Wafer Position Detection Device

Abstract

An object of the present invention is to provide a wafer position detection device. [Solution] The present invention discloses a wafer position detection device, comprising a mounting seat, a trigger assembly, and a fluid pressure detection assembly. The trigger assembly provided on the mounting seat includes a top cover that protrudes from a surface of the mounting seat to support a wafer, and a fluid transport pipeline provided in a hollow cavity formed in an inner wall of the top cover. When a wafer is provided on the top cover, the top cover can move along a direction approaching the fluid transport pipeline to block a fluid transport port of the fluid transport pipeline, and when a wafer is not provided on the top cover, the top cover can move along a direction away from the fluid transport pipeline by the action of fluid pressure to make the fluid transport port of the fluid transport pipeline conductive. The fluid pressure detection assembly indirectly contacts the wafer via the top cover to indirectly detect the positioning status of the wafer, thereby preventing defects on the wafer surface caused by direct contact and affecting yield. Compared with an optical sensor, it can detect the positioning status of a wafer which is highly sensitive to light irradiation, has a wide range of applications, and improves the versatility of the device.

Description

[Technical field]

[0001] The present invention relates to the field of semiconductor processing equipment, and more particularly to wafer position detection equipment. [Background technology]

[0002] In recent years, with the rapid growth of the semiconductor industry, the line width in the manufacturing process of semiconductor chips has been reduced from 0.18um to 10nm or less, and the number of metal layers has increased from 5-6 layers to more layers. This solves the problem that multi-layer wiring by copper process is a bottleneck in the aluminum interconnection process, and also places higher requirements on global planarization. CMP is currently the best global planarization technology and is an essential part of the copper interconnection process. However, the copper (Cu) CMP process has the defects of being prone to butterfly, erosion, and scratches, as well as corrosion.

[0003] Each part of the chemical mechanical polishing planarization apparatus needs to detect the position of the wafer in real time. For example, in the polishing process, the wafer is first placed on the stage by the manipulator, and when it is detected that the wafer is in the predetermined position, the polishing header takes the wafer from the stage and polishes it. After the wafer is polished, the polishing header returns the wafer to the stage and the manipulator transports the wafer to the cleaning mechanism. In this process, if the wafer is not accurately placed on the stage due to the vibration of the stage during movement or the vibration of the manipulator during transportation, the wafer will fail to be retrieved and even the wafer will be destroyed.

[0004] Conventional technical solutions for detecting wafers generally employ lever-brake sensors arranged around the circumference of the wafer to perform indirect detection. When the wafer is misaligned, the sensor signal differs, and this is used as the basis for judgment. This means that the lever-brake sensor performs indirect detection, which may result in particles being generated due to friction between parts, is complex in structure, and the brake lever is likely to scratch the wafer surface, making installation and maintenance difficult and affecting the accuracy of indirect detection. There are also technical solutions for direct detection by arranging sensors around the circumference of the wafer, but in the case of optical sensors, for example, direct detection using such sensors is not suitable for processes that are highly sensitive to light irradiation (e.g., copper processes), and polishing fluid and droplets are also scattered in the operating environment, making it easy for the optical sensor to falsely alarm. Summary of the Invention [Problem to be solved by the invention]

[0005] In light of this, the present invention aims to provide a wafer position detection device that solves the problem that sensors that perform indirect detection are prone to causing defects on the wafer surface, affecting yield, but that sensors that perform direct detection have a limited range of application. [Means for solving the problem]

[0006] To achieve the above objectives, the present invention provides the following technical solutions: A mounting seat and a trigger assembly provided on the mounting seat, the trigger assembly including a top cover protruding from a surface of the mounting seat to support a wafer, and a fluid transport pipe provided in a hollow cavity formed in an inner wall of the top cover, wherein when a wafer is provided on the top cover, the top cover can move in a direction approaching the fluid transport pipe to block a fluid transport port of the fluid transport pipe, and when a wafer is not provided on the top cover, the top cover can move along a direction away from the fluid transport pipe by the action of a fluid pressure to open the fluid transport port of the fluid transport pipe; a fluid pressure detection assembly connected to the controller for detecting a fluid pressure in the fluid transport line.

[0007] Preferably, a mounting groove for mounting the top cover is provided on the mounting seat, and a press cover for restricting movement of the top cover in a direction away from the fluid transport pipe is provided on a surface of the mounting groove.

[0008] Preferably, a rod-shaped guide groove for linearly guiding the movement of the top cover is provided on the circumferential side wall of the mounting groove, the rod-shaped guide groove is provided parallel to the center line direction of the mounting groove, and a guide protrusion for engaging with the rod-shaped guide groove is provided on the top cover.

[0009] Preferably, the mounting seat further includes an output hole for discharging fluid within the hollow cavity, the output hole being provided in a bottom wall of the mounting groove and penetrating the mounting seat in a direction away from the top cover.

[0010] Preferably, the fluid transport piping comprises: a nozzle removably and fixedly connected to the mounting seat; and an input pipe having one end connected to the nozzle and the other end connected to a fluid power source.

[0011] Preferably, a mounting through hole for mounting the nozzle is provided in the mounting seat, the mounting through hole penetrates along the thickness direction of the mounting seat, a female thread is provided in the mounting through hole, and a male thread is provided on the nozzle to mate with the female thread.

[0012] Preferably, the control device comprises: and a fluid pressure determining unit configured to determine whether the fluid pressure value detected by the fluid pressure detection assembly is equal to a first preset pressure value, and if so, send information notifying that the wafer is currently positioned correctly; determine whether the fluid pressure value detected by the fluid pressure detection assembly is equal to a second preset pressure value, and if so, send information notifying that there is no wafer at the current working position; determine whether the first preset pressure value is greater than the second preset pressure value; and determine whether the fluid pressure value detected by the fluid pressure detection assembly is greater than the second preset pressure value and less than the first preset pressure value, and if so, send information notifying that the wafer is currently not positioned correctly.

[0013] Preferably, the top cover is a spherical arc surface top cover.

[0014] Preferably, the number of groups of the trigger assemblies is a plurality of groups, and all of the trigger assemblies are uniformly mounted on the mounting seats.

[0015] Preferably, the trigger assemblies are in three groups, the three groups being arranged centrally symmetrically along the center of the mounting seat, and one group of the fluid pressure detection assemblies is connected to the fluid transport piping of each of the three groups of the trigger assemblies.

[0016] The wafer position detection device provided by the present invention includes a mounting seat, a trigger assembly provided on the mounting seat, the trigger assembly including a top cover that protrudes from the surface of the mounting seat to support a wafer, and a fluid transport piping provided in a hollow cavity formed in an inner wall of the top cover, and when a wafer is provided on the top cover, the top cover can move along a direction approaching the fluid transport piping to block a fluid transport port of the fluid transport piping, and when a wafer is not provided on the top cover, the top cover can move along a direction away from the fluid transport piping due to the action of fluid pressure to open the fluid transport port of the fluid transport piping, and a fluid pressure detection assembly connected to a control device and detecting fluid pressure in the fluid transport piping. Effect of the Invention

[0017] Compared with the prior art, the application of the wafer position detection device provided in the present invention provides the following technical advantages: 1. The fluid pressure detection assembly indirectly contacts the wafer through the top cover to indirectly detect the wafer positioning status. Compared with the lever brake type sensor, the fluid pressure detection assembly does not need to directly contact the wafer, which prevents defects on the wafer surface caused by direct contact and affects the yield. Compared with the optical sensor, it can detect the wafer positioning status with high sensitivity to light irradiation, which has a wider range of application and improves the versatility of the device. 2. Based on the comparison between the pressure value detected by the fluid pressure detection assembly and the preset pressure value, the accuracy of the wafer placement can be judged, and the magnitude of the pressure values ​​of the fluid pressure detection assembly at different positions can be used to guide subsequent wafer position adjustment. 3. The top of the top cover is a spherical arc surface, which makes point contact with the plane of the wafer, reducing the contact area between the two and preventing foreign matter from being present between the top cover and the wafer. If foreign matter is present between the top cover and the wafer, the area of ​​scratches caused by relative slippage will be reduced, further improving yield. 4. The rod-shaped guide groove in the mounting groove allows the top cover to move only in a linear direction, restricting the rotational freedom caused by the action of fluid, preventing scratches between the top cover and the wafer due to the rotation of the top cover, and fixing the top cover and the wafer relatively, further improving the reliability of the device. [Brief description of the drawings]

[0018] In order to more clearly describe the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces drawings used in the description of the embodiments or the prior art. It should be understood that the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can further obtain other drawings based on these drawings without creative efforts.

[0019] [Figure 1] 1 is a structural schematic diagram showing the appearance of a wafer position detection device provided in an embodiment of the present invention; [Diagram 2] FIG. 2 is a schematic diagram showing a cross-sectional structure of a portion of FIG. [Diagram 3] FIG. 2 is a structural schematic diagram showing the installation of a wafer and a wafer position detection device provided in an embodiment of the present invention. [Figure 4] FIG. 4 is a schematic diagram showing a cross-sectional structure of a portion of FIG. [Diagram 5] FIG. 2 is a structural schematic diagram showing the location of a trigger assembly provided in an embodiment of the present invention. [Figure 6] 1 is a structural schematic diagram showing the position of a wafer provided in an embodiment of the present invention when the wafer is not accurately placed on the mounting seat; [Figure 7] FIG. 7 is a schematic diagram of the shaft side structure of FIG. 6. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] The embodiments of the present invention disclose a wafer position detection apparatus that solves the problem that direct contact with the sensor can cause defects on the surface of the wafer, affecting the yield.

[0021] In the following, the technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it should be understood that the described embodiments are only some of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments that can be obtained by those skilled in the art without any creative effort shall be included in the protection scope of the present invention.

[0022] Referring to Figs. 1 to 7, Fig. 1 is a structural schematic diagram showing the appearance of a wafer position detection device provided in an embodiment of the present invention. Fig. 2 is a schematic diagram showing a partial cross-sectional structure of Fig. 1. Fig. 3 is a structural schematic diagram showing the attachment of a wafer and a wafer position detection device provided in an embodiment of the present invention. Fig. 4 is a schematic diagram showing a partial cross-sectional structure of Fig. 3. Fig. 5 is a structural schematic diagram showing the position of a trigger assembly provided in an embodiment of the present invention. Fig. 6 is a structural schematic diagram showing the position of a wafer provided in an embodiment of the present invention when it is not accurately placed on the attachment seat. Fig. 7 is a structural schematic diagram of the shaft side of Fig. 6. In a specific embodiment, the wafer position detection device of the present application includes a mounting seat 4 for placing a wafer thereon and a trigger assembly. The trigger assembly is provided on the mounting seat 4, and the mounting seat 4 indirectly places the wafer thereon via the trigger assembly.

[0023] 2 and 4, the trigger assembly includes a top cover 1 and a fluid transport pipe, the top cover 1 protrudes from the surface of the mounting seat 4 to support the wafer 6, the top cover 1 can be a columnar or base body, for example, a cylindrical body or a truncated cone, and the specific structure of the top cover 1 is set as required. The inside of the top cover 1 is a hollow cavity used to cover the fluid transport piping, the fluid transport piping is provided in the hollow cavity formed in the inner wall of the top cover 1, the top cover 1 can move along a direction approaching or moving away from the fluid transport piping to block / conduct the fluid transport port of the fluid transport piping, when a wafer 6 is provided on the top cover 1, the top cover 1 can move along a direction approaching the fluid transport piping to block the fluid transport port of the fluid transport piping, when a wafer 6 is not provided on the top cover 1, the top cover 1 can move along a direction away from the fluid transport piping under the action of fluid pressure to cut off the contact between the top cover 1 and the fluid transport port of the fluid transport piping and connect the fluid transport port of the fluid transport piping, when the fluid transport piping and the hollow cavity are connected, the fluid in the fluid transport piping flows out from the fluid transport port, the hollow cavity and the output hole in that order, and the output hole is provided on the mounting seat 4 to discharge the fluid in the hollow cavity.

[0024] As a method for mounting the top cover 1 to the mounting seat, preferably, a mounting groove for mounting the top cover 1 is provided on the mounting seat 4, and in order to prevent the top cover 1 from being removed from the mounting groove, the top end of the top cover 1 is provided protruding from the mounting groove, and the end of the top cover 1 is engaged with the mounting groove, and as can be understood, due to the clearance fit between the top cover 1 and the mounting groove, the top cover 1 can move along the center line direction of the mounting groove and move toward or away from the fluid transport pipe. Furthermore, in order to prevent the top cover 1 from rotating around its own axis due to the action of fluid pressure and performing a relative rotational movement with the wafer 6, and further causing wear or scratches on the surface of the wafer 6, preferably, a rod-shaped guide groove is provided on the peripheral side wall of the mounting hole to linearly guide the movement of the top cover 1, the rod-shaped guide groove is provided parallel to the center line direction of the mounting groove, and more preferably, the rod-shaped guide groove is parallel to the axial direction of the fluid transport pipe, and in order to ensure that the movement of the top cover 11 is linear, the top cover is provided with a guide protrusion to fit with the rod-shaped guide groove. In this manner, the rotational freedom of the top cover 1 is limited, and the top cover 1 is prevented from rotating about its own center line due to the action of fluid pressure in the fluid transport piping, which would cause the top cover 1 to move relative to the wafer and cause scratches, thereby further improving the yield and improving the reliability of the device.

[0025] The fluid pressure detection assembly is connected to the control device to detect the fluid pressure in the fluid transport pipe, and detects the wafer positioning status and placement accuracy based on the fluid pressure in the fluid transport pipe. The fluid is generally deionized water, and may be air or other inert gases, etc., if necessary, and the provision of a corresponding fluid pressure detection assembly according to the type of fluid is all within the scope of protection of the present invention.

[0026] During operation, when there is no wafer on the top cover 1, the fluid in the fluid transport pipe enters the hollow cavity through the fluid transport port, and the top cover 1 moves away from the fluid transport pipe along the rod-shaped guide groove under the action of pressure, and the end wall of the mounting hole limits the maximum sliding position of the top cover 1. At this time, the fluid pressure detection assembly detects the pressure in the fluid transport pipe, and based on the detected pressure value, it can be determined whether there is a wafer currently on the top cover 1. When a wafer is attached to the top cover 1, the top cover 1 moves toward the fluid transport pipe due to the gravitational effect of the wafer and blocks the fluid transport port of the fluid transport pipe. At this time, the fluid cannot enter the hollow cavity through the fluid transport port and flow out, and the fluid pressure becomes large, and based on the detected pressure value, it is determined whether the wafer is currently positioned correctly. As described above, the fluid pressure detection assembly detects whether the wafer is positioned in accordance with the pressure in the fluid transport pipe. In another embodiment, when a wafer is placed on the top cover 1, the fluid pressure value detected by the fluid pressure detection assembly is compared with the preset pressure value to detect whether the wafer is positioned correctly. As an example, when the wafer is positioned correctly, the preset fluid pressure of the system is 3Mpa. Therefore, in the process of detecting the positioning accuracy, a judgment is made based on the fluid pressure detected by the fluid pressure detection assembly. If it is not 3Mpa, it is considered that the wafer is not currently positioned correctly. In practical applications, a certain error range may be set as necessary.

[0027] The trigger assembly may also be used in combination with other mechanical structures or sensors to detect the positioning status and placement accuracy of the wafer, such as a lever mechanism, a displacement sensor, or a projectile sensor, as needed.

[0028] Specifically, the mounting seat 4 is provided with a mounting groove for mounting the top cover 1, and a press cover 5 is provided on the surface of the mounting groove for restricting the movement of the top cover 1 in a direction away from the fluid transport pipe. The press cover 5 and the mounting groove are removably and fixedly connected, for example, by a threaded fastener. An outer edge is provided on the bottom edge of the top cover 1 that fits into the mounting groove, and the engagement of the outer edge with the press cover 5 restricts the top cover 1, and the outer edge is continuously provided around the bottom edge of the top cover 1, where the press cover 5 may be preferably continuously provided around the peripheral edge of the mounting groove or may be provided at intervals, both of which are within the protection scope of the present invention.

[0029] Wherein, the fluid transport pipe includes a nozzle 2 and an input pipe. The nozzle 2 is removably and fixedly connected to the mounting seat 4. In one embodiment, the mounting seat 4 is provided with a mounting through-hole for mounting the nozzle 2, the mounting through-hole penetrates along the thickness direction of the mounting seat 4, the mounting through-hole is provided with a female thread, and the nozzle 2 is provided with a male thread that fits with the female thread, so that the nozzle 2 and the mounting seat 4 are fixed by thread connection. The input pipe is connected at one end to the nozzle 2 and at the other end to a fluid power source. A fluid pressure detection assembly is preferably provided in the fluid transport pipe, so that the flow rate of the fluid is stable, the interference with the fluid pressure detection is reduced, and the detection accuracy of the fluid pressure is improved.

[0030] In one embodiment, in order to prevent damage to the wafer caused by fluid splash and affecting the yield, the output hole is provided toward the other side of the mounting base 4, the output hole is provided in the bottom wall of the mounting groove and passes through the mounting base 4 in a direction away from the top cover 1, and in order to optimize the mounting space and facilitate the connection between the output hole and the output piping, the axis of the output hole is preferably parallel to the axis of the fluid transport piping.

[0031] Preferably, the fluid pressure detection assembly is a water pressure sensor 3, the fluid is deionized water, the water pressure sensor 3 has a simple structure and is easy to arrange, and the deionized water has high purity and reduces interference with the surface of the wafer.

[0032] Specifically, the control device includes: The fluid pressure detection unit is configured to determine whether the fluid pressure value detected by the fluid pressure detection assembly is equal to a first preset pressure value, and if so, transmit information notifying that the wafer 6 is currently positioned accurately; determine whether the fluid pressure value detected by the fluid pressure detection assembly is equal to a second preset pressure value, and if so, transmit information notifying that the wafer 6 is not currently positioned at the working position; determine whether the first preset pressure value is greater than the second preset pressure value, and whether the fluid pressure value detected by the fluid pressure detection assembly is greater than the second preset pressure value and less than the first preset pressure value, and if so, transmit information notifying that the wafer 6 is not currently positioned accurately, thereby realizing detection of the wafer positioning status and placement accuracy.

[0033] 6 and 7, it can be understood that in the case of a multi-group trigger assembly, when the fluid pressure values ​​detected by all the fluid pressure detection assemblies are equal to the first preset pressure value, it is determined that there is no wafer on the mounting seat 4, and an operation to place the wafer can be performed; when the fluid pressure values ​​detected by all the fluid pressure detection assemblies are equal to the second preset pressure value, it is determined that there is a wafer on the mounting seat 4 and the wafer is correctly positioned, and an operation to remove the wafer can be performed; when the fluid pressure value detected by any one of the fluid pressure detection assemblies is between the first preset pressure value and the second preset pressure value, it is determined that there is a wafer on the mounting seat 4 but is not correctly positioned, and an alarm is issued; in the first two cases described above, the fluid pressure values ​​detected by the fluid pressure detection assemblies of each trigger assembly should be equal to the first preset pressure value / second preset pressure value, respectively, thereby further improving the detection accuracy and monitoring the placement status of the mounting seat 4 before performing the operation to remove / return the wafer, thereby improving the safety of the apparatus.

[0034] Based on the above embodiments, in order to reduce the contact area between the top cover 1 and the wafer and prevent scratches, the top cover 1 is a spherical arc-surface top cover 1, which prevents scratches caused by the relative movement between the wafer and the top cover 1 and further improves the yield; in addition, the top cover 1 may be an arc-shaped top cover 1 or other types of top cover as long as the same technical effect can be obtained; it can be understood that when the top cover is a spherical arc-surface top cover / arc-shaped top cover, the nozzle structure may accordingly be a spherical arc-surface nozzle / arc-shaped nozzle, which can be fitted with the inner wall of the top cover, so that when blocking, the blocking effect is improved and the detection error of the fluid pressure is reduced.

[0035] Specifically, the number of groups of trigger assemblies is a plurality of groups, and all the trigger assemblies are uniformly arranged on the mounting seat 4. "Uniformly arranged" refers to, for example, a matrix arrangement, an arrangement along a horizontal or vertical direction, etc., and the nozzles 2 of the trigger assemblies of each group are respectively connected to the fluid pressure detection assemblies to supply water independently, and the position and attitude of the wafer can be determined and adjusted by determining the detected pressure of the fluid pressure detection assemblies connected to the trigger assemblies at different positions, so that the control device controls the driving assemblies to guide the corresponding wafer position adjustment, and the precise positioning operation is simplified. In another embodiment, the nozzles 2 of the trigger assemblies of each group may be respectively connected to the same main pipe to supply water, and the same fluid pressure detection assembly is connected to each main pipe, and in such an arrangement, the connection of parts and pipes is simple and the cost is low. As can be understood, the number of groups of trigger assemblies is arranged according to the size of the mounting seat 4 and the weight of the wafer 6.

[0036] Preferably, there are three groups of trigger assemblies, the three groups of trigger assemblies are arranged centrosymmetrically along the center of the mounting seat 4, and one group of fluid pressure detection assemblies is connected to the fluid transport pipes of the three groups of trigger assemblies, respectively. The three groups of trigger assemblies have the same structure, which is easy to produce and process, and the mounting seat 4 is preferably a circular mounting seat 4, and all the trigger assemblies are arranged centrosymmetrically along the center of the circular mounting seat 4, which further optimizes the structure of the mounting seat 4.

[0037] Compared with the prior art, the application of the wafer position detection device provided in the present invention provides the following technical advantages: 1. The fluid pressure detection assembly indirectly contacts the wafer through the top cover to indirectly detect the wafer positioning status. Compared with the lever brake type sensor, the fluid pressure detection assembly does not need to directly contact the wafer, which prevents defects on the wafer surface caused by direct contact and affects the yield. Compared with the optical sensor, it can detect the wafer positioning status with high sensitivity to light irradiation, which has a wider range of application and improves the versatility of the device. 2. Based on the comparison between the pressure value detected by the fluid pressure detection assembly and the preset pressure value, the accuracy of the wafer placement can be judged, and the magnitude of the pressure values ​​of the fluid pressure detection assembly at different positions can be used to guide subsequent wafer position adjustment. 3. The top of the top cover is a spherical arc surface, which makes point contact with the plane of the wafer, reducing the contact area between the two and preventing foreign matter from being present between the top cover and the wafer. If foreign matter is present between the top cover and the wafer, the area of ​​scratches caused by relative slippage will be reduced, further improving yield. 4. The rod-shaped guide groove in the mounting groove allows the top cover to move only in a linear direction, restricting the rotational freedom caused by the action of fluid, preventing scratches between the top cover and the wafer due to the rotation of the top cover, and fixing the top cover and the wafer relatively, further improving the reliability of the device.

[0038] Finally, it should be further clarified that, in this specification, relational terms such as first and second are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or ordering between those entities or operations. Additionally, the terms "comprise", "comprise", or any other form thereof, are intended to be non-exclusive inclusive, whereby a process, method, article, or apparatus that includes a set of elements includes not only those elements, but also other elements not expressly illustrated or inherent to such process, method, article, or apparatus. Unless further limited, an element defined by the phrase "comprises" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes that element. [Explanation of symbols]

[0039] 1 Top cover 2 Nozzles 3. Water pressure sensor 4 Mounting base 5 Press Cover 6 Wafer

Claims

1. A mounting base, a trigger assembly provided on the mounting seat, the trigger assembly including a top cover protruding from a surface of the mounting seat to support a wafer, and a fluid transport pipe provided in a hollow cavity formed in an inner wall of the top cover, wherein when a wafer is provided on the top cover, the top cover can move in a direction approaching the fluid transport pipe to block a fluid transport port of the fluid transport pipe, and when a wafer is not provided on the top cover, the top cover can move along a direction away from the fluid transport pipe by the action of a fluid pressure to open the fluid transport port of the fluid transport pipe; a fluid pressure detection assembly connected to a control device for detecting a fluid pressure in the fluid transport pipe.

2. 2. The wafer position detection device according to claim 1, characterized in that the mounting seat is provided with a mounting groove for mounting the top cover, and a press cover is provided on the surface of the mounting groove for limiting movement of the top cover in a direction away from the fluid transport piping.

3. 3. The wafer position detection device of claim 2, wherein a rod-shaped guide groove is provided on a circumferential side wall of the mounting groove for linearly guiding the movement of the top cover, the rod-shaped guide groove is provided parallel to a center line direction of the mounting groove, and the top cover is provided with a guide protrusion for engaging with the rod-shaped guide groove.

4. 3. The wafer position detection device according to claim 2, further comprising an output hole provided in the mounting seat for discharging fluid within the hollow cavity, the output hole being provided in a bottom wall of the mounting groove and penetrating the mounting seat along a direction away from the top cover.

5. a nozzle removably and fixedly connected to the mounting seat; 3. The wafer position detection device according to claim 2, further comprising: an input pipe having one end connected to the nozzle and the other end connected to a fluid power source.

6. 6. The wafer position detection device according to claim 5, characterized in that the mounting seat is provided with a mounting through hole for mounting the nozzle, the mounting through hole penetrates along a thickness direction of the mounting seat, the mounting through hole is provided with a female thread, and the nozzle is provided with a male thread that fits with the female thread.

7. The control device includes:

2. The wafer position detection device of claim 1, further comprising a fluid pressure determining unit configured to determine whether the fluid pressure value detected by the fluid pressure detection assembly is equal to a first preset pressure value, and if so, transmit information notifying that the wafer is currently positioned correctly; determine whether the fluid pressure value detected by the fluid pressure detection assembly is equal to a second preset pressure value, and if so, transmit information notifying that there is no wafer at the current working position; determine whether the first preset pressure value is greater than the second preset pressure value, and determine whether the fluid pressure value detected by the fluid pressure detection assembly is greater than the second preset pressure value and less than the first preset pressure value, and if so, transmit information notifying that the wafer is currently not positioned correctly.

8. 8. The wafer position detection device according to claim 1, wherein the top cover is a top cover having a spherical arc surface.

9. 9. The wafer position detection device according to claim 8, wherein the number of groups of the trigger assemblies is a plurality of groups, and all of the trigger assemblies are uniformly mounted on the mounting seats.

10. 10. The wafer position detection device of claim 9, wherein the trigger assemblies are in three groups, the three groups of trigger assemblies are arranged centrally symmetrically along the center of the mounting seat, and one group of the fluid pressure detection assemblies is connected to each of the fluid transport piping of the three groups of trigger assemblies.

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