Bending device and folding method using the same

Abstract

The present invention provides a bending apparatus and a bending method that can further reduce the time required for die replacement and contribute to improved productivity. [Solution] A bending device 1 according to one aspect of the present invention is fixed to a pair of side frames 2 and has multiple racks on which an upper die can be placed, an upper die fixing mechanism for the ram, an upper die gripping mechanism for the transport unit, a transport unit between the rack and the ram, a backgage for positioning the workpiece, and a moving unit for moving the backgage independently of the multiple racks. Also, a method for processing with the bending device includes a step of mounting an upper die to position the workpiece, driving the ram to press the workpiece in combination with a lower die, and a step of removing the upper die fixed to the multiple racks and gripping it.

Description

[Technical field]

[0001] The present invention relates to a bending device and a bending method using the same. [Background technology]

[0002] Generally, a bending device is equipped with an upper die (punch die) and a lower die (die die) that receives it, and the workpiece to be bent is placed between the upper die and the die die, which then clamps the workpiece with great force and performs bending on it.

[0003] Incidentally, in recent years, with increasing user needs and the increasing sophistication of products, the variety of bending processes has become more pronounced, and it has become necessary to prepare multiple types of punches and dies for use in this process.

[0004] However, the upper and lower dies, especially the upper die, may need to be replaced depending on the bending sequence, and the time required for replacing the upper die leads to a decrease in productivity. Therefore, it is very important to shorten the time required for this replacement.

[0005] Regarding the above, for example, the following Patent Document 1 discloses a technique for mounting a die unit on the tip of the ram by arranging multiple movable arms with die units attached to the front and rear of the ram and moving the movable arms. Also, the following Patent Document 2 discloses a press machine having a die storage section fixed to a backgauge device and a die exchange section that is movable in the vertical and front-rear directions and can be tilted. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2015-223594 A [Patent Document 2] JP 2003-136144 A Summary of the Invention [Problem to be solved by the invention]

[0007] However, the technology described in Patent Document 1 has a problem in that a movable arm is required for each mold unit. Therefore, it is necessary to secure a range of motion for each movable arm, and a drive device such as a cylinder is required for each movable arm. Therefore, the increase in mold units significantly increases the size and cost of the device, and problems remain such as limited working space to avoid the range of motion of each movable arm.

[0008] Furthermore, in the technology described in Patent Document 2, the die storage section is fixed to the backgauge, and the die replacement operation cannot be performed while the backgauge device is in use. In this respect, there remains an issue in reducing the time required for die replacement.

[0009] In view of the above, an object of the present invention is to provide a bending apparatus and a bending method that can reduce the time required for die replacement and contribute to improved productivity. [Means for solving the problem]

[0010] A bending device according to one aspect of the present invention which solves the above-mentioned problems comprises a pair of side frames, a number of racks fixed to the side frames and on which an upper die can be placed, a ram which has an upper die fixing mechanism for a ram for fixing the upper die and which can move up and down, a transport unit which has an upper die gripping mechanism for a transport unit for gripping the upper die and transports the upper die gripping mechanism for the transport unit between the rack and the ram, a backgage which positions the workpiece, and a backgage moving unit which moves the backgage independently of the multiple racks.

[0011] Also, in this respect, although not limited thereto, it is preferable that the racks are fixed to the side frame so that their installation positions are lowered along the direction away from the ram.

[0012] Also, in this respect, although not limited thereto, it is preferable that the conveying unit comprises an axial member, a rotation mechanism for rotating the axial member, and a moving mechanism for moving the axial member up and down and back and forth, and that the upper mold gripping mechanisms for the conveying unit are arranged in multiple numbers around the axial member along the circumferential direction of the axial member.

[0013] In addition, in this aspect, although not limited thereto, a gripping protrusion is provided on a side surface of the upper die, It is preferable that the upper mold gripping mechanism for the transport unit grips the upper mold by gripping the gripping protrusions.

[0014] Also, in this respect, although not limited thereto, it is preferable that all of the multiple racks are fixed to the side frame at a position above the upper mold fixing mechanism for the ram on the ram.

[0015] In addition, in this respect, although not limited to this, it is preferable to have a lower mold gripping mechanism that holds a lower mold corresponding to the upper mold mounted on the ram, and a bed that holds the lower mold gripping mechanism.

[0016] In addition, in this respect, although not limited thereto, it is preferable to provide a lower mold slide unit that slides the lower mold gripping mechanism.

[0017] In addition, a bending method according to another aspect of the present invention is a bending method for bending a workpiece using a bending device having a pair of side frames, a plurality of racks fixed to the side frames and on which an upper die can be placed, a ram having an upper die fixing mechanism for a ram for fixing the upper die and movable up and down, a transport unit having an upper die gripping mechanism for a transport unit for gripping the upper die, and transporting the upper die gripping mechanism for the transport unit between the rack and the ram, a backgage for positioning the workpiece, and a backgage moving unit for moving the backgage independently of the plurality of racks, the bending method having a press step of attaching a first upper die to the upper die fixing mechanism for a ram of the ram, positioning the workpiece by the backgage, and driving the ram to press the workpiece in combination with a lower die, and during the press step, a transport unit upper die preparation and attachment step of removing a second upper die fixed to the plurality of racks from the rack and having it gripped by the upper die gripping mechanism for a transport unit of the transport unit.

[0018] In addition, in this respect, although not limited thereto, it is preferable to have a rack upper mold return step in which, during the press step, the third upper mold held by the conveying unit is removed from the conveying unit and placed on the rack. Effect of the Invention

[0019] As described above, the present invention can provide a bending device and a bending method that can further shorten the time required for die replacement and contribute to improved productivity. [Brief description of the drawings]

[0020] [Figure 1] 1 is a diagram showing an outline of a bending device according to an embodiment when viewed obliquely from the front. [Diagram 2] 1 is a schematic diagram showing a bending device according to an embodiment of the present invention when viewed obliquely from behind; [Diagram 3] FIG. 2 is a schematic cross-sectional view of a bending device according to an embodiment. [Figure 4]1 is a diagram showing an outline of a specific structure of a rack in a bending device according to an embodiment; [Diagram 5] 4 is a diagram showing an outline of the arrangement of racks in the bending device according to the embodiment; FIG. [Figure 6] 5A to 5C are diagrams illustrating an outline of the operation of mounting and removing a rack in the bending device according to the embodiment. [Figure 7] 13 is a diagram showing the relationship between a rack in the bending device according to the embodiment and an upper die gripping mechanism for the transport unit of the transport unit. FIG. [Figure 8] 4A to 4C are diagrams showing a specific example of an upper die in the bending device according to the embodiment; [Figure 9] 4A to 4C are diagrams illustrating an outline of specific steps of bending a workpiece using upper and lower dies in a bending device according to an embodiment. [Figure 10] 11A to 11C are diagrams showing examples of gripping protrusions of an upper die in a bending device according to an embodiment. [Figure 11] FIG. 2 is a diagram illustrating an outline of a ram drive unit in the bending device according to the embodiment. [Figure 12] 1 is a diagram showing an outline of an upper die fixing mechanism for a ram in a bending device according to an embodiment of the present invention; FIG. [Figure 13] 4 is a diagram illustrating an outline of a conveying unit in the folding device according to the embodiment; FIG. [Figure 14] 13 is a diagram showing an outline of an upper die gripping mechanism for a conveying unit in the bending device according to the embodiment. FIG. [Figure 15] 10A to 10C are diagrams illustrating an outline of the operation of a conveying unit in the folding device according to the embodiment. [Figure 16] FIG. 2 is a diagram illustrating an outline of a back gauge in the bending device according to the embodiment. [Figure 17] FIG. 2 is a diagram showing an outline of a backgage moving unit in the bending device according to the embodiment. [Figure 18] 10A to 10C are diagrams showing a specific example of a lower die in the bending device according to the embodiment. [Figure 19]1A to 1C are diagrams illustrating a specific example of a lower die according to an embodiment. [Figure 20] 1 is a diagram showing an outline of a lower mold gripping mechanism according to an embodiment of the present invention; [Figure 21] 1A to 1C are diagrams illustrating an outline of one step of a bending method according to an embodiment. [Figure 22] 1A to 1C are diagrams illustrating an outline of one step of a bending method according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. However, the present invention can be embodied in many different forms, and is not limited to the specific examples described in the following embodiments.

[0022] FIG. 1 is a diagram showing an outline of a bending device (hereinafter referred to as "this device") 1 according to this embodiment when viewed diagonally from the front, FIG. 2 is a diagram showing an outline of this device 1 when viewed diagonally from behind, and FIG. 3 is a schematic cross-sectional view for explaining the inside of this device 1.

[0023] As shown in these figures, the apparatus 1 comprises a pair of side frames 2, a number of racks 3 fixed to the side frames 2 and on which the upper die PD can be placed, a ram 4 which has an upper die fixing mechanism 41 for the ram for fixing the upper die PD and which can move up and down, a transport unit 5 which has an upper die gripping mechanism 51 for the transport unit for gripping the upper die PD and transports the upper die gripping mechanism 51 for the transport unit between the rack 3 and the ram 4, a backgage 6 which positions the workpiece W, and a backgage moving unit 7 which moves the backgage 6 independently of the multiple racks 3.

[0024] This device 1 can provide a bending device and a bending method that can reduce the time required for die replacement and contribute to improved productivity. The operation of this device 1 and the effects it brings about will become clear from the following description. This device 1 can use the area between the side frames 2 as the processing area; in other words, if the distance between the side frames 2 is increased, a correspondingly larger workpiece W can be processed. In addition, "up and down" here means perpendicular to the installation surface G on which this device 1 is installed, specifically, a direction along the vertical direction, with up meaning the direction away from the installation surface G and down meaning the direction approaching the installation surface.

[0025] First, as described above, the present device 1 has a pair of side frames 2. The side frames 2 are members that form the framework of the present device 1, and literally function as frame members on the sides of the present device 1, supporting the various members described below.

[0026] Furthermore, it is also preferable that the device 1 includes not only a pair of side frames 2, but also a connecting member 21 for connecting the side frames 2. This makes it possible to reliably maintain the distance between the side frames 2. Note that the device 1 may also be configured to include a cover member 22 that covers at least a portion of the upper surface, lower surface, front surface, and back surface in addition to the side frames 2. This divides the space that houses each component of the device 1, ensuring safety and protecting each component.

[0027] As described above, the apparatus 1 has the rack 3. The rack 3 is fixed to the side frames 2 and is capable of carrying the upper mold PD. An example of a specific structure of the rack 3 is shown in Fig. 4. The racks 3 are provided facing each other at positions at the same height from the installation surfaces G of the side frames 2. This is because the upper mold PD has a horizontally elongated shape extending to the left and right and therefore needs to be supported at both ends.

[0028] The structure of the rack 3 is not limited as long as it can accommodate the upper fitting PD as described above and can remove the upper fitting PD as necessary, but it is preferable that the rack 3 has, for example, a support portion 31 for supporting the upper mold PD.

[0029] The support part 31 in the rack 3 is not limited as long as it can support the upper mold PD as described above, but a preferable form is a substantially L-shaped structure equipped with a lower support part 311 and a side support part 312. The substantially L-shaped structure makes it possible to support the lower surface and side surface of the upper mold PD, while allowing the upper mold PD to be easily removed without unnecessarily lifting it up by sliding it laterally from the lower support part 311. However, it is preferable to provide the lower support part 311 with a tip protrusion 313 that does not easily fall off.

[0030] In this apparatus 1, it is preferable that there are multiple racks 3, specifically the number of racks fixed to one side frame 2 (which is also the number of sets of racks provided in a pair of side frames 2). Although it is possible to have only one rack 3, this apparatus 1 is premised on the replacement of multiple upper dies PD, so by providing multiple racks, it is possible to place and store unused upper dies PD. Specifically, it is preferable that there are two or more, preferably three or more, and even more preferably four or more, and this can be adjusted appropriately depending on the size of this apparatus 1 and the type of processing of the workpiece W that is envisioned.

[0031] As is clear from the above description, the workpiece W is an object to be bent by the apparatus 1, and is preferably a metal plate, although it is not limited to this object as long as it is an object to be bent. In the apparatus 1, the initially flat workpiece W is sandwiched between the upper die PD and the lower die DD and pressed (pressed) to be bent into a desired shape. By performing this bending process multiple times, it is possible to obtain a more complex shape, and in particular, by changing the set of the upper die PD and the lower die DD, it is possible to obtain a more complex shape.

[0032] In addition, in this device 1, it is preferable that the racks 3 are fixed to the side frame so that the installation position is lower along the direction away from the ram 4. FIG. 5 shows an example in which four racks 3 are arranged. In this way, the racks 3 are arranged with gaps between them, and the racks are arranged so that the positions are lower along the direction away from the ram 4, which makes it easy to place and remove the upper die PD. More specifically, the setting position is gradually lowered to provide a step, so that the side of the upper die PD in the rear stage (the side farther from the ram) has a portion that does not overlap with the rack 3 in the front stage (the side closer to the ram) in the horizontal direction, and it becomes easy to grip the upper die PD within the range of this non-overlapping portion. The operation in this case is outlined in FIG. 6. The height of this non-overlapping portion is not particularly limited, but is preferably higher than the height of the upper die gripping mechanism 51 for the transport unit in the transport unit 5, which will be described in detail later, more specifically, the distance from the upper end 511 of the upper die holding mechanism 51 for the transport unit to the lower end 5121 of the upper die insertion portion 512. In this way, the transport unit 5, specifically the upper die gripping mechanism for the transport unit, does not interfere with the adjacent rack 3. An image of this case is shown in Fig. 7.

[0033] In addition, in this apparatus 1, the upper die PD is used in combination with the lower die DD, and is an essential component for operating this apparatus 1. However, it is a component that can be replaced as appropriate depending on the type of bending processing, etc., and it may be preferable to remove it when this apparatus 1 is not being operated, for example, during maintenance or transportation.

[0034] The upper die PD is used in combination with the lower die DD as described above, and specifically, the upper die PD preferably has a convex portion PDB and a holder portion PDH. The convex portion PDB of the upper die PD engages with the concave portion DDD of the lower die DD, and the workpiece to be bent can be bent into a desired shape by sandwiching it between them. The holder portion PDH is a portion for holding the convex portion PDB and making it easy to transport, and is a common portion in multiple dies PD. That is, in multiple upper dies PD, the convex portion PDB has a different shape for each die, and the holder portion PDH is a common portion. FIG. 8 shows a specific example of the upper die PD, and FIG. 9 shows an outline of a specific process of bending a workpiece using the upper die PD and the lower die DD. Note that the above figure shows a specific example of the upper die PD, but since it can be appropriately adjusted depending on the type of bending as described above, it is not limited to only these examples.

[0035] As described above, the number of upper dies PD can be appropriately adjusted depending on the type and number of desired folding processes, and can be adjusted accordingly in accordance with the number of racks 3. Specifically, the number may be one, but is preferably two or more, more preferably three or more, and even more preferably four or more, but is not limited thereto.

[0036] In addition, in the present apparatus 1, although not limited thereto, it is preferable that a gripping protrusion PDN is further formed on the holder portion PDH of the upper die PD. The reason for this will be described in detail later, but by forming this gripping protrusion PDN, the upper die PD can be stably attached to the upper die gripping mechanism for the transport unit 51. An outline of this case is shown, for example, in FIG. 10. As shown in this figure, it is preferable that a hole PDNB is formed in the gripping protrusion PDN. By forming this hole PDNB, it is possible to reliably hold the upper die PD while positioning it in the upper die holding mechanism for the transport unit 51 and the upper die fixing mechanism for the ram 41, which will be described later. This portion will also be described in detail later.

[0037] As described above, the present device 1 has the ram 4. The ram 4 has an upper die fixing mechanism for the ram 41 for mounting the upper die PD, is vertically movable, and is disposed at the upper front portion of the present device 1. By mounting the upper die PD on the ram 4 and moving it vertically, as described above, the distance between the upper die PD and the lower die DD can be adjusted, and the upper die PD and the lower die DD can be meshed to realize bending processing of the work. Note that the upper die fixing mechanism for the ram 41 for fixing the upper die PD to the ram 4 is preferably formed near the lower end of the ram 4. In this way, the convex portion PDB of the die PD can be protruded below the lower end of the ram 4 and meshed with the lower die DD.

[0038] The device 1 also includes a ram drive unit 9 for enabling the ram 4 to move up and down. The ram drive unit 9 is not limited as long as it can control the up and down movement of the ram 4, but it is preferable that the ram drive unit 9 includes a power mechanism 91, a shaft member 92 reciprocated by the power mechanism 91, a connection member 93 connecting the shaft member 92 and the ram 4, and a fulcrum member 94 serving as a fulcrum for the connection member 93, as shown in Fig. 11 for example. With this configuration, the shaft member 92 moves up and down by the power mechanism 91, and this up and down movement is transmitted to the ram 4 through the fulcrum member 94, allowing the ram 4 to move up and down.

[0039] 12 shows a specific example of the upper die fixing mechanism for the ram 41. The upper die fixing mechanism for the ram 41 preferably has an upper die inserting section 411 and a pressing member 412 for pressing the upper die PD inserted into the upper die inserting section 411. This makes it possible to insert the upper die PD, more specifically the gripping protrusion PDN of the upper die PD, and stably hold it. As shown in this figure, the pressing member 412 is not limited as long as it can press the gripping protrusion PDN of the upper die PD inserted into the upper die inserting section 411 to fix it to the ram 4, but it is preferable for stable fixation that a plurality of pressing members are provided distributed along the left-right direction of the ram 4.

[0040] In addition to the ram upper die fixing mechanism 41, the ram 4 is also preferably provided with a ram upper die correction mechanism 42. As described above, the upper die PD has a long shape in the left-right direction, and therefore deflection (a gap between the ram 4 and the upper die PD) may occur in the middle part. Therefore, in order to prevent this deflection, it is preferable to provide a ram upper die correction mechanism 42 that presses the upper die PD against the ram 4.

[0041] As described above, the present apparatus 1 also has the transport unit 5. The transport unit 5 has an upper mold gripping mechanism for transport unit 51 for mounting the upper mold PD, and transports the upper mold gripping mechanism for transport unit 51 between the rack 3 and the ram 4. By having the transport unit 5, the present apparatus 1 can remove the upper mold PD held in the rack 3 and mount it on the ram 4, and can also remove the upper mold PD mounted on the ram 4 and hold it in the rack 3. In other words, it becomes possible to replace the upper mold PD.

[0042] FIG. 13 is a diagram showing an outline of the transport unit 5 in the present device 1. As described above, the transport unit 5 is not limited as long as it can replace the upper die PD, but includes a shaft member 52, a rotation mechanism 53 for rotating the shaft member 52, a movement mechanism 54 for moving the shaft member 52 up and down and back and forth, and a power mechanism 55 for driving the rotation mechanism 54 and the movement mechanism. This allows the rotation shaft 52 to be freely rotated and moved up and down and back and forth, and the upper die PD can be easily transported between the rack 3 and the ram 4 and attached and detached. As is clear from the above description, the term "front and back" here refers to a horizontal direction and a direction away from the ram is the rear, and a direction approaching the ram is the front. And "left and right" refers to a horizontal direction and a direction perpendicular to the front and back directions, and the right direction when the present device 1 is viewed from the front is defined as the right, and the left direction is defined as the left.

[0043] FIG. 14 shows an outline of the upper mold gripping mechanism 51 for the conveying unit in the present device 1. The upper mold gripping mechanism 51 for the conveying unit is formed with an upper mold inserting portion 512 for inserting the upper mold PD, specifically the holding protrusion PDN of the upper mold PD, into which the holding protrusion PDN of the upper mold PD is inserted, and the upper mold PD can be securely held by literally inserting the holding protrusion PDN of the upper mold into the upper mold and pressing it, and can be removed by releasing it. In addition, the upper mold gripping mechanism 51 for the conveying unit is preferably provided with a pressing member 513 for pressing the upper mold PD. By using the pressing member 513, the upper mold PD can be pressed and fixed inside the upper mold inserting portion 512, and the holding protrusion PDN of the upper mold PD can be securely gripped. In addition, as described above, when a hole PDNB is formed in the holding protrusion PDN of the upper mold PD, the tip of the pressing member 513 preferably has a convex portion 5131 to be inserted into the hole PDNB. Forming the convex portion 5131 in this manner has the advantage that when the convex portion 5131 is inserted into the position of the hole PDNB, the positions of the upper mold PD and the mold gripping mechanism for the transport unit 51 can be reliably determined. Furthermore, in this case, it is preferable that the hole PDNB has a stepped shape, and the convex portion 5131 also has a stepped shape corresponding to this. In this way, it is possible to prevent misalignment and perform reliable positioning. Note that the height of the upper mold gripping mechanism for the transport unit 51 in the transport unit is adjusted, and the rack 3 is fixed to the side frame 2 with a gap and a further step, so that it is preferable that when an upper mold placed on the rack 3 is to be gripped, it does not come into contact with the lower end of the previous stage of the rack 3.

[0044] In addition, it is preferable that the upper mold gripping mechanism 51 for the transport unit is arranged in a plurality of ways along the circumferential direction of the shaft member 52. Here, the "circumferential direction" means the direction along the trajectory along which the shaft member 52 moves when it is rotated. In this embodiment, by arranging the upper mold gripping mechanism 51 for the transport unit in a plurality of ways, it is possible to hold, transport, and attach / detach multiple upper molds at once by rotating the shaft member 52. An outline of the operation in this case is shown in FIG. 15. In this case, it is preferable that the multiple upper mold gripping mechanisms 51 for the transport unit are arranged in the same direction along the circumferential direction. This is because the molds can always be oriented in the same direction when the shaft member 52 is rotated. The number of the upper mold gripping mechanisms 51 is not limited as long as the molds can be held to a degree that does not contact each other, and may be four or three, but it is preferable that the number is two. By using two mechanisms, it is possible to hold one for installation on the ram 4 and the other for removal from the ram 4 and return to the rack 3.

[0045] As is clear from the above figure, in this device 1, although not limited thereto, each of the above-mentioned multiple racks 3 is fixed to the side frame at a position above the mounting position of the upper die PD on the ram 4, and preferably the lower end of the ram 4 (if multiple racks are present, the lower end of the lowest rack 3) is located above the upper end of the ram upper die fixing mechanism 41 on the ram 4. With this arrangement, when the upper die PD is removed from the ram 4, it is possible to hang the upper die PD on the rack 4 without further lowering the position of the shaft member 52 of the transport unit 5. As a result, not only can the transport route of the upper die be minimized, but the movement of the backgage moving unit 7 described later is not hindered. In addition, since the multiple racks 3 are located above, it is possible to secure the operating space of the transport unit 5, specifically the rotation space of the rotation shaft 52, in this portion, which is useful.

[0046] As described above, the present apparatus 1 also has the backgauge 6. The backgauge 6 determines the position of the workpiece. Figure 16 shows an outline of the backgauge 6. The provision of the backgauge 6 has the advantage that it is possible to determine the insertion position of the workpiece W relative to the present apparatus 1, thereby enabling the desired bending process to be achieved.

[0047] As described above, the apparatus 1 has the backgage moving unit 7. The backgage moving unit 7 moves the backgage independently of the multiple racks. By providing the backgage moving unit 7, the insertion position of the workpiece W can be specified, and the desired bending process can be achieved.

[0048] In addition, the structure of the backgage movement unit 7 of the present device 1 is not limited, but is preferably configured to have a forward / backward movement mechanism 71 for moving the backgage forward / backward, a left / right movement mechanism 72 for moving the backgage left / right, and a power source 73 for moving these, as shown in Fig. 17. This makes it possible to install the backgage at a desired position. In particular, according to the present device 1, the rack 3 and the transport unit 5 are provided as separate components, and therefore can move independently without being linked to their movements, thereby shortening the time required for die replacement and contributing to improved productivity.

[0049] In addition, in the present device 1, although not limited thereto, it is preferable to have a lower die gripping mechanism 81 that holds a lower die DD corresponding to an upper die PD mounted on the ram 4, and a bed 8 that holds the lower die gripping mechanism 81. Here, FIG. 18 shows a specific example of the lower die DD, and FIG. 19 shows an outline of the lower die gripping mechanism 81. The bed 8 is also a member that covers the lower front surface of a pair of side frames. As is already clear from the above description, the lower die DD is a die that corresponds to the upper die PD, and a recessed portion DDD that corresponds to the protruding portion PDB of the upper die PD is formed. In addition, the lower die gripping mechanism is mounted on the bed 8, and its structure can adopt a configuration similar to that of the upper die fixing mechanism for ram 41 shown above.

[0050] In addition, in the present device 1, it is preferable to provide a lower die slide unit 10 that slides the lower die gripping mechanism 81. In this embodiment, a plurality of upper dies PD are provided, and by appropriately replacing them, the types of processing by the upper die PD can be increased, while the lower die DD must also have a recess that matches the upper die PD. However, in the lower die DD, a plurality of recesses that match the convex portions of the plurality of upper dies are provided in advance, and it is possible to respond by only slightly shifting the position of the lower die DD without changing the lower die DD. Therefore, by providing the lower die slide unit 10, it is possible to obtain the same effect as die replacement. FIG. 20 shows an outline of the plate die slide unit 10.

[0051] The structure of the lower die slide unit 10 in the present device 1 is not particularly limited, but it is preferable that the lower die slide unit 10 has, for example, a power mechanism 101 and a moving member 102 connected to the power mechanism 101 and moves back and forth to move the lower die gripping mechanism 81. This makes it possible to move the lower die in the front-back direction.

[0052] (How to fold) Furthermore, as is clear from the configuration of the present device 1 described above, by using the present device 1, it is possible to realize a bending method that shortens the time required for changing dies in bending processing of a workpiece, thereby contributing to improved productivity. That is, the bending method of the workpiece according to the present embodiment (hereinafter referred to as "the method") is a bending method for bending a workpiece using a bending device having a pair of side frames, a plurality of racks fixed to the side frames and capable of mounting an upper die, a ram having an upper die fixing mechanism for a ram for mounting the upper die and movable up and down, a conveying unit having an upper die gripping mechanism for a conveying unit for mounting the upper die, a backgage for positioning the workpiece, and a backgage moving unit for moving the backgage independently of the plurality of racks, and includes a press step (S1) of mounting a first upper die to the upper die fixing mechanism for a ram of the ram, positioning the workpiece by the backgage, and driving the ram to press the workpiece in combination with the lower die, and during this press step, includes a conveying unit upper die preparation and mounting step (S2) of removing the second upper die mounted on the plurality of racks from the rack and mounting it on the upper die gripping mechanism for a conveying unit of the conveying unit. An outline of the operation in this case is shown in FIG. 21.

[0053] More specifically, this method includes a press step in which the workpiece is pressed using the apparatus 1, and during this step, the upper die PD held by the rack 3 can be attached to the upper die gripping mechanism for the transport unit. As a result, the upper die PD can be attached to the upper die gripping mechanism for the transport unit without interrupting the press step, and this can be used as a preparatory operation for the next die exchange, making it possible to perform multiple processes in parallel and shortening the process time. Note that although the terms "first die" and "second die" are used here as ordinal numbers to distinguish between multiple dies and do not have any technical meaning, the first die is an upper die used for pressing in the press step, and the second die is an upper die prepared for use in the next press step.

[0054] As described above, this method includes the press step (S1) of mounting the first upper die to the ram upper die fixing mechanism of the ram, positioning the workpiece with the back gauge, and driving the ram to press the workpiece in combination with the lower die. This makes it possible to bend the workpiece W into a desired shape.

[0055] This method also includes a transport unit upper die preparation and mounting step (S2) during the above pressing step, in which the second upper die mounted on the multiple racks is removed from the rack 3 and mounted on the transport unit upper die gripping mechanism 51 of the transport unit 5. That is, in this method, while the pressing step is being performed, it is possible to carry the upper die required in the next pressing step by the transport unit and prepare for mounting it on the rack 3. That is, it is possible to significantly shorten the process.

[0056] In addition, although not limited thereto, this method preferably includes, during the pressing step, (S3) an on-rack mold returning step of removing the third upper mold attached to the transport unit from the transport unit and attaching it to the rack 3. The operation in this case is outlined in FIG.

[0057] More specifically, this method includes a pressing step in which the workpiece is pressed using the apparatus 1, and during this step, the upper die PD held by the transport unit can be returned to the rack 3. As a result, the upper die PD can be returned to the rack 3 without interrupting the pressing step, and the next operation can be performed, allowing multiple processes to be performed in parallel. Note that although the term "third die" is used here, the "third" in this term, like the above "first" and "second," is merely an ordinal number used to distinguish multiple dies and does not have a technical meaning, but the third die is an upper die that has been used in the pressing step, is returned to the rack, and is held until the next use.

[0058] As described above, the present invention provides a bending device and a bending method that can reduce the time required for die replacement and contribute to improving productivity. Specifically, the device and the method make it possible to prepare the upper die to be used in the next press step in parallel during one press step, and also to return the upper die used in the previous press step to the rack. This allows for a significant reduction in work time. [Industrial Applicability]

[0059] INDUSTRIAL APPLICABILITY The present invention has industrial applicability as a bending device and a bending method using the same. [Explanation of symbols]

[0060] 1...Bending device 2...Side frame 3. Rack 31...Support part 4. Ram 41...Ram upper mold fixing mechanism 5...Transport unit 51...Upper mold gripping mechanism for transfer unit 52...Shaft member 53...Rotation mechanism 54...Movement mechanism 55…Power 6…Back gauge 7…Backgauge moving unit 8. Bed 81…Lower mold gripping mechanism 9...Ram drive unit 91...Power 92...Shaft member 93...Connecting member 94…Support member 10...Lower die slide unit SF…Slide frame PD…upper mold PDB…Convex part PDS…side PDN…Gripping protrusion DD…Lower mold DDD…Concave part

Claims

1. A pair of side frames; a pair of racks fixed to the pair of side frames, respectively, on which one upper die can be placed; a ram having an upper die fixing mechanism for fixing the upper die and movable up and down; a conveying unit having an upper mold gripping mechanism for a conveying unit for gripping the upper mold, the conveying unit conveying the upper mold gripping mechanism between the pair of racks and the ram; A back gauge that positions the workpiece; A backgage moving unit that moves the backgage independently of the pair of racks, The pair of racks is provided in a plurality of sets, The plurality of pairs of racks are fixed to the side frames so that their installation positions are low along a direction away from the ram, and adjacent pairs of racks have portions that do not overlap with each other in a horizontal direction, The upper die has a gripping protrusion on a side surface thereof, the gripping protrusions are disposed in portions of the pair of racks that do not overlap with the pair of adjacent racks in the horizontal direction, the upper mold gripping mechanism for the conveying unit grips the upper mold by gripping the gripping protrusion from a side surface of the upper mold, The transport unit includes a shaft member, a rotation mechanism that rotates the shaft member, and a movement mechanism that moves the shaft member up and down and back and forth, The upper die gripping mechanism for the conveying unit is a bending device that is arranged around the shaft member in the circumferential direction of the shaft member.

2. 2. The bending device according to claim 1, wherein each of the pairs of racks is fixed to the side frame at a position on the ram that is above the ram upper die fixing mechanism.

3. a lower die gripping mechanism for holding a lower die corresponding to the upper die attached to the ram; 2. The bending apparatus according to claim 1, further comprising a bed for supporting said lower die holding mechanism.

4. 4. The bending apparatus according to claim 3, further comprising a lower die slide unit for sliding the lower die gripping mechanism.

5. a pair of side frames, a pair of racks fixed to each of the pair of side frames and capable of placing one upper die thereon, a ram having an upper die fixing mechanism for a ram for fixing the upper die and movable up and down, a transport unit having an upper die gripping mechanism for a transport unit for gripping the upper die and transporting the upper die gripping mechanism for the transport unit between the pair of racks and the ram, a backgage for positioning a workpiece, and a backgage moving unit for moving the backgage independently of the pair of racks, wherein a plurality of pairs of racks are provided, and the plurality of pairs of racks are arranged so that their installation positions are lowered in a direction away from the ram. a bending method for bending a workpiece using bending devices fixed to a side frame, the pair of adjacent racks having portions that do not overlap in the horizontal direction, a gripping protrusion attached to a side surface of the upper die, the gripping protrusion being arranged at a portion of the pair of racks that does not overlap with the adjacent pair of racks in the horizontal direction, the upper die gripping mechanism for the transport unit grips the upper die by grabbing the gripping protrusion from the side surface of the upper die, the transport unit includes a shaft member, a rotating mechanism that rotates the shaft member, and a moving mechanism that moves the shaft member up and down and back and forth, the upper die gripping mechanism for the transport unit comprising: a pressing step of mounting a first upper die on a ram upper die fixing mechanism of a ram, positioning a workpiece using a back gauge, and driving the ram to press the workpiece in combination with a lower die; The bending method includes a transport unit upper mold preparation and installation step in which, during the press step, a second upper mold fixed to the plurality of pairs of racks is removed from the pair of racks and grasped by a transport unit upper mold grasping mechanism of the transport unit.

6. 6. The bending method according to claim 5, further comprising a rack upper die returning step of removing the third upper die held by the transport unit from the transport unit and placing it on the rack during the pressing step.

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