Floor panel and manufacturing method thereof

Abstract

To provide a thin floor panel which enables the temperature of its upper surface to rise uniformly in a short time and has high heating efficiency.SOLUTION: A floor panel is formed by laminating a base material, an insulating layer and a heat insulation layer in this order, has wiring made of a plating layer formed on a surface opposite to the heat insulation layer of the insulating layer, and generates heat by energizing the wiring.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a floor panel and a manufacturing method thereof. [Background technology]

[0002] In recent years, buildings such as buildings have widely adopted double floors, called OA floors or free access floors, which have a space between the foundation floor and the upper floor for wiring for office automation equipment. When floor heating is performed in buildings with such double floors, floor heaters installed under the floor panel (upper floor) have been used. However, such floor heaters have problems such as reduced heating efficiency due to heat dissipation to the foundation floor, it takes a long time for heat to be transmitted to the upper surface of the upper floor and there is a large temperature unevenness on the upper surface, and the space between the foundation floor and the upper floor becomes narrower due to the installation of the heater, and improvements to these problems have been required.

[0003] Patent Document 1 describes a floor panel with heater function that constitutes a free access floor, in which the four sides of the upper surface of the panel base are formed in a convex shape and a frame body is provided to house a sheet heater and a heat equalizing plate, and the heat equalizing plate is housed in the frame body without being fixed, and describes that a carbon heater is preferable as the sheet heater. Patent Document 1 describes that such a floor panel has the following effects: since the sheet heater is attached to the surface (upper surface) of the floor panel, the floor surface is efficiently heated; the heat equalizing plate that spreads the heat of the heater evenly also protects the sheet heater and prevents damage to the heater; since the heat equalizing plate is located in the frame body of the floor panel and is housed without being fixed, distortion due to the heat of the heater can be prevented from occurring in the heat equalizing plate, and a floor panel without unevenness or wobbling can be provided. However, the floor panel has a still low temperature rise rate on the upper surface of the floor panel, and the temperature difference between the center and the periphery is large. Furthermore, since the floor panel described in Patent Document 1 has a sheet heater, it is thicker than a general floor panel without a heater. Therefore, when using the two in combination, it is necessary to adjust the thickness during manufacturing or construction so as to avoid the occurrence of steps, which increases costs. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2014-101718 A Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made to solve the above-mentioned problems, and aims to provide a thin floor panel whose upper surface heats up uniformly in a short period of time and has high heating efficiency, as well as a simple method for manufacturing the same. [Means for solving the problem]

[0006] The above problem is solved by providing a floor panel in which a base material, an insulating layer, and a heat-insulating layer are laminated in that order, wiring made of a plating layer is formed on the surface of the insulating layer facing the heat-insulating layer, and heat is generated by passing electricity through the wiring.

[0007] The heat insulating layer is preferably made of wood material. The base material is also preferably made of steel plate. The insulating layer is preferably a resin layer, more preferably includes an electrodeposition coating layer, and further preferably includes a powder coating layer, and the base material, the electrodeposition coating layer, and the powder coating layer are laminated in this order.

[0008] It is preferable that the interface between the insulating layer and the plating layer is roughened. It is also preferable that grooves are formed in the surface of the insulating layer, and that the plating layer is filled in the grooves.

[0009] The above problem can also be solved by providing a method for manufacturing the floor panel, which comprises painting a resin on the surface of the base material to form the insulating layer, performing electroless plating to form the plating layer on the surface of the insulating layer, and laminating the base material and the insulating material.

[0010] In the manufacturing method, it is preferable that a portion of a surface of the insulating layer is roughened by irradiating the portion with a pulsed laser, and the electroless plating is performed to form the plating layer on the surface of the portion.

[0011] The above problem can also be solved by providing a method for manufacturing the floor panel, in which wiring consisting of a plating layer is formed on the surface of a resin film by performing electroless plating, and the base material, the resin film and the insulating material are laminated. Effect of the Invention

[0012] The floor panel of the present invention has a high heating efficiency because the temperature of the entire upper surface is raised uniformly in a short time and heat radiation from the lower surface to the foundation floor, etc. is suppressed. In addition, the floor panel is easy to make thin because heat is generated by wiring made of an extremely thin plating layer. According to the manufacturing method of the present invention, such a floor panel can be easily manufactured. [Brief description of the drawings]

[0013] [Figure 1] FIG. 2 is an exploded oblique view of the floor panel of the first embodiment, viewed obliquely from below. [Diagram 2] This is an exploded oblique view of the floor panel of the first embodiment, seen from diagonally above. [Diagram 3] FIG. 2 is a diagram showing a floor heater of Comparative Example 1. [Figure 4] 13 is a thermography image of the upper surface of the floor panel 60 minutes after the start of energization in Example 1 and Comparative Example 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The floor panel of the present invention is a laminate of a base material, an insulating layer, and a heat-insulating layer in this order, and wiring made of a plating layer is formed on the surface of the insulating layer facing the insulating layer, and heat is generated by passing electricity through the wiring. A major feature of the present invention is that extremely thin wiring made of the plating layer is directly formed on the surface of the insulating layer. Since the wiring made of the insulating layer and the plating layer is extremely thin, the floor panel of the present invention has the same thickness as existing floor panels without a heating function. Therefore, when the floor panel of the present invention is used as the upper floor of a double floor such as an OA floor or a free access floor, a large space is secured between the base floor and the upper floor. In addition, the heat generated by passing electricity through the wiring is transmitted to the entire upper surface of the base material in a short time, and the heat dissipation to the base floor is suppressed by the insulating layer, so that the heating efficiency is high.

[0015] Fig. 1 is an exploded perspective view of a floor panel of Example 1, which will be described later, seen from diagonally below, and Fig. 2 is an exploded perspective view of the floor panel of Example 1, seen from diagonally above. Hereinafter, explanation will be given with reference to Figs. 1 and 2. From the viewpoint of high durability and thermal conductivity, the base material 2 is preferably a metal plate such as a steel plate, a copper plate, an aluminum plate, or a stainless steel plate, and among these, a steel plate is more preferable. The thickness of the base material 2 is usually 0.1 to 10 mm.

[0016] From the viewpoint of improving corrosion resistance, it is preferable that a zinc plating layer is formed on the surface of the steel sheet. The zinc plating layer may be formed on either the upper surface or the lower surface of the steel sheet, or may be formed on both surfaces. It is preferable that the zinc plating layer is formed on the upper surface of the steel sheet. When an electrodeposition coating layer, which will be described later, is formed on the lower surface of the steel sheet, it is preferable that no zinc plating layer is formed on the lower surface. The zinc plating layer can be formed by a general hot-dip galvanizing method.

[0017] The insulating layer 3 is disposed under the base material 2. The type of the insulating layer 3 is not particularly limited as long as it can prevent leakage from the wiring 4. Examples of the insulating layer 3 include a resin layer, a ceramic layer, and a glass layer (glass sheet, glass coat, etc.), and among these, a resin layer is preferred. Examples of resins contained as a main component in the resin layer include polyimide, epoxy polyester, polyvinyl chloride, polyolefin (PE, PP, etc.), polyamide, polyester (PET, etc.), polyurethane, epoxy resin, acrylic, liquid crystal polymer, fluororesin (PTFE, PFA, etc.), polycarbonate, and among these, polyimide and epoxy polyester are preferred, and polyimide is more preferred. Here, the main component means a component contained in the resin layer at 50% by mass or more. The resin layer can be formed by painting a resin on the base material 2, as described later. Also, as described later, a resin film formed in advance can be used as the resin layer.

[0018] The thickness of the insulating layer 3 is not particularly limited, but is preferably 5 to 2000 μm. If the thickness of the insulating layer 3 is less than 5 μm, the insulating properties may be insufficient. The thickness is more preferably 10 μm or more, and even more preferably 20 μm or more. On the other hand, if the thickness exceeds 2000 μm, the rate of temperature rise on the upper surface of the floor panel 1 may decrease. The thickness is more preferably 1000 μm or less, even more preferably 500 μm or less, particularly preferably 500 μm or less, and most preferably 300 μm or less.

[0019] The wiring 4 made of a plating layer is formed on the surface of the insulating layer 3 facing the heat insulating layer 5. In this way, by forming a thin plating layer directly on the surface of the insulating layer 3, the temperature rise rate of the upper surface of the floor panel 1 is improved and the floor panel 1 can be made thinner. The floor panel 1 of the present invention generates heat by passing electricity through the wiring 4 made of a plating layer. Since the amount of heat generated at this time is proportional to the square of the current and the electrical resistance of the wiring, it is preferable that the plating layer has a certain degree of electrical resistance and is excellent in heat resistance. From this viewpoint, it is preferable that the plating layer is at least one selected from the group consisting of nickel, zinc, cobalt, iron, platinum, tin, lead, iridium, rhodium, chromium, bismuth, cadmium, palladium, indium, gold, tungsten, molybdenum, and alloys thereof. The alloy referred to here means one containing 50 mass% or more of at least one of the above metal elements. An example of an alloy that is preferably used is nichrome.

[0020] From the viewpoint of the balance between electrical resistance and heat resistance, it is more preferable that the plating layer is at least one selected from the group consisting of nickel, zinc, cobalt, iron, platinum, tin, and alloys thereof. From the viewpoint of easily forming the plating layer by an electroless plating method, it is even more preferable that the plating layer is at least one selected from the group consisting of nickel, cobalt, iron, and alloys thereof.

[0021] The thickness of the plating layer is preferably 0.1 to 500 μm. If the thickness of the plating layer is less than 0.1 μm, there is a risk of disconnection. The thickness of the plating layer is more preferably 0.5 μm or more, even more preferably 1 μm or more, and particularly preferably 2 μm or more. On the other hand, if the thickness of the plating layer exceeds 500 μm, there is a risk of an increase in the manufacturing cost of the floor panel 1. The thickness of the plating layer is more preferably 250 μm or less, even more preferably 100 μm or less, particularly preferably 50 μm or less, and most preferably 30 μm or less.

[0022] The width of the wiring 4 made of the plating layer is preferably 0.2 to 50 mm. If the width is less than 0.2 mm, there is a risk of disconnection. The width is more preferably 0.5 mm or more, and even more preferably 1 mm or more. On the other hand, if the width exceeds 50 mm, there is a risk that the necessary plating thickness cannot be ensured. The width is more preferably 20 mm or less, and even more preferably 10 mm or less.

[0023] The pattern of the wiring 4 made of the plating layer formed on the surface of the insulating layer 3 is not particularly limited, but from the viewpoint of uniformly increasing the temperature of the entire upper surface of the floor panel 1, it is preferable that the wiring 4 is formed on almost the entire surface of the floor panel 1. The wiring 4 made of the plating layer is easily formed at any position on the surface of the insulating layer 3.

[0024] A heat insulating layer 5 is disposed below the insulating layer 3. The type of the heat insulating layer 5 is not particularly limited as long as it has high heat insulating properties and strength sufficient to support a load from above. Heat insulating materials such as wood, mortar, resin, ceramics, glass, and gypsum are used as the heat insulating layer 5, and wood is preferred because of its high heat insulating properties, strength, and environmental friendliness. Examples of the wood material include particle board, plywood, MDF (medium density fiberboard), and HDF (high density fiberboard), and among these, particle board is preferred.

[0025] The thickness of the insulating layer 5 is usually 1 to 50 mm. If the thickness is less than 1 mm, the insulating properties and strength of the obtained floor panel 1 may be insufficient. The thickness is preferably 2 mm or more, and more preferably 3 mm or more. On the other hand, if the thickness exceeds 50 mm, the manufacturing cost of the floor panel 1 may increase, and the space between the floor panel 1 and the foundation floor may become narrow. The thickness is preferably 30 mm or less, and more preferably 20 mm or less.

[0026] The heat insulating layer 5 may have a hole 9 formed for connecting the connection portion 8 of the wiring 4 on the surface of the insulating layer 3 to an external power source, a thermostat, a fuse, etc., or for installing a thermostat, a fuse, or a thermistor.

[0027] From the viewpoint of further improving the strength and durability of the floor panel 1, it is preferable that a protective layer 6 is disposed under the heat insulating layer 5. A metal plate is preferable as the protective layer 6. As the metal plate, the above-mentioned metal plate for use as the base material 2 is used. When a steel plate having a zinc plating layer formed on its surface is used as the metal plate, it is preferable that the zinc plating layer is formed on the underside of the steel plate. The protective layer 6 may have a hole 10 formed therein for connecting the connection portion 8 of the wiring 4 on the surface of the insulating layer 3 to an external power source, a thermostat or fuse, a thermistor, or the like.

[0028] As long as the effects of the present invention are not impaired, the floor panel 1 may have layers other than the base material 2, insulating layer 3, heat-insulating layer 5, and protective layer 6. In order to make the floor panel 1 thinner, it is preferable that it does not have the other layers.

[0029] Although there is no particular limitation on the method for manufacturing the floor panel 1 of the present invention, a preferred method is to coat the surface of the base material 2 with a resin to form the insulating layer 3, and then perform plating to form the plating layer 4 on the surface of the insulating layer 3, thereby laminating the base material 2 and the insulating material. As the plating method, electroless plating, which will be described later, is preferred.

[0030] From the viewpoint of improving the adhesion between the base material 2 and the insulating layer 3, the base material 2 may be pretreated before painting. Examples of the pretreatment include chemical conversion treatment, zinc plating layer removal treatment, etching treatment, blasting treatment, and primer treatment. It is preferable to form irregularities on the surface of the base material 2 by the pretreatment.

[0031] The method of coating the surface of the substrate 2 with a resin is not particularly limited, and examples thereof include electrodeposition coating, powder coating, spray coating, and dip coating. Electrodeposition coating and powder coating are preferred, and electrodeposition coating is more preferred. Electrodeposition coating is a method in which a voltage is applied to the substrate 2 and an electrode in an electrolyte solution containing the resin to be coated or its precursor, thereby adhering the resin or its precursor to the surface of the substrate 2, and then heat-treating the substrate as necessary to form a coating film. Powder coating is a method in which a powdered resin is attached to the substrate 2 by static electricity, and then heat-treating the substrate as necessary to form a coating film. General conditions are adopted as conditions for electrodeposition coating and powder coating. These methods may be used in combination. Examples of the resin to be coated include those mentioned above as the resin contained in the resin layer.

[0032] It is preferable that the insulating layer 3 includes a coating layer formed by the coating method. By arranging the wiring 4 consisting of the plating layer through a thin coating layer formed directly on the surface of the base material 2, the temperature rise rate of the upper surface of the floor panel 1 is further improved. It is more preferable that the insulating layer 3 consists only of the coating layer. It is also preferable that the coating layer includes at least one of an electrodeposition coating layer and a powder coating layer, and it is more preferable that the coating layer consists only of at least one of an electrodeposition coating layer and a powder coating layer. From the viewpoint of forming the insulating layer 3 of a uniform thickness, it is preferable that the coating layer includes an electrodeposition coating layer. At this time, it is more preferable that the electrodeposition coating layer is formed on the surface of the base material 2. As the resin contained in the electrodeposition coating layer, polyimide, epoxy resin, acrylic, polyurethane, polyamide, and fluororesin are preferable. From the viewpoint of further improving the insulation, it is preferable that the insulating layer 3 includes an electrodeposition coating layer and a powder coating layer, and the base material 2, the electrodeposition coating layer, and the powder coating layer are laminated in this order. As the resin contained in the powder coating layer, epoxy-polyester, epoxy resin, polyester, polyurethane, polyamide, and fluororesin are preferable.

[0033] When the insulating layer 3 includes an electrodeposition coating layer and a powder coating layer, the thickness of the electrodeposition coating layer is preferably 5 to 500 μm. If the thickness is less than 5 μm, the insulating properties may be reduced. The thickness is more preferably 10 μm or more, and even more preferably 20 μm or more. On the other hand, if the thickness exceeds 500 μm, the rate of temperature rise on the upper surface of the floor panel 1 may be reduced. The thickness is more preferably 300 μm or less, even more preferably 200 μm or less, particularly preferably 150 μm or less, and most preferably 100 μm or less.

[0034] When the insulating layer 3 includes an electrodeposition coating layer and a powder coating layer, the thickness of the powder coating layer is preferably 10 to 1500 μm. If the thickness is less than 10 μm, the insulating properties may be reduced. The thickness is more preferably 50 μm or more, and even more preferably 100 μm or more. On the other hand, if the thickness exceeds 1500 μm, the rate of temperature rise on the upper surface of the floor panel 1 may be reduced. The thickness is more preferably 1000 μm or less, even more preferably 500 μm or less, particularly preferably 300 μm or less, and most preferably 200 μm or less.

[0035] By plating, wiring 4 made of the plating layer is formed on the surface of the insulating layer 3. Although the method of forming wiring 4 is not particularly limited, a method of irradiating a partial region of the surface of the insulating layer 3 with a laser to roughen the surface of the region, and then performing electroless plating to form wiring 4 made of the plating layer on the surface of the region is preferred, in terms of ease of adaptation to various wiring patterns and reduced occurrence of defective products.

[0036] The surface of the insulating layer 3 in an area where the wiring 4 is to be formed is roughened by irradiating the area with a laser. In the floor panel 1, it is preferable that the interface between the insulating layer 3 and the plating layer is roughened. By roughening the interface, the adhesion between the insulating layer 3 and the plating layer is improved.

[0037] Although the method of laser irradiation is not particularly limited, it is preferable to irradiate the region with a pulsed laser, since this can efficiently roughen the surface of the insulating layer 3. Generally, the pulse width (seconds) of the pulsed laser is 1×10 -18 1×10 seconds or more -4 The time is 1 to 10,000 kHz, and the average output at the processing point is 0.01 to 1,000 W. The type of laser is not particularly limited, and solid-state lasers such as YAG lasers, fiber lasers, and semiconductor lasers; and gas lasers such as carbon dioxide lasers and excimer lasers can be used. The wavelength of the pulse laser is not particularly limited, and can be appropriately set depending on the type of insulating layer 3, and is usually 100 to 12,000 nm.

[0038] It is preferable that grooves are formed on the surface of the insulating layer 3 and that the plating layer is filled into the grooves. This makes the wiring 4 made of the plating layer less likely to break and further increases the rate of temperature rise on the upper surface of the floor panel 1. There is no particular limitation on the method of forming the grooves, but an example is a method in which a laser is irradiated onto the surface of the insulating layer 3 to form grooves on the surface of the insulating layer 3. It is preferable that a laser is irradiated onto the surface of the coating layer 3 to simultaneously roughen the interface of the insulating layer 3 and form the grooves.

[0039] The depth of the groove is preferably 0.1 to 1000 μm. If the depth of the groove is less than 0.1 μm, the plating layer may easily come off from the groove. The depth of the groove is more preferably 1 μm or more, and even more preferably 5 μm or more. On the other hand, if the depth of the groove exceeds 1000 μm, the cost of forming the groove may increase. The depth of the groove is more preferably 300 μm or less, and even more preferably 100 μm or less.

[0040] The thickness of the insulating layer 3 at the bottom of the groove is preferably 5 to 1000 μm. If the thickness is less than 5 μm, holes may be formed in the insulating layer 3, resulting in loss of insulation. The thickness is more preferably 20 μm or more, and even more preferably 30 μm or more. On the other hand, if the thickness exceeds 1000 μm, the temperature rise rate of the upper surface of the floor panel 1 may decrease. The thickness is more preferably 500 μm or less, even more preferably 400 μm or less, particularly preferably 300 μm or less, and most preferably 200 μm or less. When the insulating layer 3 includes an electrodeposition coating layer and a powder coating layer, and the base material 2, the electrodeposition coating layer, and the powder coating layer are laminated in this order, it is preferable that the bottom of the groove does not reach the electrodeposition coating layer. That is, it is preferable that the insulating layer 3 at the bottom of the groove includes an electrodeposition coating layer and a powder coating layer, and the plating layer is formed on the surface of the powder coating layer.

[0041] By performing electroless plating on the region of the insulating layer 3 irradiated with the laser, wiring 4 made of the plating layer is formed on the surface of the region. An electroless plating catalyst is attached to the surface of the insulating layer 3. There is no particular limitation on the electroless plating catalyst, and it may be one that contains a metal element that has a catalytic effect on the electroless plating solution. Examples of the metal element include palladium (Pd), silver (Ag), copper (Cu), nickel (Ni), aluminum (Al), iron (Fe), cobalt (Co), zinc (Zn), gold (Au), platinum (Pt), and tin (Sn). These metal elements can be appropriately selected depending on the type of electroless plating solution. Then, the insulating layer 3 is treated with an aqueous solution containing the above-mentioned metal element, and then treated with an aqueous solution containing a reducing agent to activate the electroless plating catalyst.

[0042] Before plating, it is preferable to selectively remove the catalyst attached to the portion not irradiated with the laser or selectively deactivate the catalyst. As a specific method for this, the methods described in

[0044] to

[0050] of JP 2020-113469 A are adopted.

[0043] By performing electroless plating, the plating layer is formed in the area irradiated with the laser. Electroless plating may be performed multiple times. Also, electrolytic plating may be performed after electroless plating. When plating is performed multiple times, the types of plating layers formed may be the same or different. For example, in consideration of the solderability between the wiring 4 and the terminal, a copper plating layer, a gold plating layer, a silver plating layer, a tin plating layer, or the like may be further formed on the connection portion 8 where the terminal is connected in the wiring 4.

[0044] As a method for forming wiring 4 made of the plating layer on the surface of the insulating layer 3 by electroless plating, a method is also preferred in which the surface of the insulating layer 3 is masked so that only the portion where the plating layer is to be formed is exposed, and then electroless plating is performed to form wiring 4 made of the plating layer. In this case, from the viewpoint of reducing costs, it is preferable that the insulating layer 3 is made of only an electrodeposition coating layer.

[0045] After forming the wiring 4 made of the plating layer on the surface of the insulating layer 3, a protective layer may be formed on the surfaces of the insulating layer 3 and the wiring 4. In this case, from the viewpoint of protecting the wiring 4, it is preferable that the thickness of the plating layer is the same as the depth of the groove, or that the thickness of the plating layer is smaller than the depth of the groove. The type of protective layer formed on the surfaces of the insulating layer 3 and the wiring 4 is not particularly limited, and examples of the insulating layer 3 include those mentioned above, and among them, a resin layer and a glass layer (glass sheet, glass coat, etc.) are preferable.

[0046] After forming wiring 4 made of the plating layer on the surface of the insulating layer 3, the base material 2 and the insulating material are laminated together. At this time, the insulating layer 3 formed on the base material 2 and the insulating material are laminated so as to face each other. It is preferable to adhere the insulating layer 3 and the insulating material to each other using an adhesive, an adhesive sheet, or the like.

[0047] When the protective layer 6 is disposed under the heat insulating layer 5, it is preferable to adhere the two to each other using an adhesive, an adhesive sheet, or the like. From the viewpoint of the strength and durability of the floor panel 1, it is also preferable that the base material 2 and the protective layer 6 are integrated together. One method for integrating the base material 2 and the protective layer 6 is to fold the peripheral portion 7 of at least one of the base material 2 and the protective layer 6 and crimp the peripheral portions together to integrate the two.

[0048] As a manufacturing method for the floor panel of the present invention, a method is also preferred in which electroless plating is performed to form wiring consisting of the plating layer on the surface of a resin film, and then the base material, the resin film and the insulating material are laminated.

[0049] Resins used for the resin film include those mentioned above as resins used for the insulating layer 3, and among them, polyimide, polyester (PET), polyolefin, epoxy, polyester, and fluororesin (PTFE) are preferred. As a method for forming wiring made of the plating layer on the surface of the resin film, the above-mentioned method for forming the plating layer on the surface of the insulating layer (painted layer) is adopted. The base material, the resin film on which the wiring made of the plating layer is formed, and the heat insulating material are laminated. At this time, the surface of the resin film on which no wiring is formed is opposed to the base material, and the surface of the resin film on which the wiring is formed is opposed to the heat insulating material. The base material and the resin film are preferably bonded with an adhesive or an adhesive sheet.

[0050] The floor panel 1 thus obtained generates heat by connecting a power source, a thermostat, a fuse, etc. to the connection portion 8 of the wiring 4 and then energizing the wiring 4. The wiring 4 can be arranged on the entire surface of the floor panel 1, and the wiring 4 made of the insulating layer 3 and the plating layer is extremely thin, and the distance from the wiring 4 to the upper surface of the floor panel 1 is short, so that the entire upper surface of the floor panel 1 rises in temperature in a short time. In addition, the heat insulating layer 5 suppresses heat dissipation to the foundation floor. Therefore, the floor panel 1 has a very high heating efficiency. Furthermore, the floor panel 1 has a thickness equivalent to that of an existing floor panel without a heater function. Therefore, when the floor panel 1 is used in combination with the existing floor panel 1, there is no need to adjust the thickness during manufacture or construction so as not to cause a step, and since the floor panel 1 is compatible with the existing floor panel, the floor panel 1 can be freely laid out while suppressing an increase in cost. In addition, the layout can be easily changed after construction. The floor panel 1 of the present invention is suitable for use as floors of buildings such as buildings and houses, for example, the upper floor of a double floor such as an OA floor or a free access floor, and the floor of a washroom or bathroom. EXAMPLES

[0051] The present invention will now be described in more detail with reference to examples.

[0052] Example 1 A substrate 2 (510 mm on each side, 0.5 mm thick) made of a roughly square zinc-plated steel plate with zinc-plated layers formed on both surfaces was etched to form a concave-convex shape on one side, and then polyimide was electrodeposited to form an electrodeposition coating layer with a thickness of 50 μm on the surface of the substrate. Furthermore, an epoxy-polyester powder paint was powder-coated on the surface of the electrodeposition coating layer to form a powder coating layer with a thickness of 70 to 150 μm. In this way, an insulating layer 3 consisting of the electrodeposition coating layer and the powder coating layer was formed on the surface of the substrate 2.

[0053] Using a fiber laser marker "ML-7350DL-3D" manufactured by Amada Weld Tech Co., Ltd., the surface of the powder coating layer was irradiated with laser (wavelength: 1064 nm, frequency: 50 kHz, output: 20 W) to form a groove pattern with a depth of 13 μm and a width of 1.5 mm and roughen the bottom surface of the groove.

[0054] By performing electroless plating (pretreatment, electroless plating catalyst adhesion treatment, catalyst removal treatment, activation treatment, and electroless Ni plating treatment) using the method described in the examples of JP 2020-113469, wiring 4 consisting of an electroless Ni plating layer having a thickness of 11.5 μm and a width of 1.5 μm was formed on the bottom surface of the groove.

[0055] The surface of the base material 2 on which the wiring 4 was formed and a particle board (insulation layer 5) of a substantially square shape (length of one side: 470 mm, thickness: 18 mm) were bonded together using an adhesive so that they faced each other. In addition, the surface of the particle board on which the base material 2 was not bonded was bonded to a substantially square galvanized steel plate (protective layer 6) whose peripheral portion 7 was bent upward, using an adhesive. Furthermore, the peripheral portions of the base material 2 and the galvanized steel plate were crimped together to integrate the two. In this way, the floor panel 1 shown in Figs. 1 and 2 was obtained. A tile carpet was laminated over the entire upper surface of the floor panel 1, and a power source, a thermostat, and a fuse were connected to the connection portion 8 of the wiring 4 of the floor panel 1. Electricity was applied to the wiring 4 at a power of 50 W (200 V (AC) with the resistance value between both ends of the wiring set to 800 Ω), and the temperature change at this time was measured by thermography. It took 12 minutes for the temperature in the center of the tile carpet to rise by 10°C. The thermography image 60 minutes after the start of power supply is shown in Figure 4 (right side of Figure 4). As can be seen from Figure 4, it was confirmed that the temperature of the entire tile carpet was raised uniformly. When the temperature of the center of the floor carpet was controlled at 38°C and power was supplied for 12 hours, power consumption was reduced by more than 30% compared to when the floor heater of Comparative Example 1 described later was used.

[0056] Example 2 A 50 μm thick electrodeposition coating layer was formed by electrodeposition coating polyimide on the surface of the electrodeposition coating layer not formed on the substrate (length of one side: 500 mm, thickness: 0.5 mm) made of a substantially square zinc-plated steel plate with a zinc-plated layer formed only on one side. The surface of the electrodeposition coating layer was masked with silicone rubber so that the area where the wiring pattern was to be formed was exposed. The masked substrate was subjected to electroless plating in the same manner as in Example 1, except that the catalyst removal treatment was not performed, to form wiring made of an electroless Ni plating layer with a thickness of 11.5 μm and a width of 1.5 mm on the surface of the electrodeposition coating layer. The wiring pattern formed at this time was the same as in Example 1. The substrate, the particle board (insulation layer), and the zinc-plated steel plate (protective layer) were bonded together in the same manner as in Example 1, and then caulked to obtain a floor panel. When electricity was applied to the obtained floor panel in the same manner as in Example 1, it took 12 minutes for the temperature of the center of the tile carpet laminated on the upper surface of the floor panel to rise by 10°C. When the temperature change of the tile carpet at this time was measured using a thermograph, it was confirmed that the temperature rose uniformly over the entire surface.

[0057] Example 3 The surface of a substantially square (adhesive-attached) polyimide film "7413D" (rectangle of length 470 mm, width 450 mm, total thickness 65 μm, film thickness 25 μm) manufactured by 3M was masked with silicone rubber so that the area where the wiring pattern was to be formed was exposed. The masked polyimide film was subjected to electroless plating in the same manner as in Example 2 to form wiring made of an electroless Ni plating layer having a thickness of 11.5 μm and a width of 1.5 mm on the surface of the polyimide film. The surface of a base material (length of one side 510 mm, thickness 0.5 mm) made of a substantially square zinc-plated steel plate having a zinc plating layer formed only on one side, on which the zinc plating layer was not formed, was bonded to the surface of the polyimide film on which the wiring was not formed, using an adhesive. The base material, the particle board (thermal insulation layer), and the zinc-plated steel plate (protective layer) were bonded together in the same manner as in Example 1, and then caulking was performed to obtain a floor panel. When electricity was applied to the obtained floor panel in the same manner as in Example 1, it took 15 minutes for the temperature of the center of the tile carpet laminated on the top surface of the floor panel to rise by 10°C. When the temperature change of the tile carpet at this time was measured by thermography, it was confirmed that the temperature rose uniformly over the entire top surface.

[0058] Comparative Example 1 As shown in FIG. 3, a tile carpet was laminated on the top surface of a conventional floor heater with a heater 12 installed under a floor panel 11. The floor heater was energized with a power of 50 W, and the temperature change at this time was measured by thermography. It took 60 minutes for the temperature of the center of the tile carpet to rise by 10°C. The thermography image 60 minutes after the start of energization is shown in FIG. 4 (left diagram of FIG. 4). As shown in FIG. 4, the temperature of the peripheral part was significantly lower than that of the center of the tile carpet. In addition, the power consumption when the temperature of the center of the floor carpet was controlled to 38°C and energized for 12 hours was measured, and as described above, when compared with Example 1, the floor panel 1 of Example 1 consumed 30% or more less power than Comparative Example 1. It is considered that the heat from the heater 12 is not easily transmitted to the top surface of the floor panel 11 and is easily dissipated to the base floor 13, so that the power consumption was high, it took a long time to heat up, and the temperature unevenness of the floor carpet surface was large. [Explanation of symbols]

[0059] 1 Floor Panel 2 Base material 3. Insulation layer 4. Wiring 5. Insulation layer 6 Protective layer 7 Periphery 8 Connections 9, 10 holes 11 Floor Panel 12 Heater 13 Foundation floor

Claims

1. A floor panel comprising a base material, an insulating layer, and a heat insulating layer laminated in that order, the insulating layer being made of wood material, wiring made of a plated layer being formed on the surface of the insulating layer facing the insulating layer, and heat being generated by passing electricity through the wiring.

2. A floor panel comprising a base material, an insulating layer, and a heat insulating layer laminated in this order, the insulating layer including a coating layer formed by painting a resin on the surface of the base material, wiring made of a plating layer formed on the surface of the insulating layer facing the heat insulating layer, and heat generated by passing electricity through the wiring.

3. 3. The floor panel according to claim 2, wherein the insulating layer is made of wood material.

4. The floor panel according to claim 2 or 3, wherein the insulating layer comprises an electrocoating layer.

5. The floor panel according to claim 4 , wherein the insulating layer further comprises a powder coating layer, and the substrate, the electrocoating layer and the powder coating layer are laminated in this order.

6. The floor panel according to any one of claims 1 to 5, wherein the base material is made of a steel plate.

7. A floor panel according to any one of claims 1 to 6, wherein the interface between the insulating layer and the plating layer is roughened.

8. A floor panel as described in any one of claims 1 to 7, wherein a groove is formed in the surface of the insulating layer, and the plating layer is filled into the groove.

9. A method for manufacturing a floor panel, comprising: laminating a base material, an insulating layer, and a heat insulating layer in this order; forming wiring made of a plating layer on a surface of the insulating layer facing the heat insulating layer; and passing electricity through the wiring to generate heat, The insulating layer is formed by coating a surface of the base material with a resin; forming the plating layer on the surface of the insulating layer by performing electroless plating; A method for manufacturing a floor panel, comprising laminating the base material and an insulating material.

10. a pulsed laser is irradiated onto a portion of the surface of the insulating layer to roughen the surface of the portion; The method for manufacturing a floor panel according to claim 9, wherein the plating layer is formed on the surface of the region by performing the electroless plating.

11. forming wiring made of the plating layer on the surface of the resin film by performing electroless plating; The method for manufacturing a floor panel according to claim 1 , further comprising laminating the base material, the resin film, and the wood material.

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