Semiconductor manufacturing apparatus and method for manufacturing semiconductor device

Abstract

To provide a technique capable of picking up a semiconductor device formed in an outer periphery of a semiconductor wafer and suppressing a crack generated in the semiconductor device when peeling the semiconductor device from a sheet in a simple structure.SOLUTION: A semiconductor manufacturing device comprises a sheet peeling jig 1 in contact with a rear surface of a sheet 3, which is a surface on the side opposite to a surface of the sheet 3. The sheet peeling jig 1 comprises a plurality of support blocks 6 in which each of first suction holes 18 for sucking the rear surface of the sheet 3 is formed, and a single driving plate 5 connected to the plurality of support blocks 6 so that the plurality of support blocks 6 can move in a first direction, which is a direction in which the plurality of support blocks separate from the sheet 3 in a time difference inside. The plurality of support blocks 6 is arranged along a second direction which crosses the first direction and in which peeling of a semiconductor substrate 2 progresses from the sheet 3, in the sheet peeling jig 1.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device. [Background technology]

[0002] A semiconductor wafer has a plurality of semiconductor devices formed thereon, and each semiconductor device is separated by dicing, and then transferred to a mounting process for production. After dicing, a semiconductor device pick-up device is used to peel each semiconductor device from the sheet.

[0003] Conventional semiconductor device pick-up devices include devices equipped with a pick-up jig having a plurality of needles of uniform height, and in such devices, the needles push up the semiconductor device from the adhesive sheet side.

[0004] However, when a conventional semiconductor device pickup device is used on a semiconductor device that has been thinned to, for example, 100 μm or less, there is a problem that cracks are generated in the semiconductor device by the needle.

[0005] Therefore, for example, Patent Document 1 discloses a peeling device that does not use a needle during pick-up but has a structure that uses a slider that moves laterally, thereby reducing cracks in the semiconductor device during pick-up.

[0006] Furthermore, for example, Patent Documents 2 and 3 disclose a peeling device that does not use a needle during pick-up, but moves a support block in the vertical direction, thereby reducing cracks in the semiconductor device during pick-up. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2006-156806 A [Patent Document 2] JP 2014-165302 A [Patent Document 3] JP 2017-224640 A Summary of the Invention [Problem to be solved by the invention]

[0008] In addition to the performance improvement due to the thinning of semiconductor wafers, the demand for semiconductor devices mainly made of expensive compound semiconductor materials such as silicon carbide and gallium nitride is also increasing in the power semiconductor field. Therefore, there is a demand to use the semiconductor devices formed on the outer periphery of the semiconductor wafer without waste.

[0009] In the technology described in Patent Document 1, when picking up a semiconductor device formed on the outer periphery of a semiconductor wafer, the dicing sheet is expanded to improve the pick-up performance of the semiconductor device. However, since the slider moves laterally, the slider may interfere with the inner wall of the cylindrical stage, which causes a problem that the semiconductor device formed on the outer periphery of the semiconductor wafer, which is the side in the slider movement direction, cannot be picked up.

[0010] The technology described in Patent Document 1 makes it possible to pick up semiconductor devices formed on the outer periphery of a semiconductor wafer by reversing the direction of movement of the slider, but this has the problem of complicating the structure by adding a new arm rotation axis, making the device larger and increasing manufacturing costs.

[0011] In addition, while the techniques described in Patent Documents 2 and 3 are capable of picking up semiconductor devices formed on the outer periphery of a semiconductor wafer, they have the problem that a drive source is required for each support block to move the support block vertically, which complicates the structure and increases the size of the device and manufacturing costs.

[0012] Therefore, an object of the present disclosure is to provide a technology that is capable of picking up a semiconductor device formed on the outer periphery of a semiconductor wafer using a simple structure, and that is capable of suppressing cracks that occur in the semiconductor device when the semiconductor device is peeled off from a sheet. [Means for solving the problem]

[0013] A semiconductor manufacturing apparatus according to the present disclosure is a semiconductor manufacturing apparatus that peels off a semiconductor device attached to a front surface of a sheet from the sheet, the semiconductor manufacturing apparatus comprising: a die that contacts a rear surface of the sheet, which is the surface of the sheet opposite to the front surface; the die has a plurality of support blocks each having a first suction hole formed therein for suctioning the rear surface of the sheet; and a single drive member connected to the plurality of support blocks so as to be movable in a first direction in which the plurality of support blocks move away from the sheet with a time lag; and the plurality of support blocks are arranged inside the die along a second direction that is a direction in which peeling of the semiconductor device from the sheet progresses and that intersects with the first direction. A connecting member that connects each of the support blocks and the driving member is inserted into each of the first suction holes, and an end of each of the connecting members on the support block side can be engaged with a protrusion provided on the driving member side of each of the support blocks. Effect of the Invention

[0014] According to the present disclosure, a single driving member moves multiple support blocks in a first direction, which is a direction away from the sheet, with a time lag, so that a semiconductor device formed on the outer periphery of a semiconductor wafer can be picked up with a simple structure and cracks that occur in the semiconductor device when it is peeled off from the sheet can be suppressed. [Brief description of the drawings]

[0015] [Figure 1] 1 is a cross-sectional view showing a part of a semiconductor manufacturing apparatus according to a first embodiment. [Diagram 2] 4 is a cross-sectional view showing a sheet peeling operation of the semiconductor manufacturing apparatus according to the first embodiment. FIG. [Diagram 3] 2 is a top view of a sheet peeling jig provided in the semiconductor manufacturing apparatus according to the first embodiment. FIG. [Figure 4]2 is a perspective view of a sheet peeling jig included in the semiconductor manufacturing apparatus according to the first embodiment. FIG. [Diagram 5] 5 is a flowchart showing a procedure for peeling off the semiconductor device from the sheet in the semiconductor manufacturing apparatus according to the first embodiment. [Figure 6] 1 is a cross-sectional view showing a part of a semiconductor manufacturing apparatus according to a first modification of the first embodiment. [Figure 7] 11 is a cross-sectional view showing a part of a semiconductor manufacturing apparatus according to a second modification of the first embodiment. [Figure 8] 11 is a cross-sectional view showing a sheet peeling operation of the semiconductor manufacturing apparatus according to the second modification of the first embodiment. FIG. [Figure 9] FIG. 11 is a cross-sectional view showing a part of a semiconductor manufacturing apparatus according to a second embodiment. [Figure 10] 13 is a cross-sectional view showing a relationship between a support block and a cam included in a semiconductor manufacturing apparatus according to a modification of the second embodiment. FIG. [Figure 11] FIG. 11 is a cross-sectional view showing a part of a semiconductor manufacturing apparatus according to a third embodiment. [Figure 12] FIG. 11 is a cross-sectional view showing a part of a semiconductor manufacturing apparatus according to a fourth embodiment. [Figure 13] FIG. 11 is a cross-sectional view showing a part of a semiconductor manufacturing apparatus according to a fifth embodiment. [Figure 14] FIG. 13 is a cross-sectional view showing a part of a semiconductor manufacturing apparatus according to a modified example of the fifth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] <Embodiment 1> <Overall composition> The first embodiment will be described below with reference to the drawings. Fig. 1 is a cross-sectional view showing a part of a semiconductor manufacturing apparatus according to the first embodiment. Fig. 2 is a cross-sectional view showing a sheet peeling operation of the semiconductor manufacturing apparatus according to the first embodiment. Fig. 3 is a top view of a sheet peeling jig 1 provided in the semiconductor manufacturing apparatus according to the first embodiment. Fig. 4 is a perspective view of the sheet peeling jig 1 provided in the semiconductor manufacturing apparatus according to the first embodiment.

[0017] 1, in order to separate a plurality of semiconductor devices 2 formed on a semiconductor wafer into chips, the semiconductor device manufacturing apparatus attaches the semiconductor devices 2 to the surface of a stretchable sheet 3, separates the plurality of semiconductor devices 2 by dicing, and then peels off the separated semiconductor devices 2 from the sheet 3. The sheet 3 is a dicing sheet or a mounting sheet.

[0018] The semiconductor manufacturing apparatus includes a sheet peeling jig 1 (corresponding to a die), a first suction source 15, and a collet 4.

[0019] The sheet peeling jig 1 is disposed on the back surface side of the sheet 3, which is the surface opposite to the front surface of the sheet 3. The sheet peeling jig 1 is formed in a cylindrical shape penetrating in the vertical direction, and the upper end of the sheet peeling jig 1 contacts the back surface of the sheet 3. The sheet peeling jig 1 has therein a plurality of (e.g., three) support blocks 6, a single driving plate 5 (corresponding to a driving member), and a first power source 7 such as an air cylinder.

[0020] Each support block 6 has a first suction hole 18 extending in the vertical direction. The three support blocks 6 are arranged inside the sheet peeling jig 1 along a second direction in which peeling of the semiconductor device 2 from the sheet 3 progresses. The second direction is the direction from left to right in Fig. 1. That is, the three support blocks 6 are arranged from left to right in Fig. 1.

[0021] The driving plate 5 is disposed below the three support blocks 6. The driving plate 5 is formed so that its lateral width is slightly shorter than the lateral width of the internal space of the sheet peeling jig 1 so that the driving plate 5 can move in the vertical direction. The first power source 7 is disposed below the driving plate 5 and moves the driving plate 5 in the vertical direction.

[0022] A bolt 16 (corresponding to a connecting member) that connects each support block 6 and drive plate 5 is inserted into each first suction hole 18 formed in each support block 6, and a head portion, which is an end portion of each bolt 16 on the support block 6 side, can be engaged with a protrusion 17 provided on the drive plate 5 side of each support block 6 and protruding to the inner periphery side. That is, when bolt 16 is in the lowered position, bolt 16 engages with protrusion 17, and when bolt 16 is in the raised position, bolt 16 does not engage with protrusion 17. A shaft portion of each bolt 16 is connected to drive plate 5.

[0023] The length of the shaft of the bolt 16 varies for each support block 6, and the length of the shaft of the bolt 16 increases in the second direction. In other words, the length of the shaft of the bolt 16 increases toward the right in Fig. 1. By gradually increasing the distance between the head of the bolt 16 and the protrusion 17 of the support block 6 in the second direction, it is possible to suppress cracks occurring in the semiconductor device 2 with a simple structure and to promote peeling of the semiconductor device 2 from the sheet 3.

[0024] A compression coil spring 9 is attached to each bolt 16 and is disposed between each support block 6 and the drive plate 5. The compression coil springs 9 are provided to bring the support block 6 into close contact with the seat 3. The elastic modulus of the three compression coil springs 9 is the same.

[0025] When the drive plate 5 is driven downward to move the bolts 16 in the first direction, which is a direction away from the sheet 3 in order and intersects with the second direction, that is, when the bolts 16 are driven downward in order from the shortest, the lowered bolts 16 engage with the protrusions 17, and the support blocks 6 connected to the bolts 16 also move downward in conjunction with the bolts 16. As a result, the three support blocks 6 move downward with a time lag in the second direction. Meanwhile, when the drive plate 5 is driven upward, the three support blocks 6 move upward simultaneously.

[0026] In order to peel the semiconductor device 2 from the sheet 3, the support block 6 moves downward in a direction away from the sheet 3 while the inside of the sheet peeling jig 1 is depressurized by the first suction source 15, thereby obtaining a vacuum force for peeling the sheet 3 from the semiconductor device 2. Note that, although the first suction source 15 is directly connected to the sheet peeling jig 1 in Fig. 1, it is preferable to connect it via a hose or a tube.

[0027] A through hole 5a extending in the vertical direction is formed in the driving plate 5, and the inside of the sheet peeling jig 1 can be evacuated by a first suction source 15 via the through hole 5a.

[0028] 1 and 2, by providing first suction holes 18 communicating with first suction source 15 on the surface of support block 6 that comes into contact with sheet 3, support block 6 can directly suck sheet 3. This allows a force to peel sheet 3 from semiconductor device 2 to be efficiently applied to sheet 3, accelerating the progress of peeling.

[0029] The collet 4 is disposed on the surface of the semiconductor device 2 opposite to the surface that contacts the sheet 3, and holds the semiconductor device 2 by vacuum suction.

[0030] 3 and 4, a plurality of first suction holes 18 may be provided for each support block 6. Suction holes 20 communicating with the first suction source 15 may also be formed in side walls 19 forming the sides of the sheet peeling jig 1 and in partition walls 19a separating adjacent support blocks 6. Note that the upper ends of the partition walls 19a may or may not contact the sheet 3 as long as it is possible to ensure that the interior of the sheet peeling jig 1 can be kept at a desired vacuum pressure.

[0031] <Procedure for peeling off semiconductor device from sheet> Next, a procedure for peeling the semiconductor device 2 from the sheet 3 will be described. FIG. 5 is a flow chart showing a procedure for peeling the semiconductor device 2 from the sheet 3 in the semiconductor manufacturing apparatus according to the first embodiment. FIG. 6(a) is a cross-sectional view showing a part of the semiconductor manufacturing apparatus according to the first modification of the first embodiment, showing a state before the sheet 3 to which the semiconductor device 2 is attached is placed on the sheet peeling jig 1. FIG. 6(b) is a cross-sectional view showing a part of the semiconductor manufacturing apparatus according to the first modification of the first embodiment, showing a state in which the sheet 3 to which the semiconductor device 2 is attached is placed on the sheet peeling jig 1. FIG. 7 is a cross-sectional view showing a part of the semiconductor manufacturing apparatus according to the second modification of the first embodiment. FIG. 8 is a cross-sectional view showing a sheet peeling operation of the semiconductor manufacturing apparatus according to the second modification of the first embodiment.

[0032] 5, first, a semiconductor wafer having a semiconductor device 2 attached to a sheet 3 is placed on a sheet peeling jig 1 (step S1). Next, the sheet peeling jig 1 is aligned with the semiconductor device 2 to be peeled, and the sheet 3 and the sheet peeling jig 1 are sealed (step S2). Next, the sheet peeling jig 1 adsorbs the sheet 3 by a first suction source 15 (step S3).

[0033] A member may be provided to improve adhesion between the sheet 3 and the sheet peeling jig 1. Specifically, as shown in Figures 6(a) and 6(b), an O-ring 22 may be provided on the upper surface of the sheet peeling jig 1 that comes into contact with the sheet 3 to eliminate a gap between the sheet peeling jig 1 and the sheet 3. By eliminating the gap between the sheet 3 and the upper surface of the sheet peeling jig 1, the inside of the sheet peeling jig 1 can be stably maintained in a vacuum state.

[0034] Next, the driving plate 5 inside the sheet peeling jig 1 is driven downward (step S4), and sheet peeling begins. The first power source 7 moves the driving plate 5 in a direction in which the support block 6 moves away from the sheet 3, and when the bolt 16 connected to the driving plate 5 engages with the protrusion 17 of the support block 6, as shown in Fig. 2, the left support block 6 (support block A in Fig. 5) on the upstream side in the second direction begins to move downward, and the sheet 3 begins to peel off from the semiconductor device 2 (step S5).

[0035] Inside the sheet peeling jig 1, the distance between the head of the bolt 16 and the protrusion 17 of the support block 6 is formed to become longer in the second direction, and the difference in these distances makes it possible to move the sheet 3 in a direction away from the semiconductor device 2 with a time difference, and to advance the peeling. Therefore, after the support block 6 (support block B in FIG. 5) in the center in the second direction starts to descend (step S6), the support block 6 on the right side downstream in the second direction (support block C in FIG. 5) starts to descend. That is, all the support blocks 6 start to descend (step S7).

[0036] 7 and 8, the distance between the head of the bolt 16 and the protrusion 17 of the support block 6 is symmetrically disposed with respect to the center of the semiconductor device 2, thereby obtaining effects such as shortening the time until peeling is completed and stabilizing the peeling operation. The support block 6 starts to move in a direction away from the sheet 3, generating a force to peel the sheet 3 from the semiconductor device 2, and by making the timing of the support block 6 descending symmetrical with respect to the center of the semiconductor device 2, when the peeling time in the second direction is set to 1, in the case of peeling from both sides toward the center, peeling from both sides is completed at the midpoint, so the peeling time in this case becomes about 0.5, making it possible to shorten the peeling time.

[0037] Next, when all the support blocks 6 have descended and peeling has been completed, the collet 4 transports and places the semiconductor device 2 peeled off from the sheet 3 on a tray. That is, the collet 4 transfers the semiconductor device 2 (step S8). Then, after all the support blocks 6 have risen by the upward drive of the drive plate 5, the sheet peeling jig 1 is aligned with the next semiconductor device 2 to be peeled off (step S9), and the same processes as steps S3 to S9 are performed on the entire surface of the semiconductor wafer.

[0038] The peeled semiconductor device 2 is stored in a tray, but this is not limited to this. It may be placed on a substrate, tape, or stage of a semiconductor product, or the peeled semiconductor device 2 may be held by an adsorption pad for transportation or transfer.

[0039] Furthermore, as shown in Figure 1 etc., the components of the semiconductor manufacturing equipment are not limited to being arranged in a vertical direction, such as collet 4, semiconductor device 2, sheet 3, and sheet peeling jig 1 from top to bottom, but may also be arranged horizontally, specifically with sheet 3 vertically.

[0040] Moreover, the sheet 3 to be peeled off is not limited to a sheet for dicing, and may be any sheet-like member. Furthermore, the first power source 7 may be other power sources capable of performing linear motion, such as a ball screw, in addition to an air cylinder, and the connecting member may be other rigid or elastic bodies in addition to the bolts 16.

[0041] <Effects> As described above, the semiconductor manufacturing apparatus of embodiment 1 includes a sheet peeling jig 1 that contacts the back surface of sheet 3, which is the surface opposite to the front surface of sheet 3, and sheet peeling jig 1 has therein a plurality of support blocks 6, each having a first suction hole 18 formed therein for adsorbing the back surface of sheet 3, and a single drive plate 5 connected to the plurality of support blocks 6 so that the plurality of support blocks 6 can move in a first direction, which is a direction in which the plurality of support blocks 6 move away from sheet 3 with a time difference, and the plurality of support blocks 6 are arranged inside sheet peeling jig 1 along a second direction, which is a direction in which peeling of semiconductor device 2 from sheet 3 progresses and which intersects with the first direction.

[0042] Therefore, since a single driving plate 5 moves multiple support blocks 6 in a direction away from the sheet 3 with a time difference, the semiconductor device 2 formed on the outer periphery of the semiconductor wafer can be picked up with a simple structure, and cracks that occur in the semiconductor device 2 when the semiconductor device 2 is peeled off from the sheet 3 can be suppressed.

[0043] The simplified structure not only reduces the size and manufacturing cost of the semiconductor manufacturing equipment, but also reduces the risk of failure of the semiconductor manufacturing equipment. As a result, the yield of the semiconductor devices 2 manufactured by the semiconductor manufacturing equipment can be improved.

[0044] In addition, a bolt 16 serving as a connecting member connecting each support block 6 and the drive plate 5 is inserted into each first suction hole 18, and the end of each bolt 16 on the support block 6 side can engage with a protrusion 17 provided on the drive plate 5 side of each support block 6.

[0045] Therefore, by using the bolts 16 as the connecting members, the sheet peeling jig 1 can be easily configured, and therefore the semiconductor manufacturing apparatus can be easily configured.

[0046] In addition, the length of the bolts 16 differs for each support block 6, and the longer the bolts 16, the further they are in the second direction. As the drive plate 5 is driven, the bolts 16 move in the first direction in order from the shortest, and the support block 6 connected to the bolt 16 also moves in the first direction in unison.

[0047] Therefore, the plurality of support blocks 6 move in the first direction in sequence toward the second direction, so that the peeling of the sheet 3 can be efficiently advanced.

[0048] Furthermore, the semiconductor manufacturing equipment has at least three bolts 16, and two of the at least three bolts 16 have the same length. Therefore, the timing at which the support block 6 descends can be synchronized at two locations, and peeling of the sheet 3 can be efficiently advanced.

[0049] Moreover, since the semiconductor manufacturing apparatus further includes the first suction source 15 that sucks the inside of the sheet peeling jig 1, the inside of the sheet peeling jig 1 can be stably put into a vacuum state.

[0050] Furthermore, the timing at which the multiple support blocks 6 move in the first direction is symmetrical with respect to the center of the semiconductor device 2. Therefore, by making the peeling operation of the sheet 3 symmetrical with respect to the center of the semiconductor device 2, it is possible to shorten the peeling time of the sheet 3 and stabilize the peeling operation.

[0051] The semiconductor manufacturing equipment further includes a collet 4 arranged on the surface of the semiconductor device 2 opposite to the surface that comes into contact with the sheet 3, and the collet 4 adsorbs and holds the semiconductor device 2. Therefore, as the peeling of the sheet 3 progresses, the semiconductor device 2 resists the force of being pulled by the sheet 3, making it easier to peel the sheet 3.

[0052] Furthermore, the sheet 3 is adsorbed by the suction force of the first suction source 15. Therefore, since the sheet 3 can be adsorbed inside the support block 6, the force for peeling off the sheet 3 acts even stronger when the support block 6 operates, and the peeling operation of the sheet 3 becomes stable.

[0053] In addition, an O-ring 22 is provided on the surface of the sheet peeling jig 1 that comes into contact with the sheet 3 to eliminate any gap between the sheet peeling jig 1 and the sheet 3. Therefore, the inside of the sheet peeling jig 1 can be stably maintained in a vacuum state.

[0054] <Embodiment 2> Next, a semiconductor manufacturing apparatus according to a second embodiment will be described. Fig. 9 is a cross-sectional view showing a part of the semiconductor manufacturing apparatus according to the second embodiment. Fig. 10 is a cross-sectional view showing the relationship between a support block 6 and a cam 8 provided in a semiconductor manufacturing apparatus according to a modified example of the second embodiment. In the second embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals and the description thereof will be omitted.

[0055] 9 and 10, in the second embodiment, a cam 8 is used as a means for moving the support block 6. The sheet peeling jig 1 includes a plurality of (e.g., three) support blocks 6, a single camshaft 21 as a driving member, and a plurality of (e.g., three) cams 8.

[0056] The three support blocks 6 are connected to the camshaft 21 via three cams 8 each having a different phase. The three cams 8 are eccentric cams of different shapes provided on the camshaft 21, and rotate around the camshaft 21 as an axis of rotation. The lower end of each support block 6 abuts against the circumferential surface of each cam 8, and the three cams 8 rotate as the camshaft 21 is driven to rotate, allowing the three support blocks 6 to move downward, which is a first direction, with a time difference.

[0057] The three cams 8 are eccentric cams, and therefore have regions with long and short distances from the rotation axis. By the rotational drive of the camshaft 21, the three cams 8 rotate in the second direction for each support block 6 so that they are positioned in the region with the shortest distance from the rotation axis, and the support block 6 connected to the cam 8 also moves down in conjunction with the cams 8.

[0058] Meanwhile, when the three cams 8 rotate to be positioned in an area with a large distance from the rotation shaft, the support blocks 6 connected to the cams 8 also rise in conjunction with the cams 8. Here, "the cams 8 are positioned in an area with a small distance from the rotation shaft" means that the area of ​​the cams 8 with a small distance from the rotation shaft abuts against the support blocks 6, and "the cams 8 are positioned in an area with a large distance from the rotation shaft" means that the area of ​​the cams 8 with a large distance from the rotation shaft abuts against the support blocks 6.

[0059] The first power source 7 is suitable for providing power to rotate the camshaft 21 and the cam 8, and is envisioned to be a motor, but is not limited to this as long as it is a power source capable of driving the rotation of the camshaft 21.

[0060] The cam 8 may not only be disposed so as to abut against the lower end of the support block 6, but may also be disposed inside the first suction hole 18 of the support block 6 as shown in Fig. 10. An elastic member 24 that urges the support block 6 upward is provided at the lower end of the support block 6. A protrusion 23 that protrudes outward from the lower end of the support block 6, and a recess 23a with which the protrusion 23 can engage is provided inside the sheet peeling jig 1, thereby preventing the support block 6 from moving above a predetermined height position.

[0061] Each cam 8 is disposed so as to abut against the bottom wall inside the support block 6. In this case, the three cams 8 rotate in sequence in the second direction for each support block 6 so as to be located in an area with a long distance from the rotation axis, and the support block 6 connected to the cam 8 also descends in conjunction with the three cams 8. On the other hand, the three cams 8 rotate so as to be located in an area with a short distance from the rotation axis, and the support block 6 connected to the cam 8 also ascends in conjunction with the three cams 8.

[0062] In addition, the mechanism is not limited to the protrusion 23, but may be any mechanism capable of preventing the support block 6 from moving upward, and the mechanism may be provided on the sheet peeling jig 1 side or on the upper end side of the support block 6.

[0063] Although not shown, the phases of two of the three cams 8 may be the same. Specifically, the timing at which the support block 6 descends may be linearly or point-symmetrical with respect to the center of the semiconductor device 2.

[0064] As described above, in the semiconductor manufacturing apparatus of embodiment 2, the multiple support blocks 6 are connected to the camshaft 21 via the multiple cams 8 each having a different phase, and the multiple cams 8 are rotated by driving the camshaft 21, thereby allowing the multiple support blocks 6 to move in the first direction with a time difference.

[0065] Therefore, the mechanism for operating the multiple support blocks 6 is simpler than in the case of embodiment 1, and the adjustment thereof is also easier than in the case of embodiment 1. Furthermore, since the distance between the support blocks 6 and the driving member is shorter than in the case of embodiment 1, this is advantageous when the vertical dimension of the sheet peeling jig 1 cannot be ensured.

[0066] Moreover, each cam 8 was disposed inside each first suction hole 18. Therefore, the torque of the reciprocating movement of the support block 6 from the peeling side downward to the return side upward can be stably exerted, which prevents the support block 6 from being unable to move to the peeling side due to insufficient torque.

[0067] In addition, the multiple cams 8 are eccentric cams, and as a result of the driving of the camshaft 21, the multiple cams 8 rotate in sequence in the second direction for each support block 6, and the support block 6 connected to the cam 8 also moves in the first direction in unison.

[0068] Therefore, the plurality of support blocks 6 move in the first direction in sequence toward the second direction, so that the peeling of the sheet 3 can be efficiently advanced.

[0069] In addition, the semiconductor manufacturing equipment has at least three cams 8, and the phases of two of the at least three cams 8 are the same. Therefore, the timing at which the support block 6 descends can be synchronized at two locations, and peeling of the sheet 3 can be efficiently advanced.

[0070] <Embodiment 3> Next, a semiconductor manufacturing apparatus according to embodiment 3 will be described. Fig. 11 is a cross-sectional view showing a part of the semiconductor manufacturing apparatus according to embodiment 3. In embodiment 3, the same components as those described in embodiments 1 and 2 are denoted by the same reference numerals and the description thereof will be omitted.

[0071] 11, in the third embodiment, an elastic body 10 (corresponding to a first elastic body) is employed as a means for moving the support block 6. Although rubber is assumed as the elastic body 10, other members such as a wound spring or an air spring may be used as long as they are capable of elastic deformation.

[0072] The sheet peeling jig 1 includes a plurality of (e.g., three) support blocks 6, a single drive plate 5 as a drive member, and a plurality of (e.g., three) elastic bodies 10. The three support blocks 6 are connected to the drive plate 5 via the three elastic bodies 10 having different elastic coefficients. Specifically, the upper end of the elastic body 10 is connected to the lower end of the support block 6 by a bolt 10a, and the lower end of the elastic body 10 is connected to the upper surface of the drive plate 5 by a bolt 10b. Each elastic body 10 is disposed between each support block 6 and the drive plate 5 with a compression coil spring 9 (corresponding to a second elastic body) having an elastic coefficient different from that of the elastic body 10 attached thereto. The three compression coil springs 9 have the same elastic coefficient.

[0073] Drive By driving the movable plate 5, the three support blocks 6 are movable downward in the first direction from the elastic body 10 having a small elastic modulus with a time difference. Three The elastic bodies 10 are arranged so that the elastic modulus increases in the second direction. On the other hand, when the drive plate 5 is driven upward, the three support blocks 6 move upward at the same time.

[0074] In addition, if the load of the compression coil spring 9 that applies a force to the support block 6 in a direction toward the seat 3 is defined as load A, and the load of the elastic body 10 that applies a force in a direction away from the seat 3 is defined as load B, the following effects can be obtained under the following conditions.

[0075] In region a where Load A ≧ Load B, the drive plate 5 starts to move the support block 6 in the direction away from the sheet 3, and load B is generated, but since load A is greater or load A and load B are the same, the support block 6 does not move.

[0076] In region b where Load A < Load B, the load B generated by the drive plate 5 moving the support block 6 in the direction away from the sheet 3 becomes greater than the force of the load A trying to hold the support block 6 in place, so that the support block 6 begins to move in the direction away from the sheet 3.

[0077] By combining these regions, the elastic body 10 has Elastic modulus This can provide the effect of canceling out the variation in the timing at which peeling starts, making it possible to minimize the variation in the timing at which peeling starts.

[0078] Although not shown, two of the three elastic bodies 10 may have the same elastic coefficient. Specifically, the timing at which the support block 6 descends may be linearly or point-symmetrical with respect to the center of the semiconductor device 2.

[0079] As described above, in the semiconductor manufacturing apparatus of embodiment 3, the multiple support blocks 6 are connected to the driving plate 5 via multiple elastic bodies 10 each having a different elastic coefficient, and by driving the driving plate 5, the multiple support blocks 6 can be moved in a first direction with a time difference.

[0080] Therefore, while the length of the bolt 16 is changed in the first embodiment, the length of the elastic body 10 is changed in the third embodiment. Elastic modulus Since it is only necessary to change the above, the semiconductor manufacturing apparatus can be configured even more simply than in the first embodiment.

[0081] In addition, the multiple elastic bodies 10 are arranged so that the elastic modulus becomes larger as they move in the second direction, and by driving the drive plate 5, the elastic bodies 10 move in the first direction in order from the elastic body 10 with the smallest elastic modulus, and the support block 6 connected to the elastic body 10 also moves in the first direction in conjunction with the elastic body 10.

[0082] Therefore, the plurality of support blocks 6 move in the first direction in sequence toward the second direction, so that the peeling of the sheet 3 can be efficiently advanced.

[0083] Furthermore, the semiconductor manufacturing equipment has at least three elastic bodies 10, and two of the at least three elastic bodies 10 have the same elastic coefficient. Therefore, the timing at which the support block 6 descends can be synchronized at two locations, and peeling of the sheet 3 can be efficiently advanced.

[0084] Furthermore, each support block 6 is connected to the drive plate 5 via an elastic body 10 and a compression coil spring 9 having an elastic coefficient different from that of the elastic body 10. Therefore, even if the drive plate 5 starts to move the support block 6 in a direction away from the seat 3, the movement of the support block 6 can be prevented from starting until the load on the elastic body 10 exceeds the initial load of the elastic body 10.

[0085] <Fourth embodiment> Next, a semiconductor manufacturing apparatus according to embodiment 4 will be described. Fig. 12 is a cross-sectional view showing a part of the semiconductor manufacturing apparatus according to embodiment 4. In embodiment 4, the same components as those described in embodiments 1 to 3 are denoted by the same reference numerals and the description thereof will be omitted.

[0086] In the first to third embodiments, the collet 4 has been described as having a function of vacuum-adsorbing the semiconductor device 2, but in the fourth embodiment, as shown in Fig. 12, the collet 4 not only vacuum-adsorbs the semiconductor device 2, but also has a gas blowing section 12 that blows out gas from the outer periphery of the semiconductor device 2 to increase the gas pressure at the outer periphery of the semiconductor device 2. The outline of the collet 4 in a top view is formed to be larger than the outline of the semiconductor device 2 in a top view, and the gas blowing section 12 is provided at a portion of the collet 4 facing the outer periphery of the semiconductor device 2. This increases the pressure in the space between the semiconductor device 2 and the sheet 3, thereby facilitating the progress of peeling of the sheet 3.

[0087] The outer periphery side of the semiconductor device 2 may be a portion including the outer periphery of the semiconductor device 2, or may be a portion not including the outer periphery of the semiconductor device 2 and outside the outer periphery of the semiconductor device 2.

[0088] The gas blown out from the gas blowing section 12 can be reused as the gas discharged by an ejector mechanism (not shown) adopted to obtain a vacuum source for adsorbing the semiconductor device 2 in the adsorption section 11.

[0089] As described above, in the semiconductor manufacturing apparatus of embodiment 4, the top view contour of collet 4 is formed to be larger than the top view contour of semiconductor device 2, and collet 4 blows gas from the outer periphery side of semiconductor device 2, thereby promoting the progress of peeling of sheet 3.

[0090] Moreover, the gas blown out from the collet 4 is the gas discharged when the semiconductor device 2 is suctioned. Therefore, by reusing the gas discharged to obtain a vacuum source for suctioning the semiconductor device 2, it is possible to reduce the number of ejector mechanisms to one, thereby simplifying the configuration of the semiconductor manufacturing apparatus.

[0091] <Embodiment 5> Next, a semiconductor manufacturing apparatus according to a fifth embodiment will be described. Fig. 13 is a cross-sectional view showing a part of the semiconductor manufacturing apparatus according to the fifth embodiment. Fig. 14 is a cross-sectional view showing a part of the semiconductor manufacturing apparatus according to a modified example of the fifth embodiment. In the fifth embodiment, the same components as those described in the first to fourth embodiments are denoted by the same reference numerals and the description thereof will be omitted.

[0092] As shown in FIG. 13, in the fifth embodiment, the sheet peeling jig 1 is sized so that a plurality of semiconductor devices 2 can be placed thereon.

[0093] The size of the upper surface of the sheet peeling jig 1 is set to a size that allows the semiconductor device 2 adjacent to the semiconductor device 2 to be peeled to be placed thereon, so that the force of adsorbing the sheet 3 is increased, and even when the collet 4 moves the semiconductor device 2 in a direction away from the sheet 3 when the sheet 3 is not sufficiently peeled, the sheet 3 is prevented from moving along with the transfer of the semiconductor device 2.

[0094] The sheet peeling jig 1 further has second suction holes 20a, 20b, 20c provided on the outer periphery side of the three support blocks 6, and the second suction holes 20a, 20b, 20c suck portions of the sheet 3 located on the outer periphery side of the semiconductor device 2 held by the collet 4. The second suction holes 20a, 20b, 20c are provided in the side wall 19 and are connected to the first suction source 15 through the inside of the sheet peeling jig 1. The first suction source 15 sucks the second suction holes 20a, 20b, 20c in addition to the first suction hole 18.

[0095] As shown in Fig. 14, the semiconductor manufacturing apparatus may further include second suction sources 15a and 15b for sucking second suction holes 20a, 20b, and 20c. The second suction source 15a sucks the portion of the sheet 3 facing the semiconductor device 2 on the left side in Fig. 14, and the second suction source 15b sucks the portion of the sheet 3 facing the semiconductor device 2 on the right side in Fig. 14. By providing separate suction sources for the semiconductor device 2 to be peeled and the adjacent semiconductor device 2, the variety of combinations of suction and peeling control of the sheet 3 increases. It becomes possible to use suction sources according to various requirements.

[0096] In order to hold the collet 4, a holding mechanism (not shown) for the collet 4 is required, but this can be designed arbitrarily.

[0097] As described above, in the semiconductor manufacturing apparatus of embodiment 5, the sheet peeling jig 1 further has second suction holes 20a, 20b, 20c provided on the outer periphery side of the multiple support blocks 6, and the second suction holes 20a, 20b, 20c adsorb the portions of the sheet 3 located on the outer periphery side of the semiconductor device 2 held by the collet 4.

[0098] Therefore, when the collet 4 transfers the semiconductor device 2 in a direction away from the sheet 3, even if the sheet 3 is not sufficiently peeled off, the force of adsorption of the sheet 3 increases, suppressing the floating of the sheet 3, thereby stabilizing the peeling operation of the sheet 3.

[0099] The semiconductor manufacturing apparatus further includes second suction sources 15a and 15b for sucking second suction holes 20a, 20b, and 20c. Therefore, the suction force of sheet 3 can be controlled, and sheet 3 can be kept at an appropriate tension.

[0100] <Other Modifications> The O-ring 22 described in the first embodiment may be used in the semiconductor manufacturing apparatus according to the second to fifth embodiments. Moreover, the collet 4 having the gas blowing part 12 described in the fourth embodiment may be used in the semiconductor manufacturing apparatus according to the first to third and fifth embodiments. Furthermore, the structure of the sheet peeling jig 1 and the second suction sources 15a and 15b described in the fifth embodiment may be used in the semiconductor manufacturing apparatus according to the first to fourth embodiments.

[0101] It should be noted that the embodiments can be freely combined, and each embodiment can be modified or omitted as appropriate. [Explanation of symbols]

[0102] 1 sheet peeling jig, 2 semiconductor device, 3 sheet, 4 collet, 5 drive plate, 6 support block, 8 cam, 9 compression coil spring, 10 elastic body, 15 first suction source, 15a, 15b second suction source, 16 bolt, 17 protrusion, 18 first suction hole, 20a, 20b, 20c second suction holes, 21 camshaft, 22 O-ring.

Claims

1. A semiconductor manufacturing apparatus for peeling off a semiconductor device attached to a surface of a sheet from the sheet, comprising: a die that contacts a back surface of the sheet, the back surface being a surface opposite to the front surface of the sheet; the die has a plurality of support blocks each having a first suction hole formed therein for suctioning the rear surface of the sheet, and a single drive member connected to the plurality of support blocks so as to be movable in a first direction in which the plurality of support blocks move away from the sheet with a time difference; the plurality of support blocks are disposed inside the die along a second direction that is a direction in which peeling of the semiconductor device from the sheet progresses and that intersects with the first direction; A connecting member that connects each of the support blocks and the driving member is inserted into each of the first suction holes, an end portion of each of the connection members on the side of the support block and a protrusion provided on each of the support blocks on the side of the drive member are engageable with each other.

2. The length of the connection member is different for each of the support blocks, and the length of the connection member becomes longer toward the second direction, 2. The semiconductor manufacturing apparatus according to claim 1, wherein, by driving the driving member, the connection members are moved in the first direction in order starting with the shortest one, and the support block connected to the connection members is also moved in the first direction in conjunction with the connection members.

3. The connecting member includes at least three connecting members, 3. The semiconductor manufacturing apparatus according to claim 2, wherein two of the at least three connection members have the same length.

4. A semiconductor manufacturing apparatus for peeling off a semiconductor device attached to a surface of a sheet from the sheet, comprising: a die that contacts a back surface of the sheet, the back surface being a surface opposite to the front surface of the sheet; the die has a plurality of support blocks each having a first suction hole formed therein for suctioning the rear surface of the sheet, and a single drive member connected to the plurality of support blocks so as to be movable in a first direction in which the plurality of support blocks move away from the sheet with a time difference; the plurality of support blocks are disposed inside the die along a second direction that is a direction in which peeling of the semiconductor device from the sheet progresses and that intersects with the first direction; The plurality of support blocks are connected to the drive member via a plurality of cams each having a different phase, The semiconductor manufacturing apparatus, wherein the plurality of cams are rotated by driving the driving member, thereby allowing the plurality of support blocks to move in the first direction with a time difference.

5. 5. The semiconductor manufacturing apparatus according to claim 4, wherein each of the cams is disposed inside each of the first suction holes.

6. the plurality of cams are eccentric cams, 6. The semiconductor manufacturing apparatus according to claim 4, wherein, by driving the driving member, the plurality of cams rotate in sequence in the second direction for each of the support blocks, thereby causing the support blocks connected to the cams to move in the first direction in unison.

7. The cam includes at least three cams.

7. The semiconductor manufacturing apparatus according to claim 4, wherein the phases of two of the at least three cams are the same.

8. A semiconductor manufacturing apparatus for peeling off a semiconductor device attached to a surface of a sheet from the sheet, comprising: a die that contacts a back surface of the sheet, the back surface being a surface opposite to the front surface of the sheet; the die has a plurality of support blocks each having a first suction hole formed therein for suctioning the rear surface of the sheet, and a single drive member connected to the plurality of support blocks so as to be movable in a first direction in which the plurality of support blocks move away from the sheet with a time difference; the plurality of support blocks are disposed inside the die along a second direction that is a direction in which peeling of the semiconductor device from the sheet progresses and that intersects with the first direction; The plurality of support blocks are connected to the driving member via a plurality of first elastic bodies each having a different elastic coefficient; In the semiconductor manufacturing apparatus, the plurality of support blocks can be moved in the first direction with a time difference by driving the driving member.

9. The first elastic bodies are arranged such that an elastic modulus increases toward the second direction, 9. The semiconductor manufacturing apparatus of claim 8, wherein, by driving the driving member, the first elastic body moves in the first direction in order starting with the first elastic body having a small elastic coefficient, and the support block connected to the first elastic body also moves in the first direction in conjunction with the first elastic body.

10. The first elastic body has at least three pieces, 10. The semiconductor manufacturing apparatus according to claim 8, wherein two of the at least three first elastic bodies have the same elastic modulus.

11. 11. The semiconductor manufacturing apparatus according to claim 8, wherein each of the support blocks is connected to the driving member via the first elastic body and a second elastic body having an elastic modulus different from that of the first elastic body.

12. The semiconductor manufacturing apparatus according to claim 1 , further comprising a first suction source that applies suction to an inside of the die.

13. 13. The semiconductor manufacturing apparatus according to claim 1, wherein the timing at which the plurality of support blocks move in the first direction is symmetrical with respect to a center of the semiconductor device.

14. a collet disposed on a surface of the semiconductor device opposite to a surface that contacts the sheet, 13. The semiconductor manufacturing apparatus according to claim 12, wherein the collet suctions and holds the semiconductor device.

15. A semiconductor manufacturing apparatus for peeling off a semiconductor device attached to a surface of a sheet from the sheet, comprising: a die that contacts a back surface of the sheet, the back surface being the surface opposite to the front surface of the sheet; a first suction source for suctioning the interior of the die; a collet disposed on a surface of the semiconductor device opposite to a surface that contacts the sheet, the die has a plurality of support blocks each having a first suction hole formed therein for suctioning the rear surface of the sheet, and a single drive member connected to the plurality of support blocks so as to be movable in a first direction in which the plurality of support blocks move away from the sheet with a time difference; the plurality of support blocks are disposed inside the die along a second direction that is a direction in which peeling of the semiconductor device from the sheet progresses and that intersects with the first direction; The collet attracts and holds the semiconductor device, a top view outline of the collet is formed to be larger than a top view outline of the semiconductor device; The collet blows out gas from the outer periphery side of the semiconductor device.

16. 16. The semiconductor manufacturing apparatus according to claim 15, wherein the gas blown out from the collet is exhaust gas discharged when the semiconductor device is sucked.

17. A semiconductor manufacturing apparatus for peeling off a semiconductor device attached to a surface of a sheet from the sheet, comprising: a die that contacts a back surface of the sheet, the back surface being the surface opposite to the front surface of the sheet; a first suction source for suctioning the interior of the die; a collet disposed on a surface of the semiconductor device opposite to a surface that contacts the sheet, the die has a plurality of support blocks each having a first suction hole formed therein for suctioning the rear surface of the sheet, and a single drive member connected to the plurality of support blocks so as to be movable in a first direction in which the plurality of support blocks move away from the sheet with a time difference; the plurality of support blocks are disposed inside the die along a second direction that is a direction in which peeling of the semiconductor device from the sheet progresses and that intersects with the first direction; The collet attracts and holds the semiconductor device, the die further has second suction holes provided on an outer circumferential side of the plurality of support blocks, The second suction hole sucks a portion of the sheet located on an outer periphery of the semiconductor device held by the collet.

18. The semiconductor manufacturing apparatus according to claim 17 , further comprising a second suction source for sucking the second suction hole.

19. The semiconductor manufacturing apparatus according to claim 12 , wherein the sheet is attracted by a suction force of the first suction source.

20. 20. The semiconductor manufacturing apparatus according to claim 1, further comprising an O-ring provided on a surface of the die that comes into contact with the sheet, for eliminating a gap between the die and the sheet.

21. A method for manufacturing a semiconductor device using the semiconductor manufacturing apparatus according to claim 1, (a) setting a semiconductor wafer on which the semiconductor device is formed and attached to the sheet; (b) adsorbing the sheet through the first suction holes of the die; (c) driving the driving member to move the plurality of support blocks in the first direction in sequence toward the second direction; The manufacturing method of a semiconductor device comprising the steps of:

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