Resin composition for dicing film substrate, dicing film substrate, and dicing film

Abstract

The present invention addresses the problem of providing a resin composition for dicing film substrates which is able to form dicing film substrates excellent in terms of ordinary-temperature and low-temperature stretchability and ordinary-temperature and low-temperature modulus strength. The resin composition for dicing film substrates comprises an ionomer (A) of an ethylene / (unsaturated carboxylic acid)-based copolymer, a polyamide (B), and a styrene-based resin (C).

Description

[Technical field]

[0001] The present invention relates to a resin composition for a dicing film substrate, a dicing film substrate, and a dicing film. [Background technology]

[0002] In the manufacturing process of semiconductor devices such as ICs (integrated circuits), a semiconductor wafer on which a circuit pattern is formed is generally thinned, and then a dicing process is performed to divide the semiconductor wafer into chip units. In the dicing process, a stretchable wafer processing film (also referred to as a "dicing film" in this specification) is attached to the back surface of the semiconductor wafer, and the semiconductor wafer is divided into chip units by a dicing blade, laser light, or the like. Then, in an expansion process, the dicing film is expanded to increase the distance between the chips, and the chips are divided into small pieces. In the expansion process, for example, an expansion table arranged under the dicing film is pushed up to expand the dicing film and divide the chips.

[0003] Then, in a pick-up process, only the desired chip is picked up from the dicing film and used for the desired purpose. In the pick-up process, the desired chip is generally picked up by pushing it up from the dicing film side with a fine pin.

[0004] Here, an ionomer in which an ethylene-(meth)acrylic acid copolymer is crosslinked with a metal ion is known as a material constituting a dicing film. For example, Patent Document 1 describes a radiation-curable adhesive tape for wafer processing, which contains an antistatic resin containing a polyether component and the above-mentioned ionomer. Patent Document 2 describes a resin composition for dicing film substrates, which contains the above-mentioned ionomer, a copolymer of ethylene, (meth)acrylic acid, and an alkyl (meth)acrylic ester.

[0005] Furthermore, Patent Document 3 describes an ionomer / polyamide blend containing an ionomer of a copolymer of ethylene and an α,β-ethylenically unsaturated carboxylic acid and a polyamide as a resin composition used for molded parts and the like. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2011-210887 A [Patent Document 2] JP 2012-89732 A [Patent Document 3] Special Publication No. 2000-516984 Summary of the Invention [Problem to be solved by the invention]

[0007] Here, in order to properly pick up only the desired chips in the above-mentioned pick-up process, it is important that the dicing film around the chips stretches sufficiently (hereinafter also referred to as "room temperature extensibility"). If the dicing film does not stretch sufficiently and multiple chips are pushed up by the fine pins, a phenomenon may occur in which chips that are not the targets of pick-up are peeled off from the dicing film. In addition, if the room temperature extensibility of the dicing film is low, stress is applied to the chips in the pick-up process, which may cause damage inside the chips. If these problems occur, the product yield will decrease and the number of defective products will increase.

[0008] However, Patent Document 1 does not focus on the extensibility of the adhesive tape for wafer processing itself. Furthermore, Patent Document 2 evaluates the heat resistance of the dicing film (e.g., extensibility at 120°C), but does not focus on the extensibility at room temperature. Furthermore, the ionomer / polyamide blend of Patent Document 3 contains a large amount of polyamide, making it difficult to mold it into a film.

[0009] In addition to the room temperature elongation, the resin composition for dicing film substrate is required to have the modulus strength of the dicing film at room temperature or low temperature, and may also require elongation at low temperature. Specifically, in the case of a dicing-die-bonding integrated film, there is a process of dividing and expanding the chip and the die-bonding film at low temperature, and the modulus strength required for division and the film elongation required for expansion are required. In addition, at room temperature, the modulus strength for maintaining the chip gap constant after division and the film elongation required during the pick-up process as described above are required. However, in the past, there has been no attempt to achieve both the modulus strength at room temperature or low temperature and the elongation at room temperature and low temperature.

[0010] The present invention has been made in view of the above problems, and aims to provide a resin composition for a dicing film substrate, a dicing film substrate, and a dicing film, which are capable of realizing a dicing film substrate having excellent elongation at room temperature and low temperature and also excellent modulus strength at room temperature and low temperature. [Means for solving the problem]

[0011] That is, the present invention provides the following resin composition for a dicing film substrate. [1] A resin composition for use as a dicing film substrate, comprising: an ionomer (A) of an ethylene-unsaturated carboxylic acid copolymer; a polyamide (B); and a styrene-based resin (C).

[0012] [2] The resin composition for dicing film substrates according to [1], wherein the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer is an ionomer of an ethylene-unsaturated carboxylic acid-unsaturated carboxylic acid ester copolymer.

[0013] [3] The resin composition for dicing film substrates according to [1] or [2], wherein the amount of structural units derived from an unsaturated carboxylic acid in the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer is 1 mass% or more and 30 mass% or less relative to the amount of all structural units of the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer.

[0014] [4] The resin composition for dicing film substrates according to any one of [1] to [3], wherein the degree of neutralization of the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer is 10% or more and 90% or less. [5] The resin composition for dicing film substrates according to any one of [1] to [4], wherein the styrene-based resin (C) is a styrene-based elastomer.

[0015] [6] The resin composition for dicing film substrates according to any one of [1] to [5], wherein the content of the styrene-based resin (C) is from 1% by mass to 40% by mass. [7] The resin composition for dicing film substrates according to any one of [1] to [6], wherein the content of the ionomer (A) in the ethylene-unsaturated carboxylic acid-based copolymer is equal to or greater than the total content of the polyamide (B) and the styrene-based resin (C). [8] The resin composition for dicing film substrates according to any one of [1] to [7], which has a melt flow rate of 0.1 g / 10 min or more and 30 g / 10 min or less, as measured at 230° C. under a load of 2160 g in accordance with JIS K 7210:1999.

[0016] The present invention provides the following dicing film substrate and dicing film. [9] A dicing film substrate comprising at least one layer containing the resin composition for dicing film substrates according to any one of [1] to [8] above.

[10] The dicing film substrate according to [9], wherein the layer containing the resin composition for dicing film substrates has an average value of 25% modulus in MD and 25% modulus in TD measured at 23°C in accordance with JIS K 7127:1999 of 7 MPa or more and 13 MPa or less.

[11] The dicing film substrate according to [9] or

[10] , wherein the average value of the 10% modulus in the MD direction and the 10% modulus in the TD direction of the layer containing the resin composition for the dicing film substrate, measured at -15°C in accordance with JIS K 7127:1999, is 15 MPa or more and 30 MPa or less.

[12] A dicing film comprising the dicing film substrate according to

[11] above and an adhesive layer laminated on at least one surface of the dicing film substrate. Effect of the Invention

[0017] According to the resin composition for a dicing film substrate of the present invention, a dicing film substrate having excellent elongation at room temperature and low temperature, and further having excellent modulus strength at room temperature and low temperature, can be realized. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] In this specification, a numerical range expressed using "~" means a range including the numerical values ​​before and after "~" as the lower and upper limits. In addition, "(meth)acrylic acid" is a notation used to include both "acrylic acid" and "methacrylic acid", and "(meth)acrylate" is a notation used to include both "acrylate" and "methacrylate".

[0019] 1. Resin composition for dicing film substrate The resin composition for a dicing film substrate of the present invention (hereinafter also simply referred to as "resin composition") is mainly used as a substrate for a dicing film, but the use of the resin composition is not limited to the substrate for a dicing film.

[0020] As described above, the substrate for the dicing film is required to have not only modulus strength at room temperature and low temperature but also elongation at room temperature and low temperature. However, no attempt has been made to achieve both of these properties at the same time.

[0021] In response to this, the present inventors conducted extensive research and found that a resin composition containing an ionomer (A) of an ethylene-unsaturated carboxylic acid copolymer, a polyamide (B), and a styrene-based resin (C) can provide a dicing film substrate that has both modulus strength at room temperature and low temperature and elongation at room temperature and low temperature. The reason for this is considered as follows. That is, in conventional resin compositions containing different materials, the uniformity of each material in the resin composition was low. When the resin composition was made into a film, the physical properties, especially in the TD direction, tended to decrease due to the influence of orientation. In contrast, a resin composition containing an ionomer (A), a polyamide (B), and a styrene-based resin (C) has good compatibility and can maintain the characteristics of each material without decreasing uniformity. Below, each component contained in the resin composition will be described, and then the physical properties of the resin composition will be described.

[0022] <Ionomer of ethylene-unsaturated carboxylic acid copolymer (A)> The ionomer (A) of an ethylene-unsaturated carboxylic acid copolymer (hereinafter also simply referred to as "ionomer (A)") is an ethylene-unsaturated carboxylic acid copolymer in which a part or all of the acid contained therein has been neutralized with metal ions, and has a structure in which a plurality of ethylene-unsaturated carboxylic acid copolymers are crosslinked. The resin composition may contain only one type of ionomer (A), or may contain two or more types.

[0023] The ethylene-unsaturated carboxylic acid copolymer which is the main skeleton of the ionomer (A) may be any copolymer of ethylene and an unsaturated carboxylic acid, for example, a copolymer (binary copolymer) of ethylene and an unsaturated carboxylic acid, or a copolymer (multi-component copolymer) obtained by copolymerizing ethylene, an unsaturated carboxylic acid, and a monomer other than these.

[0024] The ethylene-unsaturated carboxylic acid copolymer may be a block copolymer or a random copolymer, or may be a graft copolymer in which a known compound is graft-polymerized onto a random or block polymer.

[0025] The above-mentioned ethylene-unsaturated carboxylic acid copolymer is preferably a binary random copolymer, a ternary random copolymer, a graft copolymer of a binary random copolymer, or a graft copolymer of a ternary random copolymer, more preferably a binary random copolymer or a ternary random copolymer, and even more preferably a ternary random copolymer.

[0026] Examples of unsaturated carboxylic acids that can be used as raw materials for the ethylene-unsaturated carboxylic acid copolymer include unsaturated carboxylic acids having 4 to 8 carbon atoms, such as acrylic acid, methacrylic acid, ethacrylic acid, itaconic acid, itaconic anhydride, fumaric acid, crotonic acid, maleic acid, and maleic anhydride. Among these, acrylic acid and methacrylic acid are preferred from the viewpoints of reactivity and availability.

[0027] Examples of other monomers that can be used as raw materials for the ethylene-unsaturated carboxylic acid copolymer include unsaturated carboxylic acid esters such as (meth)acrylic acid alkyl esters; unsaturated hydrocarbons such as propylene, butene, 1,3-butadiene, pentene, 1,3-pentadiene, and 1-hexene; vinyl esters derived from vinyl acetate, vinyl propionate, and the like; oxides such as vinyl sulfate and vinyl nitrate; halogen compounds such as vinyl chloride and vinyl fluoride; primary amine compounds containing vinyl groups; secondary amine compounds containing vinyl groups; carbon monoxide; and sulfur dioxide. Among these, from the viewpoints of reactivity and availability, unsaturated carboxylic acid esters or unsaturated hydrocarbons are preferred, and unsaturated carboxylic acid esters are more preferred. In other words, it is particularly preferred that the ethylene-unsaturated carboxylic acid-based copolymer that is the main skeleton of the ionomer (A) of the present invention is an ethylene-unsaturated carboxylic acid-unsaturated carboxylic acid ester copolymer.

[0028] Examples of the unsaturated carboxylate ester include unsaturated carboxylate alkyl esters having an alkyl group with a carbon number of 1 to 12 at the ester moiety. The number of carbon atoms in the alkyl group is more preferably 1 to 8, and further preferably 1 to 4. Examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a secondary butyl group, a 2-ethylhexyl group, an isooctyl group, and the like.

[0029] Specific examples of the unsaturated carboxylic acid alkyl ester include (meth)acrylic acid methyl ester, (meth)acrylic acid ethyl ester, (meth)acrylic acid isobutyl ester, acrylic acid n-butyl ester, acrylic acid isooctyl ester, maleic acid dimethyl ester, maleic acid diethyl ester, and the like.

[0030] Specific examples of the ethylene-unsaturated carboxylic acid copolymer include binary copolymers such as ethylene-acrylic acid copolymer and ethylene-methacrylic acid copolymer; and terpolymers such as ethylene-methacrylic acid-n-butyl acrylate copolymer and ethylene-methacrylic acid-isobutyl acrylate copolymer; and the like.

[0031] The ionomer (A) of the present invention is obtained by crosslinking (neutralizing) the carboxyl groups contained in the above-mentioned ethylene-unsaturated carboxylic acid copolymer with metal ions at an arbitrary ratio.

[0032] The amount of the unsaturated carboxylic acid-derived structural units in the ionomer (A), i.e., the amount of the unsaturated carboxylic acid-derived structural units relative to the total structural units of the ethylene-unsaturated carboxylic acid copolymer, is preferably 1% by mass or more and 30% by mass or less, more preferably 4% by mass or more and 25% by mass or less, even more preferably 5% by mass or more and 20% by mass or less, and particularly preferably 6% by mass or more and 15% by mass or less. When the amount of the unsaturated carboxylic acid-derived structural units in the ionomer (A) is 4% by mass or more, the modulus strength and elongation are likely to be better. On the other hand, when the amount of the unsaturated carboxylic acid-derived structural units is 25% by mass or less, blocking is unlikely to occur, fusion is unlikely to occur, and handling is likely to be easy.

[0033] Furthermore, when the ionomer (A) contains a constituent unit derived from another monomer (e.g., an unsaturated carboxylic acid ester), the amount of the constituent units derived from the other monomer in the ionomer (A), i.e., the amount of the constituent units derived from the other monomer relative to the total constituent units of the ethylene-unsaturated carboxylic acid copolymer, is preferably 1% by mass or more and 20% by mass or less, more preferably 5% by mass or more and 15% by mass or less. When the amount of the constituent units derived from the other monomer is 1% by mass or more, the elongation of the resin composition when used as a substrate for a dicing film tends to be good. On the other hand, when the amount of the constituent units derived from the other monomer is 20% by mass or less, when the resin composition is used as a substrate for a dicing film, the substrate is less likely to block and is less likely to fuse.

[0034] In the ionomer (A), the metal ion that neutralizes the acid of the ethylene-unsaturated carboxylic acid copolymer is not particularly limited, but examples thereof include lithium ion, sodium ion, potassium ion, rubidium ion, cesium ion, zinc ion, magnesium ion, manganese ion, etc. Among these, from the viewpoint of availability, etc., magnesium ion, sodium ion, or zinc ion is preferred, sodium ion or zinc ion is more preferred, and zinc ion is even more preferred.

[0035] The neutralization degree of the ethylene-unsaturated carboxylic acid copolymer in the ionomer (A) is preferably 10% or more and 90% or less, more preferably 10% or more and 85% or less, and even more preferably 15% or more and 82% or less. When the neutralization degree of the ethylene-unsaturated carboxylic acid copolymer is 10% or more, when the resin composition is used as a base material for a dicing film, the hardness of the base material surface increases. On the other hand, when the neutralization degree is 90% or less, the processability and moldability of the resin composition are improved. The neutralization degree is the ratio of the number of moles of metal ions to the number of moles of acid groups (e.g., carboxy groups) possessed by the ethylene-unsaturated carboxylic acid copolymer. The neutralization degree can be measured by infrared absorption spectroscopy (IR). By measuring the C=O stretching absorption peak of the resin using infrared absorption spectroscopy, the amount of non-ionized carboxy groups can be quantified, and by measuring the C=O stretching absorption peak of the hydrochloric acid-treated resin, the amount of carboxy groups in the entire resin can be quantified. The neutralization degree can be obtained by measuring both, and specifically, it can be calculated by the following formula. Neutralization degree (%)=(1-P1 / P2)×100 P1: C=O stretching absorption peak height of ethylene copolymer resin P2: C=O stretching absorption peak height of ethylene copolymer resin treated with hydrochloric acid

[0036] The melt flow rate (MFR) of the ionomer (A) is preferably 0.2 g / 10 min or more and 20.0 g / 10 min or less, more preferably 0.5 g / 10 min or more and 20.0 g / 10 min or less, and even more preferably 0.5 g / 10 min or more and 18.0 g / 10 min or less. When the melt flow rate of the ionomer (A) is within the above range, the resin composition is easily molded. The melt flow rate of the ionomer (A) is a value measured at 190°C and a load of 2160 g in accordance with JIS K 7210:1999 (corresponding to ISO 1133:1997).

[0037] Here, the content of the ionomer (A) in the resin composition is preferably 30 parts by mass or more and 95 parts by mass or less, preferably 40 parts by mass or more and 90 parts by mass or less, more preferably 45 parts by mass or more and 90 parts by mass or less, based on 100 parts by mass of the total of the ionomer (A), the polyamide (B) described below, and the styrene-based resin (C) described below. When the amount of the ionomer (A) is 30 parts by mass or more, the elongation at room temperature and the elongation at low temperature of the substrate obtained from the resin composition become good. On the other hand, when the amount of the ionomer (A) is 95 parts by mass or less, the amount of the polyamide (B) and the styrene-based resin (C) becomes relatively large enough, and the modulus strength at room temperature and low temperature and the elongation at room temperature and low temperature of the substrate obtained from the resin composition become good.

[0038] The amount of ionomer (A) in the resin composition is preferably equal to or more than the sum of the amount of polyamide (B) and the amount of styrene-based resin (C), and is preferably 1.0 to 10 times, more preferably 1.0 to 7 times, the sum of the amount of polyamide (B) and the amount of styrene-based resin (C). This improves the expandability (expandability) of the substrate obtained from the resin composition at room temperature and low temperature.

[0039] <Polyamide (B)> The polyamide (B) may be any resin containing two or more amide groups. Generally, the above-mentioned ionomer (A) has a low melting point and tends to have low heat resistance, but by combining such an ionomer (A) with a polyamide (B), the heat resistance of the resin composition, and thus the substrate for the dicing film, becomes very good. In addition, by combining the above-mentioned ionomer (A) with a polyamide (B), good modulus strength and severability can be obtained when the resin composition is used as the substrate for the dicing film.

[0040] The polyamide (B) may be a polycondensate of a dicarboxylic acid and a diamine. Examples of the dicarboxylic acid include oxalic acid, adipic acid, sebacic acid, dodecanedioic acid, terephthalic acid, isophthalic acid, 1,4-cyclohexanedicarboxylic acid, etc. Examples of the diamine include ethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, decamethylenediamine, 1,4-cyclohexyldiamine, m-xylylenediamine, etc.

[0041] The polyamide (B) may be a ring-opening polymer of a cyclic lactam such as ε-caprolactam or ω-laurolactam, or a polycondensate of an aminocarboxylic acid such as 6-aminocaproic acid, 9-aminononanoic acid, 11-aminoundecanoic acid, or 12-aminododecanoic acid, or a copolymer of the above-mentioned cyclic lactam, a dicarboxylic acid, and a diamine.

[0042] Specific examples of polyamide (B) include nylon 4, nylon 6, nylon 46, nylon 66, nylon 610, nylon 612, nylon 6T, nylon 11, nylon 12, nylon MXD6, nylon 46, or copolymers thereof (e.g., nylon 6 / 66, nylon 6 / 12, nylon 6 / 610, nylon 66 / 12, nylon 6 / 66 / 610), etc. Among these, nylon 6 and nylon 6 / 12 are preferred from the viewpoints of improving low-temperature splitting properties and easy availability.

[0043] The melting point of the polyamide (B) is preferably 160°C or more and 250°C or less, more preferably 170°C or more and 240°C or less, and even more preferably 180°C or more and 235°C or less. When the melting point of the polyamide (B) is 160°C or more, the heat resistance of the substrate for the dicing film obtained from the resin composition tends to be good. On the other hand, when the melting point of the polyamide (B) is 250°C or less, the processability of the resin composition is good. The melting point of the polyamide (B) is measured, for example, by a differential scanning calorimeter (DSC) or the like.

[0044] The density of polyamide (B) is 1060 kg / m 3 More than 1220kg / m 3 Less than 1080kg / m is preferable. 3 More than 1200kg / m 3 Less than 1100kg / m is more preferable. 3 More than 1180kg / m 3 The following is even more preferred: The density of the polyamide (B) is determined in accordance with ISO 1183-3.

[0045] The content of the polyamide (B) is preferably 5 parts by mass or more and less than 40 parts by mass, preferably 5 parts by mass or more and 35 parts by mass or less, and more preferably 5 parts by mass or more and 30 parts by mass or less, based on 100 parts by mass of the total of the ionomer (A), polyamide (B), and styrene-based resin (C) described below. When the amount of polyamide (B) is 5 parts by mass or more, the heat resistance and low-temperature modulus strength of the substrate obtained from the resin composition are good. On the other hand, when the amount of polyamide (B) is less than 40 parts by mass, the moldability of the resin composition is good.

[0046] <Styrene-based resin (C)> The styrene-based resin (C) may be any resin having at least styrene as a constituent unit, and may be a homopolymer of styrene or a polymer of styrene and other monomers. Examples of the styrene-based resin (C) include styrene-based elastomers, ABS-based resins which are copolymers of acrylonitrile and styrene, polystyrene, etc. Among these, styrene-based elastomers are preferred. The styrene-based elastomer refers to a styrene-based polymer which is a rubber elastic body at room temperature.

[0047] Examples of the styrene-based elastomer include a block copolymer containing a hard segment consisting of a styrene block (styrene polymer) and a soft segment consisting of an alkylene block, or a hydrogenated product thereof; a random copolymer of styrene and an alkylene, or a hydrogenated product thereof; or an acid-modified styrene-based elastomer obtained by modifying the styrene-based elastomer with an acid.

[0048] In the block copolymer, the styrene block may be a moiety in which two or more styrenes are polymerized, and the alkylene block may be a moiety in which two or more alkenes are polymerized. The alkylene block may be a homopolymer of one type of alkene or a copolymer of two or more types of alkenes.

[0049] Examples of the block copolymer include styrene-butadiene block copolymer (SB), styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene block copolymer (SI), and styrene-isoprene-styrene block copolymer (SIS).

[0050] As described above, the styrene-based elastomer may be a hydrogenated product of the block copolymer. In the hydrogenated product, both the styrene block and the alkylene block may be hydrogenated, or only one of the styrene block and the alkylene block may be hydrogenated, or only a portion of the styrene block and the alkylene block may be hydrogenated.

[0051] Specific examples of hydrogenated products of the above block copolymers include styrene-ethylene-butylene block copolymer (SEB), which is a hydrogenated product of styrene-butadiene block copolymer (SB), styrene-ethylene-butylene-styrene block copolymer (SEBS), which is a hydrogenated product of styrene-butadiene-styrene block copolymer (SBS), and styrene-ethylene-propylene-styrene block copolymer (SEPS), which is a hydrogenated product of styrene-isoprene-styrene block copolymer (SIS).

[0052] As mentioned above, examples of styrene-based elastomers include random copolymers of styrene and alkylene, such as styrene-butadiene random copolymers, styrene-isoprene random copolymers, styrene-ethylene-butylene random copolymers, styrene-ethylene-propylene random copolymers, styrene-isobutylene random copolymers, and styrene-ethylene-isoprene random copolymers.

[0053] As described above, the styrene-based elastomer may be a hydrogenated product of the random copolymer, examples of which include hydrogenated styrene-butadiene random copolymers (HSBR).

[0054] Of the styrene-based elastomers that have not been acid-modified (described below), among the above, hydrogenated products are preferred, with styrene-ethylene-butylene-styrene block copolymer (SEBS) and styrene-ethylene-propylene-styrene block copolymer (SEPS) being more preferred, and styrene-ethylene-butylene-styrene block copolymer (SEBS) being particularly preferred from the viewpoint of being able to provide good low-temperature elongation and room-temperature elongation for the substrate for dicing film obtained from the resin composition.

[0055] On the other hand, the styrene-based elastomer may be an acid-modified styrene-based elastomer obtained by graft-modifying the above-mentioned block copolymer or random polymer, or an elastomer made of a hydrogenated product thereof, with an unsaturated carboxylic acid or a derivative thereof, as described above. The acid-modified styrene-based elastomer may be the above-mentioned block copolymer or random polymer, or a hydrogenated product thereof, with one type of unsaturated carboxylic acid or a derivative thereof, or may be the graft-modified product with two or more types of unsaturated carboxylic acids or derivatives thereof.

[0056] Examples of unsaturated carboxylic acids to be graft polymerized onto the block copolymers or random copolymers include (meth)acrylic acid, 2-ethylacrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, etc. On the other hand, examples of unsaturated carboxylic acid derivatives to be graft polymerized onto styrene-based elastomers include acid anhydrides such as maleic anhydride, phthalic anhydride, and itaconic anhydride; acid esters such as monomethyl maleate and monoethyl maleate; acid amides; acid halides; etc. Among these, maleic acid or maleic anhydride is preferred from the viewpoint of reactivity with styrene-based elastomers, etc.

[0057] The acid-modified styrene-based elastomer can be obtained by graft polymerizing the block copolymer, random copolymer, etc. with an unsaturated carboxylic acid or its derivative in the presence of a radical initiator. The radical initiator may be any known compound that is used in the graft reaction of polyolefins.

[0058] The acid value of the above acid-modified styrene-based elastomer is 0 mgCH 3 More than ONa / g, 20mgCH 3 Less than ONa / g is preferred, 0 mgCH 3 ONa / g > 11mgCH 3 Less than ONa / g is more preferable, and 0.5 mg CH 3 ONa / g or more 11mgCH 3When the acid value of the acid-modified styrene-based elastomer is within this range, the extensibility at low temperature and room temperature tends to be good.

[0059] Further, examples of the styrene-based resin (C) include ABS-based resins. ABS-based resins are resins containing acrylonitrile-derived structural units and styrene-derived structural units, and examples thereof include rubber-reinforced styrene-based polymers synthesized by various manufacturing methods such as blending, grafting, or graft-blending. Specific examples of ABS resins include those obtained by graft-polymerizing rubber components such as polybutadiene, styrene-butadiene rubber, and ethylene-propylene-diene rubber with styrene and acrylonitrile, and, if necessary, other monomers such as methyl methacrylate, α-methylstyrene, ethylene bismaleimide, and maleimide.

[0060] Examples of the styrene-based resin (C) include polystyrene obtained by polymerizing styrene. Examples of polystyrene include general-purpose polystyrene synthesized by manufacturing methods such as suspension polymerization and continuous polymerization, as well as high-impact polystyrene obtained by graft polymerization of styrene onto a rubber component such as butadiene rubber.

[0061] Regardless of the type of styrene-based resin (C), the melt flow rate is preferably 0.1 g / 10 min to 100 g / 10 min, more preferably 0.5 g / 10 min to 50 g / 10 min. The melt flow rate is a value measured at 230° C. under a load of 2160 g in accordance with JIS K 7210:1999 (corresponding to ISO 1133:1997).

[0062] Regardless of the type of styrene-based resin (C), the Tan δ peak temperature is preferably −60° C. or higher, more preferably −20° C. or higher, even more preferably −10° C. or higher, and particularly preferably 0° C. or higher, from the viewpoint of improving the low-temperature elongation and room-temperature elongation of the substrate for the dicing film obtained. The Tan δ peak temperature is the temperature at which a peak value is shown in a dynamic viscoelasticity test (temperature-dependent measurement 10 Hz) according to JIS K 6394 (corresponding to ISO 4664-1:2005).

[0063] The amount of the styrene-based resin (C) is preferably 1 part by mass or more and 40 parts by mass or less, more preferably 2 parts by mass or more and 40 parts by mass or less, and even more preferably 3 parts by mass or more and 35 parts by mass or less, relative to 100 parts by mass of the total of the ionomer (A), the polyamide (B), and the styrene-based resin (C). When the amount of the styrene-based resin (C) is 1 part by mass or more, the room temperature elongation and low temperature elongation of the substrate obtained from the resin composition are good. On the other hand, when the amount of the styrene-based resin (C) is 40 parts by mass or less, the film moldability of the resin composition is good.

[0064] In the resin composition of the present invention, the total content of the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer, the polyamide (B) and the styrene-based resin (C) is preferably 80% by mass to 100% by mass, more preferably 85% by mass to 100% by mass, even more preferably 90% by mass to 100% by mass, still more preferably more than 95% by mass to 100% by mass, particularly preferably 98% by mass to 100% by mass, and especially preferably 99% by mass to 100% by mass.

[0065] <Other polymers and additives> The resin composition may contain other polymers, various additives, antistatic agents, ultraviolet absorbers, fillers, and the like, as necessary, within the scope of not impairing the effects of the present invention.

[0066] Examples of the other polymers include polyolefins such as polyethylene, polypropylene, etc. The amount of the other polymers in the resin composition is preferably 20 parts by mass or less per 100 parts by mass of the total of the ionomer (A), the polyamide (B), and the styrene-based resin (C).

[0067] On the other hand, examples of the additives include antioxidants, heat stabilizers, light stabilizers, pigments, dyes, lubricants, antiblocking agents, antifungal agents, antibacterial agents, flame retardants, flame retardant assistants, crosslinking agents, crosslinking assistants, foaming agents, foaming assistants, fiber reinforcing materials, and the like.

[0068] Examples of the antistatic agent include low molecular weight antistatic agents and polymeric antistatic agents, with polymeric antistatic agents being preferred. Examples of the polymeric antistatic agent include vinyl copolymers having sulfonate in the molecule, alkylsulfonates, alkylbenzenesulfonates, betaines, and the like. Other examples of the polymeric antistatic agent include inorganic protonic acid salts of polyether, polyamide elastomers, polyester elastomers, polyether amides, or polyether ester amides, and the like. Examples of inorganic protonic acid salts include alkali metal salts, alkaline earth metal salts, zinc salts, or ammonium salts.

[0069] Examples of the ultraviolet absorbing agent include benzophenones, benzoates, benzotriazoles, cyanoacrylates, hindered amines, and the like.

[0070] Examples of fillers include silica, clay, calcium carbonate, barium sulfate, glass beads, talc, and the like.

[0071] The amounts of the additives, antistatic agents, ultraviolet absorbers, and fillers are appropriately selected depending on their types.

[0072] <Method for producing resin composition and physical properties of resin composition> The method for producing the resin composition of the present invention is not particularly limited as long as it is a method capable of mixing the ionomer (A), the polyamide (B), and the styrene-based resin (C), and further, if necessary, other polymers, additives, etc. For example, all the components may be dry-blended and then melt-kneaded, or some of the components may be kneaded first and then the remaining components may be added.

[0073] The shape of the resin composition after the kneading is not particularly limited, and may be, for example, in the form of pellets or may be processed into a long or discrete sheet.

[0074] The melt flow rate of the resin composition measured at 230°C under a load of 2160g in accordance with JIS K 7210:1999 (corresponding to ISO 1133:1997) is preferably 0.1g / 10min to 30g / 10min, more preferably 0.2g / 10min to 15g / 10min, even more preferably 0.5g / 10min to 10g / 10min, and even more preferably 1.0g / 10min to 7g / 10min. When the melt flow rate of the resin composition is within this range, the modulus strength at normal and low temperatures and the elongation at normal and low temperatures of the substrate obtained from the resin composition tend to be good.

[0075] 2. Dicing film substrate The dicing substrate may be a substrate having at least one layer containing the above-mentioned resin composition. The dicing film substrate has a layer containing the above-mentioned resin composition, and therefore exhibits excellent modulus strength and elongation at room temperature and low temperature. The dicing film substrate is preferably used as a substrate for a dicing film, but is not limited to this use.

[0076] The configuration of the dicing film substrate is not particularly limited, and may have only one layer containing the above-mentioned resin composition, or may have two or more layers containing the above-mentioned resin composition. Furthermore, other resin layers may be laminated as necessary.

[0077] Examples of the dicing film substrate include a laminate having a single layer structure consisting of only a layer containing the above-mentioned resin composition, a laminate having a two-layer structure consisting of a layer containing the above-mentioned resin composition and another resin layer, a laminate having a three-layer structure consisting of a layer containing the above-mentioned resin composition / another resin layer / a layer containing the above-mentioned resin composition, etc. In addition to the above, the dicing film substrate may further include a layer containing a pressure-sensitive adhesive, a pressure-sensitive adhesive sheet, etc.

[0078] Here, the layer containing the above-mentioned resin composition may be a layer consisting only of the above-mentioned resin composition, or may be a layer containing the above-mentioned resin composition and other components within a range that does not impair the purpose and effects of the present invention, but it is preferable from the viewpoint of the elongation and modulus strength of the dicing film substrate that it is a layer essentially consisting of the above-mentioned resin composition.

[0079] The thickness of the layer containing the above-mentioned resin composition is not particularly limited, but from the viewpoint of improving the strength, modulus strength, extensibility, etc. of the dicing film substrate, it is preferably 50 μm or more and 200 μm or less, and more preferably 60 μm or more and 180 μm or less.

[0080] In addition, the average value of the 25% modulus in the MD direction (Machine Direction) and the 25% modulus in the TD direction (Transverse Direction) measured at 23°C of the layer containing the resin composition is preferably 7 MPa or more and 13 MPa or less, more preferably 8 MPa or more and 12 MPa or less. When the average value of the 25% modulus at 23°C is within this range, the extensibility of the dicing film substrate at room temperature tends to be good. The 25% modulus is a value measured by preparing a film having a thickness of 100 μm, a length in the TD direction of 10 mm, and a length in the MD direction of 180 mm, which has the same composition as the layer containing the resin composition, and measuring the film in accordance with JIS K 7127:1999 (corresponding to ISO 527-3:1995) using a Shimadzu tabletop precision universal testing machine AG-X, which is a measuring device. The test speed is 300 mm / min.

[0081] On the other hand, the average value of the 10% modulus in the MD direction and the 10% modulus in the TD direction measured at -15 ° C of the layer containing the resin composition is preferably 15 MPa or more and 30 MPa or less, more preferably 17 MPa or more and 27 MPa or less. When the average value of the 10% modulus at -15 ° C is within this range, the dicing film substrate tends to have good detachability and elongation at low temperatures. The 10% modulus is a value measured by preparing a film having a thickness of 100 μm, a TD length of 10 mm, and an MD length of 180 mm, which has the same composition as the layer containing the resin composition, and measuring the film in accordance with JIS K 7127: 1999 (corresponding to ISO 527-3: 1995) using a Shimadzu tabletop precision universal testing machine AG-X, which is a measuring device. The test speed is 500 mm / min.

[0082] The layer containing the resin composition is preferably capable of measuring both the 300% modulus in the MD direction and the 300% modulus in the TD direction at 23°C. If both the 300% modulus in the MD direction at 23°C and the 300% modulus in the TD direction at 23°C are measurable, stress is less likely to be applied to the chip in the pick-up process, and damage in the chip is less likely to occur. The 300% modulus is a value measured by preparing a film having a thickness of 100 μm, a length in the TD direction of 10 mm, and a length in the MD direction of 180 mm, which has the same composition as the layer containing the resin composition, and measuring the film using a Shimadzu tabletop precision universal testing machine AG-X, which is a measuring device, in accordance with JIS K 7127:1999 (corresponding to ISO 527-3:1995). The test speed is 300 mm / min.

[0083] It is preferable that the layer containing the resin composition can measure both the 200% modulus in the MD direction and the 200% modulus in the TD direction at -15°C. If both the 200% modulus in the MD direction at -15°C and the 200% modulus in the TD direction at -15°C are measurable, the chip and the die bond film can be easily cut and expanded at a low temperature in the process of cutting and expanding. The 200% modulus is a value measured by preparing a film having a thickness of 100 μm, a length in the TD direction of 10 mm, and a length in the MD direction of 180 mm, which has the same composition as the layer containing the resin composition, and measuring the film in accordance with JIS K 7127:1999 (corresponding to ISO 527-3:1995) using a Shimadzu tabletop precision universal testing machine AG-X, which is a measuring device. The test speed is 500 mm / min.

[0084] On the other hand, examples of the other resin layer include layers containing linear low density polyethylene (LLDPE), low density polyethylene (LDPE), ethylene-α-olefin copolymer, polypropylene, ethylene-unsaturated carboxylic acid copolymer or its ionomer, ethylene-unsaturated carboxylic acid-unsaturated carboxylic acid alkyl ester terpolymer or its ionomer, ethylene-unsaturated carboxylic acid alkyl ester copolymer, ethylene-vinyl ester copolymer, ethylene-unsaturated carboxylic acid alkyl ester-carbon monoxide copolymer, unsaturated carboxylic acid graft products thereof, polyvinyl chloride, etc. The other resin layer may contain only one type of the above resin, or may contain two or more types.

[0085] The thickness of the other resin layer is not particularly limited, but is preferably from 10 μm to 100 μm, more preferably from 15 μm to 80 μm, so as not to impair the modulus strength and extensibility of the layer containing the resin composition.

[0086] Here, considering that it is used as a constituent member of the dicing film, the thickness of the entire dicing film substrate is preferably 50 μm or more from the viewpoint of frame retention during dicing, and 200 μm or less from the viewpoint of extensibility (expandability).

[0087] The surface of the dicing film substrate may be subjected to various treatments, such as corona treatment, etc. Furthermore, it may be subjected to electron beam irradiation, etc.

[0088] The manufacturing method of the dicing film substrate is not particularly limited, and can be manufactured by known molding methods.For example, when manufacturing the dicing film substrate consisting of only the layer containing the above-mentioned resin composition, the resin composition etc. can be molded by the conventionally known T-die casting molding method, T-die nip molding method, inflation molding method, extrusion lamination method, calendar molding method, etc.

[0089] On the other hand, when the dicing film substrate is a laminate of a layer containing the above-mentioned resin composition and another resin layer, the above-mentioned resin composition and the other resin may be formed by a co-extrusion lamination method or the like. In addition, the layer containing the above-mentioned resin composition and the other resin layer may be separately prepared, and these may be bonded together with an adhesive, an adhesive sheet, or the like. Examples of materials for the adhesive or adhesive sheet include various ethylene copolymers, or unsaturated carboxylic acid grafts thereof, and the like. In addition, when the dicing film substrate is a laminate of a layer containing the above-mentioned resin composition and another resin layer, one of the layer containing the above-mentioned resin composition and the other resin layer may be formed first, and the other layer may be formed and laminated on the one layer by a T-die film molding machine, an extrusion coating molding machine, or the like.

[0090] 3. Dicing film The dicing film of the present invention may include the above-mentioned dicing film substrate and an adhesive layer laminated on at least one side thereof, and may include other configurations as necessary. When the above-mentioned dicing film substrate is made of multiple layers, it is preferable that the layer containing the resin composition in the dicing film substrate and the adhesive layer are laminated.

[0091] The adhesive constituting the adhesive layer can be an adhesive for the adhesive layer of a general dicing film. Examples of the adhesive include rubber-based, acrylic-based, silicone-based, and polyvinyl ether-based adhesives; radiation-curable adhesives; and heat-foamable adhesives. In particular, in consideration of the peelability of the dicing film from the semiconductor wafer, the adhesive layer preferably contains a radiation-curable adhesive, and more preferably contains an ultraviolet-curable adhesive.

[0092] An ultraviolet-curable adhesive typically contains a radically polymerizable compound (which may be any of a monomer, oligomer, or polymer) capable of radical polymerization, and a photopolymerization initiator, and optionally contains additives such as a crosslinking agent, a tackifier, a filler, an antiaging agent, and a colorant.

[0093] Examples of the radical polymerizable compound include monomers or oligomers of (meth)acrylic acid alkyl esters such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, and isononyl (meth)acrylate; monomers or oligomers of (meth)acrylic acid hydroxyalkyl esters such as hydroxyethyl (meth)acrylate, hydroxybutyl (meth)acrylate, and hydroxyhexyl (meth)acrylate; and monomers or oligomers of the above-mentioned (meth)acrylic acid alkyl esters and / or (meth)acrylic acid hydroxyalkyl esters together with other monomers (e.g., (meth)acrylic acid, itaconic acid, maleic anhydride, (meth)acrylic acid amide, (meth)acrylic acid N-hydroxymethylamide, and (meth)acrylic acid alkylaminoalkyl. copolymerizable monomers or oligomers with (meth)acrylic acid and polyhydric alcohols such as glycidyl (meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, tetraethylene glycol di(meth)acrylate, 1,6-hexanediol (meth)acrylate, neopentyl glycol di(meth)acrylate, and dipentaerythritol hexa(meth)acrylate, as well as oligomers thereof; and isocyanurates such as 2-propenyldi-3-butenyl cyanurate, 2-hydroxyethylbis(2-acryloxyethyl)isocyanurate, tris(2-methacryloxyethyl)isocyanurate, and tris(2-methacryloxyethyl)isocyanurate.

[0094] Specific examples of the photopolymerization initiator include benzoin alkyl ethers such as benzoin methyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; aromatic ketones such as α-hydroxycyclohexyl phenyl ketone; aromatic ketals such as benzyl dimethyl ketal; and thioxanthones such as polyvinyl benzophenone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, and diethylthioxanthone.

[0095] Examples of the crosslinking agent include a polyisocyanate compound, a melamine resin, a urea resin, a polyamine, a carboxyl group-containing polymer, and the like.

[0096] The thickness of the adhesive layer is appropriately selected depending on the type of adhesive, and is preferably 3 to 100 μm, more preferably 3 to 50 μm.

[0097] The adhesive layer of the dicing film may be protected by a separator. When the adhesive layer is protected by a separator, the surface of the adhesive layer can be kept smooth. In addition, the dicing film can be easily handled and transported, and the separator can also be label-processed. The separator is peeled off when the dicing film is used.

[0098] The separator may be paper or a synthetic resin film such as polyethylene, polypropylene, or polyethylene terephthalate. The surface of the separator that comes into contact with the adhesive layer may be subjected to a release treatment such as silicone treatment or fluorine treatment, if necessary, to improve the releasability from the adhesive layer. The thickness of the separator is usually 10 to 200 μm, and preferably about 25 to 100 μm.

[0099] The manufacturing method of the dicing film is not particularly limited, and for example, the dicing film may be manufactured by applying an adhesive to the dicing substrate by a known method. In this case, the adhesive may be applied by a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, or the like. Alternatively, the adhesive may be applied to a release sheet to form an adhesive layer, and the adhesive layer may be transferred to a dicing film substrate to laminate the dicing film substrate and the adhesive layer. Alternatively, the dicing film substrate and the adhesive layer may be simultaneously formed by co-extrusion or the like. EXAMPLES

[0100] The present invention will now be described with reference to examples, which should not be construed as limiting the scope of the present invention.

[0101] [Material preparation] The following components were used: <Ionomer of ethylene-unsaturated carboxylic acid copolymer (A)> IO: Ionomer of ethylene-methacrylic acid-butyl acrylate copolymer (content of structural units derived from ethylene: 80% by mass, content of structural units derived from methacrylic acid: 10% by mass, content of structural units derived from butyl acrylate: 10% by mass, degree of neutralization: 70% zinc, MFR measured at 190°C and 2160g load in accordance with JIS K 7210:1999 (equivalent to ISO 1133:1997): 1g / 10min)

[0102] <Polyamide (B)> PA: Nylon 6 (manufactured by Ube Industries, 1022B (product name), melting point: 215°C to 225°C, density: 1140 kg / m 3 )

[0103] <Styrene-based resin (C)> Styrene-based resin 1: SEBS (styrene-ethylene-butylene-styrene block copolymer (manufactured by Asahi Kasei Chemicals Corporation, SOES1611 (trade name), conforming to JIS K 7210:1999 (equivalent to ISO 1133:1997), MFR measured at 230°C and 2160g load: 12.0g / 10min, Tan δ peak temperature: 9°C) Styrene-based resin 2: HSBR (hydrogenated styrene-butadiene random copolymer (manufactured by JSR Corporation, Dynaron 1320P (product name), conforming to JIS K 7210:1999 (equivalent to ISO 1133:1997), MFR measured at 230°C and 2160g load: 3.5g / 10min, Tan δ peak temperature: -15°C) Styrene-based resin 3: SEBS (styrene-ethylene-butylene-styrene block copolymer (manufactured by Asahi Kasei Chemicals Corporation, Tuftec H1041 (product name), conforming to JIS K 7210:1999 (equivalent to ISO 1133:1997), MFR measured at 230°C and 2160g load: 5.0g / 10min, Tan δ peak temperature: -45°C) Styrene-based resin 4: Acid-modified SEBS (maleic anhydride-modified styrene-ethylene-butylene-styrene block copolymer (manufactured by Asahi Kasei Chemicals Corporation, Tuftec M1913 (product name), acid value: 10 mgCH 3 ONa / g, measured at 230℃ and 2160g load in accordance with JIS K 7210:1999 (equivalent to ISO 1133:1997), MFR: 5.0g / 10min, Tan δ peak temperature: -40℃ Styrene-based resin 5: SEPS (styrene-ethylene-propylene-styrene block copolymer (manufactured by Kuraray Co., Ltd., in accordance with Septon 2002 and JIS K 7210:1999 (equivalent to ISO 1133:1997) and MFR measured at 230°C and a load of 2160 g: 70.0 g / 10 min.)

[0104] <Other> EMAA: Ethylene-methacrylic acid copolymer (content of ethylene-derived structural units: 91% by mass, content of methacrylic acid-derived structural units: 9% by mass, MFR measured at 190°C and 2160g load: 3g / 10min in accordance with JIS K 7210:1999 (equivalent to ISO 1133:1997)) TPU: Thermoplastic polyurethane elastomer (Miractran P485RSUI (product name) manufactured by Tosoh Corporation)

[0105] [Examples 1 to 13 and Comparative Examples 1 to 7] An ionomer (A) of an ethylene-unsaturated carboxylic acid copolymer, a polyamide (B), and a styrene resin (C) were dry-blended in the ratio (mass ratio) shown in Table 1. Next, the dry-blended mixture was fed into the resin inlet of a 30 mmφ twin-screw extruder and melt-kneaded at a die temperature of 230°C to obtain a resin composition for a dicing film substrate. The MFR of the obtained resin composition for a dicing film substrate was measured at 230°C (190°C only for Comparative Example 1) and under a load of 2160 g in accordance with JIS K 7210:1999 (corresponding to ISO 1133:1997). The results are shown in Table 1.

[0106] [evaluation] The obtained resin composition for dicing film substrate was molded at a processing temperature of 230°C using a 40 mmφ T-die film molding machine to produce a T-die film with a thickness of 100 μm. The obtained T-die film was used as a dicing film substrate and evaluated by the following method. The results are shown in Table 1.

[0107] (1) Room temperature modulus strength The dicing film substrate was cut into a rectangular shape of 10 mm width x 180 mm length. In accordance with JIS K 7127:1999 (corresponding to ISO 527-3:1995), the 25% modulus of the sample (dicing film substrate) was measured at 23°C in each of the MD (machine direction) and TD (transverse direction) directions using a Shimadzu tabletop precision universal testing machine AG-X as the measuring device. The chuck distance was 100 mm, and the test speed was 300 mm / min.

[0108] The 25% modulus in the MD direction and the 25% modulus in the TD direction obtained in the above test were averaged, and the room temperature modulus strength of the dicing film substrate was evaluated according to the following criteria. A (good): 8MPa or more and 12MPa or less B (fairly good): 7MPa or more but less than 8MPa, or more than 12MPa but less than 13MPa C (poor): Less than 7MPa or more than 13MPa

[0109] (2) Low-temperature modulus strength The dicing film substrate was cut into a rectangular shape of 10 mm width x 180 mm length. In accordance with JIS K 7127:1999 (corresponding to ISO 527-3:1995), the 10% modulus of the sample (dicing film substrate) was measured in each of the MD and TD directions at -15°C using a Shimadzu tabletop precision universal testing machine AG-X as a measuring device. The chuck distance was 100 mm, and the test speed was 500 mm / min.

[0110] The 10% modulus in the MD direction and the 10% modulus in the TD direction obtained in the above test were averaged, and the low-temperature modulus strength of the dicing film substrate was evaluated according to the following criteria. A (good): 17MPa or more and 28MPa or less B (fairly good): 15MPa or more but less than 17MPa, or 28MPa or more but less than 30MPa C (poor): Less than 15MPa or more than 30MPa

[0111] (3) Room temperature elongation The dicing film substrate was cut into a rectangular shape of 10 mm width × 180 mm length. In accordance with JIS K 7127: 1999 (corresponding to ISO 527-3: 1995), the 300% modulus was measured at 23 ° C. in each of the MD and TD directions using a Shimadzu tabletop precision universal testing machine AG-X as a measuring device.

[0112] The room temperature elongation of the dicing film substrate was evaluated based on the obtained measurement results according to the following criteria. A (Good): 300% modulus can be measured at 23°C C (Fail): The dicing film substrate broke during measurement, and the 300% modulus at 23°C could not be measured.

[0113] (4) Low-temperature elongation The dicing film substrate was cut into a rectangular shape of 10 mm width × 180 mm length. In accordance with JIS K 7127:1999 (equivalent to ISO 527-3:1995), the 200% modulus was measured at -15°C in each of the MD and TD directions using a Shimadzu tabletop precision universal testing machine AG-X as the measuring device.

[0114] The obtained measurement results were used to evaluate the low-temperature elongation of the dicing film substrate according to the following criteria. A (Good): 200% modulus can be measured at -15℃ C (Fail): The dicing film substrate broke during measurement, making it impossible to measure the 200% modulus at -15°C.

[0115] [Table 1]

[0116] As is clear from Table 1, the dicing film substrates using the resin compositions for dicing film substrates of Examples 1 to 13, which contain an ionomer (A) of an ethylene-unsaturated carboxylic acid copolymer, a polyamide (B), and a styrene-based resin (C), had excellent room temperature modulus strength, low temperature modulus strength, room temperature elongation, and low temperature elongation.

[0117] In contrast, in Comparative Example 1, which did not contain polyamide (B) and styrene-based resin (C), the room temperature elongation was low. In Comparative Example 2, which did not contain polyamide (B), the low temperature modulus strength was low. Furthermore, in Comparative Example 3, which did not contain styrene-based resin (C), both the room temperature elongation and the low temperature elongation were low. Furthermore, in Comparative Examples 4 to 7, which did not contain the ionomer (A) of an ethylene-unsaturated carboxylic acid copolymer, both the room temperature elongation and the low temperature elongation were low.

[0118] From the above results, it was confirmed that the resin composition for dicing film substrate of the present invention can realize a dicing film substrate having excellent room temperature modulus strength, low temperature modulus strength, room temperature elongation, and low temperature elongation.

[0119] This application claims priority based on Japanese Patent Application No. 2021-44998, filed on March 18, 2021. The entire contents of the specification of that application are incorporated herein by reference. [Industrial Applicability]

[0120] According to the resin composition for dicing film substrate of the present invention, a dicing film substrate having excellent elongation at room temperature and low temperature and also excellent modulus strength at room temperature and low temperature can be realized, which is therefore very useful in the field of manufacturing semiconductor devices.

Claims

1. An ionomer (A) of an ethylene-unsaturated carboxylic acid copolymer; Polyamide (B), A styrene-based resin (C); Including, The styrene-based resin (C) is a styrene-based elastomer. A resin composition for use as a dicing film substrate.

2. The ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer is an ionomer of an ethylene-unsaturated carboxylic acid-unsaturated carboxylic acid ester copolymer, The resin composition for use as a dicing film substrate according to claim 1 .

3. the amount of structural units derived from an unsaturated carboxylic acid in the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer is 1 mass% or more and 30 mass% or less with respect to the amount of all structural units in the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer; The resin composition for use as a dicing film substrate according to claim 1 or 2.

4. The degree of neutralization of the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer is 10% or more and 90% or less. The resin composition for use as a dicing film substrate according to any one of claims 1 to 3.

5. The content of the styrene-based resin (C) is 1% by mass or more and 40% by mass or less. The resin composition for use as a dicing film substrate according to any one of claims 1 to 4.

6. the content of the ionomer (A) in the ethylene-unsaturated carboxylic acid copolymer is equal to or greater than the total content of the polyamide (B) and the styrene-based resin (C); The resin composition for use as a dicing film substrate according to any one of claims 1 to 5.

7. The melt flow rate measured in accordance with JIS K 7210:1999 at 230°C and a load of 2160 g is 0.1 g / 10 min or more and 30 g / 10 min or less. The resin composition for use as a dicing film substrate according to any one of claims 1 to 6.

8. The dicing film substrate has at least one layer comprising the resin composition for dicing film substrate according to any one of claims 1 to 7. Dicing film substrate.

9. The layer containing the resin composition for dicing film substrate has an average value of 25% modulus in MD direction and 25% modulus in TD direction measured at 23°C in accordance with JIS K 7127:1999 of 7 MPa or more and 13 MPa or less. The dicing film substrate according to claim 8 .

10. The layer containing the resin composition for dicing film substrate has an average value of 10% modulus in MD direction and 10% modulus in TD direction measured at -15 ° C. in accordance with JIS K 7127: 1999 of 15 MPa or more and 30 MPa or less. The dicing film substrate according to claim 8 or 9.

11. The dicing film substrate according to claim 10, An adhesive layer laminated on at least one surface of the dicing film substrate; having Dicing film.

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