Method for manufacturing a conductive structure

Abstract

To provide a manufacturing method of a conductive structure which has a conductive linear body, can be manufactured with high production efficiency and can form the conductive linear body with high pattern accuracy even in a fine shape.SOLUTION: A manufacturing method of a conductive structure includes a step (1) of preparing a laminate 110, and a step (2) of forming a conductive linear body 120 on the surface of an adhesive layer 112 by injecting a conductive material 120a from a nozzle 20 onto the surface of the adhesive layer 112. The nozzle 20 has an injection hole 22 and an air ejection hole 23, and the nozzle 20 is arranged at a predetermined distance L from the transported laminate 110. In the step (2), the conductive linear body 120 is formed on the surface of the adhesive layer 112 by injecting the conductive material 120a from the injection hole 22 toward the laminate 110 and blowing air from the air ejection hole 23.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a method for producing a conductive structure. [Background technology]

[0002] A conductive structure in which a plurality of conductive linear members are arranged at intervals may be used in various articles, such as a heating element for a heating device, a material for a heat-generating textile, a protective film for a display (shatterproof film), etc. Such a conductive structure is used, for example, as a conductive sheet or a sheet-like conductive member in which conductive linear members are arranged on a laminate composed of a base material and an adhesive layer, or as a sheet-like heater in which the conductive linear members are used as a heating element.

[0003] As an example of such a conductive structure, Patent Document 1 discloses a conductive sheet for three-dimensional molding, which has a pseudo sheet structure in which a plurality of conductive linear bodies extending in one direction are arranged at intervals, in which the conductive linear bodies have a first wave-shaped portion having a wavelength λ1 and an amplitude A1 and a second wave-shaped portion having a wavelength λ2 and an amplitude A2 that is different from at least one of the wavelength λ1 and the amplitude A1 of the first portion, and a resin protective layer provided on one surface of the pseudo sheet structure. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2018 / 097323 Summary of the Invention [Problem to be solved by the invention]

[0005] The method for producing the conductive structure described above involves preparing a long laminate (sheet) composed of the above-mentioned base material and adhesive layer, transporting the laminate at high speed, and ejecting a conductive material that will become the conductive linear bodies from a nozzle onto the surface of the adhesive layer (see, for example, Figures 7 and 8 described below). This type of production method is expected to improve production efficiency because it is possible to form the conductive linear bodies while transporting the laminate at high speed.

[0006] However, such a manufacturing method has a problem in that it is difficult to accurately arrange fine conductive linear bodies on the laminate.

[0007] The present invention has been made in consideration of the above circumstances, and has as its main object to provide a method for manufacturing a conductive structure having a conductive linear body, which has high manufacturing efficiency and is capable of forming conductive linear bodies with high pattern precision, even when the conductive linear bodies have fine shapes. [Means for solving the problem]

[0008] As a result of intensive research into achieving the above-mentioned object, the inventors have discovered a method for manufacturing a conductive structure including a substrate, an adhesive layer laminated on a surface of the substrate, and a conductive linear body arranged on the surface of the adhesive layer, the method including: (1) a step of preparing a laminate including the substrate and the adhesive layer; and (2) a step of forming a conductive linear body on the surface of the adhesive layer by injecting a conductive material to become the conductive linear body from a nozzle onto the surface of the adhesive layer of the laminate while transporting the laminate, the nozzle having an injection hole for injecting the conductive material and an air ejection hole disposed in the vicinity of the injection hole for ejecting air, the nozzle being disposed a predetermined distance away from the laminate being transported, and the step of (2) involves injecting the conductive material from the injection hole toward the laminate being transported, and blowing air from the air ejection hole, thereby forming the conductive linear body on the surface of the adhesive layer, thereby completing the present invention.

[0009] That is, the present invention is as follows.

[0010] <1> A method for producing a conductive structure comprising a substrate, an adhesive layer laminated on a surface of the substrate, and a conductive linear body disposed on the surface of the adhesive layer, the method comprising the steps of: The method for producing a conductive structure includes: (1) a step of preparing a laminate including the base material and the adhesive layer; and (2) a step of forming the conductive linear body on the surface of the adhesive layer of the laminate while transporting the laminate, by injecting a conductive material that will become the conductive linear body from a nozzle onto the surface of the adhesive layer of the laminate, wherein the nozzle has an injection hole for injecting the conductive material and an air injection hole that is located in the vicinity of the injection hole and ejects air, the nozzle being located a predetermined distance away from the laminate being transported. The method for producing a conductive structure includes: injecting the conductive material from the injection hole toward the laminate being transported, and blowing air from the air injection hole, thereby forming the conductive linear body on the surface of the adhesive layer. <2> The step (2) is a step of forming the wavy conductive linear body on the surface of the adhesive layer by injecting the conductive material from the injection hole toward the surface of the adhesive layer of the laminate while moving the nozzle along the width direction of the laminate. <1> 2 is a method for producing the conductive structure according to claim 1 . <3> The adhesive layer contains at least one selected from the group consisting of an acrylic resin, a urethane resin, a rubber resin, a silicone resin, an epoxy resin, a polycarbonate resin, and an ester resin. <1> or <2> 2 is a method for producing the conductive structure according to claim 1 . <4> The elastic modulus of the adhesive layer is 0.001 MPa or more and 10 MPa or less. <1> ~ <3> 1 is a method for producing a conductive structure according to any one of the above items. <5> The conductive linear body includes at least one selected from the group consisting of copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, gold, and an alloy including two or more metals. <1> ~ <4> 1 is a method for producing a conductive structure according to any one of the above items. <6> The nozzle is disposed at a distance of 0.01 mm or more and 20 mm or less from the surface of the laminate being transported. <1> ~ <5> 1 is a method for producing a conductive structure according to any one of the above items. <7> The tip diameter of the nozzle is 1.5 to 10 times the diameter of the conductive linear body in a cross-sectional view. <1> ~ <6> 1 is a method for producing a conductive structure according to any one of the above items. <8> The discharge pressure of the air ejected from the air ejection hole is 0.1 MPa or more and 10 MPa or less. <1> ~ <7> 1 is a method for producing a conductive structure according to any one of the above items. <9> The conductive structure is at least one selected from the group consisting of a conductive member, a heater, and a sensor. <1> ~ <8> 1 is a method for producing a conductive structure according to any one of the above items. Effect of the Invention

[0011] According to the present invention, it is possible to provide a method for manufacturing a conductive structure having a conductive linear body, which has high manufacturing efficiency and is capable of forming a conductive linear body with high pattern precision even when the conductive linear body has a fine shape. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing an example of a conductive structure according to the present embodiment. [Diagram 2] FIG. 2 is a cross-sectional view taken along line AA in FIG. [Diagram 3] FIG. 3 is a schematic diagram showing an example of a production method according to this embodiment. [Figure 4] FIG. 4 is a partial top view showing an example of a manufacturing method according to this embodiment. [Diagram 5] FIG. 5 is a cross-sectional view showing an example of the vicinity of a nozzle in the manufacturing method according to this embodiment. [Figure 6]FIG. 6 is a perspective view showing an example of a heater using the conductive structure according to this embodiment. [Figure 7] FIG. 7 is a schematic diagram showing an example of a manufacturing method according to the prior art. [Figure 8] FIG. 8 is a cross-sectional view showing an example of the vicinity of a nozzle in a manufacturing method of the prior art. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment for carrying out the present invention (hereinafter, simply referred to as "the present embodiment") will be described in detail. The present embodiment is an example for explaining the present invention, and is not intended to limit the present invention to the following content. The present invention can be carried out by appropriately modifying it within the scope of its gist.

[0014] In the drawings, the same elements are given the same reference numerals, and duplicated explanations are omitted. Furthermore, unless otherwise specified, the positional relationships such as up, down, left, and right are based on the positional relationships shown in the drawings. Furthermore, the dimensional ratios of the drawings are not limited to the ratios shown in the drawings.

[0015] In addition, in this specification, unless otherwise specified, "(meth)acrylic" includes methacryl and acrylic. For example, (meth)acrylic means methacryl, acrylic, or both. The same applies to other synonyms such as "(meth)acrylate".

[0016] <Conductive structure>

[0017] First, a conductive structure obtained by the manufacturing method according to this embodiment will be described.

[0018] FIG. 1 is a perspective view showing an example of a conductive structure in this embodiment, and FIG. 2 is a cross-sectional view taken along line AA in FIG.

[0019] The conductive structure 100 includes a substrate 111, an adhesive layer 112 laminated on the surface of the substrate 111, and a conductive linear body 120 disposed on the surface of the adhesive layer 112. In the conductive structure 100, the conductive linear body 120 is disposed on the surface of a laminate 110 constituted by the substrate 111 and the adhesive layer 112.

[0020] The conductive structure 100 may have a structure in which a plurality of conductive linear bodies 120 are arranged at a predetermined interval P between each other. FIG. 1 illustrates an example in which four conductive linear bodies 120 are arranged. The conductive linear bodies 120 are arranged along the longitudinal direction Y of the conductive structure 100 (i.e., the transport direction described below). Then, in the width direction X of the conductive structure 100 (i.e., the direction perpendicular to the longitudinal direction Y), a plurality of conductive linear bodies 120 are arranged at a predetermined interval P (see FIG. 2).

[0021] Furthermore, the arrangement shape (patterning) of the conductive linear bodies 120 is not particularly limited and may be curved or straight. For example, as shown in Fig. 1, it may be wavy in top view. The manufacturing method according to this embodiment can arrange (pattern) even conductive linear bodies 120 in a wavy shape having complex curved portions with high dimensional accuracy.

[0022] (Laminate)

[0023] The laminate 110 includes a base material 111 and an adhesive layer 112, and can be in the form of a long sheet. The sheet-like laminate 110 makes it easy to arrange the conductive structure 100 while transporting it on a transport device, as described below.

[0024] From the viewpoint of disposing the conductive linear body 120 on the surface of the adhesive layer 112, the layer structure of the laminate 110 is not limited to two layers as long as at least the outermost surface is the adhesive layer 112. For example, it may be three or more layers. For example, the base material 111 may be made of multiple layers, or various functional layers may be provided as intermediate layers between the base material 111 and the adhesive layer 112.

[0025] (base material)

[0026] Examples of the substrate 111 include a synthetic resin film, paper, metal foil, nonwoven fabric, cloth, and glass film. The substrate 111 can directly or indirectly support the conductive structure 100. The substrate 111 is preferably an elastic substrate. The "film" may also be called a "sheet" or the like.

[0027] The stretchable substrate may be a synthetic resin film, paper, nonwoven fabric, cloth, etc. Among these stretchable substrates, a synthetic resin film or cloth is preferred, and a synthetic resin film is more preferred.

[0028] Examples of synthetic resin films include polyethylene films, polypropylene films, polybutene films, polybutadiene films, polymethylpentene films, polyvinyl chloride films, vinyl chloride copolymer films, polyethylene terephthalate films, polyethylene naphthalate films, polybutylene terephthalate films, polyurethane films, ethylene-vinyl acetate copolymer films, ionomer resin films, ethylene-(meth)acrylic acid copolymer films, ethylene-(meth)acrylic acid ester copolymer films, polystyrene films, polycarbonate films, and polyimide films. Other examples of stretchable substrates include crosslinked films and laminated films of these.

[0029] Examples of the paper include fine paper, recycled paper, and craft paper.

[0030] Examples of nonwoven fabrics include spunbond nonwoven fabrics, needle-punched nonwoven fabrics, melt-blown nonwoven fabrics, and spunlace nonwoven fabrics.

[0031] Examples of fabrics include woven fabrics and knitted fabrics.

[0032] The stretchable substrate may be a nonwoven fabric or a cloth, but is not limited thereto.

[0033] (Adhesive layer) The adhesive layer 112 is a layer having adhesive properties and may be any layer capable of adhering the conductive linear body 120 described below. For example, the adhesive layer 112 is a layer containing a resin. The adhesive layer 112 can directly or indirectly support the conductive structure 100.

[0034] The adhesive layer 112 is preferably a layer containing an adhesive. When the adhesive layer 112 contains an adhesive, the conductive linear body 120 can be attached to the adhesive layer 112, and the conductive linear body 120 can be more firmly fixed. Furthermore, when the adhesive layer 112 contains an adhesive, the conductive linear body 120 can be easily attached to the substrate 111 via the adhesive layer 112.

[0035] The adhesive layer 112 may be a layer made of a dryable or hardenable resin. After being hardened or dried, the adhesive layer 112 has impact resistance and can suppress deformation of the base material 111 due to impact.

[0036] From the viewpoint of being easily cured in a short time, the adhesive layer 112 is preferably curable with energy rays such as ultraviolet rays, visible energy rays, infrared rays, and electron beams. Note that "energy ray curing" also includes heat curing by heating using energy rays.

[0037] The adhesive of the adhesive layer 112 may be a thermosetting type that hardens when heated, a so-called heat seal type that bonds when heated, or an adhesive that develops stickiness when moistened. However, from the perspective of ease of application, it is preferable that the adhesive layer 112 is energy ray curable. Examples of energy ray curable resins include compounds having at least one polymerizable double bond in the molecule, and (meth)acrylate compounds having a (meth)acryloyl group are preferred.

[0038] Examples of the acrylate-based compound include (meth)acrylates containing a chain aliphatic skeleton (trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate. acrylates, etc.), alicyclic skeleton-containing (meth)acrylates (dicyclopentanyl di(meth)acrylate, dicyclopentadiene di(meth)acrylate, etc.), polyalkylene glycol (meth)acrylates (polyethylene glycol di(meth)acrylate, etc.), oligoester (meth)acrylates, urethane (meth)acrylate oligomers, epoxy-modified (meth)acrylates, polyether (meth)acrylates other than polyalkylene glycol (meth)acrylates, and itaconic acid oligomers.

[0039] Weight average molecular weight (M w ) is preferably 100 to 30,000, and more preferably 300 to 10,000.

[0040] The adhesive composition may contain one or more types of energy ray curable resins, and when two or more types are contained, the combination and ratio thereof may be selected arbitrarily. Furthermore, the adhesive composition may be combined with a thermoplastic resin described later, and the combination and ratio thereof may be selected arbitrarily.

[0041] The adhesive layer 112 may be an adhesive layer formed from an adhesive (such as a pressure-sensitive adhesive). The adhesive of the adhesive layer 112 is not particularly limited. For example, examples of the adhesive include an acrylic adhesive, a urethane adhesive, a rubber adhesive, a polyester adhesive, a silicone adhesive, and a polyvinyl ether adhesive. Among these, the adhesive is preferably at least one selected from the group consisting of an acrylic adhesive, a urethane adhesive, and a rubber adhesive, and is more preferably an acrylic adhesive.

[0042] Examples of acrylic adhesives include polymers containing structural units derived from alkyl (meth)acrylates having a straight-chain alkyl group or a branched-chain alkyl group (i.e., polymers obtained by polymerizing at least alkyl (meth)acrylates), and acrylic polymers containing structural units derived from (meth)acrylates having a cyclic structure (i.e., polymers obtained by polymerizing at least (meth)acrylates having a cyclic structure).

[0043] When the acrylic polymer is a copolymer, the form of the copolymerization is not particularly limited. The acrylic copolymer may be any of a block copolymer, a random copolymer, and a graft copolymer.

[0044] The acrylic copolymer may be crosslinked with a crosslinking agent. Examples of the crosslinking agent include known epoxy crosslinking agents, isocyanate crosslinking agents, aziridine crosslinking agents, and metal chelate crosslinking agents. When the acrylic copolymer is crosslinked, a hydroxyl group, a carboxyl group, or the like that reacts with these crosslinking agents can be introduced into the acrylic copolymer as a functional group derived from the monomer component of the acrylic polymer.

[0045] When the adhesive layer 112 is formed from an adhesive, the adhesive layer 112 may further contain the above-mentioned energy ray curable resin in addition to the adhesive. When an acrylic adhesive is applied as the adhesive, a compound having both a functional group that reacts with a functional group derived from a monomer component in an acrylic copolymer and an energy ray polymerizable functional group in one molecule may be used as the energy ray curable component. The reaction between the functional group of the compound and the functional group derived from the monomer component in the acrylic copolymer makes the side chain of the acrylic copolymer polymerizable by energy ray irradiation. Even when the adhesive is other than an acrylic adhesive, a component whose side chain is energy ray polymerizable may be used as a polymer component other than the acrylic polymer.

[0046] The thermosetting resin used in the adhesive layer 112 is not particularly limited, and specific examples thereof include acrylic resins, urethane resins, rubber resins, silicone resins, epoxy resins, polycarbonate resins, ester resins, phenol resins, melamine resins, urea resins, benzoxazine resins, phenoxy resins, amine compounds, and acid anhydride compounds. For example, examples of acrylic resins include polymers containing structural units derived from (meth)acrylate, such as (meth)acrylate polymers and (meth)acrylate copolymers. These may be used alone or in combination of two or more.

[0047] The moisture-curable resin used in the adhesive layer 112 is not particularly limited, and examples thereof include urethane-based resins and modified silicone-based resins, which are resins that generate isocyanate groups when exposed to moisture.

[0048] When using an energy ray curable resin or a thermosetting resin, it is preferable to use a photopolymerization initiator, a thermal polymerization initiator, etc. By using a photopolymerization initiator, a thermal polymerization initiator, etc., a crosslinked structure is formed, and the conductive structure 100 can be protected more firmly.

[0049] Examples of the photopolymerization initiator include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, 2,4-diethylthioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, 2-chloroanthraquinone, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, and bis(2,4,6-trimethylbenzoyl)-phenyl-phosphine oxide.

[0050] Examples of the thermal polymerization initiator include hydrogen peroxide, peroxodisulfates (e.g., ammonium peroxodisulfate, sodium peroxodisulfate, and potassium peroxodisulfate), azo compounds (e.g., 2,2'-azobis(2-amidinopropane) dihydrochloride, 4,4'-azobis(4-cyanovaleric acid), 2,2'-azobisisobutyronitrile, and 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), and organic peroxides (e.g., benzoyl peroxide, lauroyl peroxide, peracetic acid, persuccinic acid, di-t-butyl peroxide, t-butyl hydroperoxide, and cumene hydroperoxide).

[0051] These polymerization initiators may be used alone or in combination of two or more.

[0052] When these polymerization initiators are used to form a crosslinked structure, the amount used is preferably 0.1 parts by mass or more and 100 parts by mass or less, more preferably 1 part by mass or more and 100 parts by mass or less, and even more preferably 1 part by mass or more and 10 parts by mass or less, relative to 100 parts by mass of the energy ray-curable resin or the thermosetting resin.

[0053] The adhesive layer 112 may not be curable, and may be, for example, a layer made of a thermoplastic resin composition. The thermoplastic resin layer can be softened by including a solvent in the thermoplastic resin composition. This makes it easier to attach the conductive linear body 120 to the adhesive layer 112 when forming the conductive linear body 120 on the surface of the adhesive layer 112. On the other hand, the thermoplastic resin layer can be dried and solidified by volatilizing the solvent in the thermoplastic resin composition.

[0054] Examples of thermoplastic resins include polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyvinyl acetate, polyurethane, polyether, polyethersulfone, polyimide, and acrylic resins. Examples of acrylic resins include polymers containing structural units derived from (meth)acrylate, such as (meth)acrylate polymers and (meth)acrylate copolymers.

[0055] Examples of the solvent include alcohol-based solvents, ketone-based solvents, ester-based solvents, ether-based solvents, hydrocarbon-based solvents, alkyl halide solvents, and water.

[0056] The adhesive layer 112 may contain an inorganic filler. By containing an inorganic filler, the hardness of the adhesive layer 112 after curing can be further improved. In addition, the thermal conductivity of the adhesive layer 112 is improved.

[0057] Examples of inorganic fillers include inorganic powders (e.g., powders of silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, and boron nitride), beads obtained by sphering inorganic powders, single crystal fibers, and glass fibers. Among these, silica filler and alumina filler are preferred as inorganic fillers. The inorganic fillers may be used alone or in combination of two or more.

[0058] As the material for the adhesive layer 112, various materials mentioned above can be used depending on the application, etc., but in the manufacturing method according to the present embodiment, it is preferable that the adhesive layer 112 contains at least one selected from the group consisting of acrylic resin, urethane resin, rubber resin, silicone resin, epoxy resin, polycarbonate resin, and ester resin. By using such a material, a layer of the desired thickness can be formed more uniformly.

[0059] The adhesive layer 112 may contain other components, such as well-known additives, such as organic solvents, flame retardants, tackifiers, ultraviolet absorbers, antioxidants, preservatives, antifungal agents, plasticizers, defoamers, and wettability adjusters.

[0060] The adhesive layer 112 can be formed by applying a coating liquid in which the above-mentioned resins and additives are dissolved in a solvent using a known coating method such as die coating, spray coating, comma coating, or gravure coating, and then heating and drying as necessary.

[0061] The thickness of the adhesive layer 112 is appropriately determined depending on the application of the conductive structure 100. For example, from the viewpoint of adhesiveness, the thickness of the adhesive layer 112 is preferably 3 μm or more and 150 μm or less, and more preferably 5 μm or more and 100 μm or less.

[0062] The elastic modulus of the adhesive layer 112 is preferably 0.001 MPa or more and 10 MPa or less, more preferably 0.01 MPa or more and 2 MPa or less, and even more preferably 0.05 MPa or more and 1 MPa or less. By setting the elastic modulus in this range, the conductive linear body 120 arranged on the adhesive layer 112 can be firmly fixed in the manufacturing method described later.

[0063] (Conductive wire)

[0064] The cross-sectional shape of the conductive linear body 120 (see FIG. 2) is not particularly limited and may be, for example, circular, elliptical, polygonal, rectangular, flat, etc., but since it is manufactured using a nozzle as described below, it is preferably circular or elliptical, and more preferably circular.

[0065] When the cross-sectional shape of the conductive linear body 120 is circular, the diameter D (see FIG. 2) of the conductive linear body 120 in cross section is preferably 5 μm or more and 3 mm or less. From the viewpoints of suppressing an increase in the resistance of the conductive structure 100 and improving the heat generation efficiency and dielectric breakdown resistance characteristics when it is used as a heating element, the diameter D is more preferably 8 μm or more and 60 μm or less, and further preferably 12 μm or more and 40 μm or less.

[0066] This diameter D can be determined by observing the conductive linear body 120 of the conductive structure 100 using a digital microscope, measuring the diameter of the conductive linear body 120 at five randomly selected locations, and using the arithmetic average value.

[0067] When the cross section of the conductive linear object 120 is elliptical, it is preferable that the major axis is in the same range as the diameter D described above.

[0068] The arrangement interval P (see FIG. 2) of the conductive linear objects 120 is preferably 1 mm or more and 400 mm or less, more preferably 2 mm or more and 200 mm or less, and further preferably 3 mm or more and 100 mm or less.

[0069] If the arrangement spacing P is within the above range, the conductive linear bodies 120 will have a relatively dense patterning shape, and therefore, when the conductive structure 100 is used as a heating element, various functions can be improved, such as making the distribution of temperature rise uniform (no bias in temperature rise).

[0070] The arrangement interval P of the conductive linear bodies 120 can be obtained by observing the conductive linear bodies 120 of the conductive structure 100 visually or using a digital microscope and measuring the interval between two adjacent conductive linear bodies 120. The arrangement interval P of two adjacent conductive linear bodies 120 is the length along the direction in which the conductive linear bodies 120 are arranged (width direction X, see FIGS. 1 and 2), and is the length between opposing portions of the two conductive linear bodies 120 (see FIG. 2). When the conductive linear bodies 120 are arranged at unequal intervals, the arrangement interval P can be the arithmetic average value of the intervals between all adjacent conductive linear bodies 120.

[0071] The material of the conductive linear body 120 is not particularly limited, but is preferably a linear body including a metal wire (sometimes called a "metal wire linear body"). Metal wire has high thermal conductivity, high electrical conductivity, high handling properties, and versatility. Therefore, when a metal wire linear body is used as the conductive linear body 120, the resistance value of the conductive structure 100 can be reduced while improving the light transmittance. For example, the higher the conductivity of the conductive linear body 120, the thinner the wire can be (the smaller the diameter D). As a result, the transmission area of ​​light passing through the sheet can be increased, and the light transmittance can be improved. In addition, when the conductive structure 100 is used as a heating body, rapid heat generation can be easily achieved. Furthermore, a thin linear body with a small diameter D can be easily obtained.

[0072] In addition, examples of the conductive linear body 120 include a linear body containing a carbon nanotube and a linear body in which a conductive coating is applied to a thread, in addition to a metal wire linear body.

[0073] The metal wire linear body may be a linear body made of a single metal wire, or may be a linear body made of a plurality of twisted metal wires.

[0074] Examples of metal wires include wires containing metals such as copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, and gold, or alloys containing two or more metals (e.g., steels such as stainless steel and carbon steel, brass, phosphor bronze, zirconium-copper alloys, beryllium-copper alloys, iron-nickel alloys, nichrome, nickel-titanium alloys, iron-chromium-aluminum alloys, nickel-molybdenum-chromium alloys, and rhenium-tungsten alloys). The metal wires may be plated with tin, zinc, silver, nickel, chromium, nickel-chromium alloys, or solder, or may be surface-coated with a carbon material or polymer described below.

[0075] In particular, from the viewpoint of obtaining a conductive linear body 120 with a low volume resistivity, it is preferable that the conductive linear body 120 be a wire containing at least one metal selected from tungsten, molybdenum, and alloys containing these metals.

[0076] The metal wire may be a metal wire coated with a carbon material. When the metal wire is coated with a carbon material, the metallic luster is reduced, and the presence of the metal wire can be easily made less noticeable. In addition, when the metal wire is coated with a carbon material, metal corrosion is also suppressed.

[0077] Examples of the carbon material that coats the metal wire include amorphous carbon (for example, carbon black, activated carbon, hard carbon, soft carbon, mesoporous carbon, and carbon fiber), graphite, fullerene, graphene, and carbon nanotubes.

[0078] A linear body containing carbon nanotubes can be obtained, for example, by drawing carbon nanotubes into a sheet from the end of a carbon nanotube forest (a growth body in which multiple carbon nanotubes are grown on a substrate so that they are oriented perpendicular to the substrate, and is sometimes called an "array"), bundling the drawn carbon nanotube sheets, and then twisting the bundle of carbon nanotubes.

[0079] In the above-mentioned manufacturing method, when no twist is applied during twisting, a ribbon-shaped carbon nanotube linear body is obtained, whereas when twist is applied, a thread-shaped linear body is obtained. A ribbon-shaped carbon nanotube linear body is a linear body in which the carbon nanotubes do not have a twisted structure.

[0080] Alternatively, the linear carbon nanotube body can be obtained by spinning a dispersion of the carbon nanotubes, etc. The linear carbon nanotube body can be produced by spinning using a known method.

[0081] From the viewpoint of making the diameter of the carbon nanotube linear body more uniform, it is preferable to use a thread-like carbon nanotube linear body, and from the viewpoint of increasing the purity of the carbon nanotube linear body, it is preferable to obtain the thread-like carbon nanotube linear body by twisting a carbon nanotube sheet.

[0082] The carbon nanotube linear body may be a linear body in which two or more carbon nanotube linear bodies are woven together, or may be a linear body in which a carbon nanotube is composited with another conductive material (sometimes called a "composite linear body").

[0083] Examples of composite linear bodies include (i) composite linear bodies in which a metal element or metal alloy is supported on the surface of a carbon nanotube forest, sheet or bundle, or twisted linear body by vapor deposition, ion plating, sputtering, wet plating, etc., in the process of obtaining a carbon nanotube linear body by drawing out carbon nanotubes from the end of a carbon nanotube forest in a sheet form, bundling the drawn carbon nanotube sheet, and then twisting the bundles of carbon nanotubes; (ii) composite linear bodies in which bundles of carbon nanotubes are twisted together with linear bodies of a metal element or a metal alloy, or composite linear bodies; and (iii) composite linear bodies in which linear bodies of a metal element or a metal alloy, or composite linear bodies, are braided with linear bodies of a carbon nanotube or composite linear bodies.

[0084] In the composite linear body of (ii), when the bundles of carbon nanotubes are twisted, a metal may be supported on the carbon nanotubes in the same manner as in the composite linear body of (i).

[0085] In addition, the composite linear body of (iii) is a composite linear body in which two linear bodies are woven together, but as long as it contains at least one linear body of a simple metal or a linear body of a metal alloy, or a composite linear body, it may be a composite linear body in which three or more carbon nanotube linear bodies, or linear bodies of a simple metal or a linear body of a metal alloy, or a composite linear body are woven together.

[0086] Examples of metals for the composite linear body include elemental metals such as gold, silver, copper, iron, aluminum, nickel, chromium, tin, and zinc, as well as alloys containing at least one of these elemental metals (such as copper-nickel-phosphorus alloys and copper-iron-phosphorus-zinc alloys).

[0087] The conductive linear body 120 may be a linear body having a conductive coating applied to the thread. Examples of the thread include threads spun from resins such as nylon and polyester. Examples of the conductive coating include coatings of metals, conductive polymers, and carbon materials. The conductive coating can be formed by plating or deposition. A linear body having a conductive coating applied to the thread can improve the conductivity of the linear body while maintaining the flexibility of the thread. In other words, it becomes easier to reduce the resistance of the conductive structure 100.

[0088] As the material of the conductive linear body 120, various materials mentioned above can be used depending on the application, etc., but in the manufacturing method according to the present embodiment, it is preferable that the conductive linear body 120 contains at least one selected from the group consisting of copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, gold, and alloys containing two or more metals. Examples of the alloy include stainless steel, carbon steel, brass, phosphor bronze, zirconium-copper alloy, beryllium-copper alloy, iron-nickel alloy, nickel-chromium alloy, nickel-titanium alloy, iron-chromium-aluminum alloy, nickel-chromium-molybdenum alloy, and rhenium-tungsten alloy. By using such a material, heat can be efficiently generated when electricity is applied.

[0089] <Method of manufacturing conductive structure>

[0090] Conventionally, attempts have been made to manufacture the above-mentioned conductive structure by, for example, the following manufacturing method.

[0091] Fig. 7 is a schematic diagram showing an example of a conventional manufacturing method, and Fig. 8 is a cross-sectional view showing an example of the vicinity of a nozzle in the conventional manufacturing method.

[0092] While transporting laminate 110 having substrate 111 and adhesive layer 112 over upstream guide roller 11, pressure roller 10, downstream guide roller 12, etc. (see arrow F1), conductive material 130a that will become conductive linear body 130 is ejected from nozzle 40 toward the surface of adhesive layer 112, thereby forming conductive linear body 130 on the surface of adhesive layer 112. As shown in Fig. 8, nozzle 40 has ejection hole 42 for ejecting conductive material 130a that will become conductive linear body 130.

[0093] When the conductive material 130a is ejected from the nozzle 40 toward the adhesive layer 112, if the nozzle 40 is not in contact with the adhesive layer 112, the conductive material 130a will not be ejected from the nozzle tip 41, causing clogging, or the conductive material will not be ejected accurately toward the ejection target on the adhesive layer 112. Therefore, when the conductive material 130a is ejected from the nozzle 40, the nozzle tip 41 is in contact with the surface of the laminate 110 (see FIG. 8).

[0094] However, a detailed investigation of the behavior near the nozzle 40 in the conventional manufacturing method revealed that, since the tip 41 of the nozzle 40 is in contact with the adhesive layer 112 via the conductive linear body 130, the movement speed of the nozzle 40 when the nozzle 40 is caused to reciprocate or slide back and forth is often limited by the relationship with the conveying speed of the laminate 110. As a result, the conventional manufacturing method has a problem in that it is not possible to form a fine shape, and there are restrictions on the pattern accuracy of the conductive linear body 130.

[0095] For example, when the conductive structure is used in various conductive members, heaters, etc., the wiring pattern needs to be further fined in response to demands for miniaturization of products and parts. For example, attempts will be made to not only reduce the diameter D of one conductive linear body 130, but also to reduce the arrangement interval P when arranging multiple conductive linear bodies 130. In this case, conventional manufacturing methods have not been able to fully meet the demand for such fine and small-pitch wiring.

[0096] However, according to the manufacturing method of this embodiment, the above-mentioned problems do not occur, and the conductive structure 100 can be manufactured with high pattern precision even when the conductive linear body 130 has a fine shape.

[0097] FIG. 3 is a schematic diagram showing an example of a manufacturing method in this embodiment, FIG. 4 is a partial top view showing an example of a manufacturing method in this embodiment, and FIG. 5 is a cross-sectional view showing an example of the vicinity of the nozzle in the manufacturing method in this embodiment.

[0098] The method for producing a conductive structure 100 according to this embodiment includes a base material 111, an adhesive layer 112 laminated on the surface of the base material 111, and a conductive linear body 120 disposed on the surface of the adhesive layer 112, and includes the steps of: (1) preparing a laminate 110 including a substrate 111 and an adhesive layer 112; (2) forming the conductive linear body 120 on the surface of the adhesive layer 112 by ejecting the conductive material 120a to be the conductive linear body 120 from the nozzle 20 onto the surface of the adhesive layer 112 of the laminate 110 while conveying the laminate 110; Including, The nozzle 20 includes an injection hole 22 for injecting the conductive material 120a, and an air injection hole 23 arranged in the vicinity of the injection hole 22 for ejecting air. The nozzle 20 is disposed at a predetermined distance L from the laminate 110 being transported. In the (2) step, the conductive material 120a is injected from the injection hole 22 toward the laminate 110 being transported, and air is blown from the air outlet hole 23, thereby forming the conductive linear body 120 on the surface of the adhesive layer 112. A method for manufacturing a conductive structure 100.

[0099] (1) The process of preparing the laminate 110 will be described.

[0100] For example, the adhesive layer 112 can be formed by applying an adhesive layer-forming composition to the surface of the substrate 111. After applying the adhesive layer-forming composition, a step of drying the coating may be performed as necessary. In addition, a commercially available product may be used as the sheet having the adhesive layer 112 formed on the surface of the substrate 111.

[0101] The adhesive layer-forming composition may be a solution containing the above-mentioned components that can be used as the adhesive layer 112 and a solvent. Examples of the solvent that can be used here include alcohol-based solvents, ketone-based solvents, ester-based solvents, ether-based solvents, glycol-based solvents, glycol ester-based solvents, hydrocarbon-based solvents, halogenated alkyl solvents, and water.

[0102] Examples of alcohol-based solvents include ethanol, butanol, isobutanol, isopropyl alcohol, n-propyl alcohol, t-butanol, 1,3-butanediol, and 1,4-butanediol.

[0103] Examples of the ketone solvent include acetone, methyl ethyl ketone, methyl propyl ketone, methyl isobutyl ketone, diisobutyl ketone, and cyclohexanone.

[0104] Examples of the ester solvent include ethyl acetate, methyl acetate, butyl acetate, n-propyl acetate, and methoxybutyl acetate.

[0105] Examples of ether solvents include diisopropyl ether, methyl cellosolve, ethyl cellosolve, butyl cellosolve, and 1,4-dioxane.

[0106] Examples of glycol solvents include ethylene glycol, diethylene glycol, triethylene glycol, and propylene glycol.

[0107] Examples of glycol ester solvents include ethylene glycol monoethyl ether acetate and propylene glycol monomethyl ether acetate.

[0108] Examples of the hydrocarbon solvent include benzene, toluene, xylene, n-hexane, isohexane, and cyclohexane.

[0109] Examples of halogenated alkyl solvents include methylene chloride, trichloroethylene, perchloroethylene, and chloroform.

[0110] These solvents may be used alone or in combination of two or more.

[0111] When drying is performed, the drying conditions are preferably 60° C. to 200° C. and 5 seconds to 120 seconds. The drying temperature is more preferably 80° C. to 150° C., and even more preferably 90° C. to 130° C. The drying time is more preferably 10 seconds to 100 seconds, and even more preferably 20 seconds to 80 seconds. The drying method is not particularly limited, and for example, a heating device such as a heater or a dryer can be used.

[0112] The laminate 110 prepared by such a method can be transported using a transport device equipped with rollers or the like while carrying out step (2), thereby forming conductive linear bodies 120 on the surface of the adhesive layer 112.

[0113] In this embodiment, as shown in Figures 3 and 4, an example is shown in which a pressure roller 10 is used, but a configuration in which a wiring portion 30 is placed on a pressure plate and a conductive material 120a is ejected from a nozzle 20 onto the laminate 110 being transported on the plate may also be used.

[0114] The roller diameter (diameter) of guide rollers 11, 12 is not particularly limited, but is preferably 4 cm or more and 15 cm or less, more preferably 5 cm or more and 12 cm or less, and further preferably 8 cm or more and 10 cm or less.

[0115] The roller diameter of the pressure roller 10 is not particularly limited, but is preferably 10 cm or more and 100 cm or less, more preferably 15 cm or more and 80 cm or less, and even more preferably 20 cm or more and 50 cm or less.

[0116] The conveying speed is not particularly limited, but is preferably 0.5 m / min to 10 m / min, more preferably 1 m / min to 8 m / min, and even more preferably 2 m / min to 5 m / min. According to this embodiment, even at such a relatively high conveying speed, the conductive linear body 120 can be formed on the surface of the adhesive layer 112 with high pattern accuracy even if the conductive linear body 120 has a fine shape.

[0117] The tension during transport (transport tension) is preferably 10 N / m to 300 N / m, more preferably 20 N / m to 200 N / m, and even more preferably 30 N / m to 150 N / m.

[0118] Next, (2) the step of forming conductive linear body 120 on the surface of adhesive layer 112 will be described.

[0119] In step (2), a nozzle 20 is used, which includes an injection hole 22 for injecting conductive material 120a and an air injection hole 23 arranged in the vicinity of the injection hole 22 for ejecting air. Then, with a tip 21 of the nozzle 20 spaced a predetermined distance L from the surface of the laminate 110, that is, with the tip 21 of the nozzle 20 not in contact with the surface of the laminate 110, conductive material 120a is injected from the injection hole 22 to form conductive linear body 120 on the surface of the adhesive layer 112.

[0120] 5, nozzle 20 is formed with injection hole 22 for delivering conductive material 120a, from which conductive material 120a is delivered toward the surface of adhesive layer 112 (see arrow F3). Nozzle 20 is also provided with air ejection hole 23 in the vicinity of injection hole 22, from which air is ejected (see arrow F3). As a result, even when conductive material 120a is ejected without contacting the surface of laminate 110, the ejection force can firmly adhere to adhesive layer 112, so that even conductive linear body 120 with a fine shape can be firmly adhered to adhesive layer 112.

[0121] The air ejection hole 23 may be located in the vicinity of the ejection hole 22, but when the nozzle 20 is viewed from the bottom, it is preferable to provide it within a range of 100 μm to 2 mm from the ejection hole 22, more preferably within a range of 200 μm to 1 mm, and even more preferably within a range of 300 μm to 600 μm.

[0122] Furthermore, the shape of the air ejection holes 23 is not particularly limited, but it is preferable that one air ejection hole 23 is disposed upstream (in front of) the injection hole 22 in the line direction, and one air ejection hole 23 is disposed downstream of the injection hole 22 (see FIG. 5). By disposing the air ejection holes 23 independently on the upstream and downstream sides in this way, the respective ejection pressures can be controlled independently, and the pattern accuracy can be further improved. Of course, the air ejection holes 23 may be disposed in a substantially circular shape so as to surround the outer periphery of the injection hole 22 when the nozzle 20 is viewed from the bottom.

[0123] The diameter of the injection hole 22 is preferably a dimension value corresponding to the diameter D of the conductive linear body 120, and is, for example, preferably 5 μm or more and 3 mm or less, more preferably 8 μm or more and 200 μm or less, and even more preferably 12 μm or more and 100 μm or less.

[0124] Furthermore, in this embodiment, the nozzle 20 is separated from the surface of the laminate 110 by a predetermined distance L to eject the conductive material 120a. This relaxes restrictions on the movement of the nozzle 20, and even conductive linear bodies 120 with finer and more precise patterns can be accurately shaped. For example, when forming a corrugated conductive linear body 120, the waveform, amplitude, and wavelength can be set more finely than in conventional manufacturing methods.

[0125] From this viewpoint, the distance L between the nozzle 20 and the surface of the laminate 110 is preferably 0.01 mm or more and 20 mm or less, more preferably 0.02 mm or more and 10 mm or less, and even more preferably 0.05 mm or more and 5 mm or less. From the viewpoint of ensuring a non-contact state, the distance L is preferably larger than the diameter D of the conductive filament 120. By disposing the nozzle 20 at the above-mentioned distance from the surface of the laminate 110 being conveyed, even a conductive filament 120 having a finer and finer pattern accuracy can be accurately shaped. For example, when a corrugated conductive filament 120 is formed, the waveform, amplitude, and wavelength can be set more finely than in the conventional manufacturing method.

[0126] The tip diameter of the nozzle 20 is preferably 1.5 to 10 times the diameter D of the conductive linear body in a cross-sectional view, more preferably 1.2 to 10 times, even more preferably 1.3 to 8 times, and even more preferably 1.4 to 6 times. The tip diameter of the nozzle 20 here refers to the maximum outer diameter of the tip of the nozzle 20.

[0127] The tip diameter of the nozzle 20 is not particularly limited, but it is preferably a dimensional value corresponding to the diameter D of the conductive linear body 120, and is, for example, preferably 5 μm or more and 3 mm or less, more preferably 8 μm or more and 200 μm or less, and even more preferably 12 μm or more and 100 μm or less.

[0128] By controlling the lower limit of the tip diameter of the nozzle 20 within the above-mentioned range with respect to the diameter D of the conductive linear body 120 in a cross-sectional view, a sufficient amount of air can be ejected from the air ejection hole 23, so that even with a conductive linear body 120 having a smaller diameter, the conductive material 120a can be ejected accurately from the ejection hole 22 and a sufficient ejection force can be exerted to firmly adhere to the adhesive layer 112. In addition, by controlling the upper limit of the tip diameter of the nozzle 20 within the above-mentioned range with respect to the diameter D of the conductive linear body 120 in a cross-sectional view, turbulence of the air ejected from the air ejection hole 23 can be effectively suppressed, so that the conductive linear body 120 ejected onto the adhesive layer 112 can be shaped with high precision without being deformed.

[0129] The discharge pressure of the air discharged from the air discharge hole 23 is preferably 0.1 MPa or more and 10 MPa or less, more preferably 0.1 MPa or more and 6 MPa or less, even more preferably 0.1 MPa or more and 5 MPa or less, even more preferably 0.2 MPa or more and 1.5 MPa or less, and even more preferably 0.3 MPa or more and 1 MPa or less. By setting the air discharge pressure in such a range, the amount of air discharged from the air discharge hole 23 can be sufficiently secured, so that even if the conductive linear body 120 has a smaller diameter, the conductive material 120a can be accurately discharged from the discharge hole 22, and a sufficient discharge force can be exerted to the extent that the conductive material 120a can be firmly attached to the adhesive layer 112. Furthermore, even if the nozzle 20 discharges the conductive material 120a in a state where the nozzle 20 is not in contact with the adhesive layer 112, the conductive material 120a can be smoothly and continuously fed onto the adhesive layer 112 without causing clogging or dripping. As a result, even when the conductive linear body 120 is transported at high speed, the yield is good and even finer and more precise patterns can be accurately shaped.

[0130] In addition, by appropriately selecting the rotation speed of the pressure roller 10, the conveying speed of the conductive linear body 120, and the moving speed and moving distance of the wiring portion 30, it is possible to form a conductive linear body 120 having the desired waveform, amplitude, and wavelength on the surface of the adhesive layer 112.

[0131] Therefore, in step (2), it is preferable to form a corrugated conductive linear body 120 on the surface of the adhesive layer 112 by ejecting the conductive material 120a from the ejection hole 22 toward the surface of the adhesive layer 112 of the laminate 110 while moving the nozzle 20 along the width direction X of the laminate 110 (see FIGS. 3 and 4). The nozzle 20 is reciprocated or slid in the width direction X of the laminate 110, so that the corrugated conductive linear body 120 can be formed on the surface of the adhesive layer 112. According to the present embodiment, even if the conductive linear body has such a complicated shape, it is possible to form the conductive linear body with high pattern accuracy even if the shape is fine, and this is preferable.

[0132] In step (2), for example, the laminate 110 is placed on the outer peripheral surface of the pressure roller 10 with the base material 111 facing inward and the adhesive layer 112 facing outward, and while rotating the pressure roller 10, the conductive material 120a is fed onto the adhesive layer 112 to form the conductive linear body 120. At this time, the wiring part 30 is moved so as to repeat small reciprocating motions in a direction (see width direction X) intersecting the longitudinal direction Y of the laminate 110 (the wave traveling direction, the transport direction in transport) and to make a large reciprocating motion overall, so as to form a desired shape. This allows the conductive linear body 120 to have a complex wave shape.

[0133] In this case, the period of the reciprocating or sliding motion may be irregular or shortened. By performing such a reciprocating or sliding motion, the shape of the conductive linear body 120 becomes more complicated, but even in such a case, according to the present embodiment, high pattern accuracy can be maintained.

[0134] When the conductive linear body 120 has a wavy shape, the wiring unit 30 having the nozzle 20 preferably ejects the conductive linear body 120 while reciprocating or sliding the nozzle 20 back and forth from side to side in accordance with the wavy shape of the conductive linear body 120 to be formed. At that time, it is preferable to move the nozzle amplitude and transport speed so as to correspond to the amplitude and wavelength of the wavy shape, respectively.

[0135] A suitable shape of the conductive linear body 120 thus formed can be, for example, a sine wave or a shape similar thereto. A more suitable shape can be a complex wave shape having a smaller wave shape within a larger sine wave, as exemplified in Fig. 1. Thus, according to this embodiment, high pattern accuracy can be maintained even for a fine wave shape.

[0136] Then, although not shown in the figure, after the above-mentioned steps (1) and (2), the conductive structure 100 can be cut to a predetermined length by a cutting device arranged downstream, thereby obtaining a conductive structure 100 having the desired length in the longitudinal direction Y.

[0137] As described above, according to the manufacturing method of this embodiment, the conductive structure 100 having the conductive linear body 120 can be formed with high manufacturing efficiency and high pattern accuracy, even for fine shapes.

[0138] From this viewpoint, a preferred specific example of the conductive structure 100 is at least one selected from the group consisting of a conductive member, a heater, and a sensor. For example, the conductive structure 100 is preferably used as a heater since it has the conductive linear body 120 with low surface resistance. When used as a heater, the conductive linear body 120 can be used as a heating element.

[0139] The case where the above-mentioned conductive structure 100 is used as a heater 200 will be exemplified below.

[0140] FIG. 6 is a perspective view showing an example of a heater using the conductive structure according to this embodiment.

[0141] The heater 200 is obtained by attaching electrodes 210 to both opposing ends of the conductive structure 100 described above. Therefore, the following description will focus on the electrodes 210. The dimensions and shape of the heater 200 are not particularly limited, but it can be suitably used as, for example, a sheet-like heater.

[0142] The electrode 210 is used to supply a current to the conductive linear body 120. The electrode 210 can be formed using a known electrode material. Examples of the electrode material include a conductive paste (such as silver paste), a metal foil (such as copper foil), and a metal wire. The electrode 210 is disposed so as to be electrically connected to both ends of the conductive linear body 120.

[0143] Examples of the metal of the metal foil or metal wire include copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, gold, and the like, or alloys containing two or more metals (for example, steels such as stainless steel and carbon steel, brass, phosphor bronze, zirconium copper alloys, beryllium copper, iron nickel, nichrome, nickel titanium, Kanthal, Hastelloy, and rhenium tungsten, and the like). The metal foil or metal wire may be plated with tin, zinc, silver, nickel, chromium, nickel chromium alloys, solder, and the like.

[0144] The ratio of the resistance values ​​of the electrode 210 and the conductive linear body 120 (resistance value of the electrode 210 / resistance value of the conductive linear body 120) is preferably 0.0001 or more and 0.3 or less, and more preferably 0.0005 or more and 0.1 or less. This resistance value ratio can be calculated by "resistance value of the electrode 210 / resistance value of the conductive linear body 120". By setting the resistance value ratio within such a range, abnormal heating of the electrode portion can be effectively suppressed when used as a heating body. For example, it is possible to make the heater 200 have good heating efficiency by causing only the conductive linear body 120 to generate heat.

[0145] The resistance value of the electrode 210 and the resistance value of the conductive linear body 120 can each be measured using a tester. First, the resistance value of the electrode 210 is measured, and then the resistance value of the conductive structure 100 to which the electrode 210 is attached is measured. Thereafter, the resistance values ​​of the electrode 210 and the conductive structure 100 can be calculated by subtracting the measured value of the electrode 210 from the resistance value of the conductive structure 100 to which the electrode 210 is attached.

[0146] The thickness of the electrode 210 can be appropriately set in consideration of the dimensions and shape of the conductive structure 100, and is preferably, for example, 2 μm to 200 μm, more preferably 2 μm to 120 μm, and even more preferably 10 μm to 100 μm. By setting the thickness of the electrode 210 within such a range, the electrical conductivity can be made higher and the resistance can be made lower. In addition, sufficient strength as an electrode can be imparted. EXAMPLES

[0147] The present invention will be described in more detail with reference to the following examples and comparative examples, but the present invention is not limited to the following examples in any way.

[0148] <Example 1>

[0149] First, an acrylic adhesive (manufactured by Lintec Corporation, product name "PK") was applied to a thickness of 20 μm on a polyurethane film having a thickness of 100 μm and a width (length) of 1000 m as the substrate 111 to form an adhesive layer 112 (elastic modulus 0.1 MPa), and an adhesive sheet was produced as the laminate 110. Next, a wire injection device (manufactured by Lintec Corporation) having the configuration shown in Figures 3 and 4 was prepared. The wiring unit 30 had eight nozzles 20 (tip diameter of nozzle 20 = 0.4 mm, diameter of injection hole 22 = 0.1 mm) shown in Figure 5. The laminate 110 was set on the wire injection device, and while conveying it at a conveying speed of 3 m / min, the wiring part 30 was moved along the width direction of the laminate 110 (see arrow F2) with a tension during conveying (conveying tension) of 100 N / m, while metal wires (material: tungsten) were injected, and eight metal wires were arranged as the conductive linear bodies 120 at equal intervals with an arrangement interval P (see FIG. 2) of 1 mm. At this time, the distance L from the tip 21 of the nozzle 20 to the laminate 110 was set to 0.5 mm. The discharge pressure of the air ejected from the air ejection hole 23 was 0.5 MPa.

[0150] Then, all the nozzles 20 were moved in a direction perpendicular to the conveying direction of the laminate 110, thereby obtaining a sheet-shaped conductive member as the conductive structure 100. The metal wire, which was the conductive linear body 120, had a circular cross-sectional shape and a diameter D of 80 μm. In other words, the tip diameter of the nozzle 20 was five times the diameter D (diameter D=80 μm, tip diameter of nozzle 20=0.4 mm).

[0151] The shape of the target pattern to be formed on the surface of the laminate 110 was set to have an amplitude of 10 mm and a wavelength of 20 mm. In contrast, when the pattern shape of the actually obtained conductive linear body 120 was actually measured using a digital microscope, the amplitude was 9.5 mm and the wavelength was 19.9 mm. From the above, the pattern accuracy of Example 1 was 95% (actual amplitude measurement value / set amplitude value) and 99.5% (actual wavelength measurement value / set wavelength value) for the amplitude.

[0152] From the above, according to this embodiment, it was at least confirmed that a conductive structure having a conductive linear body can be formed with high pattern accuracy even for a fine shape while having high manufacturing efficiency. [Explanation of symbols]

[0153] 10: Pressure roller 11,12: Guide roller 20: Nozzle 21: Tip 22: Injection hole 23: Air outlet 30: Wiring section 40: Nozzle 41: Tip 42: Injection hole 100: Conductive structure 110: Laminate 111: Base material 112: Adhesive layer 120: Conductive wire 120a: Conductive material 130: Conductive wire 130a: Conductive material 200:Heater 210: Electrode X: width direction, Y: Longitudinal direction L: distance D: Diameter P: Placement interval F1, F2, F3: Arrows

Claims

1. A method for producing a conductive structure comprising a substrate, an adhesive layer laminated on a surface of the substrate, and a conductive linear body disposed on the surface of the adhesive layer, the method comprising the steps of: (1) preparing a laminate including the substrate and the adhesive layer; (2) forming the conductive linear body on the surface of the adhesive layer by ejecting a conductive material that will become the conductive linear body from a nozzle onto the surface of the adhesive layer of the laminate while conveying the laminate; and Including, the conductive material is at least one selected from the group consisting of a linear body including a metal wire, a linear body including a carbon nanotube, and a linear body in which a conductive coating is applied to a thread; the nozzle includes an injection hole for injecting the conductive material, and an air ejection hole disposed in the vicinity of the injection hole for ejecting air; the air ejection hole is disposed at one location upstream of the ejection hole and at the other location downstream of the ejection hole in a conveying direction, or the air ejection hole is disposed so as to surround an outer periphery of the ejection hole when the nozzle is viewed from the bottom, the nozzle is disposed at a predetermined distance from the laminate being transported, In the step (2), the conductive material is injected from the injection hole toward the laminate being transported, and air is blown from the air ejection hole, thereby forming the conductive linear body on the surface of the adhesive layer. A method for manufacturing a conductive structure.

2. The step (2) is a step of forming the wavy conductive linear body on the surface of the adhesive layer by injecting the conductive material from the injection hole toward the surface of the adhesive layer of the laminate while moving the nozzle along the width direction of the laminate. A method for producing the conductive structure according to claim 1 .

3. The adhesive layer contains at least one selected from the group consisting of an acrylic resin, a urethane resin, a rubber resin, a silicone resin, an epoxy resin, a polycarbonate resin, and an ester resin. A method for producing the conductive structure according to claim 1 or 2.

4. The elastic modulus of the adhesive layer is 0.001 MPa or more and 10 MPa or less. A method for producing the conductive structure according to any one of claims 1 to 3.

5. The conductive linear body includes at least one selected from the group consisting of copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, gold, and an alloy including two or more metals. A method for producing the conductive structure according to any one of claims 1 to 4.

6. The nozzle is disposed at a distance of 0.01 mm or more and 20 mm or less from the surface of the laminate being transported. A method for producing the conductive structure according to any one of claims 1 to 5.

7. a tip diameter of the nozzle is 1.5 to 10 times the diameter of the conductive linear body in a cross-sectional view; A method for producing the conductive structure according to any one of claims 1 to 6.

8. The discharge pressure of the air ejected from the air ejection hole is 0.1 MPa or more and 10 MPa or less. A method for producing the conductive structure according to any one of claims 1 to 7.

9. The conductive structure is at least one selected from the group consisting of a conductive member, a heater, and a sensor. A method for producing the conductive structure according to any one of claims 1 to 8.

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