This invention relates to a
polishing device for the outer surface of aluminum
alloy profiles, comprising a
processing table with several fixed horizontal plates mounted on its top. A first conveyor frame and a second conveyor frame are mounted on the left and right ends of the top of the
processing table. Workpieces are placed on the first and second conveyor frames. The invention includes a lifting
assembly, a translation
assembly, a longitudinal
polishing mechanism, and a transverse
polishing mechanism. The
combined use of the lifting
assembly and the longitudinal polishing assembly allows the longitudinal polishing assembly to move up and down. The
combined use of the translation assembly and the transverse polishing mechanism allows the transverse polishing assembly to move back and forth horizontally. This avoids excessive localized wear caused by the
sisal wheel being in the same position during polishing, resulting in uniform surface wear of the
sisal wheel and reducing material loss.