Double-sided co-packaged optics for high-bandwidth networking applications

Abstract

To provide optics packaging for high bandwidth networking applications.SOLUTION: An electronic package 100 comprises a first package substrate 105 and a second package substrate 106 attached to the first package substrate. A die 110 is attached to the second package substrate. Multiple photonics engines 120 are attached to a first surface and a second surface of the first package substrate. The multiple photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] TECHNICAL FIELD Embodiments of the present disclosure relate to electronic packaging, and more particularly, to optics packaging for high bandwidth networking applications. [Background technology]

[0002] As data center traffic continues to grow, it is generally accepted that next generation networks will require tight integration of networking integrated circuits (ICs) (e.g., Ethernet switch silicon dies) with high bandwidth density optical engines. Currently, high bandwidth density optics are packaged on the same surface of the interposer where the ICs are packaged. The area around the perimeter of the IC is limited, limiting future scaling by adding additional optical engines. To increase bandwidth, several architectures have been proposed to implement additional optical engines on the system board. However, such architectures are limited as the distance between the IC and the optical engine increases. Thus, there is a power penalty due to losses along the interconnect between the IC and the optical engine. [Brief description of the drawings]

[0003] [Figure 1A] 1 is a cross-sectional view of an electronic package comprising a switch die and multiple light engines connected to two surfaces of an interposer according to one embodiment.

[0004] [Figure 1B] FIG. 2 is a cross-sectional view of an electronic package comprising a switch die, multiple light engines, and thermal and mechanical components used to cool and secure the electronic package.

[0005] [Figure 2A] FIG. 2 is a plan view of the top surface of an electronic package with eight light engines around the perimeter of a switch die, according to one embodiment.

[0006] [Figure 2B] FIG. 2 is a plan view of the bottom surface of an electronic package with eight light engines, according to one embodiment.

[0007] [Figure 2C] FIG. 2 is a plan view of a top surface of an electronic package with four light engines around the perimeter of a switch die, according to one embodiment.

[0008] [Figure 2D] FIG. 2 is a plan view of the top surface of an electronic package with six light engines around the perimeter of a switch die, according to one embodiment.

[0009] [Diagram 3] 1 is a perspective view of an electronic package illustrating the positioning of an optical engine above and below an interposer according to one embodiment.

[0010] [Figure 4A] 1 is a cross-sectional view of an electronic system including a switching package with light engines on two sides of an interposer, the interposer being attached to a board by a socket, according to one embodiment.

[0011] [Figure 4B] 4B is a cross-sectional view of the electronic system of FIG. 4A along line BB' according to one embodiment.

[0012] [Figure 5A] 2 is a plan view of the bottom surface of the interposer showing the layout of the sockets and light engines on the bottom surface according to one embodiment.

[0013] [Figure 5B] 1 is a plan view of the bottom surface of an interposer showing the layout of the sockets and light engines on the bottom surface when each socket is joined as a monolithic structure, according to one embodiment.

[0014] [Figure 5C] 5C is a cross-sectional view of the interposer of FIG. 5B along line 5-5' according to one embodiment.

[0015] [Figure 5D] FIG. 5C is a cross-sectional view of the interposer of FIG. 5B along line 5-5' according to an additional embodiment.

[0016] [Figure 6] FIG. 2 is an exploded view of an electronic system with optical engines on two surfaces of an interposer, according to one embodiment.

[0017] [Figure 7] 1 is a schematic diagram of a computing device constructed in accordance with one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Described herein is a network switching package for high-bandwidth networking applications, according to various embodiments. In the following description, various aspects of an exemplary implementation are described using terms commonly employed by those skilled in the art to convey the substance of their work to others skilled in the art. However, it will be apparent to one skilled in the art that the present invention may be practiced with only some of the described aspects. For purposes of explanation, specific numbers, materials and configurations are set forth to enable a thorough understanding of the exemplary implementation. However, it will be apparent to one skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known features have been omitted or simplified in order not to obscure the exemplary implementation.

[0019] Various operations are described as multiple separate operations in a manner that is most helpful in understanding the invention, but the order of description should not be construed to imply that these operations are necessarily order dependent. In particular, these operations do not have to be performed in the order presented.

[0020] As mentioned above, future data consumption growth requires increased bandwidth in switching architectures. Accordingly, embodiments disclosed herein comprise a network switching system having optical engines packaged on both the top and bottom surfaces of an interposer. Utilizing both surfaces of the interposer for optical engines allows for scaling of bandwidth density to meet future needs. Furthermore, because the optical engines are stacked on top of each other, the distance of the interconnects from the optical engines to the switch die is minimized. This reduces losses and improves power consumption.

[0021] The embodiments disclosed herein allow for stacking of optical engines (i.e., above and below the interposer) by utilizing sockets with increased standoff heights. That is, the sockets raise the Z-height of the interposer such that there is space below the interposer to accommodate additional optical engines (as well as the thermal and mechanical components required for the additional optical engines). Additionally, the sockets are positioned to be offset from the optical engines to take full advantage of the additional space provided by the socket's increased standoffs.

[0022] 1A, a cross-sectional view of an electronic package 100 is shown according to one embodiment. The electronic package 100 may comprise a first package substrate 105. The first package substrate 105 may be considered an interposer. The first package substrate 105 may include multiple organic layers and conductive traces (not shown for simplicity) embedded in the first package substrate 105. The first package substrate 105 may comprise a first surface 101 (i.e., a bottom surface) and a second surface 102 (i.e., a top surface) opposite the bottom surface 101.

[0023] In one embodiment, the second package substrate 106 may be attached to the first package substrate 105. For example, the interconnects 111 may electrically and mechanically couple the second package substrate 106 to the second surface 102 of the first package substrate 105. Although the interconnects 111 are shown as solder balls, it should be understood that the interconnects 111 may include any suitable interconnect architecture. In one embodiment, the second package substrate 106 is a high density interconnect (HDI) organic substrate. For simplicity, the conductive features of the second package substrate 106 are omitted. In one embodiment, the second package substrate 106 may be a cored substrate or the second package substrate 106 may be coreless.

[0024] In one embodiment, the die 110 may be attached to the second package substrate 106. The die 110 may be electrically and mechanically coupled to the second package substrate 106 by interconnects 112. For example, the interconnects 112 may include solder balls, copper pillars, or the like. In one embodiment, the die 110 is a die suitable for use in switching applications. For example, the die 110 may be a silicon Ethernet switch, or the like. In the illustrated embodiment, a single switch die 110 is shown. However, it is understood that in additional embodiments, two or more switch dies 110 may be included in the electronic package 100.

[0025] In one embodiment, multiple optical engines 120 can be attached to the first package substrate 105. As used herein, an "optical engine" can refer to a device for converting optical signals to electrical signals and / or electrical signals to optical signals. In this manner, optical signals received by the electronic package 100 can be converted to electrical signals by the switch die 110 for routing and then converted back to optical signals for propagation along an optical cable (e.g., fiber optic cable). In one particular embodiment, the optical engines 120 are mechanically and electrically coupled to the first package substrate 105 by sockets 121. Using sockets 121 for interconnection has several benefits. One such benefit of using sockets 121 is that temperature-sensitive components of the optical engines (e.g., lasers) are not exposed to the high temperatures required to reflow solder interconnects. An additional benefit of using sockets 121 is that it facilitates replacement of the optical engines 120 (e.g., in the event of component damage or for performance upgrades). As shown in FIG. 1A, each of the light engines 120 can include an optical input / output 122, such as a fiber optic cable.

[0026] In one embodiment, light engines 120 are attached to both the first surface 101 and the second surface 102 of the first package substrate 105. Including light engines on the first surface 101 (i.e., opposite the die 110) effectively doubles the bandwidth of the electronic package 100. For example, if there are eight light engines 120 on the second surface 102, then there may also be eight light engines 120 on the first surface 101.

[0027] In one embodiment, the light engines 120 may each be communicatively coupled to the die 110 by an interconnect path 115. For simplicity, the interconnect paths 115 are shown as dashed lines. However, it should be understood that the interconnect paths 115 represent conductive features (e.g., traces, vias, pads, etc.) of the first package substrate 105 and the second package substrate 106. While adding light engines 120 to a system board (as described above) significantly increases the length of the interconnects to the die 110, in an embodiment where the additional light engines 120 are attached to the first surface 101 of the first package substrate 105, the increase in the length of the interconnect path 115 is minimized. Thus, losses and power consumption are reduced.

[0028] 1B, a cross-sectional view of an electronic package 100 is shown according to an additional embodiment. The electronic package 100 of FIG. 1B may be substantially similar to the electronic package 100 of FIG. 1A, except that additional thermal and mechanical components are shown. In one embodiment, the die 110 may be thermally coupled to an integrated heat spreader 114 (e.g., a lid) by a thermal interface material 113. The IHS 114 may cover a top surface of the die 110 and may have legs that are secured to the second package substrate 106 (e.g., with an epoxy (not shown)). The IHS 114 may be in contact with a heat sink (described in more detail below).

[0029] In one embodiment, each of the light engines 120 may be thermally coupled to the IHS 124 by the TIM 123. The IHS 124 may be in contact with the heat sink 125. The heat sink 125 may be any suitable heat sink. For example, the heat sink 125 may be a liquid-cooled heat sink. The structure of the heat sink 125 is described in more detail below. In one embodiment, a holding frame 126 may be provided over the heat sink 125. In some embodiments, the holding frame 126 is a ring. That is, the two holding frames 126 covering the second surface 102 may be a single structure that is joined out of the plane of FIG. 1B. Similarly, the two holding frames 126 covering the first surface 101 may be a single structure that is joined out of the plane of FIG. 1B.

[0030] 2A and 2B, there are shown plan views of an electronic package 200 according to one embodiment. Figure 2A is a plan view of a second surface 202 of a first package substrate 205, and Figure 2B is a plan view of a first surface 201 of a first package substrate 205. The electronic package 200 of Figure 2A is shown without the IHS 114 / 124, without the heat sink 125, and without the retention frame 126 so as not to obscure the die 210 and the light engine 220.

[0031] As shown in FIG. 2A , the die 210 is provided over the second package substrate 206. The second package substrate 206 is positioned on the second surface 202 of the first package substrate 205. In one embodiment, a number of light engines 220 are provided around the perimeter of the die 210 and around the perimeter of the second package substrate 206. An optical input / output 222 may be connected to each light engine 220, and the optical input / output 222 may extend away from the first package substrate 205. The light engines 220 are attached to the first package substrate 205 by sockets (not shown) below the light engines 220. In the illustrated embodiment, eight light engines 220 are provided on the second surface 202 of the first package substrate 205. For example, a pair of light engines 220 is positioned along each edge of the second package substrate 206.

[0032] 2B , additional light engines 220 may be provided on the opposing surface (i.e., first surface 201) of first package substrate 205. For example, eight more light engines 220 may be attached to first surface 201 of first package substrate 205 to provide a total of sixteen light engines 220 in electronic package 200. Each of the light engines 220 on first surface 201 of first package substrate 205 may be aligned directly beneath (i.e., within the footprint of) one of the light engines 220 on second surface 202.

[0033] Although eight light engines 220 are shown in each of Figures 2A and 2B (to provide electronic package 200 with a total of 16 light engines), it should be understood that any number of light engines 220 may be included in first package substrate 205. For example, in Figure 2C a total of four light engines 220 are provided on second surface 202 of first package substrate 205. In electronic package 200 of Figure 2C, four more light engines 220 may be positioned on first surface (not shown) to provide a total of eight light engines. Although an example of four light engines 220 per side and an example of eight light engines 220 per side are shown, it should be understood that any number of light engines 220 may be provided in electronic package 200.

[0034] 2A-2C are illustrated as having a uniform number of light engines 220 above and below the first packaging substrate 205. However, it should be understood that the number of light engines 220 on the first surface 201 of the first packaging substrate 205 need not be equal to the number of light engines 220 on the second surface 202 of the first packaging substrate 205. For example, eight light engines 220 may be provided on the second surface 202 and four light engines 220 may be provided on the first surface 201.

[0035] Additionally, although the number of light engines 220 along each edge of the second package substrate 206 is shown as being equal, it should be understood that the number of light engines 220 along each edge of the second package substrate 206 need not be equal. Figure 2D illustrates one example of such a configuration. As shown, a single light engine 220 is attached to the first edge 207 of the second package substrate 206. A and the second edge 207 B 2, a pair of light engines 220 may be provided adjacent the third edge 207 of the second package substrate 206. C and the fourth edge 207 D It may be provided adjacent to.

[0036] 3, a perspective view of an electronic package 300 is shown according to one embodiment. In the illustrated embodiment, sixteen light engines 320 are provided on the first package substrate 305 (i.e., eight on the first surface 301 and eight on the second surface 302). As shown, each light engine 320 on the second surface 302 is stacked directly above one of the light engines 320 on the first surface 301. Each light engine 320 may include an optical input / output 322 that extends away from the first package substrate 305. In one embodiment, each of the light engines 320 is attached to the first package substrate 305 by a socket 321.

[0037] In one embodiment, an IHS 324 is provided over each of the light engines 320. That is, there are 16 IHSs 324 in the electronic package 300 shown in FIG. 3. However, in other embodiments, there may be fewer IHSs 324 than light engines 320. For example, a single IHS 324 may span two or more light engines 320. In the illustrated embodiment, a die (not shown) is covered by the die IHS 314. The die IHS 314 may be disposed on the second package substrate 306. In one embodiment, multiple light engines 320 may surround the second package substrate 306.

[0038] 4A, a cross-sectional view of an electronic system 470 is shown according to one embodiment. In some embodiments, the electronic system 470 may be referred to as a switch blade of a modular server system. In one embodiment, the electronic system 470 may comprise an electronic package 400 mounted to a board 471 (e.g., a system board, a motherboard, etc.). The board 471 may include a blade interface (not shown). In one embodiment, the electronic package 400 is mounted to the board 471 by a socket 441. As described in more detail below, the socket 441 provides an electrical connection between the electronic package 400 and the board 471 in addition to providing a vertical standoff height H that allows the light engine 420 to be positioned on the first surface 401 of the first package substrate 405 of the electronic package 400.

[0039] In one embodiment, electronic package 400 may be substantially similar to the electronic packages described above. For example, electronic package 400 may include a first package substrate 405 and a second package substrate 406. Second package substrate 406 is attached to a second surface 402 of first package substrate 405 by interconnects 411. In one embodiment, a die 410 (e.g., a switch die) is attached to second package substrate 406 by interconnects 412. TIM 413 may thermally couple die 410 to IHS 414.

[0040] In one embodiment, the electronic package 400 may include multiple light engines 420. A first set of light engines 420 may be provided on a first surface 401 of a first package substrate 405, and a second set of light engines 420 may be provided on a second surface 402 of the first package substrate 405. The light engines 420 may be electrically and mechanically coupled to the first package substrate 405 by sockets 421. Optical inputs / outputs 422 may extend outwardly away from the light engines 420. In one embodiment, each light engine 420 may be thermally coupled to an IHS 424 by a TIM 423. The IHS 424 may be in thermal contact with a heat sink 425. In one embodiment, a holding frame 426 may be provided over each heat sink 425.

[0041] The standoff height H of the sockets 441 provides space below the first package substrate 405 to accommodate the first set of light engines 420 on the first surface 401 of the first package substrate 405. In one embodiment, the standoff height H may be about 15 mm or more, about 20 mm or more, or about 25 mm or more. The standoff height H also provides space for additional thermal and mechanical components covering the light engines 420. Thus, the standoff height H is greater than the maximum thickness of the light engines 420.

[0042] In one embodiment, the socket 441 is positioned below the die 410. That is, the socket 441 can be inside the footprint of the die 410. Positioning the socket 441 directly below the die 410 allows for a short electrical wiring path between the board 471 and the die 410. In some embodiments, the electrical wiring through the socket 441 is solely for connection to the die 410. In other embodiments, the electrical wiring through the socket 441 can also accommodate wiring for one or more of the light engines 420.

[0043] 4B, a cross-sectional view of the electronic system 470 of FIG. 4A along line B-B' is shown, according to one embodiment. As shown, a number of peripheral sockets 442 may also be positioned between the board 471 and the first package substrate 405. In one embodiment, the peripheral sockets 442 may be used to provide electrical wiring from the board 471 to one or more of the light engines 420. Thus, the wiring length between the board 471 and the light engines 420 is reduced, as compared to when the wiring from the board 471 to the light engines 420 is routed through the central socket 441 shown in FIG. 4A.

[0044] In one embodiment, the peripheral sockets 442 may be located at the corners of the first package substrate 405. For example, the peripheral sockets 442 may be offset from the light engines 420. That is, in some embodiments, the peripheral sockets 442 are completely outside the footprint of all of the light engines 420. Thus, the positioning of the peripheral sockets 442 does not interfere with the placement of the light engines 420. In one embodiment, the peripheral sockets 442 have the same standoff height H as the central socket 441.

[0045] 5A, a plan view of a first surface 501 of a first package substrate 505 is shown, according to one embodiment. As shown, the light engines 520 surround the perimeter of a central socket 541. In one embodiment, four peripheral sockets 542 may be positioned at the corners of the first package substrate 505. Each peripheral socket 542 may provide electrical wiring to adjacent light engines 520. That is, in some embodiments, each peripheral socket 542 may provide wiring to a pair of light engines 520 on the first surface 501 of the first package substrate 505 and a pair of light engines 520 on (not visible in FIG. 5A) the second surface 502 of the first package substrate 505. In one embodiment, each of the peripheral sockets 542 and the central socket 541 are discrete components.

[0046] 5B, a plan view of a first surface 501 of a first package substrate 505 is shown according to an additional embodiment. As shown, peripheral sockets 542 and central socket 541 are formed as a single component. For example, bridge portion 543 may couple each of peripheral sockets 542 to central socket 541. Using a single component architecture for sockets 541 / 542 may allow for improved alignment and may facilitate assembly. In one embodiment, bridge portion 543 may be structural in nature; that is, there may not be electrical wiring passing through bridge portion 543. However, in other embodiments, wiring may be present on a portion of bridge portion 543.

[0047] 5C, there is shown a cross-sectional view of first package substrate 505 and sockets 541 / 542 taken along line 5-5' in FIG. 5B, according to one embodiment. As shown, bridge portion 543 may have a lower height than sockets 541 / 542. However, in other embodiments, bridge portion 543 may have a substantially same height as sockets 541 / 542. One such embodiment is shown in the cross-sectional view of FIG. 5D.

[0048] 6, an exploded view of an electronic system 670 is shown according to one embodiment. In one embodiment, the electronic system 670 may include a board 671. In one embodiment, the central socket 641 and the peripheral sockets 642 may be mounted on the board 671. In one embodiment, the first support frame 626 may include a first support frame 626. A may be provided on the sockets 641 / 642. A The first holding frame 626 may include an opening 651 for receiving the socket 641 / 642. Thus, the socket 641 / 642 may be attached to the first holding frame 626. A can pass through a thickness of

[0049] In one embodiment, the first heat sink 625 A The first holding frame 626 AThe first heat sink 625 is provided on the A The first heat sink 625 may include multiple cooling plates 653. In some embodiments, the cooling plates 653 may be liquid cooled plates. In the embodiment shown, there are four cooling plates 653, with multiple pairs of cooling plates 653 fluidly coupled to each other. In other embodiments, all cooling plates may be fluidly coupled to each other, or each cooling plate may have its own fluid input / output. A may be used to cool a light engine (below IHS 624) provided on the lower surface of first packaging substrate 605.

[0050] In one embodiment, the electronic package 600 includes a first heat sink 625 A 6. The electronic package 600 may be similar to the electronic packages described above. For example, the electronic package 600 may comprise a first package substrate 605 having a first set of light engines overlying a top surface of the first package substrate 605 and a second set of light engines overlying a bottom surface of the first package substrate 605. In FIG. 6, the light engines are hidden by an IHS 624 positioned over the top and bottom light engines of the first package substrate 605. The die (hidden by the IHS 614) may be attached to a second package substrate (not visible), which is attached to the top surface of the first package substrate 605. The IHS 614 may be attached to a first heat sink 625 under the electronic package 600. A and a second heat sink 625 on top of the electronic package 600. B In one embodiment, the second heat sink 625 B 625 is a first heat sink A It may be substantially similar to

[0051] In one embodiment, the second holding frame 626 B The second heat sink 625 B The second holding frame 626 is positioned on BThe third heat sink 625 may include an opening 665. The opening 665 may be aligned with the die (below the IHS 614). The opening allows the third heat sink 625 C The second holding frame 626 B 614 on the die. C may also be liquid cooled.

[0052] In one embodiment, the second holding frame 626 B and a third heat sink 625 C A mounting mechanism 661 may be provided on the third heat sink 625. C is thermally coupled to the IHS 614. The mounting mechanism 661 can include fasteners 662 (e.g., screws) that mate with pins 666 extending up from a plate 667 attached to the sockets 641 / 642. The pins 666 are secured to the first holding frame 626 to mechanically secure all of the components of the electronic system 670 together. A and a second holding frame 626 B In some embodiments, the first retaining frame 626 may extend through a hole in the first retaining frame 626. A The second holding frame 626 B 626 to properly align the first holding frame 626 A Alignment pins 668 extending upwardly from the second retaining frame 626 B In some embodiments, a back plate 663 can be provided on the lower surface of the board 671. Embodiments that include a back plate 663 can have pins 666 attached to the back plate 663, which can extend through the board 671 and up through a plate 667.

[0053] FIG. 7 illustrates a modular server system according to an embodiment of the present invention. In one embodiment, the modular server system 700 is a redundant server system for web hosting and ASPs that require a server solution with carrier-class availability, reliability, and scalability. Carrier-class systems have more demanding features than enterprise-grade systems, such as "high availability" (HA), high dependability, and redundancy. However, it should be understood that the embodiments described herein are also applicable to enterprise-grade server systems. In other embodiments, the modular server system 700 may be used in any computing system. For example, the modular server system 700 may be part of a high-performance computing system.

[0054] At the heart of the modular server system 700 is the midplane 770, which may be a PC-style circuit board with multiple blade interfaces that provide a common interconnect for all modules plugged into it. The blade interfaces are in electrical communication with each other and with the system management bus of the midplane 770. The midplane 770 is preferably based on the Compact PCI form factor (Compact PCI standard by the PCI (Peripheral Component Interconnect) Industrial Computer Manufacturers Group (PICMG), PICMG2.0, version 2.1), and the blade interfaces are Compact PCI slots or Compact PCI connectors. Compact PCI utilizes the Eurocard form factor popularized by the "Versa Module Europa" (VME) bus with standard Eurocard dimensions and high density, 2 mm pin and socket connectors. In the modular server system 700 shown in FIG. 7, up to 16 individual server blades 710 can be supported in addition to up to 16 media blades 750. However, any other number of server blades 710 and media blades 750 may be supported. A blade is typically a motherboard or single board computer (SBC) with a central processing unit (CPU). Preferably, each server blade 710 has a corresponding media blade 750, but this is not a requirement as multiple server blades 710 may share a single media blade 750, and vice versa. Utilizing the midplane 770, the network (such as a local area network) becomes the primary interconnect between the blades 710, 750.

[0055] The modular server system 700 shown in FIG. 7 is also configured to support any number of switch blades 720 for full system network (e.g., Ethernet) switching and N+1 redundancy. The switch blades 720 may be optical switch blades for switching optical signals within the modular server system 700 or between different modular server systems (e.g., different racks). In one embodiment, the switch blades 720 may comprise an electronic package as described above including multiple optical engines positioned on both surfaces of an interposer. The optical engines may be communicatively coupled to a switch die connected to the interposer via a second package substrate. In one embodiment, the electronic package with the optical engines and the switch die is coupled to a board by a socket having a standoff height of about 15 mm or more, about 20 mm or more, or about 25 mm or more. In one embodiment, the board is connected to the midplane 770 using an interface as described above.

[0056] In one embodiment, the switch blade 720 has 20 10 / 100Base-T auto-negotiation ports and supports 4,096 Media Access Control (MAC) addresses. Of the 20 ports, 16 of them are preferably assigned to one Ethernet channel from the midplane 770 of the system 700 (connected to all 16 server blades 710 as shown in the example of FIG. 7), and the remaining four ports are accessible, for example, via an RJ-45 (Ethernet) connector on the faceplate of the switch blade 720. However, other configurations may be adapted depending on the number of server blades 710 supported by the modular server system 700 and whether optical wiring is used instead of electrical wiring. Data packets are preferably buffered in the switch blade 720 to prevent Ethernet collisions on any channel, and in all cases, a non-blocking switch fabric with sufficient bandwidth to prevent packet loss is recommended, but a fully managed layer 3 / 4 switch can provide quality of service (QoS) control.

[0057] In the modular server system 700 shown in FIG. 7, multiple load-sharing power supplies 730 can be connected to a midplane 770 to provide power to the modules of the server system 700. These power supplies 730 (e.g., 150 W power supplies) can also enable N+1 redundancy. One or more (AC / DC) inputs 740 can be connected to the midplane 770 to provide input power to the modular server system 700. A removable fan tray with cooling fans 760 can be utilized to provide cooling airflow inside the modular server system 700, thereby cooling the modules therein. In other embodiments, a liquid cooling system can be used in place of (or in addition to) the cooling fans 760. The power supplies 730 and cooling fans 760 of the modular server system 700 can be shared by the server blades 710, media blades 750, and switch blades 720 inside the modular server system 700 (i.e., each server blade 710, media blade 750, or switch blade 720 does not need to have its own power supply or cooling fan). Sharing the power supply 730 and cooling fans 760 allows for more efficient use of the modular server system 700's resources and minimizes space.

[0058] The above description of illustrated implementations, including what is described in the Abstract, is not intended to be exhaustive or to limit the invention to the precise form disclosed. While specific implementations and examples for the invention are described herein for illustrative purposes, various equivalent modifications are possible within the scope of the invention, as those skilled in the art will recognize.

[0059] These modifications may be made to the present invention in light of the above detailed description. The terms used in the following claims should not be construed to limit the invention to the specific implementations disclosed in the specification and claims. Rather, the scope of the invention should be determined solely by the following claims, which should be construed in accordance with established principles of claim interpretation.

[0060] Example 1: An electronic package comprising a first package substrate, a second package substrate attached to the first package substrate, a die attached to the second package substrate, and a plurality of light engines attached to a first surface and a second surface of the first package substrate, the plurality of light engines being communicatively coupled to the die via the first package substrate and the second package substrate.

[0061] Example 2: The electronic package of example 1, wherein the die is a switch die.

[0062] Example 3: The electronic package of Example 1 or Example 2, further comprising: a first socket attached to the first package substrate, the first socket being below the die; and a plurality of second sockets attached to the first package substrate.

[0063] Example 4: The electronic package of example 3, wherein a respective one of the second sockets is offset from a respective one of the light engines.

[0064] Example 5: The electronic package of Example 4, wherein each of the second sockets is positioned proximate a corner of the first package substrate.

[0065] Example 6: The electronic package of example 3, wherein the first socket and the plurality of second sockets are a monolithic structure.

[0066] Example 7: The electronic package of Examples 1 to 6, wherein a first set of light engines on a first surface of the first package substrate has four light engines and a second set of light engines on a second surface of the first package substrate has four light engines.

[0067] Example 8: The electronic package of Examples 1 to 7, wherein a first set of light engines on a first surface of the first package substrate has eight light engines and a second set of light engines on a second surface of the first package substrate has eight light engines.

[0068] Example 9: The electronic package of Example 8, wherein each of the light engines of the first set of light engines is positioned directly above each of the light engines of the second set of light engines.

[0069] Example 10: The electronic package of Examples 1 to 9, wherein each of the plurality of light engines is attached to the first package substrate by a socket.

[0070] Example 11: The electronic package of Examples 1 to 10, further comprising an integrated heat spreader (IHS) attached to each of the light engines.

[0071] Example 12: The electronic package of example 11, wherein a single IHS is attached to two or more light engines.

[0072] Example 13: The electronic package of Example 11, further comprising a plurality of IHSs, each of the plurality of IHSs being attached to a single light engine.

[0073] Example 14: An electronic package comprising: a first package substrate having a first surface and a second surface opposite the first surface; a second package substrate attached to the second surface of the first package substrate; a die attached to the second package substrate; a first light engine attached to the first surface of the package substrate, the first light engine being communicatively coupled to the die via the first package substrate and the second package substrate; a second light engine attached to the second surface of the package substrate, the second light engine being communicatively coupled to the die via the first package substrate and the second package substrate; a first socket attached to the first surface of the package substrate, the first socket being inside a footprint of the die; and a plurality of second sockets attached to the first surface of the package substrate, each of the second sockets being outside a footprint of each of the first light engine and the second light engine.

[0074] Example 15: The electronic package of Example 14, further comprising a plurality of first integrated heat spreaders (IHS), where an individual one of the first IHSs is over an individual one of the first light engines, and a plurality of second IHSs, where an individual one of the second IHSs is over an individual one of the second light engines.

[0075] Example 16: The electronic package of Example 15, further comprising a first heat sink covering the first IHS, a second heat sink covering the second IHS, a first holding frame covering the first heat sink, and a second holding frame covering the second heat sink.

[0076] Example 17: The electronic package of Example 16, wherein the first heat sink and the second heat sink are liquid cooled plates.

[0077] Example 18: The electronic package of Example 17, wherein the first holding frame and the second holding frame are rings that hold the first light engine and the second light engine therebetween.

[0078] Example 19: The electronic package of Example 18, wherein the first socket and the plurality of second sockets extend through the first retaining frame.

[0079] Example 20: The electronic package of any one of Examples 14 to 19, further comprising an integrated heat spreader (IHS) covering the die and a heat sink covering the IHS.

[0080] Example 21: The electronic package of Examples 14 to 20, wherein each of the first light engines of the first light engines and each of the second light engines of the second light engines are attached to the first package substrate by a third socket.

[0081] Example 22: An electronic system comprising: a board; a first package substrate attached to the board by a first socket and a plurality of second sockets, the first package substrate having a first surface facing toward the board and a second surface facing away from the board; a first light engine attached to the first surface of the package substrate by a third socket; a second light engine attached to the second surface of the package substrate by the third socket; a cooling component covering the first light engine and covering the second light engine, the cooling component being fixed relative to the first light engine and the second light engine by a first holding frame and a second holding frame; a second package substrate attached to the second surface of the first package substrate; and a die attached to the second package substrate, the die being communicatively coupled to each first light engine of the first light engines and each second light engine of the second light engines via the first package substrate and the second package substrate.

[0082] Example 23: The electronic system of example 22, wherein the die is a switching die.

[0083] Example 24: The electronic system of example 23, wherein the electronic system is a switch blade.

[0084] Example 25: The electronic system of Example 24, wherein the electronic system is a switch blade of a modular server system. (Item 1) A first package substrate; a second package substrate attached to the first package substrate; a die attached to the second package substrate; a plurality of light engines attached to a first surface and a second surface of the first package substrate; Equipped with the plurality of light engines are communicatively coupled to the die via the first package substrate and the second package substrate; Electronic package. (Item 2) The electronic package of item 1, wherein the die is a switch die. (Item 3) A first socket attached to the first package substrate, the first socket being below the die; and a plurality of second sockets attached to the first package substrate; Item 1. The electronic package of item 1, further comprising: (Item 4) The electronic package described in item 3, wherein each of the second sockets is offset from each of the light engines. Item 5. The electronic package of item 4, wherein each of the second sockets is positioned proximate a corner of the first package substrate. Item 6. The electronic package of item 3, wherein the first socket and the plurality of second sockets are monolithic structures. (Item 7) An electronic package as described in Item 1, wherein the first set of light engines on the first surface of the first package substrate has four light engines, and the second set of light engines on the second surface of the first package substrate has four light engines. (Item 8) The electronic package described in Item 1, wherein the first set of light engines on the first surface of the first package substrate has eight light engines, and the second set of light engines on the second surface of the first package substrate has eight light engines. (Item 9) The electronic package described in Item 8, wherein each of the light engines of the first set of light engines is positioned directly above each of the light engines of the second set of light engines. (Item 10) The electronic package of item 1, wherein each of the plurality of light engines is attached to the first package substrate by a socket. Item 11. The optical system further includes an integrated heat spreader (IHS) attached to each of the optical engines. 2. The electronic package described in item 1. (Item 12) The electronic package of item 11, wherein a single IHS is attached to two or more light engines. (Item 13) The electronic package of item 11, further comprising a plurality of IHSs, each of the plurality of IHSs being attached to a single light engine. (Item 14) A first package substrate having a first surface and a second surface opposite the first surface; a second package substrate attached to the second surface of the first package substrate; a die attached to the second package substrate; a first light engine attached to the first surface of the package substrate, the first light engine communicatively coupled to the die via the first package substrate and the second package substrate; a second light engine attached to the second surface of the package substrate, the second light engine communicatively coupled to the die through the first package substrate and the second package substrate; and a first socket attached to the first surface of the package substrate, the first socket being within a footprint of the die; a plurality of second sockets attached to the first surface of the package substrate, each of the second sockets being outside a footprint of each of the first light engine and the second light engine; An electronic package comprising: (Item 15) A plurality of first integrated heat spreaders (IHS), each of the first IHS overlying each of the first light engines; and a plurality of second IHSs, each of the second IHSs overlying each of the second light engines; Item 15. The electronic package of item 14, further comprising: (Item 16) A first heat sink covering the first IHS; a second heat sink covering the second IHS; and a first holding frame covering the first heat sink; a second holding frame covering the second heat sink; Item 16. The electronic package of item 15, further comprising: Item 17. The electronic package of item 16, wherein the first heat sink and the second heat sink are liquid-cooled plates. (Item 18) The electronic package described in Item 17, wherein the first holding frame and the second holding frame are rings that hold the first light engine and the second light engine therebetween. (Item 19) The electronic package of item 18, wherein the first socket and the plurality of second sockets extend through the first retaining frame. (Item 20) An integrated heat spreader (IHS) covering the die; A heat sink covering the IHS Item 15. The electronic package of item 14, further comprising: (Item 21) An electronic package as described in Item 14, wherein each first light engine among the first light engines and each second light engine among the second light engines are attached to the first package substrate by a third socket. (Item 22) Board and a first package substrate attached to the board by a first socket and a plurality of second sockets, the first package substrate having a first surface facing toward the board and a second surface facing away from the board; a first light engine attached to the first surface of the package substrate by a third socket; a second light engine attached to the second surface of the packaging substrate by a third socket; a cooling component covering the first light engine and covering the second light engine, the cooling component being fixed to the first light engine and the second light engine by a first holding frame and a second holding frame; a second package substrate attached to the second surface of the first package substrate; a die attached to the second package substrate, the die communicatively coupled to a respective first light engine of the first light engines and a respective second light engine of the second light engines via the first package substrate and the second package substrate; An electronic system comprising: (Item 23) The electronic system of item 22, wherein the die is a switching die. (Item 24) The electronic system of item 23, wherein the electronic system is a switch blade. (Item 25) The electronic system of item 24, wherein the electronic system is a switch blade of a modular server system.

Claims

1. A first package substrate; a plurality of light engines attached to a first surface and a second surface of the first packaging substrate; a socket attached to the first surface of the first package substrate for electrically connecting an electronic package to a board; a second package substrate attached to the second surface of the first package substrate; a die attached to the second package substrate; Equipped with the plurality of light engines are communicatively coupled to the die via the first package substrate and the second package substrate; Electronic package.

2. The electronic package of claim 1 , wherein the die is a switch die.

3. The socket is a first socket attached to the first package substrate, the first socket underlying the die; and a plurality of second sockets attached to the first package substrate; 3. The electronic package of claim 1 or 2, comprising:

4. The first socket provides an electrical coupling between the die and the board; The plurality of second sockets provide electrical wiring from the board to the plurality of light engines. The electronic package of claim 3.

5. The electronic package of claim 3 or 4, wherein each second socket of the plurality of second sockets is offset from each light engine of the plurality of light engines.

6. The electronic package of claim 5 , wherein each second socket of the plurality of second sockets is positioned proximate a corner of the first package substrate.

7. The electronic package of claim 3 , wherein the first socket and the plurality of second sockets are a monolithic structure.

8. 8. The electronic package of claim 1 , wherein a first set of the plurality of light engines on the first surface of the first package substrate has four light engines, and a second set of the plurality of light engines on the second surface of the first package substrate has four light engines.

9. 8. The electronic package of claim 1 , wherein a first set of the plurality of light engines on the first surface of the first package substrate has eight light engines, and a second set of the plurality of light engines on the second surface of the first package substrate has eight light engines.

10. 10. The electronic package of claim 8 or 9, wherein each light engine of the plurality of light engines in the first set is positioned directly above each light engine of the plurality of light engines in the second set.

11. The electronic package of claim 1 , wherein each light engine of the plurality of light engines is attached to the first package substrate by a third socket.

12. an integrated heat spreader (IHS) attached to each of the plurality of light engines; 12. An electronic package according to any one of claims 1 to 11.

13. The electronic package of claim 12 , wherein a single IHS is attached to two or more light engines.

14. The electronic package of claim 12 , further comprising a plurality of IHSs, each IHS of the plurality of IHSs being attached to a single light engine.

15. a first package substrate having a first surface and a second surface opposite the first surface; a second package substrate attached to the second surface of the first package substrate; a die attached to the second package substrate; a first light engine attached to the first surface of the first package substrate, the first light engine communicatively coupled to the die through the first package substrate and the second package substrate; a second light engine attached to the second surface of the first package substrate, the second light engine communicatively coupled to the die through the first package substrate and the second package substrate; and a first socket attached to the first surface of the first package substrate, the first socket being within a footprint of the die; a plurality of second sockets attached to the first surface of the first package substrate, each second socket of the plurality of second sockets being outside a footprint of each light engine of the first light engine and the second light engine; An electronic package comprising:

16. a plurality of first integrated heat spreaders (IHS), each of the plurality of first IHSs overlying a respective one of the first light engines; a plurality of second IHSs, each of the plurality of second IHSs overlying each of the second light engines; 20. The electronic package of claim 15 further comprising:

17. a first heat sink covering the plurality of first IHSs; a second heat sink covering the plurality of second IHSs; a first holding frame covering the first heat sink; a second holding frame covering the second heat sink; 20. The electronic package of claim 16, further comprising:

18. 20. The electronic package of claim 17, wherein the first heat sink and the second heat sink are liquid cooled plates.

19. The electronic package of claim 18 , wherein the first and second holding frames are rings that hold the first and second light engines therebetween.

20. 20. The electronic package of claim 19, wherein the first socket and the plurality of second sockets extend through the first retention frame.

21. an integrated heat spreader (IHS) covering the die; A heat sink covering the IHS; 21. The electronic package of claim 15, further comprising:

22. 21. The electronic package of claim 15, wherein each first light engine of the first light engines and each second light engine of the second light engines are attached to the first package substrate by a third socket.

23. Board and a first package substrate attached to the board by a first socket and a plurality of second sockets, the first package substrate having a first surface facing toward the board and a second surface facing away from the board; a first light engine attached to the first surface of the first package substrate by a third socket; a second light engine mounted to the second surface of the first package substrate by the third socket; a cooling component covering the first light engine and covering the second light engine, the cooling component being fixed to the first light engine and the second light engine by a first holding frame and a second holding frame; a second package substrate attached to the second surface of the first package substrate; a die attached to the second package substrate, the die communicatively coupled to a respective first light engine of the first light engines and a respective second light engine of the second light engines via the first package substrate and the second package substrate; An electronic system comprising:

24. 24. The electronic system of claim 23, wherein the die is a switching die.

25. 25. The electronic system of claim 24, wherein the electronic system is a switchblade.

26. 26. The electronic system of claim 25, wherein the electronic system is a switch blade of a modular server system.

Images