Light-emitting display device

Abstract

To improve touch sensitivity in an outer peripheral region of a light emitting display device including touch wiring formed on a protective layer by minimizing a step and bending of an upper surface of the protective layer.SOLUTION: A light emitting display device may include: a substrate 110 including a display area AA and a non-display area NA adjacent to the display area AA; a flattening layer 130 in a first portion P1 of the display area AA and the non-display area NA; a bank layer 220 arranged on the flattening layer 130; a light emitting element layer 200; a first pattern 400; and a second pattern 500 and a dam 600 arranged at a second portion P2 adjacent to the first portion P1 of the non-display area NA and having different heights from each other.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present specification relates to a light emitting display device, and more particularly, to a light emitting display device that controls a flow of a protective layer disposed on a light emitting element layer and improves the sensitivity of a touch wiring formed in an outer region of the light emitting display device. [Background technology]

[0002] 2. Description of the Related Art Modern display devices capable of displaying various information and simultaneously interacting with a user viewing the information require a variety of sizes, shapes and functions.

[0003] Such display devices include liquid crystal display devices (LCDs), electrophoretic display devices (FPDs), light emitting diode display devices (LEDs), and the like.

[0004] Light-emitting displays (LEDs) are self-emitting displays that, unlike liquid crystal displays (LCDs), do not require a separate light source and can be manufactured in a lightweight and thin form. Light-emitting displays are also advantageous in terms of power consumption due to their low voltage operation, and are also excellent in color realization, response speed, viewing angle, and contrast ratio (CR), and are being researched as the next generation of displays.

[0005] When the light emitting display device is an organic light emitting display device, the light emitting device layer may be an organic light emitting device layer including an anode electrode, a light emitting layer, and a cathode. In addition, a quantum dot light-emitting diode (QLED) including quantum dots (QD) may be used as the light emitting device layer. In the following description, the light emitting display device will be described as an organic light emitting display device as an example, but the type of the light emitting device layer is not limited thereto.

[0006] An organic light emitting display displays information on a screen by emitting light from a number of pixels, each of which includes a light emitting element layer having a light emitting layer. Depending on the method of driving the pixels, organic light emitting displays are classified as active matrix type organic light emitting diode displays (AMOLED) or passive matrix type organic light emitting diode displays (PMOLED).

[0007] An active matrix type organic light emitting display (AMOLED) uses thin film transistors (TFTs) to control the current flowing through organic light emitting diodes to display images.

[0008] An active matrix type OLED display may include various thin film transistors, such as a switching thin film transistor (TFT), a driving TFT connected to the switching TFT, and an organic light emitting diode (OLED) connected to the driving TFT.

[0009] Gate electrodes, source electrodes, drain electrodes and semiconductor layers constituting a large number of TFTs for various purposes, as well as a large number of electrode wirings connected thereto, are disposed, and a planarization layer is present on the thin film transistors.

[0010] The light emitting element layer is disposed on the planarization layer. The light emitting element layer may include an anode electrode (eg, an anode) which is a pixel electrode, a light emitting layer, and a cathode electrode (eg, a cathode).

[0011] An OLED display uses an organic material as an emission layer. Electrons and holes are injected into the emission layer made of organic material through two electrodes (e.g., an anode electrode and a cathode electrode). When the electrons and holes meet and recombine in the emission layer, excitons are formed, and light is emitted by the energy from the excitons.

[0012] Electrons and holes are injected through an anode electrode, which is a pixel electrode, and a cathode electrode, which is a common electrode. In order to more smoothly inject electrons and holes, the organic layer may include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer, and may have a multi-layer structure. An organic light emitting display device may be easily deteriorated by external factors such as moisture, oxygen, and ultraviolet rays entering from the outside, while being deteriorated by internal factors such as deterioration of the electrodes and the light emitting layer due to oxygen, and deterioration due to reactions between the light emitting layer and the interface. Therefore, packaging and encapsulation of an organic light emitting display device are very important.

[0013] A protective layer including at least one inorganic layer and at least one organic layer may be formed to protect the light emitting device layer.

[0014] The organic material constituting the protective layer is made of a polymer material, and is applied onto the substrate in a liquid state and then hardened. Since such organic material has fluidity before the hardening process, the liquid polymer constituting the organic material may penetrate into the area where the driving circuit is formed on the outer edge of the substrate, causing driving failure or defects.

[0015] In order to provide users with more diverse and useful functions, touch display devices have been developed using light-emitting display devices, which provide a touch-based input method that allows users to easily and intuitively input information or commands by avoiding conventional input methods such as buttons, keyboards, and mice.

[0016] One method of providing a touch display device is to provide a number of touch wires disposed on a protective layer and detect the presence or absence of a touch and touch coordinates, etc. based on a change in capacitance formed in the number of touch wires formed on a substrate.

[0017] In the outer region of the light emitting display device, a planarization layer, an insulating layer, and a metal wiring disposed under the protective layer may be etched, forming a steep slope and a step, which may result in a restriction that the protective layer is not applied or the thickness is rapidly reduced at the edge of the protective layer, which may result in a reduced touch sensitivity of the touch wiring disposed on the protective layer in the outer region of the light emitting display device.

[0018] Accordingly, various studies have been conducted to control the flow of a protective layer of a light emitting display device and improve the touch sensitivity of the outer region of the light emitting display device, but the results are still insufficient, and there is an urgent need for development in this regard. Summary of the Invention

[0019] An object of the present disclosure is to provide a light emitting display including a first pattern and a second pattern for more efficiently controlling the flow of a second protective layer included in the light emitting display.

[0020] Another problem to be solved by the present specification is to provide an light emitting display device having a thin bezel by controlling the flow of a second protective layer of the light emitting display device and minimizing a design margin of the second protective layer.

[0021] Another object of the present invention is to provide an organic light emitting display device that can improve display quality by increasing the thickness of a protective layer in an outer region to minimize electric field interference between electrodes disposed above and below the protective layer.

[0022] Another object of the present invention is to provide an organic light emitting display device that can improve touch sensitivity in an outer region of the organic light emitting display device including a touch wiring formed on a protective layer by minimizing steps and bends on an upper surface of the protective layer.

[0023] The light emitting display device according to the embodiments of the present specification includes a substrate including a display area and a non-display area adjacent to the display area, a planarization layer in a first portion of the display area and the non-display area, a bank layer disposed on the planarization layer, a light emitting element layer, and a first pattern, and a second pattern and a dam having different heights and disposed in a second portion adjacent to the first portion of the non-display area.

[0024] The problems to be solved by the embodiments of the present specification are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

[0025] Since the light emitting display device according to the embodiments of the present specification comprises a first pattern and a second pattern, the first pattern and the second pattern control the flow of the second protective layer, minimizing overflow of the second protective layer into the area where the driving circuit is formed, thereby improving display quality and stability.

[0026] Since the light emitting display device according to the embodiments of the present specification includes the first pattern and the second pattern, it is possible to minimize the design margin in consideration of the area in which the second protective layer spreads and thus have a thin bezel.

[0027] The light emitting display device according to the embodiments of the present specification is configured with a first pattern and a second pattern, and therefore the thickness of the protective layer disposed in the non-display area NA adjacent to the display area can be increased to effectively block moisture and oxygen entering from the sides of the light emitting display device.

[0028] Since the light emitting display device according to the embodiments of the present specification comprises first and second patterns, the thickness of the protective layer in the non-display area adjacent to the display area can be increased to minimize electric field interference between electrodes disposed above and below the protective layer, thereby improving display quality.

[0029] The light emitting display device according to the embodiments of the present disclosure may minimize steps and bends on the top surface of the protective layer, thereby preventing the touch wiring from leaking, thereby improving touch sensitivity in the outer region of the light emitting display device.

[0030] An light emitting display device according to an embodiment of the present disclosure may include a substrate including a display area and a non-display area surrounding the display area, a planarization layer in the display area, spacers on the planarization layer and in the display area, a first pattern on the planarization layer and in the non-display area, and a second pattern in the non-display area.

[0031] The effects of the present specification are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description. [Brief description of the drawings]

[0032] [Figure 1] FIG. 1 is a plan view of a light-emitting display device according to an embodiment of the present specification. [Diagram 2] FIG. 2 is an enlarged plan view of the outer region of FIG. [Diagram 3] FIG. 2 is a cross-sectional view of a light-emitting display device according to an embodiment of the present specification. [Figure 4] 4 is a microscope photograph of a cross section of a second protective layer in the light emitting display device in which the first pattern and the second pattern in FIG. 3 are formed. [Diagram 5] 1 is a cross-sectional view of a light emitting display device according to another embodiment of the present specification. [Figure 6] 1 is a cross-sectional view of a light emitting display device according to another embodiment of the present specification. [Figure 7] 11 is a plan view of an outer region of a light emitting display device including a touch sensor layer and touch wiring according to another embodiment of the present disclosure. [Figure 8] 11 is a cross-sectional view of an outer region of a light emitting display device including a touch sensor layer and a touch wiring according to another embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033] The advantages and features of the present specification, and the methods for achieving them, will become clear from the detailed description of the embodiments with accompanying drawings. However, the present specification is not limited to the embodiments disclosed below, and may be embodied in various different forms. The embodiments are provided solely to ensure that the disclosure of the present specification is complete and to fully inform those skilled in the art of the present specification of the scope of the invention, and the present specification is only defined by the scope of the claims.

[0034] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of this specification are illustrative, and are not limited to the matters illustrated in the drawings. The same reference numerals refer to the same components throughout the specification. In addition, when describing this specification, if it is determined that a specific description of related known technology may unnecessarily obscure the gist of this specification, the detailed description may be omitted. When the terms "include", "have", "be made", etc. mentioned in this specification are used, other parts may be added since "only" is not used. When a component is expressed in the singular, it may include a plural unless otherwise expressly stated.

[0035] When interpreting elements, they are to be interpreted as including an error range even if there is no separate explicit description of the error range.

[0036] When describing a positional relationship, for example when the positional relationship of two parts is described using terms such as "above," "upper," "lower," "next to," etc., one or more other parts may be located between the two parts, unless, for example, "immediately" or "directly" is used.

[0037] When describing a temporal relationship, when the temporal precedence / subsequence relationship is described using the terms "after," "following," "next," "before," etc., it is possible to include cases where things are not consecutive, since the words "immediately" or "directly" are not used.

[0038] Although the terms "first", "second" and the like are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, the first component referred to below may be the second component within the technical concept of this specification.

[0039] In describing components in this specification, terms such as first, second, A, B, (a), (b), etc. may be used. Such terms are merely intended to distinguish the components from other components, and do not limit the nature, order, sequence, number, etc. of the components. When a component is described as being "coupled," "connected," or "connected" to another component, it should be understood that the component may be directly connected or connected to the other component, but that other components may be "intervened" between each component that may be indirectly connected or connected without any particular explicit description.

[0040] "At least one" should be understood to include all combinations of one or more of the associated components. For example, the meaning of "at least one of a first, second, and third component" includes all combinations of two or more of the first, second, and third components, and not just the first, second, or third component.

[0041] In this specification, the term "apparatus" may include a display device such as a liquid crystal module (LCM) including a display panel and a driver for driving the display panel, an organic light emitting display module (OLED module), etc. It may also include a set electronic apparatus or set device or set apparatus such as a notebook computer, a television, a computer monitor, an automotive apparatus or other form of a vehicle, etc., which is a complete product or final product including an LCM, an OLED module, etc., and a mobile electronic apparatus such as a smartphone or an electronic pad.

[0042] Therefore, the device in this specification can include a display device itself such as an LCM, an OLED module, etc., and a set device which is an application product or a final consumer device including an LCM, an OLED module, etc.

[0043] In some embodiments, an LCM or OLED module including a display panel and a driver may be referred to as a "display device," and an electronic device including the LCM or OLED module as a completed product may be referred to as a "set device." For example, the display device may include a liquid crystal (LCD) or organic light emitting diode (OLED) display panel and a source PCB serving as a controller for driving the display panel. The set device may further include a set PCB serving as a set controller electrically connected to the source PCB and driving the entire set device.

[0044] The display panel used in the embodiments of the present specification may be any type of display panel such as a liquid crystal display panel, an organic light emitting diode (OLED) display panel, and an electroluminescent display panel, and the embodiments are not limited thereto. For example, the display panel may be a display panel that can generate sound by vibrating with a vibration device according to the embodiments of the present specification. The display panel applied to the display device according to the embodiments of the present specification is not limited to the shape or size of the display panel.

[0045] The features of the various embodiments of this specification may be combined or combined with each other, either partially or in whole, and may be technically interlocked and driven in various ways, and each embodiment may be implemented independently of each other or may be implemented together in a related relationship.

[0046] The following is a description of the embodiments of the present specification with reference to the accompanying drawings and examples: The scales of the components shown in the drawings are different from the actual scales for the convenience of explanation, and are not limited to the scales shown in the drawings.

[0047] Hereinafter, various embodiments of the present specification will be described in detail with reference to the accompanying drawings. All components of each light emitting display device according to all embodiments of the present specification are operatively coupled and configured.

[0048] Fig. 1 is a plan view of a light emitting display device according to an embodiment of the present specification, and Fig. 2 is an enlarged plan view of an outer region of Fig. 1.

[0049] 1 and 2, the light emitting display device 100 according to the embodiment of the present specification includes a substrate 110, a first pattern 400, a second pattern 500, and a dam 600 in a non-display area NA. It should be understood that the light emitting display device 100 also includes other elements including a plurality of gate wirings, a plurality of data wirings, and a plurality of thin film transistors (TFTs) connected to a plurality of pixels and / or a plurality of sub-pixels SP that can enable the light emitting display device 100 to operate properly.

[0050] Therefore, the light emitting display device 100 may include various additional elements for generating various signals or driving a plurality of sub-pixels SP in the display area AA. For example, one or more driving circuits for controlling a display panel may be included in the light emitting display device 100. The driving circuits for controlling (or driving) the sub-pixels SP may include a gate driver, a data signal line, a multiplexer MUX, an electrostatic discharge (ESD) circuit, a high potential voltage line VDD, a low potential voltage line VSS, an inverter circuit, and the like. The light emitting display device 100 may also include additional elements other than a function for driving each sub-pixel SP. For example, the light emitting display device 100 may include additional elements providing a touch sensing function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure sensing function, a tactile feedback function, and the like. The aforementioned additional elements may be located in the non-display area NA or an external circuit connected to the connection interface.

[0051] The substrate 110 may include an active area AA and a non-active area NA. The non-active area NA of the substrate may be adjacent to the display area AA and disposed outside the display area AA.

[0052] The outer region A may be an edge region of the substrate 110. For example, it may include an end (or one side) of the display area AA and the non-display area NA.

[0053] The display area AA is an area in which a plurality of sub-pixels SP are arranged to display an image. Each of the sub-pixels SP is an individual unit that emits light, and the sub-pixels SP may include, but are not limited to, red sub-pixels SP, green sub-pixels SP, blue sub-pixels SP, and / or white sub-pixels SP.

[0054] Each of the sub-pixels SP includes an organic light emitting diode and a driving circuit. For example, the sub-pixels SP may include a display element for displaying an image and a driving circuit for driving (or controlling) the display element.

[0055] One subpixel SP may include a plurality of transistors, a capacitor, and a plurality of wirings. For example, the subpixel SP may be formed of two transistors and one capacitor (2T1C), but is not limited thereto, and may be embodied as a subpixel applying 3T1C, 4T1C, 5T1C, 6T1C, 7T1C, 3T2C, 4T2C, 5T2C, 6T2C, 7T2C, 8T2C, etc.

[0056] The non-display area NA is an area where an image is not displayed, and is an area where various wirings, driving circuits, etc. for driving a plurality of sub-pixels SP arranged in the display area AA are arranged. For example, various ICs and driving circuits, etc., such as a gate driver and a data driver, may be arranged in the non-display area NA. The non-display area NA where an image is not displayed may be an area where an image is not displayed. For example, the non-display area NA may be a bezel area, and is not limited to the term.

[0057] The non-display area NA may be an area surrounding the display area AA as shown in Fig. 1. The non-display area NA may be an area extending from the display area AA. Alternatively, the non-display area NA may be an area in which the sub-pixels SP are not arranged, and is not limited thereto.

[0058] The display area AA may be referred to as a display area, and the non-display area NA may also be referred to or expressed as a bezel area or simply a bezel, without being limited to the terminology.

[0059] In FIG. 1, the non-display area NA is shown surrounding the rectangular display area AA, but the shape of the display area AA and the shape and arrangement of the non-display area NA adjacent to the display area AA are not limited to the example shown in FIG. 1. The display area AA and the non-display area NA may have a shape suitable for the design of an electronic device equipped with the light emitting display device 100. In the case of a display device of a wearable device, the display area AA may have a circular shape like a general wristwatch, and the concept of the embodiment of the present specification may also be applied to a free-form display device applicable to a meter panel of a vehicle, etc. Exemplary shapes of the display area AA may be, but are not limited to, a pentagon, a hexagon, an octagon, a circle, an ellipse, etc.

[0060] A bending area BA may be provided in a portion of the non-display area NA. The bending area BA may be provided between the display area AA and a pad unit 114 located in the non-display area NA. The bending area BA may be an area in which a connecting wiring unit is formed.

[0061] The bending area BA may be an area where a part of the substrate 110 is bent (bent) in order to arrange the pad unit 114 and the external module bonded to the pad unit 114 on the rear side of the substrate 110. For example, the bending area BA may be bent toward the rear side of the substrate 110, so that the external module bonded to the pad unit 114 of the substrate 110 moves to the rear side of the substrate 110, and the external module may not be visible when viewed from above the substrate 110. In addition, the bending area BA may reduce the size of the non-display area NA visible from the upper part of the substrate 110, so that a narrow bezel may be implemented. In the present specification, the bending area BA is described as being present in the non-display area NA, but is not limited thereto. For example, the bending area BA may be located in the display area AA, and the display area AA itself may be bent in various directions, and the bending area BA located in the display area AA may also have the effects mentioned in the present specification.

[0062] A pad unit 114 may be disposed on one side of the non-display area NA. The pad unit 114 is a metal pattern to which an external module, for example, a flexible printed circuit board (FPCB) and a chip on film (COF), etc. is bonded. Although the pad unit 114 has been described as being disposed on one side of the substrate 110, the shape and arrangement of the pad unit 114 are not limited thereto.

[0063] A gate driver 112 that provides gate signals to the thin film transistors may be disposed on the other side of the non-display area NA. The gate driver 112 includes various gate driving circuits, and the gate driving circuits may be directly formed on the substrate 110. In this case, the gate driver 112 may be a GIP (Gate-In-Panel).

[0064] The gate driver 112 may be disposed between the display area of ​​the substrate 110 and a first pattern 400 disposed in the non-display area NA. Alternatively, the gate driver 112 may be disposed between the display area AA of the substrate 110 and a second pattern 500 disposed in the non-display area NA. Alternatively, the gate driver 112 may be disposed between the display area AA of the substrate 110 and a dam 600 disposed in the non-display area NA.

[0065] A high potential voltage line VDD, a low potential voltage line VSS, a multiplexer MUX, an electrostatic discharge circuit ESD, and a plurality of connecting lines may be arranged between the display area AA and the pad unit 114 of the non-display area NA.

[0066] A high potential voltage line VDD, a low potential voltage line VSS, a multiplexer MUX, and an electrostatic discharge circuit unit ESD may be disposed between the display area AA and the bending area BA.

[0067] The connecting wiring unit may be disposed in the non-display area NA. For example, it may be disposed in a bending area BA in the non-display area NA where the substrate is bent. The connecting wiring unit may be configured to transmit a signal (voltage) from an external module bonded to the pad unit 114 to a circuit unit such as the display area AA or the gate driver 112. For example, various signals such as various signals for driving the gate driver 112, data signals, high potential voltages, and low potential voltages may be transmitted through the connecting wiring unit.

[0068] Along the display area AA, the non-display area NA may include a first pattern 400, a second pattern 500, and a dam 600. The first pattern 400, the second pattern 500, and the dam 600 may be disposed along the periphery of the display area AA to control the flow of the second protective layer 320 among the protective layers disposed on the light emitting element layer.

[0069] The first pattern 400, the second pattern 500, and the dam 600 may be disposed between the display area AA and the pad portion 114. The first pattern 400, the second pattern 500, and the dam 600 may be disposed between the display area AA and the bending area BA.

[0070] The first pattern 400, the second pattern 500, and the dam 600 may be disposed between the display area AA and a high potential voltage line VDD, a low potential voltage line VSS, a multiplexer MUX, or an electrostatic discharge circuit unit ESD.

[0071] The material constituting the second protective layer 320 is an organic material (polymer), which is applied in a liquid form onto the substrate 110 and then undergoes a curing process. The organic material has low viscosity and can be in a dense liquid state before being cured. Therefore, since the organic material has fluidity before being cured, it flows into the area where the driving circuits are formed in the non-display area NA of the light emitting display device 100. If the organic material enters the area where the driving circuits are formed, restrictions that induce driving failures or lighting inspection failures occur.

[0072] Therefore, the first pattern 400, the second pattern 500, and the dam 600 may be arranged adjacent to the display area AA along the periphery of the display area AA.

[0073] Therefore, before the second protective layer 320 is hardened, the second protective layer 320 is prevented from overflowing into the area where the driving circuit is formed beyond the first pattern 400, the second pattern 500, and the dam 600, thereby preventing the constraint of driving defects and improving display quality and stability.

[0074] Referring to FIG. 3 described later, the substrate 110 may further include a crack detection wiring 800 in a portion of the non-display area NA.

[0075] The crack sensing wiring 800 may be disposed between an end point (or terminal end) of the substrate 110 and the dam 600. Alternatively, the crack sensing wiring 800 may be disposed below the dam 600 and at least a portion may overlap the dam.

[0076] In order to realize a thin and flexible light emitting display device 100, a flexible substrate made of a plastic material, for example, polyimide, may be used.

[0077] A substrate made of polyimide has advantages such as low hardness and flexibility, but cracks may easily occur. For example, when a laser trimming process is performed to separate the substrate 110 from the support substrate after the manufacturing process of the light emitting display panel is completed, a crack may easily occur in a support substrate made of glass, or when an external impact occurs. A crack that occurs in the substrate 110 or the light emitting display device 100 may become larger as time passes. A crack that occurs in a specific region of the substrate 110 or the light emitting display device 100 may become a point where stress is concentrated when a force is applied from the outside. As the stress is concentrated in the crack, the crack may further extend from the non-display area NA to the display area AA. External oxygen or moisture may penetrate through the crack. The penetration of oxygen or moisture may oxidize the light emitting element in the display area AA. The oxidation of the light emitting element may cause a dark spot or pixel shrinkage to occur in the sub-pixel SP. In order to prevent the sub-pixels SP from becoming black spots or shrinking, it is necessary to control the cracks as a major quality factor. Therefore, a crack detection line 800 may be further disposed in a part of the non-display area NA to check whether a crack has occurred in the light emitting display device 100.

[0078] Referring to FIG. 2, the non-display area NA may include a first portion P1 and a second portion P2.

[0079] The first portion P1 of the non-display area NA may be a region surrounding the display area AA. The first portion P1 of the non-display area NA may be a portion of the non-display area NA adjacent to the display area AA. The first portion P1 of the non-display area NA may be a region disposed between the display area AA and the second portion P2 of the non-display area NA. The first portion P1 of the non-display area NA may be a region in which the planarization layer 130 is disposed in the non-display area NA.

[0080] The second portion P2 of the non-display area NA may be a region surrounding the first portion P1 of the non-display area NA. The second portion P2 of the non-display area NA may be disposed adjacent to the first portion P1 of the non-display area NA and surrounding the first portion P1 of the non-display area NA. The second portion P2 of the non-display area NA may be a region in the non-display area NA where the planarization layer 130 is removed by etching the planarization layer 130.

[0081] The first portion P1 of the non-display area NA may be formed extending from the planarization layer 130 disposed in the display area AA. The second portion P2 of the non-display area NA may include from an end point (or one side) of the planarization layer 130 to an end (or one side) of the light-emitting display device. The second portion P2 may be disposed outside the first portion P1 and may surround the first portion P1 of the non-display area as well as the display area AA. The boundary between the first portion P1 and the second portion P2 may be defined, for example, by defining the boundary as a location where the planarization layer 130 is no longer present in the non-display area NA.

[0082] The first pattern 400 may be disposed in a first portion P1 of the non-display area NA. The first pattern 400 may be disposed between the display area AA and a second pattern 500 disposed in a second portion P2 of the non-display area NA.

[0083] The second pattern 500 may be disposed in the second portion P2 of the non-display area NA. The second pattern 500 may be disposed along the periphery of the first pattern 400 and between the first pattern 400 and the dam 600.

[0084] The dam 600 may be disposed along the periphery of the second pattern 500. The dam 600 may be disposed adjacent to the second pattern 500 and outside of the first pattern 400 and the second pattern 500.

[0085] At least one of each of the first pattern 400, the second pattern 500, and the dam 600 may be provided. Although one is shown in the drawings, the present invention is not limited thereto, and a plurality of each of the first pattern 400, the second pattern 500, and the dam 600 may be provided.

[0086] 3 is a cross-sectional view of a light emitting display device according to an embodiment of the present specification, taken along line II' in FIG.

[0087] 3, a light emitting display device 100 according to an embodiment of the present disclosure includes a substrate 110, a planarization layer 130, a light emitting device layer 200, a first pattern 400, a second pattern 500, and a dam 600. In the embodiment of the present disclosure, as shown in FIG.

[0088] The substrate 110 can support various components of the light emitting display device 100. The substrate 110 can be made of glass or a plastic material having flexibility, although other materials may also be used.

[0089] For example, the substrate 110 may be made of at least one of polyimide, polyethersulfone, polyethylene terephthalate, and polycarbonate, but is not limited thereto.

[0090] When the substrate 110 is made of a plastic material, for example, when the substrate 110 is made of polyimide, the manufacturing process of the light emitting display device is performed in a state where a supporting substrate made of glass is disposed under the substrate 110, and after the manufacturing process of the light emitting display device 100 is completed, the supporting substrate may be released or laser trimmed. In addition, after the supporting substrate is released, a back plate for supporting the substrate 110 may be disposed under the substrate 110.

[0091] When the substrate 110 is made of polyimide, moisture may penetrate the substrate 110 made of polyimide and may progress to the thin film transistor or light emitting element layer, thereby degrading the performance of the light emitting display device. The display device according to the embodiment of the present specification may be made of two polyimides to prevent the performance of the display device from degrading due to moisture penetration. In addition, by forming an inorganic film between the two polyimides, moisture may be prevented from penetrating the lower polyimide, thereby improving the reliability of product performance. The inorganic film may be a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or a multi-layer thereof, but is not limited thereto. Other inorganic materials may be used for the inorganic layer.

[0092] The substrate 110 may include elements and functional layers formed on the substrate 110, such as, but not limited to, a switching element, a driving element (or thin film transistor) connected to the switching element, an organic light-emitting element connected to the driving element (or thin film transistor), a protective layer, etc.

[0093] The buffer layer 111 may be disposed on the entire surface of the substrate 110. The buffer layer 111 may improve adhesion between the substrate 110 and a layer formed on the buffer layer 111, and may serve to block various types of defects such as alkaline components flowing out of the substrate 110. In addition, the buffer layer 111 may delay the diffusion of moisture or oxygen that has penetrated into the substrate 110.

[0094] The buffer layer 111 can be a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or multiple layers thereof. When the buffer layer 111 is multiple layers, silicon oxide (SiOx) and silicon nitride (SiNx) can be formed alternately. Other inorganic materials can also be used for the buffer layer 111.

[0095] The buffer layer 111 may be omitted depending on the type and material of the substrate 110, the structure and type of the thin film transistor 120, and so on.

[0096] In the light emitting display device 100 according to the embodiment of the present specification, a thin film transistor 120 may be disposed on the buffer layer 111. The thin film transistor 120 may include a semiconductor pattern 121, a gate electrode 123, a source electrode 125S, and a drain electrode 125D.

[0097] The drain electrode 125D is electrically connected to the light emitting device layer 200 to transmit a current or a signal to the light emitting device layer 200. In addition, a connecting electrode 140 may be further disposed between the drain electrode 125D and the light emitting device layer 200, and a current and a signal of the thin film transistor may be transmitted to the light emitting device layer 200 through the connecting electrode 140.

[0098] For ease of explanation, only a driving thin film transistor has been shown among various thin film transistors that may be included in the light emitting display device 100, but other thin film transistors such as a switching thin film transistor may also be included in the light emitting display device 100. In addition, for ease of explanation, the thin film transistor 120 has been described as having a top gate structure, but the thin film transistor 120 is not limited to this structure and may be embodied in other structures such as a bottom gate structure.

[0099] A semiconductor pattern 121 may be disposed on the buffer layer 111. The semiconductor pattern 121 may be made of a polycrystalline semiconductor. For example, the polycrystalline semiconductor may be formed of, but is not limited to, low temperature polysilicon (LTPS) having high mobility. When the semiconductor pattern 121 is made of a polycrystalline semiconductor, it has low energy consumption and excellent reliability.

[0100] Also, the semiconductor pattern 121 may be made of an oxide semiconductor, for example, any one of IGZO (indium-gallium-zinc-oxide), IZO (indium-zinc-oxide), IGTO (indium-gallium-tin-oxide), and IGO (indium-gallium-oxide), but is not limited thereto. When the semiconductor pattern 121 is made of an oxide semiconductor, it has an excellent effect of blocking leakage current, and therefore, it is possible to minimize a luminance change of the sub-pixel during low-speed driving.

[0101] When the semiconductor pattern 121 is made of a polycrystalline semiconductor or an oxide semiconductor, a portion of the semiconductor pattern 121 may be doped with impurities.

[0102] The semiconductor pattern 121 may also be made of amorphous silicon (a-Si) or various organic semiconductor materials such as pentacene, but is not limited thereto. Other materials may also be used for the semiconductor pattern 121.

[0103] A first insulating layer 122 may be disposed on the semiconductor pattern 121. The first insulating layer 122 may insulate the semiconductor pattern 121 and the gate electrode 123 from each other.

[0104] The first insulating layer 122 may be formed of an insulating inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), or may be formed of an insulating organic material, but is not limited thereto.

[0105] The first insulating layer 122 may have holes for electrically connecting the source electrode 125S and the drain electrode 125D to the semiconductor pattern 121, respectively.

[0106] A gate electrode 123 may be disposed on the first insulating layer 122. The gate electrode 123 may be disposed to overlap the semiconductor pattern 121.

[0107] The gate electrode 123 may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), and tungsten (W), or an alloy thereof, but is not limited thereto.

[0108] A second insulating layer 124 may be disposed on the gate electrode 123 .

[0109] The second insulating layer 124 may be formed of an insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), or may be formed of an insulating organic material, but is not limited thereto.

[0110] The second insulating layer 124 may have holes for electrically connecting the source electrode 125S and the drain electrode 125D to the semiconductor pattern 121, respectively.

[0111] A source electrode 125S and a drain electrode 125D may be disposed on the second insulating layer 124.

[0112] The source electrode 125S and the drain electrode 125D may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), and neodymium (Nd), or an alloy thereof, but is not limited thereto.

[0113] For example, the source electrode 125S and the drain electrode 125D may have a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) made of conductive metal materials, but is not limited thereto.

[0114] The source electrode 125S and the drain electrode 125D are electrically connected to the semiconductor pattern 121 through holes in the first insulating layer 122 and the second insulating layer 124 .

[0115] A protective layer 126 may be disposed on the thin film transistor 120. The protective layer 126 may be disposed in a portion of the display area AA and the non-display area NA.

[0116] The protective layer 126 can protect the thin film transistor 120. The protective layer 126 can be formed of an insulating inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), or can be formed of an insulating organic material, but is not limited thereto.

[0117] The protective layer 126 may have holes for electrically connecting the thin film transistor 120 to the connecting electrode 140 or the light emitting element layer 200. The protective layer 126 is not necessarily a necessary component and may be omitted depending on the design of the light emitting display device 100.

[0118] A planarization layer 130 may be disposed on the protective layer 126. The planarization layer 130 may be disposed to cover the thin film transistor 120.

[0119] The planarization layer 130 can protect the thin film transistor 120 disposed thereunder, and can reduce or planarize steps or elevation changes due to various patterns.

[0120] The planarization layer 130 may be formed of at least one of organic insulating materials such as, but not limited to, BCB (BenzoCycloButene), acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. The planarization layer 130 may be disposed in a single layer, or in two or more layers in consideration of various electrode arrangements.

[0121] This is because various signal wirings have increased as the light emitting display device 100 has evolved to a higher resolution. Therefore, it is difficult to arrange all the wirings on one layer while ensuring the minimum spacing, and an additional layer must be created. Such an additional layer provides more room for wiring arrangement, making it easier to design the arrangement of electric wires / electrodes. In addition, if a dielectric material is used as the multi-layered planarization layer, the planarization layer 130 can be used to form capacitance between metal layers.

[0122] When the planarization layer 130 is arranged as multiple layers, the planarization layer 130 may include a first planarization layer 131 and a second planarization layer 132. However, without being limited thereto, the planarization layer 130 may include additional layers.

[0123] A connecting electrode 140 may be disposed between the first planarization layer 131 and the second planarization layer 132 .

[0124] A hole may be formed in the first planarization layer 131 and a connecting electrode 140 may be disposed in the hole, so that the thin film transistor 120 and the light emitting device layer 200 may be electrically connected to each other through the connecting electrode 140 .

[0125] For example, one end (or a portion) of the connecting electrode 140 may be connected to the thin film transistor 120 , and the other end (or another portion) of the connecting electrode 140 may be connected to the light emitting element layer 200 .

[0126] The planarization layer 130 may be disposed in a portion of the display area AA and the non-display area NA. For example, the planarization layer 130 may extend from the display area to a first portion P1 of the non-display area.

[0127] In the non-display area NA, the planarization layer 130 may be etched to form a step or height difference.

[0128] A portion of the planarization layer 130 in the non-display area NA that has not been removed by the etching process may be defined as a first portion P1, and a portion of the planarization layer 130 in the non-display area NA that has been removed by the etching process may be defined as a second portion P2.

[0129] A light emitting element layer 200 may be disposed on the planarization layer 130. The light emitting element layer 200 may include an anode electrode 210, a light emitting layer 230, and a cathode electrode 240.

[0130] The light emitting element layer 200 may be formed by sequentially disposing an anode electrode 210, a light emitting layer 230, and a cathode electrode 240 on the planarization layer 130 in this order.

[0131] An anode electrode 210 may be disposed on the planarization layer 130 .

[0132] The anode electrode 210 may be electrically connected to the drain electrode 125D through a hole in the planarization layer 130. Alternatively, when the light emitting display device 100 further includes a connecting electrode 140, the anode electrode 210 may be electrically connected to the drain electrode 125D through the connecting electrode 140.

[0133] The anode electrode 210 supplies holes to the light emitting layer 230 and may be made of a conductive material with a high work function.

[0134] When the light emitting display device 100 is a top emission type, the anode electrode 210 may be disposed using an opaque conductive material as a reflective electrode that reflects light. The anode electrode 210 may be formed of at least one of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof. For example, the anode electrode 210 may have a three-layer structure of silver (Ag) / lead (Pd) / copper (Cu), but is not limited thereto.

[0135] When the light emitting display device 100 is a bottom emission type, the anode electrode 210 may be disposed using a transparent conductive material that transmits light. For example, the anode electrode 210 may be formed of at least one of indium tin oxide (ITO) and indium zinc oxide (IZO). The anode electrode 210 may be formed of other materials including metals and non-metals.

[0136] A bank layer 220 may be disposed on the planarization layer 130 or the anode electrode 210 in the display area AA and the non-display area NA.

[0137] The bank layer 220 can separate a plurality of sub-pixels SP, minimize light spreading or glare, and prevent color mixing that occurs at various viewing angles.

[0138] A bank layer 220 may be disposed on the planarization layer 130 or the anode electrode 210 in the remaining region of the light-emitting element layer 200 excluding the light-emitting region of the anode electrode 210. The bank layer 220 may have a bank hole exposing a part of the anode electrode 210 corresponding to the light-emitting region.

[0139] The bank layer 220 may be made of at least one of inorganic insulating materials such as silicon nitride (SiNx) or silicon oxide (SiOx) or organic insulating materials such as BCB (BenzoCycloButene), acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin, but is not limited thereto.

[0140] A spacer 250 may be further disposed on the bank layer 220. The spacer 250 may buffer a space between the substrate 110 on which the light emitting device layer 200 is formed and the upper substrate, thereby minimizing damage to the light emitting display device 100 due to an external impact. The spacer 250 may be formed of the same material as the bank layer 220 and may be formed simultaneously with the bank layer 220, but is not limited thereto.

[0141] The first pattern 400, the second pattern 500, and the dam 600 may be disposed in the non-display area NA of the light emitting display device 100. The first pattern 400, the second pattern 500, and the dam 600 may prevent restrictions such as driving failure caused by the second protective layer 320 of the protective layer 300 entering an area in which a driving circuit of the non-display area NA is formed. Among the first pattern 400, the second pattern 500, and the dam 600, at least the first pattern 400 may be on the planarization layer 130, and may be disposed on the bank layer 220, which may be the same layer as the layer in which the spacer 250 is disposed. However, this is not necessarily required, and the first pattern 400 may be disposed on a layer different from the spacer 250, as long as at least the first pattern 400 can be located in the non-display area NA and on or above the planarization layer 130.

[0142] The first pattern 400, the second pattern 500, and the dam 600 may be formed in at least one number. In order to prevent the second protective layer 320 from overflowing onto the driving element and minimize the design margin of the second protective layer to have a thin bezel, at least one first pattern 400 and at least one second pattern 500 are provided, and the number of the first patterns 400 and the second patterns 500 may be at least two, and the number of the dams 600 may be at least one.

[0143] The material constituting the second protective layer 320 is an organic material (polymer), which is applied in a liquid form onto the substrate 110 and then is formed through a curing process. The organic material has low viscosity and can be in a dense liquid state before being cured. Therefore, since the organic material has fluidity before being cured, it flows into the area where the driving circuit is formed in the non-display area of ​​the light emitting display device 100. If the organic material enters the area where the driving circuit is formed, a restriction that induces a driving failure or a lighting inspection failure occurs.

[0144] Therefore, the inventors of the present specification conducted various experiments to reduce the flow of organic materials before hardening the second protective layer 320. Through various experiments, the inventors invented a light emitting display device 100 that can minimize the flow of organic materials in the second protective layer 320 of the light emitting display device and minimize driving defects caused by the second protective layer 320 intruding into an area in the non-display area NA where a driving circuit is formed.

[0145] The first pattern 400, the second pattern 500, and the dam 600 can control the flow of the organic material in the second protective layer 320, where the flow of the organic material in the second protective layer 320 is primarily controlled by the first pattern 400 adjacent to the display area AA, and if the organic material crosses the first pattern 400, the flow of the organic material can be secondarily controlled by the second pattern 500. The second pattern 500 prevents the organic material from crossing the dam 600.

[0146] A dam 600 that is taller than the second pattern 500 is disposed around the outer periphery of the second pattern 500 to confine the organic material within the dam 600, and the tertiary dam 600 can prevent the organic material of the second protective layer 320 from spreading (or flowing) to the driving circuit in the non-display area.

[0147] The first pattern 400 may be disposed along the periphery of the display area AA. For example, the first pattern 400 may be disposed adjacent to and surrounding the display area AA.

[0148] The first pattern 400 may be disposed in the first portion P1 of the non-display area NA. For example, the first pattern 400 may be disposed on the planarization layer 130 formed in the non-display area NA and extending from the display area AA.

[0149] Since the first pattern 400 is disposed on the planarization layer 130 of the first portion P1, it is positioned higher than the second pattern 500 and the dam 600 and is formed closer to the display area AA, so that the flow of the organic material can be more efficiently controlled before the second protective layer 320 is cured first.

[0150] Since the first pattern 400 is disposed on the planarization layer 130, the organic material of the second protective layer 320 is prevented from flowing into the first pattern 400 disposed in the non-display area NA adjacent to the display area AA, and the thickness of the second protective layer 320 may increase after curing. The protective layer 300 with an increased overall thickness may effectively block moisture and oxygen entering from the sides of the light emitting display device 100.

[0151] The first pattern 400 may surround the periphery of the display area AA and be disposed in a first portion P1 of the non-display area NA. The first pattern 400 may be disposed at least partially separated from the display area AA.

[0152] The first pattern 400 may be structured in multiple layers using at least one material. The first pattern 400 may be formed of the same material as the spacer 250 in the display area AA, and may be formed simultaneously with the spacer 250, but the material and forming operation are not limited thereto.

[0153] The second pattern 500 may be disposed in the second portion P2 of the non-display area NA so as to provide an enclosure around the periphery of the first pattern 400 of the non-display area NA. The second pattern 500 may be disposed at least partially separated from the first pattern 400.

[0154] The second pattern 500 blocks the flow of the organic material spreading (or flowing) from the first pattern 400, thereby reducing the movement speed of the organic material.

[0155] The second pattern 500 may be arranged in multiple layers using at least one material. The second pattern 500 may be formed of the same material as the spacer 250 in the display area AA and may be formed simultaneously with the spacer 250, but is not limited thereto.

[0156] Even though the dam 600 was disposed in the second portion P2 of the non-display area NA, the height and slope of the steps formed by etching the multiple planarization layers, insulating layers, and metal wiring in the non-display area NA, and the elevation differences caused by etching the multiple planarization layers, insulating layers, and metal wiring in the non-display area NA, increased the migration speed of the organic material in the second protective layer 320, restricting it from spreading (or flowing) into the driving circuit in the non-display area NA before the second protective layer 320 was hardened.

[0157] However, by disposing the second pattern 500 in the second portion P2 of the non-display area NA, for example, between the first pattern 400 and the dam 600, it is possible to prevent or reduce the flow of the organic material of the second protective layer 320. Therefore, the second pattern 500 reduces the speed at which the organic material of the second protective layer 320 spreads (or flows), thereby controlling the distance at which the second protective layer 320 spreads (or flows). Therefore, it is possible to prevent restrictions such as driving defects caused by the second protective layer 320 entering the non-display area NA.

[0158] In addition, the design margin of the second protective layer 320 can be minimized by minimizing the spreading (or flowing) distance of the second protective layer 320, thereby providing a light emitting display device having a thin bezel and improved reliability.

[0159] The dam 600 may be disposed in the second portion P2 of the non-display area NA so as to surround the periphery of the second pattern 500. The dam 600 may be disposed at least partially separated from the second pattern 500.

[0160] For example, the dam 600 may be disposed on the second portion P2, which is an area where the planarization layer 130 in the non-display area NA has been etched away. At least one or more dams 600 may be disposed. Although one dam 600 is shown in the drawings, the number of dams 600 does not need to be limited to one.

[0161] The dam 600 may be provided as a single layer or multiple layers using at least one or more materials.

[0162] The dam 600 may be disposed in one or more layers using one or more materials, for example, one or more of the materials used to dispose the planarization layer 130, the bank layer 220, and the spacers 250.

[0163] Alternatively or additionally, the dam 600 may be formed in multiple layers by sequentially stacking the planarization layer 130, bank layer 220, and spacer 250 arranged in the display area AA in the non-display area NA during formation, but is not limited to this.

[0164] The dam 600 may also include the same material as the anode electrode 210 disposed in the display area AA.

[0165] An emission layer 230 may be disposed on the anode electrode 210. The emission layer 230 may be a layer made of an organic material for emitting a specific color. For example, the emission layer 230 may be made of at least one of a red organic emission layer, a green organic emission layer, a blue organic emission layer, and a white organic emission layer. When the emission layer 230 is made of a white organic emission layer, a color filter may be further disposed on the light emitting element layer 200 to emit a specific color.

[0166] In addition to the light-emitting layer 230, the layer may include, but is not limited to, a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer, and additional or different layers may be included.

[0167] A cathode electrode 240 may be disposed on the light-emitting layer 230. The cathode electrode 240 supplies electrons to the light-emitting layer 230 and may be made of a conductive material, such as a conductive layer that may have a low work function.

[0168] When the light emitting display device 100 is a top emission type, the cathode electrode 240 may be disposed using a transparent conductive material that transmits light. For example, the cathode electrode 240 may be formed of at least one of indium tin oxide (ITO) and indium zinc oxide (IZO), but is not limited thereto, and various other transparent conductive materials may be used.

[0169] The cathode electrode 240 may be disposed using a semi-transparent conductive material that transmits light. For example, the cathode electrode 240 may be formed of at least one of alloys such as LiF / Al, CsF / Al, Mg:Ag, Ca / Ag, Ca:Ag, LiF / Mg:Ag, LiF / Ca / Ag, and LiF / Ca:Ag. Other alloys or compounds may be used for the cathode electrode 240 as well.

[0170] When the light emitting display device 100 is a bottom emission type, the cathode electrode 240 may be disposed using an opaque conductive material as a reflective electrode that reflects light. For example, the cathode electrode 240 may be formed of at least one of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof. Other metal materials may also be used.

[0171] A protective layer 300 may be disposed on the light emitting element layer 200. The protective layer 300 may be disposed in the display area AA and the non-display area NA of the light emitting display device 100.

[0172] The protective layer 300 prevents the penetration of oxygen and moisture from the outside to prevent oxidation of the luminescent material and the electrode material. The protective layer 300 may include a first protective layer 310, a second protective layer 320, and a third protective layer 330 that block the penetration of moisture and oxygen.

[0173] The first protective layer 310, the second protective layer 320, and the third protective layer 330 may have an alternately laminated structure. The protective layer 300 may be made of a transparent material so that light emitted from the light emitting layer 230 can be transmitted therethrough.

[0174] The first protective layer 310 and the third protective layer 330 may be additionally formed on the outer periphery of the dam 600 disposed in the non-display area NA. For example, the first protective layer 310 and the third protective layer 330 may be disposed between the dam 600 and an end (or one side) of the substrate 110.

[0175] The second protective layer 320 may be formed inside the dam 600 disposed in the non-display area NA. For example, the second protective layer 320 may be disposed between the dam 600 and the display area AA. Alternatively or additionally, the second protective layer 320 may be disposed between the dam 600 and the second pattern 500. Thus, the second protective layer 320 may be disposed in the display area AA, the second portion P2 of the non-display area NA, or both. Also, the protective layer 300 inside the first pattern and the protective layer outside the first pattern may have an elevation difference, and the difference in thickness of the second protective layer 320 between the first portion P1 and the second portion P2 of the non-display area NA may be the main cause of the elevation difference. Meanwhile, the thickness of the second protective layer 320 may change as it extends outward from the display area AA to the non-display area NA. However, the second protective layer 320 may not be disposed outside the dam 600.

[0176] The first protective layer 310 and the third protective layer 330 may be made of at least one inorganic material selected from the group consisting of silicon nitride (SiNx), silicon oxide (SiOx) and aluminum oxide (AlyOz). The first protective layer 310 and the third protective layer 330 may be formed using a vacuum deposition method such as chemical vapor deposition (CVD) or atomic layer deposition (ALD), but are not limited thereto.

[0177] The second protective layer 320 can cover foreign matter, particles, or impurities that may occur during the manufacturing process. Also, the second protective layer 320 can planarize the surface of the first protective layer 310. For example, the second protective layer 320 can be a particle cover layer, but the second protective layer 320 is not limited to this term.

[0178] The second protective layer 320 may be an organic material, for example, a polymer such as silicon oxycarbon (SiOCz), epoxy, polyimide, polyethylene, acrylate, etc. For example, the second protective layer 320 may be a polymer having a viscosity of 20 or less, but is not limited thereto. A viscosity of 20 or more may be used depending on the presence or absence of the second pattern 500 and the dam 600.

[0179] The second protective layer 320 may be made of a thermosetting or photocurable material that is cured by heat or light.

[0180] The second protective layer 320 may be formed by various methods such as, but not limited to, inkjet coating, slit coating, etc. For example, a liquid organic material may be sprayed or dropped onto the display area AA on the first substrate 110 on which the first protective layer 310 is formed, using an inkjet device or a nozzle coating device, to form the second protective layer 320 on the first protective layer 310. The organic material in a fluid state may be formed on the coating area while the spray nozzle moves over the coating area (or while the nozzle is fixed and the object moves).

[0181] After the organic material is sprayed or dropped, the organic material is dried and cured to remove the solvent and moisture, thereby forming the second protective layer 320 in a cured state.

[0182] When liquid organic material is sprayed or dropped onto the display area AA on the first substrate 110, the first pattern 400 formed on the first portion P1 and the second pattern 500 formed on the second portion P2 of the non-display area NA surrounding the display area AA can effectively block the flow of the organic material of the second protective layer 320. In the embodiment of the present specification, the surface of the protective layer 300 between the spacer 250 and the first pattern 400 may include a planar portion where the surface is essentially flat. Meanwhile, the surface of the protective layer 300 between the first pattern 400 and the second pattern 500 or the dam 600 may include an uneven portion where the surface is not completely flat or may include unevenness. Based on the flatness of the protective layer 300, the thickness of the protective layer 300 between the spacer 250 and the first pattern 400 may be different from the thickness between the first pattern 400 and the second pattern 500 or between the second pattern 500 and the dam 600. Even then, in a particular location, such as where the spacers 250 and the first pattern 400 are located, the thickness of the planarization layer 300 above the spacers 250 may be approximately the same as the thickness of the planarization layer above the first pattern 400 .

[0183] FIG. 4 is a micrograph of a cross section of a second protective layer of the light emitting display device on which the first pattern and the second pattern of FIG. 3 are formed.

[0184] The arrow in FIG. 4 labeled PCL End indicates the end point of the second protective layer 320 .

[0185] 4 is formed after the organic material constituting the second protective layer 320 is cured. It is assumed that the end point PCL End of the second protective layer 320 passes through the first pattern 400 and the second pattern 500 without crossing the dam 600.

[0186] The material constituting the second protective layer 320 has low viscosity characteristics, and can be in a dense liquid-like state before being hardened. Referring to Fig. 4, the first pattern 400 is disposed adjacent to and surrounding the display area AA in the first place, and the second pattern 500 is disposed surrounding the first pattern 400 in the second place. Therefore, it can be seen that the movement speed of the organic material is slowed down by the first pattern 400 and the second pattern 500 before the second protective layer 320 is hardened, and the amount of the organic material of the second protective layer 320 that spreads (or flows) beyond the dam 600 into the non-display area NA is minimized or eliminated.

[0187] In addition, if the first pattern 400 and the second pattern 500 are not disposed, the distance between the display area AA and the dam 600 must be spaced apart by a significant amount due to the design margin of the second protective layer 320. However, the first pattern 400 and the second pattern 500 may be configured to be smaller than the width or height of the dam 600, so that the distance over which the second protective layer 320 spreads (or flows) can be minimized, thereby minimizing the design margin of the second protective layer 320, thereby providing a light emitting display device having a thin bezel and improved reliability. In this specification, "height" refers to the height from the bottom of a pattern or dam to the top of the pattern or dam in a cross-sectional view.

[0188] In the following, another embodiment of the present invention will be described with reference to FIG.

[0189] The light emitting display device 100 of FIG. 5 is substantially the same as the display device of FIG. 3 except for the second pattern 500, and therefore a duplicated description will be omitted.

[0190] FIG. 5 is a cross-sectional view of a light emitting display device according to another embodiment of the present specification.

[0191] Referring to FIG. 5, a light emitting display device 100 according to another embodiment of the present specification includes a substrate 110 including a display area AA and a non-display area NA, a planarization layer 130, a protective layer 300, a first pattern 400, a second pattern 500, and a dam 600.

[0192] The second pattern 500 may be arranged in multiple layers using at least one material. The second pattern 500 may be formed of the same material as the planarization layer 130 in the display area AA, and may be formed simultaneously with the planarization layer 130, but is not limited thereto.

[0193] When the planarization layer 130 is arranged in two layers, it may include at least one of a first planarization layer 131 and a second planarization layer 132 .

[0194] Therefore, the second pattern 500 may be formed of the same material as the first planarization layer 131 or the second planarization layer 132, and may be formed simultaneously with the first planarization layer 131 or the second planarization layer 132, but is not limited thereto.

[0195] The second pattern 500 may be disposed in a single layer of the first planarization layer 131 or the second planarization layer 132, or may be disposed in a double layer of the first planarization layer 131 and the second planarization layer 132. The second pattern 500 may also include within its structure the same material as the material forming the first pattern 400 and the dam 600.

[0196] When the second pattern 500 is formed simultaneously with the planarization layer 130 disposed in the display area AA, the same material as the anode electrode 210 disposed in the display area AA on the second pattern 500 or a material used in the process of forming the anode electrode 210 may be further disposed on the second pattern 500. On the other hand, when the material of the anode electrode 210 is disposed in the non-display area NA, at least one of the second pattern 500 and the dam 600 may be disposed on the material of the anode electrode 210 in the non-display area NA. The material of the anode electrode 210 in the non-display area NA may be referred to as an auxiliary electrode or auxiliary pattern. The auxiliary electrode may be electrically insulated from the anode electrode 210, and a current may not flow through the auxiliary electrode, but this is not necessarily required. In other embodiments, the auxiliary electrode may be electrically connected to another structure such as the anode electrode 210, i.e., a current may flow through the auxiliary electrode. The material of the anode electrode 210 of the non-display area NA may be continuous or discontinuous in the emergency area NA, whereby the material of the anode electrode 210 of the emergency area NA may be present throughout the entire non-display area NA or in multiple discrete portions or parts of the non-display area NA. At least one of the second pattern 500 and the dam 600 may be in at least a portion of the material of the anode electrode 210 of the non-display area NA or in contact (e.g., entirely or partially) with the material of the anode electrode 210 of the non-display area NA. In various embodiments herein, the material of the anode electrode 210 of the non-display area NA may be in at least one of the bottom, side, and top of at least one of the second pattern 500 and the dam 600 or in contact (e.g., entirely or partially) with the bottom, side, and top of at least one of the second pattern 500 and the dam 600. At the same time, the material of the anode electrode 210 of the non-display area NA may be located on the top, bottom, or through at least one of the second pattern 500 and the dam 600. For example, the material of the anode electrode 210 in the non-display area NA may cover, partially cover, or be interposed between segments of the second pattern 500, or segments of the dam 600, or both.

[0197] In the following, another embodiment of the present specification will be described with reference to FIG.

[0198] The light emitting display device 100 of FIG. 6 is substantially the same as the display device of FIG. 3 except for the buffer hole BH, so a duplicated description will be omitted.

[0199] FIG. 6 is a cross-sectional view of a light emitting display device according to another embodiment of the present specification.

[0200] Referring to FIG. 6, an organic light emitting display device 100 according to another embodiment of the present specification includes a substrate 110 including a display area AA and a non-display area NA, a planarization layer 130, a protective layer 300, a first pattern 400, a second pattern 500, a dam 600, and a buffer hole BH.

[0201] The buffer hole BH may be disposed on the planarization layer 130 or the anode electrode 210 in the first portion P1 of the non-display area NA.

[0202] The buffer hole BH may be disposed along the periphery of the display area AA. For example, the buffer hole BH may be disposed between the display area AA and the first pattern 400. The buffer hole BH may be a hole or a first hole of multiple holes, but reference to the buffer hole BH is not intended to be limited by the term used to refer to the buffer hole BH.

[0203] The buffer holes BH are in the bank layer 220 and may be formed in the same process as the bank holes exposing the portions of the anode electrodes 210 corresponding to the light-emitting areas in the display area AA, but are not limited thereto.

[0204] At least one buffer hole BH may be disposed. For example, the buffer hole BH may be formed by etching the bank layer 220, so that the organic material of the second protective layer 320 may be prevented from overflowing beyond the first pattern 400. For example, the buffer hole BH may reduce the amount of the organic material of the second protective layer 320 that flows beyond the first pattern 400, so that the distance over which the organic material of the second protective layer 320 spreads (or flows) may be more effectively controlled. Therefore, the buffer hole BH may prevent restrictions such as driving failure that may occur due to the second protective layer 320 entering the non-display area NA. In addition, a buffer space or a safety margin may be secured in consideration of variations in the amount of application of the second protective layer 320, so that a light emitting display device that may have a thin bezel may be provided by minimizing the design margin of the second protective layer 320.

[0205] In the following, another embodiment of the present specification will be described with reference to FIGS.

[0206] The light emitting display device 100 shown in FIGS. 7 and 8 is substantially the same as the light emitting display device of FIG. 3 except for the touch sensor layer 700 and the touch wiring 750, and therefore will not be described again.

[0207] 7 is a plan view of an outer region of a light emitting display device including a touch sensor layer and a touch wiring according to another embodiment of the present disclosure, and FIG. 8 is a cross-sectional view of an outer region of a light emitting display device including a touch sensor layer and a touch wiring according to another embodiment of the present disclosure.

[0208] 7 and 8, a touch sensor layer 700 and touch wiring 750 may be disposed on a protective layer 300.

[0209] A touch sensor layer 700 may be disposed in the display area AA. The touch sensor layer 700 may include a first touch electrode 740_R, a second touch electrode 740_T, a first touch connecting electrode 720, and a second connecting electrode.

[0210] The first touch electrode 740_R, the second touch electrode 740_T, the first touch connecting electrode 720, and the second connecting electrode arranged in the display area AA may be formed in a mesh pattern in which metal lines having a small line width cross each other. The mesh pattern may have a diamond shape, but may have various shapes. For example, the shape of the mesh pattern may be, but is not limited to, a square, a pentagon, a hexagon, a circle, an ellipse, etc.

[0211] The first touch electrode 740_R, the second touch electrode 740_T, the first touch connecting electrode 720, and the second touch connecting electrode may be arranged using an opaque conductive material having low material resistance, and may have a single-layer or multi-layer structure made of a metal material such as, but not limited to, molybdenum (Mo), silver (Ag), titanium (Ti), copper (Cu), aluminum (Al), titanium / aluminum / titanium (Ti / Al / Ti), and molybdenum / aluminum / molybdenum (Mo / Al / Mo).

[0212] An opening may be formed inside the mesh pattern of the first touch electrode 740_R and the second touch electrode 740_T. The opening may correspond to a sub-pixel SP. For example, the light emitting element layer 200 may be disposed in the opening.

[0213] The first touch electrode 740_R, the second touch electrode 740_T, the first touch connecting electrode 720, and the second touch connecting electrode are formed so as not to overlap with the red (R), green (G), and blue (B) light emitting regions, but to overlap with the bank layer 220 formed in the non-light emitting region, so that even if they are formed of an opaque conductive material, a decrease in aperture ratio and transmittance can be prevented.

[0214] The touch panel may include a first touch block Rx including at least one first touch electrode 740_R and a first touch connecting electrode 720 connecting the first touch electrodes 740_R. The at least one first touch block Rx extends along a first direction (or X-axis direction). The first touch blocks Rx may be arranged at regular intervals from each other.

[0215] The touch panel may include a second touch block Tx including at least one second touch electrode 740_T and a second touch connecting electrode connecting the second touch electrodes 740_T. The at least one second touch block Tx may extend along a second direction (or Y direction). The second touch blocks Tx may be arranged at regular intervals from each other.

[0216] The first touch block Rx and the second touch block Tx may be spaced apart from each other to have a certain distance therebetween, and thus the first touch block Rx and the second touch block Tx may be electrically isolated from each other.

[0217] The first touch block Rx and the second touch block Tx are connected to the touch driver through the touch wiring 750 to transmit or receive a signal. For example, the touch driver may receive a touch sensing signal from the first touch block Rx or the first touch electrode 740_R. Also, the touch driver may transmit a touch driving signal to the second touch block Tx or the second touch electrode 740_T. The touch driver may sense a user's touch using mutual capacitance between the first touch block Rx or the plurality of first touch electrodes 740_R and the second touch block Tx or the plurality of second touch electrodes 740_T. For example, when a touch operation is performed on the light emitting display device 100, a capacitance change may occur between the first touch block Rx or the first touch electrode 740_R and the second touch block Tx or the second touch electrode 740_T. The touch driver may detect touch coordinates by sensing the capacitance change.

[0218] A touch buffer layer 710 may be disposed on the protective layer 300. The touch buffer layer 710 may prevent chemicals (such as a developer or an etchant) used in a manufacturing process of the touch sensor layer 700 or moisture from the outside from penetrating into the light emitting element layer 200 including an organic material. In addition, a problem of a number of touch electrodes disposed on the touch buffer layer 710 being disconnected due to an external impact may be prevented.

[0219] The touch buffer layer 710 may be formed as a single layer or multiple layers of any one of silicon oxide (SiOx) or silicon nitride (SiNx) or an alloy thereof, but is not limited thereto. Alternatively, the touch buffer layer 710 may be formed of an acrylic resin, an epoxy resin, or a siloxan-based material, but is not limited thereto.

[0220] A first touch connecting electrode 720 may be disposed on the touch buffer layer 710 in the display area AA.

[0221] The first touch connecting electrode 720 arranged in the display area AA may be disposed between adjacent first touch electrodes 740_R in a first direction (or X-axis direction). The first touch connecting electrode 720 may electrically connect a plurality of first touch electrodes 740_R arranged adjacent to each other and spaced apart in the first direction (or X-axis direction).

[0222] The first touch connecting electrode 720 may be disposed to overlap with a second touch connecting electrode connecting adjacent second touch electrodes 740_T in the second direction (or Y-axis direction). The first touch connecting electrode 720 and the second touch connecting electrode may be formed in different layers and thus may be electrically insulated from each other.

[0223] A touch insulation layer 730 may be disposed on the touch buffer layer 710 and the first touch connecting electrode 720. The touch insulation layer 730 may be formed in the display area AA and the non-display area NA.

[0224] The touch insulating layer 730 may electrically insulate the first touch connecting electrode 720 from the second touch electrode 740_T and the second touch connecting electrode 740_T.

[0225] The touch insulating layer 730 may include a hole to electrically connect the first touch electrode 740_R and the first touch connecting electrode 720.

[0226] The touch insulation layer 730 can be, but is not limited to, a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or multiple layers thereof.

[0227] A first touch electrode 740_R, a second touch electrode 740_T, and a second touch connecting electrode may be disposed on the touch insulating layer 730 in the display area AA.

[0228] The first touch electrode 740_R and the second touch electrode 740_T may be disposed at a certain distance apart. At least one first touch electrode 740_R adjacent in a first direction (or X-axis direction) may be formed spaced apart from each other. Each of the at least one first touch electrodes 740_R adjacent in the first direction (or X-axis direction) may be connected to a first touch connecting electrode 720 disposed between the first touch electrodes 740_R. For example, each first touch electrode 740_R may be connected to the first touch connecting electrode 720 through a hole in the touch insulating layer 730. The second touch electrode 740_T adjacent in a second direction (or Y-axis direction) may be connected by a second touch connecting electrode. The second touch electrode 740_T and the second touch connecting electrode may be formed in the same layer.

[0229] A touch planarization layer may be disposed on the touch insulation layer 730, the first touch electrode 740_R, the second touch electrode 740_T, and the second touch connecting electrode.

[0230] The touch planarization layer may be disposed to cover the touch insulation layer 730, the first touch electrode 740_R, the second touch electrode 740_T, and the second touch connecting electrode. An additional layer or material may be provided on the touch planarization layer.

[0231] The touch-planarization layer may be formed of at least one of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene resin, and a polyphenylene sulfide resin, but is not limited thereto.

[0232] A touch wiring 750 may be arranged in the non-display area NA. The touch wiring 750 may include a first touch wiring 751 and a second touch wiring 752. The touch wiring 750 may be arranged in a double wiring of the first touch wiring 751 and the second touch wiring 752.

[0233] A first touch wiring 751 may be disposed on the touch buffer layer 710. The first touch wiring 751 may be electrically connected to the second touch wiring 752 to stably supply a signal even if the second touch wiring 752 is disconnected due to an external impact and to reduce resistance of the second touch wiring 752 that transmits a signal of the touch driver to the first touch block Rx and the second touch block Tx. For example, the first touch wiring 751 may be electrically connected to the second touch wiring 752 through a hole in the touch insulating layer 730.

[0234] A touch insulation layer 730 may be disposed on the first touch wiring 751. The touch insulation layer 730 may be formed of the same material and in the same process at the same time as the touch insulation layer 730 is formed on the first touch connecting electrode 720 disposed in the display area AA, but is not limited thereto, and may be formed through patterning by performing a separate process during the performance of the process.

[0235] At least one of the first touch wiring 751 and the second touch wiring 752 may be disposed to overlap with each other.

[0236] The touch insulation layer 730 may further include a plurality of holes exposing at least a portion of the first touch wiring 751.

[0237] A first touch wiring 751 disposed on the lower part of the touch insulation layer 730 and a second touch wiring 752 disposed on the upper part of the touch insulation layer 730 may be electrically connected through a hole in the touch insulation layer 730 .

[0238] A second touch wiring 752 may be disposed on the touch insulation layer 730. The second touch wiring 752 may transmit a signal (or voltage) from an external module attached or bonded to the touch driver to the first touch block Rx and the second touch block Tx.

[0239] The second touch wiring 752 may be formed of the same material and in the same process as the first touch electrode 740_R, the second touch electrode 740_T, and the second touch connecting electrode disposed in the display area AA, but is not limited thereto.

[0240] A touch-planarization layer may further be disposed on the second touch wiring 752. The touch-planarization layer may be disposed to cover the second touch wiring 752. The touch-planarization layer may planarize the top of the second touch wiring 752.

[0241] The touch-planarization layer may be formed of the same material and in the same process as the touch-planarization layer disposed in the display area AA, but is not limited thereto.

[0242] The light emitting display device 100 having a number of touch wirings 750 disposed on the protective layer 300 has a restriction that touch sensitivity is low in an outer region of the light emitting display device 100 due to a low thickness and / or a steep slope and step of the protective layer 300 in the non-display area NA adjacent to the display area AA of the light emitting display device 100. For example, the protective layer 300 in the display area AA has a uniform thickness, whereas the protective layer 300 formed in the non-display area NA adjacent to the display area AA may have a steep slope and step that cause a change in elevation because the planarization layer, the insulating layer, and the metal wiring disposed under the protective layer 300 may be etched. As a result, the migration speed of the organic material of the second protective layer 320 becomes faster, and the thickness of the second protective layer 320 before hardening becomes low, resulting in a restriction that the second protective layer 320 is not applied.

[0243] The protective layer 300 formed to a low thickness in the non-display area NA adjacent to the display area AA has the limitation of causing electric field interference between the electrodes and wiring arranged above and below the protective layer 300, resulting in a decrease in display quality and a decrease in touch sensitivity.

[0244] In addition, due to the steep slope and step of the protective layer 300 in the non-display area NA, when the touch wiring 750 is manufactured in an area where the protective layer 300 has a slope or step, there is a restriction that the touch wiring 750 may be washed away or broken.

[0245] Therefore, the inventors of the present specification have conducted various experiments to reduce the degradation of display quality and touch sensitivity in the non-display area NA adjacent to the display area AA. Through various experiments, the inventors have conducted various experiments to improve display quality and touch sensitivity by minimizing electric field interference between electrodes disposed on the upper and lower parts of the protective layer 300 in the non-display area NA adjacent to the display area AA.

[0246] The first pattern 400 formed in the first portion P1 of the non-display area NA adjacent to the display area AA prevents the organic material of the second protective layer 320 from flowing, thereby increasing the thickness of the second protective layer 320 formed in the first portion P1. Since the second protective layer 320 is formed to a similar thickness in the display area AA and the first portion P1 of the non-display area NA, an increase in parasitic capacitance (Cp) previously formed in the non-display area NA adjacent to the display area AA can be prevented, thereby improving display quality and touch sensing sensitivity.

[0247] The touch wiring 750 may be disposed to overlap the first pattern 400, the second pattern 500, and the dam 600.

[0248] Alternatively, the touch wiring 750 may be arranged to be separated from the first pattern 400 and the dam 600 at least in part without overlapping at least one portion. For example, the touch wiring 750 may be arranged to not overlap the first pattern 400 and the dam 600 at least in part. The touch wiring 750 may be arranged to overlap the second pattern 500 at least in part.

[0249] The touch wiring 750 may be disposed at a first distance D1 from the first pattern 400, and the touch wiring 750 may be disposed at a second distance D2 from the dam 600. The first distance D1 and the second distance D2 may be the same or different. When the first distance D1 and the second distance D2 are different, the second distance D2 may be greater than the first distance D1.

[0250] A display device according to an embodiment of the present specification can be described as follows.

[0251] An light emitting display device according to an embodiment of the present specification may include a substrate including a display area and a non-display area adjacent to the display area, a planarization layer in a first portion of the display area and the non-display area, a bank layer disposed on the planarization layer, a light emitting element layer, and a first pattern, and a second pattern and a dam having different heights and disposed in a second portion adjacent to the first portion of the non-display area.

[0252] According to some embodiments herein, the planarization layer may extend from the display area to a first portion of the non-display area.

[0253] According to some embodiments herein, the second pattern may be spaced apart from the first pattern and the dam and disposed between the first pattern and the dam.

[0254] According to some embodiments herein, the bank layer may further include a spacer on the bank layer, and the first pattern may be located in the same layer as the spacer and made of the same material.

[0255] According to some embodiments herein, the second pattern may be made of the same material as the planarization layer.

[0256] According to some embodiments herein, at least one metal layer may be further disposed on top of the second pattern.

[0257] According to some embodiments herein, the vertical height of the first pattern and the second pattern may be less than the vertical height of the dam.

[0258] According to some embodiments herein, the dam may include a planarization layer, a bank layer, and a spacer.

[0259] According to some embodiments of the present disclosure, the number of the first patterns and the second patterns may each be arranged to be two or more.

[0260] According to some embodiments herein, the dams may be arranged in a number that is one or more less than the number of the first pattern and the second pattern.

[0261] According to some embodiments of the present disclosure, the display device may further include a protective layer disposed in the display area and the non-display area.

[0262] According to some embodiments herein, the protective layer can include a second protective layer composed of an organic material.

[0263] According to some embodiments herein, a second protective layer can be disposed at least in part between the second pattern and the dam.

[0264] According to some embodiments herein, the display device may further include a touch wiring disposed on the protective layer.

[0265] According to some embodiments herein, the touch trace may be spaced apart from a portion of at least one of the first pattern and the dam.

[0266] According to some embodiments herein, the touch wiring may be disposed overlapping at least a portion of the second pattern.

[0267] According to some embodiments of the present disclosure, the display device may further include a first touch electrode and a second touch electrode disposed in the display area.

[0268] According to some embodiments of the present disclosure, the presence or absence of a touch and the touch position can be sensed by detecting a change in mutual capacitance Cm formed between a first touch electrode and a second touch electrode.

[0269] According to some embodiments of the present disclosure, the display device may further include a driving circuit, and the first pattern, the second pattern, and the dam may be disposed between the display area and the driving circuit.

[0270] According to some embodiments of the present specification, the driving circuit may further include at least one of a multiplexer MUX, an electrostatic discharge ESD circuit, a high potential voltage wiring VDD, or a low potential voltage wiring VSS, and the first pattern, the second pattern, and the dam may be disposed between the multiplexer MUX, the electrostatic discharge ESD circuit, the high potential voltage wiring VDD, or the low potential voltage wiring VSS.

[0271] According to some embodiments of the present disclosure, the display device may further include a gate drive circuit disposed in the non-display area, and the gate drive circuit may be disposed between the display area and the first pattern, the second pattern, or the dam.

[0272] An light emitting display device according to an embodiment of the present specification may include a substrate including a display area and a non-display area surrounding the display area; a planarization layer in the display area; spacers on the planarization layer and in the display area; a first pattern on the planarization layer and in the non-display area; and a second pattern in the non-display area.

[0273] The non-display area can include a first portion adjacent to the display area, a second portion outside the first portion, and a boundary between the first and second portions, and the second portion of the non-display area does not include the planarization layer.

[0274] The non-display area may include two portions, a first portion and an outer portion of the first portion, and the dam is further disposed in the second portion of the non-display area.

[0275] The light emitting display device may further include a dam in the non-display area, and a protective layer disposed in the display area and the non-display area and over the first pattern, the second pattern and the dam.

[0276] The protective layer on the inside of the first pattern and the protective layer on the outside of the first pattern may have an elevation difference.

[0277] The light emitting display device may further include an anode electrode on the planarization layer, a bank layer on the anode electrode, a light emitting element layer on the anode electrode, and a cathode electrode on the light emitting element layer, and the material of the anode electrode may be disposed in the non-display area, and the second pattern and the dam may be on the material of the anode electrode in the non-display area.

[0278] The surface of the protective layer between the spacer and the first pattern includes a flat portion, and the surface of the protective layer between the first pattern and the second pattern or the dam includes an uneven portion.

[0279] The thickness of the protective layer between the spacer and the first pattern may be different from the thickness of the protective layer between the first pattern and the second pattern or between the second pattern and the dam.

[0280] The protective layer includes a first protective layer and a second protective layer, the thickness of the second protective layer varying as it extends outward from the display area to the non-display area.

[0281] The second protective layer does not have to be disposed on the outside of the dam.

[0282] The thickness of the planarization layer over the spacers can be approximately the same as the thickness of the planarization layer over the first pattern.

[0283] The thickness of the protective layer over the spacer may be approximately the same as the thickness of the protective layer over the first pattern and the second pattern.

[0284] The thickness of the protective layer over the spacers may be different from the thickness of the protective layer over at least one of the second pattern and the dam.

[0285] The light emitting display device may further include an anode electrode on the planarization layer, a bank layer on the anode electrode, a light emitting element layer on the anode electrode, and a cathode electrode on the light emitting element layer, where the material of the anode electrode may be disposed in the non-display area, and the second pattern may be on the material of the anode electrode.

[0286] The second pattern may contact an auxiliary electrode of the anode electrode located in the non-display area.

[0287] Although the embodiments of the present specification have been described in detail above with reference to the accompanying drawings, the present specification is not necessarily limited to such embodiments, and may be modified in various ways within the scope of the technical idea of ​​the present specification. Therefore, the embodiments disclosed in the present specification are for illustration purposes, not for limiting the technical idea of ​​the present specification, and the scope of the technical idea of ​​the present specification is not limited by such embodiments. Therefore, the embodiments described above should be understood to be illustrative and not limiting in all respects. The scope of protection of the present specification should be interpreted by the scope of the claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present specification.

Claims

1. A substrate including a display area and a non-display area adjacent to the display area; a planarization layer in the display area and in a first portion of the non-display area; a bank layer, a light-emitting element layer, and a first pattern disposed on the planarization layer; and A second pattern and a dam are disposed in a second portion adjacent to the first portion of the non-display area and have different heights. Including, A light emitting display device, wherein a height of the first pattern from the upper surface of the substrate is higher than a height of the dam from the upper surface of the substrate.

2. The light emitting display device of claim 1 , wherein the planarization layer extends from the display area to a first portion of the non-display area.

3. The light emitting display device of claim 1 , wherein the second pattern is spaced apart from the first pattern and the dam and is disposed between the first pattern and the dam.

4. A spacer on the bank layer Further comprising: The light emitting display device of claim 1 , wherein the first pattern is located in the same layer as the spacer and is made of the same material as the spacer.

5. The light emitting display device of claim 1 , wherein the second pattern is made of the same material as the planarization layer.

6. The light emitting display device of claim 5 , further comprising at least one metal layer disposed on the second pattern.

7. The light emitting display device of claim 4 , wherein the dam comprises materials of the planarization layer, the bank layer, and the spacer.

8. The light emitting display device of claim 1 , wherein the number of each of the first patterns and the second patterns is two or more.

9. The light emitting display device of claim 1 , wherein the number of the dams is less than the number of the first patterns and the number of the second patterns.

10. The light emitting display device of claim 1 , further comprising a protective layer disposed in the display area and the non-display area.

11. The light emitting display device of claim 10 , wherein the protective layer comprises a second protective layer including an organic material.

12. The light emitting display device of claim 11 , wherein at least a portion of the second protective layer is disposed between the second pattern and the dam.

13. The light emitting display device of claim 10 , further comprising a touch wiring disposed on the protective layer.

14. The light emitting display device of claim 13 , wherein the touch wiring is spaced apart from at least one of the first pattern and the dam.

15. The light emitting display device of claim 13 , wherein the touch wiring is disposed to overlap at least a portion of the second pattern.

16. The light emitting display device of claim 1 , further comprising a first touch electrode and a second touch electrode disposed in the display area.

17. The light emitting display device of claim 16 , further comprising: a touch detection unit configured to detect a change in mutual capacitance formed between the first touch electrode and the second touch electrode to detect whether or not a touch has occurred and a touch position of the touch.

18. Drive circuit Further comprising: The light emitting display device according to claim 1 , wherein the first pattern, the second pattern, and the dam are disposed between the display area and the driving circuit.

19. The driving circuit includes at least one or more multiplexers (MUX), electrostatic discharge (ESD) circuits, high potential voltage wiring (VDD), or low potential voltage wiring (VSS); 20. The light emitting display device of claim 18, wherein the first pattern, the second pattern, and the dam are disposed between the display area and a multiplexer (MUX), an electrostatic discharge (ESD) circuit, a high potential voltage wiring (VDD), or a low potential voltage wiring (VSS).

20. A gate drive circuit disposed in the non-display area Further comprising: The light emitting display device according to claim 1 , wherein the gate driving circuit is disposed between the display area and the first pattern, between the display area and the second pattern, or between the display area and the dam.

21. a substrate including a display area and a non-display area surrounding the display area; a planarization layer within the display area; spacers on the planarization layer and within the display area; a first pattern on the planarization layer and in the non-display area; a second pattern in the non-display area; and Dams in the non-display area Including, A light emitting display device, wherein a height of the first pattern from the upper surface of the substrate is higher than a height of the dam from the upper surface of the substrate.

22. the non-display area includes a first portion adjacent to the display area, a second portion outside the first portion, and a boundary between the first portion and the second portion, The light emitting display device of claim 21 , wherein the second portion of the non-display area does not include the planarization layer.

23. the non-display area includes a first portion and a second portion outside the first portion, The light emitting display device of claim 21 , wherein the dam is disposed in the second portion of the non-display area.

24. a protective layer located within the display area and the non-display area and disposed on the first pattern, the second pattern, and the dam The light emitting display device of claim 21 , further comprising:

25. The light emitting display device of claim 24 , wherein the protective layer on the inside of the first pattern and the protective layer on the outside of the first pattern have an elevation difference.

26. an anode electrode on the planarization layer, a bank layer on the anode electrode, a light emitting element layer on the anode electrode, and a cathode electrode on the light emitting element layer Further comprising: a layer made of the same material as the anode electrode is disposed in the non-display area; The light emitting display device of claim 24 , wherein the second pattern and the dam are on the layer of the same material in the non-display area.

27. a surface of the protective layer between the spacer and the first pattern includes a flat portion; The light emitting display device of claim 24 , wherein a surface of the protective layer between the first pattern and the second pattern or the dam includes an uneven portion.

28. 25. The light emitting display device of claim 24, wherein a thickness of the protective layer between the spacer and the first pattern is different from a thickness of the protective layer between the first pattern and the second pattern or between the second pattern and the dam.

29. the protective layer includes a first protective layer and a second protective layer, 25. The light emitting display of claim 24, wherein a thickness of the second protective layer varies as it extends outward from the display area to the non-display area.

30. 30. The light emitting display device of claim 29, wherein the second protective layer is not disposed outside the dam.

31. 22. The light emitting display device of claim 21, wherein a thickness of the spacer on the planarization layer is approximately the same as a thickness of the first pattern on the planarization layer.

32. The light emitting display device of claim 24 , wherein a thickness of the protective layer on the spacer is the same as a thickness of the protective layer on the first pattern and the second pattern.

33. The light emitting display device of claim 24 , wherein a thickness of the protective layer over the spacer is different from a thickness of the protective layer over at least one of the second pattern and the dam.

34. an anode electrode on the planarization layer, a bank layer on the anode electrode, a light emitting element layer on the anode electrode, and a cathode electrode on the light emitting element layer Further comprising: a layer made of the same material as the anode electrode is disposed in the non-display area; The light emitting display device of claim 21 , wherein the second pattern is on the layer made of the same material.

35. The light emitting display device of claim 21 , wherein the second pattern is in contact with an auxiliary electrode made of the same material as an anode electrode located in the non-display area.

Images