Multilayer electronic component and its manufacturing method

Abstract

To improve the completeness of a multilayer electronic component by minimizing defects in a margin portion that may occur when the margin portion is attached.SOLUTION: A method of manufacturing a multilayer electronic component, according to an embodiment of the present invention, may include the steps of: disposing, on an elastic pad to which an adhesive is attached, a plurality of cut ceramic green sheet stacked bodies to be spaced apart from each other; attaching a margin portion green sheet including a ceramic material, a photocuring agent, and a photoinitiator to at least one end surface of each of the plurality of cut ceramic green sheet stacked bodies in a third direction; an energy irradiation operation of irradiating, with energy, the margin portion green sheet to generate a photocuring polymerization reaction between the photocuring agent and the photoinitiator; and preparing a body including a dielectric layer, a first internal electrode, and a second internal electrode and a margin portion by sintering the cut ceramic green sheet stacked body to which the margin portion green sheet is attached.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component and a method for manufacturing the same. [Background technology]

[0002] Multi-Layered Ceramic Capacitor (MLCC), a type of multi-layered electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small yet high capacitance and easy to mount, and can be used as components of various electronic devices. As various electronic devices such as computers and mobile devices become smaller and have higher output, there is an increasing demand for multilayer ceramic capacitors to be smaller and have higher capacitance.

[0004] In order to realize miniaturization and high capacitance of multilayer ceramic capacitors, the internal electrodes are exposed in the width direction of the body, and the area of ​​the internal electrodes in the width direction is maximized by a margin-free design. In this case, a method is used in which a margin is separately attached to the electrode exposed surface in the width direction of the chip in the stage before firing after the chip is manufactured.

[0005] However, high heat and pressure are applied during the process of attaching the margin portion, and such heat and pressure may cause deformation of the multilayer ceramic capacitor, increasing the defect rate. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2022-056752 Summary of the Invention [Problem to be solved by the invention]

[0007] One of the various problems to be solved by the present invention is to improve the completeness of a multilayer electronic component by minimizing defects in the margins that may occur during attachment of the margins.

[0008] However, the various problems to be solved by the present invention are not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] A method for manufacturing a multilayer electronic component according to an embodiment of the present invention includes the steps of: providing a first ceramic green sheet on which a plurality of first internal electrode patterns are formed at predetermined intervals and a second ceramic green sheet on which a plurality of second internal electrode patterns are formed at predetermined intervals; laminating the first ceramic green sheet and the second ceramic green sheet in a first direction so that the first internal electrode patterns and the second internal electrode patterns cross each other to form a ceramic green sheet laminate body; and, defining a direction in which the first and second internal electrode patterns are larger as a second direction and a direction in which the first and second internal electrode patterns are smaller as a third direction, forming a ceramic green sheet laminate body such that ends of the first and second internal electrode patterns are exposed in the third direction. the step of cutting the ceramic green sheet laminate body from the ceramic green sheet laminated body; arranging the plurality of cut ceramic green sheet laminate bodies at a distance on an elastic pad having an adhesive attached thereto; attaching a margin portion green sheet including a ceramic material, a photohardener, and a photoinitiator to at least one end surface in the third direction of the plurality of cut ceramic green sheet laminate bodies; irradiating the margin portion green sheet with energy to cause a photohardener and the photoinitiator to undergo a photocuring polymerization reaction; and firing the cut ceramic green sheet laminate body with the margin portion green sheet attached thereto to provide a body including a dielectric layer, a first internal electrode, and a second internal electrode, and a margin portion.

[0010] A multilayer electronic component according to another embodiment of the present invention includes an active portion forming a capacitance including a dielectric layer and first and second internal electrodes alternately arranged in a first direction with the dielectric layer sandwiched therebetween, and includes a main body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction, first and second external electrodes arranged on the outside of the main body in the second direction and connected to the first and second internal electrodes, respectively, and margin portions arranged on both end faces of the active portion in the third direction, where an extension line of a corner in the first direction among the outermost corners of the main body based on a cross section of the main body in the first and third directions is defined as T and an extension line of a corner in the third direction is defined as W, and an angle formed by the T and the W is defined as ∠WT, the ∠WT may satisfy 90.0°±0.5°. Effect of the Invention

[0011] One of the various effects of the present invention is that it is possible to minimize defects in marginal areas and improve the completeness of multilayer electronic components.

[0012] However, the various yet significant advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0013] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] 2 is a schematic cross-sectional view taken along line II' of FIG. 1; [Figure 3a] 11A and 11B are cross-sectional and perspective views illustrating a method for manufacturing a multilayer electronic component according to another embodiment of the present invention. [Figure 3b] 11A and 11B are cross-sectional and perspective views illustrating a method for manufacturing a multilayer electronic component according to another embodiment of the present invention. [Figure 3c]11A and 11B are cross-sectional and perspective views illustrating a method for manufacturing a multilayer electronic component according to another embodiment of the present invention. [Figure 3d] 11A and 11B are cross-sectional and perspective views illustrating a method for manufacturing a multilayer electronic component according to another embodiment of the present invention. [Figure 3e] 11A and 11B are cross-sectional and perspective views illustrating a method for manufacturing a multilayer electronic component according to another embodiment of the present invention. [Figure 3f] 11A and 11B are cross-sectional and perspective views illustrating a method for manufacturing a multilayer electronic component according to another embodiment of the present invention. [Figure 3g] 11A and 11B are cross-sectional and perspective views illustrating a method for manufacturing a multilayer electronic component according to another embodiment of the present invention. [Figure 3h] 11A and 11B are cross-sectional and perspective views illustrating a method for manufacturing a multilayer electronic component according to another embodiment of the present invention. [Figure 3i] 11A and 11B are cross-sectional and perspective views illustrating a method for manufacturing a multilayer electronic component according to another embodiment of the present invention. [Figure 4] 13 is a schematic cross-sectional view of a multilayer electronic component having a margin attached to one surface of a body in accordance with another embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0015] In addition, in the drawings, parts that are not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the drawings. Furthermore, components having the same function within the same concept may be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it does not mean that the part excludes other components, but that the part may further include other components, unless otherwise specified to the contrary.

[0016] In the drawings, the first direction can be defined as the stacking direction or thickness (T) direction, the second direction can be defined as the length (T) direction, and the third direction can be defined as the width (W) direction.

[0017] Multilayer Electronic Components FIG. 1 is a diagram illustrating a perspective view of a multilayer electronic component according to an embodiment of the present invention, and FIG. 2 is a diagram illustrating a cross-sectional view taken along line II' in FIG.

[0018] Hereinafter, a multilayer electronic component according to an embodiment of the present invention will be described in detail with reference to Figures 1 and 2. Although a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, the present invention can also be applied to various electronic products that use a dielectric composition, such as inductors, piezoelectric elements, varistors, thermistors, etc.

[0019] A multilayer electronic component 100 according to an embodiment of the present invention includes a body 110 including an active portion Ac that forms a capacitance and includes a dielectric layer 111 and first and second internal electrodes 121, 122 that are alternately arranged in a first direction with the dielectric layer 111 sandwiched therebetween, the body 110 including first and second surfaces 1, 2 facing each other in the first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in the second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces 1, 2, 3, 4 and facing each other in the third direction; The active portion Ac includes first and second external electrodes 131, 132 disposed on the outside in the second direction and connected to the first and second internal electrodes 121, 122, respectively, and margin portions 114, 115 disposed on both end surfaces in the third direction of the active portion Ac. When an extension line of a corner of the outermost corner of the body 110 in the first direction is defined as T and an extension line of a corner in the third direction is defined as W based on a cross section of the body 110 in the first and third directions, and an angle formed by T and W is defined as ∠WT, the angle ∠WT may satisfy 90.0°±0.5°.

[0020] The body 110 has dielectric layers 111 and internal electrodes 121 and 122 laminated alternately.

[0021] More specifically, the body 110 may include an active portion Ac that is disposed inside the body 110 and includes first internal electrodes 121 and second internal electrodes 122 that are alternately arranged facing each other across the dielectric layer 111 to form a capacitance.

[0022] Although there is no particular limitation on the specific shape of the body 110, the body 110 may be hexahedral or a similar shape as shown in the figure. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may have a substantially hexahedral shape rather than a hexahedral shape having perfectly straight lines.

[0023] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction and connected to the first and second surfaces 1 and 2, and a fifth surface 5 and a sixth surface 6 facing each other in a third direction.

[0024] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so as to be difficult to confirm without using a scanning electron microscope (SEM).

[0025] The raw material for forming the dielectric layer 111 is not limited as long as sufficient capacitance can be obtained. Generally, perovskite (ABO3)-based materials can be used, and ceramic substances such as barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0026] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the raw material for forming the dielectric layer 111, such as powder of barium titanate (BaTiO3), according to the object of the present invention.

[0027] The thickness td' of the dielectric layer 111 does not need to be particularly limited.

[0028] However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness td' of the dielectric layer 111 can be 0.6 μm or less, and more preferably 0.4 μm or less.

[0029] Here, the thickness td′ of the dielectric layer 111 may refer to the thickness td′ of the dielectric layer 111 disposed between the first and second internal electrodes 121 and 122.

[0030] Meanwhile, the thickness td' of the dielectric layer 111 may refer to the size of the dielectric layer 111 in the first direction. In addition, the thickness td' of the dielectric layer 111 may refer to the average thickness td' of the dielectric layer 111, or may refer to the average size of the dielectric layer 111 in the first direction.

[0031] The average size in the first direction of the dielectric layer 111 may be measured by scanning an image of a cross-section of the body 110 in the first and second directions using a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, it may be an average value obtained by measuring the size in the first direction at 30 equally spaced points in the second direction of one dielectric layer 111 in the scanned image. The 30 equally spaced points may be designated as active parts Ac. Furthermore, if such an average value measurement is extended to 10 dielectric layers 111 to measure the average value, the average size in the first direction of the dielectric layer 111 may be further generalized.

[0032] The internal electrodes 121 and 122 may be laminated alternately with the dielectric layers 111 .

[0033] The internal electrodes 121, 122 may include a first internal electrode 121 and a second internal electrode 122, and the first and second internal electrodes 121, 122 are alternately arranged to face each other across the dielectric layer 111 constituting the body 110, and may be exposed to the third and fourth surfaces 3, 4 of the body 110, respectively.

[0034] More specifically, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the body 110 and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the body 110 and connected to the second internal electrode 122.

[0035] That is, the first internal electrode 121 may be connected to the first external electrode 131 without being connected to the second external electrode 132, and the second internal electrode 122 may be connected to the second external electrode 132 without being connected to the first external electrode 131. In this case, the first and second internal electrodes 121 and 122 may be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0036] Meanwhile, when margin portions 114 and 115 described below are attached, the first internal electrode 121 and the second internal electrode 122 may be exposed to a fifth surface 5 and a sixth surface 6 of the body 110. That is, the first internal electrode 121 may be exposed to the fifth surface 5 and the sixth surface 6, and the second internal electrode 122 may be exposed to the fifth surface 5 and the sixth surface 6.

[0037] The body 110 may be formed by alternately stacking first ceramic green sheets on which the first internal electrodes 121 are printed and second ceramic green sheets on which the second internal electrodes 122 are printed, and then firing the stacked sheets, which will be described in more detail in the method for manufacturing the multilayer electronic component described below.

[0038] There are no particular limitations on the material forming the internal electrodes 121 and 122, and any material having excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0039] The internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes, which contains at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, on a ceramic green sheet. The method for printing the conductive paste for internal electrodes may be a screen printing method or a gravure printing method, but the present invention is not limited thereto.

[0040] On the other hand, the thickness te' of the internal electrodes 121, 122 does not need to be particularly limited.

[0041] However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness te' of the internal electrodes 121, 122 can be 0.6 μm or less, and more preferably 0.4 μm or less.

[0042] Here, the thickness te' of the internal electrodes 121, 122 may refer to the size of the internal electrodes 121, 122 in the first direction. In addition, the thickness te' of the internal electrodes 121, 122 may refer to the average thickness te' of the internal electrodes 121, 122, or may refer to the average size of the internal electrodes 121, 122 in the first direction.

[0043] The average size of the internal electrodes 121, 122 in the first direction may be measured by scanning an image of a cross-section of the body 110 in the first and second directions using a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the average size of one internal electrode 121, 122 in the first direction may be measured at 30 equally spaced points in the second direction in the scanned image. The 30 equally spaced points may be designated as active parts Ac. Furthermore, if such an average value measurement is extended to 10 internal electrodes 121, 122 to measure the average value, the average size of the internal electrodes 121, 122 in the first direction may be further generalized.

[0044] Meanwhile, the body 110 may include cover parts 112 and 113 disposed on both end-surfaces in the first direction of the active part Ac.

[0045] More specifically, the cover 112 may include an upper cover part 112 disposed on an upper part of the active part Ac in the first direction, and a lower cover part 113 disposed on a lower part of the active part Ac in the first direction.

[0046] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer 111 or two or more dielectric layers 111 in a first direction on the upper and lower surfaces of the active part Ac, respectively, and may basically serve to prevent damage to the internal electrodes 121, 122 due to physical or chemical stress.

[0047] The upper cover part 112 and the lower cover part 113 do not include the internal electrodes 121 and 122 and may include the same material as the dielectric layer 111. That is, the upper cover part 112 and the lower cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0048] On the other hand, the thickness tc' of the covers 112 and 113 does not need to be particularly limited.

[0049] However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness tc' of the cover parts 112, 113 can be 100 μm or less, preferably 30 μm or less, and more preferably 20 μm or less for ultra-small products.

[0050] Here, the thickness tc' of the covers 112, 113 may refer to the size of the covers 112, 113 in the first direction. In addition, the thickness tc' of the covers 112, 113 may refer to the average thickness tc' of the covers 112, 113, or may refer to the average size of the covers 112, 113 in the first direction.

[0051] The average size in the first direction of the cover parts 112, 113 may be measured by scanning an image of a cross-section in the first and second directions of the body 110 using a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the average size in the first direction may be measured at 30 equally spaced points in the third direction of one cover part 112, 113 in the scanned image. The 30 equally spaced points may be specified in the upper cover part 112. Furthermore, if such an average value measurement is extended to the lower cover part 113 to measure the average value, the average size in the first direction of the cover parts 112, 113 may be further generalized.

[0052] Meanwhile, margin portions 114 and 115 may be disposed on both end surfaces of the body 110 in the third direction.

[0053] More specifically, the margin portions 114, 115 may include a first margin portion 114 disposed on the fifth surface 5 of the main body 110 and a second margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114, 115 may be disposed on both end surfaces of the main body 110 in the third direction.

[0054] Alternatively, as shown in the figure, the margin portions 114, 115 may refer to the areas between both ends of the first and second internal electrodes 121, 122 exposed in the third direction and the boundary surface of the body 110, based on a cross-section of the body 110 cut in the second and third directions.

[0055] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0056] In order to suppress steps caused by the internal electrodes 121, 122, the margin portions 114, 115 can also be formed by cutting the laminated internal electrodes 121, 122 so that they are exposed on the fifth and sixth surfaces 5, 6 of the main body 110, and then stacking a single dielectric layer 111 or two or more dielectric layers 111 in the third direction on both end faces in the third direction of the active portion Ac.

[0057] That is, the internal electrodes 121, 122 and the dielectric layer 111 may be cut and formed at the same time, and the size of the internal electrodes 121, 122 in the third direction and the size of the dielectric layer 111 in the third direction may be formed to be the same, and more specific details regarding this will be described later.

[0058] On the other hand, the width wm' of the first and second marginal portions 114, 115 does not need to be particularly limited.

[0059] However, in order to more easily achieve miniaturization and high capacity of the laminated electronic component 100, the width wm' of the first and second margin portions 114, 115 can be 100 μm or less, preferably 30 μm or less, and for ultra-small products, more preferably 20 μm or less.

[0060] Here, the width wm' of the margin portions 114, 115 may refer to the size of the margin portions 114, 115 in the third direction. In addition, the width of the margin portions 114, 115 may refer to the average width of the margin portions 114, 115, or may refer to the average size of the margin portions 114, 115 in the third direction.

[0061] The average size in the third direction of the margin portions 114, 115 may be measured by scanning an image of the cross sections of the body 110 in the first and third directions using a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the average size in the third direction may be measured at 30 equally spaced points in the first direction of one margin portion 114, 115 in the scanned image. The 30 equally spaced points may be specified in the first margin portion 114. Furthermore, if such an average value measurement is extended to the second margin portions 114, 115 to measure the average value, the average size in the third direction of the margin portions 114, 115 may be further generalized.

[0062] Meanwhile, in the case of describing a multilayer electronic component 100 including margin portions 114 and 115 attached by a manufacturing method according to another embodiment of the present invention described below with reference to FIG. 2, when an extension line of a corner in a first direction among the outermost corners of the body 110 based on a cross-section in a first and third direction of the body 110 is defined as T and an extension line of a corner in a third direction is defined as W, and the angle formed by T and W is defined as ∠WT, the ∠WT may satisfy 90.0°±0.5°.

[0063] This means that the multilayer electronic component was not deformed due to misalignment of the margin green sheet that may occur when attaching the margin green sheet or due to external force or stress that may occur during the process of forming the margin. More details regarding the method of manufacturing the margin will be described later.

[0064] In one embodiment of the present invention, a structure in which the ceramic electronic component 100 has two external electrodes 131, 132 is described, however, the number and shapes of the external electrodes 131, 132 can be changed depending on the shape of the internal electrodes 121, 122 and other purposes.

[0065] The outer electrodes 131 and 132 may be disposed on the body 110 and connected to the inner electrodes 121 and 122 .

[0066] More specifically, the external electrodes 131, 132 may include first and second external electrodes 131, 132 disposed on the third and fourth surfaces 3, 4 of the body 110, respectively, and connected to the first and second internal electrodes 121, 122, respectively. That is, the first external electrode 131 may be disposed on the third surface 3 of the body and connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 of the body and connected to the second internal electrode 122.

[0067] The external electrodes 131, 132 may be formed using any material that has electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical properties, structural stability, etc., and may further have a multi-layer structure.

[0068] For example, the external electrodes 131, 132 may include an electrode layer disposed on the body 110 and a plating layer disposed on the electrode layer.

[0069] More specifically, the electrode layer may be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and resin.

[0070] Also, the electrode layer may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the body 110 .

[0071] In addition, the electrode layer may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0072] The conductive metal used in the electrode layer is not particularly limited as long as it can be electrically connected to the internal electrodes to form capacitance, and may include, for example, at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The electrode layer may be formed by applying a conductive paste prepared by adding glass frit to the conductive metal powder, and then firing the paste.

[0073] The plating layer serves to improve mounting characteristics.

[0074] The type of plating layer is not particularly limited, and may be a single plating layer containing one or more of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof, or may be formed in multiple layers.

[0075] More specifically, the plating layer may be a Ni plating layer or a Sn plating layer, and may be a form in which a Ni plating layer and a Sn plating layer are sequentially formed on an electrode layer, or a form in which a Sn plating layer, a Ni plating layer and a Sn plating layer are sequentially formed. Also, the plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0076] Manufacturing method for multilayer electronic components 3a to 3i are cross-sectional and perspective views that roughly show a method for manufacturing a multilayer electronic component according to another embodiment of the present invention.

[0077] 3a to 3i, a method for producing a multilayer electronic component according to another embodiment of the present invention will be described in detail below, although content that overlaps with the above-described multilayer electronic component will be omitted.

[0078] A method for manufacturing a multilayer electronic component according to another embodiment of the present invention includes the steps of: providing a first ceramic green sheet on which a plurality of first internal electrode patterns 221 are formed at predetermined intervals and a second ceramic green sheet on which a plurality of second internal electrode patterns 222 are formed at predetermined intervals; laminating the first ceramic green sheet and the second ceramic green sheet in a first direction such that the first internal electrode pattern 221 and the second internal electrode pattern 222 cross each other to form a ceramic green sheet multilayer body 210; and, when a direction in which the first and second internal electrode patterns 221 and 222 are larger in size is defined as a second direction and a direction in which the first and second internal electrode patterns 221 and 222 are smaller in size is defined as a third direction, forming the ceramic green sheet multilayer body 210 such that ends of the first and second internal electrode patterns 221 and 222 are exposed in the third direction. the plurality of cut ceramic green sheet laminate bodies 210 on an elastic pad 310 to which an adhesive 320 is attached, at a distance from each other; attaching margin portion green sheets 214, 215 including a ceramic material, a photohardener, and a photoinitiator to at least one end surface in the third direction of the plurality of cut ceramic green sheet laminate bodies 210; irradiating the margin portion green sheets 214, 215 with energy 610 to cause a photohardener and a photoinitiator to undergo a photohardening polymerization reaction; and firing the cut ceramic green sheet laminate body 210 to which the margin portion green sheets 214, 215 are attached to provide a body 110 including a dielectric layer 111, a first internal electrode 121, and a second internal electrode 122, and margin portions 114, 115.

[0079] 3a, a plurality of stripe-shaped first internal electrode patterns 221 are formed at predetermined intervals on a ceramic green sheet 211. The plurality of stripe-shaped first internal electrode patterns 221 may be formed parallel to each other, and the ceramic green sheet on which the first internal electrode patterns 221 are formed may be defined as a first ceramic green sheet.

[0080] The ceramic green sheet 211 can include a ceramic slurry containing a ceramic material, an organic solvent, and an organic binder. The ceramic material is not particularly limited as a material having a high dielectric constant, but a perovskite (ABO3) - based material can be used. For example, a barium titanate - based material, a lead - composite perovskite - based material, or a strontium titanate - based material can be used. The barium titanate - based material can include BaTiO3 - based ceramic powder. As an example of the ceramic powder, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid - dissolved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned.

[0081] The strip - shaped first internal electrode pattern 221 can be formed by an internal - electrode paste containing a conductive metal. The conductive metal is not particularly limited, but a material having excellent electrical conductivity like the above - mentioned internal electrodes 121, 122 can be used.

[0082] The first internal electrode pattern 221 can be formed on the first ceramic green sheet 221a using a screen - printing method, a gravure - printing method, etc., but is not limited thereto.

[0083] Also, although not shown in the figure, a plurality of strip - shaped second internal electrode patterns 222 can be formed on another ceramic green sheet 211 with a predetermined interval therebetween. The ceramic green sheet on which the second internal electrode pattern 222 is formed can be defined as the second ceramic green sheet.

[0084] Next, as shown in FIG. 3b, the first and second ceramic green sheets may be alternately laminated such that the stripe-shaped first internal electrode pattern 221 and the stripe-shaped second internal electrode pattern 222 are cross-laminated.

[0085] At this time, a portion where the ceramic green sheet 211 and the internal electrode patterns 221, 222 are laminated in the first direction to form a capacitance may be defined as a green active portion, and the cover portion green sheets 212, 213 may be disposed on both end faces of the green active portion in the first direction. More specifically, the cover portion green sheets 212, 213 may include a first cover portion green sheet 212 disposed on an upper portion of the green active portion in the first direction and a second cover portion green sheet 213 disposed on a lower portion of the green active portion in the first direction.

[0086] Thereafter, the stripe-shaped first internal electrode pattern 221 can become the first internal electrode 121, and the stripe-shaped second internal electrode pattern 222 can become the second internal electrode 122. Also, the first cover part green sheet 212 can become the first cover part 112, and the second cover part green sheet 213 can become the second cover part 113.

[0087] There is no need to particularly limit the thickness td of the first and second ceramic green sheets.

[0088] However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness td of the first and second ceramic green sheets can be 1.0 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0089] Here, the thickness td of the first and second ceramic green sheets may refer to the size of the first and second ceramic green sheets in the first direction.

[0090] The thickness te of the first and second internal electrode patterns does not need to be particularly limited.

[0091] However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness te of the first and second internal electrode patterns may be 1.0 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0092] FIG. 3c is a cross-sectional view showing a ceramic green sheet laminated body 220 in which the first and second ceramic green sheets are laminated in a first direction, and FIG. 3d is a schematic oblique view of the ceramic green sheet laminated body 220 in which the first and second ceramic green sheets are laminated.

[0093] Referring to Figures 3c and 3d, a first ceramic green sheet having a plurality of parallel stripe-shaped first internal electrode patterns 221 printed thereon and a second ceramic green sheet having a plurality of parallel stripe-shaped second internal electrode patterns 222 printed thereon are alternately stacked with each other.

[0094] More specifically, the first ceramic green sheet and the second ceramic green sheet may be laminated such that the central portion of the stripe-shaped first internal electrode pattern 221 printed on the first ceramic green sheet and the central portion of the stripe-shaped second internal electrode pattern 222 printed on the second ceramic green sheet overlap with each other.

[0095] 3d, the ceramic green sheet laminate body 220 may be cut across the plurality of stripe-shaped first internal electrode patterns 221 and the stripe-shaped second internal electrode patterns 222. That is, the ceramic green sheet laminate body 210 may be cut along cutting lines C1-C1 and C2-C2 that are perpendicular to each other.

[0096] More specifically, the stripe-shaped first internal electrode pattern 221 and the stripe-shaped second internal electrode pattern 222 may be cut in the second direction to divide into a plurality of internal electrodes having a certain size in the third direction. At this time, the laminated ceramic green sheets may also be cut into a plurality of pieces together with the internal electrode patterns to provide a plurality of cut ceramic green sheet laminate bodies 210. Meanwhile, the sizes in the third direction of the cut ceramic green sheets and the cut internal electrode patterns may be the same.

[0097] Also, it is possible to cut the ceramic green sheet laminated body 210 to fit the individual body size along the C2-C2 cutting line, that is, before the margin portion green sheets 214a and 214b are attached, the rod-shaped ceramic green sheet laminated body 210 can be cut to the individual ceramic body size along the C2-C2 cutting line to form a plurality of cut ceramic green sheet laminated bodies 210.

[0098] That is, the bar-shaped ceramic green sheet laminate body 210 can be cut so that the predetermined intervals formed between the centers of the overlapping first internal electrodes and the second internal electrodes are cut along the same cutting line, so that one ends of the first internal electrodes and the second internal electrodes can be alternately exposed on the cut surface.

[0099] Thereafter, a cut ceramic greensheet laminate body 210 may be provided, as shown in FIG. 3e.

[0100] Meanwhile, in order to realize miniaturization and high capacitance of multilayer ceramic capacitors, the internal electrodes are exposed in the width direction of the body, and the area of ​​the internal electrodes in the width direction is maximized by a margin-free design. In this case, a method is used in which a margin is separately attached to the electrode exposed surface in the width direction of the chip in the stage before firing after the chip is manufactured.

[0101] According to a conventional method for forming a margin portion, in order to attach the margin portion to a cut surface in the width direction of the multilayer electronic component, a process may be performed that includes attaching a margin portion green sheet to the multilayer electronic component, applying heat and pressure to the margin portion green sheet to compress it to the multilayer electronic component, and punching out portions of the margin portion green sheet that are not attached to the multilayer electronic component to remove the remaining margin portion green sheet.

[0102] However, the high heat and pressure involved in the process of attaching the margin portion, as well as the punching process, can cause deformation of the multilayer electronic components, increasing the defect rate. Furthermore, the conventional margin portion forming process is not only time-consuming, but also has the disadvantage of exposing the multilayer electronic components to high stress. The high stress applied to the multilayer electronic components causes defects such as deformation of the multilayer electronic components and misalignment of the margin portion sheet, reducing the degree of completion or decreasing the production yield.

[0103] Therefore, the method for manufacturing a multilayer electronic component according to an embodiment of the present invention has an advantage that the process of attaching the margin sheet and the process of cutting the multilayer electronic component to the size thereof are simplified into one process, thereby minimizing stress applied to the multilayer electronic component. Hereinafter, a manufacturing method of the present invention will be described in more detail.

[0104] A method for manufacturing a multilayer electronic component according to an embodiment of the present invention may include, after forming a plurality of cut ceramic green sheet laminate bodies 210, arranging the plurality of cut ceramic green sheet laminate bodies 210 at a distance on an elastic pad 320 to which an adhesive 310 is attached, as shown in FIG. 3f.

[0105] In this case, the spacing between the multiple cut ceramic green sheet laminated bodies 210 is not particularly limited, but it may be preferable to maintain a constant spacing, and if the spacing is the same as or larger than the size of the cut ceramic green sheet laminated body 210 in the first direction, it may be easy to attach the margin green sheet.

[0106] At this time, the method may include a step of scanning the plurality of cut ceramic green sheet laminated bodies 210 arranged at a distance from each other. At this time, the type of the scanner 400 for scanning is not particularly limited, and may be, for example, a 3-dimensional laser scanner.

[0107] Here, the 3D laser scanner may refer to a non-contact scanner that irradiates a laser or lamp light onto an object to be scanned and detects the reflected light to grasp the shape of the object. The 3D laser scanner can be used to obtain data on the shape and arrangement of the plurality of cut ceramic green sheet laminate bodies 210 arranged at a distance from each other.

[0108] Next, as shown in FIG. 3g, the process may include attaching margin green sheets 214a and 215a to at least one end surface in the third direction of the plurality of cut ceramic green sheet laminate bodies 210.

[0109] At this time, the margin portion green sheets 214a, 215a can be attached to a carrier film and moved, and can be attached to at least one end surface in the third direction of the plurality of cut ceramic green sheet laminated bodies 210 without the application of heat and pressure.

[0110] The margin part green sheets 214a and 215a can contain a ceramic slurry including a ceramic material, an organic solvent, and an organic binder. The ceramic material is not particularly limited as a material having a high dielectric constant, but a perovskite (ABO3) - based material can be used. For example, a barium titanate - based material, a lead - composite perovskite - based material, or a strontium titanate - based material can be used. The barium titanate - based material can contain BaTiO3 - based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid - solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0111] Also, the margin part green sheets 214a and 215a can contain a photo - curing agent and a photo - initiator.

[0112] The photo - curing agent can contain, for example, at least one or more monomers or oligomers of epoxy, acrylate, urethane, and thiol, but is not particularly limited thereto.

[0113] At this time, the content of the photo - curing agent can satisfy 15 - 26 wt% with respect to the ceramic material contained in the margin part green sheets 214a and 215a.

[0114] If the content of the photohardener is less than 15 wt % based on the ceramic material, sufficient adhesive strength may not be obtained even after the photohardening polymerization reaction is completed, and if the content of the photohardener is more than 26 wt % based on the ceramic material, the excessive organic matter content may reduce the reliability of the laminated electronic component 100 after firing.

[0115] The photoinitiator may include, for example, at least one of benzoin methyl ether, 2,2-dimethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-phenyl-propane-1-one, α-hydroxy-acetophenone, Bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and Bis(2,6-dichlorobenzoyl)-(4-propylphenyl)-phosphine oxide, but is not particularly limited thereto.

[0116] The content of the photoinitiator can be 0.1 to 5.0 wt % relative to the content of the photocuring agent.

[0117] If the content of the photoinitiator is less than 0.1 wt % or more than 5.0 wt % relative to the content of the photocuring agent, the photocuring polymerization reaction described below may not proceed sufficiently, and the mechanical strength of the margin portions 114, 115 after firing may be insufficient, which can reduce the reliability of the laminated electronic component 100.

[0118] Next, as shown in FIG. 3h, an energy irradiation step may be included in which the marginal green sheets 214a and 215a are irradiated with energy to cause a photo-curing polymerization reaction between the photo-curing agent and the photoinitiator.

[0119] At this time, the energy irradiation step may irradiate only the regions of the marginal green sheets 214a and 215a attached to the plurality of cut ceramic green sheet laminated bodies 210 arranged apart from each other.

[0120] When a photocuring polymerization reaction is caused by using energy 610 irradiated from an energy irradiating device to the marginal green sheets 214a and 215a containing a photocuring agent and a photoinitiator, the photocuring polymerization reaction may occur within a short time, and thus a photocuring reactive material may be produced. At this time, the marginal green sheets 214 and 215 contain the photocuring polymerization reactive material, so that the mechanical strength can be improved.

[0121] At this time, the energy 610 may be light energy including ultraviolet light (UV: Ultra Violet) having a wavelength of about 100 to 400 nm, for example. -3 The light source may be an electron beam (EB) having a wavelength of up to 10 nm, but is not particularly limited thereto.

[0122] Meanwhile, a method of irradiating energy only to the marginal green sheet regions 214a, 215a attached to a plurality of cut ceramic green sheet laminated bodies 210 spaced apart from one another can use an energy reflecting device 500 that disperses and selectively reflects energy.

[0123] More specifically, the overall arrangement data of the shape of the individual multilayer electronic components acquired through the non-contact scanner is transferred to a digital mirror device (DMD). At this time, the DMD has tens to millions of micro mirrors arranged according to the resolution, and each micro mirror 510 can adjust its angle individually. The angle of the micro mirror 510 is adjusted based on the transferred image data, and the energy incident on the DMD is partially reflected and energy 610 is applied to the margin green sheets 214a, 215a areas to be irradiated. In this manner, a photo-curing polymerization reaction is selectively performed only on the margin green sheets 214a, 215a areas attached to at least one end surface in the third direction of the multilayer electronic components, and the margin green sheets 214, 215 on which the photo-curing polymerization reaction is performed can be formed.

[0124] Next, the carrier film 330 to which the marginal green sheets 214a and 215a are attached may be separated from the cut ceramic green sheet laminate body 210.

[0125] At this time, the margin green sheets 214, 215 containing the photocuring polymerization reactant are selectively attached to the cut ceramic green sheet laminate body 210, and the margin green sheets 214a, 215a in which the photocuring polymerization reaction has not progressed can be detached from the cut ceramic green sheet laminate body 210 as the carrier film 330 is separated.

[0126] Referring to FIG. 4 according to an embodiment of the present invention, a first margin green sheet 214 on which a photo-curing polymerization reaction has progressed may be attached to one end surface of a cut ceramic green sheet laminate body 210.

[0127] Then, the cut ceramic green sheet laminate body 210 to which the margin portion green sheet 214 on which the photocuring polymerization reaction has progressed is not attached is rotated to attach the second margin portion green sheet 215a to the other end surface, for example, the sixth surface 6, and then the second margin portion green sheet 215 containing the photocuring polymerization reaction material can be attached through the same process as the above-mentioned step.

[0128] If necessary, the margin green sheet 214 can be attached only to one end face in the third direction of the cut ceramic green sheet laminate body 210, and the margin green sheets 214, 215 can be attached to both end faces in the third direction, but this is not particularly limited.

[0129] In a method for manufacturing a multilayer electronic component according to an embodiment of the present invention, referring to FIG. 2 which is similar to the form of this step, when the ceramic green sheet laminate body cut after the energy irradiation step is taken as a cross section in the first and third directions, the extension line of the corner in the first direction among the outermost corners of the body is defined as T, the extension line of the corner in the third direction is defined as W, and the angle between T and W is defined as ∠WT, ∠WT may satisfy 90.0°±0.5°.

[0130] This can be the result of a manufacturing method according to an embodiment of the present invention, rather than a conventional margin forming method in which stress is applied to a multilayer electronic component by applying pressure or heat.

[0131] More specifically, T may be an imaginary line connecting both ends of a corner in a first direction of the body with a straight line, W may be an imaginary line connecting both ends of a corner in a third direction of the body with a straight line, and ∠WT may mean the angle formed by T and W.

[0132] Next, the cut ceramic green sheet laminate body 210 with the margin green sheets 214 and 215 attached thereto may be fired to provide a body and margins including the dielectric layers, the first internal electrodes, and the second internal electrodes.

[0133] During the firing process in the step of providing the body and the margin portion, the photocurable polymerization reactant of the margin portion ceramic green sheets 214, 215 where the photocurable polymerization reaction has progressed may be removed. Depending on the heat treatment temperature, some of the photocurable polymerization reactant may remain, but at a heat treatment temperature for ensuring sufficient mechanical strength of the margin portions 114, 115, the photocurable polymerization reactant may not remain.

[0134] This process can shorten the margin formation process, and by not carrying out unnecessary processes such as punching, it is possible to minimize stress on the multilayer electronic components, significantly reduce the defect rate, and improve the yield of the finished chips.

[0135] A method for manufacturing a multilayer electronic component according to an embodiment of the present invention may include, after the step of providing the body and the margin portion, a step of applying a first external electrode paste and a second external electrode paste to the outside of the body in the second direction, and firing the first external electrode paste and the second external electrode paste to provide the first external electrode 131 and the second external electrode 132.

[0136] The details regarding the external electrodes 131 and 132 are the same as those described above, and therefore will not be repeated.

[0137] Also, after providing the first and second external electrodes, the method may include forming a first plating layer on the first external electrode and forming a second plating layer on the second external electrode.

[0138] The details regarding the plating layer are the same as those described above, and therefore will be omitted.

[0139] Although the embodiment of the present invention has been described in detail above, the present invention is not limited to the above embodiment and the attached drawings, but is limited by the appended claims. Therefore, various substitutions, modifications and changes can be made by a person having ordinary knowledge in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0140] The present invention will be described in more detail below by way of experimental examples. However, these are intended to aid in the concrete understanding of the invention, and the scope of the present invention is not limited to these experimental examples.

[0141] (Experimental Example) Tables 1 to 3 below show relevant data comparing the numerical values ​​before and after the transfer process for comparative examples in which margins were formed using a conventional margin manufacturing method and examples in which margins were formed using a margin manufacturing method according to one embodiment of the present invention.

[0142] In the transfer process in the comparative example, the green sheet for the side margin portion was attached to the side where the ends of the first internal electrode and the second internal electrode of the cut ceramic green sheet laminate body were exposed in the width direction by applying heat and pressure with an elastic body, and then pressure was again applied with another elastic body to cut the green sheet for the side margin portion in the same shape as the laminate body, thereby completing the formation of the side margin portion.

[0143] In the transfer process in the embodiment, light of a wavelength range capable of reacting with the photocurable material to induce a photopolymerization reaction was selectively irradiated only to the area where the laminate body and the side margin sheet overlap, and the side margin green sheet was attached to the widthwise side of the laminate body. The remaining portion not irradiated with light was removed together with the carrier film, completing the formation of the side margin.

[0144] Table 1 shows data on the T size measured before and after the transfer process in the comparative examples and examples, Table 2 shows data on the W size measured before and after the transfer process in the comparative examples and examples, and Table 3 shows data on the ∠WT size measured before and after the transfer process in the comparative examples and examples.

[0145] The chip, which is a laminated electronic component, was observed using an OLYMPUS KOREA Optical Microscope (OM) under conditions of an electric stage microscope OMS-500×500×100 (mm) and a magnification of 50 to 100 times.

[0146] Here, T is the value measured by connecting the outer boundaries of the cover parts at both ends in the first direction of the chip with straight lines and connecting the straight lines so that they coincide with the flat part in the center of the height direction, and the unit is μm.

[0147] [Table 1]

[0148] Referring to Table 1 above, it can be seen that the change in the magnitude of T before and after the transfer process is smaller when the margin portion manufacturing method according to an embodiment of the present invention is performed than when the conventional margin portion manufacturing method is performed.

[0149] W is measured by connecting the boundaries between the margin and cover parts at both ends of the chip in the third direction with a straight line, and then connecting the straight line so that it coincides with the flat part in the center in the third direction, and the unit of W is μm.

[0150] [Table 2]

[0151] Referring to Table 2 above, a comparison of the size of W before and after the transfer process shows that the change in size of W in the embodiment is smaller when the margin portion manufacturing method according to an embodiment of the present invention is performed compared to the conventional margin portion manufacturing method.

[0152] ∠WT is the angle measured where the lines T and W meet, and is measured in degrees.

[0153] [Table 3]

[0154] Referring to Table 3, a comparison of the magnitude of ∠WT before and after the transfer process shows that when the margin portion manufacturing method according to an embodiment of the present invention is performed compared to the conventional margin portion manufacturing method, the change in the magnitude of ∠WT in the example is smaller and satisfies ∠90.0°±0.5°.

[0155] In summary, when using the margin manufacturing method according to one embodiment of the present invention, it can be confirmed that the deformation rate of the chip is smaller than that of the conventional margin manufacturing method, and that the degree of completion and yield of the multilayer electronic component are improved.

[0156] In addition, the expressions "one embodiment" or "one experimental example" used in this specification do not mean the same embodiment, but are provided to emphasize and describe unique features that are different from each other. However, the above-mentioned one embodiment does not exclude being realized in combination with features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood that it is a description related to the other embodiment, unless there is a description in the other embodiment that is opposite or contradictory to the matter.

[0157] The terms used in this specification are merely used to describe one embodiment and are not intended to limit the present disclosure. In this case, the singular expression includes the plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0158] 100 Multilayer electronic components 110 Main unit 111 Dielectric layer 112, 113 Cover part 114, 115 Margin 121, 122 Internal electrode 131, 132 External electrode 210 Cut ceramic green sheet laminate body 211 Ceramic green sheet 212, 213 Cover green sheet 214, 215 Margin Green Sheet 221, 222 Internal electrode pattern 310 Elastic Pad 320 Adhesive 330 Carrier Film 400 Scanner 500 Energy Reflector 510 Micromirror 610 Energy

Claims

1. providing a first ceramic green sheet having a plurality of first internal electrode patterns formed thereon at predetermined intervals and a second ceramic green sheet having a plurality of second internal electrode patterns formed thereon at predetermined intervals; forming a ceramic green sheet laminate body by laminating the first ceramic green sheet and the second ceramic green sheet in a first direction such that the first internal electrode pattern and the second internal electrode pattern cross each other; a direction in which the first internal electrode pattern and the second internal electrode pattern are larger in size and a direction in which the second internal electrode pattern is smaller in size are defined as a second direction and a third direction, respectively; cutting the ceramic green sheet laminate body such that ends of the first internal electrode pattern and the second internal electrode pattern are exposed in the third direction; placing the plurality of cut ceramic green sheet laminate bodies on an elastic pad having an adhesive attached thereto, with one end surface in the third direction of each of the cut ceramic green sheet laminate bodies spaced apart from each other and facing upward of the elastic pad; attaching a margin green sheet including a ceramic material, a photohardener, and a photoinitiator to one end surface in the third direction of the plurality of cut ceramic green sheet laminate bodies; an energy irradiation step of irradiating the marginal green sheet with energy to cause a photo-curing polymerization reaction between the photo-curing agent and the photo-initiator; and firing the cut ceramic green sheet laminate body with the margin portion green sheets attached thereto to provide a body including a dielectric layer, a first internal electrode, and a second internal electrode, and a margin portion.

2. 2. The method of claim 1, further comprising: scanning the plurality of cut ceramic green sheet laminate bodies spaced apart from each other after the step of spaced apart the plurality of cut ceramic green sheet laminate bodies.

3. 2. The method of claim 1, wherein the energy irradiating step irradiates energy only to the green sheet regions of the marginal portions attached to the plurality of cut ceramic green sheet laminate bodies arranged at a distance from each other.

4. The margin portion green sheet is attached onto a carrier film, 4. The method of claim 3, further comprising the step of: separating the carrier film to which the margin green sheet is attached from the cut ceramic green sheet laminate body after the energy irradiation step.

5. 2. The method of claim 1, wherein the light hardener comprises at least one monomer or oligomer of an epoxy, an acrylate, a urethane, and a thiol.

6. The photoinitiator is Benzoin methyl ether, 2,2-Dimethoxy-2-phenylacetophenone, 2-Hydroxy-2-methyl-phenyl-propane-1-one , α-Hydroxy-acetophenone, Bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine 2. The method for producing a multilayer electronic component according to claim 1, wherein the multilayer electronic component comprises at least one of bis(2,6-dichlorobenzoyl)-(4-propylphenyl)-phosphine oxide and bis(2,6-dichlorobenzoyl)-(4-propylphenyl)-phosphine oxide.

7. 2. The method for manufacturing a multilayer electronic component according to claim 1, wherein the content of the light hardener is 15 to 26 wt % based on the ceramic material contained in the margin green sheet.

8. 8. The method for producing a multilayer electronic component according to claim 7, wherein the content of the photoinitiator is 0.1 to 5.0 wt % based on the content of the photocuring agent.

9. After the energy irradiation step, With respect to the cross sections of the cut ceramic green sheet laminate body in the first direction and the third direction, an extension line of the outermost corner of the body in the first direction is defined as T, an extension line of the outermost corner of the body in the third direction is defined as W, and an angle between T and W is defined as ∠WT, The method for producing a multilayer electronic component according to claim 1 , wherein the angle WT satisfies 90.0°±0.5°.

10. In the step of forming the ceramic green sheet laminate body, 2. The method of claim 1, further comprising the step of: attaching cover margin sheets to both end surfaces of the ceramic green sheet laminate body in the first direction.

11. After the step of providing the body and the margin, applying first and second external electrode pastes to an outer surface of the body in the second direction; 2. The method of claim 1, further comprising the step of: firing the first and second external electrode pastes to provide first and second external electrodes.

12. After the step of providing the first and second external electrodes, forming a first plating layer on the first external electrode; The method for manufacturing a multilayer electronic component according to claim 11 , further comprising: forming a second plating layer on the second external electrodes.

13. a body including an active portion including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer therebetween to form a capacitance, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; first and second external electrodes disposed on the outer sides of the body in the second direction and connected to the first and second internal electrodes, respectively; a margin portion disposed on both end surfaces of the active portion in the third direction, Based on the cross sections of the main body in the first direction and the third direction, an extension line of the corner in the first direction among the outermost corners of the main body is defined as T, an extension line of the corner in the third direction is defined as W, and an angle formed by the T and the W is defined as ∠WT, The ∠WT satisfies 90.0°±0.5°, The margin portion is formed using a photocurable polymerization reaction material produced by a photocurable polymerization reaction of a photocuring agent and a photoinitiator.

14. 14. The laminated electronic component according to claim 13, wherein the light hardener comprises at least one monomer or oligomer of an epoxy, an acrylate, a urethane, and a thiol.

15. The photoinitiator is Benzoin methyl ether, 2,2-Dimethoxy-2-phenylacetophenone, 2-Hydroxy-2-methyl-phenyl-propane-1-one , α-Hydroxy-acetophenone, Bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine 15. The multilayer electronic component according to claim 14, comprising at least one of bis(2,6-dichlorobenzoyl)-(4-propylphenyl)-phosphine oxide and bis(2,6-dichlorobenzoyl)-(4-propylphenyl)-phosphine oxide.

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