Cooling structure for mobile computing device

Abstract

To provide a cooling structure for a computing device that improves maintainability while maintaining the cooling efficiency of the device.SOLUTION: A box-shaped enclosure 20, a pair of mounting boards 40, 50 disposed in the enclosure 20 and on which electrical elements 10 are mounted, a cooling body 30 fixed to the enclosure 20 and having a flow path 32 through which a cooling medium is flowed, are provided. The cooling body 30 is disposed so as to divide the interior of the enclosure 20 into two chambers. The mounting boards 40 and 50 are placed one by one in each of the two chambers in thermal connection with the cooling body 30, and are removably attached to the enclosure 20.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The technology disclosed herein belongs to the technical field relating to a cooling structure for a mobile computing device. [Background technology]

[0002] In recent years, almost all actuators installed in moving objects such as automobiles and railway vehicles have become electronically controlled. The arithmetic device for performing the electronic control is composed of, for example, semiconductor elements. Such electronic elements are generally sensitive to heat and therefore need to be appropriately cooled. In the field of computers, cooling structures for arithmetic devices having electronic elements have been proposed.

[0003] For example, Patent Document 1 discloses a cooling structure having a pair of electronic cards (mounting boards) on which electronic components are mounted and an autonomous liquid cooling device (cooling body), in which the autonomous liquid cooling device is sandwiched between the pair of electronic cards to form a sandwich structure, and the sandwich structure is housed within a housing. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2017-502382 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when an electronic component on a mounting board breaks down or when a wiring provided on the mounting board breaks down, it is necessary to remove the mounting board from the housing to perform repairs. In addition, when replacing electronic components, it is also necessary to remove the mounting board from the housing. In the cooling structure described in Patent Document 1, a pair of mounting boards sandwich a cooling body to form a sandwich structure as one unit, so when removing the mounting boards from the housing, it is necessary to remove the sandwich structure from the housing. Therefore, even if one of the pair of mounting boards breaks down, it is necessary to remove the other mounting board that is not broken and the cooling body from the housing together.

[0006] When removing the cooling body from the housing, there is a risk that the cooling liquid will adhere to the mounting board. If the cooling liquid adheres to the mounting board, it may cause a short circuit and lead to a failure. This may lead to the failure of the other mounting board that is not broken. In addition, if the cooling liquid adheres to the mounting board when replacing an integrated circuit as an electronic component for updating, and the electronic circuit of the mounting board breaks down, it will be necessary to carry out unnecessary repairs, resulting in unnecessary work.

[0007] The technology disclosed herein has been made in consideration of these points, and its purpose is to provide a cooling structure for a computing device that improves maintainability while maintaining the cooling efficiency of the computing device. [Means for solving the problem]

[0008] In order to solve the above problems, the technology disclosed herein is directed to a cooling structure for a computing device for a mobile body, and comprises a box-shaped housing, a pair of mounting boards arranged within the housing and having heat-generating elements mounted thereon, and a cooling body fixed to the housing and having a circulation path through which a cooling medium circulates, the cooling body being arranged so as to divide the inside of the housing into two chambers, the mounting boards being arranged in each of the two chambers while being thermally connected to the cooling body, and each of the mounting boards being removably attached to the housing.

[0009] According to this configuration, the mounting board and the housing are detachable. The cooling body is fixed to the housing. Therefore, the mounting board can be removed from the housing without removing the cooling body from the housing. Since each mounting board is arranged in a room divided by the cooling body, each mounting board can be cooled by the cooling body independently of each other. Therefore, it is possible to improve maintainability while maintaining the cooling efficiency of the computing device.

[0010] In the cooling structure for a mobile body computing device, the housing has a rectangular box-like appearance, the pair of mounting boards each have a first connector connected to a power line, the circulation path has a second connector connected to a circulation passage through which the cooling medium circulates, and each of the first connectors protrudes to the outside of the housing through a first hole provided in a first wall portion of the housing, and the second connector protrudes to the outside of the housing through a second hole provided in a second wall portion of the housing that is different from the first wall portion.

[0011] According to this configuration, when the mounting board is removed from the housing, the first connector is less likely to interfere with the second connector. Also, it is possible to prevent the cooling medium from entering the housing through the first hole. This makes it possible to reduce as much as possible the possibility of the mounting board being damaged due to the cooling medium adhering to the mounting board. This makes it possible to further improve the maintainability of the arithmetic device.

[0012] In the cooling structure for the mobile body computing device, each of the mounting boards may be a double-sided mounting type board on which the heat generating elements can be mounted on both a first mounting surface facing the cooling body and a second mounting surface facing the first mounting surface and located on the opposite side of the cooling body, and the heat generating elements may include a first heat generating element having a relatively large amount of heat generation and a second heat generating element having a relatively small amount of heat generation, and the first heat generating elements may be mounted on the first mounting surface and the second heat generating elements may be mounted on the second mounting surface.

[0013] In other words, the greater the amount of heat generated by an element, the more aggressively it is necessary to cool it. With the above-described configuration, since the first heat generating element, which generates a relatively large amount of heat, is located on the cooling body side, the first heat generating element can be aggressively cooled, and the cooling efficiency of the computing device can be improved.

[0014] In the cooling structure for the mobile body computing device, the housing may have a first board side member to which one of the pair of mounting boards is attached, a second board side member to which the other of the pair of mounting boards is attached, and a cooling body fixing member to which the cooling body is fixed, and the first board side member, the second board side member, and the cooling body fixing member may be configured to be separable from one another.

[0015] According to this configuration, for example, when only one of the pair of mounting boards fails, only that mounting board can be separated together with the first board side member, thereby reducing the risk of a new failure and further improving the maintainability of the computing device. Effect of the Invention

[0016] As described above, according to the technology disclosed herein, each of the pair of mounting boards can be separated from the cooling body and removed from the housing, thereby improving maintainability while maintaining the cooling efficiency of the computing device. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a schematic diagram illustrating an automobile equipped with a computing device having a cooling structure according to an exemplary embodiment; [Diagram 2] FIG. [Diagram 3] FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] 4 is a cross-sectional view taken along line VV in FIG. 3. [Figure 6]2 is a plan view of the upper member seen from the cooling body side inside the housing. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Exemplary embodiments will now be described in detail with reference to the drawings.

[0019] FIG. 1 shows an automobile 1 equipped with a computing device according to this embodiment. The automobile 1 is a FF or FR automobile in which a drive unit (engine or motor) (not shown) is mounted on the front side of the vehicle. The automobile 1 is equipped with a computing device 100. The computing device 100 is computer hardware, specifically, including a processor having a CPU, a memory in which a plurality of modules are stored, and the like. The computing device 100 is equipped with a plurality of electric elements 10 (see FIG. 3, etc.) constituting a module. The plurality of electric elements 10 include a specific integrated circuit 11 in which a program for enabling automatic driving of the automobile 1 is recorded. The specific integrated circuit 11 for automatic driving may be equipped with artificial intelligence (AI). The electric element 10 is an example of a heat generating element.

[0020] The automobile 1 has a battery 4 that stores power to be supplied to the arithmetic device 100. The battery 4 is electrically connected to the arithmetic device 100 by a power supply line 5.

[0021] The automobile 1 is provided with a water pump 2 for supplying cooling water to devices mounted on the automobile 1. The water pump 2 is, for example, a water pump that supplies cooling water to the drive device. The water pump 2 is connected to a cooling body 30 (see FIG. 3, etc.) of the arithmetic device 100 via a water flow pipe 3. In other words, the arithmetic device 100 is cooled by the cooling water supplied from the water pump 2. The cooling structure of the arithmetic device 100 will be described later.

[0022] 2 to 5 show a schematic diagram of the hardware configuration of the arithmetic device 100. In the following description, up, down, right, left, front, and rear will follow the arrows shown in Fig. 2. These do not limit the directions when the arithmetic device 100 is actually mounted on the automobile 1.

[0023] As shown in FIG. 2 and FIG. 3, the arithmetic device 100 has a housing 20. The housing 20 is an aluminum box having a rectangular parallelepiped shape. The housing 20 is composed of a plurality of members (three members in this example). The housing 20 has a member (hereinafter referred to as an upper member 21) having a bottomed rectangular cylindrical shape and located relatively on the upper side, a member (hereinafter referred to as a lower member 22) having a bottomed rectangular cylindrical shape and located relatively on the lower side, and a support plate 23 sandwiched between the upper member 21 and the lower member 22 and supporting the cooling body 30. The upper member 21, the lower member 22, and the support plate 23 are configured to be separable from one another. The upper member 21 and the lower member 22 are fixed to one another by a fastening member 24. Specifically, an upper flange 21a is formed on the lower edge of the upper member 21, while a lower flange 22a is formed on the upper edge of the lower member 22, and the upper flange 21a and the lower flange 22a are stacked one on top of the other and fixed to each other by fastening member 24.

[0024] In the right side wall 20a of the housing 20, the upper member 21 has an upper recess 21b recessed toward the upper side, while the lower member 22 has a lower recess 22b recessed toward the lower side. As shown in FIG. 2, FIG. 3, and FIG. 5, the support plate 23 fits into the upper recess 21b and the lower recess 22b. As shown in FIG. 5, an engagement groove 23a is formed on the periphery of each of the upper recess 21b and the lower recess 22b. The protrusion 23b provided on the entire periphery of the support plate 23 fits into the engagement groove 23a, so that the support plate 23 does not come off the upper member 21 and the lower member 22 in a state in which the upper member 21 and the lower member 22 are fixed. As a result, the support plate 23 forms a part of the right side wall 20a of the housing 20. The right side wall 20a corresponds to the second wall of the housing 20.

[0025] In the front wall 20b of the housing 20, the upper member 21 and the lower member 22 have rectangular upper and lower holes 21c and 22c, respectively. The upper and lower holes 21c and 22c are holes through which a power connector 60 (described later) is inserted to be connected to the power line 5. The front wall 20b corresponds to a first wall of the housing 20.

[0026] 4 and 5, a groove is provided in a portion of the lower edge of the upper member 21 excluding the upper recess 21b, and in a portion of the upper edge of the lower member 22 excluding the lower recess 22b. A waterproof seal 25 is disposed in this groove.

[0027] The support plate 23 has a plurality of through holes. Specifically, the support plate 23 has two large diameter holes 23c with a relatively large diameter and three small diameter holes 23d with a relatively small diameter. The large diameter holes 23c and the small diameter holes 23d are arranged alternately in the longitudinal direction of the support plate 23. The two large diameter holes 23c are holes through which a water channel connector 34 of the cooling body 30, which will be described later, is inserted. The three small diameter holes 23d are holes through which bolts 26 for attaching the cooling body 30 to the support plate 23 pass.

[0028] As shown in Figures 3 to 5, the interior of the housing 20 contains a pair of mounting boards consisting of an upper mounting board 40 and a lower mounting board 50, each of which has a plurality of electrical elements 10 mounted thereon, and a cooling body 30 arranged so as to be sandwiched vertically between the upper and lower mounting boards 40, 50.

[0029] The cooling body 30 has a block-shaped main body 31 made of an aluminum alloy. The main body 31 is arranged in the vertical center inside the housing 20 so as to extend in the front-rear and left-right directions. As a result, the cooling body 30 is arranged so as to divide the inside of the housing 20 into two chambers, one above the other. The cooling body 30 has a circulation path 32 through which the cooling water flows. The circulation path 32 has a U-shaped internal path 33 formed inside the cooling body 30, and two water channel connectors 34 that are respectively connected to two openings of the internal path 33 and connected to the water pipe 3. One of the two water channel connectors 34 is an inlet for the cooling water, and the other is an outlet for the cooling water after it has flowed through the internal path 33.

[0030] 5, each water channel connector 34 is formed of a long, thin metal tube. One end of the water channel connector 34 is inserted into the internal passage 33. Each water channel connector 34 is joined to the main body 31 by brazing.

[0031] The cooling body 30 is fixed to the support plate 23 with the bolts 26 after each water channel connector 34 is inserted into the large diameter hole 23c. In this way, the cooling body 30 is fixed and supported on the housing 20. For this reason, the support plate 23 corresponds to a cooling body fixing member.

[0032] As shown in FIG. 4, the upper mounting board 40 is disposed in the upper chamber of the two chambers divided by the cooling body 30. The upper mounting board 40 has a plurality of electric elements 10 including a specific integrated circuit 11 mounted thereon. The upper mounting board 40 has a first upper mounting surface 41 facing the cooling body 30 and a second upper mounting surface 42 facing the first upper mounting surface 41 and positioned on the opposite side to the cooling body 30. In other words, the upper mounting board 40 is a double-sided mounting board. The first upper mounting surface 41 is a mounting surface on which the specific integrated circuit 11 is mounted. The second upper mounting surface 42 is a mounting surface on which electric elements other than the specific integrated circuit 11 among the electric elements 10, specifically, low heat generating elements (such as capacitors) that generate less heat per unit time than the specific integrated circuit 11, are mounted. The specific integrated circuit 11 corresponds to the first heat generating element, and the low heat generating element corresponds to the second heat generating element.

[0033] 4 to 6, on the first upper mounting surface 41, each specific integrated circuit 11 is disposed at a position corresponding to the internal path 33 of the cooling body 30. That is, each specific integrated circuit 11 is disposed along the internal path 33. Each specific integrated circuit 11 is thermally connected to the cooling body 30 via a heat transfer sheet 12.

[0034] The wiring 61 of the power connector 60 is mounted on the second upper mounting surface 42. The power connector 60 has a power terminal 62 that is actually connected to the power line 5. The power terminal 62 has a housing 63. The housing 63 is a box-shaped rectangular parallelepiped and has a flange 63a in the middle in the short direction. As shown in FIG. 4, the flange 63a has a cross-sectional area larger than that of the upper hole 21c. As a result, only the part of the power terminal 62 that is located on the opposite side of the wiring 61 with respect to the flange 63a is inserted into the upper hole 21c. The housing 63 has mounting parts 64 for mounting and fixing the power terminal 62 to the upper mounting board 40 at both ends in the longitudinal direction. Each mounting part 64 is attached to the upper mounting board 40 by a bolt (not shown), so that the power terminal 62 is fixed to the upper mounting board 40. As a result, the upper mounting board 40 is a unit body including the power connector 60.

[0035] As shown in FIG. 6, the upper mounting board 40 is detachably attached to the upper member 21 of the housing 20 by the bolts 43. Specifically, inside the upper member 21, bosses 21d are provided at the four corners, and through holes 44 (see FIG. 3) penetrating in the thickness direction (here, the vertical direction) are provided at the four corners of the upper mounting board 40. With the holes of the bosses 21d and the through holes 44 communicating with each other in the vertical direction, the bolts 43 are fastened to the bosses 21d through the through holes 44, whereby the upper mounting board 40 is attached to the upper member 21. The fixing position of the upper mounting board 40 and the upper member 21 is a position that does not overlap with the cooling body 30 when viewed from the axial direction of the bolts 43 (here, the vertical direction). The upper member 21 corresponds to the first board-side member to which the upper mounting board 40 is attached among the mounting boards 40 and 50.

[0036] As shown in FIG. 4, the lower mounting board 50 has a structure that is basically symmetrical to the upper mounting board 40, except that the electric elements 10 arranged thereon are slightly different from those of the upper mounting board 40. Specifically, the lower mounting board 50 is disposed in the lower chamber of the two chambers divided by the cooling body 30. The lower mounting board 50 has a first lower mounting surface 51 facing the cooling body 30 and a second lower mounting surface 52 facing the first lower mounting surface 51 and positioned on the opposite side to the cooling body 30. In other words, the lower mounting board 50 is also a double-sided mounting type mounting board. The first lower mounting surface 51 is a mounting surface on which the specific integrated circuit 11 is mounted. The second lower mounting surface 52 is a mounting surface on which electric elements other than the specific integrated circuit 11 among the electric elements 10, specifically, low heat generating elements (such as capacitors) that generate less heat per unit time than the specific integrated circuit 11, are mounted.

[0037] On the first lower mounting surface 51, each specific integrated circuit 11 is also disposed at a position corresponding to the internal path 33 of the cooling body 30. Each specific integrated circuit 11 is thermally connected to the cooling body 30 via a heat transfer sheet 12.

[0038] Wiring 61 of a power connector 60 is mounted on the second lower mounting surface 52. The configuration of the power connector 60 is the same as that of the power connector 60 that is attached and fixed to the upper mounting board 40, so a detailed description will be omitted. The power terminals 62 of the lower power connector 60 also have mounting portions 64 on both longitudinal end portions of a housing 63, and the mounting portions 64 are attached to the lower mounting board 50 by bolts (not shown), thereby fixing the power terminals 62 to the lower mounting board 50.

[0039] As shown in FIG. 3, the lower mounting board 50 is removably attached to the lower member 22 of the housing 20 by bolts 53. Specifically, inside the lower member 22, boss parts 22d (only one is shown in FIG. 3) are provided at the four corners, and through holes 54 (see FIG. 3) penetrating in the thickness direction (here, vertical direction) are provided at the four corners of the lower mounting board 50. In a state where the holes of the boss parts 22d and the through holes 54 are in vertical communication with each other, the bolts 53 are fastened to the boss parts 22d through the through holes 54, whereby the lower mounting board 50 is attached to the lower member 22. The fixing position of the lower mounting board 50 and the lower member 22 is also at a position that does not overlap with the cooling body 30 when viewed from the axial direction of the bolts 53 (here, vertical direction). The lower member 22 corresponds to the second board side member to which the lower mounting board 50 is attached among the mounting boards 40 and 50.

[0040] 3 and 5, the first upper mounting surface 41 of the upper mounting board 40 and the first lower mounting surface 51 of the lower mounting board 50 are connected by an electrically conductive connector 13. This electrically conductive connector 13 electrically connects the specific integrated circuit 11 mounted on the first upper mounting surface 41 and the specific integrated circuit 11 mounted on the first lower mounting surface 51. This enables communication between the upper specific integrated circuit 11 and the lower specific integrated circuit 11.

[0041] Here, when the electric element 10 of each mounting board 40, 50 breaks down or the wiring provided on each mounting board 40, 50 breaks down, it is necessary to remove the broken mounting board from the housing 20 and repair it. In addition, when replacing the electric element 10, it is also necessary to remove the target mounting board from the housing 20. In particular, when the specific integrated circuit 11 is equipped with AI, it may be necessary to replace the specific integrated circuit 11 itself in order to update the AI. Conventionally, when each mounting board 40, 50 is removed from the housing 20, it is necessary to remove the cooling body 30 together. Therefore, when removing the cooling body 30 from the housing 20, cooling water may adhere to each mounting board 40, 50, which may cause a new failure such as a short circuit.

[0042] In contrast, according to the present embodiment, the mounting boards 40, 50 are detachable from the housing 20. Furthermore, the cooling body 30 is fixed to the support plate 23. Therefore, the mounting boards 40, 50 can be taken out of the housing 20 without removing the cooling body 30 from the housing 20. This reduces the risk of new failures occurring, and improves the maintainability of the arithmetic device 100.

[0043] In particular, in this embodiment, the power connector 60 is attached and fixed to each of the mounting boards 40 and 50, and each mounting board 40 and 50 is a unit including the power connector 60. This makes it very easy to replace all the circuits on each board for a hardware update.

[0044] In this embodiment, each power connector 60 protrudes to the outside of the housing 20 through the upper hole 21c or the lower hole 22c provided in the front wall 20b of the housing 20, and the water channel connector 34 protrudes to the outside of the housing 20 through the large diameter hole 23c provided in the right side wall 20a of the housing 20. When each mounting board 40, 50 is removed from the housing 20, the power connector 60 is less likely to interfere with the water channel connector 34. In addition, it is possible to prevent the cooling water from entering the housing 20 through the upper hole 21c or the lower hole 22c. Therefore, it is possible to reduce the possibility that the cooling water adheres to each mounting board 40, 50 and causes the mounting board 40, 50 to break down as much as possible.

[0045] In this embodiment, the housing 20 has an upper member 21 to which the upper mounting board 40 is attached, a lower member 22 to which the lower mounting board 50 is attached, and a support plate 23 to which the cooling body 30 is fixed, and the upper member 21, the lower member 22, and the support plate 23 are configured to be separable from each other. As a result, for example, when only the upper mounting board 40 breaks down, the upper mounting board 40 can be separated from the support plate 23 to which the cooling body 30 is fixed, and the upper mounting board 40 can be separated from the upper member 21. This reduces the risk of a new breakdown and makes it easy to repair the breakdown. As a result, the maintainability of the arithmetic device 100 can be further improved.

[0046] In this embodiment, the mounting boards 40, 50 are arranged in rooms separated by the cooling body 30, so that the mounting boards 40, 50 can be cooled independently by the cooling body 30. This allows the cooling efficiency of the arithmetic device 100 to be maintained at a high level.

[0047] Particularly, in this embodiment, the specific integrated circuit 11 is mounted on the mounting surface (first upper mounting surface 41 and first lower mounting surface 51) on the cooling body 30 side of each mounting board 40, 50. That is, since the specific integrated circuit 11 is an integrated circuit for performing calculations related to the automatic driving of the automobile 1, it performs a huge amount of calculation processing. For this reason, each specific integrated circuit 11 generates a large amount of heat compared to other electric elements 10, and needs to be actively cooled. Therefore, the specific integrated circuit 11 is mounted on the mounting surface on the cooling body 30 side and thermally connected to the cooling body 30 via the heat transfer sheet 12, and the other electric elements 10 are mounted on the mounting surface (second upper mounting surface 42 and second lower mounting surface 52) on the opposite side to the cooling body 30, so that the specific integrated circuit 11 can be actively cooled. This can increase the cooling efficiency of the arithmetic device 100.

[0048] Furthermore, in this embodiment, each specific integrated circuit 11 is disposed along the internal path 33 at a position corresponding to the internal path 33 of the cooling body 30. This allows each specific integrated circuit 11 to be cooled more actively. As a result, the cooling efficiency of the arithmetic device 100 can be improved.

[0049] The technology disclosed herein is not limited to the above-described embodiment, and may be substituted without departing from the spirit and scope of the claims.

[0050] For example, in the above-described embodiment, the internal path 33 of the cooling body 30 is U-shaped. However, the internal path 33 may have a shape that meanders through the entire cooling body 30. In this case, it is preferable to arrange the specific integrated circuit 11 so as to follow the meandering shape of the internal path 33.

[0051] In the above embodiment, the water pump 2 that supplies the cooling water to the drive device is used to circulate the cooling water through the circulation path 32. However, the present invention is not limited to this, and a dedicated water pump that circulates the cooling water that cools the arithmetic device 100 may be provided.

[0052] In the above-described embodiment, the upper and lower mounting boards 40, 50 are attached to the upper member 21 and the lower member 22 by the bolts 43, 53, respectively. However, this is not limiting, and any structure may be adopted as long as the mounting boards can be removably attached to the housing. For example, the mounting boards may be attached to the housing by providing claws on the housing and engaging the four corners of the mounting board with the claws.

[0053] The above-described embodiments are merely illustrative and should not be construed as limiting the scope of the present disclosure. The scope of the present disclosure is defined by the claims, and all modifications and variations within the scope of the claims are within the scope of the present disclosure. [Industrial Applicability]

[0054] The technology disclosed herein is useful in improving the maintainability of a cooling structure for a computing device for a mobile body while maintaining the cooling efficiency of the computing device. [Explanation of symbols]

[0055] 1. Automobiles (mobiles) 3 Water pipe (flow path) 5 Power Lines 10 Electrical element (heating element) 11 Specific integrated circuit (first heating element) 20. Cabinet 20a Right side wall (second wall) 20b Front wall (1st wall) 21 Upper member (first substrate side member) 22 Lower member (second board side member) 23 Support plate (cooling body fixing member) 30 Cooling body 32 Distribution Channels 34 Waterway connector (second connector) 40 Upper mounting board 41 First upper mounting surface (first mounting surface) 42 Second upper mounting surface (second mounting surface) 50 Lower mounting board 51 First lower mounting surface (first mounting surface) 52 Second lower mounting surface (second mounting surface) 60 Power connector (first connector) 100 Computing equipment

Claims

1. A cooling structure for a mobile computing device, comprising: A box-shaped housing; a pair of mounting boards housed in the housing and having heat generating elements mounted thereon; a cooling body that is fixed to the housing and accommodated within the housing, the cooling body having a flow path through which cooling water flows; The cooling body is arranged so as to divide the inside of the housing into two chambers, the mounting boards are disposed in the two chambers one by one in a state of being thermally connected to the cooling body, and are attached to the housing so as to be removable from the housing and separable from the cooling body, The housing includes: a first substrate side member to which one of the pair of mounting substrates is attached; and a second substrate side member to which the other of the pair of mounting substrates is attached; a cooling body fixing member to which the cooling body is fixed; having 13. A cooling structure for a mobile computing device, comprising: said first substrate side member, said second substrate side member, and said cooling body fixing member configured to be separable from one another.

2. The cooling structure for a mobile computing device according to claim 1, The housing has a rectangular box-like appearance, The pair of mounting boards each have a first connector connected to a power supply line, the flow path has a second connector connected to a flow passage through which the cooling water flows, each of the first connectors protrudes to the outside of the housing through a first hole provided in a first wall of the housing; A cooling structure for a mobile computing device, characterized in that the second connector protrudes to the outside of the housing through a second hole provided in a second wall portion different from the first wall portion of the housing.

3. 3. The cooling structure for a mobile computing device according to claim 1, each of the mounting substrates is a double-sided mounting substrate on which the heat generating elements can be mounted on both a first mounting surface facing the cooling body and a second mounting surface facing the first mounting surface and positioned on the opposite side to the cooling body; The heat generating element includes a first heat generating element having a relatively large heat generation amount and a second heat generating element having a relatively small heat generation amount, the first heat generating elements are mounted on the first mounting surface, 4. A cooling structure for a mobile computing device, comprising: a heat generating element for heating a heat generating portion of a heat generating member;

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