Alignment method and inspection device

Abstract

To provide a technology capable of accurately performing alignment between an electrode pad and a probe.SOLUTION: An alignment method for a probe card including a plurality of probe groups provided correspondingly to a plurality of chips includes a first mode in which for each of the plurality of chips and on the basis of positional information on two or more probes included in the probe groups provided correspondingly to the chips, an inclination and centroid of the probe groups are calculated and an inclination and centroid of the probe card are calculated on the basis of calculated inclinations and centroids of the plurality of probe groups.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to an alignment method and an inspection apparatus. [Background technology]

[0002] When testing is performed by contacting a substrate with the probes of a probe card, a technique is known for adjusting the inclination of the probe card so that the distances between the probe tips at the four corners of the probe card and the four electrode pads facing them are equal (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-231765 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that allows for highly accurate alignment of electrode pads and probes. [Means for solving the problem]

[0005] An alignment method according to one aspect of the present disclosure is a method for aligning a probe card including a plurality of probe groups provided corresponding to a plurality of chips, the method comprising the steps of: Based on design position information of two or more probes included in each probe group, a design tilt of each probe group and a design center of gravity of each probe group are calculated, a design tilt of a probe card and a design center of gravity of each probe group are calculated based on the calculated design tilt of each probe group and the design center of gravity of each probe group, a measurement tilt of each probe group and a measurement center of gravity of each probe group are calculated based on measurement position information of two or more probes included in each probe group, a measurement tilt of the probe card and a measurement center of gravity of the probe card are calculated based on the calculated measurement tilt of each probe group and the measurement center of gravity of each probe group, and a tilt deviation amount which is a deviation amount of the measurement tilt of the probe card from the design tilt of the probe card and a center of gravity deviation amount which is a deviation amount of the measurement center of gravity of the probe card from the design center of gravity of the probe card are calculated, The first mode is included. Effect of the Invention

[0006] According to the present disclosure, the electrode pads and the probes can be aligned with high accuracy. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a diagram showing an example of an inspection apparatus according to an embodiment; [Diagram 2] Plan view of the inspection device of FIG. [Diagram 3] A diagram showing an example of the hardware configuration of a controller. [Figure 4] FIG. 13 is a diagram showing an example of a method for calculating the inclination of a probe card in chip unit mode. [Diagram 5] FIG. 13 is a diagram showing an example of a method for calculating the center of gravity of a probe card in chip unit mode. [Figure 6] FIG. 13 is a diagram showing an example of a method for calculating the inclination of a probe card in a card-by-card mode. [Figure 7] FIG. 13 is a diagram showing an example of a method for calculating the center of gravity of a probe card in a card unit mode. [Figure 8] FIG. 1 is a diagram for explaining the positional relationship between the probe group and the tip in the tip-by-tip mode. [Figure 9] FIG. 1 is a diagram for explaining the positional relationship between the probe group and the chip in the card-based mode. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all of the accompanying drawings, the same or corresponding members or parts are designated by the same or corresponding reference numerals, and duplicated descriptions will be omitted.

[0009] [Inspection equipment] An example of an inspection apparatus according to an embodiment will be described with reference to Figs. 1 to 3. The inspection apparatus according to the embodiment is an apparatus that applies an electrical signal to each of a plurality of devices under test (DUTs) formed on a substrate to inspect various electrical characteristics. In the following, an example will be described in which the substrate is a semiconductor wafer (hereinafter simply referred to as a "wafer") and the devices under test are semiconductor chips (hereinafter simply referred to as "chips"). The semiconductor chips include electrode pads.

[0010] The inspection device 1 includes a loader unit 10, an inspection unit 20, a controller 30, and the like.

[0011] The loader unit 10 includes a load port 11, an aligner 12, and a substrate transfer mechanism 13. The load port 11 holds a cassette C containing a wafer W. The aligner 12 aligns the position of the wafer W. The substrate transfer mechanism 13 transfers the wafer W between the cassette C placed on the load port 11, the aligner 12, and a mounting table 21, which will be described later.

[0012] In the loader unit 10, first, the substrate transport mechanism 13 transports the wafer W accommodated in the cassette C to the aligner 12. Next, the aligner 12 aligns the wafer W. Next, the substrate transport mechanism 13 transports the wafer W aligned in the aligner 12 to a mounting table 21 provided in the inspection unit 20.

[0013] The inspection unit 20 is disposed adjacent to the loader unit 10. The inspection unit 20 includes a mounting table 21, a lifting and rotating mechanism 22, an XY stage 23, a probe card 24, an alignment mechanism 25, and the like.

[0014] The mounting table 21 has a mounting surface 21a on which the wafer W is placed. The mounting table 21 is provided so as to be movable in the horizontal direction (X direction and Y direction) and the vertical direction (Z direction) and to be rotatable around a vertical axis (θ direction) relative to the bottom of the inspection unit 20. The mounting table 21 includes a vacuum chuck, and adsorbs and holds the wafer W placed on the mounting surface 21a.

[0015] The lifting and rotating mechanism 22 supports the mounting table 21 so as to be movable (liftable) in the vertical direction (Z direction) and rotatable around a vertical axis (θ direction). The lifting and rotating mechanism 22 includes, for example, a stepping motor.

[0016] The XY stage 23 supports the lifting and rotating mechanism 22 so as to be movable in horizontal directions (X and Y directions). The XY stage 23 moves the mounting table 21 supported by the lifting and rotating mechanism 22 in the horizontal direction via the lifting and rotating mechanism 22. The XY stage 23 includes, for example, a stepping motor.

[0017] The probe card 24 is disposed above the mounting table 21. A plurality of probes 24a are formed on the side of the probe card 24 facing the mounting table 21. The probe card 24 is detachably attached to a head plate 24b. A tester (not shown) is connected to the probe card 24 via a test head T.

[0018] The alignment mechanism 25 includes an upper camera 25a, a guide rail 25b, an alignment bridge 25c, a lower camera 25d, and the like.

[0019] The upper camera 25a is attached facing downward in the center of the alignment bridge 25c and moves together with the alignment bridge 25c in the horizontal direction (Y direction). The upper camera 25a is provided to align the wafer W on the mounting table 21, and captures an image including the wafer W on the mounting table 21. The upper camera 25a is, for example, a CCD camera or a CMOS camera.

[0020] The guide rails 25b support the alignment bridge 25c so that the alignment bridge 25c is movable in the horizontal direction (Y direction).

[0021] The alignment bridge 25c is supported by a pair of left and right guide rails 25b, and moves in the horizontal direction (Y direction) along the guide rails 25b.

[0022] The lower camera 25d is attached facing upward to the side of the mounting table 21 and moves horizontally (X direction and Y direction) together with the mounting table 21. The lower camera 25d is provided to detect the positions of the multiple probes 24a formed on the probe card 24, and captures an image including the multiple probes 24a. The lower camera 25d is, for example, a CCD camera or a CMOS camera.

[0023] In the alignment mechanism 25, the upper camera 25a moves between a standby position and a position directly below the center of the probe card 24 (hereinafter referred to as the "probe center") via an alignment bridge 25c. During alignment, the upper camera 25a located at the probe center acquires an image including the electrode pads of each chip on the wafer W placed on the placement table 21 while the placement table 21 moves in the horizontal direction (X direction and Y direction), and outputs the acquired image to the controller 30. The lower camera 25d moves to the probe center via the placement table 21. During alignment, the lower camera 25d located at the probe center acquires an image including the multiple probes 24a formed on the probe card 24, and outputs the acquired image to the controller 30.

[0024] The controller 30 is provided below the mounting table 21, and controls the overall operation of the inspection apparatus 1. The controller 30 also performs an alignment method, which will be described later. As shown in Fig. 3, the controller 30 is a computer having a drive device 31, an auxiliary storage device 32, a memory device 33, a CPU 34, an interface device 35, a display device 36, and the like, which are all connected to each other via a bus 38.

[0025] The program for implementing the processing in the controller 30 is provided by a recording medium 37 such as a CD-ROM. When the recording medium 37 storing the program is set in the drive device 31, the program is installed from the recording medium 37 to the auxiliary storage device 32 via the drive device 31. However, the program does not necessarily have to be installed from the recording medium 37, and may be downloaded from another computer via a network.

[0026] The auxiliary storage device 32 stores various information. The various information includes, for example, alignment information calculated in a chip-by-chip mode and a card-by-card mode in an alignment method described later. The alignment information includes the design tilt and center of gravity of the probe group, the measurement tilt and center of gravity of the probe group, the tilt and center of gravity of the probe card 24, the amount of tilt deviation, the amount of center of gravity deviation, etc.

[0027] When an instruction to start a program is received, the memory device 33 reads the program from the auxiliary storage device 32 and stores it.

[0028] The CPU 34 executes functions related to the inspection device 1 in accordance with the programs stored in the memory device 33 .

[0029] The interface device 35 is used as an interface for connecting to a network.

[0030] The display device 36 displays various information and also functions as an operation unit that accepts operations by an operator or the like.

[0031] In the inspection device 1, the alignment mechanism 25 aligns the wafer W with the probe card 24 so that the probes 24a of the probe card 24 accurately contact the electrode pads of each chip on the wafer W placed on the placement table 21. Then, the lifting and rotating mechanism 22 lifts the placement table 21 to bring the probes 24a of the probe card 24 into contact with the corresponding electrode pads. Then, the controller 30 applies a test signal from the tester to each chip on the wafer W via the test head T and the probes 24a, and inspects the electrical characteristics of each chip.

[0032] [Alignment Method] As an example of the alignment method of the embodiment, an alignment method of the probe card 24 including a plurality of probe groups provided corresponding to a plurality of chips in the above-mentioned inspection device 1 will be described with reference to FIGS.

[0033] The alignment method of the embodiment includes selecting either a chip-based mode or a card-based mode. However, the alignment method of the probe card 24 of the embodiment may include the chip-based mode without including the card-based mode.

[0034] The chip-by-chip mode is a mode in which the inclination and center of gravity of the probe group are calculated for each chip, and the inclination and center of gravity of the probe card 24 are calculated based on the calculated inclinations and centers of gravity of the multiple probe groups.

[0035] The card mode is a mode in which the inclination and center of gravity of the probe card 24 are calculated on a probe card basis. That is, the card mode is a mode in which the inclination and center of gravity of the probe card 24 are calculated by regarding the probe card as a single object.

[0036] In the following, an example will be described in which two probe groups PA and PB are provided on the probe card 24. The probe groups PA and PB are provided corresponding to different chips CA. Each chip includes multiple electrode pads, and each of the probe groups PA and PB includes multiple probes corresponding to the multiple electrode pads of each chip.

[0037] The number of probe groups provided on the probe card 24 is not limited to two, and may be, for example, three or more.

[0038] (Chip-by-chip mode) An example of a method for calculating the inclination of the probe card 24 in the chip-by-chip mode will be described with reference to Fig. 4. Fig. 4 shows an example of a method for calculating the inclination of the probe card 24 in the chip-by-chip mode, in which Fig. 4(a) is a diagram for explaining design position information of the probe group, and Fig. 4(b) is a diagram for explaining measurement position information of the probe group.

[0039] First, as shown in FIG. 4A, the controller 30 calculates the design gradient (vector V AThe two or more probes included in the probe group PA include, for example, two or more probes among the probes PA1 to PA4 located at the four corners of the probe group PA. In addition, the controller 30 calculates the design gradient (vector V B ) is calculated. The two or more probes included in the probe group PB include, for example, two or more probes among the probes PB1 to PB4 located at the four corners of the probe group PB. The design position information of the two or more probes included in the probe group PA and the design position information of the two or more probes included in the probe group PB may be, for example, needle position information obtained from the design value of the probe card 24. Furthermore, the position information may be, for example, needle position information obtained by teaching the probe card 24.

[0040] The controller 30 also calculates the designed inclination of the probe group PA (vector V A ) and the designed inclination of the probe group PB (vector V B ) and the designed inclination (vector V A+B ) is calculated. The designed inclination of the probe card 24 (vector V A+B ) is, for example, the design slope of the probe group PA (vector V A ) and the designed inclination of the probe group PB (vector V B ) may be the average or median.

[0041] Next, as shown in FIG. 4B, the controller 30 calculates the measurement gradient (vector V A The two or more probes included in the probe group PA include, for example, two or more of the probes PA1' to PA4' located at the four corners of the probe group PA. In addition, the controller 30 calculates the measurement gradient (vector V BThe two or more probes included in the probe group PB include, for example, two or more probes among the probes PB1' to PB4' located at the four corners of the probe group PB. The measurement position information of the two or more probes included in the probe group PA and the measurement position information of the two or more probes included in the probe group PB may be, for example, needle position information obtained by capturing an image of the probe card 24 with the lower camera 25d.

[0042] The controller 30 also calculates the measured gradient of the probe group PA (vector V A ') and the measured inclination of the probe group PB (vector V B Based on the measured slope (vector V A+B The measured inclination of the probe card 24 (vector V A+B ') is, for example, the measured slope of the probe group PA (vector V A ') and the measured inclination of the probe group PB (vector V B ') may be the mean or median.

[0043] Next, the controller 30 calculates the design slope of the probe group PA (vector V A+B ) to the measured slope of the probe group PA (vector V A+B The amount of deviation of the vector V A+B '- Vector V A+B The calculated tilt deviation amount is used when aligning the electrode pads of each chip on the wafer W placed on the mounting table 21 with the multiple probes 24a formed on the probe card 24.

[0044] An example of a method for calculating the center of gravity of the probe card 24 in the chip unit mode will be described with reference to Fig. 5. Fig. 5 is a diagram showing an example of a method for calculating the center of gravity of the probe card 24 in the chip unit mode, in which Fig. 5(a) is a diagram for explaining design position information of the probe group, and Fig. 5(b) is a diagram for explaining measurement position information of the probe group.

[0045] First, as shown in FIG. 5A, the controller 30 calculates the design center of gravity G of the probe group PA based on the design position information of two or more probes included in the probe group PA. A The two or more probes included in the probe group PA include, for example, two or more probes among the probes PA1 to PA4 located at the four corners of the probe group PA. In addition, the controller 30 calculates the design center of gravity G of the probe group PB based on the design position information of the two or more probes included in the probe group PB. B The two or more probes included in the probe group PB include, for example, two or more probes among the probes PB1 to PB4 located at the four corners of the probe group PB. In addition, the controller 30 calculates the design center of gravity G of the probe group PA. A and the design center of gravity G of the probe group PB B Based on the above, the design center of gravity G of the probe card 24 is A+B The design center of gravity G of the probe card 24 is calculated. A+B For example, the design center of gravity G of the probe group PA A and the design center of gravity G of the probe group PB B It may be the average or median of the above.

[0046] Next, as shown in FIG. 5B, the controller 30 calculates the center of gravity G of the probe group PA based on the position information of two or more probes included in the probe group PA. A The two or more probes included in the probe group PA include, for example, two or more probes among the probes PA1' to PA4' located at the four corners of the probe group PA. In addition, the controller 30 calculates the measurement center of gravity G of the probe group PB based on the measurement position information of the two or more probes included in the probe group PB. B The two or more probes included in the probe group PB include, for example, two or more probes among the probes PB1' to PB4' located at the four corners of the probe group PB. The controller 30 also calculates the center of gravity G A ' and the measured center of gravity G of the probe group PB B ' and based on the measured center of gravity G of the probe card 24 A+BCalculate the center of gravity G of the probe card 24 on the measurement. A+B ' is the measured center of gravity G of the probe group PA, for example. A ' and the measured center of gravity G of the probe group PB B ' may be the mean or median.

[0047] Next, the controller 30 calculates the design center of gravity G of the probe card 24. A+B The center of gravity G of the probe card 24 on the measurement A+B The amount of deviation of the center of gravity G A+B '-G A+B The calculated center of gravity deviation amount is used when aligning the electrode pads of each chip on the wafer W placed on the mounting table 21 with the multiple probes 24a formed on the probe card 24.

[0048] Furthermore, the controller 30 may store the alignment information calculated in the chip-by-chip mode in the auxiliary storage device 32. The alignment information includes the design tilt and center of gravity of the probe groups PA and PB, the measurement tilt and center of gravity of the probe groups PA and PB, the tilt and center of gravity of the probe card 24, the amount of tilt deviation, the amount of center of gravity deviation, and the like.

[0049] (Card-by-card mode) An example of a method for calculating the inclination of the probe card 24 in the card-based mode will be described with reference to Fig. 6. Fig. 6 shows an example of a method for calculating the inclination of the probe card 24 in the card-based mode, in which Fig. 6(a) is a diagram for explaining design position information of the probe group, and Fig. 6(b) is a diagram for explaining measurement position information of the probe group.

[0050] First, as shown in FIG. 6A, the controller 30 calculates the designed inclination (vector V AB For example, the total P of the probe groups PA and PB is calculated for two or more probes included in the probe groups PA and PB. ABThe probe groups PA and PB include two or more of the probes P1 to P4 located at the four corners of the probe card 24. Design position information of the two or more probes included in the probe groups PA and PB may be, for example, needle position information obtained from the design value of the probe card 24. The position information may also be, for example, needle position information obtained by teaching the probe card 24.

[0051] Next, as shown in FIG. 6B, the controller 30 calculates the measurement tilt (vector V AB For example, the total P of the probe groups PA and PB is calculated for two or more probes included in the probe groups PA and PB. AB The probe groups PA and PB include two or more of the probes P1' to P4' located at the four corners of the probe card 24. The measurement position information of the two or more probes included in the probe groups PA and PB may be, for example, needle position information obtained by capturing an image of the probe card 24 with the lower camera 25d.

[0052] The controller 30 then calculates the designed tilt of the probe card 24 (vector V AB ) to the measured inclination of the probe card 24 (vector V AB The amount of deviation of the vector V AB '- Vector V AB The calculated tilt deviation amount is used when aligning the electrode pads of each chip on the wafer W placed on the mounting table 21 with the multiple probes 24a formed on the probe card 24.

[0053] An example of a method for calculating the center of gravity of the probe card 24 in the card-based mode will be described with reference to Fig. 7. Fig. 7 shows an example of a method for calculating the center of gravity of the probe card 24 in the card-based mode, in which Fig. 7(a) is a diagram for explaining design position information of the probe group, and Fig. 7(b) is a diagram for explaining measurement position information of the probe group.

[0054] First, as shown in FIG. 7A, the controller 30 calculates the design center of gravity G of the probe card 24 based on the design position information of two or more probes included in the probe groups PA and PB. AB The two or more probes included in the probe groups PA and PB include, for example, two or more probes out of the probes P1 to P4 located at the four corners of the entire probe groups PA and PB.

[0055] Next, as shown in FIG. 7B, the controller 30 calculates the measurement center of gravity G of the probe card 24 based on the measurement position information of two or more probes included in the probe groups PA and PB. AB The two or more probes included in the probe groups PA and PB include, for example, two or more probes among probes P1' to P4' located at the four corners of the entire probe groups PA and PB.

[0056] Next, the controller 30 calculates the design center of gravity G of the probe card 24. AB The center of gravity G of the probe card 24 on the measurement AB The amount of deviation of the center of gravity G AB '-G AB The calculated center of gravity deviation amount is used when aligning the electrode pads of each chip on the wafer W placed on the mounting table 21 with the multiple probes 24a formed on the probe card 24.

[0057] Furthermore, the controller 30 may store the alignment information calculated in the card-by-card mode in the auxiliary storage device 32. The alignment information includes the tilt and center of gravity of the probe card 24, the amount of tilt deviation, the amount of center of gravity deviation, and the like.

[0058] [Alignment of probe card and wafer] An example of the positional relationship between the probe group and the chip when the chip-unit mode is selected in the alignment method of the embodiment will be described with reference to Fig. 8. Fig. 8 is a diagram for explaining the positional relationship between the probe group and the chip in the chip-unit mode.

[0059] First, as shown in FIG. 8(a), the controller 30 calculates the designed inclination (vector V A ) and the designed inclination of the probe group PB (vector V B ) and the designed inclination (vector V A+B 8(a), the controller 30 calculates the design center of gravity G A and the design center of gravity G of the probe group PB B Based on the above, the design center of gravity G of the probe card 24 is A+B In addition, the designed inclination of the probe card 24 (vector V A+B ) and the design center of gravity G of the probe card 24 A+B The calculation methods of may be the same as those described with reference to FIG. 4(a) and FIG. 5(a), respectively.

[0060] Next, as shown in FIG. 8(b), the controller 30 calculates the measured slope (vector V A ') and the measured inclination of the probe group PB (vector V B Based on the measured slope (vector V A+B 8(b), the controller 30 calculates the center of gravity G A ' and the measured center of gravity G of the probe group PB B ' and based on the measured center of gravity G of the probe card 24 A+B The measurement inclination of the probe card 24 (vector V A+B ') and the measured center of gravity G of the probe card 24 A+B The calculation method of ' may be the same as the method described with reference to FIG. 4(b) and FIG. 5(b), respectively.

[0061] The controller 30 then calculates the designed tilt of the probe card 24 (vector V A+B ) to the measured inclination of the probe card 24 (vector V A+B The amount of deviation of the vector V A+B '- Vector VA+B In the example of FIG. 8(a) and FIG. 8(b), the designed inclination of the probe card 24 (vector V A+B ) and the measured inclination of the probe card 24 (vector V A+B Since the center of gravity G′ of the probe card 24 is equal to the center of gravity G of the probe card 24, the tilt deviation of the probe card 24 is zero. A+B The center of gravity G of the probe card 24 on the measurement A+B The amount of deviation of the center of gravity G A+B '-G A+B Calculate.

[0062] 8(c), the controller 30 aligns the electrode pads of the chips CA, CB on the wafer W with the probe groups PA, PB of the probe card 24 based on the calculated tilt misalignment amount and center of gravity misalignment amount of the probe card 24. At this time, since the tilt misalignment amount of the probe card 24 is zero as described above, the wafer W is aligned with the probe card 24 by horizontally moving the wafer W by the amount of the center of gravity misalignment amount of the probe card 24.

[0063] An example of the positional relationship between the probe group and the chip in the card unit mode in the alignment method of the embodiment will be described with reference to Fig. 9. Fig. 9 is a diagram for explaining the positional relationship between the probe group and the chip when the card unit mode is selected.

[0064] First, as shown in FIG. 9(a), the controller 30 calculates the designed tilt (vector V AB ) and the design center of gravity G of the probe card 24 AB In addition, the designed inclination of the probe card 24 (vector V AB ) and the design center of gravity G of the probe card 24 AB The calculation methods of may be the same as those described with reference to FIG. 6(a) and FIG. 7(a), respectively.

[0065] Next, as shown in FIG. 9(b), the controller 30 calculates the measured tilt of the probe card 24 (vector V AB ') and the measured center of gravity G of the probe card 24 AB The measurement inclination of the probe card 24 (vector V AB ') and the measured center of gravity G of the probe card 24 AB The calculation method of ' may be the same as the method described with reference to FIG. 6(b) and FIG. 7(b), respectively.

[0066] The controller 30 then calculates the designed tilt of the probe card 24 (vector V AB ) to the measured inclination of the probe card 24 (vector V AB The amount of deviation of the vector V AB '- Vector V AB The controller 30 also calculates the design center of gravity G of the probe card 24. AB The center of gravity G of the probe card 24 on the measurement AB The amount of deviation of the center of gravity G AB '-G AB Calculate.

[0067] 9(c), the controller 30 aligns the electrode pads of the chips CA, CB on the wafer W with the probe groups PA, PB of the probe card 24 based on the amount of tilt misalignment and the amount of center of gravity misalignment of the probe card 24. At this time, the wafer W is rotated by the amount of tilt misalignment of the probe card 24 and moved horizontally by the amount of center of gravity misalignment of the probe card 24 to align the wafer W with the probe card 24.

[0068] As described above, the alignment method of the embodiment includes a chip-by-chip mode in which the inclination and center of gravity of the probe group are calculated for each chip, and the inclination and center of gravity of the probe card 24 are calculated based on the calculated inclination and center of gravity of the multiple probe groups. This makes it possible to align the electrode pads and the probes with high accuracy even when there is misalignment between chips.

[0069] According to the alignment method of the embodiment, the alignment method includes selecting either the chip unit mode or the card unit mode, so that the user can select either the chip unit mode or the card unit mode according to the type of the probe card to perform alignment of the probe card.

[0070] In the above embodiment, the case where the user selects either the chip unit mode or the card unit mode to perform the alignment method of the probe card 24 has been described, but the present invention is not limited to this. For example, the user may select the chip unit mode to calculate the inclination of the probe card 24, and select the card unit mode to calculate the center of gravity of the probe card 24. Also, for example, the user may select the card unit mode to calculate the inclination of the probe card 24, and select the chip unit mode to calculate the center of gravity of the probe card 24.

[0071] In the above embodiment, the controller 30 is an example of a control unit.

[0072] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0073] 24 Probe Card 24a Probe CA,CB chip PA,PB probe group

Claims

1. A method for aligning a probe card including a plurality of probe groups provided corresponding to a plurality of chips, comprising the steps of: calculating a design inclination and a design center of gravity of each probe group based on design position information of two or more probes included in each probe group, and calculating a design inclination and a design center of gravity of a probe card based on the calculated design inclination and design center of gravity of each probe group; calculating a measurement inclination and a measurement center of gravity of each probe group based on measurement position information of two or more probes included in each probe group, and calculating a measurement inclination and a measurement center of gravity of a probe card based on the calculated measurement inclination and measurement center of gravity of each probe group; a first mode for calculating an inclination deviation amount, which is a deviation amount of a measured inclination of the probe card from a designed inclination of the probe card, and a center of gravity deviation amount, which is a deviation amount of a measured center of gravity of the probe card from a designed center of gravity of the probe card, Alignment method.

2. The two or more probes include two or more probes located at the four corners of the probe group.

2. The alignment method according to claim 1.

3. Calculating a design tilt of the probe card and a design center of gravity of the probe card based on design position information of two or more probes included in the plurality of probe groups; Calculating a measurement tilt of the probe card and a measurement center of gravity of the probe card based on measurement position information of two or more probes included in the plurality of probe groups; a second mode for calculating an inclination deviation amount, which is a deviation amount of a measured inclination of the probe card from a designed inclination of the probe card, and a center of gravity deviation amount, which is a deviation amount of a measured center of gravity of the probe card from a designed center of gravity of the probe card, 3. The alignment method according to claim 1 or 2.

4. The two or more probes include two or more probes located at four corners of the plurality of probe groups. The alignment method according to claim 3 .

5. selecting one of the first mode and the second mode; 5. The alignment method according to claim 3 or 4.

6. A mounting table on which a substrate is placed; a probe card including a plurality of probe groups provided corresponding to each of the plurality of chips formed on the substrate; A control unit; Equipped with The control unit is calculating a design inclination and a design center of gravity of each probe group based on design position information of two or more probes included in each probe group, and calculating a design inclination and a design center of gravity of a probe card based on the calculated design inclination and design center of gravity of each probe group; calculating a measurement inclination and a measurement center of gravity of each probe group based on measurement position information of two or more probes included in each probe group, and calculating a measurement inclination and a measurement center of gravity of a probe card based on the calculated measurement inclination and measurement center of gravity of each probe group; The apparatus is configured to execute a first mode for calculating an inclination deviation amount, which is a deviation amount of a measured inclination of the probe card from a designed inclination of the probe card, and a center of gravity deviation amount, which is a deviation amount of a measured center of gravity of the probe card from a designed center of gravity of the probe card. Inspection equipment.

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