Immersion cooling device and immersion cooling system

Abstract

An embodiment of the present disclosure relates to an immersion cooling apparatus and an immersion cooling system, comprising: a cabinet including a cooling groove and a mounting groove integrated in an outer wall of the cooling groove, the cooling groove being used to accommodate an electronic device to be cooled and a first cooling liquid, the mounting groove being used to accommodate the first cooling liquid, and the cooling groove and the mounting groove being in fluid communication with each other via a through hole; and a heat exchange module suitable for being inserted into the mounting groove, the heat exchange module including a cooling liquid circulation line, a heat exchanger, and a cooling liquid driving device, the cooling liquid circulation line and the heat exchanger being in fluid communication with each other to provide a second cooling liquid to the heat exchanger, the heat exchanger being used to utilize the second cooling liquid therein to cool the first cooling liquid thereoutside, and the cooling liquid driving device being used to provide the first cooling liquid between the mounting groove and the cooling groove.

Description

[Technical field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority to a Chinese patent application filed with the State Intellectual Property Office of China on December 22, 2021, bearing application number 202111582976.0 and entitled "Immersion Cooling Apparatus and Immersion Cooling System," the entire contents of which are incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate generally to the field of electronics cooling technology, and more specifically to immersion cooling devices and immersion cooling systems including immersion cooling devices. [Background technology]

[0003] As next-generation information and communication technologies such as 5G, cloud computing, big data, and artificial intelligence converge and develop with the real economy, data centers are gradually expanding from providing services to a select few companies to providing services to the entire society, becoming a new infrastructure.

[0004] This new infrastructure places higher demands on the cooling solutions and overall energy efficiency of cooling centers. On the one hand, with the advent of the big data era, data is growing at an unimaginable rate, and the processing, storage and transmission of large-scale data requires the power consumption of IT equipment to double, which poses a huge challenge to chip cooling. Traditional cooling solutions are already struggling to meet the demand for efficient cooling of electronic information devices. At the same time, national, local and industrial energy policies are being launched one after another, which places higher demands on the energy conservation indicators of data centers.

[0005] Traditional data center machine rooms generally adopt room-level air conditioners and cooling methods that blow air from under the floor. This method has low construction costs, high utilization rate of machine rooms, and is used to solve the heat generation of a single cabinet of 3 to 5 kW. However, with the mass application of rack-type and blade-type servers in machine rooms, the number of equipment in a single cabinet, power density, and heat generation density have all increased significantly. Traditional machine room-level air conditioners have already become unable to solve the cooling problem of IT equipment, and row-level air conditioners and rear panel air conditioners have appeared. These new air conditioners have terminals closer to the heat source, solving the problems of localized hot spots and high heat generation density, and can reduce the power consumption of fans and achieve energy saving through short-distance cold transmission. Whether it is a room-level air conditioner, row-level air conditioner, or rear panel air conditioner, it first cools the air, and then exchanges heat between the cold air and the server's CPU to lower the temperature. Because the heat exchange efficiency and heat flow density of the air are very low, air-cooled servers have problems such as high cooling energy consumption, high noise, and low equipment density.

[0006] In order to solve the cooling problems of IT equipment with very high power density, data centers have begun to adopt immersion cooling technology, using working fluid as an intermediate medium for heat transmission to transfer heat away from the heat source and then cool it. The cooling efficiency of immersion cooling technology is significantly higher than that of air cooling, which can effectively solve the cooling problems of high-density servers, reduce the energy consumption of the cooling system, and reduce noise.

[0007] In data centers currently using immersion cooling solutions, the conventional immersion cooling system is generally configured with one or more sets of coolant distribution units (CDUs) in a large cabinet (typically about 3 meters long). The coolant distribution units are installed on both the left and right sides of the cabinet. The inventors of the present application have discovered that such conventional immersion cooling systems have various problems.

[0008] First, the cabinet size of the traditional immersion cooling system is large, which makes operation and maintenance difficult. When performing maintenance, the operator can only stand in front of the cabinet, and cannot stand on either side of the cabinet, which makes operation difficult. For example, in the traditional immersion cooling industry, the system applied to the immersion cooling of servers basically adopts a horizontal cabinet with a length of about 2-3 meters, which brings many difficulties in implementation, operation and maintenance.

[0009] Secondly, any conventional immersion cooling system needs to be equipped with one or more sets of coolant distribution units, making the overall system architecture relatively complicated.

[0010] Third, conventional immersion cooling systems are not well suited for IT equipment. In a typical immersion cooling system, when assembling IT equipment of different heights, it is necessary to use cabinets of the same height. If the height of the IT equipment to be assembled is lower than the height of the cabinet, more cooling liquid needs to be allocated to the servers, which will incur more costs.

[0011] Fourth, since the capacity of IT equipment mounted in a single system of a conventional immersion cooling system is large, in the case of a relatively small-scale IT system, it will result in a certain amount of equipment and coolant waste.

[0012] Therefore, an improved data center immersion cooling solution is needed. Summary of the Invention [Problem to be solved by the invention]

[0013] An object of the present disclosure is to provide an immersion cooling apparatus and an immersion cooling system including the immersion cooling apparatus to at least partially solve the above problems existing in the prior art. [Means for solving the problem]

[0014] According to a first aspect of the present disclosure, there is provided an immersion cooling apparatus, comprising: a cabinet including a cooling groove and a mounting groove integrated in an outer wall of the cooling groove, the cooling groove being used to accommodate an electronic device to be cooled and a first cooling liquid, the mounting groove being used to accommodate the first cooling liquid, the cooling groove and the mounting groove being in fluid communication with each other via a through hole, and a heat exchange module suitable for insertion into the mounting groove, the heat exchange module including a cooling liquid circulation pipe, a heat exchanger, and a cooling liquid drive unit, the cooling liquid circulation pipe and the heat exchanger being in fluid communication with each other to provide a second cooling liquid to the heat exchanger, the heat exchanger being used to cool the first cooling liquid outside thereof by utilizing the second cooling liquid therein, and the cooling liquid drive unit being used to circulate the first cooling liquid between the mounting groove and the cooling groove.

[0015] The cabinet in the immersion cooling apparatus according to the embodiment of the present disclosure solves the problems of small size, small overall weight, and difficult deployment. Operators can perform maintenance on each side of the immersion cooling apparatus, which makes it very easy to maintain the internal electronic components. Furthermore, since the cabinet and the heat exchange module are integrated, there is no need to install an additional cooling liquid allocation unit in the entire system, which is very flexible and convenient.

[0016] In some embodiments, the through holes include a first set of through holes and a second set of through holes. The cooling fluid driver is proximate to the first set of through holes to drive the first cooling fluid in the mounting groove into the cooling groove and to cause the first cooling fluid in the cooling groove to flow through the second set of through holes into the mounting groove when the heat exchange module is inserted into the mounting groove. In such embodiments, the cooling fluid driver is located adjacent to the first set of through holes to facilitate rapid circulation of the first cooling fluid between the mounting groove and the cooling groove.

[0017] In some embodiments, the first set of through holes is located proximate a bottom side of the mounting groove and the second set of through holes is located proximate a top side of the mounting groove, such that most of the first cooling liquid in the mounting groove can circulate back to the cooling groove, improving the cooling performance of the immersion cooling apparatus.

[0018] In some embodiments, when the heat exchange module is inserted into the mounting groove, the cooling liquid drive unit is adjacent to a bottom side of the mounting groove, and the heat exchanger is located above the cooling liquid drive unit and is installed adjacent to the cooling liquid drive unit. In such embodiments, by installing the cooling liquid drive unit adjacent to the heat exchanger, the first cooling liquid after being cooled by the heat exchanger can be transported to the cooling groove in a timely manner, further improving the cooling performance of the immersion cooling device.

[0019] In some embodiments, the cooling fluid driver includes a plurality of circulation pumps, each of which is proximate a corresponding through hole in the first set of through holes when the heat exchange module is inserted into the mounting groove, and in such embodiments, the plurality of circulation pumps may drive the first cooling fluid into a corresponding through hole, thereby further increasing the circulation rate of the first cooling fluid between the mounting groove and the cooling groove.

[0020] In some embodiments, the cabinet further comprises an external framework and a top cover, the external framework is installed to surround the cooling groove and the mounting groove, and the top cover is pivotally connected to the external framework and switchable between a closed state for closing the cooling groove and an open state for opening the cooling groove. In such embodiments, the top cover is employed to close the first cooling groove, thereby reducing leakage of the first cooling liquid in the cooling groove and preventing external contaminants from entering the cooling groove.

[0021] In some embodiments, the top cover includes a frame and a transparent portion surrounded by the frame. In such embodiments, the electronic device in the cooling groove can be observed through the transparent portion, and the operating state of the components of the electronic device can be known in a timely manner.

[0022] In some embodiments, a first seal ring is provided on the side of the top cover facing the cooling groove. When the top cover is in the closed state, the first seal ring seals between the top cover and the cooling groove. In such embodiments, the first seal ring can be used to improve the sealing performance between the top cover and the cooling groove, and further reduce leakage of the first cooling liquid in the cooling groove.

[0023] In some embodiments, the cabinet further comprises a hydraulic drive, the hydraulic drive being connected between the external framework and the top cover for driving the top cover to switch between the closed state and the open state, in such embodiments, the hydraulic drive is employed to facilitate opening and closing of the top cover.

[0024] In some embodiments, the hydraulic drive device includes a pair of hydraulic levers, one of which is connected between a first side of the top cover and the external framework, and the other of which is connected between a second side of the top cover and the external framework, and the first side and the second side of the top cover are opposite sides. In such embodiments, the pair of hydraulic levers installed opposite each other can quickly and reliably switch the state of the top cover.

[0025] In some embodiments, the immersion cooling apparatus further includes a height adjustment bracket, which is disposed below the cooling groove and supports the cooling groove. In such embodiments, users can combine immersion cooling apparatuses with different height adjustment brackets according to the actual depth needs of electronic devices, which can greatly reduce the usage of the first cooling liquid and help achieve carbon neutrality.

[0026] In some embodiments, the heat exchange module further comprises a plurality of liquid occupying blocks that are at least partially submersible in the first cooling liquid in the mounting channel when the heat exchange module is inserted into the mounting channel. In such embodiments, the liquid occupying blocks can occupy a volume of the first cooling liquid when the heat exchange module is inserted into the mounting channel, thereby reducing the amount of first cooling liquid required for the cabinet and reducing overall costs.

[0027] In some embodiments, the liquid occupying blocks are positioned adjacent a top side of the mounting channel when the heat exchange module is inserted into the mounting channel.

[0028] In some embodiments, adjacent ones of the liquid occupation blocks include passages between which the first cooling liquid can flow, in such embodiments, the first cooling liquid can form a stable fluid path by flowing through the passages between the liquid occupation blocks.

[0029] In some embodiments, the heat exchange module further comprises a support portion, the support portion being located outside the mounting groove when the heat exchange module is inserted into the mounting groove, in such embodiments, the support portion can ensure that the heat exchange module is supported by the cabinet and can prevent leakage of the first cooling liquid from the mounting groove.

[0030] In some embodiments, a second seal ring is provided on the side of the support facing the mounting groove. When the heat exchange module is inserted into the mounting groove, the second seal ring seals between the support and the mounting groove. In such embodiments, the second seal ring can improve the sealing performance between the support and the mounting groove and further reduce leakage of the first cooling liquid from the mounting groove.

[0031] In some embodiments, the height of the cabinet is in the range of 1000 mm to 1100 mm, the width of the cabinet is in the range of 750 mm to 850 mm, and the length of the cabinet is in the range of 500 mm to 800 mm. In such embodiments, when the height and width of the cabinet are essentially the same as the height and width of a normal cabinet, the length of the cabinet is significantly reduced compared to the length of a normal cabinet, and therefore the volume of the cabinet is also significantly reduced.

[0032] In some embodiments, the first cooling liquid comprises a fluorinated liquid or a mineral oil, and / or the second cooling liquid comprises deionized water.

[0033] In some embodiments, the electronic equipment includes a server or a switch.

[0034] According to a second aspect of the present disclosure, there is provided an immersion cooling system comprising a plurality of immersion cooling apparatuses arranged side by side, each of the plurality of immersion cooling apparatuses being any one of the immersion cooling apparatuses according to the first aspect of the present disclosure.

[0035] This section is provided to introduce a selection of concepts in a simplified form that are further described in the specific embodiments below. This section is not intended to identify key features or primary features of the disclosed subject matter, nor is it intended to limit the scope of the disclosed subject matter. [Brief description of the drawings]

[0036] These and other objects, features and advantages of embodiments of the present disclosure will become more readily apparent from a reading of the following detailed description in conjunction with the drawings in which certain embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in which: [Figure 1] 1 shows a structural schematic diagram of an immersion cooling apparatus according to one embodiment of the present disclosure, with the top cover in a closed state; [Diagram 2] 1 shows a structural schematic diagram of an immersion cooling apparatus according to one embodiment of the present disclosure, with the top cover in an open state; [Diagram 3] FIG. 2 shows a structural schematic diagram of the immersion cooling apparatus shown in FIG. 1, in which the heat exchange module is in a withdrawn state. [Figure 4] FIG. 2 is a structural schematic diagram of the immersion cooling device shown in FIG. 1 when viewed from a different viewing angle. [Diagram 5] FIG. 3 illustrates a top view of the immersion cooling apparatus shown in FIG. 2 with the top cover not shown to show the first cooling fluid in the cooling channels. [Figure 6] 3 illustrates a top view of the immersion cooling apparatus shown in FIG. 2 with the top cover and heat exchange module not shown to show the first cooling fluid in the cooling and mounting channels. [Figure 7] 1 shows a structural schematic diagram of an outer wall for integrating a mounting groove of a cooling groove according to one embodiment of the present disclosure. [Figure 8] FIG. 2 shows a structural schematic diagram of a heat exchange module according to one embodiment of the present disclosure. [Figure 9] 4 shows a schematic flow path of a first cooling liquid. [Figure 10] 10 illustrates different arrangements of electronics in an immersion cooling apparatus according to embodiments of the present disclosure. [Figure 11] 10 illustrates different arrangements of electronics in an immersion cooling apparatus according to embodiments of the present disclosure. [Figure 12] 10 illustrates different arrangements of electronics in an immersion cooling apparatus according to embodiments of the present disclosure. [Figure 13] 1 shows a structural schematic diagram of an immersion cooling system according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0037] The following describes in more detail the preferred embodiments of the present disclosure with reference to the drawings. Although the preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be realized in various forms without being limited to the embodiments described herein. On the contrary, these embodiments are provided to make the present disclosure more thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art.

[0038] As used herein, the term "including" and variations thereof refer to an open inclusive, i.e., "including, but not limited to." Unless otherwise specified, the term "or" refers to "and / or." The term "based on" refers to "based at least in part on." The terms "in one embodiment" and "in one embodiment" refer to "at least one embodiment." The term "in another embodiment" refers to "at least one other embodiment." The terms "first," "second," etc. may refer to different or the same object.

[0039] As described above, conventional immersion cooling systems have various problems, such as difficulty in operation and maintenance, complexity of the overall architecture, poor compatibility, and waste of coolant. The embodiments of the present disclosure provide an immersion cooling apparatus and an immersion cooling system including an immersion cooling apparatus with an integrated heat exchanger therein, in order to reduce the difficulty in operation and maintenance, reduce the complexity of the architecture, enhance compatibility, and save coolant. The principle of the present disclosure will be described below in conjunction with FIGS. 1 to 13.

[0040] 1 and 2 show structural schematic diagrams of an immersion cooling apparatus 100 according to an embodiment of the present disclosure. In FIG. 1, the top cover 24 is in a closed state, whereas in FIG. 2, the top cover 24 is in an open state. FIG. 3 shows a structural schematic diagram of the immersion cooling apparatus 100 shown in FIG. 1, in which the heat exchange module 3 is in a withdrawn state. FIG. 4 shows a structural schematic diagram of the immersion cooling apparatus 100 shown in FIG. 1 when viewed from another viewing angle. In FIG. 1, the symbol X indicates the longitudinal direction of the immersion cooling apparatus 100, the symbol Y indicates the width direction of the immersion cooling apparatus 100, and the symbol Z indicates the height direction of the immersion cooling apparatus 100.

[0041] As shown in Figures 1 to 4, generally, the immersion cooling apparatus 100 described herein comprises a cabinet 2 and a heat exchange module 3. The cabinet 2 comprises an outer framework 23, a cooling groove 21, a mounting groove 22 integrated with an outer wall 211 of the cooling groove 21, and a top cover 24. The cooling groove 21 is used to accommodate an electronic device 4 to be cooled and a first cooling liquid 5 (see Figures 5 and 6). The mounting groove 22 is used to accommodate a heat exchange module 3 and a first cooling liquid 5 (see Figure 6). The cooling groove 21 and the mounting groove 22 are in fluid communication via a through hole 6 (see Figure 7). The heat exchange module 3 is suitable to be inserted into the mounting groove 22.

[0042] 1-4, the external framework 23 generally surrounds the cooling channels 21 and the mounting channels 22 to provide some mechanical support to the cooling channels 21 and the mounting channels 22. The cooling channels 21 and the mounting channels 22 may be attached to the external framework 23 by welding or in other manners. In some embodiments, the external framework 23 may be formed by welding section steel beams. In other embodiments, the external framework 23 may be manufactured and formed using other processes or using other materials. The embodiments of the present disclosure are not strictly limited in this respect.

[0043] In some embodiments, the cooling grooves 21 and the mounting grooves 22 may be formed by welding using stainless steel plates. In other embodiments, the cooling grooves 21 and the mounting grooves 22 may be manufactured and formed by other processes or using other materials. The embodiments of the present disclosure are not strictly limited in this respect.

[0044] As shown in Fig. 1 and Fig. 2, the top cover 24 is rotatably connected to the external framework 23 and can be switched between a closed state in which the cooling groove 21 is closed and an open state in which the cooling groove 21 is opened. In Fig. 1, the top cover 24 is shown in a closed state, whereas in Fig. 2, the top cover 24 is shown in an open state. In the closed state, the top cover 24 can reduce leakage of the first cooling liquid 5 in the cooling groove 21 and can also prevent external contaminants from entering the cooling groove 21. When the top cover 24 is in an open state, an operator can install or maintain the electronic device 4 in the cooling groove 21 and inject the first cooling liquid 5 into the cooling groove 21.

[0045] In some embodiments, the first coolant 5 comprises a fluorinated liquid or a mineral oil. In other embodiments, the first coolant 5 may be of other types. The embodiments of the present disclosure are not strictly limited in this respect.

[0046] In some embodiments, the top cover 24 may open more than 90 degrees relative to the external framework 23. A stopper (not shown) may be provided to limit the position of the top cover 24 at the maximum opening angle.

[0047] In some embodiments, the top cover 24 may be connected to one side of the external framework 23 via a hinge. In other embodiments, the top cover 24 may be connected to the external framework 23 in other manners, such as a bore-and-bolt fit, etc. The embodiments of the present disclosure are not strictly limited in this regard.

[0048] In some embodiments, as shown in FIGS. 1 and 2, the top cover 24 includes a frame 241 and a transparent portion 242 surrounded by the frame 241. The frame 241 is connected to the external framework 23 and is rotatable relative to the external framework 23. The frame 241 may be manufactured using aluminum alloy or other types of metal or nonmetal materials. The transparent portion 242 may be manufactured using transparent polycarbonate (PC) material or other types of transparent materials. By installing the transparent portion 242, even when the top cover 24 is in a closed state, an operator can observe the electronic device 4 in the cooling groove 21 through the transparent portion 242 and timely grasp the operating state of the components of the electronic device 4.

[0049] In some embodiments, a first seal ring (not shown) is installed on the side of the top cover 24 facing the cooling groove 21. When the top cover 24 is in a closed state, the gap between the top cover 24 and the cooling groove 21 is sealed by the first seal ring. The first seal ring may include, for example, EPDM rubber or other types of sealing materials. By employing the first seal ring, the sealing performance between the top cover 24 and the cooling groove 21 can be improved, and the leakage of the first cooling liquid 5 in the cooling groove 21 can be further reduced.

[0050] In some embodiments, the cabinet 2 further includes a hydraulic driving device (not shown) to realize the opening and closing of the top cover 24. The hydraulic driving device is connected between the external framework 23 and the top cover 24 to drive the top cover 24 to switch between a closed state and an open state. The opening and closing of the top cover 24 can be easily realized by utilizing the hydraulic driving device.

[0051] In some embodiments, the hydraulic drive device includes a pair of hydraulic levers (not shown). One of the pair of hydraulic levers is connected between a first side 243 of the top cover 24 and a corresponding side of the external framework 23. The other of the pair of hydraulic levers is connected between a second side 244 of the top cover 24 and a corresponding side of the external framework 23. The first side 243 and the second side 244 of the top cover 24 are opposite sides. The pair of hydraulic levers installed opposite to each other can quickly and reliably realize state switching of the top cover 24.

[0052] It should be understood that in other embodiments, the top cover 24 may be switched between the closed and open states in other manners, and the embodiments of the present disclosure are not strictly limited in this respect.

[0053] In some embodiments, a handle (not shown) may further be provided on the side of the top cover 24 facing away from the cooling grooves 21. Using such an arrangement, an operator can grasp the handle to open and close the top cover 24.

[0054] In addition, in the embodiment of the present disclosure, since the heat exchange module 3 is suitable for being inserted into and withdrawn from the mounting groove 22, an operator can easily use different heat exchange modules 3 for the cooling requirements of different electronic devices 4.

[0055] As mentioned above, both the cooling groove 21 and the mounting groove 22 are used to accommodate the first cooling liquid 5. In the cooling groove 21, the first cooling liquid 5 can be immersed in the electronic device 4 to cool the electronic device 4. In the mounting groove 22, the heat exchange module 3 can be at least partially immersed by the first cooling liquid 5. The heat exchange module 3 can be connected to an external cooling device (e.g., a cooling tower) to receive a second cooling liquid provided from the external cooling device. Since the temperature of the second cooling liquid in the heat exchange module 3 is lower than the temperature of the first cooling liquid 5 in the mounting groove 22, the first cooling liquid 5 in the mounting groove 22 can be cooled.

[0056] In some embodiments, the second cooling liquid in the heat exchange module 3 may include deionized water. In other embodiments, the second cooling liquid may be of other types. The embodiments of the present disclosure are not strictly limited in this respect.

[0057] The following describes an exemplary structure of the heat exchange module 3 in conjunction with FIG. 8. As shown in FIG. 8, the heat exchange module 3 includes a coolant circulation line 31, a heat exchanger 32, and a coolant drive unit 33. The coolant circulation line 31 and the heat exchanger 32 are in fluid communication with each other to circulate a second coolant between the heat exchanger 32 and an external cooling device (e.g., a cooling tower). By using such an arrangement, a second coolant having a relatively low temperature can be provided to the heat exchanger 32. The heat exchanger 32 is used to cool the first coolant 5 outside thereof by using the second coolant therein. The coolant drive unit 33 is used to circulate the first coolant 5 between the mounting groove 22 and the cooling groove 21. With this method, the low-temperature first cooling liquid 5 that enters the cooling groove 21 from the mounting groove 22 can absorb heat from the electronic device 4, and the first cooling liquid 5 after absorbing heat and increasing in temperature enters the mounting groove 22 from the cooling groove 21 via the through hole 6, and is cooled again in the mounting groove 22 by the heat exchanger 32, allowing the next circulation to begin.

[0058] 1 to 8, when the heat exchange module 3 is inserted in the mounting groove 22, the heat exchanger 32 and the coolant drive 33 can be immersed in the first coolant 5. Due to the presence of the second coolant received in the heat exchanger 32 via the coolant circulation line 31, the second coolant can be used to lower the temperature of the first coolant 5 in the mounting groove 22.

[0059] In some embodiments, the coolant circulation line 31 may include two sets of inlet and return lines. With such a redundant design, when one set of inlet and return lines fails, the other set of inlet and return lines can still operate normally, thereby improving the reliability of the system.

[0060] In some embodiments, heat exchanger 32 may include a plate heat exchanger. In other embodiments, heat exchanger 32 may include other types of heat exchangers. The embodiments of the present disclosure are not strictly limited in this respect.

[0061] In some embodiments, a dense micro-cavity structure may be provided inside the heat exchanger 32 to increase the contact area between the second cooling fluid and the heat exchanger 32 and improve the heat exchange efficiency of the heat exchanger 32.

[0062] In some embodiments, the heat exchanger 32 may be fabricated using a stainless steel material. In other embodiments, the heat exchanger 32 may be fabricated using other types of materials having relatively high thermal conductivity. The embodiments of the present disclosure are not strictly limited in this regard.

[0063] 7 shows an exemplary arrangement of the through holes 6 on the outer wall 211 of the cooling groove 21. In some embodiments, as shown in FIG 7, the through holes 6 include a first set of through holes 61 and a second set of through holes 62. As shown in FIGS. 1 to 4 and 7 and 8, when the heat exchange module 3 is inserted into the mounting groove 22, the coolant driving device 33 is adjacent to the first set of through holes 61 so as to drive the first coolant 5 in the mounting groove 22 to the cooling groove 21 through the first set of through holes 61, and to cause the first coolant 5 in the cooling groove 21 to flow into the mounting groove 22 through the second set of through holes 62.

[0064] In some embodiments, each through hole in the first set of through holes 61 may be elliptical in shape, as shown in Figure 7. It should be understood that in other embodiments, each through hole in the first set of through holes 61 may be other shapes, such as circular, rectangular, square, strip-shaped, etc. The embodiments of the present disclosure are not strictly limited in this regard.

[0065] Similarly, as shown in Figure 7, each through hole in the second set of through holes 62 may be elliptical in shape. In other embodiments, each through hole in the second set of through holes 62 may be other shapes, such as circular, rectangular, square, strip-shaped, etc. The embodiments of the present disclosure are not strictly limited in this respect.

[0066] 7, the first set of through holes 61 are located proximate the bottom side of the mounting groove 22 and the second set of through holes 62 are located proximate the top side of the mounting groove 22. Using such an arrangement, most of the first cooling liquid 5 in the mounting groove 22 can be involved in the cooling liquid circulation between the cooling groove 21 and the mounting groove 22.

[0067] 1 to 4 and 8, when the heat exchange module 3 is inserted into the mounting groove 22, the coolant drive unit 33 is adjacent to the bottom side of the mounting groove 22, and the heat exchanger 32 is located above the coolant drive unit 33 and installed adjacent to the coolant drive unit 33. By installing the coolant drive unit 33 adjacent to the heat exchanger 32, the first coolant 5 after being cooled by the heat exchanger 32 can be transported to the cooling groove 21 in a timely manner, further improving the cooling performance of the immersion cooling apparatus 100.

[0068] 8, the coolant driving device 33 includes a plurality of circulation pumps, each of which is adjacent to a corresponding through-hole in the first set of through-holes 61 when the heat exchange module 3 is inserted into the mounting groove 22. Using such an arrangement, the plurality of circulation pumps can drive the first coolant 5 to the corresponding through-hole, and the circulation speed of the first coolant 5 between the mounting groove 22 and the cooling groove 21 can be further increased.

[0069] In some embodiments, an additional circulation pump may be installed near each through-hole in the first set of through-holes 61. Using such a redundant design, the circulation stability of the first cooling liquid 5 between the mounting groove 21 and the cooling groove 22 can be improved.

[0070] In other embodiments, the coolant driver 33 may further include other types of drive units or may employ other arrangements, and the embodiments of the present disclosure are not strictly limited in this respect.

[0071] 8, the heat exchange module 3 further includes a plurality of liquid occupying blocks 34. When the heat exchange module 3 is inserted into the mounting groove 22, the plurality of liquid occupying blocks 34 are at least partially submerged in the first coolant 5 in the mounting groove 22. In this manner, the liquid occupying blocks 34 can occupy a volume of the first coolant 5 in the mounting groove 22, thereby raising the level of the first coolant 5 in the mounting groove 22 and reducing the amount of first coolant 5 required for the cabinet 2, thereby reducing the overall cost.

[0072] In some embodiments, as shown in Figures 1-4 and 8, the liquid occupying blocks 34 are positioned adjacent to the top side of the mounting groove 22 when the heat exchange module 3 is inserted into the mounting groove 22. In other embodiments, the liquid occupying blocks 34 may be positioned in other locations. The embodiments of the present disclosure are not strictly limited in this respect.

[0073] 8, a passage 35 through which the first cooling liquid 5 flows is provided between adjacent liquid occupying blocks 34 among the plurality of liquid occupying blocks 34. The first cooling liquid 5 can form a stable fluid path by flowing through the passage 35 between the liquid occupying blocks 34.

[0074] 1 to 4 and 8, in some embodiments, the heat exchange module 3 includes a support 36 located at the top. When the heat exchange module 3 is inserted into the mounting groove 22, the support 36 is located outside the mounting groove 22 and is supported by the external framework 23. In this manner, the entire weight of the heat exchange module 3 can be reliably supported by the external framework 23.

[0075] In some embodiments, a second seal ring (not shown) is provided on the side of the support 36 facing the mounting groove 22. When the heat exchange module 3 is inserted into the mounting groove 22, the second seal ring seals between the support 36 and the mounting groove 22. By employing the second seal ring, the sealing performance between the support 36 and the mounting groove 22 can be improved, and the leakage of the first cooling liquid 5 through the mounting groove 22 can be further reduced.

[0076] 1 to 4 and 8, in some embodiments, the support 36 is provided with a pair of handles 37. By gripping the handles 37, an operator can easily manipulate the heat exchange module 3, for example, to pull the heat exchange module 3 out of the mounting groove 22 or to insert the heat exchange module 3 into the mounting groove 22.

[0077] Returning to FIG. 1 to FIG. 4 , in some embodiments, the immersion cooling apparatus 100 further includes a height adjustment bracket 7. The height adjustment bracket 7 is installed below the cooling groove 21 and supports the cooling groove 21. Using such an arrangement, a user can combine immersion cooling apparatuses having different height adjustment brackets 7 according to the needs of the actual depth of the electronic device 4, thereby greatly saving the usage of the first cooling liquid 5 and also contributing to the realization of carbon neutrality. In some cases, the height adjustment bracket 7 can also support the mounting groove 22.

[0078] FIG. 9 shows a schematic flow path of the first cooling liquid 5 indicated by an arrow. As shown in FIG. 9, when the heat exchange module 3 is inserted into the mounting groove 22, the heat exchanger 32 and the cooling liquid driving device 33 can be immersed in the first cooling liquid 5. Since the second cooling liquid received through the cooling liquid circulation pipe 31 is present in the heat exchanger 32, the second cooling liquid can be used to lower the temperature of the first cooling liquid 5 in the mounting groove 22. The cooling liquid driving device 33 then drives the first cooling liquid 5 in the mounting groove 22 through the first set of through holes 61 into the cooling groove 21 and flows through the electronic device 4 from bottom to top, thereby cooling the electronic device. Then, the first cooling liquid 5 after absorbing heat from the electronic device 4 in the cooling groove 21 flows into the mounting groove 22 through the second set of through holes 62. The first cooling liquid 5 enters the mounting groove 22 from top to bottom again, lowers its temperature through the heat exchanger 32, and performs the next circulation.

[0079] In some embodiments, as shown in FIG. 9 , the second cooling liquid in the heat exchanger 32 can flow along the left-right direction, while the first cooling liquid 5 in the mounting groove 22 can flow up-down along the vertical direction, thereby forming a bifurcated flow type heat exchange and enhancing the heat exchange efficiency of the heat exchanger 32.

[0080] In some embodiments, electronic device 4 includes a server or a switch. In other embodiments, electronic device 4 may be of other types, and embodiments of the present disclosure are not strictly limited in this respect.

[0081] 10 to 12 show different arrangements of the electronic device 4 in the immersion cooling apparatus 100 according to the embodiments of the present disclosure. As shown in FIG. 10, the electronic device 4 includes both a computational server and a storage server. As shown in FIG. 11, the electronic device 4 mainly includes a storage server. As shown in FIG. 12, the electronic device 4 mainly includes a computational server. In some embodiments, the size of the cabinet 2 of the immersion cooling apparatus 100 shown in FIG. 10 to 12 may be, for example, 8U. In other embodiments, the size of the cabinet 2 may be larger or smaller than 8U. The embodiments of the present disclosure are not strictly limited in this respect.

[0082] As shown in Fig. 1, when the height along the height direction Z and the width along the width direction Y of the cabinet 2 according to the embodiment of the present disclosure are basically the same as the height and width of a normal cabinet, the length along the longitudinal direction X of the cabinet 2 is only about one-sixth of the length of a normal cabinet. For example, when the height of the cabinet is within a range of 1000mm to 1100mm (e.g., about 1050mm) and the width of the cabinet is within a range of 750mm to 850mm (e.g., about 800mm), the length of a normal cabinet is generally about 3 meters, but the length of the cabinet 2 in the embodiment of the present disclosure is only 500mm, which significantly reduces the size. In the embodiment of the present disclosure, the length along the longitudinal direction X of the cabinet 2 can be adjusted according to the number of electronic devices 4 installed therein, and it is recommended to keep it within a range of 500mm to 800mm.

[0083] 10 to 12 further show conductive terminals 8 for connecting the electronic device 4 to supply power to the electronic device 4 and transmit signals / data thereto.

[0084] As shown in FIGS. 10 to 12, since the size of the cabinet 2 is relatively small compared to typical immersion cooling solutions, an operator can stand on either side of the cabinet 2 to operate the electronic equipment 4 in the cabinet 2.

[0085] In the embodiment of the present disclosure, the cabinet 2 and the heat exchange module 3 are designed as an integrated unit, and cooling by liquid heat exchange is completed within the entire system, thereby greatly simplifying the new architecture of the liquid-immersion cooled data center.

[0086] Fig. 13 shows a structural schematic diagram of an immersion cooling system 900 according to an embodiment of the present disclosure. As shown in Fig. 13, the immersion cooling system 900 includes a plurality of immersion cooling apparatuses 100 arranged side by side. Each of the plurality of immersion cooling apparatuses 100 may be any one of the immersion cooling apparatuses 100 described in conjunction with Figs. 1 to 12.

[0087] Whether deploying a small, medium or large data center, users can set the number of immersion cooling devices 100 according to business needs to form business systems of different scales, and provide data centers with more flexible and efficient deployment modes of immersion cooling systems. This also solves the problem that the number of IT equipment in a single cabinet is large and the loss caused by a single failure is too large. For example, in some edge computing usage scenarios, such small immersion cooling devices 100 can be independently deployed in small quantities, enabling more miniaturized and flexible deployment application scenarios.

[0088] In addition, when deploying a large-scale cluster, by arranging the cabinet 2 and the heat exchange module 3 in advance in the data center, the immersion cooling device 100 can be arranged in the machine room of the data center in advance, and debugging can be completed by connecting the coolant circulation pipe 31 to the primary coolant supply system (e.g., a cooling tower). After that, when there is a business demand, the user can purchase IT equipment, arrange it in the cooling groove 21 of the cabinet 2, and finally add the first coolant 5 to the cooling groove, thereby completing the deployment of the entire system. This method can significantly shorten the deployment time of the data center.

[0089] An embodiment of the present disclosure further provides a data center with a large-scale cluster deployment, including a plurality of immersion cooling apparatuses 100 pre-disposed in a machine room of the data center, each of which has no electronic device 4 installed therein and has no first cooling liquid 5 injected therein, and a primary-side cooling liquid supply system (e.g., a cooling tower) connected via an infusion line to a cooling liquid circulation line 31 in a heat exchange module 3 of each of the immersion cooling apparatuses 100. Utilizing such an arrangement, the immersion cooling apparatuses 100 and the primary-side cooling liquid supply system can be connected to each other to perform a trial run in advance, facilitating rapid large-scale cluster deployment.

[0090] In the embodiment according to the present disclosure, the cooling grooves 21 of the cabinet 2 in the immersion cooling apparatus 100 may be designed to have different depths to accommodate different sizes of IT equipment, for example, 4U, 8U, etc., where U represents the height unit of the IT equipment, where 1U=1.75 inches=4.445 centimeters, 4U=7 inches=17.78 centimeters, and 8U=14 inches=35.56 centimeters. Accordingly, the height adjustment brackets 7 may have different sizes so that the same set of external frameworks 23 can be adapted to different cooling grooves 21. In some embodiments, the height adjustment brackets 7 may be height-adjustable height adjustment brackets.

[0091] For example, the depth of a compute server is generally 600 mm, and the depth of a storage server is generally 800 mm. The cabinet 2 can adjust the depth of the cooling grooves 21 by using the height adjustment brackets 7 at the bottom. By designing the cooling grooves 21 to have different depths, the amount of coolant used by IT equipment in the immersion cooling system 900 can be reduced by about 5-33%.

[0092] An embodiment of the present disclosure provides an immersion cooling system design with an integrated heat exchanger inside, which efficiently realizes self-circulating cooling of IT equipment such as servers and switches placed therein, reducing the investment and overall operating costs of the data center, and controlling the overall power usage effectiveness (PUE) of the data center to 1.1 or less, thereby helping to achieve carbon neutrality.

[0093] Although each embodiment of the present disclosure has been described above, the above description is illustrative, not exhaustive, and is not limited to each disclosed embodiment. Many modifications and changes are obvious to those skilled in the art without departing from the scope and spirit of each described embodiment. The selection of terms used in this specification aims to best interpret the principles, practical applications, or technical improvements in the market of each embodiment, or to enable other skilled in the art to understand each embodiment disclosed in this specification.

Claims

1. a cabinet (2) including a cooling groove (21) and a mounting groove (22) integrated into an outer wall (211) of the cooling groove (21), the cooling groove (21) being used to accommodate an electronic device (4) to be cooled and a first cooling liquid (5), the mounting groove (22) being used to accommodate the first cooling liquid (5), and the cooling groove (21) and the mounting groove (22) being in fluid communication with each other via a through hole (6); a heat exchange module (3) suitable for being inserted into said mounting groove (22) and including a cooling liquid circulation line (31), a heat exchanger (32) and a cooling liquid drive (33), said cooling liquid circulation line (31) and said heat exchanger (32) being in fluid communication for providing a second cooling liquid to said heat exchanger (32), said heat exchanger (32) being used to cool said first cooling liquid (5) outside thereof by utilizing said second cooling liquid therein, and said cooling liquid drive (33) being used to circulate said first cooling liquid (5) between said mounting groove (22) and said cooling groove (21); The immersion cooling apparatus (100) comprises:

2. the through holes (6) include a first set of through holes (61) and a second set of through holes (62), wherein when the heat exchange module (3) is inserted into the mounting groove (22), the cooling liquid driving device (33) drives the first cooling liquid (5) in the mounting groove (22) into the cooling groove (21) and drives the first cooling liquid (5) in the cooling groove (21) into the mounting groove (22) through the second set of through holes (62) adjacent to the first set of through holes (61); The immersion cooling apparatus (100) of claim 1.

3. The first set of through holes (61) are disposed adjacent to the bottom side of the mounting groove (22), and the second set of through holes (62) are disposed adjacent to the top side of the mounting groove (22). The immersion cooling apparatus (100) of claim 2.

4. When the heat exchange module (3) is inserted into the mounting groove (22), the cooling liquid drive unit (33) is adjacent to the bottom side of the mounting groove (22), and the heat exchanger (32) is located above the cooling liquid drive unit (33) and adjacent to the cooling liquid drive unit (33). The immersion cooling apparatus (100) of claim 3.

5. the coolant drive device (33) includes a plurality of circulation pumps, each of which is adjacent to a corresponding through hole in the first set of through holes (61) when the heat exchange module (3) is inserted into the mounting groove (22); The immersion cooling apparatus (100) of claim 2.

6. The cabinet (2) further includes an external framework (23) and a top cover (24), the external framework (23) is installed to surround the cooling groove (21) and the mounting groove (22), and the top cover (24) is rotatably connected to the external framework (23) and is switchable between a closed state for closing the cooling groove (21) and an open state for opening the cooling groove (21). The immersion cooling apparatus (100) of claim 1.

7. The top cover (24) includes a frame (241) and a transparent portion (242) surrounded by the frame (241). The immersion cooling apparatus (100) of claim 6.

8. a first seal ring is provided on the side of the top cover (24) facing the cooling groove (21), and when the top cover (24) is in the closed state, the gap between the top cover (24) and the cooling groove (21) is sealed by the first seal ring; The immersion cooling apparatus (100) of claim 6.

9. the cabinet (2) further comprises a hydraulic drive connected between the external framework (23) and the top cover (24) for driving the top cover (24) to switch between the closed state and the open state; The immersion cooling apparatus (100) of claim 6.

10. the hydraulic drive unit includes a pair of hydraulic levers, one of which is connected between a first side (243) of the top cover (24) and the external framework (23), and the other of which is connected between a second side (244) of the top cover (24) and the external framework (23), the first side (243) and the second side (244) of the top cover (24) being on opposite sides; The immersion cooling apparatus (100) of claim 9.

11. The immersion cooling apparatus (100) further includes a height adjustment bracket (7), and the height adjustment bracket (7) is installed below the cooling groove (21) and supports the cooling groove (21). The immersion cooling apparatus (100) of claim 6.

12. the heat exchange module (3) further comprises a plurality of liquid occupying blocks (34), the plurality of liquid occupying blocks (34) being at least partially immersable in the first cooling liquid (5) in the mounting groove (22) when the heat exchange module (3) is inserted in the mounting groove (22); The immersion cooling apparatus (100) of claim 1.

13. When the heat exchange module (3) is inserted into the mounting groove (22), the liquid occupying blocks (34) are located adjacent to the top side of the mounting groove (22). The immersion cooling apparatus (100) of claim 12.

14. A passage (35) for the first cooling liquid (5) to flow is provided between adjacent liquid occupying blocks (34) among the plurality of liquid occupying blocks (34). The immersion cooling apparatus (100) of claim 12.

15. the heat exchange module (3) further comprises a support portion (36), wherein the support portion (36) is located outside the mounting groove (22) when the heat exchange module (3) is inserted into the mounting groove (22); The immersion cooling apparatus (100) of claim 1.

16. a second seal ring is provided on the side of the support portion (36) facing the mounting groove (22), and when the heat exchange module (3) is inserted into the mounting groove (22), the gap between the support portion (36) and the mounting groove (22) is sealed by the second seal ring. The immersion cooling apparatus (100) of claim 15.

17. The height of the cabinet is within the range of 1000mm to 1100mm, the width of the cabinet is within the range of 750mm to 850mm, and the length of the cabinet is within the range of 500mm to 800mm. The immersion cooling apparatus (100) of claim 1.

18. the first cooling liquid (5) comprises a fluorinated liquid or a mineral oil, and / or the second cooling liquid comprises deionized water; The immersion cooling apparatus (100) of claim 1.

19. The electronic device (4) includes a server or a switchboard. The immersion cooling apparatus (100) of any one of the preceding claims.

20. 20. An immersion cooling system (900) comprising a plurality of immersion cooling apparatuses (100) arranged side by side, each of the plurality of immersion cooling apparatuses (100) being an immersion cooling apparatus (100) according to claim 19. An immersion cooling system (900).

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