, The main body, a first air pipe that receives high-pressure air from a first high-pressure air supply source and supplies the high-pressure air to an inside of the main body; a filter that removes oil contained in the high-pressure air passing through the first air piping; a gas detector that detects organic gases contained in the high-pressure air after passing through the filter; a second air pipe to which high pressure air is supplied and which supplies the high pressure air to the inside of the main body; a second filter that removes oil contained in the high-pressure air passing through the second air pipe; a second gas detector that detects an organic gas contained in the high-pressure air after passing through the second filter; a three-way valve connected to a downstream side of the first air pipe and a downstream side of the second air pipe; an internal pipe connected to the three-way valve and directed toward the inside of the main body; an alarm unit that notifies the presence of oil in the high-pressure air inside the first air piping when the gas detector detects an organic gas contained in the high-pressure air, and that notifies the presence of oil in the high-pressure air inside the second air piping when the second gas detector detects an organic gas contained in the high-pressure air; Equipped with when the organic gas contained in the high-pressure air is detected by the gas detector while the first air piping and the internal piping are connected by the three-way valve, the three-way valve is switched to disconnect the first air piping and the internal piping and to connect the second air piping and the internal piping.

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