Compression molding apparatus and compression molding method

Abstract

To provide a compression molding apparatus and a compression molding method that are capable of preventing deformation of electronic components and the like mounted on a base material and preventing variation in molding quality due to misalignment of resin during transportation.SOLUTION: A compression molding apparatus 1 uses a sealing mold 202 having an upper mold 204 and a lower mold 206 to seal a base material Wa on which an electronic component Wb is mounted with a block-shaped resin R, and process it into a molded product, and includes a resin welding mechanism 110 for welding the resin R to a predetermined position of the base material Wa.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a compression molding apparatus and a compression molding method. [Background technology]

[0002] As an example of a resin sealing apparatus and method for sealing a workpiece having electronic components mounted on a substrate with sealing resin (hereinafter sometimes simply referred to as "resin") and processing it into a molded product, a method using a compression molding method is known.

[0003] The compression molding method is a technique for resin sealing by supplying a predetermined amount of resin to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, placing a workpiece in the sealing area, and clamping the workpiece with the upper mold and the lower mold. As an example, a technique is known in which a workpiece having an electronic component (specifically, a semiconductor chip) wire-bonded on a substrate (specifically, a lead frame) is sandwiched between resin and molded (see Patent Document 1: JP-A-9-008179). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 9-008179 [Patent Document 2] JP 2004-179284 A Summary of the Invention [Problem to be solved by the invention]

[0005] Generally, when a workpiece having electronic components wire-bonded to a substrate (such as a normal resin substrate) is compression-molded using a sealing die having a cavity in the upper die, a technique is known in which resin (such as granular or liquid resin) is placed on the substrate and conveyed into the sealing die. At that time, a problem may occur in that the resin comes into contact with the wires of the workpiece and deforms the wires due to movement (misalignment) of the resin. In response to this, a technique is also known in which resin is placed on the substrate after the substrate is conveyed into the sealing die (Patent Document 2: see the second embodiment and Figs. 4 and 5 in JP 2004-179284 A). However, even when this technique is implemented, the problem of the resin coming into contact with the wires of the workpiece and deforming the wires may similarly occur.

[0006] In addition, when compression molding a workpiece in which a plurality of electronic components are arranged in a matrix on a substrate, a technique is known in which individual resins are placed on each electronic component. In this case, if the substrate is carried into a sealing die and then the resins are placed on the substrate in order, the thermal history of the resins in the early and later stages of the process due to the heat from the heated sealing die differs, which can cause a problem of variation in molding quality. [Means for solving the problem]

[0007] The present invention has been made in consideration of the above circumstances, and aims to provide a compression molding apparatus and a compression molding method that can prevent deformation of electronic components, etc. mounted on a substrate due to misalignment of the resin during transportation, and can prevent variation in molding quality.

[0008] The present invention solves the above problems by the solution means described below as one embodiment.

[0009] A compression molding apparatus according to one embodiment is a compression molding apparatus that uses a sealing die having an upper die and a lower die to seal a base material on which an electronic component is mounted with a block-shaped resin to process the base material into a molded product, and is provided with a resin welding mechanism that welds the resin to a predetermined position of the base material. A plurality of resins are used, including a cylindrical or prismatic resin having an accommodating recess or an accommodating hole on the lower surface thereof, the recess or hole having an inner diameter and depth capable of accommodating the electronic component.The requirements are as follows.

[0010] This allows the resin to be welded to a predetermined position on the substrate when the workpiece and resin are transported into the sealing die, thus resolving the problem that the resin may shift position on the substrate during transport and come into contact with and deform electronic components (e.g., wire-bonded portions, etc.).

[0011] Furthermore, when compression molding a workpiece having a matrix of electronic components arranged on a substrate, resin can be placed (welded in this embodiment) on each electronic component on the substrate before the workpiece is transported into the sealing mold. This solves the problem of variation in molding quality due to differences in thermal history that may occur when resins are placed in sequence after the substrate is brought into the sealing mold. Furthermore, since the process of placing resin on the substrate and the pressing process (the process of closing the mold) can be performed in parallel, there is no impact on the takt time.

[0012] Furthermore, when compression molding a workpiece that uses a base material with holes, such as a lead frame, it is possible to realize a resin supply method in which the resin is held on the base material and transported into a sealing mold.

[0013] The resin welding mechanism preferably includes a substrate heating section for heating the substrate, and a conveying and pressing section for placing the resin at a predetermined position on the substrate heated to a predetermined temperature and pressing the resin to weld it. By placing the resin on the substrate heated to a temperature lower than the resin curing temperature, the surface of the resin melts and adheres to the substrate, so that the resin can be fixed onto the substrate having holes.

[0014] In addition, the resin welding mechanism preferably includes a resin heating section for heating the resin, and a conveying and pressing section for placing the resin heated to a predetermined temperature at a predetermined position on the substrate and pressing it to weld it. By placing the resin heated to a temperature lower than the resin curing temperature on the substrate, the surface of the resin melts and adheres to the substrate, so that the resin can be fixed onto the substrate with holes.

[0015] In addition, it is preferable that the resin used is cylindrical or prismatic, and has an accommodating recess or hole on its underside that has an inner diameter and depth sufficient to accommodate the electronic component. This allows the resin to be welded onto the substrate in such a manner that it covers the electronic component from above and surrounds the periphery of the electronic component.

[0016] In addition, a plurality of resins are used, including a resin having a cylindrical or prismatic shape and a receiving recess or receiving hole on the lower surface thereof having an inner diameter and depth capable of receiving the electronic component. composition According to this method, fine adjustments can be made to optimize the resin placement depending on the type of workpiece (particularly, the shape, etc.).

[0017] Moreover, a compression molding method according to one embodiment is a compression molding method in which a substrate mounted with electronic components is sealed with a block-shaped resin using a sealing mold having an upper mold and a lower mold, thereby processing the substrate into a molded product, and is required to include a resin welding process for welding the resin to a predetermined position on the substrate.

[0018] A compression molding method according to another embodiment is a compression molding method for processing a substrate on which electronic components are mounted into a molded product by sealing the substrate with a block-shaped resin using a sealing die having an upper die and a lower die, the resin being cylindrical or prismatic and having an accommodating recess or accommodating hole on the underside thereof with an inner diameter and depth capable of accommodating the electronic components. and a resin welding process for placing the supplied resin at a predetermined position on the base material and then welding the resin.According to this, since the resin is placed on the base material inside the sealing die, the problem of the resin being displaced during transportation does not occur compared to the case where the resin is placed at a stage before the workpiece is transported into the sealing die. Therefore, deterioration of molding quality can be prevented.

[0019] In addition, a compression molding method according to another embodiment is a method for compressing a substrate on which an electronic component is mounted, using a sealing die having an upper die and a lower die. Material The compression molding method is a method for sealing a substrate with resin and processing the substrate into a molded product, the method comprising the steps of: a resin supplying step of supplying resin that is plate-shaped with a predetermined thickness and has a plurality of accommodating recesses or accommodating holes on its underside with an inner diameter and depth capable of accommodating the electronic components, the accommodating recesses or accommodating holes being provided for each electronic component; and a resin welding step of placing the supplied resin at a predetermined position on the substrate and welding the resin. According to this, in the case of compression molding a workpiece on which a plurality of electronic components are mounted in an arrangement such as a matrix on a substrate, the resin can be placed on the substrate in a single operation using a plate-shaped resin, which simplifies the process and reduces the time. Effect of the Invention

[0020] According to the present invention, it is possible to solve the problem that the resin may shift position on the substrate when the workpiece is transported, causing deformation of electronic components, etc. Furthermore, for a workpiece having a substrate on which multiple electronic components are mounted, by mounting the corresponding resin before the workpiece is transported into the sealing die, it is possible to solve the problem of variation in molding quality due to differences in the thermal history of the resin. [Brief description of the drawings]

[0021] [Figure 1] FIG. 1 is a plan view showing an example of a compression molding device according to an embodiment of the present invention. [Diagram 2] 2 is a cross-sectional view showing an example of a sealing mold of the compression molding apparatus of FIG. 1. [Diagram 3] 2 is a plan view showing an example of a workpiece to be compression molded by the compression molding apparatus of FIG. 1. [Figure 4] FIG. 2 is an explanatory diagram showing an example of a compression molding method according to an embodiment of the present invention. [Diagram 5] FIG. 4 is a plan view showing another example of a compression molding device according to an embodiment of the present invention. [Figure 6] FIG. 2 is a perspective view showing an example of a resin used in an embodiment of the present invention. [Figure 7] FIG. 2 is a perspective view showing another example of a resin used in the embodiment of the present invention. [Figure 8] FIG. 4 is a side view showing another example of a resin used in the embodiment of the present invention. [Figure 9] 9 is a cross-sectional view taken along line IX-IX in FIG. 8. [Figure 10] FIG. 4 is an explanatory diagram showing another example of a compression molding method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] [First embodiment] (Overall composition) Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a plan view (schematic diagram) showing an example of a compression molding apparatus 1 according to this embodiment. Fig. 2 is a side cross-sectional view (schematic diagram) showing an example of a sealing mold 202 of the compression molding apparatus 1. For convenience of explanation, arrows may be used in the drawings to explain the front-rear, left-right, and up-down directions of the compression molding apparatus 1. In addition, in all the drawings for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

[0023] The compression molding apparatus 1 according to this embodiment is an apparatus for resin-sealing a workpiece (molded product) W using a sealing die 202 including an upper die 204 and a lower die 206. Hereinafter, as an example of the compression molding apparatus 1, a compression molding apparatus will be described in which the workpiece W on which resin R is placed is held by the lower die 206, a cavity 208 (including a part of the die surface 204a) provided in the upper die 204 is covered by a release film (hereinafter, may be simply referred to as a "film") F, and the upper die 204 and the lower die 206 are clamped to resin-seal the workpiece W with the resin R.

[0024] First, the workpiece W to be molded has a configuration in which an electronic component Wb is mounted on a substrate Wa. More specifically, examples of the substrate Wa include a lead frame, a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a wafer, and other plate-like members formed in a rectangular shape (or a circular shape). Examples of the electronic component Wb include a semiconductor chip, a MEMS chip, a passive element, a capacitor, a coil, a heat sink, a conductive member, a spacer, and the like.

[0025] Examples of methods for mounting electronic components Wb on the substrate Wa include wire bonding mounting, flip chip mounting, etc. Alternatively, in the case of a configuration in which the substrate (glass or metal carrier plate) Wa is peeled off from the molded product after resin sealing, there is also a method in which the electronic components Wb are attached using a thermally peelable adhesive tape or an ultraviolet-curable resin that is cured by exposure to ultraviolet light.

[0026] Here, an example of the work W is shown in FIG. 3. In the work W, a lead frame is used as the substrate Wa, and a semiconductor chip is used as the electronic component Wb, and the electronic component (semiconductor chip) Wb is mounted in a matrix (row and column) on a die pad p of the substrate (lead frame) Wa by wire bonding mounting (wires are not shown). However, the mounting method is not limited to this, and other methods such as flip chip mounting may be used. Here, with regard to the size of the package to be resin-sealed, the width L1 of the package is set smaller than the dimension between two dam bars b, b (two on the left and right in FIG. 3), and the length L2 of the package is set smaller than the dimension between two hanging pins h, h (two on the top and bottom in FIG. 3). Note that, like a conventional lead frame, a number of predetermined through holes are formed on the plate surface.

[0027] Next, examples of the film F include film materials having excellent heat resistance, peelability, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride, etc. In this embodiment, a roll-shaped film is used as the film F. As a modified example, a strip-shaped film may be used (not shown).

[0028] Here, for the resin R according to this embodiment, a thermosetting resin (e.g., an epoxy resin containing a filler) formed in a block shape (a block shape) is used (details will be described later). As an example, the curing temperature of the resin R is about 100 to 200°C, and the melting start temperature of the surface portion is about 60°C. However, the resin R is not limited to this, and may be a resin other than an epoxy thermosetting resin.

[0029] Next, an overview of the compression molding apparatus 1 according to this embodiment will be described. As shown in Fig. 1, the compression molding apparatus 1 mainly comprises a supply unit 100A for supplying the workpiece W and the resin R, a press unit 100B for supplying and storing (disposing of) the film F and resin-sealing the workpiece W to process it into a molded product, and a storage unit 100C for storing the molded product after resin sealing. In this embodiment, an example will be described in which the upper mold 204 has a cavity 208, the lower mold 206 holds the workpiece W on which the resin R is placed on the substrate Wa, and the mold is closed to obtain a molded product. However, the present invention is not limited to this configuration.

[0030] In this embodiment, the supply unit 100A, the press unit 100B, and the storage unit 100C are arranged in the left-right direction in that order. Any number of guide rails 100D are provided linearly between the units, and a first loader 210 for transporting the workpiece W and the resin R and a second loader 212 for transporting the molded product are provided to be movable between predetermined units along the guide rails 100D.

[0031] The compression molding apparatus 1 can change the overall configuration by changing the configuration of the units. For example, the configuration shown in Fig. 1 is an example in which two press units 100B are installed, but a configuration in which only one press unit 100B is installed, or three or more press units are installed, etc. are also possible. Also, a configuration in which other units are installed (neither is shown in the figure) is also possible.

[0032] (Supply unit) Next, the supply unit 100A included in the compression molding apparatus 1 will be described.

[0033] The supply unit 100A includes a supply magazine 102 in which a plurality of workpieces W are stored, and a preparation table 104 on which the workpieces W supplied from the supply magazine 102 are placed. A known stack magazine, slit magazine, or the like is used as the supply magazine 102. Also, a known pusher, conveyor rail, or the like is provided (not shown) as a means for supplying (conveying) the workpieces W from the supply magazine 102 to the preparation table 104.

[0034] Next, the supply unit 100A is equipped with a resin supply section 106 that stores and supplies multiple block-shaped resin R, and a resin welding mechanism 110 that welds the resin R to a predetermined position of the base material Wa of the workpiece W (details will be described later).

[0035] Next, the supply unit 100A includes a first loader 210 that transports the workpiece W and the resin R. The first loader 210 has a holding mechanism for the workpiece W on its lower surface. As an example, the holding mechanism uses a known mechanism (for example, a clamping mechanism with holding claws, a suction mechanism with suction holes communicating with a suction device, etc.) (not shown).

[0036] Here, as an example of the resin welding mechanism 110 according to the present embodiment, as shown by the reference symbol 110A in FIG. 1, the mechanism is configured to include a substrate heating section 112 that holds the workpiece W and heats the workpiece W (specifically, the substrate Wa) to a predetermined temperature (a temperature at which the resin R does not completely melt (e.g., 60° C.)), and a conveying and pressing section 114 that places the resin R at a predetermined position on the substrate Wa in a state where the substrate Wa has been heated to the predetermined temperature and presses it to weld it. As an example, the substrate heating section 112 is configured to heat the substrate Wa using a known heating mechanism (e.g., an electric wire heater, an infrared heater, etc.). Note that, in addition to the substrate heating section 112, the mechanism may be configured to include a preheater (not shown) that preheats the workpiece W before being conveyed into the sealing die 202.

[0037] On the other hand, the transport and press unit 114 is configured to grip the block-shaped resin R supplied (transported) from the resin supply unit 106 and move it in the horizontal and vertical directions. Therefore, the transport and press unit 114 can grip the resin R and press it against the base material Wa heated to a predetermined temperature, thereby welding the resin R to a predetermined position on the base material Wa. Here, Fig. 4(a) shows a diagram of the resin R before being welded to the predetermined position on the base material Wa (such as on the die pad p around the electronic component Wb), and Fig. 4(b) shows a diagram of the resin R after being welded.

[0038] According to the above configuration, by placing the resin R on the substrate Wa heated to a temperature lower than the resin curing temperature, the surface of the resin R melts and adheres to the substrate Wa. Therefore, even if the workpiece W uses a substrate Wa having a through hole on its plate surface as exemplified by a lead frame, the resin R can be placed on the workpiece W (i.e., on the substrate Wa) and fixed (welded). Furthermore, even when the workpiece W having such a through hole is compression molded, it is possible to realize a resin supply method in which the resin R is held on the workpiece W (on the substrate Wa) and transported into the sealing die 202, as in the case of a workpiece having no through hole.

[0039] In addition, when the workpiece W and the resin R are transported into the sealing die 202, the resin R is welded to a predetermined position on the substrate Wa, thereby solving the following problem. Specifically, the problem of the resin R being displaced on the substrate Wa during transport and coming into contact with and deforming the electronic components Wb (particularly, the wire portions of the electronic components Wb wire-bonded on the substrate Wa) can be solved. Furthermore, before the workpiece W is transported into the sealing die 202, the resin R can be placed (welded in this embodiment) on each electronic component Wb on the substrate Wa. Therefore, the problem of variation in molding quality due to differences in thermal history, which may occur when the resin R is placed in order after the substrate Wa is carried into the sealing die 202, can be solved. In addition, the process of placing the resin R on the substrate Wa and the pressing process (the process of closing the mold) can be performed in parallel, so there is no impact on the tact time.

[0040] As another example of the resin welding mechanism 110, as shown by reference numeral 110B in FIG. 5, a configuration may be used that includes a resin heating section 116 that heats the resin R to a predetermined temperature (a temperature at which the resin R does not completely melt (e.g., 60°C)), and a conveying and pressing section 114 that places the resin R heated to the predetermined temperature at a predetermined position on a workpiece W (specifically, a substrate Wa) held on a table 118 and presses and welds the resin R. According to this configuration, by placing the resin R heated to a temperature lower than the resin curing temperature (e.g., about 100 to 200°C as mentioned above) (e.g., about 60°C as mentioned above) on the substrate Wa, the surface of the resin R melts and adheres to the substrate Wa, so that the resin R can be fixed onto the substrate Wa. Therefore, the same effect as the above-mentioned configuration example can be obtained.

[0041] Here, as the resin R according to the present embodiment, as shown in FIG. 6 (FIG. 6(a) is a top perspective view, and FIG. 6(b) is a bottom perspective view), a resin is preferably used that is cylindrical and has a non-penetrating accommodating recess (or a penetrating accommodating hole) Ra on the bottom surface, the inner diameter of which is large enough to accommodate the electronic component Wb in a depth and an inner diameter of the electronic component Wb. Specifically, the resin R is configured so that the inner diameter dimension of the accommodating recess (or the accommodating hole) Ra in a plan view is larger than the outer diameter dimension of the electronic component Wb in a plan view. Instead of the cylindrical shape, the resin R may be configured in a prismatic column shape, as shown in FIG. 7 (FIG. 7(a) is a top perspective view, and FIG. 7(b) is a bottom perspective view). Depending on the shape of the electronic component Wb, the shape of the accommodating recess Ra is preferably the same as that of the electronic component Wb. For example, in the case of a rectangular electronic component Wb, the planar shape of the bottom surface of the accommodating recess Ra is preferably also rectangular. According to these configurations, the resin R can be welded onto the substrate Wa in such an arrangement that it covers the electronic component Wb from above and surrounds the periphery of the electronic component Wb. Therefore, the necessary amount of resin can be evenly supplied around the electronic component Wb without causing deformation or misalignment of the electronic component Wb, and the quality of the molded product can be improved.

[0042] Furthermore, as a modified example of the resin R, as shown in Fig. 8 (side view) and Fig. 9 (cross-sectional view of line IX-IX in Fig. 8), a groove Rb (i.e., an area that does not come into contact with the upper surface of the substrate Wa) may be provided on the lower surface to be welded to the substrate Wa. This makes it easier to discharge the air inside the accommodation recess (or accommodation hole) Ra through the groove Rb when the work W is clamped between the upper die 204 and the lower die 206 and the resin R is heated and pressurized to perform resin sealing (compression molding) of the work W. This makes it possible to prevent the occurrence of molding defects in which residual air is trapped in the molded product as air bubbles.

[0043] In this embodiment, one resin R having the above-mentioned configuration is used. However, the present invention is not limited to this, and a configuration may be used in which multiple resins, such as the above-mentioned resin R and another resin, are used (not shown). This makes it possible to make fine adjustments so that the resin arrangement is optimal depending on the type of workpiece W (particularly, the shape, etc.).

[0044] (Press unit) Next, the press unit 100B included in the compression molding apparatus 1 will be described.

[0045] The press unit 100B includes a sealing die 202 having a pair of dies that can be opened and closed (for example, a plurality of die blocks, die plates, die pillars, and other members made of alloy tool steel are assembled together). The sealing die 202 can have a known configuration.

[0046] In this embodiment, of the pair of dies, one die on the upper side in the vertical direction is an upper die 204, and the other die on the lower side is a lower die 206. This sealing die 202 is closed and opened by the upper die 204 and the lower die 206 moving toward and away from each other. That is, the vertical direction (up and down direction) is the die opening and closing direction.

[0047] The mold opening and closing mechanism for opening and closing the sealing mold 202 is configured to include a pair of platens, a plurality of connecting mechanisms (tie bars or pillars) on which the pair of platens are supported, a drive source (e.g., an electric motor) for moving (raising and lowering) the platens, and a drive transmission mechanism (e.g., a ball screw or toggle link mechanism) (all not shown).

[0048] Here, the sealing mold 202 is disposed between a pair of platens in the mold opening and closing mechanism. In this embodiment, the upper mold 204 is assembled to a fixed platen (a platen fixed to the connecting mechanism), and the lower mold 206 is assembled to a movable platen (a platen that moves up and down along the connecting mechanism) (not shown). However, this configuration is not limited to this, and the upper mold 204 may be assembled to the movable platen and the lower mold 206 may be assembled to the fixed platen, or both the upper mold 204 and the lower mold 206 may be assembled to the movable platen.

[0049] Next, the upper die 204 of the sealing die 202 will be described. As shown in FIG. 2, the upper die 204 is configured to include an upper plate 222, a cavity piece 226, a clamper 228, and the like. In this embodiment, a cavity 208 is provided on the lower surface (the surface on the lower die 206 side) of the upper die 204. In this embodiment, a case where a workpiece W having a plurality of electronic components Wb arranged on a substrate Wa is collectively sealed with resin is taken as an example, and a plurality of cavities 208 are provided corresponding to the arrangement of the electronic components Wb. However, this is not limited to this configuration, and there may be a configuration in which one cavity is provided for a workpiece having one electronic component Wb mounted on each substrate Wa to be sealed (not shown).

[0050] As a specific example of the configuration around the cavity 208, the cavity piece 226 is fixed and assembled to the lower surface of the upper plate 222 via a cavity block 234. The cavity piece 226 and the cavity block 234 may be integral. Meanwhile, the clamper 228 is configured in an annular shape so as to surround the cavity piece 226, and is assembled to the lower surface of the upper plate 222 via a biasing member 232 so as to be spaced apart (floating) from the lower surface of the upper plate 222 and movable up and down. The cavity piece 226 constitutes the inner part (bottom part) of the cavity 208, and the clamper 228 constitutes the side part of the cavity 208. Here, the cavity piece 226 is configured so that the outer diameter dimension in a plan view is smaller than the outer diameter dimension in a plan view of the cavity 208.

[0051] In this embodiment, a suction mechanism (not shown) is provided that suction-holds the film F supplied from a film supply mechanism 250 (described later) to the upper mold 204. This makes it possible to suction-hold the film F to the mold surface 204a including the inner surface of the cavity 208.

[0052] In this embodiment, an upper die heating mechanism is provided that heats the upper die 204 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a control unit, a power source, and the like (none of which are shown), and performs heating and its control. As an example, the heater is built into the upper plate 222 or a die base (not shown) that houses them, and is configured to apply heat mainly to the entire upper die 204 and the resin R. As a result, the upper die 204 is heated and adjusted to a predetermined temperature (e.g., 100°C to 200°C).

[0053] Furthermore, in this embodiment, there is provided a film supply mechanism 250 that transports (supplies) the film F in a roll shape with no openings (holes) on its sheet surface into the sealing die 202. This film supply mechanism 250 includes an unwinding section 252 and a winding section 254, and is configured to transport the film F from the unwinding section 252 to the winding section 254. As a result, the film F is supplied to the sealing die 202 that is disposed between the unwinding section 252 and the winding section 254.

[0054] Next, the lower mold 206 of the sealing mold 202 will be described. As shown in Fig. 2, the lower mold 206 is configured to include a lower plate 224, a plate 238, etc. Here, the plate 238 is fixed and assembled to the upper surface of the lower plate 224 (the surface on the upper mold 204 side).

[0055] In this embodiment, a workpiece holding mechanism is provided that holds the workpiece W at a predetermined position on the upper surface of the plate 238. As an example, this workpiece holding mechanism communicates with a suction device via a suction passage disposed penetrating the plate 238 and the lower plate 224 (not shown). This makes it possible to hold the workpiece W by suction on the die surface 206a (here, the upper surface of the plate 238). Note that the workpiece holding mechanism may be configured to include holding claws that clamp the outer periphery of the workpiece W instead of or in addition to the above-mentioned suction mechanism.

[0056] In this embodiment, a lower die heating mechanism is provided that heats the lower die 206 to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a control unit, a power source, and the like (none of which are shown), and performs heating and its control. As an example, the heater is built into the lower plate 224 or a die base (not shown) that houses them, and is configured to apply heat mainly to the entire lower die 206 and the workpiece W. As a result, the lower die 206 is heated and adjusted to a predetermined temperature (e.g., 100°C to 200°C).

[0057] (Storage unit) Next, the storage unit 100C included in the compression molding apparatus 1 will be described.

[0058] The storage unit 100C includes a storage table 304 on which resin-sealed molded products are placed, and a storage magazine 302 in which a plurality of molded products are stored. A known stack magazine, slit magazine, or the like is used for the storage magazine 302. Also, a known pusher, transport rail, or the like is provided (not shown) as a means for storing (transporting) the molded products from the storage table 304 to the storage magazine 302.

[0059] Next, the storage unit 100C is provided with a second loader 212 that transports the molded products. The second loader 212 has a molded product holding mechanism on its underside. As an example, the holding mechanism uses a known mechanism (for example, a clamping mechanism with holding claws, a suction mechanism with suction holes that communicate with a suction device, etc.) (not shown).

[0060] (Resin sealing operation) Next, the operation of resin sealing using the compression molding apparatus 1 according to this embodiment (i.e., the compression molding method according to this embodiment) will be described. Here, an example is taken of a case where a workpiece W having a plurality of electronic components Wb (semiconductor chips, for example) mounted (implemented) in a matrix on a substrate Wa (a lead frame, for example) is held by the lower die 206 and resin sealing is performed all at once.

[0061] First, a heating step (upper die heating step) is performed in which the upper die 204 is heated to a predetermined temperature (e.g., 100°C to 200°C) by the upper die heating mechanism. In addition, a heating step (lower die heating step) is performed in which the lower die 206 is heated to a predetermined temperature (e.g., 100°C to 200°C) by the lower die heating mechanism.

[0062] Next, a process is performed in which the workpiece W is supplied from the supply magazine 102 and placed on the preparation table 104. Before or after this process, a process is performed in which the film supply mechanism 250 transports (sends out) the film F from the unwinding section 252 to the winding section 254, supplies the film F to a predetermined position (a position between the upper die 204 and the lower die 206) in the sealing die 202, and adsorbs and holds the film F to the die surface 204a including the inner surface of the cavity 208.

[0063] Next, a process of supplying a plurality of resins R from the resin supply unit 106 and a resin welding process of welding the resins R to a predetermined position of the base material Wa of the work W are performed. Here, as an example of the resin welding process according to the present embodiment, a base material Wa heating process of heating the base material Wa to a predetermined temperature (a temperature at which the resin R does not completely melt (for example, 60°C)) and a conveying and pressing process of placing the resin R at a predetermined position of the base material Wa in a state where it is heated to the predetermined temperature and pressing it to weld it (see FIG. 4). This makes it possible to achieve a state in which the resin R is welded to the predetermined position of the base material Wa. Therefore, as described above, even when a lead frame or the like is used as the base material Wa, the resin R can be placed on the work W and conveyed into the sealing die 202. In addition, since it is possible to prevent the resin R from shifting its position during conveyance, etc., it is possible to prevent damage to the wires and maintain good molding quality, particularly in resin sealing of wired products.

[0064] Here, the resin welding step preferably includes a step of fitting a cylindrical or prismatic resin R having an accommodating recess (or accommodating hole) Ra on its underside with an inner diameter and depth capable of accommodating the electronic component Wb, onto the base material Wa so that the electronic component Wb is accommodated in the accommodating recess (or accommodating hole) Ra, and a step of welding an outer edge of the accommodating recess (or accommodating hole) Ra on the underside of the resin R to a position on the base material Wa surrounding the electronic component Wb. This allows the resin R to be welded onto the base material Wa in an arrangement that covers the electronic component Wb from above and surrounds the periphery of the electronic component Wb.

[0065] As another example of the resin welding process, the process may include a resin heating process in which the resin R is heated to a predetermined temperature (a temperature at which the resin R does not completely melt (e.g., 60°C)), and a transport and pressing process in which the resin R heated to the predetermined temperature is placed at a predetermined position on the substrate Wa and pressed to weld it. With this configuration, the same effect as the above-mentioned configuration example can be obtained.

[0066] Next, the first loader 210 transports the workpiece W with the resin R welded thereto into the sealing die 202, and a process of holding the workpiece W at a predetermined position in the lower die 206 is performed. Note that, before the first loader 210 transports the workpiece W into the sealing die 202, a process of preheating the workpiece W may be further performed.

[0067] The subsequent steps are the same as those of the conventional compression molding method, and the steps of closing the sealing mold 202, clamping two workpieces W between the upper mold 204 and the lower mold 206, and heating and pressurizing the resin R against the workpieces W are performed. This thermally hardens the resin R, completing the resin sealing (compression molding). Next, the sealing mold 202 is opened, and a step of separating the molded product and the used film F is performed. Next, a step of transporting the molded product from inside the sealing mold 202 by the second loader 212 is performed. Also, a step of feeding out the used film F (film discharging step) is performed by transporting the film F from the unwinding section 252 to the winding section 254 by the film supply mechanism 250.

[0068] The above are the main operations of resin sealing performed using the compression molding apparatus 1. However, the above process order is only an example, and the order of steps can be changed or performed in parallel as long as there is no problem. For example, in this embodiment, a compression molding apparatus equipped with multiple (two, as an example) press units is used, and the above operations can be performed in parallel to efficiently form a molded product.

[0069] [Second embodiment] Next, a second embodiment of the present invention will be described. This embodiment is different from the above-described first embodiment in the supplying step of the resin R. The following description will focus on this difference.

[0070] In the first embodiment described above, a resin welding process is performed to weld the resin R to a predetermined position of the base material Wa of the work W before the work W is transported into the sealing mold 202. In contrast, in this embodiment, the work W is transported into the sealing mold 202 and held in a predetermined position (specifically, a predetermined position in the lower mold 206), and then a process is performed in which the resin R is placed in a predetermined position on the work W (specifically, the base material Wa) in the sealing mold 202. Next, the mold is closed to perform compression molding. The configuration (shape) of the resin R is the same as in the first embodiment.

[0071] According to this, since the resin R is placed on the base material Wa inside the sealing die 202, there is no problem of the resin R shifting position during transport, compared to the case where the resin R is placed at a stage before the workpiece W is transported into the sealing die 202. Therefore, it is possible to prevent deformation of the workpiece W (particularly, wires, etc.) that may occur due to the shifting position of the resin R. Note that, since welding is not an essential component for the process of placing (placing) the resin R described above, a heating mechanism or process for welding and a pressing mechanism or process are not required, and it is possible to simplify both the device and the process.

[0072] [Third embodiment] Next, a third embodiment of the present invention will be described. This embodiment is different from the first and second embodiments in the configuration of the resin R used. The following description will focus on this difference.

[0073] In the first embodiment described above, the resin R is cylindrical or prismatic, and has an accommodating recess (or accommodating hole) Ra on its lower surface, the inner diameter and depth of which are sufficient to accommodate the electronic component Wb, and one resin R is used for each electronic component Wb. In contrast, the present embodiment uses a plate-like resin R having a predetermined thickness, and has an accommodating recess (or accommodating hole) Ra on its lower surface, the inner diameter and depth of which are sufficient to accommodate the electronic component Wb.

[0074] As a specific operation example, the resin R is placed on the substrate Wa so that the electronic components Wb are accommodated in the corresponding accommodating recesses (or accommodating holes) Ra. Here, Fig. 10(a) shows the resin R before it is placed on the substrate Wa, and Fig. 10(b) shows the resin R after it is placed. The resin R may be fused to the substrate Wa using a resin fusion mechanism similar to that of the first embodiment. The accommodating recesses (or accommodating holes) Ra may be provided individually corresponding to the individual electronic components Wb, or one accommodating recess (or accommodating hole) Ra may be provided for a plurality of electronic components Wb.

[0075] According to this, for example, when compression molding a workpiece W in which multiple electronic components Wb are arranged in a matrix on a base material Wa, a plate-shaped resin R can be used and placed on the base material Wa in a single operation, thereby simplifying the process and reducing time.

[0076] As described above, according to the present invention, it is possible to solve the problem that the resin may shift position on the substrate when the workpiece is transported, causing deformation of electronic components, etc. Furthermore, if a configuration is further provided in which a corresponding resin is mounted on a workpiece having a plurality of electronic components mounted on a substrate before the workpiece is transported into the sealing die, it is possible to solve the problem of variation in molding quality due to differences in the thermal history of the resin. Therefore, it is possible to stabilize the molding quality (maintain high quality).

[0077] The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, in the above-described embodiment, a configuration in which a plurality of cavities are provided in the upper mold is described as an example, but the present invention is not limited to this, and can also be applied to a configuration in which a single cavity is provided in the upper mold.

[0078] In the above embodiment, the compression molding apparatus having a cavity in the upper mold is described as an example, but the present invention can also be applied to a compression molding apparatus having a cavity in the lower mold. In that case, the resin may be welded to the lower surface of the workpiece so that it does not fall, and then the workpiece may be transported into the sealing mold and held in a predetermined position in the upper mold.

[0079] In addition, in the above embodiment, a workpiece in which electronic components are mounted on a substrate by wire bonding mounting has been described as an example, but the present invention is also applicable to a workpiece in which electronic components are mounted on a substrate by flip chip mounting. [Explanation of symbols]

[0080] 1. Compression molding equipment 110 Resin Welding Mechanism 112 Base material heating section 114 Conveying and pressing section 116 Resin heating section 202 Sealing mold R resin W work

Claims

1. A compression molding apparatus that uses a sealing mold having an upper mold and a lower mold to seal a base material on which an electronic component is mounted with a block-shaped resin and process it into a molded product, a resin welding mechanism for welding the resin to a predetermined position on the base material, A plurality of resins are used, including a cylindrical or prismatic resin having an accommodating recess or an accommodating hole on the bottom surface, the recess or hole having an inner diameter and depth capable of accommodating the electronic component. A compression molding apparatus comprising:

2. A compression molding apparatus that uses a sealing mold having an upper mold and a lower mold to seal a base material on which an electronic component is mounted with a block-shaped resin and process it into a molded product, a resin welding mechanism for welding the resin to a predetermined position on the base material, The resin used is a plate-like resin having a predetermined thickness, and has a bottom surface on which a plurality of accommodating recesses or accommodating holes having an inner diameter and depth capable of accommodating the electronic components are formed, and the accommodating recesses or accommodating holes are provided for each of the electronic components. A compression molding apparatus comprising:

3. A compression molding method for molding a substrate having an electronic component mounted thereon into a molded product by sealing the substrate with a block-shaped resin using a sealing mold having an upper mold and a lower mold, comprising: a resin supplying step of supplying a plurality of resin pieces, the resin pieces being cylindrical or prismatic and having an accommodating recess or an accommodating hole on a lower surface thereof, the recess or hole having an inner diameter and depth capable of accommodating the electronic component; and a resin welding process in which the supplied resin is placed at a predetermined position on the base material and then welded. A compression molding method comprising the steps of:

4. A compression molding method for molding a substrate having an electronic component mounted thereon into a molded product by encapsulating the substrate with a resin using a encapsulation mold having an upper mold and a lower mold, comprising the steps of: a resin supplying step of supplying the resin in a plate shape having a predetermined thickness, the resin having a bottom surface on which a plurality of accommodating recesses or accommodating holes having an inner diameter and depth capable of accommodating the electronic components are formed, the accommodating recesses or the accommodating holes being provided for each of the electronic components; and a resin welding process in which the supplied resin is placed at a predetermined position on the base material and then welded. A compression molding method comprising the steps of:

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