Energy-saving heat treatment device for metal substrates in corrosive gases

Abstract

The present invention discloses an energy-saving heat treatment apparatus for metal substrates in corrosive gas. The apparatus includes a process frame disposed in a radiation field and a substrate configured to be inserted into the process frame, the process frame covering the outer edge of the top surface of the substrate to form a small-volume process space. The process frame is a modified structure of a conventional process frame, and covers the outer edge of the substrate to protect the edge from contact with selenium and reduce chalcogen at the contacted edge. Even if chalcogen or hydrocarbon remains in the chamber, the edge of the substrate will not be corroded. Since the process space is minimized, the chalcogen in the process chamber is greatly reduced, and therefore the barrier layer on the bottom surface of the substrate can also be greatly thinned.

Description

[Technical field]

[0001] The present invention relates to the technical field of rapid thermal processing of metal substrates, in particular to an energy-saving thermal processing device for metal substrates in corrosive gases. [Background technology]

[0002] The process box is constructed of a composite material frame, such as graphite or carbon fiber reinforced carbon (CFRC, RCC, or CFC). Glass ceramic tiles have been proven to be resistant to high temperatures, insensitive to temperature gradients, insensitive to selenium and sulfur corrosion, have a very low coefficient of expansion, and have high mechanical stability. When the plates, each 4 mm thick, are used individually, the mass of the plate is already four times that of the substrate. With an area of ​​about 1 m 2 For a substrate of 1000mm (which corresponds to 5kg for a thickness of 2mm), the total weight of the box would be about 40kg. Such "non-productive" material must eventually be heated to the process temperature and then cooled again during the process.

[0003] For example, EP1258043 (selection box) and EP1277238 (chamber structure of selection plant) describe practical designs and improvements of the volume reduction reaction vessel concept and the structure of production equipment based thereon. In EP1258043, a graphite film is described as the energy transmission body, but the independent claims always envisage a transparent body, in particular a glass ceramic. The energy transmission body is therefore an additional layer or film that cannot function as a lid or a base plate of the box.

[0004] In the patent application by J. Palm, M. Pfrfanger, J. Baumbach and F. Karg on the subject of box-less RTP "Device and method for tempering objects in a treatment chamber", inventories EM2008 0002, (patent granted in EP2291868B1) an alternative RTP procedure is proposed that does not require the use of a moving P-box (process head). This method allows energy savings if the process shoe is not cooled during continuous operation. Only in that case would the heating of a much larger mass than the actual substrate occur when the first heating is completed. The required cooling capacity would also be lower, since only the carrier and the substrate are cooled.

[0005] For example, EP1258043 (selection box) and EP1277238 (chamber structure of selection plant) describe practical designs and improvements of the volume reduction reaction vessel concept and the structure of production equipment based thereon. In EP1258043, a graphite film is described as the energy transmission body, but the independent claims always envisage a transparent body, in particular a glass ceramic. The energy transmission body is therefore an additional layer or film that cannot function as a lid or a base plate of the box.

[0006] Alternatives to the process with process boxes are systems and processes currently or already followed by competitors, which move the substrate on rolls or in a process chamber (chamber or continuous channel). In this case, selenium needs to be injected in gaseous form into a relatively large chamber (with transport rollers) to generate the required selenium vapor pressure. However, it is not yet possible to mass-produce or laboratory-produce CIGS / CIGSSE thin-film semiconductors or thin-film modules based on these methods with similar efficiency. Also, chalcogen consumption is usually very high, since chalcogen is not fundamentally limited to small process volumes. This also increases the problems of deposits and corrosion. Summary of the Invention [Problem to be solved by the invention]

[0007] One of the objectives of the present invention is to provide an energy-saving heat treatment apparatus for metal substrates in corrosive gas to overcome the above-mentioned shortcomings of the prior art, and its core idea is to further develop the existing AVANCIS procedure so that the modified process frame has the advantages of no corrosion of the edge of the substrate during processing, high efficiency and low energy consumption, which can effectively eliminate the situation that the current IG or semiconductor stack cannot be produced on the metal substrate. [Means for solving the problem]

[0008] In order to achieve the above object, the present invention provides an energy-saving heat treatment apparatus for a metal substrate in a corrosive gas, comprising: a process chamber; a radiant field disposed in the process space to provide a heat source to the process space; a process frame installed in the process space to accommodate at least one substrate for rapid thermal processing, the substrate having an outer periphery upper surface covered by the process frame; a cover that covers the process frame so as to isolate a space above the substrate from the process chamber; Including, The process frame, the substrate and the cover define a small process volume that minimizes the amount of process gas introduced and / or spillover exchanged with the process chamber.

[0009] The process frame is a modified structure of a conventional process frame, and covers the outer edge of the substrate to protect the edge from contact with selenium and reduce chalcogen at the contacted edge. Even if chalcogen or hydrocarbon remains in the chamber, the edge of the substrate will not be corroded. Since the process space is minimized, chalcogen in the process chamber is greatly reduced, and therefore the barrier layer on the bottom surface of the substrate can also be greatly thinned.

[0010] In the present scenario, the term "radiation field" refers to the heating space formed by the heating radiation of the energy source in the RTP process. For example, the radiation source, such as a lamp, emits transparent walls, and the object to be processed is placed in the chamber and heated by irradiating it with radiation from the radiation source. Note that a chamber with transparent walls is not necessarily required as long as the system controls the atmosphere in which the object is placed during processing.

[0011] The term "processing space" refers to the space in which the substrate undergoes RTP processing. Specifically, the space is the space of the process frame that covers the substrate in a radiation field.

[0012] As a further improvement of the above proposal, the cover is 1) Located within the radiation field and remaining stationary, or 2) Located on the process frame and integral with the process frame It is configured as follows.

[0013] In the first method of using the cover, the cover and the radiation field are integrated into one structure, in which the cover can be reused and one cover can be used for multiple process frames, which increases the utilization rate and reduces the processing cost.

[0014] In the second use of the cover, the cover and the process frame are of one-piece structure, in which the cooperation effect between the cover and the process frame is better, and each cover corresponds to a separate process frame, so that the processing effect is better.

[0015] As a further improvement to the above proposal, the lower outer edge of the substrate (2) is 1) The process frame covers the bottom edge of the substrate; or 2) The substrate contacts the bottom surface of the radiation field so that the bottom surface of the radiation field covers the bottom surface of the substrate. It is configured as follows.

[0016] These two covering methods of the bottom outer edge correspond to covering by the process frame itself and covering by the bottom surface of the radiation field, which is realized by contacting the substrate with the bottom surface of the radiation field. In the first covering method, the substrate and the process frame are fitted by insertion, so that the fixing between the substrate and the process frame is more solid, and the contact area between the substrate edge and the process frame is relatively large. In the second covering method, the process frame does not have a bottom plate, so that the overall structure of the process frame is more simple.

[0017] As a further improvement of the above proposal, a cover part is located between the two outer edges of the substrate, the coverage area of ​​the cover part is 1mm-50mm, and the cover part is made of a photoelectrically inactive material. From the edge to the inside, the coverage area should be 1mm or more and 50mm or less. 5mm-10mm seems to be the best choice to ensure good sealing of the edges while less space is wasted. Also, in the later process, this area may be used as the contact area of ​​the busbar, and may be separated later.

[0018] As a further improvement to the above proposal, a bottom plate is placed under the substrate, a) the bottom plate supports the substrate and is located at the bottom end of the process frame, forming an integral structure with the process frame; b) the bottom plate supports a substrate and is attached to the bottom surface of the radiation field; The present invention includes two aspects.

[0019] In the first embodiment, the bottom plate and the process frame are of one-piece structure, in which the cooperation effect between the bottom plate and the process frame is better, and each cover corresponds to a separate process frame, and the process effect is better.

[0020] In the second embodiment, the bottom plate and the radiation field are integrated into one structure, in which the bottom plate can be reused and one bottom plate can be used for multiple process frames, which has a high utilization rate and reduces the processing cost.

[0021] As a further improvement to the above scheme, in order to seal the outer edge of the substrate, a seal is arranged inside the outer edge of the substrate, which seals the upper and / or lower surfaces of the outer edge of the substrate.

[0022] As a further improvement of the above proposal, the seal has a larger longitudinal expansion coefficient than the material of the process frame, and a gap is formed by the seal, the process frame and the substrate in a cold state, specifically, when heated, the seal expands more than the process frame and closes the gap, thus contributing to the escape of residual water vapor and oxygen.

[0023] As a further refinement of the above proposal, the seal comprises at least one or a combination of microcrystalline glass, zirconium oxide, and magnesium oxide.

[0024] As a further improvement of the above, a metal wire net is disposed on the lower plate surface of the substrate, substantially parallel to the substrate, the metal wire net being composed of a bar material having a circular or rectangular cross section, the smallest area of ​​the metal wire net being parallel to the foil material, and the substrate is supported by mechanical clamping, thereby reducing the occurrence of permanent bending of the substrate due to elastic deformation at high temperatures.

[0025] As a further improvement of the above proposal, the base plate comprises at least one support bar which may be made of an opaque material, a partially transparent material or a transparent material.

[0026] As a further improvement of the above proposal, the bottom plate is A first transmission plate; A second transmission plate; a spacer that separates the first transmission plate and the second transmission plate and is disposed on an outer circumferential edge portion of the first transmission plate and an outer circumferential edge portion of the second transmission plate; a first spring disposed between a bottom surface of the first transmission plate and the spacer; a second spring disposed between the upper surface of the second transmission plate and the spacer; Including, By using the first spring and the second spring to form an expansion space between the first transmission plate and the spacer and between the second transmission plate and the spacer, it is possible to prevent the first transmission plate or the second transmission plate from cracking due to being compressed in a narrow space after thermal expansion.

[0027] As a further improvement to the above proposal, the first spring is positioned adjacent to an outer circumferential edge of the first transmission plate, and the second spring is positioned adjacent to an outer circumferential edge of the second transmission plate.

[0028] As a further improvement of the above proposal, each of the first spring and the second spring comprises a superalloy, which is non-magnetic, has high strength, excellent formability, excellent corrosion resistance and high fatigue strength, so as to prevent the chalcogen gas from corroding the two springs in the expansion space, while its long service life extends the actual service life of the bottom plate.

[0029] Additionally, the superalloy includes cobalt, chromium, nickel, and molybdenum.

[0030] As a further improvement of the above proposal, the first transmission plate is provided with a plurality of vent holes for allowing gas to pass into the gas storage space.

[0031] As a further improvement to the above proposal, the first spring includes a coil spring contacting a bottom surface of the first transmission plate adjacent to an outer peripheral edge of the first transmission plate, and the second spring includes a coil spring contacting a top surface of the second transmission plate adjacent to an outer peripheral edge of the second transmission plate.

[0032] As a further improvement to the above proposal, the gap is The gap is provided on the upper and / or bottom surface thereof, and includes a hollow body embodied as a metal inner wall and a cavity, and a first filling material is disposed in the cavity so as to close a connection port between the cavity and the gap, and the first filling material contracts with an increase in temperature to open the connection port. In a heated state, the gap and the cavity communicate with each other, and in this state, the hollow body forms a suction cup structure to fix the substrate more firmly, and in combination with a seal, reduces the amount of gas containing chalcogen in the gap.

[0033] In addition, as a further improvement of the above proposal, the first packing has a tapered tip, and the tip of the first packing is located at the connection port. During the contraction process, the tip of the first packing contracts in both the radial and lateral directions, which can make the gas passage communicate more quickly.

[0034] As a further improvement to the above proposal, in order to achieve rapid shrinkage of the first filler at high temperature conditions, the first filler comprises a ceramic fiber material having very good thermal shrinkage properties.

[0035] As a further improvement of the above proposal, the chalcogen filtering member is disposed at the connection port, thereby achieving the purpose of filtering out the chalcogen in the gas entering the cavity, and realizing the primary filtering out of the chalcogen.

[0036] As a further improvement to the above proposal, a desulfurization space for storing desulfurization gas is provided within the cavity, and after the gas is sucked in, desulfurization is performed through the desulfurization space, thereby reducing the chalcogen content of the gas in the gaps and the desulfurization space.

[0037] As a further improvement of the above scheme, the desulfurization gas may be a basic gas, preferably ammonia gas.

[0038] As a further improvement of the above proposal, the position limiting member is disposed between the first filling and the cavity. In this embodiment, the desulfurization space is in a gas releasing state after heating, and the desulfurization gas is allowed to enter the gap. When the gas passages are connected, the desulfurization spaces on both sides form a syringe-like structure under the action of the metal inner wall and the second filling, realizing the pushing action of the desulfurization gas. In this process, the desulfurization gas is injected into the gap, thereby maximizing the gas desulfurization action of the gap.

[0039] As a further improvement of the above proposal, a position restriction space for the linear movement of the first filler is formed between the two inner metal coals, and the desulfurization space is located on the other side of the inner metal wall, which is a member with good thermal conductivity, and can better conduct heat to the first filler during the heating process, while restricting the first filler and the second filler to gradually shrink in a linear direction, thereby better separating the first filler from the connection port.

[0040] As a further improvement of the above solution, the connection port is provided with an inlet section, a reduced diameter section, a throat section and an expanded diameter section in that order in the intake direction, forming a Venturi tube type gas passage that facilitates the flow of gas from the cavity into the gap. By utilizing the advantage of the Venturi tube structure having low resistance to fluid, the flow of gas into the gap is facilitated, and at the same time, clogging is unlikely to occur even after long-term use, thereby extending the life of the process frame.

[0041] As a further improvement of the above solution, the second filler includes a thermally conductive balloon and a thermally expandable fluid, and the fluid is combined with the thermally conductive balloon to form a thermally deformable structure that is easy to expand and contract according to temperature, and the thermally deformable structure has a longer life while the second filler is less likely to be damaged during the thermal deformation process.

[0042] With reference to the following description and drawings, specific embodiments of the invention are disclosed in detail and show how the principles of the invention can be applied. It is to be understood that the embodiments of the invention are not thereby limited in scope, but rather encompass many changes, modifications and equivalents within the spirit and terms of the appended claims. [Brief description of the drawings]

[0043] [Figure 1] FIG. 4 is a structural schematic diagram in which the cover is inserted into the process frame from the left side in the present invention. [Diagram 2] FIG. 2 is a structural schematic diagram of the present invention in which a bottom plate is provided and a cover is inserted into the process frame from the left side. [Diagram 3] FIG. 2 is a structural schematic diagram showing the variables of the vertical translation of the cover without the bottom plate in the present invention. [Figure 4] FIG. 2 is a structural schematic diagram showing the variables of the vertical translation of the cover when the bottom plate is present in the present invention. [Diagram 5] FIG. 2 is a structural schematic diagram of a first design of the process frame in a separated state in the present invention; [Figure 6] FIG. 2 is a structural schematic diagram of the second design of the process frame in the separated state in the present invention. [Figure 7] FIG. 2 is a schematic diagram showing the structure of a gap in the present invention. [Figure 8] FIG. 2 is a structural schematic diagram of a bottom plate according to the present invention. [Figure 9] FIG. 2 is a structural schematic diagram in which the bottom plate in the present invention is a support rod. [Figure 10] FIG. 2 is a structural schematic diagram of an external metal net according to the present invention. [Figure 11] FIG. 1 is an isometric structural schematic diagram of an energy-saving heat treatment apparatus for metal substrates in corrosive gases. [Figure 12] FIG. 12 is an enlarged schematic diagram of the structure at B in FIG. [Figure 13] FIG. 2 is a structural schematic diagram of a bottom plate according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0044] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be described in more detail below with reference to the accompanying drawings and embodiments. However, it should be understood that the specific embodiments described herein are only used to interpret the present invention, and are not used to limit the scope of the present invention.

[0045] It should be noted that when a component is described as being "mounted" or "provided" on another component, it may be located directly on the other component, or there may be intermediate components present. When a component is described as being "connected" or "connected to" another component, it may be directly connected to the other component, or intermediate components may be present at the same time. "Fixed" means fixedly connected, and includes various methods of fixed connection, which are not considered to be within the scope of protection of this specification. The terms "vertical", "horizontal", "left", "right", and similar expressions used in this specification are used for explanatory purposes only and are not meant to be the only embodiment.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by a person skilled in the art of the present invention. The terms used herein are used only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the associated items listed.

[0047] In the present invention, the attached drawings of the specification are described in detail, and one embodiment of the energy-saving heat treatment apparatus for metal substrates in corrosive gas is shown in FIG. 1 and FIG. 2. Based on the frame structure of the conventional process box, in order to realize the additional function of protecting the edge, the substrate 2 (i.e., steel plate or foil material) is inserted into the process frame 1 to protect the edge from selenium. Therefore, the surface and the bottom surface of the substrate 2 must be covered by a part of the process frame 1. Therefore, the process frame 1 forms an open area that is affected by evaporated chalcogenide elements or excess H2S. In the covered area along the edge, only a trace amount of chalcogen (Se, S) or hydrocarbon (H2Se, H2S) acts. By shielding the edge from below in a similar way, even if chalcogen or hydrocarbon remains in the chamber, the edge will not be corroded. Meanwhile, by covering the outer area on the back side of the substrate 2 back with the process frame 1, the ingress of chalcogen from the bottom to the edge of the substrate 2 can be guaranteed. Due to the minimized process volume, the chalcogen concentration in the process chamber is significantly reduced, and therefore the barrier layer on the bottom surface of the substrate 2 can be significantly thinner.

[0048] In the above structure, the lower outer edge of the substrate 2 is 1) The process frame 1 covers the bottom outer edge of the substrate, or Second) The substrate 2 is configured to contact the bottom surface of the radiation field so that the bottom surface of the radiation field covers the lower surface of the substrate 2.

[0049] From the above structure, the minimum substrate 2 processing space is formed by the process frame 1, the cover 3, and the substrate 2, and the cover 3 is disposed on the process frame 1 and combined with the process frame 1 and the substrate 2 to form a gas-blocking space that isolates the gas in the radiation field.

[0050] In the case of a movable process frame, the cover is used as a lid for the process frame, which is inserted into or placed on the process frame (see Fig. 3 and Fig. 4). In the case of a fixed process head, the lid remains on the process frame, and the process frame and the lid are transformed into a process space with a reduced volume by vertical translation. Here, Fig. 3 shows this variable without a bottom plate, and Fig. 4 shows this variable with a bottom plate. For example, Fig. 4 can also show the case where the process frame is placed on the bottom plate.

[0051] More specifically, the cover 3 is 1) Located within the radiation field and remaining stationary, or 2) It is configured to be located on the process frame 1 and to form an integral structure with the process frame 1, and said cover 3 can be inserted into the process frame 1. Alternatively, the cover area must be greater than 1 mm and less than 50 mm from the edge of the process frame 1 to the inside. It is considered that 5 mm to 10 mm is the best choice to ensure good sealing of the edge while reducing space waste. And said area is photoelectrically inactive. For example, in the later process, said area may be the contact area of ​​the bus bar, and may be separated later.

[0052] A bottom plate 4 is disposed below the substrate 2 to support the substrate 2 and prevent the substrate 2 from being corroded by the corrosive gas.

[0053] As for the bottom plate 4, it is further improved based on the structure of the process frame 1, and the process frame 1 itself with the above-mentioned substrate 2 and cover 3 can form the smallest process space, that is, the bottom plate 4 is no longer necessary for chalcogen suppression. The elimination of the bottom plate 4 also has the advantage of greatly reducing the thermal mass. In addition, the asymmetry of heat supply is reduced. However, the prior art of the process frame 1 achieves the heat supply from above only by radiation (radiation of the heat sink and the cover indirectly heated by the heat sink), and the heat transfer from below is partly by thermal conduction through physical contact between the bottom plate 4 and the substrate 2 and partly by heat dissipation. This leads to more complex temporal dynamic changes, which can only be partially compensated for by the different current emission performance at the top and bottom.

[0054] Regarding the bottom plate 4, the present invention also allows two other designs different from the above-mentioned method. That is, the process frame 1 and the bottom plate 4 are separated from each other, and specifically, the following two aspects a) and b) are included.

[0055] a) Referring to Fig. 5, the bottom plate 4 maintains its integrity and further supports the substrate 2. For example, the bottom plate 4 is made of one or more of microcrystalline glass, borosilicate glass, CFK, graphite, and the bottom plate 4 itself provides protection from corrosive gas. In this case, sealing is not required, and the bottom plate 4 is fitted into the process frame 1, or the process frame 1 is mounted on the bottom plate 4. Of course, the bottom plate 4 can be a curved film added into the process frame 1 or reinforced by a supporting part.

[0056] b) Referring to Fig. 6, the bottom plate 4 maintains its integrity and is located within the radiation field. In this structure, the bottom plate 4 can be reused, and one bottom plate 4 can be used for multiple process frames 1, which has a high utilization rate and reduces processing costs.

[0057] Regarding the process frame 1, unlike the situation in the prior art process box where the substrate 2 is always smaller than the box frame, the present invention allows the following way of inserting the substrate 2 into the process frame 1.

[0058] In some examples, referring to Figures 5 and 6, two possible designs of the process frame 1 are shown, which are composed of at least two separable parts. In this case, the process frame 1 is composed of at least two separable parts, the substrate 2 is inserted or placed on the lower frame, and the upper frame protects and covers the edge area of ​​the upper surface of the substrate 2. Of course, other structures, such as inserting from the side, may also be adopted.

[0059] In some examples, the process frame 1 has a bottom plate 4, the substrate 2 is paved on the bottom plate 4, and the process frame 1 is attached to the bottom plate 4, so that the bottom plate 4 and the process frame 1 comprehensively protect and cover the edge area of ​​the substrate 2.

[0060] 8 to 10, the mechanical strength of the process frame 1 and the smooth storage of the substrate 2 during heating are important aspects, the substrate 2 made of glass material may be permanently bent due to elastic deformation at high temperatures, and in the case of metal, it may be plastically deformed (here, dislocations and crystal boundaries) due to thermal stress and mechanical stress (such as its own weight). In the above cases, in some examples, the following improvements can be made to the bottom plate 4.

[0061] It is supported by external rods on the load frame, for which the following possibilities are described:

[0062] The external rods are circular or rectangular cross-section rods whose smallest area is parallel to the foil material.

[0063] The outer rod may be opaque, partially transparent or completely transparent.

[0064] Graphite or carbon fiber reinforced carbon is coated onto a metal rod.

[0065] The glass rod is made of quartz, borosilicate glass or microcrystalline glass.

[0066] The connection is made via adhesive or an adhesive made of a low-conductivity material (such as a ceramic adhesive).

[0067] Of course, it is also possible to mechanically clamp the film as the bottom plate of a process frame to stimulate and support the substrate.

[0068] Stimulation can also be achieved by an external metal wire net (with or without a base plate).

[0069] In this structure, the bottom plate 4 is composed of a number of support bars.

[0070] 7, in order to ensure that the gas barrier space has good sealing even if the process frame 1 is mechanically deformed or thermally expanded, the size of the seal 5 should ensure that the gas barrier space can be kept cool, which makes it easier to extract the remaining water vapor or oxygen gas. When heated, the seal 5 expands more than the process frame 1 and closes the gap 6 between the substrate 2 and the process frame 1.

[0071] Further examples of material combinations for the above construction are given below: Graphite box frame (stretch factor 2x10 -6 K -1 ) or CFK (0.5x10 perpendicular to the fibers -6 K -1 ). Seal 5: Expansion coefficient is 9 x 10 -6 K -1 Microcrystalline glass, 10-13x10 -6 K -1 Zirconium oxide, magnesium oxide. The seal thickness is 5mm, the temperature difference is 400K, and the length difference is about 0.1mm. The steel substrate is also 11-13x10 -6 K -1 Taking into account the expansion coefficient of 0.1 mm, the width of the gap 6 in the cold state can be made slightly larger.

[0072] When the gap 6 is actually used, a portion of the chalcogen gas remains in the gap 6, and it is very difficult to remove the chalcogen gas remaining in the gap 6. In this case, by improving the conventional structure, it is possible to realize automatic removal of the chalcogen gas.

[0073] In some examples, referring to Figs. 11 and 12, a hollow body 7 is opened above or below the gap 6, and the hollow body 7 is composed of a metal inner wall 71 and a cavity 72. The metal inner wall 71 is configured to transmit the radiation field and the temperature of the process frame 1 to the first filler 73 and to function as a desulfurization space 76. The first filler 73, which shrinks as it absorbs the temperature rise of the metal inner wall 71, is disposed at the connection port between the cavity 72 and the gap 6. As the first filler 73 shrinks, a gas passage 74 that communicates with the gap 6 and the cavity 72 is formed.

[0074] According to the present invention, the first packing 73 has a tapered shape, and the tip of the first packing 73 is located at the connection port. During the contraction process, the tip of the first packing 73 contracts in both the radial and lateral directions, which allows the gas passage 74 to communicate more quickly.

[0075] Furthermore, in order to achieve rapid opening of the gas passages 74 under high temperature conditions, the first filler 73 includes a ceramic fiber material having excellent heat shrinkage properties.

[0076] In some embodiments, a chalcogen filtering structure is designed to better filter out the chalcogen in the gas. Preferably, the primary filtering structure uses a chalcogen filtering member, which is configured to filter out the chalcogen on the gas passage 74 and is arranged in the gas passage 74. This achieves the purpose of filtering out the chalcogen in the gas entering the cavity 72, and realizes the primary filtering of the chalcogen. The secondary filtering structure is a desulfurization space 76 that stores desulfurization gas and is arranged between the cavity 72 and the metal inner wall 71, and after the gas is sucked in, the desulfurization gas in the desulfurization space 76 is used to desulfurize, thereby reducing the chalcogen in the gas in the gap 6 and the desulfurization space 76. For example, the desulfurization gas may be a basic gas, preferably ammonia gas.

[0077] In order to better push the gas in the desulfurization space 76 into the gap 6, a piston structure for pushing out the desulfurization gas is formed in the desulfurization space 76 by disposing a second filler 77 that expands with an increase in temperature. In this embodiment, the desulfurization space 76 is in a gas releasing state after heating, and the desulfurization gas enters the gap 6. When the gas passage 74 is connected, the desulfurization spaces 76 on both sides form a structure similar to a syringe under the action of the metal inner wall 71 and the second filler 77, and realize the pushing action of the desulfurization gas. In this process, the gas desulfurization action of the gap 6 is maximized by injecting the desulfurization gas into the gap 6. For example, the second filler 77 includes a thermally conductive balloon and a thermally expandable fluid, and since the thermally expandable fluid is common, the present invention omits the description of the thermally expandable fluid material. A heat-resistant material is used for the thermally conductive balloon. The fluid is combined with the thermally conductive balloon to form a thermally deformable structure that is easily expanded and contracted by temperature. The thermally deformable structure has a longer life, while the second filler 77 is less likely to be damaged during the thermal deformation process. Of course, a thermally expandable solid structure may be used as the second filler, but since thermally expandable solid materials are common, the present invention will not describe it.

[0078] Furthermore, a position restriction space for the linear movement of the first filler 73 is formed between one side of the metal inner wall 71 and the inner wall of the cavity 72, and a desulfurization space 76 is located on the other side of the metal inner wall 71. The metal inner wall 71 is a member with good thermal conductivity, which improves the heat transfer to the first filler 73 during the heating process, while restricting the first filler 73 and the second filler 77 to gradually shrink in the linear direction, thereby improving the detachment of the first filler 73 from the connection port.

[0079] Furthermore, the gas passage 74 is provided with an inlet section, a reduced diameter section, a throat section, and an expanded diameter section in that order in the intake direction, forming a Venturi tube type gas passage 74 that facilitates the flow of gas from the cavity 72 into the gap 6. By utilizing the advantage of the Venturi tube structure having low resistance to fluid, the flow of gas into the gap 6 is facilitated, and at the same time, clogging is unlikely to occur even after long-term use, thereby extending the life of the process frame 1.

[0080] In practical application of the present invention, in order to ensure the mechanical strength of the bottom plate 4, a structure that is difficult to crack when compressed is adopted for the bottom plate 4. In the present invention, the following improvements are made to the bottom plate 4.

[0081] Referring to FIG. 13, the bottom plate 4 includes a first transmission plate 41, a second transmission plate 42, a spacer 43, a first spring 44, and a second spring 45, and in a specific application, the special 43 may be a part of the process frame 1. The spacer 43 is configured to separate the first transmission plate 41 and the second transmission plate 42, and to be installed on the outer periphery of the first transmission plate 41 and the outer periphery of the second transmission plate 42. The first spring 44 is disposed between the bottom surface of the first transmission plate 41 and the spacer 43 to form a first expansion space, and the second spring 45 is disposed between the top surface of the second transmission plate 42 and the spacer 43 to form a second expansion space. Specifically, the first spring 44 is disposed at a position adjacent to the outer periphery of the first transmission plate 41, and the second spring 45 is disposed at a position adjacent to the outer periphery of the second transmission plate 42.

[0082] By using the first spring 44 and the second spring 45 to form an expansion space between the first transmission plate 41 and the spacer 43, and between the second transmission plate 42 and the spacer 43, it is possible to prevent the first transmission plate 41 or the second transmission plate 42 from cracking due to pressure in a narrow space after thermal expansion.

[0083] In a specific embodiment of the present disclosure, each of the first spring 44 and the second spring 45 includes a superalloy. For example, the superalloy includes cobalt, chromium, nickel, and molybdenum. The reason for using a superalloy is that the superalloy is non-magnetic, exhibits high strength, has excellent formability, excellent corrosion resistance, and high fatigue strength, thereby preventing the chalcogen gas from corroding the two springs in the expansion space, and at the same time, its long service life extends the actual service life of the bottom plate 4.

[0084] In some embodiments, the first spring 44 includes a coil spring contacting a bottom surface of the first transmission plate 41 adjacent to the outer peripheral edge of the first transmission plate 41, and the second spring 45 includes a coil spring contacting a top surface of the second transmission plate 42 adjacent to the outer peripheral edge of the second transmission plate 42.

[0085] Furthermore, both the first transmission plate 41 and the second transmission plate 42 are provided with a plurality of ventilation holes 411 for allowing gas to pass through into the gas storage space.

[0086] The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent replacements, or improvements made within the spirit and principle of the present application should be included within the protection scope of the present invention. [Explanation of symbols]

[0087] 1 Process Frame 2. Board 3 Cover 4 Bottom plate 5. Seal 6. Gap 7 Hollow body 11 Containment Space 41 First transmission plate 42 Second transmission plate 43 Spacer 44 First Spring 45 Second Spring 46 Gas storage space 71 Metal inner wall 72 Cavity 73 First filling 74 Gas passage 75 Chalcogen filtration material 76 Desulfurization space 77 Second Filling 411 Ventilation hole

Claims

1. 1. An energy-saving heat treatment apparatus for a metal substrate in a corrosive gas, comprising: A process chamber; a radiation field that forms a heated space by heating radiation from a heat source in a process space in the process chamber; a process frame having an opening area that opens to the process chamber, the process frame being installed in the process space in the process chamber to accommodate at least one substrate in the process space and perform a rapid thermal processing process, the process frame covering an upper surface of an outer edge of the substrate; a cover that covers an upper portion of the process frame so as to isolate a space above the substrate from the process chamber; Including, The process frame, the substrate and the cover define a process space having a small process volume, which minimizes the amount of introduction and / or spillage of process gas exchanged with the process chamber.

2. An energy-saving heat treatment apparatus for a metal substrate in a corrosive gas, comprising:

2. The cover is 1) located within the process chamber and remaining stationary; or 2) A member that is positioned on the process frame and that is integral with the process frame.

2. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 1, characterized in that:

3. 1) the process frame covers the outer edge of the lower surface of the substrate; 2) The lower surface of the substrate is in communication with an opening area of ​​the process frame.

3. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 2, characterized in that:

4. A cover is disposed on the inner periphery of one end of the process frame, and is disposed at a position spaced apart from the cover so as to face the substrate, both ends of which are supported on the inner periphery of the process frame, the coverage range of the cover being 1 mm to 50 mm, and the cover being made of a photoelectrically inactive material.

4. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 3.

5. The method of disposing a bottom plate under the substrate in the process frame so as to close an opening area of ​​the process frame, a) the bottom plate supports the substrate and is located at a bottom end of the process frame, forming an integral structure with the process frame; b) the bottom plate supports the substrate and is attached to the process frame; 5. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 4, characterized in that the apparatus includes one of the following two aspects.

6. 6. An energy-saving heat treatment apparatus for metal substrates in corrosive gas as described in claim 5, characterized in that a seal is arranged in the gap between the outer edge of the substrate and the process frame to seal the upper and / or lower surfaces of the outer edge of the substrate.

7. 7. The energy-saving heat treatment apparatus for metal substrates in corrosive gases according to claim 6, wherein the seal has a larger longitudinal expansion coefficient than the material of the process frame, and a gap is formed by the seal, the process frame and the substrate in a cold state.

8. The seal includes at least one or a combination of microcrystalline glass, zirconium oxide, and magnesium oxide.

8. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 7.

9. The bottom plate is A first transmission plate; a second transmission plate disposed above the upper surface of the first transmission plate in opposition to the upper surface of the first transmission plate; a spacer having an inner periphery on which an outer periphery of the first transmission plate and an outer periphery of the second transmission plate are supported so as to separate the first transmission plate and the second transmission plate; a first spring disposed on an inner periphery of the spacer adjacent to a lower surface of the first transmission plate; a second spring disposed on an inner periphery of the spacer adjacent to an upper surface of the second transmission plate; The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 8, further comprising:

10. The first spring is disposed adjacent to an outer circumferential edge of the first transmission plate, and the second spring is disposed adjacent to an outer circumferential edge of the second transmission plate. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 9 .

11. Each of the first spring and the second spring comprises a superalloy. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 10 .

12. The superalloy contains any one of the elements of the group consisting of cobalt, chromium, nickel, and molybdenum. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 11 .

13. The first transmission plate has a plurality of vent holes for allowing gas to pass through. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 12 .

14. The first spring includes a coil spring that contacts a bottom surface of the first transmission plate adjacent to an outer peripheral edge of the first transmission plate, and the second spring includes a coil spring that contacts a top surface of the second transmission plate adjacent to an outer peripheral edge of the second transmission plate. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 12 .

15. The gap between the outer edge of the substrate and the process frame is An internal space defined by a metal wall disposed within a cavity inside the process frame is filled, i.e., occupied, through a connection port; A first filler is disposed adjacent to the metal inner wall in the cavity so as to close the connection port, and the first filler contracts as the temperature of the metal inner wall increases, opening the connection port and forming a gas passage. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 14.

16. The first filler has a tapered tip, and the tip of the first filler is located at the connection port. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 15.

17. The first filler comprises a ceramic fiber material. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 16 .

18. A chalcogen filtering member for removing gaseous chalcogen remaining in the gap is disposed in the connection port. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 17.

19. A desulfurization space for storing desulfurized gas is provided within the cavity. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 18.

20. The desulfurized gas contains a basic gas. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 19.

21. A position limiting space for regulating the moving direction of the first filling material is formed between one surface of the metal inner wall forming a part of the desulfurization space and the inner wall of the cavity. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 20.

22. A second filler is disposed in the desulfurization space, and the second filler expands with an increase in temperature in the cavity, thereby forming a piston structure in the desulfurization space that pushes the desulfurized gas in the desulfurization space to the gas passage. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 21 .

23. The connection port is provided with an inlet portion, a reduced diameter portion, a throat portion, and an expanded diameter portion in that order in the intake direction, forming a Venturi-type gas passage that facilitates the flow of gas from the cavity to the gap. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 22.

24. The second filling includes a thermally conductive balloon and a thermally expandable fluid.

24. The energy-saving heat treatment apparatus for a metal substrate in a corrosive gas according to claim 22 or 23.

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