Coating nozzle, coating device, and method for coating epoxy resin composition
A water-repellent coated nozzle with a pressurized application method addresses the challenge of stable adhesive application in small nozzles, ensuring continuous and high-quality adhesive application by minimizing backflow and thread formation.
Patent Information
- Application Number
- JP2021045182
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-03-18
- Publication Date
- 2025-01-24
- Estimated Expiration
- 2041-03-18
AI Technical Summary
Existing application methods using nozzles with inner diameters of 0.35 mm or less face challenges in stable and continuous adhesive application due to increased resistance and adhesive backflow, leading to quality issues such as thread formation and bridging.
A needle-shaped discharge pipe with an inner diameter of 0.35 mm or less, coated with a water-repellent film, and a pressurized application method to facilitate adhesive flow from the entrance to the exit, minimizing adhesive backflow and ensuring stable application.
The water-repellent coating reduces adhesive backflow, enabling stable and continuous application, preventing thread formation and bridging, thereby improving product quality.
Smart Images

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Abstract
Description
[Technical field]
[0001] The present invention relates to a coating nozzle, a coating device, and a method for coating an epoxy resin composition. [Background technology]
[0002] Patent Document 1 teaches a coating device having a restricting member that restricts the movement of a coating nozzle by contacting the surface of a printed circuit board so that the tip of the coating nozzle is kept at a certain distance from the surface of the printed circuit board when a coating agent in a cylinder is applied to the printed circuit board through the coating nozzle, characterized in that the surface of the tip of the coating nozzle is made non-adhesive with respect to the coating agent. The coating agent is an adhesive for fixing electronic components to the board, and an epoxy resin composition is generally used. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Japanese Utility Model Application Publication No. 03-120099 Summary of the Invention [Problem to be solved by the invention]
[0004] As electronic components become smaller, it is becoming necessary to reduce the amount of adhesive applied depending on the size of the electronic components. Therefore, when applying adhesive to a workpiece, application nozzles equipped with discharge pipes having an inner diameter of 0.35 mm or less have come to be used. However, when the inner diameter of the discharge pipe is 0.35 mm or less, it is difficult to apply the adhesive stably and continuously just by making the tip of the application nozzle non-sticky. When the inner diameter of the discharge pipe becomes smaller, the resistance between the adhesive and the inner wall that regulates the hollowness of the discharge pipe increases. As a result, the adhesive does not suck back sufficiently, which makes it easy for stringing to occur and reduces the quality of the product. [Means for solving the problem]
[0005] One aspect of the present invention relates to an application nozzle having a hollow space with an inner diameter of 0.35 mm or less, and a needle-shaped discharge pipe having an inlet for introducing adhesive into the hollow space and an outlet for discharging the adhesive toward a workpiece, wherein the entire area from the inlet to the outlet of an inner wall that regulates the hollow space of the discharge pipe, the tip of the discharge pipe on the outlet side, and at least a portion of the area of the outer wall of the discharge pipe that continues from the outlet to the outlet are covered with a water-repellent coating.
[0006] Another aspect of the present invention relates to an application device further comprising: the application nozzle described above, which has a main body having a liquid reservoir in which the adhesive is filled, and which is fixed to the main body such that the inlet of the discharge pipe communicates with the liquid reservoir; and a pressure unit that applies pressure to the adhesive filled in the liquid reservoir, moving the adhesive from the inlet to the hollow space, and then discharging the adhesive from the outlet.
[0007] Yet another aspect of the present invention relates to a coating method for coating an adhesive onto a workpiece using the coating device described above, in which the pressure unit applies pressure to the adhesive filled in the liquid reservoir, moving the adhesive from the inlet into the hollow space, and then discharging the adhesive from the outlet to contact the workpiece. Effect of the Invention
[0008] The adhesive separates easily from the outlet of the discharge pipe of the application nozzle, making it easier to apply the adhesive stably and continuously. [Brief description of the drawings]
[0009] [Figure 1] 1 is a front view showing a configuration of a coating device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a perspective view of a coating nozzle provided in the coating device. [Diagram 3] FIG. 2 is a vertical cross-sectional view of a coating nozzle. [Figure 4] FIG. 2 is an enlarged cross-sectional view of a main part of the application nozzle. [Diagram 5]1 is an explanatory diagram showing a state in which an adhesive is applied to a surface of a substrate using an application device according to an embodiment of the present invention. [Figure 6] FIG. 1 is an explanatory diagram showing a state in which an adhesive is applied to a surface of a substrate using a conventional application device. [Figure 7] FIG. 11 is another explanatory diagram showing a state in which an adhesive is applied to a surface of a substrate using a conventional application device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0010] Below, we will explain a coating nozzle (hereinafter also referred to as "coating nozzle A") and a coating device (hereinafter also referred to as "coating device A") according to one embodiment of the present invention, as well as a coating method using coating device A (hereinafter also referred to as "coating method A"); however, the present invention is not limited to the following embodiments.
[0011] (Application nozzle A) The application nozzle A has a needle-shaped discharge pipe. The discharge pipe has a hollow with an inner diameter of 0.35 mm or less, an inlet for introducing adhesive into the hollow, and an outlet for discharging the adhesive toward the work. That is, the discharge pipe of the application nozzle A has a structure in which the inner diameter of the hollow is extremely small and the sliding resistance with the adhesive moving through the hollow is likely to be large. The inner diameter of the hollow can be 0.33 mm or less, 0.30 mm or less, or 0.27 mm or less. The adhesive is introduced from the inlet, passes through the hollow, is discharged from the outlet, and is applied to the work. The inlet of the discharge pipe is located at one end of the discharge pipe, and the outlet is located at the other end. The work is a member to which the adhesive is applied, for example, a circuit member such as a board on which electronic components are mounted.
[0012] The entire area from the inlet to the outlet of the inner wall that regulates the hollow of the discharge pipe, the tip of the outlet side of the discharge pipe, and at least a part of the area of the outer wall of the discharge pipe that continues from the outlet to the outlet are covered with a water-repellent coating. The at least a part of the area of the outer wall of the discharge pipe that continues from the outlet to the outlet may be, for example, only the vicinity of the outlet of the outer wall, or may be an area from the outlet of the outer wall to 30% or more of the length of the discharge pipe. The entire area where the outer wall of the discharge pipe is exposed may be covered with a water-repellent coating, or the area from the outlet of the outer wall to the outlet and the middle of the main body described later may be covered with a water-repellent coating. That is, at least the entire area of the surface of the discharge pipe that may come into contact with the adhesive is covered with a water-repellent coating.
[0013] By covering the entire area of the inner wall of the hollow with a water-repellent coating, the sliding resistance between the inner wall and the adhesive is significantly reduced, making suck-back easy, even when the inner diameter of the discharge pipe (i.e., the diameter of the hollow) is very small, such as 0.35 mm or less. Suck-back is a phenomenon in which at least a part of the adhesive in the hollow is drawn into the inlet side of the discharge pipe when the application of pressure to discharge the adhesive from the outlet of the discharge pipe is stopped. Note that the stopping of the application of pressure to discharge the adhesive from the outlet of the discharge pipe includes the time when the applied pressure is reduced.
[0014] Furthermore, by covering the tip of the outlet side of the discharge pipe and at least a part of the area of the outer wall of the discharge pipe that continues from the outlet to the outlet with a water-repellent coating, adhesive is less likely to remain at the outlet of the discharge pipe and its vicinity. This effect, combined with the suck-back phenomenon, makes it easier for the adhesive to separate from the outlet of the discharge pipe of the application nozzle. As a result, the adhesive is less likely to become stringy, the shape of the adhesive applied to the workpiece is stabilized, and the quality of the product is improved.
[0015] If the entire area of the inner wall is not covered with the water-repellent coating, but only a portion of the inner wall is covered, sufficient suck-back does not occur. For example, if only the outlet of the inner wall of the discharge pipe and its vicinity are covered with the water-repellent coating, the suck-back of the adhesive is insufficient. As a result, the adhesive is likely to remain at the outlet of the discharge pipe and its vicinity, and the adhesive is likely to become stringy. In addition, if multiple discharge pipes are adjacent to each other at a short distance, the adhesive may wet and spread between the adjacent discharge pipes, causing a bridge. Therefore, it may be difficult to apply the adhesive stably and continuously.
[0016] For example, water-repellent resins, graphite fluoride, etc. may be used for the water-repellent coating. These may be used alone or in combination of two or more. Examples of water-repellent resins include fluororesins and silicone resins. Fluororesins are a general term for synthetic resins obtained by polymerizing olefins containing fluorine. Among fluororesins, -(CF2) n Particularly preferred is a fluororesin having a structure represented by - (where n is an integer of 1 or more) or CF3-. Examples of such fluororesins include polymer materials containing at least one monomer unit selected from the group consisting of tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride. Specific examples of fluororesins include polytetrafluoroethylene (PTFE), polyhexafluoropropylene, tetrafluoroethylene-perfluoroalkoxyethylene copolymers, perfluoroethylene-propylene copolymers, ethylene-tetrafluoroethylene copolymers, polyvinylidene fluoride, polychlorotrifluoroethylene, and ethylene-chlorotrifluoroethylene copolymers.
[0017] The application nozzle A may further have a main body having a reservoir filled with adhesive. In this case, the inlet of the discharge pipe may be fixed to the main body so as to communicate with the reservoir. That is, the adhesive is forced into the discharge pipe from the reservoir of the main body. The reservoir may also serve as a connection to a container that contains the adhesive. The container is, for example, a syringe-shaped container. The reservoir of the main body is, for example, attached to the discharge outlet at the tip of the syringe-shaped container.
[0018] The application nozzle A may further have a stopper that protrudes beyond the discharge pipe in the direction in which the discharge pipe extends from the main body. The end face of the stopper that faces the workpiece is farther from the main body than the outlet of the tip of the discharge pipe. Therefore, when the adhesive is discharged onto the workpiece, a distance is ensured between the tip of the outlet side of the discharge pipe and the workpiece. The shape of the stopper may be, for example, a columnar or pin-shaped shape that extends alongside the discharge pipe, or an annular or frame-shaped shape that surrounds at least a portion of the discharge pipe.
[0019] The end face of the stopper facing the workpiece and at least a part of the region continuing from the end face to the end face of the outer wall of the stopper may be covered with a water-repellent coating. This can suppress the phenomenon in which the adhesive adheres to the stopper adjacent to the discharge pipe and creeps up between the stopper and the discharge pipe. The at least a part of the region continuing from the end face to the end face of the outer wall of the stopper may be, for example, only the vicinity of the end face (tip) of the outer wall of the stopper, or may be a region from the end face to 30% or more of the length of the stopper. The entire region where the outer wall of the stopper is exposed may be covered with a water-repellent coating.
[0020] Furthermore, at least a portion of the main body may be covered with a water-repellent coating. The entire area of the exposed outer wall of the application nozzle A including the main body and the entire area of the inner wall may be covered with a water-repellent coating. This facilitates maintenance of the application nozzle A when, for example, solidified adhesive adheres to the application nozzle A. The water-repellent coating covering at least a portion of the stopper or at least a portion of the main body may be the same as the water-repellent coating covering at least a portion of the discharge pipe, or may be of a different type.
[0021] (Coating device A) The coating device A includes a coating nozzle A having a main body and a discharge pipe, and further includes a pressurizing unit that applies pressure to the adhesive filled in the liquid reservoir of the main body, moving the adhesive from the inlet into the hollow, and then discharging it from the outlet. The pressurizing unit is a device that applies pressure to the adhesive filled in the liquid reservoir. The pressurizing unit may be, for example, a pneumatic type (air pulse type), a volumetric type (mechanical type), a plunger type, or the like. The pneumatic type pressurizing unit includes, for example, an air pump, pneumatic piping, a regulator, a dispenser (discharge controller), or the like.
[0022] When the pressure applied by the pressurizing unit is stopped or the applied pressure is reduced, the pressure in the liquid reservoir drops. At that time, because the entire area of the inner wall of the discharge pipe is covered with a water-repellent coating, even though the inner diameter of the discharge pipe of application nozzle A is small at 0.35 mm or less, sufficient suck-back occurs in which at least a part of the adhesive in the hollow is drawn into the liquid reservoir. The suck-back reduces the adhesive between the workpiece and the outlet of the discharge pipe, and helps the adhesive in contact with the workpiece to separate from the outlet of the discharge pipe.
[0023] (Application method A) Coating method A is a method for coating an adhesive on a workpiece using coating device A. Coating method A includes a step of applying pressure to the adhesive filled in the liquid reservoir with a pressure unit to move the adhesive from the inlet of the discharge pipe into the hollow space, and then discharging the adhesive from the outlet to contact the workpiece.
[0024] When using coating device A equipped with coating nozzle A, stopping the application of pressure by the pressure unit (or reducing the applied pressure) and lowering the pressure in the liquid reservoir causes sufficient suck-back such that at least a portion of the adhesive in the hollow space is drawn into the liquid reservoir, promoting separation of the adhesive in contact with the workpiece from the outlet of the discharge pipe.
[0025] The adhesive is a liquid adhesive that has fluidity at room temperature (e.g., 25°C). The liquid adhesive contains at least a liquid component, and may contain a solid component. The liquid component contains a base resin. The solid component may contain an inorganic filler, carbon black, etc.
[0026] The adhesive may be a liquid epoxy resin composition. The epoxy resin composition contains an epoxy resin as a base resin, and may contain a curing agent (including a compound called a curing accelerator). General additives (such as a silane coupling agent and a dispersant) may be added to the epoxy resin composition.
[0027] The epoxy resin is not particularly limited, and for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol S type epoxy resin, fluorene type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, glycidylamine type epoxy resin, alicyclic epoxy resin, dicyclopentadiene type epoxy resin, novolac type epoxy resin, polyether type epoxy resin, silicone modified epoxy resin, reactive diluent having an epoxy group, etc. can be used. Here, the reactive diluent is preferably a monofunctional or bifunctional epoxy compound. Examples of the monofunctional epoxy compound include alkyl glycidyl ether or alkenyl glycidyl ether, which are alcohol ethers having 3 to 15 carbon atoms, and aromatic glycidyl ethers having one phenoxy group. Examples of the bifunctional epoxy compound include alkylene glycol diglycidyl ether, polyoxyalkylene diglycidyl ether, etc. These may be used alone or in combination of two or more.
[0028] The curing agent is not particularly limited, and examples thereof include phenolic resins, acid anhydrides, amine compounds, imidazole compounds, phosphorus compounds, phosphonium salt compounds, bicyclic amidines, organometallic complexes, urea compounds of polyamines, dicyandiamide, amine adduct-type aliphatic tertiary amines, microcapsule-type curing agents, etc. These may be used alone or in combination of two or more.
[0029] Hereinafter, the embodiment of the present invention will be described in more detail with reference to the drawings. Fig. 1 is a front view showing the configuration of a coating apparatus 100 (coating apparatus A) according to one embodiment of the present invention. Fig. 2 is a perspective view of a coating nozzle 10 provided in the coating apparatus 100. Fig. 3 is a vertical cross-sectional view of the coating nozzle 10. Fig. 4 is an enlarged cross-sectional view of a main part of the coating nozzle 10.
[0030] The coating apparatus 100 is an apparatus that coats an adhesive on a circuit board S (workpiece) mounted on a workbench 101. The coating apparatus 100 is used in a process of manufacturing a mounted board by mounting, for example, minute electronic components of JIS 0402 size or smaller (or even 0201 size or smaller) on the circuit board S.
[0031] The circuit board S is placed at a predetermined position on the workbench 101 by a board transport mechanism (not shown). A syringe-shaped container 20 filled with adhesive is placed vertically above the circuit board S. The syringe-shaped container 20 is held by a container holding section 40 of a moving device 30. The moving device 30 includes a lifting unit 31 to which the container holding section 40 is attached, and an XY table unit 32 that supports the lifting unit 31. The lifting unit 31 moves the container holding section 40 in the vertical direction (Z direction) above the workbench. The XY table unit 32 moves the container holding section 40 in the horizontal direction (XY direction) above the workbench. The movements of the lifting unit 31 and the XY table unit 32 are controlled by a control section (not shown).
[0032] The application nozzle 10 is attached to the outlet at the tip of a syringe-shaped container 20. The tip of an air pressure pipe 51 equipped to a pressurizing unit 50 is attached to the rear end of the syringe-shaped container 20. Air pressure controlled by a dispenser built into the pressurizing unit 50 is supplied from the air pressure pipe 51. The amount of adhesive discharged is adjusted by the dispenser. The operation of the pressurizing unit 50 is controlled by a control unit (not shown).
[0033] In the illustrated application nozzle 10, two needle-shaped discharge pipes 11 arranged in parallel protrude from a main body 12. Each of the two discharge pipes 11 has a hollow space with an inner diameter of 0.35 mm or less, an inlet 111 for introducing adhesive into the hollow space, and an outlet 112 for discharging the adhesive toward a workpiece.
[0034] The main body 12 has a cylindrical liquid reservoir 121 having an inner diameter sufficiently larger than the inner diameter of the discharge pipe 11, and a disk-shaped large diameter portion 122 closing one end of the liquid reservoir 121. The end of the discharge pipe 11 on the inlet 111 side is embedded in the main body 12 so as to penetrate the large diameter portion 122, so that the inlet 111 of the discharge pipe 11 is connected to the liquid reservoir 121. The adhesive is forced into the hollow of the discharge pipe 11 from the liquid reservoir 121 via the inlet 111. The end of the main body 12 opposite to the large diameter portion 122 has a connecting portion 123 with a discharge port at the tip of a syringe-shaped container 20 that contains the adhesive (see FIG. 2). The connecting portion 123 is not shown in FIG. 3.
[0035] A columnar stopper 124 protrudes from the large diameter portion 122 of the main body 12 in the extension direction of the discharge pipe 10. The end face of the stopper 124 facing the circuit board S is farther from the main body 12 than the outlet 112 at the tip of the discharge pipe 10. The stopper 124 comes into contact with the circuit board S when the lifting unit 31 descends to discharge the adhesive onto the circuit board S, thereby ensuring a separation distance between the outlet 112 of the discharge pipe 10 and the circuit board S.
[0036] The entire area from the inlet to the outlet of the inner wall that regulates the hollow of the discharge pipe 11, the tip of the outlet side of the discharge pipe, and the entire area where the outer wall of the discharge pipe is exposed are covered with a water-repellent coating C. The part of the discharge pipe 11 embedded in the large diameter part 122 at the end on the inlet 111 side does not have an exposed outer wall, and does not need to be covered with the water-repellent coating C. In other words, the part of the outer wall of the discharge pipe 11 embedded in the main body part 12 is not included in the area where the outer wall is exposed.
[0037] FIG. 5 shows a state where adhesive R is applied to the surface of a circuit board S using an application device 100. FIG. 6 shows a state where adhesive R is applied to the surface of a circuit board S using an application device equipped with a conventional discharge pipe 11X. In FIG. 5(a) and FIG. 6(a), the end face of a stopper (not shown) abuts against the circuit board S, and adhesive R discharged from the outlet of the discharge pipe contacts the circuit board S. FIG. 5(b) and FIG. 6(b) show a state where pressure application by the pressurizing unit 50 is stopped and the discharge pipe 11 is raised. The inner diameter of the discharge pipe 11 is 0.35 mm or less (or even 0.33 mm or less, or 0.30 mm or less). The conventional discharge pipe 11X does not have a water-repellent coating C.
[0038] First, the XY table unit 32 positions the syringe-shaped container 20 held by the container holder 40 above the circuit board S. Next, the lifting unit 31 lowers the application nozzle 10 together with the syringe-shaped container 20, and when the end face of the stopper 124 abuts against the circuit board S, air pressure is supplied from the pressurizing unit 50 to the air pressure piping 51. This applies pressure to the adhesive R filled in the liquid reservoir of the main body, and the adhesive R is discharged from the outlet 112 of the discharge pipe 11 and applied to the circuit board S. Next, the supply of air pressure by the pressurizing unit 50 is stopped, and the lifting unit 31 raises the syringe-shaped container 20 and the application nozzle 10.
[0039] In the case where the entire area of the inner wall of the hollow of the discharge pipe 11 is covered with the water-repellent coating C, when the supply of air pressure by the pressurizing unit 50 is stopped, the pressure in the liquid reservoir 121 drops, and suck-back occurs, in which at least a part of the adhesive R in the hollow of the discharge pipe 11 is drawn into the liquid reservoir 121. The suck-back reduces the adhesive R present between the circuit board S and the outlet 112 of the discharge pipe 11, and assists in the separation of the adhesive R in contact with the circuit board S from the outlet 112 of the discharge pipe. Therefore, as shown in FIG. 5(b), the adhesive R easily separates from the outlet 112 of the discharge pipe 11 without stringing. Residual adhesive R is also less likely to adhere to the outlet 112 of the discharge pipe 11 and its vicinity.
[0040] On the other hand, since the hollow inner wall of the conventional discharge pipe 11X is not covered with the water-repellent coating C, the adhesive R is likely to form strings and remain at the outlet 112X of the discharge pipe 11X and its vicinity, as shown in FIG. 6(b). In addition, as shown in FIG. 7, when multiple discharge pipes 11X are adjacent to each other at a short distance, the adhesive R may wet and spread between the adjacent discharge pipes 11X, causing a bridge. Note that some conventional discharge pipes have a hollow inner wall partially covered with the water-repellent coating C, but sufficient suck-back does not occur even if only a part of the inner wall is covered.
[0041] Although not shown, in the application nozzle 100, the end face of the stopper 124 facing the circuit board S and the entire area from the end face of the outer wall of the stopper 124 to the main body 12 are also covered with a water-repellent coating C. Furthermore, at least a part (preferably the entire area) of the inner wall of the liquid reservoir 121 of the main body 12 may be covered with the water-repellent coating C. Furthermore, at least a part (preferably the entire area) of the outer wall of the main body 12 may be covered with the water-repellent coating C. This suppresses adhesion of the adhesive R to the application nozzle 10, and even if the adhesive R adheres to the main body of the application nozzle 10, it becomes easy to remove it. [Industrial Applicability]
[0042] The coating nozzle, coating device, and coating method according to the present invention are suitable for coating an adhesive, such as an epoxy resin composition, onto a circuit component, and are particularly effective when coating an adhesive to fix a minute electronic component, which is equal to or smaller than the Japanese Industrial Standard 0402 size (or even equal to or smaller than 0201 size), to a substrate when mounting the electronic component on the substrate. [Explanation of symbols]
[0043] 10: Application nozzle 11, 11X: Discharge pipe 111:Entrance 112, 112X: Exit 12: Main body 121: Liquid reservoir 122: Large diameter section 123:Connection part 124: Stopper 20: Syringe-shaped container 30: Mobile device 31: Lifting unit 32: XY table unit 40: Container holding part 50: Pressurizing unit 51: Pneumatic piping 100: Coating device 101: Workbench S: Circuit board C: Water repellent coating R: Adhesive
Claims
1. a needle-shaped discharge pipe having a hollow with an inner diameter of 0.35 mm or less and an inlet for introducing an adhesive into the hollow and an outlet for discharging the adhesive toward a workpiece; an entire area from the inlet to the outlet of an inner wall that defines the hollow of the discharge pipe, a tip of the discharge pipe on the outlet side, and at least a part of an area of an outer wall of the discharge pipe that continues from the outlet to the outlet are covered with a water-repellent coating; An application nozzle in which, when the application of pressure to discharge the adhesive from the outlet of the discharge pipe is stopped or reduced, at least a portion of the adhesive within the hollow is drawn into the inlet side of the discharge pipe.
2. The application nozzle according to claim 1 , wherein an entire area of the outer wall of the discharge pipe where the outer wall is exposed is covered with the water-repellent coating.
3. The application nozzle according to claim 1 , wherein the water-repellent coating comprises a fluororesin.
4. moreover, a main body having a liquid reservoir into which the adhesive is filled, The application nozzle according to any one of claims 1 to 3, wherein the inlet of the discharge pipe is fixed to the main body portion so as to communicate with the liquid reservoir portion.
5. moreover, a stopper that protrudes beyond the discharge pipe in a direction in which the discharge pipe extends from the main body portion so as to define a distance between the outlet end of the discharge pipe and the workpiece when the adhesive is discharged onto the workpiece; The application nozzle according to claim 4 , wherein an end face of the stopper facing the workpiece and at least a part of an area of the outer wall of the stopper continuing from the end face to the end face are covered with a water-repellent coating.
6. The application nozzle according to claim 4 ; a pressurizing unit that applies pressure to the adhesive filled in the liquid reservoir to move the adhesive from the inlet to the hollow space, and then discharges the adhesive from the outlet.
7. 7. The coating device according to claim 6, wherein when the application of the pressure by the pressurizing unit is stopped, the pressure in the liquid reservoir decreases, and at least a portion of the adhesive in the hollow is drawn into the liquid reservoir, thereby reducing the amount of adhesive present between the workpiece and the outlet.
8. A coating method for coating an adhesive on a workpiece using the coating device according to claim 6, comprising the steps of: The adhesive application method includes applying pressure to the adhesive filled in the liquid reservoir section by the pressurizing unit, moving the adhesive from the inlet to the hollow space, and then ejecting the adhesive from the outlet to contact the workpiece.
9. 9. The coating method according to claim 8, further comprising: stopping application of the pressure by the pressurizing unit to reduce the pressure in the liquid reservoir and drawing at least a portion of the adhesive in the hollow toward the liquid reservoir, thereby reducing the amount of adhesive present between the workpiece and the outlet and assisting in separation of the adhesive in contact with the workpiece from the outlet.
Citation Information
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