Modular micro-nano satellite integrated power system suitable for batch production and assembly method thereof

Abstract

The invention discloses a modular micro-nano satellite integrated power system suitable for batch production and an assembly method thereof. The integrated power system is composed of a semi-open type electric box structure and a modular circuit board. The electricity box structure comprises an electricity box upper cover and an electricity box lower cover, and a plurality of threaded holes are formed in the two sides of the electricity box upper cover and the two sides of the electricity box lower cover and used for being connected with a satellite structure cabin plate; the heat dissipation plate bodies are distributed on the two sides of the modular circuit board; the modularized circuit board is provided with a plurality of circuit boards which are respectively provided with electronic modules in a stacking arrangement. A plurality of electronic modules are integrated into an electronic system by adopting a mechanical-electrical-thermal integrated design method, the system breaks through the function limit of a traditional satellite subsystem, the defects of information exclusion and resource waste are eliminated, a satellite is used as a whole to be subjected to unified design and resource planning tradeoff from the system level, and the system performance is improved. The weight of cables and connectors between electronic modules is greatly reduced, and the effective load ratio is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of aerospace satellites, and in particular to a modular micro-nano satellite integrated electrical system suitable for mass production and its assembly method. Background Art

[0002] In recent years, with the rapid development of commercial aerospace, technologies such as micro-devices and components, integration, modular multi-functional structures, and integrated comprehensive electronics have been widely applied in the design of micro-nano satellites. The design of micro-nano satellites is developing rapidly towards high integration and high functional density.

[0003] Traditional satellites are mostly divided into several subsystems according to functions, and each subsystem independently designs single-machine modules, such as the attitude and orbit control subsystem, the measurement and control data transmission subsystem, etc. The characteristics of such satellite design schemes are that the interfaces between systems and the wiring relationships between boards are complex, the integration degree of the electronic system is low, the general ability is weak, there are many cables, the weight is heavy, and the reliability is low, resulting in large satellite mass, large volume, high cost, and long development cycle. This design mode has been difficult to meet the development needs of low-cost, rapid mass production of micro-nano satellites. Traditional satellite electrical boxes adopt a fully enclosed structure (such as CN217957558U), resulting in a long heat dissipation path (thermal resistance ≥ 1.5 K / W) and a large weight (≥ 1.8 kg); while the modular stacking structure (such as CN109041501B) relies on positioning grooves and cannot solve the problems of uneven heat conduction and modular circuit board assembly stress caused by tolerance accumulation (error ≥ 0.3 mm).

[0004] Based on the above technical problems, those skilled in the art urgently need to develop a modular micro-nano satellite integrated electrical system suitable for mass production and its assembly method, which can realize the highly integrated integration of the micro-nano satellite integrated electrical box, and at the same time take into account the modular and standardized function expansion task requirements of multiple models of micro-nano satellites, and is suitable for the rapid batch networking of micro-nano satellites. Summary of the Invention

[0005] The purpose of the present invention is to provide a modular micro-nano satellite integrated electrical system suitable for mass production and its assembly method, which can realize the highly integrated integration of the micro-nano satellite integrated electrical box, and at the same time take into account the modular and standardized function expansion task requirements of multiple models of micro-nano satellites, and is suitable for the rapid batch networking of micro-nano satellites.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] The modular micro-nano satellite integrated electrical system suitable for mass production of the present invention is composed of a semi-open electrical box structure and modular circuit boards; wherein,

[0008] The electric box structure includes an upper electric box cover and a lower electric box cover. The modular circuit board is located between the upper electric box cover and the lower electric box cover. Multiple threaded holes are provided on both sides of the upper electric box cover and both sides of the lower electric box cover for connecting the satellite structure cabin plates; and

[0009] Heat dissipation plate bodies distributed on both sides of the modular circuit board, and the heat dissipation plate bodies are in contact with the satellite structure plate bodies;

[0010] The modular circuit board has multiple circuit boards, and the electronic modules are stacked and arranged according to the power consumption levels respectively. Each circuit board is connected to the heat dissipation plate body.

[0011] Preferably, the heat dissipation plate body is provided with a heat conduction concave structure matching the circuit board. The depth of the heat conduction concave structure is 2 ± 0.1 mm, and the heat conduction concave structure is filled with a heat conduction material inside;

[0012] And the circuit board and the heat dissipation plate body are provided with coaxial connection holes. The external hexagon bolt is inserted downward from the upper end of the upper electric box cover through the circuit board and the heat dissipation plate body, and is connected and fixed through a fastening nut from the bottom of the lower electric box cover.

[0013] Preferably, a heat dissipation surface is formed on the heat dissipation plate body, and the heat of the circuit board is transferred to the heat dissipation surface;

[0014] The heat dissipation surface is provided with heat conduction belt through holes, and a flexible heat conduction belt is embedded in the heat conduction belt through holes.

[0015] Preferably, the electric box structure is made of aluminum alloy material, the thickness of its main heat dissipation surface is 0.8 mm ± 0.1 mm, the total weight ≤ 1.2 kg, and the lower electric box cover is integrated with satellite payload installation interfaces;

[0016] T-shaped reinforcing rib networks are provided on the inner sides of the upper electric box cover and the lower electric box cover. The ratio of the height of the rib strips to the thickness of the heat dissipation surface is 1:3, forming multi-level force transmission and heat transfer paths.

[0017] Preferably, the flexible heat conduction belt is made of graphene composite material, with a thickness of 1 mm ± 0.1 mm and a thermal conductivity ≥ 1500 W / m·K, and is fixed in the heat conduction belt through holes by gluing.

[0018] Furthermore, the modular circuit board includes a power controller circuit board arranged from bottom to top, on which a power controller module is arranged;

[0019] A navigation circuit board, on which a navigation module is arranged;

[0020] A flywheel circuit board, on which a flywheel control module is arranged;

[0021] The central computer circuit board, on which a central computer module is arranged;

[0022] The power lower computer, on which a power lower computer module is arranged;

[0023] The power distribution and thermal control circuit board, on which a power distribution and thermal control module is arranged;

[0024] The measurement and control data transmission integrated machine, on which a measurement and control data transmission module is arranged;

[0025] The power controller circuit board, the navigation circuit board, the flywheel circuit board, the central computer circuit board, the power lower computer, the power distribution and thermal control circuit board, and the measurement and control data transmission integrated machine are stacked in a string and signal interconnection is realized through board-to-board connectors.

[0026] The assembly method of the modular micro-nano satellite integrated power system suitable for mass production according to the present invention, the assembly method includes the following steps:

[0027] S1, pre-treatment before thermal control electrical installation;

[0028] S2, stack and plug all the circuit boards according to the board sequence and board spacing to realize signal interconnection;

[0029] S3, evenly fill the heat-conducting concave structure with heat-conducting materials;

[0030] S4, insert the heat dissipation plate bodies on both sides into the two ends of the circuit board in an opposing manner, and the flexible heat-conducting belt passes through the through holes of the heat-conducting belt;

[0031] S5, install the upper cover and lower cover of the electrical box;

[0032] S6, sequentially pass four groups of external hexagon bolts through the upper cover of the electrical box, the heat dissipation plate body, the modular circuit board, and the lower cover of the electrical box, and install four groups of fastening nuts, applying a standard torque.

[0033] Further, the pre-treatment before thermal control electrical installation is specifically that the thermal control firmly pastes the temperature measurement points and heating tapes that need to be pasted on each circuit board in advance, and the GD414 silicone rubber is left to cure statically, and the electrical installation brushes the three-proof treatment on the electronic components on the circuit board in advance.

[0034] Further, in the step S6, the tightening torque of the external hexagon bolts is 0.8 - 1.2 N·m and is applied in stages.

[0035] In the above technical solution, the modular micro-nano satellite integrated power system suitable for mass production and its assembly method provided by the present invention have the following beneficial effects:

[0036] The integrated power system for modular micro-nano satellites suitable for mass production and its assembly method of the present invention adopt a semi-open structural form, which is suitable for micro-nano satellites with relatively low requirements for electromagnetic shielding. By using an electromechanical-thermal integration design method, multiple electronics modules are integrated into an electronics system. This integrated system breaks the functional boundaries of traditional satellite subsystems, eliminates the drawbacks of information exclusivity and resource waste, and no longer decomposes various functions of the satellite to each subsystem and realizes them by corresponding single machines. Instead, the satellite is designed and resource-planned and weighed as a whole from the system level, reducing the disadvantages of too many computer levels in the original subsystems and low processing efficiency due to the need for step-by-step distribution and processing of information transmission, greatly reducing the weight of cables and connectors between electronics modules and increasing the payload ratio.

[0037] Compared with the traditional fully enclosed electrical box, the semi-enclosed electrical box structure of the present invention is lighter in weight and has fewer parts. There are only four main load-bearing modules. The integrated power system with integrated design has fewer parts, a simple structure, a short processing cycle, and is easy to assemble quickly in batches, which can effectively improve the function density of the satellite, greatly reduce the development cost, and shorten the development cycle. At the same time, it solves the problems brought by the high function density and low thermal inertia of high-resolution compact operational cubesats to the thermal control of the whole satellite. Through the integrated co-structure design, the payload ratio of compact cubesats is greatly improved.

[0038] The modular electronic architecture adopted by the present invention is very easy to productize, and mass production can be carried out from modules to the entire electrical box, which can bring about batch procurement and batch production of raw materials, devices, and components, reduce production costs, and shorten the R & D cycle.

[0039] The integrated power system of the present invention does not require heat pipes for heat conduction. By adopting an electromechanical-thermal integration structural form, it solves the heat dissipation problem of equipment running for a long time and at high power during the long-term in-orbit operation of operational micro-nano satellites. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings.

[0041] Figure 1 It is an exploded view of the integrated power system for modular micro-nano satellites suitable for mass production provided by an embodiment of the present invention;

[0042] Figure 2 It is an assembly drawing of the integrated power system for modular micro-nano satellites suitable for mass production provided by an embodiment of the present invention;

[0043] Figure 3Schematic diagram of the heat dissipation plate body in the integrated power system of a modular micro-nano satellite suitable for mass production provided by an embodiment of the present invention;

[0044] Figure 4 Constraint diagram of the circuit board in the integrated power system of a modular micro-nano satellite suitable for mass production provided by an embodiment of the present invention;

[0045] Figure 5 Installation schematic diagram of the flexible heat conduction belt in the integrated power system of a modular micro-nano satellite suitable for mass production provided by an embodiment of the present invention;

[0046] Figure 6 Comparison chart of the random vibration curves of the semi-open electrical box and the traditional electrical box provided by an embodiment of the present invention.

[0047] Explanation of reference numerals:

[0048] 1. Upper cover of the electrical box; 2. Lower cover of the electrical box; 3. Heat dissipation plate body; 5. External hexagon bolt; 6. Fastening nut;

[0049] 31. Heat conduction concave structure; 32. Heat dissipation surface; 33. Through hole for heat conduction belt; 34. Flexible heat conduction belt;

[0050] 71. Power controller circuit board; 72. Navigation circuit board; 73. Flywheel circuit board; 74. Central computer circuit board; 75. Power substation; 76. Power distribution and thermal control circuit board; 77. Measurement and control data transmission integrated machine. Detailed implementation manners

[0051] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0052] See Figures 1 to 6 as shown;

[0053] The integrated power system of the modular micro-nano satellite suitable for mass production of the present invention occupies about 1.5U (U: unit of CubeSat, 10 cm × 10 cm × 10 cm is 1U) space. The integrated power system is composed of a semi-open electrical box structure and modular circuit boards; among them,

[0054] The electrical box structure includes an upper cover 1 of the electrical box and a lower cover 2 of the electrical box. The modular circuit board is located between the upper cover 1 of the electrical box and the lower cover 2 of the electrical box. And both sides of the upper cover 1 of the electrical box and both sides of the lower cover 2 of the electrical box are provided with a plurality of M4 threaded holes for connecting the satellite structural cabin board; among them, the upper cover 1 of the electrical box adopts a co-structure design form, which can provide installation points for other subsystem single machines, thereby reducing the on-board brackets and the structural mass during the overall satellite design process, and effectively increasing the payload ratio;

[0055] The heat dissipation plate bodies 3 distributed on both sides of the modular circuit board are in contact with the satellite structural board body;

[0056] The modular circuit board has multiple circuit boards, on which electronic modules are respectively installed and stacked according to the power consumption level. Each circuit board is connected to the heat dissipation plate body 3. The structural parts of the electric box in the present invention are greatly reduced. There are only four main load-bearing modules. The parts adopt standardized design, the structural design is simple, the processing cycle is shortened from the traditional one month to two weeks, the mass production cost is low, the proportion of the whole satellite structure weight is reduced, and the proportion of the payload is significantly increased. The size of the electric box structure is: 98mm×94mm×150mm (expandable in all three directions). The weight of the electric box is only 1.2 kg, and the weight of the electric box is optimized by more than 30% compared with the traditional integrated electronic system, greatly improving the proportion of the payload. The standardized and modular design of the electric box structure can realize the rapid iterative design, modular mass production and general assembly of the integrated electronic systems of various models and functions of satellites. The assembly is simple, improving the mass production efficiency of micro-nano satellites. It takes at least 2 hours to complete the assembly of the traditional electric box. In the general assembly process of 20 mass-produced satellites of a certain model in the present invention, the assembly of a single box only takes 15 minutes, greatly improving the assembly efficiency and reducing the production cost of the satellite.

[0057] The circuit board and the heat dissipation plate body 3 are provided with coaxial connection holes, and the external hexagon bolt 5 is inserted downward through the circuit board and the heat dissipation plate body 3 from the upper end of the electric box upper cover 1, and is fixedly connected through the fastening nut 6 from the bottom of the electric box lower cover 2.

[0058] As a further introduction of this embodiment, a heat dissipation surface 32 is formed on the heat dissipation plate body 3, and the heat of the circuit board is transferred to the heat dissipation surface 32;

[0059] The heat dissipation surface 32 is provided with heat conduction belt through holes 33, and a flexible heat conduction belt 34 is embedded in the heat conduction belt through holes 33. The components on the high-power consumption circuit board can be directly connected to the external structure of the satellite through the flexible heat conduction belt 34, which is a form of mechatronic integration structure, solving the heat dissipation problem of the high-power consumption circuit board of the integrated electronic system. Among them, the flexible heat conduction belt 34 adopts a graphene heat conduction belt, with a thickness of about 1 mm, high heat conduction efficiency, a thermal conductivity of ≥1500 W / m·K, and light weight.

[0060] The heat dissipation surface 32 adopts an integrated structural thermal control design form, integrating the heat dissipation surface 32 with the inter-board support columns and the heat conduction concave structure 31. The structural design is simple, reducing the number of parts and facilitating the assembly of the electrical box. The heat dissipation surface 32 is made of 2A12 aluminum alloy material. There is a heat conduction concave structure 31 with a width of 2.5 mm and a depth of 2 mm on the heat dissipation surface 32, which matches the circuit board. The depth of the heat conduction concave structure 31 is 2 ± 0.1 mm, which is 1.1 - 1.2 times the thickness of the circuit board. A silicon-based flexible heat conduction material (thermal conductivity ≥ 8 W / m·K, thermal resistance ≤ 0.05 K·cm 2 / W) is filled, and the side wall of the heat conduction concave structure 31 is provided with a serrated microstructure, thereby increasing the contact area of the heat conduction material and making the filling of the heat conduction material more uniform. The thickness of the heat dissipation skin on the heat dissipation surface 32 is 0.8 mm. The heat of the low-power circuit board can be conducted to the two side heat dissipation plates 3 by contact, and then conducted to the satellite structure by the two side heat dissipation plates 3. The filling of the heat conduction material not only improves the overall heat dissipation uniformity, but also provides a vibration buffering function for the circuit board module. At the same time, the filling of the heat conduction material also buffers the accumulation of stacking errors existing in the stacking process of the circuit boards, solves the problems of stress and uneven heat conduction caused by the cumulative installation errors due to the uneven overall thickness of the circuit boards.

[0061] Specifically, the collaborative design of the heat conduction concave structure 31 and the silicon-based material compensates for tolerances through flexible materials, and at the same time forms an electromagnetic shielding layer by combining ground plane openings, solving the contradiction between shielding and heat dissipation in the traditional solution; the integrated layout of the graphene heat conduction belt 34 and the heat dissipation plate body 3 realizes "point-to-point" heat dissipation of high-power modules, avoiding the intersection of heat flow paths, and the related existing technologies only rely on copper layer heat conduction.

[0062] As a further introduction of this embodiment, the modular circuit board includes a power controller circuit board 71 arranged from bottom to top, on which a power controller module is arranged;

[0063] a navigation circuit board 72, on which a navigation module is arranged;

[0064] a flywheel circuit board 73, on which a flywheel control module is arranged;

[0065] a central computer circuit board 74, on which a central computer module is arranged;

[0066] a power lower computer 75, on which a power lower computer module is arranged;

[0067] a power distribution thermal control circuit board 76, on which a power distribution thermal control module is arranged;

[0068] a measurement and control data transmission integrated machine 77, on which a measurement and control data transmission module is arranged;

[0069] The electronics module can be flexibly expanded according to the satellite function requirements.

[0070] The power controller circuit board 71, the navigation circuit board 72, the flywheel circuit board 73, the central computer circuit board 74, the power sub - computer 75, the power distribution thermal control circuit board 76, and the measurement and control data transmission integrated machine 77 are stacked. The height of the J119 connector (13mm, 15mm, 18mm, 20mm, 23mm) between adjacent boards is adaptively matched to the component size. Specifically, the material of the circuit board is PCB board, with a size of 94mm×94mm×2mm, and the size can be adjusted according to the requirements of the electronics module and the overall satellite layout. Each circuit board card is stacked through board - to - board connectors. There is a 16mm external wire - leading envelope on the side of the circuit board. Among them, high - power consumption modules (measurement and control data transmission integrated machine 77, power controller circuit board 71) are directly connected to the satellite external structure through the graphene heat conduction belt 34 to form a short - path heat dissipation channel; low - power consumption modules (navigation circuit board 72, central computer circuit board 74) are close to the heat dissipation plate body 3, and high - power consumption modules are independently arranged in layers. Each circuit board is stacked and interconnected through J119 - type connectors, and the board - to - board spacing tolerance

[0071] ≤0.05mm, and the common - ground window between boards forms an electromagnetic shielding layer (shielding effectiveness ≥60dB).

[0072] The circuit in the circuit board is subjected to a 1.5mm window - opening treatment. The window - opening is grounded together with the two - side heat dissipation plate body 3 through the mounting holes, and finally grounded to the whole - satellite shell through the grounding pile on the heat dissipation surface, forming a shield for the internal circuit of the PCB.

[0073] The stack connectors between the electrical box boards are J119 - type connectors. The corresponding connector height is selected according to the height of the components on each circuit board. There are five standard specifications: 13mm, 15mm, 18mm, 20mm, and 23mm.

[0074] The integrated power system of the present invention has the following functions:

[0075] Satellite mission management: task scheduling and management, fault detection and handling functions;

[0076] Attitude control: The satellite attitude control software runs in the central computer and serves as a task module of the satellite mission management software;

[0077] Telecommand management: receiving, processing, distributing, and executing telecommand instructions;

[0078] Telemetry management: engineering parameter acquisition, framing, and data processing functions;

[0079] Time management: having functions of ground time - service, self - time - keeping, Beidou navigation time - calibration, uniform time - calibration, and centralized time - calibration;

[0080] Magnetoresistance control: driving and controlling the three - axis magnetic torquer through the magnetic torquer drive circuit;

[0081] Collect the triaxial magnetic field intensity: Sense the triaxial magnetic field intensity of the entire satellite through the magnetometer module;

[0082] Propulsion control: Compatible with cold propulsion control through solenoid valves and electric propulsion control through the CAN bus;

[0083] Digital input acquisition: Collect digital input information such as satellite-rocket separation and solar panel deployment;

[0084] Software on-orbit loading function: Support software on-orbit loading function through the CAN bus.

[0085] The assembly method of the modular micro-nano satellite integrated power system suitable for mass production according to the present invention, the assembly method includes the following steps:

[0086] S1, Pretreatment before thermal control and electrical installation: The thermal control firmly paste the temperature measurement points and heating tapes that each circuit board needs to paste in advance, and let the GD414 silicone rubber stand for curing. The electrical installation brushes the three-proof treatment on the electronic components on the circuit board in advance;

[0087] S2, Stack and plug all the circuit boards according to the board sequence and board spacing to achieve signal interconnection;

[0088] S3, Uniformly fill the heat-conducting concave structure 31 with heat-conducting material;

[0089] S4, Insert the heat dissipation plate bodies 3 on both sides into the two ends of the circuit board, and the flexible heat-conducting belt 34 passes through the through hole 33 of the heat-conducting belt;

[0090] S5, Install the upper cover 1 of the electrical box and the lower cover 2 of the electrical box;

[0091] S6, Pass the four groups of external hexagon bolts 5 through the upper cover 1 of the electrical box, the heat dissipation plate body 3, the modular circuit board, and the lower cover 2 of the electrical box in sequence, and install the four groups of fastening nuts 6. The tightening torque of the external hexagon bolts is applied in stages at 0.8-1.2 N·m.

[0092] After testing, this solution achieves:

[0093] Heat dissipation efficiency: The thermal resistance of the high-power consumption module (measurement and control data transmission integrated machine 77) is reduced to 0.8 K / W (47% lower than the traditional solution), and the temperature rise ≤ 5°C (≥ 15°C in the traditional solution);

[0094] Structural stability: After filling with the silicon-based heat-conducting material, the cumulative error of the stacking tolerance ≤ 0.05 mm, the displacement under the vibration environment < 0.1 mm, and the random vibration response level is reduced by 63%;

[0095] Mass production efficiency: The modular design enables the assembly time of a single satellite electrical box ≤ 0.2 hours (≥ 2 hours in the traditional solution), and the yield rate ≥ 98%.

[0096] Comparative example: A 6U CubeSat using a traditional fully enclosed electrical box, with the electrical box weighing 1.8 kg, the temperature rise of the TT&C and data transmission module being 10 °C, and the assembly cycle being 2 h;

[0097] Example of the present invention: The electrical box weighs 1.2 kg, the temperature rise of the TT&C and data transmission module is 4 °C, the assembly cycle is 0.2 h, and the payload ratio is increased from 52% to 67%.

[0098] The performance data is as follows:

[0099] Weight comparison: Traditional electrical box 1.8 kg → Present invention 1.2 kg (a decrease of more than 30%);

[0100] Heat dissipation efficiency: Under the same power consumption of 32 W, the temperature difference of the traditional solution is 10 °C → Present invention 4 °C;

[0101] Batch production efficiency: The total assembly time per electrical box for 20 satellites is shortened from 2 hours to 0.2 hours.

[0102] Experimental verification: Vibration test (no structural failure under random vibration of 10 - 2000 Hz) and thermal vacuum test (normal function under the cycle of -40 °C to +80 °C) are cited. As Figure 6 shown, where A represents the random vibration curve of the semi-open electrical box of the present invention, and B represents the random vibration curve of the traditional electrical box. It can be seen from the test curves that above 200 Hz, the response of the electrical box of the present invention is significantly reduced, and the response value is reduced by 63%.

[0103] Only some exemplary embodiments of the present invention have been described by way of illustration. Undoubtedly, for those of ordinary skill in the art, without departing from the spirit and scope of the present invention, the described embodiments can be modified in various different ways. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A modular integrated electrical system for microsatellites suitable for mass production, characterized in that, The integrated power system is composed of a semi-open electrical box structure and modular circuit boards; among them, the electrical box structure includes an electrical box upper cover (1) and an electrical box lower cover (2), the modular circuit board is located between the electrical box upper cover (1) and the electrical box lower cover (2), and a plurality of threaded holes are opened on both sides of the electrical box upper cover (1) and both sides of the electrical box lower cover (2) for connecting the satellite structure cabin plates; and heat dissipation plate bodies (3) distributed on both sides of the modular circuit board, the heat dissipation plate bodies (3) are in contact with the satellite structure plate bodies; the modular circuit board has a plurality of circuit boards, and the electronic modules are stacked and arranged according to the power consumption level respectively, and each circuit board is connected to the heat dissipation plate body (3).

2. The integrated power and electrical system of a modular micro-nano satellite suitable for mass production according to claim 1, characterized in that, The heat dissipation plate body (3) is provided with a heat conduction concave structure (31) matching the circuit board, the side wall of the heat conduction concave structure (31) is provided with a serrated microstructure, the depth of the heat conduction concave structure (31) is 2±0.1 mm, and the heat conduction concave structure (31) is filled with a heat conduction material inside; the circuit board and the heat dissipation plate body (3) are provided with coaxial connection holes, and an external hexagon bolt (5) is inserted downward from the upper end of the electrical box upper cover (1) through the circuit board and the heat dissipation plate body (3), and is connected and fixed from the bottom of the electrical box lower cover (2) through a fastening nut (6).

3. The modular micro-nano satellite integrated power system suitable for mass production according to claim 1, characterized in that, A heat dissipation surface (32) is formed on the heat dissipation plate body (3), and the heat of the circuit board is transferred to the heat dissipation surface (32); heat conduction belt through holes (33) are opened on the surface of the heat dissipation surface (32), and a flexible heat conduction belt (34) is embedded in the heat conduction belt through holes (33).

4. The integrated electrical system of a modular micro-nano satellite suitable for mass production according to claim 3, characterized in that The electrical box structure is made of aluminum alloy material, the thickness of its main heat dissipation surface is 0.8 mm±0.1 mm, the total weight ≤1.2 kg, and satellite payload installation interfaces are integrated on the electrical box upper cover (1) and the electrical box lower cover (2); T-shaped reinforcing rib networks are provided on the inner sides of the electrical box upper cover (1) and the electrical box lower cover (2), and the ratio of the height of the rib strips to the thickness of the heat dissipation surface (32) is 1:3, forming a multi-stage force transmission and heat transfer path.

5. The integrated power and electrical system of a modular micro-nano satellite suitable for mass production according to claim 3, characterized in that, The flexible heat conduction belt (34) is made of graphene composite material, the thickness is 1 mm±0.1 mm, the thermal conductivity ≥1500 W / m·K, and it is fixed in the heat conduction belt through hole (33) by gluing.

6. The integrated electrical system of a modular micro-nano satellite suitable for mass production according to claim 1, characterized in that, The modular circuit board includes a power controller circuit board (71) arranged from bottom to top, on which a power controller module is arranged; a navigation circuit board (72), on which a navigation module is arranged; a flywheel circuit board (73), on which a flywheel control module is arranged; a central computer circuit board (74), on which a central computer module is arranged; a power lower computer (75), on which a power lower computer module is arranged; a power distribution thermal control circuit board (76), on which a power distribution thermal control module is arranged; a measurement and control data transmission integrated machine (77), on which a measurement and control data transmission module is arranged; The power controller circuit board (71), the navigation circuit board (72), the flywheel circuit board (73), the central unit circuit board (74), the power slave unit (75), the power distribution thermal control circuit board (76), and the measurement and control data transmission integrated machine (77) are stacked in a series and signal interconnection is achieved through board-to-board connectors.

7. Assembly method of modular integrated power and electronics system for micro-nano satellite suitable for mass production, characterized in that The assembly method includes the following steps: S1, pre-treatment before thermal control electrical installation; S2, stack and plug all the circuit boards according to the board sequence and board spacing to achieve signal interconnection; S3, evenly fill the heat-conducting concave structure (31) with heat-conducting material; S4, insert the heat dissipation plate bodies (3) on both sides into the two ends of the circuit board, and the flexible heat-conducting belt (34) passes through the heat-conducting belt through hole (33); S5, install the upper cover (1) and the lower cover (2) of the electrical box; S6, sequentially pass four groups of hexagon head bolts (5) through the upper cover (1) of the electrical box, the heat dissipation plate body (3), the modular circuit board, and the lower cover (2) of the electrical box, and install four groups of fastening nuts (6) with the standard torque applied.

8. The assembly method of the modular micro-nano satellite integrated power system suitable for mass production according to claim 7, characterized in that, The pre-treatment before thermal control electrical installation specifically means that the thermal control firmly pastes the temperature measurement points and heating tapes that need to be pasted in advance on each circuit board, and the GD414 silicone rubber is left to cure statically. The electrical installation pre-brushes the three-proof protection on the electronic components on the circuit board.

9. The assembly method of the modular micro-nano satellite integrated power system suitable for mass production according to claim 7, characterized in that, In the step S6, the tightening torque of the hexagon head bolts (5) is 0.8 - 1.2 N·m and is applied in stages.

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