738results about "Ohmic-resistance heating devices" patented technology

An illuminating device coupled with sensors or an image acquisition device and a logical controller allows illumination intensity and spectrum to be varied according to changing user needs. The system provides illumination to areas according to the principles of correct lighting practice for the optimal performance of visual tasks in the most efficient, cost effective manner. Aspects of the invention include: lighting fixtures which adapt to ambient lighting, movement, visual tasks being performed, and environmental and personal conditions affecting illumination requirements at any given instant. Lighting fixtures having spatial distribution of spectrum and intensity, providing both “background” room lighting, and “task” lighting.

The invention describes a heating system (100) and a corresponding method of heating a heating surface (180) of an object (150, 950) to a processing temperature of at least 100° C., wherein the heating system (100) comprises semiconductor light sources (115), and wherein the heating system (100) is adapted to heat an area element of the heating surface (180) with at least 50 semiconductor light sources (115) at the same time. The heating system (100) may be part of a reactor for processing semiconductor structures. The light emitted by means of the semiconductor light sources (115) overlaps at the heating surface (180). Differences of the characteristic of one single semiconductor light source (115) may be blurred at the heating surface (180) such that a homogeneous temperature distribution across a processing surface of a, for example, wafer may be enabled.

A system for direct injection of selected thermal-infrared (IR) wavelength radiation or energy into food items for a wide range of processing purposes is provided. These purposes may include heating, raising or maintaining the temperature of the food articles. The system is especially applicable to operations that require or benefit from the ability to irradiate at specifically selected wavelengths or to pulse or inject the radiation. The system is particularly advantageous when functioning at higher speeds and in a non-contact environment with the target.

A process is disclosed for sterilising ambient air conducted in an air duct (401), as well as a use of a device for breaking down gaseous hydrocarbon emissions in order to sterilise ambient air conducted in an air duct (104), and a device for sterilising ambient air conducted in an air duct (401). Ambient air is supplied to the air duct (401) of an UV unit (403) for irradiation with UV radiation, and the thus pre-purified ambient air is supplied to a downstream ionization unit (407) arranged in the air duct and in which the ambient air is ionised.

Certain example embodiments relate to systems and/or methods for preferentially and selectively heat treating conductive coatings such as ITO using specifically tuned near infrared-short wave infrared (NIR-SWIR) radiation. In certain example embodiments, the coating is preferentially heated, thereby improving its properties while at the underlying substrate is kept at low temperatures. Such techniques are advantageous for applications on glass and/or other substrates, e.g., where elevated substrate temperatures can lead to stress changes that adversely effect downstream processing (such as, for example, cutting, grinding, etc.) and may sometimes even result in substrate breakage or deformation. Selective heating of the coating may in certain example embodiments be obtained by using IR emitters with peak outputs over spectral wavelengths where the conductive coating (or the conductive layer(s) in the conductive coating) is significantly absorbing but where the substrate has reduced or minimal absorption.

A heating device in which uniform heating of an article to be processed is possible even in the case a temperature change which leads to a loss of the uniformity of the temperature distribution in a narrowly delineated area, and in which a reduction in the size of the device is possible. The heating device has a plurality of heaters, each heater having a single bulb of transparent material in which there is a filament that is divided in the axial direction into several filament parts and the respective filament parts are supplied with power independently of each other.

The present disclosure relates to aerosol delivery devices that may include components configured to convert electrical energy to heat and atomize an aerosol precursor composition. An outer body may at least partially enclose the components. An illumination source may be configured to output electromagnetic radiation. A wave guide may be configured to receive the electromagnetic radiation from the illumination source and illuminate the aerosol delivery device. The wave guide may define an increasing width from a first longitudinal end at which the electromagnetic radiation is received to an opposing second longitudinal end. Thereby, the wave guide may directly transmit the electromagnetic radiation across the entirety of the second longitudinal end to provide substantially even illumination at the second longitudinal end while employing less material and reducing the volume of space occupied by the wave guide as compared to cylindrical embodiments of wave guides. Related methods are also provided.

An ultraviolet (UV) LED-based lamp for UV curing lamp assemblies is disclosed. An array of UV emitting LEDs are packaged together and arranged along the length of a cylindrical lens to form a UV LED-based optical component assembly. The UV LED-based optical component assembly may be made to be modular. A UV LED lamp assembly may comprise a plurality of UV LED-based optical component assemblies arranged around a workpiece tube. The workpiece tube may be filled with an inert gas and may be made of quartz or glass. One or more curved back reflectors may be placed opposite the LED UV LED-based optical component assemblies to collect UV light escaping the workpiece tube and refocus the light to the other side of the workpiece. The UV LEDs may be arranged on a single surface or a multi-level tiered platform.

A curing device comprises a first elliptic cylindrical reflector and a second elliptic cylindrical reflector, the first elliptic cylindrical reflector and the second elliptic cylindrical reflector arranged to have a co-located focus, and a light source located at a second focus of the first elliptic cylindrical reflector, wherein light emitted from the light source is reflected to the co-located focus from the first elliptic cylindrical reflector and retro-reflected to the co-located focus from the second elliptic cylindrical reflector.

A surface of a semiconductor wafer with a gate of a high dielectric constant film formed thereon is heated to a target temperature for a short time by irradiating the surface with a flash of light. This promotes the crystallization of the high dielectric constant film while suppressing the growth of an underlying silicon dioxide film. Subsequently, the temperature of the semiconductor wafer subjected to the flash heating is maintained at an annealing temperature by irradiating the semiconductor wafer with light from halogen lamps. An annealing process after the flash heating is performed in an atmosphere of a gas mixture of hydrogen gas and nitrogen gas. The annealing process is performed on the semiconductor wafer in the atmosphere of the hydrogen-nitrogen gas mixture, so that defects present near the interfaces of the high dielectric constant film are eliminated by hydrogen termination.

A system for heating a patio, the system comprising: a head unit comprising a heating unit configured for heating a patio; an offset assembly, wherein the offset assembly is coupled to the head unit; a mounting pole comprising a plurality of sections, the mounting pole being coupled to the offset assembly; and a base unit the base unit supporting the mounting pole.

A semiconductor wafer is held by support pins horizontally. A susceptor and a heating plate are moved upwardly so that the semiconductor wafer is transferred from the support pins to the susceptor. At this time, a gas layer is sandwiched between the upper surface of the susceptor and the lower surface of the semiconductor wafer to cause the semiconductor wafer to float over the upper surface of the susceptor for about seventy seconds immediately after the semiconductor wafer is mounted on the upper surface of the susceptor. Then, flash lamps are lit up to perform flash heating while the semiconductor wafer is floating over the upper surface of the susceptor. Even when flashlight irradiation causes rapid thermal expansion of the wafer surface, the semiconductor wafer does not suffer a great stress. This can prevent the semiconductor wafer from breaking.

A method and system are provided for digitally injecting heat into a wide range of products by way of incorporation of a special class of semi-conductor lasers, e.g. surface emitting devices. This technique relates to a more specific, economical, and advantageous way of practicing the art of directly injecting narrowband radiant energy that desirously matches the absorption specification of a particular material at a specified wavelength.

An apparatus to be used by motor vehicle drivers under conditions such as freezing rain, sleet or snow to allow improved forward vision. Comprised of a conventional windshield wiper assembly having an electrically conductive arm and a first elongated conductor, such as an insulated wire having a first end opposite a second end is provided, wherein the first end terminated by a first terminal connection at the base end of the wiper arm, and the second end is terminated at the electrical ground plane of the motor vehicle. A second elongated conductor is terminated at one end by a second terminal connection at the distal end of the wiper arm, and at the opposing end is electrically connected to an imbedded heating element in the wiper blade. A third elongated conductor is electrically connected at one end to the electrically opposing terminal on the imbedded heating element in the wiper blade and is routed down the wiper arm and is held close the wiper arm by a harnessing means such as a plurality of spaced clip connectors. The opposing end of the third elongated conductor communicates directly with a voltage control regulator for controlling or stopping electrical current. The system is electrically connected to the motor vehicle's existing fuse box to serve as the electrical power source.

A radiant heater includes a radiant heat source and a reflector to direct the bulk of the heat generated by the radiant source in one direction. The shape of the reflector determines the radiant pattern of the heater, and generally defocuses the output to provide a diffuse heat pattern that is substantially free of hot spots.

An infrared ray lamp having a structure wherein a groove is formed in the vicinity of each of both end portions of a substantially plate heating element formed of a carbon-based substance, a carbon-based adhesive is applied to a region including the groove, and the end portion of the heating element is inserted into a slit formed at the end portion of a heat-emitting block having high conductivity so as to be sandwiched; by forming a reflection film on the glass tube of the infrared ray lamp, an infrared ray lamp having a desired emission intensity distribution is provided; a heating apparatus using this infrared ray lamp and method of producing the infrared ray lamp are also provided.

A susceptor of a holding part for holding a semiconductor wafer includes a disc-shaped holding plate, an annular shaped guide ring, and a plurality of support pins. The guide ring has an inside diameter greater than the diameter of the semiconductor wafer and is installed on the peripheral portion of the top face of the holding plate. The guide ring has a tapered surface along the inner circumference. The semiconductor wafer before irradiated with flash light is supported by the support pins. The annular shape of the guide ring increases the contact area when the semiconductor wafer that has jumped off the susceptor and fallen when irradiated with flash light collides with the guide ring, thus reducing the impact of the collision and preventing cracks in the substrate.