NON-CONTACT DEPOSITION SYSTEM INCLUDING INJECTION ASSEMBLY - Patent application

Abstract

The non-contact deposition system includes a jetting assembly including at least one microvalve. The microvalve includes an orifice plate defining an orifice therethrough. An actuation beam is spaced apart from the orifice plate. The actuation beam includes a base portion and a cantilever portion extending from the base portion toward the orifice and is movable between a closed position and an open position. A seal structure including a seal member is disposed at an overlapping portion of the cantilever portion. A fluid manifold is coupled to the microvalve and defines a fluid reservoir containing pressurized fluid. When the actuation beam is in the closed position, the cantilever portion is positioned such that the seal structure closes the microvalve to seal the orifice, and when in the open position, fluid is dispensed from the orifice toward a substrate for deposition on the substrate.

Description

[Technical field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority to U.S. Provisional Application No. 62 / 929,271, filed November 1, 2019, the contents of which are incorporated herein by reference in their entirety.

[0002] The present disclosure relates generally to the field of microvalves fabricated using microelectromechanical systems (MEMS) technology. More specifically, the present disclosure relates to a non-contact deposition system that includes a jetting assembly that includes a MEMS microvalve. [Background technology]

[0003] Conventional dispensing and deposition systems have several drawbacks. For example, in biological or biomedical applications, solutions containing chemical, biochemical or biological molecules are typically manually deposited onto a substrate using a pipette. Automated systems have been developed that can simultaneously pipette multiple solutions onto a substrate. However, such systems generally still use a pipette tip, the opening of which remains exposed to air even when solutions are not being deposited through said pipette tip. Other deposition systems, such as microarray printing assemblies, contact the substrate and deposit the fluid using the surface tension of the fluid. Such deposition assemblies are subject to imprecise droplet size and volume, and require solvent evaporation in a controlled environment to prevent evaporation.

[0004] Similar shortcomings exist in deposition systems used for printing or marking. For example, continuous inkjet printers have certain deficiencies that are difficult to overcome. For example, the process of generating droplets from an ink supply can lead to ink dripping in undesirable directions (e.g., away from the target), which can lead to maintenance requirements. In addition, the supply is lost over time as a result of evaporation, necessitating continual replenishment. Other maintenance costs are also required, such as repair of orifice plates due to deterioration. Moreover, the orifices or openings through which the fluid is ejected are typically left open to air, which can cause evaporation of solvent from the fluid, resulting in clogging and eventual failure of conventional deposition systems. The prior art documents relevant to the invention of this application are as follows (including documents cited during the international phase after the international filing date and documents cited when the application entered the national phase in other countries). (Prior art document) (Patent Documents) (Patent Document 1) U.S. Patent Application Publication No. 2011 / 0073188 (Patent Document 2) U.S. Patent Application Publication No. 2018 / 0056288 (Patent Document 3) U.S. Patent Application Publication No. 2003 / 0076649 (Patent Document 4) U.S. Patent Application Publication No. 2016 / 0189494 Summary of the Invention [Problem to be solved by the invention]

[0005] Finally, when the fluid being dispensed is a gas, such as air, conventional deposition systems or valves capable of controlling the dispensing of the gas are physically large and heavy, require excessive electrical energy, and are subject to failure due to mechanical problems of the various components contained therein. For these and other reasons, improved dispensing and deposition systems are needed. [Means for solving the problem]

[0006] The embodiments described herein relate generally to non-contact deposition systems, and more particularly to systems that include a jetting assembly that includes a microvalve with an orifice defined by an orifice plate and an actuation beam that remains in a default closed position to seal the orifice and is selectively opened to jet and deposit fluid onto a substrate.

[0007] In some embodiments, a non-contact deposition system has an ejection assembly including at least one microvalve. Each microvalve has an orifice plate including a first surface and a second surface. The orifice plate includes an orifice extending from the first surface to the second surface. A spacing member is disposed on the first surface and offset from the orifice. A valve seat surrounds the orifice and defines an opening in fluid communication with the orifice. An actuation beam is disposed on the spacing member and extends from the spacing member toward the orifice. The actuation beam includes a layer of piezoelectric material and is movable between a closed position and an open position by application of an electrical signal to the layer of piezoelectric material. A seal member is disposed on an end of the actuation beam. A fluid manifold is coupled to the microvalve and defines a fluid reservoir containing pressurized fluid around the actuation beam. When no electrical signal is applied to the layer of piezoelectric material, the actuation beam is in a closed position and a seal member surface of the seal member contacts the orifice plate to seal the orifice and close the microvalve. Additionally, in the open position, fluid is ejected from the orifice towards the substrate and deposited thereon.

[0008] In another embodiment, the non-contact deposition system further includes a platform spaced from the jetting assemblies and configured to receive a substrate onto which a fluid is to be deposited, and a motion mechanism coupled to at least one of the jetting assemblies or the platform and configured to provide three-dimensional motion to the jetting assemblies or platform to deposit a fluid at a predetermined location on the substrate.

[0009] In another embodiment, the substrate comprises a histopathology cassette and the fluid comprises a cell stain.

[0010] In another embodiment, the substrate comprises a circuit board and the fluid comprises a conductive fluid, a semiconductive fluid, or a piezoelectric fluid.

[0011] In another embodiment, the substrate comprises a fabric, a ceramic tile, an engineered wood or a laminate tile, and the fluid comprises at least one of a conductive ink, a paint, a nanocoating, or an antimicrobial coating.

[0012] In another embodiment, the substrate comprises a slide, the fluid comprises a solution of at least one of a chemical, a biochemical, or a biomolecule, and the non-contact deposition system is configured to deposit an array of droplets of the solution onto the slide.

[0013] In another embodiment, the substrate comprises a microwell plate defining a plurality of microwells, the fluid comprises a solution of at least one of a chemical, a biochemical, or a biomolecule, and the non-contact deposition system is configured to deposit a quantity of the solution into each of the plurality of microwells. In another embodiment, the fluid includes a polymer, and the non-contact deposition system is configured to deposit multiple layers of the polymer to form a three-dimensional object having a predetermined shape.

[0014] In another embodiment, the fluid includes a polymer, and the non-contact deposition system is configured to deposit multiple layers of the polymer to form a three-dimensional object having a predetermined shape.

[0015] In another embodiment, the non-contact deposition system further includes an interposer disposed on and coupled to the fluid manifold, and a carrier disposed on and coupled to the interposer, such that the orifice plate, the fluid manifold, the interposer and the carrier collectively define a boundary of a fluid reservoir, and the carrier further defines a first fluid channel configured to deliver a first fluid to the fluid reservoir.

[0016] In another embodiment, the carrier further includes a second fluid channel configured to deliver a second fluid, different from the first fluid, to the fluid reservoir.

[0017] In another embodiment, the ejection assembly is configured to selectively deliver a first fluid, a second fluid, or a mixture including the first and second fluids through the orifice, where the mixture is formed in the fluid reservoir.

[0018] In another embodiment, the substrate comprises an artificial or natural fingernail, the first fluid comprises a first nail color, and the second fluid comprises a second nail color.

[0019] In another embodiment, the substrate comprises a mixing palette, and the first fluid and the second fluid comprise at least one of a powder, a liquid, or a gel.

[0020] In another embodiment, the carrier defines an interior volume and a compressible fluid container containing a fluid is disposed within the interior volume.

[0021] In another embodiment, the interior volume of the carrier is filled with a compressed gas configured to exert a pressure on the compressible fluid container, which pressure causes fluid to be transferred through the fluid channel to the fluid reservoir.

[0022] In another embodiment, a biasing member is disposed within the interior volume, the biasing member configured to apply pressure to the compressible fluid container, the pressure causing fluid to be transferred through the fluid channel to the fluid reservoir.

[0023] In another embodiment, the fluid comprises one of an ink, a paint, a solvent, a biological solution, a biochemical solution, a chemical solution, a physiological fluid, an adhesive, a powder, a gel, a dye, a cell stain, a colloidal solution, an emulsion, or a suspension.

[0024] In another embodiment, the fluid comprises a volatile or air sensitive fluid and the jetting assembly is configured to limit exposure of the fluid to air present in an environment external to the jetting assembly.

[0025] In another embodiment, the array of orifices is defined in an orifice plate.

[0026] In another embodiment, the array comprises a rectangular array, a square array, a semicircular array, an elliptical array, a polygonal array, or an asymmetric array.

[0027] In another embodiment, the actuation beam includes an actuation portion including a non-active portion, an adjustment layer, and at least one layer of piezoelectric material, where the adjustment layer has a predetermined adjustment stress when in the closed position that causes the seal member to contact and exert a force on the valve seat to fluidly seal the orifice.

[0028] In another embodiment, the fluid is a gaseous fluid.

[0029] In another embodiment, there is provided a haptic interface device including the non-contact deposition system of any of the embodiments previously described herein.

[0030] In some embodiments, a non-contact deposition system includes a jetting assembly including at least one microvalve. The at least one microvalve includes an orifice plate including a first surface and a second surface. The orifice plate includes an orifice extending from the first surface to the second surface. An actuation beam is spaced apart relative to the orifice plate. The actuation beam includes a base portion and a cantilever portion. The cantilever portion extends from the base portion toward the orifice, with an overlapping portion overlapping the orifice. The actuation beam is movable between a closed position and an open position. A seal structure is disposed at the overlapping portion of the cantilever portion, the seal structure comprising a seal member. A fluid manifold is coupled to the microvalve and defines a fluid reservoir containing pressurized fluid around the actuation beam. When the actuation beam is in the closed position, the cantilever portion is disposed to seal the orifice such that the seal structure closes the microvalve. In the open position, fluid is dispensed from the orifice toward and deposited on a substrate.

[0031] In another embodiment, the actuation beam includes a layer of piezoelectric material, the actuation beam being movable between a closed position and an open position in response to an electrical signal applied to the piezoelectric material.

[0032] In another embodiment, no electrical signal is applied to the piezoelectric material when the microvalve is in the closed position.

[0033] In another embodiment, a non-contact deposition system has a platform spaced from the jetting assemblies and configured to receive a substrate, and a motion mechanism coupled to at least one of the jetting assemblies or the platform and configured to provide three-dimensional motion to the jetting assembly or platform to deposit a fluid at a predetermined location on the substrate.

[0034] In another embodiment, the substrate comprises a histopathology cassette and the fluid comprises a cell stain.

[0035] In another embodiment, the substrate comprises a circuit board and the fluid comprises a conductive fluid, a semiconductive fluid, or a piezoelectric fluid.

[0036] In another embodiment, the substrate comprises a fabric, a ceramic tile, an engineered wood or a laminate tile, and the fluid comprises at least one of a conductive ink, a paint, a nanocoating, or an antimicrobial coating.

[0037] In another embodiment, the substrate includes a slide, the fluid includes at least one solution of a chemical or a biomolecule, and the non-contact deposition system is configured to deposit an array of droplets of the solution onto the slide.

[0038] In another embodiment, the substrate includes a microwell plate defining a plurality of microwells, the fluid has a solution of at least one of a chemical, a biochemical, or a biomolecule, and the non-contact deposition system is configured to deposit a volume of the solution into each of the plurality of microwells.

[0039] In another embodiment, the fluid includes a polymer, and the non-contact deposition system is configured to deposit multiple layers of the polymer to form a three-dimensional object having a predetermined shape.

[0040] In another embodiment, a non-contact deposition system has an interposer disposed on and coupled to a fluid manifold, and a carrier disposed on and coupled to the interposer such that the orifice plate, the fluid manifold, the interposer and the carrier collectively define a boundary of a fluid reservoir, the carrier further defining a first fluid channel configured to deliver a first fluid to the fluid reservoir.

[0041] In another embodiment, the carrier further includes a second fluid channel configured to deliver a second fluid, different from the first fluid, to the fluid reservoir.

[0042] In another embodiment, the ejection assembly is configured to selectively deliver a first fluid, a second fluid, or a mixture including the first and second fluids through the orifice, where the mixture is formed in the fluid reservoir.

[0043] In another embodiment, the substrate comprises an artificial or actual fingernail, the first fluid having a first nail color and the second fluid having a second nail color.

[0044] In another embodiment, the substrate comprises a mixing palette, and the first fluid and the second fluid comprise at least one of a powder, a liquid, or a gel.

[0045] In another embodiment, the carrier defines an interior volume and the compressible fluid container includes a fluid disposed within the interior volume.

[0046] In another embodiment, the interior volume of the carrier is filled with a compressed gas configured to exert a pressure on the compressible fluid container, which pressure causes fluid to be transferred through the fluid channel to the fluid reservoir.

[0047] In another embodiment, a biasing member is disposed within the interior volume, the biasing member configured to apply pressure to the compressible fluid container, which pressure causes fluid to be transferred through the fluid channel to the fluid reservoir.

[0048] In another embodiment, the fluid comprises one of an ink, a paint, a solvent, a biological solution, a biochemical solution, a chemical solution, a physiological fluid, an adhesive, a powder, a gel, a dye, a cell stain, a colloidal solution, an emulsion, or a suspension.

[0049] In another embodiment, the fluid comprises a volatile or air sensitive fluid and the jetting assembly is configured to limit exposure of the fluid to air present in an environment external to the jetting assembly.

[0050] In another embodiment, the array of orifices is defined in an orifice plate.

[0051] In another embodiment, the array comprises a rectangular array, a square array, a circular array, a semicircular array, an elliptical array, a polygonal array, or an asymmetric array.

[0052] In another embodiment, the actuation beam includes an actuation portion including a non-active portion, an adjustment layer, and at least one layer of piezoelectric material, where the adjustment layer has a predetermined adjustment stress when in the closed position that causes the seal member to contact and exert a force on the valve seat to fluidly seal the orifice.

[0053] In another embodiment, the microvalve further includes a valve seat surrounding the orifice, the valve seat defining an opening in fluid communication with the orifice.

[0054] In another embodiment, the fluid is a gaseous fluid.

[0055] In another embodiment, the haptic interface device includes a non-contact deposition system of any of the embodiments already described hereinabove.

[0056] It is to be understood that all combinations of the foregoing and additional concepts described in more detail below (provided such concepts are not mutually inconsistent) are considered to be part of the inventive subject matter disclosed herein, in particular all combinations of claimed subject matter described at the end of this disclosure are considered to be part of the inventive subject matter disclosed herein. [Brief description of the drawings]

[0057] The foregoing and other features of the present disclosure will become more fully apparent from the following description and appended claims, taken in conjunction with the accompanying drawings, in which: The present disclosure will be described with additional specificity and detail through the use of the accompanying drawings, with the understanding that these drawings illustrate only some implementations according to the present disclosure and therefore should not be considered as limiting its scope. [Figure 1]FIG. 1 is a perspective view of a jetting assembly disposed within a holder according to an exemplary embodiment. [Diagram 2] FIG. 2 is an exploded view of the injection assembly shown in FIG. [Diagram 3] FIG. 3 is a schematic cross-sectional view of the injection assembly shown in FIG. [Figure 4A] FIG. 4 is a top view of the injection assembly shown in FIG. [Figure 4B] FIG. 4 is a top view of the injection assembly shown in FIG. [Figure 5A] FIG. 5A is a cross-sectional view of a jetting assembly including a microvalve, according to an exemplary embodiment. [Figure 5B] FIG. 5B is a cross-sectional view of a jetting assembly including a microvalve according to another exemplary embodiment. [Figure 6] FIG. 6 is a cross-sectional view providing a more detailed view of the injection assembly shown in FIG. [Figure 7A] FIG. 7A is a cross-sectional view of an actuation beam of a microvalve, according to an example embodiment. [Figure 7B] FIG. 7B is a cross-sectional front view of the actuation beam of FIG. 7A according to another exemplary embodiment. [Figure 8] FIG. 8 is a schematic diagram of a non-contact deposition system, according to one embodiment. [Figure 9-14] 9-14 are schematic diagrams of substrates and fluids deposited on the substrate by the system of FIG. 8 in various embodiments. [Figure 15] FIG. 15 is a schematic diagram of a jetting assembly that can be used in one embodiment with the non-contact deposition system of FIG. [Figure 16] 16-18 are schematic diagrams of jetting assemblies that can be used in the non-contact deposition system of FIG. 8 in various embodiments. [Figure 17] 16-18 are schematic diagrams of jetting assemblies that can be used in the non-contact deposition system of FIG. 8 in various embodiments. [Figure 18]16-18 are schematic diagrams of jetting assemblies that can be used in the non-contact deposition system of FIG. 8 in various embodiments. [Figure 19-23] 19-23 are schematic diagrams of orifice plates defining an array of different shaped orifices therethrough in various embodiments. [Figure 24] FIG. 24 is a schematic diagram of the non-contact deposition system of FIG. 8 for depositing fluid onto a microwell plate, according to one embodiment.

[0058] In the drawings, like reference numerals typically identify like components unless the context dictates otherwise. The exemplary implementations described in the detailed description, drawings, and claims are not meant to be limiting. Other implementations may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein. It will be readily understood that the aspects of the disclosure as described herein and illustrated in the figures can be arranged, substituted, combined, and designed in a variety of different configurations, all of which are contemplated and made as part of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0059] SUMMARY OF THE DISCLOSURE The embodiments described herein relate generally to non-contact deposition systems, and in particular to systems that include a jetting assembly that includes a microvalve with an orifice defined in an orifice plate and an actuation beam that remains in a default closed position to seal the orifice and is selectively opened to eject and deposit fluid onto a substrate.

[0060] Before proceeding to the description of the figures showing the exemplary embodiments in detail, it should be understood that the present application is not limited to the details or methodology set forth in the detailed description or illustrated in the figures, and it should also be understood that the terminology used is for purposes of description only and should not be regarded as limiting.

[0061] Generally with reference to the figures, described herein is a jetting assembly including a plurality of microvalves, and a non-contact deposition system including such jetting assembly. The microvalves described herein use an actuation beam having a sealing member disposed thereon. The utilization of such an actuation beam allows the microvalve to be tuned to eliminate or reduce various defects associated with conventional techniques including continuous jetting assemblies. For example, in various embodiments, the microvalve includes a spacing member disposed between the actuation beam and an orifice plate. The spacing member maintains a spacing between a first end of the actuation beam and an orifice in the orifice plate to prevent damping of the squeeze film of the actuation beam. The actuation beam extends from the spacing member onto the orifice, and the sealing member extends toward the orifice to either directly contact the orifice or to contact a valve seat that may be disposed around or at the edge of the orifice. Thus, without application of electrical energy to the actuation beam, the sealing member seals the orifice. In other words, the default position of the actuation beam (e.g., configured by careful selection of materials included therein) is that the microvalve is closed. As such, fluids placed into the microvalve (e.g., inks, paints, solvents, biological solutions, biochemical solutions, chemical solutions, physiological fluids (e.g., blood, urine, saliva, plasma, cerebrospinal fluid), adhesives, powders, gels, dyes, cell stains, colloidal solutions, emulsions or suspensions, etc.) placed within the microvalve are sealed from the external environment of the jetting assembly. This eliminates evaporation of the liquid and reduces clogging. Additionally, limited evaporation allows for the use of faster drying fluids, allowing for faster deposition than conventional systems.

[0062] To ensure proper sealing of the microvalves described herein, a compatible relationship is maintained between the sealing member disposed on the actuation beam and the valve seat. Maintaining such a relationship requires adjustment of several factors related to the structure of the jetting assembly. In one aspect, measures are taken to ensure proper dimensions of the various components of the microvalve. For example, in some embodiments, the spacing members and sealing members described herein are formed in a single manufacturing step (e.g., by etching a portion of a wafer to form the spacing members and sealing members in a single etching step) to ensure that they have the same thickness. Constructing these components in such a manner allows for precise control of the placement of components attached to the actuation beam, such as the dimensions of the sealing members and the length of the actuation beam. This allows the sealing members to be precisely aligned with the valve seat, ensuring that a proper seal is formed between the valve seat and the sealing members or between the orifice plate and the sealing members. Additionally, fabricating the sealing members and spacing members in such a manner allows these structures to share a common thickness, which facilitates proper spacing between the actuation beam and the orifice plate. The fluid manifold is coupled to the microvalve and defines a fluid reservoir around the microvalve to enable deposition of fluid onto the substrate when the actuation beam is in an open position.

[0063] Thus, multiple components of the jetting assemblies described herein are constructed with a seal in mind established at the interface between the seal member and the orifice and / or valve seat. A proper seal helps prevent fluid from leaking at the orifice, which occurs in conventional continuous jetting assemblies. Beneficially, the microvalves used herein can be tuned to provide a desired droplet size. For example, in one embodiment, the orifice of the orifice plate is approximately 60 microns in diameter. In certain embodiments, the orifice plate can have a thickness in the range of 60-900 microns (e.g., 350 microns). In some embodiments, the orifice diameter to length ratio can range from 1:1 to 15:1. An electrical signal can be applied to the actuation beam, which, through at least one layer of piezoelectric material contained therein, temporarily moves the actuation beam away from the valve seat to create a fluid outlet at the valve seat and orifice for a predetermined period of time (e.g., based on a desired droplet frequency). Thus, based on the orifice volume and the droplet frequency, a volume of fluid is released from the orifice to form droplets that are disposed on the substrate to create a desired marking, pattern, solution, or object. In various embodiments, when the droplet frequency is configured for about 10 kHz, the microvalves used herein can generate droplets having a volume of about 600 pL, which is larger than those generated by conventional deposition systems, which typically only generate droplets with a volume of about 30 pL. As a result of this larger droplet size, the jetting assemblies described herein can utilize a greater throw, thereby enabling the formation of images on a desired object at a greater distance than conventional systems.

[0064] Various embodiments of the non-contact deposition system including the jetting assembly described herein provide advantages including, for example: (1) preventing evaporation of fluid by keeping the microvalve closed in a default position while fluid deposition is not occurring; (2) reducing power consumption by using power only to open the microvalve; (3) enabling precise deposition of volumes of liquid ranging from 500 picoliters (pL) to 5 milliliters (mL) or more; (4) enabling deposition of a variety of fluids including, but not limited to, inks, conductive inks, paints, dyes, cell stains, polymers, adhesives, suspensions, emulsions, nanocoatings, antimicrobial coatings, powders, biological solutions, biochemical solutions, chemical solutions, and the like; (5) enabling deposition of multiple fluids from a single microvalve; (6) integrating pumping functionality such that an external pump or compression system for providing pressurized fluid to the jetting assembly can be eliminated; and (7) enabling deposition of fluid in a variety of patterns by enabling motility capabilities and / or by providing orifices defined by an orifice plate in a predetermined pattern.

[0065] As described herein, the term "default position," when used in describing an actuation beam of a microvalve, refers to a position of the actuation beam relative to various other components of the microvalve without application of a control signal (e.g., a charge, current, or voltage to the actuation beam). In other words, the default position is the position of the actuation beam (and components connected to it) when the actuation beam is in a passive state.

[0066] 1, a perspective view of a jetting assembly 100 disposed within a holder 150 is shown according to an exemplary embodiment. The jetting assembly 100 includes a valve body 102 mounted to a carrier 108. The holder 150 includes a substantially circular body including an opening adapted to receive the jetting assembly 100. The body of the holder 150 includes a notch 118 extending from its periphery, which facilitates mounting of the holder 150 to a marking device. The valve body 102 may be a component of the marking device. In an exemplary embodiment, the valve body 102 is used in a non-contact deposition system including a pressurized fluid supply.

[0067] As described herein, the valve body 102 includes an input fluid manifold attached to a plurality of microvalves. The microvalves and the input fluid manifold form a fluid plenum or reservoir configured to hold fluid received from an external fluid supply. In other embodiments, the valve body 102 can define a plurality of fluid plenums, each fluid plenum corresponding to at least a portion of the plurality of microvalves. In such embodiments, each fluid plenum may be filled with a different colored fluid (e.g., different colored inks or different fluids, such as black, green, yellow, cyan, etc.) to provide the ability to deposit multiple fluids. In various embodiments, the microvalve includes an actuation beam configured to move in response to a voltage applied thereto to temporarily open a fluid outlet at an orifice of the orifice plate. As a result, droplets are ejected from the fluid outlet onto a target to generate a desired marking pattern on the target.

[0068] As shown, the circuit board 104 is mounted to the side of the carrier 108. The circuit board 104 can include multiple electrical paths and provide a connection point between the valve body 102 and an electrical controller (e.g., via a wiring harness). The electrical controller can provide control signals via the electrical paths to control the actuation of actuation beams of multiple microvalves contained in the valve body 102. The structure and function of such microvalves are described in more detail herein. In some embodiments, the circuit board 104 itself includes a microcontroller that generates and provides the control signals to actuate the microvalves.

[0069] An identification tag 106 is attached to the jetting assembly 100. In some embodiments, the identification tag 106 includes an internal memory configured to store various forms of information regarding the jetting assembly 100 (e.g., manufacturing information, serial numbers, valve calibration information, settings, etc.). For example, in one embodiment, the identification tag 106 is a radio frequency identification (RFID) tag configured to receptively transmit stored information in response to receiving a predetermined identifier from an external device. In this manner, information regarding the jetting assembly 100 can be obtained quickly and efficiently.

[0070] Referring to FIG. 2, an exploded view of the jetting assembly 100 is shown, according to an exemplary embodiment. The carrier 108 includes a front surface 110, a rear surface 112, and a side surface 124. In various embodiments, the valve body 102 is attached to the front surface 110 via an adhesive. The rear surface 112 has a cover 116 disposed thereon. The cover 116 includes openings 120 that provide supply ports for fluid (e.g., ink) for deposition on a target through the valve body 102. For example, in some embodiments, the fluid (e.g., ink) is supplied to the valve body 102 through a first opening (e.g., via an input supply line or hose), circulated through the valve body 102, and output from the valve body 102 through a second one of the openings 120. In other words, the fluid is recirculated through the fluid plenum. A septum may be disposed in each of the openings 120 and configured to allow for insertion of a fluid delivery or fluid return pin to allow fluid communication to the fluid plenum while maintaining a fluid seal of the jetting assembly 100. In some embodiments, a heating element (e.g., a resistive wire) may be disposed proximate to (e.g., around or coupled to a sidewall of) the valve body 102 or carrier 108. The heating element can be used to selectively heat a fluid (e.g., ink) contained within the fluid plenum to maintain the fluid at a desired temperature.

[0071] The front face 110 includes a cavity adapted to receive the valve body 102 such that the valve body 102 is securely attached (e.g., via an adhesive) to the front face 110. The circuit board 104 is attached to the carrier 108 via the side 124. As shown, the side 124 includes mounting pegs 126. In various embodiments, the circuit board 104 includes openings arranged in a manner corresponding to the arrangement of the mounting pegs 126 and adapted to receive the mounting pegs 126 to align the circuit board 104 to the carrier 108.

[0072] As shown, the circuit board 104 has a flex circuit 114 attached thereto. The flex circuit 114 extends at an angle from the circuit board 104 and is attached to the carrier 108 proximate the front surface 110. The valve body 102 and the circuit board 104 are disposed perpendicular to one another, with the flex circuit 114 extending around a corner boundary of the front surface 110. The circuit board 104 also includes a controller interface 122 that includes electrical connection members (e.g., pins) configured to receive control signals, for example, from a deposition system controller.

[0073] As described herein, in various embodiments, the flex circuit 114 is disposed between the fluid manifold and the carrier 108 or between the carrier 108 and the valve body 102 to facilitate the formation of electrical connections between the flex circuit 114 and electrodes of the multiple microvalves contained in the valve body 102. In some embodiments, the flex circuit 114 is attached to the front surface 110 via a mounting member 148. An opening in the flex circuit 114 is aligned with a bulkhead of the carrier 108 to provide a fluid inlet to a fluid plenum formed through the valve body 102.

[0074] Referring to Figure 3, a schematic diagram of various components of the injector assembly 100 is shown, according to an exemplary embodiment. For example, Figure 3 may show a cross-sectional view of the injector assembly 100 at line II shown in Figure 1. As shown, the valve body 102 extends from the front surface 110 of the carrier 108 via an interposer 170. The interposer 170 provides structural support to ensure maximum performance of the various components within the valve body 102.

[0075] The valve body 102 includes an input fluid manifold 162 and a number of microvalves 164 attached to the input fluid manifold 162. The microvalves 164 and the input manifold 162 form a fluid plenum 166 for fluid (e.g., a combination of ink and make-up fluid) received from a pressurized fluid supply (e.g., via an opening 120 in a cover 116 attached to the back surface 112). In various embodiments, the fluid supply includes a fluid reservoir and a pump configured to supply pressurized fluid to the jetting assembly 100 via a supply line coupled to the carrier 108. In various embodiments, the fluid supply provides pressurized fluid between 7 and 15 PSI when one or more microvalves 164 are open. For example, in one embodiment, the fluid has a pressure of about 10 PSI when one or more microvalves are open. The carrier 108 can include an internal cavity configured to receive the pressurized fluid and deliver the fluid to the fluid plenum 166. In various embodiments, a pressure differential can be maintained between the fluid plenum and the fluid supply to expel fluid from the valve body 102. Pressure sensors are provided in the valve body 102 and / or the carrier 108 to determine the pressure differential and / or pumping pressure of the fluid pumped through the valve body 102 .

[0076] The input fluid manifold 162 may include a glass structure that includes channels that form a fluid plenum. In general, the microvalve 164 includes an actuation beam held in spaced relation to an orifice on an orifice plate on the front surface 110 from which the fluid is emitted. The actuation beam may include at least one layer of piezoelectric material configured to deflect in response to receiving a control signal (e.g., a voltage waveform provided via the controller interface 122 on the circuit board 104). As described herein, application of such an electrical signal opens the microvalve 164, which causes droplets to be ejected at the orifice plate. The droplets advance a throw distance 192 onto the substrate 190, generating a desired pattern on the substrate 190. The structure and function of the various components of the microvalve 164 are described in more detail herein. In other embodiments, the actuation beam may include a stainless steel actuation beam (e.g., having a length of about 1 mm). In yet other embodiments, the actuation beam may include a bimorph beam having two layers of piezoelectric material disposed on either side of a base layer (e.g., a base silicon layer or a stainless steel layer). An electrical signal (e.g., a voltage) can be applied to either of the piezoelectric layers to induce the actuation beam to bend toward the corresponding piezoelectric layer. The two piezoelectric layers may comprise the same piezoelectric material or different piezoelectric materials. In certain embodiments, a different electrical signal can be applied to each of the piezoelectric layers to bend or curve the actuation beam a predetermined distance toward the orifice. Although the embodiments described herein generally describe the actuation beam as comprising a piezoelectric material, in other embodiments, any other actuation mechanism can be used. For example, in some embodiments, the actuation beam can include a capacitive coupling to move the actuation beam. In still other embodiments, the actuation beam can include a magnetic coupling (e.g., an electromagnetic structure activated by an electromagnet) to move the beam. In still other embodiments, the actuation beam can include a magnetic coupling (e.g., an electromagnetic structure activated by an electromagnet) to move the beam. In still other embodiments, the actuation beam can include a temperature sensitive bimetal plate configured to move in response to a temperature change.

[0077] The interposer 170 generally adds stiffness to various portions of the valve body 102. For example, the interposer 170 can be configured to be stiffer than the components of the valve body 102 (e.g., orifice plate, actuation beam, etc.), thereby countering stresses caused by connecting such components to one another. For example, the interposer 170 can be attached to the valve body 102 to counteract stresses induced by adhesives used to attach the carrier 108 to the valve body 102. Additionally, the interposer 170 can counteract stresses at the interface between the input fluid manifold 162 and the microvalve 164.

[0078] Referring to FIG. 4, a plan view of the jetting assembly 100 is shown, according to an exemplary embodiment. FIG. 4 shows a plan view of the valve body 102 at line II-II shown in FIG. 2. As such, FIG. 4 shows a plan view at the interface between the input fluid manifold 162 and the orifice plate. The input fluid manifold 162 includes a first opening 172 and a second opening 174. The first opening 172 exposes the plurality of microvalves 164 to form a fluid plenum 166 configured to hold fluid received from a fluid supply. In the illustrated example, the plurality of microvalves 164 includes a plurality of actuation beams 176 aligned in a single row. Each of the plurality of actuation beams 176 has a seal member 178 disposed at an end thereof. In some embodiments, the seal member 178 aligns with and contacts a valve seat disposed at an orifice of the orifice plate to prevent fluid contained in the fluid plenum 166 from escaping the fluid plenum 166 in the absence of an electrical signal. The jet assembly 100 is shown to include 52 actuation beams 176 that form 52 microvalves 164. In other embodiments, the jet assembly 100 may include any number of actuation beams.

[0079] In various embodiments, each of the plurality of actuation beams 176 extends from a member disposed below the boundary between the first and second openings 172 and 174. Each of the members may include an electrical connection portion exposed through the second opening 174. An electrical contact pad 180 is disposed on each of the electrical connections. Wire bonds electrically connect each electrical connection portion to the controller interface 122 through the electrical contact pad 180. Thus, electrical signals may be received by each of the actuation beams 176 through the electrical contact pad 180. In some embodiments, tape automated bonding (TAB) may be used to electrically connect each of the electrical connection portions to the controller interface.

[0080] The boundary between the first and second openings 172 and 174 isolates the electrical contact pads 180 from the fluid contained in the reservoir formed by the fluid openings 172. Also, advantageously, the electrical contact pads 180 are disposed below the input fluid manifold 162. The electrical connections between the actuation beams 176 are disposed internal to the carrier 108 and are protected from degradation and external contamination.

[0081] An adhesive structure 182 is disposed on the input fluid manifold 162 to isolate the electrical contact pads 180 from the fluid contained in the fluid plenum 166. The adhesive structure 182 bonds the input fluid manifold 162 to the orifice plate. As shown in FIG. 4, the adhesive structure 182 forms a "racetrack" around each of the first and second openings 172 and 174. The racetrack provides a barrier for fluids penetrating between the input fluid manifold 162 and the orifice plate. For example, the racetrack may be constructed by several concentric rectangular loops of adhesive (e.g., a bisphenol A novalac glycidyl ether based photoresist sold under the trade name SU-8, or polymethyl methacrylate, polydimethyl siloxane, silicone rubber, etc.) around each of the first and second openings 172 and 174. Segments of adhesive may be cut across a plurality of the rectangular loops to form compartments for receiving the penetrating fluid. Such adhesive structures 182 facilitate fluidic isolation between the microvalves 164 and the electrical contact pads 180 . 5A, a cross-sectional view of an ejection assembly 200 including a microvalve 230 is shown, according to an exemplary embodiment. In some embodiments, the ejection assembly 200 is an exemplary embodiment of the ejection assembly 100 described with respect to FIGS. 1, 2, 3 and 4. As shown, the ejection assembly 200 includes a carrier 202 attached to a valve body 298 via a structural layer 222. In some embodiments, the structural layer 222 is part of the carrier 202.

[0082] The carrier 202 includes a top 204 and a housing portion 206 extending from an edge of the top 204. The top 204 includes a septum 208 through which pressurized ink is provided. The housing portion 206 defines a cavity in which the valve body 298 is disposed. The valve body 298 includes an input fluid manifold 210 and the microvalve 230. As shown, the input fluid manifold 210 and the microvalve 230 define a reservoir 300 configured to hold a volume of pressurized fluid received from an external fluid supply via the septum 208. In various embodiments, the pressurized fluid held within the reservoir 300 includes, but is not limited to, ink, paint, solvent, biological solution, biochemical solution, chemical solution, physiological fluid (e.g., blood, urine, saliva, plasma, cerebrospinal fluid), adhesive, powder, gel, dye, cell stain, colloidal solution, suspension, emulsion, or other suitable liquid.

[0083] The carrier 202 may be formed of plastic, ceramic, or any other suitable material. The carrier 202 facilitates operation of the jetting assembly 200 by providing structural support to the valve body 298. For example, in some embodiments, the periphery of the valve body 298 is attached to the housing portion 206 via a layer of adhesive 302 disposed on an inner surface of the housing portion 206. Such adhesive facilitates maintaining a desired relative position between the microvalve 230 and the input fluid manifold 210.

[0084] In various embodiments, the input fluid manifold 210 is preformed prior to attachment to additional components of the jetting assembly 200. The fluid manifold 210 is formed by a body 310 (e.g., formed from glass, silicon, silica, etc.) having any suitable thickness (e.g., 500 microns). As shown, the input fluid manifold 210 is preformed to include a first channel 212 and a second channel 214. In the embodiment shown, the first and second channels 210 are substantially linear and parallel to one another, however, the input fluid manifold 210 is positioned as needed for the placement of the microvalve disposed thereon. The first channel 212 is formed to have a width 304 having a predetermined relationship to a length 312 of a cantilever beam portion 308 of an actuation beam 240 of the microvalve 230. For example, the first channel 212 is formed to have a width 304 that is greater than a desired length 312 of the cantilever portion 308 by a threshold amount. The second channel 214 provides a means for electrical connections to be made via wire bonds 220 extending between the actuation beam 240 and the flex circuit 216. Beneficially, using such a configuration, the electrical connection between the actuation beam 240 and the flex circuit 216 is internalized. In other words, the electrical connection between such components is not external to the carrier 202 and therefore is not vulnerable to degradation. In various embodiments, the first channel 212 and / or the second channel 214 have sloped sidewalls.

[0085] As shown, the second channel 214 is substantially filled with an encapsulant 218. The encapsulant 218 may include an epoxy type or any other suitable material. The encapsulant 218 is configured to encapsulate the electrical connections formed between the wire bonds 220, the flex circuit 216, and the actuation beam 240, and to protect the wire bonds 220 from physical damage, moisture, and corrosion. Thus, the encapsulant 218 ensures maintenance of a proper electrical connection between the flex circuit 216 and the actuation beam 240, and facilitates providing electrical control signals to the actuation beam 240 to cause its movement to open and close the microvalve 230.

[0086] The portion 314 of the input fluid manifold 210 that separates the first and second channels 212 and 214 acts as a barrier that prevents fluid contained in the reservoir 300 from reaching the electrical connections. Thus, the input fluid manifold 210 acts both as part of the reservoir 300 for pressurized fluid received from an external fluid supply and as an insulating barrier between the pressurized fluid and the electrical connections contained within the jetting assembly 200. The first and second channels 212 and 214 can be formed using any suitable process (e.g., via sandblasting, physical or chemical etching, drilling, etc.). In some embodiments, the input fluid manifold 210 is not constructed of glass, but rather is constructed of silicon, silica, ceramic, or any other suitable material.

[0087] With continued reference to FIG. 5A, the microvalve 230 includes an orifice plate 250 attached to the actuation beam 240. The orifice plate 250 is formed from any suitable material, such as glass, stainless steel, nickel, nickel with electroplated metal (e.g., stainless steel), polyimide (e.g., Kapton) or photoresist (e.g., SU-8, polyimide methacrylate, etc.). The orifice plate 250 is substantially planar and includes an orifice 260 extending between a first surface and a second surface opposite the first surface. In various embodiments, the orifice 260 is substantially cylindrical and has a central axis that is perpendicular or substantially perpendicular to a surface of the orifice plate 250. A valve seat 270 is disposed on an inner surface 316 of the orifice plate 250 adjacent the orifice 260. In various embodiments, the valve seat 270 includes a flexible material that surrounds or substantially surrounds the orifice 260. In some embodiments, the valve seat 270 is constructed from an epoxy-based adhesive, such as SU-8 photoresist. In other embodiments, the valve seat 270 can be formed from a moldable polymer, such as polydimethylsiloxane or silicone rubber. The valve seat 270 creates an outlet for the pressurized fluid contained in the reservoir 300 against an internal opening 318 substantially aligned with the orifice 260. In certain embodiments, the valve plate 270 can be omitted such that a seal member surface of the actuation beam 240 contacts the orifice plate 250 around the orifice 260 to seal the orifice 260 and close the microvalve 230.

[0088] The actuation beam 240 includes a base portion 306 and a cantilever portion 308. The base portion 306 extends below the portion 314 of the input fluid manifold 210 that separates the first and second channels 212 and 214. As shown, the base portion 306 includes an electrical connection portion 294 in an area that overlaps with the second channel 214. The electrical connection portion 294 includes an electrode that makes an electrical connection to a flex circuit 216 via a wire bond 220. The cantilever portion 308 extends from the portion 314 of the input fluid manifold 210 into the reservoir 300. As shown, the cantilever portion 308 is disposed on a spacing member 280 such that it is spatially separated from the orifice plate 250. Thus, there is space on either side of cantilever portion 308 to allow the actuation beam 240 to bend toward and / or away from the orifice plate 250 as a result of application of an electrical signal thereto via electrical connection portion 294. The spacing member 280 is configured to prevent squeeze film damping of the actuation beam.

[0089] The cantilever portion 308 has a length 312 such that the cantilever portion extends a predetermined distance from the boundary of the reservoir 300. In various embodiments, the predetermined distance is specifically selected such that a portion 292 of the cantilever portion 308 overlaps the valve seat 270 and the orifice 260. A seal member 290 extends from the portion 292 of the actuation beam 240 that overlaps the orifice 260. In some embodiments, the seal member 290 is constructed to have a shape that substantially corresponds to the shape of the orifice 260. For example, in one embodiment, both the orifice 260 and the seal member 290 are substantially cylindrical, with the seal member 290 having a larger outer diameter. Such a configuration facilitates allowing the seal member 290 to cover the entire orifice 260 and form a seal between the seal member 290 and the valve seat 270. In other embodiments, the orifice 260 has any other shape, such as a star, a square, a rectangle, a polygon, an ellipse, or an asymmetric shape. In certain embodiments, the valve seat 270 defines a recess size and is shaped to receive the seal member 290. In various embodiments, the orifice plate 250, and thus the orifice 260, are formed from a non-wetting (e.g., hydrophobic) material, such as silicone or Teflon. In other embodiments, a non-wetting (e.g., hydrophobic) coating is disposed on the inner wall of the orifice 260. Such coatings can include, for example, Teflon, nanoparticles, an oleophilic coating, or any other suitable coating.

[0090] In various embodiments, spacing member 280 and sealing member 290 are constructed of the same material and have equal or substantially equal thicknesses 310 and 322 (e.g., silicone, SU-8, silicone rubber, polymethylmethacrylate, etc.). In such embodiments, when actuation beam 240 extends parallel to orifice plate 250, the lower surfaces of spacing member 280 and sealing member 290 are aligned with one another. When actuation beam 240 is disposed in a closed position (as described herein), a surface of sealing member 290 contacts valve seat 270 to close the fluid outlet formed in orifice 260 (e.g., the sealing member surface of said sealing member 290 can be configured to extend approximately 2 microns below the lower surface of spacing member 280 when said valve seat 270 is not present). The valve seat 270 and seal member 290 are dimensioned such that a sufficient surface area of ​​the seal member 290 contacts the valve seat 270 when the actuation beam 240 is disposed in the closed position (e.g., when an electrical signal is removed from or applied to the actuation beam 240 via a wire bond) to prevent fluid from migrating from the reservoir 300 to the orifice 260. For example, the seal member 290 has a larger diameter or other cross-section than the valve seat 270.

[0091] Various aspects of the jetting assembly 200 are designed to ensure the formation of a proper seal between the valve seat 270 and the seal member 290. For example, the structural layer 222 disposed on the input fluid manifold 210 bonds the components of the microvalve 230 together and prevents bowing of the orifice plate 250 due to stresses induced thereon via the adhesive bonding the microvalve 230 to the housing portion 206. In various embodiments, the structural layer 222 is constructed to have a greater rigidity than the orifice plate 250 to perform this function. The structural layer 222 may be constructed of silicon or any other suitable material. As shown, the structural layer 222 includes a protruding portion 224 extending from its main portion. The protruding portion 224 is attached to the top surface of the input fluid manifold 210 (e.g., at the boundary of the first and second channels 212 and 214). In certain embodiments, the protruding portion 224 is omitted. A seal is formed at the protruding portion 224, for example, via an adhesive disposed between the structural layer 222 and the flex circuit 216. The protruding portion 224 provides clearance above the input fluid manifold 210. Such clearance facilitates disposal of the encapsulant 218 that completely covers all contact points between the wire bonds 220 and the flex circuit 216. In some embodiments, the carrier 202 includes the structural layer 222 such that rigidity is provided by the carrier 202.

[0092] In another aspect, the actuation beam 240 is constructed such that when in the closed position, a tight seal is formed at the interface between the valve seat 270 and the seal member 290. The actuation beam 240 can include at least one layer of piezoelectric material. The layer of piezoelectric material can include lead zirconate titanate (PZT) or any suitable material. The layer of piezoelectric material has electrodes electrically connected thereto. In various embodiments, wire bonds 220 are attached to the electrodes such that an electrical signal from the flex circuit 216 is provided to the layer of piezoelectric material through the electrodes. The electrical signal causes the actuation beam 240 to move (e.g., bend, rotate, etc.) relative to its default position. In other embodiments, the actuation beam 240 can include a stainless steel actuation beam (e.g., having a length of about 1 mm). In yet other embodiments, the actuation beam 240 can include a bimorph beam having two layers of piezoelectric material disposed on either side of a base layer (e.g., a base silicon layer). An electrical signal (e.g., a voltage) can be applied to either of the piezoelectric layers to urge the actuation beam 240 to bend toward the corresponding piezoelectric layer. The two piezoelectric layers may comprise the same piezoelectric material or different piezoelectric materials. In certain embodiments, a different electrical signal can be applied to each of the piezoelectric layers to bend or curve the actuation beam a predetermined distance.

[0093] As shown, the wire bonds 220 are attached to the actuation beam 240 at their electrical connection portions 294. The electrical connection portions 294 include wire bond pads (e.g., constructed of gold or platinum) that are conductively connected to at least one electrode in the actuation beam 240. Beneficially, the electrical connection portions 294 are isolated from the cantilever portion 308 of the actuation beam 240. In other words, the electrical connection portions 294 are isolated from the fluid contained in the jetting assembly 200 via a seal formed at the connection point between the input fluid manifold 210 and the actuation beam 240. In some embodiments, the wire bonds 220 and / or the encapsulant 218 are routed through openings provided in the orifice plate 250.

[0094] In various embodiments, the actuation beam 240 is constructed such that the closed position is its default position. In other words, various layers within the actuation beam 240 are constructed such that the actuation beam 240 curves toward the orifice 260 as a result of a force provided via the pressurized fluid contained in the reservoir 300. Adjustment layers within the actuation beam 240 may be constructed to be in a state of compressive stress, causing the actuation beam 240 to have a curvature toward the orifice 260. As a result of such curvature, the seal member 290 contacts the valve seat 270 in the absence of an electrical signal applied to the actuation beam 240 to close the orifice 260. The degree of curvature is specifically selected to form a tight seal at the interface between the seal member 290 and the valve seat 270 with the actuation beam 240 in the default position. Beneficially, such a default seal prevents evaporation of the fluid contained in the jetting assembly 200, preventing clogging and other defects.

[0095] 5A, the actuation beam 240 is bent away from the orifice plate 250. Achieving such bending results from applying an electrical signal to the actuation beam 240 via the flex circuit 216. For example, the flex circuit 216 is electrically connected to an external controller that provides an electrical signal that is relayed to the actuation beam 240.

[0096] As shown in FIG. 5A, application of the electrical signal causes the actuation beam 240 to temporarily deviate from its default position. For example, in various embodiments, the actuation beam 240 moves upward from the orifice 260 such that a portion of the seal member surface of the seal member 290 is at least 10 microns from the top surface of the valve seat 270. In one embodiment, a central portion of the seal member surface is approximately 15 microns from the valve seat 270 at the peak of its vibration pattern. As a result, a temporary opening is formed between the valve seat 270 and the seal member 290. The opening provides a path for a volume of fluid to enter the orifice 260 and form droplets on the outer surface of the orifice plate 250. The droplets are deposited on a substrate to form a pattern determined via the control signal provided to each of the actuation beams 240 of each of the microvalves 230 of the jetting assembly 200. As will be appreciated, the frequency at which the actuation beam 240 moves away from its default position to the position shown in FIG. 5 will vary depending on the implementation. In various embodiments, the natural frequency of the actuation beam 240 ranges from 1 to 30 kHz, depending on the length, width, thickness, and / or stiffness of the actuation beam 240. For example, in one embodiment, the actuation beam 240 vibrates at a frequency of about 12 kHz. However, the actuation beam 240 can vibrate at a lower (e.g., 10 kHz) or higher frequency (e.g., 20 kHz) in other embodiments.

[0097] 5B, a cross-sectional view of an ejection assembly 200b including a microvalve 230b is shown, according to an example embodiment. In some embodiments, the ejection assembly 200b is an example embodiment of the ejection assembly 100 described with respect to Figures 1, 2, 3, and 4. As shown, the ejection assembly 200b includes a carrier 202b attached to a valve body 298b via an interposer 222b.

[0098] The carrier 202b includes a top 204b and a housing portion 206b extending from an edge of the top 204b. A fluid channel 211b is provided in the top 204b. A septum 208b (e.g., a rubber or foam septum) is disposed at an inlet of the fluid channel 211b, and a filter 213b is disposed at an outlet of the fluid channel 211b. A cover 203b (e.g., a plastic or glass cover) is disposed on the carrier 202b such that the septum 208b is disposed between and fixed between the carrier 202b and the cover 203b. An opening 209b is defined in the cover 203b and corresponds to the inlet of the fluid channel 211b. A fluid connector 10b is coupled to the cover 203b or the inlet of the fluid channel 211b. The fluid connector 10b includes an insertion needle 12b configured to penetrate the bulkhead 208b and be disposed in the fluid channel 211b therethrough. The fluid connector 10b is configured to deliver pressurized fluid to the input fluid manifold 210b of the jetting assembly 200b via the insertion needle 12b. Additionally, the filter 213b is configured to filter particles from the fluid before the fluid is transmitted to the fluid manifold 210b. In some embodiments, the insertion needle 12b is formed from or coated with a non-wetting (e.g., hydrophobic material such as Teflon). In other embodiments, the insertion needle 12b includes a heating element or an electric current can be provided to the insertion needle 12b to heat the insertion needle 12b and thereby heat the fluid flowing therethrough to the input fluid manifold 210b. In still other embodiments, a metal needle or any other heating element is provided to the input fluid manifold 210b to heat the fluid contained therein.

[0099] The housing portion 206b defines a cavity or boundary within which the valve body 298b is disposed. The valve body 298 includes the input fluid manifold 210b and the microvalve 230b. As shown, the input fluid manifold 210b and the microvalve 230b define a reservoir 300b configured to hold a volume of pressurized fluid received from an external fluid supply via the septum 208b. In various embodiments, the pressurized fluid held within the reservoir 300b includes an ink, paint, solvent, biological solution, biochemical solution, chemical solution, physiological fluid (e.g., blood, urine, saliva, plasma, cerebrospinal fluid), adhesive, powder, gel, dye, cell stain, colloidal solution, suspension, emulsion, or other suitable liquid.

[0100] In various embodiments, the input fluid manifold 210b is preformed prior to attachment to additional components of the jetting assembly 200b. For example, the fluid manifold 210b is formed of a glass body 310b having any suitable thickness (e.g., 500 microns). As shown, the input fluid manifold 210b is preformed to include a first channel 212b and a second channel 210b. The first channel 212b is formed to have a width 304b that has a predetermined relationship to a length 312b of a cantilever portion 308b of an actuation beam 240b of the microvalve 230b. The second channel 214b provides a means for electrical connections to be made via wire bonds 220b extending between the actuation beam 240b and a flex circuit 216b.

[0101] As shown, the second channel 214b is substantially filled with an encapsulant 218b that ensures proper electrical connection between the flex circuit 216b and the actuation beam 240b, facilitates providing electrical control signals to the actuation beam 240b such that movement of the actuation beam 240b opens and closes the microvalve 230b, and protects the wire bonds 220b from physical damage or moisture as previously described herein.

[0102] The portion 314b of the input fluid manifold 210b that separates the first and second channels 212b and 214b acts as a barrier that prevents fluid contained in the reservoir 300b from reaching the electrical connections. Thus, the input fluid manifold 210b functions both as part of the reservoir 300b for pressurized fluid received from an external fluid supply and as an insulating barrier between the pressurized fluid and the electrical connections contained within the ejection assembly 200b.

[0103] The microvalve 230b includes an orifice plate 250b attached to an actuation beam 240b. The orifice plate 250b is substantially planar and includes an orifice 260b extending between its surfaces. A valve seat 270b is disposed on an inner surface 316b of the orifice plate 250b adjacent the orifice 260b. The valve seat 270b opposes an internal opening 318b substantially aligned with the orifice 260b to create an outlet for the pressurized fluid contained in the reservoir 300b. In certain embodiments, the valve seat 270b is omitted such that a seal member surface of the seal member 290 contacts the orifice plate 250b around the orifice 260b to seal the orifice 260b and close the microvalve 230b.

[0104] The actuation beam 240b includes a base portion 306b and a cantilever portion 308b. The base portion 306b extends below the portion 314b of the input fluid manifold 210b that separates the first and second channels 212b and 214b. As shown, the base portion 306b includes an electrical connection portion 294b in an area that overlaps with the second channel 214b. The electrical connection portion 294b includes an electrode that makes an electrical connection with the flex circuit 216b via a wire bond 220b. The cantilever portion 308b extends from the portion 314b of the input fluid manifold 210b into the reservoir 300b. As shown, the cantilever portion 308b is disposed on a spacing member 280b and is thus spatially separated from the orifice plate 250b.

[0105] Cantilever portion 308b has a length 312b such that the cantilever portion 308b extends a predetermined distance from the boundary of the reservoir 300b. In various embodiments, the predetermined distance is specifically selected such that portion 292b of cantilever portion 308b overlaps the valve seat 270b and orifice 260b. A seal member 290b extends from the portion 292b of the actuation beam 240b that overlaps the orifice 260b. In some embodiments, seal member 290b is constructed to have a shape that substantially corresponds to the shape of orifice 260b.

[0106] The flex circuit 216b is disposed on the glass body 310b and the portion 314b of the input fluid manifold 210b and bonded thereto via a first adhesive layer (e.g., SU-8, silicone rubber, etc.). An interposer 222b is disposed between the top portion 204b of the carrier 202b and the input fluid manifold 210b, creating a gap between the top portion 204b and the input fluid manifold 210b. This allows enough space for disposing the encapsulant 218 and increases the volume of the input fluid manifold 210b. As shown in FIG. 5B, the interposer 222b is disposed on and bonded to a portion of the flex circuit 216b via a second adhesive layer 223b (e.g., SU-8, silicone, or any other adhesive). Further, the interposer 222b is bonded to a sidewall of the top portion 204b of the carrier 202b adjacent to the microvalve 230b via a third adhesive layer 225b (e.g., SU-8, silicone, or any other adhesive).

[0107] The interposer 222b is formed from a strong, flat, rigid material (e.g., plastic, silicon, glass, ceramic, etc.) and is positioned over the input fluid manifold 210b to bond the components of the microvalve 230b together and prevent bending of the orifice plate 250b due to stresses induced thereon through the adhesive that bonds the microvalve 230b to the housing portion 206b. In various embodiments, the interposer 222b is constructed to have greater rigidity than the orifice plate 250b to perform this function.

[0108] In another aspect, the actuation beam 240b is constructed such that a tight seal is formed at the interface between the valve seat 270b and the seal member 290b when in the closed position. The actuation beam 240b includes at least one layer of piezoelectric material (e.g., lead zirconate titanate (PZT) or any suitable material). The layer of piezoelectric material has electrodes electrically connected thereto, and wire bonds 220b are attached to the electrodes such that an electrical signal from a flex circuit 216b is provided to the layer of piezoelectric material via the electrodes. The electrical signal causes the actuation beam 240b to move (e.g., bend, rotate, etc.) relative to its default position.

[0109] As shown, wire bond 220b is attached to actuation beam 240b at its electrical connection portion 294b and is substantially similar to the wire bond 220 described with respect to the jetting assembly 200 of Figure 5A. In various embodiments, actuation beam 240b is constructed such that the closed position is its default position, as described in detail with respect to the actuation beam 240 of Figure 5A.

[0110] As shown in FIG. 5B, the actuation beam 240b is bent away from the orifice plate 250b. Achieving such bending results from applying an electrical signal to the actuation beam 240b via a flex circuit 216b. For example, the flex circuit 216b is electrically connected to a circuit board 215b (e.g., a printed circuit board) that extends perpendicular to the longitudinal axis of the actuation beam 240b along a sidewall of the carrier 202b. An identification tag 217b (e.g., an identification tag 106) is disposed between the circuit board 215b and the sidewall of the carrier 202b. An electrical connector 219b is electrically coupled to the circuit board 215b and configured to electrically connect the flex circuit 216b to an external controller that provides an electrical signal that is relayed to the actuation beam 240b via the circuit board 215b.

[0111] As shown in Figure 5B, application of the electrical signal causes the actuation beam 240b to temporarily deviate from its default position. For example, in various embodiments, the actuation beam 240b moves upward and away from orifice 260b such that a portion of the seal member surface of seal member 290b is at least 10 microns from the top surface of valve seat 270b, as described in detail with respect to the actuation beam 240 in Figure 5A.

[0112] Referring now to FIG. 6, a more detailed diagram illustrating various components of the jet assembly 200 described with respect to FIG. 5A is shown, according to an exemplary embodiment. As shown, an actuation beam 240 includes an actuation portion 242, a tuning layer 244, and a non-active layer 246. The non-active layer 246 serves as a base for the tuning layer 244 and the actuation portion 242. The structure of the actuation portion 242 and the tuning layer 244 are described in more detail with respect to FIGS. 7A-7B. In some embodiments, the non-active layer 246 is constructed from silicon or other suitable material. In some embodiments, the non-active layer 246, the spacing member 280, and the seal member 290 are all constructed from the same material (e.g., monolithically formed from a silicon wafer). In an exemplary embodiment, the non-active layer 246, the spacing member 280, and the seal member 290 are formed from a dual silicon-on-insulator (SOI) wafer.

[0113] The spacing member 280 is shown to include an intermediate layer interposed between two peripheral layers. In an exemplary embodiment, the intermediate and inactive layer 246 comprises two silicon layers of a dual SOI wafer, with the peripheral layers disposed on either side of the intermediate layer including a silicon oxide layer. In this example, the seal member 290 and spacing member 280 are formed by etching the surface of the dual SOI wafer opposite the active portion 242. An oxide layer serves to control or stop the etching process, for example, when the entire intermediate layer forming the spacing member 280 has been removed in the area separating the spacing member 280 and the sealing member 290. Such a process provides precise control of both the width and thickness of the spacing and sealing members 280 and 290.

[0114] As will be appreciated, the size of the sealing member 290 can contribute to the resonant frequency of the actuation beam 240. A larger amount of material placed at or near the end of the actuation beam 240 generally results in a lower resonant frequency of the actuation beam. Furthermore, such a large amount of material can affect the default curvature of the actuation beam 240 induced from pressurized fluid contacting the actuation beam 240. Thus, the desired size of the sealing member 290 influences various other design choices of the actuation beam 240. Such design choices are described in more detail with respect to FIG. 7A. In some embodiments, the sealing member 290 is sized based on the dimensions of the orifice 260. In some embodiments, the sealing member 290 is substantially cylindrical and has a diameter that is about 1.5 times the diameter of the orifice 260. For example, in one embodiment, if the orifice 260 has a diameter of about 60 microns, the sealing member 290 has a diameter of about 90 microns. Such a configuration facilitates alignment between the seal member 290 and the orifice 260 such that the seal member 290 completely covers the orifice 260 when it contacts the valve seat 270. In another embodiment, the seal member 290 is sized to have a surface area approximately twice that of the orifice 260 (e.g., the spacing member 280 is approximately 150 microns in diameter and the orifice 260 is approximately 75 microns in diameter). Such an embodiment provides greater tolerance for aligning the seal member 290 and the orifice 260 to facilitate creation of the seal between the valve seat 270 and the seal member 290. In other embodiments, the diameter of the seal member 290 may be 2, 2.5, 3, 3.5, or 4 times the diameter of the orifice 260. In various embodiments, the length to diameter ratio of the orifice 260 ranges from 1:1 to 15:1. This ratio affects the shape, size, and / or volume of the fluid droplets expelled through the orifice 260 and will vary based on the particular application.

[0115] Beneficially, the gap 324 between the spacing member 280 and the seal member 290 creates a separation volume 326 between the actuation beam 240 and the orifice plate 250. The separation volume 326 prevents squeeze film damping of the vibration of the actuation beam 240. In other words, insufficient separation between the orifice plate 250 and the actuation beam 240 leads to drag due to air having to move in and out of the separation volume 326 as the actuation beam 240 opens and closes the orifice 260. Having a larger volume of separation created via the spacing member 280 reduces such drag and thus facilitates the actuation beam 240 to vibrate at a faster frequency.

[0116] 6, the orifice plate 250 includes a base layer 252 and an intermediate layer 254. For example, in one embodiment, the base layer 252 comprises a silicon layer and the intermediate layer 254 comprises a silicon oxide layer. In the embodiment shown, a portion of the intermediate layer 254 proximate the orifice 260 is removed, and a first portion of the valve seat 270 is disposed directly on the base layer 252 and a second portion of the valve seat 270 is disposed on the intermediate layer 254. It should be understood that in an alternative embodiment, the intermediate layer 254 extends all the way to the boundary of the orifice 260 and the valve seat 270 is disposed on the intermediate layer 254. In yet another embodiment, the removed portion of the intermediate layer 254 has a cross-section equal to or greater than the cross-section of the valve seat 270 such that the valve seat 270 is disposed entirely on the base layer 252.

[0117] Due to the importance of the spatial relationship between the spacing member 280 and the valve seat 270, the attachment of the spacing member 280 to the orifice plate 250 is performed in a manner that allows for precise control of the resulting distance between the actuation beam 240 and the orifice plate 250. As shown, an adhesive layer 256 is used to attach the spacing member 280 to the orifice plate 250. In various embodiments, a precise amount of an epoxy-based adhesive (e.g., SU-8, polymethylmethacrylate, silicone, etc.) is applied to the intermediate layer 254 before placing the combination of the spacing member 280 and the actuation beam 240 thereon. The adhesive is then cured to form the adhesive layer 256 having a precisely controlled thickness. For example, in some embodiments, the bottom surface of the spacing member 280 is substantially aligned with the top surface of the valve seat 270. Any desired relationship between such surfaces can be obtained to create a relationship between the seal member 290 and the valve seat 270 that creates a proper seal when the actuation beam 240 is in the default position. In various embodiments, the adhesive layer 256 and the valve seat 270 are formed from the same material (eg, SU-8) in a single photolithography step.

[0118] In various embodiments, once the actuation beam 240 and orifice plate 250 are attached to one another via adhesive layer 256 (e.g., to form microvalve 230), an additional adhesive layer 248 is applied around the periphery of the actuation beam 240. The additional adhesive layer 248 is used to attach an input fluid manifold 210 to the actuation beam 240. An interposer (e.g., the interposer 222b) is disposed over the input fluid manifold 210 and bonded thereto via a second adhesive layer 225. In some embodiments, the additional adhesive layer 248 and the second adhesive layer 225 can comprise the same material as the adhesive layer 256.

[0119] 7A, there is shown a more detailed view, not to scale, of an actuation beam 240, according to an exemplary embodiment. As shown, actuation beam 240 includes the inactive layer 246, the tuning layer 244, a barrier layer 400, a first electrode portion 402, the actuation portion 242, a second electrode portion 404, and a passivation structure 406. As will be appreciated, actuation beam 240 can include more or less layers in various alternative embodiments.

[0120] In some embodiments, the tuning layer 244 is disposed directly on the inactive layer 246. The tuning layer 244 generally functions as an adhesion layer to facilitate deposition of the additional layers described herein. Additionally, as described herein, the thickness of the tuning layer 244 can play an important role in determining the overall curvature of the actuation beam 240 when in its default position. Generally speaking, the tuning layer 244 is configured to have a predetermined tuning stress such that in a closed position, the sealing member 290 of the actuation beam 240 contacts and exerts a force on the valve seat 270 to fluidly seal the orifice 260. In some embodiments, in the absence of an electrical signal, the predetermined tuning stress is configured to cause the actuation beam 240 to curve toward the orifice 260, such that in the absence of the valve seat 270, the sealing member surface of the sealing member 290 will be disposed a predetermined distance (e.g., 2 microns) below the lower surface of the spacing member 280. For example, the tuning layer 244 is placed in a state of compressive stress as a result of deposition of the additional layers described herein. Thus, the thicker the tuning layer 244, the greater the curvature of the actuation beam 240 towards the orifice 260 when in its default position.

[0121] The barrier layer 400 acts as a barrier against diffusion of materials contained in the first piezoelectric layer 414 into the tuning layer 244. If left unchecked, such migration can lead to detrimental intermixing effects between constituent materials in the layers, adversely affecting performance. In various embodiments, the barrier layer 400 is comprised of zirconium oxide or zirconium dioxide, for example. As shown, the first electrode portion 402 includes an adhesion layer 408 and a first electrode 510. The adhesion layer 408 facilitates deposition of the first electrode 410 onto the barrier layer 400 and prevents materials in the first electrode 410 from diffusing into other layers. In various embodiments, the adhesion layer 408 is comprised of titanium. The first electrode 410 is constructed of platinum or gold to provide a conductive path for electrical signals provided to the actuation portion 242. In some embodiments, the first electrode portion 402 is included only in selected portions of the actuation beam 240. For example, the first electrode portion 402 is adjacent to and / or contained only within the electrical connection portion 294 .

[0122] The actuating portion 242 may be formed from a single layer or multiple layers of any suitable piezoelectric material. In the example shown, the active portion includes a growth template or seed layer 412 and a piezoelectric layer 414. The growth template layer 412 acts as a seed layer to promote the growth of said piezoelectric layer 414 with a desired texture (e.g., 001 crystal structure and corresponding texture) to ensure maximum piezoelectric response. In some embodiments, the growth template layer 412 is comprised of lead titanate. The piezoelectric layer 414 may be comprised of any suitable material, such as lead zirconate titanate (PZT).

[0123] The piezoelectric layer 414 can be deposited using any method, such as utilizing vacuum deposition or sol-gel deposition techniques. In some embodiments, the piezoelectric layer 414 is in the range of about 20-200 microns thick (e.g., 20, 30, 40, 50, 60, 70, 80, 90, 100, 120, 140, 160, 180, or 100 microns) and is adapted to generate a deflection of about 10 microns at the end of the actuation beam 240 when an electrical signal is applied thereto. A deflection of 10 microns (e.g., such that the surface of the seal member 290 moves away from the valve seat 270 by an amount slightly less than that amount) is sufficient to generate a droplet at the orifice 260 having a desired size. In some embodiments, the piezoelectric layer 414 has a piezoelectric transverse coefficient (d31 value) magnitude of about 140 to 160 pm / V. This value makes it possible to generate a suitable deflection of the actuation beam 240 via the electrical signals supplied to the first and second electrode portions 402 and 404 .

[0124] As shown, the second electrode portion 404 is disposed on the actuation portion 242. In various embodiments, the second electrode portion 404 is structured similarly to the first electrode portion 402 described herein. Thus, application of a voltage to the first electrode portion 402 and / or the second electrode portion 404 induces a strain in the piezoelectric layer 414, causing the entire actuation beam 240 to bend away from the orifice plate 250. Through application of a periodic control signal to the first and second electrode portions 402 and 404, periodic cycling of the actuation beam 240 generates droplets that are output from the orifice 260 at a desired frequency. Although FIG. 7A shows the first and second electrode portions 402 and 404 overlapping one another, in other locations, the first and second electrode portions 402 and 404 may not overlap. This can limit or prevent electronic leakage between the first and second electrode portions 402 and 404, which can damage the piezoelectric layer 414 or cause an electrical short.

[0125] 7A can extend substantially completely through the length of the actuation beam 240. Thus, there is an overlap between electrode portions 402 and 404 and the reservoir formed through the microvalve 230. In various embodiments, the fluid contained in the reservoir 300 is conductive and / or corrosive to the material forming the first and second electrode portions 402 and 404. Thus, it is preferable to isolate the electrode portions 402 and 404 from the fluid reservoir 501 to prevent the fluid contained in the reservoir 300 from contacting the electrode portions 402 and 404.

[0126] In this regard, the passivation structure 406 is configured to perform such isolation. In the illustrated example, the passivation structure 406 includes a dielectric layer 416, an insulator layer 418, and a barrier layer 420. The barrier layer 420 is constructed of silicon nitride, which acts as a diffusion barrier against water molecules and ions contained in the fluid to prevent corrosion of the electrode portions 402 and 404. In some embodiments, the insulator layer 418 includes a silicon dioxide layer having a compressive stress that approximately balances the tensile stress of the barrier layer 420. The dielectric layer 416 may be constructed of aluminum oxide to prevent oxidation of the additional layers included in the actuation beam 240. In some embodiments, an additional metal layer is disposed on the barrier layer 420. For example, the metal layer is composed of tantalum oxide or any other suitable chemically resistant metal to further enhance the protective properties of the passivation structure 406. In certain embodiments, the barrier layer 420 can be formed of Teflon or Parylene. In another embodiment, at least a portion of the actuation beam 240, i.e. the structure formed by the layers shown in FIG. 7A, is covered or coated with a Teflon or Parylene layer. Such a protective coating can prevent microcracks from forming in the layers of the actuation beam 240. In yet another embodiment, the protective coating comprises a metal layer, for example a tantalum or palladium layer.

[0127] The addition of the passivation structure 406 can have a significant effect on the default positioning of the actuation beam 240. This is because the passivation structure 406 is offset from the neutral axis of compression 422 of the actuation beam 240. As shown, the neutral axis 422 is in the inactive layer 246, which means that the electrode portion 404 and the passivation structure 406 are the furthest away from it in the actuation beam 240. With this in mind, the tensile or compressive stress induced in such layer will have a significant effect on the default curvature of the actuation beam 240. Thus, the thickness of the tuning layer 244 is selected based on the structure of the various constituent layers of the passivation structure 406.

[0128] 7B is a front cross-sectional view of the actuation beam 240 showing the arrangement of the layers included in the actuation beam, not to scale, according to an exemplary embodiment. As shown, the actuation beam 240 includes the inactive layer 246, the adjustment layer 244, and the barrier layer 400, as described with respect to FIG. 7A. The first electrode portion 402 includes the adhesion layer 408 (e.g., titanium oxide) disposed on the barrier layer 400, and a conductive layer or electrode 410 (e.g., platinum or gold) disposed thereon. The first electrode portion 402 is configured to have a width smaller than a width of the barrier layer 400, such that an end of the electrode portion 402 in a direction perpendicular to the longitudinal axis of the actuation beam 240 is disposed inside an end of the barrier layer 400 in the same direction.

[0129] The actuating portion 242, including the seed layer 412 and the piezoelectric layer 414, is conformally disposed on the first electrode portion 402 such that it extends beyond the lateral ends of the first electrode portion 402 and contacts the barrier layer 400. In this manner, the piezoelectric layer completely surrounds or encapsulates at least the portion of the first electrode portion 402 that overlaps or is adjacent to the second electrode portion 404. The second electrode portion 404 includes an adhesion layer 403 (e.g., titanium) and a conductive layer 405 (e.g., platinum or gold). In some embodiments, the second electrode portion 404 includes only the conductive layer 405 disposed directly on the piezoelectric layer 414 (i.e., the adhesion layer 403 is omitted). Because the actuating portion 242 overlaps and extends beyond the end of the first electrode portion 402, the actuating portion effectively electrically insulates the first electrode portion 402 from the second electrode portion 404 to prevent electron leakage and current transfer that can be detrimental to the performance of the actuating beam 240.

[0130] The passivation structure 406 conformally coats the exposed portions of each of the other layers 246, 244, 400, 402, 242, and 404. However, the bottom surface of the inactive layer 246 should not be coated with the passivation structure 406. The passivation structure 406 includes a dielectric layer 416, an insulator layer 418, a barrier layer 420, and a top passivation layer 424. The barrier layer 420 is constructed of silicon nitride, which acts as a diffusion barrier for water molecules and ions contained in the fluid to prevent corrosion of the electrode portions 402 and 404. However, silicon nitride is generally in a state of tensile stress when deposited on the remaining layers. The insulator layer 418 is configured to counteract such tensile stress. For example, in some embodiments, the insulator layer 418 includes a silicon dioxide layer having a compressive stress that approximately balances the tensile stress of the barrier layer 420. In various embodiments, the barrier layer 420 is disposed below the insulator layer 418. The dielectric layer 416 is constructed from aluminum oxide, titanium oxide, zirconium oxide, or zinc oxide to prevent oxidation of the additional layers included in the actuation beam 240. Thus, the passivation structure 406 helps to prevent both corrosion and oxidation (two major sources of defects caused by the presence of fluids) in the actuation beam 240, thus ensuring the long-term performance of the microvalve 230. Furthermore, the upper passivation layer 424 is disposed on the barrier layer 420 and includes a Teflon or Parylene layer. Such a protective film can prevent microcracks from forming in the layers of the actuation beam 240 and can also prevent underlying layers from plasma discharges (e.g., to which the buried layer may be exposed in subsequent manufacturing operations). In certain embodiments, the upper passivation layer 424 includes a metal layer, such as a tantalum or palladium layer. In some embodiments, an additional metal layer is disposed on the barrier layer 420. For example, the metal layer may be comprised of tantalum oxide or any other suitable chemically resistant metal to further enhance the protective properties of passivation structure 406 .

[0131] In some embodiments, a non-contact deposition system can include a jetting assembly, such as any of the jetting assemblies described herein. For example, Figure 8 is a schematic diagram of a non-contact deposition system 10 including a jetting assembly 500, according to one embodiment. The jetting assembly 500 includes a microvalve 530 coupled to a carrier 504 via an interposer 522.

[0132] The microvalve 530 includes an orifice plate 550 including a first surface 551 and a second surface 553 opposite the first surface 551. An orifice 560 extends from the first surface 551 to the second surface 553. The orifice plate 550 is substantially similar to the orifice plate 250 / 250b and therefore will not be described in further detail herein. In some embodiments, a valve seat 570 can surround the orifice 560. The valve seat 570 defines an opening 518 in fluid communication with the orifice 560. The valve seat 570 is substantially similar to the valve seat 270 / 270b and therefore will not be described in further detail herein.

[0133] A spacing member 579 is disposed on the first surface 551 and offset from the orifice 560. An actuation beam 540 is disposed on the spacing member 579. The actuation beam 540 extends from the spacing member 579 toward the orifice 560. The actuation beam 540 has a layer of piezoelectric material and is movable between a closed position and an open position by applying an electrical signal to the layer of piezoelectric material. A seal member 588 is disposed at an end of the actuation beam 540 and overlaps the orifice 560.

[0134] For example, when no electrical signal (e.g., voltage or differential voltage) is applied to the layer of piezoelectric material, the actuation beam 540 is in the closed position (e.g., in its default state). In the closed position, a seal member surface 589 of the seal member 588 contacts the valve seat 570 (or the orifice plate 550 in embodiments in which the microvalve 530 includes the valve seat 570) to seal the orifice 560 and close the microvalve 530. In the open position, the actuation beam 540 bends or curves away from the orifice 560 such that the seal member 588 no longer seals the orifice 560 and fluid is expelled from the orifice 560 towards the substrate 590. The actuation beam 540 may be substantially similar to the actuation beam 240 / 240b or any other actuation beam described herein and therefore is not described in further detail herein.

[0135] A fluid manifold 514 is coupled to the microvalve and defines a fluid reservoir 501 around the actuation beam 540. The fluid manifold 514 is substantially similar to the fluid manifold 314 / 314b and therefore will not be described in further detail herein. In some embodiments, an interposer 522 is disposed on and coupled to the fluid manifold 514. The interposer 522 may be substantially similar in structure and function to the interposer 222b and therefore will not be described in further detail herein.

[0136] Further, a carrier 502 can be disposed on and coupled to the interposer 522 such that the orifice plate 550, the fluid manifold 514, the interposer 522, and the carrier 502 collectively define a boundary of a fluid reservoir 501. The carrier 502 includes a base portion 504 disposed on and coupled to the interposer 522 to define a portion of the boundary of the fluid reservoir 501. A sidewall 505 extends from the base portion 504 away from the microvalve 530 such that the carrier defines a fluid channel 511 therethrough. A septum 508 (e.g., a rubber or foam septum) is disposed at an inlet of the fluid channel 511 and a filter 513 is disposed at an outlet of the fluid channel 511. A cover 503 (e.g., a plastic or glass cover) is disposed on the sidewall 505 such that the septum 508 is disposed and secured between the sidewall 505 and the cover 503 forming the fluidic channel 511. An opening 509 is defined in the cover 503 and corresponds to an inlet of the fluidic channel 511. A fluidic connector 51 is coupled (e.g., via a fluidic coupler) to the cover 503 or the opening 509 of the fluidic channel 511. The fluidic connector 51 includes an insertion needle 52 configured to penetrate the septum 508 and to be disposed therethrough in the fluidic channel 511. The fluidic connector 51 is configured to supply a pressurized fluid (e.g., pressurized via a pump disposed upstream of the fluidic connector 51) to the fluidic reservoir 501 via the insertion needle 52. Furthermore, the filter 513 is configured to filter particles from the fluid before the fluid is transmitted to the fluidic reservoir 501. In some embodiments, the carrier 502 and the needle 52 are substantially similar to the carrier 202b and the needle 12b, and therefore will not be described in further detail herein.

[0137] Although not shown in FIG. 8 for clarity, the jetting assembly 500 may include any other components as described with respect to the jetting assembly 200 / 200b. Such components may include, for example, flex circuits 216 / 216b, wire bonds 220 / 220b, encapsulants 218 / 218b, electrical connectors 219b, circuit boards 215b, or any other components as described with respect to the jetting assembly 200 / 200b. Such components have the same structure, perform the same functions, and are co-located as previously described herein. Although FIG. 8 illustrates the non-contact deposition system 10 as including a single jetting assembly 500, it should be understood that in other embodiments, the non-contact deposition system 10 includes multiple jetting assemblies 500. In such embodiments, each of the multiple jetting assemblies 500 is configured to deposit the same fluid onto multiple corresponding substrates or to deposit multiple fluids onto the same or different substrates.

[0138] In some embodiments, the non-contact deposition system 10 also includes a platform 580 spaced apart from the microvalve 530 of the jetting assembly 500 on which the substrate 590 is disposed. In some embodiments, a motion mechanism 50 is coupled to the jetting assembly 500 via a coupling member 52 (e.g., a coupling rod, shaft, or frame). Although shown coupled to the carrier 502, in other embodiments, the motion mechanism 50 is coupled to the interposer 522, the fluid manifold 514, or any other portion of the jetting assembly 500. The motion mechanism 50 includes a servo motor, a belt rail assembly, or other components configured to provide two-dimensional (in the XY plane) or three-dimensional (in the XYZ plane) motion to the jetting assembly 500 to effect deposition of the fluid at a predetermined location on the substrate 590. In other embodiments, the motion mechanism 50 is additionally or alternatively coupled to the platform 580 and configured to move the platform 580, and thereby move the substrate 590 relative to the jetting assembly 500.

[0139] As previously described herein, the fluid reservoir 501 is filled with pressurized fluid provided by the fluid connector 51 via the fluid channel 511. By applying an electrical signal (e.g., a differential voltage) to the actuation beam 540, the fluid can be selectively ejected from the orifice 560 by moving the cantilever portion of the actuation beam 540 away from the orifice 560 to open the microvalve 530. Droplets of the fluid are ejected from the orifice 560 towards the substrate 590 and deposited thereon as fluid deposits 592 (e.g., droplets, patterns, marks, etc.).

[0140] The fluid may include any suitable fluid depending on the particular application in which the non-contact deposition system 10 is being used. The fluid may be a liquid, gel, powder, or colloidal solution. Suitable fluids include, but are not limited to, inks, paints, solvents, biological solutions, biochemical solutions, chemical solutions, physiological fluids, adhesives, powders, gels, dyes, cell stains, colloidal solutions, emulsions, suspensions, and the like. In various embodiments, the fluid may include a volatile fluid (e.g., a solvent-based solution such as an ink, paint, or adhesive) or an air-sensitive fluid (e.g., a fluid that includes components that are oxidized by oxygen in the air). In some embodiments, the non-contact deposition system 10 is configured to deposit high viscosity fluids having viscosities in the range of 5 to 20 centipoise without using an external pump to pressurize the fluid provided to the jetting assembly 500. Additionally, the non-contact deposition system 10 can deposit fluids having viscosities up to 100 centipoise by providing pressurized fluid to the jetting assembly 500 (e.g., pumped by an external pump).

[0141] The jetting assembly 500 is configured to limit exposure of such fluids to air present in an environment outside the jetting assembly 500. For example, the default position of the microvalve 530 is the closed position, as previously described herein. Thus, the fluid contained within the fluid reservoir 501 is only exposed to air when the microvalve 530 is open, thereby limiting exposure to air. This extends the life of the fluid and reduces costs by eliminating the need for the use of a controlled environment to perform deposition operations.

[0142] The substrate 590 may include any suitable substrate. Figures 9-14 are schematic diagrams of various substrates that may be used to deposit a fluid thereon using the non-contact deposition system 10. Referring to Figure 9, in some embodiments, the substrate includes a histopathology cassette 690. The histopathology cassette 690 includes a number of slots 691, each configured to hold a different cell or tissue sample. In such embodiments, the fluid includes a cell stain, and the non-contact deposition system 10 is configured to deposit the same stain in each slot 691, or different stains in different slots 691 (e.g., via a number of microvalves included in the non-contact deposition system 10). In some embodiments, the fluid includes an ink, and the non-contact deposition system 10 is configured to deposit the ink onto the histopathology cassette 690 that forms a mark 692 (e.g., a logo, a barcode, a serial number, etc.) on the histopathology cassette 690.

[0143] In some embodiments, the substrate includes a slide 790 as shown in FIG. 10. For example, the slide 790 may include a microscope slide and may be formed of glass or plastic. In such embodiments, the fluid may include a chemical, biological, or biochemical solution. A biochemical or biological solution may include, for example, a solution containing biomolecules, such as proteins (e.g., antibodies, antigens, enzymes, protein fractions, etc.), oligonucleotides, DNA strands, cell lysates, etc., in a physiological buffer or solvent. In some embodiments, a gelling agent (e.g., a sol-gel or hydrogel) or a polymerization agent is also included in the solution. The non-contact deposition system 10 is configured to deposit an array of droplets 794 of the solution (e.g., 500 pL to 10 nL volume droplets) to form a microarray, which may be analyzed using fluorescent probes or other suitable analytical techniques. In some embodiments, the non-contact deposition system 10 is also configured to deposit ink onto the slide 790 to form marks 792 thereon (e.g., logos, bar codes, serial numbers, etc.).

[0144] In other embodiments, the substrate comprises a fabric (e.g., cotton, nylon, polyester, spandex, rayon, carpet, etc.), ceramic tile, engineered wood, or laminate tile. In such embodiments, the non-contact deposition system 10 is configured to deposit any suitable fluid, such as a conductive ink (e.g., conductive silver ink, polyethylenedioxythiophene (PEDOT), polypyrrole (PPy), etc.), paint, nanocoating, or antimicrobial coating. For example, FIG. 11 illustrates a fabric 890 including a garment formed from any suitable material described herein. The non-contact deposition system 10 can be used to deposit a conductive ink onto the fabric 890 in a predetermined pattern to form an electrical component 894 (e.g., a resistor, an electrode lead, or a contact) on a surface of the fabric 890. Additionally, the non-contact deposition system 10 is also configured to deposit ink onto the fabric 890 to form a mark 892 thereon. Similarly, Figure 13 includes a fabric (e.g., cotton, nylon, polyester, spandex, rayon, carpet, etc.), ceramic tile, engineered wood or laminate tile, and the non-contact deposition system 10 is used to deposit a coating 1092, such as a nanocoating or an antimicrobial coating, onto the substrate 1090. Figure 14 includes a fabric (e.g., cotton, nylon, polyester, spandex, rayon, carpet, etc.), ceramic tile, engineered wood or laminate tile, and the non-contact deposition system is configured to deposit an ink or paint onto the substrate 1090 to form a pattern 1192 on the substrate 1090.

[0145] In some embodiments, the substrate includes a circuit board. For example, FIG. 12 illustrates a circuit board 990, e.g., a printed circuit board (PCB). The non-contact deposition system 10 is configured to deposit a conductive fluid, e.g., (conductive silver ink, polyethylenedioxythiophene (PEDOT), polypyrrole (PPy), etc.), a semiconductor fluid (e.g., hydrogenated amorphous silicon mixed with arsenic, selenium, and / or tellurium), or a piezoelectric fluid to print a circuit on the circuit board 990. For example, FIG. 12 illustrates an exemplary circuit having an electrode lead 994 between two contact points 996 printed on the circuit board 990 by the non-contact deposition system 10. In other embodiments, the non-contact deposition system 10 can also be used to deposit an ink or paint on the circuit board 990, e.g., to form a mark 992 on the circuit board 990. The non-contact deposition system 10 forms multiplexed electrical connections on the circuit board 990.

[0146] In some embodiments, the non-contact deposition system 10 can also print fruit and vegetable stickers or labels that are adhesively affixed to food products to provide various information (e.g., price, sell-by date, country of origin, etc.) For example, the non-contact deposition system 10 can be configured to deposit adhesive onto such labels and to print indicia thereon.

[0147] In some embodiments, the fluid comprises a polymer capable of changing its phase to a solid (e.g., a molten plastic that solidifies upon cooling or a liquid polymer that polymerizes upon exposure to air). In such embodiments, the non-contact deposition system 10 is configured to deposit multiple layers of the polymer onto the substrate 590 to form a three-dimensional object having a predetermined shape. For example, the motion mechanism 50 is configured to move the jetting assembly 500 along a predetermined path such that multiple layers of the polymer are sequentially deposited onto the substrate to form a three-dimensional object. In other words, the non-contact deposition system 10 is used for 3D printing.

[0148] In some embodiments, a jetting assembly is configured to receive multiple fluids. For example, FIG. 15 is a schematic diagram of a jetting assembly 1200 for use in the non-contact deposition system 10, according to one embodiment. The jetting assembly 1200 includes the microvalve 530 including the orifice plate 550 defining the orifice 560 therethrough, and the actuation beam 540 having the seal member 588 disposed at its tip overlapping the orifice 560, as previously described herein. Unlike the jetting assembly 500, the jetting assembly 1200 includes a carrier 1202 disposed on and coupled to the interposer 522 such that the orifice plate 550, the fluid manifold 514, the interposer 522, and the carrier 1202 collectively define the boundaries of the fluid reservoir 501.

[0149] The carrier 1202 includes a base portion 1204 disposed on and coupled to the interposer 522. A sidewall 1205 extends from the base portion 1204 away from the microvalve 530. Unlike the jetting assembly 500, however, the sidewall 1205 defines a first fluid channel 1211a and a second fluid channel 1211b through the carrier 1202. A first bulkhead 1208a is disposed at an inlet of the first fluid channel 1211a and a second bulkhead 1208b is disposed at an inlet of the second fluid channel 1211b. Additionally, a first filter 1213a and a second filter 1213b are disposed at the outlets of the first and second fluid channels 1211a and 1211b, respectively. A cover 1203 is disposed on the sidewall 1205 such that the partitions 1208a / b are disposed between and secured to the sidewall 1205 and the cover 1203 that define the fluid channels 1211a / b. Openings 1290a / b are formed in the cover 1203 and correspond to the inlets of the fluid channels 1211a / b.

[0150] A first fluid connector 51a is coupled to a first opening 1290a and a second fluid connection 51b is coupled (e.g., via a fluid coupler) to a second opening 1290b defined in the cover 1203 corresponding to the inlets of the first and second fluid channels 1211a and 1211b, respectively. The fluid connectors 51a / b include corresponding insertion needles 52a / b configured to pierce the septum 1208a / b and therethrough to be positioned into the fluid channels 1211a / b.

[0151] The first fluid connector 51a is configured to deliver a first fluid to the first fluid channel 1211a, and the second fluid connector 51b is configured to deliver a second fluid, different from the first fluid, to the second fluid channel 1211b. In this manner, the first fluid channel 1211a is configured to deliver the first fluid (e.g., ink or paint having a first color) and the second fluid channel 1211b is configured to deliver the second fluid (e.g., ink or paint having a second color, different from the first color) to the fluid reservoir 501. The jetting assembly 1200 is configured to selectively deposit the first fluid, the second fluid, or a mixture thereof formed in the fluid reservoir 501 onto the substrate (e.g., the substrate 590). For example, the first fluid is selectively delivered to the fluid reservoir 501 via the first fluid connector 51a and deposited onto a substrate (e.g., the substrate 590 or any other substrate described herein). Delivery of the first fluid through the first fluid connector 51a may be selectively stopped and then the second fluid delivered to the fluid reservoir 501 by the second fluid connector 51b. In other embodiments, each of the first and second fluid connectors 51a / b may simultaneously deliver the first and second fluids to the fluid reservoir 501 such that a mixture thereof is formed in the fluid reservoir 501. The mixture is then selectively deposited on the substrate by the microvalve 530. While FIG. 15 illustrates the carrier as including two fluid channels 1211a / b, any number of fluid channels may be provided within the carrier 1202 such that any number of fluids may be delivered to the fluid reservoir 501 for deposition individually on the substrate or for deposition of at least a mixture thereof on the substrate.

[0152] The jetting assembly 1200 can be used in any suitable application for depositing a fluid or mixture thereof onto a substrate. For example, in some embodiments, the substrate can include an artificial fingernail or a real nail. In such embodiments, the first fluid has a first nail color and the second fluid has a second nail color that is different from the first nail color. The jetting assembly 1200 is configured to deposit a predetermined pattern of the first color, the second color, or a mixture thereof onto a real or artificial nail. In other embodiments, the substrate can include a mixing palette (e.g., a palette for mixing art colors or hair dyes), and the first and second fluids can include powders, liquids, and / or gels that are mixed in the reservoir 501 or that are separately placed on the palette so that they can be mixed on the palette.

[0153] In some embodiments, the ejection assembly may include a predetermined supply of fluid and a pressurizing mechanism for pressurizing the fluid in the fluid reservoir such that an external fluid connector is not required. For example, the carrier of the ejection assembly may define an interior volume containing the fluid. The fluid may be contained in a compressible fluid container disposed within the interior volume and is under a constant pressure. In such embodiments, the carrier or a portion of the carrier is removable.

[0154] For example, Figure 16 is a schematic diagram of an ejection assembly 1300, according to one embodiment. The ejection assembly 1300 includes the microvalve 530 and a carrier 1310 coupled to the microvalve 530. The carrier 1310 has a carrier first portion 1302 coupled to the microvalve 530. The carrier first portion 1302 is substantially similar to the carrier 502 and will not be described in further detail herein. The carrier 1310 also has a carrier second portion 1320 disposed on and coupled to the carrier first portion 1302. The carrier second portion 1320 includes a carrier second portion housing 1322 that defines an interior volume 1324. A compressible fluid container 1326 (e.g., a flexible bag or pouch containing the fluid) is disposed within the interior volume. A needle 1321 may fluidly couple the compressible fluid reservoir 1326 to a fluid channel 1311 defined in the carrier first portion 1302, as previously described herein.

[0155] A portion of the interior volume surrounding the compressible fluid container 1326 is filled with compressed gas (e.g., compressed air or nitrogen). The compressed gas exerts a constant pressure on the compressible fluid container 1326, causing the compressible fluid container 1326 to deliver the pressurized fluid through the needle 1321 and the fluid channel 1311 to the fluid reservoir 501. When the microvalve 530 opens and fluid is expelled from the orifice 560, the compressible fluid container 1326 delivers more fluid to the fluid reservoir 501 due to the continued gas pressure acting on it. In this way, a separate fluid connector and pressurized supply of fluid can be eliminated from the non-contact deposition system including the jetting assembly 1300.

[0156] In some embodiments, the jetting assembly 1300 can be replaced with a new jetting assembly when the fluid contained in the carrier second part 1320 is depleted. In other embodiments, the carrier 1310 or a portion thereof can be removably coupled to the microvalve, and the microvalve can be replaced with a new carrier 1310 or a portion thereof when the fluid contained therein is depleted. For example, the carrier second part 1320 can be removably coupled to the carrier first part 1302, for example, via a snap-fit ​​mechanism (e.g., clips, ledges, detents, indentations, etc.), belts, screws, pins, etc. When all the fluid contained in the compressible fluid container 1326 is delivered to the fluid reservoir 510, a user can replace the carrier second part 1320 with a new part filled with fluid.

[0157] 17 is a schematic diagram of an ejection assembly 1400 according to another embodiment. The ejection assembly 1400 includes a microvalve 530 and a carrier 1410 coupled to the microvalve 530. The carrier 1410 includes a carrier first portion 1402 coupled to the microvalve 530. The carrier first portion 1402 may be substantially similar to the carrier 502 and therefore will not be described in further detail herein. The carrier 1410 also includes a carrier second portion 1420 disposed on and coupled to the carrier first portion 1402. The carrier second portion 1420 includes a carrier second portion housing 1422 defining an interior volume 1424 in which a compressible fluid reservoir 1426 is disposed. The needle 1421 can fluidly couple the compressible fluid reservoir 1426 to a fluid channel 1411 defined in the carrier first portion 1402 as previously described herein.

[0158] Unlike the carrier 1310, the carrier 1410 includes a biasing member 1428 disposed in an interior volume 1424 that is coupleable to a pressure plate 1429 in contact with the compressible fluid reservoir 1426. The biasing member 1428 urges the pressure plate 1429 towards the compressible fluid reservoir 1426 such that pressure is applied to the compressible fluid reservoir 1426. The pressure causes fluid to communicate through the fluid channel 1411 to the fluid reservoir 501.

[0159] 18 is a schematic diagram of an ejection assembly 1500 according to yet another embodiment. The ejection assembly 1500 includes a microvalve 530 and a carrier 1510 coupled to the microvalve 530. The carrier 1510 includes a carrier first portion 1502 coupled to the microvalve 530 and a carrier second portion 1520 coupled to the carrier first portion. The carrier first portion 1502 is substantially similar to the carrier first portion 1302. Unlike the carrier second portion 1320, the carrier second portion 1520 includes a diaphragm 1526 that divides an interior volume of the carrier second portion 1520 into a first volume 1524 and a second volume 1525. The first volume 1524 is filled with a compressed gas (e.g., compressed air or nitrogen) and the second volume 1525 is filled with a fluid. The compressed gas exerts pressure on the diaphragm 1526 , thereby exerting pressure on the fluid, which communicates with the fluid reservoir 501 .

[0160] While various embodiments of the injector assemblies shown herein include a single orifice, in other embodiments, an array of orifices can be defined in an orifice plate of the injector assembly in any suitable pattern. For example, FIG. 19 illustrates an embodiment of an orifice plate 1650 including an array of orifices defined in a circular pattern. FIG. 20 illustrates another embodiment of an orifice plate 1750 including an array of orifices 1760 defined in a semicircular pattern. FIG. 21 illustrates yet another embodiment of an orifice plate 1850 including an array of orifices 1860 defined in an elliptical pattern. FIG. 22 illustrates yet another embodiment of an orifice plate 1950 including an array of orifices 1960 defined in an octagonal pattern. FIG. 23 illustrates yet another embodiment of an orifice plate 2050 including an array of orifices 2060 defined in an asymmetric pattern.

[0161] In some embodiments, a microvalve including an orifice plate 1650, 1750, 1850, 1950, 2050 can include a single actuation beam for depositing fluid through each of the multiple orifices 1660, 1760, 1860, 1960, 2060. For example, a seal member (e.g., seal member 588) of an actuation beam (e.g., actuation beam 540) can be large enough to overlap and seal with all of the multiple orifices 1660, 1760, 1860, 1960, 2060 in a closed position of the microvalve, and fluid is ejected through each of the multiple orifices 1660, 1760, 1860, 1960, 2060 when the actuation beam is moved to an open position. In other embodiments, a dedicated actuation beam may be associated with a corresponding orifice of the plurality of orifices 1660, 1760, 1860, 1960, 2060 to selectively deposit through one or more of the orifices 1660, 1760, 1860, 1960, 2060 based on a particular application. Although Figures 19 through 23 illustrate particular patterns of orifices, in other embodiments the orifices can be defined in the orifice plate in any suitable pattern. All such arrangements should be considered within the scope of the present disclosure.

[0162] In some embodiments, any of the non-contact deposition systems described herein can be configured to deposit fluid onto a microwell plate. For example, FIG. 24 is a schematic diagram of a non-contact deposition system 10 with a microwell plate 2190 disposed on a platform 580. The microwell plate 2190 defines a plurality of microwells 2192 (e.g., arranged in a rectangular array). In some embodiments, the microwell plate 2190 can include an array of microwells 2192 (e.g., 6, 12, 24, 48, 96, 384, 1,536, 3,456, or 9,600 microwells) arranged in any suitable configuration, e.g., a 2:3 rectangular matrix. Each microwell 2192 can be configured to hold a volume of fluid, e.g., ranging from 10 nL to 10 mL.

[0163] In such embodiments, the fluid may include a solution of chemical, biochemical, and / or biological molecules, and the non-contact deposition system 10 may be configured to deposit a volume of the solution into each of the multiple microwells. For example, the fluid may include a solution used to perform an enzyme-linked immunosorbent assay (ELISA), a polymerase chain reaction (PCR), cell culture, filtration, separation, optical detection, reaction mixing, detection of microbial activity, and the like. In some embodiments, the non-contact deposition system 10 may include multiple jetting assemblies 500, each configured to deposit a separate solution into a corresponding microwell 2192. In other embodiments, the non-contact deposition system 10 may include a jetting assembly 1200 instead of the jetting assembly 500, or any other jetting assembly capable of depositing multiple fluids onto the microwell plate 1290.

[0164] In yet another embodiment, the deposition system including the injection assembly and the microvalve is configured to dispense a fluid that is a gas. Such fluids are collectively referred to as gaseous fluids. The type of gas is not limited and can be one or more of air, oxygen, nitrogen, carbon dioxide, hydrogen, or a noble gas. Examples of noble gases include one or more of helium, neon, argon, krypton, xenon, and radon. In some configurations, the gaseous fluid can include one or more liquid particles, for example, water in atomized form. However, in other configurations, the gaseous fluid does not include additional liquid particles. It is noted that even if the gaseous fluid does not include additional liquid particles, there may still be a measurable amount of liquid particles that are typical of the system, such as condensation of moisture in compressed air.

[0165] When the deposition system is configured to dispense a gaseous fluid, the pressure of the gaseous fluid in the reservoir of the jetting assembly or microvalve is greater than the pressure of the atmosphere surrounding the deposition system, jetting assembly, or microvalve. This causes the gaseous fluid to be expelled from the orifice into the atmosphere. In some embodiments, the pressure can be changed during operation to provide different applications or different operational effects for the same deposition system.

[0166] When the deposition system is configured to dispense a gaseous fluid, the deposition system can be incorporated into a variety of devices. For example, such a deposition system can be incorporated into one or more of a sorting device, a dehydrator, an air knife, an air jet cleaner, a liquid aeration, a spray coating, an optical cleaner, a surface cleaner, and a haptic interface device. Examples of haptic interface devices that include the deposition system described herein include one or more of a headset, a hand cover, a glove configured to fit a hand, a foot cover, a boot configured to fit a foot, a pair of pants, a shirt, a cover for any part of the skin, a head cover, and a face covering. Such a haptic interface device directs the gaseous fluid toward a wearer or user, thereby enabling the wearer or user to perceive a haptic sensation.

[0167] As used herein, the terms "about" and "approximately" generally mean plus or minus 10% of the stated value. For example, about 0.5 includes 0.45 and 0.55, about 10 includes 9 to 11, and about 1000 includes 900 to 1100.

[0168] As used herein, the terms "coupled," "connected," and the like, mean that two members are joined directly or indirectly to one another. Such joining may be static (e.g., permanent) or movable (e.g., removable or releasable). Such joining may be achieved by the two members, or the two members and any additional intermediate members, being integrally formed with one another as a single, unitary body, or by the two members, or the two members and any additional intermediate members being attached to one another.

[0169] References herein to the location of elements (e.g., "top", "bottom", "up", "down", etc.) are merely used to describe the orientation of the various elements in the figures. It should be noted that the orientation of the various elements may differ according to other exemplary embodiments, and such variations are intended to be included in the present disclosure.

[0170] The configuration and arrangement of elements as shown in the exemplary embodiments are illustrative only. While only a few embodiments of the present disclosure have been described in detail, those skilled in the art who review this disclosure will readily appreciate that many modifications are possible without substantially departing from the novel teachings and advantages of the described subject matter (e.g., changes in size, dimensions, structure, shape and proportions of various elements, parameter values, mounting arrangements, use of materials, colors, orientations, etc.). For example, elements shown as integrally formed may be composed of multiple parts or elements, the positions of elements may be reversed or otherwise changed, and the nature or number of individual elements or positions may be changed or varied.

[0171] Moreover, the term "exemplary" is used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "example" should not necessarily be construed as preferred or advantageous over other embodiments or designs (and such terms are not intended to imply that such embodiments are necessarily special or superlative examples). Rather, use of the word "exemplary" is intended to present concepts in a concrete manner. Accordingly, all such modifications are intended to be included within the scope of the present disclosure. Other substitutions, modifications, changes, and omissions can be made in the design, operating conditions, and arrangements of the preferred and other exemplary embodiments without departing from the scope of the appended claims.

[0172] It is important to note that the configurations and arrangements of the various embodiments presented herein are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those skilled in the art who review this disclosure will readily appreciate that many modifications are possible (e.g., changes in size, dimensions, structure, shape and proportions of various elements, parameter values, mounting arrangements, use of materials, colors, orientations, etc.) without substantially departing from the novel teachings and advantages of the subject matter described herein. Furthermore, it should be understood that features from one embodiment disclosed herein can be combined with features of other embodiments disclosed herein as one of ordinary skill in the art would understand. Other substitutions, modifications, changes and omissions may also be made in the design, operating conditions and arrangements of the various exemplary embodiments without departing from the scope of the present invention.

[0173] Although the specification contains many specific implementation details, these should not be construed as limitations on the scope of the invention or what may be claimed, but rather as descriptions of features specific to particular implementations of a particular invention. Certain features described in this specification in the context of separate implementations may also be implemented in combination in a single implementation. Conversely, various features described in the context of a single implementation may also be implemented in multiple implementations separately or in any suitable subcombination. Furthermore, even if features are described above as acting in a particular combination and initially claimed as such, one or more features from a claimed combination may in some cases be carved out of the combination, and the claimed combination may be directed to a subcombination or a variation of the subcombination.

Claims

1. 1. A non-contact deposition system having an injection assembly, The injection assembly includes: At least one microvalve, each microvalve comprising: an orifice plate including a first surface and a second surface, the orifice plate having an orifice extending from the first surface to the second surface; a spacing member disposed on the first surface, the spacing member offset from the orifice; and a valve seat surrounding the orifice, the valve seat defining an opening in fluid communication with the orifice; an actuation beam disposed on the spacing member, the actuation beam extending from the spacing member toward the orifice, the actuation beam including a layer of piezoelectric material, the actuation beam being movable between a closed position and an open position by applying an electrical signal to the layer of piezoelectric material; At least one microvalve having a fluid manifold coupled to the microvalve and defining a fluid reservoir containing pressurized fluid around the actuation beam; having when no electrical signal is applied to the layer of piezoelectric material, the actuation beam is in the closed position and a seal member surface of the seal member contacts the orifice plate to seal the orifice and close the microvalve, and in the open position, fluid is ejected from the orifice towards and deposited on a substrate, and a throw of the ejection assembly is configurable based on modulation of an actuation frequency of the actuation beam. Non-contact deposition system.

2. 10. The non-contact deposition system of claim 1 further comprising: a platform spaced from the jetting assembly and configured to receive a substrate upon which the fluid is deposited; a motion mechanism coupled to at least one of the jetting assembly or the platform and configured to provide three-dimensional motion to the jetting assembly or the platform to deposit the fluid at a predetermined location on the substrate; and A non-contact deposition system comprising:

3. 3. The non-contact deposition system of claim 2, wherein the substrate comprises a circuit board and the fluid comprises a conductive fluid, a semiconducting fluid, or a piezoelectric fluid.

4. 3. The non-contact deposition system of claim 2, the substrate comprises a slide, the fluid comprises a solution of at least one of a chemical, a biochemical, or a biomolecule, and the non-contact deposition system is configured to deposit an array of droplets of the solution onto the slide; Non-contact deposition system.

5. 3. The non-contact deposition system of claim 2, The non-contact deposition system, wherein the substrate has a microwell plate defining a plurality of microwells, the fluid comprises a solution of at least one of a chemical, a biochemical, or a biomolecule, and the non-contact deposition system is configured to deposit a volume of the solution into each of the plurality of microwells.

6. 3. The non-contact deposition system of claim 2, The fluid includes a polymer, and the non-contact deposition system is configured to deposit multiple layers of the polymer to form a three-dimensional object having a predetermined shape.

7. 3. The non-contact deposition system of claim 2, A non-contact deposition system, wherein the fluid comprises one of an ink, a paint, a solvent, a biological solution, a biochemical solution, a chemical solution, a physiological fluid, an adhesive, a powder, a gel, a dye, a cell stain, a colloidal solution, an emulsion, or a suspension.

8. 2. The non-contact deposition system of claim 1, A non-contact deposition system, wherein the fluid is a gaseous fluid.

9. A tactile interface device comprising the non-contact deposition system of claim 1.

10. A non-contact deposition system having an injection assembly. The injection assembly includes: At least one microvalve, an orifice plate including a first surface and a second surface, the orifice plate having an orifice extending from the first surface to the second surface; an actuation beam spaced apart from the orifice plate, the actuation beam including a base portion and a cantilever portion extending from the base portion toward the orifice such that the cantilever portion overlaps the orifice, the actuation beam being movable between a closed position and an open position; a seal structure having a seal member disposed at the overlapping portion of the cantilever portion; At least one microvalve having a fluid manifold coupled to the microvalve and defining a fluid reservoir having pressurized fluid about the actuation beam; having when the actuation beam is in the closed position, the cantilever portion is arranged to configure the orifice such that the seal structure closes the microvalve, and when in the open position, the fluid is dispensed from the orifice towards the substrate and deposited on the substrate, a throw of the ejection assembly being configurable based on modulation of an actuation frequency of the actuation beam. Non-contact deposition system.

11. 11. The non-contact deposition system of claim 10 further comprising: a platform positioned at a distance from the jet assembly and configured to receive the substrate; a motion mechanism coupled to at least one of the jetting assembly or the platform and configured to provide three-dimensional motion to the jetting assembly or the platform to deposit the fluid at a predetermined location on the substrate; and A non-contact deposition system comprising:

12. 12. The non-contact deposition system of claim 11, wherein the substrate comprises a circuit board and the fluid comprises a conductive fluid, a semiconductive fluid, or a piezoelectric fluid.

13. 12. The non-contact deposition system of claim 11, The non-contact deposition system, wherein the substrate comprises a slide, the fluid comprises a solution of at least one of a chemical or a biomolecule, and the non-contact deposition system is configured to deposit an array of droplets of the solution onto the slide.

14. 12. The non-contact deposition system of claim 11, The non-contact deposition system, wherein the substrate has a microwell plate defining a plurality of microwells, the fluid comprises a solution of at least one of a chemical, a biochemical, or a biomolecule, and the non-contact deposition system is configured to deposit a volume of the solution into each of the plurality of microwells.

15. 12. The non-contact deposition system of claim 11, The fluid includes a polymer, and the non-contact deposition system is configured to deposit multiple layers of the polymer to form a three-dimensional object having a predetermined shape.

16. 12. The non-contact deposition system of claim 11, A non-contact deposition system, wherein the fluid comprises one of an ink, a paint, a solvent, a biological solution, a biochemical solution, a chemical solution, a physiological fluid, an adhesive, a powder, a gel, a dye, a cell stain, a colloidal solution, an emulsion, or a suspension.

17. 11. The non-contact deposition system of claim 10, The fluid is a gaseous fluid; Non-contact deposition system.

18. A tactile interface device comprising the non-contact deposition system of claim 10.

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