Resin sealing device and resin sealing method

Abstract

To provide a resin sealing device and a resin sealing method which prevent occurrence of a molding failure caused by leakage of a resin, and can improve molding quality, in a configuration having a cavity on a lower die.SOLUTION: A resin sealing device 1, which seals workpiece W where an electronic component Wb is mounted on a substrate Wa with a resin R and works the workpiece W into a molded article Wp using a sealing mold 202 having an upper die 204 and a lower die 206 having a cavity 208, includes: a resin guard 400 for holding a film F on which the resin R is mounted; a resin guard loader 212 for conveying the resin guard 400; and a plunger 214 for pressing the resin R, discharging air in the resin R and reducing bulk in the state where the film F on which the resin R is mounted is stored in and held on the cavity 208.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a resin sealing apparatus and a resin sealing method. [Background technology]

[0002] As an example of a resin sealing apparatus and method for sealing a workpiece having electronic components mounted on a substrate with sealing resin (hereinafter sometimes simply referred to as "resin") and processing it into a molded product, a method using a compression molding method is known.

[0003] The compression molding method is a technology in which a predetermined amount of resin is supplied to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, a workpiece is placed in the sealing area, and the upper mold and lower mold are clamped to seal the resin. As an example, when a sealing mold having a cavity in the upper mold is used, a technology is known in which resin is supplied all at once to the center position on the workpiece and molded. On the other hand, when a sealing mold having a cavity in the lower mold is used, a technology is known in which a film and resin that cover the mold surface including the cavity are supplied and molded (Patent Document 1: JP 2019-145550 A). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-145550 A Summary of the Invention [Problem to be solved by the invention]

[0005] In compression molding with a cavity in the lower mold, it is important to prevent resin from leaking (spilling) from the cavity in order to maintain good molding quality. However, there is a problem that resin leakage is likely to occur because the air contained in the gaps is foamed (defoamed) by heating or decompression, especially in granular resin, due to the bulkiness caused by the particles piling up with gaps between them. [Means for solving the problem]

[0006] The present invention has been made in consideration of the above-mentioned circumstances, and aims to provide a resin sealing apparatus and a resin sealing method that can prevent molding defects caused by resin leakage and improve molding quality in a configuration having a cavity in the lower mold.

[0007] The present invention solves the above problems by the solution means described below as one embodiment.

[0008] The resin sealing apparatus according to the present invention is an apparatus for sealing a workpiece having an electronic component mounted on a substrate with resin to process the workpiece into a molded product, using a sealing die having an upper die and a lower die having a cavity, and is provided with a resin guard for holding a film on which the resin is placed, a resin guard loader for transporting the resin guard, and a plunger for pressing the resin to expel air from within the resin and reduce its volume while the film on which the resin is placed is housed and held in the cavity. The resin guard loader has a holding mechanism for holding the resin guard, which is separate from the resin guard loader, the plunger is disposed in a recess of the resin guard loader, and has a pressing plate configured to be able to pass through a through hole that serves as a holding space for the resin in the resin guard when the resin guard is held on the lower surface of the resin guard loader, and to press the resin. The requirements are as follows.

[0009] According to this, by using the resin guard to transport the film and resin, it is possible to prevent leakage of the resin when the resin is carried into the lower mold and contained and held in the cavity. Furthermore, by pressing the resin contained and held in the cavity of the lower mold with a plunger, it is possible to eliminate or reduce the bulkiness of the resin. Therefore, it is possible to prevent leakage of the resin caused by the air contained in the gaps in the resin foaming during molding.

[0010] Also, With the resin guard held by the resin guard loader and in contact with the lower die, the resin carried into the cavity of the lower die can be pressed by the plunger.

[0011] It is also preferable to further include a vibration mechanism that vibrates the resin guard while holding the film on which the resin is placed. With this, by vibrating the resin guard while granular, crushed, or powdered resin is placed on the upper surface of the film held by the resin guard, the thickness of the resin placed on the upper surface of the film can be made uniform at a stage before the film is carried into the sealing mold.

[0012] Further, a resin sealing method according to the present invention is a resin sealing method for processing a workpiece having an electronic component mounted on a substrate into a molded product by sealing with resin using a sealing mold including an upper mold and a lower mold having a cavity, the method comprising: a resin placing step of holding a film on the lower surface of a resin guard and placing the resin on the film through a through hole provided in the resin guard; a resin transport step of transporting the resin guard holding the film on which the resin has been placed by a resin guard loader and accommodating and holding the film on which the resin has been placed in the cavity; and a resin pressing step of pressing the resin with a plunger while the film on which the resin has been placed is accommodated and held in the cavity to discharge air from within the resin and reduce its volume. The resin pressing step includes a step of passing a pressing plate, which is provided so as to be movable up and down on the plunger disposed in the recess of the resin guard loader, through the through hole of the resin guard held by the resin guard loader to press the resin. The requirements are as follows. Effect of the Invention

[0013] According to the present invention, in a resin sealing device and a resin sealing method having a cavity in a lower mold, the problem that the air in the gaps in the resin foams (defoams) during molding due to the bulk caused by the particles being piled up with gaps between them, and the resin is likely to leak, can be solved. Therefore, it is possible to prevent molding defects caused by resin leakage and improve molding quality. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a plan view illustrating an example of a resin sealing apparatus according to an embodiment of the present invention. [Diagram 2] 2 is a cross-sectional view showing an example of a sealing die of the resin sealing apparatus of FIG. 1. [Diagram 3] 2 is a cross-sectional view showing an example of a resin guard loader of the resin sealing apparatus of FIG. 1. [Figure 4] 2 is a plan view showing an example of a resin guard of the resin sealing apparatus of FIG. 1. [Diagram 5] 5A to 5C are explanatory diagrams illustrating an operation of the resin sealing apparatus according to the embodiment of the present invention. [Figure 6] FIG. 6 is an explanatory diagram of the operation following FIG. 5. [Figure 7] FIG. 7 is an explanatory diagram of the operation following FIG. [Figure 8] FIG. 8 is an explanatory diagram of the operation following FIG. 7. [Figure 9] FIG. 9 is an explanatory diagram of the operation following FIG. 8. [Figure 10] 10 is an explanatory diagram of the operation following FIG. 9. [Figure 11] FIG. 11 is an explanatory diagram of the operation following FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] (Overall composition) Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view (schematic diagram) showing an example of a resin sealing apparatus 1 according to this embodiment. FIG. 2 is a side cross-sectional view (schematic diagram) showing an example of a sealing mold 202 of the resin sealing apparatus 1, and FIG. 3 is a side cross-sectional view (schematic diagram) showing an example of a resin guard loader 212 of the resin sealing apparatus 1. For convenience of explanation, arrows may be used in the drawings to explain front-rear, left-right, and up-down directions in the resin sealing apparatus 1. In addition, in all the drawings for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

[0016] The resin sealing apparatus 1 according to this embodiment is an apparatus for resin-sealing a workpiece (molded product) W by using a sealing die 202 including an upper die 204 and a lower die 206. Hereinafter, the resin sealing apparatus 1 will be described as an example of a compression molding apparatus in which the workpiece W is held by the upper die 204, a cavity 208 (including a part of the die surface 206a) provided in the lower die 206 is covered with a release film (hereinafter, may be simply referred to as a "film") F, resin R is supplied, and the upper die 204 and the lower die 206 are clamped to seal the workpiece W with the resin R.

[0017] First, the workpiece W to be molded has a configuration in which a plurality of electronic components Wb are mounted in a matrix on a substrate Wa. More specifically, examples of the substrate Wa include plate-shaped components (so-called rectangular workpieces) such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers formed in a rectangular shape. Examples of the electronic components Wb include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, spacers, and the like. Note that other examples of the substrate Wa may include the above-mentioned components formed in a circular or square shape (not shown).

[0018] Examples of methods for mounting electronic components Wb on the substrate Wa include wire bonding mounting, flip chip mounting, etc. Alternatively, in the case of a configuration in which the substrate (glass or metal carrier plate) Wa is peeled off from the molded product Wp after resin sealing, there is also a method in which the electronic components Wb are attached using a thermally peelable adhesive tape or an ultraviolet-curable resin that is cured by exposure to ultraviolet light.

[0019] On the other hand, examples of the resin R include granular (including cylindrical), pulverized, or powdered (sometimes collectively referred to as "granular" in the present application) thermosetting resins (e.g., filler-containing epoxy resins, etc.). Note that the resin R is not limited to the above state, and may be in other states (shapes), such as liquid, plate, or sheet, and may be a resin other than an epoxy thermosetting resin.

[0020] As an example of the film F, a film material having excellent heat resistance, peelability, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride, etc., is preferably used. In this embodiment, a strip-shaped film corresponding to the strip-shaped workpiece W is used as the film F. However, the present invention is not limited to this configuration.

[0021] Next, an overview of the resin sealing apparatus 1 according to this embodiment will be described. As shown in FIG. 1, the resin sealing apparatus 1 mainly comprises a work processing unit 100A that mainly supplies the work W and stores the molded product Wp after resin sealing, a press unit 100B that mainly seals the work W with resin and processes it into the molded product Wp, and a dispensing unit 100C that mainly supplies and stores (disposes) the film F and supplies the resin R. In this embodiment, a configuration in which one lower mold 206 has two sets of cavities 208 and one upper mold 204 has two work holding parts 205, two workpieces W (for example, rectangular workpieces) are resin-sealed together and two molded products Wp are obtained at the same time will be described as an example. However, the present invention is not limited to this configuration.

[0022] In this embodiment, the work processing unit 100A, the press unit 100B, and the dispensing unit 100C are arranged in the left-right direction in that order. Any number of guide rails (not shown) are provided linearly across the units, and a first loader 210 for transporting the work W and the molded product Wp, and a second loader 212 for transporting the film F and the resin R are provided so as to be movable between predetermined units along any of the guide rails.

[0023] The resin sealing apparatus 1 can change the overall configuration by changing the configuration of the units. For example, the configuration shown in Fig. 1 is an example in which two press units 100B are installed, but a configuration in which only one press unit 100B is installed, or three or more press units are installed, etc. are also possible. Also, a configuration in which other units are installed (neither of which are shown in the figures) is also possible.

[0024] (Work Processing Unit) Next, the workpiece processing unit 100A included in the resin sealing apparatus 1 will be described in detail.

[0025] The workpiece processing unit 100A includes a supply magazine 102 for storing a plurality of workpieces W, and a storage magazine (not shown) for storing a plurality of molded products Wp. Here, the supply magazine 102 and the storage magazine may be a known stack magazine, a slit magazine, or the like.

[0026] As an example, the work processing unit 100A is provided with a supply rail 104 disposed behind the supply magazine 102, on which the work W taken out from the supply magazine 102 is placed. In this embodiment, the work W is supplied from the supply magazine 102 to the supply rail 104 via a relay rail 106 using a known pusher or the like (not shown). Furthermore, the work processing unit 100A is provided with a supply pickup 120 that holds the work W placed on the supply rail 104 and transports it to a predetermined position.

[0027] The work processing unit 100A is also provided with a storage rail (not shown) disposed behind a storage magazine (not shown) on which the molded product Wp removed from the sealing mold 202 is placed. In this embodiment, the molded product Wp is stored in the storage magazine from the storage rail via a relay rail using a known pusher or the like (both not shown). Furthermore, the work processing unit 100A is provided with a storage pickup 122 and a storage elevator 124 that receive the molded product Wp after resin sealing and transport it onto the storage rail (not shown).

[0028] Next, the work processing unit 100A is provided with a first loader 210 that transports the work W and the molded product Wp. Specifically, the first loader 210 is provided with a first holding section 210A that holds the work W held by the supply pickup 120 by a holding mechanism provided on its upper surface and transports it to a predetermined holding position of the upper die 204. The first loader 210 is also provided with a second holding section 210B that holds the molded product Wp held by the upper die 204 after resin sealing by a holding mechanism provided on its upper surface and transports it to a predetermined position outside the sealing die 202 (for example, a position to be held by the storage pickup 122). Here, the holding mechanism for the work W in the first holding section 210A is configured to be arranged in two rows in the left-right direction so as to be able to hold two rectangular workpieces W. Similarly, the holding mechanism for the molded product Wp in the second holding section 210B is configured to be arranged in two rows in the left-right direction so as to be able to hold two rectangular molded products Wp. However, the present invention is not limited to these configurations. The holding mechanism may be a known holding mechanism (for example, a clamping mechanism with holding claws, a suction hole communicating with a suction device for suction, etc.) (not shown).

[0029] The workpiece processing unit 100A also includes a workpiece heater 116 that heats the workpiece W transported by the first loader 210 from its lower surface (substrate Wa side). As an example, a known heating mechanism (e.g., an electric wire heater, an infrared heater, etc.) is used for the workpiece heater 116. This allows the workpiece W to be preheated before being transported into the sealing mold 202 and heated. Note that the workpiece heater 116 may not be included.

[0030] (Press unit) Next, the press unit 100B included in the resin sealing apparatus 1 will be described in detail.

[0031] The press unit 100B is equipped with a sealing mold 202 having a pair of molds (for example, a plurality of mold blocks, mold plates, mold pillars, and other members made of alloy tool steel are assembled) that are opened and closed. In this embodiment, one of the pair of molds, which is on the upper side in the vertical direction, is an upper mold 204, and the other mold on the lower side is a lower mold 206. This sealing mold 202 is closed and opened by the upper mold 204 and the lower mold 206 moving toward and away from each other. In other words, the vertical direction (up and down direction) is the mold opening and closing direction.

[0032] The sealing mold 202 is opened and closed by a known mold opening and closing mechanism (not shown). For example, the mold opening and closing mechanism includes a pair of platens, a plurality of connecting mechanisms (tie bars and columns) between which the pair of platens are supported, a drive source (e.g., an electric motor) and a drive transmission mechanism (e.g., a ball screw and a toggle link mechanism) that move (raise and lower) the platens (all not shown).

[0033] Here, the sealing mold 202 is disposed between a pair of platens of the mold opening and closing mechanism. In this embodiment, an upper mold 204 serving as a fixed mold is assembled to a fixed platen (a platen fixed to the connecting mechanism), and a lower mold 206 serving as a movable mold is assembled to a movable platen (a platen that rises and falls along the connecting mechanism). However, this configuration is not limited to this, and the upper mold 204 may be assembled to the movable platen and the lower mold 206 may be assembled to the fixed platen, or both the upper mold 204 and the lower mold 206 may be assembled to the movable platen.

[0034] Next, the lower mold 206 of the sealing mold 202 will be described in detail. As shown in Fig. 2, the lower mold 206 includes a lower plate 222, a cavity piece 226, a clamper 228, etc., which are assembled together. In this embodiment, a cavity 208 is provided on the upper surface of the lower mold 206 (the surface on the upper mold 204 side).

[0035] More specifically, the cavity piece 226 is fixedly attached to the upper surface of the lower plate 222. Meanwhile, the clamper 228 is configured in an annular shape so as to surround the cavity piece 226, and is attached to the upper surface of the lower plate 222 via a biasing member 232 so as to be spaced apart (floating) from the upper surface of the lower plate 222 and be movable up and down. The cavity piece 226 forms the inner part (bottom part) of the cavity 208, and the clamper 228 forms the side part of the cavity 208. Here, in this embodiment, as shown in FIG. 1, two sets of cavities 208 are arranged side by side in the left-right direction in one lower mold 206 (208A, 208B in the figure), and two workpieces W are collectively sealed with resin. However, the present invention is not limited to this configuration.

[0036] Here, a suction groove (not shown) is provided on the mold surface 204a of the upper mold 204 facing the clamper 228, and this groove is connected to a suction device (not shown). In addition, by providing a seal structure surrounding these, it becomes possible to degas the cavity 208 in a mold closed state by driving the suction device to reduce the pressure.

[0037] In this embodiment, a suction mechanism is provided that suctions and holds the film F (in this embodiment, with the resin R mounted thereon) supplied from the dispensing unit 100C described below on the lower mold 206. As an example, this suction mechanism has suction paths 230a and 230b that are disposed penetrating the clamper 228 and communicate with a suction device (not shown), and a suction path 230c that is disposed penetrating the lower plate 222 and the cavity piece 226 and communicates with a suction device (not shown). Specifically, one end of the suction paths 230a, 230b, and 230c is connected to the mold surface 206a of the lower mold 206, and the other end is connected to a suction device disposed outside the lower mold 206. This makes it possible to drive the suction device to suck the film F through the suction paths 230a, 230b, and 230c, and to hold the film F by suction on the mold surface 206a including the inner surface of the cavity 208.

[0038] In this way, by providing a film F that covers the inner surface of the cavity 208 and a part of the mold surface 206a of the lower mold 206, the portion of the resin R on the underside of the molded product Wp can be easily peeled off, making it possible to easily remove the molded product Wp from the sealing mold 202 (lower mold 206).

[0039] A gap of a predetermined dimension provided between the inner peripheral surface of the clamper 228 and the outer peripheral surface of the cavity piece 226 constitutes a part of the suction path 230a. Therefore, a seal member 234 (e.g., an O-ring) is disposed at a predetermined position in the gap to perform a sealing function when the film F is sucked.

[0040] In this embodiment, a lower die heating mechanism is provided that heats the lower die 206 to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by a control unit (all not shown). As an example, the heater is built into the lower plate 222 or a die base (not shown) that houses them, and is configured to apply heat mainly to the entire lower die 206 and the resin R (described later). As a result, the lower die 206 is heated to a predetermined temperature (e.g., 100°C to 200°C).

[0041] Next, the upper die 204 of the sealing mold 202 will be described in detail. As shown in Fig. 2, the upper die 204 includes an upper plate 224, a holding plate 236, etc., which are assembled together. Here, the holding plate 236 is fixed to and assembled with respect to the lower surface of the upper plate 224 (the surface on the lower die 206 side).

[0042] In this embodiment, a workpiece holding section 205 is provided to hold the workpiece W at a predetermined position on the lower surface of the holding plate 236. As an example, the workpiece holding section 205 has a suction passage 240a that is disposed penetrating the holding plate 236 and the upper plate 224 and communicates with a suction device (not shown). Specifically, one end of the suction passage 240a is connected to the die surface 204a of the upper die 204, and the other end is connected to a suction device disposed outside the upper die 204. This allows the suction device to be driven to suck the workpiece W through the suction passage 240a, and the workpiece W can be sucked and held on the die surface 204a (here, the lower surface of the holding plate 236). Furthermore, a configuration having holding claws that clamp the outer periphery of the workpiece W may be provided in parallel with the configuration having the suction passage 240a (not shown).

[0043] In this embodiment, an upper die heating mechanism is provided that heats the upper die 204 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by a control unit (all not shown). As an example, the heater is built into the upper plate 224 or a die base (not shown) that houses them, and is configured to apply heat mainly to the entire upper die 204 and the workpiece W. As a result, the upper die 204 is heated to a predetermined temperature (e.g., 100°C to 200°C).

[0044] (Dispense unit) Next, the dispensing unit 100C included in the resin sealing apparatus 1 will be described in detail.

[0045] The dispensing unit 100C includes a film supply mechanism 306 that supplies the film F, and a dispenser 312 that supplies the resin R. In this embodiment, when the film F and the resin R are transported to the sealing die 202, a resin guard 400 (described later) is used as a jig for holding and transporting them.

[0046] As an example, the film supply mechanism 306 is configured to include two film rolls 306A, 306B having an unwinding / winding mechanism, and a cutting mechanism (such as a known fixed blade cutter or heat melting cutter) that cuts the long film F. This makes it possible to supply rectangular sheets of film F of a predetermined length.

[0047] The dispensing unit 100C also includes a resin guard pickup 304 that transports the resin guard 400 (and film F, resin R) within the unit, and a second loader 212 (referred to as the "resin guard loader" in this application) that transports the resin guard 400 (and film F, resin R) received from the resin guard pickup 304 into the sealing mold 202 and also transports the used film Fd from the sealing mold 202.

[0048] As an example, the resin guard loader 212 is provided with a third holding section 212A that holds the resin guard 400, transports it into the sealing mold 202, and holds the film F (with the resin R placed) held by the resin guard 400 in the cavity 208 of the lower mold 206 (including a part of the mold surface 206a). Furthermore, the resin guard loader 212 according to this embodiment is provided with a fourth holding section 212B that holds the used film Fd, transports it from the sealing mold 202 to the disposer 316 for disposal. Note that the holding mechanism for the resin guard 400 in the resin guard pickup 304 and the resin guard loader 212 uses a known holding mechanism (for example, a structure that has holding claws to hold the film, a structure that has suction holes communicating with a suction device to adsorb the film, etc.) (not shown). Further, as a holding mechanism for the used film Fd in the resin guard loader 212, a known holding mechanism (for example, a configuration for adsorbing the used film Fd by having a suction hole communicating with a suction device, etc.) is used (not shown).

[0049] Furthermore, the resin guard loader 212 is provided with a plunger 214 that presses the resin R to discharge air from within the resin R (here, the entirety of the predetermined amount of resin R placed) and reduce the volume when the film F on which the resin R is placed is housed and held in the cavity 208. Specifically, the plunger 214 has a pressing plate 216 that is configured to be able to pass through through holes (resin injection holes described later) 400a and 400b that serve as a holding space for the resin R in the resin guard 400 when the resin guard 400 is held on the lower surface of the resin guard loader 212, and presses the resin R. That is, the pressing plate 216 is configured to be able to move in the up-down direction (vertical direction). Note that a known moving mechanism (for example, a ball screw or a cylinder mechanism) or the like is used as the moving mechanism of the pressing plate 216 (not shown).

[0050] According to the above configuration, by using the resin guard 400 to transport the resin R, it is possible to prevent leakage (spillage) of the resin R and the scattering of fine powder during the process of transporting the resin R into the sealing mold 202 and until the resin R is placed on the lower mold 206 (specifically, the cavity 208). Furthermore, while the resin guard 400 is held on the lower surface of the resin guard loader 212 and placed (contacted) on the lower mold 206 (i.e., while the resin guard 400 is sandwiched between the resin guard loader 212 and the lower mold 206), the resin R transported to the lower mold 206 (cavity 208) can be pressed by the plunger 214. This can eliminate or reduce the bulkiness caused by the resin R particles piling up with gaps between them. Therefore, it is possible to solve the problem that the air in the gaps in the resin R foams (defoams) during molding due to the bulkiness of the resin R, making the resin R more likely to leak. In addition, in the unlikely event that an area occurs in the cavity 208 where the resin R has not spread, the effect of filling that area with the resin R can also be obtained.

[0051] It is preferable that the pressing plate 216 of the plunger 214 has a surface treatment applied to the lower surface 216a that comes into contact with the resin R to prevent adhesion of the resin R. The reason for this is that it is possible to prevent a problem in which the resin R adheres to the pressing plate 216 and cannot be set in the lower mold 206 when the pressing plate 216 is moved upward (raised) after pressing the resin R.

[0052] Here, as a modified example of the plunger 214, a configuration including a heating mechanism for heating the pressing plate 216 to a predetermined temperature (a temperature at which the resin R does not completely melt or dissolve (e.g., 60°C)) may be used (not shown). With this configuration, the resin R can be pressed by the pressing plate 216 heated to a predetermined temperature, and the particles of the resin R, particularly on the surface (upper surface), can be fused together and integrated. Therefore, when the pressing plate 216 is moved (raised) upward and the surface (upper surface) of the resin R is exposed, it is possible to prevent the fine powdery resin R from flying up into the sealing die 202.

[0053] Next, the dispensing unit 100C is provided with a vibration mechanism (not shown) that vibrates the resin guard 400 holding the film F on which the resin R is placed, in at least one direction of front and back, left and right, and up and down. As an example, the vibration mechanism is a known vibration mechanism (e.g., a vibration motor, an air vibrator, etc.) that is disposed on the conveying table 310. This allows the resin guard 400 to be vibrated in a state in which the granular, pulverized, or powdered resin R is placed on the upper surface of the film F held by the resin guard 400, so that the thickness of the resin R placed on the upper surface of the film F can be made uniform at a stage before it is carried into the sealing mold 202. Therefore, it is possible to prevent molding defects and stabilize the quality. It is also possible to configure the device without the vibration mechanism.

[0054] Next, the configuration of the resin guard 400 used in this embodiment for transporting the film F and the resin R will be described. As shown in FIG. 4, the resin guard 400 has a flat plate shape of a predetermined thickness formed on a plane in which the upper and lower surfaces are parallel, and has two film holding parts 400A, 400B that hold the film F in the center. Each of the film holding parts 400A, 400B has two resin injection holes 400a, 400b formed in a through hole so that each film F is exposed when viewed from the top at a position corresponding to each film F (a position holding each film F). These resin injection holes 400a, 400b are formed corresponding to the positions of the cavities 208A, 208B, respectively. However, the present invention is not limited to this configuration.

[0055] According to this configuration, two sets of resin R can be held (placed) on the resin guard 400 (i.e., on the film F held by the film holding portions 400A, 400B), and the two sets of resin R can be transported together into the sealing mold 202 and held (placed) via the film F within the cavities 208A, 208B at predetermined positions in the sealing mold 202 (in this embodiment, the lower mold 206).

[0056] The resin guard 400 according to this embodiment is provided with a number of suction holes 400c around the resin injection holes 400a, 400b, which generate a suction force to hold the film F. In addition, the resin guard pickup 304 and the resin guard loader 212 are provided with a mechanism (not shown) that communicates with the suction holes 400c and applies a suction force. This mechanism makes it possible to transport the resin guard 400 with two films F (with resin R placed on them) aligned in the left-right direction and held by suction on the underside of the resin guard 400.

[0057] (Resin sealing operation) Next, the operation of resin sealing using the resin sealing apparatus 1 according to this embodiment (i.e., the resin sealing method according to this embodiment) will be described with reference to Fig. 1 and Figs. 5 to 11. Here, an example is taken of a configuration in which one lower die 206 has two sets of cavities 208, two workpieces W (e.g., rectangular workpieces) are arranged on one upper die 204, and resin sealing is performed collectively to obtain two molded products Wp at the same time (however, the present invention is not limited to this configuration). Figs. 5 to 11 are side cross-sectional views in the same direction as Figs. 2 and 3.

[0058] First, a heating step (upper die heating step) is performed in which the upper die 204 is heated to a predetermined temperature (e.g., 100°C to 200°C) by the upper die heating mechanism. In addition, a heating step (lower die heating step) is performed in which the lower die 206 is heated to a predetermined temperature (e.g., 100°C to 200°C) by the lower die heating mechanism.

[0059] Next, the resin guard 400 (not holding the film F or resin R) that has been cleaned on the preparation table 302 is held by the resin guard pickup 304, and is transported onto the film table 308. At this time, two pieces of film F that have been unwound from two film rolls 306A and 306B and cut into strips of a predetermined length are prepared on the film table 308 (see FIG. 1).

[0060] 5, suction force is generated in the suction holes 400c of the resin guard 400 via the resin guard pickup 304, causing the two films F to be adsorbed and held on the lower surface of the resin guard 400. In this state, the resin guard 400 is held by the resin guard pickup 304 and transported onto the transport table 310.

[0061] 6, the conveyor table 310 on which the resin guard 400 is placed is moved to a position directly below the nozzle 312a of the dispenser 312. In this state, the resin R is simultaneously poured from the nozzles 312a of the two dispensers 312 into the inside of the two rows of through holes (resin feeding holes) 400a, 400b in the resin guard 400. In this manner, a process of placing the resin R through the through holes (resin feeding holes) 400a, 400b on the film held on the lower surface of the resin guard 400 is carried out (resin placing process).

[0062] In the above resin placing step, when the resin R is dropped from the two nozzles 312a, the conveying table 310 on which the resin guard 400 is mounted is moved along an arbitrary pattern. This allows the resin R to be supplied in the corresponding pattern into each of the resin injection holes 400a, 400b.

[0063] Next, as shown in FIG. 7, the conveying table 310 is made to reciprocate slightly in at least one of the directions of front and rear, left and right, and up and down to vibrate the resin guard 400 holding the film F on which the resin R is placed (vibration process). According to this, by vibrating the resin guard 400 in a state in which the granular, pulverized, or powdered resin R is placed on the upper surface of the film F held by the resin guard 400, the thickness of the resin R placed on the upper surface of the film F can be made uniform at a stage before being carried into the sealing mold 202. Therefore, it is possible to prevent the occurrence of molding defects and stabilize the quality. In particular, by performing the vibration process before the resin conveying process, it is possible to obtain the effect of making the thickness of the resin R uniform before the conveying while causing the fine powder of the resin R to fly up and be removed in advance. Therefore, it is possible to further prevent (suppress) the flying up of the fine powder of the resin R that may occur during the subsequent conveying. It is also possible to adopt a configuration that does not include the vibration process.

[0064] 8, the resin guard loader 212 is moved downward (lowered) to hold the resin guard 400 on the conveyor table 310. At this time, the resin guard 400 is held by the holding claws of the third holding part 212A, and a suction force is generated in the suction holes 400c of the resin guard 400 via the third holding part 212A, maintaining the state in which the two films F are adsorbed to the lower surface of the resin guard 400. In this way, the resin guard 400 is held by the third holding part 212A of the resin guard loader 212.

[0065] Next, as shown in FIG. 9, the resin guard 400 holding the film F on which the resin R is placed is transported by the resin guard loader 212, and a process is performed in which the film F on which the resin R is placed is contained and held in the cavity 208 (resin transport process).

[0066] Next, as shown in FIG. 10, while the film F on which the resin R is placed is contained and held in the cavity 208, a process is carried out in which the resin R (i.e., the group of resins placed) is pressed by the plunger 214 to expel the air from within the resin R and reduce its volume (resin pressing process).

[0067] In this way, in a series of steps from the resin conveying step to the resin pressing step, the resin R (placed on the film F) in the through holes (resin injection holes) 400a, 400b can be conveyed in a sealed state between the resin guard 400 and the lower surface (specifically, the pressing plate 216) of the resin guard loader 212. This makes it possible to prevent leakage (spillage) of the resin R and the scattering of fine powder during the conveying into the sealing mold 202 and until the resin R is placed in the cavity 208 of the lower mold 206. Furthermore, while the resin guard 400 is held on the lower surface of the resin guard loader 212 and placed on the lower mold 206, the resin R conveyed into the lower mold 206 (cavity 208) can be pressed by the plunger 214. This makes it possible to eliminate or reduce the bulkiness caused by the resin R piling up with gaps between the particles. As a result, it is possible to prevent air from foaming (defoaming) in the gaps in the resin R during molding due to the bulkiness of the resin R, which can cause leakage of the resin R. The above synergistic effects make it possible to prevent molding defects caused by leakage of the resin R, etc., and further improve molding quality. Furthermore, in the unlikely event that an area occurs in the cavity 208 where the resin R has not spread, it is also possible to obtain the effect of filling that area with the resin R.

[0068] As a variation of the above resin pressing process, the process may be performed with the pressing plate 216 heated to a predetermined temperature (a temperature at which the resin R does not completely melt or dissolve (e.g., 60°C)). This allows the particles of resin R on the surface (upper surface) that the pressing plate 216 contacts to be fused together and integrated. Therefore, when the pressing plate 216 is moved (raised) upward and the surface (upper surface) of the resin R is exposed, it is possible to prevent the fine powdery resin R from flying up into the sealing die 202.

[0069] Next, as shown in FIG. 11, the resin guard 400 is transferred (carried out) to the outside of the sealing mold 202 by the resin guard loader 212 (third holding section 212A).

[0070] The subsequent steps are the same as those of the conventional resin sealing method, and the sealing mold 202 is closed, and the two workpieces W are clamped between the upper mold 204 and the lower mold 206. At this time, the cavity pieces 226 in the two sets of cavities 208 rise relatively to each other, and the resin R is heated and pressurized against the two workpieces W. This thermally hardens the resin R, completing the resin sealing (compression molding). Next, the sealing mold 202 is opened, and the two molded products Wp and the used film Fd are separated. Next, the first loader 210 (second holding unit 210B) transports (carries out) the two molded products Wp from the sealing mold 202. In addition, the resin guard loader 212 (third holding unit 212A) transports (carries out) the two used films Fd from the sealing mold 202.

[0071] The above are the main operations of resin sealing performed using the resin sealing apparatus 1. However, the above process order is only an example, and the order of steps can be changed or performed in parallel as long as there is no problem. For example, in this embodiment, an apparatus configuration is adopted that includes multiple (two, as an example) press units 100B, and therefore efficient formation of molded products is possible by performing the above operations in parallel.

[0072] As described above, according to the present invention, the resin can be transported in a sealed state with the resin guard and the resin guard loader. This makes it possible to prevent the resin from leaking (spilling off) and the fine powder from flying up during the process of transporting the resin into the sealing mold and when placing it in the cavity of the lower mold. Furthermore, while the resin guard is held on the lower surface of the resin guard loader and placed on the lower mold, the resin (a group of resins) that has been transported into the cavity of the lower mold can be pressed by the plunger. This makes it possible to eliminate or reduce the bulkiness that occurs when the resin particles pile up with gaps between them. Therefore, it is possible to solve the problem that the air in the gaps in the resin foams (defoams) during molding due to the bulkiness of the resin, making it easy for the resin to leak. In other words, it is possible to prevent deterioration of the molding quality caused by the resin leaking (spilling off) and the like, and to stabilize the molding quality (maintain high quality).

[0073] The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. In particular, the sealing resin has been described using granular, pulverized, or powdered thermosetting resin as an example, but the present invention is not limited thereto, and can be applied to a configuration using a resin in a liquid, plate, or sheet form.

[0074] In addition, an example has been given of a configuration in which two sets of cavities are provided in the upper mold, two workpieces are placed in the lower mold, and resin sealing is performed together to obtain two molded products at the same time, but this is not limited to this, and the present invention can also be applied to a configuration in which one set (or three or more sets) of cavities are provided in the upper mold, one workpiece (or three or more sets) is placed in the lower mold, and resin sealing is performed together to obtain one molded product (or three or more sets). [Explanation of symbols]

[0075] 1 Resin sealing equipment 204 Upper mold 206 Lower mold 208 Cavity 212 Resin Guard Loader 214 Plunger 400 Resin Guard Double work

Claims

1. A resin sealing apparatus that uses a sealing die having an upper die and a lower die having a cavity to seal a workpiece having an electronic component mounted on a substrate with resin to process the workpiece into a molded product, A resin guard that holds the film on which the resin is placed; a resin guard loader for transporting the resin guard; a plunger that presses the resin to expel air from within the resin and reduce the volume of the resin while the film on which the resin is placed is housed and held in the cavity, The resin guard loader has a holding mechanism for holding the resin guard, the holding mechanism being separate from the resin guard loader; The plunger has a pressing plate disposed in a recess of the resin guard loader and configured to be able to pass through a through hole that serves as a holding space for the resin in the resin guard when the resin guard is held on the lower surface of the resin guard loader, and to press the resin. A resin sealing device characterized by the above.

2. The resin is in a granular, pulverized or powdered form when placed on the film.

2. The resin sealing device according to claim 1,

3. The resin guard may further include a vibration mechanism for vibrating the resin guard while holding the film on which the resin is placed.

3. The resin sealing device according to claim 2,

4. A resin sealing method for processing a workpiece having an electronic component mounted on a substrate into a molded product by sealing the workpiece with resin using a sealing mold having an upper mold and a lower mold having a cavity, comprising: a resin placing step of holding a film on the lower surface of a resin guard and placing the resin on the film through a through hole provided in the resin guard; a resin transport process in which the resin guard, which holds the film on which the resin is placed, is transported by a resin guard loader to accommodate and hold the film on which the resin is placed in the cavity; a resin pressing step of pressing the resin with a plunger while the film on which the resin is placed is housed and held in the cavity, thereby discharging air from within the resin and reducing its volume, The resin pressing step includes a step of passing a pressing plate, which is provided so as to be movable up and down on the plunger disposed in the recess of the resin guard loader, through the through hole of the resin guard held by the resin guard loader to press the resin. The resin sealing method is characterized by the above.

5. The resin is in a granular, pulverized or powdered form when placed on the film.

5. The resin sealing method according to claim 4,

6. The method further includes a vibration step of vibrating the resin guard holding the film on which the resin is placed, after the resin placing step and before the resin conveying step.

6. The resin sealing method according to claim 5,

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