Housing and atomizer
The housing design with varying thickness heat insulating layers and a heat equalizing layer addresses temperature and power consumption issues in miniaturized HNB devices, ensuring effective thermal insulation and user experience.
Patent Information
- Application Number
- JP2023133972
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2022-09-27
- Filing Date
- 2023-08-21
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2043-08-21
AI Technical Summary
Conventional HNB devices face issues of excessive temperature rise and increased power consumption due to limited internal insulation space and accelerated heat transfer to the outer surface of the housing with miniaturization.
A housing design for atomizers featuring a first and second heat insulating layer with differing thicknesses on opposite surfaces of the substrate, combined with a heat equalizing layer, to improve thermal insulation and reduce heat transfer.
The design effectively prevents excessive temperature rise and energy loss, enhances insulation without increasing the housing thickness, and maintains user comfort and portability.
Smart Images

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Abstract
Description
[Technical field]
[0001] The present invention relates to the technical field of atomizers, and in particular to a housing and an atomizer. [Background technology]
[0002] HNB (HEAT NOT BURN) devices are devices that generate aerosols for inhalation by users by heating and baking an aerosol-generating substrate.
[0003] HNB devices are generally handheld by users, and since the atomization temperature can reach over 200°C, HNB products need to be insulated to avoid affecting the user experience.
[0004] As the trend toward smaller HNB devices continues, the internal insulating space is limited, and the transfer of heat from the inside of the HNB device to the outer surface of the housing is accelerated, resulting in problems such as an excessive rise in the housing temperature and increased power consumption. Summary of the Invention [Problem to be solved by the invention]
[0005] In view of this, there is a need to provide a housing and atomizer that addresses problems such as excessive rise in temperature of the housing of conventional HNB devices and increased power consumption due to rapid heat dissipation. [Means for solving the problem]
[0006] A housing applicable to an atomizer, the housing including a substrate, a first insulating layer located on a first surface of the substrate, and a second insulating layer located on a second surface of the substrate, the thickness of the first insulating layer being different from the thickness of the second insulating layer in the thickness direction of the housing.
[0007] In this way, a difference in thickness of the second surface structure within the substrate is realized, improving the insulation effect and avoiding excessive rise in the temperature of the housing caused by the heat inside the atomizer being transferred from the first surface to the second surface of the substrate. Furthermore, by providing a second insulation layer, the second surface can be again insulated from heat, avoiding energy loss caused by the heat transferred to the second surface being directly transferred to the air.
[0008] In one embodiment, the first and second insulating layers are both formed by oxidizing the substrate. By oxidizing more substrate to form the first or second insulating layer, the insulating effect can be improved without increasing the thickness of the housing.
[0009] In one embodiment, the thickness of the second insulating layer is smaller than that of the first insulating layer, thus enhancing the insulating effect while not affecting the appearance effect of the atomizer.
[0010] In one embodiment, the porosity of the first insulating layer is greater than the porosity of the second insulating layer.
[0011] In one embodiment, the porosity of the first insulating layer is greater than the porosity of the second insulating layer, and the roughness of the first insulating layer is greater than the roughness of the second insulating layer, thereby doubly enhancing the insulating effect.
[0012] In one embodiment, a thermal spread layer is laid on the first thermal insulation layer, and the thermal spread layer has a thermal conductivity coefficient greater than that of the substrate.
[0013] In one embodiment, the thermal isolating layer is laid on one side of the first thermal insulation layer facing away from the first surface of the substrate.
[0014] In one embodiment, the heat spreader layer extends along the axial direction of the housing.
[0015] The heat-equalizing layer is directly opposed to the atomizing assembly inside the atomizer, and the heat generated by the atomizing assembly is transferred to the heat-equalizing layer, which has a higher thermal conductivity coefficient, and is rapidly uniformed and the temperature is reduced, thereby preventing a large amount of heat from being concentrated and transferred from one point in the housing.
[0016] In one embodiment, the thermal isolating layer is a graphite structure or coating layer and the substrate is an aluminum alloy.
[0017] Another aspect of the present invention provides an atomizer comprising an atomizing assembly and a housing according to any of the above embodiments, the atomizing assembly being disposed within the housing.
[0018] According to the above housing, by making the thickness of the first insulating layer located on the first surface of the substrate and the thickness of the second insulating layer located on the second surface of the atomizer housing different, a difference in the thickness of the structure between the inner and outer surfaces of the substrate is realized, improving the insulating effect and avoiding excessive rise in the temperature of the housing caused by the heat inside the atomizer being transferred from the inner surface of the substrate to the outer surface, while reducing the heat transfer rate by the first insulating layer and the second insulating layer, thereby reducing power consumption loss. [Brief description of the drawings]
[0019] [Figure 1] FIG. 2 is a schematic diagram of the three-dimensional structure of an atomizer provided according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic diagram of the local structure of a housing of an atomizer provided according to an embodiment of the present invention; [Diagram 3] FIG. 2 is a planar structural schematic diagram of a local cross section of an atomizer provided according to an embodiment of the present invention; [Figure 4] FIG. 2 is a schematic diagram of a local cross-sectional three-dimensional structure of an atomizer provided according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0020] In order to more clearly understand the above objects, features and advantages of the present invention, the following detailed description of specific embodiments of the present invention will be given with reference to the drawings. In the following description, many specific details will be described in order to fully understand the present invention. However, the present invention can be embodied in many other forms different from the embodiments described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0021] In describing the present invention, it should be understood that the orientations or positional relationships indicated by the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "up," "down," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are based on the orientations or positional relationships shown in the drawings, and are intended only to facilitate and simplify the description of the present invention, and do not imply or suggest that the devices or elements referred to have a particular orientation or must be constructed and operated in a particular orientation, and should not be construed as limiting the present invention.
[0022] It should be noted that the terms "first" and "second" are for descriptive purposes only and are not to be understood as implying or suggesting the relative importance or number of the technical features described. Thus, a feature qualified with "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, unless otherwise expressly and specifically limited, "plurality" means at least two, e.g., two, three, etc.
[0023] In the present invention, unless otherwise clearly defined and limited, the terms "attached", "coupled", "connected", "fixed" and the like should be understood in a broad sense, and may refer to, for example, a fixed connection, a detachable connection, or an integral connection. They may also refer to a mechanical connection or an electrical connection. Furthermore, unless otherwise clearly limited, they may refer to a direct connection, an indirect connection via an intermediate medium, an internal communication between two elements, or an interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.
[0024] In the present invention, unless otherwise clearly defined and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intermediate medium. Furthermore, a first feature being "above," "above," and "on the upper surface" of a second feature may simply indicate that the first feature is directly above or diagonally above the second feature, or that the horizontal height of the first feature is greater than that of the second feature. A first feature being "below," "below," and "on the lower surface" of a second feature may simply indicate that the first feature is directly below or diagonally below the second feature, or that the horizontal height of the first feature is smaller than that of the second feature.
[0025] For purposes of illustration, when an element is referred to as "fixed" or "mounted" on another element, it may be directly connected to the other element, or there may be intervening elements. When an element is considered to be "connected" to another element, it may be directly connected to the other element, or there may be intervening elements. As used herein, the terms "vertical," "horizontal," "up," "down," "left," "right," and similar terms are for illustrative purposes only and do not represent the only embodiment.
[0026] Aerosol is a colloidal dispersion formed when small particles of solid or liquid are dispersed and suspended in a gas medium, and aerosols are absorbed into the human body through the respiratory system, providing a new alternative absorption means for users. For example, electronic atomizers that generate aerosols by baking or heating herbal or paste-like aerosol-generating substrates are applied in various fields to provide inhalable aerosols to users instead of traditional electronic atomizer forms and absorption means.
[0027] As mentioned in the Background Art, in recent years, HNB (HEAT NOT BURN) devices have been increasingly adopted by consumers. HNB devices are devices that generate aerosols for inhalation by users by heating and baking an aerosol-generating substrate. Currently available HNB devices generally include an atomizer and an electric element, and a heating element is provided inside the housing of the atomizer, which generates heat to atomize the aerosol-generating substrate and form an inhalable aerosol.
[0028] The heating atomization temperature of the aerosol generating device is generally higher, and heat is usually concentrated in the heating area, resulting in localized temperature concentration. When the volume of the HNB device is relatively large, various insulation means such as an air layer, a vacuum layer, and an insulation layer can be added to reduce the temperature of the outer surface of the housing of the HNB device below the safe standard.
[0029] However, as people have higher demands for operability and portability, HNB devices are gradually developed into smaller devices, and the internal insulation space is limited, which accelerates the transfer of heat generated inside to the outer surface of the housing, resulting in problems such as excessive rise in the temperature of the housing and increased power consumption.
[0030] To solve the above problems, the present invention provides an electronic atomization device, which includes an atomizer 100 and an electric element. The electronic atomization device is used to atomize a solid aerosol-generating substrate in the form of a powder, granule, or powder. The atomizer 100 heats and atomizes the aerosol-generating substrate under the action of electrical energy provided by the electric element.
[0031] Referring to Figures 1 and 2, one embodiment of the present invention provides an atomizer 100 of an electronic atomization device, which comprises an atomization assembly and a housing 10, in which a receiving cavity 14 is formed, and the atomization assembly is disposed within the receiving cavity 14 to atomize an aerosol-generating substrate to form an aerosol.
[0032] The electronic atomization device may be an HNB device, in which the atomization assembly includes a heating element and the aerosol-generating substrate is contained within the containment cavity 14 and heated or baked by the heating element, thereby vaporizing it to generate an aerosol.
[0033] Specifically, referring to Figures 2 to 4, the housing 10 comprises a substrate 11, a first insulating layer 12, and a second insulating layer 13, the first insulating layer 12 being located on a first surface 111 of the substrate 11 and the second insulating layer 13 being located on a second surface 112 of the housing 10, and in the thickness direction of the housing 10, the thickness of the first insulating layer 12 is different from the thickness of the second insulating layer 13.
[0034] Furthermore, the first surface 111 of the substrate 11 faces the interior of the atomizer 100, i.e., toward the accommodating cavity 14, and accordingly, the second surface 112 faces the exterior of the atomizer 100, i.e., toward the opposite side to the accommodating cavity 14.
[0035] In this way, by making the thickness of the first insulating layer 12 located on the first surface 111 of the substrate 11 and the thickness of the second insulating layer 13 located on the second surface 112 of the housing 10 of the atomizer 100 different, a difference in the thickness of the structure of the second surface 112 in the substrate 11 is realized, improving the insulating effect and preventing an excessive rise in the temperature of the housing 10 caused by the heat inside the atomizer 100 being transferred from the first surface 111 to the second surface 112 of the substrate 11. Not only that, by providing the second insulating layer 13, the second surface 112 can be again insulated from heat, and energy loss caused by the heat transferred to the second surface 112 being directly transferred to the air can be avoided.
[0036] In another embodiment, the second surface 112 of the substrate 11 may also face the inside of the atomizer 100, i.e., the receiving cavity 14, and accordingly the first surface 111 faces the outside of the atomizer 100, i.e., faces the opposite side to the receiving cavity 14. In this case, the second insulating layer 13 can prevent the excessive rise in temperature of the housing 10 caused by the heat inside the atomizer 100 being transferred from the second surface 112 of the substrate 11 to the first surface 111, and the first insulating layer 12 can again insulate the first surface 111 from heat, and can prevent the energy loss caused by the heat transferred to the first surface 111 being directly transferred to the air.
[0037] Furthermore, since the first and second insulating layers 12 and 13 can provide sufficient insulating capacity, the requirement for insulating space is relatively reduced, so that the structure of the housing 10 of the atomizer 100 can be designed more compactly, which is favorable for miniaturization of the product and improves operability and portability. In the process of using the atomizer 100, the user's experience will not be affected by an excessive rise in the temperature of the housing of the product.
[0038] As can be seen, the difference in thickness of the structure of the second surface 112 in the substrate 11 can ensure the thermal insulation effect, provided that the thickness of the finally formed housing 10 is not too thick.
[0039] Specifically, the first insulating layer 12 and the second insulating layer 13 may be laid on the first surface 111 and the second surface 112 of the substrate 11 after the substrate 11 is formed, or may be formed by oxidizing the substrate 11 itself, i.e., the first surface 111 of the substrate 11 reacts with oxygen to produce the first insulating layer 12, and the second surface 112 of the substrate 11 reacts with oxygen to produce the second insulating layer 13.
[0040] In this way, the difference in thickness between the first and second insulating layers 12 and 13 can be achieved by oxidizing the first and second surfaces 111 and 112 of the substrate 11 to different degrees, thereby realizing one-sided thickening of the first and second insulating layers 12 and 13, and achieving a difference in thickness between the first and second insulating layers 12 and 13 on the inside and outside of the housing 10. Also, by thickening one side, more of the substrate 11 can be oxidized to form the first and second insulating layers 12 and 13, improving the insulating effect.
[0041] Specifically, regarding the difference in thickness between the inside and outside of the substrate 11, the thickness of the first insulating layer 12 may be greater than the thickness of the second insulating layer 13, or the thickness of the first insulating layer 12 may be smaller than the thickness of the second insulating layer 13.
[0042] For example, when the thickness of the first insulating layer 12 is greater than that of the second insulating layer 13, a layer of protective coating is applied to the second surface 112 of the substrate 11, and then a first anodization process is performed only on the first surface 111 of the substrate 11. The protective coating on the second surface 112 is then removed, and a second anodization process is performed on the entire substrate 11. At this time, a thicker first insulating layer 12 is formed on the first surface 111 by performing two anodization processes, and a thinner second insulating layer 13 is formed on the second surface 112 by performing one anodization process. When the thickness of the first insulating layer 12 is smaller than that of the second insulating layer 13, the reverse operation can be performed according to the above method, and will not be described again here.
[0043] Specifically, the substrate 11 may be a cylinder, a prism, or other shape, and the inside of the substrate 11 is surrounded to form a receiving cavity 14, one end of the receiving cavity 14 is formed with an opening for a user to inhale, and the other end is formed with an air inlet for carrying away the aerosol inside the receiving cavity 14. Other conventional structures of the atomizer 100, such as an electric element, a mint head, etc., may be provided inside the receiving cavity 14, and will not be described again here.
[0044] In some embodiments, optionally, the thickness of the second insulation layer 13 is less than the thickness of the first insulation layer 12, i.e., the thickness of the first insulation layer 12 is greater than the thickness of the second insulation layer 13.
[0045] In addition to adopting the above-mentioned method in the manufacturing process, the first surface 111 and the second surface 112 of the substrate 11 may be anodized once as a whole, and the second surface 112 may be protected and then anodized a second time. Alternatively, the first surface 111 and the second surface 112 of the substrate 11 may be anodized once as a whole, and then an excess thickness of the second insulating layer 13 on the second surface 112 may be removed by a method such as mechanical polishing to form a thinner second insulating layer 13 and maintain a thicker first insulating layer 12.
[0046] The second surface 112 of the substrate 11 is limited by requirements for appearance, color, strength, etc., and an increase in its thickness will result in many other structural variations, while the first surface 111 of the substrate 11 can be considered only for its thermal insulation effect. In this way, by forming a thicker first thermal insulation layer 12 on the first surface 111 of the substrate 11, production is simple, and when it is necessary to improve the thermal insulation effect, it is sufficient to make the thickness of the first thermal insulation layer 12 as thick as possible, and at the same time, the requirements for the second surface 112 such as wear resistance in appearance can be satisfied, power consumption can be reduced as much as possible, and the temperature of the housing 10 can be reduced.
[0047] Regarding the treatment of the thickness of the first insulating layer 12, the thickness of the first insulating layer 12 may be increased by anodizing without changing the thickness of the second insulating layer 13, to convert more of the substrate 11 into the first insulating layer 12. The anodizing may be by increasing the current density of the oxidation process, increasing the oxidation time, using a more corrosive acid or mixed acid electrolyte, or hard oxidation, etc., and is not limited here.
[0048] Accordingly, the thickness of the second insulating layer 13 is generally in the range of 5 um to 20 um, and the thickness of the first insulating layer 12 is generally in the range of 5 um to 150 um, preferably 50 um to 100 um. Within these ranges, not only the insulating effect of the housing 10 but also the miniaturization of the structure of the housing 10 can be ensured.
[0049] Optionally, in some embodiments, the porosity of the first insulating layer 12 is greater than the porosity of the second insulating layer 13 .
[0050] The porosity is the ratio of the volume of the voids in the bulk material to the total volume of the material in its natural state, expressed as a percentage. The first insulating layer 12 is made porous, and the holes in the second insulating layer 13 are closed as much as possible. The first insulating layer 12 with multiple holes can reduce the contact area with the heating element inside the atomizer 100, increase the proportion of air inside the first insulating layer 12, and greatly improve the insulating effect.
[0051] Furthermore, the smaller the pore size of the pores in the first insulation layer 12 and the higher the pore density, the higher the insulation effect.
[0052] A method for realizing the differentiated design in which the first insulation layer 12 has a porous structure and the second insulation layer 13 has a microporous structure may be to simultaneously anodize the first surface 111 and the second surface 112 of the substrate 11, apply a layer of protective paint to the first surface 111, and perform a coloring process only on the second surface 112 to close the pores. At this time, the pore structure inside the second insulation layer 13 is mostly closed to form a microporous structure, and then, when the protective paint on the first surface 111 is removed, the inside of the first insulation layer 12 has a multi-pore structure.
[0053] Optionally, in some embodiments, the roughness of the first insulating layer 12 is greater than the roughness of the second insulating layer 13 .
[0054] Increasing the roughness of the first insulating layer 12 can reduce the contact area between the first insulating layer 12 and the atomizing assembly inside the atomizer 100, thereby improving the insulating effect. The second insulating layer 13 on the second surface 112 can have a maximum roughness according to the appearance requirements, thereby improving the insulating effect.
[0055] Furthermore, the increase in roughness can be achieved by methods such as mechanical polishing or chemical etching, and by increasing the roughness of the first insulating layer 12 located on the first surface 111, the insulating effect can be improved while avoiding any impact on the appearance of the housing 10.
[0056] In practical application, the porosity of the first insulating layer 12 can be increased while its roughness can be increased to double-strengthen the insulating effect without affecting the appearance effect of the atomizer 100. Other embodiments can be designed according to actual requirements and are not limited here.
[0057] In other embodiments, where strict appearance requirements are not a consideration, the roughness and porosity of the second insulation layer 13 can be increased in the same proportion to match the first insulation layer 12 to improve the insulation effect.
[0058] In some embodiments, optionally, the atomizer 100 further includes a heat spreader layer 15, which is laid on the first insulating layer 12, and the thermal conductivity coefficient of the heat spreader layer 15 is greater than the thermal conductivity coefficient of the substrate 11.
[0059] The heat-equalizing layer 15 is directly opposed to the atomizing assembly inside the atomizer 100, and the heat generated by the atomizing assembly is transferred to the heat-equalizing layer 15, which has a higher thermal conductivity coefficient, and then the heat is rapidly equalized and the temperature is reduced, thereby preventing a large amount of heat from being transferred from one point in the housing 10.
[0060] As can be understood, the heat spreading layer 15 has a certain area, and the heat transferred thereon is rapidly dispersed to each point of the heat spreading layer 15 to achieve heat uniformity.
[0061] There are many ways to lay the thermally isolating layer 15 on the surface of the first insulating layer 12, but preferably, the thermally isolating layer 15 is laid on one side of the first insulating layer 12 facing away from the first surface 111. In this case, the thermally isolating layer 15 directly faces the accommodating cavity 14, and heat generated in the accommodating cavity 14 is first contacted with the thermally isolating layer 15 for soaking, then insulated by the first insulating layer 12, and then transferred to the substrate 11 where it is insulated again by the second insulating layer 13.
[0062] In this way, by performing insulation after the heat generated in the receiving cavity 14 is uniformly distributed, the insulation effect is improved and concentration of heat in a certain area is avoided.
[0063] In one embodiment, the heat spreading layer 15 is provided extending along the axial direction of the housing 10, and heat can be rapidly spread along the axial direction of the housing 10 after being transferred to the heat spreading layer 15.
[0064] Specifically, in the axial direction of the housing 10, the length of the heat-soaking layer 15 is equal to or shorter than the length of the substrate 11, and preferably, the ratio of the length of the heat-soaking layer 15 to the length of the substrate 11 may be 1 / 4 to 1, and more preferably, 2 / 3 to 1, thereby ensuring the heat-soaking effect in the axial direction.
[0065] In one embodiment, the heat spreading layer 15 is a graphite structure or coating layer, and the substrate 11 is an aluminum alloy. A graphite coating layer is applied onto the substrate 11, or a graphite sheet structure is attached to form the heat spreading layer 15. Graphite has a larger thermal conductivity coefficient and better heat spreading ability, and can rapidly spread the heat generated at the heat generating portion, thereby avoiding problems such as excessive temperature rise and heat loss caused by the heat being concentrated and transferred from one portion to the second surface 112 of the housing 10.
[0066] The embodiment of the present invention further provides a housing 10 in the above atomizer 100 having the above features. The housing 10 is oxidized to different degrees on the first surface 111 and the second surface 112 of the substrate to realize one-sided thickening of the first insulating layer 12 or the second insulating layer 13, so as to achieve the difference in thickness of the first insulating layer 12 and the second insulating layer 13 on the inside and outside of the housing 10, thereby improving the insulating effect of the housing 10.
[0067] The present invention further provides an electronic atomization device, which includes the atomizer 100 provided by any of the above embodiments. The electronic atomization device has all the technical features of the atomizer 100 provided by any of the above embodiments, and thus has the same technical effects as the atomizer 100 provided by any of the above embodiments.
[0068] In one embodiment, the electronic atomization device further includes an electrical element that is used to provide electrical energy, for example, by providing electrical energy to an atomization assembly within the atomizer 100 to atomize the aerosol-generating substrate.
[0069] Thus, the housing 10 and atomizer 100 provided by the present invention have the following advantages: (1) The difference in thickness between the first insulating layer 12 on the first surface 111 of the substrate 11 and the second insulating layer 13 on the second surface 112 of the substrate 11 improves the insulating effect and prevents heat inside the atomizer 100 from being transferred from the first surface 111 to the second surface 112 of the substrate 11. (2) A larger amount of the substrate 11 is oxidized to form the first insulating layer 12 or the second insulating layer 13, thereby improving the insulating effect without increasing the thickness of the housing 10. (3) Since the thickness of the second insulating layer 13 is smaller than the thickness of the first insulating layer 12, by forming a thicker first insulating layer 12 inside the housing 10, it is easy to manufacture, and by increasing the thickness of the first insulating layer 12 as much as possible, the insulating effect can be improved while also satisfying requirements such as external wear resistance of the second surface 112, power consumption can be reduced as much as possible, and the temperature of the housing 10 can be lowered. (4) The porosity of the first insulating layer 12 is greater than that of the second insulating layer 13, which reduces the contact area with the atomization assembly inside the atomizer 100 and increases the proportion of air inside the first insulating layer 12, thereby greatly improving the insulating effect. (5) The roughness of the first insulating layer 12 is greater than that of the second insulating layer 13. By increasing the roughness of the first insulating layer 12, the contact area between the first insulating layer 12 and the inside of the atomizer 100, such as the atomization assembly, can be reduced, thereby improving the insulating effect and ensuring the appearance effect.
[0070] The technical features of the embodiments described above can be combined in any manner, and for the sake of brevity, not all possible combinations of the technical features in the embodiments described above have been described; however, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope described in this specification.
[0071] The above examples merely show some embodiments of the present application, and although the description is specific and detailed, it should not be understood as limiting the scope of the present invention. It should be noted that those skilled in the art can make some modifications and improvements that fall within the scope of the present application without departing from the idea of the present application. Therefore, the scope of the patent of the present application shall be subject to the scope of the attached claims. [Explanation of symbols]
[0072] 100 Atomizer 10. Housing 11 Substrate 111 First Side 112 Second Side 12 First insulation layer 13 Second insulation layer 14. Storage cavity 15 Heating layer
Claims
1. A housing for use in an atomizer, comprising: a substrate, a first thermal insulation layer located on a first side of the substrate, and a second thermal insulation layer located on a second side of the substrate; The housing has an interior formed therein a receiving cavity for receiving an atomizing assembly, the first surface faces the receiving cavity; the second surface faces away from the receiving cavity; The thickness of the first insulating layer in the thickness direction of the housing is greater than the thickness of the second insulating layer. A housing characterized by:
2. The first and second thermal insulation layers are both formed by oxidation of the substrate. The housing of claim 1 .
3. The porosity of the first insulating layer is greater than the porosity of the second insulating layer. The housing of claim 1 .
4. The roughness of the first insulating layer is greater than the roughness of the second insulating layer. The housing of claim 1 .
5. The porosity of the first insulating layer is greater than the porosity of the second insulating layer; The roughness of the first insulating layer is greater than the roughness of the second insulating layer. The housing of claim 1 .
6. A heat isotropic layer is laid on the first heat insulating layer, The thermal conductivity of the heat spreader layer is greater than the thermal conductivity of the substrate. The housing of claim 1 .
7. 7. The housing of claim 6, wherein the heat spreader layer is laid on one side of the first insulating layer facing away from the first surface of the substrate.
8. The heat spreader layer is provided to extend along the axial direction of the housing. The housing of claim 6.
9. The heat spreader layer is a graphite structure or coating layer, The substrate is an aluminum alloy. The housing of claim 6.
10. A nebulizer assembly and a housing according to any one of claims 1 to 9, The atomizing assembly is disposed within the housing. An atomizer characterized by:
Citation Information
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