Electronic device

Abstract

To provide an electronic apparatus with high portability, an electronic apparatus with excellent listability, or an electronic apparatus having a novel light source that can be used in shooting photographs and video.SOLUTION: An electronic apparatus includes a camera and a flexible display portion. The display portion has a first region and a second region. The first region has a function of emitting light to a photographic subject of the camera. The second region has a function of displaying an image of the photographic subject shot by the camera. The display portion has a function of being bent so that the first region and the second region face in different directions.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] One embodiment of the present invention relates to a display device. In particular, the display device has flexibility and can be bent. Further, one embodiment of the present invention relates to an electronic device including a display device.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one aspect relates to an article, a method, or a manufacturing method. One aspect of the present invention is a process, machine, manufacture, or composition. Therefore, the present invention more specifically disclosed herein The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a lighting device, a power storage device, Examples of the memory device include a memory device, a method for driving the memory device, or a method for manufacturing the memory device. Cut. [Background technology]

[0003] In recent years, display devices are expected to be used for a variety of purposes, and are becoming more and more diverse. For example, display devices used in portable electronic devices must be thin and lightweight. In addition, new uses that have not been seen before are being sought. is.

[0004] In addition, Patent Document 1 discloses a film substrate on which transistors and other semiconductor devices are mounted as switching elements. A flexible active matrix type light emitting device having an organic EL element is disclosed. . [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2003-174153 A Summary of the Invention [Problem to be solved by the invention]

[0006] In recent years, the amount of information displayed has increased by enlarging the display area of ​​the display device, and the display list On the other hand, for mobile device applications, the display area needs to be enlarged. If the number of files is increased, portability will decrease. It has been difficult to achieve both high speed and high portability.

[0007] In addition, cameras are installed in electronic devices such as portable information terminals, allowing users to easily take photos and videos. There is also a demand for light sources that illuminate the subject with higher brightness and lower power consumption. It is being done.

[0008] An object of one embodiment of the present invention is to provide an electronic device with excellent portability. It is an object of the present invention to provide an electronic device that is easy to view. One object of the present invention is to provide an electronic device equipped with a new light source that can be used occasionally. Another object is to provide a novel display device, lighting device, or electronic device.

[0009] The description of these problems does not preclude the existence of other problems. It is not necessary to solve all of these problems. Problems other than those mentioned above are not necessarily solved. It will become clear from the description of the specification, etc., and problems other than those mentioned above will not be identified from the description of the specification, etc. It is possible to extract [Means for solving the problem]

[0010] One embodiment of the present invention is an electronic device including a camera and a flexible display portion, The display unit has a first area and a second area, and the first area emits light to a subject of the camera. The second area has a function of displaying an image of a subject photographed by the camera. The display unit has a function of bending so that the first region and the second region are oriented in different directions. It is an electronic device with the following functions:

[0011] Another embodiment of the present invention is a display device having a housing, a camera, and a flexible display portion. An electronic device, the display unit having an area fixed to a first surface of a housing, the camera having: The display unit has a region fixed to the second surface of the housing, and the display unit has a first region and a second region. The first region has a function of emitting light to a subject of the camera, and the second region has a function of detecting the light by the camera. The display unit has a function of displaying an image of a subject photographed by the camera, and the display unit has a first area and a second area. The electronic device has the ability to bend so that the two regions are oriented in different directions.

[0012] The housing has a third surface, the third surface has an area in contact with the first surface, and a display It is preferable that the portion has a region provided along the third surface. It is preferable that the display device has a recess, and the recess has a function of folding and storing the display unit.

[0013] The display unit includes a first pixel and a second pixel, and the first pixel includes a first light-emitting element. the second pixel has a second light-emitting element, and a third pixel is disposed between the first pixel and the second pixel. In this case, the first pixel and the second pixel are preferably an active layer. The third light-emitting element has a function of being controlled by a passive matrix driving method. It is preferable that the function be controlled by a switch drive.

[0014] The display unit has a third area and a fourth area, and the third area is The fourth region has a region provided along the contour of the third region. The fourth region preferably has a fourth light emitting element. In this case, the display section includes a circuit and wiring, and both or either one of the circuit and the wiring and the fourth light-emitting element are mutually It is preferable that the third region has an area overlapping the active matrix. The fourth region has a function controlled by a passive matrix drive. It is preferable that the ion exchange resin has a function of being capable of being inserted into the ion exchange resin. Effect of the Invention

[0015] According to one aspect of the present invention, an electronic device having excellent portability can be provided. Or, new light that can be used when taking photos or videos can be provided. An electronic device with a power source can be provided. [Brief description of the drawings]

[0016] [Figure 1] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. [Diagram 2] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. [Diagram 3] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. [Figure 4] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. [Diagram 5] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. [Figure 6] FIG. 4 is a diagram showing an example of a display unit according to the embodiment. [Figure 7] FIG. 4 is a diagram showing an example of a display area according to an embodiment. [Figure 8] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 9] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 10] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 11] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 12] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 13] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 14] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 15] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] The embodiment will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiment, and various changes and modifications may be made in the form and details without departing from the spirit and scope of the present invention. It will be easily understood by those skilled in the art that the present invention can be realized by the following embodiments. The present disclosure should not be construed as being limited to the contents of the preceding paragraph.

[0018] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and the repeated explanations are omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be used.

[0019] In each figure described in this specification, the size, layer thickness, or area of ​​each component is indicated by the following formula: The figures may be exaggerated for clarity and are not necessarily limited to scale. stomach.

[0020] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The numbers are added for the purpose of convenience and are not intended to be limiting.

[0021] (Embodiment 1) In this embodiment, a configuration example of an electronic device according to one embodiment of the present invention will be described.

[0022] [Examples of electronic device configurations] 1A to 1E show an electronic device 100 as an example. The display unit 101 of the device 100 is shown in an unfolded state. ) shows a state in which the display unit 101 of the electronic device 100 is folded. 1(D) and (E) show an example of the electronic device 100 in use.

[0023] The electronic device 100 includes a display unit 101 and a housing 102 .

[0024] The display unit 101 is flexible. In addition, the display unit 101 has a part of its area in contact with the housing 102. The display unit 101 is fixed to a housing 102. The display unit 101 has a display area 103 for displaying an image. , and a non-display area 104 surrounding the display area 103.

[0025] The housing 102 has a camera 105 on its surface. In FIG. 1 shows a case where a camera 105 is provided on the surface opposite to the surface on which the sensor is fixed.

[0026] In the electronic device 100 according to one embodiment of the present invention, a part of a flexible display unit 101 is disposed on a housing 10. The display unit 101 is supported by a display panel 2. The display unit 101 can be deformed by bending or the like. For example, the display unit 101 can be bent so that the display surface faces inward (inward bending). It is possible to bend the display surface outward (outward bending). The term "foldable" refers to the surface on which an image is displayed. The display unit 101 can be folded by bending it. The electronic device 100 according to one embodiment of the present invention is portable when the display unit 101 is folded. When unfolded, the large, seamless display area provides excellent visibility of the display.

[0027] Furthermore, the housing 102 has a recess in which the display unit 101 can be stored in a folded state. By providing such a recess, when the display unit 101 is folded, the display unit 101 is prevented from being inserted into the housing 1. Therefore, it is possible to eliminate or reduce the part protruding from the electronic device 10. This can prevent the display unit 101 from being damaged when carrying the device. This is ideal when carrying the electronic device 100 in a pocket or bag.

[0028] When using the electronic device 100 according to one embodiment of the present invention, the display unit 101 is in an unfolded state. The entire seamless display area 103 may be used, or the display surface of the display unit 101 may be By bending the display unit 101 so that the display unit 101 faces the display side, a part of the display area 103 may be used. When folding the display surface inward, a part of the display area 103 that is not visible to the user is hidden. This makes it possible to reduce the power consumption of the display unit 101.

[0029] The display area 103 of the display unit 101 is expanded so that it has a predetermined aspect ratio. For example, the aspect ratio should be set to 9:16. When the display unit 101 is folded (for example, as shown in FIG. 1B), It is preferable to set the aspect ratio to a value close to that of the original. It is possible to make the aspect ratio of the displayed image approximately equal between the open and closed states. As a result, the entire display area 103 that is visually recognized in both the unfolded and folded states has the same size. When enlarging or reducing an image, unnatural white space may appear in either state. Or, the vertical and horizontal enlargement or reduction ratios may be different, causing image distortion. It is possible.

[0030] Moreover, it is preferable that the display unit 101 is provided across two or more surfaces of the housing 102. FIG. 1 shows a case where a display unit 101 is provided along one side surface of a housing 102. At this time, one image is displayed on the entire display area 103 including the part provided on the side of the housing 102. In addition, a part of the display area 103 provided on the side of the housing 102 may display the following: Notify you of incoming e-mails, SNS (social networking services), phone calls, etc. Display of the message, subject of email or SNS, sender name of email or SNS, etc. It can display various information such as date, time, battery level, and antenna reception strength. Alternatively, images having functions such as operation buttons, icons, sliders, etc. may be displayed.

[0031] 1(D) and (E) show an example in which a camera 105 is used for capturing an image.

[0032] Here, a part of the display area 103 of the display unit 101 is designated as an area 1 which functions as a light source during shooting. As shown in FIG. 1(D) and (E), a part of the display unit 101 The light is emitted from the area 111 while being folded back toward the shooting direction of the camera 105. This allows you to brightly illuminate your subject.

[0033] The area 111 functions as a surface light source, and thus has the effect of blurring the shadow when the subject is photographed. When using point light sources such as LEDs or flash lamps, shadows are emphasized too much. However, by using the light emitted from the area 111, it is possible to capture an image with a soft impression. This becomes possible.

[0034] In addition, power consumption is extremely low compared to when a xenon light source is used to illuminate the subject. Therefore, when using a xenon light source, etc., a separate light source is required. There is no need to install a battery. Also, the size of the area 111 can be freely set by the user. It is preferable to make it possible to make the area of ​​the region 111 larger. This makes it possible to reduce the power consumption required to transmit the signal.

[0035] When the area 111 is used as a light source, for example, the same color is displayed across the area 111. For example, white may be displayed over the entire area 111. Alternatively, warm white, neutral white, or daylight white may be displayed. Even if you display white light with a color temperature ranging from 2000K to 8000K, assuming a color temperature such as light color, Since the area 111 is a part of the display unit 101, light of various colors can be used as a light source. Alternatively, a single color other than white, such as red, blue, green, or yellow, can be displayed over the entire area 111. Good too.

[0036] Alternatively, the area 111 may be divided into two or more parts, and each part may be displayed in a different color. Alternatively, the color may be changed continuously across the region 111 (also called gradation). A display may be provided.

[0037] Furthermore, the light emitted from the area 111 may be emitted in accordance with the timing of the photographing, or may be emitted at the same time. It may be fired continuously for a fixed period of time. When shooting video, it is recommended to have the flash fired continuously. preferable.

[0038] Also, as shown in FIG. 1E, the area 112 of the display area 103 that is not folded back is At this time, the photographed image displayed in the area 112 can be displayed in its vertical and horizontal directions. It is preferable to display the ratio as a predetermined value, for example, 3:4. The user can take a picture while viewing the image displayed in area 112. It is also possible to adjust the intensity of the light emitted from the region 111 and the area of ​​the region 111.

[0039] In addition, area 113 of display area 103 can display shooting information for photos and videos. 13 may be placed near the area 112, and may be placed above, below, to the right, or to the left of the area 112. Alternatively, the area 112 and the area 113 may be overlapped. The shooting information that can be displayed in the area 113 includes the aperture value, the shutter speed, and the like. In addition to information such as shutter speed, ISO sensitivity, and focal length, exposure compensation and filter settings , information such as the image quality, resolution, size, and number of gradations of the captured image, and the currently set shooting mode Display information such as (macro mode, night view mode, backlight mode, auto mode, etc.) can be done.

[0040] [Other examples of electronic device configurations] In FIG. 1, the display unit 101 is shown extending to the side surface of the housing 102. It may be provided so as to extend to the surface of the housing 102 on which the camera 105 is disposed.

[0041] In FIG. 2A, the display extends to the rear side of the housing 102 (the side where the camera 105 is disposed). In this example, the display unit 101 is provided in an extended manner. In the portion provided along the back surface of the second substrate 2, a part of the portion is made to function as the region 111. In addition to the folded-back portion of the display unit 101, a portion along the back surface of the housing 102 is preferably By using the LED as a light source during shooting, the brightness of the light can be increased. Since the area of ​​the area 111 is increased, it is possible to improve the effect of blurring the shadows created by the subject. It becomes Noh.

[0042] 2A, a light source 106 may be separately disposed in the housing 102. For example, an LED may be used as the light source 106. can be used interchangeably.

[0043] As shown in FIG. 2B, a display unit 101 is provided along the rear surface of the housing 102. An opening may be provided at the portion overlapping with the camera 105. By surrounding the periphery of 05 with the region 111, even if the subject is very close, This makes it possible to suitably illuminate the subject.

[0044] 3A and 3B, a non-display area 10 surrounding the display area 103 of the display unit 101 is 4, a light emitting area 114 that functions as a light source during photography is disposed. The light emitting area 114 is provided along the outline of the display area 103 .

[0045] The light emitting area 114 may be disposed so as to overlap a part of the non-display area 104, or may be disposed so as not to overlap the non-display area 104. The display may be arranged over the entire area 104. When a part of the unit 101 is provided so as to extend to the rear side of the housing 102, The light emitting area 114 may be disposed in a part or the whole of the non-display area 104 provided along the stomach.

[0046] The light-emitting region 114 has a light-emitting element. The light-emitting element is provided in the display region 103. It is preferable that the light emitting region 114 is formed in the same process as the light emitting element to be formed. A circuit for driving a plurality of pixels in the display area 103, or a plurality of pixels and circuits and an electric It is preferable that the wiring is provided so as to overlap with the wiring for connecting the wiring to the target object.

[0047] A configuration in which a plurality of light emitting elements are provided in the light emitting region 114 and these elements can be made to emit light individually It is preferable that each light-emitting element is controlled by a passive matrix drive. It is preferable that one light emitting element is provided across the light emitting region 114. However, by controlling the light emission individually, only the area facing the shooting direction of the camera 105 is illuminated. This is preferable because it is possible to

[0048] In addition, a plurality of pixels provided in the display area 103 are controlled by active matrix driving. The light emitting elements provided in the light emitting area 114 are controlled by passive matrix driving. By setting the drive system individually in this way, when shooting is not being performed, The supply of power supply potential for driving the light emitting region 114 can be cut off, thereby reducing power consumption. Furthermore, when taking a photograph, the image to be displayed in the display area 103 (for example, a photographed image) can be reduced. The display quality of the light-emitting region 114 can be improved by driving it as needed. For example, when the amount of light from the area 111 is sufficient for photographing, the light emitting area 114 is It is also possible to prevent the motor from being driven.

[0049] In addition, a voltage for causing the light emitting elements in the light emitting region 114 to emit light is applied to the image in the display region 103. For example, the voltage for emitting light emitting elements of the light emitting region 11 may be different from the voltage for emitting light emitting elements of the light emitting region 11. By setting a high voltage for emitting light emitting elements in the light emitting region 114, The brightness of the light from the area 111 can be increased to be higher than the brightness of the light from the area 112. By emitting light at a higher intensity, it is possible to irradiate the subject with light of a higher brightness.

[0050] In addition, the housing 102 may include a processor in which various ICs such as a battery, a computing device, and a driving circuit are mounted. Various sensors including printed wiring boards, wireless receivers, wireless transmitters, wireless power receivers, and acceleration sensors By appropriately incorporating electronic components such as a sensor, the electronic device 100 can be used as a mobile terminal, a mobile display, The housing 102 can function as an image reproducing device, a portable lighting device, etc. , cameras, speakers, various input / output terminals including power supply terminals, various sensors including optical sensors, etc. A sensor, an operation button, etc. may be incorporated.

[0051] Here, the electronic device 100 described above has a configuration having one housing 102, but it may have two or more housings. 4(A) to 4(D) show electronic device 15 having three housings. 0 configuration example is shown.

[0052] FIG. 4A shows the electronic device 150 in an unfolded state. FIG. 4B shows the electronic device 1 4C shows the display unit 10 facing the camera 105 in the shooting direction. FIG. 4(D) shows the case where a part of 1 is directed toward the cutting line XY in FIG. 4(A). 1 shows a schematic cross-sectional view of the

[0053] The electronic device 150 includes three housings (housings 102a, 102b, and 102c). The display unit 101 is held in the housing 102. A hinge 151 is provided between the two housings. The display unit 101 can be bent inward or outward via 51 .

[0054] At least one of the housings 102a, 102b, and 102c is provided with the electronic device described above. At this time, each electronic component can be installed in one of the multiple cases. The housings may be connected via hinges 151. The electronic components in the multiple housings may be electrically connected by connecting wiring or the like. By distributing the electronic components among multiple housings, it is possible to reduce the thickness of each housing.

[0055] Also, as shown in FIG. 4(D), a battery 152 may be incorporated into each of the multiple housings. By providing the battery 152 in each housing, the electronic device 150 can be It can be used for a long time. Also, it is possible to use a small battery to meet a specified capacity. By distributing the batteries 152 in each housing, the physical It is also possible to reduce the thickness, in which case the thickness of the electronic device 150 can be reduced. The thickness of the battery 152 can be reduced by using a stacked type power storage device. For example, a stacked lithium ion battery or the like can be used.

[0056] The electronic device 160 illustrated in FIGS. 5A to 5C has two outer housings (housing 102) and A display unit 101 is provided on the side surface of the housing 10 (102a, 102c) and the rear surface of the housing 10. On the back side of 2c, a camera 105 is provided at a position overlapping with an opening provided in the display unit 101. The figure shows the configuration in which the

[0057] In this way, even if there are multiple housings, the display unit 101 is arranged along two or more surfaces of the housings. By placing the electronic device 160 in such a manner, the display can be displayed on two or more sides of the housing even when the electronic device 160 is folded. This becomes possible.

[0058] Although a configuration having three housings has been shown here, the number of housings is not limited to this. It may be configured to have two housings, or may be configured to have four or more housings. In this case, camera 105 may be disposed on one surface of at least one of the multiple housings.

[0059] In addition, in each of the drawings exemplified above, the thicknesses of the multiple housings are shown to be approximately the same, However, the thickness of each housing may be different. If the thickness of all the housings is the same, the horizontality of the light-emitting surface of the electronic device when it is unfolded is In addition, all of the various electronic components can be mounted in one of the multiple housings. A part or most of the components are integrated into the housing, and the housing is used as a relatively thick main body, and the thickness of the other housings is reduced. It is also possible to reduce the thickness and use the display unit 101 simply as a member for supporting the display unit 101.

[0060] [Display section configuration example] 6A is a schematic top view of the display portion 101. The display portion 101 is made of a flexible substrate. A display area 103, a circuit 121, a circuit 122, and a plurality of wirings 123 are provided on the display device 120. An FPC 124 that is electrically connected to the multiple wirings 123 is attached to the substrate 120 . In addition, an IC 125 is provided on the FPC 124 .

[0061] The display area 103 has a plurality of pixels. The pixels provided in the display area 103 include at least It is preferable that the display device further includes a display element. The display element is typically an organic electroluminescence (EL) element. A light emitting element such as a liquid crystal element or the like can be used.

[0062] The circuit 121 and the circuit 122 are circuits having a function of driving the pixels of the display area 103. For example, it can function as a gate drive circuit. Although the configuration has two circuits sandwiching 103, it may be possible to use only one of them. When a signal is supplied to the pixel via C124, the circuit 121 and the circuit 122 are not required. Alternatively, a different configuration may be used.

[0063] A plurality of wirings 123 are electrically connected to the circuit 121, the circuit 122, or the pixels in the display area 103. Also, some of the wirings 123 are electrically connected to the terminals that are connected to the FPC 124. To be continued.

[0064] In FIG. 6(A), an IC 125 is mounted on an FPC 124 by a COF method or the like. The IC 125 can function as a source driver circuit, for example. Alternatively, the display area 103 may have a function for correcting the image signal to be supplied thereto. Note that a circuit that can function as a source driver circuit is provided over the flexible substrate 120. In cases where the IC125 is mounted externally, or where the circuit is provided externally, the IC125 may not be mounted. In addition, when the number of pixels of the display unit 101 is large, a configuration in which a plurality of FPCs 124 are provided may be used. good.

[0065] Here, when the pixels in the display area 103 have light-emitting elements, there are cases where an image is displayed, and By making the potential supplied to the pixel different when it is used as a light source during photography, In this way, when the light source is used as a light source for photographing, the image is displayed. In this case, the current flowing through the light emitting element can be increased compared to the case where the light emitting element is in a low-temperature state, and the light emitting luminance of the light emitting element can be increased. For example, the display area 103 can be used as the area 111 that functions as a light source during shooting. In this case, the wiring that functions as a gate line electrically connected to the pixel and the wiring that functions as a signal line If a higher (or lower) potential than that used to display an image is supplied to both wirings, Good.

[0066] Therefore, the circuit 121 and the circuit 122 that can function as a gate drive circuit can output two or more potentials. For example, two power lines can be arranged, and one of the power lines can be The potential of the pixel may be supplied to the pixel. The C125 has a configuration in which the output signal has two or more potentials and either potential can be supplied to a pixel. For example, the IC 125 may be configured to have a level shifter circuit. It is only necessary to adopt a configuration in which the output potential (amplitude) of the transistor circuit can be changed.

[0067] In addition, the circuit 121 and the circuit 122 are divided into a plurality of circuits, each of which is driven independently. In FIG. 6B, the circuit 121 may be divided into three circuits (circuits 121a, 121b, and 121c). , and when the circuit 122 is divided into three (circuits 122a, 122b, and 122c), In addition, in FIG. 6B, a plurality of wirings electrically connected to the circuit 121a are shown. A wire 126a, a plurality of wirings 126b electrically connected to the circuit 121b, and a plurality of wirings 126b electrically connected to the circuit 122a a plurality of wirings 127a electrically connected to the circuit 122b; and a plurality of wirings 127b electrically connected to the circuit 122b. 1 shows a configuration having the following:

[0068] The display unit 101 can be folded by dividing a circuit that can function as a gate drive circuit into multiple parts. This makes it easy to prevent a part of the display area 103 that is hidden when the display is folded from being driven. At this time, it becomes easy to cut off the power supply potential supplied to the circuit. The power consumption of the 01 can be made extremely low.

[0069] In addition, the circuit that can function as a gate drive circuit is divided into several parts, and each part is driven individually. This makes it easy to supply a different potential to a portion of the display area 103 than to the other portions. As a result, an image is displayed in a part of the display area 103, and the other part is photographed. For example, in FIG. 6B, In the illustrated configuration, the power supply potential supplied to the circuits 121a and 122a is supplied to the circuits 121b and 122a. b, 121c, and 122c. In this way, the luminance of light emitted from the pixels electrically connected to the circuits 121a and 122a is compared with that of the other parts. can be higher than 1 min.

[0070] In FIG. 6C, the circuit 121, the circuit 122, and a plurality of wirings 123 are overlapped. The figure shows a case where a light emitting region 114 having a function as a light source is provided. In addition, a light-emitting region 114 is provided so as to overlap the circuits and wiring arranged around the display region 103. Therefore, the area of ​​the non-display area of ​​the display unit 101 can be reduced compared to when they are not overlapped. It becomes possible.

[0071] [Example of display area configuration] In the following, a plurality of pixels for displaying an image in the display area 103 and light emitting elements between the pixels will be described. An example in which an element is provided will be described.

[0072] FIG. 7A shows a pattern of pixel electrodes in a pixel provided in the display region 103. Here, the display area 103 is provided with red (R), green (G) or blue (B ) will be described.

[0073] The pixel that emits red light has a pixel electrode 131R. Similarly, the pixel that emits green light has A pixel that emits blue light has a pixel electrode 131G, and a pixel that emits blue light has a pixel electrode 131B.

[0074] In addition, an electrode 132 is provided between adjacent pixels. The electrodes are electrically isolated from each other and arranged in a grid pattern.

[0075] FIG. 7B is a schematic cross-sectional view of the display unit 101 taken along the line AB in FIG. 7A. As an example, FIG. 7B shows a top view of a white-emitting organic EL element. 1 shows a cross section near a light emitting element in the case where an emission type light emitting element is used. A more specific configuration example will be described later.

[0076] Each pixel electrode and the electrode 132 are provided on an insulating layer 141. An insulating layer 143 is provided to cover the end of the electrode 132. A layer containing a light-emitting organic compound (hereinafter referred to as an EL layer 133) covers the insulating layer 143. An electrode 134 is provided to cover the EL layer 133.

[0077] Further, a substrate 142 is provided which is bonded to the insulating layer 141 via a sealing material 144. Color filters 135R, 135G, and 135B are provided on one surface of the plate 142. A color filter 135R that transmits red light is provided so as to overlap the pixel electrode 131R. A color filter 135G that transmits green light is provided so as to overlap the pixel electrode 131G. A color filter 135B that transmits blue light is disposed so as to overlap with the pixel electrode 131B. Moreover, no color filter is provided at a position overlapping with the electrode 132.

[0078] FIG. 7C shows a case where a light-emitting element manufactured by a color-coded method is used. An EL layer 136R that emits red light is provided on the pixel electrode 131R. An EL layer 136G that emits green light is disposed on the pixel electrode 131G, and an EL layer 136G that emits green light is disposed on the pixel electrode 131B. An EL layer 136B that emits blue light is provided on the electrode 132. The LED 130 is provided with an EL layer 133 that emits white light.

[0079] In this example, the substrate 142 is not provided with a color filter. As shown in FIG. 1, a color filter may be provided at a position overlapping each pixel electrode.

[0080] With this configuration, a full-color image can be displayed in the display area 103. Furthermore, white light can be emitted from a light-emitting element including the electrode 132, the EL layer 133, and the electrode 134. Light (W) can be used as a light source when taking pictures.

[0081] In addition, by providing a plurality of such electrodes 132 in the display area 103, It is possible to individually control the light emission of each light element. For example, a light emitting element including an electrode 132 is In the case where the light-emitting element is controlled by a passive matrix driving method, This is preferable because it is not necessary to provide a separate transistor or the like.

[0082] This concludes the description of the display area.

[0083] Although the example in which the light-emitting element is used as the display element has been described, One embodiment of the form is not limited to this.

[0084] For example, in this specification, a display element, a display device which is a device having a display element, or Display panels, light-emitting elements, and light-emitting devices having light-emitting elements can be used in various forms. A display element, a display device, a display panel, a light-emitting element, The element or light-emitting device may be, for example, an EL (electroluminescence) element (organic and inorganic EL elements, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs, Green LED, blue LED, etc.), transistors (transistors that emit light according to the current), Electron emission element, liquid crystal element, electronic ink, electrophoretic element, grating light valve (G LV), plasma display (PDP), MEMS (Micro-Electro-Mechanical Systems) Display elements using a digital micromirror device (DMD), DMS (Digital Micro Shutter), MIRASOL (registered trademark), IMOD (Inter Optical interference, optical shutter-type MEMS display element MEMS display element, electrowetting element, piezoelectric ceramic display , a display element using carbon nanotubes, etc. In addition, contrast, brightness, reflectance, transmittance, etc. can change due to electrical or magnetic effects. An example of a display device using an EL element is an EL display. An example of a display device using electron emission elements is the field emitter. Surface-Mounted Display (FED) or Surface-Mounted Display (SED) ace-conduction Electron-emitter Display) An example of a display device using liquid crystal elements is a liquid crystal display (transmissive liquid crystal Displays, semi-transmissive LCD displays, reflective LCD displays, direct-view LCD displays Play, projection type liquid crystal display), etc. Electronic ink, electronic liquid powder (registered trademark), An example of a display device using an electrophoretic element is electronic paper. In order to realize a transparent or reflective liquid crystal display, a part of the pixel electrode, Alternatively, the entire electrode may function as a reflective electrode. A part or the whole of the material may be made of aluminum, silver, etc. In this case, it is possible to provide a memory circuit such as an SRAM under the reflective electrode. This also makes it possible to reduce power consumption.

[0085] For example, in this specification, an active matrix type having active elements in pixels, Alternatively, a passive matrix system in which the pixels do not have active elements can be used.

[0086] In the active matrix method, a transistor is used as an active element (active element, nonlinear element). By using not only transistors but also various active elements (active elements, nonlinear elements), For example, MIM (Metal Insulator Metal) or T It is also possible to use FD (Thin Film Diode) and other elements. Since the number of manufacturing steps is small, it is possible to reduce manufacturing costs and improve yields. Alternatively, these elements can improve the aperture ratio due to their small size. This makes it possible to achieve low power consumption and high brightness.

[0087] As a non-active matrix type, active elements (active elements, nonlinear elements It is also possible to use a passive matrix type that does not use active elements. Since it does not use any nonlinear elements, there are fewer manufacturing steps, which reduces manufacturing costs and improves yield. It is possible to improve the accuracy. Or, it is possible to use active elements (active elements, nonlinear elements) Since the aperture ratio is not increased, it is possible to achieve low power consumption and high brightness. This can be done.

[0088] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0089] (Embodiment 2) In this embodiment, a light-emitting panel that can be used for a display portion of an electronic device according to one embodiment of the present invention will be described. A configuration example and a manufacturing method example will be described.

[0090] <Example 1> FIG. 8A shows a plan view of the light-emitting panel. An example of a cross-sectional view is shown in FIG. 8(C). The light-emitting panel shown in the first specific example uses a color filter method. In this embodiment, the light-emitting panel is a top-emission type light-emitting panel. For example, one color can be expressed using three sub-pixels of R (red), G (green), and B (blue). A single color is expressed using four sub-pixels: R (red), G (green), B (blue), and W (white). There is no particular limitation on the color elements, and colors other than RGBW may be used. For example, , yellow, cyan, magenta, etc.

[0091] The light-emitting panel shown in FIG. 8A includes a light-emitting section 804, a driving circuit section 806, and an FPC (Flex The light emitting unit 804 and the driving circuit The light emitting element and the transistor included in the path portion 806 are formed by the substrate 801, the substrate 803, and the sealing layer 8 It is sealed by 23.

[0092] The light-emitting panel shown in FIG. 8(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of transistors. A transistor, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, and an insulating layer 82 1, sealing layer 823, overcoat 849, coloring layer 845, light-shielding layer 847, insulating layer 843 , an adhesive layer 841, and a substrate 803. The sealing layer 823, an overcoat 849, an insulating Layer 843, adhesive layer 841, and substrate 803 are transparent to visible light.

[0093] The light emitting portion 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light-emitting element 830 includes a lower electrode 83 on an insulating layer 817. 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. Preferably, the upper electrode 835 is transparent to visible light.

[0094] The light-emitting section 804 includes a colored layer 845 overlapping the light-emitting element 830 and a layer overlapping the insulating layer 821. The colored layer 845 and the light-shielding layer 847 are covered with an overcoat 849. The space between the light emitting element 830 and the overcoat 849 is filled with a sealing layer 823. There are.

[0095] The insulating layer 815 has an effect of suppressing diffusion of impurities into a semiconductor that constitutes a transistor. The insulating layer 817 has a planarizing function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating layer having

[0096] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 8C, one of the transistors included in the driver circuit portion 806 is 1 shows two transistors.

[0097] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. The insulating layer 813 and the substrate 803 are bonded together by the adhesive layer 841. If a film with low water permeability is used for 843, impurities such as water may be easily absorbed into the light emitting element 830 or the transistor 820. This is preferable because it is possible to prevent objects from entering the panel and the reliability of the panel is increased.

[0098] The conductive layer 857 transmits signals (video signals, clock signals, switch signals, etc.) from the outside to the driving circuit section 806. The external input terminal is electrically connected to an external input terminal that transmits a signal (such as a start signal or a reset signal) or a potential. Here, an example is shown in which an FPC808 is provided as an external input terminal. In order to prevent this, the conductive layer 857 is made of the same material and the same wiring as the electrodes and wiring used in the light-emitting section and the driving circuit section. In this embodiment, the conductive layer 857 is formed in the transistor 820. This shows an example in which the electrode is made of the same material and in the same process as the electrode to be used.

[0099] In the light-emitting panel shown in FIG. 8C, the connector 825 is located on the substrate 803. 25 includes a substrate 803, an adhesive layer 841, an insulating layer 843, a sealing layer 823, an insulating layer 817, and The conductive layer 857 is connected through an opening provided in the insulating layer 815. 5 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are connected to each other via the connector 825. When the conductive layer 857 and the substrate 803 overlap, an opening is provided in the substrate 803. By using a substrate having an opening, the conductive layer 857, the connection body 825, and the FP C808 can be electrically connected.

[0100] In the specific example 1, the insulating layer 813, the transistor 820, the light-emitting element 820, and the like are formed on a highly heat-resistant substrate. A substrate 830 is prepared, the prepared substrate is peeled off, and an insulating layer 8 is formed on a substrate 801 using an adhesive layer 811. 13, a transistor 820, and a light-emitting element 830. In addition, in the specific example 1, the insulating layer 843 and the colored layer 845 are formed on a highly heat-resistant substrate. A light-shielding layer 847 is formed, the formed substrate is peeled off, and the light-shielding layer 847 is formed on the substrate 803 using the adhesive layer 841. A light-emitting panel can be produced by transposing the insulating layer 843, the colored layer 845, and the light-shielding layer 847. It shows.

[0101] When using a material with low heat resistance (such as resin) for the substrate, the substrate is exposed to high temperatures during the manufacturing process. Since it is difficult to form a semiconductor substrate, there are limitations on the conditions for forming transistors and insulating layers on the substrate. When using a highly water-permeable material (such as resin) for the substrate, high temperatures are applied to form a low-permeability film. In the manufacturing method of this embodiment, a transistor is preferably formed on a manufacturing substrate having high heat resistance. Since it is possible to manufacture highly reliable transistors and transistors with sufficient water permeability by applying high temperatures, Then, the film with low adhesion can be transferred to the substrate 801 or the substrate 803. In this way, a highly reliable light-emitting panel can be manufactured. A light-weight or thin and highly reliable light-emitting panel can be realized. The details of the manufacturing method will be described later. do.

[0102] <Example 2> FIG. 8B shows a plan view of the light-emitting panel. An example of a cross-sectional view is shown in FIG. 8(D). The light-emitting panel shown in the specific example 2 is different from the light-emitting panel shown in the specific example 1. This is a top-emission type light-emitting panel that uses a color filter method. Only the points that differ from Example 1 will be described in detail, and the points in common with Example 1 will be omitted.

[0103] The light-emitting panel shown in FIG. 8(D) differs from the light-emitting panel shown in FIG. 8(C) in the following respects.

[0104] The light-emitting panel shown in FIG. 8D has a spacer 827 over the insulating layer 821. By providing 827, the distance between the substrate 801 and the substrate 803 can be adjusted.

[0105] In addition, in the light-emitting panel shown in FIG. 8(D), the substrate 801 and the substrate 803 are different in size. The connector 825 is located on the insulating layer 843 and does not overlap the substrate 803. The conductive layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815 are provided with openings. Since there is no need to provide an opening in the substrate 803, the material of the substrate 803 is The fee is not limited.

[0106] <Example 3> FIG. 9A shows a plan view of the light-emitting panel. An example of a cross-sectional view is shown in FIG. 9(C). The light-emitting panel shown in the third concrete example uses a color-coded method. It is a top-emission type light-emitting panel.

[0107] The light-emitting panel shown in FIG. 9A includes a light-emitting section 804, a driving circuit section 806, and an FPC 808. The light emitting element and the transistor included in the light emitting section 804 and the driving circuit section 806 are formed on the substrate 80. 1, the substrate 803, a frame-shaped sealing layer 824, and a sealing layer 823.

[0108] The light-emitting panel shown in FIG. 9C includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of transistors. A transistor, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, and an insulating layer 82 1, a sealing layer 823, a frame-shaped sealing layer 824, and a substrate 803. Plate 803 transmits visible light.

[0109] The frame-shaped sealing layer 824 is preferably a layer having a higher gas barrier property than the sealing layer 823. This prevents moisture and oxygen from entering the light-emitting panel from the outside. This makes it possible to realize a highly reliable light-emitting panel.

[0110] In the third specific example, the light emitted from the light emitting element 830 is taken out of the light emitting panel through the sealing layer 823. Therefore, it is preferable that the sealing layer 823 has a higher light-transmitting property than the frame-shaped sealing layer 824. In addition, it is preferable that the sealing layer 823 has a higher refractive index than the frame-shaped sealing layer 824. In addition, the sealing layer 823 has a smaller volume shrinkage during hardening than the frame-shaped sealing layer 824. is preferred.

[0111] The light emitting portion 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light-emitting element 830 includes a lower electrode 83 on an insulating layer 817. 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. Preferably, the upper electrode 835 is transparent to visible light.

[0112] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 9C, one of the transistors included in the driver circuit portion 806 is 1 shows two transistors.

[0113] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. If a film with low water permeability is used, impurities such as water may penetrate into the light emitting element 830 and the transistor 820. This is preferable because it can suppress the intrusion of foreign matter and increase the reliability of the light-emitting panel.

[0114] The conductive layer 857 serves as an external input terminal for transmitting signals and potentials from the outside to the driving circuit section 806. Electrically connect. Here, an example is shown in which an FPC808 is provided as an external input terminal. Here, the conductive layer 857 is made of the same material as the electrode of the transistor 820. An example produced using the same process is shown below.

[0115] In the light-emitting panel shown in FIG. 9C, the connector 825 is located on the substrate 803. 25 denotes the substrate 803, the sealing layer 823, the insulating layer 817, and the openings provided in the insulating layer 815. The connector 825 is connected to the conductive layer 857 via the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected via the connector 825.

[0116] In the specific example 3, the insulating layer 813, the transistor 820, the light-emitting element 820, and the like are formed on a highly heat-resistant substrate. A substrate 830 is prepared, the prepared substrate is peeled off, and an insulating layer 8 is formed on a substrate 801 using an adhesive layer 811. 13, a transistor 820, and a light-emitting element 830. Since transistors and other devices can be manufactured on a heat-resistant substrate, they can be manufactured at high temperatures. Therefore, it is possible to form a highly reliable transistor and a film with sufficiently low water permeability. By transferring them to the substrate 801, a highly reliable light-emitting panel can be manufactured. As a result, in one embodiment of the present invention, a light-weight or thin light-emitting panel with high reliability can be realized. Cut.

[0117] <Example 4> FIG. 9B shows a plan view of the light-emitting panel. An example of a cross-sectional view is shown in FIG. 9(D). The light-emitting panel shown in the fourth example uses a color filter method. The light-emitting panel used here is a bottom-emission type.

[0118] The light-emitting panel shown in FIG. 9(D) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of transistors. Transistor, conductive layer 857, insulating layer 815, colored layer 845, insulating layer 817a, insulating layer 81 7b, a conductive layer 816, a plurality of light-emitting elements, an insulating layer 821, a sealing layer 823, and a substrate 803 The substrate 801, the adhesive layer 811, the insulating layer 813, the insulating layer 815, the insulating layer 817a, and and insulating layer 817b transmits visible light.

[0119] The light emitting portion 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light-emitting element 830 includes an insulating layer A lower electrode 831 on the lower electrode 831, an EL layer 833 on the lower electrode 831, and an upper The lower electrode 831 is a source electrode or drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 is preferably reflective to visible light. The lower electrode 831 is preferably transparent to visible light. The position of the colored layer 845 overlapping the light emitting element 830 is not particularly limited. If it is provided between the edge layer 817a and the insulating layer 817b, or between the insulating layer 815 and the insulating layer 817a, good.

[0120] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 9D, the driver circuit portion 806 has two transistors. 1 shows two transistors.

[0121] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. When a film with low water permeability is used, the light emitting element 830 and the transistors 820 and 822 are not exposed to water or other impurities. This is preferable because it is possible to suppress the intrusion of impurities and increase the reliability of the light-emitting panel.

[0122] The conductive layer 857 serves as an external input terminal for transmitting signals and potentials from the outside to the driving circuit section 806. Electrically connect. Here, an example is shown in which an FPC808 is provided as an external input terminal. In addition, the conductive layer 857 is formed of the same material and in the same process as the conductive layer 816. Here is an example.

[0123] In the specific example 4, the insulating layer 813, the transistor 820, the light-emitting element 820, and the like are formed on a highly heat-resistant substrate. The substrate is peeled off, and an insulating layer is formed on the substrate 801 using the adhesive layer 811. A light-emitting panel that can be produced by transposing 813, a transistor 820, a light-emitting element 830, etc. Since transistors and other devices can be manufactured on a heat-resistant substrate, they can be manufactured without being exposed to high temperatures. This makes it possible to form highly reliable transistors and films with sufficiently low water permeability. By transferring these to the substrate 801, a highly reliable light-emitting panel can be manufactured. As a result, in one embodiment of the present invention, a light-weight or thin and highly reliable light-emitting panel can be realized. It can be realized.

[0124] <Example 5> FIG. 9E shows an example of a light-emitting panel different from concrete examples 1 to 4.

[0125] The light-emitting panel shown in FIG. 9(E) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a conductive layer 8 14, conductive layer 857a, conductive layer 857b, light-emitting element 830, insulating layer 821, sealing layer 823 , and a substrate 803.

[0126] The conductive layer 857a and the conductive layer 857b are external connection electrodes of the light-emitting panel, and are connected to an FPC or the like. It can be electrically connected.

[0127] The light emitting element 830 includes a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the bottom electrode 831 is covered with an insulating layer 821. The type of the light-extracting side is the top-emission type, the dual-emission type, or the top-emission type. The electrodes, the substrate, the insulating layer, etc. are each transparent to visible light. and electrically connect it to.

[0128] The substrate from which the light is extracted has a hemispherical lens and a microlens array as a light extraction structure. For example, the resin-based film may have a film having a concave-convex structure, a light-diffusing film, or the like. The lens or film is placed on a plate, and the refractive index is the same as that of the substrate or the lens or film. By bonding the light-extraction structure using an adhesive having such properties, a light-extraction structure can be formed.

[0129] The conductive layer 814 is not necessarily required, but it is preferable to reduce the voltage drop caused by the resistance of the lower electrode 831. For the same purpose, the upper electrode 835 and the A conductive layer for electrical connection is formed on the insulating layer 821, the EL layer 833, the upper electrode 835, etc. It may be provided.

[0130] The conductive layer 814 may be made of copper, titanium, tantalum, tungsten, molybdenum, chromium, or neodymium. Materials selected from the group consisting of aluminum, scandium, nickel, and aluminum, or materials containing these as main components The conductive layer 814 can be formed as a single layer or a stacked layer using an alloy material or the like. For example, the thickness can be 0.1 μm or more and 3 μm or less, and preferably, 0.1 μm or more and 0.5 μm or less. It is less than .5μm.

[0131] A paste (such as silver paste) is used as the material for the conductive layer electrically connected to the upper electrode 835. When the conductive layer is heated, the metal constituting the conductive layer becomes granular and aggregates. This results in a structure with many gaps, making it difficult for the EL layer 833 to completely cover the conductive layer, and This is preferable because it makes it easier to electrically connect the conductive layer to the conductive layer.

[0132] In Example 5, an insulating layer 813, a light-emitting element 830, and the like are fabricated on a highly heat-resistant fabrication substrate. The substrate is peeled off, and an insulating layer 813 and a light-emitting element 83 are formed on the substrate 801 using an adhesive layer 811. This shows a light-emitting panel that can be manufactured by transposing 0, etc. on a highly heat-resistant manufacturing substrate. By applying high temperature, an insulating layer 813 or the like having a sufficiently low water permeability is formed, and then the insulating layer 813 is transferred to the substrate 801. As a result, a light-emitting panel with high reliability can be manufactured. This makes it possible to realize a thin and highly reliable light-emitting panel.

[0133] <Examples of materials> Next, materials that can be used for the light-emitting panel will be described. The explanation of the configuration may be omitted.

[0134] The substrate can be made of materials such as glass, quartz, organic resin, metal, and alloy. The substrate on the side from which light from the optical element is extracted is made of a material that is translucent to the light.

[0135] In particular, it is preferable to use a flexible substrate. For example, a substrate made of organic resin or a flexible material may be used. Any thickness of glass, metal or alloy may be used.

[0136] Since organic resin has a smaller specific gravity than glass, when organic resin is used as a flexible substrate, This is preferable because it allows the light-weight light-emitting panel to be made lighter than when glass is used.

[0137] It is preferable to use a highly tough material for the substrate. This makes it possible to achieve excellent impact resistance and fracture resistance. For example, organic resin substrates and thin metal substrates can be used. By using an alloy substrate, it is lighter and less susceptible to breakage than when using a glass substrate. It is possible to realize a light-emitting panel.

[0138] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making it possible to This is preferable because it can suppress local temperature rises in the panel. The thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable to do so.

[0139] The material constituting the metal substrate or alloy substrate is not particularly limited. For example, aluminum The preferred materials are aluminum, copper, nickel, aluminum alloys, stainless steel, and other metal alloys. It can be used appropriately.

[0140] In addition, if a material with high thermal emissivity is used for the substrate, the surface temperature of the light-emitting panel will increase. For example, the substrate can be thermally bonded to a metal substrate, and the damage to the light-emitting panel and the deterioration of its reliability can be suppressed. A stack of layers with high emissivity (for example, metal oxides or ceramic materials can be used) It may also be of this structure.

[0141] As a material having flexibility and light transmission, for example, polyethylene terephthalate (PE T), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin Resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, Examples of resins that can be used include polystyrene resins, polyamide-imide resins, and polyvinyl chloride resins. It is preferable to use a material with a low expansion coefficient, for example, polyamide-imide resin, polyimide Resin, PET, etc. can be suitably used. In addition, a substrate in which a fiber body is impregnated with resin (printed film) can be used. Use boards with a lower thermal expansion coefficient by mixing inorganic fillers with organic resins. It is also possible.

[0142] As for the flexible substrate, the layer using the above material acts as a hard layer to protect the surface of the device from scratches. Coating layers (e.g., silicon nitride layers, etc.) and layers of materials that can disperse pressure (e.g., aramid layers, etc.) The insulating layer may be laminated with a layer of a polymeric mide resin or the like.

[0143] The flexible substrate may be used by laminating a plurality of layers. In particular, a structure having a glass layer is preferable. This will improve the barrier properties against water and oxygen, making it possible to create a highly reliable light-emitting panel. can.

[0144] For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closer to the light emitting element is The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. The thickness of the glass layer is preferably 25 μm or more and 100 μm or less. A glass layer having such a thickness is highly resistant to water and oxygen. The organic resin layer can be made thicker than 1 mm thick and has high barrier properties against water and flexibility. The thickness of the thin film is set to 0 μm or more and 200 μm or less, and preferably 20 μm or more and 50 μm or less. By placing the mechanical resin layer on the outside of the glass layer, breakage or cracks in the glass layer are suppressed. The mechanical strength can be improved by using such a composite material of glass material and organic resin. By applying this to the substrate, it is possible to create a highly reliable and flexible light-emitting panel. can.

[0145] For the adhesive layer and sealing layer, there are photo-curable adhesives such as UV-curable adhesives, reaction-curable adhesives, and heat-curable adhesives. Various curing adhesives such as adhesives, anaerobic adhesives, etc. can be used. The following resins are available: epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, Imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin Examples of the resin include ethylene vinyl acetate (EVA) resin. In particular, the permeability of epoxy resin and the like is improved. A material with low wettability is preferable. A two-part mixed resin may also be used. etc. may also be used.

[0146] The resin may contain a desiccant. For example, an oxide of an alkaline earth metal (an acid The material used is one that adsorbs moisture by chemical adsorption, such as calcium chloride or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. If a desiccant is included, impurities such as moisture can be prevented from adsorbing to the functional element. This is preferable because it is possible to suppress the intrusion of foreign matter and improve the reliability of the light-emitting panel.

[0147] In addition, by mixing a filler having a high refractive index or a light scattering material into the resin, a light emitting element can be formed. For example, titanium oxide, barium oxide, Zeolite, zirconium, etc. can be used.

[0148] The structure of the transistor in the light-emitting panel is not particularly limited. For example, a staggered transistor The transistor may be a top gate transistor or an inverted staggered transistor. The transistor may have either a top gate type or a bottom gate type structure. The semiconductor material is not particularly limited, and examples thereof include silicon and germanium. , In-Ga-Zn-based metal oxides, etc. An oxide semiconductor including one of these may be used.

[0149] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor having a partially crystalline region) If a semiconductor having crystallinity is used, the This is preferable because it is possible to suppress deterioration of the resistor characteristics.

[0150] In order to stabilize the characteristics of the transistor, it is preferable to provide an undercoat film. , silicon oxide film, silicon nitride film, silicon oxynitride film, silicon nitride oxide film, etc. The base film can be formed by a single layer or a multilayer structure using an organic insulating film. , CVD (Chemical Vapor Deposition) method (Plasma CVD method, thermal CVD method, MOCVD (Metal Organic CVD) method, etc.), ALD (Atomic Layer Deposition), coating, printing, etc. In addition, the undercoat film does not have to be provided if it is not necessary. The layer 813 can also serve as an underlayer for the transistor.

[0151] The light-emitting element may be a self-emitting element that is illuminated by a current or a voltage. The category includes devices whose light intensity can be controlled. For example, light-emitting diodes (LEDs), organic An EL element, an inorganic EL element, etc. can be used.

[0152] The light-emitting elements are top emission type, bottom emission type, and dual emission type. The electrode on the light extraction side is made of a conductive film that transmits visible light. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. stomach.

[0153] The conductive film that transmits visible light is, for example, indium oxide or indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide, Gallium-doped It can be formed using zinc oxide with added metals. It can also be formed using gold, silver, platinum, magnesium , nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, if Metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (e.g. For example, titanium nitride can be used by forming it thin enough to have light transmission properties. A laminated film of the above materials can also be used as the conductive layer. For example, a layer of silver and magnesium It is preferable to use a laminated film of an alloy of tungsten and ITO, since the electrical conductivity can be increased. Graphene or the like may also be used.

[0154] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, etc. Metallic materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above-mentioned metal materials and alloys may be used. Tungsten, neodymium, germanium, etc. may be added. Aluminum alloys such as tungsten alloys, aluminum-nickel alloys, and aluminum-neodymium alloys Alloys containing palladium (aluminum alloys), silver and copper alloys, silver, palladium and copper alloys, It can be formed using an alloy containing silver, such as an alloy of silver and magnesium. The alloy is preferable because of its high heat resistance. By laminating the metal oxide film, the oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO A laminated film of an alloy of silver and magnesium and ITO, or the like can be used.

[0155] The electrodes may be formed by vapor deposition or sputtering. The shape is created using a discharge method such as the ink jet method, a printing method such as the screen printing method, or a plating method. It can be achieved.

[0156] A voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 831 and the upper electrode 835. When this occurs, holes are injected into the EL layer 833 from the anode side, and electrons are injected from the cathode side. The electrons and holes are recombined in the EL layer 833, and the light-emitting material contained in the EL layer 833 emits light. It shines.

[0157] The EL layer 833 has at least a light-emitting layer. The EL layer 833 has the following layers other than the light-emitting layer: Materials with high hole injection properties, materials with high hole transport properties, hole blocking materials, materials with high electron transport properties A material with high electron injection properties or a bipolar material (high electron transport and hole transport properties) The layer may further include a layer containing a material such as a metal.

[0158] The EL layer 833 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 833 may each be formed by deposition (vacuum deposition). It can be formed by methods such as the transfer method, printing method, inkjet method, coating method, etc. Cut.

[0159] It is preferable that the light emitting element is provided between a pair of insulating films having low water permeability. This makes it possible to prevent impurities such as water from entering the light emitting element, thereby preventing a decrease in the reliability of the light emitting device. Can be controlled.

[0160] Insulating films with low water permeability include silicon nitride films and silicon oxynitride films, which are made of nitrogen and silicon. and films containing nitrogen and aluminum, such as an aluminum nitride film. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0161] For example, the water vapor permeability of a low-permeability insulating film is 1×10 -5 [g / m 2 ·day] or later Lower, preferably 1 x 10 -6 [g / m 2 ·day] or less, preferably 1×10 -7 [ g / m 2 ·day] or less, and more preferably 1×10 -8 [g / m 2 ·day] or less do.

[0162] It is preferable to use an insulating film with low water permeability for the insulating layer 813 and the insulating layer 843.

[0163] The insulating layer 815 may be, for example, a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film. In addition, an inorganic insulating film such as an inorganic film can be used. The insulating layer 817b may be made of, for example, polyimide, acrylic, polyamide, or polyimide. Organic materials such as amide and benzocyclobutene resins can be used. Low dielectric constant materials (low-k materials) can be used. In addition, multiple insulating films can be stacked. Each insulating layer may be formed by

[0164] The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. For example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy resin, etc. In particular, photosensitive resin materials can be used. It is preferable that the side wall of the opening is formed as an inclined surface having a continuous curvature. I wish.

[0165] The method for forming the insulating layer 821 is not particularly limited, but may be a photolithography method, a sputtering method, or the like. , deposition method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing It is advisable to use a printing method, etc.

[0166] The spacer 827 may be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, inorganic insulating materials and organic insulating materials can be used for the insulating layer. Examples of metal materials that can be used include titanium and aluminum. The spacer 827 containing a conductive material and the upper electrode 835 are electrically connected to each other. This makes it possible to suppress a potential drop caused by the resistance of the upper electrode 835. The shape of the 27 may be either a forward taper shape or a reverse taper shape.

[0167] For light-emitting panels that function as electrodes or wiring of transistors or auxiliary electrodes of light-emitting elements The conductive layer used may be, for example, molybdenum, titanium, chromium, tantalum, tungsten, or aluminum. Metal materials such as aluminum, copper, neodymium, scandium, etc., or alloy materials containing these elements The conductive layer can be formed as a single layer or a laminated layer using a conductive metal oxide. The conductive metal oxide may be indium oxide (In2O3, etc.). ), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, indium zinc oxide (I n2O3-ZnO, etc.) or these metal oxide materials containing silicon oxide It is possible.

[0168] The colored layer is a colored layer that transmits light of a specific wavelength band. For example, A red (R) color filter transmits light in the green wavelength range, and a green (G) color filter transmits light in the green wavelength range. A blue (B) color filter that transmits light in the blue wavelength band is used. Each color layer can be formed by using various materials and by printing, inkjet printing, photolithography, etc. They are formed at desired positions by an etching method using a graphic technique or the like.

[0169] The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from the adjacent light-emitting elements. The colored layer is provided with an end portion that is light-shielding to suppress color mixing between adjacent light-emitting elements. By providing the light-shielding layer so as to overlap the light-shielding layer, it is possible to suppress light leakage. Materials that block light emitted from the light-emitting element can be used, including, for example, metal materials, pigments, and dyes. The black matrix may be formed using a resin material that includes the light-shielding layer. If the light emitting portion is provided in an area other than the light emitting portion, unintended light leakage due to guided light can be suppressed. This is preferable.

[0170] In addition, an overcoat may be provided to cover the colored layer and the light-shielding layer. By doing so, it is possible to prevent impurities contained in the colored layer from diffusing into the light emitting element. The overcoat is made of a material that transmits light emitted from the light emitting element, such as silicon nitride. It uses inorganic insulating films such as silicon oxide films, and organic insulating films such as acrylic films and polyimide films. Alternatively, the insulating film may have a laminated structure of an organic insulating film and an inorganic insulating film.

[0171] In addition, when the material for the sealing layer is applied onto the colored layer and the light-shielding layer, the material for the overcoat is It is preferable to use a material that has high wettability with respect to the material of the sealing layer. As the substrate, an oxide conductive film such as an ITO film or a metal film such as an Ag film that is thin enough to have transparency is used. It is preferred to use a membrane.

[0172] The connector is a paste or sheet made of a thermosetting resin mixed with metal particles. For example, a material that exhibits anisotropic conductivity when bonded by heat and pressure can be used. For example, particles with layers of two or more metals, such as nickel particles coated with gold, are used. It is preferable that

[0173] <Production method example> Next, a method for manufacturing a light-emitting panel will be illustrated with reference to FIGS. The following description will be given taking the light-emitting panel having the configuration of 1 (FIG. 8(C)) as an example.

[0174] First, a peeling layer 203 is formed on a substrate 201, and an insulating layer 813 is formed on the peeling layer 203. Next, a plurality of transistors, a conductive layer 857, an insulating layer 815, and an insulating film are formed on the insulating layer 813. An edge layer 817, a plurality of light-emitting elements, and an insulating layer 821 are formed. Note that the conductive layer 857 is exposed. In this manner, openings are formed in the insulating layer 821, the insulating layer 817, and the insulating layer 815 (FIG. 10(A)). ).

[0175] In addition, a peeling layer 207 is formed on the production substrate 205, and an insulating layer 843 is formed on the peeling layer 207. Next, a light-shielding layer 847, a coloring layer 845, and an overcoat 84 are formed on the insulating layer 843. 9 is formed (Figure 10(B)).

[0176] The substrates 201 and 205 are made of a glass substrate, a quartz substrate, and a surface treatment substrate, respectively. A fiber substrate, a ceramic substrate, a metal substrate, etc. can be used.

[0177] The glass substrate may be made of, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as quartz glass, barium borosilicate glass, etc. can be used. If the degree of hardness is high, it is advisable to use one with a strain point of 730°C or higher. By adding more BaO, a more practical heat-resistant glass can be obtained. Russ etc. can be used.

[0178] When a glass substrate is used as the substrate, a silicon oxide film, an acid film, etc. are interposed between the substrate and the peeling layer. When an insulating film such as a silicon oxynitride film, a silicon nitride film, or a silicon oxynitride film is formed, the glass This is preferable because it can prevent contamination from the substrate.

[0179] The peeling layers 203 and 207 are made of tungsten, molybdenum, and titanium, respectively. Tantalum, Niobium, Nickel, Cobalt, Zirconium, Zinc, Ruthenium, Rhodium An element selected from the group consisting of ruthenium, palladium, osmium, iridium, and silicon, It is made of an alloy material or a compound material containing the element, and is a single layer or a laminated layer. The crystal structure of the layer containing silicon may be any of amorphous, microcrystalline, and polycrystalline.

[0180] The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, etc. The coating method includes a spin coating method, a droplet ejection method, and a dispense method.

[0181] When the peeling layer has a single layer structure, it is preferably a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten and tungsten oxide. A layer containing an oxynitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing a tungsten oxide or nitride. Alternatively, a layer containing an oxide or oxynitride of a mixture of fluorine and molybdenum may be formed. A mixture of tungsten and molybdenum is, for example, a mixture of tungsten and molybdenum. Correct.

[0182] In addition, a layer including tungsten and a layer including a tungsten oxide may be used as the peeling layer. When forming a structure, a layer containing tungsten is formed, and an insulating layer formed of oxide is formed on the layer. By forming a film, a tungsten oxide-containing film is formed at the interface between the tungsten layer and the insulating film. Alternatively, the surface of the layer containing tungsten may be subjected to a thermal oxidation treatment. Treatment with oxygen plasma, nitrous oxide (N2O) plasma, ozone water, and other highly oxidizing agents A layer containing tungsten oxide may be formed by treating with a solution or the like. Treatment and heating may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The above plasma treatment or heat treatment may be performed under a mixed gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film that will be formed later. be.

[0183] Each insulating layer is formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. For example, it is possible to form a thin film at a temperature of 250°C or higher and 400°C or higher by plasma CVD. By forming the membrane at a temperature of 0.4 °C or lower, it is possible to obtain a dense membrane with extremely low water permeability.

[0184] Thereafter, the surface of the production substrate 205 on which the colored layer 845 and the like are provided or the light-emitting element of the production substrate 201 is A material for the sealing layer 823 is applied to the surface on which the chip 830 and the like are provided, and the The fabrication substrate 201 and the fabrication substrate 205 are bonded together so that their surfaces face each other (FIG. 10( C).

[0185] Then, the fabrication substrate 201 is peeled off, and the exposed insulating layer 813 and substrate 801 are bonded to the adhesive layer 81 1. The production substrate 205 is peeled off, and the exposed insulating layer 843 and the substrate 11A, the substrate 803 is attached to the conductive layer 802 using an adhesive layer 841. Although the conductive layer 857 does not overlap with the substrate 803, the conductive layer 857 and the substrate 803 may overlap with each other.

[0186] For example, a peeling layer may be formed by a method using a film made of a When a layer including a metal oxide film is formed on the side in contact with the peeling layer, the metal oxide film is crystallized. The layer to be peeled off can be peeled off from the substrate by weakening the layer to be peeled off. When an amorphous silicon film containing hydrogen is formed as a peeling layer between the substrate and the peeled layer, the laser beam The amorphous silicon film is removed by irradiation or etching, so that the layer to be peeled off is separated from the production substrate. The peeling layer can be peeled off from the layer to be peeled off. The metal oxide film is weakened by crystallization, and a part of the peeling layer is dissolved in a solution or NF. 3. After removal by etching using fluoride gas such as BrF3 or ClF3, the material was weakened. It can be peeled off at the metal oxide film. Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as a peeling layer. (e.g., hydrogen-containing amorphous silicon film, hydrogen-containing alloy film, oxygen-containing alloy film, etc.) The peeling layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained in the peeling layer as gas. A method of promoting peeling between the peeled layer and the substrate by exposing the peeled layer to the substrate may also be used. The substrate is mechanically removed or fluorinated with a solution or fluoride gas such as NF3, BrF3, or ClF3. In this case, the peeling layer is not required. good.

[0187] In addition, the peeling process can be performed more easily by combining a plurality of the above peeling methods. In other words, laser irradiation, etching of the peeling layer with gas or solution, sharp knife or Mechanical removal is performed using a scalpel or similar tool to make the peeling layer and the layer to be peeled easier to peel off. Peeling can also be achieved by physical force (mechanically, etc.).

[0188] In addition, a liquid is permeated into the interface between the release layer and the layer to be peeled off, and the layer to be peeled off is peeled off from the substrate. Also, the peeling may be performed while pouring liquid such as water on the film.

[0189] As for other peeling methods, when the peeling layer is made of tungsten, it is possible to use ammonia water and The peeling layer may be etched with a mixed solution of hydrogen peroxide and water to perform the peeling.

[0190] In addition, if peeling can be performed at the interface between the preparation substrate and the layer to be peeled off, a peeling layer may not be provided. For example, glass is used as the substrate, and polyimide, polyester, or polyimide is placed in contact with the glass. Forming organic resins such as polyolefin, polyamide, polycarbonate, and acrylic, Insulating films and transistors are formed on the resin. In this case, the organic resin is heated. The film can be peeled off at the interface between the substrate and the organic resin. A metal layer is provided, and the metal layer is heated by passing an electric current through the metal layer, and an organic resin is formed at the interface between the metal layer and the organic resin. Peeling may also be performed.

[0191] Finally, the insulating layer 843 and the sealing layer 823 are opened to expose the conductive layer 857. (FIG. 11B). In the case where the substrate 803 overlaps with the conductive layer 857, The substrate 803 and adhesive layer 841 are also opened to expose 7 (FIG. 11(C)). The method is not particularly limited, and examples of the method include a laser ablation method, an etching method, an ion beam method, and the like. A sputtering method or the like may be used. Also, the film on the conductive layer 857 may be cut with a sharp blade or the like. Alternatively, an incision may be made in the membrane using a cutting tool and a portion of the membrane may be peeled off using physical force.

[0192] In this manner, a light-emitting panel can be manufactured.

[0193] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0194] (Embodiment 3) In this embodiment, a folding LCD panel that can be used for a display portion of an electronic device according to one embodiment of the present invention will be described. A possible configuration of the touch panel will be described with reference to Figs. 12 to 15. For details on the cost, please refer to embodiment 2.

[0195] <Configuration example 1> Fig. 12(A) is a top view of the touch panel. Fig. 12(B) is a diagram showing the touch panel shown by the dashed line in Fig. 12(A). FIG 12(C) is a cross-sectional view taken along the dashed line in FIG 12(A) and the dashed line in FIG 12(C). FIG. 1 is a cross-sectional view between EF.

[0196] As shown in FIG. 12A, a touch panel 390 includes a display unit 301 .

[0197] The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. This allows the detection of a finger or the like touching the display unit 301. A touch sensor can be formed using the above-mentioned.

[0198] The pixel 302 includes a number of sub-pixels (e.g., sub-pixel 302R), each of which includes a light-emitting element and a The pixel circuit is capable of supplying power to drive the light emitting element.

[0199] The pixel circuit includes a wiring that can supply a selection signal and a wiring that can supply an image signal. The wiring is electrically connected to the wiring.

[0200] The touch panel 390 also includes a scan line driver that can supply a selection signal to the pixel 302. A circuit 303g(1) and an image signal line driving circuit capable of supplying an image signal to the pixel 302. It has a path 303s(1).

[0201] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

[0202] The imaging pixel circuit includes wiring that can supply a control signal and a power supply potential. The wiring is electrically connected to the semiconductor device.

[0203] The control signal may be, for example, a signal to select an imaging pixel circuit that reads out a recorded imaging signal. a signal that can initialize the imaging pixel circuit; and a signal that can detect light by the imaging pixel circuit. Examples of such signals include a signal that can determine the time at which the signal is detected.

[0204] The touch panel 390 may provide control signals to the imaging pixels 308. and an image pickup signal line drive circuit 303s(2) that reads out an image pickup signal. .

[0205] As shown in FIG. 12B, the touch panel 390 is disposed on a substrate 510 and faces the substrate 510. The semiconductor device has a substrate 570.

[0206] A flexible material can be suitably used for the substrate 510 and the substrate 570 .

[0207] Materials that suppress the permeation of impurities can be suitably used for the substrates 510 and 570. For example, if the water vapor transmission rate is 10 -5 g / m 2 ·day or less, preferably 10 -6 g / m 2 Materials with a shelf life of 0.1-day or less can be preferably used.

[0208] Materials having approximately the same linear expansion coefficient can be suitably used for the substrates 510 and 570. For example, if the linear expansion coefficient is 1×10 -3 / K or less, preferably 5×10-5 / K or less, better Preferably 1×10 -5 A material having a viscosity of 0.1 to 1.0 μm may be preferably used.

[0209] The substrate 510 is made up of a flexible substrate 510b and an insulating layer 510a for preventing impurities from diffusing into the light emitting element. , and an adhesive layer 510c for bonding the flexible substrate 510b and the insulating layer 510a is laminated. It is a laminate.

[0210] The substrate 570 includes a flexible substrate 570b and an insulating layer 570a for preventing impurities from diffusing into the light-emitting element. and an adhesive layer 570c that bonds the flexible substrate 570b and the insulating layer 570a. do.

[0211] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), poly Imide, polycarbonate or acrylic, urethane, epoxy or siloxane bonds A material containing a resin having the above formula can be used for the adhesive layer.

[0212] The sealing layer 360 bonds the substrate 570 and the substrate 510 together. In addition, when light is extracted to the sealing layer 360 side, the sealing layer 360 is a sealing layer. A layer that optically bonds two members (here, substrate 570 and substrate 510) sandwiching stop layer 360. (hereinafter, also referred to as an optical bonding layer) also functions as a pixel circuit and a light-emitting element (for example, the first The light emitting element 350 R is between the substrate 510 and the substrate 570 .

[0213] The pixel 302 includes a subpixel 302R, a subpixel 302G, and a subpixel 302B (FIG. 12). In addition, the subpixel 302R includes a light-emitting module 380R, and the subpixel 302G includes a light-emitting The subpixel 302B comprises a light emitting module 380G, and the subpixel 302B comprises a light emitting module 380B.

[0214] For example, the subpixel 302R supplies power to the first light emitting element 350R and the second light emitting element 350R. (FIG. 12B) The light emitting module 380R includes a first light emitting element 350R and an optical element (for example, a first It has a colored layer 367R).

[0215] The first light emitting element 350R includes a first lower electrode 351R, an upper electrode 352, a first The EL layer 353 is between the electrode 351R and the upper electrode 352 (FIG. 12(C)).

[0216] The EL layer 353 includes a first EL layer 353a, a second EL layer 353b, and a first EL layer 353c. There is an intermediate layer 354 between 53a and the second EL layer 353b.

[0217] The light emitting module 380R has a first colored layer 367R on a substrate 570. Any material that transmits light having a certain wavelength may be used, for example, red, green, or blue. A material that selectively transmits light can be used. Alternatively, the light emitted by the light-emitting element can be directly transmitted through the material. Alternatively, a transparent region may be provided.

[0218] For example, the light emitting module 380R includes a first light emitting element 350R and a first color layer 367R. The sealing layer 360 is in contact with the substrate 30.

[0219] The first colored layer 367R is located so as to overlap the first light emitting element 350R. A part of the light emitted by the first light emitting element 350R is reflected by the sealing layer 360, which also serves as an optical bonding layer, and the first The light is transmitted through the colored layer 367R and emitted to the outside of the light emitting module 380R as shown by the arrow in the figure. It is served.

[0220] The touch panel 390 includes a light-shielding layer 367BM on a substrate 570. The light-shielding layer 367BM is , and is provided so as to surround a colored layer (for example, the first colored layer 367R).

[0221] The touch panel 390 includes an anti-reflection layer 367p at a position overlapping the display unit 301. As the antireflection layer 367p, for example, a circular polarizing plate can be used.

[0222] The touch panel 390 includes an insulating layer 321. The insulating layer 321 includes a transistor 302t. The insulating layer 321 serves to flatten the unevenness caused by the pixel circuits. In addition, the diffusion of impurities into the transistor 302t and the like can be suppressed. A laminate of insulating layers that can be formed can be applied to the insulating layer 321 .

[0223] The touch panel 390 includes a light emitting element (for example, a first light emitting element 350R) disposed on an insulating layer 321. has.

[0224] The touch panel 390 has a partition wall 328 overlapping an end of the first lower electrode 351R and an insulating layer 3. 21. Also, a spacer 329 for controlling the distance between the substrate 510 and the substrate 570 is provided on the substrate 510. It is provided on the wall 328 .

[0225] The image signal line driver circuit 303s(1) includes a transistor 303t and a capacitor 303c. The driver circuit can be formed on the same substrate as the pixel circuit in the same process. As shown in FIG. 3B, the transistor 303t has a second gate 304 on the insulating layer 321. The second gate 304 is electrically connected to the gate of the transistor 303t. Alternatively, they may be provided with different potentials. A second gate 304 may be provided for transistor 308t, transistor 302t, etc.

[0226] The imaging pixel 308 has a photoelectric conversion element 308p and converts light irradiated onto the photoelectric conversion element 308p into The imaging pixel circuit includes a transistor 308t. include.

[0227] For example, a pin-type photodiode can be used as the photoelectric conversion element 308p.

[0228] The touch panel 390 includes wiring 311 through which a signal can be supplied, and a terminal 319. The wiring 311 is provided to supply signals such as image signals and synchronization signals. The FPC 309(1) is electrically connected to the terminal 319. 1) may have a printed wiring board (PWB) attached.

[0229] The transistors formed in the same process are transistor 302t, transistor 303 t, transistor 308t, etc. Please refer to embodiment 2.

[0230] In addition to the gate, source, and drain of the transistor, each element constituting the touch panel Materials that can be used for the seed wiring and electrodes include aluminum, titanium, chromium, and nickel. Nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten Metals such as tungsten or alloys containing these as the main components are used in a single layer structure or a multilayer structure. For example, a single-layer structure of an aluminum film containing silicon, or a structure in which an aluminum film is laminated on a titanium film, Two-layer structure, a two-layer structure in which an aluminum film is laminated on a tungsten film, a copper-magnesium- Two-layer structure with copper film laminated on aluminum alloy film, two-layer structure with copper film laminated on titanium film A two-layer structure in which a copper film is laminated on a tungsten film, a titanium film or titanium nitride film and its titanium An aluminum film or a copper film is laminated on the titanium nitride film or the titanium film, and a titanium film is further laminated on the aluminum film or the copper film. A three-layer structure in which a titanium nitride film or a molybdenum nitride film is formed, a molybdenum film or a molybdenum nitride film, and An aluminum film or a copper film is laminated on the molybdenum film or the molybdenum nitride film, and There is also a three-layer structure in which a molybdenum film or molybdenum nitride film is formed on top of the molybdenum oxide film. Transparent conductive materials containing indium, tin oxide, or zinc oxide may also be used. The use of copper, which is rich in copper, is preferable because it improves the controllability of the shape by etching.

[0231] <Configuration example 2> 13(A) and (B) are perspective views of the touch panel 505. FIG. 14 is a cross-sectional view taken along the dashed line X1-X2 in FIG. 13(A). be.

[0232] The touch panel 505 includes a display unit 501 and a touch sensor 595 (FIG. 13(B)). The touch panel 505 includes a substrate 510, a substrate 570, and a substrate 590. , substrate 510, substrate 570 and substrate 590 are all flexible.

[0233] The display unit 501 includes a substrate 510, a plurality of pixels on the substrate 510, and a display device for supplying signals to the pixels. The plurality of wirings 511 are arranged on the outer periphery of the substrate 510. The terminal 519 is connected to the FPC 509 (1 ) and electrically connect it to

[0234] The substrate 590 includes a touch sensor 595 and a plurality of electrodes electrically connected to the touch sensor 595. The wiring 598 is routed around the periphery of the substrate 590, and a part of the wiring 598 is The terminal is electrically connected to the FPC 509(2). 13B, for the sake of clarity, the photodiode 590 is shown on the rear surface side (substrate 510 side) of the substrate 590. The electrodes, wiring, etc. of the touch sensor 595 are indicated by solid lines.

[0235] As the touch sensor 595, for example, a capacitive touch sensor can be used. The capacitance type includes a surface type capacitance type and a projected type capacitance type.

[0236] The projected capacitive type is classified into self-capacitance type, mutual capacitance type, etc., mainly based on the difference in the driving method. The mutual capacitance method is preferable because it enables simultaneous multi-point detection.

[0237] In the following, the case where a projected capacitive touch sensor is applied will be described with reference to FIG. This will be explained using:

[0238] In addition, various sensors capable of detecting the proximity or contact of a detection target such as a finger are used. It can be used.

[0239] The projected capacitive touch sensor 595 has an electrode 591 and an electrode 592. 591 is electrically connected to one of the multiple wirings 598, and the electrode 592 is connected to the multiple wirings 598. The other of the two is electrically connected to the other of the two.

[0240] As shown in FIGS. 13(A) and 13(B), the electrodes 592 are arranged in a single direction. The shape is such that two quadrilaterals are connected at their corners.

[0241] The electrode 591 is quadrilateral and is repeatedly arranged in a direction intersecting the direction in which the electrodes 592 extend. It has been done.

[0242] The wiring 594 electrically connects the two electrodes 591 that sandwich the electrode 592. It is preferable that the area of ​​the intersection between the pole 592 and the wiring 594 be as small as possible. This reduces the area of ​​the region where no electrodes are provided, and reduces unevenness in transmittance. As a result, unevenness in the luminance of the light passing through the touch sensor 595 can be reduced.

[0243] The shapes of the electrodes 591 and 592 are not limited to this, and may take various shapes. For example, multiple electrodes 591 are arranged with as few gaps as possible, and the electrodes 591 are connected to each other via an insulating layer. 92 may be provided at intervals so that there is an area that does not overlap with the electrode 591. At this time, a dummy electrode that is electrically insulated from the two adjacent electrodes 592 is placed between the adjacent electrodes 592. Providing an electrode is preferable because it makes it possible to reduce the area of ​​the region with different transmittance.

[0244] The touch sensor 595 includes a substrate 590, electrodes 591 arranged in a staggered pattern on the substrate 590, and The insulating layer 593 covers the electrodes 591 and 592, and the adjacent electrodes 591 and 592. The wiring 594 electrically connects the

[0245] The adhesive layer 597 is formed on the substrate 590 so that the touch sensor 595 overlaps the display unit 501. It is pasted onto board 570.

[0246] The electrode 591 and the electrode 592 are formed using a light-transmitting conductive material. The conductive materials that can be used are indium oxide, indium tin oxide, and indium zinc oxide. Conductive oxides such as zinc oxide and zinc oxide doped with gallium can be used. A film containing graphene may also be used. The film containing graphene may be formed, for example, in a film shape. The graphene oxide-containing film can be reduced to form the film. The method for removing the resin from the resin can be, for example, a method of applying heat.

[0247] After forming a film of a light-transmitting conductive material on a substrate 590 by a sputtering method, By using various patterning techniques such as lithography, unnecessary parts are removed to form electrodes 59. 1 and electrode 592 can be formed.

[0248] The material used for the insulating layer 593 is, for example, a resin such as acrylic or epoxy. In addition to resins with siloxane bonds, silicon oxide, silicon oxynitride, and aluminum oxide It is also possible to use inorganic insulating materials such as the above.

[0249] An opening reaching the electrode 591 is provided in the insulating layer 593, and a wiring 594 is connected to the adjacent electrode 591 is electrically connected. The transparent conductive material increases the aperture ratio of the touch panel. Therefore, the electrode 591 and the electrode 59 can be suitably used for the wiring 594. A material having a higher electrical conductivity than 2 can be preferably used for the wiring 594 since it can reduce electrical resistance. can.

[0250] One electrode 592 extends in one direction, and multiple electrodes 592 are provided in a stripe pattern. .

[0251] The wiring 594 is provided so as to intersect with the electrodes 592 .

[0252] A pair of electrodes 591 are provided with one electrode 592 sandwiched therebetween, and wiring 594 is connected to the pair of electrodes 591 are electrically connected.

[0253] The multiple electrodes 591 do not necessarily have to be arranged in a direction perpendicular to one electrode 592. However, the angle between the first and second electrodes may be less than 90 degrees.

[0254] One of the wirings 598 is electrically connected to the electrode 591 or the electrode 592. The wiring 598 is made of, for example, aluminum, gold, platinum, silver, etc. , nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or para For example, a metal material such as zinc or an alloy material containing such a metal material can be used.

[0255] An insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.

[0256] Furthermore, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).

[0257] The connection layer 599 may be made of various anisotropic conductive films (ACFs). Conductive Film) and Anisotropic Conductive Paste (ACP) opic conductive paste) can be used.

[0258] The adhesive layer 597 is transparent. For example, a thermosetting resin or an ultraviolet curing resin may be used. Specifically, the resin may have an acrylic, urethane, epoxy, or siloxane bond. Resins such as resins can be used.

[0259] The display unit 501 includes a plurality of pixels arranged in a matrix. The pixel circuit drives the display element.

[0260] In this embodiment, an organic EL element that emits white light is applied to a display element. However, the display element is not limited to this.

[0261] For example, organic EL elements with different emitting colors can be used as sub-pixels so that the color of light emitted by each sub-pixel is different. It may be applied on a pixel-by-pixel basis.

[0262] The substrate 510, the substrate 570, and the sealing layer 560 can have the same configuration as in the first configuration example.

[0263] The pixel includes a sub-pixel 502R, which comprises a light-emitting module 580R.

[0264] The subpixel 502R supplies power to the first light-emitting element 550R and the second light-emitting element 550R. The pixel circuit includes a transistor 502t that can emit light. 580R includes a first light emitting element 550R and an optical element (eg, a color layer 567R).

[0265] The first light emitting element 550R has a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode. Yes.

[0266] The light emitting module 580R has a first colored layer 567R in the direction in which the light is extracted.

[0267] In addition, when the sealing layer 560 is provided on the side from which light is extracted, the sealing layer 560 is It contacts the light emitting element 550R and the first colored layer 567R.

[0268] The first colored layer 567R is located so as to overlap the first light emitting element 550R. A part of the light emitted by the first light emitting element 550R is transmitted through the first colored layer 567R and is The light is emitted to the outside of light emitting module 580R in the direction of the arrow.

[0269] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. , and is provided so as to surround a colored layer (for example, the first colored layer 567R).

[0270] The display unit 501 includes an anti-reflection layer 567p at a position overlapping the pixel. For example, a circular polarizing plate can be used as p.

[0271] The display unit 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. The insulating film 521 is used as a layer for flattening unevenness caused by the pixel circuit. In addition, a laminated film including a layer capable of suppressing the diffusion of impurities can be applied to the insulating film 521. This can reduce the reliability of the transistors 502t and the like caused by the diffusion of impurities. The decrease in the amount of

[0272] The display unit 501 has a light-emitting element (for example, a first light-emitting element 550R) on an insulating film 521. do.

[0273] The display unit 501 has a partition wall 528 on an insulating film 521, the partition wall 528 overlapping an end of the first lower electrode. In addition, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528 .

[0274] The scanning line driver circuit 503g(1) includes a transistor 503t and a capacitor 503c. In addition, the driver circuit and the pixel circuit can be formed on the same substrate in the same process.

[0275] The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is connected to the wiring 511. 11. In addition, F PC 509 ( 1 ) is electrically connected to terminal 519 .

[0276] In addition, a printed wiring board (PWB) may be attached to the FPC509(1). stomach.

[0277] The display portion 501 has wiring such as scanning lines, signal lines, and power lines. can be used for wiring.

[0278] Note that various transistors can be used for the display portion 501. A configuration in which the data is applied to the display unit 501 is shown in FIGS.

[0279] For example, a semiconductor layer including an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown.

[0280] For example, a semiconductor containing polycrystalline silicon crystallized by a process such as laser annealing The layer is applied to the transistor 502t and the transistor 503t shown in FIG. It is possible.

[0281] In addition, a configuration in which a top-gate type transistor is applied to the display unit 501 is shown in FIG. Illustrated in (C).

[0282] For example, a single crystal silicon film transferred from a polycrystalline silicon or single crystal silicon substrate, etc. The semiconductor layer including the above is formed into a transistor 502t and a transistor 502t shown in FIG. Can be applied to 03t.

[0283] <Configuration example 3> FIG. 15 is a cross-sectional view of touch panel 505B. The display unit 505B displays the supplied image information on the side where the transistor is provided. The touch sensor is provided on the substrate 510 side of the display unit. This is different from the touch panel 505 of Example 2. The different configuration will be described in detail here. The above description is incorporated herein by reference in relation to the parts in which the above configuration can be used.

[0284] The first colored layer 567R is located so as to overlap the first light emitting element 550R. The first light emitting element 550R shown in A) emits light toward the side where the transistor 502t is provided. As a result, a part of the light emitted by the first light emitting element 550R is reflected by the first colored layer 567. The light is transmitted through R and emitted to the outside of light emitting module 580R in the direction of the arrow shown in the figure.

[0285] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. , and is provided so as to surround a colored layer (for example, the first colored layer 567R).

[0286] The touch sensor 595 is provided on the substrate 510 side of the display unit 501 (FIG. 15(A)). ).

[0287] The adhesive layer 597 is between the substrate 510 and the substrate 590, and the display unit 501 and the touch sensor 5 Paste 95 together.

[0288] Note that various transistors can be used for the display portion 501. A configuration in which the data is applied to the display unit 501 is shown in FIGS.

[0289] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is This can be applied to the transistor 502t and the transistor 503t shown.

[0290] For example, a semiconductor layer containing polycrystalline silicon or the like is formed into a transistor 5 shown in FIG. The present invention can be applied to transistors 502t and 503t.

[0291] In addition, a configuration in which a top-gate type transistor is applied to the display unit 501 is shown in FIG. Illustrated in (C).

[0292] For example, a semiconductor layer including polycrystalline silicon or a transferred single crystal silicon film is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown in FIG. do.

[0293] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. [Explanation of symbols]

[0294] 100 Electronic equipment 101 Display section 102 Case 102a Case 102b Case 102c Case 103 Display area 104 Hidden area 105 Camera 106 Light source 111 areas 112 areas 113 areas 114 Light-emitting area 120 Substrate 121 Circuit 121a Circuit 121b circuit 121c circuit 122 circuits 122a circuit 122b circuit 122c circuit 123 Wiring 124 FPC 125 IC 126a Wiring 126b Wiring 127a Wiring 127b Wiring 131B Pixel electrode 131G Pixel electrode 131R Pixel electrode 132 Electrode 133 EL layer 134 Electrode 135B Color Filter 135G Color Filter 135R Color Filter 136B EL layer 136G EL layer 136R EL layer 141 Insulating layer 142 Substrate 143 Insulating Layer 144 Encapsulating materials 150 Electronic equipment 151 Hinge 152 Battery 160 Electronic equipment 201 Preparation substrate 203 Peeling layer 205 Preparation Substrate 207 Peeling layer 301 Display section 302 pixels 302B subpixel 302G subpixel 302R subpixel 302t Transistor 303c capacity 303g(1) Scanning line driver circuit 303g(2) Imaging pixel driving circuit 303s(1) Image signal line driver circuit 303s(2) Imaging signal line driver circuit 303t Transistor Gate 304 308 imaging pixels 308p Photoelectric conversion element 308t transistor 309 FPC 311 Wiring 319 Terminal 321 Insulating Layer 328 Bulkhead 329 Spacer 350R Light emitting element 351R lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Middle Class 360 Sealing layer 367BM light shielding layer 367p anti-reflection layer 367R colored layer 380B Light Emitting Module 380G Light Emitting Module 380R Light Emitting Module 390 Touch Panel 501 Display section 502R subpixel 502t transistor 503c capacity 503g Scanning line driver circuit 503t Transistor 505 Touch Panel 505B Touch Panel 509 FPC 510 Substrate 510a Insulating layer 510b flexible substrate 510c adhesive layer 511 Wiring 519 Terminal 521 Insulating film 528 Bulkhead 550R Light emitting element 560 Sealing layer 567BM light shielding layer 567p anti-reflection layer 567R colored layer 570 Substrate 570a Insulating layer 570b flexible substrate 570c ​​adhesive layer 580R Light Emitting Module 590 Substrate 591 Electrode 592 Electrode 593 Insulating Layer 594 Wiring 595 Touch Sensor 597 Adhesive layer 598 Wiring 599 Connection Layer 801 Substrate 803 Substrate 804 Light emitting part 806 Drive circuit section 808 FPC 811 Adhesive layer 813 Insulating layer 814 Conductive layer 815 Insulating layer 816 Conductive layer 817 Insulating layer 817a Insulating layer 817b Insulating layer 820 Transistor 821 Insulating layer 822 Transistor 823 Sealing layer 824 Sealing layer 825 Connector 827 Spacer 830 Light emitting element 831 Lower electrode 833 EL layer 835 Upper electrode 841 Adhesive layer 843 Insulation Layer 845 Colored layer 847 Light blocking layer 849 Overcoat 857 Conductive Layer 857a Conductive layer 857b Conductive layer

Claims

1. A foldable electronic device, comprising: A first housing; A second housing; a hinge between the first housing and the second housing; a display unit having a display area, a first gate drive circuit, and a second gate drive circuit; A camera provided in the first housing, In an unfolded state, the display area overlaps with each of the first housing and the second housing, the display area includes an area surrounding the camera, the first gate drive circuit is provided on a first side in a longitudinal direction of the display area, and overlaps with each of the first housing and the second housing; The electronic device, wherein the second gate drive circuit is provided on a second side in a longitudinal direction of the display area and overlaps with each of the first housing and the second housing.

2. A foldable electronic device, A first housing; A second housing; a hinge between the first housing and the second housing; a display unit having a display area, a first gate drive circuit, and a second gate drive circuit; A camera provided in the first housing; a first battery provided in the first housing; a second battery provided in the second housing; In an unfolded state, the display area overlaps with each of the first housing and the second housing, the display area includes an area surrounding the camera, the first gate drive circuit is provided on a first side in a longitudinal direction of the display area, and overlaps with each of the first housing and the second housing; The electronic device, wherein the second gate drive circuit is provided on a second side in a longitudinal direction of the display area and overlaps with each of the first housing and the second housing.

3. A foldable electronic device, A first housing; A second housing; a hinge between the first housing and the second housing; a display unit having a display area, a first gate drive circuit, and a second gate drive circuit; A camera provided in the first housing, In an unfolded state, the display area overlaps with each of the first housing and the second housing, the display area has an area surrounding the camera and has a function of displaying an image of a subject while the camera is photographing the subject; the first gate drive circuit is provided on a first side in a longitudinal direction of the display area, and overlaps with each of the first housing and the second housing; The electronic device, wherein the second gate drive circuit is provided on a second side in a longitudinal direction of the display area and overlaps with each of the first housing and the second housing.

4. A foldable electronic device, comprising: A first housing; A second housing; a hinge between the first housing and the second housing; a display unit having a display area, a first gate drive circuit, and a second gate drive circuit; A camera provided in the first housing; a first battery provided in the first housing; a second battery provided in the second housing; In an unfolded state, the display area overlaps with each of the first housing and the second housing, the display area has an area surrounding the camera and has a function of displaying an image of a subject while the camera is photographing the subject; the first gate drive circuit is provided on a first side in a longitudinal direction of the display area, and overlaps with each of the first housing and the second housing; The electronic device, wherein the second gate drive circuit is provided on a second side in a longitudinal direction of the display area and overlaps with each of the first housing and the second housing.

5. In any one of claims 1 to 4, The display unit has a flexible substrate, the flexible substrate has a first side and a second side in a short-side direction of the display area, the flexible substrate has a terminal portion on the first side for electrically connecting to an FPC, The electronic device, wherein the first side of the flexible board is shorter than the second side and overlaps with the FPC.

6. In any one of claims 1 to 5, the display area has a plurality of pixels arranged in a matrix; Each of the plurality of pixels includes a transistor and a light-emitting element electrically connected to the transistor.

Images