Material supply sheet

Abstract

To improve a member supply sheet for supplying a protective cover member.SOLUTION: A protective cover member includes a laminate having: a protective film shaped to cover an opening when the member is placed on a surface thereof; and a carrier film. A substrate sheet includes a substrate layer and an adhesive layer laminated on the substrate layer. The carrier film is bonded to the substrate layer interposing the adhesive layer. Surface free energy of the carrier film is 20 mJ / m2 or more on a surface at a substrate sheet side, and tackiness power of the adhesive layer is 100 mN / mm2 or less.SELECTED DRAWING: Figure 3B

Description

[Technical field]

[0001] The present invention relates to a member supplying sheet for supplying a protective cover member to be placed on a surface of an object having an opening. [Background technology]

[0002] In recent years, there has been a demand for placing protective cover members on the openings of minute products such as microelectromechanical systems (hereinafter referred to as "MEMS"). As part of this, in order to improve the efficiency of placing protective cover members in the manufacturing process of the above products, it has been considered to apply a device that picks up semiconductor elements by pushing up to pick up protective cover members. In this device, it is assumed that the protective cover member 62 is picked up by a suction nozzle 57 or the like in a state in which a base sheet 61 is pushed up by a push-up indenter 64 from the opposite side to the placement surface 63 of the protective cover member 62 (at this time, the protective cover member 62 is partially peeled off from the base sheet 61) (see FIG. 1).

[0003] Patent Document 1 discloses a vent assembly for protecting an opening of a MEMS, the vent assembly comprising an ePTFE membrane vent (ventilation filter) and a carrier attached to the ventilation filter by an adhesive, with a liner (base sheet) of UV-curable dicing tape attached to the underside of the carrier. A protective cover member for an opening of a MEMS as shown in Patent Document 1 is usually supplied to an end user in a state where a component sheet that will become the protective cover member after being divided is bonded to a base sheet. The end user dices the component sheet, in other words, singulates it and divides it into a plurality of protective cover members. After dicing, ultraviolet light (UV light) is irradiated to facilitate partial peeling of the protective cover member from the base sheet. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2018-501972 Summary of the Invention [Problem to be solved by the invention]

[0005] According to the inventors' investigations, in the component supply method disclosed in Patent Document 1, after base sheet 91 is attached to component sheet 93 (see the left diagram in FIG. 2), if a long period of time passes due to storage or the like, the interface between the lower part of component sheet 93 and adhesive 92 of base sheet 91 gradually becomes familiar (see the right diagram in FIG. 2). Furthermore, the inventors have found that the aforementioned familiarization over time increases the adhesive strength of the adhesive of the base sheet, leading to unstable pick-up properties when the protective cover member is picked up from the base sheet using the above-mentioned pick-up device.

[0006] An object of the present invention is to improve a member supplying sheet for supplying a protective cover member. [Means for solving the problem]

[0007] The present invention relates to A member supply sheet for supplying a protective cover member, the member supply sheet comprising: two or more protective cover members to be placed on a surface of an object having an opening; and a base sheet having the two or more protective cover members arranged on a surface thereof, The protective cover member is composed of a laminate including a protective film having a shape that covers the opening when the protective cover member is placed on the surface, and a carrier film joined to a peripheral portion of the protective film; The base sheet includes a base layer and a pressure-sensitive adhesive layer laminated on the base layer, The carrier film is attached to the base layer via the pressure-sensitive adhesive layer, The surface free energy of the carrier film is 20 mJ / m on the surface of the base sheet side. 2 That's all. The tack strength of the adhesive layer is 100 mN / mm2 Below is the Parts supply sheet, to provide. Effect of the Invention

[0008] In the member supply sheet of the present invention, the surface free energy of the carrier film in the protective cover member is equal to or greater than a predetermined value on the surface on the base sheet side. Also, the tack strength of the adhesive layer in the base sheet is equal to or less than a predetermined value. According to the inventors' studies, the tack strength of the adhesive layer in this member supply sheet is suppressed. Therefore, the partial peeling caused by pushing up and the final peeling of the protective cover member during subsequent pick-up proceed smoothly and reliably. Therefore, the member supply sheet of the present invention improves pick-up properties. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram for explaining picking up of a protective cover member in a push-up pick-up device. [Diagram 2] FIG. 2 is a schematic diagram showing the mechanism by which the adhesive strength of the adhesive of the base sheet increases over time in the member disclosed in Patent Document 1. [Figure 3A] FIG. 3A is a plan view diagrammatically illustrating an example of the member supplying sheet of the present invention. [Figure 3B] 3B is a cross-sectional view showing a cross section BB in a region I of the member supplying sheet in FIG. 3A. [Figure 4] FIG. 4 is a schematic diagram showing one embodiment of supplying a protective cover member by the member supplying sheet of the present invention. [Figure 5A] FIG. 5A is a schematic plan view illustrating one embodiment of supplying a protective cover member by the member supplying sheet of the present invention. FIG. [Figure 5B] FIG. 5B is a cross-sectional view that diagrammatically shows cross section BB of FIG. 5A. [Figure 5C] FIG. 5C is a cross-sectional view that illustrates a typical state during pick-up. [Figure 6] FIG. 6 is a cross-sectional view that typically shows one example of a protective cover member supplied by the member-supplying sheet of the present invention. [Figure 7A] FIG. 7A is a cross-sectional view that typically shows one example of a protective cover member supplied by the member supplying sheet of the present invention. [Figure 7B] FIG. 7B is a cross-sectional view that typically shows one example of a protective cover member supplied by the member supplying sheet of the present invention. [Figure 8] FIG. 8 is a plan view that illustrates an example of a protective cover member supplied by the member supplying sheet of the present invention. [Figure 9] FIG. 9 is a cross-sectional view that typically shows one example of a protective cover member supplied by the member-supplying sheet of the present invention. [Figure 10] FIG. 10 is a cross-sectional view that typically shows one example of a protective cover member supplied by the member-supplying sheet of the present invention. [Figure 11] FIG. 11 is a cross-sectional view that typically shows one example of a protective cover member supplied by the member-supplying sheet of the present invention. [Figure 12] FIG. 12 is a cross-sectional view that typically shows one example of a protective cover member supplied by the member-supplying sheet of the present invention. [Figure 13A] FIG. 13A is a schematic plan view illustrating an evaluation test of the pick-up characteristics of the member supplying sheet carried out in the examples. [Figure 13B] FIG. 13B is a cross-sectional view that diagrammatically shows cross section BB of FIG. 13A. [Figure 13C] FIG. 13C is a cross-sectional view that illustrates a typical state during pick-up. [Figure 14] FIG. 14 is a schematic diagram for explaining an evaluation test of the pick-up characteristics of the member supplying sheet carried out in the examples. [Figure 15] FIG. 15 is a graph used for calculating the surface free energy for the member supplying sheet implemented in the examples. [Figure 16]FIG. 16 is a schematic diagram for explaining an evaluation test of the tack strength of the member supplying sheet carried out in the examples. [Figure 17] FIG. 17 is a schematic view showing a part of the manufacturing process of the member supplying sheet carried out in the examples. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The present invention is not limited to the following embodiment.

[0011] An example of the member supply sheet of the present invention is shown in Figures 3A and 3B. Figure 3B shows a cross section BB of region I in the member supply sheet 1 of Figure 3A. The member supply sheet 1 comprises a base sheet 2 and two or more protective cover members 3 arranged on a surface (arrangement surface) 4 of the base sheet 2. In this manner, in the member supply sheet 1, a plurality of protective cover members 3 are arranged on the surface 4 of the base sheet 2.

[0012] A plurality of protective cover members 3 are arranged lengthwise and widthwise on the surface 4 of the base sheet 2 while maintaining a distance W between them. The distance W may be 0.05 mm or more and 5.0 mm or less, particularly 0.10 mm or more and 3.0 mm or less. The distance W may be larger than the width of the dicing saw, in other words, 0.10 mm or more, and even 3.0 mm or more. The base sheet 2 in FIG. 3A is a leaf-like shape having a rectangular shape, and the protective cover members 3, which are rectangular when viewed from a direction perpendicular to the surface 4, are arranged on the surface 4 of the base sheet 2. The distance W includes a distance W1 in the longitudinal direction of the protective cover member 3 and a distance W2 in the lateral direction of the protective cover member 3 when viewed perpendicular to the main surface of the protective cover member 3. The distance W1 and the distance W2 may each be within the range exemplified above for W. The distance W1 and the distance W2 may be equal to or different from each other.

[0013] The member supply sheet 1 is a sheet for supplying a protective cover member 3. The protective cover member 3 is a member to be placed on a surface (arrangement surface) of an object having a surface with an opening. By placing the protective cover member 3 on the arrangement surface, for example, it is possible to prevent the intrusion of foreign matter into and / or from the opening, in other words, the intrusion of foreign matter through the opening. The protective cover member 3 may be a member that is placed on the surface of an object having a surface with an opening to prevent the intrusion of foreign matter into the opening. The protective cover member 3 is composed of a laminate 34 including a protective film 31 and a carrier film 33 bonded to the peripheral portion of the protective film 31. The protective film 31 has a shape that covers the opening when the protective cover member 3 is placed on the surface.

[0014] 3B, the laminate 34 has a three-layer structure of a protective film 31, an adhesive layer 32, and a carrier film 33. The protective film 31 and the adhesive layer 32 are bonded to each other. The adhesive layer 32 and the carrier film 33 are bonded to each other. The base sheet 2 includes a base layer 21 and an adhesive layer 22 laminated on the base layer 21. In the member supplying sheet 1, the carrier film 33 is attached to the base layer 21 with the adhesive layer 22 interposed therebetween.

[0015] The laminate 34 may have a two-layer structure of a protective film 31 and a carrier film 33. In this case, the protective film 31 and the carrier film 33 may be welded together by a method such as ultrasonic welding.

[0016] For the protective cover member 3, the surface free energy of the carrier film 33 on the surface on the base sheet 2 side is 20 mJ / m 2 The surface free energy of the carrier film 33 on the surface on the base sheet 2 side is 30 mJ / m 2 More than 40mJ / m 2 Above 50mJ / m 2 The upper limit of the surface free energy of the carrier film 33 may be, for example, 65 mJ / m 2 The following is the result.

[0017] The surface free energy (i.e., surface tension) of a solid is calculated as follows:

[0018] Surface tension γ is calculated as follows: Surface tension γ = dispersion energy component γ d + Polar energy component γ p In the following, the surface tension γ of the liquid is expressed as γ L , the surface tension of the solid γ is γ S This indicates that.

[0019] For two types of liquid L (pure water, ethylene glycol) with known surface tension γ, L ,γ L d ,γ L p The values ​​of L for two known liquids are shown in Table 1 below.

[0020] [Table 1]

[0021] The contact angle θ of each of the above two types of liquid L (pure water, ethylene glycol) is measured using an automatic contact angle measuring device (Eiko Seiki Co., Ltd., Contact Angle System OCA30).

[0022] The graph shown in FIG. 15 can be obtained from the Young-Dupre equation below, the values ​​of L for two types of liquids shown in Table 1, and the measured contact angle θ. In the graph of FIG. 15, point A indicates pure water, and point B indicates ethylene glycol. In the following, W LS corresponds to the left hand side of the Young-Dupré equation.

[0023]

number

[0024] From the graph shown in Figure 15, the intercept (γ S d ) 0.5 and the slope (γ S p ) 0.5 Calculate the surface tension of the solid γS is the dispersion energy component γ S d + Polar energy component γ S p Therefore, the surface free energy can be calculated from the above results.

[0025] For the base sheet 2, the tack strength of the adhesive layer 22 is 100 mN / mm 2 The tack strength of the adhesive layer 22 is 90 mN / mm 2 Below that, 85mN / mm 2 The lower limit of the tack strength of the adhesive layer 22 may be, for example, 20 mN / mm 2 That's all.

[0026] The tensile test for determining the tack strength will be described with reference to FIG. 16. The base sheet 2 is attached to one side of an acrylic double-sided tape (No. 5000NS, manufactured by Nitto Denko) so that the adhesive layer 22 of the base sheet 2 faces outward (upper side in FIG. 16), and then cut into a square of 15 mm×15 mm. The other side of the No. 5000NS is attached to a SUS304 base. A cylindrical probe P made of SUS304 and having a diameter of 10 mm is set on a tensile tester (Autograph AGS-X, manufactured by Shimadzu Corporation). The test piece is compressed and bonded at 25° C. at a speed of 3 mm / min for 5 N×15 seconds (compression mode M1). Then, a tensile test is performed at 25° C. at a speed of 100 mm / min (tensile mode M2), and the maximum load at this time is measured to calculate the tack strength.

[0027] The component supply sheet 1 can be used as a sheet that supplies the protective cover member 3 to a push-up pick-up device. However, the destination of the protective cover member 3 supplied by the component supply sheet 1 is not limited to the push-up pick-up device. For example, it is also possible to supply the protective cover member 3 to a pick-up device other than the push-up pick-up device, or to a process in which the protective cover member 3 is picked up and used by hand, tweezers, or the like. Examples of push-up pick-up devices include chip mounters and die bonders. However, the push-up pick-up device is not limited to the above examples.

[0028] FIG. 4 shows an example of supplying a protective cover member 3 to a push-up pickup device by a member supply sheet 1. As shown in FIG. 4, the member supply sheet 1 supplied to the push-up pickup device is pushed up from the opposite side to the surface 4 of the base sheet 2 by a push-up presser 71 provided in the device at the position where the protective cover member 3 is arranged. The base sheet 2 is deformed upward by the push-up, and the protective cover member 3 is partially peeled off from the base sheet 2. The peeled surface is located between the carrier film 33 of the protective cover member 3 and the adhesive layer 22 of the base sheet 2. In this state, the protective cover member 3 is picked up from the base sheet 2 by a pickup unit 72 such as a suction nozzle. The picked-up protective cover member 3 can be transported by the pickup unit 72, for example, and placed on a surface 74 of an object 73 having a surface 74 with an opening 75. The protective cover member 3 can be placed, for example, so that the carrier film 33 is in contact with the surface 74.

[0029] The specific pickup mode is not limited as long as the base sheet 2 is pushed up during pickup. Examples of specific pickup modes are shown in Figs. 5A to 5C. Note that Fig. 5B shows the cross section BB of Fig. 5A. Fig. 5C shows a schematic diagram of the pickup mode. The member supply sheet 1 of Figs. 5A and 5B is supplied to a push-up pickup device in a state where it is fixed to a dicing ring (wafer ring) 42. The member supply sheet 1 of Figs. 5A and 5B is fixed to the dicing ring 42 by the adhesive layer 22 of the base sheet 2. However, the fixing method of the member supply sheet 1 is not limited to the above example. The member supply sheet 1 may be fixed to the dicing ring 42 by, for example, a double-sided adhesive tape.

[0030] In the example of FIG. 5A, two or more protective cover members 3 are regularly arranged on the base sheet 2. More specifically, the protective cover members 3 are arranged so that the center of each protective cover member 3 is located at the intersection (lattice point) of a rectangular lattice when viewed perpendicularly to the surface of the base sheet 2. However, the arrangement of the regularly arranged protective cover members 3 is not limited to the above example. The protective cover members 3 may be regularly arranged so that the center of each protective cover member 3 is located at the intersection of various lattices such as a square lattice, an oblique lattice, and a rhombic lattice. In addition, the arrangement of the protective cover members 3 is not limited to the above example. For example, the protective cover members 3 may be arranged in a staggered manner when viewed perpendicularly to the surface of the base sheet 2. The center of the protective cover member 3 can be determined as the center of gravity of the shape of the member 3 when viewed perpendicularly to the surface.

[0031] 5C, the base sheet 2 is pushed up in a state where the member supply sheet 1 is lifted up by another dicing ring (expanding ring) 46 having an outer diameter smaller than the inner diameter of the dicing ring 42. When the amount of pushing up by the push-up indenter 47 reaches a maximum, the protective cover member 3 is picked up from the base sheet 2 by the suction nozzle 48.

[0032] The material constituting the base material layer 21 included in the base material sheet 2 is typically a resin. Examples of the resin are polyolefins such as polyethylene and polypropylene, polyvinyl chloride, and polyurethane. However, the material constituting the base material layer 21 is not limited to the above examples. The base material layer 21 may be a single layer or may have a laminated structure of two or more layers.

[0033] The adhesive layer 22 laminated on the base layer 21 is an ultraviolet-curable adhesive (UV-curable adhesive) that is cured by irradiation with ultraviolet light (UV light). In other words, the adhesive layer 22 is formed by irradiating the UV-curable adhesive laminated on the base layer 21 with UV light and curing it. When the adhesive layer 22 is a UV-curable adhesive that is cured by irradiation with UV light, an increase in tackiness over time is suppressed. This improves the pick-up ability of the protective cover member 3.

[0034] The base sheet 2 may be a dicing tape having a laminated structure of a base layer 21 and a pressure-sensitive adhesive layer 22 .

[0035] The thickness of the base sheet 2 is, for example, 1 to 200 μm. The thickness of the base sheet 2 may be 100 μm or less.

[0036] The base sheet 2 in FIG. 3A is in the form of a sheet having a rectangular shape. The base sheet 2 in FIG. 5A is in the form of a sheet having a circular shape. The shape of the base sheet 2 in the form of a sheet is not limited to the above example, and may be a polygon including a square and a rectangle, a circle, an ellipse, or the like. When the base sheet 2 is in the form of a sheet, the member supply sheet 1 can be distributed and used in the form of a sheet. The base sheet 2 may be in the form of a strip, in which case the member supply sheet 1 is also in the form of a strip. The strip-shaped member supply sheet 1 can be distributed as a roll wound around a core.

[0037] The protective film 31 may be non-permeable in the thickness direction or may have permeability in the thickness direction. When the protective film 31 has permeability in the thickness direction, the arrangement of the protective cover member 3 can ensure permeability of the opening 75 while preventing the intrusion of foreign matter through the opening 75 of the object 73. By ensuring permeability, for example, it is possible to adjust the pressure through the opening 75 of the object 73 and to alleviate the pressure fluctuation. An example of alleviating the pressure fluctuation is shown below. In a state where a semiconductor element is arranged so as to cover one opening of a through hole provided in a circuit board, a heat treatment such as solder reflow may be performed. Here, by arranging the protective cover member 3 so as to cover the other opening, the intrusion of foreign matter into the element through the through hole during the heat treatment can be suppressed. When the protective film 31 has permeability in the thickness direction, the pressure increase in the through hole due to heating is alleviated, and damage to the element due to the pressure increase can be prevented. Examples of semiconductor elements are MEMS such as microphones, pressure sensors, and acceleration sensors. These elements have an opening through which air or sound can pass, and can be arranged on the circuit board so that the opening faces the through hole. The protective cover member 3 may be arranged on the semiconductor element after manufacture so as to cover the opening 75 of the element. When the protective film 31 has air permeability in the thickness direction, the arranged protective cover member 3 can function, for example, as an air permeable member that ensures air permeability through the opening 75 while preventing the intrusion of foreign matter through the opening 75, and / or as a sound permeable member that ensures sound permeability through the opening 75 while preventing the intrusion of foreign matter through the opening 75. Note that even when the protective film 31 is not air permeable in the thickness direction, sound can be transmitted by vibration of the protective film 31, so that the arranged protective cover member 3 can function as a sound permeable member.

[0038] The air permeability of the protective film 31 having air permeability in the thickness direction is expressed as air permeability (Gurley air permeability) determined in accordance with the air permeability measurement method B (Gurley type method) specified in JIS L1096, and is, for example, 100 seconds / 100 mL or less.

[0039] The protective film 31 may be waterproof and / or dustproof. The protective cover member 3 having the waterproof protective film 31 can function, for example, as a waterproof breathable member and / or a waterproof sound-permeable member after being placed on the target object 73. The waterproof protective film 31 has a water pressure resistance of, for example, 5 kPa or more, as determined in accordance with the water resistance test method A (low water pressure method) or method B (high water pressure method) specified in JIS L1092.

[0040] Examples of materials constituting the protective film 31 include metals, resins, and composite materials thereof.

[0041] Examples of resins that can form the protective film 31 include polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate (PET), silicone resins, polycarbonates, polyimides, polyamideimides, polyphenylene sulfide, polyether ether ketones (PEEK), and fluororesins. Examples of fluororesins include polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymers (PFA), tetrafluoroethylene-hexafluoropropylene copolymers (FEP), and tetrafluoroethylene-ethylene copolymers (ETFE). However, the resins are not limited to the above examples.

[0042] Examples of metals that can form the protective film 31 include stainless steel and aluminum.

[0043] The protective film 31 may be made of a heat-resistant material. In this case, depending on the material of the other layers constituting the protective cover member 3, it is possible to more reliably cope with high-temperature treatment such as solder reflow. Examples of heat-resistant materials are metals and heat-resistant resins. The heat-resistant resin typically has a melting point of 150°C or higher. The melting point of the heat-resistant resin may be 160°C or higher, 200°C or higher, 250°C or higher, 260°C or higher, or even 300°C or higher. Examples of heat-resistant resins are silicone resins, polyimides, polyamideimides, polyphenylene sulfide, PEEK, and fluororesins. The fluororesin may be PTFE. PTFE is particularly excellent in heat resistance.

[0044] The protective film 31 having air permeability in the thickness direction may include a stretched porous film. The stretched porous film may be a stretched porous film of fluororesin, particularly a stretched porous film of PTFE. The stretched porous film of PTFE is usually formed by stretching a paste extrudate or cast film containing PTFE particles. The stretched porous film of PTFE is composed of fine fibrils of PTFE, and may have nodes in which PTFE is in an aggregated state compared to the fibrils. The stretched porous film of PTFE can achieve both high levels of performance in preventing the intrusion of foreign matter and air permeability. The protective film 31 may be a known stretched porous film.

[0045] The protective film 31 having air permeability in the thickness direction may include a perforated film in which a plurality of through holes are formed connecting both main surfaces. The perforated film may be a film in which a plurality of through holes are provided in an original film having a non-porous substrate structure, for example, a non-porous film. The perforated film may not have a ventilation path in the thickness direction other than the plurality of through holes. The through holes may extend in the thickness direction of the perforated film, or may be straight holes extending linearly in the thickness direction. The shape of the opening of the through holes may be a circle or an ellipse when viewed perpendicularly to the main surface of the perforated film. The perforated film can be formed, for example, by laser processing of the original film, or by hole-making processing by ion beam irradiation and subsequent chemical etching.

[0046] The protective film 31 having air permeability in the thickness direction may include a nonwoven fabric, a woven fabric, a mesh, or a net.

[0047] The protective film 31 is not limited to the above example.

[0048] The shape of the protective film 31 in Fig. 3B is a rectangle when viewed perpendicularly to its main surface. However, the shape of the protective film 31 is not limited to the above example, and may be, for example, a polygon including a square or a rectangle, a circle, or an ellipse when viewed perpendicularly to its main surface. The polygon may be a regular polygon. The corners of the polygon may be rounded.

[0049] The protective film 31 has a thickness of, for example, 1 to 100 μm.

[0050] The area of ​​the protective film 31 is, for example, 175 mm 2 The protective cover member 3 having the protective film 31 with an area within this range is suitable for placement on, for example, a circuit board or MEMS that normally has a small opening. The lower limit of the area of ​​the protective film 31 is, for example, 0.20 mm 2 However, the area of ​​the protective film 31 may be larger depending on the type of object on which the protective cover member 3 is placed.

[0051] The adhesive layer 32 is, for example, a coating layer of an adhesive. Examples of adhesives include acrylic adhesives, silicone adhesives, urethane adhesives, epoxy adhesives, and rubber adhesives. When it is necessary to consider using the protective cover member 3 under high temperatures, it is preferable to select an acrylic adhesive or a silicone adhesive, particularly an acrylic adhesive, which has excellent heat resistance.

[0052] The acrylic adhesive is, for example, the adhesive disclosed in JP-A-2005-105212, and the silicone adhesive is, for example, the adhesive disclosed in JP-A-2003-313516 (including the one disclosed as a comparative example).

[0053] The pressure-sensitive adhesive layer 32 may be a single layer, or may have a laminate structure including two or more pressure-sensitive adhesive layers.

[0054] 3B is bonded to protective film 31. However, another layer may be disposed between protective film 31 and adhesive layer 32.

[0055] The adhesive layer 32 may be a double-sided adhesive tape (see FIG. 6). The adhesive layer 32 in FIG. 6 is a substrate-containing tape having a substrate 32A and adhesive layers 32B provided on both sides of the substrate 32A. The adhesives contained in the pair of adhesive layers 32B may be the same as or different from each other. For example, one adhesive layer 32B may contain an acrylic adhesive, and the other adhesive layer 32B may contain a silicone adhesive. The double-sided adhesive tape may be a substrate-less tape that does not contain the substrate 32A.

[0056] The adhesive layer 32 may be a combination of a plurality of adhesive layers. The adhesive layer 32 may be a laminated structure in which a single-sided adhesive tape having a base material 32A and an adhesive layer 32B provided on one side of the base material 32A is combined with an adhesive layer 32C (see Figs. 7A and 7B). In the example of Fig. 8A, the adhesive layer 32B of the single-sided adhesive tape is the bonding surface with the surface of the carrier film 33. In the example of Fig. 7B, the adhesive layer 32C is the bonding surface with the surface of the carrier film 33. The adhesive layer 32C may be a coating layer of adhesive or a double-sided adhesive tape.

[0057] The surface of the adhesive layer 32 that is bonded to the surface of the carrier film 33 is preferably made of an acrylic adhesive.

[0058] The substrate 32A of the adhesive tape is, for example, a film, nonwoven fabric, or foam of resin, metal, or a composite material thereof. The substrate 32A of the adhesive tape may be made of a heat-resistant material. In this case, depending on the materials of the other layers constituting the protective cover member 3, it may be possible to more reliably cope with use under high temperatures. Specific examples of heat-resistant materials are as described above in the description of the protective film 31.

[0059] The thickness of the adhesive layer 32 is, for example, 10 to 200 μm.

[0060] The carrier film 33 is a non-adhesive film. The carrier film 33 is, for example, a resin film, a nonwoven fabric, a paper, a metal foil, a woven fabric, a rubber sheet, a foam sheet, or a laminate thereof. The resin film may contain at least one selected from the group consisting of, for example, polyimide (PI), polyvinylidene fluoride (PVdF), polyethersulfone (PES), and polyphenylene sulfide (PPS).

[0061] 3B is bonded to the adhesive layer 32. However, other layers may be disposed between the carrier film 33 and the adhesive layer 32.

[0062] The thickness of the carrier film 33 is, for example, 10 to 200 μm.

[0063] The adhesive layer 32 and the carrier film 33 in FIG. 3B are disposed in a limited area on the main surface of the protective film 31 when viewed perpendicularly to the main surface of the protective film 31. The shape of the adhesive layer 32 and the carrier film 33 in FIG. 3B is the shape of the peripheral part of the protective film 31 when viewed perpendicularly to the main surface of the protective film 31, and more specifically, is a frame shape (see FIG. 8). FIG. 8 is a plan view of the protective cover member 3 in FIG. 3A and FIG. 3B when viewed from the carrier film 33 side. In this case, in the region A of the protective film 11 where the adhesive layer 32 and the carrier film 33 are not formed, better ventilation and / or sound transmission is possible compared to the region where the adhesive layer 32 and the carrier film 33 are formed. However, the shapes of the adhesive layer 32 and the carrier film 33 are not limited to the above example.

[0064] The area of ​​the region A of the protective film 11 is, for example, 20 mm 2 The protective cover member 3 having the area of ​​the region A in this range is suitable for placement on, for example, a circuit board or MEMS that normally has a small opening. The lower limit of the area of ​​the region A is, for example, 0.008 mm 2 However, the area of ​​region A may be larger depending on the type of object 73 on which protective cover member 3 is placed.

[0065] The laminate 34 of the protective cover member 3 may include layers other than the protective film 31, the adhesive layer 32, and the carrier film 33. Examples of protective cover members 3 including additional layers are shown in Figs.

[0066] The laminate 34 in FIG. 9 includes an adhesive layer 35 disposed at a position where the adhesive layer 32 and the protective film 31 are sandwiched therebetween. In this case, it is possible to dispose an additional layer on the adhesive layer 35, or the adhesive layer 35 can be bonded to any member and / or surface when the protective cover member 3 is disposed on the object 73. The protective cover member 3 may be disposed so that the adhesive layer 35, not the adhesive layer 32, contacts the surface 74 of the object 73. The adhesive layer 35 in FIG. 9 is bonded to the protective film 31. However, another layer may be disposed between the protective film 31 and the adhesive layer 35. The protective cover member 3 in FIG. 9 is the same as the protective cover member 3 in FIG. 3B, except that the protective cover member 3 in FIG. 9 further includes the adhesive layer 35.

[0067] The adhesive layer 35 may have the same configuration as the adhesive layer 32. For example, the adhesive layer 35 may be a double-sided adhesive tape (see FIG. 10). The adhesive layer 35 in FIG. 10 is a base-containing tape having a base material 35A and adhesive layers 35B provided on both sides of the base material 35A.

[0068] 9 and 10 has the same shape as the adhesive layer 32. In this case, better ventilation and / or sound transmission is possible in region B of the protective film 11 where the adhesive layer 35 is not formed, compared to the region where the adhesive layer 35 is formed. However, the shape of the adhesive layer 35 is not limited to the above example. The area of ​​region B may be in the same range as the area of ​​region A. The area of ​​region B may be the same as the area of ​​region A.

[0069] The laminate 34 in FIG. 11 further includes a cover film 36 that is located on the opposite side of the protective film 31 from the adhesive layer 32 and the carrier film 33 and covers the protective film 31. The cover film 36 is disposed on the adhesive layer 35. Another layer may be disposed between the adhesive layer 35 and the cover film 36. The cover film 36 functions as a protective film that protects the protective film 31, for example, until the protective cover member 3 is disposed on the object 73. The cover film 36 may be peeled off after the protective film 31 is disposed on the object 73. The cover film 36 may cover the entire protective film 31 or may cover a part of the protective film 31 when viewed perpendicularly to the main surface of the protective film 31.

[0070] 11 has a tab 37 that is a portion that protrudes outward from the outer periphery of the protective film 31 when viewed perpendicularly to the main surface of the protective film 31. The tab 37 can be used to peel off the cover film 36. However, the shape of the cover film 36 is not limited to the above example.

[0071] Examples of materials that can form the cover film 36 include metals, resins, and composite materials thereof. Specific examples of materials that can form the cover film 36 are the same as the specific examples of materials that can form the base material 32A.

[0072] The cover film 36 has a thickness of, for example, 200 to 1000 μm.

[0073] Fig. 12 shows another example of a protective cover member 3 further including a cover film 36. The protective cover member 3 in Fig. 12 is the same as the protective cover member 3 in Fig. 11 except that the adhesive layer 32 and the adhesive layer 35 are double-sided adhesive tapes.

[0074] The shape of the protective cover member 3 in Figures 3A and 3B is a rectangle when viewed perpendicularly to the main surface of the protective film 31. However, the shape of the protective cover member 3 is not limited to the above example. The shape may be a polygon including a square and a rectangle, a circle, or an ellipse when viewed perpendicularly to the main surface of the protective film 31. The polygon may be a regular polygon. The corners of the polygon may be rounded.

[0075] The area of ​​the protective cover member 3 (the area when viewed perpendicularly to the main surface of the protective film 31) is, for example, 175 mm 2 The protective cover member 3 having an area within this range is suitable for placement on, for example, a circuit board or MEMS that normally has a small opening. The lower limit of the area of ​​the protective cover member 3 is, for example, 0.20 mm 2That is all. However, the area of ​​the protective cover member 3 may be larger depending on the type of object to be placed. Note that the smaller the area of ​​the protective cover member 3, the more difficult it becomes to pick up the object. For this reason, when the area of ​​the protective cover member 3 is within the above range, the effect of the present invention is particularly remarkable.

[0076] The object 73 on which the protective cover member 3 is placed is, for example, a semiconductor element such as a MEMS or a circuit board. In other words, the protective cover member 3 may be a member for a semiconductor element, a circuit board, or a MEMS, in which the object 73 is a semiconductor element, a circuit board, or a MEMS. The MEMS may be a non-sealed element having a vent hole on the surface of the package. Examples of non-sealed MEMS are various sensors that detect air pressure, humidity, gas, airflow, etc., and electro-acoustic conversion elements such as speakers and microphones. In addition, the object 73 is not limited to a semiconductor element or a circuit board after manufacturing, but may be an intermediate product of these elements or boards in the manufacturing process. In this case, the protective cover member 3 can protect the intermediate product in the manufacturing process. Examples of the manufacturing process are a solder reflow process, a dicing process, a bonding process, and a mounting process. However, the object 73 is not limited to the above examples.

[0077] A surface 74 of an object 73 on which the protective cover member 3 can be disposed is typically a surface of the object 73. The surface 74 may be a flat surface or a curved surface. In addition, an opening 75 of the object 73 may be an opening of a recess or an opening of a through hole.

[0078] The component supply sheet 1 enables the manufacture of an object 73 having a protective cover member 3 disposed on a surface 74. The present disclosure includes a method for manufacturing an object with a protective cover member by supplying the component supply sheet 1. The component supply sheet 1 is typically supplied to a push-up pick-up device.

[0079] The component supply sheet 1 can be produced by disposing a protective cover member 3 on the surface 4 of a base sheet 2. The protective cover member 3 can be produced, for example, by laminating a protective film 31, an adhesive layer 32, and a carrier film 33. The base sheet 2 can be produced, for example, by laminating a base layer 21 and an adhesive layer 22. The component supply sheet 1 can be produced, for example, by bonding the carrier film 33 to the base layer 21 with the adhesive layer 22 interposed therebetween.

[0080] The member supplying sheet 1 is supplied to an end user in a state where it is packaged in a packaging material. The member supplying sheet 1 may be packaged in a packaging material in a state where it has an adhesive layer 22 that is a UV-curable adhesive that is cured by irradiation with UV light, and the protective cover members are arranged at intervals W of 0.05 mm or more and 5.0 mm or less. EXAMPLES

[0081] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the examples shown below.

[0082] First, the characteristics of the base sheet, the pick-up characteristics of the protective cover member in the member-feeding sheet, and the evaluation method for product misalignment will be described.

[0083] [Surface free energy] The surface free energy of the carrier film in the protective cover member was calculated from the surface tension γ calculated by the above-mentioned method.

[0084] [Tack strength] The tack strength of the pressure-sensitive adhesive layer on the substrate sheet was calculated by the method described above.

[0085] [Pickup characteristics] The pickup characteristics of the member supply sheet were evaluated as follows. The prepared member supply sheet was placed on the mounter of a push-up pickup device (Daitron, wafer chip sorter WCS-700C). The mounter was equipped with four push-up indenters. The push-up indenters were needle-shaped with a diameter of 0.15 mm, a tip curvature of 0.022 mm, and a height of 0.20 mm. According to the program, each protective cover member on the base sheet can be pushed up at any push-up amount and push-up speed. The member supply sheet was placed as follows using a dicing ring 42 (see Figures 13A and 13B. Note that Figure 13B shows the cross section BB of Figure 13A). A single-sided adhesive sheet 43 was attached to one side of the dicing ring 42 with the outer circumferences of the two sheets aligned with each other. A rectangular (100 mm x 60 mm) opening 44 was provided in the center of single-sided adhesive sheet 43 when viewed perpendicularly to the main surface of sheet 43. Next, component supply sheet 1 to be evaluated was placed on adhesive surface 45 of single-sided adhesive sheet 43 so as to cover opening 44, and fixed to dicing ring 42. The placement was performed so that the long sides of component supply sheet 1 and opening 44 were parallel to each other, and so that the distance between the outer periphery of component supply sheet 1 and the outer periphery of opening 44 was uniform over the entire periphery of both. Next, dicing ring 42 to which component supply sheet 1 was fixed was placed on a mounter.

[0086] Next, 10 of the 100 protective cover members arranged on one member supply sheet were randomly selected as one set, and picking up was attempted for each of the protective cover members included in the set by pushing up. The push-up amount was 200 μm. The push-up speed was 4.0 mm / sec. The push-up was performed by pushing up points 39a, 39b, 39c, and 39d on the square protective cover member 3 using the four push-up indenters. Points 39a, 39b, 39c, and 39d are the center points between the vertices of the protective film 31 and the corresponding vertices of the base sheet 3 on two diagonal lines 38A and 38B passing through the opposite vertices of the protective film 31 and the opposite vertices of the base sheet 3, respectively (see FIG. 14). The push-up was performed in a state where the single-sided adhesive sheet 43 and the component supply sheet 1 were lifted by 2.0 mm (expanding height 2.0 mm) by another dicing ring (expanding ring) 46 having an outer diameter smaller than the inner diameter of the dicing ring 42 to which the component supply sheet was fixed (see FIG. 13C. FIG. 13C shows a schematic diagram of the pickup state). The dicing ring 46 was selected so that it did not overlap with the protective cover member 3 when viewed perpendicularly to the main surface of the component supply sheet 1. A suction nozzle 48 was used for the pickup, and suction by the suction nozzle 48 was started when the push-up amount reached a maximum. The diameter of the suction nozzle 48 was 0.5 mm, and the suction pressure was 45 kPa. The suction time was 100 ms. The pickup characteristics were evaluated by the pickup rate B / A, which is the ratio of the number A (10 pieces) of protective cover members included in one set to the number B of protective cover members that could be picked up in the set. If the pick-up rate B / A was 9 / 10 or higher, it was judged as a pass (O), and otherwise it was judged as a fail (X).

[0087] [Product misalignment] The product displacement of the component supply sheet was evaluated as follows. A vibration test was carried out on the component supply sheet on which 10 protective cover members were arranged, using a complex environmental vibration tester (VS-5500-220T, manufactured by IMV) in accordance with the method described in JIS Z0232. The frequency range was 5 to 200 Hz, the vibration direction was the z-axis (vertical) direction, and the acceleration was 5.8 m / s2 After the vibration test, if the protective cover member was displaced from the initial state by 0.10 mm or more in the horizontal direction relative to the base sheet, it was judged as "failed x", and if the horizontal displacement was less than 0.10 mm, it was judged as "passed ◯".

[0088] (Manufacturing Example 1: Production of protective cover member A) A PTFE porous film (NTF1033, manufactured by Nitto Denko, thickness 10 μm) was prepared as the protective film 31. The shape of the PTFE porous film was a square with an outer shape of 3.0 mm × 3.0 mm. Next, a heat-resistant double-sided adhesive tape (No. 585, manufactured by Nitto Denko) having a picture frame shape was attached to one main surface of the protective film 31 as the adhesive layer 32. The outer shape of the adhesive layer 32 was a square of 3.0 mm × 3.0 mm, the inner shape was a square of 1.5 mm × 1.5 mm, and the width was constant all around. Furthermore, a polyimide film (Kapton 200H, manufactured by Toray DuPont, surface free energy 53.3 mJ / m 2 ) was prepared to have the same shape as the heat-resistant double-sided adhesive tape. The protective film 31, the adhesive layer 32, and the carrier film 33 were attached so that their peripheries were aligned. The adhesive layer 32B of the double-sided adhesive tape was an acrylic adhesive layer on both sides. In this way, a protective cover member A was obtained that was square when viewed from the main surface of the protective film 31.

[0089] (Manufacturing Example 2: Production of Protective Cover Members B1 to B3) Protective cover members B1 to B3 were obtained in the same manner as in Production Example 1, except that three types of heat-resistant films were used as the carrier film 33. For the protective cover member B1, a vinylidene fluoride film (KFC Film FT-50Y, manufactured by Kureha Extron, surface free energy 34.1 mJ / m 2 For the protective cover member B2, a polyethersulfone film (manufactured by Sumitomo Bakelite, Sumilite FS-1300, surface free energy 51.5 mJ / m) was used as the carrier film 33. 2For the protective cover member B3, a polyphenylene sulfide film (Toray, Torelina #50-3030, surface free energy 64.5 mJ / m) was used as the carrier film 33. 2 ) was used.

[0090] (Manufacturing Example 3: Production of protective cover member C) As the carrier film 33, a polytetrafluoroethylene film (manufactured by Nitto Denko, Nitoflon No. 900UL, surface free energy 18.0 mJ / m 2 A protective cover member C was obtained in the same manner as in Production Example 1, except that ) was used.

[0091] (Base sheet) Five types of dicing tapes a to e (Elepholder, manufactured by Nitto Denko Corporation) were prepared as the base sheet 2. The product names and characteristics of the dicing tapes a to e are shown in Table 2. The shape of the dicing tapes a to e was a circle with a diameter of 270 mm.

[0092] [Table 2]

[0093] Example 1 The dicing tape a was attached to a dicing ring (Izumi Metal, 8-inch flat ring) with the adhesive layer 22 facing up. Next, 100 protective cover members A (10 columns x 10 rows) were arranged and attached to the adhesive layer 22 of the dicing tape a. The protective cover members A were arranged so that, when viewed perpendicularly to the surface of the dicing tape a on which the protective cover members A were arranged, they were arranged with a spacing W of 0.10 mm or more and 0.50 mm or less between each other. One hour after the above attachment, a separator made of a PET base material was placed over the protective cover members A, and a UV irradiation device (Nitto Seiki, UM810) was used to irradiate the protective cover members A with 300 mJ / cm. 2 The dicing tape a was irradiated with UV light for 7 seconds from the base layer 21 side so as to achieve an integrated light amount of 1000 nm. In this manner, a member supplying sheet of Example 1 was obtained.

[0094] FIG. 17 is a schematic diagram showing a part of the manufacturing process of the member supply sheet 1. In FIG. 17, the protective film 31 and the adhesive layer 32 of the protective cover member 3 are omitted for ease of explanation. After the carrier film 33 is bonded to the base material layer 21 via the UV-curable adhesive constituting the adhesive layer 22 (see the left diagram of FIG. 17), when UV light is irradiated under the above-mentioned conditions, the adhesive constituting the adhesive layer 22 hardens and shrinks, and the fluidity of the adhesive is suppressed (see the right diagram of FIG. 17). That is, the member supply sheet 1 has the adhesive layer 22, which is a UV-curable adhesive hardened by UV light irradiation. Therefore, even if the affinity between the carrier film 33 and the adhesive is high, an increase in the tackiness of the adhesive over time is suppressed.

[0095] Example 2 A member feeding sheet of Example 2 was obtained in the same manner as in Example 1, except that dicing tape b was used as the base sheet 2.

[0096] Example 3 A member supplying sheet of Example 2 was obtained in the same manner as in Example 1, except that the dicing tape c was used as the base sheet 2.

[0097] Example 4 A member feeding sheet of Example 2 was obtained in the same manner as in Example 1, except that the dicing tape d was used as the base sheet 2.

[0098] Example 5 A member-feeding sheet of Example 5 was obtained in the same manner as in Example 1, except that the protective cover member B1 was used as the protective cover member 3.

[0099] Example 6 A member-feeding sheet of Example 6 was obtained in the same manner as in Example 1, except that the protective cover member B2 was used as the protective cover member 3.

[0100] Example 7 A member-feeding sheet of Example 7 was obtained in the same manner as in Example 1, except that the protective cover member B3 was used as the protective cover member 3.

[0101] Comparative Example 1 After the above lamination, the sheet was stored in an environment of 85° C. and 95% RH for 24 hours, and then irradiated with UV light under the above conditions, in the same manner as in Example 1, to obtain a member supplying sheet of Comparative Example 1.

[0102] Comparative Example 2 After the above lamination, the sheet was stored in an environment of 85° C. and 95% RH for 24 hours, and then irradiated with UV light under the above conditions, in the same manner as in Example 2, to obtain a member supplying sheet of Comparative Example 2.

[0103] Comparative Example 3 After the above lamination, the sheet was stored in an environment of 85° C. and 95% RH for 24 hours, and then irradiated with UV light under the above conditions, in the same manner as in Example 3 to obtain a member supplying sheet of Comparative Example 3.

[0104] Comparative Example 4 After the above lamination, the sheet was stored in an environment of 85° C. and 95% RH for 24 hours, and then irradiated with UV light under the above conditions, in the same manner as in Example 4, to obtain a member supplying sheet of Comparative Example 4.

[0105] Comparative Example 5 A member feeding sheet of Comparative Example 5 was obtained in the same manner as in Comparative Example 1, except that dicing tape e was used as the base sheet 2.

[0106] Comparative Example 6 A member-feeding sheet of Comparative Example 6 was obtained in the same manner as in Example 1, except that the protective cover member C was used as the protective cover member 3.

[0107] The evaluation results are shown in Tables 3A and 3B below.

[0108] [Table 3A]

[0109] [Table 3B]

[0110] As shown in Tables 3A and 3B, in Examples 1 to 7, good pick-up properties were ensured and no product deviation occurred.

[0111] Next, for Examples 1 to 3, the pickup characteristics were evaluated by irradiating UV light under the above conditions 3 hours after the lamination. The pickup ratio B / A of Example 1 was 10 / 10, and excellent pickup properties were maintained. The pickup ratios B / A of Examples 2 and 3 were both 9 / 10. From these results, it can be seen that the smaller the (initial) tack strength before UV light irradiation, the better the pickup properties. That is, it is considered that the (initial) tack strength before UV light irradiation affects the tack strength after UV light irradiation. The mechanism is not clear, but is presumed to be as follows. If the tack strength before UV light irradiation is large, the tack strength may not be sufficiently reduced even when UV light is irradiated. In this case, the adhesive strength after UV light irradiation is also large, so it is considered that the pickup properties are reduced. In addition, the greater the degree of hardening and shrinkage of the adhesive layer 22 during UV light irradiation, the smaller the contact area between the carrier film 33, which is the adherend, and the adhesive layer 22, and the lower the adhesive strength. Therefore, if the tack strength before UV light irradiation is large, the hardening and shrinkage of the adhesive layer 22 that occurs during UV light irradiation is suppressed, making it difficult to reduce the adhesion area between the carrier film 33 and the adhesive layer 22. In this case, it is considered that the pickup property decreases because the decrease in adhesive strength due to UV light irradiation is suppressed.

[0112] The tack and adhesive strength of the component supply sheet before irradiation with UV light can be inferred based on the component supply sheet after irradiation with UV light, using qualitative and quantitative analysis (monomer type and amount of each component) of the UV-curable adhesive that constitutes the adhesive layer 22, and information on the base material composition. [Industrial Applicability]

[0113] The member-supplying sheet of the present invention can be used, for example, to supply protective cover members to a push-up pick-up device. [Explanation of symbols]

[0114] 1. Material supply sheet 2. Base sheet 21 Base material layer 22 Adhesive layer 3 Protective cover material 31 Protective film 32 Adhesive layer 33 Carrier Film 34 Laminate 35 Cover Sheet 71 Push-up indenter 72 Pickup section 73 Object 74 sides 75 Aperture

Claims

1. A member supply sheet for supplying a protective cover member, comprising: two or more protective cover members to be placed on a surface of an object having an opening; and a base sheet having the two or more protective cover members arranged on a surface thereof, The protective cover member is composed of a laminate including a protective film having a shape that covers the opening when the protective cover member is placed on the surface, and a carrier film joined to a peripheral portion of the protective film; The base sheet includes a base layer and a pressure-sensitive adhesive layer laminated on the base layer, The carrier film is attached to the base layer via the pressure-sensitive adhesive layer, The surface free energy of the carrier film is 20 mJ / m on the surface on the base sheet side. 2 That's all. The tack strength of the adhesive layer is 100 mN / mm 2 Below is the Sheet for supplying parts.

2. The tack strength is 20 mN / mm 2 The member supplying sheet according to claim 1 .

3. 3. The member supplying sheet according to claim 1, wherein the two or more protective cover members are arranged on the surface of the base sheet with a distance of 0.05 mm or more and 5.0 mm or less between each other.

4. 4. The member supplying sheet according to claim 1, wherein the adhesive layer is an ultraviolet-curable adhesive that is cured by irradiation with ultraviolet rays.

5. The member supplying sheet according to any one of claims 1 to 4, wherein the protective film has air permeability in a thickness direction.

6. The member supplying sheet according to any one of claims 1 to 5, wherein the protective film includes a polytetrafluoroethylene film.

7. The member supply sheet according to any one of claims 1 to 6, wherein the carrier film contains at least one selected from the group consisting of polyimide, polyvinylidene fluoride, polyethersulfone, and polyphenylene sulfide.

8. The member supply sheet according to any one of claims 1 to 7, wherein the laminate is further provided with a cover film located on the opposite side of the protective film from the carrier film and covering the protective film.

9. 9. The member supplying sheet according to claim 1, wherein the protective cover member is a member for a microelectromechanical system (MEMS) for which the target object is a MEMS.

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