Apparatus and method for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or EUV exposure masks - Patents.com

Abstract

The present invention relates to an apparatus 12 for processing pot-shaped hollow bodies 10, in particular transport containers for semiconductor wafers or EUV exposure masks, comprising a wall 14 enclosing an internal space 16, a gripping and moving device 17 arranged in the internal space 16 for moving the hollow bodies 10 within the internal space 16, and a wall opening 26 formed in the wall 14 that can be closed by a closure 28, through which the internal space 16 can be accessed, the apparatus 12 comprising at least one lid handling unit 54, 102 that can be removably connected to a lid 44, which can be connected to the lid handling unit 54, 102 and detached from the hollow bodies 10. Furthermore, the present invention relates to a corresponding method (Fig. 1A).

Description

[Technical field]

[0001] The present invention relates to an apparatus for processing pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or for EUV exposure masks. Furthermore, the invention relates to a corresponding method. [Background technology]

[0002] Today, the manufacture of highly integrated electronic circuits and other sensitive semiconductor elements is carried out in factories in which so-called semiconductor wafers pass through numerous processing steps, the majority of which are carried out in clean spaces that are kept free of contaminants, and in particular free of particles, at great expense, particularly because particles coming into contact with the semiconductor material of the semiconductor wafers can affect the material properties of the semiconductor wafers in such a way that the entire production batch becomes defective, unusable and must be discarded.

[0003] As the integration density of semiconductor circuits increases, it becomes increasingly important to keep them clean, and as the size of the clean space increases, the burden of keeping them clean grows exponentially, so that semiconductor wafers are not transported in an "open" form from one processing station to the next. Instead, special transport containers (so-called FOUPs, Front Open Unified Pods) are used. These are understood to be loaf-pan shaped transport containers in which a number of semiconductor wafers can be placed. FOUPs are usually closed by a removable lid. Without a lid, the FOUP has the basic shape of a pan with a square base. If the FOUP is closed by its lid, the semiconductor wafers contained therein can be transported from one clean space to another in a protected manner from the outside world. When the FOUP reaches a processing station, it is opened and the semiconductor wafers are removed and processed accordingly. After the processing has been carried out, the semiconductor wafers are transported back to the FOUP and handed over to the next processing station.

[0004] Because of the large production losses that can occur if the semiconductor wafers are contaminated, the FOUP must be cleaned from time to time. The FOUP is contaminated by dust from the semiconductor wafers, especially when the wafers are transferred into and removed from the FOUP.

[0005] Significantly, the same is true for transport containers for EUV (Extreme Ultra-Violet Radiation) exposure masks, which are used to manufacture very small integrated circuits. Similar situations arise when EUV exposure masks, like semiconductors, must be transported. In the following, wherever FOUPs are mentioned, the statements about them also apply to transport containers for EUV exposure masks.

[0006] Apparatuses for cleaning FOUPs are known, for example, from US Pat. No. 5,399,663 to US Pat. No. 5,399,651. In particular, it can be seen from US Pat. No. 5,399,663 that such an apparatus comprises a number of process units in which different process steps for cleaning the FOUP are carried out. The FOUP is transported from one process unit to the next by means of a gripping and transferring device, which can be configured, for example, as a gripping robot.

[0007] As mentioned at the beginning, the FOUP is equipped with a lid, by means of which the internal space of the hollow body can be closed. Cleaning of the FOUP only on its outer surface certainly contributes to the reduction of defective semiconductor wafers, but this contribution is clearly smaller compared to cleaning of the inner surface. However, to be able to clean the inner surface, the lid has to be removed, as a result of which the gripping and moving equipment used has to execute relatively complex movement flows. Since during the cleaning process the FOUP is usually in a position that does not change during the cleaning process, the action radius of the gripping and moving equipment has to be relatively long to be able to grip and move the FOUP. Furthermore, the gripping and moving equipment cannot always be operated at full speed.

[0008] The equipment in which FOUPs are cleaned typically includes walls having wall openings through which the interior space defined by the walls can be accessed. Introduction into and removal from the interior space are similarly time-consuming processes.

[0009] Due to the above circumstances, the gripping and moving equipment used is expensive, and furthermore, due to the complex movement flow, the time of the cleaning process is relatively long. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] US Patent Publication No. 5,238,703 [Patent Document 2] International Patent Publication No. 2005 / 001888 [Patent Document 3] European Patent Registration No. 1899084 Summary of the Invention [Problem to be solved by the invention]

[0011] It is an object of one embodiment of the invention to provide an apparatus for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers, which makes it possible to shorten the time of the cleaning process by simple and inexpensive measures.

[0012] Furthermore, one aspect of the invention provides a method for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers, by means of which the device can be operated. [Means for solving the problem]

[0013] This problem is solved by the features set forth in claims 1 and 10. Advantageous embodiments are the subject of the dependent claims.

[0014] Since the invention is not limited to FOUPs or transport containers for EUV exposure masks, in the following the invention will be described on the basis of hollow bodies.

[0015] One embodiment of the invention relates to an apparatus for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or EUV exposure masks, which apparatus comprises: The walls surrounding the interior space; A gripping and moving device disposed in the internal space for moving the hollow body within the internal space; a wall opening formed in the wall and capable of being closed by a closure; Equipped with Through this opening, the interior space can be accessed and the closure The device is supported by a fixing unit in a movable manner within the device. It has a receiving unit by means of which the hollow body can be removably connected to the closure body.

[0016] This hollow body can be connected to a closure body, moved and removed again from the closure body, which at the same time serves to close the wall opening.

[0017] The hollow body is connected to the closure body, for which two steps are performed: firstly, the hollow body is placed on the closure body, which can be done manually, and secondly, the hollow body is locked, which can be done automatically.

[0018] The closure body is then moved to a position where the opening is closed, the hollow body is gripped by the gripping and moving device, and then the hollow body is coupled to the closure body so that it can be moved within the interior space. The closure body is associated with the motion flow around which the hollow body will move during processing, and the hollow body is transported together with the closure body into the interior space and removed therefrom.

[0019] In another embodiment, the fastening unit is configured as a hinge, by means of which the closure body is fixed in a rotatable manner to the wall. In principle, the fastening unit can define any arbitrary movement of the closure body, for example a parallelogram movement. However, the use of a fastening unit configured as a hinge is associated with a small technical burden. In particular, the hinge can work in cooperation with the drive device in a simple manner. Furthermore, the hinge is characterized by a high reliability.

[0020] In one improved embodiment, the closure may be movable between a first position and a second position, the closure closing the wall opening in the first position and in the second position.

[0021] The closure can be configured in an L-shape and can have two legs that meet at the center of rotation. In the first position, the hollow body is connected to the receiving part on the second leg of the closure, whereby the hollow body is outside the interior space. The wall opening is closed by means of the first leg. In the second position, the hollow body is arranged in the interior space, whereby the wall opening is closed by the second leg. Since both the first and the second positions can be selected in such a way that the closure can be easily reached, the movement flow is simplified and shortened. Complicated handovers through the wall openings are eliminated. The transition of the closure from the first position to the second position also closes the interior space. No additional steps are required for this.

[0022] In one improved embodiment, the hollow body is A first gripping portion; A second gripping portion; and Equipped with the receiving portion comprises a locking means by means of which the closure body can be operated in cooperation with the hollow body by means of the first gripping portion; The gripping and moving device comprises gripping means by means of which the gripping and moving device can operate in cooperation with the hollow body using a second gripping part.

[0023] In this embodiment, the hollow body comprises a first gripping part and a second gripping part. It is therefore possible to at least temporarily fix the hollow body to the closure body or to the gripping and moving device. For example, the locking means can only be released when the gripping means completely grips the hollow body. On the one hand, for example, the two gripping parts can be arranged in such a way that the two gripping parts are easily accessible even when the closure body is connected to the first gripping part. On the other hand, it can be ensured that the hollow body is at least connected reliably to the gripping and moving device or to the closure body, so that uncontrolled movements of the hollow body are prevented. Thereby, it is not necessary to lower the hollow body in the interior space, which may be necessary to be able to switch the gripping and moving device from the first gripping part to the second gripping part, thereby saving time.

[0024] In one improved embodiment, the device can comprise a further gripping and moving device for transferring the hollow body to the closure body and for taking it away from the closure body. As mentioned above, the hollow body can be manually placed on the closure body in the first position and automatically locked and connected to it. The same applies for the release and removal. The transfer to and removal from the closure body can be automated using this further gripping and moving device, which is typically arranged outside the interior space and can be configured, for example, as an OHT system (Overhead Transport System). The OHT system can also take care of further transporting the hollow body with the semiconductor / semiconductor wafers within the clean space or between several clean spaces. Therefore, based on this embodiment, the device can also be integrated into an OHT system.

[0025] In another embodiment, the further gripping and moving device comprises a further gripping means by which it can work with the hollow body using a second gripping part. As mentioned above, the further gripping and moving device is typically arranged outside the interior space, while the further gripping and moving device is usually arranged inside the interior space. In this case, the two gripping and moving devices are separated from the wall of the device and the closure takes over the delivery of the hollow body into the interior space, so that the two gripping and moving devices never come into contact with the hollow body at the same time. In this respect, in the proposed device it is possible to use the second gripping part of the hollow body for two different gripping and moving devices. As a result, the construction of the hollow body can be simplified, since there is no need to provide a third gripping part. Furthermore, the gripping means of the further gripping and moving device and the further gripping means of the further gripping and moving device can be realized with the same structure, whereby cost advantages can be achieved.

[0026] In one improved embodiment, the hollow body is a bottom wall and one or more side walls; an opening facing the bottom wall; a lid capable of closing the opening; The device is characterized in that it comprises at least one lid operating unit capable of being removably coupled to the lid.

[0027] As mentioned above, cleaning only the outer surface of a hollow body, in particular a FOUP, contributes significantly less to the reduction of defective semiconductor wafers than cleaning the inner surface. To clean the inner surface, the hollow body must be opened, for which the lid must be removed from the hollow body, which can be done automatically by means of the lid handling unit. Based on this embodiment, the device therefore also makes it possible to clean the inner surface with the above-mentioned advantages.

[0028] In another embodiment, The device comprises at least one processing unit capable of processing hollow bodies and a lid operating unit, the treatment unit has a process space in which the hollow body can be treated, The process space is accessible through a process space opening; This lid operating unit is supported by another fixing device in such a manner that it can move within the apparatus between an open position in which the lid operating unit opens the process opening and a closed position in which the lid operating unit closes the process opening.

[0029] As mentioned above, the lid is removably connected to the lid handling unit. Like the closure, the lid handling unit is integrated into the handling of the hollow body, in this case the handling of the lid of the hollow body. The lid is transported into the treatment unit by moving the lid handling unit from the open position to the closed position and vice versa. Again, complex transport into and removal from the process space is eliminated.

[0030] Another embodiment is characterized in that the device comprises a first processing unit configured as a cleaning device for cleaning the hollow body and / or the lid. As mentioned above, cleaning of the hollow body plays a crucial role in reducing defective semiconductor wafers. In this embodiment, the significance of cleaning is taken into account. It is worth mentioning here that the lid can be cleaned separately from the rest of the hollow body. In particular, the inner surface of the lid can also be cleaned. Usually, a cleaning fluid is used for this purpose.

[0031] In another embodiment, the device can comprise a second processing unit configured as a vacuum device which applies a negative pressure inside the hollow body and / or at the lid. The application of the negative pressure serves to remove any residual cleaning fluid remaining on the surfaces of the hollow body and the lid as a result of cleaning the hollow body with the cleaning device. Due to capillary attraction, moisture also diffuses into the microscopic pores on the surfaces of the hollow body and the lid. This moisture can likewise be removed by the negative pressure, so that the microscopic surfaces can also be dried.

[0032] It is therefore conceivable to transfer the hollow bodies first to a cleaning device and then to a vacuum device.

[0033] One embodiment of the invention relates to a method for treating pot-shaped hollow bodies, in particular transport containers for semiconductor wafers or EUV exposure masks, with an apparatus according to one of the above-mentioned embodiments, which method comprises the steps of: moving the closure to a first position in which the containment portion is disposed outside the interior space; delivering the hollow body to the receiving portion and actuating the receiving portion to couple the hollow body to the closure; moving the closure to a second position in which the closure closes the wall opening; has.

[0034] The technical effects and advantages achievable by the proposed method are the same as those discussed with respect to the present device for processing pot-shaped hollow bodies, in particular carrier containers for semiconductor wafers. To summarize, it should be noted that this allows the gripping and transferring device to execute simpler movement sequences and therefore be constructed more simply than in the methods known from the prior art. Furthermore, the movement sequences can be executed faster, which reduces the duration of the processing process.

[0035] In one alternative configuration, the hollow body comprises a first gripping portion and a second gripping portion, and the method further comprises: transferring the hollow body to the closure using another gripping and moving device with another gripping means, the other gripping and moving device being coupled to the hollow body by means of the other gripping means using a second gripping portion; activating a locking means of the receiving portion and connecting the hollow body to the closure using the first gripping portion; Decoupling the separate gripping and moving device from the second gripping portion; moving the closure to a closed position in which the closure closes the wall opening; connecting the hollow body to a gripping and moving device using the second gripping portion; - separating the hollow body from the closure by stopping the containing portion; has.

[0036] The delivery of the hollow bodies to the closure and the removal of the hollow bodies from the closure can be automated.

[0037] In one further developed configuration, the hollow body comprises: a bottom wall and one or more side walls; an opening facing the bottom wall; a lid capable of closing the opening; Equipped with The method further comprising: transferring the hollow body to a lid operating unit using a gripping and moving device; coupling the lid to a lid operating unit; Removing the lid from the hollow body using a lid handling unit and / or a gripping and moving device. has.

[0038] In this configuration of the method, the hollow body can be opened by removing the lid using the lid handling unit, so that the inner surface of the hollow body can be treated. The lid can also be treated.

[0039] In one improved configuration of the method, the device comprises at least one processing unit by means of which hollow bodies can be processed, the processing unit working in cooperation with a lid handling unit, the treatment unit has a process space in which the hollow body can be treated, This process space is accessible through a process opening, The method further comprising: moving the lid operating unit to an open position in which the lid operating unit opens the process opening; coupling the lid to the lid handling unit and removing the lid from the hollow body using the lid handling unit and / or the gripping and moving device; moving the lid operating unit to a closed position in which the lid operating unit closes the process opening; has.

[0040] In this configuration of the method, the lid handling unit is used not only to remove the lid from the hollow body, but also to convey the lid into the process space, again eliminating the complicated conveying of the lid into and removal from the process space.

[0041] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. [Brief description of the drawings]

[0042] [Figure 1A] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1B] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1C] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1D] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1E] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1F] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1G]1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1H] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1I] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1J] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1K] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1L] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1M] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1N] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1O] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1P]1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1Q] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1R] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1S] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Figure 1T] 1A-1C are cross-sectional views illustrating the steps of a method for processing a pot-shaped hollow body proposed herein, in particular a carrier container for semiconductor wafers or for EUV exposure masks, using an embodiment of the proposed apparatus. [Diagram 2] Main cross-section of a processing unit realized as a cleaning device [Diagram 3] Main cross-section of the processing unit realized as a vacuum device DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] In figures 1A-1T various steps of the method for processing a pot-shaped hollow body 10 proposed herein, in particular a carrier container for semiconductor wafers, are illustrated in major cross-sectional views. Figure 1A furthermore illustrates, also in major part, an apparatus according to the invention, with which the method proposed herein can be carried out. The hollow body 10 is also called a FOUP.

[0044] The device 12 according to the invention comprises a wall 14 which encloses an internal space 16. In this internal space 16, a gripping and moving device 17 is arranged, by means of which the hollow body 10 to be treated can be moved within the internal space 16. Furthermore, in the internal space 16, there are two processing units 18, namely a first processing unit 181 configured as a cleaning device 20 and shown in more detail in FIG. 2 and a second processing unit 182 configured as a vacuum device 22 and shown in more detail in FIG. 3.

[0045] Furthermore, the device 12 comprises another gripping and moving device 24, by means of which the hollow body 10 can be moved outside the interior space. This other gripping and moving device 24 is configured in the form of an overhead transport system (OHT) for transporting the hollow body 10 close to the ceiling.

[0046] The wall 14 is formed with a wall opening 26 that can be closed by a closure body 28, through which the interior space 16 is accessible. The closure body 28 is journalled in a movable manner in the device 12 by means of a fastening unit 30, which is configured as a hinge 32, by means of which the closure body 28 is rotatably fixed to the wall 14 in the form of a flap. The closure body 28 is movable between a first position and a second position.

[0047] Furthermore, the closure body 28 comprises a receiving part 34 by means of which the hollow body 10 can be removably fixed to the closure body 28. In the illustrated embodiment, suitably designed locking means 36 are provided on the receiving part 34 for this purpose.

[0048] In the embodiment shown, the closure body 28 is configured in an L-shape and has a first leg 33 and a second leg 35 which are connected to the hinge 32 at an angle of 90° to each other. The receiving part 34 is arranged on the first leg 33 which is outside the interior space 16 in the first position. The second leg 35 closes the opening 26 when the closure body 28 is in the first position, and in so doing the second leg 35 abuts against a gasket 37 surrounding the opening 26.

[0049] To move the closure 28 to the second position, the closure is rotated 90° (see FIG. 1B). In the second position, the first leg 33 abuts against the packing 37, so that the opening 26 is closed by the first leg 33. Thus, the opening 26 is only opened when the closure 26 is moved between the first and second positions.

[0050] The hollow body 10 is configured in the shape of a substantially rectangular parallelepiped and comprises a bottom wall 38 and four side walls 40, an opening 42 opposite the bottom wall 38, and a lid 44 by means of which the opening 42 can be closed. The hollow body 10 further comprises a first gripping portion 46 and a second gripping portion 48, each arranged on one of the side walls 40. The first gripping portion 46 is configured to cooperate with the locking means 36 of the receiving portion 34 of the closure body 28, whereby the hollow body 10 can be removably connected to the closure body 28. The second gripping portion 48 is configured in a T-shaped cross section and is therefore also called a "mushroom".

[0051] The gripping and moving device 17 comprises a gripping means 50, and the other gripping and moving device 24 comprises another gripping means 52, which are of approximately the same configuration and can operate in cooperation with a second gripping part 48 of the hollow body 10, so as to grip the hollow body 10.

[0052] A method in which the device 12 can be operated will now be described with reference to Figures 1A-1T, in which only those components of the device 12 that are directly involved in the method are shown in Figures 1B-1T, and which are partly simplified for reasons of clarity.

[0053] The hollow body 10 is gripped at the second gripping part 48 by the further gripping means 52 of the further gripping and moving device 24 (not explicitly shown) and transported towards the device 12. After the hollow body 10 has reached the correct position, it is removed from the further gripping and moving device 24 and placed on the closure body 28 in the first position, in particular on the receiving part 34, so that the hollow body 10 can be fixed to the closure body 28 by means of the locking means 36 (FIG. 1A). The further gripping means 52 is released and the further gripping and moving device 24 is detached from the hollow body 10 (not shown). The closure body 28 is now moved to the second position, for which purpose it is rotated by about 90° by a drive unit (not shown) (FIG. 1B). In the process, the wall opening 26 is closed and the hollow body 10 is brought into the interior space 16. The hollow body 10 is then gripped by the gripping means 50 of the gripping and moving device 17 at the second gripping portion 48 (FIG. 1C) and then the locking means 36 of the closure body 28 is released. The hollow body 10 is now detached from the closure body 28 by means of the gripping and moving device 17 (FIG. 1D) and moved in the interior space 16. From FIG. 1E it can be seen that the hollow body 10 is now moved towards a lid operating unit 54, which is movably journalled in the cleaning device 20 by means of a further fixing device 57 (see FIG. 2). The functional form of the lid operating unit 54 will be taken up in more detail later. The lid operating unit 54 can be removably connected to the lid 44 of the hollow body 10. For that purpose, the hollow body 10 is placed on the lid handling unit 54 with the lid 44 and the connecting means 55 (see FIG. 2) are activated, by means of which the lid 44 can be connected to the lid handling unit 54 in a detachable manner. The hollow body 10 is then detached from the lid handling unit 54 by means of the gripping and moving device 17, with the lid 44 remaining on the lid handling unit 54 (see FIG. 1F). The opened hollow body 10 is then conveyed by the gripping and moving device 17 into the cleaning device 20 (FIG. 1G), where the hollow body 10 is placed on a base wall 62 of the cleaning device 20, on which the hollow body 10 is fixed by means of the fixing means 63 (see FIG. 2). This base wall 62 has a through opening 58 adapted to the size of the hollow body 10.The hollow body 10 is fixed to the base wall 62 in such a way that the through opening 58 is approximately flush with the side wall 40 of the hollow body 10, as is clear from Fig. 1H. The gripping and moving device 17 is then detached from the hollow body 10 and the inner surface of the hollow body 10 is cleaned by spraying with a cleaning fluid, as represented by the arrow P in Fig. 1H. After the cleaning is finished, the hollow body 10 is again gripped by the gripping and moving device 17 and detached from the base wall 62 (Fig. 1I). Now the hollow body 10 is again moved towards the lid handling unit 54 of the cleaning device 20 (Fig. 1J) and the lid 44 is again connected to the hollow body 10 (Fig. 1K).

[0054] The hollow body 10 is then transferred by means of the gripping and moving device 17 towards the vacuuming device 22, which also has a lid operating unit 102 of substantially the same construction as the lid operating unit 54 of the cleaning device 20. The lid 44 is again connected to the lid operating unit 102 of the vacuuming device 22 and removed from the hollow body 10 (FIG. 1L). The hollow body 10 is then moved towards the base wall 62 of the vacuuming device 22 (FIG. 1M) and placed there (FIG. 1N). Next, a negative pressure is built up in the interior space 16 of the hollow body 10 by means of a vacuum pump 64 (FIG. 3) connected to a vacuum port 66 of the vacuuming device 22, which is represented by the symbol Δp in FIG. 1N. During this time, the gripping and moving device 17 is detached from the hollow body 10.

[0055] After the evacuation process is finished, the gripping and moving device 17 is again connected to the hollow body 10 and the hollow body 10 is transported towards the lid handling unit 102 of the evacuation device 22 (Figs. 1O and 1P). The lid 44 is connected to the hollow body 10 and detached from the lid handling unit 102 (Fig. 1Q). The hollow body 10 is moved back to the closure body 28 in the second position and there it is placed in the receiving part 34, so that the hollow body 10 is firmly connected to the closure body 28 by the activation of the locking means 36 (Fig. 1R). The gripping and moving device 17 is now detached from the hollow body 10 (Fig. 1S) and the closure body 28 is moved to the first position (Fig. 1T) where the hollow body 10 is gripped by another gripping and moving device 24. The locking means 36 is released and the hollow body 10 is detached from the closure body 28. Now, another hollow body 10 is placed in the receiving section 34 by another gripping and moving device 24 and processed in the manner described above.

[0056] In Fig. 2, the cleaning device 20 is shown in detail, with which the cleaning process illustrated in Fig. 1N can be carried out. The cleaning device 20 comprises a housing 28, which is formed with a housing opening 70, which can be closed by means of a cover 72 which can be removed from the housing 68. In addition to this, the already mentioned base wall 62 is arranged in the housing 68. The cleaning device 20 forms a process space 22, which is bounded by the housing 68 itself and the cover 72. The base wall 62 is formed with the already mentioned through-opening 58, the already mentioned fastening means 63 being arranged radially outside the through-opening 58. In the illustrated embodiment, two through-openings 78 are provided in the base wall 62 radially outside the fastening means 63.

[0057] The cleaning device 20 comprises a first cleaning head 80 which projects beyond the through opening 58. The cleaning device 20 further comprises a second cleaning head 82 which is configured in a substantially U-shape. The second cleaning head 82 is rotatable about a second axis of rotation D2, the drive device used for this purpose being not shown.

[0058] The housing 68 is further formed with a process space opening 84, through which the process space 73 can be accessed. The process space opening 84 can be connected to the already mentioned lid operating unit 54, which is fixed to the wall part 44 in a rotatable manner about a first rotation axis D1 by means of a further fixing device 57. The lid operating unit 54 can be moved by means of a drive unit (not shown) between an open position in which the lid operating unit 54 opens the process opening 84 and a closed position in which the lid operating unit 54 closes the process opening 84. In FIG. 2, the lid operating unit 54 is in the closed position.

[0059] The cleaning device 20 further comprises a first cleaning head 86 which is arranged adjacent to the lid operating unit 54 when the lid operating unit is in the closed position.

[0060] The cleaning equipment 20 further comprises a fluid guiding unit 88, by means of which the first cleaning fluid can be guided in a manner not shown in detail to the first cleaning head 80 and to the further first cleaning head 86, and the second cleaning fluid can be guided to the second cleaning head 82. The fluid guiding unit 88 further comprises a first discharge channel 90, by means of which the first cleaning fluid discharged from the first cleaning head 80 and to the further first cleaning head 86 can be discharged again from the process space 73.

[0061] In addition, the fluid directing unit 88 has a second discharge channel 92 in fluid communication with the two through holes 78. Thus, the first cleaning fluid and the second cleaning fluid can be directed separately to the cleaning device 20.

[0062] The lid handling unit 54 has already been mentioned with reference to Figures 1E and 1F. In the following, the functional form of the lid handling unit 54 is explained in more detail with reference to Figure 2. The hollow body 10 is placed on the lid handling unit 54 by means of the lid 44 when the lid handling unit is in the open position. This lid handling unit 54 comprises a coupling means 55 which is actuated here, so that the lid 44 is fixed to the lid handling unit 54. The hollow body 10 is detached from the lid 44 and placed on the base wall 62 by means of the gripping and moving device 17, with the cover 72 being arranged such that it opens the housing opening 72 and thus allows access to the process space 73. This gripping and moving device 17 is then detached from the hollow body 10.

[0063] The lid operating unit 54 is rotated around the first rotation axis D1 to close the process space opening 84. The cover 72 is also arranged to close the process space 73, as shown in Fig. 2. Here, a cleaning fluid is sprayed onto the inner surface of the hollow body by means of the first cleaning head 80, onto the inner surface of the lid by means of the other first cleaning head 82, and onto the outer surface of the hollow body by means of the second cleaning head 82. To this end, the first cleaning head 80, the other first cleaning head 86 and the second cleaning head 82 are each equipped with a cleaning nozzle 96.

[0064] Next, to remove the cleaning fluid, drying gas is sprayed onto the inner surface of the hollow body, the inner surface of the lid and the outer surface of the hollow body through drying nozzles 98 of the first cleaning head 80, the further first cleaning head 86 and the second cleaning head 82. Furthermore, the first cleaning head 80, the further first cleaning head 86 and the second cleaning head 82 are equipped with infrared diodes 100, which can be used to heat and evaporate the remaining cleaning fluid present on the inner surface of the hollow body, the inner surface of the lid and the outer surface of the hollow body.

[0065] Then the cover 72 is removed, the hollow body 10 is coupled with the gripping and moving device 17 and the lid operating unit 54 is moved to the open position. The hollow body 10 is lifted from the base wall 62 with the gripping and moving device 17 and moved onto the lid operating unit 54. The coupling means 55 is stopped. Now the lid 44 is again coupled with the hollow body 10 and is carried by the gripping and moving device 17 into the evacuation device 22, which is shown in detail in FIG.

[0066] The vacuum instrument 22 is of similar construction to the cleaning instrument 20, but does not include a fluid directing unit and a cleaning head. Rather, the vacuum instrument 22 includes the previously mentioned vacuum port 66 to which the previously mentioned vacuum pump 64 can be connected, thereby applying a negative pressure within the process space 73.

[0067] This evacuation equipment 22 also comprises a lid operating unit 102, which is realized in a substantially identical configuration to the lid operating unit 54. The handover of the hollow body 10 to this evacuation equipment 22 is performed in a substantially identical manner to that described for the cleaning equipment 20. In Fig. 3, the cover 72 is connected to the housing as shown and the lid operating unit 54 is in the closed position, so that the process space 73 is closed. The vacuum pump 64 is now activated and a negative pressure is applied in the process space 73. Residuals of cleaning fluid present on the inner surface of the hollow body, the inner surface of the lid and the outer surface of the hollow body are removed.

[0068] After the evacuation process is finished, the cover 72 is removed, so that access to the process space 73 is again possible. The gripping and moving device 17 is coupled to the hollow body 10 and the lid handling unit 54 is moved to an open position, in which the lid 44 can be coupled to the hollow body 10 in the manner described above. The hollow body 10 has now completed the cleaning and can be transported further, as illustrated in Figures 1R-1T. The present application relates to the invention described in the claims, but may also include the following configurations as other aspects. 1. An apparatus (12) for processing pot-shaped hollow bodies (10), in particular transport containers for semiconductor wafers or EUV exposure masks, comprising: A wall surface (14) surrounding an internal space (16); a gripping / moving device (17) disposed within the internal space (16) for moving the hollow body (10) within the internal space (16); a wall opening (26) formed in the wall (14) and closable by a closure (28), the wall opening providing access to the interior space (16) through said opening; Equipped with This closure (28) The device (12) is movably supported by a fixed unit (30), The device comprises a receiving portion (34) by means of which the hollow body (10) can be removably connected to the closure body (28). 2. In the device (12) according to claim 1, The device, wherein the fixing unit (30) is configured as a hinge (32) by means of which the closure body (28) is fixed to the wall surface (14) in a rotatable manner. 3. In the device (12) according to 1 or 2 above, The device, wherein the closure (28) is movable between a first position and a second position, the closure (28) closing the wall opening (26) in the first position and in the second position. 4. In the device (12) according to any one of 1 to 3 above, The hollow body (10) A first gripping portion (46); A second gripping portion (48); and Equipped with said receiving unit (34) comprises a locking means (36) by means of which the closure body (28) can be operated in cooperation with the hollow body (10) by means of the first gripping portion (46); The apparatus, wherein the gripping and moving device (17) comprises a gripping means (50) by means of which the gripping and moving device (17) can operate in cooperation with the hollow body (10) using a second gripping part (48). 5. In the device (12) according to any one of 1 to 4 above, The apparatus (12) comprises a separate gripping and moving device (24) for feeding the hollow body (10) to the closure body (28) and for taking the hollow body (10) from the closure body (28). 6. In the device (12) according to 5 above, The apparatus, wherein the further gripping and moving device (24) comprises a further gripping means (52) by means of which the further gripping and moving device (24) can operate in cooperation with the hollow body (10) using a second gripping portion (48). 7. In the device (12) according to any one of 1 to 6 above, The hollow body (10) a bottom wall (38) and one or more side walls (40); an opening (42) facing the bottom wall (38); a lid (44) capable of closing the opening (42); Equipped with The apparatus (12) comprises at least one lid operating unit (54, 102) removably connectable to the lid (44). 8. In the device (12) according to claim 7, The apparatus (10) comprises at least one processing unit (18, 181, 182) capable of processing a hollow body (10) and a lid operation unit (54, 102); This treatment unit (18, 181, 182) comprises a process space (73) in which the hollow body (10) can be treated, The process space (73) is accessible through a process space opening (84); This lid operating unit (54, 102) is supported by another fixed device (57) in a manner that allows it to move within the apparatus (12) between an open position in which the lid operating unit (54, 102) opens the process space opening (84) and a closed position in which the lid operating unit (54, 102) closes the process space opening (84). 9. In the device (12) according to claim 8, The apparatus (12) comprises a first processing unit (18, 181, 182) configured as a cleaning device (20) for cleaning the hollow body (10) and / or the lid (44). 10. In the device (12) according to the above 8 or 9, The apparatus (12) comprises a second processing unit (18, 181, 182) configured as a vacuum device (22) for applying a negative pressure inside the hollow body (10) and / or at the lid (44). 11. A method for treating a pot-shaped hollow body (10), in particular a transport container (30) for semiconductor wafers or EUV exposure masks, using the device according to any one of 1 to 10 above, comprising the steps of: moving the closure (28) to a first position in which the closure (28) opens the wall opening (26); providing the hollow body (10) to the receiving portion (34) and actuating the receiving unit (34) to couple the hollow body (10) with the closure body (28); moving the closure body (28) to a closed position in which the closure body (28) closes the wall opening (26); The method comprising the steps of: 12. In the method according to claim 11, The hollow body (10) has a first gripping portion (46) and a second gripping portion (48); feeding the hollow body (10) to the closure body (28) using another gripping and moving device (24) equipped with another gripping means (52) and connecting the other gripping and moving device (24) to the hollow body (10) by means of the other gripping means using the second gripping portion (48); activating the locking means (36) of the receiving portion (34) to couple the hollow body (10) with the closure body (28) using the first gripping portion (46); Decoupling the separate gripping and moving device (24) from the second gripping portion (48); moving the closure body (28) to a closed position in which the closure body (28) closes the wall opening (26); connecting the hollow body (10) to a gripping and moving device (17) using a second gripping portion (48); Detaching the hollow body (10) from the closure (28) by deactivating the containing portion (34); The method comprising the steps of: 13. In the method according to claim 12, The hollow body (10) a bottom wall (38) and one or more side walls (40); an opening (42) facing the bottom wall (38); a lid (44) capable of closing the opening (42); wherein the method comprises: feeding the hollow body (10) to a lid handling unit (54, 102) using a gripping and moving device (17); coupling the lid (44) to a lid operating unit (54, 102); Separating the lid (44) from the hollow body (10) using the lid handling unit (54, 102) and / or the gripping and moving device (17); The method comprising the steps of: 14. In the method according to claim 13, The device (12) comprises at least one processing unit (18, 181, 182) capable of processing the hollow body (10), the processing unit (18, 181, 182) working in cooperation with a lid operating unit (54, 102), the treatment unit (18, 181, 182) comprises a process space (73) in which the hollow body (10) can be treated, The process space (73) is accessible through a process space opening (84); The method further comprising: moving the lid operating unit (54, 102) to an open position in which the lid operating unit (54, 102) opens the process space opening (84); coupling the lid (44) to a lid operating unit (54, 102); Separating the lid (44) from the hollow body (10) using the lid handling unit (54, 102) and / or the gripping and moving device (17); and moving the lid handling unit (54, 102) to a closed position in which the lid handling unit (54, 102) closes the process space opening (84). [Explanation of symbols]

[0069] 10 Hollow body 12 This device 14 Wall 16 Interior Space 17 Gripping and moving equipment 18 Processing Unit 181 First Processing Unit 182 Second Processing Unit 20 Cleaning Equipment 22 Vacuum equipment 24 Other gripping and moving devices 26 Wall Opening 28 Closed body 30 Fixed Unit 32 Hinge 34 Containment Unit 36 Locking means 38 Bottom Wall 40 side wall 42 Opening 44 Lid 46 First gripping part 48 Second gripping part 50 Gripping means 52 Alternative gripping means 54 Lid operation unit 55 Connection means 57 Another fixed device 58 Through opening 62 Foundation Wall 63 Fixing means 64 Vacuum Pump 66 Vacuum Port 68 Case 70 Housing opening 72 Cover 73 Process Space 78 Through hole 80 First Cleaning Head 82 Second Cleaning Head 84 Process space opening 86 Alternate First Cleaning Head 88 Fluid guide unit 90 First discharge flow path 92 Second discharge flow path 96 Cleaning nozzle 98 Drying nozzle 100 Infrared Diode 102 Lid operation unit D1 First rotation axis D2 Second rotation axis P Arrow

Claims

1. An apparatus (12) for treating a pot-shaped hollow body (10), comprising: A wall surface (14) surrounding an internal space (16); a gripping and moving device (17) disposed within the internal space (16) for moving the hollow body (10) within the internal space (16); a wall opening (26) formed in the wall (14) and closable by a closure (28), through which the interior space (16) is accessible; Equipped with This closure (28) The device (12) is movably supported by a fixed unit (30), The device comprises a receiving part (34) by means of which a hollow body (10) can be removably connected to a closing body (28), The hollow body (10) A first gripping portion (46); A second gripping portion (48); and Equipped with said receiving portion (34) is provided with a locking means (36) by means of which the closure body (28) can be operated in cooperation with the hollow body (10) by means of the first gripping portion (46); 13. The device according to claim 12, wherein the gripping and moving device (17) comprises a gripping means (50) by means of which the gripping and moving device (17) can operate in cooperation with the hollow body (10) using a second gripping part (48).

2. The apparatus described in Claim 1, characterized in that the pot-shaped hollow body (10) is a transport container for semiconductor wafers or EUV exposure masks.

3. 3. The device (12) according to claim 1 or 2, The device is characterized in that the fastening unit (30) is configured as a hinge (32) by means of which the closure body (28) is rotatably fastened to the wall surface (14).

4. The device (12) according to any one of claims 1 to 3, The device, wherein the closure (28) is movable between a first position and a second position, the closure (28) closing the wall opening (26) in the first position and in the second position.

5. The device (12) according to any one of claims 1 to 4, The device (12) is characterized in that it comprises a further gripping and moving device (24) for feeding the hollow body (10) to the closure body (28) and for taking the hollow body (10) from the closure body (28).

6. 6. The device (12) according to claim 5, The device is characterized in that the further gripping and moving device (24) comprises a further gripping means (52) by means of which the further gripping and moving device (24) can operate in cooperation with the hollow body (10) using a second gripping part (48).

7. The device (12) according to any one of claims 1 to 6, The hollow body (10) a bottom wall (38) and one or more side walls (40); an opening (42) facing the bottom wall (38); a lid (44) capable of closing the opening (42); Equipped with The apparatus (12) is characterized in that it comprises at least one lid operating unit (54, 102) removably connectable to the lid (44).

8. 8. The device (12) according to claim 7, The apparatus (10) comprises at least one processing unit (18, 181, 182) capable of processing the hollow body (10) and a lid operation unit (54, 102), This treatment unit (18, 181, 182) comprises a process space (73) in which the hollow body (10) can be treated, This process space (73) is accessible through a process space opening (84); The apparatus is characterized in that the lid operation unit (54, 102) is supported by another fixed device (57) in a manner such that it can move within the apparatus (12) between an open position in which the lid operation unit (54, 102) opens the process space opening (84) and a closed position in which the lid operation unit (54, 102) closes the process space opening (84).

9. 9. The device (12) according to claim 8, 10. The apparatus (12) is characterized in that it comprises a first treatment unit (18, 181, 182) configured as a cleaning device (20) for cleaning the hollow body (10) and / or the lid (44).

10. 10. The device (12) according to claim 8 or 9, 10. The device (12), characterized in that it comprises a second treatment unit (18, 181, 182) configured as a vacuum device (22) for applying a negative pressure in the hollow body (10) and / or at the lid (44).

11. A method for treating a wok-shaped hollow body (10) using a device according to any one of claims 2 to 10, comprising the steps of: The hollow body (10) comprises a first gripping portion (46) and a second gripping portion (48), moving the closure (28) to a first position in which the closure (28) opens the wall opening (26); feeding the hollow body (10) into the receiving part (34) using another gripping and moving device (24) with another gripping means (52), connecting said another gripping and moving device (24) with the hollow body (10) using the second gripping part (48) by said another gripping means, and connecting the hollow body (10) with the closure body (28) using the first gripping part (46) by activating the locking means (36) of the receiving part (34); Decoupling the separate gripping and moving device (24) from the second gripping portion (48); moving the closure body (28) to a closed position in which the closure body (28) closes the wall opening (26); connecting the hollow body (10) to a gripping and moving device (17) using a second gripping portion (48); Detaching the hollow body (10) from the closure body (28) by deactivating the containing portion (34); The method according to claim 1,

12. 12. The method of claim 11, The hollow body (10) a bottom wall (38) and one or more side walls (40); an opening (42) facing the bottom wall (38); a lid (44) capable of closing the opening (42); wherein the method comprises: feeding the hollow body (10) to a lid handling unit (54, 102) using a gripping and moving device (17); coupling a lid (44) to a lid operating unit (54, 102); - separating the lid (44) from the hollow body (10) using a lid handling unit (54, 102) and / or a gripping and moving device (17); The method according to claim 1,

13. 13. The method of claim 12, The device (12) comprises at least one processing unit (18, 181, 182) capable of processing the hollow body (10), the processing unit (18, 181, 182) working in cooperation with a lid operating unit (54, 102), The treatment unit (18, 181, 182) comprises a process space (73) in which the hollow body (10) can be treated, This process space (73) is accessible through a process space opening (84); The method further comprising: moving the lid operating unit (54, 102) to an open position in which the lid operating unit (54, 102) opens the process space opening (84); coupling a lid (44) to a lid operating unit (54, 102); - separating the lid (44) from the hollow body (10) using a lid handling unit (54, 102) and / or a gripping and moving device (17); and moving the lid handling unit (54, 102) to a closed position in which the lid handling unit (54, 102) closes the process space opening (84).

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