Electronic device including a speaker module and a receiver module

Abstract

Provided is an electronic device including a speaker module and a receiver module. The electronic device according to an embodiment of the present invention includes a housing, a camera module disposed in the housing, a speaker module disposed in a first direction relative to the camera module, a receiver module disposed in a second direction opposite to the first direction relative to the camera module, a connecting hole disposed in the first direction relative to the camera module and a hole disposed in the second direction relative to the camera module, the electronic device includes a first acoustic hole disposed on a side of the electronic device, a first acoustic duct connecting the connecting hole and the speaker module, a second acoustic hole disposed on a front of the electronic device, and a connecting duct disposed in a third direction perpendicular to the first acoustic duct, the second acoustic duct connecting the second acoustic hole and the receiver module, and a connecting portion connecting the connecting duct of the first acoustic duct and the second acoustic duct.

Description

[Technical field]

[0001] Various embodiments disclosed herein relate to an electronic device including a speaker module and a receiver module. Place Regarding. [Background technology]

[0002] As a variety of contents are reproduced through electronic devices, users are becoming more and more interested in audio performance. In order to deliver stereophonic sound to a user, the electronic device has speaker holes at its upper and lower ends, which are connected to speaker modules.

[0003] The electronic device may include a speaker module and a receiver module. The speaker module and the receiver module may be positioned in opposite directions relative to a camera module disposed in the electronic device. In addition, a speaker hole for emitting sound output from the speaker module to the outside of the electronic device may be located on the side of the electronic device, and a receiver hole for emitting sound output from the receiver module to the outside of the electronic device may be located on the front of the electronic device.

[0004] Meanwhile, since the speaker module and the receiver module are positioned adjacent to each other with respect to the camera module, the speaker duct connecting the speaker module to the speaker hole and the receiver duct connecting the receiver module to the receiver hole are positioned adjacent to each other. For example, at least a portion of the receiver conduit is located in a rear-to-front direction of the electronic device relative to the speaker conduit. When a speaker hole is additionally formed in a direction adjacent to the receiver module, the speaker duct and the receiver duct are connected so that sound output from the receiver module is emitted to the additional speaker hole. Therefore, the sound output by the receiver module may be dispersed. Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention relates to an electronic device including the above conventional speaker module and receiver module. Place The present invention has been made in consideration of the problems in the field of electronic equipment, and an object of the present invention is to provide an electronic device including a speaker module and a receiver module. Place To improve the speaker radiation performance. [Means for solving the problem]

[0006] According to various embodiments disclosed herein, an electronic device includes a housing, a camera module disposed in the housing, a speaker module disposed in a first direction relative to the camera module, a receiver module disposed in a second direction opposite to the first direction relative to the camera module, a connection hole disposed in the first direction relative to the camera module, and a receiver module disposed in the second direction relative to the camera module. and at least some of them have been closed down. the first acoustic hole located on a side of the electronic device, a first acoustic duct connecting the connecting hole and the speaker module, a second acoustic hole located on a front surface of the electronic device, and a connecting duct arranged in a third direction perpendicular to the first direction with respect to the first acoustic duct, the second acoustic duct connecting the second acoustic hole and the receiver module, and a connecting portion connecting the connecting duct of the first acoustic duct and the second acoustic duct. Effect of the Invention

[0008] According to various embodiments disclosed herein, a speaker pipe and a receiver pipe are connected to each other to form an electronic device. Place The speaker radiation performance can be improved. In addition, even if a speaker hole is additionally formed in a direction adjacent to the receiver module, a structure can be presented in which sound output from the receiver module is not emitted through the speaker hole. [Brief description of the drawings]

[0009] In connection with the description of the drawings, the same or similar reference numbers are used for the same or similar components. [Figure 1] FIG. 1 is a block diagram showing a schematic configuration of an electronic device in a network environment according to an embodiment of the present invention. [Figure 2a] 1 is a front perspective view of an electronic device according to an embodiment of the present invention. [Figure 2b] 2b is a rear perspective view of the electronic device of FIG. 2a according to an embodiment of the present invention. [Diagram 3] 2b is an exploded perspective view of the electronic device of FIG. 2a according to an embodiment of the present invention. [Figure 4] 2 is a view showing the upper end of a housing of an electronic device according to an embodiment of the present invention as viewed from the front side of the electronic device. [Figure 5a] 5 is a cross-sectional view of the electronic device according to the embodiment of the present invention taken along line AA in FIG. 4. [Figure 5b] 5 is a cross-sectional view of an electronic device according to an embodiment of the present invention taken along line BB in FIG. 4. [Figure 5c] 5 is a cross-sectional view of the electronic device according to the embodiment of the present invention taken along line CC in FIG. 4. [Figure 6] 2 is an enlarged perspective view of a first acoustic conduit, a second acoustic conduit, and a first acoustic hole according to an embodiment of the present invention. FIG. [Figure 7a] 1 is a diagram showing a state in which a shielding member is disposed on an upper end of a housing of an electronic device according to an embodiment of the present invention; [Figure 7b] 4 is a partial cross-sectional view showing a state in which a dummy hole is partially blocked according to an embodiment of the present invention; FIG. [Figure 7c] 5 is a partial cross-sectional view showing a state in which a dummy hole is closed via a shielding member according to an embodiment of the present invention. FIG. [Figure 7d] 1 is a partial cross-sectional view showing a state in which a first acoustic duct and a second acoustic duct are connected and sound generated from a first speaker module and a receiver module are emitted outside an electronic device according to an embodiment of the present invention. [Figure 8a]FIG. 2 is a perspective view showing a shielding member according to an embodiment of the present invention. [Figure 8b] 1 is a diagram showing a state in which a shielding member according to an embodiment of the present invention is placed in a housing to close a dummy hole of a first acoustic hole. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] In the following description, various embodiments of the present invention are set forth with reference to the accompanying drawings. The various embodiments of the present invention and the terms used herein are not intended to limit the technical features described herein to a particular embodiment, but should be understood to include various modifications, equivalents, or alternatives of the embodiment.

[0011] In connection with the description of the drawings, like reference numerals are used for like or related components. The singular form of a noun referring to an item may include one or more of the item, unless the relevant context clearly dictates otherwise.

[0012] In this document, each phrase such as "A or B," "at least one of A and B," "or at least one of B," "A, B or C," "at least one of A, B and C," and "or at least one of C" includes any one or all possible combinations of the items listed with the corresponding phrase in the phrase. Terms such as "first," "second," or "primary" or "second" are used simply to distinguish an element from other elements and do not limit the element in other respects (e.g., importance or order). When any (e.g., first) component is referred to as being "coupled" or "connected" to a different (e.g., second) component, with or without the terms "functionally" or "communicatively," it means that any component can be coupled to the other component directly (e.g., by wire), wirelessly, or through a third component.

[0013] FIG. 1 is a block diagram showing a schematic configuration of an electronic device 101 in a network environment 100 according to an embodiment of the present invention. Referring to FIG. 1, in a network environment 100, an electronic device 101 communicates with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to one embodiment, electronic device 101 communicates with electronic device 104 via server 108 .

[0014] According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an acoustic output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identity module 196, or an antenna module 197. In one embodiment, electronic device 101 omits at least one of these components (eg, connection terminal 178) or adds one or more other components. In one embodiment, some of the components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into one component (eg, display module 160).

[0015] The processor 120 may, for example, execute software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120 and to perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculations, the processor 120 stores instructions or data received from other components (e.g., the sensor module 176 or the communications module 190) in volatile memory 132, processes the instructions or data stored in volatile memory 132, and stores the resulting data in non-volatile memory 134.

[0016] According to one embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit or application processor) or an auxiliary processor 123 (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that may operate independently or in conjunction with a main processor 121. For example, if the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be dedicated to a designated function. The auxiliary processor 123 may be embodied separately from the main processor 121 or as part of it.

[0017] The auxiliary processor 123 controls at least a portion of the functionality or state associated with at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor 123 (eg, an image signal processor or a communication processor) may be embodied as part of another functionally related component (eg, the camera module 180 or the communication module 190).

[0018] According to one embodiment, the auxiliary processor 123 (eg, a neural network processor) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence model may be generated via machine learning. Such learning may take place, for example, on the electronic device 101 itself where the artificial intelligence model is implemented, or it may take place via a separate server (eg, server 108). Examples of learning algorithms include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning.

[0019] The artificial intelligence model includes multiple artificial neural network layers. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the above examples. The artificial intelligence model may include software structures in addition to or instead of hardware structures.

[0020] The memory 130 stores a variety of data used by at least one component of the electronic device 101, such as the processor (120) or the sensor module 176. Data may include, for example, input data or output data for software (eg, program 140) and associated instructions. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

[0021] Programs 140 are stored in memory 130 as software and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0022] The input module 150 receives instructions or data from outside the electronic device 101 (eg, a user) for use by components of the electronic device 101 (eg, the processor 120). The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (eg, buttons), or a digital pen (eg, a stylus pen).

[0023] The audio output module 155 outputs an audio signal outside the electronic device 101 . The audio output module 155 includes, for example, a speaker or a receiver. The speakers are used for general purposes such as multimedia playback or recording playback. The receiver is used to receive an incoming call. According to one embodiment, the receiver may be embodied either separately from or as part of the speaker.

[0024] The display module 160 visually presents information external to the electronic device 101 (eg, to a user). The display module 160 may include, for example, a display, a holographic device, or a projector and control circuitry for controlling the device. According to one embodiment, the display module 160 includes a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of a force generated by a touch.

[0025] The audio module 170 converts sound into electrical signals and vice versa. According to one embodiment, audio module 170 acquires sound via input module 150 or outputs sound via audio output module 155 or an external electronic device connected directly or wirelessly to electronic device 101, such as electronic device 102 (e.g., a speaker or headphones).

[0026] The sensor module 176 detects an operational condition of the electronic device 101 (eg, power or temperature) or an external environmental condition (eg, user condition) and generates an electrical signal or data value corresponding to the detected condition. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0027] Interface 177 supports one or more specified protocols by which electronic device 101 may interface directly or wirelessly with external electronic devices (eg, electronic device 102). According to one embodiment, interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0028] The connection terminal 178 includes a connector through which the electronic device 101 can be physically coupled to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

[0029] Haptics module 179 converts the electrical signals into mechanical (eg, vibration or movement) or electrical stimuli that the user can perceive via touch or kinesthetic sensation. According to one embodiment, the haptics module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0030] The camera module 180 captures still and video images. According to one embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0031] The power management module 188 manages the power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be embodied, for example, as at least a portion of a power management integrated circuit (PMIC).

[0032] The battery 189 provides power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0033] The communications module 190 supports the establishment of a direct (e.g., wired) or wireless communications channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and the execution of communications over the established communications channel. Communications module 190 operates independently of processor 120 (eg, an application processor) and includes one or more communications processors supporting direct (eg, wired) or wireless communications. According to one embodiment, the communication module 190 includes a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module, or a power line communication module).

[0034] A corresponding one of these communication modules communicates with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). Such multiple types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as multiple separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the subscriber identity module 196 to identify or authenticate the electronic device 101 within a communication network, such as a first network 198 or a second network 199.

[0035] The wireless communication module 192 supports 5G networks and next-generation communication technologies beyond 4G networks, such as NR access technology (new radio access technology). NR connection technologies support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 may, for example, support high frequency bands (eg, mmWave bands) to achieve high data transmission rates.

[0036] The wireless communication module 192 supports various technologies for ensuring performance in high frequency bands, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 supports various requirements defined by the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 supports a "Peak data rate" (e.g., 20 Gbps or more) for implementing eMBB, loss coverage (e.g., 164 dB or less) for implementing mMTC, or "U-plane latency" (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0037] The antenna module 197 transmits or receives signals or power to or from the outside (eg, an external electronic device). According to one embodiment, antenna module 197 may include an antenna that includes a radiator that is made of electrical conductors or conductive patterns formed on a substrate (eg, a PCB). According to one embodiment, the antenna module 197 includes multiple antennas (eg, an array antenna). In such a case, at least one antenna adapted to a communication method used in a communication network, such as the first network 198 or the second network 199, is selected from the plurality of antennas, for example by the communication module 190. Signals or power are transmitted or received between the communication module 190 and an external electronic device via at least one selected antenna. According to one embodiment, other components besides the radiator (eg, a radio frequency integrated circuit (RFIC)) may additionally be formed as part of the antenna module 197.

[0038] According to one embodiment, the antenna module 197 forms an mmWave antenna module. According to one embodiment, an mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a specified high frequency band (e.g., an mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second side (e.g., a top or side) of the printed circuit board and capable of transmitting or receiving signals in the specified high frequency band.

[0039] At least some of the above components are connected to each other via a communication method between peripheral devices (e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) to exchange signals (e.g., commands or data) between them.

[0040] According to one embodiment, instructions or data are sent or received between the electronic device 101 and the external electronic device 104 via a server 108 connected to a second network 199 . Each of the external electronic devices (102 or 104) may be the same as electronic device 101 or a different type of device. According to one embodiment, all or part of the operations performed by electronic device 101 may be performed in one or more of external electronic devices (102, 104, or 108). For example, whenever electronic device 101 must perform any function or service automatically or in response to a request from a user or another device, electronic device 101 may request one or more external electronic devices to perform that function or at least a portion of that service, instead of or in addition to performing the function or service itself. The one or more external electronic devices that receive the request perform at least a portion of the requested function or service, or additional functions or services related to the request, and communicate the results of that performance to the electronic device 101. The electronic device 101 processes the results as is or additionally and provides them as at least part of a response to the request.

[0041] For this, for example, cloud computing, distributed computing, mobile edge computing (MEC) or client-server computing technologies are used. The electronic device 101 provides ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 includes an internet of things (IoT) device. The server 108 may be an intelligent server that utilizes machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or server 108 is included within a second network 199 . The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0042] FIG. 2a is a front perspective view of an electronic device according to an embodiment of the present invention, and FIG. 2b is a rear perspective view of the electronic device of FIG. 2a according to an embodiment of the present invention. The electronic device 200 described below includes at least one of the components of the electronic device 101 described above in FIG.

[0043] 2a and 2b, an electronic device 200 according to one embodiment of the present invention includes a housing 210 including a first face (or front face) 210A), a second face (or back face) 210B, and a side face 210C that encloses a space between the first face 210A and the second face 210B. In other embodiments (not shown), the housing may refer to the structure forming part of the first face 210A, the second face 210B, and the side face 210C of FIG. 2a. According to one embodiment, the first side 210A is formed at least in part by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, or a polymer plate). The second face 210B is formed by a rear plate 211 which is substantially opaque.

[0044] The back plate 211 may be formed, for example, from coated or colored glass, ceramics, polymers, metals (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. Side 210C is formed by a side bezel structure 218 (or "side member") that mates with front plate 202 and rear plate 211 and comprises a metal and / or a polymer. In one embodiment, the rear plate 211 and the side bezel structures 218 are integrally formed and comprise the same material (eg, a metallic material such as aluminum).

[0045] In the illustrated embodiment, the front plate 202 includes a first region 210D) on either long edge of the front plate that extends seamlessly from the first surface 210A toward the rear plate. In the illustrated embodiment (see FIG. 2b), the rear plate 211 includes second regions 210E on either long edge that extend from the second face 210B towards the front plate in a seamless curve. In one embodiment, the front plate 202 or the back plate 211 includes only one of the first region 210D or the second region 210E. In one embodiment, the front plate 202 does not include the first region and the second region, but only includes a flat plane disposed parallel to the second surface 210B. In the above embodiment, when viewed from the side of the electronic device, the side bezel structure 218 has a first thickness (or width) on the side that does not include the first region 210D or the second region 210E as described above, and has a second thickness that is thinner than the first thickness on the side that includes the first region 210D or the second region 210E.

[0046] According to one embodiment, the electronic device 200 includes at least one of a display 201, an input device 203, an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device 217, an indicator (not shown), and a connector 208. In some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 or the indicator) or may additionally include other components.

[0047] Display 201 is visually exposed, for example, through a substantial portion of face plate 202 . In one embodiment, at least a portion of the display 201 is exposed through a front plate 202 that defines a first face 210A and a first region 210D of a side 210C. The display 201 may be coupled to or adjacent to touch detection circuitry, a pressure sensor capable of measuring the strength (pressure) of a touch, and / or a digitizer for detecting a magnetic field-based stylus pen. In one embodiment, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device 217 are disposed in the first area 210D and / or the second area 210E.

[0048] The input device 203 includes a microphone 203 . In one embodiment, the input device 203 includes multiple microphones 203 positioned to detect the direction of sound. The audio output devices (207, 214) include speakers (207, 214). The speakers (207, 214) include an external speaker 207 and a telephone receiver 214. In one embodiment, the microphone 203, the speakers (207, 214) and the connector 208 may be disposed at least partially within the interior space of the electronic device 200 and exposed to the external environment through at least one hole formed in the housing 210. In one embodiment, a hole formed in the housing 210 is shared for the microphone 203 and the speaker (207, 214). In one embodiment, the acoustic output devices (207, 214) include speakers (eg, piezo speakers) that are operated while eliminating holes formed in the housing 210.

[0049] The sensor modules (204, 219) generate electrical signals or data values ​​that correspond to internal operating conditions of the electronic device 200 or external environmental conditions. The sensor modules (204, 219) may include, for example, a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first side 210A of the housing 210, and / or a third sensor module 219 (e.g., an HRM sensor) disposed on a second side 210B of the housing 210. The fingerprint sensor is disposed on the first surface 210A of the housing 210 (eg, a home key button), on a portion of the second surface 210B, and / or below the display 201. The electronic device 200 may further include a sensor module not shown in the figure, such as at least one of a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0050] The camera modules (205, 212) include a first camera module 205 disposed on a first side 210A of the electronic device 200, and a second camera module 212 disposed on a second side 210B, and / or a flash 213. The camera modules (205, 212) include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (such as a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and an image sensor are disposed on one side of the electronic device 200 .

[0051] The key input device 217 is disposed on the side surface 210C of the housing 210. In other embodiments, the electronic device 200 may not include some or all of the mentioned key input devices 217, and the key input devices 217 that are not included may be embodied in other forms, such as soft keys, on the display 201. In another embodiment, the key input device 217 may be implemented using a pressure sensor included in the display 201 .

[0052] The indicator is disposed, for example, on the first surface 210A of the housing 210. The indicator provides status information of the electronic device 200 in the form of light (eg, a light-emitting element), for example. In other embodiments, the light emitting element can provide a light source in conjunction with operation of the camera module 205, for example. The indicators may include, for example, LEDs, IR LEDs, and / or xenon lamps.

[0053] The connector holes 208 include a first connector hole 208 that can accommodate a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and / or data to and from an external electronic device, and / or a second connector hole (or earphone jack) (not shown) that can accommodate a connector for transmitting and receiving audio signals to and from an external electronic device.

[0054] A portion of the camera module 205 of the camera modules (205, 212), a portion of the sensor module 204 of the sensor modules (204, 219), or an indicator is positioned to be visually exposed via the display 201. For example, the camera module 205, the sensor module 204, or an indicator may be positioned in the interior space of the electronic device 200 so as to be in contact with the external environment through an opening or transparent area of ​​the display 201 drilled through to the front plate 202. According to one embodiment, the area where the display 201 and the camera module 205 face each other is formed as a transparent area having a certain transmittance as a part of the area where the content is displayed. According to one embodiment, the transmissive region is formed to have a transmittance in the range of about 5% to about 20%. Such a transparent region includes an area that overlaps with an effective area (eg, an angle of view area) of the camera module 205 through which light passes to be focused on the image sensor to generate an image.

[0055] For example, a transmissive area of ​​display 201 includes an area with a lower density of pixels than the surrounding area. For example, the transmissive region can replace the opening. For example, the camera module 205 includes an under display camera (UDC). In other embodiments, some sensor modules 204 may be positioned within the interior space of the electronic device to perform their functions without being visually exposed through the front plate 202 . For example, in such a case, the area of ​​the display 201 facing the sensor module may not require a perforated opening.

[0056] According to one embodiment, the electronic device 200 has a bar type or plate type appearance, although the present invention is not limited thereto. For example, the illustrated electronic device 200 may be part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. By "foldable electronic device," "slidable electronic device," "stretchable electronic device," and / or "rollable electronic device" is meant an electronic device that can be bent and deformed such as a display (e.g., display 330 of FIG. 3) and can be at least partially folded, wound or rolled, at least partially expanded in area, and / or housed within a housing (e.g., housing 210 of FIGS. 2a and 2b). Foldable, slidable, strechable, and / or rollable electronic devices can be used to expand the screen display area by unfolding the display or exposing a larger area of ​​the display to the outside, depending on the user's needs.

[0057] FIG. 3 is an exploded perspective view of electronic device 200 of FIG. 2a according to an embodiment of the present invention. The electronic device 300 of FIG. 3 may be at least partially similar to the electronic device 200 of FIGS. 2a and 2b, or may include other embodiments of an electronic device. Referring to FIG. 3, an electronic device 300 (e.g., electronic device 200 of FIG. 2a or FIG. 2b) includes a side member 310 (e.g., a side bezel structure), a first support member 311 (e.g., a bracket or support structure), a front plate 320 (e.g., a front cover), a display 330 (e.g., display 201 of FIG. 2a), a substrate 340 (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a rear plate 380 (e.g., a rear cover).

[0058] In one embodiment, the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360) or may additionally include other components. At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 200 of FIG. 2a or FIG. 2b, and a duplicated description will be omitted below.

[0059] The first support member 311 is disposed inside the electronic device 300 and is connected to the side member 310 or is formed integrally with the side member 310 . The first support member 311 is formed of, for example, a metallic material and / or a non-metallic (eg, polymer) material. The first support member 311 has a display 330 coupled to one surface thereof and a substrate 340 coupled to the other surface thereof. The board 340 is equipped with a processor, memory, and / or interfaces. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0060] The memory may include, for example, a volatile memory or a non-volatile memory. The interfaces include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0061] Battery 350 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell as a device for providing power to at least one component of electronic device 300 . At least a portion of the battery 350 is disposed substantially flush with the substrate 340, for example. The battery 350 may be integrally disposed within the electronic device 300 . In other embodiments, the battery 350 may be disposed so as to be removable from the electronic device 300 .

[0062] The antenna 370 is disposed between the back plate 380 and the battery 350 . Antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370, for example, performs short-range communication with an external device or wirelessly transmits and receives power required for charging. In other embodiments, the antenna structure is formed by a portion of the side bezel structure 310 and / or the first support member 311 or a combination thereof.

[0063] FIG. 4 is a view of the upper end of a housing 410 of an electronic device 400 according to an embodiment of the present invention viewed from the front of the electronic device 400, FIG. 5a is a cross-sectional view of the electronic device 400 according to an embodiment of the present invention taken along line AA shown in FIG. 4, FIG. 5b is a cross-sectional view of the electronic device 400 according to an embodiment of the present invention taken along line BB shown in FIG. 4, FIG. 5c is a cross-sectional view of the electronic device 400 according to an embodiment of the present invention taken along line CC shown in FIG. 4, and FIG. 6 is an enlarged oblique view of a first acoustic duct 540, a second acoustic duct 560, and a first acoustic hole 530 according to an embodiment of the present invention.

[0064] The electronic device 400 shown in FIG. 4 may be an example of the electronic device 101 shown in FIG. 1, the electronic device 200 shown in FIGS. 2a and 2b, and / or the electronic device 300 shown in FIG. Although the electronic device 400 described below is described based on a bar-type electronic device as shown in Figures 2a, 2b, and 3, in one embodiment, the electronic device 400 may be part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. In addition, the same reference numerals are used throughout for components that are the same or similar to those described in Figures 1, 2a, 2b, and 3, unless otherwise indicated.

[0065] According to an embodiment of the present invention, electronic device 400 includes a housing 410 (eg, housing 210 of FIGS. 2a and 2b) that supports various appliances and various electronic components. Here, the housing 410 may be a general concept for various fixtures and fixtures that support various electronic components. 4 and 5a, the housing 410 includes a side member 411 (e.g., side member 310 in FIG. 3) that at least a portion of which constitutes a side appearance of the electronic device 400, a first support structure 412 that supports the first speaker module 430, and a second support structure 414 disposed between the side member 411 and the first support structure 412.

[0066] The housings 410 may have symmetrical shapes with respect to a straight line in the length direction of the housings 410 (for example, a straight line in the Y-axis direction with reference to FIG. 4) or may have partially asymmetrical shapes. The housings 410 may have symmetrical shapes or partially asymmetrical shapes with respect to a line in the width direction (for example, a line in the X-axis direction with reference to FIG. 4). The housing 410 can be formed from a variety of materials. For example, it may be formed from metallic and / or non-metallic materials. Here, the metallic materials may include aluminum, stainless steel (STS, SUS), iron, magnesium, and / or titanium alloys, and the non-metallic materials may include synthetic resins, ceramics, and / or engineering plastics. Also, the housing 410 can be formed in various ways, such as injection molding and die casting.

[0067] In one embodiment, housing 410 has a printed circuit board (PCB) disposed therein (eg, board 340 in FIG. 3). The electronic components disposed in the housing 410 are operatively in electrical communication with the printed circuit board. For example, the first speaker module 430 (e.g., the acoustic output module 155 of FIG. 1 or the acoustic output device 214 of FIG. 2a), the second speaker module (not shown) (e.g., the acoustic output module 155 of FIG. 1 or the acoustic output device 207 of FIG. 2a), the receiver module 440 (e.g., the acoustic output module 155 of FIG. 1 or the acoustic output device 214 of FIG. 2a) and the camera module 420 (e.g., the camera module 180 of FIG. 1 or the first camera module 205 of FIG. 2a) described below are electrically connected to the printed circuit board and operate.

[0068] In one embodiment, the electronic components disposed in the housing 410 are electrically connected to a printed circuit board via a flexible printed circuit board (fpcb) (eg, board 340 in FIG. 3). For example, one end of a flexible printed circuit board is electrically connected to an electronic component, and the other end of the flexible printed circuit board is connected to a printed circuit board. Thus, the electronic component and the printed circuit board are electrically connected.

[0069] According to the embodiment, a first speaker module 430 and a receiver module 440 are disposed in a housing 410 of an electronic device 400 . In one embodiment, referring to FIG. 4, the first speaker module 430 and the receiver module 440 are disposed at the top of the housing 410 . The first speaker module 430 refers to a component that outputs sound according to instructions from a processor when an application is executed. The receiver module 440 refers to a component that outputs a call sound. In one embodiment, the receiver module 440 may be a component that outputs sound according to instructions from a processor when an application is executed.

[0070] According to the embodiment, the first speaker module 430 and the receiver module 440 are positioned adjacent to each other at the top end of the housing 410 . For example, referring to FIG. 4, the first speaker module 430 is located in a first direction (eg, +X direction in FIG. 4) with respect to the camera module 420 disposed in the upper center portion of the housing 410. Meanwhile, the receiver module 440 is located in a second direction (eg, −X direction in FIG. 4) that is opposite to the first direction with respect to the camera module 420. In other embodiments, the first speaker module 430 and the receiver module 440 may be arranged in an opposite manner to that shown in FIG. For example, the first speaker module 430 may be disposed in a second direction relative to the camera module 420, and the receiver module 440 may be disposed in a first direction relative to the camera module 420.

[0071] According to an embodiment, housing 410 includes a support structure disposed therein for supporting various fixtures and electronic components. For example, referring to FIG. 5 a , a first support structure 412 supports a first speaker module 430 . In one embodiment, the first support structure 412 supports at least one of the first speaker module 430 , the receiver module 440 , and / or the camera module 420 . The first support structure 412 may include a groove formed to accommodate at least one of the first speaker module 430, the receiver module 440, and / or the camera module 420. In one embodiment, the first support structure 412 is formed separately from the housing 410 and assembled to the housing 410 . In another embodiment, the first support structure 412 is integrally formed with the housing 410 and defines an interior space of the housing 410 .

[0072] According to the embodiment, the electronic device 400 includes a first sound hole 530 which is a passage through which sound output from the first speaker module 430 is emitted to the outside of the electronic device 400 . The first acoustic hole 530 is formed in the side member 411 that constitutes the side surface of the electronic device 400 . In one embodiment, referring to FIG. 4, the first acoustic hole 530 is formed in the side member 411 so as to be located on the upper side of the electronic device 400 . For example, the multiple holes constituting the first acoustic hole 530 are formed in the side member 411 in a direction parallel to the width direction of the electronic device 400 (for example, the X-axis direction with reference to FIG. 4).

[0073] In one embodiment, the first acoustic hole 530 is defined with reference to the camera module 420, as described below. For example, referring to FIG. 4, the first acoustic hole 530 includes a connection hole 531 formed in a first region (P1) of the side member 411 located in a first direction based on the camera module 420, and a dummy hole 532 formed in a second region (P2) of the side member 411 located in a second direction based on the camera module 420. The connection hole 531 may have a hole or an opening shape so that the sound output from the first speaker module 430 can be emitted to the outside of the electronic device 400 . Meanwhile, the dummy hole 532 may be formed as a concave groove or may be formed as an opening and may be closed by a separate device (eg, the shielding member 700 of FIG. 7b). In one embodiment, the first acoustic hole 530 is composed of only the connecting hole 531 . Therefore, the sound output from the first speaker module 430 is emitted to the outside of the electronic device 400 through the first sound hole 530 .

[0074] In an embodiment, a partition 413 is formed inside the housing 410 to separate the connection hole 531 of the first sound hole 530 from the dummy hole 532 of the first sound hole 530 . The partition portion 413 may be a part of a second support structure 414 that constitutes the housing 410 . The partition 413 prevents the sound output from the first speaker module 430 from being emitted to the outside of the electronic device 400 through the dummy hole 532 . Therefore, the sound output from the first speaker module 430 is emitted to the outside of the electronic device 400 through the connecting hole 531 instead of the dummy hole 532 .

[0075] According to an embodiment, as shown in FIGS. 4 and 5 a , the electronic device 400 includes a first acoustic conduit 540 connecting the first acoustic hole 530 and the first speaker module 430 . For example, the first acoustic duct 540 connects the connection hole 531 of the first acoustic hole 530 and the first speaker module 430 . In one embodiment, the first sound duct 540 is formed in the housing 410 so that the sound output from the first speaker module 430 is transmitted to the connection hole 531 of the first sound hole 530 . In one embodiment, the first acoustic conduit 540 may be a space formed by multiple fixtures that make up the housing 410. Here, the term "duct" refers to a path that guides sound (sound waves). For example, a pipeline represents a physical space. The conduit comprises a space filled with a medium (eg, air) capable of transmitting sound. Hereinafter, the transmission of sound through a duct means that the sound is transmitted via a specific space.

[0076] In one embodiment, referring to FIG. 5a, the first acoustic duct 540 includes a first duct 541 extending parallel to the direction in which the first acoustic holes 530 are arranged (e.g., the X-axis direction with reference to FIG. 5a) and a second duct 542 extending in the Y-axis direction with reference to FIG. 5a and connecting the first speaker module 430 and the first duct 541. Referring to FIG. 5 a , the second conduit 542 may be a space formed in a first support structure 412 disposed in the housing 410 . For example, the second conduit 542 may be a conduit formed on the first support structure 412 so as to be inclined with respect to the Y-axis shown in FIG. 5a.

[0077] In one embodiment, as described above, the first sound hole 530 includes a connection hole 531 through which the sound output from the first speaker module 430 is substantially emitted to the outside of the electronic device 400 . The first acoustic duct 540 connects the connection hole 531 of the first acoustic hole 530 to the first speaker module 430 . In this case, the sound output from the first speaker module 430 is emitted to the outside of the electronic device 400 via the second duct 542 including the guide surface 412 , the first duct 541 , and the connection hole 531 of the first sound hole 530 . However, the above-mentioned first pipe line 541 and second pipe line 542 are merely concepts for explaining the connection relationship between the first speaker module 430 and the connecting hole 531, and in reality, the first pipe line 541 and the second pipe line 542 may not be separated on the first acoustic pipe line 540.

[0078] According to an embodiment, the electronic device 400 includes a display module 510 (eg, the display module 160 of FIG. 1, the display 201 of FIG. 2a, or the display 330 of FIG. 3). The display module 510 is disposed on a front surface of the housing 410 (eg, the first surface (or front surface) 210A in FIG. 2a). As described in FIG. 2a, the display module 510 includes a camera hole 205 (eg, the camera hole 205 in FIG. 2a) including at least a portion of a light-transmitting area to allow light to pass through to the camera lens 421 of the camera module 420. The camera lens 421 of the camera module 420 faces the camera hole 205 of the display module 510 . In one embodiment, the camera hole 205 may be formed at the center of the top of the display module 510 in consideration of the aesthetics of the electronic device 400 .

[0079] In one embodiment, the center of the first acoustic hole 530 is aligned with the camera hole 205 . For example, the first acoustic hole 530 may be symmetrical with respect to a line in the length direction of the electronic device 400 passing through the camera hole 205 (for example, the Y-axis direction with reference to FIG. 4). In one embodiment, the center of the first acoustic hole 530 is aligned with the center of the housing 410 in the width direction (eg, the X-axis direction with reference to FIG. 4).

[0080] In one embodiment, the housing 410 of the electronic device 400 has multiple speaker modules disposed therein. For example, a first speaker module 430 is disposed at an upper end of the housing 410, and a second speaker module is disposed at a lower end of the housing 410. The second speaker module refers to a component that outputs sound according to instructions from the processor when an application is executed. The electronic device 400 includes a third sound hole (not shown) through which the sound output from the second speaker module is emitted to the outside of the electronic device 400 . The third acoustic hole is formed in a side member 411 that constitutes the outer side surface of the electronic device 400 . For example, referring to FIG. 2 a , the third acoustic hole is formed in the side member 411 so as to be located on the bottom side of the electronic device 400 . The plurality of holes constituting the third acoustic hole are formed in the side member 411 in a direction parallel to the width direction of the electronic device 400 (for example, the X-axis direction with reference to FIG. 4). The sound output from the second speaker module travels along a third sound duct (not shown) connecting the second speaker module and the third sound hole, and is emitted to the outside of the electronic device 400 through the third sound hole.

[0081] In one embodiment, the third acoustic hole is positioned symmetrically to the first acoustic hole 530 with respect to a line in the width direction (eg, the X-axis direction in FIG. 4) of the electronic device 400 in consideration of the aesthetics of the electronic device 400. In such a case, the center of the third acoustic hole is aligned with the camera hole 205 as is the first acoustic hole 530 . For example, the third acoustic hole may be symmetrical with respect to a line in the length direction of the electronic device 400 passing through the camera hole 205 (for example, the Y-axis direction with reference to FIG. 4). In one embodiment, the center of the third acoustic hole is aligned with the center of the housing 410 in the width direction (eg, the X-axis direction with reference to FIG. 4).

[0082] According to the embodiment, the electronic device 400 includes a second sound hole 550 through which the sound output from the receiver module 440 is emitted to the outside of the electronic device 400 . In one embodiment, the second acoustic hole 550 refers to a space formed by separating the display module 510 disposed in the housing 410 toward the front side of the electronic device 400 and the side member 411 of the housing 410 . For example, referring to FIG. 5 b , the second acoustic hole 550 refers to a slit-shaped hole located between the display module 510 and the side member 411 . Here, the slit-shaped hole is formed extending in the X-axis direction shown in FIG. 5b. In another embodiment, the second acoustic hole 550 is formed in the display module 510 . For example, the second sound hole 550 is formed at the top of the display module 510 so that the sound output from the receiver module 440 can be emitted to the outside of the electronic device 400 .

[0083] In one embodiment, when a user holds electronic device 400 to make a call, the user's ear is adjacent to the center of the top edge of electronic device 400 . In this case, the second sound hole 550 is located at the center of the top of the electronic device 400 so that the call sound can be efficiently transmitted to the user.

[0084] According to an embodiment, as shown in FIGS. 4 and 5 b , the electronic device 400 includes a second acoustic conduit 560 connecting the second acoustic hole 550 and the receiver module 440 . In one embodiment, a second acoustic conduit 560 is formed in the housing 410 so that the sound output from the receiver module 440 is transmitted to the second acoustic hole 550 . In one embodiment, the second acoustic conduit 560 may be a space formed by multiple fixtures that make up the housing 410.

[0085] According to an embodiment, as shown in FIG. 5b, the second acoustic duct 560 includes a connecting duct 561 extending parallel to the direction in which the first acoustic holes 530 are arranged (e.g., the X-axis direction with reference to FIG. 4). For example, the connecting pipe 561 extends in a first direction with respect to the camera module 420 . In one embodiment, referring to FIG. 4, the connecting conduit 561 faces a portion of the side member 411 . The second acoustic duct 560 includes an extension duct 562 that extends from the receiver module 440 to the connecting duct 561 so that the sound output from the receiver module 440 is transmitted to the connecting duct 561 . The sound output from the receiver module 440 passes through the extension pipe 562 , the connection pipe 561 , and the second sound hole 550 and is emitted to the outside of the electronic device 400 . However, the above-mentioned connecting pipe 561 and extension pipe 562 are merely concepts for explaining the connection relationship between the receiver module 440 and the second acoustic hole 550, and in reality, the connecting pipe 561 and the extension pipe 562 may not be separated on the second acoustic pipe 560.

[0086] In one embodiment, at least a portion of the second acoustic line 560 is located in a direction from the rear to the front of the electronic device 400 relative to the first acoustic line 540 (eg, in the +Z direction with respect to FIG. 5b). For example, referring to FIGS. 5a and 5b, the connecting line 561 of the second acoustic line 560 is located in the +Z direction with respect to the first line 541 of the first acoustic line 540 with reference to FIG. 5b. As shown in FIG. 5 a , the connecting pipe 561 of the second acoustic pipe 560 is separated from the first pipe 541 of the first acoustic pipe 540 by the partition wall 413 . In another embodiment, the connecting conduit 561 is located in the -Z direction with respect to the first conduit 541 with reference to FIG. 5b. In still another embodiment, the connecting conduit 561 is located in the +Y direction or the -Y direction with respect to the first conduit 541 with reference to FIG. 5b. The positional relationship between the connecting pipeline 561 and the first pipeline 541 described above is merely an example, and is not meant to limit the positional relationship between the connecting pipeline 561 and the first pipeline 541. In addition, the positional relationship between the connecting pipe 561 and the first pipe 541 can be modified in various ways within the scope of the practice of ordinary engineers.

[0087] According to the embodiment, as shown in FIG. 6, one end of the connecting pipe 561 of the second acoustic pipe 560 is formed wider than the other end of the connecting pipe 561. For example, one end of the connecting pipeline 561 (e.g., a part of the connecting pipeline 561 located in the -X direction with reference to FIG. 6) may have a larger width (W) and lateral width (L) than the other end of the connecting pipeline 561 (e.g., a part of the connecting pipeline 561 located in the +X direction with reference to FIG. 6).

[0088] According to the embodiment, a foreign object blocking member 570 is disposed in the first sound hole 530 and the second sound hole 550 . The foreign object blocking member 570 blocks foreign objects from entering the electronic device 400 from the outside. The foreign object blocking member 570 includes a plurality of speaker modules and fine holes formed therein to allow sounds generated from the receiver module 440 to be emitted to the outside of the electronic device 400 . For example, it includes a mesh structure. The foreign object blocking member 570 is disposed inside the electronic device 400 to cover the first sound hole 530 and the second sound hole 550 . In one embodiment, referring to FIG. 5 a , the foreign object blocking member 570 is disposed at the outlet of the second conduit 542 of the first acoustic conduit 540 to reduce the inflow of foreign objects into the first speaker module 430 .

[0089] According to an embodiment of the present invention, the first speaker module 430 is disposed at an eccentric position at the top center portion of the housing 410 . For example, the first speaker module 430 is disposed apart in the first direction from the camera module 420 located at the center of the upper end of the housing 410, and is thus offset from the center of the housing 410 in the first direction. In such a case, the first acoustic duct 540 may be designed to avoid the fixtures disposed in the central portion of the housing 410, so that the volume of the first acoustic duct 540 may become small. Therefore, the speaker radiation performance of the electronic device 400 due to the first speaker module 430 may be degraded.

[0090] In an embodiment of the present invention, an additional path may be provided in addition to the path in which the sound output from the first speaker module 430 is emitted via the first acoustic duct 540-the connection hole 531 of the first acoustic hole 530. For example, the first acoustic line 540 and the second acoustic line 560 may be coupled. In this case, the sound output from the first speaker module 430 passes through the second sound pipe 560 and the second sound hole 550 in this order, and is then emitted to the outside of the electronic device 400 . Therefore, an additional path for the sound output from the first speaker module 430 to be emitted to the outside of the electronic device 400 is formed, thereby improving the speaker radiation performance of the electronic device 400. Hereinafter, the structure in which the first acoustic pipe 540 and the second acoustic pipe 560 are connected will be described.

[0091] According to an embodiment, the first acoustic line 540 is coupled to a second acoustic line 560 . In one embodiment, the first acoustic line 540 is coupled to a connecting line 561 of the second acoustic line 560 . For example, referring to FIGS. 5 c and 6 , the first acoustic duct 540 is connected to a connection duct 561 of the second acoustic duct 560 via a connection part 600 positioned adjacent to the first speaker module 430 . The connection part 600 is spaced apart in the first direction from the camera module 420 located at the center of the upper end of the housing 410 and is adjacent to the first speaker module 430 . The connection part 600 is formed on the housing 410 to extend in a third direction (eg, the Z-axis direction in FIG. 6) perpendicular to the first and second directions. In one embodiment, the connection portion 600 may be a space formed by an object disposed in the housing 410 .

[0092] The connecting portion 600 connects the first pipe 541 of the first acoustic pipe 540 and the second acoustic pipe 560 . When the connection part 600 is positioned adjacent to the receiver module 440 rather than the first speaker module 430 , the first acoustic duct 540 and the second acoustic duct 560 are connected at a position adjacent to the receiver module 440 . In this case, the second acoustic pipe 560 is connected to the first acoustic pipe 540 via the connecting portion 600 , and is thereby connected to the connecting hole 531 of the first acoustic hole 530 connected to the first acoustic pipe 540 . Therefore, the sound output from the receiver module 440 is emitted to the outside of the electronic device 400 through the connection hole 531 of the first sound hole 530 as well as the second sound hole 550 . In such a case, the user's call sound may be transmitted to others, thereby violating the user's privacy. According to an embodiment of the present invention, the connection part 600 is located adjacent to the first speaker module 430 rather than the receiver module 440 . A connection pipe 561 between the first acoustic pipe 540 and the second acoustic pipe 560 is connected via a connection part 600 at a position adjacent to the first speaker module 430 from the receiver module 440 . Therefore, the sound output from the receiver module 440 passes through the second sound pipe 560 and is emitted to the outside of the electronic device 400 through the second sound hole 550 adjacent to the receiver module 440 from the connecting part 600 .

[0093] In one embodiment, the connector 600 connects the first line 541 of the first acoustic line 540 to the second acoustic line 560 . For example, the connection part 600 may be a part that extends from the first pipe 541 of the first acoustic pipe 540 in the third direction and is connected to the connection pipe 561 of the second acoustic pipe 560 . In one embodiment, the connector 600 connects the second line 542 of the first acoustic line 540 and the connecting line 561 of the second acoustic line 560 .

[0094] The connecting portion 600 described above is a conceptual term for explaining the portion where the connecting pipe 561 of the first acoustic pipe 540 and the second acoustic pipe 560 are connected, and may not actually be a configuration that is divided on the first acoustic pipe 540 and the connecting pipe 561. For example, the coupling portion 600 may be a portion of at least one of the first acoustic line 540 and the coupling line 561 .

[0095] According to an embodiment of the present invention, the first acoustic duct 540 is connected to the connection duct 561 of the second acoustic duct 560 via the connection part 600 located adjacent to the first speaker module 430 . The sound generated in the first speaker module 430 passes through the second line 542 of the first acoustic line 540 , the first line 541 of the first acoustic line 540 , and the connecting hole 531 of the first acoustic hole 530 in this order, and is then emitted to the outside of the electronic device 400 . In addition, the sound generated in the first speaker module 430 is released outside the electronic device 400 via the second duct 542 of the first acoustic duct 540, the first duct 541 of the first acoustic duct 540, the connection part 600, the connection duct 561 of the second acoustic duct 560, and the second acoustic hole 550 in that order. Therefore, the sound generated from the first speaker module 430 is emitted through the connecting hole 531 of the first sound hole 530 and the second sound hole 550, thereby improving the speaker radiation performance of the electronic device 400.

[0096] According to an embodiment of the present invention, the speaker radiation performance of the electronic device 400 is improved by increasing the number of holes constituting the first acoustic hole 530 or the third acoustic hole formed in the side member 411 of the housing 410 . However, a larger number of appliances and electronic components are disposed at the upper end of the housing 410 than at the lower end of the housing 410 . In this case, there is a structural limit to forming an additional hole constituting the first sound hole 530 formed in the upper end of the side member 411 of the housing 410. For example, if a hole constituting the first acoustic hole 530 is additionally formed in a second direction based on the camera module 420, the added first acoustic hole 530 is connected to the second acoustic pipe 560, and the sound output from the receiver module 440 is emitted outside the electronic device 400 through the added first acoustic hole 530.

[0097] Meanwhile, fewer appliances and electronic components are disposed at the lower end of the housing 410 than at the upper end of the housing 410 . Accordingly, a hole constituting a third sound hole is additionally formed at the lower end of the side member 411 of the housing 410. However, in terms of aesthetic appearance of the electronic device 400, the first acoustic hole 530 and the third acoustic hole are formed symmetrically with respect to a line in the width direction of the housing 410 (eg, the X-axis direction in FIG. 4). Therefore, the number of holes constituting the third acoustic hole depends on the number of holes constituting the first acoustic hole 530. According to an embodiment of the present invention, a method for additionally forming holes constituting the first acoustic hole 530 and the third acoustic hole can be provided. Also, a structure can be presented in which the sound output from the receiver module 440 is not emitted through the additional first acoustic hole 530 .

[0098] FIG. 7a is a view showing a state in which a shielding member 700 is arranged on the upper end of a housing 410 of an electronic device 400 according to an embodiment of the present invention, FIG. 7b is a partial cross-sectional view showing a state in which a portion of a dummy hole 532 according to an embodiment of the present invention is blocked, FIG. 7c is a partial cross-sectional view showing a state in which a dummy hole 532 according to an embodiment of the present invention is closed by a shielding member 700, FIG. 7d is a partial cross-sectional view showing a state in which a sound generated from a first speaker module 430 and a sound generated from a receiver module 440 are emitted outside the electronic device 400 when a first acoustic duct 540 and a second acoustic duct 560 according to an embodiment of the present invention are connected, FIG. 8a is a perspective view showing a shielding member 700 according to an embodiment of the present invention, and FIG. 8b is a view showing a state in which a shielding member 700 according to an embodiment of the present invention is arranged on a housing 410 and blocks a dummy hole 532 of a first acoustic hole 530.

[0099] According to an embodiment, as shown in FIG. 7a, the first acoustic hole 530 is defined with respect to the camera module 420 (eg, the camera module 180 in FIG. 1 or the first camera module 205 in FIG. 2a). For example, the first acoustic hole 530 includes a connecting hole 531 formed in a first region (P1) of the side member 411 positioned in a first direction shown in FIG. 7a based on the camera module 420, and a dummy hole 532 formed in a second region (P2) of the side member 411 positioned in a second direction shown in FIG. 7a based on the camera module 420. As described above, the connection hole 531 may be in the form of an opening or hole formed to allow communication between the exterior of the electronic device 400 and the interior of the electronic device 400 .

[0100] According to an embodiment, as shown in FIG. 7a, a partition portion 413 is formed inside a housing 410 (e.g., housing 210 in FIGS. 2a and 2b) to separate a first region (P1) of a side member 411 (e.g., side member 310 in FIG. 3) from a second region (P2) of the side member 411. The partition portion 413 may be a part of a second support structure 414 that constitutes the housing 410 . In one embodiment, the partition portion 413 is formed by extending at least a portion of the housing 410 in a third direction (eg, the +Z direction in FIG. 6) to partition the connection hole 531 of the first sound hole 530 and the dummy hole 532 of the first sound hole 530. In addition, the partition portion 413 extends in a width direction of the housing 410 (for example, in the X-axis direction with reference to FIG. 7a) to separate the first pipe 541 of the first acoustic pipe 540 from the second connecting pipe 561 of the second acoustic pipe 560. Therefore, the first acoustic line 540 and the second acoustic line 560 are connected only via the connecting portion 600 .

[0101] The partition portion 413 blocks the sound output from the first speaker module 430 (e.g., the acoustic output module 155 in FIG. 1 or the acoustic output device 214 in FIG. 2a) from being transmitted to the dummy hole 532 formed in the second region (P2) of the side member 411. Therefore, the sound output from the first speaker module 430 is emitted through the partition wall 413 to the connecting hole 531 of the first acoustic hole 530 instead of the dummy hole 532 . In addition, the sound output from the first speaker module 430 is emitted outside the electronic device 400 via the second duct 542 of the first acoustic duct 540, the first duct 541 of the first acoustic duct 540, the connection part 600, the connection duct 561 of the second acoustic duct 560, and the second acoustic hole 550 in that order. The partition 413 prevents the sound output from the receiver module 440 from being emitted to the outside of the electronic device 400 through the connection hole 531 of the first sound hole 530 formed in the first region (P1) of the side member 411. Therefore, the sound output from the receiver module 440 (e.g., the acoustic output module 155 in FIG. 1 or the acoustic output device 214 in FIG. 2a) is not emitted to the connecting hole 531 of the first acoustic hole 530 by the partition portion 413, but is emitted to the outside of the electronic device 400 via the extension pipe 562 of the second acoustic pipe 560-the connecting pipe 561 of the second acoustic pipe 560-the second acoustic hole 550.

[0102] According to the embodiment, the dummy holes 532 are formed in various shapes in the second region (P2) of the side member 411 constituting the housing 410. In one embodiment, the dummy hole 532 may have a closed interior. For example, referring to FIG. 7 b , the dummy hole 532 comprises a groove recessed into the side member 411 of the housing 410 . In this case, the sound output from the receiver module 440 is not emitted to the outside of the electronic device 400 through the dummy hole 532 but is emitted to the outside of the electronic device 400 through the second sound hole 550 .

[0103] According to the embodiment, the dummy hole 532 may be an opening formed to connect the inside of the electronic device 400 to the outside of the electronic device 400 . In this case, the connecting conduit 561 of the second acoustic conduit 560 is connected to the dummy hole 532 . Therefore, the sound generated in the receiver module 440 is emitted to the outside of the electronic device 400 through the dummy hole 532 in addition to the second sound hole 550 . Therefore, there is a possibility that the call sound may be transmitted to others other than the user, thereby violating the user's privacy. To solve this problem, a separate device for closing the dummy hole 532 is disposed inside the housing 410.

[0104] For example, referring to FIG. 8 a , a shielding member 700 is disposed within the housing 410 to close the dummy hole 532 . In one embodiment, referring to FIGS. 7 c and 7 d , the shielding member 700 is at least partially disposed on the connecting line 561 of the second acoustic line 560 to close the dummy hole 532 . According to an embodiment of the present invention, by closing the dummy hole 532, the sound output from the receiver module 440 may not be emitted to the outside of the electronic device 400 through the dummy hole 532. Therefore, the sound output from the receiver module 440 is emitted to the outside of the electronic device 400 through the second sound hole 550 adjacent to the user's ear during a call.

[0105] In one embodiment, referring to Figures 7d and 8a, the shielding member 700 includes a recess 701 formed by etching so that sound output from the receiver module 440 can be transmitted to the connecting pipe 561 of the second acoustic pipe 560 via the extension pipe 562 of the second acoustic pipe 560. The recess 701 formed in the shielding member 700 may extend from one end of the shielding member 700 to the other end of the shielding member 700 . For example, the recess 701 formed in the shielding member 700 may extend from one end of the shielding member 700 located in the -Z direction to the other end of the shielding member 700 located in the +Z direction with reference to FIG. 8a. Referring to FIG. 7d, the sound output from the receiver module 440 passes through the extension line 562 of the second acoustic line 560, the recess 701 formed in the shielding member 700, the connecting line 561 formed in the second shielding member 700, and the second acoustic hole 550, in that order, and is then emitted outside the electronic device 400.

[0106] 7d and 8a, in one embodiment, a shielding member 700 includes a protruding structure 702. As shown in FIG. The protruding structure 702 formed on the shielding member may be a structure formed by protruding from one surface of the shielding member 700 (eg, a surface facing the +Z direction with reference to FIG. 8a). The shielding member 700 may have a flat surface on the other side (eg, the surface facing the -Z direction with reference to FIG. 8a) opposite to the surface on which the protrusion structures 702 are formed. The shielding member 700 is inserted into the housing 410 from the front to the back direction of the electronic device 400 (e.g., the -Z direction with reference to FIG. 7d) so that at least a portion of the shielding member 700 is positioned on the connecting pipe 561 of the second acoustic pipe 560 to close the dummy hole 532. Referring to FIG. 7d, when inserted into the housing 410, the protrusion structure 702 formed on the shielding member 700 is inserted toward the front surface of the electronic device 400 (e.g., the surface facing the +Z direction with reference to FIG. 7d). The protruding structure 702 formed on the shielding member 700 serves as a reference for determining whether the other surface of the shielding member 700 is first inserted into the housing 410 .

[0107] In one embodiment, referring to FIGS. 8a and 8b, the shielding member 700 has a different width in the Y-axis direction with reference to FIG. 8a. For example, the width (W1) of one end (700-1) of the shielding member 700 on which the protrusion structure 702 is formed (e.g., the width in the Y-axis direction with reference to FIG. 8a) is longer than the width (W2) of the other end (700-2) (e.g., the width in the Y-axis direction with reference to FIG. 8a). A portion of the housing 410 on which the shielding member 700 is seated is formed to correspond to the shape of the shielding member 700 . For example, referring to FIG. 8b, a portion of the housing 410 where one end 700-1 of the shielding member 700 is disposed is formed to be wider than a portion where the other end 700-2 of the shielding member 700 is disposed.

[0108] Since the width (W1) of one end (700-1) of the shielding member 700 is different from the width (W2) of the other end (700-2) of the shielding member 700, it is possible to determine whether the shielding member 700 is inserted into the housing 410 in the desired direction during the assembly process. For example, referring to FIG. 8b, when the protrusion structure 702 of the shielding member 700 is inserted into the housing 410 toward the rear surface of the electronic device 400 (the surface facing the -Z direction with reference to FIG. 7d), the shielding member 700 may not be able to be inserted into the housing 410 because the width (W1) of one end (700-1) of the shielding member 700 is longer than the width of a portion of the housing 410 that is formed to correspond to the width (W2) of the other end (700-2) of the shielding member 700. Therefore, the width (W1) of one end (700-1) of the shielding member 700 and the width (W2) of the other end (700-2) are made different from each other to determine whether the shielding member 700 is inserted into the housing 410 in the correct direction.

[0109] In one embodiment, not shown in the drawings, the shielding member 700 may be part of the fixture that makes up the housing 410 of the electronic device 400 . For example, the shielding member 700 may be a part of a rear case (eg, the second support member 360 in FIG. 3) disposed toward the rear surface of the housing 410. A part of the rear case disposed on the rear surface of the housing 410 extends up to the dummy hole 532 to close the dummy hole 532 . In one embodiment, the shielding member 700 may be a concept that refers to a portion of the housing 410 that closes the dummy hole 532. In addition, the dummy hole 532 formed in the side member 411 of the housing 410 may be closed in various ways within the scope of what a skilled technician can implement, such as by closing the dummy hole 532 through a separate device (e.g., a shielding member 700) disposed inside the housing 410 or by extending a device constituting the housing 410.

[0110] According to embodiments, the shielding member 700 is formed from a variety of materials. For example, it may be made of an elastomeric, metallic, or non-metallic material. The elastic material may be made of materials such as rubber and urethane. Metallic materials may include alloys such as aluminum, stainless steel (STS, SUS), iron, magnesium, and titanium, and non-metallic materials may include synthetic resins, ceramics, and engineering plastics. Also, the shielding member 700 can be formed by various methods such as injection molding and die casting.

[0111] According to an embodiment of the present invention, a first acoustic hole 530 including a connecting hole 531 formed in a first region (P1) of the side member 411 and a dummy hole 532 formed in a second region (P2) of the side member 411 is formed in the side member 411 of the housing 410. The first acoustic duct 540 is connected to a connection duct 561 of the second acoustic duct 560 via a connection part 600 located adjacent to the first speaker module 430 . Referring to FIG. 7d, the sound output from the first speaker module 430 is emitted outside the electronic device 400 via the second line 542 of the first acoustic line 540, the first line 541 of the first acoustic line 540, and the connecting hole 531 of the first acoustic hole 530, in that order. The sound output from the first speaker module 430 passes through the first acoustic duct 540 , the connecting part 600 , the connecting duct 561 of the second acoustic duct 560 , and the second acoustic hole 550 in this order, and is then emitted outside the electronic device 400 . Therefore, a path for discharging the sound output from the first speaker module 430 is added, thereby improving the speaker radiation performance of the electronic device 400 . On the other hand, the dummy holes 532 are closed by being formed in a concave groove shape or by arranging the shielding member 700 so as to cover the dummy holes 532 . Therefore, the sound output from the receiver module 440 passes through the extension line 562 of the second acoustic line 560 , the connection line 561 of the second acoustic line 560 , and the second acoustic hole 550 in this order, and is then emitted outside the electronic device 400 .

[0112] According to an embodiment of the present invention, the speaker radiation performance of the electronic device 400 can be improved by adding the number of holes constituting the first acoustic hole 530 or the third acoustic hole formed in the side member 411 of the housing 410. Holes constituting the first acoustic hole 530 and the third acoustic hole may be additionally formed. For example, referring to FIG. 5C and FIG. 6, the side member 411 of the housing 410 is formed with dummy holes 532 arranged in a direction parallel to the connecting hole 531 of the first sound hole 530 . The dummy hole 532 is formed to be located in a second direction (eg, −X direction in FIG. 7a) with respect to the camera module 420 located in the center of the upper end of the housing 410. The dummy hole 532 is formed in the second region (P2) of the side member 411 facing the connecting pipe 561 of the second acoustic pipe 560. If the dummy hole 532 is formed in an open shape, the dummy hole 532 and the connecting pipe 561 of the second acoustic pipe 560 may be connected, and the sound generated from the receiver module 440 may be emitted to the dummy hole 532 . In such a case, the user's call sound may be transmitted to others, thereby violating the user's privacy. Therefore, the dummy holes 532 are formed in a closed state, or the shielding members 700 are disposed in the dummy holes 532 to shield the dummy holes 532 .

[0113] Meanwhile, in order to ensure the speaker radiation performance of the electronic device 400, a connection hole 531 for the first sound hole 530 is additionally formed in the first region (P1) of the side member 411. An additional hole constituting a dummy hole 532 is formed in the second region (P2) of the side member 411 so that the center of the first acoustic hole 530 is aligned with the center of the width direction of the housing 410 (e.g., the X-axis direction with reference to FIG. 4). By forming the additional hole constituting the connection hole 531, the sound output from the first speaker module 430 is radiated in a wider direction than the existing one.

[0114] The number of holes constituting the first acoustic hole 530 appears to increase when holes constituting the connecting hole 531 are additionally formed or when holes constituting the dummy hole 532 are additionally formed. The third acoustic hole is formed symmetrically to the first acoustic hole 530 with respect to a line in the width direction of the housing 410 (eg, the X-axis direction in FIG. 7a) in consideration of the aesthetics of the electronic device 400. The number of holes constituting the third acoustic hole is increased by the number of holes added to the first acoustic hole 530 . Therefore, by adding the third acoustic hole, the sound generated by the second speaker module is radiated in a wider direction than the existing one.

[0115] According to an embodiment of the present invention, one end of the connecting pipe 561 of the second acoustic pipe 560 (e.g., a part of the connecting pipe 561 located in the -X direction with reference to FIG. 6) is extended in the direction in which the dummy hole 532 is formed (e.g., in the -X direction with reference to FIG. 6). For example, one end of the connecting pipe 561 may have a larger width (W) and lateral width (L) than the other end of the connecting pipe 561 (for example, a part of the connecting pipe 561 located in the +X direction with reference to FIG. 6). Therefore, the radiation area of ​​the sound output from the receiver module 440 is enlarged, and the receiver radiation performance of the electronic device 400 is improved.

[0116] An electronic device 400 (e.g., electronic device 101 of FIG. 1 , electronic device 200 of FIG. 2 a , or electronic device 300 of FIG. 3 ) according to an embodiment of the present invention includes a housing 410 (e.g., housing 210 of FIGS. 2 a and 2 b ), a camera module 420 (e.g., camera module 180 of FIG. 1 or first camera module 205 of FIG. 2 a ) disposed in the housing, a speaker module 430 (e.g., acoustic output module 155 of FIG. 1 ) positioned in a first direction (e.g., first direction shown in FIG. 4 ) relative to the camera module, acoustic output device 214 of FIG. 2 a or first speaker module 430 of FIG. 4 , a receiver module 440 (e.g., receiver module 450 of FIG. 4 ) positioned in a second direction (e.g., second direction shown in FIG. 4 ) opposite to the first direction relative to the camera module. 1 or the audio output device 214 in FIG. 2a), a connecting hole 531 located in a first direction relative to the camera module and a hole located in a second direction relative to the camera module (e.g., dummy hole 532 in FIG. 4), a first acoustic hole 530 located on a side of the electronic device, a first acoustic duct 540 connecting the connecting hole and the speaker module, a second acoustic hole 550 located on the front of the electronic device (e.g., the surface facing the +Z direction with reference to FIG. 2a), a connecting duct 561 arranged in a third direction (e.g., the +Z direction with reference to FIG. 6) perpendicular to the first acoustic duct, a second acoustic duct 560 connecting the second acoustic hole and the receiver module, and a connecting portion 600 connecting the connecting duct of the first acoustic duct and the second acoustic duct.

[0117] Also, it is preferable that the connecting portion is located adjacent to the speaker module rather than the receiver module. In addition, it is preferable that the second acoustic conduit further includes a shielding member 700 that is connected to the hole of the first acoustic hole (e.g., the dummy hole 532 in FIG. 4) and closes the hole of the first acoustic hole (e.g., the dummy hole 532 in FIG. 4). Moreover, the shielding member preferably includes a recess 701 connected to the second acoustic line. Moreover, the shielding member preferably includes a protruding structure 702 that protrudes from the rear surface of the electronic device toward the front surface (eg, in the +Z direction with respect to FIG. 8a). Furthermore, it is preferable that the second acoustic conduit is connected to a hole of the first acoustic hole (e.g., dummy hole 532 in FIG. 4), and the hole (e.g., dummy hole 532 in FIG. 4) is closed via a fixture constituting the housing. Furthermore, it is preferable that the connecting hole of the first acoustic hole includes an opening formed on a side surface of the housing, and the hole of the first acoustic hole (e.g., dummy hole 532 in FIG. 4) includes a groove formed in a concave shape on the side surface of the housing. In addition, it is preferable that the connecting pipe of the second acoustic pipe extends in the first direction. In addition, the connecting portion is preferably formed on the housing and extended in the third direction. Moreover, the first acoustic conduit and the second acoustic conduit are preferably formed in the housing.

[0118] It is preferable that the housing further includes a display module 510 (e.g., display module 160 of FIG. 1, display 201 of FIG. 2a, or display 330 of FIG. 3) arranged toward the front surface of the housing, and the second acoustic hole includes a hole formed in the shape of a slit between the display module and the housing. It is also preferable that the display module 510 (e.g., the display module 160 of FIG. 1, the display 201 of FIG. 2a, or the display 330 of FIG. 3) further includes a camera hole (e.g., the camera hole 205 of FIG. 2a) formed to allow light to pass through to the lens 421 of the camera module, the camera hole being located at the center of the top end of the display module, and the center of the first acoustic hole being aligned with the camera hole. It is also preferable that the acoustic transducer further includes a partition wall portion 413 that separates the first acoustic duct from the second acoustic duct.

[0119] An electronic device 400 (e.g., electronic device 101 of FIG. 1 , electronic device 200 of FIG. 2 a , or electronic device 300 of FIG. 3 ) according to an embodiment of the present invention includes a housing 410 (e.g., housing 210 of FIGS. 2 a and 2 b ), a camera module 420 (e.g., camera module 180 of FIG. 1 or first camera module 205 of FIG. 2 a ) disposed in the housing, a speaker module 430 (e.g., acoustic output module 155 of FIG. 1 ) located in a first direction (e.g., a first direction shown in FIG. 4 ) relative to the camera module, acoustic output device 214 of FIG. 2 a or first speaker module 430 of FIG. 4 ), and a second direction (e.g., a second direction shown in FIG. 5 ) opposite to the first direction relative to the camera module. 6), a first acoustic hole 530 located on the side of the housing, a first acoustic duct 540 connecting the first acoustic hole and the speaker module, a second acoustic hole 550 located on the front surface of the housing (e.g., the surface facing the +Z direction with reference to FIG. 2a), a connecting duct 561 arranged in a third direction (e.g., the +Z direction with reference to FIG. 6) perpendicular to the first direction to the first acoustic duct, a second acoustic duct 560 connecting the second acoustic hole and the receiver module, and a connecting portion 600 connecting the connecting duct of the first acoustic duct and the second acoustic duct.

[0120] Also, it is preferable that the connecting portion is located adjacent to the speaker module rather than the receiver module. In addition, the connecting portion is preferably formed on the housing and extended in the third direction. In addition, it is preferable that the connecting pipe of the second acoustic pipe extends in the first direction. Moreover, the first acoustic duct and the second acoustic duct are preferably formed in the housing.

[0121] It is preferable that the housing further includes a display module 510 (e.g., display module 160 of FIG. 1, display 201 of FIG. 2a, or display 330 of FIG. 3) arranged toward the front surface of the housing, and the second acoustic hole includes a hole formed in the shape of a slit between the display module and the housing. It is also preferable that the display module 510 (e.g., the display module 160 of FIG. 1, the display 201 of FIG. 2a, or the display 330 of FIG. 3) includes a camera hole (e.g., the camera hole 205 of FIG. 2a) facing the lens 421 of the camera module, the camera hole being located at the center of the top edge of the display module, and the center of the first acoustic hole being aligned with the camera hole.

[0122] Furthermore, the embodiments disclosed in this specification and the drawings are merely specific examples presented to easily explain the technical content according to the embodiments of the present invention and to aid in understanding the embodiments of the present invention, and are not intended to limit the scope of the embodiments of the present invention. Therefore, the scope of the embodiments of the present invention should be interpreted as including all modifications and variations derived based on the technical concept of the embodiments of the present invention in addition to the embodiments disclosed herein. [Explanation of symbols]

[0123] 100 Network Environment 101, 102, 104, 200, 300, 400 Electronic equipment 108 Server 120 processors 121 Main Processor 123 Auxiliary Processor 130 Memory 132 Volatile Memory 134 Non-volatile memory 136 Built-in memory 138 External Memory 140 Programs 142 Operating System (OS) 144 Middleware 146 Applications 150 Input Module 155 Acoustic Output Module 160 Display Module 170 Audio Module 176, 204, 219 Sensor Module 177 Interface 178 Connection terminal 179 Haptics Module 180, 205, 212, 420 Camera Module 188 Power Management Module 189, 350 Battery 190 Communication Module 192 Wireless communication module 194 Wired communication module 196 Subscriber Identity Module 197 Antenna Module 198 Network 1 199 Second Network 201, 330 Display 202, 320 Faceplate 203 Input device (microphone) 207, 214 Sound output device 208 Connector 210, 410 Housing 211, 380 Rear plate 213 Flash 217 Key input device 218 Side bezel structure 310, 411 Side members 311 First support member 340 Substrate 360 Second support member 370 Antenna 412 1st support structure 414 Second support structure 421 Camera Lens 430 1st speaker module 440 Receiver Module 530 1st acoustic hole 531 Connection hole 532 Dummy hole 540 1st acoustic pipe 541 1st pipeline 542 2nd pipeline 560 2nd acoustic pipe 561 Connecting pipeline 562 Extension pipeline 570 Foreign object blocking member 600 Connection section

Claims

1. 1. An electronic device comprising: Housing and a camera module disposed in the housing; a speaker module positioned in a first direction relative to the camera module; a receiver module located in a second direction opposite to the first direction with respect to the camera module; a first acoustic hole located on a side surface of the electronic device, the first acoustic hole including a connection hole located in the first direction relative to the camera module and a hole located in the second direction relative to the camera module and at least a portion of which is closed; a first acoustic duct connecting the connecting hole and the speaker module; a second acoustic hole located on a front surface of the electronic device; a second acoustic pipe including a connecting pipe arranged in a third direction perpendicular to the first direction with respect to the first acoustic pipe, the second acoustic pipe connecting the second acoustic hole and the receiver module; a connecting portion that connects a connecting line of the first acoustic line and a connecting line of the second acoustic line.

2. The electronic device of claim 1 , wherein the connection portion is located closer to the speaker module than to the receiver module.

3. 2. The electronic device according to claim 1, further comprising a shielding member for closing the first acoustic hole.

4. The electronic device of claim 3 , wherein the shielding member includes a recess connected to the second acoustic pipe.

5. The electronic device according to claim 3 , wherein the shielding member includes a protruding structure protruding from a rear surface of the electronic device toward a front surface of the electronic device.

6. 2. The electronic device according to claim 1, wherein the first acoustic hole is closed through a fixture constituting the housing.

7. The connection hole of the first sound hole includes an opening formed on a side surface of the housing, The electronic device according to claim 1 , wherein the first acoustic hole comprises a groove formed in a concave shape on a side surface of the housing.

8. The electronic device of claim 1 , wherein the connecting pipe of the second acoustic pipe extends in the first direction.

9. The electronic device of claim 1 , wherein the connection portion is formed on the housing and extends in the third direction.

10. The electronic device of claim 1 , wherein the first acoustic conduit and the second acoustic conduit are formed in the housing.

11. a display module disposed toward a front surface of the housing; The electronic device of claim 1 , wherein the second sound hole comprises a slit-shaped hole formed between the display module and the housing.

12. 2. The electronic device according to claim 1, further comprising a partition wall that separates a connecting line between the first acoustic line and the second acoustic line.

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