Die peeling method

Abstract

To provide a die peeling method that prevents a carrier film from being torn when dies pasted in the form of the carrier film are pushed up from below the film and peeled from the film.SOLUTION: A method includes: distributing dies on a carrier film; spreading the carrier film; capturing an image of a target die and an adjacent die; determining whether a gap between the target die and the adjacent die is adequate for suction devices; raising a pedestal until a first suction device abuts a target area and a second suction device abuts an adjacent area, if the position of the gap is correct; and suction-holding the target area with the first suction device and suction-holding the adjacent area with the second suction device, forming a step between the target area and the adjacent area by lowering the second suction device, and peeling the target die from the target area by the step.SELECTED DRAWING: Figure 1B

Description

[Technical field]

[0001] The present invention relates to a die peeling method. [Background technology]

[0002] Integrated circuits are fabricated on a semiconductor wafer through multiple steps in batch production, and the wafer is then cut into multiple dies. In other words, a die is a small, unpackaged integrated circuit body made of semiconductor material. The cut dies are then systematically attached to multiple target areas on a carrier film. Then, a long and thin pick-up rod is used to break through the carrier film, press and move the target die, and the target die is peeled off from the target area on the carrier film. Finally, a pick-up device transfers the target die from the carrier film onto a substrate for subsequent processing steps.

[0003] However, the carrier film is destroyed and cannot be reused.

[0004] In addition, the tipping bar is likely to damage the die, increasing the risk of die breakage and potentially reducing die production yields. Summary of the Invention [Problem to be solved by the invention]

[0005] The main object of the present invention is to provide a method for peeling a die which can avoid damage to the carrier film and the die.

[0006] In order to achieve the above-mentioned object, the present invention provides a method for manufacturing a semiconductor device, comprising the steps of: distributing a plurality of dies, each of which has solder balls and copper pillars on its surface, on a carrier film; expanding the carrier film so that the width of the gap between the plurality of dies becomes larger; capturing an image of at least one target die located on a top surface of a target area of ​​the carrier film and at least one adjacent die located on a top surface of an adjacent area of ​​the carrier film; receiving the image, and determining based on the image whether the gap between the at least one target die and the at least one adjacent die is aligned with respect to a gap between a first suction device and a second suction device on a base; determining whether the gap between the at least one target die and the at least one adjacent die is aligned with respect to a gap between a first suction device and a second suction device on a base; and when it is determined that the position is aligned with respect to a gap between a first suction device and a second suction device in the adjacent area, raising the pedestal until the first suction device abuts against a bottom surface of the target area and the second suction device abuts against a bottom surface of the adjacent area; and when the position is determined to be aligned with a gap between a first suction device and a second suction device in the adjacent area, the first suction device suctions the target area by negative pressure to hold it immobile, the second suction device suctions the adjacent area by negative pressure, and the second suction device is driven and lowered by a drive device to suction the adjacent area by negative pressure of the second suction device and lower it, forming a step between the target area and the adjacent area, and using the step to peel off the at least one target die from the top surface of the target area.

[0007] In addition, the process of distributing the multiple dies on the carrier film further includes a process of supporting the carrier film with a support device and abutting the bottom surface of the carrier film with a ring-shaped body; and the process of spreading the carrier film further includes a process of lifting the ring-shaped body so as to spread the carrier film.

[0008] Furthermore, the step of capturing an image further includes a step of capturing an image of the at least one target die and the at least one adjacent die by an image capture unit; and the step of determining whether or not a gap is aligned based on the image further includes a step of receiving the image by a processing unit and determining whether or not a gap between the at least one target die and the at least one adjacent die is aligned with respect to the gap between the first suction device and the second suction device on the base based on the image.

[0009] The method further includes, after the step of peeling off the at least one target die, a step of causing the first suction device to stop suctioning the target area by the negative pressure, causing the second suction device to stop suctioning the adjacent area by the negative pressure, removing the target area from the first suction device, and removing the adjacent area from the second suction device; and a step of suctioning the at least one target die by a die fixing device, and placing the at least one target die on a substrate having no solder balls and no copper pillars on a surface thereof.

[0010] Also, the step of capturing an image further includes a step of capturing an image of the single target die and a single adjacent die; the step of determining whether a gap is aligned based on the image further includes a step of determining whether a gap between the single target die and the single adjacent die is aligned with respect to the gap between the first suction device and the second suction device on the base based on the image; and the step of peeling the at least one target die further includes a step of peeling the single target die from the top surface of the target area.

[0011] The method further includes distributing the plurality of dies on the carrier film, the method further includes arranging the plurality of dies in a plurality of rows of die combinations, each row of die combinations including a plurality of dies; the method further includes capturing an image of a plurality of target dies in one row of the plurality of rows of die combinations and a plurality of adjacent dies in another row of the plurality of rows of die combinations; the method further includes determining, based on the image, whether the gaps between the plurality of target dies in one row of the plurality of rows of die combinations and the plurality of adjacent dies in the other row of the plurality of rows of die combinations are aligned with respect to the gaps between the first suction device and the second suction device on the base; and the method further includes peeling off the at least one target die from a top surface of a target area.

[0012] The method further includes, in the step of lifting the pedestal and the step of peeling off the at least one target die, a step of adsorbing the at least one target die by at least one die fixing device; after the step of peeling off the at least one target die, a step of adsorbing the at least one target die by at least one die fixing device, causing the first adsorption device to stop adsorbing the target area by the negative pressure, causing the second adsorption device to stop adsorbing the adjacent area by the negative pressure, and driving the second adsorption device by the driving device to raise the target area and the adjacent area to be aligned in height; and adsorbing the at least one target die by the at least one die fixing device and moving the pedestal laterally or moving the carrier film laterally, The method further includes the steps of: making the gap between the first suction device and the second suction device correspond to a bottom position of at least one target die; suctioning the at least one target die with the at least one die fixing device, suctioning and holding the target area immovable by the negative pressure of the first suction device, suctioning the adjacent area by the negative pressure of the second suction device, driving the second suction device to lower it with the driving device, suctioning and lowering the adjacent area by the negative pressure of the second suction device, forming a step between the target area and the adjacent area, and expanding an area of ​​the at least one target die peeled off from the target area by the step; and repeatedly performing the above steps until the at least one target die is completely detached from the top surface of the target area.

[0013] Furthermore, the first adsorption device is provided with at least one first channel, the second adsorption device is provided with at least one second channel, and the at least one first channel and the at least one second channel are connected to a vacuum device; when the vacuum device synchronously bleeds the at least one first channel and the at least one second channel, the gas in the at least one first channel and the at least one second channel is discharged to the outside to generate a vacuum state, and at the same time, a negative pressure is provided, so that the first adsorption device adsorbs the target area by the negative pressure, and the second adsorption device adsorbs the adjacent area by the negative pressure.

[0014] Furthermore, the first suction device is provided with at least one first channel, and the second suction device is provided with at least one second channel, and the at least one first channel and the at least one second channel are connected to a vacuum device providing the negative pressure; when the vacuum device stops synchronously extracting air from the at least one first channel and the at least one second channel, the at least one first channel and the at least one second channel are released from a vacuum state, and the vacuum device does not provide the negative pressure, so that the first suction device stops suctioning the target area by the negative pressure, and the second suction device stops suctioning the adjacent area by the negative pressure. Effect of the Invention

[0015] The advantage of the present invention is that the method of the present invention allows the target die to be peeled off from the carrier film without destroying the carrier film or contacting the target die, thereby avoiding damage to the carrier film and the target die, allowing the carrier film to be used repeatedly and improving the production yield of the die. [Brief description of the drawings]

[0016] [Figure 1A]1 is a flow chart of a first embodiment of a method according to the present invention. [Figure 1B] 1 is a flow chart of a first embodiment of a method according to the present invention. [Diagram 2] FIG. 2 is a schematic diagram of step S100 of a first embodiment of the method according to the present invention. [Diagram 3] FIG. 2 is a schematic diagram of steps S110 and S120 of a first embodiment of the method according to the present invention. [Figure 4] FIG. 2 is a schematic diagram of step S130 of a first embodiment of the method according to the present invention. [Diagram 5] FIG. 2 is a schematic diagram of step S140 of a first embodiment of the method according to the present invention. [Figure 6] FIG. 2 is a schematic diagram of step S150 of a first embodiment of the method according to the present invention. [Figure 7] FIG. 2 is a schematic diagram of step S160 of a first embodiment of the method according to the present invention. [Figure 8] FIG. 2 shows a top view of a first implementation of a first embodiment of the method according to the invention. [Figure 9] FIG. 2 shows a top view of a first implementation of a first embodiment of the method according to the invention. [Figure 10] FIG. 2 is a schematic diagram of the connection relationship between a first suction device of the present invention, a second suction device, and a vacuum device. [Figure 11A] 4 is a flow chart of a second embodiment of the method according to the invention; [Figure 11B] 4 is a flow chart of a second embodiment of the method according to the invention; [Figure 12] FIG. 4 is a schematic diagram of step S240 of a second embodiment of the method according to the present invention. [Figure 13] FIG. 4 is a schematic diagram of step S250 of a second embodiment of the method according to the present invention. [Figure 14] FIG. 4 is a schematic diagram of step S260 of a second embodiment of the method according to the present invention. [Figure 15A] FIG. 4 is a schematic diagram of a first embodiment of step S270 of the second embodiment of the method according to the invention. [Figure 15B] FIG. 4 is a schematic diagram of a second embodiment of step S270 of the first embodiment of the method according to the present invention. [Figure 16] FIG. 4 is a schematic diagram of step S280 of a second embodiment of the method according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the embodiments of the present invention will be described in more detail with reference to the accompanying drawings and reference numerals, so that those skilled in the art can practice the present invention after reading the specification.

[0018] 1A and 1B are a flow chart of a first embodiment of the method according to the present invention, FIG 2 is a schematic diagram of step S100 of the first embodiment of the method according to the present invention, FIG 3 is a schematic diagram of steps S110 and S120 of the first embodiment of the method according to the present invention, FIG 4 is a schematic diagram of step S130 of the first embodiment of the method according to the present invention, FIG 5 is a schematic diagram of step S140 of the first embodiment of the method according to the present invention, FIG 6 is a schematic diagram of step S150 of the first embodiment of the method according to the present invention, and FIG 7 is a schematic diagram of step S160 of the first embodiment of the method according to the present invention. The present invention provides a die peeling method, which includes the steps described below.

[0019] In step S100, as shown in Figures 1A and 2, a supporting device 10 supports a carrier film 20, and an annular body 30 abuts against the carrier film 20, and multiple dies 40 having solder balls and no copper pillars on their surfaces are distributed on the upper surface of multiple target areas of the carrier film 20.

[0020] In step S110, as shown in FIG. 1A and FIG. 3, the annular body 30 is raised and the carrier film 20 is expanded to increase the width of the gaps 41 between the multiple dies 40.

[0021] 1A and 3, in step S120, an image 51 of at least one target die 42 and at least one adjacent die 43 is captured by an image capture unit 50, as shown in FIG. 4. The at least one target die 42 is positioned on the top surface of the target area 21 of the carrier film 20, and the at least one adjacent die 43 is positioned on the top surface of the adjacent area 22 of the carrier film 20.

[0022] 1A and 4, in step S130, referring to FIG. 3, the processing unit 60 receives an image 51 and determines whether or not the gap 41 between at least one target die 42 and at least one adjacent die 43 is aligned with the gap 73 between the first suction device 71 and the second suction device 72 of the base 70 based on the image 51. If the processing unit 60 determines that the gap 41 is aligned with the gap 73 based on the image 51, the process proceeds to the next step, and if the processing unit 60 determines that the gap 41 is not aligned with the gap 73 based on the image 51, the process ends.

[0023] In step S140, as shown in Figures 1B and 5, referring to Figure 4, if the processing unit 60 determines based on the image 51 that the gap 41 between at least one target die 42 and at least one adjacent die 43 is aligned with the gap 73 between the first suction device 71 and the second suction device 72 of the base 70, the base 70 is raised until the first suction device 71 abuts against the bottom surface of the target area 21 and the second suction device 72 abuts against the bottom surface of the adjacent area 22.

[0024] In step S150, as shown in Figures 1B and 6, a first suction device 71 generates negative pressure 74 to suction and hold the target area 21 immobile, a second suction device 72 suctions the adjacent area 22 by the negative pressure 74, and the second suction device 72 is driven and lowered by a driving device 75, and the adjacent area 22 is suctioned and lowered by the negative pressure 74 of the second suction device 72, thereby forming a step 23 between the target area 21 and the adjacent area 22, and at least one target die 42 is peeled off from the top surface of the target area 21 by the step 23.

[0025] In step S160, as shown in FIGS. 1B and 7, the first suction device 71 stops suctioning the target area 21 by the negative pressure 74, the second suction device 72 stops suctioning the adjacent area 22 by the negative pressure 74, the target area 21 is detached from the first suction device 71, and the adjacent area 22 is detached from the second suction device 72; at least one target die 42 is suctioned by the die fixing device 80, and the at least one target die 42 is placed on a substrate 90 having solder balls and copper pillars on its surface.

[0026] Two aspects of a first embodiment of the method according to the invention will now be described with reference to the drawings.

[0027] 8 is a top view of the first embodiment of the method according to the present invention. As shown in FIG. 8, for the first embodiment, the at least one target die 42 is a single target die 42, and the at least one adjacent die 43 is a single adjacent die 43. More specifically, in step S120, an image 51 of the single target die 42 and the single adjacent die 43 is captured by an image capture unit 50; in step S130, the image 51 is received by a processing unit 60, and based on the image 51, a gap 41 between the single target die 42 and the single adjacent die 43 is determined to be aligned with a gap 73 between the first suction device 71 and the second suction device 72 on the base 70; in step S150, the single target die 42 is peeled off from the top surface of the target area 21.

[0028] 9 is a top view of a second embodiment of the first embodiment of the method according to the present invention. As shown in FIG. 9, for the second embodiment, the at least one target die 42 is a plurality of target dies 42 in one row of a plurality of rows of die combinations 44, and the at least one adjacent die 43 is a plurality of adjacent dies 43 in another row of the plurality of rows of die combinations 44.

[0029] More specifically, in step S100, the plurality of dies 40 are arranged into a plurality of rows of die combinations 44, each of which includes a plurality of dies 40; in step S120, an image capture unit 50 captures an image 51 of a plurality of target dies 42 in one row of the plurality of rows of die combinations 44 and a plurality of adjacent dies 43 in another row of the plurality of rows of die combinations 44; in step S130, a processing unit 60 receives the image 51 and determines based on the image 51 whether the gaps 41 between the plurality of target dies 42 in one row of the plurality of rows of die combinations 44 and the plurality of adjacent dies 43 in another row of the plurality of rows of die combinations 44 are aligned with the gaps 73 between the first suction device 71 and the second suction device 72 on the base 70; in step S150, the plurality of target dies 42 in one row of the plurality of rows of die combinations 44 are peeled off from the top surface of the target area 21.

[0030] Apparently, the number of dies 40 that can be processed at one time in the second embodiment is greater than that in the first embodiment, and the efficiency is higher.

[0031] 10 is a schematic diagram of the connection relationship between the first suction device 71, the second suction device 72, and the vacuum device 100 in the present invention. As shown in FIG. 2 and FIG. 10, preferably, the first suction device 71 is provided with a plurality of first channels 711, the second suction device 72 is provided with a plurality of second channels 721, and the plurality of first channels 711 and the plurality of second channels 721 are connected to the vacuum device 100.

[0032] In step S150, as shown in Figures 6 and 10, when the vacuum device 100 synchronously extracts gas from the first channels 711 and the second channels 721, the gas in the first channels 711 and the second channels 721 is discharged to the outside to create a vacuum state, and at the same time, negative pressure is provided, so that the first adsorption device 71 adsorbs the target area 21 by the negative pressure 74, and the second adsorption device 72 adsorbs the adjacent area 22 by the negative pressure 74.

[0033] In step S160, as shown in Figures 7 and 10, when the vacuum device 100 stops synchronously extracting air from the first channels 711 and the second channels 721, the first channels 711 and the second channels 721 are released from the vacuum state, and since the vacuum device 100 does not provide negative pressure 74, the first suction device 71 stops adsorbing the target area 21 by the negative pressure 74, and the second suction device 72 stops adsorbing the adjacent area 22 by the negative pressure 74.

[0034] Figures 11A and 11B are flowcharts of a second embodiment of the method according to the present invention, Figure 12 is a schematic diagram of step S240 of the second embodiment of the method according to the present invention, Figure 13 is a schematic diagram of step S250 of the second embodiment of the method according to the present invention, Figure 14 is a schematic diagram of step S260 of the second embodiment of the method according to the present invention, Figures 15A and 15B are schematic diagrams of a first and second embodiment, respectively, of step S270 of the second embodiment of the method according to the present invention, and Figure 16 is a schematic diagram of step S280 of the second embodiment of the method according to the present invention.

[0035] As shown in Fig. 11A, steps S200 to S230 of the second embodiment are exactly the same as steps S100 to S130 of the first embodiment. As shown in Fig. 11B, 12 and 13, steps S240 to S250 of the second embodiment are different from steps S140 to S150 of the first embodiment in that at least one target die 42 is adsorbed by the die fixing device 80. After step S250 of the second embodiment, the following steps are further included.

[0036] Specifically, as shown in FIGS. 10, 11B and 14, when at least one target die 42 is adsorbed by the die fixing device 80 and the vacuum device 100 stops synchronously extracting air from the first channels 711 and the second channels 721, the first channels 711 and the second channels 721 are released from the vacuum state, and since the vacuum device 100 does not provide negative pressure 74, the first adsorption device 71 stops adsorbing the target area 21 by the negative pressure 74, and the second adsorption device 72 stops adsorbing the adjacent area 2 by the negative pressure 74. 11B, 15A, and 15B, the die fixing device 80 fixes at least one target die 42, and moves the base 70 laterally (see FIG. 15A, which is a first embodiment) or moves the carrier film 20 laterally (see FIG. 15B, which is a second embodiment) to reduce the gap 73 between the first suction device 71 and the second suction device 72. 10, 11B and 16, at least one target die 42 is adsorbed by a die fixing device 80, and a vacuum device 100 synchronously bleeds the first channels 711 and the second channels 721, so that the gas in the first channels 711 and the second channels 721 is exhausted to the outside to generate a vacuum state, and at the same time, a negative pressure 74 is provided, so that the first adsorption device 71 adsorbs the target area 21 by the negative pressure 74, and the second adsorption device The method further includes a step S280 of adsorbing the adjacent area 22 by using negative pressure 74, driving the second adsorption device 72 by a driving device 75 to lower the second adsorption device 72, adsorbing and lowering the adjacent area 22 by the negative pressure 74 of the second adsorption device 72, thereby forming a step 23 between the target area 21 and the adjacent area 22, and expanding the area in which at least one target die 42 is peeled off from the target area 21 by the step 23, and a step of repeatedly performing the above-mentioned steps until the at least one target die 42 is completely detached from the upper surface of the target area 21.

[0037] As shown in FIG. 10B, step S290 in the second embodiment is exactly the same as step S160 in the first embodiment.

[0038] In the five steps from step S240 to step S280, the die fixing device 80 continues to adsorb the at least one target die 42, so that the alignment with the at least one target die 42 can be continuously maintained and the at least one target die 42 is not displaced due to the influence of the lateral movement of the pedestal 70. Therefore, the range in which the at least one target die 42 is peeled off from the target area 21 can be gradually expanded.

[0039] Since the bottom surface of the at least one target die 42 is completely separated from the top surface of the target area 21 , the at least one target die 42 can be easily transferred to the substrate 90 by the die fixing device 80 .

[0040] The difference between the first embodiment of the second embodiment and the first embodiment of the first embodiment is that in the six steps from step S240 to step S290, a single target die 42 is continuously adsorbed by a single die fixing device 80. The difference between the second embodiment of the second embodiment and the second embodiment of the first embodiment is that in the six steps from step S240 to step S290, a plurality of die fixing devices 80 are arranged in a row, and each of the plurality of target dies 42 in one row of the plurality of rows of die combinations 44 is continuously adsorbed.

[0041] As described above, the method according to the present invention makes it possible to peel the target die 42 from the carrier film 20 without destroying the carrier film 20 or contacting the target die 42, thereby avoiding damage to the carrier film 20 and the target die 42. This allows the carrier film 20 to be used repeatedly, and also improves the production yield of the dies 40.

[0042] The above-mentioned are only preferred embodiments for explaining the present invention, which are not intended to impose any formal limitations on the present invention, and any modifications or changes made to the present invention under the same inventive concept should be included in the intended scope of protection of the present invention. [Explanation of symbols]

[0043] 10 Support device 20 Career Film 21 Target Area 22 Adjacent Areas 23 Steps 30 Circular bodies 40 Die 41 Gap 42 Target Die 43 Adjacent Dies 44 Die Combinations 50 Image Capture Unit 51 images 60 Processing Units 70 Pedestal 71 First Adsorption Device 711 Channel 1 72 Second Adsorption Device 721 Channel 2 73 Gap 74 Negative Pressure 75 Drive Unit 80 Die fixing device 90 Substrate 100 Vacuum equipment S100~S160, S200~S290 process

Claims

1. Distributing a plurality of dies having solder balls and no copper pillars on their surfaces on a carrier film; expanding the carrier film to increase the width of the gaps between the dies; capturing an image of at least one target die located on top of the target area of ​​the carrier film and at least one adjacent die located on top of the adjacent area of ​​the carrier film; receiving the image and determining based on the image whether a gap between the at least one target die and the at least one adjacent die is aligned with a gap between a first pickup device and a second pickup device on a pedestal; when determining that a gap between the at least one target die and the at least one adjacent die is aligned with a gap between a first suction device and a second suction device on the pedestal, raising the pedestal until the first suction device abuts a bottom surface of the target area and the second suction device abuts a bottom surface of the adjacent area; a step of sucking the target area by the first suction device with negative pressure and holding it immobile, sucking the adjacent area by the second suction device with negative pressure, driving the second suction device to lower it by a drive device, sucking the adjacent area by the negative pressure of the second suction device and lowering it, forming a step between the target area and the adjacent area, and peeling off the at least one target die from the upper surface of the target area by the step, The step of lifting the pedestal and the step of peeling off the at least one target die further include a step of adsorbing the at least one target die by at least one die fixing device; After the step of peeling off the at least one target die, adsorbing the at least one target die by at least one die fixing device, causing the first adsorption device to stop adsorbing the target area by the negative pressure, causing the second adsorption device to stop adsorbing the adjacent area by the negative pressure, and driving the second adsorption device to rise by the driving device until the heights of the target area and the adjacent area are aligned; adsorbing the at least one target die by the at least one die fixing device, and moving the base laterally or moving the carrier film laterally to make the gap between the first adsorption device and the second adsorption device correspond to a bottom position of the at least one target die; adsorbing the at least one target die with the at least one die fixing device, adsorbing and holding the target area immovable by the negative pressure of the first adsorption device, adsorbing the adjacent area by the negative pressure of the second adsorption device, driving and lowering the second adsorption device with the driving device, adsorbing and lowering the adjacent area by the negative pressure of the second adsorption device, forming a step between the target area and the adjacent area, and expanding an area where the at least one target die is peeled off from the upper surface of the target area by the step; and repeatedly performing the above steps until the at least one target die is completely detached from the top surface of the target area. Die peeling method.

2. In the step of distributing the plurality of dies on the carrier film, the step of supporting the carrier film with a supporting device and abutting a bottom surface of the carrier film with a ring-shaped body is further included; The step of spreading the carrier film further includes a step of raising the annular body so as to spread the carrier film. The die peeling method according to claim 1 .

3. The step of capturing an image further includes capturing an image of the at least one target die and the at least one adjacent die by an image capture unit; and determining whether the gap is aligned based on the image further includes receiving the image by a processing unit and determining whether the gap between the at least one target die and the at least one adjacent die is aligned with respect to the gap between the first pickup device and the second pickup device on the pedestal based on the image. The die peeling method according to claim 1 .

4. After the step of peeling off the at least one target die, a step of causing the first suction device to stop suctioning the target area by the negative pressure, causing the second suction device to stop suctioning the adjacent area by the negative pressure, and releasing the target area from the first suction device and releasing the adjacent area from the second suction device; and adsorbing the at least one target die by a die fixing device, and placing the at least one target die on a substrate having a surface free of solder balls and copper pillars. The die peeling method according to claim 1 .

5. The step of capturing an image further includes capturing an image of a single target die and a single adjacent die; determining whether the gap is aligned based on the image further includes determining whether the gap between a single target die and a single adjacent die is aligned with respect to the gap between the first pickup device and the second pickup device on the pedestal based on the image; the step of peeling off the at least one target die further comprises peeling off a single target die from a top surface of the target area. The die peeling method according to claim 1 .

6. The step of distributing the plurality of dies on the carrier film further includes arranging the plurality of dies into a plurality of rows of die combinations, each row of die combinations including a plurality of dies; The step of capturing an image further includes capturing an image of a plurality of target dies in one row of the plurality of rows of die combinations and a plurality of adjacent dies in another row of the plurality of rows of die combinations; determining whether or not gaps are aligned based on the image further includes determining whether or not gaps between a plurality of target dies in one row of the die combinations and a plurality of adjacent dies in another row of the die combinations are aligned with respect to the gaps between the first suction device and the second suction device on the base based on the image; and peeling the at least one target die further comprises peeling a plurality of target dies in one row of the plurality of rows of die combinations from a top surface of the target area. The die peeling method according to claim 1 .

7. the first adsorption device is provided with at least one first channel, the second adsorption device is provided with at least one second channel, and the at least one first channel and the at least one second channel are connected to a vacuum device; When the vacuum device synchronously extracts air from the at least one first channel and the at least one second channel, gas in the at least one first channel and the at least one second channel is exhausted to the outside to generate a vacuum state, and at the same time, the negative pressure is provided, so that the first adsorption device adsorbs the target area by the negative pressure, and the second adsorption device adsorbs the adjacent area by the negative pressure. The die peeling method according to claim 1 or 4.

8. the first adsorption device is provided with at least one first channel, the second adsorption device is provided with at least one second channel, and the at least one first channel and the at least one second channel are connected to a vacuum device; when the vacuum device stops synchronously extracting air from the at least one first channel and the at least one second channel, the at least one first channel and the at least one second channel are released from a vacuum state, and the vacuum device no longer provides the negative pressure, causing the first suction device to stop suctioning the target area by the negative pressure, and the second suction device to stop suctioning the adjacent area by the negative pressure. The die peeling method according to claim 4.

Images