Method for manufacturing a light emitting device

Abstract

To provide, for example, new improved light emitting device, light source device, optical fiber laser, and method for manufacturing the light emitting device.SOLUTION: A light emitting device includes a light emitting unit including a light emitting element that emits laser light, a lens that refracts the laser light emitted by the light emitting element, a housing containing the light emitting element and the lens and provided with a window for transmitting laser light from the lens, and a heat transfer surface that is a part of the outer surface of the housing, a base having a heat receiving surface facing the heat transfer surface and receiving heat from the heat transfer surface, a first joining portion at least partially interposed between the heat transfer surface and the heat receiving surface and joining the light emitting unit and the base, and a second joining portion that joins the light-emitting unit and the base separately from the first joining portion.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention , issue The present invention relates to a method for manufacturing an optical device. [Background technology]

[0002] Conventionally, a semiconductor laser module having a chip-on submount has been known as a light-emitting device (for example, Patent Document 1). The chip-on submount has a submount and a light-emitting element mounted on the submount. A lens is attached to the submount, and thus a subassembly is formed in which the chip-on submount and the lens are integrated.

[0003] For such subassemblies, the position and attitude of the lens relative to the submount are adjusted while detecting the laser light emitted from the light-emitting element and transmitted through the lens, and the lens is fixed to the submount in the adjusted position and attitude. In this way, the optical axis of the laser light is adjusted for each subassembly so that the laser light transmitted through the lens travels in a desired direction. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-164671 A Summary of the Invention [Problem to be solved by the invention]

[0005] In light of the need to improve dust resistance in this type of light emitting device, development is underway of a light emitting unit in which the above-mentioned subassembly is housed within a housing.

[0006] In such a light emitting unit, when the light emitting unit is assembled, the lens is housed within the housing, and therefore it is not possible to adjust the position or attitude of the lens relative to the submount as in the conventional case.

[0007] However, if the position and attitude of the lens relative to the submount is adjusted while emitting laser light as in the conventional method for a subassembly that is not yet housed in a housing before the light-emitting unit is assembled, there is a risk that reliability will decrease because it is not possible to prevent light dust from collecting while the laser light is being emitted during the adjustment. In other words, the effect of housing the subassembly in a housing will be lost.

[0008] Therefore, one of the objects of the present invention is to provide a new and improved light emitting device, light source device, optical fiber laser, and method for manufacturing a light emitting device, for example, that makes it easier to adjust the optical axis of the laser light of the light emitting unit. [Means for solving the problem]

[0009] The light emitting device of the present invention includes, for example, a light emitting unit having a light emitting element that emits laser light, a lens that refracts the laser light emitted by the light emitting element, a housing that contains the light emitting element and the lens and has a window portion through which the laser light from the lens passes, and a heat transfer surface that is a part of the outer surface of the housing, a base that faces the heat transfer surface and has a heat receiving surface that receives heat from the heat transfer surface, a first joint at least a portion of which is interposed between the heat transfer surface and the heat receiving surface and joins the light emitting unit to the base, and a second joint that joins the light emitting unit to the base separately from the first joint.

[0010] In the light emitting device, at least a part of the second bonding portion may be located outside a gap between the heat transfer surface and the heat receiving surface or may be exposed from the gap.

[0011] In the light emitting device, the light emitting unit may have a first portion separated from the heat transfer surface, and the second bonding portion may bond the first portion to the base.

[0012] In the light emitting device, the first bonding portion and the second bonding portion may be made of different materials.

[0013] In the light emitting device, the first bonding portion may be made of a material that melts when heated and then solidifies when cooled to form a bonded state.

[0014] In the light emitting device, the first bonding portion may include solder.

[0015] In the light emitting device, the second bonding portion may be made of a material that solidifies from a fluid state to a bonded state and that does not melt at or below the melting point of the first bonding portion after solidification.

[0016] In the light emitting device, the second bonding portion may be made of a material that is solidified from a fluid state into a bonded state by irradiation with electromagnetic waves.

[0017] In the light emitting device, the base may be provided with a clearance for avoiding interference with electromagnetic waves irradiated toward the second joint portion.

[0018] In the light emitting device, the second bonding portion may be made of a material that is solidified from a fluid state to a bonded state by heating.

[0019] In the light emitting device, a volume of the second bonding portion may be smaller than a volume of the first bonding portion.

[0020] In the light emitting device, the second bonding portion may be a welded portion.

[0021] In the light emitting device, the base may be provided with a surface, a recess having a side recessed from the surface and a bottom surface serving as the heat receiving surface, and the second bonding portion may be bonded to at least one of the side surface and the surface.

[0022] In the light emitting device, the base may have a second portion spaced apart from the heat receiving surface, and the second bonding portion may bond the light emitting unit to the second portion.

[0023] The light emitting device comprises a plurality of light emitting units as the light emitting units, a plurality of heat receiving surfaces arranged in a stepped pattern as the heat receiving surfaces, and at least one step surface provided on the base and positioned between two adjacent heat receiving surfaces among the plurality of heat receiving surfaces, and the second joint may be joined to at least one of the step surface and the heat receiving surface away from the heat transfer surface of the light emitting unit to which the second joint is joined.

[0024] In the light emitting device, one of the heat transfer surface and the heat receiving surface may have a convex curved surface, and the other of the heat transfer surface and the heat receiving surface may have a concave curved surface that generally follows the convex curved surface at a substantially constant interval.

[0025] In the light emitting device, the light emitting unit and the base may be joined via a member different from the light emitting unit and the base and the second joint portion.

[0026] In the light emitting device, the light emitting element may have a fast axis and a slow axis, and the output of the laser light may be 5 [W] or more.

[0027] In the light emitting device, the lens may be a collimating lens that collimates the laser light emitted from the light emitting element.

[0028] The light emitting device may include a plurality of light emitting units as the light emitting units, and an optical component that guides the laser light emitted from each of the light emitting units to an optical fiber.

[0029] The light emitting device of the present invention includes, for example, a light emitting unit having a light emitting element that emits laser light, a base that supports the light emitting unit, a first joint that joins the light emitting unit to the base, and a second joint made of a different material from the first joint that joins the light emitting unit to the base.

[0030] In the light emitting device, a bonding strength between the light emitting unit and the base by the second bonding portion may be lower than a bonding strength between the light emitting unit and the base by the first bonding portion.

[0031] A light source device of the present invention includes, for example, the light emitting device.

[0032] An optical fiber laser of the present invention includes, for example, the light source device and an amplifying optical fiber that amplifies the laser light emitted from the light source device.

[0033] A manufacturing method for a light emitting device of the present invention, for example, includes a light emitting unit having a light emitting element that emits laser light, a lens that refracts the laser light emitted by the light emitting element, a housing that houses the light emitting element and the lens and has a window that transmits the laser light from the lens, and a heat transfer surface that is a part of the outer surface of the housing, and a base that faces the heat transfer surface and has a heat receiving surface that receives heat from the heat transfer surface, and the manufacturing method includes a first step of adjusting at least one of the relative position and attitude between the light emitting unit and the base, a second step of joining the light emitting unit, whose at least one of the relative position and attitude has been adjusted in the first step, and the base at a second joint, and a third step of joining the light emitting unit joined at the second joint to the base at a first joint. Effect of the Invention

[0034] According to the present invention, it is possible to obtain a novel and improved light emitting device, a light source device, an optical fiber laser, and a method for manufacturing a light emitting device. [Brief description of the drawings]

[0035] [Figure 1] FIG. 1 is an illustrative and schematic plan view of the light emitting device according to the first embodiment. [Diagram 2] FIG. 2 is an illustrative schematic side view (partial cross-sectional view) of the light emitting device of the first embodiment. [Diagram 3]FIG. 3 is an illustrative schematic front view (partial cross-sectional view) of the light emitting device of the first embodiment. [Figure 4] FIG. 4 is an exemplary schematic side view (partial cross-sectional view) showing a method for bonding the light-emitting unit and the base in the light-emitting device of the first embodiment, illustrating a state in which a bonding material is applied or placed on the base. [Diagram 5] FIG. 5 is an exemplary schematic side view (partial cross-sectional view) showing a method for bonding the light-emitting unit and the base in the light-emitting device of the first embodiment, showing a state in which the light-emitting unit is placed on the bonding material. [Figure 6] FIG. 6 is an exemplary schematic side view (partial cross-sectional view) showing a method for joining the light-emitting unit and the base in the light-emitting device of the first embodiment, illustrating a state in which the position or attitude of the light-emitting unit has been adjusted. [Figure 7] FIG. 7 is an illustrative and schematic side view (partial cross-sectional view) showing a method of joining a light-emitting unit and a base in the light-emitting device of the first embodiment, and shows a state in which the light-emitting unit, whose position or posture has been adjusted, is joined to the base by a bonding material. [Figure 8] FIG. 8 is an illustrative schematic front view (partial cross-sectional view) of the light emitting device of the second embodiment. [Figure 9] FIG. 9 is an illustrative schematic front view (partial cross-sectional view) of the light emitting device of the third embodiment. [Figure 10] FIG. 10 is an illustrative schematic front view (partial cross-sectional view) of the light emitting device of the fourth embodiment. [Figure 11] FIG. 11 is an illustrative schematic plan view of the light emitting device according to the fourth embodiment. [Figure 12] FIG. 12 is an illustrative schematic plan view of the light emitting device according to the fifth embodiment. [Figure 13] FIG. 13 is an illustrative schematic front view (partial cross-sectional view) of the light emitting device of the sixth embodiment. [Figure 14] FIG. 14 is an illustrative schematic plan view of the light emitting device according to the sixth embodiment. [Figure 15]FIG. 15 is an illustrative schematic front view (partial cross-sectional view) of the light emitting device of the seventh embodiment. [Figure 16] FIG. 16 is an illustrative schematic plan view of the light emitting device according to the seventh embodiment. [Figure 17] FIG. 17 is an illustrative schematic front view (partial cross-sectional view) of the light emitting device of the eighth embodiment. [Figure 18] FIG. 18 is an illustrative schematic side view (partial cross-sectional view) of the light emitting device of the ninth embodiment, showing a state before bonding with a bonding material. [Figure 19] FIG. 19 is an exemplary schematic side view (partial cross-sectional view) of a light emitting device according to the ninth embodiment, showing a bonding state of a bonding material. [Figure 20] FIG. 20 is an illustrative schematic side view (partial cross-sectional view) of the light emitting device of the tenth embodiment. [Figure 21] FIG. 21 is an illustrative schematic perspective view of the light emitting device according to the eleventh embodiment. [Figure 22] FIG. 22 is an illustrative schematic perspective view of a light emitting device according to the twelfth embodiment. [Figure 23] FIG. 23 is an illustrative schematic diagram of a light emitting device according to the thirteenth embodiment. [Figure 24] FIG. 24 is an illustrative schematic diagram of a light source device according to the fourteenth embodiment. [Diagram 25] FIG. 25 is an illustrative schematic diagram of an optical fiber laser according to the fifteenth embodiment. [Figure 26] FIG. 26 is an illustrative schematic plan view of the light emitting device according to the sixteenth embodiment. [Figure 27] FIG. 27 is an illustrative schematic side view (partial cross-sectional view) of the light emitting device of the sixteenth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0036] Exemplary embodiments of the present invention are disclosed below. The configurations of the embodiments shown below, and the actions and results (effects) brought about by the configurations are merely examples. The present invention can be realized by configurations other than those disclosed in the following embodiments. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derivative effects) obtained by the configurations.

[0037] The following embodiments have similar configurations. Therefore, according to the configurations of the respective embodiments, similar actions and effects based on the similar configurations can be obtained. In the following, the similar configurations are given the same reference numerals, and duplicated descriptions may be omitted.

[0038] In this specification, ordinal numbers are given for the sake of convenience to distinguish between members, parts, etc., and do not indicate a priority order or sequence.

[0039] In each drawing, the X direction is represented by an arrow X, the Y direction is represented by an arrow Y, and the Z direction is represented by an arrow Z. The X direction, Y direction, and Z direction intersect with each other and are perpendicular to each other.

[0040] [First embodiment] Fig. 1 is a plan view of the light emitting device 100A (100). Fig. 2 is a side view of the light emitting device 100A and includes a cross section taken along line II-II in Fig. 1. Fig. 3 is a front view of the light emitting device 100A and includes a cross section taken along line III-III in Fig. 1.

[0041] 1 to 3, the light emitting device 100A includes a light emitting unit 10 and a base 101. In this embodiment, for ease of explanation, a configuration including one light emitting unit 10 is exemplified, but the same actions and effects can be obtained for a light emitting device 100 including the base 101 and a plurality of light emitting units 10 with the same configuration and method as in this embodiment for each light emitting unit 10.

[0042] [Light Emitting Unit] As shown in Figures 1 and 2, the light-emitting unit 10 has a housing 20 and a subassembly 30. In Figures 1 and 2, the housing 20 of the light-emitting unit 10 is partially broken away to show the internal configuration of the light-emitting unit 10. In Figures 1 and 2, the optical axis of the laser light is indicated by a dashed line Ax.

[0043] The subassembly 30 includes a submount 31 , a light emitting element 32 , and a lens 33 .

[0044] The submount 31 has, for example, a rectangular parallelepiped shape that is thin and flat in the Z direction. The submount 31 can be made of an insulating material with a relatively high thermal conductivity, such as aluminum nitride (AIN), ceramic, or glass. A metallized layer 31a is formed on the submount 31 as an electrode that supplies power to the light-emitting element 32. The submount 31 is mounted on the bottom wall 21 of the housing 20.

[0045] The light emitting element 32 is, for example, a semiconductor laser element having a fast axis (FA) and a slow axis (SA) and an output of 5 [W] or more. The light emitting element 32 extends in the X direction. The light emitting element 32 emits laser light in the X direction from an emission opening (not shown) provided in an emission surface 32a located at an end in the X direction perpendicular to the Z direction. In this embodiment, the fast axis of the light emitting element 32 is along the Z direction, and the slow axis is along the Y direction.

[0046] The lens 33 is attached to an end surface of the submount 31 in the X direction, and is disposed adjacent to the emission surface 32a of the light-emitting element 32 in the X direction. The lens 33 refracts and transmits the laser light from the light-emitting element 32. The laser light emitted from the light-emitting element 32 and transmitted through the lens 33 travels in the X direction. The lens 33 is, for example, a collimating lens, and collimates the laser light in the fast axis.

[0047] The housing 20 has a box-like shape and may also be referred to as a housing. The housing 20 forms an accommodation chamber R therein. The housing 20 accommodates the subassembly 30 in the accommodation chamber R. The housing 20 hermetically seals the accommodation chamber R, thereby preventing the subassembly 30 from being exposed to liquid, gas, dust, and the like from outside the housing 20. In addition, for example, an inert gas is sealed in the accommodation chamber R.

[0048] The housing 20 is made of a material with high thermal conductivity, such as copper or a copper alloy.

[0049] The bottom wall 21 of the housing 20 is located at an end of the housing 20 on the opposite side to the Z direction. The bottom wall 21 intersects with the Z direction and extends in the X direction and the Y direction. The bottom wall 21 has a rectangular, plate-like shape.

[0050] A lower surface 21a of the bottom wall 21 on the opposite side in the Z direction faces the opposite direction to the Z direction. The lower surface 21a intersects with the Z direction and extends in the X direction and the Y direction. The lower surface 21a is a flat surface.

[0051] A front wall 22, which is one of the side walls of the housing 20, is located at the end in the X direction of the housing 20. The front wall 22 intersects with the X direction and extends in the Y direction and the Z direction. The front wall 22 has a rectangular, plate-like shape.

[0052] Further, an opening 22a is provided in the front wall 22. In the present embodiment, the opening 22a is circular as an example, but may be another shape such as a rectangle. A window member 23 is fitted in the opening 22a. The window member 23 has a property of transmitting laser light. In other words, the window member 23 is transparent to the laser light emitted by the light-emitting element 32. The window member 23 is an example of a window portion.

[0053] [base] 2 and 3, the base 101 supporting the light emitting unit 10 crosses the Z direction and extends in the X direction and the Y direction. The base 101 has a plate shape. The base 101 is made of a material with high thermal conductivity, such as oxygen-free copper.

[0054] A surface 101a in the Z direction of the base 101 intersects with the Z direction and extends in the X direction and the Y direction. The surface 101a is a flat surface.

[0055] The base 101 is provided with a recess 101b recessed from the surface 101a in the opposite direction to the Z direction. As shown in Figures 1 to 3, the recess 101b forms a cavity having a rectangular shape in a plan view and has a bottom surface 101b1 and a side surface 101b2. The bottom surface 101b1 faces the Z direction, intersects with the Z direction, and extends in the X direction and the Y direction. The bottom surface 101b1 and the side surface 101b2 are each flat.

[0056] [Joint part] 2 and 3, the light emitting unit 10 and the base 101 are bonded together by a bonding material 41. The bonding material 41 is interposed between the lower surface 21a of the bottom wall 21 of the light emitting unit 10 and the bottom surface 101b1 of the base 101 in a relatively thin manner, intersecting the Z direction and extending in the X direction and the Y direction. The height of the bonding material 41 is, for example, 20 μm or more and 150 μm or less. The bonding material 41 is a bonding agent having thermal conductivity, and one example is a bonding agent containing solder.

[0057] The light emitting unit 10 and the base 101 are mechanically and thermally connected via the bonding material 41. That is, heat generated in the light emitting element 32 is transferred to the base 101 via the submount 31, the bottom wall 21, and the bonding material 41. The lower surface 21a of the bottom wall 21 is an example of a heat transfer surface, and the bottom surface 101b1 of the recess 101b is an example of a heat receiving surface. In this embodiment, the bonding material 41 is interposed over substantially the entire gap between the lower surface 21a and the bottom surface 101b1, but is not limited thereto, and there may be a portion between the lower surface 21a and the bottom surface 101b1 where the bonding material 41 is not interposed. In addition, the bonding material 41 may partially protrude from between the lower surface 21a and the bottom surface 101b1. That is, at least a part of the bonding material 41 is interposed between the lower surface 21a and the bottom surface 101b1. The bonding material 41 is an example of a first bonding portion.

[0058] The bonding material 41 is made of a material that is melted by heating and then solidified by cooling to form a bonded state, and is, for example, a sheet-shaped solder or a solder paste.

[0059] 1 and 3, the light emitting unit 10 and the base 101 are also bonded by the bonding material 42. The bonding material 42 is interposed between the surface 101a of the base 101 and the side surface 101b2 of the recess 101b and the side surface 20a of the housing 20. That is, the bonding material 42 is interposed between the edge 101b3 between the surface 101a and the side surface 101b2 and the side surface 20a. The bonding material 42 is also bonded to a portion of the side surface 20a that is separated from the lower surface 21a in the Z direction. As shown in FIG. 1, the bonding material 42 extends in the X direction, but is not limited thereto. The bonding material 42 is an example of a second bonding portion. The portion of the side surface 20a that is separated from the lower surface 21a in the Z direction to which the bonding material 42 is bonded is an example of a first portion. Furthermore, the portion of the side surface 101b2 that is distant from the bottom surface 101b1, the edge 101b3, and the surface 101a are examples of the second portion.

[0060] The bonding material 42 is made of a material different from the bonding material 41. The bonding material 42 is, for example, an ultraviolet-curable or visible-light-curable adhesive, that is, an electromagnetic-wave-curable adhesive. The bonding strength between the light-emitting unit 10 and the base 101 by the bonding material 42 is lower than the bonding strength between the light-emitting unit 10 and the base 101 by the bonding material 41. In this case, the bonding strength can be defined as the load applied to the light-emitting unit 10 in the Z direction relative to the base 101 when the light-emitting unit 10 is removed from the base 101.

[0061] [Joining method] 4 to 7 are side views showing steps of a method for joining light emitting unit 10 and base 101, and include cross-sectional views at the same positions as in FIG.

[0062] FIG. 4 shows a state in which the bonding material 41 is set on the base 101. In the step shown in FIG. 4, the base 101 is set in a posture in which the surface 101a and the bottom surface 101b1 of the recess 101b are aligned along the X direction. The bonding material 41 is laid or applied on the bottom surface 101b1 of the recess 101b in a state in which it extends along the bottom surface 101b1. At this time, the recess 101b serves as a rough guide for the location in which the bonding material 41 is set, and also functions as a positioning of the bonding material 41. In this step, the bonding material 41 is in an unbonded state. Hereinafter, this state is referred to as an unbonded state S1 in this specification. In the example of FIG. 4, the bonding material 41 in the unbonded state S1 extends on the bottom surface 101b1 with a substantially constant thickness, but is not limited thereto. For example, the bonding material 41 may be placed on the bottom surface 101b1 in a lump form or with a thickness in the Z direction that varies depending on the location.

[0063] In a step subsequent to the state shown in Fig. 4, the light emitting unit 10 may be temporarily placed on the bonding material 41 as shown in Fig. 5. This step is not essential.

[0064] 5, in this example, it is assumed that the optical axis Axr of the laser light emitted from the light-emitting unit 10, i.e., the optical axis Axr of the laser light emitted from the light-emitting element 32 and transmitted through the lens 33 and the window member 23, is tilted in the opposite direction of the Z direction with respect to the optical axis Axd along the X direction which is the median value of the design tolerance range. In this case, the optical axis Axr of the laser light from the light-emitting unit 10 moves in the opposite direction of the Z direction as it moves in the X direction, with the lower surface 21a of the light-emitting unit 10 oriented along the X direction.

[0065] FIG. 6 shows a state in which the relative position and posture of the light-emitting unit 10 in FIG. 5 is adjusted with respect to the base 101. As described above, in the example of FIG. 5, the optical axis Axr of the laser light from the light-emitting unit 10 is tilted in the opposite direction to the Z direction with respect to the optical axis Axd. Therefore, in order to correct this tilt, a gripping device (not shown) grips the housing 20 of the light-emitting unit 10 and tilts the housing 20 toward the Z direction as it moves toward the X direction, as shown in FIG. 6. This results in a state in which the optical axis Axr is aligned with the X direction. The gripping device holds the light-emitting unit 10 in the position and posture adjusted in this manner. Note that here, an example is shown in which the posture (angle) of the light-emitting unit 10 and the optical axis Axr are corrected, but this is not limited thereto, and the posture of the light-emitting unit 10 and the optical axis Axr can be changed to any posture within an adjustable range, and the position of the light-emitting unit 10 and the optical axis Axr can also be changed to any position within an adjustable range.

[0066] The adjustment of the position and attitude of the light-emitting unit 10 relative to the base 101 is performed while detecting the laser light emitted from the light-emitting unit 10. At this time, since the subassembly 30 including the light-emitting element 32 is housed in the housing 20 and is dustproof, no problem occurs due to light dust collection in the housing 20.

[0067] Next, with the gripping device gripping the light-emitting unit 10 in the position and attitude shown in Fig. 6, the bonding material 42 in a fluid state is applied to the position shown in Fig. 1 and 3. Next, the bonding material 42 is irradiated with electromagnetic waves such as ultraviolet light or visible light that solidify the bonding material 42, thereby solidifying the bonding material 42 and joining the light-emitting unit 10 and the base 101 together. When the bonding material 42 reaches the joined state, the gripping device releases the light-emitting unit 10. Note that with the bonding material 42 in a fluid state applied, the relative position and attitude of the light-emitting unit 10 with respect to the base 101 may be adjusted, and then the bonding material 42 may be solidified.

[0068] Thereafter, the bonding material 41 is subjected to a reflow process. That is, the bonding material 41 in the unbonded state S1 is heated and melted, and then cooled and solidified to become a bonded state S2 in which the light emitting unit 10 and the base 101 are bonded together. Fig. 7 shows a state in which the light emitting unit 10 and the base 101 are bonded together by the bonding material 41 in the bonded state S2.

[0069] Here, as is clear by comparing FIG. 7 with FIG. 6, in FIG. 6, the gap g between the lower surface 21a and the bottom surface 101b1 is large due to the inclination of the light-emitting unit 10, and the portion where the bonding material 41 was not present in the unbonded state S1 is filled with the bonding material 41 in the bonded state S2 in FIG. 7. This is because the bonding material 41, in a heated and molten fluid state, spreads wet along both the lower surface 21a and the bottom surface 101b1 due to its surface tension. In order to fill the gap g with the bonding material 41 using such surface tension, it is preferable to set the volume of the bonding material 41 in the unbonded state S1 to be equal to or larger than the maximum volume of the gap g in the bonded state S2. The maximum volume of the gap g can be obtained from dimensional tolerances and manufacturing variations. In order to fill in this way, for example, as shown in FIG. 5, the size of the bonding material 41 in the unbonded state S1 can be set so that its width in the Y direction is the same as the width in the Y direction of the lower surface 21a, and its length L2 in the X direction is greater than the length L1 in the X direction of the lower surface 21a.

[0070] To achieve bonding by the above-mentioned method, it is necessary for the bonding material 42 to maintain the relative position and posture adjusted as shown in Fig. 6, that is, to maintain the bonded state, while the bonding material 41 is being reflowed. For this reason, the bonding material 42 is made of a material that, after solidification, does not melt at least at or below the melting point of the bonding material 41. When the bonding material 41 contains solder, the melting point of the bonding material 41 is, for example, about 150°C.

[0071] As described above, in this embodiment, the light emitting unit 10 and the base 101 are bonded by the bonding material 41 (first bonding portion) and the bonding material 42 (second bonding portion). If the bonding material 42 is not present, the holding device needs to hold the light emitting unit 10 in an adjusted position and posture until the bonding material 41 goes from a fluid state to a solidified state and becomes a bonded state. In this case, for example, the holding device needs to be heat resistant to the temperature at which the bonding material 41 goes into a molten state, and when a plurality of light emitting units 10 are bonded to the base 101 at once, the holding device needs to be large-scale. In this respect, in this embodiment, the functions can be separated into a stronger bond having thermal conductivity by the bonding material 41 and a temporary bond by the bonding material 42, and the bonding material 42 can temporarily hold the light emitting unit 10 in an adjusted position and posture relative to the base 101 until the bonding material 41 goes from a fluid state to a solidified state and becomes a bonded state. This provides the advantages of making it possible to further simplify the gripping device and to further simplify the process of joining the light emitting unit 10 and the base 101, thereby making it possible to further shorten the time required for the entire joining process.

[0072] In addition, if there is no bonding material 42 and the light-emitting units 10 and the base 101 are bonded only by the bonding material 41, each light-emitting unit 10 is relatively firmly fixed to the base 101 by the bonding material 41 after the position and posture relative to the base 101 are adjusted. For this reason, if some defect occurs in any part of the light-emitting device 100 including the light-emitting unit 10 after at least one light-emitting unit 10 and the base 101 are bonded by the bonding material 41, and it becomes necessary to remove the light-emitting unit 10 attached to the base 101 from the base 101, for example, it may be time-consuming to remove the light-emitting unit 10 or replace it with another light-emitting unit 10, or if the light-emitting unit 10 cannot be removed from the base 101, the entire light-emitting device 100 may become a defective product that does not satisfy the required specifications, and in some cases, the light-emitting device 100 including the light-emitting unit 10 without any defect may have to be discarded. In this respect, according to the present embodiment, the bonding material 42 bonds the light-emitting unit 10 to the base 101 in a so-called temporary holding or temporary fixing state in which the bonding strength is lower than that of the bonding material 41, so that the light-emitting unit 10 can be relatively easily removed from the base 101 even after the position and attitude of the light-emitting unit 10 relative to the base 101 is adjusted, as long as it is before the light-emitting unit 10 is bonded to the base 101 by the bonding material 41. That is, according to the present embodiment, even after the position and attitude of the light-emitting unit 10 relative to the base 101 is adjusted, a defective light-emitting unit 10 can be more easily removed, the light-emitting unit 10 can be more easily replaced, and the yield of the light-emitting device 100 can be improved. From this perspective, it is preferable to perform the bonding process of the multiple light-emitting units 10 to the base 101 by the bonding material 41 all at once, that is, simultaneously in parallel. In addition, the bonding material 42 may be a bonding material 42 having reversibility that changes from a solidified state to a fluid state by some physical or chemical action such as the application of heat.

[0073] In this embodiment, the bonding material 42 is located outside the gap g between the lower surface 21a (heat transfer surface) and the bottom surface 101b1 (heat receiving surface). The bonding material 42 bonds a portion (first portion) of the side surface 20a of the housing 20 away from the lower surface 21a to the base 101. The bonding material 42 bonds the housing 20 to a portion of the side surface 101b2 of the base 101 away from the bottom surface 101b1, the edge 101b3, and the surface 101a (second portion). This configuration makes it easier to apply and solidify the bonding material 42.

[0074] In this embodiment, the bonding material 42 is made of an electromagnetic wave curable resin material. Therefore, a provisional bonding state between the light-emitting unit 10 and the base 101 by the bonding material 42 can be obtained by a relatively simple operation of applying the bonding material 42 having fluidity before or after adjusting the position and posture, and irradiating the bonding material 42 with electromagnetic waves to harden the bonding material 42 after the position and posture are adjusted.

[0075] In this embodiment, the volume of the bonding material 42 is smaller than the volume of the bonding material 41. With this configuration, it is possible to reduce waste of the bonding material 42 while ensuring a required amount of heat transfer by the bonding material 41.

[0076] In this embodiment, the base 101 is provided with a surface 101a and a recess 101b recessed from the surface 101a, and the bonding material 42 is bonded to at least one of the side surface 101b2 of the recess 101b and the surface 101a. With this configuration, in a configuration in which the light-emitting unit 10 is housed in the recess 101b, the bonding material 42 can be disposed at a position where it can be applied and solidified more easily.

[0077] In this embodiment, the output of the light-emitting element 32 is, for example, 5 [W] or more. The greater the output of the laser light from the light-emitting element 32, the more likely light dust collection occurs. Therefore, the configuration in which the subassembly 30 is housed in the housing 20 as in this embodiment is preferable when the output of the laser light from the light-emitting element 32 is 5 [W] or more.

[0078] [Second embodiment] FIG. 8 is a front view of the light emitting device 100B (100) of the second embodiment. As shown in FIG. 8, in this embodiment, the bonding material 42 is partially located in the gap g between the lower surface 21a and the bottom surface 101b1. In this configuration, the bonding material 42 is applied to or placed on the base 101 without the light emitting unit 10, and then the light emitting unit 10 is brought close to the base 101 and the bonding material 42, thereby obtaining a state in which the bonding material 42 is interposed between the light emitting unit 10 and the base 101. According to this embodiment, an advantage is obtained in that the bonding material 42 can be applied or placed more easily than when the bonding material 42 is applied or placed in a state in which the light emitting unit 10 exists.

[0079] Also in this embodiment, the volume of the bonding material 42 is smaller than the volume of the bonding material 41. With this configuration, it is possible to reduce waste of the bonding material 42 while ensuring a required amount of heat transfer by the bonding material 41.

[0080] In this embodiment, the bonding material 42 is made of a thermosetting resin material. Therefore, the bonding material 42 having fluidity is applied before or after the position and posture are adjusted, and the bonding material 42 is heated, for example, by a heat gun or the like, to harden the bonding material 42 in a state where the position and posture are adjusted, thereby obtaining a provisional bonding state between the light-emitting unit 10 and the base 101 by the bonding material 42, which is a relatively easy operation. Note that the thermosetting temperature of the bonding material 42 is, for example, lower than the melting point of the bonding material 41.

[0081] [Third embodiment] Fig. 9 is a front view of a light emitting device 100C (100) according to the third embodiment. As shown in Fig. 9, in the present embodiment, similarly to the second embodiment, the bonding material 42 is located outside the bonding material 41 within the gap g between the lower surface 21a and the bottom surface 101b1.

[0082] In this embodiment, the bonding material 42 is, for example, an electromagnetic wave curable adhesive, and is partially exposed to the outside of the gap g.

[0083] Furthermore, in this embodiment, the side surface 101b2 of the recess 101b is inclined in the Y or X direction in a direction away from the bottom surface 101b1 as it moves away from the bottom surface 101b1 in the Z direction.

[0084] According to this embodiment, the configuration and arrangement of the bonding material 42 and the inclination of the side surface 101b2 make it easier to irradiate the bonding material 42 with electromagnetic waves U for solidifying the bonding material 42, i.e., ultraviolet rays and visible light. The inclined side surface 101b2 is an example of a clearance that avoids interference between the electromagnetic waves U irradiated toward the bonding material 42 for solidification and the base 101. This configuration provides the advantage that the bonding material 42 can be solidified more easily or more reliably. This clearance has the effect of making it easier to apply heat from a heat gun even when the bonding material 42 is a thermosetting adhesive. Note that the clearance is not limited to an inclined surface as long as it avoids interference between the base 101 and electromagnetic waves, etc.

[0085] [Fourth embodiment] FIG. 10 is a front view of the light emitting device 100D (100) of the fourth embodiment, and FIG. 11 is a plan view of the light emitting device 100D. As shown in FIGS. 10 and 11, in this embodiment, the base 101 is provided with a plurality of protrusions 101c protruding in the Z direction from the surface 101a adjacent to the recess 101b, and the bonding material 42 is interposed between each of the protrusions 101c and the side surface 20a of the housing 20. With this configuration, the bonding material 42 can be arranged, for example, at a position where it is easy to apply, place, and solidify, so that the bonding between the light emitting unit 10 and the base 101 by the bonding material 42 can be more easily performed. In addition, the protrusions 101c are adjacent to the recess 101b in the Y direction and in the opposite direction to the Y direction. Therefore, the light emitting device 100D can be configured more compactly in the X direction compared to a case where the protrusions 101c are arranged adjacent to the X direction or in the opposite direction to the X direction. In addition, a portion of the base 101 opposite the protrusion 101c with respect to the surface 101a is an example of a body, and the protrusion 101c is an example of a second portion.

[0086] The position, height, shape, and number of the protrusions 101c can be changed as appropriate. The protrusions 101c do not require the presence of the recesses 101b. Even in a configuration in which the recesses 101b are not provided, the effect of the bonding material 42 bonding the protrusions 101c protruding from the surface 101a to the housing 20 as described above can be obtained. The bonding material 42 may be bonded to a position different from the side surface 20a of the housing 20, such as the upper surface opposite to the lower surface 21a of the housing 20. The protrusions 101c may be formed by attaching a member separate from the body to the body by adhesion or the like, or may be formed integrally with the body when the base 101 is manufactured.

[0087] [Fifth embodiment] Fig. 12 is a plan view of a light emitting device 100E (100) of the fifth embodiment. As shown in Fig. 12, this embodiment has a similar configuration to the fourth embodiment, except that the arrangement of the multiple protrusions 101c is different. With this configuration, the light emitting device 100E can be configured more compactly in the Y direction compared to a case in which the protrusions 101c are arranged adjacent to each other in the Y direction or in the opposite direction to the Y direction. This configuration is preferable from the viewpoint of miniaturization of the light emitting device 100 when multiple light emitting units 10 are arranged on the base 101 in the Y direction.

[0088] [Sixth embodiment] Fig. 13 is a front view of a light emitting device 100F (100) of the sixth embodiment, and Fig. 14 is a plan view of the light emitting device 100F. As shown in Figs. 13 and 14, in this embodiment, the base 101 is provided with a plurality of surfaces 101a1 arranged in a step-like manner, shifted in the Z direction as it approaches the Y direction. The surfaces 101a1 are arranged at regular intervals in the Y direction and shifted at regular intervals in the Z direction. As a result, a step surface 101d is provided between two surfaces 101a1 adjacent in the Y direction. The step surface 101d intersects with the Y direction, faces the opposite direction to the Y direction, and extends in the Z direction as well as the X direction.

[0089] The light emitting units 10 are bonded onto each surface 101a1 via a bonding material 41. The bonding structure between each light emitting unit 10 and the base 101 by the bonding material 41 is the same as in the first embodiment.

[0090] The bonding material 42 is interposed between the surface 101a1 and the step surface 101d and the side surface 20a of the housing 20 of the light-emitting unit 10. That is, the bonding material 42 is interposed between the side surface 20a and an edge 101d1 between the surface 101a1 and the step surface 101d. A portion of the step surface 101d away from the surface 101a1 in the Z direction, the edge 101d1, and the surface 101a1 adjacent to the edge 101d1 are an example of a second portion.

[0091] According to this configuration, the bonding material 42 can be arranged at a position where it can be easily applied, placed, and solidified by utilizing the stepped configuration of the base 101. In addition, there is an advantage that the configuration of the base 101 can be simplified compared to a case where the protrusions 101c for the bonding material 42 are separately provided.

[0092] [Seventh embodiment] FIG. 15 is a front view of the light emitting device 100G (100) of the seventh embodiment, and FIG. 16 is a plan view of the light emitting device 100G. As shown in FIGS. 15 and 16, in this embodiment, as in the fourth and fifth embodiments, a plurality of protrusions 101c protruding from the surface 101a in the Z direction are provided. However, in this embodiment, the protrusions 101c are higher than those in the fourth and fifth embodiments, and extend to the vicinity of the upper surface 22c opposite to the lower surface 21a of the housing 20 of the light emitting unit 10. In this embodiment, the base 101 is provided with a protrusion 101c adjacent to the light emitting unit 10 in the Y direction and a protrusion 101c adjacent to the light emitting unit 10 in the opposite direction to the Y direction, and these two protrusions 101c are aligned in the Y direction. The protrusions 101c are separate members from the body of the base 101, and are attached to the surface 101a by soldering, adhesion, or the like.

[0093] On the other hand, a rod-shaped bracket 43 extending in the Y direction is attached to the upper surface 22c of the light-emitting unit 10 with an adhesive 44 or the like. The Y direction end and the opposite end of the bracket 43 in the Y direction are adjacent to the top of another protrusion 101c. The bracket 43 is a separate member from the housing 20 of the light-emitting unit 10, and is attached to the housing 20 with an adhesive 44.

[0094] In this embodiment, the bracket 43 and the protrusion 101c are joined via a welded portion 45 by YAG laser welding or the like. The welded portion 45 is an example of a second joining portion. That is, similarly to the first to sixth embodiments, welding is performed by the welded portion 45 in a state where the relative position and posture of the light emitting unit 10 and the base 101 are adjusted, and then joining is performed by the joining material 41.

[0095] Before being joined by the welded portion 45, the bracket 43 is integrated with the light-emitting unit 10. Therefore, it can be said that the bracket 43 is a part of the light-emitting unit 10. In this case, the bracket 43 is an example of a first portion separated from the lower surface 21a (heat transfer surface) of the light-emitting unit 10. Similarly, it can be said that the protrusion 101c is a part of the base 101.

[0096] On the other hand, as described above, bracket 43 and protrusion 101c are separate members from housing 20 of light-emitting unit 10 and body of base 101. Therefore, in this embodiment, it can be said that light-emitting unit 10 and base 101 are joined via bracket 43 and protrusion 101c, which are separate members from light-emitting unit 10 and base 101, and welded portion 45.

[0097] The bracket 43 and the protrusion 101c may be made of a material with low thermal conductivity suitable for YAG laser welding, such as stainless steel. That is, the bracket 43 and the protrusion 101c may be made of a material different from that of the housing 20 and the body of the base 101.

[0098] [Eighth embodiment] Fig. 17 is a front view of a light emitting device 100H (100) of the eighth embodiment. As shown in Fig. 17, in this embodiment, the base 101 does not have a recess 101b, and the surface 101a and the lower surface 21a are joined by a bonding material 41. The bottom wall 21 and the surface 101a are joined by a welding part 45. The bonding material 41 is an example of a first bonding part, and the welding part 45 is an example of a second bonding part. With the relative position and posture of the light emitting unit 10 and the base 101 adjusted, welding is performed by the welding part 45, and then joining is performed by the bonding material 41.

[0099] In this case, the welded portion 45 is formed by, for example, laser welding using a fiber laser or a laser beam with high absorptivity between the housing 20 and the base 101. The laser beam with high absorptivity includes, for example, a laser beam with a wavelength of 350 [nm] or more and 550 [nm] or less, such as a blue laser beam or a green laser beam.

[0100] In this embodiment, the light emitting unit 10 and the base 101 are joined via the joining material 41 and the welded portion 45 (second joining portion), and the same effects as those of the first to seventh embodiments can be obtained. Moreover, according to this embodiment, the light emitting device 100H can be realized with a simpler configuration and by an easier manufacturing method.

[0101] [Ninth embodiment] 18 and 19 are side views of the light emitting device 100I (100) of the ninth embodiment, in which FIG. 18 shows an unbonded state S1 of the bonding material 41 and FIG. 19 shows a bonded state S2 of the bonding material 41. In a step prior to the state of FIG. 18, the relative positions and postures of the light emitting unit 10 and the base 101 are adjusted, and the light emitting unit 10 and the base 101 are bonded by the bonding material 42. Then, as shown in FIG. 18, a lump of bonding material 41 in an unbonded state S1 is applied or placed in the recess 101b. The bonding material 41 in this case also includes solder, and is, for example, a sheet-like solder or a solder paste. Then, in a reflow process, the bonding material 41 that is heated and melted enters the gap g by capillary action, and is then cooled and solidified, resulting in a bonded state S2 of FIG. 19.

[0102] According to this embodiment, at the stage of adjusting the relative position and posture between the light-emitting unit 10 and the base 101, the bonding material 41 in the unbonded state S1 can be positioned outside the gap between the lower surface 21a and the bottom surface 101b1. This makes it possible to avoid the bonding material 41 in the unbonded state S1 interfering with the light-emitting unit 10 during the adjustment of the position and posture, thereby limiting the adjustment range of the position and posture or making the adjustment difficult.

[0103] [Tenth embodiment] Fig. 20 is a side view of a light emitting device 100J (100) of the tenth embodiment. As shown in Fig. 20, in this embodiment, the lower surface 21a is a convex curved surface protruding in the opposite direction of the Z direction, and the bottom surface 101b1 is a concave curved surface recessed in the opposite direction of the Z direction. The lower surface 21a and the bottom surface 101b1 are, for example, spherical or cylindrical with a certain radius of curvature. A bonding material 41 is interposed between the lower surface 21a and the bottom surface 101b1.

[0104] In this embodiment, when adjusting the relative position and posture of the light-emitting unit 10 and the base 101, the base 101 can support the light-emitting unit 10 so that the light-emitting unit 10 can be rocked due to a structure in which the curved lower surface 21a and the bottom surface 101b1 face each other. This configuration makes it easier to adjust the angle of the optical axis Axr of the light-emitting unit 10. In addition, regardless of the relative posture of the light-emitting unit 10 and the base 101, the distance between the light-emitting unit 10 and the base 101 can be maintained approximately constant, which is an advantage, and therefore the heat dissipation from the light-emitting unit 10 to the base 101 can be maintained approximately constant.

[0105] [Eleventh embodiment] Fig. 21 is a perspective view of a light emitting device 100K (100) of the eleventh embodiment. As shown in Fig. 21, the light emitting device 100K includes a base 101, a plurality of light emitting units 10, a plurality of lenses 102, a plurality of mirrors 103, condenser lenses 104 and 105, a support portion 106, and an optical fiber 107. The lens 102, the mirror 103, and the condenser lenses 104 and 105 are examples of optical components.

[0106] The laser light emitted in the X direction from each light-emitting unit 10 passes through the lens 102. The lens 102 is a collimating lens, and collimates the light in the slow axis.

[0107] The mirror 103 reflects the laser light traveling in the X direction from the lens 102 in the Y direction. The mirror 103 is an example of a deflection component. The light reflected by the mirror 103 is condensed by the condenser lenses 104 and 105.

[0108] Here, the subunits 100a of the light-emitting unit 10, the lens 102, and the mirror 103 are arranged at approximately equal intervals in the Y direction. The subunits 100a are arranged shifted from each other in the Z direction. The subunits 100a are configured such that the distance in the Z direction from the bottom surface 101e of the base 101 of the subunit 100a becomes shorter as the subunit 100a is closer to the condenser lens 104. Therefore, as shown in FIG. 21, the surface 101a of the base 101 is provided with a stepped surface 101a1 (not shown in FIG. 21) as shown in FIG. 13, which is shifted in the Z direction as it moves toward the Y direction. Each light-emitting unit 10 is joined to the base 101 by the bonding material 41 and bonding material 42 or the welded portion 45 (not shown in FIG. 21) similar to the first to tenth embodiments.

[0109] In such a configuration, the light from each subunit 100a (each mirror 103) is aligned at equal intervals in the Z direction on the incident surface of the condenser lens 104. The light from each subunit 100a is coupled to an input portion 107a of an optical fiber 107 via condenser lenses 104 and 105.

[0110] According to the light emitting device 100K of this embodiment, by applying the configurations of the first to tenth embodiments, it is possible to obtain the same effects as those of the first to tenth embodiments.

[0111] [Twelfth embodiment] Fig. 22 is a perspective view of a light emitting device 100L (100) of the twelfth embodiment. As shown in Fig. 22, in this embodiment, the mounting positions of the multiple light emitting units 10 in the Z direction on the surface 101a of the base 101 are the same. That is, the multiple light emitting units 10 are lined up on one flat surface 101a without any steps. Each light emitting unit 10 is joined to the base 101 by the bonding material 41 and bonding material 42 or a welded portion 45 (not shown in Fig. 22) similar to the first to tenth embodiments.

[0112] Furthermore, in the light emitting device 100L of this embodiment, the laser beams from the multiple light emitting units 10 are aligned at equal intervals in the Y direction.

[0113] Then, the light traveling from the light-emitting unit 10 to the X direction through the lens 102 is first reflected in the Z direction by the mirror 103a, then reflected in the Y direction by the mirror 103b, and travels toward the condenser lens 104. Here, the base 101 has a plurality of side surfaces 101f arranged in a step-like manner facing the opposite direction to the X direction. Each of the side surfaces 101f intersects with the X direction and extends in the Y direction and the Z direction. In addition, the side surfaces 101f are shifted in a step-like manner in the X direction as they approach the Y direction. The sets of the optically connected mirrors 103a and 103b are mounted on the side surfaces 101f. With this configuration, the light traveling in the opposite direction to the Y direction from each mirror 103b toward the condenser lens 104 is arranged at equal intervals in the X direction on the entrance surface of the condenser lens 104. The light from each subunit 100a is input to the input section 107a of the optical fiber 107 via the condenser lenses 104 and 105.

[0114] According to the light emitting device 100L of this embodiment, by applying the configurations of the first to tenth embodiments, it is possible to obtain the same effects as those of the first to tenth embodiments.

[0115] [Thirteenth embodiment] Fig. 23 is a schematic diagram of a light-emitting device 100M (100) of the thirteenth embodiment. As shown in Fig. 23, in this embodiment, a base 101 is provided with arrays A1 and A2 in which a plurality of light-emitting units 10 are arranged at predetermined intervals (for example, constant intervals) in the Y direction and are substantially parallel to each other. In each of these arrays A1 and A2, the light-emitting units 10 are arranged in a stepped manner so that the positions in the Z direction are shifted toward the Y direction, as in the eleventh embodiment, for example.

[0116] The combiner 109 combines the light from the two arrays A1 and A2 and outputs it toward the condenser lens 104. Here, the light from the array A1 is input to the combiner 109 via the mirror 103 and the half-wave plate 108, and the light from the array A2 is input directly to the combiner 109. The half-wave plate 108 rotates the polarization plane of the light from the array A1. The combiner 109 may also be referred to as a polarization combining element.

[0117] The base 101 is provided with a refrigerant passage 101g for cooling the light emitting units 10, the support 106 of the optical fiber 107, the condenser lenses 104 and 105, the combiner 109, and the like. In the refrigerant passage 101g, for example, a refrigerant such as a cooling liquid flows. The refrigerant passage 101g passes, for example, near the mounting surface of each component of the base 101, for example, directly below or in the vicinity thereof, and the inner surface (not shown) of the refrigerant passage 101g and the refrigerant (not shown) in the refrigerant passage 101g are thermally connected to the components and parts to be cooled, that is, the light emitting units 10, the support 106, the condenser lenses 104 and 105, and the combiner 109. Heat exchange is performed between the refrigerant and each component via the base 101, and each component is cooled. In addition, each light emitting unit 10 is joined to the base 101 by the bonding material 41 and bonding material 42 or the welded portion 45 (not shown in FIG. 23) similar to the first to tenth embodiments.

[0118] According to the light emitting device 100M of this embodiment, by applying the configurations of the first to tenth embodiments, it is possible to obtain the same effects as those of the first to tenth embodiments.

[0119] [Fourteenth embodiment] 24 is a configuration diagram of a light source device 110 of the 14th embodiment. The light source device 110 includes a plurality of light emitting devices 100 as excitation light sources. The light emitting device 100 is a light emitting device 100 having a plurality of light emitting units 10, such as the light emitting device 100K of the 11th embodiment, the light emitting device 100L of the 12th embodiment, or the light emitting device 100M of the 13th embodiment.

[0120] Light (laser light) emitted from the multiple light emitting devices 100 is propagated to a combiner 90 serving as an optical coupling section via an optical fiber 107. Output ends of the optical fibers 107 are respectively coupled to multiple input ports of the multiple-input, single-output combiner 90. Note that the light source device 110 is not limited to one including multiple light emitting devices 100, and it is sufficient that the light source device 110 includes at least one light emitting device 100.

[0121] According to the light source device 110 of this embodiment, by including the light emitting device 100 of any one of the first to thirteenth embodiments, it is possible to obtain the same effects as those of the first to thirteenth embodiments.

[0122] [Fifteenth embodiment] Fig. 25 is a configuration diagram of an optical fiber laser 200 of the fifteenth embodiment. The optical fiber laser 200 includes the light source device 110 and the combiner 90 shown in Fig. 24, a rare-earth doped optical fiber 130, and an output-side optical fiber 140. Highly reflective FBRs 120 and 121 (fiber bragg gratings) are provided at the input and output ends of the rare-earth doped optical fiber 130, respectively.

[0123] The output end of the combiner 90 is connected to the input end of the rare-earth doped optical fiber 130, and the output end of the rare-earth doped optical fiber 130 is connected to the input end of the output side optical fiber 140. Note that the input section for inputting the laser light output from the plurality of light emitting devices 100 into the rare-earth doped optical fiber 130 may have another configuration instead of the combiner 90. For example, the optical fibers 107 of the output sections of the plurality of light emitting devices 100 may be arranged side by side, and the laser light output from the plurality of optical fibers 107 may be input into the input end of the rare-earth doped optical fiber 130 using an input section such as an optical system including a lens. The rare-earth doped optical fiber 130 is an example of an amplifying optical fiber.

[0124] According to the optical fiber laser 200 of this embodiment, by including the light emitting device 100 of any one of the first to thirteenth embodiments, the same effects as those of the first to thirteenth embodiments can be obtained.

[0125] [Sixteenth embodiment] Fig. 26 is a plan view of a light emitting device 100N (100) according to the sixteenth embodiment, and Fig. 27 is a side view of the light emitting device 100N, including a cross-sectional view taken at the same position as in Fig. 2.

[0126] 26 and 27, in light emitting device 100N, light emitting unit 10 has a subassembly 30 similar to that of the above embodiment, but does not have a housing 20. That is, in this embodiment, subassembly 30 having submount 31, light emitting element 32, and lens 33 is light emitting unit 10.

[0127] 27, a lower surface 31b of the submount 31 opposite to the metallized layer 31a is bonded to a bottom surface 101b1 of the recess 101b via a bonding material 41. The lower surface 31b is an example of a lower surface of the light-emitting unit 10, and is an example of a heat transfer surface.

[0128] 26, a side surface 31c of the submount 31 is joined to a side surface 101b2 (edge ​​101b3) of the recess 101b via a bonding material 42. The side surface 31c is an example of a side surface of the light-emitting unit 10, and a part of the side surface 31c is an example of a first portion.

[0129] 26 and 27 using the bonding materials 41 and 42 is merely an example, and the subassembly 30 (light-emitting unit 10) can be bonded to the base 101 using other bonding methods such as those shown in the above embodiment.

[0130] In addition, adjustments of the position, direction, etc. of the optical axis Ax may be performed by adjusting the position and attitude of the subassembly 30 relative to the base 101, as in the above embodiment, or by adjusting the position and attitude of the lens 33 relative to the submount 31, or both of these may be performed.

[0131] In this way, even in a configuration in which the light-emitting unit 10 does not have the housing 20, the same effects as those of the above-mentioned embodiment can be obtained by providing the bonding materials 41 and 42 with different functions. Also, in the light source device 110 and the optical fiber laser 200 including the light-emitting device 100N of this embodiment, the same effects as those of the light source device 110 and the optical fiber laser 200 including the light-emitting device 100 of the above-mentioned embodiment can be obtained.

[0132] Although the embodiment of the present invention has been illustrated above, the above embodiment is merely an example and is not intended to limit the scope of the invention. The above embodiment can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the gist of the invention. In addition, the specifications of each configuration, shape, and the like (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be appropriately changed and implemented.

[0133] For example, the welding method of the welded portion may be other welding methods, such as welding with an optical fiber laser. [Explanation of symbols]

[0134] 10…Light emitting unit 20…Housing 20a…Side (first part) 21…Bottom wall 21a…Bottom surface (heat transfer surface) 22...Front wall 22a...Opening 22c…Top surface 23...Window member (window portion) 30…Sub-assembly 31…Submount 31a…Metallized layer 31b…Bottom surface (heat transfer surface) 31c…Side (first part) 32...Light emitting element 32a...Emission surface 33…Lens 41…Jointing material (first joint) 42…Jointing material (second joint) 43...Bracket (first part) 44...Adhesive material 45…Welded section (second joint) 90…Combiner 100, 100A~100N...Light emitting device 100a…Subunit 101...Bass 101a…Surface (heat receiving surface, second part) 101a1…Surface (second part) 101b...recess 101b1…Bottom surface (heat receiving surface) 101b2...Side (clearance, second part) 101b3…Edge (second part) 101c...Protrusion (second part) 101d...Step surface (second part) 101d1…Edge (second part) 101e…Bottom surface 101f…side 101g…refrigerant passage 102...Lens 103, 103a, 103b...Mirror 104...Condenser lens 105...Condenser lens 106...Support part 107...Optical fiber 107a...input section 108…1 / 2 wavelength plate 109…Combiner 110...Light source device 120…High reflective FBR 121…High reflective FBR 130...Rare earth doped optical fiber (optical amplifier fiber) 140...Output optical fiber 200...Optical fiber laser A1, A2…Array Ax,Axd,Axr…Optical axis g…Gap L1, L2...Length R…Containment room S1: Unconnected state S2: Bonded state U...electromagnetic wave X...direction (second direction) Y…direction (third direction) Z...direction (first direction)

Claims

1. A method for manufacturing a light emitting device, comprising the steps of: The light emitting device comprises: a light-emitting unit including a light-emitting element that emits a laser beam, a lens that refracts the laser beam emitted by the light-emitting element, a housing that houses the light-emitting element and the lens and has a window that transmits the laser beam from the lens, and a heat transfer surface that is a part of the outer surface of the housing; a base having a heat receiving surface facing the heat transfer surface and receiving heat from the heat transfer surface; Equipped with The manufacturing method includes: a first step of adjusting at least one of a relative position and a relative attitude between the light emitting unit and the base; a second step of temporarily joining the light emitting unit to the base by a second joining portion in a state in which at least one of the relative position and the relative attitude is adjusted in the first step; a third step of joining the light emitting unit and the base by a first bonding portion in a state in which the light emitting unit is temporarily bonded to the base by the second bonding portion; In the third step, the first bonding portion is heated and then cooled, so that the first bonding portion solidifies from a fluid state to bond the light-emitting unit and the base, A method for manufacturing a light emitting device, wherein the second bonding portion is made of a material that solidifies from a fluid state to a bonded state and that does not melt at or below the melting point of the first bonding portion after solidification.

2. The method for manufacturing a light emitting device according to claim 1 , wherein at least a part of the second bonding portion is located outside a gap between the heat transfer surface and the heat receiving surface or is exposed from the gap.

3. the light emitting unit has a first portion remote from the heat transfer surface; The method for manufacturing a light emitting device according to claim 1 , wherein the second bonding portion bonds the first portion and the base.

4. 4. The method for manufacturing a light emitting device according to claim 1, wherein the first bonding portion includes solder.

5. 5. The method for manufacturing a light emitting device according to claim 1, wherein the second bonding portion is made of a material that is solidified from a fluid state to a bonded state by irradiation with electromagnetic waves.

6. The method for manufacturing a light emitting device according to claim 5 , wherein the base is provided with a clearance for avoiding interference with an electromagnetic wave irradiated toward the second bonding portion.

7. 7. The method for manufacturing a light emitting device according to claim 1, wherein the second bonding portion is made of a material that is solidified from a fluid state by heating to a bonded state.

8. 8. The method for manufacturing a light emitting device according to claim 1, wherein a volume of the second bonding portion is smaller than a volume of the first bonding portion.

9. The method for manufacturing a light emitting device according to claim 1, wherein the second bonding portion is a welded portion.

10. The base is provided with a surface, a recess having a side surface recessed from the surface and a bottom surface serving as the heat receiving surface, The method for manufacturing a light emitting device according to claim 1 , wherein the second bonding portion is bonded to at least one of the side surface and the front surface.

11. the base has a second portion spaced from the heat receiving surface; The method for manufacturing a light emitting device according to claim 1 , wherein the second bonding portion bonds the light emitting unit and the second portion.

12. The light emitting device comprises: A plurality of light-emitting units as the light-emitting unit; A plurality of heat receiving surfaces arranged in a stepped manner as the heat receiving surface; At least one step surface provided on the base and positioned between two adjacent heat receiving surfaces among the plurality of heat receiving surfaces; Equipped with A method for manufacturing a light-emitting device described in any one of claims 1 to 9, wherein the second bonding portion is bonded to at least one of the two heat-receiving surfaces, the heat-receiving surface that is away from the heat-transfer surface of the light-emitting unit to which the second bonding portion is bonded, and the step surface.

13. A method for manufacturing a light-emitting device described in any one of claims 1 to 12, wherein one of the heat transfer surface and the heat receiving surface has a convex curved surface, and the other of the heat transfer surface and the heat receiving surface has a concave curved surface that is approximately aligned with the convex curved surface at an approximately constant interval.

14. The method for manufacturing a light emitting device according to claim 1 , wherein the light emitting unit and the base are joined via a member different from the light emitting unit and the base and the second joining portion.

15. 15. The method for manufacturing a light emitting device according to claim 1, wherein the light emitting element has a fast axis and a slow axis, and has an output of 5 W or more.

16. 16. The method for manufacturing a light emitting device according to claim 1, wherein the lens is a collimating lens that collimates the laser light emitted from the light emitting element.

17. The light emitting device comprises: A plurality of light-emitting units as the light-emitting unit; an optical component that guides the laser light emitted from each of the light-emitting units to an optical fiber; A method for manufacturing a light emitting device according to any one of claims 1 to 16, comprising:

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