Thermal Management Unit

Abstract

The present application discloses an electronic expansion valve (1) and a thermal management unit (400). The electronic expansion valve has a valve element (13), a rotor unit (14), a stator unit (15), and a circuit board (16), the stator unit being electrically connected to the circuit board, the electronic expansion valve has a valve port (120), the valve element moves relative to the valve port, the valve body (11) has a first flow section (23), a second flow section (24), a first chamber (210), and a second chamber (220), the first chamber being above the valve port and the second chamber being below the valve port, the first flow section being directly connected to a first connection section (232) connected to an external connection pipe (10), The second flow section has a second connection section (243) connected to an external connection pipe (5011) and a second subsection (241) directly communicating with the second chamber, and an acute angle is formed between the center line of at least one of the first subsection and the second subsection and the center line of the valve body in the clockwise direction, so that the electronic expansion valve can be mounted to fit into the connection pipe of the adapter (501) and the connection pipe of the external system.

Description

[Technical field]

[0001] The present application relates to the technical field of fluid control, and more particularly to a thermal management unit. To Get involved. [Background technology]

[0002] Referring to FIG. 1, FIG. 1 discloses a thermal management unit 400', which is applied to an automobile air conditioning system, a heat pump system and a battery cooling system. The thermal management unit 400' has a heat exchanger 500' and a thermal expansion valve 4' assembled to be integrated via an adapter 501'. The thermal expansion valve 4' has a first flow section 41' connected to a connection pipe 10' of an external system and a second flow section 42' connected to a connection pipe 5011' of the adapter 501'. The thermal expansion valve 4' has an air box cover 43', a membrane piece 44' and a transmission rod 45'. A medium chamber 47' is formed between the air box cover 43' and the membrane piece 44', and a power medium is filled in the medium chamber 47'.

[0003] When the system is operating, the power medium senses the superheat of the working medium in the heat exchanger outlet passage 5012', and causes the power medium to expand or contract, acting on the membrane piece 44' to generate an axial force, which is directly or indirectly transmitted to the transmission rod 45', so that the transmission rod 45' can move in the axial direction, and the transmission rod 45' moves the valve body component 46' relative to the valve port 120', changing the opening degree of the valve port 120' to adjust the flow rate of the refrigerant. Summary of the Invention [Problem to be solved by the invention]

[0004] The method of using the thermal properties of such a power medium to achieve driving has a relatively low reaction sensitivity and a relatively low control accuracy for the flow rate. Therefore, when the relative position between the connecting pipe 5011' and the connecting pipe 10' of the external system remains unchanged, how to improve the control accuracy for the flow rate is a technical issue that must be considered during design.

[0005] The present application aims to provide an electronic expansion valve that is attached to fit the connecting pipe of the adapter and the connecting pipe of an external system when the relative positions of the connecting pipe of the adapter and the connecting pipe of an external system remain unchanged, and that improves the control accuracy of the flow rate. [Means for solving the problem]

[0006] In order to achieve the above object, one embodiment of the present application adopts the following technical solution: an electronic expansion valve, comprising: a valve body, a valve element, a rotor unit, a stator unit, and a circuit board, the stator unit being disposed on the outer periphery of the rotor unit and electrically connected to the circuit board, the electronic expansion valve having a valve port, the valve element being movable relative to the valve port to adjust the opening degree of the valve port, the valve body having a first circulating portion and a second circulating portion, at least a portion of the first circulating portion being defined above the valve port and at least a portion of the second circulating portion being defined below the valve port, the electronic expansion valve having a first chamber and a second chamber, the first chamber being defined above the valve port and the second chamber being defined below the valve port, the first circulating portion being defined to communicate with the first chamber and the second circulating portion being defined to communicate with the second chamber, the first circulating portion being connected to an external the second flow section has a second connection section connected to an external connection pipe and a second subsection directly communicating with the second chamber, a portion of a center line of the first subsection that is within the first subsection is defined as a first line, a portion of a center line of the second subsection that is within the second subsection is defined as a second line, a cutting plane is defined, a center line of the valve body is within the cutting plane, and a flow path of an operating medium in the first flow section and the second flow section is also within the cutting plane, a first cross section is formed by creating a cross section of the electronic expansion valve along the cutting plane, and an angle formed in the first cross section between at least one of the first line and the second line and the center line of the valve body along a clockwise direction is an acute angle.

[0007] A thermal management unit having an electronic expansion valve and a heat exchanger, said electronic expansion valve fixedly connected to said heat exchanger, said electronic expansion valve being the electronic expansion valve described above.

[0008] In this way, the electronic expansion valve and the thermal management unit use an electromagnetic driving method in which the rotor unit moves the valve disc relative to the valve port, and this electromagnetic driving method has a relatively high response sensitivity and improves the control accuracy of the flow rate. At the same time, in the first flow section, the first connection section is connected to the external connection pipe and the first subsection directly communicates with the first chamber, and in the second flow section, the second connection section is connected to the external connection pipe and the second subsection directly communicates with the first chamber, and in the first cross section, an angle formed between at least one of the first line and the second line and the center line of the valve disc along the clockwise direction is an acute angle. In this way, when the relative position between the adapter connection pipe and the external system connection pipe remains unchanged, the electronic expansion valve can be mounted to fit the adapter connection pipe and the external system connection pipe. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic cross-sectional view of a thermal management unit according to the prior art. [Diagram 2] FIG. 1 is a schematic block diagram of an embodiment of a refrigeration system in the present application. [Diagram 3] FIG. 2 is a schematic three-dimensional diagram of an embodiment of a thermal management unit of the present application. [Figure 4] FIG. 4 is a schematic three-dimensional diagram of the electronic expansion valve in FIG. 3; [Diagram 5] 5 is a schematic diagram of a cross section of the electronic expansion valve in FIG. 4 taken along the direction AA. FIG. [Figure 6] 1 is a schematic cross-sectional view of a first embodiment of a thermal management unit of the present application; [Figure 7] FIG. 7 is a front view schematic diagram of the electronic expansion valve in FIG. 6. [Figure 8] 8 is a schematic diagram of a cross section of the electronic expansion valve in FIG. 7 taken along the direction BB. FIG. [Figure 9] FIG. 9 is a schematic diagram showing the three-dimensional configuration of the valve body shown in FIG. 7 or FIG. 8. [Figure 10] FIG. 10 is a schematic diagram showing the front configuration of the valve body in FIG. [Figure 11]11 is a schematic diagram of a cross section of the valve body in FIG. 10 taken along the CC direction. FIG. [Figure 12] FIG. 2 is a schematic cross-sectional view of a thermal management unit according to a second embodiment of the present application. [Figure 13] FIG. 13 is a schematic cross-sectional view of the electronic expansion valve in FIG. [Figure 14] FIG. 13 is a schematic cross-sectional view of a third embodiment of a thermal management unit of the present application. [Figure 15] FIG. 15 is a schematic cross-sectional view of the electronic expansion valve in FIG. 14. [Figure 16] FIG. 13 is a schematic cross-sectional view of a fourth embodiment of a thermal management unit of the present application. [Figure 17] FIG. 17 is a schematic cross-sectional view of the electronic expansion valve in FIG. 16. [Figure 18] FIG. 13 is a schematic cross-sectional view of a thermal management unit according to a fifth embodiment of the present application. [Figure 19] FIG. 19 is a schematic cross-sectional view of the electronic expansion valve in FIG. 18. [Figure 20] FIG. 13 is a schematic cross-sectional view of a sixth embodiment of a thermal management unit of the present application. [Figure 21] FIG. 21 is a schematic three-dimensional diagram of the electronic expansion valve in FIG. 20. [Figure 22] FIG. 22 is a front view of the electronic expansion valve shown in FIG. 21 . [Figure 23] 23 is a schematic diagram of a cross section of the electronic expansion valve in FIG. 22 taken along the EE direction. FIG. [Figure 24] 22 is a schematic diagram of a cross section of the electronic expansion valve in FIG. 21 taken along the DD direction. FIG. [Diagram 25] 23 is a schematic diagram of a cross section of the electronic expansion valve in FIG. 22 taken along the FF direction. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The present invention will be further described below in conjunction with the drawings and specific embodiments. In a refrigeration system, a throttling element controls the flow rate of a refrigerant, and the throttling element mainly controls the flow rate of the refrigerant according to the change in the superheat degree of the system. The electronic expansion valve controls the flow rate of the refrigerant by an electromagnetic driving method, so that the response sensitivity of such an electromagnetic driving method is relatively high and it is convenient to improve the control accuracy of the flow rate. In order to improve the control accuracy of the flow rate, fields such as automobile air conditioning systems, heat pump systems and battery cooling systems gradually use electronic expansion valves as throttling elements.

[0011] FIG. 2 is a schematic block diagram of an embodiment of a refrigeration system. In this embodiment, the refrigeration system includes an air conditioning system and a battery cooling system. The air conditioning system includes a compressor 100, a condenser 200, a first electronic expansion valve 1, and an evaporator 300. When the air conditioning system is in operation, the refrigerant is compressed into a high-temperature and high-pressure refrigerant through the compressor 100. After the high-temperature and high-pressure refrigerant passes through the condenser 200, it becomes a room-temperature and high-pressure refrigerant. The room-temperature and high-pressure refrigerant passes through the first electronic expansion valve 1 and enters the evaporator 300. After the room-temperature and high-pressure refrigerant passes through the first electronic expansion valve 1, the pressure of the refrigerant is reduced, so the refrigerant evaporates and becomes a low-temperature refrigerant. The low-temperature refrigerant absorbs a large amount of heat through the evaporator 300, becomes a refrigerant, and returns to the compressor 100. The battery cooling system has the compressor 100, the condenser 200, the second electronic expansion valve 2, the heat exchanger 500, and a battery. When the battery cooling system is operating, the refrigerant is compressed into a high-temperature, high-pressure refrigerant through the compressor 100. The high-temperature, high-pressure refrigerant passes through the condenser 200 and becomes a room-temperature, high-pressure refrigerant. The room-temperature, high-pressure refrigerant passes through the second electronic expansion valve 1 and enters the heat exchanger 500 to perform heat exchange within the heat exchanger 500. The refrigerant after heat exchange by the heat exchanger 500 flows into the battery to cool the battery. In the refrigeration system, the first electronic expansion valve 1 and the evaporator 300 may be two independent components that are installed separately in the system pipeline, or the first electronic expansion valve 1 and the evaporator 300 may be assembled together and then installed in the system pipeline; similarly, the second electronic expansion valve 2 and the heat exchanger 500 may be two independent components that are installed separately in the system pipeline, or of course, the second electronic expansion valve 2 and the heat exchanger 500 may be assembled together and then installed in the system pipeline; for convenience of description, the unit in which the first electronic expansion valve 1 and the evaporator 300 are assembled together and the unit in which the second electronic expansion valve 2 and the heat exchanger 500 are assembled together are collectively referred to as a thermal management unit.

[0012] FIG. 3 is a schematic diagram of a specific embodiment of a thermal management unit. In the technical solution, the thermal management unit 400 has a heat exchanger 500 and a second electronic expansion valve 2 integrated into one body. Combining FIG. 2, in the present invention, the first electronic expansion valve 1 has the same configuration as the second electronic expansion valve 2. In the following, the first electronic expansion valve 1 and the second electronic expansion valve 2 are collectively referred to as electronic expansion valves. Of course, the first electronic expansion valve and the second electronic expansion valve may have different configurations. Alternatively, the battery cooling system does not use an electronic expansion valve, and one of the first electronic expansion valve and the second electronic expansion valve has the same configuration as the electronic expansion valve of the technical solution. All of them fall within the protection scope of the technical solution.

[0013] 4 and 5, the electronic expansion valve 1 includes a valve body 11, a valve element 13, a rotor unit 14, a stator unit 15, and a circuit board 16. The electronic expansion valve 1 further includes a valve port 120 that communicates the flow passages on both sides of the valve port 120. The stator unit 15 is fitted onto the outer periphery of the rotor unit 14. In this embodiment, a casing 19 is provided between the stator unit 15 and the rotor unit 14 to separate the stator unit 15 and the rotor unit 14. The stator unit 15 is electrically connected to the circuit board 16 and / or are connected to the signal line, and when the electronic expansion valve 1 is operated, the current passing through the windings of the stator unit 15 is controlled to change according to a predetermined rule, thereby controlling the stator unit 15 to generate a variable excitation magnetic field, and the rotor unit 14 rotates under the action of the excitation magnetic field, causing the body 13 to move relative to the valve orifice 120, thereby adjusting the opening degree of the valve orifice 120. In this way, the rotor unit can move the valve body relative to the valve orifice using an electromagnetic driving method, and the response sensitivity of such an electromagnetic driving method is relatively high, and further improves the control accuracy of the flow rate.

[0014] 4 and 5, the electronic expansion valve 1 further includes a valve seat 12 which is disposed on the outer periphery of the valve element 13 and is arranged to be positionally restricted. In this embodiment, the valve port 120 is molded on the valve seat 12, and the valve element 13 moves close to and away from the valve port 120 to change the flow cross-sectional area of ​​the working medium at the valve port 120, and further forms a throttle on the valve port 120. Referring to FIG. 5, the electronic expansion valve 1 further includes a connecting member 17, the casing 19 covers the outer periphery of the rotor unit 15 and is welded and fixed to the connecting member 17, and the valve seat 12 is fixedly connected to the connecting member 17, that is, the casing 19 and the valve seat 12 are connected by the connecting member 17, thus simplifying the mold, making the mold smaller, and facilitating the molding of the valve seat 12. Of course, the connecting member 17 may be molded integrally with the valve seat 12, so that there is no need to connect the two.

[0015] 5 and 8, the electronic expansion valve 1 has a first chamber 210 and a second chamber 220, the first chamber 210 is defined above the valve port 120, the second chamber 220 is defined below the valve port 120, and an operating medium flows through the first chamber 210 and the second chamber 220.

[0016] In the present invention, the electronic expansion valve has a first flow section and a second flow section, specifically, the first flow section and the second flow section are molded in a valve body, the working medium in the first flow section can communicate with the working medium in the second flow section, at least a part of the first flow section is defined above the valve orifice, and at least a part of the second flow section is defined below the valve orifice, in this way, the working medium can form a throttle at the valve orifice, the valve body has a first wall surface and a second wall surface respectively on both sides of the valve body, the first flow section has a first connection section and a first subsection, and the first connection section is connected to the first wall surface. The second flow section has a second connection section and a second subsection, the second connection section is perpendicular to the second wall surface and is connected to the external connection pipe, and the second subsection is directly connected to the second chamber. In this way, the connection pipe 5011' of the adapter in FIG. 1 and the connection pipe 10' of the external system can be mounted horizontally. Of course, when the connection pipe 5011' of the adapter in FIG. 1 and the connection pipe 10' of the external system are mounted at an angle, the first connection section and the first wall surface form an angle. Similarly, the second connection section and the second wall surface are also arranged to have an angle, a portion of the center line of the first subsection that is within the first subsection is defined as a first line, a portion of the center line of the second subsection that is within the second subsection is defined as a second line, a certain cross section is defined, the center line of the valve body is within the cross section, and the flow path of the working medium in the first circulation section and the second circulation section is also within the cross section, a first cross section is obtained by creating a cross section of the electronic expansion valve along the cross section, and a clockwise direction is defined in the first cross section. and when the angle formed between at least one of the first line and the second line and the center line of the valve body is an acute angle, and the relative position between the connecting pipe 5011' of the adapter and the connecting pipe 10' of the external system in FIG. 1 is unchanged, the first flow part is connected to the first chamber and / or the second flow part is connected to the second chamber in an inclined manner, and the working medium can flow into the first chamber and / or the second chamber, and the electronic expansion valve is mounted to fit the connecting pipe of the adapter and the connecting member of the external system, and in the present invention, the first flow part is the inflow end of the working medium, and the second flow part is the outflow end of the working medium,When the electronic expansion valve is applied to an automobile air conditioning system and / or a heat pump system and / or a battery cooling system, the high-pressure working medium flows from the first flow section into the first chamber, and as shown in FIG. 5, the rotor unit 14 moves the valve body 13 relative to the valve port 120 to adjust the opening degree of the valve port 120, so that the working medium in the first chamber can form a throttle at the valve port, and the working medium after the throttle flows into the second chamber, and the second flow section communicates with the second chamber, so that the working medium in the second chamber can flow out from the second flow section.

[0017] In accordance with the above description, the thermal management unit and electronic expansion valve of the present invention have six embodiments, and the configurations of the thermal management unit and electronic expansion valve of the present invention in six embodiments are described in detail below.

[0018] For convenience in describing the thermal management units and electronic expansion valves of the six embodiments, the electronic expansion valve of the first embodiment will be designated as electronic expansion valve 1, the thermal management unit will be designated as 400, and no subscript will be added to other reference symbols; the electronic expansion valve of the second embodiment will be designated as electronic expansion valve 1a, the thermal management unit will be designated as 400a, and all other reference symbols will be designated with the subscript a; the electronic expansion valve of the third embodiment will be designated as electronic expansion valve 1b, the thermal management unit will be designated as 400b, and all other reference symbols will be designated with the subscript a. the electronic expansion valve of the fourth embodiment is designated as electronic expansion valve 1c, the thermal management unit is designated as 400c, and the other reference symbols all have the subscript c; the electronic expansion valve of the fifth embodiment is designated as electronic expansion valve 1d, the thermal management unit is designated as 400d, and the other reference symbols all have the subscript d; the electronic expansion valve of the sixth embodiment is designated as electronic expansion valve 1e, the thermal management unit is designated as 400e, and the other reference symbols all have the subscript e.

[0019] Referring to Figure 6, Figure 6 is a schematic diagram of the configuration of a first embodiment of a thermal management unit in the technical solution, Figures 7 to 8 are schematic diagrams of the configuration of an electronic expansion valve in Figure 6, and Figures 9 to 11 are schematic diagrams of the configuration of a valve body in Figure 7 or Figure 8. The configuration of the first embodiment of the electronic expansion valve will be introduced in detail below.

[0020] 6, the thermal management unit 400 has a heat exchanger 500 and an electronic expansion valve 1 integrated as one unit, and specifically, the heat exchanger 500 and the electronic expansion valve 1 are assembled so as to be integrated as one unit via an adapter 501. Referring to FIGS. 6 to 11, the valve body 11 has a first circulation portion 23 and a second circulation portion 24, the first circulation portion 23 has a first subsection 231 and a first connection section 232, the first subsection 231 communicates with the first connection section 232, is closer to the valve port 120 than the first connection section 232, and communicates with the first chamber 210. Referring to FIG. 8, the valve body 11 has a first wall surface 111 and a second wall surface 112 on both sides of the valve body 11, and the first circulation portion 23 6, the first connection section 232 is perpendicular to the first wall surface 111 and can be connected to the external connection pipe 10 in FIG. 6. In this embodiment, the center line of the first connection section 232 is perpendicular to the center line of the valve body 13, and the flow cross-sectional area of ​​the first connection section 232 is larger than the flow cross-sectional area of ​​the working medium in the first sub-section 231, thus reducing the flow resistance and defining a certain cutting plane, the center line of the valve body 13 being within the corresponding cutting plane, and the flow of the working medium in the first sub-section 231 is reduced. The flow paths in the first circulating section 23 and the second circulating section 24 are also within the corresponding cutting plane, and a first cross section is obtained by making a cross section of the electronic expansion valve 1 along the corresponding cutting plane, and a part within the first subsection 231 on the center line of the first subsection 231 is defined as a first line, and an angle formed between the first line and the center line of the valve body 13 along the clockwise direction in the first cross section is an acute angle, thus making the first circulating section 23 communicate with the first chamber 210 in an inclined manner, and further allowing the working medium to flow into the first chamber 210. In this way, when the relative position between the connecting pipe 5011' of the adapter and the connecting pipe 10' of the external system in FIG. 1 remains unchanged, by adjusting the relative position of the first circulating section 23 based on the position of the second circulating section 24, the electronic expansion valve can be installed to fit the connecting pipe of the adapter and the connecting member of the external system in FIG. 1 as a replacement for a traditional thermostatic expansion valve, and the control accuracy of the flow rate is improved.

[0021] 8, when an extension line L1 is made in the first cross section along the extending direction of the first subsection 231 toward the direction approaching the first connecting section 232, the extension line L1 does not intersect with the first connecting section 232. In this way, when machining the first subsection 231, the bit does not destroy the configuration of the first connecting section 232, and in this embodiment, the first connecting section 232 is connected to the external connecting pipe.

[0022] 5, 6, 8 and 11, the flow cross-sectional area of ​​the first subsection 231 is larger than that of the valve port 120, so that the working medium does not form a throttle in the first subsection 231, and the distance between the first subsection 231 and the peripheral side wall 211 of the first chamber along the extension direction of the first subsection 231 is not less than 2 mm, so that the structural strength of the first subsection 231 can be guaranteed. In addition, in this embodiment, when the electronic expansion valve 1 operates, the working medium flows from the outlet 2310 of the first subsection 231 into the first chamber 210, and the inlet 2311 of the first subsection 231 is molded on the bottom surface of the first connecting section 232, so as to contribute to the processing of the first subsection 231.

[0023] 8 and 11, the first flow section 23 further includes a first accommodating section 233 having an accommodating chamber, the open end of the first accommodating section 233 is molded in the first wall surface 111 of the valve body 11, the first accommodating section 233 communicates with the first connection section 232, and the diameter of the first accommodating section 233 is larger than the diameter of the first connection section 232. A first seal ring 401 in FIG. 6 is disposed in the accommodating chamber of the first accommodating section 233 to prevent the operating medium from leaking at the connection point between the first connection section 232 and the external connection pipe 10 in FIG. 6.

[0024] 8 and 11, the second flow section 24 has a second connection section 243 and a second subsection 241, the second connection section 243 is perpendicular to the second wall surface 112 and can be connected to the external connection pipe 5011 in FIG. 6, and the second subsection 242 directly communicates with the second chamber 220. In this embodiment, the second connection section 243 and the second subsection 241 are the same section. For the sake of convenience in describing the second connection section and the second subsection, a dashed line is introduced as the boundary between the second subsection 241 and the second connection section 243 in FIG. 11. In this embodiment, 8. In this figure, the second subsection 241 is to the right of the dotted line in FIG. 11, and the second connecting section 243 is to the left of the dotted line in FIG. 11. The second connecting section 243 and the second subsection 241 are the same section. Specifically, the flow cross-sectional areas of the second connecting section 243 and the second subsection 241 are equal. The second connecting section 243 and the second subsection 241 are both located below the valve port 120 in FIG. 8. The flow cross-sectional area of ​​the second subsection 241 is greater than that of the valve port 120. In this way, two throttlings are formed in the second subsection 241, which can prevent the flow rate from being affected.

[0025] Referring to FIG. 11 , the second flow section 24 further has a second accommodating section 242, the open end of which is molded into the second wall surface 112, the second accommodating section 242 communicates with the second connection section 243, and the diameter of the second accommodating section 242 is larger than the diameter of the second connection section 243. Referring to FIG. 6 , a second sealing ring 402 is disposed in the second accommodating section 242 to prevent the operating medium from leaking at the connection point between the second connection section 243 and the connection tube 5011 of the connection member 501.

[0026] 8 and 11, the cross-sectional area of ​​the first subsection 231 is smaller than that of the second subsection 241. The high-pressure liquid working medium first flows into the first chamber 210 through the first subsection 231. After being throttled by the valve port 120, the pressure of the high-pressure working medium is reduced, and the liquid working medium becomes a gas-liquid mixed state working medium. At this time, the flow velocity of the working medium in the second subsection 241 is higher than that of the first subsection 231, and the flow cross-sectional area of ​​the working medium in the first subsection 231 is smaller than that of the working medium in the second subsection 241. Thus, the flow stability of the working medium is improved, and the occurrence of vortexes is reduced.

[0027] 3, 6 and 8, in this embodiment, the working medium flows in through the first flow section 23, the working medium that has been throttled by the valve port 120 flows into the heat exchanger 500 through the second flow section 24, and the working medium that has been heat exchanged by the heat exchanger 500 flows out through the outlet passage 5012 of the adapter 501. In this embodiment, generally, a sensor is provided near the outlet passage 5012 of the adapter 501 to collect parameters (e.g., temperature and / or pressure) related to the working medium at the outlet of the heat exchanger 500, the sensor is connected to a control means in the system via a harness, and the control means in the system obtains the related parameters and then adjusts the opening degree of the electronic expansion valve according to a corresponding control program.

[0028] Referring to FIG. 12, FIG. 12 is a schematic diagram of the configuration of a thermal management unit in a second embodiment of the technical solution, and FIG. 13 is a schematic diagram of the configuration of the electronic expansion valve in FIG. 12. The configuration of the second embodiment of the electronic expansion valve will be introduced in detail below.

[0029] 12 and 13, the second flow section 24a has a second subsection 241a and a second connection section 243a, the second connection section 243a is connected to the second subsection 241a, the second subsection 241a is closer to the valve port 120 than the second connection section 243a, the second subsection 241a and the second connection section 243a are both below the valve port 120, and the flow cross-sectional area of ​​the second subsection 241a is larger than the flow cross-sectional area of ​​the valve port 120, thus preventing the second subsection 241a from forming two throttles and affecting the flow rate; and the flow cross-sectional area of ​​the second connection section 243a is larger than the flow cross-sectional area of ​​the second subsection 241a, thus reducing the flow resistance. In this embodiment, the second subsection 241a and the second connection section 243a are different diameter sections.

[0030] Referring to FIG. 13, the second flow section 24a further has a second accommodating section 242a, the open end of the second accommodating section 242a is molded into the second wall surface 112a, the second accommodating section 242a is connected to the second connection section 243a, the diameter of the second accommodating section 242a is larger than the diameter of the second connection section 243a, and a second seal ring 402 is arranged in the second accommodating section 242a to prevent the operating medium from leaking at the connection point between the second connection section 243a and the connecting tube 5011a of the adapter.

[0031] Compared with the first embodiment of the thermal management unit and the electronic expansion valve, in this embodiment, the second subsection 241a and the second connecting section 243a are different diameter sections. For other configurations of the electronic expansion valve in this embodiment, refer to the first embodiment of the electronic expansion valve, so no detailed description will be given here.

[0032] Referring to FIG. 14, FIG. 14 is a schematic diagram of the configuration of a thermal management unit in a third embodiment of the technical solution, and FIG. 15 is a schematic diagram of the configuration of the electronic expansion valve in FIG. 14. The configuration of the third embodiment of the electronic expansion valve will be introduced in detail below.

[0033] 14 and 15 , the second flow section 24b has a second subsection 241b and a second connecting section 243b, the second subsection 241b communicates with the second connecting section 243b and is closer to the valve port 120 than the second connecting section 243b, the second connecting section 243b is perpendicular to the second wall surface 112 and connected to the connecting pipe 5011b of the adapter, the flow cross-sectional area of ​​the second connecting section 243b is larger than that of the second subsection 241b, a certain cross-sectional surface is defined, the center line of the valve body 13 is within the cross-sectional surface, and the flow path of the working medium in the first flow section 23 and the second flow section 24 is also within the cross-sectional surface, a first cross-sectional surface is obtained by creating a cross-section of the electronic expansion valve 1 along the cross-sectional surface, and in the first cross-sectional surface, The portion of the center line of subsection 241b that is within the second subsection 241b is defined as a second line, and the angle formed between the second line and the center line of the valve body 13 in a clockwise direction is an acute angle, so that the second flow section 24b is connected to the second chamber 220 in an inclined manner, and the working medium can flow into the second chamber 220. In this way, when the relative position between the connecting pipe of the adapter and the connecting member of the external system in FIG. 1 remains unchanged, by adjusting the relative position of the second flow section 24b based on the position of the first flow section 23b, the electronic expansion valve can be installed to fit the connecting pipe of the adapter and the connecting pipe of the external system in FIG. 1 as a replacement for the traditional thermostatic expansion valve, and the control accuracy of the flow rate is improved.

[0034] 14 and 15, when an extension line L2 is made in the first cross section along the extending direction of the second subsection 241b toward the direction approaching the second connecting section 243b, the extension line L2 does not intersect with the second connecting section 243b. In this way, when machining the second subsection 241b, the bit does not destroy the configuration of the second connecting section 243b, and in this embodiment, the second connecting section 241b is connected to the external connecting pipe 10b.

[0035] Referring to Figures 14 and 15, the flow cross-sectional area of ​​the second subsection 241b is larger than the flow cross-sectional area of ​​the valve port 120, thus preventing the operating medium from forming a throttle in the second subsection 241b and further affecting the flow rate; along the extension direction of the second subsection 241b, the distance between the second subsection 241b and the peripheral side wall of the second chamber 220 is 2 mm or more, thus ensuring the structural strength of the second subsection 241b.

[0036] 14 and 15, the first flow section 23b has a first subsection 231b and a first connection section 232b, the first connection section 232b is perpendicular to the first wall surface 111 and perpendicular to the first wall surface 112, and is connected to the external connection pipe, and the first subsection 231b directly communicates with the first chamber 210. In this embodiment, for the first subsection 231b and the first connection section 232b, in order to conveniently describe the first subsection 231b and the first connection section 232b, refer to FIG. 15. In this embodiment, the first connection section 232b is shown in FIG. 15. The first subsection 231b is to the right of the dashed line in FIG. 15, and the first subsection 231b is to the left of the dashed line in FIG. 15. The first subsection 231b and the first connecting section 232b are the same section. Specifically, the flow cross-sectional areas of each point of the first subsection 231b and the first connecting section 232b are equal. The first subsection 231b and the first connecting section 232b are both above the valve port 120. The flow cross-sectional area of ​​the first subsection 231b is greater than the flow cross-sectional area of ​​the valve port 120. Thus, two throttles are formed in the first subsection 231b, which further prevents the flow rate from being affected.

[0037] 14 and 15, the first flow-through portion 23b further has a first accommodating portion 233b communicating with the first connection section 232b, and the diameter of the first accommodating portion 233b is larger than the diameter of the first connection section 232b. Combining Figures 14 and 15, the first accommodating portion 233b has an accommodating chamber, and a first seal ring 401b is arranged in the accommodating chamber to prevent the operating medium from leaking at the connection point between the first flow-through portion 23b and the external connection tube 10b. The second flow-through portion 24b further has a second accommodating portion 242b communicating with the second connection section 243b, and the diameter of the second accommodating portion 242b is larger than the diameter of the second connection section 243b. A second seal ring 402b is arranged in the fourth accommodating portion 42b to prevent the operating medium from leaking at the connection point between the second flow-through portion 24b and the adapter-like connection tube 5011b.

[0038] Compared with the first embodiment of the thermal management unit and the electronic expansion valve, in this embodiment, the part of the center line of the second subsection 241b that is within the second subsection 241b is defined as a second line, and the angle formed between the second line and the center line of the valve body 13 along the clockwise direction is an acute angle, and the first circulating portion 23b is linear. Compared with the first embodiment of the thermal management unit and the electronic expansion valve, in this embodiment, the relative position of the second circulating portion 24b is adjusted based on the position of the first circulating portion 23b, so that the electronic expansion valve is installed to fit the connecting pipe of the adapter and the connecting pipe of the external system in FIG. 1 as a replacement for the traditional thermostatic expansion valve. In this embodiment, other configurations of the electronic expansion valve can be referred to the first embodiment of the electronic expansion valve, so that they will not be described in detail here.

[0039] Referring to FIG. 16, FIG. 16 is a schematic diagram of the configuration of a fourth embodiment of a thermal management unit in the technical solution, and FIG. 17 is a schematic diagram of the configuration of the electronic expansion valve in FIG. 16. The configuration of the fourth embodiment of the electronic expansion valve will be introduced in detail below.

[0040] 16 and 17, the first flow section 23c has a first subsection 231c and a first connection section 232c, the first subsection 231c communicates with the first connection section 232c and is closer to the valve port 120 than the first connection section 232c. The first subsection 231c and the first connection section 232c are both above the valve port 120. The first connection section 232c is connected to the external connection pipe 10c. The flow cross-sectional area of ​​the first subsection 231c is larger than the flow cross-sectional area of ​​the valve port 120, thus preventing the first subsection 231c from forming a double throttle and affecting the flow rate. The flow cross-sectional area of ​​the first connection section 232c is larger than the flow cross-sectional area of ​​the first subsection 231c, thus reducing the flow resistance. In this embodiment, the first subsection 231c and the first connection section 232c are sections with different diameters.

[0041] Referring to Figures 16 and 17, the first flow section 23c further has a first accommodating portion 233c communicating with the first connection section 232c, and the diameter of the first accommodating portion 233c is larger than the diameter of the first connection section 232c, and a first seal ring 401c is arranged in the first accommodating portion 233c to prevent the operating medium from leaking at the connection point between the first flow section 23c and the external connection pipe 10c.

[0042] Compared with the third embodiment of the thermal management unit and the electronic expansion valve, in this embodiment, the first subsection 231c and the first connecting section 232c are different diameter sections. In the embodiments, for other configurations of the electronic expansion valve, reference may be made to the third embodiment of the electronic expansion valve, so that detailed description will not be given here.

[0043] Referring to FIG. 18, FIG. 18 is a schematic diagram of the configuration of a thermal management unit of the fifth embodiment of the technical solution, and FIG. 19 is a schematic diagram of the configuration of the electronic expansion valve of FIG. 18. The configuration of the fifth embodiment of the electronic expansion valve will be introduced in detail below.

[0044] 18 and 19, the electronic expansion valve 1d has a first flow section 23d and a second flow section 24d, the working medium in the first flow section 23d can communicate with the working medium in the second flow section 24d, in this embodiment, at least a part of the first flow section 23d is defined above the valve port 120, and at least a part of the second flow section 24d is defined below the valve port 120, the first flow section 23d has a first subsection 231d communicating with the first connection section 232d and a first connection section 232d connected to the external connection pipe 10d, The section 231d communicates with the first chamber 210, and the second flow section 24d has a second subsection 241d communicating with the second connection section 243d and a second connection section 243d connected to the adapter connection pipe 5011d, and defines a certain cross section, the center line of the valve body 13 is within the cross section, and the flow path of the working medium in the first flow section 23d and the second flow section 24d is also within the cross section, and a first cross section is obtained by creating a cross section of the electronic expansion valve 1d along the cross section, and the first subsection 241d communicates with the center line of the first subsection 231d. The portion of the second subsection 241d that is within the first subsection 241d is defined as a first line, and the portion of the second subsection 241d that is within the second subsection 241d is defined as a second line. In the first cross section, the angles formed between the first line and the second line and the center line of the valve body along the clockwise direction are all acute angles. In this manner, the first flow section 23d is connected to the first chamber 210, the second flow section 24d is connected to the second chamber 220, and the working medium is connected to the first chamber 210 through the first flow section 26d by inclining the first subsection 231d and the second subsection 241d. 1 and the connecting pipe 110' of the external system in the relative position between the adapter connecting pipe 5011' in FIG. 1 and the connecting pipe 110' of the external system, the electronic expansion valve can be installed to fit the connecting pipe 5011' of the adapter in FIG. 1 and the connecting pipe 110' of the external system in the relative position between the adapter connecting pipe 5011' ...

[0045] Compared with the first embodiment of the thermal management unit and the electronic expansion valve, in this embodiment, in the first cross section, the angles formed between the first and second lines and the center line of the valve body 13 along the clockwise direction are all acute angles. Compared with the first embodiment of the thermal management unit and the electronic expansion valve, in this embodiment, the first connection section 232d and the second connection section 243d are close to each other, so that the electronic expansion valve replaces the traditional thermostatic expansion valve and is further installed to fit into the adapter connection pipe 5011' and the external system connection pipe 110' in FIG. 1. For other configurations of the electronic expansion valve in this embodiment, please refer to the first and third embodiments of the electronic expansion valve, so no detailed description will be given here.

[0046] Referring to Figure 20, Figure 20 is a schematic diagram of the configuration of the thermal management unit in the technical solution according to the sixth embodiment, and Figures 21 to 25 are schematic diagrams of the configuration of the electronic expansion valve in Figure 20. The configuration of the sixth embodiment of the electronic expansion valve will be introduced in detail below.

[0047] 20 to 25, the electronic expansion valve 1e further includes a valve body 11e having a first flow section 23e and a second flow section 24e molded therein, and the electronic expansion valve 1e further includes a sensor 2e, the sensor 2e is fixedly disposed on the valve body 11e so as to be positionally restricted, and is electrically and / or signal-connected to a circuit board 16e, the valve body 11e further includes a first flow passage 3e that does not communicate with the first flow passage 23e and the second flow passage 24e, and at least a part of the sensor 2e enters the first flow passage 3e, and the sensor 2e detects the pressure and / or temperature of the working medium in the first flow passage 3e, and the sensor 2e and the electronic expansion valve 1e are assembled to be integrated, thereby improving the integration degree of the system. Combining FIGS. 20 and 23, the working medium flows in through the first flow passage 23e, Then, the working medium that has been throttled by the valve port 120 flows into the heat exchanger 500 through the second flow section 24e, and the working medium that has undergone heat exchange flows out through the first flow path 3e. In this embodiment, the temperature and / or pressure of the working medium at the outlet side of the heat exchanger is detected by the sensor 2e. The sensor 2e is electrically and / or signal-connected to the circuit board 16e, so that the sensor 2e transmits the collected temperature and / or pressure signal to the circuit board 16e. After the circuit board 16e obtains the relevant parameters, it adjusts the opening degree of the electronic expansion valve 1e according to a corresponding control program. Compared with the second embodiment of the thermal management unit and the electronic expansion valve, in this embodiment, the sensor 2e and the electronic expansion valve 1e are assembled to be integrated, thereby improving the integration degree of the system.

[0048] In the sixth embodiment of the electronic expansion valve, only the configuration of the first circulating section and the second circulating section in the second embodiment is utilized, and of course, the configuration methods of the first circulating section and the second circulating section in the second to fifth embodiments of the electronic expansion valve described in this specification are also applied to this embodiment in the same manner, so that they will not be described in detail here.

[0049] It is to be understood that the above embodiments do not limit the technical solutions described in the present invention, but only illustrate the present invention, and the present specification has described the present invention in detail with reference to the above embodiments. However, as can be understood by those skilled in the art, those skilled in the art may make amendments or equivalent replacements to the present invention, and any technical solutions and improvements thereon that do not deviate from the spirit and scope of the present invention should fall within the scope of the claims of the present invention.

[0050] This application claims priority to an invention patent application filed with the China Patent Office on January 30, 2019, bearing application number 201910089086.2, and entitled "ELECTRONIC EXPANSION VALVE AND THERMAL MANAGEMENT UNIT", the entire contents of which are incorporated herein by reference.

Claims

1. A thermal management unit having an electronic expansion valve and a heat exchanger fixedly connected via an adapter, the electronic expansion valve having a valve body, a valve element, a rotor unit, a stator unit and a circuit board; the stator unit is positioned on the outer periphery of the rotor unit and is electrically connected to the circuit board; the electronic expansion valve has a valve port, and the valve element moves relative to the valve port to adjust the opening degree of the valve port; the valve body has a first flow passage portion and a second flow passage portion, and at least a portion of the first flow passage portion is defined above the valve port and at least a portion of the second flow passage portion is defined below the valve port; the valve body has a first chamber and a second chamber, and the first chamber is defined above the valve port and the second chamber is defined below the valve port, and the first flow passage portion communicates with the first chamber and the second flow passage portion communicates with the second chamber, The operating medium flows in from the first flow portion and flows out from the second flow portion through the valve port, the first flow-through portion has a first connection section connected to a connection pipe of an external system and a first subsection directly communicating with the first chamber, the second flow-through portion has a second connection section connected to a connection pipe of the adapter and a second subsection directly communicating with the second chamber, a portion of a center line of the first subsection that is within the first subsection is defined as a first line, a portion of a center line of the second subsection that is within the second subsection is defined as a second line, a cutting plane is defined, a center line of the valve body is within the cutting plane, and a flow path of the operating medium in the first flow portion and the second flow portion is also within the cutting plane, a first cross section is formed by creating a cross section of the electronic expansion valve along the cutting plane, and an angle formed between at least one of the first line and the second line and the center line of the valve body along a clockwise direction in the first cross section is an acute angle, the valve body having oppositely disposed first and second wall surfaces, the first connection section perpendicular to the first wall surface, the second connection section perpendicular to the second wall surface, and a flow cross-sectional area of ​​the first subsection smaller than a flow cross-sectional area of ​​the second subsection.

2. 2. The thermal management unit of claim 1, wherein the first subsection communicates directly with the first connection section and is closer to the valve port than the first connection section, the flow cross-sectional area of ​​the first connection section is larger than the flow cross-sectional area of ​​the first subsection, and an angle formed in the first cross-section along a clockwise direction from the first line to a center line of the valve body is an acute angle.

3. The second subsection communicates directly with the second connection section, 3. The thermal management unit of claim 1, wherein the first cross-section is closer to the valve port than the second subsection, the flow cross-sectional area of ​​the second connection section is greater than the flow cross-sectional area of ​​the second subsection, and an angle formed in the first cross-section between the second line and a center line of the valve body along a clockwise direction is an acute angle.

4. The thermal management unit of claim 2, characterized in that the flow cross-sectional area of ​​the first subsection is larger than the flow cross-sectional area of ​​the valve port, and when an extension line is drawn in the first cross section along the extension direction of the first subsection toward a direction approaching the first connection section, the extension line does not intersect with the peripheral wall of the first connection section.

5. a cross-sectional flow area of ​​the second subsection is larger than a cross-sectional flow area of ​​the valve port, the cross-sectional flow areas of the second connection section and the second subsection are equal at each location, the second connection section and the second subsection are the same section, and the second connection section and the second subsection are both below the valve port, Alternatively, the thermal management unit of claim 4, characterized in that the second subsection has a cross-sectional flow area larger than the cross-sectional flow area of ​​the valve port, the second connection section communicates with the second subsection, the second subsection is closer to the valve port than the second connection section, the second connection section has a cross-sectional flow area larger than the cross-sectional flow area of ​​the second subsection, the second connection section and the second subsection are different diameter sections, and both the second connection section and the second subsection are below the valve port.

6. The thermal management unit described in claim 3, characterized in that the flow cross-sectional area of ​​the second subsection is larger than the flow cross-sectional area of ​​the valve port, and when an extension line is drawn in the first cross section along the extension direction of the second subsection toward a direction approaching the second connection section, the extension line does not intersect with the peripheral wall of the second connection section.

7. a flow cross-sectional area of ​​the first subsection is larger than a flow cross-sectional area of ​​the valve port, the flow cross-sectional areas of the first connection section and the first subsection are equal at each location, the first connection section and the first subsection are the same section, and both the first connection section and the first subsection are above the valve port, Alternatively, the thermal management unit of claim 6, wherein the flow cross-sectional area of ​​the first subsection is larger than the flow cross-sectional area of ​​the valve orifice, the first connection section communicates with the first subsection, the first subsection is closer to the valve orifice than the first connection section, the flow cross-sectional area of ​​the first connection section is larger than the flow cross-sectional area of ​​the first subsection, the first connection section and the first subsection are different diameter sections, and both the first connection section and the first subsection are above the valve orifice.

8. The thermal management unit according to any one of claims 1 to 7, characterized in that the electronic expansion valve further has a sensor, the sensor is fixedly arranged so as to be positionally restricted in the valve body and is electrically and / or signal-connected to the circuit board, the valve body further has a first flow passage not communicating with the first flow passage and the second flow passage, at least a portion of the sensor extends into the first flow passage, and the sensor detects the pressure and / or temperature of the operating medium in the first flow passage.

9. 2. The thermal management unit of claim 1, wherein the electronic expansion valve further comprises a sensor, the sensor being fixedly arranged so as to be positionally restricted in the valve body and electrically and / or signal-connected to the circuit board, the valve body further comprising a first flow passage not communicating with the first flow passage and the second flow passage, at least a portion of the sensor extending into the first flow passage, and the sensor detecting a pressure and / or a temperature of the operating medium in the first flow passage.

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