Coating device and coating method

Abstract

To facilitate cleaning of a coating applicator to improve maintainability.SOLUTION: An application method includes: a holding step in which a workpiece 10 is held on a holding surface S0 of a rotary stage 20; a cleaning fluid supply step in which a cleaning fluid is supplied to an inner wall of a container 21 which is provided so as to enclose the rotary stage; and an application step in which a coating liquid is supplied to the workpiece 10 held by the rotary stage 20 from the side of a first major surface S1 which does not face the holding surface of the workpiece 10 and the rotary stage is rotated after the cleaning fluid supply step. In the cleaning fluid supply step, the cleaning fluid is supplied to the first major surface side of the workpiece 10 held by the rotary stage 20 with the rotary stage 20 being rotated and the cleaning liquid is scattered from the workpiece to the inner wall by a centrifugal force.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to an apparatus and method for applying a coating liquid to a processing object such as a semiconductor wafer. [Background technology]

[0002] As a method for coating a resin film such as a resist on a semiconductor substrate, a spin coating method is commonly used in which a coating liquid is dropped onto the rotating substrate while the substrate is rotating, and a uniform thin film is formed by centrifugal force. In the spin coating method, the dropped coating liquid may also splash onto the inner wall of the coating device, and when it dries, the resin component may adhere to the inner wall. The adhered resin component must be removed periodically.

[0003] As a method for cleaning a coating device, Patent Document 1 proposes providing a chemical liquid dropping nozzle on the side of a cup surrounding a rotating wafer chuck in a semiconductor manufacturing device in which resist is dropped onto a wafer placed on a wafer chuck to form a thin resist film by centrifugal force, in which the nozzle is used to wash away waste processing liquid. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 62-73670 Summary of the Invention [Problem to be solved by the invention]

[0005] This makes it easier to clean the coating equipment and improves maintainability. [Means for solving the problem]

[0006] One aspect of the present invention relates to a coating method including a holding step of holding a workpiece on a holding surface of a rotating stage, a cleaning liquid supplying step of supplying a cleaning liquid onto an inner wall of a container arranged to surround the rotating stage, and a coating step of supplying a coating liquid to the workpiece held on the rotating stage from a side of a first main surface of the workpiece that does not face the holding surface after the cleaning liquid supplying step, and rotating the rotating stage, wherein in the cleaning liquid supplying step, the cleaning liquid is supplied to the first main surface side of the workpiece held on the rotating stage while rotating the rotating stage, and the cleaning liquid is scattered from the workpiece onto the inner wall by centrifugal force.

[0007] Another aspect of the present invention is a container including a rotation stage that holds a workpiece on a holding surface, a bottom, and a sidewall that stands up from the bottom and surrounds the rotation stage, the height of the sidewall being higher than the height of the rotation stage, a rotation unit that rotates the rotation stage about a rotation axis that intersects with the holding surface, a coating liquid supply unit that supplies a coating liquid to the workpiece from a side of a first main surface of the workpiece that does not face the holding surface, a cleaning liquid supply unit that supplies a cleaning liquid to the workpiece from the side of the first main surface of the workpiece, and a control unit that controls the rotation unit, the coating liquid supply unit, and the cleaning liquid supply unit, wherein the coating liquid supply unit has a coating nozzle, and the cleaning liquid supply unit and a cleaning nozzle, the coating liquid supply unit and the cleaning liquid supply unit are controlled by the control unit so that, when the coating nozzle is in a predetermined retracted position and the cleaning nozzle is in a first position, the cleaning nozzle discharges the cleaning liquid, and then, when the cleaning nozzle is in a predetermined retracted position and the coating nozzle is in a second position different from the first position, the coating liquid is discharged, and the rotating unit is controlled by the control unit so as to rotate the rotating stage while the cleaning nozzle is discharging the cleaning liquid at the first position, so that the cleaning liquid supplied to the workpiece is scattered against the side wall by centrifugal force. Effect of the Invention

[0008] According to the present invention, cleaning of the coating device becomes easier, and maintainability is improved. [Brief description of the drawings]

[0009] [Figure 1] 1 is a diagram showing a schematic view of a main part of a coating device according to an embodiment of the present invention; [Diagram 2] 1 is a block diagram showing a configuration of a coating apparatus according to an embodiment of the present invention. [Diagram 3] 2 is a flowchart illustrating a coating method according to one embodiment of the present invention. [Figure 4] 11 is a cross-sectional view illustrating a schematic internal state of the coating device in a cleaning liquid supplying step. FIG. [Diagram 5] FIG. 4 is a cross-sectional view that illustrates a schematic internal state of the coating device in a coating liquid supplying step. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The coating method according to this embodiment includes a holding step of holding the object to be treated on the holding surface of the rotating stage, a cleaning liquid supplying step of supplying cleaning liquid to the inner wall of a container provided so as to surround the rotating stage, and a coating step of supplying coating liquid to the object to be treated held on the rotating stage from the side of the first main surface of the object that does not face the holding surface of the object and rotating the rotating stage after the cleaning liquid supplying step. The object to be treated to which the coating liquid is attached rotates by the coating step. In the coating step, the rotation of the rotating stage may be started before the coating liquid is supplied, or may be performed after the coating liquid is supplied. That is, the coating liquid may be supplied to the rotating object to be treated, or the object to which the coating liquid has been supplied may be rotated.

[0011] In the cleaning liquid supplying step, while rotating the rotating stage, the cleaning liquid is supplied to the first main surface side of the workpiece held on the rotating stage, and the cleaning liquid is scattered from the workpiece onto the inner wall by centrifugal force. This makes it possible to remove the resin components that have adhered to the inner wall in the previous step. In addition, the inner wall of the container can be covered or wetted with the cleaning liquid before applying the coating liquid to the workpiece. As a result, the coating liquid is prevented from adhering to and fixing on the inner wall.

[0012] In the cleaning liquid supplying step, the cleaning liquid may be supplied to the outer edge of the first main surface side of the workpiece. The centrifugal force generated by the rotation of the rotating stage causes the cleaning liquid to scatter toward the inner wall of the container. By supplying the cleaning liquid to the outer edge, which is close to the inner wall of the container, the cleaning liquid can be efficiently scattered toward the inner wall of the container. In addition, the cleaning liquid is prevented from adhering to the object to be coated (e.g., a substrate) provided in the center of the workpiece.

[0013] Preferably, the object to be treated has a substrate, a holding sheet for holding the substrate, and a frame for holding the outer edge of the holding sheet. In the cleaning liquid supplying step, if the cleaning liquid is dropped from, for example, a nozzle so that the cleaning liquid is supplied to the frame portion of the object to be treated, the cleaning liquid is difficult to supply to the substrate, but the cleaning liquid is scattered toward the outside of the frame due to centrifugal force and splashes onto the inner wall of the container. On the other hand, in the coating step, the coating liquid is supplied to the substrate provided at the center of the object to be treated by dropping the coating liquid from, for example, a nozzle (separate from the nozzle for the cleaning liquid). Thus, the coating of the coating liquid to the substrate and the supply of the cleaning liquid to the inner wall of the container can be achieved simultaneously in a simple manner.

[0014] The position of the holding surface that holds the object to be treated on the rotating stage may be higher in the cleaning liquid supplying process than in the coating process. The height of the holding surface refers to the position in the normal direction of the holding surface. The further the holding surface is from the bottom surface of the container (the direction from the bottom surface toward the object to be treated), the higher the height of the holding surface is. By raising the height of the holding surface in the cleaning liquid supplying process, the scattered cleaning liquid adheres to a higher position on the inner wall of the container. The attached cleaning liquid can hang down along the inner wall due to gravity and cover the inner wall. This allows the cleaning liquid to be scattered in the area of ​​the inner wall of the container where the coating liquid is expected to adhere, and the inner wall of the device can be covered or wetted with the cleaning liquid. As a result, the effect of removing the attached resin components and the effect of covering the inner wall of the container with the cleaning liquid can be enhanced.

[0015] In the cleaning liquid supplying step, the cleaning liquid may be supplied to the workpiece at a plurality of positions on the rotating stage. Here, the plurality of positions means relative positions in the coating device that are not dependent on the rotation of the rotating stage. The cleaning liquid supplied to the outer edge of the workpiece may scatter in a direction away from the rotating shaft due to centrifugal force and adhere to the inner wall of the container, but is unlikely to scatter on the inner wall located on the opposite side of the rotating shaft from the dripping position. As a result, depending on the position of the inner wall of the container, there may be areas where the cleaning liquid is less scattered and areas where it is more scattered. However, by supplying the cleaning liquid at a plurality of positions, the cleaning liquid can be uniformly scattered regardless of the position of the inner wall of the container, and the inner wall of the container can be covered with the cleaning liquid. The coating device may be provided with a mechanism for rotating the inner wall of the container. By supplying the cleaning liquid to the rotating workpiece while rotating the inner wall of the container, the same effect as supplying the cleaning liquid to multiple positions on the rotation stage can be obtained.

[0016] The coating liquid contains, for example, a resin component. In this case, the cleaning liquid preferably contains a solvent that dissolves the resin component. As a result, the resin component attached to the inner wall of the container is dissolved in the solvent, the viscosity of the resin component decreases, and the resin component falls down to the bottom of the container along the inner wall. Therefore, the resin component attached to the inner wall of the container is collected from the bottom.

[0017] Prior to the coating step, a cleaning liquid (second cleaning liquid) may be retained in advance in the space below the rotating stage of the container. Most of the coating liquid supplied in the coating step is used for film formation on the substrate, but some of it may scatter toward the inner wall of the container in the outer circumferential direction without being used for film formation and adhere to the inner wall of the container. However, the scattered coating liquid is covered with the cleaning liquid supplied in the cleaning liquid supply step, which prevents the coating liquid from adhering to the inner wall, so it moves to the bottom of the container and mixes with the cleaning liquid retained at the bottom. Therefore, by discharging the cleaning liquid (second cleaning liquid) retained at the bottom, the excess coating liquid not used for film formation on the substrate can be easily removed.

[0018] The second cleaning liquid retained at the bottom has the property of dispersing or dissolving the coating liquid (resin component). The second cleaning liquid may contain the same components as the cleaning liquid (first cleaning liquid) used in the cleaning liquid supplying step. The second cleaning liquid may be the cleaning liquid supplied in the cleaning liquid supplying step that has migrated to the bottom of the container and retained there. To facilitate removal of the cleaning liquid, for example, a drain hole for discharging the liquid may be provided at the bottom of the container.

[0019] Hereinafter, the coating apparatus and coating method according to the present embodiment will be described in detail with reference to the drawings.

[0020] Fig. 1 is a cross-sectional view showing a schematic configuration of a coating apparatus according to an embodiment of the present invention. Fig. 2 is a block diagram of a coating apparatus according to an embodiment of the present invention. This coating apparatus is used, for example, to form a resin film that serves as a mask on a substrate made of a semiconductor material or the like.

[0021] The coating apparatus 100 includes a rotating stage 20 that holds the workpiece 10 on a holding surface, a container 21 that surrounds the rotating stage 20, a rotating section 22 that rotates the rotating stage 20, a coating liquid supply section 23 that supplies a coating liquid to the workpiece 10 from the side of the first main surface S1 of the workpiece 10 that does not face the holding surface, and a cleaning liquid supply section 24 that supplies a cleaning liquid from the first main surface S1 side of the workpiece 10.

[0022] 1, the object 10 includes a substrate 11, a holding sheet 12 that holds the substrate 11, and a frame 13 that holds the outer edge of the holding sheet 12. The object 10 is held by the holding sheet 12 on a holding surface S0 of a rotating stage 20. The object 10 has a main surface S1 (main surfaces of the substrate 11 and holding sheet 12) that does not face the holding surface S0, and a main surface S2 (a contact surface of the holding sheet 12 that comes into contact with the holding surface S0) that faces the holding surface. The holding sheet 12 is, for example, a dicing tape.

[0023] The holding sheet 12 may be subjected to a water-repellent treatment. The water-repellent treatment suppresses adhesion of hydrophilic coating liquid and cleaning liquid to the holding sheet, and the step of cleaning the holding sheet after forming the coating film can be omitted. Known materials and processing methods can be used as the method of water-repellent treatment.

[0024] The object to be processed 10 is held on the rotating stage 20. The rotating stage 20 is rotatable about a rotation axis in a direction intersecting the holding surface S0 (preferably, a direction normal to the holding surface S0). The rotating stage 20 may have a fixing portion for fixing the frame 13 of the object to be processed 10. The fixing portion is, for example, a clamp.

[0025] The rotating stage 20 may hold the object 10 to be treated by an adsorption mechanism. The adsorption mechanism may be, for example, vacuum adsorption or electrostatic adsorption. Vacuum adsorption is preferable in terms of simplifying the configuration of the device. In this case, the rotating stage may be formed with suction holes connected to a suction pump, or the surface of the rotating stage may be formed of a porous material connected to a suction pump. The number and spacing of the suction holes may be appropriately set depending on the size of the rotating stage and the object to be treated, etc.

[0026] The rotating stage 20 is also movable in the direction normal to the holding surface S0, thereby changing the position (height) in the direction normal to the holding surface S0. The position (height) in the direction normal to the holding surface S0 can be changed by the elevator 27.

[0027] The container 21 has a bottom 21a and a side wall 21b standing upright from the bottom 21a, and is open at the top. The side wall 21b surrounds the rotating stage 20, and the height of the side wall 21b is higher than the height of the rotating stage 20 (when the lifting unit 27 is provided, the maximum height at which the distance to the bottom 21a is maximum). The rotating stage 20 and the object 10 to be processed are stored in the container 21. The bottom side of the container 21 can be filled with a cleaning liquid. In this case, a drain hole 30 for draining the cleaning liquid is provided in the bottom 21a of the container or in the side wall 21b below the rotating stage.

[0028] The rotating unit 22 rotates the rotating stage 20 about a rotation axis in a direction intersecting the holding surface S0 (preferably, a direction normal to the holding surface S0). The rotating unit 22 can be composed of, for example, a rotating body connected to the rotating stage, a motor that rotates the rotating body, and the like.

[0029] The coating liquid supply unit 23 supplies the coating liquid from the first main surface S1 side toward the substrate 11 of the workpiece 10. The coating liquid supply unit includes, for example, a coating nozzle 23a, a tank for storing the coating liquid, and a pump for adjusting the pressure of the raw material liquid to be discharged. An opening is formed at the tip of the coating nozzle 23a, and the coating liquid is supplied from the tank to the coating nozzle 23a and then dripped from this opening at a predetermined amount and pressure. The shape of the opening of the coating nozzle 23a is not particularly limited, and may be, for example, circular or slit-shaped. There may be a plurality of coating nozzles 23a.

[0030] The coating liquid contains, for example, a resist material as a resin component, such as a thermosetting resin containing polyimide or the like, a photoresist containing phenolic resin or the like, or a water-soluble resist containing acrylic resin or the like.

[0031] The cleaning liquid supply unit 24 supplies the cleaning liquid to the workpiece 10 from the first main surface S1 side. Preferably, the cleaning liquid supply unit 24 supplies the cleaning liquid from the first main surface S1 side toward the frame 13 provided on the outer edge of the workpiece 10. The cleaning liquid supply unit includes, for example, a cleaning nozzle 24a, a tank in which the cleaning liquid is stored, a pump for adjusting the pressure of the cleaning liquid to be discharged, and the like. An opening is formed at the tip of the cleaning nozzle 24a. After the cleaning liquid is supplied from the tank to the cleaning nozzle 24a, it is dripped from this opening at a predetermined amount and pressure. The shape of the opening of the cleaning nozzle 24a is not particularly limited, and may be, for example, a circle or a slit shape. There may be a plurality of cleaning nozzles 24a.

[0032] The cleaning liquid contains a solvent that dissolves at least a part of the resin component contained in the coating liquid. The solvent may be appropriately selected depending on the resin component. Examples of the solvent that dissolves the resist material include propylene glycol monomethyl ether acetate (PGMEA), methyl ethyl ketone (MEK), isopropyl alcohol (IPA), ethanol, acetone, water, etc. The cleaning liquid contains one of these alone or two or more of them.

[0033] The coating apparatus 100 may also include a nozzle moving unit 25 that moves the coating nozzle 23a in the coating liquid supply unit 23 and the cleaning nozzle 24a in the cleaning liquid supply unit 24. The nozzle moving unit 25 moves the coating nozzle 23a at least in a plane parallel to the holding surface S0. The nozzle moving unit 25 also moves the cleaning nozzle 24a at least in a plane parallel to the holding surface S0. In addition, the nozzle moving unit may move the coating nozzle and / or the cleaning nozzle in at least one of the vertical direction and the circumferential direction of the substrate. The movement mechanism included in the nozzle moving unit is not particularly limited, and a known mechanism can be used.

[0034] The coating device 100 also includes a control unit 26. The control unit 26 includes, for example, a computer and controls the coating liquid supply unit 23, the cleaning liquid supply unit 24, the rotating unit 22, the elevating unit 27, and the nozzle moving unit 25. The control unit 26 individually controls the position of the coating nozzle, the supply amount of the coating liquid, the position of the cleaning nozzle, the supply amount of the cleaning liquid, the rotation speed of the rotating stage 20, the position (height) of the rotating stage 20, and the like.

[0035] More specifically, the control unit 26 controls the coating liquid supply unit 23 and the cleaning liquid supply unit 24 such that after the cleaning nozzle discharges the cleaning liquid in a state where the coating nozzle 23a is in a predetermined retracted position and the cleaning nozzle 24a is in the first position, the cleaning nozzle 24a is in the predetermined retracted position and the coating nozzle 23a discharges the coating liquid in a state where the coating nozzle 23a is in the second position. The first position is, for example, a position where the distance to the rotation axis of the rotating stage 20 is farther than that of the second position (i.e., the outer peripheral side). More specifically, the first position may be a position corresponding to the frame 13 of the object to be processed 10, and the second position may be a position corresponding to the substrate 11 of the object to be processed 10. The retracted position is a position sufficiently separated from the object to be processed 10. The movement of the cleaning nozzle 24a from the retracted position to the first position and from the first position to the retracted position, and the movement of the coating nozzle 23a from the retracted position to the second position and from the second position to the retracted position can be performed by the nozzle moving unit 25 under the control of the control unit 26.

[0036] Also, the control unit 26 controls the rotating unit 22 to rotate the rotating stage 20 while the cleaning nozzle 24a discharges the cleaning liquid at the first position. The rotation speed of the rotating unit 22 is controlled so that the cleaning liquid supplied to the object to be processed 10 scatters to the side wall 21b of the container by centrifugal force.

[0037] Further, the control unit 26 controls the elevating unit 27 so that the distance to the bottom 21a of the holding surface S0 maintains a first distance X1 while the cleaning nozzle 24a discharges the cleaning liquid at the first position, and maintains a second distance X2 closer than the first distance X1 (X2 < X1) while the coating nozzle 23a discharges the coating liquid at the second position.

[0038] A coating method according to one embodiment of the present invention can be carried out, for example, as follows, using the above-mentioned coating apparatus 100. Fig. 3 shows a flowchart showing the coating method according to one embodiment of the present invention.

[0039] Prior to application of the coating liquid, the drain valve 29 provided in the container 21 is closed to allow the cleaning liquid to remain in the bottom 21a of the container 21 (ST01). The cleaning liquid is, for example, water, and has the property of dispersing or dissolving the coating liquid. As a result, at least the space below the rotating stage 20 in the container 21 is filled with the cleaning liquid.

[0040] Next, the object to be processed 10 is placed on the rotating stage 20 (ST02).

[0041] 4, the height of the rotation stage 20 is changed by the lifting unit 27 (ST03). Here, the rotation stage 20 is raised so that the height of the rotation stage 20 is higher (i.e., so that the distance between the bottom 21a of the container and the rotation stage 20 is larger) compared to the state after step ST05 described later. This step may be performed before step ST01 or ST02.

[0042] Next, with the application nozzle 23a moved to the retracted position, the rotating stage 20 is rotated and the cleaning nozzle 24a is moved to the first position to supply the cleaning liquid toward the frame 13 of the workpiece 10 (ST04: cleaning liquid supply step). The state inside the application device 100 in this state is shown in FIG. 4. The cleaning liquid dropped onto the frame 13 is scattered toward the side wall 21b of the container by centrifugal force. As a result, the inner wall of the container is covered with the components of the cleaning liquid, and a protective layer 28 (see FIG. 5) is formed on the inner wall of the container.

[0043] In this process, the movement of the cleaning nozzle and the application of the cleaning liquid may be repeated multiple times to supply the cleaning liquid at multiple positions on the rotating stage. By supplying the cleaning liquid at multiple positions, unevenness in the amount of the cleaning liquid scattered depending on the position on the inner wall of the container can be suppressed, and the inner wall of the container can be uniformly covered with the cleaning liquid. The cleaning liquid splashed toward the side wall 21b of the container moves downward along the side wall 21b. Since the drain valve 29 is closed, the cleaning liquid is not discharged but mixes with the cleaning liquid at the bottom of the container and remains there.

[0044] The rotation speed of the turntable in the cleaning liquid supplying step is not particularly limited, but may be 300 rpm or more, or 500 rpm or more, and may be 2000 rpm or less, or 1500 rpm or less.

[0045] The viscosity of the cleaning liquid is not particularly limited. From the viewpoint of productivity, the viscosity of the cleaning liquid at 20° C. measured in accordance with JIS Z 8803 may be 1 mPa·s or more and 1000 mPa·s or less.

[0046] 5, the height of the rotation stage 20 is adjusted by the lifting unit 27 (ST05). Here, the rotation stage 20 is lowered so that the height of the rotation stage 20 is lowered (i.e., the distance between the bottom 21a of the container and the rotation stage 20 is reduced) compared to the state after the above-mentioned step ST03.

[0047] Next, with the cleaning nozzle 24a moved to the retracted position, the coating nozzle 23a is moved to the second position, and the coating liquid is supplied toward the substrate 11 of the workpiece 10, while the rotating stage is rotated (ST06: coating liquid supply step). The state inside the coating device 100 in this state is shown in FIG. 5. The coating liquid dropped onto the substrate 11 uniformly covers the surface of the substrate by centrifugal force. Meanwhile, a part of the coating liquid may splash toward the side wall 21b of the container. However, since the protective layer 28 is formed on the inner wall of the container, adhesion of the coating liquid to the inner wall of the container is suppressed. The coating liquid that has splashed and adhered to the inner wall of the container moves downward along the inner wall and mixes with the cleaning liquid at the bottom of the container.

[0048] The rotation speed of the rotating stage in the coating liquid supplying step is not particularly limited, but may be 300 rpm or more, or 500 rpm or more. The rotation speed of the table may be 5000 rpm or less, or 3000 rpm or less. When the coating liquid is supplied, the rotating stage may be stopped or may be rotating at a lower speed (for example, 10 rpm or more and 50 rpm or less).

[0049] The viscosity of the coating liquid is not particularly limited. From the viewpoint of productivity, the viscosity of the raw material liquid at 20°C measured in accordance with JIS Z 8803 may be 1 mPa·s or more and 1000 mPa·s or less. Usually, the viscosity of the coating liquid is higher than the viscosity of the cleaning liquid supplied in the cleaning liquid supplying step.

[0050] The amount of the coating solution to be supplied may be appropriately set according to the thickness of the coating film of the desired resin component. The thickness of the coating film is not particularly limited, but for example, in the case of a resin film used in plasma dicing, the thickness is, for example, 5 μm or more and 60 μm or less.

[0051] Next, the object 10 to be processed is removed from the rotating stage 20 (ST07). The removed object 10 to be processed is subjected to a drying process, and a resin film is formed on the substrate 11. The drying conditions are not particularly limited, and may be set appropriately taking into consideration the components and concentration of the coating liquid, the heat resistance of the holding sheet 12, and the like. Examples of the drying mechanism include heat drying using a heater, reduced pressure drying using an exhaust device, and hot air drying using an air supply device. After step ST07, another object to be processed 10 may be prepared, and steps ST02 to ST07 may be repeated.

[0052] Next, the drain valve 29 is opened to drain the cleaning liquid from the drain hole 30 provided in the bottom of the container (ST08).

[0053] The rotation speed of the rotating stage 20 in the cleaning liquid supplying step (ST04) may be different from the rotation speed of the rotating stage 20 in the coating liquid supplying step (ST06). From the viewpoint of promoting the scattering of the cleaning liquid onto the inner wall of the container while suppressing the scattering of the coating liquid onto the inner wall of the container, it is preferable that the rotation speed of the rotating stage 20 in the cleaning liquid supplying step is faster than the rotation speed of the rotating stage 20 in the coating liquid supplying step. [Industrial Applicability]

[0054] The coating apparatus and coating method of the present invention are capable of forming a uniform resin film on a substrate, and are particularly suitable for an apparatus and method for forming a mask for dicing a substrate by plasma processing. [Explanation of symbols]

[0055] 100: Coating device 10: Object to be treated 11: Substrate 12: Retaining sheet 13: Frame 20: Rotating stage 21: Container 21a: Bottom 21b: Side wall 22: Rotating section 23: Coating liquid supply section 23a: Application nozzle 24: Cleaning liquid supply unit 24a: Cleaning nozzle 25: Nozzle moving part 26: Control unit 27: Lifting section 28:Protective layer 29: Exhaust valve 30: Discharge hole

Claims

1. a holding step of holding the object to be processed on a holding surface of a rotating stage; a cleaning liquid supplying step of supplying a cleaning liquid to an inner wall of a container provided so as to surround the rotating stage; a coating step of supplying a coating liquid to the object held on the rotating stage from a side of a first main surface of the object that does not face the holding surface after the cleaning liquid supply step, and rotating the rotating stage; In the cleaning liquid supplying step, the cleaning liquid is supplied to the first main surface side of the object to be processed held on the rotating stage while rotating the rotating stage, and the cleaning liquid is scattered from the object to the inner wall by centrifugal force; a position of the holding surface of the rotating stage in the cleaning liquid supplying step being higher than a position of the holding surface of the rotating stage in the coating step.

2. 2. The coating method according to claim 1, wherein in the cleaning liquid supplying step, the cleaning liquid is supplied to an outer edge portion of the first main surface side of the workpiece, and the cleaning liquid supplied to the outer edge portion is scattered onto the inner wall by centrifugal force.

3. the processing target object includes a substrate, a holding sheet for holding the substrate, and a frame for holding an outer edge of the holding sheet; The cleaning liquid supplying step supplies the cleaning liquid to the frame, The coating method according to claim 2 , wherein the coating step includes supplying the coating liquid to the substrate.

4. 4. The coating method according to claim 1, wherein in the cleaning liquid supplying step, the cleaning liquid is supplied to the target object at a plurality of positions on the rotating stage.

5. The coating liquid contains a resin component, 5. The coating method according to claim 1, wherein the cleaning liquid contains a solvent that dissolves the resin component.

6. The coating method according to claim 1 , further comprising, prior to the coating step, a step of retaining the cleaning liquid in a space of the container at least below the rotation stage.

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