Semiconductor module inspection equipment

Abstract

Disclosed is a semiconductor module inspection device with which it is possible to easily perform temperature control. This semiconductor module inspection device comprises: a PCB substrate; an IC socket storing a semiconductor module disposed on a first main surface of the PCB substrate; a first temperature control device disposed in contact with the upper surface of the IC socket; and a second temperature control device disposed in contact with a second main surface of the PCB substrate. In one embodiment, the first temperature control device and the second temperature control device have Peltier elements and heat dissipating fins. In one embodiment, the semiconductor module inspection device further comprises a chamber structure including a chamber top connected to a heat dissipating surface of the first temperature control device, and a chamber bottom connected to a heat dissipating surface of the second temperature control device, and the chamber structure comprises a purge mechanism for purging the chamber internal space with dry air. In one embodiment, the semiconductor module inspection device further comprises a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature control device, and a pin receiver fitting with the positioning pin.

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor module inspection device. [Background technology]

[0002] In recent years, there has been a demand for smaller, lower power, and faster optical communication transceivers to cope with the increase in communication traffic. Optical semiconductor modules including optical communication transceivers include optical modulators that convert electrical signals into optical signals to be transmitted, photodiodes that convert received optical signals into electrical signals, and optical circuit chips that connect them. In some cases, the electronic-optical circuit also includes amplifier circuits, control circuits, and digital signal processing circuits to drive the optical modulators and photodiodes.

[0003] In recent years, research and development has been conducted on optical semiconductor modules equipped with BGA (Ball Grid Array) and LGA (Land Grid Array) as small and high-speed input / output interfaces for electrical signals. Such optical semiconductor modules are called Co-packaged Optics, and research and development has been actively conducted in recent years. (For example, Non-patent technical document 1)

[0004] In the shipping inspection of such optical semiconductor modules with BGA, an inspection is carried out using an IC socket, just like with integrated circuits (IC) and IC modules (IC packages) with general BGAs that do not contain optical semiconductors, such as processors or ASICs (application specific integrated circuits). IC sockets have contact pins, and electrical characteristics can be inspected by bringing the terminals of the accommodated IC module into contact with the contact pins to establish electrical continuity. (Patent Technology Document 1)

[0005] When inspecting IC modules in a temperature environment, it is common to change the ambient temperature of each IC socket by using a non-contact temperature control device (environmental testing machine) that sprays jet air at temperatures of approximately -100°C to 300°C onto the IC socket.

[0006] A simple method for changing the temperature is to attach a contact-type temperature control device such as a Peltier element or fins to the top of the IC socket and change the temperature of the top surface of the IC module. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2020-194041 A [Non-patent literature]

[0008] [Non-Patent Document 1] P. Maniotis et al., “Scaling HPC Networks with Co-Packaged Optics”, T3K.7, OFC2020, March 2020 Summary of the Invention

[0009] Jet air causes vibrations in the optical fiber connected to the optical semiconductor module, which can affect the inspection results of the optical semiconductor module. Also, if a temperature control device is installed on top of the IC socket, there is a problem that temperature distribution occurs in the optical semiconductor module.

[0010] The present disclosure has been made in view of such problems, and an object of the present disclosure is to provide a semiconductor module inspection device that is capable of easily controlling the temperature and is particularly suitable for optical semiconductor modules.

[0011] In order to achieve this objective, a semiconductor module inspection device of one embodiment of the present invention comprises a PCB substrate, an IC socket for accommodating a semiconductor module arranged on a first main surface of the PCB substrate, a first temperature control device arranged in contact with an upper surface of the IC socket, and a second temperature control device arranged in contact with a second main surface of the PCB substrate.

[0012] As described above, according to one embodiment of the present invention, it is possible to provide a semiconductor module inspection device that is capable of easily controlling temperature and is particularly suitable for optical semiconductor modules. [Brief description of the drawings]

[0013] [Figure 1a] FIG. 1a is a schematic diagram of an environmental test machine. [Figure 1b] FIG. 1b is a schematic diagram of a semiconductor module inspection device equipped with a temperature adjustment device. [Figure 1c] FIG. 1c is a schematic diagram of a semiconductor module inspection device equipped with a thermostatic chamber. [Diagram 2] FIG. 2 is a schematic diagram of a semiconductor module inspection device according to one embodiment of the present invention. [Figure 3a] FIG. 3a is a schematic diagram of a semiconductor module inspection device according to one embodiment of the present invention. [Figure 3b] FIG. 3b is a schematic diagram of a semiconductor module inspection device according to one embodiment of the present invention. [Figure 4] FIG. 4 is a schematic diagram of a semiconductor module inspection device according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The same or similar reference numerals indicate the same or similar elements, and repeated explanations may be omitted. The following description of the embodiment is an example, and some configurations may be changed, omitted, or added without departing from the gist of the invention.

[0015] Before describing the embodiments of the present invention, an example of a conventional IC module inspection device will be described with reference to FIGS. 1a to 1c.

[0016] FIG. 1a is a schematic diagram of a jet air injection type semiconductor module inspection device which is an environmental tester. An IC module inspection device 10a which is an inspection device is a device for inspecting semiconductor modules such as IC modules or optical semiconductor modules 20. FIG. 1a shows an optical semiconductor module 20 having an LGA connected to an optical fiber 21 as a semiconductor module. The IC module inspection device 10a includes a printed circuit board (PCB) 11 which is a development board, an IC socket 12 arranged on the PCB 11, and a jet air device 16 which injects jet air 31 from above the IC socket 12 toward a test environment including a semiconductor module mounted on the IC socket 12. The IC socket 12 is made of a metal material such as aluminum and a resin material for insulation. Furthermore, the IC socket 12 has contact pins 13 for connecting terminals (for example, fine flat electrodes (lands)) of the mounted semiconductor module to wiring (not shown) on the PCB 11. The wiring on the PCB 11 is connected to a connector 14 arranged near the edge of the PCB 11. A cable 15 is connected to the connector 14. The cable 15 is connected to, for example, a control unit and a measurement unit (not shown) of the inspection device. The optical fiber 21 is connected to a light receiving unit and a light emitting unit (not shown) of the inspection device. The IC module inspection device 10a is a jet air injection type environmental tester, and can change temperatures including the ambient temperature by a jet air device 16 as a non-contact temperature control device. In such a test environment, the module is inspected by supplying power to the semiconductor module via the cable 15, the wiring on the PCB 11, and the contact pins 13, inputting and outputting electrical signals such as control signals and output signals, and inputting and outputting optical signals via the optical fiber 21.

[0017] Fig. 1b is a schematic diagram of a semiconductor module inspection device equipped with a contact-type temperature adjustment device. Like the IC module inspection device 10a in Fig. 1a, the IC module inspection device 10b in Fig. 1b includes a PCB 11 and an IC socket 12 having contact pins 13. The IC module inspection device 10b further includes a Peltier element 17 as a temperature adjustment device provided on the upper part of the IC socket 12, and a heat dissipation fin 18 for cooling the Peltier element 17. The Peltier element 17 and the heat dissipation fin 18 can change the temperature of the test environment including the semiconductor module mounted in the IC socket 12.

[0018] Fig. 1c is a schematic diagram of a semiconductor module inspection device equipped with a thermostatic chamber. As with the IC module inspection device 10a in Fig. 1a, the IC module inspection device 10c in Fig. 1c includes an IC socket 12 arranged on a PCB 11 and a thermostatic chamber 19 that controls and maintains the temperature of a test environment including a semiconductor module mounted on the IC socket 12. The thermostatic chamber 19 includes a cable outlet 191 for pulling out a cable 15 connected to a connector 14 arranged near the edge of the PCB 11 and an optical fiber 21 connected to an optical semiconductor module 20. The semiconductor module is inspected with the entire IC socket 12 with the semiconductor module mounted thereon placed inside the thermostatic chamber 19.

[0019] In the example of the semiconductor module inspection device in Figures 1a to 1c, a configuration for inspecting an optical semiconductor module 20 having an LGA is shown, but when inspecting an optical semiconductor module having a BGA, an IC socket can be used in the same way as for an optical semiconductor module having an LGA.

[0020] An optical fiber 21 is connected to the optical semiconductor module 20 as an input / output section for an optical signal. Therefore, in the jet air injection type environmental tester (IC module inspection device 10a) shown in Fig. 1a, the optical fiber 21 vibrates, changing the polarization state of the optical signal passing through the optical fiber 21, which has a problem of affecting the inspection results.

[0021] When the contact-type temperature control device (IC module inspection device 10b) of Fig. 1b is used, the influence of the shaking of the optical fiber 21 caused by the jet air can be eliminated, but since only the temperature on the top side of the optical semiconductor module 20 can be changed, a temperature difference occurs between the top side and the bottom side (contact pin 13 side) of the optical semiconductor module 20. This is not a problem for general IC modules. However, since optical circuits are generally more sensitive to the effects of temperature characteristics than electronic circuits, there is a problem in that it is necessary to control the temperature of not only the bottom side of the optical semiconductor module 20 but the entire optical semiconductor module.

[0022] When a semiconductor module inspection device (IC module inspection device 10c) equipped with a thermostatic chamber as shown in Fig. 1c is used, the entire IC socket 12 is housed inside the thermostatic chamber 19, so that the optical fiber 21 does not vibrate and the temperature of the optical semiconductor module 20 can be uniformly controlled. However, the thermostatic chamber 19 is generally expensive and large, so it is difficult to arrange the control unit, measurement unit, light receiving unit, and light emitting unit of the inspection device in parallel. Furthermore, because the thermostatic chamber 19 is large, the optical fiber 21 connected to the optical semiconductor module 20 for inspection becomes long, which poses problems in terms of handling the optical fiber 21 and costs.

[0023] Next, a semiconductor module inspection device according to an embodiment of the present invention will be described with reference to Figures 2, 3a, 3b, and 4. The semiconductor module inspection device according to the embodiment of the present invention includes a PCB board, an IC socket that houses a semiconductor module arranged on a first main surface of the PCB board, a first temperature adjustment device arranged in contact with an upper surface of the IC socket, and a second temperature adjustment device arranged in contact with a second main surface of the PCB board.

[0024] (First embodiment) Fig. 2 is a diagram showing an outline of a semiconductor module inspection device according to a first embodiment of the present invention. As shown in Fig. 2, an IC module inspection device 30a, which is a semiconductor module inspection device, includes a PCB 11, an IC socket 12 having contact pins 13 arranged on the PCB 11, and a Peltier element 17a and a heat dissipation fin 18a for cooling the Peltier element 17a as a contact-type temperature control device provided on the upper part of the IC socket 12. The IC socket 12 is made of a metal material such as aluminum and a resin material for insulation, similar to the IC socket 12 shown in Figs. 1a to 1c. The semiconductor module mounted in the IC socket 12 is an optical semiconductor module 20 equipped with an LGA, and an optical fiber 21 is connected to it.

[0025] The heat dissipating fin 18a includes a plate-shaped base and a fin portion. The fin portion has a plurality of fins extending in a direction substantially perpendicular to the main surface of the base. The heat dissipating fin 18a is disposed on the upper portion of the Peltier element 17a so that one of the main surfaces of the base (the main surface opposite the fin portion) contacts the main surface of the Peltier element 17a (the main surface opposite the main surface contacting the IC socket 12). The heat dissipating fin 18a is made of aluminum or the like, and is attached to the Peltier element 17a using a thermally conductive adhesive or thermally conductive grease.

[0026] 2 further includes a Peltier element 17b and heat dissipation fins 18b for cooling the Peltier element 17b as a contact-type temperature adjustment device on the lower main surface (the main surface opposite to the main surface on which the IC socket 12 is arranged) of the PCB 11. The Peltier element 17b and the heat dissipation fins 18b are a large Peltier element that adjusts the temperature of the entire range of the PCB 11 and a cooling fin.

[0027] Like the heat dissipation fin 18a, the heat dissipation fin 18b includes a plate-shaped base and a fin portion. The heat dissipation fin 18b is disposed below the Peltier element 17b such that one of the main surfaces of the base (the main surface opposite the fin portion) contacts the main surface of the Peltier element 17b (the main surface opposite the main surface contacting the IC socket 12). The heat dissipation fin 18b is made of an aluminum material or the like, and is attached to the Peltier element 17 using a thermally conductive adhesive or thermally conductive grease.

[0028] The IC module inspection device 30a in FIG. 2 is different from the IC module inspection device 10b in FIG. 1b in that it is provided with a Peltier element 17b and a heat dissipation fin 18b for cooling the Peltier element 17b on the lower surface of the PCB 11. In the IC module inspection device 30a of this embodiment, the Peltier element 17a and the heat dissipation fin 18a can change the temperature of the upper surface side of the optical semiconductor module 20 mounted on the IC socket 12, and the Peltier element 17b and the heat dissipation fin 18b can change the temperature of the lower surface side of the optical semiconductor module 20. This makes it possible to adjust the temperature inside the optical semiconductor module 20 without difference between the upper side and the lower side, and to accurately inspect the temperature characteristics of the optical semiconductor module 20. In addition, since no jet air is used, there is no influence on the inspection result due to the vibration of the optical fiber 21 caused by the jet air.

[0029] The contact-type temperature adjustment device may have a cooling fan (not shown) in addition to the Peltier element and the heat dissipation fins.

[0030] Second Embodiment When a semiconductor module is inspected under conditions below the dew point of the surrounding environment using the IC module inspection apparatus 30a of the first embodiment described above with reference to FIG. 2, condensation occurs.

[0031] 3a and 3b are diagrams showing an outline of a semiconductor module inspection apparatus according to a second embodiment of the present invention, which is capable of preventing condensation. The configuration of IC module inspection apparatus 30b of this embodiment is obtained by adding a chamber structure to the configuration of IC module inspection apparatus 30a of FIG.

[0032] As shown in FIG. 3a, an IC module inspection apparatus 30b which is a semiconductor module inspection apparatus of this embodiment includes a PCB 11, an IC socket 12 having contact pins 13 arranged on the PCB 11, a Peltier element 17a provided on an upper portion of the IC socket 12, heat dissipation fins 18a for cooling the Peltier element 17a, a Peltier element 17b provided on a lower portion of the PCB 11, heat dissipation fins 18b for cooling the Peltier element 17b, and a chamber structure having an upper chamber portion 40a and a lower chamber portion 40b.

[0033] The upper chamber 40a has a plate-shaped base and a sidewall disposed on the outer edge of the base, and the overall shape is a concave shape with an opening on the lower side. The lower chamber 40b also has a plate-shaped base and a sidewall disposed on the outer edge of the base, similar to the upper chamber 40a, and the overall shape is a concave shape with an opening on the upper side. The upper chamber 40a and the lower chamber 40b are configured such that, when the optical semiconductor module 20 is mounted on the IC socket 12, a part of the sidewall of the upper chamber 40a and a part of the sidewall of the lower chamber 40b contact and fit with each other. As a result, a test environment including the semiconductor module mounted on the IC socket 12 is formed in the chamber internal space formed, for example, when a part (e.g., an end) of the sidewall of the upper chamber 40a and a part (e.g., an end) of the sidewall of the lower chamber 40b are fitted with each other.

[0034] The base of the upper chamber 40a has an opening. The edge of the opening of the upper chamber 40a and the edge of the base of the heat dissipation fin 18a are bonded and fixed so that the fin part of the heat dissipation fin 18a provided on the upper part of the IC socket 12 protrudes into the chamber external space and the position of the Peltier element 17a is within the chamber internal space. In other words, the base of the heat dissipation fin 18a, which is the heat dissipation surface of the temperature adjustment device, is connected to the upper chamber 40a. The base of the lower chamber 40b also has an opening, similar to the upper chamber 40a. The edge of the opening and the edge of the base of the heat dissipation fin 18b are bonded and fixed so that the fin part of the heat dissipation fin 18b provided on the lower surface side of the PCB 11 protrudes into the chamber external space and the position of the Peltier element 17b is within the chamber internal space. In other words, the base of the heat dissipation fin 18b, which is the heat dissipation surface of the temperature adjustment device, is connected to the lower chamber 40b. A part of the base of the heat dissipation fins 18a and 18b, together with the base of the chamber upper part 40a and the chamber lower part 40b, constitutes a part of the chamber structure, whereby the heat of the Peltier elements 17a and 17b is dissipated to the space outside the chamber. By using an adhesive with high thermal conductivity as the adhesive for bonding and fixing the edge of the opening of the chamber upper part 40a to the edge of the base of the heat dissipation fin 18a, the chamber itself may be used as the heat dissipation surface of the temperature control device, or by using an adhesive with high thermal insulation, only the heat dissipation fin 18a may be used as the heat dissipation surface.

[0035] Alternatively, with regard to the fixing of the edge of the opening of the upper chamber part 40a to the edge of the base of the heat dissipation fin 18a, instead of adhesively fixing the upper chamber part 40a to the heat dissipation fin 18a, rails or the like may be attached to the heat dissipation fin 18a so that the upper chamber part 40a slides relative to the heat dissipation fin 18a. In this way, the upper chamber part 40a and the lower chamber part 40b are fitted together in a manner that is less susceptible to mechanical tolerances, and the effect of air flowing into the chamber due to a gap between the upper chamber part 40a and the lower chamber part 40b can be eliminated.

[0036] The chamber structure is provided with a cable outlet for taking out the cable 15 connected to the connector 14 and the optical fiber 21 connected to the optical semiconductor module 20 from the internal space of the chamber.

[0037] 3b shows the state in which the optical semiconductor module 20 is mounted on the IC socket 12 of the IC module inspection device 30b of this embodiment. The IC socket 12 is divided into two parts: a cover part and a recessed part. The cover part of the IC socket 12 is adhesively fixed to the Peltier element 17a, and the recessed part of the IC socket 12 is adhesively fixed to the Peltier element 17b. The optical semiconductor module 20 is mounted in the recessed part of the IC socket 12 having the contact pins 13, and then the optical fiber 21 connected to the optical semiconductor module 20 is led to the space outside the chamber through the cable outlet provided on the side of the recessed part of the IC socket 12 and the cable outlet provided on the side wall of the chamber structure, and finally the cover part of the IC socket 12 integrated with the chamber upper part 40a is placed on the optical semiconductor module 20.

[0038] As shown in Figures 3a and 3b, the IC module inspection apparatus 30b of this embodiment includes at least one purge mechanism in at least one of the upper chamber 401 and the lower chamber 40b. The purge mechanism may be, for example, a purge hole 41. The purge mechanism is a mechanism for purging the internal space of the chamber with dry air during inspection. This allows the IC module inspection apparatus 30b of this embodiment to perform inspection while preventing condensation even below the dew point.

[0039] (Third embodiment) 4 is a schematic diagram of a semiconductor module inspection apparatus according to one embodiment of the present invention, which is a modified version of the semiconductor module inspection apparatus according to the second embodiment.

[0040] 4, in an IC module inspection device 30c which is a semiconductor module inspection device, the lid of the IC socket 12 is not adhesively fixed to the Peltier element 17a, and the lid of the IC socket 12 and the Peltier element 17a can be separated. Meanwhile, the IC module inspection device 30c includes a positioning mechanism for aligning the lid of the IC socket 12 with the Peltier element 17a. The positioning mechanism includes a positioning pin 50 and a pin receiver 51 into which the positioning pin 50 fits. In the IC module inspection device 30c of this embodiment, the Peltier element 17a includes the positioning pin 50 on its main surface (the main surface in contact with the IC socket 12 and the main surface opposite the heat dissipation fins 18a), and the lid of the IC socket 12 includes the pin receiver 51.

[0041] According to the IC module inspection apparatus 30c of this embodiment, even if the lid of the IC socket 12 is equipped with a torque management screw (not shown) or the like for controlling the appropriate load on the optical semiconductor module 20, it is possible to mount the optical semiconductor module 20 in the IC socket 12, place the lid of the IC socket 12 on the optical semiconductor module 20, perform torque management using the torque management screw, and then attach a separate Peltier element 17a to the top of the lid of the IC socket 12. [Industrial Applicability]

[0042] According to the various embodiments described above, it is possible to provide an optical semiconductor module inspection device capable of easily and uniformly adjusting the temperature of an optical semiconductor module. [Explanation of symbols]

[0043] 10a, 10b, 10c, 30a, 30b, 30c IC module inspection equipment 11 PCB 12 IC sockets 13 Contact pin 14 Connectors 15 Cable 16 Jet Air Device 17, 17a, 17b Peltier element 18, 18a, 18b Heat dissipation fins 19 Constant temperature bath 191 Cable outlet 20 Optical semiconductor module 21 Optical Fiber 40a Upper chamber 40b Lower chamber 41 Purge hole 42 Dry Air 50 Locating pin 51 Pin holder

Claims

1. A PCB board; an IC socket for accommodating a semiconductor module disposed on a first main surface of the PCB substrate; a first temperature control device disposed in contact with an upper surface of the IC socket; a second temperature control device disposed in contact with a second main surface of the PCB substrate; a chamber structure including an upper chamber portion connected to a heat dissipation surface of the first temperature control device and a lower chamber portion connected to a heat dissipation surface of the second temperature control device; A semiconductor module inspection device comprising:

2. 2. The semiconductor module inspection device according to claim 1, wherein said first temperature adjustment device and said second temperature adjustment device each have a Peltier element and a heat dissipation fin.

3. 3. The semiconductor module inspection apparatus according to claim 2, wherein said first temperature adjustment device and said second temperature adjustment device further include a cooling fan.

4. The upper chamber portion and the lower chamber portion are fitted together to form a chamber internal space, 2. The semiconductor module inspection device according to claim 1, wherein the chamber structure includes a purge mechanism for purging the internal space of the chamber with dry air.

5. a positioning mechanism including a positioning pin for positioning the IC socket and the first temperature adjustment device, and a pin receiver that fits with the positioning pin; the first temperature control device includes the positioning pin, 5. The semiconductor module inspection device according to claim 1, wherein a cover of said IC socket is provided with said pin receiver.

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