Highly efficient die dicing and release

Abstract

A method for dicing and / or releasing a die from a wafer is provided. [Solution] A batch method for large-scale parallel die release of die from a substrate enables low-cost mass production of passives, system-in-package (SiP) or system-in-a-package, or system-on-chip (SoC), filters and / or other devices from a glass substrate.

Description

[Technical field]

[0001] The present invention relates to a method for dicing and / or releasing a die from a wafer. [Background technology]

[0002] Without limiting the scope of the invention, its background is described in relation to methods for dicing and / or releasing die from a wafer.

[0003] Die size in VLSI technology has allowed for larger die sizes with increased complexity, resulting in more powerful CPUs and denser memory devices. Larger dies and larger market demands have resulted in larger area wafers that increase performance while reducing the cost per die. Removing or dicing a die from a wafer is considered an incremental cost to the overall cost of the final product. However, there have been advances in the integration of passive devices using thin and thick film processes with a combination of additive and subtractive processes. This has the capability to create thousands to tens of thousands of passive devices and filters as well as device combinations on a single substrate. Classical dicing using sequential processes such as laser scribing, sawing or waterjet tools takes too long (up to tens of hours) and dramatically impacts the cost of manufacturing passive or other fine feature devices.

[0004] What is needed is a better and faster method for removing or dicing the die from the wafer. Summary of the Invention [Means for solving the problem]

[0005] The inventors have demonstrated parallel and batch processes for removing die from a substrate that increase the number of die per substrate while dramatically reducing costs and improving yields.

[0006] In one embodiment, the present invention includes a method of making a die release or scribe pattern for one or more dies from a substrate in a parallel batch process, comprising, consisting of, or consisting essentially of the steps of exposing at least a portion of a photosensitive glass substrate with a die release or scribe pattern using an activating UV energy source, heating the photosensitive glass substrate to a heating phase above its glass transition temperature for at least 10 minutes, cooling the photosensitive glass substrate to convert at least a portion of the exposed photosensitive glass substrate to a crystalline material to form a glass-ceramic crystalline substrate, coating the exposed area with a UV light blocking layer, fabricating and completing passive components, filters, or other devices on the front side of the substrate, and etching away the ceramic phase of the die release or scribe pattern in the photosensitive glass substrate with an etchant solution to release the die from the substrate. In one aspect, the die release scribe pattern is a rectangle, circle, ellipse, fractal, or other shape that outlines the shape of the passive components, filters, or other devices. In another embodiment, the die release scribe pattern is etched through to the adhesive backing. In another embodiment, the die release scribe pattern is larger than 5 μm and 250 μm wide structures. In another embodiment, the die release scribe pattern has a greater number of dies per substrate than the number of dies of an equivalent mechanically cut substrate. In another embodiment, the edges of the released dies have a surface roughness of less than 5 μm. In another embodiment, the edges of the released dies have a surface roughness of less than 1 μm. In another embodiment, the edges of the released dies have a non-perpendicular angle from the surface of the die. In another embodiment, the edges of the released dies have a non-perpendicular angle from the surface of the die. The edges have a non-normal angle from the surface of the die that is at least 1° and less than 30° from the normal to the surface of the die. In another embodiment, the top or bottom corners of the released die have a non-normal curvature from the surface of the die that is at least 1° and less than 30° from the surface of the die. In another embodiment, the width of the one or more scribe lines is 10, 20, 30, 40, 50, 60, 70, 75, 80, or 90 μm wide, or any range therebetween.

[0007] In one embodiment, the invention comprises a method of making a die release or scribe pattern for one or more dies from a substrate in a parallel batch process, comprising, consisting of, or consisting essentially of the steps of masking a photosensitive glass substrate with the die release or scribe pattern; exposing at least a portion of the photosensitive glass substrate with an activating UV energy source as a die release; heating the photosensitive glass substrate above its glass transition temperature for at least 10 minutes to a heating phase; cooling the photosensitive glass substrate to convert at least a portion of the exposed photosensitive glass substrate to form a glass-ceramic crystalline portion of the photosensitive glass substrate; coating the exposed areas with a UV light blocking layer; fabricating and completing passive components, filters, or other devices; placing a weakly adhesive backing on the backside of the substrate; etching away the glass-ceramic portion of the die release or scribe pattern in the photosensitive glass substrate with an etchant solution that releases the die; and removing the one or more dies from the weakly adhesive backing. In one embodiment, the die release or scribe pattern is a rectangle, circle, ellipse, fractal, or other shape that outlines the shape of a passive component, filter, or other device. In another embodiment, the die release scribe pattern is a can etch into the adhesive backing. In another embodiment, the die release scribe pattern can be larger than 5 μm and 250 μm wide structures. In another embodiment, the die release scribe pattern allows for a large number of dies per substrate. In another embodiment, the edge of the released die has a surface roughness of less than 5 μm. In another embodiment, the edge of the released die has a surface roughness of less than 1 μm. In another embodiment, the edge of the released die has a non-perpendicular angle from the surface of the die. In another embodiment, the edge of the released die has a non-perpendicular angle from the surface that is at least 1° from the normal to the surface of the die and less than 30°.In another embodiment, the top or bottom corners of the released die have a non-perpendicular curvature from the surface of the die that is at least 1° and less than 30° from the surface. In another embodiment, the width of the one or more scribe lines is 10, 20, 30, 40, 50, 60, 70, 75, 80, or 90 μm wide, or any range therebetween. [Brief description of the drawings]

[0008] For a more complete understanding of the features and advantages of the present invention, reference should now be made to the detailed description of the invention taken in conjunction with the accompanying drawings. [Figure 1] FIG. 2 is a side view of a sawed trench sidewall. [Diagram 2] FIG. 2 is a side view of the sidewalls of an etched trench. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Although the making and using of various embodiments of the invention are discussed in detail below, it should be understood that the invention provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed herein are merely illustrative of specific ways to make and use the invention and do not limit the scope of the invention.

[0010] To facilitate the understanding of this invention, several terms are defined below. The terms used herein have the meanings as commonly understood by one of ordinary skill in the areas relevant to the invention. Terms such as "a," "an," and "the" are not intended to refer to a singular entity only, but include general categories for which specific examples can be used to illustrate. Although the terms used herein are used to describe specific embodiments of the invention, their usage is not intended to limit the invention, except as outlined in the claims.

[0011] Thin and thick film additive and subtractive processes can be used to process most semiconductor and MEMS substrates. Subtractive processes remove material that has been added to or from the substrate using etching, milling, ion beam milling, lift-off or other processes. Depending on the substrate, subtractive processes can be either fast or slow. Sapphire substrates are very difficult (slow) to etch, ion beam mill or mill due to the hardness and inert nature of sapphire. Silicon substrates can be etched using chemical or plasma etching or ion beam milling. One of the more easily processed substrates is the photodefinable glass substrate.

[0012] Photosensitive glass materials can be processed in a simple three-step process with first generation semiconductor equipment, and the final material can be formed into either glass, ceramic, or contain regions of both glass and ceramic. Photosensitive glasses offer several advantages for the manufacture of a wide variety of microsystem components, systems-on-chips, and systems-in-packages. Microstructures and electronic components can be manufactured relatively inexpensively in these types of glasses using conventional semiconductor and printed circuit board (PCB) processing equipment. Glass has been made into glass for many years. In general, glass has high temperature stability, good mechanical and electrical properties, and better chemical resistance than plastics and many types of metals. When exposed to UV light within the absorption band of cerium oxide, cerium oxide acts as a sensitizer by absorbing a photon and losing an electron. This reaction reduces adjacent silver oxide to form silver atoms. For example, Ce 3+ +Ag + =Ce 4+ +Ag 0

[0013] The silver ions coalesce into silver nanoclusters during the heat treatment process, inducing nucleation sites for the formation of a crystalline ceramic phase in the surrounding glass. This heat treatment must be carried out at a temperature close to the glass transition temperature. The ceramic crystalline phase is more easily absorbed by an etcher such as hydrofluoric acid (HF) than by the unexposed glassy, ​​amorphous glassy regions. In particular, the crystalline (ceramic) regions of FOTURAN® etch about 20 times faster than the amorphous regions in 10% HF, allowing for microstructures with wall slope ratios of about 20:1 when the exposed regions are removed. See TR Dietrich et al., "Fabrication technologies for microsystems utilizing photoetchable glass," Microelectronic Engineering 30, 497 (1996), which is incorporated herein by reference. Other compositions of photosensitive glass will etch at different rates.

[0014] One method of manufacturing a passive device or combination of passive devices to form a filter or other electronic or RF component can take a photosensitive glass substrate made of silica, lithium oxide, aluminum oxide, and cerium oxide, and involves using a mask and UV light to create a pattern in the photosensitive glass substrate that has at least one two-dimensional or three-dimensional ceramic phase region.

[0015] Preferably, the shaped glass structures include at least one or more two or three dimensional inductive devices. Capacitive devices are formed by creating a series of connected structures to form a high surface area capacitor for power requirements. These structures can be either rectangular, circular, elliptical, fractal, or other shapes that create a pattern that creates capacitance. The patterned areas of the APEX™ glass can be filled with metals, alloys, composites, glass or other magnetic media by several methods including plating or vapor deposition. Once the passive devices are produced, the supporting APEX™ glass can be left in place or removed to create an array of passive devices that can be removed in series or parallel. Traditional series processes use lasers, sawing water jets and other processes to cut the substrate and release the die containing the passive devices. The novel approach uses the basic properties of a photosensitive glass substrate to expose a hatch pattern that separates each die, bake the photosensitive glass substrate to convert the exposed areas to a ceramic phase, attach the photosensitive glass substrate to a backing with a light adhesive to support the wafer and / or die, and then etch troughs or trenches that complete the exposed hatch pattern down to the adhesive backing. This process separates the individual die on the light adhesive backing. The separated die can be removed using traditional pick and place techniques and applied to a reel to reel or other delivery system.

[0016] Using the described release patterns, materials and methods, rectangular, circular, elliptical, fractal, or other shapes that mimic the shape of a passive device or combination of passive devices can be created, further enabling the release of die shapes that were not possible using traditional series processes such as lasers, sawing water jets, and other processes that cut substrates to release dies containing passive devices.

[0017] To address these needs, the inventors have developed glass-ceramics (APEX® glass-ceramics) as novel packaging and substrate materials for semiconductors, RF electronics, microwave electronics, and optical imaging. APEX® glass-ceramics are processed in a simple three-step process with first generation semiconductor equipment, and the final material can be formed into either glass, ceramic, or contain regions of both glass and ceramic. APEX® glass-ceramics have several advantages over current materials, including easily fabricated high density vias, proven microfluidic capabilities, microlenses or microlens arrays, high Young's modulus for more rigid packages, halogen-free fabrication, and economical manufacturing. Photosensitive glasses offer several advantages for the fabrication of a wide variety of microsystem components. Microstructures have been fabricated relatively inexpensively in these glasses using conventional semiconductor processing equipment. In general, glasses have high temperature stability, good mechanical and electrical properties, and better chemical resistance than plastics and many metals. To our knowledge, the only commercially available photosensitive glass is FOTURAN®, made by Schott and imported into the United States only by Invenios. FOTURAN® comprises a lithium aluminum silicate glass containing trace amounts of silver ions plus other trace elements, specifically 75-85 wt.% silicon oxide (SiO2), 7-11 wt.% lithium oxide (Li2O), 3-6 wt.% aluminum oxide (Al2O3), 1-2 wt.% sodium oxide (Na2O), 0.2-0.5 wt.% antimonium trioxide (Sb2O3) or arsenic oxide (As2O3), 0.05-0.15 wt.% silver oxide (Ag2O), and 0.01-0.04 wt.% cerium oxide (CeO2). As used herein, the terms "APEX® glass-ceramic," "APEX® glass," or simply "APEX®" are used to refer to one embodiment of the glass-ceramic composition of the present invention.

[0018] When exposed to UV light within the absorption band of cerium oxide, the cerium oxide acts as a sensitizer, absorbing photons and losing electrons that reduce adjacent silver oxide to form silver atoms. For example, Ce3++Ag+=Ce4++Ag0

[0019] The silver atoms coalesce into silver nanoclusters during the baking process, inducing nucleation sites for the crystallization of the surrounding glass. When exposed to UV light through a mask, the exposed areas of the glass Only the regions will crystallize during the subsequent heat treatment.

[0020] This heat treatment must be carried out at a temperature close to the glass transition temperature (e.g., greater than 465° C. in air for FOTURAN®). The crystalline phase is more soluble in etchants such as hydrofluoric acid (HF) than the unexposed glassy amorphous regions. In particular, the crystalline regions of FOTURAN® are etched about 20 times faster than the amorphous regions in 10% HF, allowing for microstructures with wall slope ratios of about 20:1 when the exposed regions are removed. TR Dietrich et al., "Fabrication technologies for See, "microsystems utilizing photodefinable glass," Microelectronic Engineering 30, 497 (1996), which is incorporated herein by reference.

[0021] In general, glass-ceramic materials have had limited success in microstructuring, plagued by problems of performance, uniformity, ease of use by others, and availability. Whereas past glass-ceramic materials have yield etch aspect ratios of about 15:1, APEX® glass has an average etch aspect ratio of greater than 50:1. This allows users to create smaller and deeper features. In addition, our manufacturing process allows for product yields greater than 90% (conventional glass yields are closer to 50%). Finally, in conventional glass-ceramics, only about 30% of the glass is converted to the ceramic state, whereas in APEX™ glass-ceramics, this conversion is closer to 70%.

[0022] APEX® compositions offer three main mechanisms for improving their performance: (1) higher amounts of silver lead to the formation of smaller ceramic crystals that etch faster at the grain boundaries, (2) reduced silica content (the main component etched by HF acid) reduces the unwanted etching of unexposed material, and (3) a higher total weight percentage of alkali metal and boron oxide produces a much more homogeneous glass during manufacturing.

[0023] The glass ceramicization is achieved by exposing the entire glass substrate to approximately 20 J / cm of 310 nm light. 2 This is accomplished by exposing the mask to a quartz / chrome mask. When attempting to create glass spaces within a ceramic, the user exposes all of the material except where the glass is to remain glass. In one embodiment, the invention provides a quartz / chrome mask that includes various concentric circles with different diameters.

[0024] The present invention includes a method for fabricating inductive devices in or on glass-ceramic structures for electrical microwave and radio frequency applications. The glass-ceramic substrate can be a photosensitive glass substrate having a number of compositional variations, including but not limited to 60-76% silica, at least 3% K2O and 6-16% K2O and Na2O in combination, 0.003-1% of at least one oxide selected from the group consisting of Ag2O and Au2O, 0.003-2% Cu2O, 0.75%-7% B2O3, and 6-7% Al2O3 and B2O3 in combination, and not more than 13% Al2O3, 8-15% Li2O, and 0.001-0.1% CeO2 by weight. This and other various compositions are commonly referred to as APEX® glass.

[0025] The exposed portions can be converted to crystalline material by heating the glass substrate to a temperature close to its glass transition temperature. When etching a glass substrate with an etchant such as hydrofluoric acid, the anisotropic etch ratio of the exposed portions to the unexposed portions is small when the glass is exposed to a flood lamp with broad spectrum mid-UV (approximately 308-312 nm) light to provide a shaped glass structure with an aspect ratio of at least 30:1, creating a guiding structure. The ratio of the exposed glass to the unexposed portion is 30:1. The mask for exposure can be a halftone mask that provides a continuous gray scale for exposure to form curved structures for making the inductive structures / devices. Digital masks can also be used in flood exposure to make the inductive structures / devices. The exposed glass is then baked, typically in a two-step process: heating at a temperature range of 420°C to 520°C for 10 minutes to 2 hours to allow the silver ions to coalesce into silver nanoparticles, and heating at a temperature range of 520°C to 620°C for 10 minutes to 2 hours to allow lithium oxide to form around the silver nanoparticles. The glass plate is then etched. The glass substrate is etched with an etchant, typically 5% to 10% by volume, of HF solution, providing a shaped glass structure with an anisotropic etch ratio of at least 30:1 when exposed with a broad spectrum mid-ultraviolet flood light and greater than 30:1 when exposed with a laser. Once the passive devices are produced, the supporting APEX™ glass can be left in place or removed to create an array of passive devices that can be removed in series or parallel. Conventional series processes use lasers, sawing water jets and other processes to cut the substrate and release the die containing the passive devices. The present invention exposes a trench pattern that separates each die onto a photosensitive glass substrate, bakes the photosensitive glass substrate to convert the exposed areas to a ceramic phase, attaches the photosensitive glass substrate to a backing with a light adhesive to support the wafer and / or die, and then etches troughs or trenches that complete the exposed hatch pattern into the adhesive backing. This process separates the individual die onto the light adhesive backing. The separated die can be removed using conventional pick and place techniques and applied to a reel to reel or other delivery system.

[0026] The described patterns can be either rectangular, circular, elliptical, fractal, or other shapes that mimic the shape of a passive device or combination of passive devices, further enabling the release of die shapes that would not be possible using traditional series processes such as lasers, sawing water jets, and other processes that cut a substrate to release a die containing passive devices.

[0027] Although the making and using of various embodiments of the invention are discussed in detail below, it should be understood that the invention provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed herein are merely illustrative of specific ways to make and use the invention and do not limit the scope of the invention.

[0028] The invention includes capacitors, inductors, filters or other passive devices fabricated in or on a photosensitive glass-ceramic substrate. The photosensitive glass-ceramic substrate has a hatch pattern of trenches that, when etched, release the devices fabricated in / on the photosensitive glass substrate. The photosensitive glass wafer can range in thickness from 50 μm to 1,000 μm. In one non-limiting case, it is 400 μm. The photosensitive glass is then patterned with trench structures in the hatch pattern.

[0029] No. 1: 20 J / cm of 310 nm light 2 for a minimum of 2 minutes and a maximum of 10 minutes to expose a hatch pattern trench structure in the photosensitive glass.

[0030] Second: Using the same mask used to generate the hatch pattern of the trenches, create a negative photoresist pattern on a photosensitive glass substrate.

[0031] Third: The substrate is then placed into a sputtering system to deposit 1.0 μm of chromium metal.

[0032] Fourth: Remove the photoresist, leaving a protective hard chrome mask over the trench hatch pattern.

[0033] Fifth: Treat the photosensitive glass substrate to fabricate passive devices or systems based on passive devices up to a bake cycle to convert exposed areas to nanophase ceramic. 3DGS references, related materials and / or methods taught in U.S. Pat. No. 10,201,091, "Photo-definable glass with integrated electronics and ground plane," U.S. Pat. No. 10,070,533, "Photo-definable glass with integrated electronics and ground plane," or U.S. Pat. No. 8,709,702, "Methods to fabricate a photoactive substrate suitable for microfabrication," and portions thereof, are incorporated herein by reference.

[0034] Sixth: The photosensitive glass substrate with the passive devices is then baked in a two-step process: heated at a temperature range of 420°C to 520°C for 10 minutes to 2 hours to coalesce the silver ions into silver nanoparticles, and heated at a temperature range of 520°C to 620°C for 10 minutes to 2 hours to allow lithium oxide to form around the silver nanoparticles.

[0035] Seventh: Finish the fabrication of the passive device or a system based on the passive device through metallization and passivation.

[0036] Eighth: Remove chromium metal using a mixture of perchloric acid (HClO4) and ammonium cerium.

[0037] Step 9: Attach the polyimide layer with a mild adhesive to the backside of the photosensitive glass substrate of the wafer.

[0038] Tenth: Etch the nanoceramic hatch pattern trenches in the photosensitive glass substrate in a HF solution, typically an etchant of 5 vol% to 10 vol%, such that the etching ratio of the exposed parts to those of the non-exposed parts is at least 30:1, so that the exposed trench structures in the hatch pattern are etched through the volume of the glass.

[0039] The trench structure of the hatch pattern can range from 5 μm to 250 μm in diameter, but is preferably 30 μm in diameter. The length of the trench can traverse all or part of the width of the photosensitive glass substrate. There is slight texture to the etched surface texturing of the ceramic walls, and a slight slope that is between 1° and 20° from vertical. The slope is due to the preferential etching rate of the photosensitive glass (30:1 from exposed to unexposed areas). When the HF hits the unexposed areas adjacent to the trench pattern, the etchant will remove 1 μm laterally for every 30 μm removed vertically, creating a sloped and textured surface. This is in contrast to using a cutting tool that grinds the substrate with nearly vertical walls of a rough / rough surface. Due to the width of the cutting / polishing blade / wheel, the scribe or cut line needs to be larger than 100 μm. The width of the scribe or cut line determines the total number of dies on the substrate. The thinner the scribe or cut lines, the closer the dies can be packed on the substrate (more products per substrate). In some embodiments of the invention, the scribe lines are no more than 10, 20, 30, 40, 50, 60, 70, 75, 80, or 90 μm wide, or range between each of these specific widths.

[0040] Thus, the present invention includes a batch method for large scale parallel die release of die from a substrate, including passive, system in package (SiP) from a glass substrate. ) or system-in-a-package, or system-on-chip ( Enables low-cost, high-volume production of SoC (systems-on-chip), filters and / or other devices It becomes Noh.

[0041] In one embodiment, the invention comprises a method of producing a die release or scribe pattern for one or more dies from a substrate in a parallel batch process comprising, consisting of, or consisting essentially of the steps of exposing at least a portion of a photosensitive glass substrate with the die release or scribe pattern using an activating UV energy source; heating the photosensitive glass substrate above its glass transition temperature to a heating phase for at least 10 minutes; cooling the photosensitive glass substrate to convert at least a portion of the exposed photosensitive glass substrate to a crystalline material to form a glass-ceramic crystalline substrate; coating the exposed areas with a UV light blocking layer; fabricating and completing passive components, filters, or other devices on the front side of the substrate; and etching away the ceramic phase of the die release or scribe pattern in the photosensitive glass substrate with an etchant solution to release the die from the substrate.

[0042] In one embodiment, the invention comprises a method of making a die release or scribe pattern for one or more dies from a substrate in a parallel batch process, comprising, consisting of, or consisting essentially of the steps of masking a photosensitive glass substrate with the die release or scribe pattern; exposing at least a portion of the photosensitive glass substrate with an activating UV energy source as a die release; heating the photosensitive glass substrate above its glass transition temperature for at least 10 minutes to a heating phase; cooling the photosensitive glass substrate to convert at least a portion of the exposed photosensitive glass substrate to form a glass-ceramic crystalline portion of the photosensitive glass substrate; coating the exposed areas with a UV light blocking layer; fabricating and completing passive components, filters, or other devices; placing a weakly adhesive backing on the backside of the substrate; etching away the glass-ceramic portion of the die release or scribe pattern in the photosensitive glass substrate with an etchant solution that releases the die; and removing the one or more dies from the weakly adhesive backing.

[0043] Although the present invention and its advantages have been described in detail, it should be understood that various modifications, substitutions and alterations can be made herein without departing from the spirit and scope of the present invention as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the processes, machines, manufacture, compositions of matter, means, methods and steps described herein. As one skilled in the art would readily appreciate from the present disclosure, any currently existing or later developed processes, machines, manufacture, compositions of matter, means, methods or steps that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein can be utilized in accordance with the present invention. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods or steps.

[0044] The use of the word "a" or "an" when used in conjunction with the term "comprising" in the claims and / or specification can mean "one," but is also consistent with the meanings of "one or more," "at least one," and "one or more than one." The use of the term "or" in the claims is used to mean "and / or," unless expressly indicated to refer to only alternatives or the alternatives are not mutually exclusive, although the disclosure supports a definition that refers only to alternatives and "and / or." Throughout this application, the term "about" is used to indicate that a value includes the inherent variation of error for the device used to determine the value, or the variation that exists between study subjects.

[0045] As used in the specification and claims, "comprising" (and all forms of comprising, such as "comprise" and "comprises"), "having" (and all forms of having, such as "have" and "has"), "including" (and all forms of including, such as "includes" and "include"), or "containing" (and all forms of containing, such as "contains" and "contain") are inclusive or open-ended and do not exclude additional, unrecited elements or method steps. In any of the embodiments of the compositions and methods provided herein, "comprising" can be replaced with "consisting essentially of" or "consisting of." As used herein, the phrase "consisting essentially of" includes any specified integer or step, As used herein, the term "consisting" means a combination of a stated integer (e.g., a feature, element, characteristic, property, method / process step, etc.) and a combination of a feature, element, characteristic, property, property, method / process step, etc. or limitation) or integer (e.g. feature, element, characteristic, property, method / process) It is used to indicate the presence of only a group of (step, step, or restriction).

[0046] The term "or combinations thereof" as used herein refers to all permutations and combinations of the listed items preceding the term. For example, "A, B, C, or combinations thereof" is intended to include at least one of A, B, C, AB, AC, BC, or ABC, and also BA, CA, CB, CBA, BCA, ACB, BAC, or CAB, if order is important in the particular context. Continuing with this example, combinations including repeats of one or more items or terms, such as BB, AAA, AB, BBC, AAABCCCC, CBBAAA, CABABB, etc., are expressly included. One of skill in the art will understand that there is typically no limit to the number of items or terms in any combination, unless otherwise clear from the context.

[0047] As used herein, without limitation, approximation words such as "about," "substantial," or "substantially" refer to a condition that, when so modified, is understood to not necessarily be absolute or complete, but that would be considered by one of ordinary skill in the art to be close enough to warrant specifying the condition as existing. The extent to which the description may vary will depend on how large a change can occur and still allow one of ordinary skill in the art to recognize the modified feature as still having the desired characteristics and capabilities of the unmodified feature. In general, but subject to the preceding discussion, numerical values ​​herein modified by approximation words such as "about" may vary by at least ±1, 2, 3, 4, 5, 6, 7, 10, 12, or 15% from the stated value.

[0048] All of the compositions and / or methods disclosed and claimed herein can be made and executed without undue experimentation in light of the present disclosure. While the compositions and methods of the present invention have been described in terms of preferred embodiments, it will be apparent to those skilled in the art that variations can be applied to the compositions and / or methods described herein, and in the steps or sequence of steps of the methods, without departing from the concept, spirit and scope of the invention. All such similar substitutes and modifications apparent to those skilled in the art are deemed to be within the spirit, scope and concept of the invention as defined by the appended claims.

[0049] In order to assist the Patent Office, and any reader of any patent that may issue on this application, in interpreting the claims appended hereto, Applicant hereby declares that paragraph 6 of paragraph (f) of 35 U.S.C. 112, or an equivalent thereof, exists as of the filing date of this application, to be construed as a "means for" or "of It is to be noted that none of the appended claims are intended to apply the phrase "steps for" unless the phrase is expressly used in a particular claim.

[0050] For each claim, each dependent claim may depend both from the independent claim and from each of the previous dependent claims for each and every claim, so long as the previous claim provides a suitable antecedent for a term or element of the claim.

Claims

1. A die release or scribe pattern for one or more dies in a substrate for parallel batch processing, comprising: Photosensitive glass substrate; a die release or scribe pattern comprising a glass-ceramic crystalline material in the photosensitive glass substrate; and a filter on a front surface of said photosensitive glass substrate; Equipped with the glass-ceramic crystalline material of the die release or scribe pattern on the photosensitive glass substrate is configured to be etched away with an etchant solution to release the filter. The die release or scribe pattern.

2. 10. The die release or scribe pattern of claim 1, which is rectangular, circular, elliptical, fractal, or other shape that outlines the shape of the filter.

3. The die release or scribe pattern of claim 1 further comprising an adhesive backing on the rear surface of the photosensitive glass substrate.

4. 2. The die release or scribe pattern of claim 1, wherein the width of the die release or scribe pattern is between 5 μm and 250 μm.

5. 10. The die release or scribe pattern of claim 1 having a greater number of filters per substrate than an equivalent mechanically cut substrate.

6. 10. The die release or scribe pattern of claim 1, wherein the released filter edge has a surface roughness of less than 5 μm.

7. 10. The die release or scribe pattern of claim 1, wherein the released filter edge has a surface roughness of less than 1 μm.

8. 10. The die release or scribe pattern of claim 1, wherein an edge of the released filter is at a non-perpendicular angle from a surface of the filter.

9. 10. The die release or scribe pattern of claim 1, wherein an edge of the released filter has a non-perpendicular angle from the surface of the filter that is at least 1 degree from a normal to the surface of the filter and less than 30 degrees.

10. 2. The die release or scribe pattern of claim 1, wherein a top or bottom corner of the released filter has a non-perpendicular curvature from the surface of the filter that is at least 1° and less than 30° from the surface of the released filter.

11. 10. The die release or scribe pattern of claim 1, wherein the width of the one or more scribe lines is 10, 20, 30, 40, 50, 60, 70, 75, 80, or 90 μm wide, or any range therebetween.

12. A die release or scribe pattern for one or more dies in a substrate for parallel batch processing, comprising: Photosensitive glass substrate; the die release or scribe pattern comprising a glass-ceramic crystalline material in the photosensitive glass substrate; a filter on the surface of the photosensitive glass substrate; and a weakly adhesive backing on the back side of said substrate; Equipped with The die release or scribe pattern is configured such that the glass ceramic crystalline material of the die release or scribe pattern is configured to be etched away with an etchant solution that releases the filter and separates the one or more dies on the weakly adhesive backing, and the one or more dies are configured to be removed from the weakly adhesive backing.

13. 13. The die release or scribe pattern of claim 12, which is rectangular, circular, elliptical, fractal, or other shape that outlines the shape of the filter.

14. The die release or scribe pattern of claim 12, wherein the width of the die release or scribe pattern is between 5 μm and 250 μm.

15. 13. The die release or scribe pattern of claim 12, wherein the die release or scribe pattern allows for a large number of filters per substrate.

16. 13. The die release or scribe pattern of claim 12, wherein the edges of the released filter have a surface roughness of less than 5 μm.

17. 13. The die release or scribe pattern of claim 12, wherein the edges of the released filter have a surface roughness of less than 1 μm.

18. 13. The die release or scribe pattern of claim 12, wherein an edge of the released filter is at a non-perpendicular angle from a surface of the filter.

19. 13. The die release or scribe pattern of claim 12, wherein an edge of the released filter has a non-perpendicular angle from the surface of the filter that is at least 1 degree from a normal to the surface of the filter and less than 30 degrees.

20. 13. The die release or scribe pattern of claim 12, wherein a top or bottom corner of the released filter has a non-perpendicular curvature from the surface of the filter that is at least 1° and less than 30° from the surface of the filter.

21. 13. The die release or scribe pattern of claim 12, wherein the width of the one or more scribe lines is 10, 20, 30, 40, 50, 60, 70, 75, 80, or 90 μm wide, or any range therebetween.

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