Composite having a supporting substrate and a polymer member and also having inorganic particles, method for producing the same, and polymer particles suitable for the method

Abstract

To provide a method for producing a composite having a support base material and a polymer member, and further having inorganic particles while ensuring excellent quality.SOLUTION: A method for producing a polymer particle layer-support base material composite, in which at least one of the polymer particle or the support base material contains inorganic particles, includes: providing the polymer particles; providing the support base material; and forming a polymer particle layer on the support base material by accumulating the polymer particles on the support base material.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a composite having a supporting substrate and a polymeric member and having inorganic particles, and a method for producing the same.

[0002] The present disclosure also relates to polymer particles and dispersions suitable for use in the above-mentioned methods. Additionally, the present disclosure also relates to a polymer substrate, a composite comprising a polymer substrate and a supporting substrate, a composite comprising a polymer substrate and an additional polymer substrate, a composite comprising a polymer substrate and an inorganic substrate, a polymer substrate laminate, and a composite comprising a polymer substrate laminate and an inorganic substrate, and methods for producing the same. [Background technology]

[0003] Polymer members, for example, polyolefin-based polymer substrates such as polypropylene, polyethylene, and cycloolefin polymers, are excellent in lightness, mechanical strength, chemical resistance, etc., and are therefore widely used in molded products such as resin films, nonwoven fabrics, automotive parts, electrical equipment parts, camera lenses, etc. In contrast, inorganic materials such as metals, semiconductors, or oxides thereof have mechanical, thermal, optical, and chemical properties that differ from those of polymer members.

[0004] Therefore, it has been considered to bond a polymer member to an inorganic substrate to produce a polymer member-inorganic substrate composite, thereby making favorable use of the different properties thereof.

[0005] Furthermore, it has also been considered to obtain a composite having new properties by further depositing a polymer containing inorganic particles on such a polymer member-inorganic substrate composite.

[0006] Here, when producing the above-mentioned composite, there is a risk that the solvent used to form the upper layer may have an undesirable effect on the supporting substrate of the lower layer.

[0007] Patent Document 1 discloses a method for producing an organic thin film laminate in which organic functional layers are laminated. The document describes that, by forming an intermediate layer capable of blocking the penetration of the solvent of the upper layer into the lower layer, damage to the lower layer (first light-emitting layer side) caused by the solvent when forming the upper layer (second light-emitting layer side) by a wet method is reduced. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] JP 2017-22063 A Summary of the Invention [Problem to be solved by the invention]

[0009] As described above, when a composite having a supporting substrate and a polymer member and also having inorganic particles is produced, there is a risk that the supporting substrate may be undesirably affected by the solvent.

[0010] In this context, an object of the present disclosure is to provide a method for producing a composite having a supporting substrate and a polymer component and having inorganic particles while ensuring excellent quality.

[0011] Another object of the present disclosure is to provide polymer particles and dispersions suitable for the above-mentioned method.Furthermore, another object of the present disclosure is to provide a polymer substrate having excellent quality, a composite comprising a polymer substrate and a support substrate, a composite comprising a polymer substrate and an additional polymer substrate, a composite comprising a polymer substrate and an inorganic substrate, a polymer substrate laminate, and a composite comprising a polymer substrate laminate and an inorganic substrate, and a method for producing the same. [Means for solving the problem]

[0012] In response to the above problems, the present inventors have discovered the present invention having the following aspects: <Aspect 1> Providing polymer particles; Providing a supporting substrate; and depositing the polymer particles on the supporting substrate to form a polymer particle layer on the supporting substrate; Including, At least one of the polymer particles or the supporting substrate contains inorganic particles; Method for producing a polymer particle layer-support substrate composite. <Aspect 2> 2. The method of embodiment 1, wherein the polymer particles are inorganic particle-containing polymer particles. <Aspect 3> 2. The method of embodiment 1, wherein the polymer particles are a mixture of inorganic particle-containing and inorganic particle-free polymer particles. <Aspect 4> The method according to any one of aspects 1 to 3, wherein the deposition of the polymer particles onto the support substrate comprises: Providing a dispersion in which the polymer particles are dispersed in a dispersion medium; and Coating the dispersion onto the supporting substrate and drying. <Aspect 5> The method of any one of aspects 1 to 4, wherein the supporting substrate is an inorganic particle-free polymeric substrate. Aspect 6 The method of any one of aspects 1 to 4, wherein the supporting substrate is an inorganic particle-containing polymeric substrate. Aspect 7 The method according to any one of aspects 1 to 4, wherein the supporting substrate is: An additional polymer substrate-polymer substrate composite comprising a polymer substrate and an additional polymer substrate, the polymer substrate and the additional polymer substrate being disposed at least partially on top of each other, and at least one of the polymer substrate and the additional polymer substrate comprising inorganic particles. <Aspect 8> The method according to any one of aspects 1 to 4, wherein the supporting substrate is an inorganic substrate. <Aspect 9> Producing a polymer particle layer-support substrate composite by the method according to any one of aspects 1 to 8; and forming a polymer substrate on the support substrate by heat pressing the polymer particle layer of the polymer particle layer-support substrate composite; A method for producing a polymer substrate-support substrate composite, comprising: Aspect 10 The support substrate is supported on a release substrate; and peeling the support substrate from the release substrate before or after the polymer particle layer is heat-pressed; 10. The method of embodiment 9, further comprising: <Aspect 11> Obtaining a polymer substrate-support substrate composite by the method according to aspect 9 using a release substrate as the support substrate; Obtaining a polymer substrate by peeling the polymer substrate from the support substrate, which is a release substrate, in the polymer substrate-support substrate composite; A method for producing a polymer substrate comprising: Aspect 12 Producing a polymer substrate by the method according to embodiment 11; Providing an additional polymeric substrate; and laminating the polymer substrate and the additional polymer substrate together; Additional methods for making polymer substrate-polymer substrate composites. Aspect 13 Producing a polymer substrate by the method according to embodiment 11; Providing an inorganic substrate; and disposing the polymeric substrate on the inorganic substrate; The method for producing a polymer substrate-inorganic substrate composite includes the steps of: Aspect 14 Producing a polymer substrate-inorganic substrate composite by the method according to embodiment 9 or 13. Providing an additional polymeric substrate; and disposing the additional polymer substrate on top of the polymer substrate of the polymer substrate-inorganic substrate composite; Additional methods for producing a polymer substrate-polymer substrate-inorganic substrate composite include: Aspect 15 Obtaining a polymer particle layer-support substrate composite by the method according to any one of aspects 1 to 8; depositing inorganic particle-free polymer particles, inorganic particle-containing polymer particles, or a mixture of inorganic particle-containing and inorganic particle-free polymer particles on the polymer particle layer-support substrate composite to form an additional polymer particle layer on the polymer particle layer-support substrate composite; A method for producing an additional polymer particle layer-polymer particle layer-support substrate composite, comprising: Aspect 16 Producing an additional polymer particle layer-polymer particle layer-support substrate composite by the method of embodiment 15; forming a polymer substrate and an additional polymer substrate on the supporting substrate by heat pressing the polymer substrate layer and the additional polymer substrate layer of the additional polymer substrate layer-polymer substrate layer-supporting substrate composite; Additional methods for producing a polymer substrate-polymer substrate-support substrate composite, comprising: Aspect 17 Obtaining an additional polymer substrate-polymer substrate-support substrate composite by the method of embodiment 16 using a release substrate as the support substrate; In the additional polymer substrate-polymer substrate-support substrate composite, the additional polymer substrate-polymer substrate composite is peeled off from the support substrate, which is a peeling substrate, to obtain an additional polymer substrate-polymer substrate composite. Additional methods for producing polymer substrate-polymer substrate composites, comprising: Aspect 18 Producing an additional polymer substrate-polymer substrate composite having a polymer substrate and an additional polymer substrate at least partially overlapping each other by the method of any one of aspects 9, 10, 12 and 17, wherein the polymer substrate is an inorganic particle-containing polymer substrate and / or the additional polymer substrate is an additional inorganic particle-containing polymer substrate. Providing an inorganic substrate; and placing the additional polymer substrate-polymer substrate composite on the inorganic substrate such that the polymer substrate being an inorganic particle polymer substrate or the additional polymer substrate being an additional inorganic particle-containing polymer substrate faces the inorganic substrate; Additional methods for producing a polymer substrate-polymer substrate-inorganic substrate composite include: Aspect 19 1. A method for producing a polymer substrate laminate having at least three polymer substrates stacked together such that the content of inorganic particles in each of the polymer substrates increases or decreases stepwise along the stacking direction starting from the outermost layer of the laminate, the method comprising: (a) selecting at least two materials from the group consisting of a polymer substrate not containing inorganic particles, a polymer substrate containing inorganic particles, and a composite of at least two polymer substrates, wherein the at least two materials include a polymer substrate produced by the method of any one of embodiments 11 and / or a composite of at least two polymer substrates produced by the method of any one of embodiments 9, 10, 12, 16, and 17, and the composite comprises at least three polymer substrates in total; (b) laminating said at least two materials such that the content of inorganic particles increases or decreases stepwise along the lamination direction to obtain a polymer-based laminate. Aspect 20 A method for producing a polymer substrate laminate having at least one inorganic particle-containing polymer substrate and at least one inorganic particle-free polymer substrate, the polymer substrate having an alternating laminate structure of inorganic particle-containing polymer substrates and inorganic particle-free polymer substrates, the method comprising: (a) selecting at least two materials from the group consisting of inorganic particle-free polymer substrates, inorganic particle-containing polymer substrates, and composites consisting of at least one inorganic particle-containing polymer substrate and at least one inorganic particle-free polymer substrate and having a structure in which the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate are alternately laminated, wherein the at least two materials include a polymer substrate produced by the method according to embodiment 11 or a composite produced by the method according to any one of embodiments 9, 10, 12, 16, and 17, and include at least three polymer substrates in total; (b) laminating said at least two materials in a side-by-side relationship between the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate to produce a polymer substrate laminate; Aspect 21 Producing a polymer substrate laminate having at least three polymer substrates by the method of embodiment 9, 10, 16, 19 or 20; Providing an inorganic substrate or a composite having a polymeric substrate and an inorganic substrate; and placing the polymer substrate laminate onto the inorganic substrate or onto the polymer substrate of the composite; The method for producing a polymer substrate laminate-inorganic substrate composite, comprising: Aspect 22 Providing an inorganic substrate or a composite having a polymeric substrate and an inorganic substrate; and producing the polymer substrate laminate on the inorganic substrate or on the polymer substrate of the composite by the method of claim 19 or 20; The method for producing a polymer substrate laminate-inorganic substrate composite, comprising: Aspect 23 23. The method of embodiment 21 or 22, wherein the composite having a polymeric substrate and an inorganic substrate is produced by the method of any one of embodiments 8, 13, 14, 16, and 18. Aspect 24 Polymers, Inorganic particles selected from the group consisting of metals and semi-metals, oxides of metals and semi-metals, nitrides of metals and semi-metals, carbides of metals and semi-metals, carbon materials, and combinations thereof, having a primary particle size of 1 nm to 500 nm, and dispersed in the polymer; The inorganic particle-containing polymer particle comprises: Aspect 25 25. The inorganic particle-containing polymer particles according to embodiment 24, wherein the inorganic particles are silicon particles. Aspect 26 26. The inorganic particle-containing polymer particle according to claim 24 or 25, wherein the polymer is an olefin polymer. Aspect 27 27. The inorganic particle-containing polymer particle according to any one of aspects 24 to 26, wherein the polymer is a cycloolefin polymer. Aspect 28 28. The inorganic particle-containing polymer particles according to any one of embodiments 24 to 27, further comprising a coupling agent. Aspect 29 The inorganic particle-containing polymer particles according to any one of embodiments 24 to 28, having an average particle size of 0.5 μm to 100 μm. Aspect 30 A dispersion comprising inorganic particle-free polymer particles and / or inorganic particle-containing polymer particles according to any one of aspects 24 to 29, and a dispersion medium. Aspect 31 31. The dispersion of embodiment 30, wherein the dispersion medium comprises at least one of 2-propanol, ethylene glycol, and terpineol. Aspect 32 A polymer substrate, and a layer of polymer particles deposited on the polymer substrate; and The polymer particle layer contains the inorganic particle-containing polymer particles according to any one of aspects 24 to 29. Polymer particle layer-polymer substrate composite. Aspect 33 A polymer substrate, and a layer of polymer particles deposited on the polymer substrate; and The polymer particle layer is made of polymer particles that do not contain inorganic particles. Polymer particle layer-polymer substrate composite. Aspect 34 34. The composite of claim 33, wherein the polymeric substrate is an inorganic particle-containing polymeric substrate. Aspect 35 Polymer substrate, a layer of polymer particles deposited on the polymer substrate; an additional layer of polymer particles deposited on said layer of polymer particles; an additional polymer particle layer-polymer particle layer-polymer substrate composite comprising: Aspect 36 36. The composite of embodiment 35, wherein the polymer substrate, the polymer particle layer, and / or the additional polymer particle layer comprises inorganic particles. Aspect 37 a polymer substrate and an additional polymer substrate; At least one of the polymer substrate and the additional polymer substrate comprises inorganic particles; the polymeric substrate and the additional polymeric substrate are disposed at least partially on top of one another; and The interface between the polymer substrate and the additional polymer substrate is flat. Additional polymer substrate-polymer substrate composites. Aspect 38 38. The composite of embodiment 37, wherein the polymeric substrate and / or the additional polymeric substrate further comprises a coupling agent. Aspect 39 39. The composite of claim 37 or 38, wherein the polymeric substrate and the additional polymeric substrate are in the form of a membrane or film. Aspect 40 Contains at least three polymeric substrates that are laminated together; and At least one of the interfaces of adjacent polymer substrates is flat; Polymer-based laminates. Aspect 41 A laminate according to embodiment 40, wherein the inorganic particle content in the at least three polymer substrates constituting the polymer substrate laminate is different from each other. Aspect 42 The polymer substrates are laminated such that the content of inorganic particles in the at least three polymer substrates constituting the polymer substrate laminate increases or decreases stepwise along the lamination direction. 42. The laminate of embodiment 41. Aspect 43 The polymer substrate has at least one inorganic particle-free polymer substrate and at least one inorganic particle-containing polymer substrate, and has a structure in which the inorganic particle-free polymer substrate and the inorganic particle-containing polymer substrate are alternately laminated. 41. The laminate of embodiment 40. Aspect 44 The composite according to any one of aspects 32 to 40 or the laminate according to any one of aspects 41 to 43, which is for optical use. Aspect 45 Cycloolefin polymers, and Silicon particles with a primary particle size of 1 nm to 500 nm A membrane or film-like substrate comprising: Effect of the Invention

[0013] According to the present disclosure, it is possible to provide a method for producing a composite having a supporting substrate and a polymer member, and also having inorganic particles, while ensuring excellent quality.

[0014] In addition, according to the present disclosure, it is possible to provide polymer particles and dispersions suitable for the above-mentioned method.Furthermore, according to the present disclosure, it is possible to provide an inorganic particle-containing polymer substrate, a polymer particle layer-support substrate composite, a polymer substrate-support substrate composite, an additional polymer substrate-polymer substrate-support substrate composite, and a polymer substrate laminate, as well as methods for producing the same, which have excellent quality. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 illustrates a schematic diagram of one embodiment of a method for producing a polymer particle layer-support substrate composite according to the present disclosure. [Diagram 2] FIG. 2 shows a schematic diagram of another embodiment of a method for producing a polymer particle layer-support substrate composite according to the present disclosure. [Diagram 3] FIG. 3 illustrates a schematic diagram of one embodiment of a deposition step in a method for making a polymer particle layer-support substrate composite according to the present disclosure. [Figure 4] FIG. 4 shows a schematic representation of an embodiment of a dispersion that can be used in the deposition step of the method for producing a polymer particle layer-support substrate composite according to the present disclosure. [Diagram 5] FIG. 5 illustrates a schematic diagram of one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure. [Figure 6A] FIG. 6A shows a schematic diagram of one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, in which a polymer substrate not containing inorganic particles is used as the support substrate. [Figure 6B] FIG. 6B shows a schematic diagram of one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, in which an inorganic particle-containing polymer substrate is used as the support substrate. [Figure 6C] FIG. 6C shows a schematic diagram of another embodiment of the method for producing a polymer substrate-support substrate composite according to the present disclosure, in which an inorganic particle-containing polymer substrate is used as the support substrate. [Figure 7A]FIG. 7A shows a schematic diagram of one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, in which a composite having two polymer substrates is used as the support substrate. [Figure 7B] FIG. 7B is a schematic diagram illustrating another embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, in which a composite having two polymer substrates is used as the support substrate. [Figure 8A] FIG. 8A illustrates a schematic diagram of one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, where the support substrate is supported by a release substrate. [Figure 8B] FIG. 8B illustrates a schematic diagram of another embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, where the support substrate is supported by a release substrate. [Figure 9] FIG. 9 shows a schematic diagram of one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, in which an inorganic substrate is used as the support substrate. [Figure 10A] FIG. 10A illustrates a schematic diagram of one embodiment of a method for producing a polymer substrate according to the present disclosure, in which a release substrate is used as a supporting substrate. [Figure 10B] FIG. 10B illustrates a schematic diagram of another embodiment of the method for producing a polymer substrate according to the present disclosure, in which a release substrate is used as the supporting substrate. [Figure 11] FIG. 11 illustrates a schematic diagram of one embodiment of a method for producing an additional polymer substrate-polymer substrate composite according to the present disclosure, comprising overlapping substrates. [Figure 12] FIG. 12 illustrates a schematic diagram of one embodiment of a method for making a polymer substrate-inorganic substrate composite according to the present disclosure, comprising disposing a polymer substrate on an inorganic substrate. [Figure 13] FIG. 13 illustrates generally one embodiment of a method for producing an additional polymer substrate-polymer substrate-inorganic substrate composite according to the present disclosure, comprising providing an additional polymer substrate. [Figure 14A]FIG. 14A illustrates generally one embodiment of a method for making an additional polymer particle layer-polymer particle layer-support substrate composite according to the present disclosure, which includes using a polymer substrate as the support substrate. [Figure 14B] FIG. 14B illustrates generally one embodiment of a method for producing an additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure, comprising using a polymer substrate as the support substrate. [Figure 15A] FIG. 15A illustrates generally one embodiment of a method for producing an additional polymer particle layer-polymer particle layer-support substrate composite according to the present disclosure, comprising using a composite comprising two polymer substrates as the support substrate. [Figure 15B] FIG. 15B illustrates generally one embodiment of a method for producing an additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure, comprising using a composite comprising two polymer substrates as the support substrate. [Figure 16] FIG. 16 illustrates generally one embodiment of a method for producing an additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure, which includes using an inorganic substrate as the support substrate. [Figure 17] FIG. 17 illustrates generally one embodiment of an additional method for producing a polymer substrate-polymer substrate composite according to the present disclosure, including using a release substrate as a supporting substrate. [Figure 18] FIG. 18 illustrates generally one embodiment of a method for making an additional polymer substrate-polymer substrate-inorganic substrate composite, comprising disposing an additional polymer substrate-polymer substrate composite on an inorganic substrate. [Figure 19] FIG. 19 illustrates generally one embodiment of a method for making a polymeric substrate laminate according to the present disclosure. [Figure 20] FIG. 20 illustrates generally another embodiment of a method for making a polymeric substrate laminate according to the present disclosure. [Figure 21] FIG. 21 illustrates generally one embodiment of a method for making a polymer substrate laminate-inorganic substrate composite according to the present disclosure, comprising placing a polymer substrate laminate on an inorganic substrate. [Figure 22] FIG. 22 illustrates generally one embodiment of a method for making a polymer substrate laminate-inorganic substrate composite according to the present disclosure, comprising placing a polymer substrate laminate on a polymer substrate of a composite having a polymer substrate and an inorganic substrate. [Figure 23] FIG. 23 illustrates generally another embodiment of a method for making a polymer substrate laminate-inorganic substrate composite according to the present disclosure, comprising producing a polymer substrate laminate on the polymer substrate of a composite having a polymer substrate and an inorganic substrate. [Figure 24] FIG. 24 shows an SEM image of the polymer particles according to Example 1 produced by the spray drying method. [Diagram 25] FIG. 25 shows an SEM image of the polymer particles according to Example 2 produced by the reprecipitation method. [Figure 26A] FIG. 26A is a diagram showing an SEM image of a cross section of a polymer substrate-support substrate composite according to Comparative Example 2, and a method for evaluating flatness. [Figure 26B] FIG. 26B is a diagram showing an SEM image of a cross section of the polymer substrate-support substrate composite according to Example 1, and a method for evaluating the flatness. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] <<Method for producing polymer particle layer-support substrate composite>> The method for producing a polymer particle layer-support substrate composite according to the present disclosure includes the steps of: Providing polymer particles (polymer particle providing step); Providing a support substrate (support substrate providing step); depositing polymer particles on a supporting substrate to form a polymer particle layer on the supporting substrate (depositing step); Including, At least one of the polymer particles or the supporting substrate comprises inorganic particles.

[0017] 1 is a schematic diagram illustrating one embodiment of a method for producing a polymer particle layer-support substrate composite 210a according to the present disclosure, in which polymer particles 14 including inorganic particles 13 and a polymer 12 are deposited on a support substrate 100 to form a polymer particle layer 160a on the support substrate 100, thereby obtaining a polymer particle layer-support substrate composite 210a.

[0018] In the method for producing a polymer particle layer-support substrate composite according to the present disclosure, at least one of the polymer particles and the support substrate contains inorganic particles. Therefore, according to the method according to the present disclosure, a composite in which at least one of the polymer particle layer and the support substrate contains inorganic particles can be obtained.

[0019] In a conventional method, when a composite having a supporting substrate, a polymer member, and inorganic particles is manufactured, a solution in which the polymer is dissolved in a solvent is used when disposing the polymer on the supporting substrate. In this case, there is a risk that the solvent for dissolving the polymer may have an undesirable effect on the supporting substrate.

[0020] In contrast, in the method according to the present disclosure, when a composite having a support substrate and a polymer member and inorganic particles is produced, instead of applying a polymer solution onto the support substrate, deposition of polymer particles is performed, so that the solvent for dissolving the polymer can be reduced. Therefore, it is possible to avoid or suppress undesirable effects on the support substrate caused by the solvent. In addition, in the method according to the present disclosure, the use of a solvent for dissolving the polymer is suppressed, so that the environmental burden and undesirable effects on health associated with the use of a solvent can be reduced.

[0021] <Polymer particle providing step> In the polymer particle providing step in the method for producing a polymer particle layer-support substrate composite according to the present disclosure, polymer particles are provided.

[0022] (Polymer particles) The polymer particles include inorganic particle-free polymer particles, inorganic particle-containing polymer particles, and mixtures of inorganic particle-containing polymer particles and inorganic particle-free polymer particles.

[0023] When the supporting substrate does not contain inorganic particles, for example when the supporting substrate is a polymer substrate that does not contain inorganic particles, the polymer particles can be inorganic particle-containing polymer particles, or a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles.

[0024] When the supporting substrate contains inorganic particles, for example when the supporting substrate is a polymer substrate containing inorganic particles, the polymer particles may be polymer particles not containing inorganic particles.

[0025] The average particle size of the polymer particles is preferably 0.1 μm to 1000 μm, more preferably 0.5 μm to 100 μm, particularly preferably 1.0 μm to 50 μm, and even more particularly preferably 1.5 μm to 10 μm. When the average particle size of the polymer particles is within this range, good moldability can be ensured when forming a layer using the polymer particles.

[0026] The average particle size of the polymer particles can be measured by calculating the average equivalent circle diameter of 100 randomly selected particles in an image obtained using a scanning electron microscope (SEM), a transmission electron microscope (TEM), or the like.

[0027] The polymer particles according to the present disclosure may be irregular particles, and the shape is not particularly limited. The shape of the polymer particles may be, for example, spherical, scaly, or fibrous. In the present application, "irregular" means that the polymer particles are not formed by a mold or the like.

[0028] (Polymer particles containing inorganic particles) The inorganic particle-containing polymer particles include inorganic particles and a polymer.

[0029] 1, inorganic particle-containing polymer particles 14 are used as the polymer particles. In this case, for example, the content of inorganic particles contained in the inorganic particle-containing polymer particles can be adjusted to adjust the content of inorganic particles in the resulting polymer particle layer.

[0030] The content ratio of inorganic particles and polymer in the inorganic particle-containing polymer particles can be, for example, 1:99 to 99:1, 5:95 to 95:5, 10:90 to 85:15, 20:80 to 80:20, 30:70 to 75:25, or 40:60 to 70:30 in the volume ratio of polymer to inorganic particles in the inorganic particle-containing polymer particles. If the inorganic particles are too few, the desired effect expected by containing the inorganic particles may not be obtained. If the inorganic particles are too many, the integrity and strength of the inorganic particle-containing polymer particles may not be maintained.

[0031] In the inorganic particle-containing polymer particles, it is preferred that the inorganic particles are dispersed in the polymer.

[0032] The inorganic particle-containing polymer particles according to the present disclosure can be produced by, for example, a spray-drying method or a reprecipitation method.

[0033] In the method for producing inorganic particle-containing polymer particles by the spray-drying method, a spray-drying device can be used. Specifically, the method for producing inorganic particle-containing polymer particles by the spray-drying method includes, for example, a step of preparing a precursor solution in which inorganic particles are dispersed in a polymer solution, a step of spraying the precursor solution, a step of drying the inorganic particle-containing polymer particle precursor formed by spraying, and a step of disintegrating the dried inorganic particle-containing polymer particle precursor. In the step of preparing the precursor solution, the polymer solution may be prepared, for example, by dissolving a polymer in a solvent such as toluene. In addition, it is preferable that the inorganic particle-containing polymer particles are substantially free of a solvent for dissolving the polymer. The method of disintegration is not particularly limited and can be performed by a known method.

[0034] The spray drying method may be capable of obtaining inorganic particle-containing polymer particles having a relatively high degree of sphericity, and may be capable of obtaining inorganic particle-containing polymer particles having an equivalent circle diameter of 0.1 to 50 μm.

[0035] The method for producing inorganic particle-containing polymer particles by the reprecipitation method includes, for example, a step of preparing a precursor solution in which inorganic particles are dispersed in a polymer solution, a step of dropping the precursor solution into a solvent, a step of recovering the solid content generated in the solvent as a precipitate, and a step of drying the recovered precipitate. In the step of preparing the precursor solution, for example, the polymer solution can be prepared by dissolving the polymer in a solvent such as toluene. It is preferable that the inorganic particle-containing polymer particles do not substantially contain a solvent for dissolving the polymer. In the step of dropping the precursor solution into the solvent, for example, 2-propanol can be used as the solvent. In the step of recovering the precipitate, for example, a centrifuge can be used. In the step of drying the recovered precipitate, drying can be performed using a vacuum oven.

[0036] By the reprecipitation method, it may be possible to obtain relatively amorphous inorganic particle-containing polymer particles. Also, it may be possible to obtain inorganic particle-containing polymer particles having an equivalent circle diameter of 1 μm or less by the reprecipitation method.

[0037] (Inorganic particles) In the present disclosure, inorganic particles can include any inorganic particles that can be dispersed in a polymer, such as metal or semi-metal particles, metal or semi-metal oxide or fluoride particles, and metal or semi-metal containing compound particles.

[0038] As such a metal or semi-metal, at least one selected from the group consisting of Si, Ge, Al, Mg, Ti, Ni, Cr, Fe, Cu, Au, Ag, W, Zr, Y, In, and Ir can be preferably used, and Si and Ge can be particularly preferably used. Also, as such an oxide or fluoride of a metal or semi-metal, at least one selected from the group consisting of MgO, Al2O3, Bi2O3, CaF2, In2O3, In2O3·SnO2, HfO2, La2O3, MgF2, Sb2O5, Sb2O5·SnO2, SiO2, SnO2, TiO2, Y2O3, ZnO, and ZrO2 can be preferably used, and MgO, Al2O3, SiO2, and TiO2 can be particularly preferably used. Examples of compounds containing such metals or semimetals include GaAs, InGaAs, InAlAs, LiTaOx, NbTaOx, ZnTe, GaSe, GaP, CdTe, diamond, diamond-like carbon, and SiC.

[0039] When the inorganic particles are silicon particles, examples of the silicon particles include silicon particles obtained by laser pyrolysis, particularly laser pyrolysis using a CO2 laser.

[0040] The inorganic particles, particularly silicon particles, may have a concentration of each impurity element of 1,000 ppm or less, 500 ppm or less, 300 ppm or less, 100 ppm or less, 50 ppm or less, 10 ppm or less, or 1 ppm or less. When the inorganic particles are silicon particles, such impurities may include group 13 and group 15 elements. Silicon particles with reduced impurities as described above are preferred because they have good physical properties, and are particularly preferred because they provide good optical properties.

[0041] The average primary particle diameter of the inorganic particles is preferably 1 nm or more, or 3 nm or more, and 10,000 nm or less, 5,000 nm or less, 2,000 nm or less, 1,000 nm or less, 500 nm or less, 200 nm or less, 100 nm or less, 50 nm or less, 30 nm or less, 20 nm or less, or 10 nm or less.

[0042] In the present invention, the average primary particle diameter of particles can be determined as the number average primary particle diameter by directly measuring the area-equivalent circle diameter based on images taken with a scanning electron microscope, a transmission electron microscope, or the like, and analyzing particle groups consisting of 100 or more aggregates.

[0043] In addition, if the particle size of the inorganic particles is too large, scattering is likely to occur, which may be undesirable. On the other hand, if the particle size of the inorganic particles is too small, the specific surface area of ​​the particles increases, promoting activation of the particle surface, and the cohesion between the particles increases significantly, which may be undesirable as a result of which handling properties are reduced.

[0044] Inorganic particles, particularly metal or metalloid particles, can be treated on their surfaces with ozone, ultraviolet light, etc. to increase the functional groups, such as hydroxyl groups, available for bonding with the polymer.

[0045] (polymer) The polymer contained in the polymer particles may be formed of an olefin polymer, for example, a cycloolefin polymer.

[0046] The olefin polymer means a polymer obtained by polymerizing a monomer containing an olefin as a main component, that is, a polymer obtained by polymerizing a monomer containing 50% by mass or more, 60% by mass or more, 70% by mass or more, 80% by mass or more, 90% by mass or more, or 95% by mass or more of a monomer portion derived from an olefin. Examples of the olefin polymer include copolymers of α-olefin and ethylene or propylene, such as polyethylene, polypropylene, polybutene, polymethylpentene, propylene-ethylene copolymers and propylene-butene copolymers, styrene-butadiene-styrene block copolymers, styrene-hexadiene-styrene copolymers, styrene-pentadiene-styrene copolymers, ethylene-propylene-diene copolymers (RPDM), and cycloolefin polymers, but the present invention is not limited to these examples. These olefin polymers may be used alone or in combination of two or more types.

[0047] Among these olefin polymers, cycloolefin polymers can be mentioned in particular.

[0048] A cycloolefin polymer is a polymer having a cycloolefin moiety in the polymer main chain. Examples of such cycloolefin polymers include ring-opening polymers of cycloolefin monomers, addition polymers of cycloolefin monomers, and copolymers of cycloolefin monomers and chain olefins, but the present invention is not limited to these examples.

[0049] Cycloolefin monomers are compounds having a ring structure formed by carbon atoms and having a carbon-carbon double bond in the ring structure. Examples of cycloolefin monomers include norbornene-based monomers, which are monomers containing a norbornene ring, such as bicyclic monomers such as 2-norbornene and norbornadiene, tricyclic monomers such as dicyclopentadiene and dihydrodicyclopentadiene, tetracyclic monomers such as tetracyclododecene, ethylidenetetracyclododecene, and phenyltetracyclododecene, pentacyclic monomers such as tricyclopentadiene, and heptacyclic monomers such as tetracyclopentadiene; and monocyclic cycloolefins such as cyclobutene, cyclopentene, cyclooctene, cyclododecene, and 1,5-cyclooctadiene, but the present invention is not limited to these examples. Cycloolefin monomers may have a substituent within the scope of the present invention.

[0050] Cycloolefin polymers can be readily obtained commercially, for example, as products manufactured by Zeon Corporation under the trade names Zeonex series and Zeonor series, products manufactured by Sumitomo Bakelite Co., Ltd. under the trade name SUMILITE series, products manufactured by JSR Corporation under the trade name ARTON series, products manufactured by Mitsui Chemicals, Inc. under the trade name APEL series, products manufactured by Ticona under the trade name Topas, and products manufactured by Hitachi Chemical Co., Ltd. under the trade name OPTRETZ series.

[0051] (Coupling Agent) The inorganic particle-containing polymer particles according to the present disclosure may further include a coupling agent.

[0052] The coupling agent in the present invention is not particularly limited, and preferably, any coupling agent that can be combined with inorganic particles can be used.Specifically, as the coupling agent, a silane coupling agent, a titanate coupling agent, or an aluminate coupling agent can be used, and in particular, a silane coupling agent can be used.

[0053] When an olefin polymer, for example, a cycloolefin polymer, is used as the polymer contained in the inorganic particle-containing polymer particles, the coupling agent may be a coupling agent having a functional group having good compatibility with these polymers, such as an alkyl chain, a cyclohexyl group, or a benzene ring, more specifically, a coupling agent having an alkyl chain, a cyclohexyl group, or a benzene ring having 1 to 30, 1 to 25, or 1 to 20 carbon atoms. The coupling agents and / or hydrolysis condensates of the coupling agents may be used alone or in combination of two or more kinds.

[0054] Specifically, examples of the coupling agent include octadecyltriethoxysilane (OTS), octyltriethoxysilane, triethoxyphenylsilane, 3-phenylpropyltriethoxysilane, cyclohexyltrimethoxysilane, octadecyltrimethoxysilane, octadecyltrichlorosilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, γ-(2-aminoethyl)aminopropyltrimethoxysilane, γ-(2-aminoethyl)aminopropyltriethoxysilane, γ-(2-aminoethyl)aminopropylmethyldimethoxysilane, γ-(2-aminoethyl)aminopropylmethyldiethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane hydrochloride, Examples of suitable silanes include N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltriethoxysilane hydrochloride, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, vinyltriacetoxysilane, γ-anilinopropyltrimethoxysilane, γ-anilinopropyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, octadecyldimethyl[3-(trimethoxysilyl)propyl]ammonium chloride, octadecyldimethyl[3-(triethoxysilyl)propyl]ammonium chloride, γ-ureidopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, 3-isocyanatopropyltrimethoxysilane, and 3-isocyanatopropyltriethoxysilane.

[0055] By further containing a coupling agent in the inorganic particle-containing polymer particles, the adhesion between the inorganic particle-containing polymer particles and the supporting substrate may be further improved in some cases, particularly in cases where the adhesion between the inorganic particle-containing polymer particles and the supporting substrate is reduced due to the inclusion of inorganic particles.

[0056] Without being limited by theory, it is believed that when the inorganic particle-containing polymer particles further contain a coupling agent, the coupling agent attached to the surfaces of the inorganic particles improves the dispersibility of the inorganic particles in the inorganic particle-containing polymer particles, and the remaining coupling agent improves the adhesion of the inorganic particle-containing polymer particles to the supporting substrate (particularly the polymer substrate).

[0057] When the inorganic particle-containing polymer particles contain a coupling agent, the content ratio of the coupling agent can be, for example, such that the mass ratio of the inorganic particles to the coupling agent is 1:99 to 99:1, 5:95 to 95:5, 10:90 to 90:10, 20:80 to 80:20, 30:70 to 70:30, or 40:60 to 60:40. By making the mass ratio of the inorganic particles to the coupling agent within this range, it may be possible to ensure particularly good adhesion between the inorganic particle-containing polymer particles and the supporting substrate, and it may be possible to ensure the integrity and strength of the inorganic particle-containing polymer particles.

[0058] The inorganic particle-containing polymer particles used in the production method according to the present disclosure may contain other additives, such as a curing accelerator, a discoloration inhibitor, a surfactant, a colorant, and a viscosity modifier.

[0059] (Polymer particles not containing inorganic particles) The inorganic particle-free polymer particles contain a polymer and are free of inorganic particles.

[0060] For the polymer contained in the inorganic particle-free polymer particles, the above description of the inorganic particle-containing polymer particles can be referred to.In addition, the inorganic particle-free polymer particles can contain coupling agent and other additives, similar to the above description of the inorganic particle-containing polymer particles.By the inorganic particle-free polymer particles further containing coupling agent, the adhesion between the inorganic particle-free polymer particles and the supporting substrate can be further improved in some cases.

[0061] The inorganic particle-free polymer particles can be produced in the same manner as the spray drying method or reprecipitation method described above for the inorganic particle-containing polymer particles, except that a polymer solution is used as the precursor solution instead of a precursor solution in which inorganic particles are dispersed in a polymer solution.

[0062] (Mixture of polymer particles containing inorganic particles and polymer particles not containing inorganic particles) The polymer particles may be a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles.

[0063] FIG. 2 is a schematic diagram showing another embodiment of the method for producing a polymer particle layer-support substrate composite according to the present disclosure. In the method according to FIG. 2, a mixture of inorganic particle-containing polymer particles 14 and inorganic particle-free polymer particles 15 is used as the polymer particles. When a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles is used as the polymer particles, not only the content of inorganic particles contained in the inorganic particle-containing polymer particles but also the ratio of inorganic particle-containing polymer particles and inorganic particle-free polymer particles in the mixture can be adjusted. Therefore, by using a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles as the polymer particles, the content of inorganic particles in the polymer particle layer can be adjusted more simply.

[0064] The ratio of the inorganic particle-containing polymer particles and the inorganic particle-free polymer particles in the mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles is not particularly limited, but the inorganic particle-free polymer particles contained in the mixture may be 0.01 parts by mass or more, 0.1 parts by mass or more, 1 part by mass or more, 5 parts by mass or more, 10 parts by mass or more, or 50 parts by mass or more, relative to 100 parts by mass of the inorganic particle-containing polymer particles, and / or 10,000 parts by mass or less, 1,000 parts by mass or less, 100 parts by mass or less, or 75 parts by mass or less.

[0065] The mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles may be produced by directly mixing the inorganic particle-containing polymer particles and the inorganic particle-free polymer particles, or may be produced by adding the inorganic particle-free polymer particles or the inorganic particle-containing polymer particles to a suitable dispersion medium containing the inorganic particle-containing polymer particles or the inorganic particle-free polymer particles, and stirring the mixture.

[0066] <Support base material provision process> In the support substrate providing step of the polymer particle layer-support substrate composite according to the present disclosure, a support substrate is provided.

[0067] (Supporting base material)

[0068] The supporting substrate may be a polymer substrate, an inorganic substrate, or a release substrate.

[0069] The supporting substrate may be in any shape, such as a film, sheet, plate, tube, rod, disk, etc. The supporting substrate may be in any size.

[0070] The thickness of the supporting substrate is not particularly limited, and may be, for example, 1 nm or more, 5 nm or more, or 10 nm or more, and may be 10 cm or less, 1 cm or less, 1 mm or less, 100 μm or less, 30 μm or less, or 10 μm or less, or even 1000 nm or less, 500 nm or less, or 100 nm or less.

[0071] When the polymer particle layer on the supporting substrate is further subjected to a heat press treatment, the supporting substrate is preferably made of a material having a glass transition temperature or melting point higher than the glass transition temperature of the polymer constituting the polymer particles.

[0072] (Polymer substrate) The polymer substrate includes a polymer. For the polymer contained in the polymer substrate, the above description regarding the polymer contained in the polymer particle can be referred to. The polymer substrate may be formed of an olefin polymer, for example, a cycloolefin polymer. The polymer substrate may be a member of any shape, for example, a membrane or film. The thickness of the polymer substrate may be 0.5 μm or more, 1 μm or more, 2 μm or more, 5 μm or more, or 10 μm or more, and may be 1000 μm or less, 500 μm or less, 200 μm or less, or 100 μm or less.

[0073] The polymer substrate can be obtained, for example, by mixing and stirring a polymer dissolved in a solvent at room temperature to obtain a polymer solution, which is then applied to a substrate such as a glass plate and dried. The polymer substrate thus produced may be peeled off from the substrate as necessary. In the process of applying the polymer solution, the solution may be applied at a constant thickness using a doctor blade or a gravure coater. In the drying process after application, the solution may be dried by heating, for example, at a temperature of 80°C to 200°C for 1 minute to 2 hours. For example, toluene may be used as a solvent for dissolving the polymer.

[0074] The polymer substrate can also be obtained, for example, by depositing a powder made of a polymer on a substrate such as a glass plate or a layer of polymer particles, and then heat-pressing the layer made of the deposited powder.

[0075] The polymer substrate can also be obtained by extruding a molten polymer through a die such as a T-die to obtain a film, and then stretching the film to form it into a desired thickness.

[0076] The polymer substrate may or may not contain inorganic particles. In particular, the polymer substrate may be an inorganic particle-free polymer substrate that does not contain inorganic particles, or an inorganic particle-containing polymer substrate that contains inorganic particles.

[0077] When the polymer substrate contains inorganic particles, the content ratio of the inorganic particles and the polymer in the polymer substrate can be, for example, such that the volume ratio of the polymer to the inorganic particles is 1:99 to 99:1, 5:95 to 95:5, 10:90 to 85:15, 20:80 to 80:20, 30:70 to 75:25, or 40:60 to 70:30.

[0078] The polymer substrate as the supporting substrate may also be the following additional polymer substrate-polymer substrate composites: An additional polymer substrate-polymer substrate composite comprising a polymer substrate and an additional polymer substrate, the polymer substrate and the additional polymer substrate being disposed at least partially on top of each other, and at least one of the polymer substrate and the additional polymer substrate comprising inorganic particles.

[0079] In the above-mentioned additional polymer substrate-polymer substrate composite, the polymer substrate and the additional polymer substrate are preferably at least partially overlapped with each other via their respective main surfaces, more preferably overlapped with each other. Even more preferably, in the above-mentioned additional polymer substrate-polymer substrate composite, the main surface of one of the polymer substrate and the additional polymer substrate substantially covers the main surface of the other.

[0080] Alternatively, the polymer substrate may be an additional polymer substrate-polymer substrate composite as described below: a polymer substrate and an additional polymer substrate laminated to the polymer substrate; An additional polymer substrate-polymer substrate composite, wherein at least one of the polymer substrate and the additional polymer substrate comprises inorganic particles.

[0081] Preferably, in the additional polymer substrate-polymer substrate composite, the additional polymer substrate is laminated to a major surface of the polymer substrate.

[0082] The inorganic particle-free polymer substrate, inorganic particle-containing polymer substrate, or the additional polymer substrate-polymer substrate composite described above as the supporting substrate may be one produced by the method according to the present disclosure.

[0083] When the polymer particles do not contain inorganic particles, for example, when the polymer particles are inorganic particle-free polymer particles, the supporting substrate provided in the supporting substrate providing step contains inorganic particles.

[0084] (Inorganic base material) The material constituting the inorganic substrate may be any inorganic material, and may be selected from the group consisting of, for example, metals and semimetals, oxides of metals and semimetals, nitrides of metals and semimetals, carbides of metals and semimetals, carbon materials, and combinations thereof. Specifically, metals include aluminum, magnesium, titanium, nickel, chromium, iron, copper, gold, silver, tungsten, zirconium, yttrium, indium, iridium, and the like, and semimetals include silicon, germanium, GaAs, InGaAs, InAlAs, LiTaOx, NbTaOx, ZnTe, GaSe, GaP, CdTe, diamond, diamond-like carbon, and the like. Therefore, metal oxides include oxides of these metals, and semimetal oxides include oxides of these semimetals. Silicon oxides include glass such as quartz glass and soda glass, and aluminum oxides include sapphire. Nitrides include aluminum nitride, silicon nitride, and the like. Carbides include silicon carbide. Moreover, examples of the carbon material include diamond.

[0085] The surface of the inorganic material constituting the inorganic substrate, particularly a metal or semimetal, can be subjected to treatment such as ozone treatment or ultraviolet treatment in order to increase the number of functional groups, such as hydroxyl groups, available for bonding with the polymer contained in the polymer particle layer or the inorganic particle-containing polymer layer.

[0086] When a polymer particle layer formed on an inorganic substrate is subjected to a heat press treatment, from the viewpoint of stably forming a polymer substrate on the inorganic substrate, it is preferable to use an inorganic material having a melting point higher than the thermal modification temperature of the thermally modified polymer layer.

[0087] (Removal substrate) The release substrate is not particularly limited, but is preferably one that has excellent release properties from the polymer substrate. The release substrate may be, for example, a glass plate, a polyamide film, a polyethylene naphthalate film, a polyethylene sulfide, a polyphenylene oxide, or a polytetrafluoroethylene.

[0088] <Deposition process> In the depositing step in the method for producing a polymer particle layer-support substrate composite according to the present disclosure, polymer particles are deposited on the support substrate to form a polymer particle layer on the support substrate.

[0089] The polymer particles may be deposited on the supporting substrate by a known method, for example, a wet method including dispersing the polymer particles in a dispersion medium, an electrodeposition method, an electrostatic adsorption method, an inkjet method, or the like.

[0090] In one embodiment of the method for producing a polymer particle layer-support substrate composite according to the present disclosure, the depositing step may include the following operations: Providing a dispersion in which polymer particles are dispersed in a dispersion medium; and Coating the dispersion onto a supporting substrate and drying.

[0091] One embodiment of the deposition process according to the present disclosure is shown in schematic form in Fig. 3. In the method shown in Fig. 3, inorganic particle-containing polymer particles 14 are dispersed in a dispersion medium 24 to obtain a dispersion 22. The dispersion 22 is then applied onto a supporting substrate 100 using a device 29, such as a doctor blade, and dried to obtain a polymer particle layer-supporting substrate composite 210a.

[0092] (dispersion) The method of providing the dispersion in which the polymer particles are dispersed in the dispersion medium is not particularly limited. For example, the dispersion may be obtained by adding the polymer particles to the dispersion medium held in a container and appropriately stirring the mixture with a homogenizer or the like.

[0093] Figure 4 shows schematic diagrams of various embodiments of dispersions that can be used in the deposition process. In the dispersion 22' shown on the left in Figure 4, inorganic particle-free polymer particles 15 and inorganic particle-containing polymer particles 14 are dispersed in a dispersion medium 24. In the dispersion 22'' shown on the right in Figure 4, inorganic particle-free polymer particles 15 are dispersed in a dispersion medium 24.

[0094] (dispersion medium) The dispersion medium that can be used in the deposition process is not particularly limited as long as it can disperse the polymer particles well, but it is preferable that it is difficult to dissolve the polymer components contained in the polymer particles.Moreover, it is particularly preferable that the dispersion medium that can be used in the deposition process is difficult to dissolve the material that constitutes the support substrate.By using a dispersion medium that is difficult to dissolve the material that constitutes the support substrate, it is possible to avoid or suppress the undesirable influence on the support substrate when the polymer particles are deposited on the support substrate.

[0095] In particular, when a polymer substrate is used as the supporting substrate, it is preferable that the dispersion medium used in the deposition step is one that does not easily dissolve the polymer components that constitute the polymer substrate.

[0096] Dispersion media that can be used in the deposition process include water, alcohols, esters, ether solvents, and mixtures containing at least one of the foregoing. Alcohols include, for example, ethanol, 2-propanol, ethylene glycol, and terpineol.

[0097] When the viscosity of the dispersion medium is high, a dispersion with high viscosity is obtained, which has the advantage of providing a coating film with high uniformity in the coating process. From this viewpoint, it is preferable that the dispersion medium contains a high-viscosity solvent such as ethylene glycol or terpineol.

[0098] The boiling point of the solvent constituting the dispersion medium is preferably 20° C. or higher, or 50° C. or higher, and is preferably 350° C. or lower, 300° C. or lower, 250° C. or lower, or 230° C. or lower. When the boiling point of the solvent constituting the dispersion medium is within the above range, coating defects due to drying during coating are unlikely to occur, and the solvent can be easily removed in the drying step.

[0099] The dispersion medium used is preferably one that has good wettability with the resin contained in the polymer particles. When the dispersion medium has good wettability with the polymer particles, the polymer particles are well dispersed in the dispersion, and a uniform and defect-free coating film can be formed.

[0100] The dispersion may contain a dispersant to improve the dispersibility of the polymer particles in the dispersion medium. The dispersant may be, for example, a surfactant.

[0101] (Coating) In one embodiment of the deposition step, for example, the above dispersion is applied onto a support substrate and then dried. Coating methods include spin coating, roll coater, spray coating, die coater, applicator, dip coating, brush coating, spatula coating, roller coating, curtain flow coater, and other solution-based methods. In the coating process of the deposition step, for example, a doctor blade may be used to apply the coating at a constant thickness.

[0102] (Dry) In one embodiment of the deposition step, the drying process after coating may be performed by heating, for example, at a temperature of 100° C. to 200° C. for 1 minute to 2 hours. For example, after the dispersion is applied to the support substrate in the deposition step, drying may be performed by removing the dispersion medium by heating. In this case, the heating conditions may be selected to be a temperature, heating time, and atmospheric pressure conditions sufficient to remove the dispersion medium from the coating film.

[0103] (Method of manufacturing a supporting substrate-polymer particle layer-inorganic substrate composite) In one embodiment according to the present disclosure, the support substrate-polymer particle layer-inorganic substrate composite can be formed by a method having the following steps: Producing a polymer particle layer-support substrate composite according to the method of the present disclosure; Providing an inorganic substrate; and The polymer particle layer-supporting substrate composite is disposed on the inorganic substrate with the polymer particle layer facing the inorganic substrate.

[0104] Here, as the supporting substrate in the production of the supporting substrate-polymer particle layer-inorganic substrate composite, a polymer substrate is preferably used.

[0105] <Method for manufacturing polymer substrate-support substrate composite> The method for producing a polymer substrate-support substrate composite according to the present disclosure includes the steps of: Obtaining a polymer particle layer-support substrate composite by the method according to the present disclosure (composite providing step); and forming a polymer substrate on the support substrate by heat pressing the polymer particle layer of the polymer particle layer-support substrate composite (heat pressing step); Includes.

[0106] Fig. 5 is a schematic diagram showing one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure. In the method shown in Fig. 5, a polymer particle layer-support substrate composite 210a has an inorganic particle-containing polymer particle layer 160a deposited on a support substrate 100, and an inorganic particle-containing polymer substrate-support substrate composite 220a obtained by heat pressing the polymer particle layer-support substrate composite 210a has an inorganic particle-containing polymer substrate 170a disposed on the support substrate 100.

[0107] In the method for producing a polymer substrate-support substrate composite exemplified in Fig. 5, a polymer particle layer-support substrate composite obtained by the method according to the present disclosure is used. Therefore, as explained above, it is possible to avoid or suppress undesirable effects on the support substrate caused by a solvent for dissolving the polymer. In addition, since the amount of the solvent for dissolving the polymer can be reduced, it is possible to reduce the environmental burden and undesirable effects on health associated with the use of a solvent for dissolving the polymer.

[0108] Furthermore, since the manufacturing method of the polymer substrate-support substrate composite according to the present disclosure includes a step of heat-pressing the polymer particle layer, it is believed that a polymer substrate having better packing and strength than the polymer particle layer can be obtained. Without intending to be limited by theory, it is believed that gaps may exist between the polymer particles in the polymer particle layer, and that such gaps can be reduced or substantially eliminated by heat-pressing the polymer particle layer. As a result, it is believed that a polymer substrate having better packing and strength can be obtained.

[0109] <Composite provision process> In the composite providing step in the method for producing a polymer substrate-support substrate composite, a polymer particle layer-support substrate composite is obtained according to the method for producing a polymer particle layer-support substrate composite according to the present disclosure. For the method for obtaining the polymer particle layer-support substrate composite, the description of the method for producing a polymer particle layer-support substrate composite described above can be referred to.

[0110] In the method for producing a polymer substrate-support substrate composite according to the present disclosure, the inorganic particle content in the polymer substrate of the resulting polymer substrate-support substrate composite can be adjusted by adjusting the inorganic particle content in the polymer particle layer of the polymer particle layer-support substrate composite. The inorganic particle content in the polymer particle layer may be adjusted by adjusting the amount of inorganic particles in the inorganic particle-containing polymer particles constituting the polymer particle layer, or by adjusting the ratio of inorganic particle-containing polymer particles to inorganic particle-free polymer particles.

[0111] <Heat pressing process> In the heat pressing step in the manufacturing method of the polymer substrate-support substrate composite, the polymer particle layer of the polymer particle layer-support substrate composite provided in the above-mentioned composite providing step is heat pressed to form a polymer substrate on the support substrate.

[0112] The manner of performing the heat press is not particularly limited. For example, the heat press may be vacuum heat press using a vacuum heating press. The temperature of the heat press is preferably equal to or higher than the thermal denaturation temperature of the polymer constituting the polymer particles. The heat press may be performed, for example, under vacuum conditions (for example, 0 to 10 Pa), under temperature conditions of 100°C to 300°C, and for 1 minute to 10 hours. The heat press may be performed, for example, under pressure conditions of 0.1 to 1000 MPa, 0.2 to 500 MPa, 0.5 to 500 MPa, 1 to 200 MPa, 2 to 100 MPa, 5 to 100 MPa, or 10 to 70 MPa.

[0113] <Polymer Substrate as Support Substrate> In one embodiment according to the present disclosure, in the method for producing a polymer substrate-support substrate composite, a polymer substrate is used as the support substrate.

[0114] 6A is a schematic diagram showing one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, which includes using a polymer substrate not containing inorganic particles as a support substrate. In the production method shown in FIG. 6A, a polymer particle layer-support substrate composite 212a having an inorganic particle-containing polymer particle layer 160a deposited on a polymer substrate 150 not containing inorganic particles as a support substrate is heat-pressed to obtain an inorganic particle-containing polymer substrate-support substrate composite 222a. The obtained inorganic particle-containing polymer substrate-support substrate composite 222a has an inorganic particle-containing polymer substrate 170a disposed on the inorganic particle-free polymer substrate 150 as a support substrate.

[0115] Conventionally, a composite in which an inorganic particle-containing polymer containing inorganic particles and a polymer are laminated with an inorganic particle-free polymer has been used, for example, as an optical member. In a conventional method, when an inorganic particle-containing polymer is arranged on an inorganic particle-free polymer substrate, inorganic particles are contained in a polymer solution in which a polymer is dissolved in a solvent and then applied. However, in this method, the polymer substrate is dissolved by the solvent for dissolving the polymer during application, and the quality of the resulting composite may be deteriorated.

[0116] In contrast, in the method illustrated in FIG. 6A, a composite in which an inorganic particle-containing polymer layer is disposed on a polymer substrate as a support substrate can be obtained by depositing polymer particles instead of applying a polymer solution, and the amount of solvent used to dissolve the polymer is reduced. Therefore, the problem of the polymer substrate being dissolved by a solvent can be avoided or suppressed, and as a result, good properties of the composite produced can be ensured. In addition, the polymer substrate-support substrate composite having a polymer substrate as a support substrate obtained by the method according to the present disclosure has improved flatness of the interface between the polymer substrates compared to a conventional method of depositing using a polymer solution.

[0117] Furthermore, the polymer substrate-support substrate composite having the inorganic particle-containing polymer substrate has physical properties that are useful for various applications, compared to substrates consisting of only polymers. For example, since it is believed that the inorganic particle-containing polymer substrate may have a refractive index different from that of a layer consisting of only polymers, the polymer substrate-support substrate composite having the inorganic particle-containing polymer substrate is believed to be useful as an optical component having excellent reflection and transmission properties, particularly excellent antireflection properties.

[0118] In another embodiment of the method for producing a polymer substrate-support substrate composite according to the present disclosure, a polymer substrate containing inorganic particles can also be used as the support substrate.

[0119] FIG. 6B illustrates a schematic diagram of one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, comprising using an inorganic particle-containing polymer substrate as the support substrate.

[0120] 6B, a polymer particle layer-support substrate composite 213a having a polymer particle layer 160 not containing inorganic particles deposited on a polymer substrate 170a containing inorganic particles as a support substrate is heat-pressed to obtain a polymer substrate-support substrate composite 222a. The polymer substrate-support substrate composite 222a has a polymer substrate 150 not containing inorganic particles disposed on the polymer substrate 170a containing inorganic particles as a support substrate.

[0121] 6A and 6B have different manufacturing steps, but the resulting composite has the same configuration. Therefore, the present disclosure can provide multiple options for manufacturing a composite having a specific configuration.

[0122] 6C is a schematic diagram showing another embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, which includes using an inorganic particle-containing polymer substrate as a support substrate. In FIG. 6C, a polymer particle layer-support substrate composite 213b has an inorganic particle-containing polymer particle layer 160b deposited on an inorganic particle-containing polymer substrate 170a as a support substrate, and a polymer substrate-support substrate composite 222b obtained by heat pressing has an inorganic particle-containing polymer substrate 170b disposed on the inorganic particle-containing polymer substrate 170a as a support substrate.

[0123] In FIG. 6C, the inorganic particle-containing polymer substrate 170b has a lower inorganic particle content than the inorganic particle-containing polymer substrate 170a. That is, the polymer substrate-support substrate composite 222b has a gradient of inorganic particle content in which the inorganic particle content increases or decreases along the stacking direction. In order to form such a gradient of inorganic particle content, the method according to FIG. 6C uses a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles, and adjusts the ratio of the inorganic particle-containing polymer particles and inorganic particle-free polymer particles in the mixture so that the inorganic particle content in the inorganic particle-containing polymer substrate 170b is lower than that in the inorganic particle-containing polymer substrate 170a.

[0124] Therefore, according to the method of the present disclosure, a composite having two polymer substrates with different inorganic particle contents can be produced relatively easily while ensuring excellent quality.

[0125] In addition, a polymer substrate-support substrate composite having two inorganic particle-containing polymer substrates with different inorganic particle contents has physical properties that are useful for various applications compared to a substrate made of only a polymer. For example, in this composite, it is possible to adjust the refractive index between the constituent members by adjusting the difference in inorganic particle content between adjacent inorganic particle-containing polymer substrates, and therefore it is considered to be useful as an optical member having excellent antireflection properties.

[0126] In another embodiment of the method for producing a polymer substrate-support substrate composite according to the present disclosure, the following additional polymer substrate-polymer substrate composites can be used as the support substrate: An additional polymer substrate-polymer substrate composite comprising a polymer substrate and an additional polymer substrate, the polymer substrate and the additional polymer substrate being disposed at least partially on top of each other, and at least one of the polymer substrate and the additional polymer substrate comprising inorganic particles.

[0127] For the additional polymer substrate-polymer substrate composite as the supporting substrate, the above description regarding the supporting substrate in the manufacturing method of the polymer particle layer-support substrate composite can be referred to. The additional polymer substrate-polymer substrate composite may be, for example, the composite 222a or 222b illustrated in Figures 6A to 6C.

[0128] Figures 7A and 7B are schematic diagrams showing an embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, including using a composite having two polymer substrates as a support substrate. The polymer particle layer-support substrate composites 322a and 322b shown in Figures 7A and 7B have composites 222a and 222b having two polymer substrates as a support substrate, respectively, and have polymer particle layers 160a and 160c, respectively. The composites 222a and 222b have the same configuration as described in Figures 6A and 6B.

[0129] In the composite 322a in Fig. 7A, an inorganic particle-containing polymer particle layer 160a is formed on the inorganic particle-free polymer substrate 150 constituting the composite 222a. A composite 332a obtained by heat pressing this composite 322a has two inorganic particle-containing polymer substrates 170a, 170a' and the inorganic particle-free polymer substrate 150 sandwiched between them.

[0130] 7B, a polymer particle layer 160c composed of a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles is formed on 170b, which has a relatively low inorganic particle content among the two inorganic particle-containing polymer substrates constituting the composite 222b. A composite 332b obtained by subjecting this composite 322b to a heat press treatment has three inorganic particle-containing polymer substrates 170a, 170b, and 170c, which are laminated so as to have a gradient of the inorganic particle content along the lamination direction.

[0131] Polymer substrate-support substrate composites having two polymer substrates as support substrates have physical properties useful for various applications. For example, in these composites, it is possible to adjust the refractive index between the constituent members by adjusting the difference in inorganic particle content between adjacent inorganic particle-containing polymer substrates, and therefore it is considered to be useful as an optical member having excellent transmission and reflection properties, particularly excellent antireflection properties. In particular, since the composite exemplified in Figures 7A and B has three polymer substrates, it is considered possible to adjust the optical properties more finely.

[0132] (An embodiment in which the supporting substrate is held by the peeling substrate) In one embodiment according to the present disclosure, the support substrate is held on a release substrate, and the polymer substrate is peeled off from the release substrate before or after the polymer particle layer is heat pressed.

[0133] In the method shown in Fig. 8A, a polymer substrate 150 as a support substrate is held on a peeling substrate 190. After forming an inorganic particle-containing polymer particle layer 160a on the polymer substrate 150 as a support substrate by the method according to the present disclosure, a composite 226a of a polymer substrate-support substrate composite 222a and a peeling substrate 190 is obtained by a heat press treatment. Then, in this composite 226a, the polymer substrate-support substrate composite 222a is peeled off from the peeling substrate 190 to obtain a polymer substrate-support substrate composite 222a.

[0134] In another embodiment according to the present disclosure, the polymer substrate as a support substrate may be peeled off from the release substrate before the polymer particle layer is heat-pressed. That is, for example, as shown in FIG. 8B, a polymer substrate 150 as a support substrate is formed on a release substrate 190, and an inorganic particle-containing polymer particle layer 160a is formed on the polymer substrate 150 to obtain a composite 216a of the polymer particle layer-polymer substrate composite and the release substrate, and then the polymer particle layer-support substrate composite 212a is peeled off from the release substrate 190 in the composite 216a to obtain a polymer particle layer-support composite 212a. Furthermore, a polymer substrate-support substrate composite 222a can be manufactured by subjecting the polymer particle layer-support substrate composite 212a thus obtained to a heat press treatment.

[0135] The release substrate for holding the support substrate is not particularly limited. The release substrate is preferably a glass plate, a polyamide film, a polyethylene naphthalate film, a polyethylene sulfide, a polyphenylene oxide, or a polytetrafluoroethylene, because the release substrate has good releasability when peeling the polymer-containing layer from the release substrate.

[0136] According to the above-mentioned manufacturing method in which the support substrate is held by the release substrate, it becomes possible to protect the support substrate from the external environment when forming the polymer particle layer and / or when hot pressing the polymer particle layer, and in some cases, the quality of the obtained composite can be further improved.

[0137] <Aspects in which an inorganic substrate is used as a supporting substrate> In one embodiment according to the present disclosure, in the method for producing a polymer substrate-support substrate composite, an inorganic substrate is used as the support substrate.

[0138] FIG. 9 is a schematic diagram showing one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure when an inorganic substrate is used as the support substrate. In the embodiment shown in FIG. 9, a polymer particle layer-support substrate composite 421a having an inorganic particle-containing polymer particle layer 160a deposited on an inorganic substrate 180 as the support substrate is produced by the method according to the present disclosure. Then, the polymer particle layer 160a of the obtained polymer particle layer-support substrate composite 421a is heat-pressed to form an inorganic particle-containing polymer substrate 170a on the inorganic substrate 180 as the support substrate, thereby obtaining a polymer substrate-support substrate composite 420a. The obtained polymer substrate-support substrate composite 420a has an inorganic particle-containing polymer substrate 170a disposed on the inorganic substrate 180 as the support substrate.

[0139] A polymer substrate-support substrate composite having an inorganic substrate as a support substrate has different physical properties compared to, for example, an inorganic substrate, and is useful for various applications, particularly as an optical member. For example, a polymer substrate-support substrate composite having an inorganic particle-containing polymer substrate as a polymer substrate and an inorganic substrate as a support substrate has a reduced difference in refractive index between the constituent members compared to a composite consisting of an inorganic particle-free polymer substrate and an inorganic substrate, and as a result, it is considered that the reflectance of the composite is reduced.

[0140] <Aspect of using a release substrate as a supporting substrate> In one embodiment according to the present disclosure, in the method for producing a polymer substrate-support substrate composite, a release substrate is used as the support substrate.

[0141] In particular, according to the present disclosure, a polymer substrate can be produced by using a release substrate as a supporting substrate. That is, the present disclosure includes a method for producing a polymer substrate, including: Obtaining a polymer substrate-support substrate composite by the method according to the present disclosure using a release substrate as the support substrate (composite providing step); In the polymer substrate-support substrate complex, the polymer substrate is peeled off from the support substrate, which is a peeling substrate, to obtain the polymer substrate (peeling step).

[0142] FIG. 10A shows a schematic diagram of a method for obtaining an inorganic particle-free polymer substrate 150 by using a peeling substrate 190 as a support substrate. In the method shown in FIG. 10A, a polymer particle layer-support substrate composite 216b is produced by the method according to the present disclosure, using inorganic particle-free polymer particles as polymer particles and a peeling substrate 190 as a support substrate. Then, the inorganic particle-free polymer particle layer 160 in the polymer particle layer-support substrate composite 216b is heat-pressed to form an inorganic particle-free polymer substrate 150 on the peeling substrate 190, thereby obtaining a polymer substrate-support substrate composite 226b. Then, the inorganic particle-free polymer substrate 150 is peeled off from the peeling substrate 190 to obtain an inorganic particle-free polymer substrate 150 as a polymer substrate.

[0143] FIG. 10B shows a method for obtaining an inorganic particle-containing polymer substrate 170a as a polymer substrate by a method similar to that shown in FIG. 10A, except that inorganic particle-containing polymer particles are used as the polymer particles.

[0144] In the above-described production method according to the present disclosure for obtaining a polymer substrate, the inorganic particle-containing polymer substrate can be peeled off relatively easily by selecting an appropriate substrate for peeling.

[0145] In addition, the inorganic particle-containing polymer substrate obtained by the manufacturing method according to the present disclosure has physical properties different from those of, for example, polymer-only polymer substrates due to the inclusion of inorganic particles. In particular, the inorganic particle-containing polymer substrate can have an intermediate value between the inorganic substrate and the polymer in terms of refractive index, and is therefore useful, for example, in optical applications. Specifically, for example, when the difference in refractive index between the inorganic substrate and the polymer is large, the inorganic particle-containing polymer substrate can be used to reduce problems caused by the difference, such as the problem of increased reflectance.

[0146] (Composite provision process) In the composite providing step of the method for producing a polymer substrate according to the present disclosure, a release substrate is used as the support substrate, and a polymer substrate-support substrate composite is obtained by the method according to the present disclosure. The above description can be referred to for the method for producing a polymer substrate-support substrate composite.

[0147] (Removal substrate) The release substrate used as the supporting substrate in the method for producing a polymer substrate according to the present disclosure is not particularly limited, but is preferably one that has excellent release properties from the polymer substrate. For the release substrate, the above description can be referred to.

[0148] (Peeling process) In the peeling step of the method for producing a polymer substrate according to the present disclosure, the polymer substrate is obtained by peeling the polymer substrate from the supporting substrate, which is a substrate for peeling, in the polymer substrate-supporting substrate composite. The peeling method is not particularly limited and can be performed by a known method.

[0149] <<Method for producing additional polymer substrate-polymer substrate composite, including overlapping substrates>> The present disclosure includes additional methods of making polymer substrate-polymer substrate composites, including: Producing a polymer substrate by the method according to the present disclosure (substrate production step); Providing an additional polymer substrate (substrate providing step); and The polymer substrate and the additional polymer substrate are superimposed on each other (positioning step).

[0150] 11, an inorganic particle-containing polymer substrate 170a is produced by the method according to the present disclosure, and an inorganic particle-free polymer substrate 150 is provided as an additional polymer substrate. The inorganic particle-containing polymer substrate 170a and the inorganic particle-free polymer substrate 150 are then stacked together to obtain an additional polymer substrate-polymer substrate composite 222a′.

[0151] The additional polymer substrate-polymer substrate composite having an inorganic particle-containing polymer substrate as the additional polymer substrate has physical properties useful for various applications, compared to a substrate consisting of only a polymer. In particular, since it is believed that the inorganic particle-containing polymer substrate may have a refractive index different from that of a layer consisting of only a polymer, the composite is believed to be useful as an optical member having excellent anti-reflection properties.

[0152] <Base material manufacturing process> In the substrate manufacturing step of the additional method for manufacturing a polymer substrate-polymer substrate composite including overlapping substrates according to the present disclosure, the polymer substrate is manufactured by the method according to the present disclosure. The above description of the method for manufacturing the polymer substrate can be referred to.

[0153] <Base material provision process> In the substrate providing step in the method for producing an additional polymer substrate-polymer substrate composite including overlaying substrates according to the present disclosure, an additional polymer substrate is provided. The additional polymer substrate may be an inorganic substrate-containing polymer substrate or an inorganic substrate-free polymer substrate. For the inorganic substrate-containing polymer substrate or inorganic substrate-free polymer substrate as the additional polymer substrate, the above description may be referred to. The inorganic substrate-containing polymer substrate or inorganic substrate-free polymer substrate as the additional polymer substrate may be one produced by the method for producing a polymer substrate according to the present disclosure.

[0154] <Placement process> In the arranging step in the manufacturing method of an additional polymer substrate-polymer substrate composite including overlapping substrates according to the present disclosure, the polymer substrate and the additional polymer substrate are overlapped with each other. In the arranging step, the polymer substrate and the additional polymer substrate are preferably overlapped with each other via their main surfaces so as to at least partially overlap each other, in particular so as to overlap each other. More preferably, the polymer substrate and the additional polymer substrate are overlapped with each other so that the main surface of one of the polymer substrate and the additional polymer substrate substantially covers the main surface of the other.

[0155] 〈Thermocompression bonding process〉 In one embodiment according to the present disclosure, the additional polymer substrate-polymer substrate composite obtained in the disposing step can be further subjected to a thermocompression treatment. By subjecting the composite to a thermocompression treatment, the adhesion between the additional polymer substrate and the polymer substrate can be further improved. For the thermocompression treatment, the following description regarding the method for producing a polymer substrate-inorganic substrate composite can be referred to.

[0156] <Production method of polymer substrate-inorganic substrate composite> The present disclosure includes a method for making a polymer substrate-inorganic substrate composite, comprising: Producing a polymer substrate by the method according to the present disclosure (substrate production step); Providing an inorganic substrate (inorganic substrate providing step); and Disposing a polymeric substrate on an inorganic substrate (disposing step).

[0157] In the method shown in Fig. 12, an inorganic particle-containing polymer substrate 170a is manufactured by the method according to the present disclosure, and an inorganic substrate 180 is provided. Then, the inorganic particle-containing polymer substrate 170a is disposed on the inorganic substrate 180 to obtain a polymer substrate-inorganic substrate composite 420a. The inorganic particle-containing polymer substrate 170a may be manufactured by, for example, the manufacturing method illustrated in Fig. 10B.

[0158] A polymer substrate-inorganic substrate composite having an inorganic particle-containing polymer substrate as the polymer substrate has different physical properties compared to an inorganic substrate, and is useful for various applications, particularly as an optical member. In particular, the composite has a reduced difference in refractive index between the constituent members compared to a composite consisting of a polymer substrate not containing inorganic particles and an inorganic substrate, and as a result, it is considered that the reflectance of the composite is reduced.

[0159] <Base material manufacturing process> In the substrate manufacturing process in the method for manufacturing a polymer substrate-inorganic substrate composite of the present disclosure, a polymer substrate is manufactured by the method according to the present disclosure. The above description of the present disclosure can be referred to for the method for manufacturing a polymer substrate.

[0160] <Inorganic base material provision process> In the inorganic substrate providing step in the method for producing a polymer substrate-inorganic substrate composite of the present disclosure, an inorganic substrate is provided. For the inorganic substrate, the above description can be referred to.

[0161] <Placement process> In the disposing step in the manufacturing method of the polymer substrate-inorganic substrate composite of the present disclosure, the polymer substrate is disposed on the inorganic substrate.

[0162] In the disposing step, the polymer substrate may be disposed on the inorganic substrate such that the polymer substrate and the inorganic substrate at least partially overlap each other, particularly overlap each other, via their main surfaces. Alternatively, in the disposing step, the polymer substrate may be disposed on the inorganic substrate such that the main surface of one of the polymer substrate and the inorganic substrate substantially covers the main surface of the other.

[0163] The manner in which the polymer substrate is disposed on the inorganic substrate in the disposing step is not particularly limited. For example, the polymer substrate can be disposed directly on the inorganic substrate.

[0164] In another embodiment, when the polymer substrate is disposed on the inorganic substrate in the disposing step, for example, an adhesive polymer layer is disposed on the inorganic substrate in advance, and the polymer substrate can be disposed on the inorganic substrate via the adhesive polymer layer. When the polymer substrate is disposed on the inorganic substrate via the adhesive polymer layer, the adhesion between the polymer substrate and the inorganic substrate is further improved, which is preferable.

[0165] The adhesive polymer layer is not particularly limited as long as it can improve the adhesion between the polymer substrate and the inorganic substrate. In order to further promote the bonding between the adhesive polymer layer and the polymer substrate, it is particularly preferable that the adhesive polymer layer is composed of the same type of polymer as the polymer substrate.

[0166] The adhesive polymer layer is preferably a thermally modified polymer layer. The thermally modified polymer layer as the adhesive polymer layer can be formed, for example, by forming a polymer layer on an inorganic substrate by coating and / or thermocompression bonding, and heating the polymer layer to form a thermally modified polymer layer. The heating method is not particularly limited, and examples thereof include a method using a heating source such as an oven, a hot plate, infrared rays, a flame, a laser, or a flash lamp. Here, the degree of thermal modification can be adjusted by the heating temperature, time, surrounding atmosphere, etc. for thermal modification. Specifically, the degree of thermal modification can be, for example, such that the adhesion of the thermally modified polymer layer to the inorganic substrate is greater than the adhesion of the polymer layer to the inorganic substrate.

[0167] 〈Thermocompression bonding process〉 In one embodiment of the present disclosure, the polymer substrate-inorganic substrate composite obtained in the disposing step can be further subjected to a thermocompression treatment. When the composite is subjected to a thermocompression treatment, the adhesion between the polymer substrate and the inorganic substrate can be further improved.

[0168] The manner of thermocompression bonding of the polymer substrate-inorganic substrate composite is not particularly limited, and can be performed by a known method. The thermocompression bonding may be performed, for example, under vacuum conditions (for example, 0 to 10 Pa) and / or at a temperature equal to or higher than the thermal denaturation temperature of the polymer constituting the polymer substrate. The temperature of the thermocompression bonding may be, for example, 80°C to 300°C. The pressure of the thermocompression bonding may be, for example, 0.1 to 1000 MPa, or 0.2 to 500 MPa, 0.5 to 500 MPa, 1 to 200 MPa, 2 to 100 MPa, 5 to 100 MPa, or 10 to 70 MPa. The time of the thermocompression bonding may be, for example, 1 minute to 10 hours, or 10 minutes to 300 minutes, or 30 minutes to 120 minutes.

[0169] <<Method for producing an additional polymer substrate-polymer substrate-inorganic substrate composite, comprising providing an additional polymer substrate>> The present disclosure includes additional methods of making polymer substrate-polymer substrate-inorganic substrate composites, including: Producing a polymer substrate-inorganic substrate composite by the method according to the present disclosure (composite production process) Providing an additional polymer substrate (substrate providing step); and Disposing an additional polymer substrate on top of the polymer substrate in the polymer substrate-inorganic substrate composite (disposing step).

[0170] 13, a polymer substrate-inorganic substrate composite 420a is produced by the method according to the present disclosure, and an additional polymer substrate is provided as an inorganic particle-free polymer substrate 150. The inorganic particle-free polymer substrate 150 is then disposed on top of the inorganic particle-containing polymer substrate 170a in the polymer substrate-inorganic substrate composite 420a, thereby producing an additional polymer substrate-polymer substrate-inorganic substrate composite 430a.

[0171] The additional polymer substrate-polymer substrate-inorganic substrate composite having an inorganic particle-containing polymer substrate has excellent physical properties, and in particular, compared to a composite consisting of a polymer substrate not containing inorganic particles and an inorganic substrate only, the difference in refractive index between the constituent members is reduced, and as a result, it is believed to have excellent reflection characteristics.

[0172] <Composite manufacturing process> In the composite manufacturing step of the additional polymer substrate-polymer substrate-inorganic substrate composite manufacturing method including providing an additional polymer substrate according to the present disclosure, a polymer substrate-inorganic substrate composite is manufactured by the method according to the present disclosure. The above description can be referred to for the method for manufacturing a polymer substrate-inorganic substrate composite, and for example, a polymer substrate-inorganic substrate composite can be manufactured by the manufacturing method exemplified in FIG. 9 or FIG. 12 described above.

[0173] Preferably, in the composite production step, a polymer substrate-inorganic substrate composite is produced having an inorganic substrate-containing polymer substrate as the polymer substrate. In this case, an additional polymer substrate-polymer substrate-inorganic substrate composite having a relatively reduced refractive index between components can be obtained, which is particularly useful in optical applications.

[0174] <Base material provision process> In the substrate providing step of the method for producing an additional polymer substrate-polymer substrate-inorganic substrate composite according to the present disclosure, which includes providing an additional polymer substrate, an additional polymer substrate is provided. The additional polymer substrate may be an inorganic substrate-containing polymer substrate or an inorganic substrate-free polymer substrate, which may be produced by the method according to the present disclosure. For the inorganic substrate-containing polymer substrate or inorganic substrate-free polymer substrate as the additional polymer substrate, the above description can be referred to. Preferably, the additional polymer substrate provided in the substrate providing step is an inorganic particle-free polymer substrate, or has a lower inorganic particle content than the polymer substrate contained in the composite produced in the composite production step.

[0175] <Placement process> In the arranging step of the method for producing an additional polymer substrate-polymer substrate-inorganic substrate composite according to the present disclosure, which includes providing an additional polymer substrate, the additional polymer substrate is arranged on the polymer substrate in the polymer substrate-inorganic substrate composite. In the arranging step, the additional polymer substrate and the polymer substrate in the polymer substrate-inorganic substrate composite may be arranged so that they at least partially overlap each other via their main surfaces, in particular so that they overlap each other. Alternatively, in the arranging step, the additional polymer substrate or the polymer substrate in the polymer substrate-inorganic substrate composite may be arranged so that one main surface of the additional polymer substrate or the polymer substrate substantially covers the other main surface.

[0176] 〈Thermocompression bonding process〉 In one embodiment according to the present disclosure, the additional polymer substrate-polymer substrate-inorganic substrate composite obtained in the disposing step can be further subjected to a thermocompression treatment. The thermocompression treatment can further improve the adhesion between the substrates constituting the composite. For the thermocompression treatment, the above description regarding the "method for producing a polymer substrate-inorganic substrate composite" can be referred to.

[0177] In addition, when producing an additional polymer substrate-polymer substrate-inorganic substrate composite, the additional polymer substrate may be placed on the polymer substrate in the polymer substrate-inorganic substrate composite, or the polymer substrate may be placed at a different timing. Although not shown in FIG. 13, for example, after producing an additional polymer substrate-polymer substrate composite by placing a polymer substrate on an inorganic particle-containing polymer substrate, this additional polymer substrate-polymer substrate composite may be placed on the inorganic substrate, or the additional polymer substrate may be placed on the polymer substrate before peeling the polymer substrate from the peeling substrate in the polymer substrate-peeling substrate composite.

[0178] <<Method for producing additional polymer particle layer-polymer particle layer-support substrate composite>> The present disclosure includes additional methods of making a polymer particle layer-polymer particle layer-support substrate composite, including: Obtaining a polymer particle layer-support substrate composite by the method according to the present disclosure (composite providing step); Depositing inorganic particle-free polymer particles, inorganic particle-containing polymer particles, or a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles on the polymer particle layer-support substrate composite to form an additional polymer particle layer on the polymer particle layer-support substrate composite (additional polymer particle layer providing step).

[0179] In the example shown in FIG. 14A, a mixture of inorganic particle-containing polymer particles 14 and inorganic particle-free polymer particles 15 is deposited onto polymer particle layer 160b of polymer particle layer-support substrate composite 214b to form an additional polymer particle layer 160c, producing composite 312b.

[0180] According to the manufacturing method of the present disclosure, a composite having two polymer particle layers can be relatively easily manufactured, and in particular, a composite having two polymer particle layers having different inorganic particle contents can be relatively easily manufactured.

[0181] An additional polymer particle layer-polymer particle layer-support substrate composite having a polymer substrate as a support substrate is believed to be useful as an optical component because it may have multiple polymer particle layers with different inorganic particle contents and therefore have different optical properties compared to, for example, a single polymer substrate.

[0182] <Composite provision process> In the composite providing step in the manufacturing method of the additional polymer particle layer-polymer particle layer-support substrate composite according to the present disclosure, a polymer particle layer-support substrate composite is obtained by the method according to the present disclosure. Preferably, the polymer particle layer-support substrate composite is manufactured using a polymer substrate as the support substrate. The above description can be referred to for the manufacturing method of the polymer particle layer-support substrate composite.

[0183] <Step of Providing Additional Polymer Particle Layer> In the additional polymer particle layer providing step in the manufacturing method for an additional polymer particle layer-polymer particle layer-support substrate composite according to the present disclosure, inorganic particle-free polymer particles, inorganic particle-containing polymer particles, or a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles are deposited on the polymer particle layer-support substrate composite to form an additional polymer particle layer on the polymer particle layer-support substrate composite.

[0184] The deposition of the polymer particles can be carried out in the same manner as described above for the polymer particle layer-support substrate composite according to the present disclosure. Specifically, for example, a dispersion is prepared by dispersing the polymer particles in a dispersion medium, and the dispersion is deposited on the polymer particle layer of the polymer particle layer-support substrate composite provided in the composite providing step, and the dispersion is dried to produce an additional polymer particle layer-polymer particle layer-support substrate composite.

[0185] <<Additional method for producing polymer substrate-polymer substrate-support substrate composite>> Methods according to the present disclosure include additional methods for making polymer substrate-polymer substrate-support substrate composites, including: Producing an additional polymer particle layer-polymer particle layer-support substrate composite by the method according to the present disclosure (composite production step); The polymer particle layer and the additional polymer particle layer of the additional polymer particle layer-polymer particle layer-support substrate composite are heat-pressed to form a polymer substrate and an additional polymer substrate on the support substrate (heat-pressing step).

[0186] Figure 14B shows one embodiment of a method for producing an additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure when a polymer substrate is used as the support substrate. In the method shown in Figure 14B, the polymer particle layer 160b and the additional polymer particle layer 160c of the additional polymer particle layer-polymer particle layer-support substrate composite 312b produced by the method according to the present disclosure are heat pressed to produce an additional polymer substrate-polymer substrate-support substrate composite 332b. The obtained additional polymer substrate-polymer substrate-support substrate composite 332b has polymer substrates 170a, 170b, and 170c with different inorganic particle contents.

[0187] In the additional method for producing a polymer substrate-polymer substrate-support substrate composite according to the present disclosure, a composite including a plurality of stacked polymer particle layers is heat-pressed, so that two polymer particle layers can be heat-pressed at once to produce a composite having a plurality of stacked polymer substrates. Therefore, according to this production method, a composite having two stacked polymer substrates can be produced relatively easily. In particular, according to the additional method for producing a polymer substrate-polymer substrate-support substrate composite according to the present disclosure, a composite including three or four polymer substrates can be produced relatively easily by using a polymer substrate as the support substrate.

[0188] Additionally, the method of the present disclosure reduces the use of solvents to dissolve the polymer, resulting in a composite with improved interfacial planarity between adjacent polymer substrates.

[0189] Furthermore, the additional polymer substrate-polymer substrate-support substrate composite having inorganic particle-containing polymer substrate has physical properties useful for various applications.For example, in the composite, the refractive index between components can be adjusted by adjusting the difference in inorganic particle content between adjacent inorganic particle-containing polymer substrates, so it is considered to be useful as an optical component having excellent reflection properties, particularly excellent antireflection properties.

[0190] As described above, according to the manufacturing method of the additional polymer substrate-polymer substrate-support substrate composite of the present disclosure, a composite composed of four polymer substrates can also be manufactured. In the method shown in FIG. 15A, a polymer particle layer-support substrate composite 322b having two polymer substrates as a support substrate is manufactured by the method according to the present disclosure, and an additional polymer particle layer 160d is formed on the polymer particle layer 160c of this composite 322b to manufacture an additional polymer particle layer-polymer particle layer-support substrate composite 422a. Then, in FIG. 15B, an additional polymer substrate-polymer substrate-support substrate composite 442a is manufactured by heat pressing the additional polymer particle layer 160d and the polymer particle layer 160c of the obtained composite 422a. The obtained composite 442a has four polymer substrates 170a, 170b, 170c, and 170d having different inorganic particle contents, and has a gradient of inorganic particle content in the stacking direction.

[0191] The composite composed of four polymer substrates obtained by the method according to the present disclosure can have a configuration in which the content of inorganic particles increases or decreases stepwise in the stacking direction starting from the polymer substrate constituting the outermost layer, as shown in, for example, Fig. 15B. In such a composite, since four inorganic particle-containing polymer substrates with different inorganic particle contents are adjacent to each other, it is possible to adjust the refractive index between the constituent members more finely, and it is considered to be particularly useful as an optical member having excellent antireflection properties.

[0192] <Composite manufacturing process> In the composite manufacturing step in the manufacturing method of the additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure, the additional polymer particle layer-polymer particle layer-support substrate composite is manufactured by the method according to the present disclosure. The manufacturing method of the additional polymer particle layer-polymer particle layer-support substrate composite can be referred to the above description.

[0193] <Heat pressing process> In the heat pressing step in the manufacturing method of the additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure, the polymer particle layer and the additional polymer particle layer of the additional polymer particle layer-polymer particle layer-support substrate composite are heat pressed to form a polymer substrate and an additional polymer substrate on the support substrate. For the method of heat pressing the polymer particle layer and the additional polymer particle layer, the above description of the manufacturing method of the polymer substrate-support substrate composite according to the present disclosure can be referred to.

[0194] <<Additional method for producing a polymer substrate-polymer substrate-support substrate composite, including using an inorganic substrate as a support substrate>> In the manufacturing method of an additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure, by using an inorganic substrate as the support substrate, a composite in which a polymer substrate and an additional polymer substrate are laminated on the inorganic substrate can be obtained.

[0195] In Figure 16, an additional polymer particle layer-polymer particle layer-support substrate composite 431a is produced having polymer particle layers 160a and 160 deposited on an inorganic substrate 180, and a heat press process is performed on this composite 431a to produce an additional polymer substrate-polymer substrate-support substrate composite 430a' having polymer substrates 150 and 170a arranged on the inorganic substrate 180 as a support substrate.

[0196] According to this method, a composite in which a polymer substrate and an additional polymer substrate are laminated on an inorganic substrate can be obtained relatively easily. In addition, the additional polymer substrate-polymer substrate-support substrate composite having an inorganic substrate as a support substrate and an inorganic particle-containing polymer substrate has excellent physical properties, for example, the difference in refractive index between the constituent members is reduced compared to a composite consisting of only an inorganic particle-free polymer substrate and an inorganic substrate, and as a result, it is considered to have excellent reflection properties, particularly excellent antireflection properties.

[0197] <<Additional method for producing a polymer substrate-polymer substrate composite, including using a release substrate as a support substrate>> The present disclosure includes additional methods of making polymer substrate-polymer substrate composites, including: Obtaining an additional polymer substrate-polymer substrate-support substrate composite by the method according to the present disclosure using a release substrate as the support substrate (composite manufacturing step); In the additional polymer substrate-polymer substrate-support substrate composite, the additional polymer substrate-polymer substrate composite is peeled off from the support substrate, which is a peeling substrate, to obtain an additional polymer substrate-polymer substrate composite (peeling step).

[0198] 17 shows one embodiment of a method for producing an additional polymer substrate-polymer substrate composite 222a′, including using a release substrate as a support substrate. The above description can be referred to for each component in the figure. The additional polymer substrate-polymer substrate composite having an inorganic particle-containing polymer substrate is considered to have physical properties useful for various applications, similar to the additional polymer substrate-polymer substrate composites already described, and is considered to be useful as an optical member having excellent anti-reflection properties.

[0199] <Composite manufacturing process> In the composite manufacturing step of the manufacturing method of the additional polymer substrate-polymer substrate composite including using a release substrate as a support substrate according to the present disclosure, the additional polymer substrate-polymer substrate-support substrate composite is manufactured by the above-mentioned method according to the present disclosure using a release substrate as a support substrate. The above description can be referred to for the release substrate as a support substrate and the manufacturing method of the additional polymer substrate-polymer substrate-support substrate composite.

[0200] At least one of the additional polymer substrate and the polymer substrate constituting the additional polymer substrate-polymer substrate composite produced in the composite production step is preferably an inorganic particle-containing polymer substrate.

[0201] <Peeling process> In the peeling step of the method for producing an additional polymer substrate-polymer substrate composite including using a peeling substrate as a supporting substrate according to the present disclosure, the additional polymer substrate-polymer substrate composite is peeled off from the supporting substrate, which is the peeling substrate, in the additional polymer substrate-polymer substrate-supporting substrate composite to obtain an additional polymer substrate-polymer substrate composite. The peeling method is not particularly limited, and a known method can be used.

[0202] <<Additional method for producing a polymer substrate-polymer substrate-inorganic substrate composite, including disposing the composite on an inorganic substrate>> The present disclosure includes additional methods of making polymer substrate-polymer substrate-inorganic substrate composites, including: Producing an additional polymer substrate-polymer substrate composite having a polymer substrate and an additional polymer substrate at least partially overlapping each other by the production method according to the present disclosure (composite production step), wherein the polymer substrate is an inorganic particle-containing polymer substrate and / or the additional polymer substrate is an additional inorganic particle-containing polymer substrate; Providing an inorganic substrate (inorganic substrate providing step); An additional polymer substrate-polymer substrate composite is placed on the inorganic substrate such that the polymer substrate which is an inorganic particle polymer substrate or the additional polymer substrate which is an additional inorganic particle-containing polymer substrate faces the inorganic substrate (placement step).

[0203] FIG. 18 illustrates one embodiment of a method for producing an additional polymer substrate-polymer substrate-inorganic substrate composite 430a″, which includes disposing the composite on an inorganic substrate. In the method illustrated in FIG. 18, a polymer substrate-support substrate composite 222a is produced by the method according to the present disclosure illustrated in FIG. 6A and the like, and an inorganic substrate 180 is provided. Then, the polymer substrate-support substrate composite 222a is disposed on the inorganic substrate 180 such that the inorganic particle-containing polymer substrate 170a of the polymer substrate-support substrate composite 222a faces the inorganic substrate 180.

[0204] The additional polymer substrate-polymer substrate-inorganic substrate composite having an inorganic particle-containing polymer substrate has excellent physical properties as described above. For example, the composite has a reduced difference in refractive index between the constituent members compared to a composite consisting of only a polymer member and an inorganic substrate, and as a result, is considered to have excellent anti-reflection properties.

[0205] <Composite manufacturing process> In the composite manufacturing process according to the manufacturing method of the additional polymer substrate-polymer substrate-inorganic substrate composite of the present disclosure, which includes disposing a composite on an inorganic substrate, an additional polymer substrate-polymer substrate composite having a polymer substrate and an additional polymer substrate that are at least partially overlapped with each other is manufactured. Here, the "additional polymer substrate-polymer substrate composite" may be an additional polymer substrate-polymer substrate composite manufactured by the method according to the present disclosure illustrated in FIG. 11 or FIG. 17. Also, the "additional polymer substrate-polymer substrate composite" may be a polymer substrate-support substrate having a polymer substrate as a support substrate, manufactured by the method according to the present disclosure illustrated in the above-mentioned FIG. 6A, 6B, 6C, FIG. 8A, and FIG. 8B.

[0206] <Inorganic base material provision process> In the inorganic substrate providing step of the additional method for producing a polymer substrate-polymer substrate-inorganic substrate composite of the present disclosure, which includes disposing a composite on an inorganic substrate, an inorganic substrate is provided. For the inorganic substrate, the above description can be referred to.

[0207] <Placement process> In the placement step of the present disclosure's method for producing an additional polymer substrate-polymer substrate-inorganic substrate composite, which includes placing a composite on an inorganic substrate, the additional polymer substrate-polymer substrate composite is placed on the inorganic substrate such that the polymer substrate which is an inorganic particle polymer substrate or the additional polymer substrate which is an additional inorganic particle-containing polymer substrate faces the inorganic substrate.

[0208] Regarding the manner in which the additional polymer substrate-polymer substrate composite is disposed on the inorganic substrate in the disposing step, the above description regarding the manufacturing method of the polymer substrate-inorganic substrate composite can be referred to. For example, the additional polymer substrate-polymer substrate composite can be disposed on the inorganic substrate directly or via an adhesive polymer layer.

[0209] In the arranging step, the additional polymer substrate or polymer substrate and the inorganic substrate of the additional polymer substrate-polymer substrate composite may be arranged so that they at least partially overlap each other, particularly overlap each other, via their respective main surfaces. Alternatively, in the arranging step, the additional polymer substrate or polymer substrate and the inorganic substrate may be arranged so that one main surface of the additional polymer substrate or polymer substrate and the inorganic substrate substantially covers the other main surface.

[0210] 〈Thermocompression bonding process〉 In one embodiment according to the present disclosure, the additional polymer substrate-polymer substrate-inorganic substrate composite obtained in the disposing step can be further subjected to a thermocompression treatment. The thermocompression treatment can further improve the adhesion between the additional polymer substrate-polymer substrate composite and the inorganic substrate composite. For the thermocompression treatment, the above description regarding the method for producing a polymer substrate-inorganic substrate composite can be referred to.

[0211] <<Method for manufacturing gradient polymer substrate laminate>> The present disclosure includes a method for producing a polymer substrate laminate having at least three polymer substrates stacked together, in which the at least three polymer substrates are stacked together such that the content of inorganic particles in each of the polymer substrates increases or decreases stepwise along the stacking direction starting from the outermost layer of the laminate (hereinafter referred to as a "gradient type polymer substrate laminate"). The method for producing the polymer substrate laminate includes the following steps (a) and (b): (a) selecting at least two materials from the group consisting of a polymer substrate not containing inorganic particles, a polymer substrate containing inorganic particles, and a composite composed of at least two polymer substrates (material selection step), wherein the at least two materials include a polymer substrate produced by the method according to the present disclosure, and / or a composite composed of at least two polymer substrates produced by the method according to the present disclosure, and the at least two materials include a total of at least three polymer substrates; (b) Laminating at least two materials so that the content of inorganic particles increases or decreases stepwise along the lamination direction to obtain a polymer-based laminate (lamination step).

[0212] FIG. 19 is a schematic diagram of one embodiment of a method for manufacturing a gradient polymer substrate laminate. In the method shown in FIG. 19, polymer substrate-support substrate composites 222b, 222d, and 222e having a polymer substrate as a support substrate, which are manufactured by the method according to the present disclosure, are selected as at least two materials. These composites are composites composed of at least two polymer substrates manufactured by the method according to the present disclosure. In composite 222b, the content of inorganic particles in polymer substrate 170a is higher than that in polymer substrate 170b. In composite 222d, the content of inorganic particles in polymer substrate 170c is lower than that in polymer substrate 170b and higher than that in polymer substrate 170d. Composite 222e has polymer substrate 170e having a lower inorganic particle content than polymer substrate 170d, and inorganic particle-free polymer substrate 150.

[0213] 19, these selected materials are laminated such that the content of inorganic particles increases or decreases stepwise along the lamination direction to obtain polymer substrate laminate 470a'. Polymer substrate laminate 470a' has six laminated polymer substrates 170a-170e and 150, and the six polymer substrates are laminated such that the content of inorganic particles in each of the polymer substrates constituting polymer substrate laminate 470a' increases or decreases stepwise along the lamination direction starting from the outermost layer of the laminate.

[0214] According to this method, a gradient type polymer substrate laminate having excellent quality can be produced relatively easily. In particular, when a composite having two polymer substrates obtained by the production method according to the present disclosure is used, a polymer substrate laminate having a relatively high flatness of the interface between the polymer substrates can be obtained.

[0215] In addition, the gradient polymer substrate laminate obtained by the above method has physical properties useful for various applications. For example, in a gradient polymer substrate laminate having a large number of inorganic particle-containing polymer substrates, special effects can be added by changing the film structure, for example, the transmitted wavelength band can be expanded / contracted or limited, or the reflectance can be set to an arbitrary value. Therefore, the gradient polymer substrate laminate according to the present disclosure is particularly useful as an optical member having excellent reflection / transmission properties.

[0216] (Gradient Polymer-Based Laminate) The gradient type polymer substrate laminate has at least three polymer substrates laminated. The gradient type polymer substrate laminate may be composed of at least three inorganic particle-containing polymer substrates, or may be composed of at least two inorganic particle-containing polymer substrates and one inorganic particle-free polymer substrate. The polymer substrate, inorganic particles, and polymer constituting the polymer substrate laminate can be referred to the above description. The at least three polymer substrates constituting the polymer substrate laminate preferably contain the same type of polymer.

[0217] The gradient polymeric substrate laminate may preferably have 3 or more, 4 or more, 5 or more, 6 or more, 7 or more, or 8 or more polymeric substrates, and / or 20 or less, 18 or less, 16 or less, 14 or less, 12 or less, or 10 or less polymeric substrates.

[0218] In a gradient polymer substrate laminate, at least three polymer substrates are laminated such that the content of inorganic particles in each polymer substrate increases or decreases stepwise along the stacking direction, starting from the outermost layer of the laminate.

[0219] "The content of inorganic particles increases or decreases stepwise along the lamination direction" means that a gradient in the content of inorganic particles is formed along the lamination direction in the polymer substrate laminate. The stepwise increase or decrease in the content of inorganic particles may be formed between at least one pair of polymer substrates constituting the polymer substrate laminate. For example, in a polymer substrate laminate composed of six polymer substrates, the inorganic particle content in the five polymer substrates from the outermost layer may be the same, and the sixth polymer substrate may have a higher or lower inorganic particle content than the other five polymer substrates. Preferably, each polymer substrate constituting the polymer substrate laminate has a different inorganic particle content from the adjacent polymer substrates.

[0220] For the content of inorganic particles in the polymer substrate, the above description regarding the polymer substrate as a support substrate can be referred to. Each polymer substrate constituting the polymer substrate laminate may contain different types of inorganic particles, or may contain the same type of inorganic particles. Preferably, each polymer substrate constituting the polymer substrate laminate contains the same type of inorganic particles.

[0221] Preferably, the polymer substrate laminate is made of a polymer substrate and does not include a release substrate or an inorganic substrate. Such a polymer substrate laminate can be produced by using a polymer substrate and / or a composite made of a polymer substrate as a material.

[0222] <Material selection process> In the method of making a gradient polymeric substrate laminate according to the present disclosure, the material selection step comprises selecting at least two materials from the group consisting of: A polymeric substrate free of inorganic particles; An inorganic particle-containing polymer substrate, and A composite consisting of at least two polymeric substrates.

[0223] The at least two materials selected in the material selection process include a polymer substrate produced by the method of the present disclosure and / or a composite composed of at least two polymer substrates produced by the method of the present disclosure, for a total of at least three polymer substrates.

[0224] The "polymer substrate manufactured by the method according to the present disclosure" in the material selection step may be an inorganic particle-containing polymer substrate manufactured by the method according to the present disclosure. The manufacturing method of the inorganic substrate-containing polymer substrate may be referred to above.

[0225] In the material selection step, the "composite made of at least two polymer substrates produced by the method according to the present disclosure" is preferably made of two to four, more preferably two to three, and particularly preferably two polymer substrates, and / or does not include any components other than the polymer substrate, particularly an inorganic substrate or a release substrate. Examples of the "composite made of at least two polymer substrates produced by the method according to the present disclosure" include a polymer substrate-support substrate composite (see, for example, Figures 6A to 6C) produced using a polymer substrate as a support substrate, a polymer substrate-support substrate composite (see, for example, Figure 7B) produced using a composite having two polymer substrates as a support substrate, an additional polymer substrate-polymer substrate composite (see, for example, Figure 11) containing an inorganic particle-containing polymer substrate, an additional polymer substrate-polymer substrate-support substrate composite (see, for example, Figures 14B and 15B) having a polymer substrate or a composite having two polymer substrates as a support substrate, and an additional polymer substrate-polymer substrate composite (see, for example, Figure 17).

[0226] In the material selection step, when all the polymer substrates contained in the entire selected material are considered, the inorganic particle content is different between at least any pair of polymer substrates. Preferably, when all the polymer substrates contained in the entire selected material are considered, the inorganic particle content in all the polymer substrates is different from each other. For example, in the example of FIG. 19, when all the polymer substrates 170a-170e and 150 contained in the selected materials 222b, 222d, and 222e are considered, the inorganic particle content in all the polymer substrates is different from each other.

[0227] In the material selection step, materials are selected such that the resulting polymer substrate laminate has at least three polymer substrates. For example, materials can be selected that are only composites having three or four polymer substrates, or materials can be selected that are composites having two polymer substrates and one polymer substrate.

[0228] In the material selection step, the materials are selected so that the content of inorganic particles in the polymer substrate laminate obtained by laminating the materials increases or decreases stepwise along the lamination direction. For example, when a composite having three or four polymer substrates is selected as a material, the composite has a content of inorganic particles that increases or decreases stepwise along the lamination direction.

[0229] <Lamination process> In the lamination step in the method for producing a gradient-type polymer substrate laminate according to the present disclosure, at least two materials are laminated so that the content of inorganic particles increases or decreases stepwise along the lamination direction to obtain a polymer substrate laminate.

[0230] For example, in the example shown in FIG. 19, a composite 222d is laminated on a polymer substrate 170b constituting a composite 222b, with a polymer substrate 170c having a lower inorganic particle content than the polymer substrate 170b facing the polymer substrate 170b. Then, in the laminate consisting of the obtained composites 222b and 222d, a composite 222e is laminated on the polymer substrate 170d, with a polymer substrate 170e having a lower inorganic particle content than the polymer substrate 170d facing the polymer substrate 170d. As a result, a polymer substrate laminate 470a′ is obtained in which the content of inorganic particles decreases stepwise along the lamination direction, starting from the polymer substrate 170a constituting the outermost layer. In the polymer substrate laminate 470a′, the content of inorganic particles increases stepwise along the lamination direction, starting from the polymer substrate 150 constituting the outermost layer.

[0231] 〈Thermocompression bonding process〉 In one embodiment of the present disclosure, the gradient-type polymer substrate laminate obtained in the lamination step can be further subjected to a thermocompression treatment. The thermocompression treatment can further improve the adhesion between the polymer substrates constituting the gradient-type polymer substrate laminate. For the thermocompression treatment, the above description regarding the method for producing a polymer substrate-inorganic substrate composite can be referred to.

[0232] <Method for producing alternating polymer substrate laminate> The present disclosure includes a method for producing a polymer substrate laminate having at least one inorganic particle-containing polymer substrate and at least one inorganic particle-free polymer substrate, the polymer substrate laminate having a structure in which the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate are alternately laminated (hereinafter referred to as an "alternate type polymer substrate laminate"), the method including the following steps (a) and (b): (a) selecting at least two materials from the group consisting of inorganic particle-free polymer substrates, inorganic particle-containing polymer substrates, and composites consisting of at least one inorganic particle-containing polymer substrate and at least one inorganic particle-free polymer substrate and having a structure in which the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate are alternately laminated (material selection step), wherein the at least two materials include a polymer substrate produced by the method according to the present disclosure or a composite produced by the method according to the present disclosure, and include at least three polymer substrates in total; (b) Laminating at least two materials, with an inorganic particle-containing polymer substrate and an inorganic particle-free polymer substrate adjacent to each other, to produce a polymer substrate laminate (lamination step).

[0233] FIG. 20 is a schematic diagram of another embodiment of a method for producing a polymer substrate laminate according to the present disclosure. In the method shown in FIG. 20, four composites 222a are selected as materials. These composites 222a as materials each have one inorganic particle-containing polymer substrate and one inorganic particle-free polymer substrate. The composites 222a may be, for example, a polymer substrate-support substrate composite having a polymer substrate as a support substrate produced by the method according to the present disclosure (see FIGS. 6A and 6B). In the method shown in FIG. 20, the four selected composites 222a are laminated so that the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate are adjacent to each other to produce a polymer substrate laminate 490a′. The obtained polymer substrate laminate 490a′ has four inorganic particle-containing polymer substrates and four inorganic particle-free polymer substrates, and has a structure in which the inorganic particle-containing polymer substrates and the inorganic particle-free polymer substrates are alternately laminated.

[0234] The above method allows for the relatively easy production of alternating polymer substrate laminates having excellent quality.

[0235] The alternating polymer substrate laminate obtained by the above method has physical properties useful for various applications. For example, in the alternating polymer substrate laminate according to the present disclosure in which inorganic particle-free polymer substrates and inorganic particle-containing polymer substrates are alternately laminated, substrates with different refractive indices are arranged alternately, so that a reflective film with a very high reflectance may be obtained as the entire laminate. In addition, in the polymer substrate laminate according to the present disclosure having a large number of polymer substrates, a special effect can be added by changing the film structure, for example, the transmitted wavelength band may be expanded / contracted or limited, or the reflectance may be set to an arbitrary value. Therefore, the alternating polymer substrate laminate according to the present disclosure is particularly useful as an optical member having excellent reflection / transmission properties.

[0236] (Alternating polymer-based laminates) The alternating polymer substrate laminate has at least one inorganic particle-containing polymer substrate and at least one inorganic particle-free polymer substrate. The polymer substrate, inorganic particles, and polymer constituting the polymer substrate laminate can be referred to the above description. Each polymer substrate constituting the polymer substrate laminate is preferably composed of the same type of polymer.

[0237] The alternating polymer substrate laminate may preferably have 3 or more, 4 or more, 5 or more, 6 or more, 7 or more, or 8 or more polymer substrates, and / or have 20 or less, 18 or less, 16 or less, 14 or less, 12 or less, or 10 or less polymer substrates. The alternating polymer substrate laminate preferably has the same number of inorganic particle-free polymer substrates and inorganic particle-containing polymer substrates.

[0238] <Material selection process> In accordance with the present disclosure, the material selection step in the method of making an alternating polymeric substrate laminate comprises selecting at least two materials from the group consisting of: A polymeric substrate free of inorganic particles; A polymer substrate containing inorganic particles, and A composite which is composed of at least one inorganic particle-containing polymer substrate and at least one inorganic particle-free polymer substrate, and has a structure in which the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate are alternately laminated.

[0239] At least two of the materials selected in the material selection step include a polymeric substrate produced by a method according to the present disclosure or a composite produced by a method according to the present disclosure.

[0240] The "polymer substrate manufactured by the method according to the present disclosure" in the material selection step may be an inorganic substrate-containing polymer substrate manufactured by the method according to the present disclosure as illustrated in Fig. 10B. The above description can be referred to for the method for manufacturing an inorganic substrate-containing polymer substrate.

[0241] The "composite produced by the method according to the present disclosure" in the material selection step is preferably composed of 2 to 4 polymer substrates, more preferably 2 or 3 polymer substrates, particularly preferably 2 polymer substrates, and / or does not include any components other than the polymer substrate, particularly an inorganic substrate or a release substrate. Examples of the "composite produced by the method according to the present disclosure" include a polymer substrate-support substrate composite (see, for example, Figures 6A-B, 7A, 8A, and 8B) having a polymer substrate or a composite having two polymer substrates as a support substrate, an additional polymer substrate-polymer substrate composite (see, for example, Figure 11) having an inorganic particle-containing polymer substrate and an inorganic particle-free polymer substrate, an additional polymer substrate-polymer substrate-support substrate composite having a polymer substrate or a composite having two polymer substrates as a support substrate, and an additional polymer substrate-polymer substrate (see, for example, Figure 17). The above description can be referred to for the manufacturing method of these composites.

[0242] <Lamination process> In the lamination step in the method for producing a gradient-type polymer substrate laminate according to the present disclosure, at least two materials are laminated so that an inorganic particle-containing polymer substrate and an inorganic particle-free polymer substrate are adjacent to each other to produce a polymer substrate laminate.

[0243] The lamination process will be described with reference to Fig. 20. For example, one of the four composites 222a as materials is arranged such that the inorganic particle-containing polymer substrate 170a included in the other composite 222a is in contact with the inorganic particle-free polymer substrate 150 of the other composite 222a, thereby producing a laminate precursor A having four polymer substrates in total. Then, another composite 222a is similarly arranged on the inorganic particle-free polymer layer 150 constituting the outermost layer of the laminate precursor A, thereby producing a laminate precursor B having six polymer substrates in total. Then, by repeating the same process, an alternating type polymer substrate laminate 490a' can be produced.

[0244] 〈Thermocompression bonding process〉 In one embodiment of the present disclosure, the alternating polymer substrate laminate obtained in the lamination step can be further subjected to a thermocompression treatment. The thermocompression treatment can further improve the adhesion between the polymer substrates constituting the alternating polymer substrate laminate. For the thermocompression treatment, the above description regarding the polymer substrate-inorganic substrate composite can be referred to.

[0245] <Production method of polymer substrate laminate-inorganic substrate composite having arrangement step> The present disclosure includes a method for making a polymer substrate laminate-inorganic substrate composite, the method comprising: Producing a polymer substrate laminate having at least three polymer substrates by the method according to the present disclosure (polymer substrate laminate production process); Providing an inorganic substrate or a composite having a polymer substrate and an inorganic substrate (Providing step); Placing a polymer substrate laminate onto an inorganic substrate or onto said polymer substrate of a composite (placing step).

[0246] Figure 21 illustrates generally one embodiment of a method for making a polymer substrate laminate-inorganic substrate composite 470a according to the present disclosure, comprising placing a polymer substrate laminate 470a' on an inorganic substrate 180. Figure 22 illustrates generally one embodiment of a method for making a polymer substrate laminate-inorganic substrate composite 470a according to the present disclosure, comprising placing a polymer substrate laminate 470a'' on a polymer substrate 170b of a composite 430b having a polymer substrate and an inorganic substrate.

[0247] In the above-mentioned method for producing a polymer substrate laminate-inorganic substrate composite according to the present disclosure, a polymer substrate laminate-inorganic substrate composite is produced using a polymer substrate laminate produced by the method according to the present disclosure, so that a polymer substrate laminate-inorganic substrate composite having excellent quality can be produced relatively easily. In addition, since the polymer substrate laminate-inorganic substrate composite produced by the method according to the present disclosure has the polymer substrate laminate according to the present disclosure, it is considered to be particularly useful in optical applications.

[0248] (Polymer-based laminate-inorganic substrate composite) The polymer substrate laminate-inorganic substrate composite has an inorganic substrate and a polymer substrate laminate having at least three polymer substrates disposed on the inorganic substrate. The polymer substrate laminate having at least three polymer substrates may be the gradient type polymer substrate laminate described above or the alternating type polymer substrate laminate described above (see, for example, Figures 19 and 20). The polymer substrate laminate having at least three polymer substrates may also be a polymer substrate-support substrate composite using a composite having two polymer substrates as a support substrate (see, for example, Figures 7A and 7B), or an additional polymer substrate-polymer substrate-support substrate composite having a polymer substrate as a support substrate (see, for example, Figures 14B and 15B).

[0249] <Polymer substrate laminate manufacturing process> In the polymer substrate laminate manufacturing process of the method for manufacturing a polymer substrate laminate-inorganic substrate composite according to the present disclosure, a polymer substrate laminate having at least three polymer substrates is manufactured by the method according to the present disclosure. The above description can be referred to for the method for manufacturing a polymer substrate laminate having at least three polymer substrates, a polymer substrate-support substrate composite using a composite having two polymer substrates as a support substrate, and an additional polymer substrate-polymer substrate-support substrate composite having a polymer substrate as a support substrate.

[0250] 〈Providing process〉 In the providing step of the method for producing a polymer substrate laminate-inorganic substrate composite according to the present disclosure, an inorganic substrate or a composite having a polymer substrate and an inorganic substrate is provided.

[0251] The "composite having a polymer substrate and an inorganic substrate" provided in the providing step may be a composite produced by the method according to the present disclosure. For example, the "composite having a polymer substrate and an inorganic substrate" may be a composite produced by disposing a polymer substrate produced by the production method according to the present disclosure or an additional polymer substrate-polymer substrate composite on an inorganic substrate (see, for example, FIG. 12, FIG. 13, FIG. 18), or may be a polymer substrate-support substrate composite produced by the method according to the present disclosure using an inorganic substrate as a support substrate (see, for example, FIG. 9) or an additional polymer substrate-polymer substrate-support substrate composite (see, for example, FIG. 16).

[0252] <Placement process> In the disposing step of the method for producing a polymer substrate laminate-inorganic substrate composite according to the present disclosure, the polymer substrate laminate is disposed on the inorganic substrate or on the polymer substrate of the composite.

[0253] The manner in which the polymer substrate laminate is disposed on the inorganic substrate in the disposing step can be referred to the above description regarding the method for producing a polymer substrate-inorganic substrate composite. For example, the polymer substrate laminate can be disposed on the inorganic substrate directly or via an adhesive polymer layer.

[0254] 〈Thermocompression bonding process〉 In one embodiment according to the present disclosure, the polymer substrate laminate-inorganic substrate composite obtained in the disposing step can be further subjected to a thermocompression treatment. The thermocompression treatment can further improve the adhesion between the polymer substrate laminate and the inorganic substrate. For the thermocompression treatment, the above description of the method for producing a polymer substrate-inorganic substrate composite can be referred to.

[0255] <<Method for producing a polymer substrate laminate-inorganic substrate composite, including producing a polymer substrate laminate on an inorganic substrate>> The present disclosure also includes a method for making a polymer substrate laminate-inorganic substrate composite, comprising: Providing an inorganic substrate or a composite having a polymer substrate and an inorganic substrate (Providing step); Producing a polymer substrate laminate on the inorganic substrate or on the polymer substrate of the composite by the method according to the present disclosure (lamination step).

[0256] FIG. 23 illustrates generally another embodiment of a method for producing a polymer substrate laminate-inorganic substrate composite 470a in accordance with the present disclosure, comprising producing a polymer substrate laminate on top of a polymer substrate 170b of a polymer substrate and inorganic substrate composite 430b using a polymer substrate 170c and a three polymer substrate composite 332c as materials.

[0257] In the method for producing a polymer substrate laminate-inorganic substrate composite having a lamination step according to the present disclosure, a polymer substrate laminate-inorganic substrate composite is produced by producing a polymer substrate laminate on an inorganic substrate or the like by the method according to the present disclosure. Therefore, according to this method, a polymer substrate laminate-inorganic substrate composite having excellent quality can be produced relatively easily.

[0258] (Providing process) For the providing step in the manufacturing method for a polymer substrate laminate-inorganic substrate composite having a lamination step, the description in the above "Manufacturing method for a polymer substrate laminate-inorganic substrate composite having an arrangement step" can be referred to.

[0259] (Lamination process) In the lamination step in the method for producing a polymer substrate laminate-inorganic substrate composite having a lamination step, a polymer substrate laminate is produced on the inorganic substrate provided in the above-mentioned providing step or the polymer substrate in the composite provided in the above-mentioned providing step according to the method according to the present disclosure. The produced polymer substrate laminate may be the above-mentioned gradient type polymer substrate laminate or the above-mentioned alternating type polymer substrate laminate. The above description can be referred to for the production method of these polymer substrate laminates.

[0260] (Thermocompression bonding process) In one embodiment according to the present disclosure, the polymer substrate laminate-inorganic substrate composite obtained in the lamination step can be further subjected to a thermocompression treatment. The thermocompression treatment can further improve the adhesion between the polymer substrate laminate and the inorganic substrate. For the thermocompression treatment, the above description regarding the polymer substrate-inorganic substrate composite can be referred to.

[0261] <Polymer particles containing inorganic particles> The present disclosure includes inorganic particle-containing polymer particles comprising: Polymers, Inorganic particles selected from the group consisting of metals and semi-metals, oxides of metals and semi-metals, nitrides of metals and semi-metals, carbides of metals and semi-metals, carbon materials, and combinations thereof, having a primary particle size of 1 nm to 500 nm, and dispersed in a polymer.

[0262] The inorganic particle-containing polymer particles according to the present disclosure are particularly useful in producing the above-mentioned polymer particle layer-support substrate composite according to the present disclosure. By using the inorganic particle-containing polymer particles according to the present disclosure, the composite can be produced while reducing the amount of solvent for dissolving the polymer, so that it is possible to avoid the support substrate being undesirably affected by the solvent for dissolving the polymer. In particular, when the support substrate is a polymer substrate, it is possible to avoid the support substrate being dissolved by the solvent for dissolving the polymer.

[0263] For the inorganic particle-containing polymer particles according to the present disclosure, and the polymer and inorganic particles contained in the inorganic particle-containing polymer particles, reference may be made to the above descriptions regarding the inorganic particle-containing polymer particles in the production method of the present disclosure, and the polymer and inorganic particles contained in the inorganic particle-containing polymer particles.

[0264] <Coupling Agent> The inorganic particle-containing polymer particles according to the present disclosure can further comprise a coupling agent.For the coupling agent that can be contained in the inorganic particle-containing polymer particles according to the present disclosure, the above description of the coupling agent that can be contained in the inorganic particle-containing polymer particles according to the manufacturing method of the present disclosure can be referred to.

[0265] ≪Dispersion body≫ The present disclosure includes a dispersion comprising inorganic particle-free polymer particles and / or inorganic particle-containing polymer particles according to the present disclosure and a dispersion medium.

[0266] By using the dispersion according to the present disclosure, it becomes possible to easily obtain a uniform polymer particle layer, for example, when forming a film-like polymer particle layer on a supporting substrate.

[0267] In addition, it is preferable to use a dispersion medium that does not easily dissolve the supporting substrate as the dispersion medium. In this case, undesirable effects on the supporting substrate can be further suppressed when polymer particles are deposited on the supporting substrate using the dispersion.

[0268] <Polymer particles, dispersion medium, dispersion body> For the dispersion according to the present disclosure, and the polymer particles and dispersion medium contained in the dispersion, reference may be made to the above descriptions of the dispersion, polymer particles, and dispersion medium in the production method according to the present disclosure, respectively.

[0269] <Inorganic particle-containing polymer particle layer-polymer substrate composite> The present disclosure includes a polymer particle layer-polymer substrate composite, which is: A polymer substrate, and A layer of polymer particles deposited on a polymer substrate. and The polymer particle layer comprises inorganic particle-containing polymer particles according to the present disclosure.

[0270] A polymer particle layer-polymer substrate composite including an inorganic particle-containing polymer particle layer may have different physical properties compared to, for example, a substrate made of only a polymer, due to the presence of inorganic particles in the polymer particle layer. For example, the composite may have a refractive index different from that of a substrate made of only a polymer, and is therefore considered to be useful as an optical member, particularly an anti-reflection film, or a precursor material for the anti-reflection film.

[0271] Such a polymer particle layer-polymer substrate composite can be produced by the above-mentioned production method according to the present disclosure. For the polymer substrate, inorganic particle-containing polymer particle layer, and inorganic particle-containing polymer particles contained in the polymer particle layer-polymer substrate composite according to the present disclosure, the above description of the production method according to the present disclosure can be referred to.

[0272] The thickness of the inorganic particle-containing polymer particle layer may be 2 μm or more, 5 μm or more, 10 μm or more, or 20 μm or more, and may be 2000 μm or less, 1000 μm or less, 500 μm or less, 200 μm or less, or 100 μm or less.

[0273] <Coupling Agent> In the polymer particle layer-polymer substrate composite according to the present disclosure, either or both of the polymer particle layer and the polymer substrate may further contain a coupling agent.For the coupling agent that can be contained in the polymer particles of the present disclosure, the above description of the coupling agent that can be contained in the polymer particles in the manufacturing method of the present disclosure can be referred to.

[0274] <Inorganic particle-free polymer particle layer-polymer substrate composite> The present disclosure also includes a polymer particle layer-polymer substrate composite, which is: A polymer substrate, and A layer of polymer particles deposited on a polymer substrate. and The polymer particle layer is made of polymer particles that do not contain inorganic particles.

[0275] The polymer substrate constituting the polymer particle layer-polymer substrate composite is preferably an inorganic particle-containing polymer substrate.

[0276] An inorganic particle-free polymer particle layer-polymer substrate composite having an inorganic particle-containing polymer substrate as a polymer substrate may have different physical properties, for example, compared to a substrate made of only a polymer, due to the presence of inorganic particles in the inorganic particle-containing polymer particle layer. For example, the composite may have a refractive index different from that of a substrate made of only a polymer, and is therefore considered to be useful as an optical member, particularly an anti-reflection film, or a precursor material for the anti-reflection film.

[0277] Such a polymer particle layer-polymer substrate composite can be produced by the above-mentioned production method according to the present disclosure. For the polymer substrate, inorganic particle-free polymer particle layer, and inorganic particle-free polymer particles contained in the polymer particle layer-polymer substrate composite according to the present disclosure, the description of the above-mentioned production method according to the present disclosure can be referred to.

[0278] <Coupling Agent> In the inorganic particle-containing polymer particle layer-polymer substrate composite of the present disclosure, either or both of the inorganic particle-containing polymer particle layer and the polymer substrate may further comprise a coupling agent.For the coupling agent that can be contained in the polymer particle of the present disclosure, the above description of the coupling agent that can be contained in the polymer particle in the manufacturing method of the present disclosure can be referred to.

[0279] <<Additional polymer particle layer-polymer particle layer-polymer substrate composite>> The present disclosure includes additional polymer particle layer-polymer particle layer-polymer substrate composites, including: Polymer substrate, a layer of polymer particles deposited on a polymer substrate; An additional layer of polymer particles is deposited on the layer of polymer particles.

[0280] Preferably, at least one of the polymer substrate, the polymer particle layer and the additional polymer particle layer contained in the additional polymer particle layer-polymer particle layer-polymer substrate composite has inorganic particles.

[0281] In an additional polymer particle layer-polymer particle layer-support substrate composite including an inorganic particle-containing polymer particle layer, the refractive index can be adjusted by adjusting the difference in inorganic particle content between adjacent polymer particle layers, and therefore it is believed to be useful as an optical component.

[0282] The polymer substrate included in the additional polymer particle layer-polymer particle layer-polymer substrate composite may be a polymer substrate without inorganic particles, a polymer substrate with inorganic particles, or a composite having at least two polymer substrates. The polymer substrate and the composite having at least two polymer substrates may be obtained by the method according to the present disclosure described above.

[0283] The polymer particle layer and the additional polymer particle layer are each composed of inorganic particle-free polymer particles, inorganic particle-containing polymer particles, or a mixture of inorganic particle-free polymer particles and inorganic particle-containing polymer particles.

[0284] Such an inorganic particle-free polymer particle layer-polymer substrate composite can be manufactured by the above-mentioned manufacturing method according to the present disclosure. For the polymer substrate, polymer particle layer, and additional polymer particle layer contained in the additional polymer particle layer-polymer particle layer-polymer substrate composite according to the present disclosure, the description of the above-mentioned manufacturing method according to the present disclosure can be referred to.

[0285] <<Additional polymer substrate-polymer substrate composite>> The present disclosure includes additional polymer substrate-polymer substrate composites that are: a polymer substrate and an additional polymer substrate; At least one of the polymeric substrate and the additional polymeric substrate comprises inorganic particles; the polymeric substrate and the additional polymeric substrate are disposed at least partially on top of one another; and The interface between the polymer substrate and the further polymer substrate is flat.

[0286] The additional polymer substrate-polymer substrate composite according to the present disclosure can be used as an optical component, particularly as an anti-reflection film. In particular, the polymer substrate-polymer substrate composite having an inorganic particle-containing polymer substrate has reduced interface roughness at the interface between the polymer substrate and the inorganic particle-containing polymer layer, so that light scattering is suppressed, and it is considered to be particularly useful as an optical component, particularly as an anti-reflection film.

[0287] The additional polymer substrate-polymer substrate composite according to the present disclosure has a polymer substrate and an additional polymer substrate, and at least one of the polymer substrate and the additional polymer substrate has inorganic particles, and preferably the polymer substrate and the additional polymer substrate have inorganic particles. In particular, in the additional polymer substrate-polymer substrate composite according to the present disclosure, at least one of the polymer substrate and the additional polymer substrate is an inorganic particle-containing polymer substrate, and particularly preferably, the polymer substrate and the additional polymer substrate are inorganic particle-containing polymer substrates. The additional polymer substrate-polymer substrate composite according to the present disclosure may have an inorganic particle-free polymer substrate as the polymer substrate or the additional polymer substrate. When both the polymer substrate and the additional polymer substrate are inorganic particle-containing polymer substrates, the inorganic particle content in each substrate may be different from each other.

[0288] The additional polymer substrate-polymer substrate composite according to the present disclosure may be an additional polymer substrate-polymer substrate composite produced by the manufacturing method according to the present disclosure, for example, a polymer substrate-support substrate composite produced by the method according to the present disclosure using a polymer substrate as the support substrate.

[0289] For the polymer substrate, inorganic particles, and polymer constituting the additional polymer substrate-polymer substrate composite according to the present disclosure, as well as the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate, reference may be made to the above description of the manufacturing method according to the present disclosure.

[0290] In the additional polymer substrate-polymer substrate composite according to the present disclosure, at least one of the polymer substrate and the additional polymer substrate may be in the form of a membrane or film, or the polymer substrate and the additional polymer substrate may be in the form of a membrane or film.

[0291] In the additional polymer substrate-polymer substrate composite according to the present disclosure, the thickness of the polymer substrate and the additional polymer substrate may be 0.5 μm or more, 1 μm or more, 2 μm or more, or 5 μm or more, and may be 2000 μm or less, 1000 μm or less, 500 μm or less, 200 μm or less, or 100 μm or less.

[0292] <Coupling Agent> In the additional polymer substrate-polymer substrate composite according to the present disclosure, at least one of the polymer substrate and the additional polymer substrate may further contain a coupling agent. For the coupling agent that may be contained in at least one of the polymer substrate and the additional polymer substrate, the above description of the coupling agent that may be contained in the polymer particles in the manufacturing method of the present disclosure may be referred to.

[0293] In the additional polymer substrate-polymer substrate composite according to the present disclosure, at least one of the polymer substrate and the additional polymer substrate may further contain a coupling agent, which may further improve adhesion between the additional polymer substrate and the polymer substrate.

[0294] In the additional polymer substrate-polymer substrate composite according to the present disclosure, the polymer substrate and the additional polymer substrate are disposed at least partially on top of each other.

[0295] In the above-mentioned additional polymer substrate-polymer substrate composite, the polymer substrate and the additional polymer substrate may at least partially overlap each other via their respective main surfaces. Alternatively, in the above-mentioned additional polymer substrate-polymer substrate composite, the polymer substrate and the additional polymer substrate may have one main surface substantially covering the other main surface. Alternatively, the above-mentioned additional polymer substrate-polymer substrate composite may have a polymer substrate and an additional polymer substrate laminated to the polymer substrate.

[0296] <Flatness> In the additional polymer substrate-polymer substrate composite according to the present disclosure, the interface between the polymer substrate and the additional polymer substrate is flat. The interface being flat means that the roughness of the interface (interface roughness) is reduced. In the additional polymer substrate-polymer substrate composite according to the present disclosure, the interface roughness at the interface between the polymer substrate and the additional polymer substrate is reduced, and preferably, the "interface roughness s" calculated by the following method is 0.01 μm or more, 0.1 μm or more, 0.2 μm or more, 0.5 μm or more, 0.8 μm or more, 1.0 μm or more, or 1.2 μm or more, and is 2.5 μm or less, 2.0 μm or less, or 1.7 μm or less.

[0297] A method for evaluating the "interface roughness s" at the interface between the polymer substrate (P1) and the polymer substrate (P2) that are arranged to overlap each other at least partially will be described with reference to Fig. 26B. Fig. 26B shows an SEM image of a cross section of a polymer substrate-support substrate composite having a polymer substrate as a support substrate according to Example 1, and a method for evaluating flatness.

[0298] The "interface roughness s" at the interface between the polymer substrate P1 and the polymer substrate P2, which are arranged at least partially overlapping each other, can be evaluated by the following method: In an SEM image of a cross section of the composite obtained by a scanning electron microscope (SEM), 25 line segments are drawn at regular intervals along the surface direction of the polymer substrate P2, extending in the thickness direction from an interface A between the polymer substrate P2 and the surrounding atmosphere (e.g., air) (or a surface A of the polymer substrate P2 opposite the polymer substrate P1) to an interface B between the polymer substrate P2 and the polymer substrate P1; Among the 25 line segments, a line segment whose end at the interface B on the polymer substrate P1 side is located closest to the ambient atmosphere (whose end at the interface B on the polymer substrate P1 side is located farthest from the polymer substrate P1) is identified; Draw a straight line (reference line) that is tangent to the end of the line segment at the interface B on the polymer substrate P1 side and perpendicular to the line segment; For each of the 25 line segments, measure the length from the intersection with the reference line to the end at the interface on the polymer substrate side; The standard deviation of the measured length is calculated, and the calculated standard deviation is set as the roughness s of the interface.

[0299] <Polymer-based laminate> The present disclosure includes a polymeric substrate laminate that is: Contains at least three polymeric substrates that are laminated together; and At least one of the interfaces of adjacent polymeric substrates is flat.

[0300] The polymer substrate laminate according to the present disclosure can be used as an optical member, particularly as an anti-reflection film.In particular, in the polymer substrate laminate according to the present disclosure, the interface roughness of at least one of the interfaces of adjacent polymer substrates is reduced, so that light scattering is suppressed, and it is considered to be particularly useful as an optical member, particularly as an anti-reflection film.

[0301] The polymer substrate laminate according to the present disclosure contains at least three polymer substrates. The at least three polymer substrates may be composed of inorganic particle-containing polymer substrates and / or inorganic particle-free polymer substrates. Preferably, the polymer substrate laminate may be an alternating polymer substrate laminate or a gradient polymer substrate laminate.

[0302] In the polymer substrate laminate according to the present disclosure, at least three polymer substrates are laminated. Preferably, each of the at least three polymer substrates contacts the main surface of the polymer substrate constituting the lower layer via its main surface. More preferably, each of the at least three polymer substrates substantially covers the main surface of the polymer substrate constituting the lower layer with its main surface.

[0303] In the polymer substrate laminate according to the present disclosure, at least one of the interfaces of adjacent polymer substrates is flat. The above description can be referred to for the flatness of the interface and the interface roughness s as an index for evaluating the flatness of the interface.

[0304] In one embodiment of the polymer substrate laminate according to the present disclosure, the inorganic particle contents of at least three polymer substrates constituting the polymer substrate laminate are different from each other, and in particular, the inorganic particle contents of at least three inorganic particle-containing polymer substrates constituting the polymer substrate laminate are different from each other.In this embodiment, the polymer substrate laminate may have a polymer substrate not containing inorganic particles in addition to a plurality of inorganic particle-containing polymer substrates having different inorganic particle contents from each other.

[0305] (Gradient Polymer-Based Laminate) In another embodiment of the polymer substrate laminate according to the present disclosure, the polymer substrates are laminated such that the content of inorganic particles in at least three polymer substrates constituting the polymer substrate laminate increases or decreases stepwise along the lamination direction, and in particular, the content of inorganic particles in at least three inorganic particle-containing polymer substrates constituting the polymer substrate laminate increases or decreases stepwise along the lamination direction. For such a polymer substrate laminate, the above description of the method for producing a gradient type polymer substrate laminate can be referred to.

[0306] In such embodiments, the polymeric substrate laminate may have inorganic particle-free polymeric substrates in addition to a plurality of inorganic particle-containing polymeric substrates having different inorganic particle contents.

[0307] The gradient polymer substrate laminate has physical properties that are useful for various applications. For example, in a gradient polymer substrate laminate having a large number of inorganic particle-containing polymer substrates, special effects can be added by changing the film structure, for example, the transmitted wavelength band can be expanded / contracted or limited, or the reflectance can be set to any value. Therefore, the gradient polymer substrate laminate according to the present disclosure is considered to be useful as an optical member having excellent reflection / transmission properties.

[0308] (Alternating polymer-based laminates) In yet another embodiment of the polymer substrate laminate according to the present disclosure, the polymer substrate laminate has at least one inorganic particle-free polymer substrate and at least one inorganic particle-containing polymer substrate, and has a structure in which the inorganic particle-free polymer substrate and the inorganic particle-containing polymer substrate are alternately laminated.For such a polymer substrate laminate, the above description of the method for producing an alternating type polymer substrate laminate can be referred to.

[0309] The alternating polymer substrate laminate has physical properties that are useful for various applications. For example, in the alternating polymer substrate laminate according to the present disclosure in which inorganic particle-free polymer substrates and inorganic particle-containing polymer substrates are alternately laminated, substrates with significantly different refractive indices are arranged alternately, so that the entire laminate may be able to obtain a reflective film with a very high reflectance. In addition, in a polymer substrate laminate having a large number of polymer substrates, a special effect can be added by changing the film structure, for example, the transmitted wavelength band may be expanded / contracted or limited, or the reflectance may be set to an arbitrary value. Therefore, the gradient polymer substrate laminate according to the present disclosure is considered to be useful as an optical member having excellent reflection / transmission properties.

[0310] The polymer substrate laminate according to the present disclosure can be produced by the above-described method for producing a polymer substrate laminate according to the present disclosure.

[0311] <Silicon particle-containing cycloolefin polymer component> The present disclosure includes a membranous or film-like member containing a cycloolefin polymer and silicon particles having a primary particle size of 1 nm to 500 nm.

[0312] The silicon particle-containing cycloolefin polymer member has different physical properties from, for example, a polymer member made only of cycloolefin polymer due to the inclusion of silicon particles. In particular, the silicon particle-containing cycloolefin polymer member can have an intermediate value between the silicon substrate and the cycloolefin polymer in terms of refractive index, and is therefore useful, for example, in optical applications. Specifically, for example, the silicon particle-containing cycloolefin polymer member can be used to reduce problems caused by the difference in refractive index between the silicon substrate and the cycloolefin polymer, such as the problem of increased reflectance.

[0313] Furthermore, the silicon particle-containing cycloolefin polymer member contains silicon particles having a primary particle size of 1 nm to 500 nm, which is advantageous in optical applications, and in particular has excellent antireflection effects. Also, the member is in the form of a membrane or film, which makes it particularly suitable for use as an antireflection film. EXAMPLES

[0314] The present invention will now be described in more detail with reference to examples.

[0315] In the following Examples 1 and 2 and Comparative Examples 1 and 2, a cycloolefin polymer (COP; Zeon Corporation, Zeonex (trademark) 480R, glass transition temperature 138° C.) was used as the polymer.

[0316] In the following Examples 1-2 and Comparative Examples 1-2, silicon particles were used as inorganic particles. Silicon as inorganic particles was produced by laser pyrolysis. The metal impurity contents of the obtained silicon particles were measured using an inductively coupled plasma mass spectrometer (ICP-MS), and the Fe content was 15 ppb, the Cu content was 18 ppb, the Ni content was 10 ppb, the Cr content was 21 ppb, the Co content was 13 ppb, the Na content was 20 ppb, and the Ca content was 10 ppb. The average primary particle size of the inorganic particles was 100 nm.

[0317] Example 1 (Production of polymer particles containing inorganic particles) (Production of inorganic particle dispersed polymer solution) 35.5 parts by mass of silicon particles as inorganic particles, 64.5 parts by mass of cycloolefin polymer as polymer, and 826 parts by mass of toluene as polymer solvent were mixed and dispersed using a homogenizer (IKA, T25) at a rotation speed of 20,000 rpm to obtain an inorganic particle-dispersed polymer solution.

[0318] The inorganic particle-dispersed polymer solution was dried and granulated using a spray dryer (manufactured by Okawara Kakoki, CNL-3) to obtain inorganic particle-containing polymer particles. The area circle equivalent diameter of the obtained inorganic particle-containing polymer particles was 2.0 μm. The area circle equivalent diameter was determined by calculating the average diameter of 100 particles randomly selected from an observation image obtained using a scanning electron microscope (manufactured by Hitachi High-Tech, TM3000).

[0319] FIG. 24 shows an optical microscope image of the inorganic particle-containing polymer particles according to Example 1 obtained by the spray drying method.

[0320] Preparation of Dispersion A dispersion medium was obtained by mixing 70 parts by mass of ethylene glycol (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) and 30 parts by mass of terpineol (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.). 65 parts by mass of this dispersion medium and 35 parts by mass of the inorganic particle-containing polymer particles were mixed and dispersed at a rotation speed of 20,000 rpm using a homogenizer (manufactured by IKA, T20), to obtain a dispersion in which the inorganic particle-containing polymer particles are dispersed in the dispersion medium (the dispersion of Example 1).

[0321] Preparation of a polymer substrate supported on a release substrate A dope in which a cycloolefin polymer was dissolved in toluene at a concentration of 35% by weight was applied onto a glass plate by a doctor blade, and the dope was heated in an electric furnace at 100°C for 10 minutes to remove the solvent, thereby obtaining a polymer substrate as a supporting substrate supported on the glass plate as a substrate for peeling. The thickness of the polymer substrate was 30 μm.

[0322] <Production of Polymer Particle Layer-Support Substrate Composite> The above-mentioned dispersion in which inorganic particle-containing polymer particles are dispersed in a dispersion medium was applied to the above-mentioned polymer substrate as a support substrate by a doctor blade, and the dispersion medium was removed by heating in an electric furnace at 170°C for 15 minutes to obtain a composite of an inorganic particle-containing polymer particle layer-support substrate composite and a substrate for peeling. The polymer particle layer-support substrate composite was then peeled off from the glass plate as the substrate for peeling to obtain a polymer particle layer-support substrate composite according to Example 1. The polymer particle layer-support substrate composite according to Example 1 had an inorganic particle-containing polymer particle layer as the polymer particle layer, and had a polymer substrate not containing inorganic particles as the support substrate. The thickness of the polymer particle layer of the polymer particle layer-support substrate composite according to Example 1 was 52 μm.

[0323] <Production of polymer substrate-support substrate composite> The obtained polymer particle layer-support substrate composite according to Example 1 was heat-pressed for 1 hour under conditions of 130°C and 50 MPa using a vacuum heat press device (Kitagawa Seiki Co., Ltd., VH1-2294) to obtain a polymer substrate-support substrate composite according to Example 1. The polymer substrate-support substrate composite according to Example 1 had an inorganic particle-containing polymer substrate as the polymer substrate, and had an inorganic particle-free polymer substrate as the support substrate. The thickness of the inorganic particle-containing polymer substrate was 22 μm.

[0324] In the polymer substrate-support substrate composite of Example 1, no cracks were observed on the surface, and the composite had good integrity.

[0325] <Flatness evaluation> The flatness (interface roughness) of the interface between the inorganic particle-free polymer substrate as the supporting substrate and the inorganic particle-containing polymer substrate as the polymer substrate for the polymer substrate of Example 1 was examined. The polymer substrate-support substrate composite of Example 1 was cut with a cutter knife, and a cross-sectional image of the composite was obtained with a scanning electron microscope (SEM). The interface roughness s was calculated for the obtained SEM image by the following procedure: (1) Twenty-five line segments were drawn at regular intervals along the surface of the polymer substrate, extending in the thickness direction from the polymer substrate-ambient atmosphere (air) interface to the polymer substrate-support substrate interface. (2) Of the 25 line segments, the line segment whose end at the interface on the supporting substrate side is located closest to the ambient atmosphere was identified. (3) A straight line (reference line) was drawn that was tangent to the end of the line segment thus identified at the interface on the support substrate side and perpendicular to the line segment. (4) For each of the 25 line segments, the length from the intersection with the reference line to the end of the interface on the supporting substrate side was measured, and the standard deviation of the measured lengths was calculated. This standard deviation was defined as the roughness s of the interface.

[0326] The interface roughness s of the polymer substrate-support substrate composite according to Example 1 was 1.54 μm. The SEM image of the cross section of the polymer substrate-support substrate composite according to Example 1 and the process of calculating the interface roughness are shown in FIG. 26B. The evaluation results for Example 1 are summarized in Table 1 below.

[0327] Example 2 Inorganic particle-containing polymer particles according to Example 2 were produced as follows: A dispersion liquid obtained by mixing 10 parts by mass of toluene with 1 part by mass of the inorganic particle-dispersed polymer solution prepared by the method described in Example 1 was dropped into 90 parts by mass of 2-propanol while stirring the 2-propanol, and the polymer was coagulated in the 2-propanol to obtain a solid content. The obtained solid content was precipitated by a centrifuge (manufactured by Hitachi High-Technologies, CR20GIII), and the precipitate was dried in a vacuum oven to obtain inorganic particle-containing polymer particles according to Example 2.

[0328] FIG. 25 shows an SEM image of the inorganic particle-containing polymer particles according to Example 2 produced by the reprecipitation method.

[0329] Comparative Example 1 A dope in which cycloolefin was dissolved in toluene as a solvent at a concentration of 35% by weight was applied onto a glass plate, and the dope was heated in an electric furnace at 100°C for 10 minutes, and the solvent was removed to obtain a polymer substrate as a support substrate on the glass plate. The thickness of the polymer substrate was 30 μm.

[0330] Furthermore, when the inorganic particle-dispersed polymer solution prepared by the method described in Example 1 was applied onto the polymer substrate as the above-mentioned supporting substrate and dried, cracks were generated in the polymer substrate. The evaluation results for Comparative Example 1 are summarized in Table 1 below.

[0331] Comparative Example 2 A dope in which cycloolefin was dissolved in toluene at a concentration of 35% by weight was applied onto a glass substrate, and the dope was heated in an electric furnace at 100°C for 10 minutes, and the solvent was removed to obtain a polymer substrate as a support substrate on the glass substrate. The thickness of the polymer substrate was 30 μm.

[0332] Furthermore, a liquid obtained by mixing 1 part by mass of the inorganic particle-dispersed polymer solution prepared by the method described in Example 1 with 9 parts by mass of toluene was spray-coated onto the polymer substrate as the above-mentioned supporting substrate, and the solvent was removed by heating in an electric furnace at 100°C for 10 minutes, thereby obtaining a polymer substrate precursor-support substrate composite relating to Comparative Example 2.

[0333] Thereafter, the polymer substrate precursor-support substrate composite according to Comparative Example 2 was heat-pressed for 1 hour at 130°C and 50 MPa using a vacuum heat press device (Kitagawa Seiki, VH1-2294) to obtain a polymer substrate-support substrate composite according to Comparative Example 2. The polymer substrate-support substrate composite according to Comparative Example 2 had an inorganic particle-containing polymer substrate as the polymer substrate, and an inorganic particle-free polymer substrate as the support substrate. No cracks were observed on the surface of the polymer substrate-support substrate composite according to Comparative Example 2, and the composite had good integrity.

[0334] The interface roughness between the polymer substrate and the support substrate of the polymer substrate-support substrate composite of Comparative Example 2 was evaluated in the same manner as in Example 1, and the interface roughness s was found to be 2.81 μm. FIG. 26A shows an SEM image of a cross section of the polymer substrate-support substrate composite of Comparative Example 2, and the process of calculating the interface roughness. The evaluation results for Comparative Example 2 are summarized in Table 1 below.

[0335] [Table 1]

[0336] As can be seen in Table 1, the polymer substrate-support substrate composite of Example 1, which was produced by a method involving deposition of polymer particles and heat pressing of the polymer particle layer, had better integrity than the polymer substrate-support substrate composite of Comparative Example 1, which had a polymer substrate produced by a method involving a coating process.

[0337] The manufacturing method according to Comparative Example 1 includes a step (coating step) of coating the polymer substrate as a supporting substrate with an inorganic particle-dispersed polymer solution containing toluene, which is a solvent for dissolving the polymer, and therefore the supporting substrate is undesirably affected, and as a result, a composite having good integrity cannot be obtained. In contrast, the manufacturing method according to Example 1 does not use toluene, which is a solvent for dissolving the polymer, when depositing the polymer particles on the polymer substrate as a supporting substrate, and instead uses ethylene glycol, which is a non-solvent for the polymer, as a dispersion medium for the polymer particles, so that damage to the supporting substrate can be suppressed, and as a result, a composite having good integrity can be obtained.

[0338] Furthermore, as can be seen in Table 1, the polymer substrate-support substrate composite of Example 1, which was produced by a method involving deposition of polymer particles and heat pressing of the polymer particle layer, had a higher flatness at the interface between the polymer substrate and the support substrate (interface roughness was reduced) compared to the polymer substrate-support substrate composite of Comparative Example 2, which has a polymer substrate produced by a method involving a spraying process.

[0339] The method according to Comparative Example 2 includes a step (spraying step) of spraying a solution containing toluene, which is a solvent for dissolving polymers, onto the polymer substrate, which is the supporting substrate, so that the surface of the supporting substrate is partially dissolved by toluene, and as a result, the interface between the polymer substrate and the supporting substrate in the composite is considered to be relatively rough. In contrast, the manufacturing method according to Example 1 does not use toluene, which is a solvent for dissolving polymers, when depositing polymer particles on the polymer substrate as the supporting substrate, but uses ethylene glycol, which is a non-solvent for polymers, as a dispersion medium for the polymer particles, so that dissolution of the polymer substrate as the supporting substrate can be suppressed, and as a result, the flatness of the interface between the polymer substrate and the supporting substrate in the composite is considered to be improved. [Explanation of symbols]

[0340] 100 Supporting base material 12 Polymer 13 Inorganic particles 14 Polymer particles containing inorganic particles 15 Polymer particles not containing inorganic particles 150 Polymer substrate without inorganic particles 160, 160a, 160b, 160c, 160d Polymer particle layer 170a, 170a′, 170b, 170c, 170d, 170e Polymer substrate containing inorganic particles 180 Inorganic base material 190 Peeling substrate 210a, 210b Polymer particle layer-support substrate composite 212a, 213a, 213b, 214b Polymer particle layer-support substrate composite having a polymer substrate as a support substrate 214a Additional polymer particle layer having a release substrate as a supporting substrate - polymer particle layer - supporting substrate composite 216a Composite of polymer particle layer-support substrate composite having polymer substrate as supporting substrate and release substrate 216b, 216c Polymer particle layer-support substrate composite having a peeling substrate as a support substrate 220a Polymer substrate-support substrate composite 222a, 222b, 222d, 222e Polymer substrate-support substrate composite having a polymer substrate as a support substrate 222a′ Additional polymer-substrate-polymer-substrate composites 226a Composite of polymer substrate-support substrate having polymer substrate as supporting substrate and release substrate 226b, 226c Polymer substrate-support substrate composite having a release substrate as a support substrate 223a Additional polymer substrate-polymer substrate-support substrate composite having a release substrate as a support substrate 312b Additional polymer particle layer having a polymer substrate as a supporting substrate - polymer particle layer - supporting substrate composite 322a, 322b A polymer particle layer-support substrate composite having a composite having two polymer substrates as a support substrate. 332a, 332b, 332c Polymer substrate-support substrate composite having two polymer substrates as a support substrate 420a Polymer substrate-support substrate composite having an inorganic substrate as a support substrate 421a Polymer particle layer-support substrate composite having an inorganic substrate as a support substrate 422a Additional polymer particle layer-polymer particle layer-support substrate composite having a composite having two polymer substrates as a support substrate 430a, 430a' Additional polymer substrate-polymer substrate-inorganic substrate composites 430a' Additional polymer substrate-polymer substrate-support substrate composite 431a Additional polymer particle layer having an inorganic substrate as a supporting substrate - polymer particle layer - supporting substrate composite 430b Additional polymer substrate-polymer substrate-support substrate composite having an inorganic substrate as a support substrate 442a Additional polymer substrate-polymer substrate-support substrate composite having a composite having two polymer substrates as a support substrate 470a′, 470a″ Gradient polymer-based laminate 490a' Alternating polymer-based laminate 470a Polymer substrate laminate-inorganic substrate composite 22, 22′, 22′′ dispersion 24 Dispersion medium 29 Doctor Blade

Claims

1. An inorganic particle-containing polymer particle for use as a dispersion in a dispersion medium, comprising: Polymers, and Inorganic particles having an average primary particle size, measured as an average equivalent circle diameter, of 1 nm to 500 nm and dispersed in the polymer; Including, The inorganic particles are silicon particles, and The polymer is an olefin polymer. Polymer particles containing inorganic particles.

2. The inorganic particle-containing polymer particles described in claim 1, which are dispersed in a dispersion medium to form a dispersion, which is applied onto a supporting substrate and dried to obtain a polymer particle layer-supporting substrate composite.

3. The inorganic particle-containing polymer particle described in claim 2, wherein the supporting substrate is an inorganic substrate.

4. The inorganic particle-containing polymer particle according to any one of claims 1 to 3, wherein the polymer is a cycloolefin polymer.

5. The inorganic particle-containing polymer particle according to any one of claims 1 to 4, further comprising a coupling agent.

6. The inorganic particle-containing polymer particles according to any one of claims 1 to 5, having an average particle size measured as an average equivalent circle diameter of 0.5 µm to 100 µm.

7. A dispersion comprising the inorganic particle-containing polymer particles according to any one of claims 1 to 6, and a dispersion medium.

8. 8. The dispersion of claim 7, wherein the dispersion medium comprises at least one of 2-propanol, ethylene glycol, and terpineol.

9. A polymer substrate, and a layer of polymer particles deposited on the polymer substrate; and The polymer particle layer comprises the inorganic particle-containing polymer particles according to claim 1 or 2. Polymer particle layer-polymer substrate composite.

10. 10. The composite of claim 9, wherein the polymer substrate and / or the polymer particle layer comprises inorganic particles.

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