Electronic cooling device

Abstract

To improve fluidity of air near a power supply part supported by a power supply cover of an electronic cooling device.SOLUTION: An electronic cooling device 1 includes: a peltier element including heat exchange parts on both surfaces; an inner cover 13; an outer cover 14; an inner fan 15; an outer fan; a power supply part; and a power supply cover 18 which supports the power supply part. The inner cover has suction ports 13a which may introduce air to an area near the power supply cover in a state that the inner cover covers at least a part of the power supply part and at least a part of the power supply cover. A wind guide part 19 which guides air suctioned into the inner cover through the suction port to the power supply part in the power supply cover is provided at a space between a side surface of the power supply cover and a side surface of the inner cover.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to an electronic cooling device that utilizes a Peltier element. [Background technology]

[0002] As described in Patent Document 1, an electronic cooling device is known in which a Peltier element power supply unit is placed in the heat absorption space to prevent overheating of the power supply unit without installing a dedicated heat dissipation fan for the power supply unit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2012-195567 A

[0004] Although this structure has made it possible to generally prevent the power supply unit from overheating, there are cases where the airflow around the power supply unit placed in the heat absorption space is impeded, resulting in heat building up around the power supply unit. Considering that the product lifespan is shortened if the electronic board that constitutes the power supply unit overheats, it is preferable to prevent heat from building up around the power supply unit. Summary of the Invention [Problem to be solved by the invention]

[0005] The inventor of the present invention has studied this point diligently and attempted to solve the problem. The problem to be solved by the present invention is to increase the fluidity of air near the power supply unit supported by the power supply cover of the electronic cooling device. [Means for solving the problem]

[0006] In order to solve the above problems, the electronic cooling device includes a Peltier element having heat exchange units on both sides, an inner cover covering the heat exchange unit located on one side of the Peltier element, an outer cover covering the heat exchange unit located on the other side of the Peltier element, an inner fan blowing out air that has flowed into the heat exchange unit located on one side of the Peltier element, an outer fan blowing out air that has flowed into the heat exchange unit located on the other side of the Peltier element, a power supply unit used to drive the Peltier element, the inner fan, and the outer fan, and a power supply cover supporting the power supply unit, wherein the inner cover has an air intake port capable of introducing air near the power supply cover while covering at least a part of the power supply unit and at least a part of the power supply cover, and an air guide section is provided in the space between the side of the power supply cover and the side of the inner cover to guide the air sucked into the inner cover through the air intake port to the power supply unit inside the power supply cover.

[0007] It is also preferable that the power supply cover has a first opening, and the air guide section is provided so as to guide air into the power supply cover through the first opening.

[0008] It is also preferable that the power supply cover has a first opening on its upper surface, and the air guide section is provided so as to guide air to the upper surface of the power supply cover.

[0009] It is also preferable that the power supply cover be provided with a second opening extending from the bottom surface to the front surface. Effect of the Invention

[0010] According to the present invention, it is possible to increase the fluidity of air in the vicinity of a power supply unit supported by a power supply cover of an electronic cooling device. [Brief description of the drawings]

[0011] [Figure 1] 1 is a perspective view of an electronic cooling device according to an embodiment, seen from an outer cover side. [Diagram 2] 2 is a diagram showing an example in which the electronic cooling device shown in FIG. 1 is attached to a box. [Diagram 3]1 is a perspective view of an electronic cooling device according to an embodiment, seen from an inner cover side. [Figure 4] 1 is a vertical cross-sectional view of an electronic cooling device according to an embodiment. [Diagram 5] FIG. 2 is an exploded perspective view of the electronic cooling device according to the embodiment. [Figure 6] 2 is a diagram illustrating a state in which a power supply unit and a power supply cover are removed from a power supply storage case of the electronic cooling device in the embodiment. FIG. [Figure 7] 13 is a diagram showing a part of the inner cover and a power supply cover having an air guide section as viewed from the rear side. FIG. [Figure 8] 8 is a diagram showing a state in which the power supply cover and part of the inner cover shown in FIG. 7 are viewed from slightly obliquely above. [Figure 9] 13 is a diagram showing the power supply cover and a part of the inner cover provided with an air guide section as viewed from the rear side. FIG. [Figure 10] 10 is a diagram showing the power supply cover and part of the inner cover shown in FIG. 9 as viewed from slightly obliquely above. [Figure 11] 13 is a diagram showing an example in which a power supply unit is attached to a power supply cover. FIG. [Figure 12] FIG. 12 is an exploded perspective view of FIG. [Figure 13] 13 is a diagram showing an example in which a power supply unit is attached to a power supply cover having a first opening on a side surface. FIG. [Figure 14] 13 is a diagram showing an example in which a power supply unit is attached to a power supply cover that has a first opening on the top surface and second openings on upper and lower sides. FIG. [Figure 15] 13 is a diagram showing an example in which a power supply unit is attached to a power supply cover that has a first opening on the top surface and a second opening on the lower part of the side surface. FIG. [Figure 16] 13 is a diagram showing an example in which a power supply unit is attached to a power supply cover that has a first opening on the top surface and a second opening that extends from the bottom surface to the front surface. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] An embodiment of the invention will be described below. As can be understood from Fig. 1 to Fig. 5, the electronic cooling device 1 of this embodiment comprises a Peltier element 12 having heat exchangers on both sides, an inner cover 13 covering the heat exchanger located on one side of the Peltier element 12, an outer cover 14 covering the heat exchanger located on the other side of the Peltier element 12, an inner fan 15 blowing out air that has flowed into the heat exchanger located on one side of the Peltier element 12, an outer fan 16 blowing out air that has flowed into the heat exchanger located on the other side of the Peltier element 12, and a fan 17 for blowing out the air that has flowed into the heat exchanger located on the other side of the Peltier element 12. The electronic cooling device 1 includes a power supply unit 17 used to drive the inner fan 15 and the outer fan 16, and a power supply cover 18 that supports the power supply unit 17. The inner cover 13 has an air intake 13a that can introduce air near the power supply cover 18 while covering at least a part of the power supply unit 17 and at least a part of the power supply cover 18, and a wind guide section 19 is provided in the space between the side of the power supply cover 18 and the side of the inner cover 13, for guiding the air sucked into the inner cover 13 through the air intake 13a to the power supply unit 17 in the power supply cover 18. This makes it possible to increase the fluidity of air near the power supply unit 17 supported by the power supply cover 18 of the electronic cooling device 1. The space between the side of the power supply cover 18 and the side of the inner cover 13 means the space between a surface that extends in the direction in which the side portion of the power supply cover 18 extends and a surface that extends in the direction in which the side portion of the inner cover 13 adjacent to the surface extends.

[0013] 1 and 2, the electronic cooling device 1 of the embodiment is attached to a box 8 for use. The box 8 is primarily a box for storing electric and electronic devices, such as a distribution board, a switchboard, a control panel, a high-voltage power receiving facility, or a system rack, but may be something other than a box for storing electric and electronic devices. For example, the electronic cooling device 1 may be attached to a work box in which people work, a delivery box for storing parcels, or the like.

[0014] 3 to 5, the electronic cooling device 1 of the embodiment has box-shaped covers on both sides thereof, and when attached to the box 8, the cover located inside the box 8 is the inner cover 13, and the cover located outside the box 8 is the outer cover 14. The inner cover 13 in the example shown in Fig. 3 is provided so as to be shorter than the outer cover 14 in the up-down and left-right directions.

[0015] When mounting the electronic cooling device 1 in the box 8, a hole slightly larger than the inner cover 13 is made in the box 8, a part of the inner cover 13 is inserted into the hole from outside the box 8, the inside of the partition plate 23 is abutted against the outside of the box 8, and then the partition plate 23 is fixed from inside the box 8 into the mounting hole made in the partition plate 23 with a screw or the like. It is preferable to provide a waterproof packing 24 on the inside of the partition plate 23 to prevent water from entering the internal space.

[0016] The inside of the electronic cooling device 1 of the embodiment is divided into an inner space and an outer space by a partition plate 23. A Peltier module is attached approximately in the center of the partition plate 23. The Peltier module is a Peltier element 12 provided with heat exchangers on both sides.

[0017] In the embodiment, each heat exchanger is a heat sink, is housed in a case, and is fixed to the partition plate 23 with screws. The heat exchanger located on one side of the Peltier element 12 (hereinafter referred to as the "inner heat exchanger 11a") is located in the inner space defined by the inner cover 13, and its outer side abuts against the Peltier element 12. The heat exchanger located on the other side of the Peltier element 12 (hereinafter referred to as the "outer heat exchanger 11b") is located in the outer space defined by the outer cover 14, and its inner side abuts against the Peltier element 12. In the embodiment, the outer heat exchanger 11b is formed larger than the inner heat exchanger 11a in order to enhance the cooling effect.

[0018] In the embodiment, an inner fan 15 is provided at a location located inside the box 8 relative to the inner heat exchanger 11a. The inner fan 15 can blow air that has flowed into the inner heat exchanger 11a from inside the inner cover 13 into the box 8. The inner fan 15 in the embodiment is attached to the case of the inner heat exchanger 11a. The inner cover 13 covering the inner heat exchanger 11a has a hole penetrating the inner fan 15, and in the attached state, the inner fan 15 is exposed to the inside of the box 8 from the hole of the inner cover 13.

[0019] In the embodiment, an outer fan 16 is provided on the outside of the case of the outer heat exchanger 11b. The outer fan 16 in the embodiment is covered by the outer cover 14 together with the outer heat exchanger 11b. Air intake holes 14a are provided on the side of the outer cover 14. These air intake holes 14a are holes for sucking air outside the box 8 into the outer cover 14 by the outer fan 16.

[0020] In order to cool the inside of the box 8, the inner heat exchanger 11a is cooled by the Peltier element 12, while the outer heat exchanger 11b is heated. The outer heat exchanger 11b is cooled by air drawn into the outer cover 14 from the air intake 14a on the side of the outer cover 14. The air heated by cooling the outer heat exchanger 11b is blown out of the outer cover 14 by the outer fan 16. To make this possible, the outer cover 14 is provided with an air vent 14b on the surface facing the outer fan 16. In other words, the air that has flowed into the outer heat exchanger 11b can be blown out of the outer cover 14 by driving the outer fan 16.

[0021] Incidentally, the electronic cooling device 1 includes a power supply unit 17 for driving the Peltier element 12, the inner fan 15, and the outer fan 16. The power supply unit 17 may be located in either the partitioned inner space or the outer space, but in order to improve the waterproofing of the power supply unit 17 with a relatively simple structure, it is preferable to locate it in the inner space.

[0022] Furthermore, in order to reduce the size of the main body of the electronic cooling device 1, the power supply unit 17 may be located across both the inner space and the outer space of the electronic cooling device 1. In this case, for example, the power supply unit 17 is located in an internal space that expands from the inner space of the electronic cooling device 1 toward the outer space.

[0023] In the example shown in Fig. 6, a power supply storage case 25 is provided to protect the power supply unit 17 located in the internal space. The top, sides, back, and bottom of the power supply storage case 25 shown in Fig. 6 are generally located in the external space, but are arranged so that there is a portion that protrudes toward the inner cover 13 side beyond the partition plate 23. The front of the power supply storage case 25 opens toward the internal space.

[0024] When attaching the power supply cover 18 supporting the power supply unit 17 to the electronic cooling device 1, the power supply cover 18 supporting the power supply unit 17 is inserted from an opening provided in the power supply storage case 25, and a fixing operation such as screw tightening is performed using a portion of the side of the power supply storage case 25 that protrudes toward the inner cover 13 side beyond the partition plate 23. At this time, the power supply cover 18 is not entirely stored in the power supply storage case 25, but a portion of it protrudes from the power supply storage case 25, and the protruding portion is covered by the inner cover 13. In other words, the power supply unit 17 and the power supply cover 18 that supports it are arranged to straddle the surface on which the partition plate 23 is located (see Figures 4 and 5).

[0025] The bottom surface of the power supply storage case 25 is provided with an electric wire insertion portion 26 for inserting an electric wire for supplying power from the power supply unit 17 to the outer fan 16. It is preferable to provide a cable gland or the like in the electric wire insertion portion 26 to fix the electric wire and waterproof the inside of the power supply storage case 25 (see FIG. 6).

[0026] Here, we will explain the air flow that occurs inside the electronic cooling device 1. Air intakes are provided on the top and side surfaces of the inner cover 13. These air intakes are holes through which the air inside the box 8 is sucked in by the inner fan 15 and drawn into the inner cover 13.

[0027] 1 to 4, air drawn into the inner cover 13 from the air intake port on the side is cooled by the inner heat exchanger 11a and then blown out into the box 8 by the inner fan 15. Meanwhile, air drawn into the inner cover 13 from the air intake port 13a provided on the top surface moves heated air accumulated around the power supply unit 17 in the power supply cover 18 to the inner heat exchanger 11a, is cooled by the inner heat exchanger 11a, and then blown out into the box 8 by the inner fan 15.

[0028] At this time, if the air sucked into the inner cover 13 from the air intake 13a provided on the top surface can flow to the periphery of the power supply unit 17 in the power supply cover 18, the air around the power supply unit 17 can be circulated, and it is possible to prevent hot air from accumulating around the power supply unit 17. In order to make this possible, in the embodiment, the electronic cooling device 1 is provided with an air guide section 19 that can guide the air sucked into the inner cover 13 from the air intake 13a to the periphery of the power supply unit 17 in the power supply cover 18. More specifically, the air guide section 19 that guides the air sucked into the inner cover 13 through the air intake 13a to the power supply unit 17 in the power supply cover 18 is provided in the space between the side surface of the power supply cover 18 and the side surface of the inner cover 13.

[0029] The air guide section 19 may be provided on any member as long as it can guide the air sucked into the inner cover 13 from the air intake port 13a to the periphery of the power supply section 17 in the power supply cover 18. For example, as can be seen from Figs. 7 and 8, it may be provided on the side of the power supply cover 18, or as can be seen from Figs. 9 and 10, it may be provided on the inner surface of the inner cover 13. In the example shown in Figs. 7 and 8, a plate-shaped air guide section 19 is provided so as to extend obliquely upward from the upper surface of the power supply cover 18, and in the example shown in Figs. 9 and 10, a plate-shaped air guide section 19 extending obliquely downward at a position opposite to the air intake port 13a provided at the upper part of the inner cover 13 is integrally formed with the inner cover 13. Each air guide section 19 is arranged so as to prevent air that has entered the inner cover 13 from the upper side of the air guide section 19 from flowing around directly below the air guide section 19.

[0030] It is preferable to provide air guide section 19 near air intake port 13a. This allows air drawn in from air intake port 13a to be reliably guided to the periphery of power supply unit 17. It is also preferable to provide air guide section 19 near a portion of power supply unit 17 supported by power supply cover 18 where hotter air accumulates. This allows air to circulate around power supply unit 17 more efficiently.

[0031] 11 and 12, the power supply unit 17 is protected by the power supply cover 18, and it is preferable that an opening is provided in the power supply cover 18. The first opening 21 is an opening provided to allow air to enter the power supply cover 18, and it is preferable that the first opening 21 is provided near the periphery of the power supply unit 17. It is also preferable that an air guide unit 19 is provided so as to guide air into the power supply cover 18 through the first opening 21.

[0032] 11, in order to circulate heated air that accumulates around the upper portion of the power supply unit 17 inside the power supply cover 18, a first opening 21 in the form of a through hole is provided on the upper surface of the power supply cover 18. When the first opening 21 is provided on the upper surface of the power supply cover 18, it is preferable that the air guide unit 19 is provided so as to guide air to the upper surface of the power supply cover 18.

[0033] If the purpose is to circulate hot air that accumulates around the sides of the power supply unit 17 inside the power supply cover 18, a first opening 21 may be provided on the side of the power supply cover 18 (see Figure 13).

[0034] The second opening 22 is an opening for discharging air from inside the power supply cover 18, and is preferably provided in a position within the power supply cover 18 close to the inner heat exchanger 11a or the inner fan 15. In the example shown in Fig. 4, the inner heat exchanger 11a and the inner fan 15 are located below the power supply cover 18. In such a case, it is preferable to provide the second opening 22 at least on the bottom surface of the power supply cover 18.

[0035] At this time, in order to more efficiently circulate the heated air that accumulates around the power supply unit 17, it is preferable to provide the second opening 22 not only on the bottom surface of the power supply cover 18 but also in a position extending from the bottom surface to the front surface. For this reason, in the example shown in Fig. 11, the first opening 21 is provided on the top surface of the power supply cover 18, and the second opening 22 is provided in a position extending between the front surface and the bottom surface.

[0036] In order to create an air flow in which air entering through the first opening 21 is exhausted through the second opening 22, it is preferable to avoid providing openings on the side surface of the power supply cover 18 as much as possible. Note that there are no problems with gaps that may occur when bending the side surface of the power supply cover 18 so long as they do not significantly affect the air flow.

[0037] However, if ventilation conditions are met, it is also possible to provide a second opening 22, which is an opening for discharging air from inside the power supply cover 18, on the side surface of the power supply cover 18. For example, as can be seen from Fig. 14, the second opening 22 may be provided on the upper and lower parts of the side surface of the power supply cover 18. Note that in this example, the second opening 22 is not provided on the bottom surface.

[0038] 15, the second opening 22 may be provided in the lower part of the side surface of the power supply cover 18. In this example, the second opening 22 is not provided in the bottom surface.

[0039] 16, the second opening 22 may be provided in the lower part of the side surface of the power supply cover 18 and also in the bottom surface. In this example, the second opening 22 is provided from the bottom surface to the front surface.

[0040] In the embodiment, a drain pan 29 is provided below the inner space to receive condensation water generated when air is cooled by the inner heat exchanger 11a. This allows the condensation water to be collected. When the electronic cooling device 1 is attached to the box 8 for use, it is preferable to provide a drainage path extending from the drain pan 29 to the outside of the box 8.

[0041] The inner cover 13 of the embodiment is provided with a temperature sensor 35 for measuring the temperature inside the box 8. The temperature sensor of the embodiment is connected to the power supply unit 17, and the temperature sensor connected to the power supply unit 17 is led out from the lead-in part 33 of the power supply cover 18 and attached to the inner cover 13.

[0042] 11 is provided with a display unit 31 that can display the temperature inside the panel, the operating states of the Peltier element 12, the inner fan 15, and the outer fan 16, and display abnormalities such as temperature abnormalities inside the box 8, abnormalities in the power supply unit 17, and abnormalities in the Peltier element 12, the inner fan 15, and the outer fan 16. The power supply cover 18 is also provided with a setting unit 32 that can make settings for controlling the driving of the Peltier element 12, the inner fan 15, and the outer fan 16.

[0043] Moreover, the power supply cover 18 of the embodiment is provided with a terminal section 34. The terminal section 34 of the embodiment is provided with a power terminal, an earth terminal, and an alarm output terminal. The power supply terminal can be used as a portion for connecting a power line when power is supplied from the power line to the power supply section 17. Also, a signal line can be connected to the alarm output terminal to output a signal to the outside. For example, a temperature abnormality in the box 8 measured by a temperature sensor, an abnormality in the power supply section 17, or an abnormality in the Peltier element 12, the inner fan 15, or the outer fan 16 can be output to the outside via the signal line.

[0044] In order to allow the display unit 31, the setting unit 32, and the terminal unit 34 provided on the power supply cover 18 to be used even with the inner cover 13 attached, the inner cover 13 is provided with a number of holes. The display unit 31, the setting unit 32, and the terminal unit 34 are exposed to the inside of the box 8 through these holes, so that they can be used even with the inner cover 13 attached.

[0045] Although the present invention has been described above by taking the embodiment as an example, the present invention is not limited to the above embodiment and can be modified in various ways. For example, an air intake port capable of introducing air into the vicinity of the power supply cover can be provided on the upper side of the inner cover. [Explanation of symbols]

[0046] 1 Electronic cooling device 11 Heat exchange section 12 Peltier element 13 Inner cover 14 Outer cover 15 Inner fan 16 Outer Fan 17 Power supply section 18 Power supply cover 19 Airflow section 21 First opening 22 Second opening

Claims

1. A Peltier element having heat exchange portions on both sides; an inner cover for covering a heat exchange portion located on one side of the Peltier element; an outer cover for covering a heat exchange portion located on the other side of the Peltier element; An inner fan that blows out air that has flowed into a heat exchanger located on one side of the Peltier element; an outer fan that blows out air that has flowed into a heat exchanger located on the other side of the Peltier element; A power supply unit used to drive the Peltier element, the inner fan, and the outer fan; a power supply cover for supporting the power supply unit; An electronic cooling device comprising: the inner cover has an air intake port capable of introducing air into the vicinity of the power supply cover while covering at least a part of the power supply unit and at least a part of the power supply cover; a ventilation section is provided in a space between a side surface of the power supply cover and a side surface of the inner cover to guide air drawn into the inner cover through the air intake port to a power supply section in the power supply cover; the power supply cover has a first opening on an upper surface; an electronic cooling device, wherein an air guide section is provided in a space between a side surface of the power supply cover and a side surface of the inner cover at each of both ends of the top surface having the first opening.

2. 2. The electronic cooling device according to claim 1, wherein the power supply cover is provided with a second opening extending from the bottom surface to the front surface.

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