Heat dissipation for LIDAR sensors

Abstract

To improve the accuracy of an FMCW LIDAR signal.SOLUTION: A LIDAR apparatus in an integrated chip includes a substrate layer, a cladding layer, a waveguide and an ohmic element. The cladding layer is disposed together with the substrate layer. The waveguide passes through the cladding layer. The ohmic element passes through the cladding layer. The ohmic element is disposed to transfer heat to the waveguide when current is driven through the ohmic element.SELECTED DRAWING: Figure 3c

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Patent Application No. 17 / 530,925, filed November 19, 2021, which claims priority to U.S. Provisional Application No. 63 / 117,310, filed November 23, 2020. U.S. Application Nos. 17 / 530,925 and 63 / 117,310 are incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE This disclosure relates generally to optics, and more particularly, to Light Detection and Ranging (LIDAR). [Background technology]

[0003] Frequency Modulated Continuous Wave (FMCW) LIDAR directs a frequency modulated collimated beam of light at a target to directly measure the distance and velocity of an object. Target range and velocity information is derived from the FMCW LIDAR signal. Designs and techniques that increase the accuracy of the LIDAR signal are preferred.

[0004] The automotive industry is currently developing autonomous capabilities to control vehicles in certain situations. According to SAE International Standard J3016, there are six levels of autonomy ranging from Level 0 (no autonomy) to Level 5 (vehicles that can operate without driver input in all conditions). Vehicles with autonomous capabilities use sensors to sense the environment in which the vehicle travels. By acquiring and processing data from the sensors, the vehicle is able to explore the environment. An autonomous vehicle may include one or more FMCW LIDAR devices to sense the environment. Summary of the Invention

[0005] An embodiment of the present disclosure includes a Light Detection and Ranging (LIDAR) device in an Integrated Chip including a substrate layer, a cladding layer, a waveguide, and an Ohmic Element. The cladding layer is disposed with the substrate layer. At least a portion of the waveguide passes through the cladding layer. At least a portion of the Ohmic Element passes through the cladding layer. The Ohmic Element is arranged to transfer heat to the waveguide in response to a current supplied to the Ohmic Element.

[0006] In one embodiment, the substrate layer includes an air gap, and the waveguide is disposed between the ohmic element and the air gap. The air gap of the substrate layer may include a polymer or a polyimide. The air gap of the substrate layer may include a dielectric. The air gap of the substrate layer may include one or more metals.

[0007] In one embodiment, the waveguide has a higher index of refraction than the cladding layer.

[0008] In one embodiment, the ohmic element runs alongside the waveguide.

[0009] In one embodiment, the LIDAR device further includes a heating module configured to modulate the phase of light propagating through the waveguide by modulating the current supplied to the ohmic element.

[0010] In one embodiment, the light propagating through the waveguide is infrared.

[0011] In one embodiment, the heat generating module is coupled to a first portion of the ohmic element and a second portion of the ohmic element opposite the first portion of the ohmic element.

[0012] In one embodiment, a portion of the cladding layer is located between the waveguide and the ohmic element.

[0013] In one embodiment, the substrate layer is a silicon substrate.

[0014] In one embodiment, the cladding layer comprises silicon dioxide.

[0015] In one embodiment, the waveguide comprises at least one of silicon dioxide, silicon, or silicon nitride.

[0016] In one embodiment, the ohmic element includes at least one of a metal or doped silicon.

[0017] An embodiment of the present disclosure includes an autonomous vehicle control system for an autonomous vehicle including a LIDAR device and one or more processors. The LIDAR device includes a substrate layer, a cladding layer, a waveguide, and an ohmic element. The cladding layer is disposed with the substrate layer. At least a portion of the waveguide passes through the cladding layer. At least a portion of the ohmic element passes through the cladding layer. The ohmic element is arranged to transfer heat to the waveguide in response to a current supplied to the ohmic element. An infrared transmit beam is configured to propagate through the waveguide to an environment external to the autonomous vehicle. The one or more processors are configured to control the autonomous vehicle in response to an infrared return beam that is a reflection of the infrared transmit beam.

[0018] In one embodiment, the substrate layer includes an air gap, and the waveguide is disposed between the ohmic element and the air gap.

[0019] In one embodiment, the LIDAR device further includes a heat generating module configured to modulate a phase of an infrared transmit beam propagating through the waveguide by modulating a current driven through the ohmic element.

[0020] An embodiment of the disclosure includes an autonomous vehicle including a LIDAR sensor and a control system. The LIDAR sensor includes a substrate layer, a cladding layer, a waveguide, and an ohmic element. The cladding layer is disposed with the substrate layer. The waveguide passes through the cladding layer. The ohmic element passes through the cladding layer. The ohmic element is arranged to transfer heat to the waveguide in response to a current provided to the ohmic element. An infrared transmit beam is configured to propagate through the waveguide to an environment external to the autonomous vehicle. The control system is configured to control the autonomous vehicle in response to an infrared return beam that is a reflection of the infrared transmit beam.

[0021] In an embodiment, the autonomous vehicle further includes a heat generating module configured to modulate a phase of an infrared transmit beam propagating through the waveguide by modulating a current driven through the ohmic element. [Brief description of the drawings]

[0022] Non-limiting and non-exhaustive embodiments of the present invention are described with reference to the following drawings, in which, unless otherwise stated, like reference numerals refer to like parts throughout the various drawings.

[0023] [Figure 1a] 1 illustrates an optical structure including a substrate layer, a cladding layer, a waveguide, and an Ohmic element according to an embodiment of the present disclosure.

[0024] [Figure 1b] 1 illustrates an optical structure having a void formed in a substrate layer according to an embodiment of the present disclosure.

[0025] [Figure 1c] 1 illustrates an apparatus including a light structure and a heat generating module according to an embodiment of the present disclosure.

[0026] [Figure 2a]1 illustrates a polymeric material formed in a void according to an embodiment of the present disclosure. [Figure 2b] 1 illustrates a polymeric material formed in a void according to an embodiment of the present disclosure. [Figure 2c] 1 illustrates a polymeric material formed in a void according to an embodiment of the present disclosure.

[0027] [Figure 3a] 1 illustrates a dielectric material formed in the gap according to an embodiment of the present disclosure. [Figure 3b] 1 illustrates a dielectric material formed in the gap according to an embodiment of the present disclosure. [Figure 3c] 1 illustrates a dielectric material formed in the gap according to an embodiment of the present disclosure.

[0028] [Figure 4a] 1 illustrates metal formed in a gap according to an embodiment of the present disclosure. [Figure 4b] 1 illustrates metal formed in a gap according to an embodiment of the present disclosure. [Figure 4c] 1 illustrates metal formed in a gap according to an embodiment of the present disclosure. [Figure 4d] 1 illustrates metal formed in a gap according to an embodiment of the present disclosure. [Figure 4e] 1 illustrates metal formed in a gap according to an embodiment of the present disclosure.

[0029] [Figure 5a] 1 illustrates an autonomous vehicle including an exemplary array of sensors according to an embodiment of the present disclosure.

[0030] [Figure 5b] FIG. 1 illustrates a top view of an autonomous vehicle including an exemplary array of sensors according to an embodiment of the present disclosure.

[0031] [Figure 5c] 1 illustrates an exemplary vehicle control system including a sensor, a drivetrain, and a control system according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] An embodiment of a heat dissipation design in a thermally controlled waveguide is described herein. In the following description, some details are presented to provide a thorough understanding of the embodiment. However, those skilled in the relevant art will recognize that the technology described herein may be implemented without one or more specific details, or using other methods, elements, or materials, etc. In other cases, well-known structures, materials, or operations have not been shown or described in detail to avoid obscuring certain aspects.

[0033] References throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described with respect to an embodiment is included in at least one embodiment of the invention. Thus, the appearances of the phrase "one embodiment" or "an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Also, particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0034] Throughout this specification, several technical terms are used. These terms shall take their general meaning in the technical field from which they originate, unless specifically defined herein or the context of use clearly indicates otherwise. For purposes of this disclosure, the term "Autonomous Vehicle" includes vehicles having autonomous capabilities at the SAE International Standard J3016 autonomy level.

[0035] The temperature in an optical waveguide may need to be manipulated to achieve a desired function, such as optical phase control. In an exemplary context, the phase of light propagating through the waveguide can change with the temperature of the waveguide. Thus, thermal behavior, such as Thermal Tuning Efficiency and Thermal Bandwidth, is important for certain applications and often requires careful design and optimization.

[0036] An embodiment of the present disclosure includes an Ohmic Element arranged to apply heat to the waveguide to control the phase characteristics of the light propagating through the waveguide. The waveguide and Ohmic Element pass through the cladding layer, and a cavity filled (or partially filled) with air, polymer, dielectric or metal may be placed near the waveguide to aid in temperature control of the waveguide. By selecting a filler material to backfill the cavity, the Heat Dissipation Rate of the waveguide can be tailored to specific design criteria. That is, modifying the heat dissipation function of the periphery of the waveguide affects the thermal behavior of the waveguide.

[0037] Embodiments of the present disclosure may include a LIDAR device that includes a waveguide that is selectively heated and cooled to modulate the phase of infrared light emitted by the LIDAR device. The LIDAR device may be included in an autonomous vehicle or a system for an autonomous vehicle.

[0038] FIG. 1a shows an optical structure 100 including a substrate layer 110, a cladding layer 120, a waveguide 130, and an ohmic element 140 according to an embodiment of the present disclosure. The substrate layer 110 may be a silicon substrate. The cladding layer 120 is disposed with the substrate layer 110 and may include Silicon Dioxide. The cladding layer 120 may be in contact with the substrate layer 110. The cladding layer 120 may be grown or deposited on the substrate layer 110. The cladding layer 120 may be bonded to the substrate layer 110. The waveguide 130 passes through the cladding layer 120 (in or out of the page) and may include Silicon Dioxide, Silicon, or Silicon Nitride. The waveguide 130 has a higher refractive index than the cladding layer 120. The ohmic element 140 may include a metal (e.g., copper) or doped silicon. The ohmic elements 140 are arranged (or positioned) to transfer heat through the cladding layer 120 and to the waveguide 130 in response to an electrical current being supplied (eg, driven) to the ohmic elements 140 .

[0039] FIG. 1b illustrates an optical structure 102 with voids 107 formed in a substrate layer 110 of the optical structure 100 according to an embodiment of the present disclosure. To form the voids 107 in the optical structure 100, the substrate layer 110 (e.g., a silicon wafer) can be flipped over and one or more voids 107 can be etched into the substrate layer 110. In some embodiments, plasma etching techniques or anisotropic chemical etching can be used to form the voids 107. In FIG. 1b, the waveguide 130 is disposed between the ohmic element 140 and the voids 107 in the substrate layer 110. In the particular example of FIG. 1b, the voids 107 are filled with air or other gas. When silicon is used as the substrate layer 110, the thermal conductivity of silicon is about 160 W / mK, and the thermal conductivity of air is 0.025 W / mK, so forming the voids 107 substantially reduces the heat emission from the waveguide 130. In embodiments of the present disclosure, the void 107 may remain an air gap or may include (e.g., filled or partially filled) a material such as a polymer, a dielectric, and / or a metal to control heat emission from the waveguide 130.

[0040] FIG. 1c shows an apparatus 104 including an optical structure 102 and a heat generating module 150 according to an embodiment of the present disclosure. FIG. 1c includes a side view of the optical structure 102 cut along a plane 190 of FIG. 1b. The substrate layer 110 is visible behind the cavity 107 when the cavity 107 is filled with air. FIG. 1b and FIG. 1c show that a portion of the cladding layer 120 is disposed between the waveguide 130 and the ohmic element 140. In FIG. 1b and FIG. 1c, the ohmic element 140 runs alongside the waveguide 130, but in other embodiments, the ohmic element 140 does not necessarily run alongside the waveguide 130.

[0041] In FIG. 1c, the heat generating module 150 drives a current through the ohmic element 140 in response to a heat signal 153. The heat signal 153 can be an analog or digital control signal. The heat generating module 150 can include one or more transistors. The heat generating module 150 is coupled to both ends of the ohmic element 140 to drive a current through the ohmic element 140 to transfer heat to the waveguide 130. Thus, the heat generating module 150 can be coupled to a first portion of the ohmic element 140 and a second portion of the ohmic element 140 opposite the first portion of the ohmic element 140. A voltage potential can be present across the ohmic element 140. Heating or cooling the waveguide 130 can change the phase of light propagating through the waveguide 130. In FIG. 1c, input light 171 is received by the waveguide 130 at an input end of the waveguide 130. The input light 171 propagates through the waveguide 130 and exits the output end as output light 173. The phase of the output light 173 may vary depending on the heat transferred to the waveguide 130 by the ohmic element 140. Thus, the heat generating module 150 may be configured to modulate the phase of the light propagating through the waveguide 130 by modulating the current driven through the ohmic element 140. The light 171 may be infrared. The light 171 may be near infrared.

[0042] 2a-2c show a polymer material 260 formed in the voids 107 according to an embodiment of the present disclosure. FIG. 2a shows the optical structure 102. FIG. 2b shows that the polymer material 260 can be formed in the voids 107 of the optical structure 102 to form the optical structure 204. Forming the polymer material 260 can include flipping the optical structure 102 wafer and spin-coating a photosensitive polymer such as polyimide or a Benzocyclobutene-based Polymer onto the optical structure 102. FIG. 2c shows that a portion of the polymer material 260 is removed, leaving the polymer material 260 filling the voids 107 of the optical structure 206. In FIG. 2c, the top of the polymer material 260 can be flat with the top of the substrate layer 110. Forming the optical structure 206 from the optical structure 204 can include, for example, photolithography techniques to pattern and remove excess polymer material 260.

[0043] 3a-3c show a dielectric material 360 formed in the void 107 according to an embodiment of the present disclosure. FIG. 3a shows the optical structure 102. FIG. 3b shows that the dielectric material 360 can be formed in the void 107 of the optical structure 102 to form the optical structure 304. Forming the dielectric material 360 can include flipping the wafer of the optical structure 102 and depositing the dielectric material 360 (e.g., silicon oxide) on the optical structure 102. For example, a Flame Hydrolysis Deposition Technique can be used to deposit the dielectric material 360 on the optical structure 102. FIG. 3c shows that a portion of the dielectric material 360 is removed, leaving the dielectric material 360 filling the void 107 of the optical structure 306. The top of the dielectric material 360 can be flat with the top of the substrate layer 110. Producing optical structure 306 from optical structure 304 may include, for example, chemical mechanical polishing (CMP) to remove excess dielectric material 360 to planarize the wafer.

[0044] 4a-4e show a metal 460 formed in the void 107 according to an embodiment of the present invention. FIG. 4a shows the optical structure 102. FIG. 4b shows a metal film layer 445 disposed on top of the substrate layer 110 and within the void 107 of the optical structure 102 to form an optical structure 404. The metal film layer 445 is also formed on the bottom of the void 107 and on the sidewalls of the void 107. In one embodiment, the metal film layer 445 is copper. Forming the metal film layer 445 may include electroplating the metal film layer 445 on the optical structure 102. The metal film layer 445 acts as a seed layer for filling the void 107 with a subsequent metal material.

[0045] FIG. 4c shows a light structure 406 formed by patterning a photoresist 455 on the light structure 404. In some embodiments, photolithography techniques can be used to pattern the photoresist 455. FIG. 4d shows an additional metal material 460 formed in the voids 107 of the light structure 406 to form the light structure 408. In some embodiments, the metal 460 can be formed by an electroplating process. In an embodiment of the present disclosure, the metal 460 can be copper or nickel-iron (NiFe). FIG. 4e shows a light structure 410. The light structure 410 can be formed by removing the photoresist 455 from the light structure 408 and a portion of the metal film layer 445 disposed on the substrate layer 110. Removing the photoresist 455 can include stripping the photoresist 455, and removing the metal film layer 445 can include an etching process.

[0046] The optical structures 102, 206, 306, and 410 show that the void 107 can be filled or partially filled with air (or other gas), polymer, dielectric, or metal. Thus, different heat dissipation rates can be designed for different optical structures to select a heat dissipation rate that meets the design goal. In some embodiments, the thermal conductivity of the material included in the void 107 is between 0.1 W / mK and 1 W / mK. In some embodiments, the thermal conductivity of the material included in the void 107 is between 1 W / mK and 2 W / mK. In some embodiments, the thermal conductivity of the material included in the void 107 is between 2 W / mK and 10 W / mK. In some embodiments, the thermal conductivity of the material included in the void 107 is between 10 W / mK and 100 W / mK. In some embodiments, the thermal conductivity of the material included in the void 107 is between 100 W / mK and 500 W / mK. In some embodiments, the filler material is polyimide with a thermal conductivity of 0.12 W / mK. In some embodiments, the filler material is silicon oxide with a thermal conductivity of 1.4 W / mK. In some embodiments, the filler material is nickel-iron alloy with a thermal conductivity of 17 W / mK. In some embodiments, the filler material is copper with a thermal conductivity of 390 W / mK.

[0047] The optical structures 102, 206, 306 and 410 can be considered as a Photonic Integrated Circuit (PIC) on a Silicon-On-Insulator (SOI) wafer when a silicon wafer is used as the substrate layer 110. In an embodiment of the present disclosure, the optical structures 206, 306 and 410 can have a thermal module similar to the heat generating module 150 coupled to the ohmic element 140 to modulate a current through the ohmic element in response to a thermal signal 153 to modulate heat transferred to the waveguides in the optical structures 206, 306 and 410.

[0048] FIG. 5a illustrates an example autonomous vehicle 500 that may include the optical structures of FIGS. 1a-4e of a LIDAR device according to an embodiment of the present disclosure. The illustrated autonomous vehicle 500 includes a sensor array configured to capture one or more objects of an external environment of the autonomous vehicle and generate sensor data related to the captured one or more objects for the purpose of controlling the operation of the autonomous vehicle 500. FIG. 5a illustrates sensors 533A, 533B, 533C, 533D, and 533E. FIG. 5b illustrates a top view of the autonomous vehicle 500 that includes sensors 533F, 533G, 533H, and 533I in addition to sensors 533A, 533B, 533C, 533D, and 533E. Any of the sensors 533A, 533B, 533C, 533D, 533E, 533F, 533G, 533H, and / or 533I may include a LIDAR device that includes the design of FIGS. 1a-4e. 5c illustrates a block diagram of an example system 599 for an autonomous vehicle 500. For example, the autonomous vehicle 500 may include a powertrain 502 including a prime mover 504 that may be powered by an energy source 506 and provide power to a drivetrain 508. The autonomous vehicle 500 may further include a control system 510 including directional control 512, powertrain control 514, and brake control 516. The autonomous vehicle 500 may be embodied as many different vehicles, including vehicles that may transport people and / or cargo and may operate in a variety of different environments. It will be appreciated that the components 502-516 described above may vary widely depending on the type of vehicle in which these components are used.

[0049] For example, the embodiments described below focus on wheeled land vehicles such as cars, vans, trucks, or buses. In such embodiments, the prime mover 504 may include one or more electric motors and / or an internal combustion engine (among others). The energy source may include, for example, a fuel system (e.g., providing gasoline, diesel, hydrogen), a battery system, solar panels or other renewable energy sources and / or a fuel cell system. The drivetrain 508 may include wheels and / or tires along with a transmission and / or any other mechanical drive components suitable for converting the power output of the prime mover 504 into vehicle motion, as well as one or more brakes configured to controllably stop or slow the autonomous vehicle 500 and a steering or steering component suitable for controlling the trajectory of the autonomous vehicle 500 (e.g., a rack and pinion steering connection that allows one or more wheels of the autonomous vehicle 500 to pivot about a generally vertical axis to change the angle of the wheel's rotational plane relative to the vehicle's longitudinal axis). In some embodiments, a combination of powertrain and energy source may be used (e.g., in the case of an electric / gas hybrid vehicle). In some embodiments, multiple electric motors (eg, dedicated to individual wheels or axles) can be used as prime movers.

[0050] Directional control 512 may include one or more actuators and / or sensors for controlling and receiving feedback from directional or steering components so that autonomous vehicle 500 can follow a desired trajectory. Powertrain control 514 may be configured to control the output of powertrain 502, such as by controlling the output power of prime mover 504 and controlling the transmission gears of drivetrain 508, thereby controlling the speed and / or direction of autonomous vehicle 500. Brake control 516 may be configured to control one or more brakes, such as disc or drum brakes coupled to the wheels of the vehicle, to slow or stop autonomous vehicle 500.

[0051] Other vehicle types, including, but not limited to, off-road vehicles, all-terrain or track vehicles, or construction equipment, will necessarily utilize other powertrains, drivetrains, energy sources, directional control, powertrain control, and braking control as would be understood by one of ordinary skill in the art having the benefit of this disclosure. Also, in some embodiments, some components may be combined, although for example, directional control of the vehicle may be handled primarily by modifying the output of one or more prime movers. Thus, the embodiments disclosed herein are not limited to the specific application of the technology described herein in wheeled land autonomous vehicles.

[0052] In the illustrated embodiment, autonomous control for the autonomous vehicle 500 is embodied in a vehicle control system 520, which may include one or more processors and one or more memories 524 within processing logic 522, which is configured to execute program code (e.g., instructions 526) stored in memory 524. The processing logic 522 may include, for example, a graphics processing unit (GPU) and / or a central processing unit (CPU). The vehicle control system 520 may be configured to control a powertrain 502 of the autonomous vehicle 500 in response to an infrared return beam that is a reflection of the infrared transmit beam that propagates through the multiple waveguides 130 into an environment external to the autonomous vehicle 500 and is reflected back to the receiving LIDAR pixels.

[0053] The sensors 533A-533I may include various sensors suitable for collecting data from the autonomous vehicle's surrounding environment for use in controlling the operation of the autonomous vehicle. For example, the sensors 533A-533I may include a RADAR unit 534, a LIDAR unit 536, a 3D positioning sensor 538, a satellite navigation system such as GPS, GLONASS, BeiDou, Galileo, or Compass. The LIDAR design of FIGS. 1a-4e may be included in the LIDAR unit 536. The LIDAR unit 536 may include, for example, multiple LIDAR sensors distributed around the autonomous vehicle 500. In some embodiments, the 3D positioning sensor 538 may use satellite signals to determine the vehicle's position on Earth. The sensors 533A-533I may optionally include one or more ultrasonic sensors, one or more cameras 540, and / or an inertial measurement unit (IMU) 542. In some embodiments, the camera 540 may be a monographic or stereographic camera capable of recording still and / or video images. The camera 540 may include a complementary metal-oxide-semiconductor (CMOS) image sensor configured to capture images of one or more objects in the external environment of the autonomous vehicle 500. The IMU 542 may include a multi-gyroscope and accelerometer capable of detecting linear and rotational motion of the autonomous vehicle 500 in three directions. One or more encoders (not shown), such as wheel encoders, may be used to monitor the rotation of one or more wheels of the autonomous vehicle 500.

[0054] The output of the sensors 533A-533I may be provided to a control subsystem 550, which includes a localization subsystem 552, a trajectory subsystem 556, a perception subsystem 554, and a control system interface 558. The localization subsystem 552 may be configured to determine the position and orientation (also sometimes referred to as "attitude") of the autonomous vehicle 500 within the surrounding environment, and generally within a particular geographic region. The autonomous vehicle's position may be compared to the positions of additional vehicles in the same environment as part of the labeled autonomous vehicle data generation. The perception subsystem 554 may be configured to detect, track, classify, and / or determine objects within the environment surrounding the autonomous vehicle 500. The trajectory subsystem 556 may be configured to generate trajectories for stationary and moving objects in the environment, as well as trajectories for the autonomous vehicle 500 given a desired destination over a particular time frame. Machine learning models according to some embodiments may be utilized to generate the vehicle trajectory. The control system interface 558 is configured to communicate with the control system 510 to implement the trajectory of the autonomous vehicle 500. In some embodiments, machine learning models can be leveraged to control an autonomous vehicle to execute a planned trajectory.

[0055] It will be understood that the collection of components for vehicle control system 520 shown in FIG. 5c is merely exemplary in nature. Individual sensors may be omitted in some embodiments. In some embodiments, the different types of sensors shown in FIG. 5c may be used redundantly and / or to cover different areas in the environment surrounding the autonomous vehicle. In some embodiments, different types and / or combinations of control subsystems may be used. Also, although subsystems 552-558 are shown as separate from processing logic 522 and memory 524, it will be understood that in some embodiments, some or all of the functionality of subsystems 552-558 may be embodied in program code, such as instructions 526 resident in memory 524 and performed by processing logic 522, and that these subsystems 552-558 may be embodied using the same processor and / or memory, in some cases. In some embodiments, the subsystems may be embodied as various dedicated circuit logic, various processors, various Field Programmable Gate Arrays (FPGAs), various Application-Specific Integrated Circuits (ASICs), various real-time controllers, etc., and as previously described, multiple subsystems may utilize circuits, processors, sensors, and / or other components. Additionally, the various components of vehicle control system 520 may be networked in various ways.

[0056] In some embodiments, different architectures including various combinations of software, hardware, circuit logic, sensors, and networks can be used to embody the various components shown in FIG. 5c. Each processor can be embodied, for example, as a microprocessor, and each memory can refer to main storage as well as any auxiliary levels of memory, for example, random access memory (RAM), including cache memory, non-volatile or backup memory (e.g., programmable or flash memory), or read-only memory. Each memory can also be considered to include memory storage physically located elsewhere in the autonomous vehicle 500, for example, any cache memory of the processor, as well as any storage capacity used as virtual memory, for example, as stored in a mass storage device or other computer controller. The processing logic 522 shown in FIG. 5c, or entirely separate processing logic, can be used to perform additional functions in the autonomous vehicle 500 other than for autonomous control purposes, for example, to control an entertainment system or operate doors, lights, or convenience functions.

[0057] For additional storage, autonomous vehicle 500 may also include one or more mass storage devices, such as a removable disk drive, a hard disk drive, a direct access storage device ("DASD"), an optical drive (e.g., CD drive, DVD drive), a solid state storage drive (SSD), a network attached storage, a storage area network, and / or a tape drive. Autonomous vehicle 500 may also include a user interface 564, such as one or more displays, touch screens, voice and / or gesture interfaces, buttons, and other tactile controls, through which autonomous vehicle 500 receives inputs from and generates outputs for the passenger. In some embodiments, inputs from the passenger may be received via other computers or electronic devices, such as via an app on a mobile device or via a web interface.

[0058] In some embodiments, autonomous vehicle 500 may include one or more network interfaces, e.g., network interface 562, suitable for communicating with one or more networks 570 (e.g., a local area network ("LAN"), a wide area network ("WAN"), a wireless network, and / or the Internet, etc.), which may enable communication of information with other computers and electronic devices, including, for example, a central service, such as a cloud service, for autonomous vehicle 500 to receive environmental and other data for use in autonomous control. In some embodiments, data collected by one or more sensors 533A-533I may be uploaded via network 570 to computing system 572 for additional processing. In such embodiments, a timestamp may be associated with each instance of vehicle data prior to uploading.

[0059] The processing logic 522 shown in Figure 5c, as well as the various additional controllers and subsystems disclosed herein, generally operate and execute under the control of an operating system or otherwise rely on various computer software applications, components, programs, objects, modules, or data structures, which are described in detail below. Also, the various applications, components, programs, objects, or modules may execute on one or more processors of other computers coupled to the autonomous vehicle 500 via a network 570, for example in a distributed, cloud-based, or client-server computing environment, whereby the processing required to carry out the functions of a computer program is allocated across multiple computers and / or services via the network.

[0060] The routines executed to embody the various embodiments described herein are referred to herein as "program code" whether embodied as part of an operating system or as part of a particular application, component, program, object, module, or instruction sequence, or a subset thereof. Program code generally includes one or more instructions resident in various memory and storage devices, which, when read and executed by one or more processors, perform the steps necessary to execute the steps or elements embodying the various aspects of the present disclosure. Also, while the embodiments are and will be described in the context of fully functional computers and systems, it will be understood that the various embodiments described herein can be distributed as program products in various forms, and can be embodied regardless of the particular type of computer readable medium used to actually effect the distribution. Examples of computer readable media include non-transitory media types such as volatile and non-volatile memory devices, floppy and other removable disks, solid state drives, hard disk drives, magnetic tape, and optical disks (e.g., CD-ROM, DVD).

[0061] Additionally, various program codes described below may be identified based on the application for which they are embodied in a particular embodiment. However, it should be understood that any particular program nomenclature below is used merely for convenience, and thus the present invention should not be limited to use only with any particular application identified and / or implied by such nomenclature. It should also be understood that the present disclosure is not limited to the particular organization and allocation of program functions described herein, given the generally infinite number of ways in which computer programs can be organized into routines, procedures, methods, modules, objects, etc., and the various ways in which program functions are allocated among the various software layers resident within a typical computer (e.g., operating system, libraries, APIs, applications, applets).

[0062] Those skilled in the art having the benefit of this disclosure will recognize that the exemplary environment illustrated in Figure 5c is not intended to limit the embodiments disclosed herein, and indeed, those skilled in the art will recognize that other alternative hardware and / or software environments may be used without departing from the scope of the embodiments disclosed herein.

[0063] In an embodiment of the present disclosure, visible light can be defined as having a wavelength range of about 380 nm to 700 nm. Invisible light can be defined as light having a wavelength outside the visible light range, such as ultraviolet light and infrared light. Infrared light having a wavelength range of about 700 nm to 1 mm includes near infrared light. In an embodiment of the present disclosure, near infrared light can be defined as having a wavelength range of about 700 nm to 1.6 μm.

[0064] In aspects of the present disclosure, the term "transparent" can be defined as having greater than 90% light transmittance. In some embodiments, the term "transparent" can be defined as a material that has greater than 90% transmittance of visible light.

[0065] As used herein, the term "processing logic" may include one or more processors, microprocessors, multi-core processors, application specific integrated circuits (ASICs), and / or field programmable gate arrays (FPGAs) for performing the operations disclosed herein. In some embodiments, memory (not shown) is integrated into the processing logic for storing instructions for performing operations and / or storing data. Additionally, the processing logic may include analog or digital circuitry for performing operations according to embodiments of the present disclosure.

[0066] A "memory" or "memories" as described herein may include one or more volatile or non-volatile memory architectures. A "memory" or "memories" may be removable and non-removable media embodied in any method or technology for storage of information, such as computer-readable instructions, data structures, program modules, or other data. Examples of memory technologies may include RAM, ROM, EEPROM, flash memory, CD-ROM, DVD, high definition multimedia / data storage disks or other optical storage devices, magnetic cassettes, magnetic tapes, magnetic disk storage devices, or other non-transmitting media that can be used to store information to enable access by a computing device.

[0067] The network includes any network or network system, such as, but not limited to, a peer-to-peer network, a local area network (LAN), a wide area network (WAN), a public network such as the Internet, a private network, a cellular network, a wireless network, a wired network, a combined wired and wireless network, and a satellite network.

[0068] The communication channel is IEEE802.11 protocol, SPI (Serial Peripheral Interface), I 2It may include or be routed by one or more wired or wireless communications using an Inter-Integrated Circuit (C), Universal Serial Port (USB), Controller Area Network (CAN), cellular data protocols (e.g., 3G, 4G, LTE, 5G), optical communications networks, Internet Service Providers (ISPs), peer-to-peer networks, LANs, WANs, public networks (e.g., the “Internet”), private networks, satellite networks, or others.

[0069] The computing devices may include desktop computers, laptop computers, tablets, phablets, smartphones, feature phones, server computers, etc. The server computers may be located remotely in a data center or stored locally.

[0070] The processes described above are described in terms of computer software and hardware. The techniques described may constitute machine-executable instructions embodied in a tangible or non-transitory machine (e.g., computer) readable storage medium that, when executed by a machine, causes the machine to perform the described operations. The processes may also be embodied in hardware, such as an application specific integrated circuit ("ASIC").

[0071] A tangible, non-transitory, machine-readable storage medium may include any mechanism for providing (e.g., storing) information in a form accessible by a machine (e.g., a computer, a network device, a PDA, a manufacturing tool, any device having one or more processor sets, etc.). For example, machine-readable storage media include recordable / non-recordable media (e.g., Read Only Memory (ROM), Random Access Memory (RAM), magnetic disk storage media, optical storage media, flash memory devices, etc.).

[0072] The foregoing description of illustrated embodiments of the disclosure, including what is described in the Abstract, is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Although specific embodiments and examples of the invention have been described herein for illustrative purposes, various modifications are possible within the scope of the invention, as those skilled in the relevant art will recognize.

[0073] Such modifications of the invention can be made in light of the above detailed description. The terms used in the following claims should not be construed to limit the invention to the specific embodiments disclosed in the specification. Rather, the scope of the invention is to be determined entirely by the following claims, which are to be construed in accordance with established doctrines of claim interpretation.

Claims

1. 1. A light detection and ranging (LIDAR) device, comprising: A substrate layer; a cladding layer disposed on the substrate layer; a waveguide configured to propagate light, at least a portion of the waveguide passing through the cladding layer; an ohmic element, at least a portion of the ohmic element passing through the cladding layer, the ohmic element arranged to transfer heat to the waveguide in response to a current supplied to the ohmic element; Including, 1. A LIDAR device, wherein the phase of the light propagating through the waveguide is modulated by the current supplied to the ohmic element.

2. 10. The LIDAR device of claim 1, wherein the waveguide is selectively heated and cooled based on an amount of the heat transferred from the ohmic element to the waveguide.

3. 10. The LIDAR device of claim 1, wherein an infrared transmit beam is configured to propagate through the waveguide to an environment external to the LIDAR device.

4. 10. The LIDAR device of claim 1, further comprising a heating module coupled to the ohmic element, the heating module configured to drive the current supplied to the ohmic element.

5. 5. The LIDAR device of claim 4, wherein the heat generating module is coupled to a first portion of the ohmic element and a second portion of the ohmic element opposite the first portion of the ohmic element.

6. The LIDAR device of claim 4 , wherein the heat generating module includes one or more transistors.

7. 10. The LIDAR device of claim 1, wherein the light propagating through the waveguide is infrared.

8. 10. The LIDAR device of claim 1, wherein the substrate layer includes an opening disposed relative to the waveguide to aid in temperature control of the waveguide.

9. 10. The LIDAR device of claim 8, further comprising a filler material disposed in the opening, the thermal conductivity of the filler material being selected to adjust a heat dissipation rate of the waveguide.

10. 10. The LIDAR device of claim 9, wherein the opening is at least partially filled with a filler material having a thermal conductivity between 0.025 W / mK and 500 W / mK.

11. 10. The LIDAR device of claim 9, wherein the opening is at least partially filled with a filler material having a thermal conductivity between 0.1 W / mK and 20 W / mK.

12. 9. The LIDAR device of claim 8, wherein the waveguide is disposed between the ohmic element and the opening, and a portion of the cladding layer is disposed between the waveguide and the ohmic element.

13. 1. An autonomous vehicle control system for an autonomous vehicle, the autonomous vehicle control system comprising: A light detection and ranging (LIDAR) device; one or more processors; Including, The LIDAR device is A substrate layer; a cladding layer disposed on the substrate layer; a waveguide configured to propagate an infrared transmit beam to an environment external to the autonomous vehicle, at least a portion of the waveguide passing through the cladding layer; an ohmic element, at least a portion of the ohmic element passing through the cladding layer, the ohmic element arranged to transfer heat to the waveguide in response to a current supplied to the ohmic element; Including, a phase of the infrared transmit beam propagating through the waveguide is modulated by the current supplied to the ohmic element; The one or more processors are configured to control the autonomous vehicle in response to an infrared return beam that is a reflection of the infrared transmit beam.

14. 14. The autonomous vehicle control system of claim 13, wherein the LIDAR device includes a heating module coupled to a first portion of the ohmic element and a second portion of the ohmic element opposite the first portion of the ohmic element, the heating module configured to drive a current provided to the ohmic element.

15. The autonomous vehicle control system of claim 14 , wherein the heat generating module includes one or more transistors.

16. The autonomous vehicle control system of claim 13 , wherein the substrate layer includes an opening disposed relative to the waveguide to assist in temperature control of the waveguide.

17. 17. The autonomous vehicle control system of claim 16, further comprising a filler material disposed in the opening, the thermal conductivity of the filler material being selected to adjust a heat dissipation rate of the waveguide.

18. 1. An autonomous vehicle, comprising: A light detection and ranging (LIDAR) sensor; and A control system; Including, The LIDAR sensor includes: A substrate layer; a cladding layer disposed on the substrate layer; a waveguide configured to propagate an infrared transmit beam to an environment external to the autonomous vehicle, at least a portion of the waveguide passing through the cladding layer; an ohmic element, at least a portion of the ohmic element passing through the cladding layer, the ohmic element arranged to transfer heat to the waveguide in response to a current supplied to the ohmic element; Including, a phase of the infrared transmit beam propagating through the waveguide is modulated by the current supplied to the ohmic element; The autonomous vehicle, wherein the control system is configured to control the autonomous vehicle in response to an infrared return beam that is a reflection of the infrared transmit beam.

19. 20. The autonomous vehicle of claim 18, wherein the LIDAR sensor includes a heating module coupled to a first portion of the ohmic element and a second portion of the ohmic element opposite the first portion of the ohmic element, the heating module configured to drive a current provided to the ohmic element.

20. the substrate layer includes an opening positioned relative to the waveguide to assist in temperature control of the waveguide; 20. The autonomous vehicle of claim 18, wherein the LIDAR sensor further includes a filler material disposed in the opening, the thermal conductivity of the filler material being selected to tune a heat dissipation rate of the waveguide.

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