Method for inspecting printed circuit boards

Abstract

To provide a method for inspecting a wiring circuit board which can bring a first terminal and a first probe into stable contact and improve the accuracy of inspection.SOLUTION: A wiring circuit board 3 comprises a plurality of circuits 8 each including a first terminal 9 and a second terminal 10, and an inspection jig 2 comprises two first probes 14 and two second probes 15. The two first probes 14 are brought collectively into contact with all of first terminals 9, and corresponding two second probes 15 are brought into contact with at least one second terminal 10 among the plurality of second terminals 10, for inspecting the circuits 8 for broken wire. The inspection jig 2 further includes: a rigid and planar main plate 12; an elastic member 16 which is arranged at the bottom surface of the main plate 12; and a planar sub-plate 13 which is arranged at the bottom surface of the elastic member. The two first probes 14 are arranged at the bottom surface of the sub-plate 13. The rebound resilience of the elastic member 16 is 3% or more and 8% or less.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for inspecting a printed circuit board. [Background technology]

[0002] It has been known in the past to test the continuity of each circuit in a wired circuit board having a plurality of circuits. In such a continuity test of a wired circuit board, for example, a probe is brought into contact with each of two terminals of each circuit to apply a voltage to each circuit.

[0003] In recent years, there has been a demand for finer pitches for multiple circuits and smaller terminals. This makes it difficult to stably contact a probe with a terminal during a continuity test of a wired circuit board, which can result in a decrease in test accuracy. Thus, various methods for testing the continuity of a wired circuit board that enable stable contact of a probe with a terminal have been studied.

[0004] For example, in a printed wiring board having a plurality of wiring patterns each including a test pad, wiring, and pads for connecting electronic components, a continuity test method has been proposed in which a multi-point contact type test probe is simultaneously brought into contact with a plurality of the test pads, and a micro test probe is brought into contact with each of the plurality of electronic component connection pads (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 11-64425 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the continuity test method described in Patent Document 1, there is a limit to how much test accuracy can be improved due to the influence of contact resistance between the multiple test pads and the multi-point contact type test probe.

[0007] The present invention provides a method for inspecting a wired circuit board, which can ensure stable contact between a first terminal and a first probe and can improve the inspection accuracy. [Means for solving the problem]

[0008] The present invention [1] includes a method for inspecting a wired circuit board using an inspection jig, the wired circuit board having a plurality of circuits in which first terminals and second terminals are connected by wiring, the inspection jig having two first probes extending in a direction in which the plurality of first terminals are arranged and contacting all of the first terminals, the two first probes being spaced apart from each other in an orthogonal direction perpendicular to the extension direction of the first probes, and two second probes contacting one of the second terminals corresponding to all of the second terminals, the method including a first inspection step of contacting the two first probes with all of the first terminals at once and contacting the two second probes corresponding to at least one of the plurality of second terminals to inspect for breaks in the circuit.

[0009] However, due to the recent trend toward finer pitch circuits and smaller terminals, it is becoming more difficult to make contact between the probe and terminal during testing, and if the probe and terminal are misaligned from their designated positions, the contact between the probe and terminal may become unstable.

[0010] In particular, extremely strict positional accuracy is required to bring two probes into contact with each of a plurality of terminals, and it is difficult to stably bring two probes into contact with one terminal.

[0011] On the other hand, according to the above method, the two first probes are brought into contact with all the first terminals at once, so that even if the multiple first terminals are fine-pitched and each first terminal is miniaturized, the two first probes can be stably brought into contact with all the first terminals.

[0012] Furthermore, a first inspection process is performed in which two first probes are brought into contact with all first terminals and two second probes corresponding to at least one second terminal to inspect for circuit breaks, thereby preventing the contact resistance between the probes and the terminals from affecting the inspection results of the first inspection process regarding circuit breaks.

[0013] As a result, the first terminals and the first probes can be brought into stable contact with each other, and the inspection accuracy of the first inspection step can be improved.

[0014] The present invention [2] includes the method for inspecting a wired circuit board described in [1] above, wherein a dimension of each of the two first probes in the orthogonal direction is 20% or less of a dimension of the first terminal in the orthogonal direction, and a distance between the two first probes in the orthogonal direction is 20% or less of a dimension of the first terminal in the orthogonal direction.

[0015] According to this method, the dimension of each first probe in the orthogonal direction is less than or equal to the above-mentioned upper limit relative to the dimension of the first terminal in the orthogonal direction, and the distance between the two first probes in the orthogonal direction is less than or equal to the above-mentioned upper limit, so that contact between the two first probes and all of the first terminals can be more reliably achieved in the first inspection process.

[0016] The present invention [3] includes the method for inspecting a wired circuit board according to the above [1] or [2], in which the first terminals are arranged in a straight line, and each of the two first probes has a bar shape.

[0017] According to this method, it is possible to more reliably bring the two first probes into contact with all of the first terminals.

[0018] The present invention [4] includes the method for inspecting a wired circuit board according to any one of the above [1] to [3], wherein each of the two second probes has a needle shape extending in a thickness direction of the wired circuit board.

[0019] According to this method, the two second probes can be brought into contact with one second terminal more reliably.

[0020] The present invention [5] includes the method for inspecting a wired circuit board according to any one of [1] to [4] above, wherein a dimension of the first terminal in the direction in which the first terminals are arranged is 35 μm or less, a distance between adjacent first terminals in the direction in which the first terminals are arranged is 60 μm or less, a dimension of the second terminal in the direction in which the second terminals are arranged exceeds 35 μm, and a distance between adjacent second terminals in the direction in which the second terminals are arranged exceeds 60 μm.

[0021] According to this method, even if each first terminal is made small and the plurality of first terminals are fine-pitched so that the dimension of the first terminals in the arrangement direction is not more than the above-mentioned upper limit and the distance between adjacent first terminals is not more than the above-mentioned upper limit, two first probes contact all of the first terminals at once in the first inspection process, thereby enabling stable contact between the first terminals and the first probes.

[0022] The present invention [6] includes the method for inspecting a wired circuit board according to any one of the above [1] to [5], wherein the inspection jig has an elastic member arranged on the opposite side of the first terminals with respect to the two first probes.

[0023] According to this method, since the elastic member is disposed on the opposite side of the first terminals with respect to the two first probes, the elasticity of the elastic member allows the two first probes to contact all of the first terminals at once so as to follow them in the first inspection step, which allows the first terminals and the first probes to contact each other more stably in the first inspection step.

[0024] The present invention [7] includes the method for inspecting a wired circuit board according to any one of the above [1] to [6], which includes a second inspection step of, after the first inspection step, releasing the contact of the two first probes with all of the first terminals and bringing the two corresponding second probes into contact with at least any two of the second terminals, thereby inspecting for short circuits in at least any two of the multiple circuits.

[0025] According to this method, after the first inspection process, the contact of the two first probes with all of the first terminals is released, and two corresponding second probes are brought into contact with any two of the plurality of second terminals, thereby performing a second inspection process in which any two of the plurality of circuits are inspected for short circuits.

[0026] Therefore, after inspecting for open circuits in the first inspection process, it is possible to inspect for short circuits in the second inspection process.

[0027] The present invention [8] includes the method for inspecting a wired circuit board described in [7] above, in which the wired circuit boards are arranged at intervals in a direction in which the plurality of first terminals are arranged, the inspection jig is movable in the direction in which the plurality of wired circuit boards are arranged, and the first inspection step and the second inspection step are sequentially repeated by moving the inspection jig so that the first inspection step is performed on the wired circuit board located downstream in the movement direction of the inspection jig and the second inspection step is performed on the wired circuit board located upstream in the movement direction of the inspection jig and on which the first inspection step has been performed.

[0028] According to this method, the first inspection step and the second inspection step can be sequentially and repeatedly performed on the multiple wired circuit boards by moving the inspection jig in the direction in which the multiple wired circuit boards are arranged. Therefore, even though it is a simple method, the first inspection step and the second inspection step can be smoothly performed on the multiple wired circuit boards.

[0029] The present invention [9] includes the method for inspecting a wired circuit board according to any one of the above [1] to [8], wherein the wired circuit board is arranged at intervals in a direction in which the plurality of first terminals are arranged, and each of the two first probes includes a plurality of probe portions corresponding to the first terminals of the plurality of wired circuit boards and arranged at intervals in the direction in which the plurality of wired circuit boards are arranged, and a connecting portion connecting adjacent probe portions among the plurality of probe portions, and the connecting portion is arranged so as to avoid conductive members located between adjacent wired circuit boards among the plurality of wired circuit boards.

[0030] According to this method, since the first probe has a plurality of probe portions corresponding to the first terminals of the plurality of wired circuit boards, the first inspection step can be performed collectively on the plurality of wired circuit boards. Also, since the connecting portion connecting the adjacent probe portions of the first probe is arranged so as to avoid the conductive member located between the adjacent wired circuit boards, contact between the first probe and the conductive member can be suppressed.

[0031] Therefore, it is possible to prevent the contact between the first probe and the conductive member from affecting the inspection results in the first inspection process, and to prevent a decrease in the inspection accuracy in the first inspection process. Effect of the Invention

[0032] According to the method for inspecting a wired circuit board of the present invention, the first terminals and the first probes can be brought into stable contact with each other, and the inspection accuracy can be improved. [Brief description of the drawings]

[0033] [Figure 1] FIG. 1 shows a plan view of a board assembly and an inspection jig according to a first embodiment of a method for inspecting a wired circuit board of the present invention. [Diagram 2] FIG. 2 shows an enlarged view of the printed circuit board shown in FIG. [Diagram 3] FIG. 3 shows a bottom view of the inspection jig shown in FIG. [Figure 4] FIG. 4 shows a cross-sectional view taken along line DD of the inspection jig shown in FIG. [Diagram 5] Fig. 5A shows a cross-sectional view taken along line AA of the first terminal and the first probe shown in Fig. 2. Fig. 5B shows a cross-sectional view taken along line BB of the first terminal and the first probe shown in Fig. 2. Fig. 5C shows a cross-sectional view taken along line CC of the second terminal and the second probe shown in Fig. 2. [Figure 6] FIG. 6 shows a state in which the inspection jig shown in FIG. 1 has been moved downstream in the moving direction. [Figure 7] FIG. 7 shows a plan view of a board assembly and an inspection jig according to a second embodiment of the wired circuit board inspection method of the present invention. [Figure 8] FIG. 8 shows a cross-sectional view of the first terminal and the first probe shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0034] First Embodiment The method for inspecting a wired circuit board of the present invention is carried out on the wired circuit board by using an inspection jig. A first embodiment of the method for inspecting a wired circuit board of the present invention will be described below with reference to Figs.

[0035] 1. Substrate assembly 1, in the first embodiment, an inspection is performed on a board assembly 1 using an inspection jig 2. The board assembly 1 includes a plurality of wired circuit boards 3 as an example of an inspection target, and a frame 4.

[0036] 1-1. Wiring circuit board The multiple wired circuit boards 3 are arranged at intervals from each other in a predetermined direction. In Fig. 1, for convenience, the number of the multiple wired circuit boards 3 is six, but the number of the multiple wired circuit boards 3 is not particularly limited. Each of the multiple wired circuit boards 3 has a flat belt shape extending in a direction perpendicular to the predetermined direction.

[0037] In Figure 1, the left-right direction of the paper is the arrangement direction (first direction) in which multiple wired circuit boards 3 are arranged, with the left side of the paper being one side in the arrangement direction (one side in the first direction) and the right side of the paper being the other side in the arrangement direction (the other side in the first direction).

[0038] In addition, in Figure 1, the up-down direction of the paper is the longitudinal direction of the wired circuit board 3 (a second direction perpendicular to the first direction, an orthogonal direction perpendicular to the arrangement direction), with the upper side of the paper being one side of the longitudinal direction (one side of the second direction, one side of the orthogonal direction) and the lower side of the paper being the other side of the longitudinal direction (the other side of the second direction, the other side of the orthogonal direction).

[0039] 1, the paper thickness direction is the thickness direction of the wired circuit board 3 (a third direction perpendicular to both the first and second directions, and perpendicular to both the arrangement direction and the perpendicular direction), with the front side of the paper being one side in the thickness direction (one side in the third direction) and the back side of the paper being the other side in the thickness direction (the other side in the third direction). Specifically, this corresponds to the directional arrows in each figure.

[0040] In the following, unless otherwise specified, the arrangement direction in which multiple wired circuit boards 3 are arranged is simply referred to as the arrangement direction, the longitudinal direction of wired circuit board 3 is simply referred to as the longitudinal direction, and the thickness direction of wired circuit board 3 is simply referred to as the thickness direction.

[0041] The wired circuit board 3 is, for example, a flexible wired circuit board (FPC), and includes a base insulating layer 5, a conductor pattern 6, and a cover insulating layer 7, which are arranged in this order from the other thickness direction side to the one thickness direction side, as shown in Fig. 5A. For convenience, the cover insulating layer 7 is omitted in Figs. 1 and 2.

[0042] As shown in FIG. 2, the base insulating layer 5 has a flat belt shape extending in the longitudinal direction when viewed in the thickness direction.

[0043] Examples of materials for the base insulating layer 5 include synthetic resins such as polyimide resin, polyamideimide resin, acrylic resin, polyethernitrile resin, polyethersulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, and polyvinyl chloride resin, and preferably polyimide resin.

[0044] The thickness of the base insulating layer 5 is, for example, 1 μm or more, preferably 3 μm or more, and for example, 30 μm or less, preferably 15 μm or less.

[0045] The conductive pattern 6 is disposed on one surface in the thickness direction of the base insulating layer 5. The conductive pattern 6 includes a plurality of circuits 8. That is, the wired circuit board 3 includes a plurality of circuits 8.

[0046] The multiple circuits 8 are arranged at intervals from each other in the arrangement direction (width direction of the wired circuit board 3). For convenience, the number of circuits 8 in each wired circuit board 3 is four in Fig. 1 and Fig. 2, but the number of circuits 8 is not particularly limited. In this embodiment, when distinguishing between the multiple (four) circuits 8, they are referred to as a first circuit 8A, a second circuit 8B, a third circuit 8C, and a fourth circuit 8D from one side to the other side in the arrangement direction.

[0047] In each of the multiple circuits 8, a first terminal 9 and a second terminal 10 are connected by a wiring 11. In other words, each of the multiple circuits 8 includes a first terminal 9, a second terminal 10, and a wiring 11.

[0048] The first terminal 9 comes into contact with the first probe 14 in a first inspection step described below. The first terminal 9 is disposed at one longitudinal end of the base insulating layer 5. The first terminals 9 of the multiple circuits 8 are disposed at one longitudinal end of the base insulating layer 5 so as to be linearly aligned in the arrangement direction (width direction of the wired circuit board 3) and spaced apart from each other in the arrangement direction. That is, in the first embodiment, the direction in which the multiple first terminals 9 are aligned is the same as the direction in which the multiple wired circuit boards 3 are aligned (width direction of the wired circuit board 3).

[0049] Each of the plurality of first terminals 9 has a rectangular shape (corner land) extending in the longitudinal direction when viewed in the thickness direction.

[0050] A dimension L1 of the first terminal 9 in the longitudinal direction is, for example, 20 μm or more, preferably 50 μm or more, for example, 300 μm or less, preferably 100 μm or less.

[0051] A dimension L2 of each first terminal 9 in the direction in which the multiple first terminals 9 are arranged (the width direction of the wired circuit board 3) is, for example, 5 μm or more, preferably 10 μm or more, for example, 100 μm or less, preferably 35 μm or less.

[0052] Furthermore, the spacing S1 between adjacent first terminals 9 in the direction in which the multiple first terminals 9 are arranged is, for example, 5 μm or more, preferably 10 μm or more, for example, 100 μm or less, preferably 60 μm or less.

[0053] The second terminal 10 comes into contact with the second probe 15 in a first inspection step and a second inspection step described later. The second terminal 10 is disposed at the other end in the longitudinal direction of the base insulating layer 5. The second terminals 10 of the multiple circuits 8 are disposed at one side portion in the arranging direction at the other end in the longitudinal direction of the base insulating layer 5 so as to be linearly aligned in the longitudinal direction, and are disposed at intervals from each other in the longitudinal direction. That is, in the first embodiment, the direction in which the multiple second terminals 10 are aligned is different (perpendicular) from the direction in which the multiple first terminals 9 are aligned (the direction in which the multiple wired circuit boards 3 are aligned), and the direction in which the multiple second terminals 10 are aligned is the same as the longitudinal direction of the wired circuit board 3.

[0054] Each of the plurality of second terminals 10 has a rectangular shape (corner land) when viewed in the thickness direction.

[0055] A dimension L3 of the second terminals 10 in the direction in which the multiple second terminals 10 are arranged (the longitudinal direction of the wired circuit board 3) is greater than, for example, the dimension L2 of the first terminals 9. Specifically, the dimension L3 of the second terminals 10 exceeds, for example, 35 μm, and is preferably 50 μm or more, more preferably 100 μm or more, and is, for example, 300 μm or less, preferably 200 μm or less.

[0056] The dimension L4 of the second terminal 10 in the direction in which the multiple first terminals 9 are arranged (the width direction of the wired circuit board 3) is, for example, 50 μm or more, preferably 100 μm or more, for example, 300 μm or less, preferably 200 μm or less.

[0057] Furthermore, the interval S2 between adjacent second terminals 10 in the direction in which the multiple second terminals 10 are arranged (the longitudinal direction of the wired circuit board 3) is, for example, larger than the interval S1 between adjacent first terminals 9. Specifically, the interval S2 between adjacent second terminals 10 is, for example, 50 μm or more, preferably exceeds 60 μm, and more preferably 100 μm or more, and is, for example, 300 μm or less, preferably 200 μm or less.

[0058] The wiring 11 electrically connects the first terminal 9 and the second terminal 10. The wiring 11 is continuous from the other end in the longitudinal direction of the first terminal 9, extends along the longitudinal direction on the base insulating layer 5, and is then bent as necessary to connect to the second terminal 10.

[0059] The wires 11 of the multiple circuits 8 are arranged on the base insulating layer 5 at intervals from one another in the arrangement direction (the width direction of the wired circuit board 3).

[0060] Examples of the material of the conductive pattern 6 include conductive materials such as copper. The thickness of the conductive pattern 6 is, for example, 1 μm or more, preferably 3 μm or more, for example, 30 μm or less, preferably 12 μm or less.

[0061] 5A, the cover insulating layer 7 is disposed on one surface in the thickness direction of the base insulating layer 5 so as to cover the multiple wirings 11. In detail, the cover insulating layer 7 has a pattern shape that exposes the multiple first terminals 9 and the multiple second terminals 10 and covers the multiple wirings 11 when viewed from one side in the thickness direction. Examples of materials for the cover insulating layer 7 include the same synthetic resin as that for the base insulating layer 5. The thickness of the cover insulating layer 7 is set appropriately.

[0062] In such a wired circuit board 3, for example, electronic components are mounted on one longitudinal side, and a power supply circuit is connected to the other longitudinal side. The first terminals 9 are relatively small and arranged densely because terminals of the electronic components are connected to them. On the other hand, the second terminals 10 are relatively large and arranged sparsely because terminals of the power supply circuit are connected to them.

[0063] 1-2.Frame As shown in Fig. 1, the frame body 4 collectively supports the multiple wired circuit boards 3. The frame body 4 has a rectangular frame shape when viewed in the thickness direction, and surrounds the multiple wired circuit boards 3. The frame body 4 is configured integrally with the above-mentioned base insulating layer 5. The frame body 4 integrally includes two horizontal frames 4A and two vertical frames 4B.

[0064] The two horizontal frames 4A are disposed on both longitudinal sides of the plurality of wired circuit boards 3, and are disposed at an interval from each other in the longitudinal direction. Each of the two horizontal frames 4A extends in the side-by-side direction.

[0065] Of the two horizontal frames 4A, the horizontal frame 4A on one side in the longitudinal direction is continuous with one longitudinal end portion of the base insulating layer 5 of the multiple wiring circuit boards 3, and the horizontal frame 4A on the other side in the longitudinal direction is continuous with the other longitudinal end portion of the base insulating layer 5 of the multiple wiring circuit boards 3. In this way, the frame 4 supports the multiple wiring circuit boards 3 collectively.

[0066] The two vertical frames 4B are arranged on both sides in the arrangement direction of the multiple wired circuit boards 3, and are arranged at an interval from each other in the arrangement direction. Each of the two vertical frames 4B extends in the longitudinal direction and connects the two horizontal frames 4A.

[0067] 2.Inspection fixture Next, the inspection jig 2 will be described with reference to FIGS.

[0068] In a first inspection step and a second inspection step described later, the inspection jig 2 is disposed so as to face the multiple wired circuit boards 3 from one side in the thickness direction (see FIG. 5A). In addition, while facing the multiple wired circuit boards 3 in the thickness direction, the inspection jig 2 is movable from the other side to one side in the direction in which the multiple wired circuit boards 3 are arranged. Therefore, in the following description of the inspection jig 2, the state in which the inspection jig 2 faces the multiple wired circuit boards 3 in the thickness direction is used as a reference.

[0069] FIG. 3 is a bottom view of the inspection jig 2 as viewed from the other side in the thickness direction of the wired circuit board 3. In FIG. 3, the upper side of the paper is one side in the longitudinal direction, the lower side of the paper is the other side in the longitudinal direction, the right side of the paper is one side in the arrangement direction, the left side of the paper is the other side in the arrangement direction, the front side of the paper is the other side in the thickness direction, and the back side of the paper is one side in the thickness direction.

[0070] As shown in FIGS. 3 and 4, the inspection jig 2 includes a main plate 12, a sub-plate 13, two first probes 14, an elastic member 16, and a plurality of second probes 15.

[0071] The main plate 12 has a flat plate shape and is rigid. Examples of materials for the main plate 12 include hard resins such as phenolic resins. The main plate 12 has a recess 12A.

[0072] The recess 12A is disposed on one side in the arrangement direction at one longitudinal end portion on the other thickness direction surface of the main plate 12. The recess 12A is recessed from the other thickness direction surface of the main plate 12 toward one side in the thickness direction and extends in the arrangement direction.

[0073] Further, on the other surface in the thickness direction of the main plate 12, a portion located on the other side in the arrangement direction with respect to the recess 12A has no first probe 14 and has a flat surface.

[0074] The sub-plate 13 supports two first probes 14. The sub-plate 13 is disposed in the recess 12A. The sub-plate 13 has a flat plate shape extending in the arrangement direction.

[0075] The two first probes 14 come into contact with all the first terminals 9 of the wired circuit board 3 that is subjected to a first inspection step described later (see FIGS. 5A and 5B). The two first probes 14 are disposed on the other surface of the sub-plate 13 in the thickness direction.

[0076] 2, each of the two first probes 14 has a bar shape extending in the arrangement direction. The two first probes 14 are arranged at a distance from each other in the longitudinal direction. In other words, the two first probes 14 extend in the direction in which the multiple first terminals 9 are arranged, and are arranged at a distance from each other in a direction perpendicular to the extension direction of the first probes 14.

[0077] The dimension L5 of each of the two first probes in a direction perpendicular to the extending direction of the first probe 14 (the longitudinal direction of the wired circuit board 3) is, for example, 5% or more, preferably 10% or more, for example, 30% or less, preferably 20% or less of the dimension L1 of the first terminal 9 in the longitudinal direction. Specifically, the dimension L5 of the first probe is, for example, 5 μm or more, preferably 10 μm or more, for example, 30 μm or less, preferably 20 μm or less.

[0078] Furthermore, the spacing S3 between the two first probes in a direction perpendicular to the extending direction of the first probes 14 (the longitudinal direction of the wired circuit board 3) is, for example, 5% or more, preferably 10% or more, for example, 30% or less, preferably 20% or less, of the dimension L1 of the first terminal 9 in the longitudinal direction. Specifically, the spacing S3 between the two first probes is, for example, 5 μm or more, preferably 10 μm or more, for example, 30 μm or less, preferably 20 μm or less.

[0079] Although not shown, the first probe 14 is electrically connected to a first voltage detection circuit capable of detecting a voltage.

[0080] 5A, in a first inspection step described later, the elastic member 16 brings the first probes 14 into contact with the multiple first terminals 9 so as to conform to the first probes 14. The elastic member 16 is disposed on the opposite side of the first terminals 9 with respect to the two first probes 14. The elastic member 16 is located on the opposite side of the two first probes 14 with respect to the sub-plate 13, and is disposed between the sub-plate 13 and the bottom surface of the recess 12A. Examples of materials for the elastic member 16 include rubber and sponge.

[0081] The elastic modulus (rebound resilience) of such elastic member 16 is, for example, 1% or more, preferably 3% or more, for example, 20% or less, preferably 8% or less.

[0082] If the elastic modulus of the elastic member 16 is equal to or greater than the lower limit, the first probe 14 can be reliably brought into contact with the first terminals 9 in the first inspection step described below, and the first probe 14 and the first terminals 9 can be stably electrically connected to each other. If the elastic modulus of the elastic member 16 is equal to or less than the upper limit, damage to the first terminals 9 when the first probe 14 and the first terminals 9 come into contact with each other can be suppressed.

[0083] 5C , the second probes 15 come into contact with all the second terminals 10 of the wired circuit board 3 subjected to a first inspection step and a second inspection step described below. The second probes 15 are supported by the main plate 12.

[0084] As shown in Fig. 3, the second probes 15 include a plurality of second probe rows 17 corresponding to the plurality of wired circuit boards 3. The second probe rows 17 are arranged at intervals from one another in the arrangement direction in the other longitudinal side portion of the main plate 12. Note that, for convenience, the number of the second probe rows 17 is six in Fig. 3, but the number of the second probe rows 17 is not particularly limited.

[0085] Each of the second probe rows 17 includes a plurality of pairs of two second probes 15 arranged at intervals from each other in the longitudinal direction. The pairs are made up of two second probes 15 arranged at intervals from each other in the arrangement direction.

[0086] Each pair of second probes 15 comes into contact with one second terminal 10 (see FIG. 5C). Moreover, in each second probe row 17, the same number of pairs of second probes 15 as the number of second terminals 10 of each wired circuit board 3 are provided so as to correspond to all the second terminals 10 of each wired circuit board 3. In other words, the inspection jig 2 includes a plurality of second probes 15, each of which comes into contact with one second terminal 10, corresponding to all the second terminals 10.

[0087] As shown in FIG. 4, each of the second probes 15 has a needle shape extending in the thickness direction.

[0088] The outer diameter of the second probe 15 is, for example, 10 μm or more, preferably 20 μm or more, for example, 100 μm or less, preferably 200 μm or less.

[0089] The second probe 15 penetrates the main plate 12 in the thickness direction. The other end of the second probe 15 in the thickness direction protrudes from the other surface of the main plate 12 in the thickness direction. One end of the second probe 15 in the thickness direction is electrically connected to a voltage unit (not shown) that includes a voltage application device capable of applying a voltage and a second voltage detection circuit capable of detecting the voltage.

[0090] As shown in FIG. 3, one longitudinal side portion of such an inspection jig 2 is configured as a first inspection unit U1, and the other longitudinal side portion is configured as a second inspection unit U2.

[0091] The first inspection unit U1 includes the two first probes 14 described above, and a plurality (three) of the plurality (six) of second probe rows 17 described above that are located on one side in the longitudinal direction.

[0092] The second inspection unit U2 includes a plurality (three) of the second probe rows 17 located on the other side in the longitudinal direction out of the plurality (six) of second probe rows 17 described above, but does not include a first probe 14.

[0093] 3. Testing Method The method for inspecting the substrate assembly 1 in the first embodiment includes a first inspection step of inspecting the circuits 8 for breaks, and a second inspection step of inspecting the plurality of circuits 8 for short circuits between adjacent circuits 8.

[0094] 3.1 First inspection process As shown in FIGS. 5A to 5C, in the first inspection process, first, the inspection jig 2 and each wired circuit board 3 are arranged facing each other in the thickness direction, and two first probes 14 are brought into contact with all first terminals 9 on each wired circuit board 3 at once, and two corresponding second probes 15 are brought into contact with each of the multiple second probes 15 on each wired circuit board 3.

[0095] 1, in the first embodiment, the two first probes 14 extend across multiple (three) adjacent wired circuit boards 3 on the other side of the arrangement direction among the multiple (six) wired circuit boards 3, and collectively contact all of the first terminals 9 of the multiple (three) wired circuit boards 3 on the other side of the arrangement direction. Therefore, in the first embodiment, first, the first inspection step is simultaneously performed on the multiple (three) wired circuit boards 3 located on the other side of the arrangement direction.

[0096] In detail, a voltage application device (not shown) applies a voltage to the first circuit 8A via a second probe 15 that contacts the second terminal 10 of the first circuit 8A (any one of the multiple circuits 8).

[0097] Thereafter, if a first voltage detection circuit (not shown) connected to the first probe 14 detects a voltage through the first probe 14, it is confirmed that the first circuit 8A is not open-circuited, and if the first voltage detection circuit (not shown) does not detect a voltage through the first probe 14, it is confirmed that the first circuit 8A is open-circuited.

[0098] Next, a voltage application device (not shown) sequentially applies voltage to each of the second circuit 8B, the third circuit 8C, and the fourth circuit 8D in the same manner as described above, and a first voltage detection circuit (not shown) detects the presence or absence of a break in the circuit 8 in the same manner as described above. Note that the order of applying voltages to the multiple circuits 8 is not limited to the above order and can be changed as appropriate, and it is also possible to simultaneously apply voltages to the multiple circuits 8 and simultaneously detect the presence or absence of a break in the multiple circuits 8.

[0099] This completes the first inspection step for the multiple (three) wired circuit boards 3 on the other side in the arrangement direction.

[0100] 3.2 Second inspection process Next, a second inspection step is simultaneously performed on the plurality of wired circuit boards 3 that are located on the other side in the arrangement direction and have been subjected to the first inspection step.

[0101] More specifically, as shown in Fig. 6, the inspection jig 2 is moved toward one side in the arrangement direction. Then, the two first probes 14 are released from contact with all the first terminals 9 of each wired circuit board 3 on which the first inspection process has been performed, and the first terminals 9 face the main plate 12 with a gap therebetween in the thickness direction. At this time, each of the multiple second terminals 10 of each wired circuit board 3 on which the first inspection process has been performed is brought into contact with the corresponding two second probes 15.

[0102] In other words, after the first inspection process, the contact of the two first probes 14 with all of the first terminals 9 of each wired circuit board 3 on which the first inspection process has been performed is released, and the two corresponding second probes 15 come into contact with each of the multiple second terminals 10 of each wired circuit board 3 on which the first inspection process has been performed.

[0103] Next, a voltage application device (not shown) applies a voltage to the first circuit 8A via a second probe 15 that contacts the second terminal 10 of the first circuit 8A (any one of the multiple circuits 8).

[0104] When the second voltage detection circuit (not shown) detects a voltage through the second probe 15 in contact with the second terminal 10 of the second circuit 8B, it is confirmed that the adjacent first circuit 8A and second circuit 8B (one example of any two of the multiple circuits 8) are short-circuited, and when the second voltage detection circuit (not shown) does not detect a voltage through the second probe 15 in contact with the second terminal 10 of the second circuit 8B, it is confirmed that the adjacent first circuit 8A and second circuit 8B are not short-circuited.

[0105] Next, a voltage application device (not shown) sequentially applies voltage to each of the second circuit 8B, the third circuit 8C, and the fourth circuit 8D in the same manner as described above, and a second voltage detection circuit (not shown) detects the presence or absence of a short circuit between adjacent circuits 8 (one example of any two circuits 8 among the multiple circuits 8) in the same manner as described above. Note that the order of applying voltages to the multiple circuits 8 is not limited to the above order and can be changed as appropriate, and it is also possible to simultaneously apply voltages to the multiple circuits 8 and simultaneously detect the presence or absence of a short circuit in the multiple circuits 8.

[0106] This completes the second inspection process for the multiple (three) wired circuit boards 3 that are located on the other side in the arrangement direction (upstream side in the movement direction of the inspection jig 2) and that have been subjected to the first inspection process.

[0107] In addition, the above-mentioned first inspection process is performed on multiple (three) wired circuit boards 3 located on one side in the arrangement direction (downstream in the movement direction of the inspection jig 2) of the wired circuit board 3 on which the second inspection process is performed.

[0108] That is, by moving the inspection jig 2, the two first probes 14 come into contact collectively with all of the first terminals 9 of the multiple (three) wired circuit boards 3 located on one side in the arrangement direction (downstream in the movement direction of the inspection jig 2), and the two corresponding second probes 15 come into contact with each of the multiple second terminals 10 on each of the wired circuit boards 3. Then, a voltage is applied sequentially to each of the multiple circuits 8 to detect whether the circuit 8 is disconnected.

[0109] This completes the first inspection step for the multiple (three) wired circuit boards 3 on one side in the arrangement direction (downstream side in the moving direction of the inspection jig 2).

[0110] Thereafter, the inspection jig 2 is moved so that both the first inspection step and the second inspection step are performed on all of the plurality of wired circuit boards 3, and the first inspection step and the second inspection step are repeated in sequence.

[0111] 5A to 5C, in the first embodiment described above, two first probes 14 are brought into contact with all first terminals 9 at once. Therefore, even if the plurality of first terminals 9 are fine-pitched and each first terminal 9 is miniaturized, the two first probes 14 can be brought into stable contact with all first terminals 9.

[0112] In particular, as shown in FIG. 2, even if the first terminals 9 are relatively small and arranged closely together, the dimension L2 of the first terminals 9 in the arrangement direction is less than the above upper limit, and the spacing S1 between adjacent first terminals 9 is less than the above upper limit, the first terminals 9 can be brought into stable contact with the first probes 14.

[0113] Moreover, the first inspection step is performed to inspect the circuit 8 for disconnections by contacting two first probes 14 with all first terminals 9 at once and contacting two second probes 15 corresponding to at least one second terminal 10. This makes it possible to prevent the contact resistance between the probes and the terminals from affecting the inspection results of the first inspection step regarding disconnections in the circuit 8. As a result, the first terminals 9 and the first probes 14 can be brought into stable contact with each other, and the inspection accuracy of the first inspection step can be improved.

[0114] Preferably, with respect to the dimension L1 of the first terminal 9 in the longitudinal direction, the dimension L5 of each first probe 14 in the longitudinal direction is equal to or less than the above upper limit, and the interval S3 between the two first probes 14 in the longitudinal direction is equal to or less than the above upper limit. Therefore, in the first inspection step, the two first probes 14 can be more reliably brought into contact with all the first terminals 9.

[0115] Moreover, each of the two first probes 14 preferably has a bar shape, which allows the two first probes 14 to come into contact with all of the first terminals 9 more reliably.

[0116] 4, each of the two second probes 15 preferably has a needle shape extending in the thickness direction, which allows the two second probes 15 to be in contact with one second terminal 10 more reliably.

[0117] 5A, preferably, the elastic member 16 is disposed on the opposite side of the first terminals 9 with respect to the two first probes 14. Therefore, due to the elasticity of the elastic member 16, the two first probes 14 can be brought into contact with all of the first terminals 9 at once in the first inspection step so as to follow all of the first terminals 9. As a result, the first terminals 9 and the first probes 14 can be brought into contact with each other more stably in the first inspection step.

[0118] 6, preferably, after the first inspection step, the contact of the two first probes 14 with all the first terminals 9 is released and two corresponding second probes 15 are brought into contact with each of the second terminals 10 to perform a second inspection step to inspect the multiple circuits 8 for short circuits. Therefore, after inspecting the circuits 8 for open circuits in the first inspection step, the circuits 8 can be inspected for short circuits in the second inspection step.

[0119] 1 and 6, the inspection jig 2 is preferably moved in the direction in which the plurality of wired circuit boards 3 are arranged, so that the first inspection step and the second inspection step can be sequentially and repeatedly performed on the plurality of wired circuit boards 3. Therefore, the first inspection step and the second inspection step can be smoothly performed on the plurality of wired circuit boards 3, despite being a simple method.

[0120] <Second embodiment> Next, a second embodiment of the present invention will be described with reference to Fig. 7. In the second embodiment, the same members as those in the first embodiment described above are denoted by the same reference numerals, and the description thereof will be omitted.

[0121] In the first embodiment, each inspection is performed on the wired circuit board 3 as an example of an inspection object, but the inspection object is not limited to this.

[0122] As shown in FIG. 7, for example, the inspection object may be a suspension board with circuit 20 as an example of a wired circuit board.

[0123] In this case, the board assembly 1 includes a plurality of suspension boards with circuits 20, a frame 4, and a plurality of bridging portions 21 as an example of conductive members.

[0124] The plurality of suspension boards with circuit 20 are arranged at intervals from one another in the arrangement direction, similar to the plurality of wired circuit boards 3 described above.

[0125] As shown in FIG. 8, the suspension board with circuit 20 includes a metal support 22 in addition to the above-mentioned base insulating layer 5, conductive pattern 6 and cover insulating layer .

[0126] The metal support 22 has a flat belt shape extending in the longitudinal direction when viewed in the thickness direction. The metal support 22 is located on the opposite side of the base insulating layer 5 from the conductive pattern 6.

[0127] Examples of materials for the metal support 22 include metal materials such as stainless steel, 42 alloy, aluminum, copper-beryllium, phosphor bronze, etc., and preferably stainless steel. The thickness of the metal support 22 is, for example, 10 μm or more, preferably 15 μm or more, and for example, 35 μm or less, preferably 25 μm or less.

[0128] As shown in FIG. 7, in the second embodiment, the frame 4 collectively supports a plurality of suspension boards with circuit 20, and is configured integrally with the metal support body 22 described above.

[0129] Each of the multiple bridging portions 21 is located between adjacent suspension boards with circuit 20 among the multiple suspension boards with circuit 20. More specifically, each bridging portion 21 is located between the multiple first terminals 9 of one suspension board with circuit 20 and the multiple first terminals 9 of the other suspension board with circuit 20 among the adjacent suspension boards with circuit 20.

[0130] Each bridge portion 21 is integral with the above-mentioned metal support 22, and connects one end in the longitudinal direction of adjacent metal supports 22. Moreover, each bridge portion 21 is exposed when viewed from the thickness direction.

[0131] In such a suspension board with circuit 20, the first terminal 9 is connected to a magnetic head, and the second terminal 10 is connected to a power supply circuit.

[0132] In the second embodiment, each of the two first probes 14 includes a plurality of probe portions 23 and a plurality of linking portions 24.

[0133] The multiple probe portions 23 correspond to the multiple suspension boards with circuit 20 and are arranged at intervals from each other in the arrangement direction. Each of the multiple probe portions 23 extends in the arrangement direction. Moreover, the probe portions 23 of the two first probes 14 are arranged at the above-mentioned interval S3 from each other in the longitudinal direction.

[0134] Each of the multiple connecting portions 24 connects adjacent probe portions 23 among the multiple probe portions 23. Each connecting portion 24 is arranged so as to avoid each bridging portion 21 in each of the first and second inspection processes. Specifically, each connecting portion 24 has a concave shape that opens toward one side in the longitudinal direction, and is arranged so as to pass the other side in the longitudinal direction of each bridging portion 21 in each of the first and second inspection processes.

[0135] According to the second embodiment, the first probe 14 includes a plurality of probe portions 23 corresponding to the first terminals 9 of the plurality of suspension boards with circuit 20. Therefore, the first inspection step can be performed collectively on the plurality of suspension boards with circuit 20. Furthermore, in the first probe 14, the connecting portion 24 connecting the adjacent probe portions 23 is arranged so as to avoid the bridging portion 21 located between the adjacent suspension boards with circuit 20. As a result, it is possible to prevent the first probe 14 and the bridging portion 21 from coming into contact with each other. This makes it possible to prevent a decrease in the inspection accuracy of the first inspection step.

[0136] In the second embodiment, the bridge portion 21 is given as an example of a conductive member, but the conductive member is not particularly limited as long as it has electrical conductivity.

[0137] In the second embodiment, the same effects as those of the first embodiment can be achieved.

[0138] <Modification> In the above-described first embodiment, both the first inspection step and the second inspection step are performed on each wired circuit board 3, but the present invention is not limited to this. Only the first inspection step may be performed on each wired circuit board 3.

[0139] In the first embodiment, the first inspection step is performed collectively on a plurality of wired circuit boards 3, but the present invention is not limited to this. The first inspection step may be performed on one wired circuit board 3.

[0140] In the above first embodiment, the pair of second probes 15 is arranged to line up in the longitudinal direction in each wired circuit board 3, but the arrangement of second probes 15 is not particularly limited. For example, the pair of second probes 15 may be arranged to line up in the arrangement direction.

[0141] With these, too, the same effects as those of the first embodiment can be achieved. [Explanation of symbols]

[0142] 2 Inspection jig 3 Wiring circuit board 8 Circuit 9 1st terminal 10 2nd terminal 11 Wiring 12 Main plate 13 Subplate 14 First Probe 15 Second probe 16 Elastic member 20 Circuit-equipped suspension board 21 Bridge part 23 Probe part 24 Connecting part

Claims

1. A method for inspecting a printed circuit board using an inspection jig, comprising the steps of: the wired circuit board includes a plurality of circuits in which first terminals and second terminals are connected by wiring; The inspection jig is the first probes extend in a direction in which the first terminals are arranged and contact all of the first terminals, the two first probes being spaced apart from each other in a direction perpendicular to the direction in which the first probes extend; a plurality of second probes each contacting one of the second terminals, the plurality of second probes corresponding to all of the second terminals; The inspection jig is a main plate having a flat shape and rigidity and a recess on a bottom surface thereof; a flat subplate supporting the two first probes; an elastic member disposed in the recess between the sub-plate and the main plate; Further equipped with The elastic member has a resilience of 3% or more and 8% or less, a first inspection step of contacting the two first probes with all of the first terminals at once and contacting the two second probes corresponding to at least one of the second terminals, thereby inspecting for an open circuit in the circuit.

2. a dimension of each of the two first probes in the orthogonal direction is 20% or less of a dimension of the first terminal in the orthogonal direction; 2. The method for inspecting a wired circuit board according to claim 1, wherein a distance between the two first probes in the orthogonal direction is 20% or less of a dimension of the first terminal in the orthogonal direction.

3. The first terminals are arranged in a straight line, 3. The method for inspecting a wired circuit board according to claim 1, wherein each of the two first probes has a bar shape.

4. 4. The method for inspecting a wired circuit board according to claim 1, wherein each of the two second probes has a needle shape extending in a thickness direction of the wired circuit board.

5. A dimension of the first terminals in a direction in which the first terminals are arranged is 35 μm or less, A distance between adjacent first terminals among the plurality of first terminals in a direction in which the first terminals are arranged is 60 μm or less; A dimension of the second terminal in a direction in which the second terminals are arranged exceeds 35 μm; 5. The method for inspecting a wired circuit board according to claim 1, wherein a distance between adjacent second terminals in the plurality of second terminals in a direction in which the second terminals are arranged exceeds 60 μm.

6. 6. The method for inspecting a wired circuit board according to claim 1, further comprising a second inspection step of, after the first inspection step, releasing the contact of the two first probes with all of the first terminals and bringing the two second probes into contact with any two of the second terminals corresponding thereto, thereby inspecting for a short circuit in any two of the plurality of circuits.

7. A method for inspecting a printed circuit board using an inspection jig, comprising the steps of: the wired circuit board includes a plurality of circuits in which first terminals and second terminals are connected by wiring; The inspection jig is the first probes extend in a direction in which the first terminals are arranged and contact all of the first terminals, the two first probes being spaced apart from each other in a direction perpendicular to the direction in which the first probes extend; a plurality of second probes each contacting one of the second terminals, the plurality of second probes corresponding to all of the second terminals; a first inspection step of contacting the two first probes with all the first terminals at once and contacting the two second probes with at least one second terminal among the plurality of second terminals to inspect for a break in the circuit; a second inspection step of, after the first inspection step, releasing the contact of the two first probes with all of the first terminals and bringing the two second probes into contact with any two of the second terminals corresponding thereto, thereby inspecting for a short circuit in any two of the circuits; The wired circuit boards are arranged at intervals from each other in a direction in which the first terminals are arranged, the inspection jig is movable in a direction in which the plurality of wired circuit boards are arranged, a wiring circuit board inspection method, characterized in that the first inspection step and the second inspection step are sequentially repeated by moving the inspection jig so that the first inspection step is performed on a wiring circuit board located downstream in a movement direction of the inspection jig, and the second inspection step is performed on a wiring circuit board located upstream in the movement direction of the inspection jig and on which the first inspection step has been performed.

8. A method for inspecting a printed circuit board using an inspection jig, comprising: the wired circuit board includes a plurality of circuits in which first terminals and second terminals are connected by wiring; The inspection jig is the first probes extend in a direction in which the first terminals are arranged and contact all of the first terminals, the two first probes being spaced apart from each other in a direction perpendicular to the direction in which the first probes extend; a plurality of second probes each contacting one of the second terminals, the plurality of second probes corresponding to all of the second terminals; a first inspection step of contacting the two first probes with all the first terminals at once and contacting the two second probes with at least one second terminal among the plurality of second terminals to inspect for a break in the circuit; The wired circuit boards are arranged at intervals from each other in a direction in which the first terminals are arranged, Each of the two first probes comprises: a plurality of probe portions arranged at intervals from each other in a direction in which the plurality of wired circuit boards are arranged, the probe portions corresponding to the first terminals of the plurality of wired circuit boards; a linking portion linking adjacent probe portions among the plurality of probe portions; Equipped with the connecting portion is a conductive member located between adjacent ones of the plurality of wired circuit boards, and is arranged so as to avoid conductive members located between the plurality of first terminals of one of the adjacent wired circuit boards and the plurality of first terminals of the other of the adjacent wired circuit boards.

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