Inspection device and inspection method

Abstract

To provide an inspection device and an inspection method, which suppress collapse of a stage.SOLUTION: An inspection device comprises: a probe card having a probe contacted to an inspected body; an upper module having a mounting part for mounting the inspected body; a movement mechanism that can move the upper module to a horizontal direction while supporting the upper module so as to be lifted; and a lifting mechanism that is provided to a lower side of the movement mechanism, and can push up the upper module toward the probe card. An axis of a point of action of a pressing force when pushing up the upper module by the lifting mechanism and an axis of a point of action of a loading received by the probe card are arranged at a common position.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to an inspection apparatus and an inspection method. [Background technology]

[0002] There is known an inspection apparatus that places a wafer on which electronic devices are formed or a carrier on which electronic devices are arranged on a stage and brings probes provided on a probe card into contact with electrodes of the electronic device to inspect the electrical characteristics of the electronic device.

[0003] Patent Document 1 discloses a substrate contact device for a probe card, which contacts a substrate with a probe card of a substrate inspection interface of a substrate inspection apparatus having an inspection unit that inspects electrical characteristics of a semiconductor device formed on a substrate and a substrate inspection interface arranged above the inspection unit, the substrate contact device comprising: a transport mechanism that transports the substrate together with a plate-shaped member to a position facing the probe card; a contact mechanism that moves the substrate transported by the transport mechanism toward the probe card together with the plate-shaped member to contact a plurality of electrodes of a semiconductor device provided on the substrate with a plurality of probes provided on the probe card, and then further moves the substrate together with the plate-shaped member a predetermined distance toward the probe card; a holding mechanism that reduces the pressure in the space between the probe card and the plate-shaped member to maintain a state in which the plurality of electrodes of the semiconductor device and the plurality of probes of the probe card are in contact with each other; and a detachment mechanism that detaches the transport mechanism from the plate-shaped member after the contact state is maintained by the holding mechanism. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2014-29916 A Summary of the Invention [Problem to be solved by the invention]

[0005] When the probes are brought into contact with the outer periphery of the wafer or carrier, an offset occurs between the center of gravity of the press load from the probe card and the center of the stage supporting it, which can cause the stage to tip over.

[0006] In one aspect, the present disclosure provides an inspection apparatus and an inspection method that suppresses tilting of a stage. [Means for solving the problem]

[0007] In order to solve the above problem, according to one aspect, a probe card having a probe that comes into contact with an object to be tested, an upper module having a mounting portion on which the object to be tested is placed, a moving mechanism that supports the upper module so that it can be raised and lowered and is capable of moving the upper module in a horizontal direction, and a lifting mechanism that is provided below the moving mechanism and is capable of pushing up the upper module toward the probe card, the lifting mechanism being disposed at a position where a point of application of a pressing force when the lifting mechanism pushes up the upper module and a point of application of a load received by the probe card are on a common axis. the moving mechanism has a first stage movable in a first direction relative to a base plate, and a second stage movable in a second direction different from the first direction relative to the upper module, the upper module is supported on the first stage so as to be movable up and down, and the first stage has an opening. An inspection device is provided. Effect of the Invention

[0008] According to one aspect, it is possible to provide an inspection device and an inspection method that suppress the tilt of a stage. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic cross-sectional view illustrating a configuration of an inspection device according to a first embodiment. [Diagram 2] FIG. [Diagram 3] 4 is a flowchart showing an example of the operation of the inspection apparatus. [Figure 4] FIG. 4 is a schematic cross-sectional view of the inspection apparatus according to the first embodiment after horizontal movement when inspecting electronic devices at the center of a carrier. [Diagram 5]FIG. 4 is a schematic cross-sectional view of the inspection device according to the first embodiment during inspection of an electronic device at the center of a carrier. [Figure 6] FIG. 4 is a schematic cross-sectional view of the inspection device according to the first embodiment after horizontal movement when inspecting electronic devices on the outer periphery of a carrier. [Figure 7] FIG. 4 is a schematic cross-sectional view of the inspection device according to the first embodiment during inspection of electronic devices on the outer periphery of a carrier. [Figure 8] FIG. 4 is a schematic cross-sectional view of the inspection device according to the first embodiment after horizontal movement when the probe is brought into contact with the center of the needle grinding plate. [Figure 9] FIG. 4 is a schematic cross-sectional view of the inspection device according to the first embodiment when a probe is brought into contact with the center of a needle grinding plate. [Figure 10] FIG. 4 is a schematic cross-sectional view of the inspection device according to the first embodiment after horizontal movement when the probe is brought into contact with the outer periphery of the needle grinding plate. [Figure 11] FIG. 4 is a schematic cross-sectional view of the inspection device according to the first embodiment when a probe is brought into contact with the outer periphery of a needle grinding plate. [Figure 12] FIG. 11 is a schematic cross-sectional view of an electronic device at the center of a carrier in the inspection apparatus according to the reference example during inspection. [Figure 13] 11 is a schematic cross-sectional view of an inspection device according to a reference example during inspection of electronic devices on the outer periphery of a carrier. FIG. [Figure 14] 13 is a schematic cross-sectional view of the inspection device according to the reference example when a probe is brought into contact with the center of a needle grinding plate. FIG. [Figure 15] 13 is a schematic cross-sectional view of the inspection device according to the reference example when a probe is brought into contact with the outer periphery of a needle grinding plate. FIG. [Figure 16] FIG. 11 is a schematic cross-sectional view of the inspection apparatus according to the second embodiment after horizontal movement when inspecting electronic devices at the center of a carrier. [Figure 17] FIG. 11 is a schematic cross-sectional view of an electronic device at the center of a carrier in the inspection apparatus according to the second embodiment during inspection. [Figure 18] FIG. 11 is a schematic cross-sectional view illustrating the configuration of an inspection device according to a third embodiment. [Figure 19]FIG. 13 is a plan view illustrating the configuration of an inspection device according to a fourth embodiment. [Figure 20] FIG. 13 is a schematic cross-sectional view illustrating the configuration of an inspection device according to a fourth embodiment. [Figure 21] FIG. 13 is an exploded perspective view of an inspection device according to a fourth embodiment. [Figure 22] FIG. 13 is a schematic cross-sectional view of an electronic device at the center of a carrier in the inspection device according to the fourth embodiment during inspection. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and duplicated descriptions may be omitted.

[0011] An inspection device 1 according to the first embodiment will be described with reference to Fig. 1. Fig. 1 is a schematic cross-sectional view illustrating the configuration of the inspection device 1 according to the first embodiment.

[0012] The inspection apparatus 1 is an apparatus that inspects the electrical characteristics of each of a plurality of electronic devices arranged on a carrier (object under inspection) C. The carrier C includes a wafer, a glass substrate, a single chip, and the like.

[0013] The inspection device 1 has a probe chamber 2. A probe card 3 is arranged in the upper part of the probe chamber 2. The probe card 3 has a plurality of probes 4. A stage base 10 is provided in the lower part of the probe chamber 2. In the probe chamber 2, a Y stage 20, an X stage 30, an upper Z stage 40, a θ stage 41, a chuck 42, a lower camera 43, a needle grinding plate support stage 50, and a needle grinding plate 51 are provided.

[0014] The Y stage 20 moves the chuck 42 and the needle grinding plate 51 in the Y-axis direction. The Y stage 20 is attached to the stage base 10 via a linear guide 21. The linear guide 21 has, for example, a guide rail provided on the upper surface of the stage base 10 and extending in the Y-axis direction, and a slider provided on the lower surface of the Y stage 20 and sliding along the guide rail. This allows the Y stage 20 to move in the Y direction.

[0015] The Y drive mechanism 22 drives the Y stage 20 in the Y direction. The Y drive mechanism 22 includes, for example, a motor and a rotary-linear mechanism (for example, a ball screw) that converts the rotary motion of the motor into a linear motion. The operation of the motor of the Y drive mechanism 22 is controlled by the control device 80.

[0016] The detector 23 detects the Y direction position of the Y stage 20, in other words, the Y direction positions of the chuck 42 and the needle grinding plate 51. The detector 23 is, for example, an encoder that detects the rotation of the motor of the Y drive mechanism 22, and the detection signal of the detector 23 is transmitted to the control device 80. The control device 80 calculates the Y direction position of the Y stage 20 based on the detection signal of the detector 23.

[0017] The Y stage 20 is formed in a frame shape, and has an opening 25 penetrating therethrough in the Z-axis direction.

[0018] The X-stage 30 moves the chuck 42 and the needle grinding plate 51 in the X-axis direction. The X-stage 30 is attached to the Y-stage 20 via a linear guide 31. The linear guide 31 has, for example, a guide rail provided on the upper surface of the Y-stage 20 and extending in the X-axis direction, and a slider provided on the lower surface of the X-stage 30 and sliding along the guide rail. This allows the X-stage 30 to move in the X-direction.

[0019] The X-driving mechanism 32 drives the X-stage 30 in the X-direction. The X-driving mechanism 32 includes, for example, a motor and a rotary-linear mechanism (for example, a ball screw) that converts the rotary motion of the motor into a linear motion. The operation of the motor of the X-driving mechanism 32 is controlled by the control device 80.

[0020] The detector 33 detects the X-direction position of the X-stage 30, in other words, the X-direction positions of the chuck 42 and the needle grinding plate 51. The detector 33 is, for example, an encoder that detects the rotation of the motor of the X-drive mechanism 32, and the detection signal of the detector 33 is transmitted to the control device 80. The control device 80 calculates the X-direction position of the X-stage 30 based on the detection signal of the detector 33.

[0021] The X-stage 30 has two openings penetrating in the Z-axis direction. A guide 35 and a guide 36 are provided in each of the two openings.

[0022] The upper Z stage 40 is supported so as to be insertable and removable in the Z axis direction, and its movement in the X axis direction and Y axis direction is restricted by the guides 35. As a result, the upper Z stage 40 is configured to be movable in the up and down direction relative to the X stage 30.

[0023] A θ stage 41, a chuck 42, and a lower camera 43 are provided on the upper Z stage 40. The θ stage 41 has a function of rotating the chuck 42 around the Z axis as the axis of rotation. A θ drive mechanism (not shown) that rotates the θ stage 41 is controlled by the control device 80. The chuck 42 carries the carrier C. The chuck 42 has a fixing mechanism (not shown) that fixes the carrier C to the chuck 42. This prevents the carrier C from being misaligned relative to the chuck 42. The lower camera 43 is provided on the side of the chuck 42. It moves and rotates together with the chuck 42.

[0024] The needle grinding plate support stage 50 is supported by the guide 36 so that the movement in the X-axis direction and the Y-axis direction is restricted and the needle grinding plate support stage 50 can be inserted and removed in the Z-axis direction.

[0025] A needle grinding plate 51 is provided on the needle grinding plate support stage 50. The needle grinding plate 51 is brought into contact with the tip of the probe 4 and grinds the tip of the probe 4.

[0026] The stage base 10 has an opening 15 penetrating therethrough in the Z-axis direction. A guide 61 is provided in the opening 15.

[0027] The lower Z stage 60 is supported by guides 61 such that movement in the X-axis and Y-axis directions is restricted and the lower Z stage 60 is insertable and removable in the Z-axis direction. As a result, the lower Z stage 60 is configured to be movable in the up and down directions relative to the stage base 10.

[0028] The Z drive mechanism 62 drives the lower Z stage 60 in the Z direction. The Z drive mechanism 62 includes, for example, a motor and a rotary-linear mechanism (for example, a ball screw) that converts the rotary motion of the motor into a linear motion. The operation of the motor of the Z drive mechanism 62 is controlled by the control device 80.

[0029] Here, when the probe 4 is brought into contact with the carrier C or the needle grinding plate 51 placed on the chuck 42, the center of gravity of the press load of the probe card 3 and the center of gravity of the press load of the lower Z stage 60 are arranged so as to be kept on the same axis (see Figs. 5, 7, 9, and 11 described later). In other words, the axis of the point of application of the pressing force when the lower Z stage 60 pushes up the upper Z stage 40 and the axis of the point of application of the load received by the probe card 3 are arranged at a common position. Here, "the axis is common" means that they are on the same axis (the axes are the same) and that they are almost the same (in the same direction). For example, the central axis of the probe card 3 and the central axis of the lower Z stage 60 are common. Also, the central axis of the probe card 3 and the central axis of the ball screw of the Z drive mechanism 62 are common.

[0030] The detector 63 detects the X-direction position of the lower Z stage 60, in other words, the Z-direction position of the chuck 42 provided on the upper Z stage 40 connected to the lower Z stage 60 or the needle grinding plate 51 connected to the needle grinding plate support stage 50. The detector 63 is, for example, an encoder that detects the rotation of the motor of the Z drive mechanism 62, and the detection signal of the detector 63 is transmitted to the control device 80. The control device 80 calculates the Z-direction position of the lower Z stage 60 based on the detection signal of the detector 63.

[0031] The load cell 64 detects the load received by the lower Z stage 60. A detection signal from the load cell 64 is input to the control device 80. Note that a torque sensor that detects the torque of the Z drive mechanism 62 may be used instead of the load cell 64. Furthermore, when feedback control of the detected load is performed, the control device 80 simultaneously performs position control and load control.

[0032] A movable connecting mechanism 71 is provided below the upper Z stage 40. The movable connecting mechanism 71 is configured to be switchable between a connected state in which the upper Z stage 40 and the lower Z stage 60 are connected, and a movable state in which the connection between the upper Z stage 40 and the lower Z stage 60 is released and the upper Z stage 40 is movable on the stage base 10.

[0033] A movable connecting mechanism 72 is provided below the needle grinding plate support stage 50. The movable connecting mechanism 72 is configured to be switchable between a connected state in which the needle grinding plate support stage 50 and the lower Z stage 60 are connected, and a movable state in which the connection between the needle grinding plate support stage 50 and the lower Z stage 60 is released, allowing the needle grinding plate support stage 50 to move on the stage base 10.

[0034] 2 is a schematic diagram illustrating the movable connecting mechanism 71. The movable connecting mechanism 71 has a horizontal movement mechanism 701 and a connecting mechanism 702.

[0035] The horizontal movement mechanism 701 enables the upper Z stage 40 to move on the stage base 10. As the horizontal movement mechanism 701, for example, a free bearing, an air bearing, or a ball-type air bearing that is movable in a planar direction can be used.

[0036] The coupling mechanism 702 detachably couples the upper Z stage 40 and the lower Z stage 60. For example, an electromagnet can be used as the coupling mechanism 702. The coupling mechanism 702 is controlled by the control device 80.

[0037] 1, control device 80 controls the operation of inspection device 1. Detection signals from detectors 23, 33, 63 and load cell 64 are input to control device 80. Control device 80 controls Y drive mechanism 22, X drive mechanism 32, Z drive mechanism 62, θ drive mechanism, and movable linkage mechanisms 71, 72.

[0038] Next, the operation of the inspection device 1 according to the first embodiment will be described with reference to Fig. 3. Fig. 3 is a flowchart showing an example of the operation of the inspection device 1 according to the first embodiment.

[0039] In step S101, the control device 80 controls the Y drive mechanism 22 and the X drive mechanism 32 to move the chuck 42 (the needle grinding plate 51) to a predetermined position.

[0040] In step S102, the control device 80 controls the movable connecting mechanism 71 (72) to be in a connected state, whereby the upper Z stage 40 (the needle grinding plate support stage 50) and the lower Z stage 60 are connected to each other.

[0041] In step S103, the control device 80 controls the Z drive mechanism 62 to raise the lower Z stage 60. This causes the probes 4 to contact the electrodes of the electronic device placed on the carrier C. The control device 80 detects the load at the time of contact with the load cells 64, and controls the Z drive mechanism 62 to control the contact load. This causes a tester (not shown) to be connected to the electronic device via the probes 4.

[0042] In step S104, the control device 80 controls the tester to test the electrical characteristics of the electronic device.

[0043] In step S105, the control device 80 controls the Z drive mechanism 62 to lower the lower Z stage 60.

[0044] In step S106, the control device 80 controls the movable connecting mechanism 71 (72) to release the connection. This releases the connection between the upper Z stage 40 (the needle grinding plate support stage 50) and the lower Z stage 60. In addition, the upper Z stage 40 (the needle grinding plate support stage 50) becomes movable in the horizontal direction.

[0045] Thereafter, steps S101 to S106 are repeated for each electronic device.

[0046] Next, the stress in each state of the inspection device 1 according to the first embodiment will be described with reference to FIGS.

[0047] Fig. 4 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment after horizontal movement when inspecting electronic devices at the center of a carrier C. Fig. 5 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment when inspecting electronic devices at the center of a carrier C.

[0048] As shown in Fig. 4, the Y stage 20 and the X stage 30 are moved to place the electronic device in the center of the carrier C under the probe 4. Next, the movable connecting mechanism 72 is brought into the connected state to connect the upper Z stage 40 and the lower Z stage 60. As shown in Fig. 5, the Z driving mechanism 62 is driven to raise the chuck 42 and press the probe 4 against the carrier C. At this time, the reaction forces received by the probe card 3 and the reaction forces received by the Z driving mechanism 62 are indicated by black arrows. Since the press load center position of the probe card 3 and the press load center position of the Z driving mechanism 62 are arranged on the same axis, tilting of the upper Z stage 40 can be prevented.

[0049] Fig. 6 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment after horizontal movement when inspecting electronic devices on the outer periphery of a carrier C. Fig. 7 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment when inspecting electronic devices on the outer periphery of a carrier C.

[0050] As shown in Fig. 6, the Y stage 20 and the X stage 30 are moved to place the electronic device on the outer periphery of the carrier C under the probe 4. Next, the movable connecting mechanism 72 is brought into the connected state to connect the upper Z stage 40 and the lower Z stage 60. As shown in Fig. 7, the Z drive mechanism 62 is driven to raise the chuck 42 and press the probe 4 against the carrier C. At this time, the reaction forces received by the probe card 3 and the reaction forces received by the Z drive mechanism 62 are indicated by black arrows. Since the press load center position of the probe card 3 and the press load center position of the Z drive mechanism 62 are arranged on the same axis, tilting of the upper Z stage 40 can be prevented.

[0051] Fig. 8 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment after horizontal movement when the probe 4 is brought into contact with the center of the needle grinding plate 51. Fig. 9 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment when the probe 4 is brought into contact with the center of the needle grinding plate 51.

[0052] As shown in FIG. 8, the Y stage 20 and the X stage 30 are moved to position the center of the needle grinding plate 51 under the probe 4. Next, the movable connecting mechanism 72 is connected to connect the needle grinding plate support stage 50 and the lower Z stage 60. As shown in FIG. 9, the Z drive mechanism 62 is driven to raise the needle grinding plate 51 and press the probe 4 against the needle grinding plate 51. At this time, the reaction forces received by the probe card 3 and the reaction forces received by the Z drive mechanism 62 are indicated by black arrows. Since the press load center position of the probe card 3 and the press load center position of the Z drive mechanism 62 are arranged on the same axis, the inclination of the needle grinding plate support stage 50 can be prevented.

[0053] Fig. 10 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment after horizontal movement when the probe 4 is brought into contact with the outer periphery of the needle grinding plate 51. Fig. 11 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment when the probe 4 is brought into contact with the outer periphery of the needle grinding plate 51.

[0054] As shown in FIG. 10, the Y stage 20 and the X stage 30 are moved to position the outer periphery of the needle grinding plate 51 under the probe 4. Next, the movable connecting mechanism 72 is connected to connect the needle grinding plate support stage 50 and the lower Z stage 60. As shown in FIG. 11, the Z drive mechanism 62 is driven to raise the needle grinding plate 51 and press the probe 4 against the needle grinding plate 51. At this time, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism 62 are indicated by black arrows. Since the press load center position of the probe card 3 and the press load center position of the Z drive mechanism 62 are arranged on the same axis, the inclination of the needle grinding plate support stage 50 can be prevented.

[0055] Here, an example of the inspection device 1C according to the reference example will be described. FIG. 12 is a schematic cross-sectional view of the inspection device 1C according to the reference example when inspecting electronic devices in the center of the carrier C. FIG. 13 is a schematic cross-sectional view of the inspection device 1C according to the reference example when inspecting electronic devices in the outer periphery of the carrier C. FIG. 14 is a schematic cross-sectional view of the inspection device 1C according to the reference example when the probe 4 is brought into contact with the center of the needle grinding plate 51C. FIG. 15 is a schematic cross-sectional view of the inspection device 1C according to the reference example when the probe 4 is brought into contact with the outer periphery of the needle grinding plate 51C. In addition, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism 62 are indicated by black arrows.

[0056] In an inspection apparatus 1C according to a reference example, a Z drive mechanism (not shown) is provided on the X stage 30, and a Z stage 40C moves up and down relative to the X stage 30. A needle grinding plate 51C is fixed to the Z stage 40C via a beam structure 52C.

[0057] 12, when testing an electronic device at the center of the carrier C, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism are arranged on the same axis. This makes it possible to prevent the Z stage 40C from tilting.

[0058] 13, when testing electronic devices on the outer periphery of carrier C, the reaction force received by probe card 3 and the reaction force received by the Z drive mechanism are arranged on different axes. Therefore, as shown by the white arrow, tilt of Z stage 40C occurs.

[0059] 14, when the probe 4 is brought into contact with the center of the needle grinding plate 51C, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism are arranged on different axes. Therefore, as shown by the white arrow, the beam structure 52C is deflected, causing the needle grinding plate 51C to tilt.

[0060] 15, when the probe 4 is brought into contact with the outer periphery of the needle grinding plate 51C, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism are arranged on different axes. Therefore, as shown by the white arrow, the beam structure 52C is further deflected, and the inclination of the needle grinding plate 51C becomes even larger.

[0061] As described above, according to the inspection device 1 of the first embodiment, the center of gravity of the press load of the probe card 3 and the center of gravity of the press load of the Z drive mechanism 62 (lower Z stage 60) can be always kept on the same axis (see FIGS. 5 and 7), not only when the probe 4 is in contact with the center of the carrier C, but also when it is in contact with the outer periphery of the carrier C. This makes it possible to prevent the upper Z stage 40 from falling over even if the contact load is large.

[0062] Moreover, according to the inspection device 1 of the first embodiment, it is possible to prevent the needle grinding plate 51 from falling over (see Figs. 9 and 11). Moreover, since the upper Z stage 40 and the needle grinding plate support stage 50 can be raised and lowered by a single Z drive mechanism 62, it is possible to reduce the cost of the inspection device 1 without providing separate drive mechanisms.

[0063] Next, the inspection device 1A according to the second embodiment will be described with reference to Fig. 16 and Fig. 17. Fig. 16 is a schematic cross-sectional view of the inspection device 1A according to the second embodiment after horizontal movement when inspecting electronic devices at the center of a carrier C. Fig. 17 is a schematic cross-sectional view of the inspection device 1A according to the second embodiment when inspecting electronic devices at the center of a carrier C.

[0064] Compared to the inspection device 1 according to the first embodiment, the inspection device 1A according to the second embodiment has a movable connecting mechanism 73 and a movable mechanism 74 instead of the movable connecting mechanisms 71 and 72. The other configurations are similar, and therefore repeated explanations will be omitted.

[0065] The upper part of the lower Z stage 60 is provided with a movable connecting mechanism 73. The movable connecting mechanism 73 is configured to be able to switch between a connected state in which the upper Z stage 40 or the needle grinding plate support stage 50 is connected to the lower Z stage 60, and a movable state in which the upper Z stage 40 or the needle grinding plate support stage 50 is released from the lower Z stage 60 and the upper Z stage 40 or the needle grinding plate support stage 50 is movable on the lower Z stage 60. The movable connecting mechanism 73 has a horizontal movement mechanism and a connecting mechanism. The horizontal movement mechanism allows the upper Z stage 40 or the needle grinding plate support stage 50 to move on the lower Z stage 60. For example, a free bearing, an air bearing, or a ball-type air bearing that can move in a planar direction can be used as the horizontal movement mechanism. The connecting mechanism detachably connects the upper Z stage 40 or the needle grinding plate support stage 50 to the lower Z stage 60. For example, an electromagnet can be used as the connecting mechanism. The connecting mechanism is controlled by the control device 80.

[0066] The upper part of the stage base 10 has a movable mechanism 74. The movable mechanism 74 has a horizontal movement mechanism. The horizontal movement mechanism enables the upper Z stage 40 or the needle grinding plate support stage 50 to move on the stage base 10. As the horizontal movement mechanism, for example, a free bearing, an air bearing, or a ball-type air bearing that can move in a planar direction can be used.

[0067] As described above, according to the inspection device 1A of the second embodiment, like the inspection device 1 of the first embodiment, the press load center of gravity position of the probe card 3 and the press load center of gravity position of the Z drive mechanism 62 (lower Z stage 60) can always be kept on the same axis. This makes it possible to prevent the upper Z stage 40 from falling even if the contact load is increased. In addition, it is possible to prevent the needle grinding plate 51 from falling. In addition, since the upper Z stage 40 and the needle grinding plate support stage 50 can be raised and lowered by a single Z drive mechanism 62, the cost of the inspection device 1 can be reduced without providing separate drive mechanisms.

[0068] Next, an inspection device 1B according to a third embodiment will be described with reference to Fig. 18. Fig. 18 is a schematic cross-sectional view illustrating the configuration of the inspection device 1B according to the third embodiment.

[0069] Compared to the inspection device 1 according to the first embodiment, the inspection device 1B according to the third embodiment has a movable connecting mechanism 75 instead of the movable connecting mechanisms 71 and 72. The other configurations are similar, and duplicated explanations will be omitted. In addition, the upper Z stage 40 and the needle grinding plate support stage 50 are configured to be suspended on the X stage 30 when lowered. As a result, the upper Z stage 40 and the needle grinding plate support stage 50 are configured to be out of contact with the stage base 10. The other configurations are similar, and duplicated explanations will be omitted.

[0070] A movable connecting mechanism 75 is provided on the upper part of the lower Z stage 60. The movable connecting mechanism 75 is configured to be able to switch between a connected state in which the upper Z stage 40 or the needle grinding plate support stage 50 is connected to the lower Z stage 60, and a movable state in which the connection between the upper Z stage 40 or the needle grinding plate support stage 50 and the lower Z stage 60 is released, and the upper Z stage 40 or the needle grinding plate support stage 50 is allowed to move on the lower Z stage 60. The movable connecting mechanism 75 has an O-ring provided on the upper surface of the lower Z stage 60, and an intake and exhaust mechanism that intakes and exhausts the space surrounded by the O-ring. The intake and exhaust mechanism intakes air from within the space surrounded by the O-ring to connect the upper Z stage 40 or the needle grinding plate support stage 50 to the lower Z stage 60 by vacuum suction. The intake and exhaust mechanism also releases the connection between the upper Z stage 40 or the needle grinding plate support stage 50 and the lower Z stage 60 by supplying air into the space surrounded by the O-ring. Furthermore, the supplied air causes the upper Z stage 40 or the needle grinding plate support stage 50 to float above the lower Z stage 60. This allows the upper Z stage 40 and the needle grinding plate support stage 50 to move in the horizontal direction.

[0071] The O-ring can also be used as a cushion to absorb the impact when the upper Z stage 40 or the needle grinding plate support stage 50 comes into contact with the lower Z stage 60. This makes it possible to suppress the impact when the upper Z stage 40 or the needle grinding plate support stage 50 and the lower Z stage 60 are connected.

[0072] As described above, according to the inspection device 1B of the third embodiment, like the inspection device 1 of the first embodiment, the press load center of gravity position of the probe card 3 and the press load center of gravity position of the Z drive mechanism 62 (lower Z stage 60) can be always kept on the same axis. This makes it possible to prevent the upper Z stage 40 from falling even if the contact load is increased. In addition, it is possible to prevent the needle grinding plate 51 from falling. In addition, since the upper Z stage 40 and the needle grinding plate support stage 50 can be raised and lowered by a single Z drive mechanism 62, the cost of the inspection device 1 can be reduced without providing separate drive mechanisms.

[0073] Next, the inspection device 1D according to the fourth embodiment will be described with reference to Figs. 19 to 22. Fig. 19 is a plan view illustrating the configuration of the inspection device 1D according to the fourth embodiment. Fig. 20 is a schematic cross-sectional view illustrating the configuration of the inspection device 1D according to the fourth embodiment. Fig. 21 is an exploded perspective view of the inspection device 1D according to the fourth embodiment. Fig. 22 is a schematic cross-sectional view of the inspection device 1D according to the fourth embodiment during inspection of an electronic device at the center of a carrier C. In Fig. 21, the movement direction of each part is indicated by an arrow.

[0074] The inspection apparatus 1D is an apparatus that inspects the electrical characteristics of each of a plurality of electronic devices arranged on a carrier (object under inspection) C. The carrier C includes a wafer, a glass substrate, a single chip, and the like.

[0075] The inspection device 1D has a probe chamber 2. A probe card 3 is disposed in the upper part of the probe chamber 2. The probe card 3 has a plurality of probes 4. A stage base 10 is provided in the lower part of the probe chamber 2. A Y stage 20A, an X stage 30A, an upper Z stage 40A, a θ stage 41, a chuck 42, and a lower camera 43 are provided in the probe chamber 2. In addition, a Y stage 20B, an X stage 30B, an upper Z stage 40B, and a needle grinding plate 51 are provided in the probe chamber 2.

[0076] The Y stage 20A moves the chuck 42 in the Y-axis direction. The Y stage 20A is attached to the stage base 10 via a linear guide 21. The linear guide 21 has, for example, a guide rail provided on the upper surface of the stage base 10 and extending in the Y-axis direction, and a slider provided on the lower surface of the Y stage 20A and sliding along the guide rail. This allows the Y stage 20A to move in the Y direction.

[0077] The Y driving mechanism 22A drives the Y stage 20A in the Y direction. The Y driving mechanism 22A includes, for example, a motor and a rotary-linear mechanism (for example, a ball screw) that converts the rotary motion of the motor into a linear motion. The operation of the motor of the Y driving mechanism 22A is controlled by the control device 80.

[0078] The detector 23A detects the Y direction position of the Y stage 20A, in other words, the Y direction position of the chuck 42. The detector 23A is, for example, an encoder that detects the rotation of the motor of the Y drive mechanism 22A, and the detection signal of the detector 23A is transmitted to the control device 80. The control device 80 calculates the Y direction position of the Y stage 20A based on the detection signal of the detector 23A.

[0079] The Y stage 20A has an opening penetrating in the Z-axis direction. A guide 26A is provided in the opening.

[0080] The upper Z stage 40A has a protrusion 45A that protrudes downward. The protrusion 45A of the upper Z stage 40A is inserted into the guide 26A. The upper Z stage 40A is supported by the guide 26A such that the movement of the upper Z stage 40A in the X-axis direction and the Y-axis direction is restricted and the upper Z stage 40A is supported so as to be insertable and removable in the Z-axis direction. This allows the upper Z stage 40A to move in the vertical direction relative to the Y stage 20A. The upper Z stage 40A has a protrusion 45A that protrudes downward. In addition, a stopper 46A is provided on the top surface of the Y stage 20A against which the upper Z stage 40A abuts when it descends.

[0081] The X stage 30A moves the chuck 42 in the X-axis direction. The X stage 30A is attached to the upper Z stage 40A via a linear guide 31A. The linear guide 31A has, for example, a guide rail provided on the lower surface of the X stage 30A and extending in the X-axis direction, and a slider provided on the upper surface of the upper Z stage 40A and sliding along the guide rail. This allows the X stage 30A to be movable in the X direction. In addition, the slider of the linear guide 31A is preferably disposed symmetrically in the X-axis direction from the central axis of the lower Z stage 60 when viewed from the side in the Y-axis direction (see FIG. 20).

[0082] The X driving mechanism 32A drives the X stage 30A in the X direction. The X driving mechanism 32A includes, for example, a motor and a rotary-linear mechanism (for example, a ball screw) that converts the rotary motion of the motor into a linear motion. The operation of the motor of the X driving mechanism 32A is controlled by the control device 80.

[0083] The detector 33A detects the X-direction position of the X-stage 30A, in other words, the X-direction position of the chuck 42. The detector 33A is, for example, an encoder that detects the rotation of a motor of the X-drive mechanism 32A, and a detection signal of the detector 33A is transmitted to the control device 80A. The control device 80 calculates the X-direction position of the X-stage 30A based on the detection signal of the detector 33A.

[0084] A θ stage 41, a chuck 42, and a lower camera 43 are provided on the X stage 30A. The θ stage 41 has a function of rotating the chuck 42 around the Z axis as the axis of rotation. A θ drive mechanism 44A that rotates the θ stage 41 is controlled by the control device 80. The chuck 42 carries the carrier C. The chuck 42 has a fixing mechanism (not shown) that fixes the carrier C to the chuck 42. This prevents the carrier C from being displaced relative to the chuck 42. The lower camera 43 is provided on the side of the chuck 42. It moves and rotates together with the chuck 42.

[0085] The Y stage 20B moves the needle grinding plate 51 in the Y-axis direction. The upper Z stage 40B is configured to be movable in the up and down direction relative to the Y stage 20B. The X stage 30B moves the needle grinding plate 51 in the X-axis direction. Note that the Y stage 20B, upper Z stage 40B, and X stage 30B have the same configurations as the Y stage 20A, upper Z stage 40A, and X stage 30A, and therefore repeated explanations will be omitted.

[0086] A needle grinding plate 51 is provided on the X-stage 30B. The needle grinding plate 51 abuts the tip of the probe 4 and grinds the tip of the probe 4. The needle grinding plate 51 also has a function of rotating the needle grinding plate 51 about the Z-axis as a rotation axis. The θ drive mechanism 44B that rotates the needle grinding plate 51 is controlled by the control device 80.

[0087] The stage base 10 has an opening 15 penetrating therethrough in the Z-axis direction. A guide 61 is provided in the opening 15.

[0088] The lower Z stage 60 is supported by guides 61 such that movement in the X-axis and Y-axis directions is restricted and the lower Z stage 60 is insertable and removable in the Z-axis direction. As a result, the lower Z stage 60 is configured to be movable in the up and down directions relative to the stage base 10.

[0089] The Z drive mechanism 62 drives the lower Z stage 60 in the Z direction. The Z drive mechanism 62 includes, for example, a motor and a rotary-linear mechanism (for example, a ball screw) that converts the rotary motion of the motor into a linear motion. The operation of the motor of the Z drive mechanism 62 is controlled by the control device 80.

[0090] Here, when the probe 4 is brought into contact with the carrier C or the needle grinding plate 51 placed on the chuck 42, the center of gravity of the press load of the probe card 3 and the center of gravity of the press load of the lower Z stage 60 are arranged so as to be on the same axis (see FIG. 22). In other words, the axis of the point of application of the pressing force when the lower Z stage 60 presses up the upper Z stage 40A and the axis of the point of application of the load received by the probe card 3 are arranged at a common position. Here, the axis being common means being on the same axis (the axes being the same) and being almost the same (in the same direction). For example, the central axis of the probe card 3 and the central axis of the lower Z stage 60 are common. Also, the central axis of the probe card 3 and the central axis of the ball screw of the Z drive mechanism 62 are common.

[0091] The detector 63 detects the X-direction position of the lower Z stage 60, in other words, the Z-direction position of the chuck 42 provided on the upper Z stage 40A connected to the lower Z stage 60 or the needle grinding plate 51 connected to the needle grinding plate support stage 50. The detector 63 is, for example, an encoder that detects the rotation of the motor of the Z drive mechanism 62, and the detection signal of the detector 63 is transmitted to the control device 80. The control device 80 calculates the Z-direction position of the lower Z stage 60 based on the detection signal of the detector 63.

[0092] The load cell 64 detects the load received by the lower Z stage 60. A detection signal from the load cell 64 is input to the control device 80. Note that a torque sensor that detects the torque of the Z drive mechanism 62 may be used instead of the load cell 64. Furthermore, when feedback control of the detected load is performed, the control device 80 simultaneously performs position control and load control.

[0093] The lower part of the upper Z stage 40A has a movable connecting mechanism 75. The movable connecting mechanism 75 is configured to be switchable between a connected state in which the upper Z stage 40A and the lower Z stage 60 are connected, and a movable state in which the connection between the upper Z stage 40A and the lower Z stage 60 is released and the upper Z stage 40A is movable on the stage base 10.

[0094] Here, the case where the lower Z stage 60 pushes up the upper Z stage 40A has been described as an example, but the same applies to the case where the lower Z stage 60 pushes up the upper Z stage 40B. That is, when the lower Z stage 60 pushes up the upper Z stage 40B, the Y stage 20A is retracted from above the lower Z stage 60, and the Y stage 20B is moved so as to be positioned above the lower Z stage 60. In this case, the movable coupling mechanism 75 is configured to be able to switch between a coupled state in which the upper Z stage 40B and the lower Z stage 60 are coupled, and a movable state in which the upper Z stage 40B and the lower Z stage 60 are released from the coupling, and the upper Z stage 40B is allowed to move on the stage base 10.

[0095] As described above, according to the inspection device 1D of the fourth embodiment, the center of gravity of the press load of the probe card 3 and the center of gravity of the press load of the Z drive mechanism 62 (lower Z stage 60) can be always kept on the same axis (see FIG. 22) not only when the probe 4 is in contact with the center of the carrier C but also when it is in contact with the outer periphery of the carrier C. This makes it possible to prevent the upper Z stage 40A from falling over even if the contact load is large.

[0096] In addition, since the slider of the linear guide 31A is provided on the top surface of the upper Z stage 40A and is arranged symmetrically in the X-axis direction from the central axis of the lower Z stage 60, it is possible to prevent the X stage 30A from falling over when the upper Z stage 40A is pushed up.

[0097] Moreover, the inspection device 1D according to the fourth embodiment can prevent the needle grinding plate 51 from falling. Moreover, since the upper Z stage 40A supporting the chuck 42 and the upper Z stage 40B supporting the needle grinding plate 51 can be raised and lowered by a single Z drive mechanism 62, the cost of the inspection device 1D can be reduced without providing separate drive mechanisms.

[0098] Although the inspection devices 1, 1A to 1D have been described above, the present disclosure is not limited to the above-described embodiments, and various modifications and improvements are possible within the scope of the gist of the present disclosure described in the claims. [Explanation of symbols]

[0099] 1. Inspection equipment 2. Probe chamber 3 Probe Card 4. Probe 10 Stage Base 15 Opening 20 Y Stage 21 Linear guide 22 Y drive mechanism 23 Detection unit 25 Opening 30X Stage 31 Linear guide 32 X drive mechanism 33 Detection unit 35,36 Guide 40 Upper Z stage (upper module) 42 Chuck (Placement part) 50 Needle grinding plate support stage 51 Needle sharpening board 60 Lower Z stage 61 Guide 62 Z drive mechanism 63 Detection unit 64 Load Cells 71~73 Movable connection mechanism 74 Movable mechanism 75 Movable connection mechanism 80 Control device C Carrier (test subject)

Claims

1. a probe card having a probe that comes into contact with the test object; an upper module having a placement portion on which the test object is placed; a movement mechanism that supports the upper module so as to be able to rise and fall and that is able to move the upper module in a horizontal direction; a lifting mechanism provided below the moving mechanism and capable of lifting up the upper module toward the probe card; a pressing force applied to the upper module by the lifting mechanism and a load applied to the probe card are disposed at a common axis; The moving mechanism includes: a first stage movable in a first direction relative to a base plate; a second stage movable relative to the upper module in a second direction different from the first direction; the upper module is supported on the first stage so as to be capable of ascending and descending; the first stage having an opening; Inspection equipment.

2. Further comprising a connecting mechanism for detachably connecting the upper module and the lifting mechanism.

2. The inspection device according to claim 1.

3. The connecting mechanism connects by magnetic attraction.

3. The inspection device according to claim 2.

4. The connecting mechanism connects by vacuum suction.

3. The inspection device according to claim 2.

5. Further provided with a needle grinding plate support stage for supporting the needle grinding plate, the moving mechanism supports the needle grinding plate support stage so as to be capable of ascending and descending independently of the upper module; The lifting mechanism pushes the needle grinding plate support stage toward the probe card. The inspection device according to any one of claims 1 to 4.

6. a probe card having a probe that comes into contact with the test object; an upper module having a placement portion on which the test object is placed; a movement mechanism that supports the upper module so as to be able to rise and fall and that is able to move the upper module in a horizontal direction; a lifting mechanism provided below the moving mechanism and capable of lifting up the upper module toward the probe card; The moving mechanism includes: a first stage movable in a first direction relative to a base plate; a second stage movable relative to the upper module in a second direction different from the first direction; the upper module is supported on the first stage so as to be capable of ascending and descending; 1. A method for inspecting an inspection apparatus, the method comprising: controlling the moving mechanism to move the object under test; and controlling the lifting mechanism to bring the device under test into contact with the probes, so that a point of application of a pressing force applied when the lifting mechanism lifts up the upper module and a point of application of a load applied to the probe card are coaxially arranged. Inspection method for inspection equipment.

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