Electronics Assembly

Abstract

To provide an electronic apparatus assembly capable of cooling an inside and suppressing dust and dirt from accumulating on a substrate.SOLUTION: An electronic apparatus assembly includes: a housing having a first opening and a second opening; a fan provided in the second opening of the housing; and one or a plurality of electronic apparatus units. The electronic apparatus unit includes: a substrate; a heat-generation component that generates heat through energization; a closure panel; a cover; a radiator; and a ventilation unit. The closure panel is secured to other end at an opposite side of one end of the substrate. The cover covers all of a first surface of the substrate and all of an edge adjacent to the first surface of the substrate in collaboration with the closure panel. The radiator is provided on the cover. The ventilation unit is provided on the closure panel and formed on an outside of the cover in a position to apply air to the radiator on a path between the fans.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE EMBODIMENTS FIELD OF THE DISCLOSURE The present invention relates to an electronic device assembly. [Background technology]

[0002] For example, Patent Document 1 discloses an electronic device assembly in which a heat sink is mounted on a board, forming one unit, and multiple units are stored in a housing. In one unit of this electronic device assembly, air passes from the bottom to the top of the outside of the heat sink. An air intake is provided between the board and the heat sink. An opening is formed at the top end between the board and the heat sink, and air taken in from the air intake escapes from the opening above the air intake by natural convection. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2001-339187 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide an electronic device assembly capable of cooling the inside and suppressing accumulation of dirt and dust on a board. [Means for solving the problem]

[0005] According to an embodiment, an electronic device assembly includes a housing having a first opening and a second opening, a fan provided in the second opening of the housing to introduce air from the outside of the first opening into the inside of the housing and to exhaust the air inside the housing to the outside of the housing, and one or more electronic device units. The electronic device unit includes a substrate, a heat-generating component that generates heat when energized, a closing panel, a cover, a heat sink, and a first ventilation section. When the substrate is attached to the housing through the first opening, one end of the substrate is close to the fan. The heat-generating component is mounted on a first surface of the substrate. The closing panel is fixed to the other end of the substrate opposite to the one end of the substrate, and is supported by the first opening when the substrate is attached to the housing through the first opening. The cover cooperates with the closing panel to cover the entire first surface of the substrate and the entire edge portion adjacent to the first surface of the substrate. The heat sink is provided in the cover and dissipates heat transferred from the heat-generating component. The first ventilation section is provided in the closing panel and is formed at a position outside the cover where air hits the radiator on the path between the cover and the fan. [Brief description of the drawings]

[0006] [Figure 1] 1 is a schematic perspective view showing a front side of an electronic device assembly according to an embodiment; [Diagram 2] 1 is a schematic perspective view of an electronic device assembly according to an embodiment, seen from above; [Diagram 3] 3 is a schematic cross-sectional view of the electronic device assembly taken along line III-III in FIG. 2. [Figure 4] 1 is a schematic exploded perspective view of a portion of an electronic device unit of an electronic device assembly according to an embodiment; [Diagram 5] 1 is a schematic perspective view of an electronics unit of an electronics assembly according to an embodiment; [Figure 6] 6 is a schematic perspective view of the electronic device unit as viewed from a different direction than that of FIG. 5. [Figure 7] FIG. 7 is a schematic cross-sectional view taken along plane VII-VII in FIG. 5. [Figure 8] 8 is a schematic side view of an electronic device unit of the electronic device assembly as viewed in the direction indicated by arrow VIII in FIG. 5. [Figure 9] 9 is a schematic side view of the electronic device unit as viewed in the direction indicated by the arrow IX in FIGS. 5 and 8. FIG. [Figure 10] 1 is a schematic perspective view of the air flow inside and outside the electronic device assembly according to an embodiment, viewed from above the electronic device assembly. [Figure 11] 1 is a schematic perspective view of the air flow inside and outside the electronic device assembly according to an embodiment, seen from the side of the electronic device assembly. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] 1 to 3 show an electronic device assembly 10 according to the present embodiment. FIG. 1 is a schematic perspective view showing the front side of the electronic device assembly 10. FIG. 2 is a view taken along line II-II in FIG. 3, and can also be considered a schematic perspective view of the electronic device assembly 10 seen from above. FIG. 3 is a schematic cross-sectional view taken along line III-III of the electronic device assembly 10 in FIG. 2.

[0008] FIG. 4 is an exploded perspective view of a part of the electronic device unit 20. FIG. 5 is a schematic perspective view of the electronic device unit 20, looking at the cover 64 and the heat sink 66 side. FIG. 6 is a schematic perspective view of the electronic device unit 20, looking at the board mounting plate 52 side. FIG. 7 is a cross-sectional view taken along the VII plane in FIG. 5. FIG. 8 is a schematic view of the electronic device unit 20 as viewed from the direction indicated by the arrow VIII in FIG. 5. FIG. 9 is a schematic view of the electronic device unit 20 as viewed from the direction indicated by the arrow IX in FIG. 5 and FIG. 8.

[0009] Fig. 10 is a schematic perspective view of the air flows inside and outside the electronic device assembly 10 shown in Fig. 2 as viewed from above the electronic device assembly 10. Fig. 11 is a schematic perspective view of the air flows inside and outside the electronic device assembly 10 shown in Fig. 3 as viewed from the side of the electronic device assembly 10.

[0010] 1 to 11 are communication devices, various control devices, etc. The electronic device assembly 10 includes a housing 12, a fan 14 provided in the housing 12, a motherboard substrate 16 fixed to the housing 12, a first connector 18 provided on the motherboard substrate 16, and one or more electronic device units 20 electrically connectable to and detachable from the first connector 18.

[0011] As shown in FIG. 1 to FIG. 3, the housing 12 is cylindrical, for example, rectangular. The housing 12 has, for example, an upper plate 12a, a lower plate 12b, and a pair of side plates 12c, 12d between the upper plate 12a and the lower plate 12b. The upper plate 12a and the lower plate 12b are formed, for example, in plate shapes of the same shape and size. The pair of side plates 12c, 12d are formed, for example, in plate shapes of the same shape and size. The housing 12 has a front opening (first opening) 13a and a rear opening (second opening) 13b by the upper plate 12a, the lower plate 12b, and the pair of side plates 12c, 12d. It is preferable that the front opening 13a and the rear opening 13b are aligned along one axis. In this embodiment, the one axis is set so as not to pass through the upper plate 12a, the lower plate 12b, and the pair of side plates 12c and 12d. It is preferable that the one axis is parallel to the inner surfaces of the upper plate 12a, the lower plate 12b, and the pair of side plates 12c and 12d, but deviation is allowed.

[0012] In this embodiment, as shown in FIG. 2, an example will be described in which the housing 12 has seven slots 30 in which seven electronic device units 20 can be arranged in parallel. The number of slots 30 can be set appropriately. In this embodiment, the slot 30 has a rail 30a provided on at least one of the upper plate 12a and the lower plate 12b of the housing 12. The rail 30a supports, for example, upper and lower edge portions (remaining ends different from the one end portion 55a and the other end portion 55b) 55c, 55d of the board mounting plate 52. The outer surface of the board mounting plate 52 is supported in parallel by, for example, a pair of side plates 12c, 12d.

[0013] A fan 14 for forced cooling is fixed to an opening 13b on the rear side of the housing 12. When the fan 14 is driven, it draws air outside the housing 12 into the inside of the housing 12 and expels air inside the housing 12 to the outside of the housing 12. In Fig. 2, two fans 14 are arranged side by side. There may be one fan 14, or three or more fans 14.

[0014] The motherboard substrate 16 is provided between the opening 13a on the front side and the opening 13b on the rear side of the housing 12. The motherboard substrate 16 extends in a position facing the fan 14 within the housing 12 so as to form a gap between the motherboard substrate 16 and the housing 12. The motherboard substrate 16 is supported by, for example, each of the pair of side plates 12c and 12d. In this embodiment, as an example, the motherboard substrate 16 is covered by a plate-shaped cover 17 made of, for example, an aluminum alloy material. The cover 17 covers the entire front and rear sides of the motherboard substrate 16. In this embodiment, the cover 17 forms a gap between the cover 17 and the upper plate 12a of the housing 12 and between the cover 17 and the lower plate 12b. The cover 17 is supported by, for example, each of the pair of side plates 12c and 12d.

[0015] The first connector 18 is provided on the motherboard substrate 16. The first connector 18 is exposed to the outside through a cutout portion of the cover 17. In FIG. 2, an example in which the first connector 18 does not protrude to the outside of the cover 17 is shown, but the first connector 18 may protrude to the outside of the cover 17.

[0016] 1, the electronic device assembly 10 has a power supply unit 42, a wireless unit 44, and a communication control unit 46 as an example of an electronic device unit 20. The power supply unit 42, the wireless unit 44, and the communication control unit 46 are inserted into a slot 30 of the housing 12 through a first opening 13a on the front side of the housing 12 and mounted therein. In this embodiment, the communication control unit 46 will be described as a representative example of the electronic device unit 20.

[0017] As shown in Figures 4 to 9, the electronic equipment unit 20 has, for example, a substantially rectangular board mounting plate 52, for example, a substantially rectangular board 54, a second connector 56, a heat-generating component 58 that generates heat when electricity is passed through it, a heat transfer member 60, a blocking panel 62, a cover 64, a heat sink 66, a first ventilation section 68, and a second ventilation section 70.

[0018] The board mounting plate 52, the heat transfer member 60, the cover 64, and the heat sink 66 are made of a material with high thermal conductivity, such as an aluminum alloy. In other words, the board mounting plate 52, the heat transfer member 60, the cover 64, and the heat sink 66 are made of a material that dissipates heat transferred from the heat-generating components 58.

[0019] The board mounting plate 52 and the board 54 are formed, for example, in a substantially rectangular shape. The short and long sides of the board mounting plate 52 are formed to be larger than the short and long sides of the board 54. The board 54 is attached to the board mounting plate 52. When looking at the board mounting plate 52, the outer edge of the board 54 is located inside the outer edge of the board mounting plate 52.

[0020] A second connector 56 is provided on one end 55a, which is one of the four sides of the substrate 54. The second connector 56 is detachable from the first connector 18. When the substrate 54 is attached to the housing 12, the second connector 56 is electrically connected to the first connector 18. When the electronic device unit 20 is removed from the housing 12, the second connector 56 is electrically separated from the first connector 18. The second connector 56 electrically connects the heat-generating component 58 and electronic components 72, 74, and 76 (described later) to the motherboard substrate 16.

[0021] The substrate 54 has a first surface 54a and a second surface 54b. A heat-generating component 58 that generates heat when powered is mounted on the first surface 54a. An example of the heat-generating component 58 is a power supply device such as an FPGA or a CPU.

[0022] As shown in Fig. 4, electronic components 72, 74 other than the heat-generating component 58 are mounted on the first surface 54a. As shown in Fig. 7, electronic components 76 other than the heat-generating component 58 are mounted on the second surface 54b. These electronic components 72, 74, 76 are formed as electronic devices necessary for appropriate communication when the electronic device assembly 10 is used as a communication device.

[0023] 4, the heat transfer member 60 is formed, for example, as a block-shaped member (heat transfer block) and is fixed on the first surface 54a side of the substrate 54. As shown in Fig. 4 and Fig. 7, the heat transfer member 60 cooperates with the first surface 54a of the substrate 54 to sandwich the heat generating component 58. Therefore, the heat transfer member 60 comes into contact with the heat generating component 58.

[0024] The heat transfer member 60 may be fixed to the cover 64 or the heat sink 66 .

[0025] As shown in Fig. 4, a closure panel 62 is fixed to one end 55a of the substrate 54 and the other end 55b opposite thereto. As shown in Figs. 4 and 9, the closure panel 62 is provided with connection terminals 72a, 74a to which various cables are connected. The length of the closure panel 62 in the longitudinal direction is longer than the length of the other end 55b of the substrate 54. When viewed from the front side of the electronic device assembly 10, the closure panel 62 covers the entire other end 55b of the substrate 54.

[0026] For example, the end face 64a of the cover 64 abuts against or is close to the back surface 62a of the closure panel 62. As shown in Figures 8 and 9, three end faces 64a of the cover 64 abut against or are close to the back surface 62a of the closure panel 62. It is preferable that the end faces 64a of the cover 64 are formed so that there is no or almost no gap between the back surface 62a of the closure panel 62 and the cover 64.

[0027] In this embodiment, the cover 64 cooperates with the closure panel 62 to cover the entire first surface 54a of the substrate 54. The cover 64 has an end surface 64b formed by bending three sides of an aluminum alloy plate. The cover 64 is formed with a cutout portion 64c that is partially cut out so that the connection position of the second connector 56 with the first connector 18 is exposed.

[0028] In this embodiment, in order to store some of the electronic components 72 while keeping the height of the cover 64 as low as possible, a substantially U-shaped cutout portion 64d is formed in a part of the cover 64. A lid member 65 is fixed to the cutout portion 64d.

[0029] The cover 64 is provided on the substrate mounting plate 52 and fixed by, for example, screws 80a to a rod-shaped spacer 80 that penetrates the substrate 54. At this time, an end surface 64b of the cover 64 abuts against the surface of the substrate mounting plate 52 that faces the second surface 54b of the substrate 54.

[0030] The heat sink 66 is fixed to the cover 64. The heat sink 66 has a plurality of fins 66a to maximize the contact area with the air. The heat generating components 58 that need to be cooled transfer heat to the heat sink 66. For this reason, the heat sink 66 is provided on the cover 64 and dissipates the heat transferred from the heat generating components 58 to the outside of the electronic device unit 20.

[0031] The first ventilation section 68 is provided on the closure panel 62. The first ventilation section 68 is formed as a through hole, and is formed in a size and shape that does not allow a cylindrical rod with a diameter of 12 mm to pass through. In this embodiment, the first ventilation section 68 is formed of rectangular holes with a few millimeters square arranged in two rows, for example. It is preferable that the first ventilation section 68 is divided into a plurality of sections in the longitudinal direction. The first ventilation section 68 is formed at a position where the air flows into the inside of the housing 12 by driving the fan 14, and hits the heat sink 66 on the path between the fan 14 and the first ventilation section 68 on the outside of the cover 64 (the side opposite to the side facing the first surface 54a of the board 54). The fins 66a of the heat sink 66 are formed at a position that can be seen, for example, at the back side of the first ventilation section 68 through the first ventilation section 68 when the electronic device assembly 10 is viewed from the front side.

[0032] The second ventilation section 70 is provided in the closure panel 62. The second ventilation section 70 is formed as a through hole, and is formed in a size and shape that does not allow a cylindrical rod with a diameter of 12 mm to pass through. In this embodiment, the second ventilation section 70 is formed with rectangular holes of several millimeters square, for example, in a row. It is preferable that the second ventilation section 70 is divided into a plurality of sections in the longitudinal direction. The second ventilation section 70 is formed at a position where the air flows into the inside of the housing 12 by driving the fan 14, and hits the air on the path between the fan 14 and the outside of the board mounting plate 52 (the side opposite to the side facing the second surface 54b of the board 54).

[0033] Then, the second connector 56 of the electronic device unit 20 is fitted into the first connector 18 of the motherboard substrate 16, whereby the substrate 54 of the electronic device unit 20 and the motherboard substrate 16 are electrically connected.

[0034] In this embodiment, the communication control unit 46 has the second connector 56. The power supply unit 42 and the wireless unit 44 may not have the second connector 56, and may be electrically connected to the communication control unit 46 by wiring formed in the housing 12. In this case, even if the power supply unit 42 and the wireless unit 44 do not have the second connector 56 that connects to the motherboard substrate 16, the power supply unit 42 and the wireless unit 44 are electrically connected to the motherboard substrate 16 via the second connector 56 of the communication control unit 46.

[0035] A board mounting plate 52 is disposed on the second surface 54b side of the board 54, and a closing panel 62 is disposed on the other end 55b on the front side of the board 54. Therefore, two surfaces of the board 54 (the second surface 54b and the surface of the other end 55b) are closed by the board mounting plate 52, the closing panel 62, and the cover 64.

[0036] Also, the cover 64, which has three sides facing the first surface (front surface) 54a of the substrate 54 bent, covers the entire first surface 54a of the substrate 54 and the entire edge portion adjacent to the first surface 54a via the spacer 80. Therefore, the remaining four surfaces of the substrate 54 (the surface facing the first surface 54a of the cover 64 and the remaining three end surfaces) are covered by the cover 64.

[0037] Therefore, the electronic equipment unit 20 is formed in a box shape in which the board mounting plate 52, the closing panel 62, and the cover 64 as a whole close off the entire board 54.

[0038] The operation of the electronic device assembly 10 according to this embodiment will be described below. Here, the operation of the electronic device assembly 10 with respect to cooling will be described.

[0039] The housing 12 of the electronic device assembly 10 according to the present embodiment is placed indoors or outdoors, for example, in a place with a roof. Then, the plurality of pre-assembled electronic device units 20, i.e., the power supply unit 42, the wireless unit 44, and the communication control unit 46, are inserted into the plurality of slots 30 of the housing 12 of the electronic device assembly 10. In this manner, when the electronic device unit 20 is attached to the housing 12 through the first opening 13a, one end of the board 54 approaches the fan 14. When the board 54 is attached to the housing 12, the second connector 56 provided at one end of the board 54 is electrically connected to the first connector 18. When the electronic device unit 20 is attached to the slot 30 of the housing 12 through the first opening 13a, the blocking panel 62 is supported by the first opening 13a. Therefore, the electronic device assembly 10 can be maintained at the installation site of the housing 12.

[0040] The slots 30 of the housing 12 may be empty. In this case, for example, a flat plate can be fixed around the empty slots 30 to close the empty slots 30 and prevent dirt and dust from entering the housing 12.

[0041] It should be noted that electronics assembly 10 may be preassembled prior to installation in its appropriate location.

[0042] After the electronics assembly 10 is properly assembled, each electronics unit 20 of the electronics assembly 10 is energized and the fan 14 is rotated. When each electronics unit 20 of the electronics assembly 10 is energized, the fan 14 continues to rotate.

[0043] Fig. 10 shows an image of air flow in a horizontal cross section of the electronic device assembly 10, and Fig. 11 shows an image of air flow in a vertical cross section of the electronic device assembly 10. Outside air enters through ventilation sections 68, 70 of the closing panel 62 by the fan 14 on the rear side of the electronic device assembly 10, passes through a heat sink 66 provided on the outside of the cover 64 that covers the board 54, and is exhausted from the fan 14 on the rear side of the electronic device assembly 10. The outside air passes through the heat sink 66 to cool the heat-generating components 58 on the board 54.

[0044] In the electronic device assembly 10, air is introduced into the housing 12 through the first ventilation section 68 as a first flow path, and is exhausted by the fan 14 through the heat sink 66 and the upper or lower side of the motherboard substrate 16. At this time, heat from the heat-generating component 58 continues to be directly transferred to the heat transfer member 60 in contact with the heat-generating component 58, and also continues to be transferred to the heat sink 66 in contact with the heat transfer member 60. Therefore, the heat sink 66 continues to be cooled by the air that continues to pass through the first flow path. Therefore, the heat generated from the heat-generating component 58 continues to be cooled by heat transfer.

[0045] The heat generated from the heat-generating component 58 is not only transferred to the heat sink 66 in contact with the heat transfer member 60, but also to the cover 64 that fixes the heat sink 66. Therefore, the air passing through the first flow path cools the cover 64 as well as the heat sink 66. Since the heat generated from the heat-generating component 58 is transferred not only to the heat sink 66 but also to the cover 64, the heat generated from the heat-generating component 58 is cooled more efficiently by heat transfer.

[0046] Lid member 65 fixed to cover 64 is made of the same material as cover 64, and increases the contact area with the air passing through the first flow path. Therefore, lid member 65 fixed to cover 64 more efficiently cools the heat generated from heat-generating component 58.

[0047] At a position adjacent to the first ventilation section 68, the end surface 64a of the cover 64 abuts or is close to the surface of the closing panel 62. Therefore, even if the surface of the closing panel 62 and the end surface 64a of the cover 64 are not airtightly formed at a position adjacent to the first ventilation section 68, the presence of a gap is minimized. Even if the air that flows into the housing 12 through the first ventilation section 68 heads toward the boundary between the closing panel 62 and the cover 64, there is no or almost no gap between them, and the air heads toward the radiator 66 provided outside the cover 64. That is, the gap between the cover 64 and the closing panel 62 is formed so that the air that flows in from the first ventilation section 68 passes through the outside of the cover 64 and then passes through the fan 14. In this way, the electronic device unit 20 suppresses the air that has passed through the first ventilation section 68 from entering the cover 64, and suppresses the intrusion of dust and dirt between the board 54 and the cover 64, for example. Therefore, the electronic device unit 20 suppresses the accumulation of dirt and dust on the board 54, for example.

[0048] The cover 64 is formed in a shape that conforms to the insulating outer shell of the second connector 56, and the cutout portion 64c of the cover 64 abuts against or is close to the outer shell of the second connector 56. Therefore, the presence of a gap between the cutout portion 64c of the cover 64 and the second connector 56 is minimized. This prevents air that has passed through the first ventilation portion 68 from entering the cover 64, and prevents, for example, dust and dirt from entering between the board 54 and the cover 64. Therefore, the electronic device unit 20 prevents, for example, dust and dirt from accumulating on the board 54.

[0049] As described above, the presence of a gap between the notch 64c of the cover 64 and the outer shell of the second connector 56 is minimized. Therefore, even if the fan 14 stops or air flows from the fan 14 toward the first ventilation section 68 due to the influence of the atmospheric pressure outside the electronic device assembly 10, the air passing through the fan 14 is prevented from entering the cover 64, and for example, dust and dirt are prevented from entering between the board 54 and the cover 64. Therefore, the electronic device unit 20 prevents dust and dirt from accumulating on the board 54, for example.

[0050] In the electronic device assembly 10, air is introduced into the housing 12 through the second ventilation section 70 as a second flow path, and is exhausted by the fan 14 through the board mounting plate 52 and the upper or lower side of the motherboard substrate 16. At this time, the outside of the board mounting plate 52 (the outside of the electronic device unit 20) is cooled by the air passing through the second flow path.

[0051] An end face 64b of the cover 64 abuts or is close to the surface of the board mounting plate 52 facing the second surface 54b of the board 54. Therefore, heat from the heat-generating components 58 is transferred to the board mounting plate 52 through the heat transfer member 60, the heat sink 66, and the cover 64. Therefore, the board mounting plate 52 is cooled by the air passing through the second flow path. Therefore, the heat generated from the heat-generating components 58 is transferred not only to the heat sink 66 but also to the board mounting plate 52 through the cover 64, so that the heat generated from the heat-generating components 58 is cooled more efficiently by heat transfer.

[0052] Furthermore, the presence of a gap between the surface of the board mounting plate 52 and the end surface 64b of the cover 64 is minimized at a position adjacent to the second ventilation section 70. This prevents air that has passed through the second ventilation section 70 from entering between the board mounting plate 52 and the cover 64, thereby preventing dust and dirt from entering between the board 54 and the cover 64, or between the board 54 and the board mounting plate 52. Therefore, the electronic device assembly 10 according to this embodiment prevents dust and dirt from accumulating on the board 54 of the electronic device unit 20, for example.

[0053] In this way, in the electronic device unit 20, the board mounting plate 52, the closing panel 62, and the cover 64 are collectively formed into a box shape that completely closes the board 54. Meanwhile, heat from the heat-generating components 58 is dissipated through the heat transfer member 60, the cover 64, the heat sink 66, and the board mounting plate 52. In addition, since the cover 64 and the board mounting plate 52 also abut against the closing panel 62, heat from the heat-generating components 58 is also dissipated from the closing panel 62 exposed to the outside of the electronic device assembly 10. Therefore, the electronic device assembly 10 according to this embodiment is effectively cooled.

[0054] In the electronic device assembly 10 according to the present embodiment, a board mounting plate 52, a board 54, a heat generating component 58, and electronic components 72, 74 are combined into a module to form one electronic device unit 20, which is inserted and mounted through a first opening 13a on the front surface of the housing 12 and fitted to a motherboard substrate 16 formed in the housing 12 by a connector, and the heat generating component 58 and the electronic components 72, 74 are electrically connected to the motherboard substrate 16. In the electronic device assembly 10, the entire board 54 of each electronic device unit 20 is covered with a cover 64 in the housing 12. Air forced for cooling by the fan 14 does not hit the board 54 of the electronic device unit 20 through a first ventilation section 68 and a second ventilation section 70 provided in a closing panel 62 on the front surface of the electronic device unit 20.

[0055] With such a structure, the electronic device unit 20 prevents dirt, dust, and the like from entering the board 54. Therefore, the electronic device assembly 10 according to the present embodiment does not require consideration of dust and dirt entering the electronic device unit 20. Therefore, the electronic device assembly 10 does not require the attachment of filters to both the first ventilation section 68 and the second ventilation section 70. Therefore, by using the electronic device assembly 10, it is not necessary to periodically clean the clogged filters. Therefore, the electronic device assembly 10 according to the present embodiment can reduce the number of maintenance operations. And, by not attaching filters to both the first ventilation section 68 and the second ventilation section 70, the filters do not become clogged, so that it is possible to suppress a decrease in the amount of air flowing into the housing 12 by the fan 14. Moreover, the electronic device assembly 10 according to the present embodiment does not reduce the amount of air flowing in due to filter clogging, and the cooling efficiency remains unchanged, that is, it is possible to prevent a decrease in the cooling efficiency, and the quality of the device is improved.

[0056] Therefore, according to this embodiment, it is possible to provide an electronic device assembly 10 that is capable of cooling the inside and that prevents dirt and dust from accumulating on the board 54.

[0057] Further, the electronic device unit 20 mounted in the housing 12 is entirely covered with a plate-shaped cover (metal fitting) 64 made of, for example, aluminum material, and the motherboard substrate 16 is entirely covered with a plate-shaped cover (metal fitting) 64 made of, for example, aluminum material. In the case of this embodiment, dust also enters the housing 12 together with the outside air from the ventilation parts 68, 70 of the closing panel 62. However, in the electronic device assembly 10, even if dust or dirt enters the housing 12, the electronic device unit 20 is covered with metal sheets (substrate mounting plate 52, closing panel 62, and cover 64), so that the dust or dirt can be prevented from adhering to the substrate 54 and tracking can be prevented from occurring on the substrate 54. Furthermore, the motherboard substrate 16 is covered with a cover 17, so that the dust or dirt can be prevented from adhering to the motherboard substrate 16 and tracking can be prevented from occurring on the motherboard substrate 16. Therefore, the electronic device assembly 10 according to this embodiment can improve the quality of the device.

[0058] In the present embodiment, an example has been described in which the communication control unit 46 has the second connector 56, and the power supply unit 42 and the wireless unit 44 do not have the second connector 56. In this case, it is not necessary to form the cutout portion 64c in the cover 64 of the power supply unit 42 and the wireless unit 44 as the electronic device unit 20. That is, the power supply unit 42 and the wireless unit 44 can cover the first surface 54a side and the end faces other than the closing panel 62 with the cover 64 having three sides folded. On the other hand, it is also preferable that, in the electronic device unit 20, not only the communication control unit 46 but also the power supply unit 42 and the wireless unit 44 each have a second connector 56. In this case, the motherboard substrate 16 is provided with a first connector 18 so as to be electrically connected to each of the second connectors 56.

[0059] In the present embodiment, an example has been described in which the first surface 54a and the second surface 54b and the ends 55a, 55b, 55c, and 55d of the substrate 54 are covered with the substrate mounting plate 52, the closing panel 62, and the cover 64. For example, the cover 64 may be formed in a cylindrical shape with a bottom, and the open end of the cylindrical cover 64 with a bottom may abut against the closing panel 62, thereby making the substrate mounting plate 52 unnecessary. In this case, it is sufficient that the cover 64 and the substrate 54 are fixed together.

[0060] 1 to 3, an example in which the pair of side panels 12c, 12d and the board mounting plate 52 of the electronic device unit 20 are parallel to each other has been described, but the upper panel 12a and the lower panel 12b may be formed to be parallel to the board mounting plate 52 of the electronic device unit 20. In this case, the slot 30 has a rail 30a provided on at least one of the pair of side panels 12c, 12d of the housing 12. The shapes of the blocking panel 62, the first ventilation section 68, and the second ventilation section 70 are also formed to match the slot 30.

[0061] According to at least one of the embodiments described above, it is possible to provide an electronic device assembly 10 that is capable of cooling the inside and suppresses accumulation of dirt and dust on the board 54.

[0062] Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0063] 10...electronic device assembly, 12...housing, 13a...first opening, 13b...second opening, 14...fan, 16...motherboard board, 17...cover, 18...first connector, 20...electronic device unit, 42...power supply section, 44...wireless section, 46...communication control section, 52...board mounting plate, 54...board, 54a...first surface, 54b...second surface, 55a...one end, 55b...other end, 56...second connector, 58...heat generating component, 60...heat transfer member, 62...closure panel, 64...cover, 64a, 64b...end surface, 66...heat sink, 68...first ventilation section, 70...second ventilation section

Claims

1. a housing having a first opening and a second opening; a fan that is provided in the second opening of the housing and that, when driven, causes air to flow from the outside of the first opening to the inside of the housing and discharges the air inside the housing to the outside of the housing; a substrate, one end of which is adjacent to the fan when the substrate is attached to the housing through the first opening; a heat generating component mounted on a first surface of the substrate and generating heat when energized; a closure panel fixed to the other end of the substrate opposite to the one end and supported by the first opening when the substrate is attached to the housing through the first opening; a cover that cooperates with the closure panel to cover the entire first surface of the base plate and the entire edge of the base plate adjacent the first surface; a heat sink provided on the cover for radiating heat transferred from the heat generating component; and a first ventilation section provided on the closing panel, configured to cause the air to flow into the inside of the housing by driving the fan, and configured to hit the air against the radiator on a path between the fan and the outside of the cover; one or more electronics units having 1. An electronic device assembly comprising:

2. The electronics unit comprises: The electronic device assembly of claim 1 , further comprising a board mounting plate to which the board is attached, facing a second surface opposite the first surface, and cooperating with the cover to cover the entire second surface of the board.

3. The electronics unit comprises: one or more electronic components fixed to the second surface of the substrate; a second ventilation section provided on the closure panel, the second ventilation section being formed at a position where, by driving the fan, the air flows into the inside of the housing and hits the outside of the board mounting plate on a path between the fan and the second ventilation section; The electronic device assembly of claim 2 , comprising:

4. The electronic device assembly according to claim 3 , wherein the board mounting plate, the closing panel, and the cover are collectively formed into a box shape that completely closes the board.

5. 5. The electronic device assembly according to claim 1, wherein the electronic device unit has a heat transfer member in contact with the heat generating component and the cover or the heat sink, for transferring heat from the heat generating component to the heat sink.

6. a motherboard substrate extending within the housing at a position facing the fan so as to form a gap between the motherboard substrate and the housing; a first connector provided on the motherboard; having the electronic device unit has a second connector provided at the one end of the board and electrically connected to the first connector when the board is attached to the housing; 6. The electronic device assembly according to claim 1, wherein the cover exposes a connection terminal of the second connector that is to be connected to the first connector and is formed into a shape that conforms to an outer shell of the second connector.

7. The electronic device assembly according to claim 6 , wherein the cover has a cutout portion that exposes the connection terminal of the second connector to the outside.

8. The electronic device assembly according to claim 1 , wherein the cover is made of a material that dissipates heat transferred from the heat-generating component.

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