Optical devices and components

Abstract

In the present invention, an optical device comprises: a base having a mounting surface; and an optical component having an optical element part and a support part which supports the optical element part and which has a first bonded surface bonded to the packaging surface with a photocurable first adhesive interposed therebetween, the optical component being provided with an optical opening which is adjacent to the first bonded surface and which is capable of transmitting light for curing the first adhesive.

Description

[Technical field]

[0001] The present invention relates to an optical device and an optical component. [Background technology]

[0002] 2. Description of the Related Art Conventionally, an optical device including a substrate and an optical component such as a lens bonded onto the substrate with an ultraviolet-curable adhesive is known (Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-098335 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in an optical device having a lens, for example a silicone lens, silicone does not transmit ultraviolet light, so the ultraviolet light is blocked by the silicone lens and the ultraviolet light cannot be sufficiently irradiated onto the ultraviolet-curable adhesive, which may make it difficult to adhere the adhesive.

[0005] Therefore, one object of the present invention is to provide a novel configuration that makes it easier to obtain a better adhesive state in an optical device in which an optical component is adhered to a base by a photocurable adhesive, for example. [Means for solving the problem]

[0006] The optical device of the present invention comprises, for example, an optical component having a base having a mounting surface, an optical element portion, and a support portion having a first adherend surface that is adhered to the mounting surface via a photocurable first adhesive and supporting the optical element portion, the optical component being provided with an optical opening adjacent to the first adherend surface that allows light to pass through to harden the first adhesive.

[0007] In the optical device, the support portion may include a high-transmittance portion that transmits the light as the optical opening, and a low-transmittance portion that has a lower transmittance of the light than the high-transmittance portion.

[0008] In the optical device, the optical aperture may include a recess that is recessed in a direction along the first adherend surface.

[0009] The optical device may include a mirror that reflects the light towards the first adhesive.

[0010] The optical device may include a mirror adjacent to the first adhesive as the mirror.

[0011] The optical device may include a mirror configured to reflect the light toward the first adhesive through the optical aperture.

[0012] The optical device may include, as the mirror, a mirror provided on the mounting surface.

[0013] The optical device may include, as the mirror, a mirror disposed adjacent to the optical aperture.

[0014] The optical device may further include a component other than the optical component mounted on the mounting surface, and the mirror may be a mirror provided on the other component.

[0015] The optical device may include a case that houses the base and the optical component, and the mirror may be a mirror provided on an inner surface of the case.

[0016] The optical device may include, as the mirror, two mirrors provided on either side of the optical aperture.

[0017] In the optical device, the support portion may have a plurality of support sites aligned in a direction intersecting the mounting surface and bonded to one another.

[0018] The optical device may further include a mirror that reflects light that cures the second adhesive, the second adhesive bonding the plurality of support portions being a light curable adhesive.

[0019] In the optical device, the optical component may be a lens array having a plurality of lens portions arranged in parallel as the optical element portion.

[0020] Moreover, the optical device of the present invention includes an optical component having, for example, a base having a mounting surface, an optical element portion, and a support portion having a first adherend surface that is adhered to the mounting surface via a photocurable first adhesive and supporting the optical element portion, and a mirror that reflects light that hardens the first adhesive toward the first adhesive.

[0021] The optical device may include a transparent member that transmits the light toward the first adhesive, separate from the optical component.

[0022] Moreover, the optical component of the present invention includes, for example, an optical element portion, and a support portion having a first adherend surface that is adhered to a mounting surface of a base via an adhesive, supporting the optical element portion, and provided with an optical opening adjacent to the first adherend surface that can pass light that hardens the adhesive.

[0023] In the optical component, the support portion may include a high-transmittance portion that transmits the light as the optical opening, and a low-transmittance portion that has a lower transmittance of the light than the high-transmittance portion.

[0024] In the optical component, the optical aperture may include a recess that is recessed in a direction along the first adherend surface.

[0025] In the optical component, the support portion may have a plurality of support sites aligned in a direction intersecting the mounting surface and bonded to one another. Effect of the Invention

[0026] According to the present invention, for example, in an optical device in which an optical component is bonded onto a mounting surface of a base with a photocurable adhesive, a novel configuration can be obtained that makes it easier to obtain a better bonded state. [Brief description of the drawings]

[0027] [Figure 1] FIG. 1 is an illustrative schematic side view of the optical device according to the first embodiment. [Diagram 2] FIG. 2 is an illustrative schematic side view of the optical device according to the first modified example. [Diagram 3] FIG. 3 is an illustrative schematic side view of an optical device according to a second modified example. [Figure 4] FIG. 4 is an illustrative schematic side view of an optical device according to a third modified example. [Diagram 5] FIG. 5 is an illustrative schematic side view of an optical device according to a fourth modified example. [Figure 6] FIG. 6 is an illustrative schematic side view of an optical device according to a fifth modified example. [Figure 7] FIG. 7 is an illustrative schematic side view of an optical device according to a sixth modified example. [Figure 8] FIG. 8 is an illustrative schematic side view of the optical device according to the seventh modified example. [Figure 9] FIG. 9 is an illustrative schematic side view of an optical device according to an eighth modified example. [Figure 10] FIG. 10 is an illustrative schematic side view of an optical device according to a ninth modified example. [Figure 11] FIG. 11 is an illustrative schematic side view of an optical device according to a tenth modified example. [Figure 12] FIG. 12 is an illustrative schematic side view of an optical device according to an eleventh modified example. [Figure 13] FIG. 13 is an illustrative schematic side view of an optical device according to a twelfth modified example. [Figure 14] FIG. 14 is an illustrative schematic side view of an optical device according to a thirteenth modified example. [Figure 15]FIG. 15 is an exemplary schematic side view showing the internal configuration of the optical device according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Exemplary embodiments and modifications of the present invention are disclosed below. The configurations of the embodiments and modifications shown below, as well as the actions and results (effects) brought about by the configurations, are merely examples. The present invention can be realized by configurations other than those disclosed in the following embodiments and modifications. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derivative effects) obtained by the configurations.

[0029] The embodiments and modifications shown below have similar configurations. Therefore, according to the configurations of the embodiments and modifications, similar actions and effects based on the similar configurations can be obtained. In the following, the similar configurations are given the same reference numerals, and duplicated descriptions may be omitted.

[0030] In this specification, ordinal numbers are given for the sake of convenience to distinguish between parts, portions, etc., and do not indicate a priority order or sequence.

[0031] In each figure, the X direction is represented by an arrow X, the Y direction is represented by an arrow Y, and the Z direction is represented by an arrow Z. The X direction, Y direction, and Z direction intersect with each other and are perpendicular to each other. The X direction and Y direction are also referred to as the extension direction of the mounting surface, and the Z direction can also be referred to as the height direction, thickness direction, arrangement direction of the support parts, or the perpendicular direction (normal direction) of the mounting surface.

[0032] [First embodiment] Fig. 1 is a side view of an optical device 100A according to the present embodiment. As shown in Fig. 1, the optical device 100A includes a substrate 10 and an optical component 20A.

[0033] The substrate 10 extends in a direction intersecting with the Z direction. In this embodiment, the substrate 10 extends in the X direction and the Y direction, and is perpendicular to the Z direction. The substrate 10 also has a base surface 10a. The base surface 10a has a planar shape and extends in a direction intersecting with the Z direction. In this embodiment, the base surface 10a extends in the X direction and the Y direction, and is perpendicular to the Z direction. The substrate 10 is made of, for example, a metal material or a ceramic material. The substrate 10 is an example of a base, and the base surface 10a is an example of a mounting surface.

[0034] The optical component 20A includes an optical element portion 21 and a support portion 220.

[0035] The optical element section 21 is a section that optically acts on light such as laser light. In this embodiment, the optical element section 21 is, for example, a lens such as a convex lens. However, the optical element section 21 is not limited to this, and may be, for example, another lens such as a concave lens, or an optical element other than a lens such as a prism or a mirror. In this embodiment, light passes through the optical element section 21 in the X direction.

[0036] The support portion 220 supports the optical element portion 21. The support portion 220 has a rectangular parallelepiped shape. The support portion 220 has a bottom surface 220a, a top surface 220b, and side surfaces 220c.

[0037] The bottom surface 220a has a rectangular and planar shape, and spreads out so as to intersect with the Z direction. In this embodiment, the bottom surface 220a extends in the X direction and the Y direction, and is perpendicular to the Z direction.

[0038] The bottom surface 220a faces the base surface 10a of the substrate 10. A first adhesive layer 23 is interposed between the base surface 10a and the bottom surface 220a.

[0039] The first adhesive layer 23 bonds the base surface 10a and the bottom surface 220a. In other words, the bottom surface 220a is bonded to the base surface 10a via the first adhesive layer 23. The base surface 10a is an example of a mounting surface, and the bottom surface 220a is an example of a first bonded surface.

[0040] The first adhesive layer 23 is, for example, a light-curing adhesive such as an ultraviolet-curing adhesive. The first adhesive layer 23 may be an adhesive that is cured by light other than ultraviolet light, such as visible light. The first adhesive layer 23 is an example of a first adhesive.

[0041] The top surface 220b has a rectangular and planar shape, and spreads out crossing the Z direction. In this embodiment, the top surface 220b extends in the X direction and the Y direction, and is perpendicular to the Z direction.

[0042] Moreover, the support portion 220 has, as the side surfaces 220c, two side surfaces 220c1 and two side surfaces 220c2.

[0043] The two side surfaces 220c1 are located at an end in the X direction and an end in the opposite direction to the X direction. The side surfaces 220c1 have a rectangular shape and a planar shape, respectively, and extend across the X direction. In this embodiment, the side surfaces 220c1 extend in the Y direction and the Z direction and are perpendicular to the X direction.

[0044] Two side surfaces 220c2 perpendicular to the two side surfaces 220c1 are located at an end in the Y direction and an end in the opposite direction to the Y direction. The side surfaces 220c2 have a rectangular shape and a planar shape, respectively, and extend across the Y direction. In this embodiment, the side surfaces 220c2 extend in the X direction and the Z direction and are perpendicular to the Y direction.

[0045] Moreover, the support portion 220 includes a first support portion 221, a second support portion 222, and a second adhesive layer 223. The first support portion 221 and the second support portion 222 are examples of the support portion.

[0046] The first support portion 221 has a rectangular parallelepiped shape. The first support portion 221 has a bottom surface 220a, a part of a side surface 220c, and a top surface 221a.

[0047] The top surface 221a has a rectangular and planar shape, and spreads out so as to intersect with the Z direction. In this embodiment, the top surface 221a extends in the X direction and the Y direction, and is perpendicular to the Z direction.

[0048] The second support portion 222 has a rectangular parallelepiped shape. The second support portion 222 has a top surface 220b, a part of a side surface 220c, and a bottom surface 222a.

[0049] The bottom surface 222a has a rectangular and planar shape, and spreads out so as to intersect with the Z direction. In this embodiment, the bottom surface 222a extends in the X direction and the Y direction, and is perpendicular to the Z direction.

[0050] The top surface 221a of the first support portion 221 and the bottom surface 222a of the second support portion 222 face in the Z direction. A second adhesive layer 223 is interposed between the top surface 221a and the bottom surface 222a. The second adhesive layer 223 bonds the top surface 221a and the bottom surface 222a together. That is, the first support portion 221 and the second support portion 222 are aligned in the Z direction, i.e., in a direction intersecting and perpendicular to the base surface 10a, and are bonded together by the second adhesive layer 223.

[0051] The second adhesive layer 223 may be a non-photocurable adhesive, or may be a photocurable adhesive like the first adhesive layer 23. In the case of a photocurable adhesive, the second adhesive layer 223 may be an adhesive that is cured by light other than ultraviolet light, such as visible light. The second adhesive layer 223 is an example of a second adhesive. Note that the first support portion 221 and the second support portion 222 may be bonded to each other by a bonding method other than adhesion, such as welding or mechanical bonding.

[0052] In this embodiment, an optical component 20A having a support portion 220 in which a first support portion 221 and a second support portion 222 are integrated by a second adhesive layer 223, and an optical element portion 21 is mounted on a base surface 10a via a first adhesive layer 23. After adjusting the position and posture of the optical component 20A before the first adhesive layer 23 is cured, the first adhesive layer 23 is irradiated with curing light CL, and the first adhesive layer 23 is cured.

[0053] In this embodiment, the second support portion 222 and the optical element portion 21 are integrally formed from the same material. The second support portion 222 and the optical element portion 21 are made of, for example, silicon. For this reason, when the light CL capable of curing the first adhesive layer 23 (hereinafter simply referred to as curing light CL) is ultraviolet light or visible light, the curing light CL is unlikely to transmit through the second support portion 222 and the optical element portion 21. The curing light CL is irradiated from an optical head (not shown) positioned away from the base surface 10a in the Z direction in an inclined direction with respect to the base surface 10a, that is, in an inclined direction between the opposite direction to the Z direction and the Y direction or the opposite direction to the Y direction.

[0054] On the other hand, in this embodiment, the first support portion 221 is made of, for example, glass or acrylic. Therefore, when the curing light CL is ultraviolet light or visible light, the curing light CL easily passes through the first support portion 221. That is, the first support portion 221 has a higher transmittance (transmittance) of the light than the second support portion 222, in other words, the second support portion 222 has a lower transmittance (transmittance) of the light than the first support portion 221. The first support portion 221 is an example of a high transmittance portion, and the second support portion 222 is an example of a low transmittance portion. The first support portion 221 may also be referred to as a transparent portion, and the second support portion 222 may also be referred to as an opaque portion. In addition, the first support portion 221 may be said to be an optical opening portion for the curing light CL provided in the support portion 220.

[0055] In addition, the first support portion 221 includes a bottom surface 220a. In other words, the first support portion 221 is adjacent to the bottom surface 220a. Therefore, as shown in FIG. 1, a part of the curing light CL can pass through the first support portion 221 and reach the first adhesive layer 23.

[0056] As described above, in this embodiment, optical component 20A has optical element portion 21 and support portion 220. Support portion 220 is provided with first support site 221 (optical opening) adjacent to bottom surface 220a (first adhered surface).

[0057] According to such a configuration, the curing light CL can reach the first adhesive layer 23 (first adhesive) by transmitting through the first supporting portion 221. Therefore, compared to a configuration in which the supporting part 220 does not have the first supporting portion 221 and has only the second supporting portion 222 through which the curing light CL is less likely to transmit, the curing light CL can be irradiated over a wider range of the first adhesive layer 23, and thus the adhesive strength of the first adhesive layer 23 is more likely to be increased.

[0058] In addition, in this embodiment, the support portion 220 has, for example, a first support portion 221 (high transmittance portion) that transmits the curing light CL as an optical opening, and a second support portion 222 (low transmittance portion) that has a lower transmittance (transmittance rate) of the curing light CL than the first support portion 221.

[0059] According to such a configuration, for example, a support portion 220 having an optical opening adjacent to a bottom surface 220a (first adherend surface) can be realized as a relatively simple configuration having a first support portion 221 and a second support portion 222.

[0060] In this embodiment, the support portion 220 has, for example, a first support portion 221 and a second support portion 222 (plurality of support portions) aligned in the Z direction (a direction intersecting the base surface 10a (mounting surface)) and bonded to each other.

[0061] According to such a configuration, for example, the support section 220 having a plurality of portions with different light transmittance can be realized with a relatively simple configuration.

[0062] [First Modification] Fig. 2 is a side view of an optical device 100B according to a first modified example. As shown in Fig. 2, the optical device 100B includes a substrate 10 and an optical component 20B.

[0063] However, in this embodiment, the optical component 20B is mounted on a metallized layer 31 provided on the base surface 10a of the substrate 10 via a first adhesive layer 23. The metallized layer 31 is provided on the base surface 10a. The metallized layer 31 extends along the base surface 10a and extends intersecting the Z direction. In this embodiment, the metallized layer 31 extends in the X direction and the Y direction and is perpendicular to the Z direction.

[0064] The metallization layer 31 is made of a metal material such as copper or a copper alloy, and is configured so as to be able to reflect the curing light CL on its surface. The metallization layer 31 can be made by, for example, sputtering or vapor deposition.

[0065] The first adhesive layer 23 is adjacent to the metallized layer 31. In other words, the metallized layer 31 is adjacent to the first adhesive layer 23 in the opposite direction to the Z direction. That is, the metallized layer 31 is adjacent to the first adhesive layer 23 in the opposite direction to an optical head (not shown) that emits the curing light CL. Therefore, a portion of the curing light CL reflected by the metallized layer 31 can reach the first adhesive layer 23.

[0066] In this embodiment, the metallized layer 31 protrudes outward from the first adhesive layer 23 along the base surface 10a. Furthermore, the metallized layer 31 is provided adjacent to the first support portion 221. For this reason, as shown in FIG. 2, a part of the curing light CL reflected by the metallized layer 31 can enter the first support portion 221, pass through the first support portion 221, and reach the second adhesive layer 223. In addition, the curing light CL that is not absorbed by the first adhesive layer 23 and passes through the first adhesive layer 23, i.e., the remaining curing light CL, may be reflected by the metallized layer 31 and enter the first adhesive layer 23 again, or may further pass through the first adhesive layer 23 and the first support portion 221 to reach the second adhesive layer 223. In the following, the curing light CL that enters the first adhesive layer 23 or the second adhesive layer 223 and remains without being absorbed is referred to as the remaining light.

[0067] As described above, in this modified example, the optical device 100B includes the metallized layer 31 (mirror) that reflects light toward the first adhesive layer 23 (first adhesive).

[0068] In this modification, the optical device 100B further includes a metallized layer 31 adjacent to the first adhesive layer 23.

[0069] With such a configuration, for example, the curing light CL can more easily reach the first adhesive layer 23 compared to when the metallized layer 31 is not present, which in turn provides advantages such as the first adhesive layer 23 being more easily cured, curing more reliably, or the range over which it becomes harder being increased.

[0070] In this modification, the metallized layer 31 is provided on the base surface 10a (mounting surface).

[0071] According to such a configuration, for example, the metallization layer 31 can be provided more easily or more reliably.

[0072] In this modification, the second adhesive layer 223 (second adhesive) is a photocurable adhesive, and the optical component 20B includes a metallized layer 31 (mirror) that reflects light toward the second adhesive layer 223.

[0073] According to such a configuration, for example, the curing light CL can more easily reach the second adhesive layer 223 compared to when the metallized layer 31 is not present, which in turn has the advantage that the second adhesive layer 223 is more easily cured, cured more reliably, or the range over which it becomes harder is increased.

[0074] In this modification, the metallized layer 31 is provided adjacent to the first support portion 221 (optical aperture portion).

[0075] According to such a configuration, for example, the curing light CL reflected by the metallized layer 31 can pass through the first support portion 221 and reach the second adhesive layer 223, making it easier for the curing light CL to reach the second adhesive layer 223, and thus obtaining advantages such as the second adhesive layer 223 being easier to cure, curing more reliably, or the range in which it becomes harder being increased.

[0076] [Second modified example] 3 is a side view of an optical device 100C according to a second modified example. As shown in FIG. 3, the optical device 100C includes a substrate 10, an optical component 20B having a configuration similar to that of the first modified example, and a component 41.

[0077] The component 41 is mounted on the base surface 10a. The component 41 may be an optical component or a non-optical component. The component 41 is an example of another component.

[0078] The component 41 has a side surface 41a facing the optical component 20B. On the side surface 41a, a metallization layer 32 that reflects the curing light CL is provided. The metallization layer 32 has a rectangular shape and a planar shape, and spreads across the Y direction. In this embodiment, the metallization layer 32 extends in the X direction and the Z direction, and is perpendicular to the Y direction. The metallization layer 32 can be made of the same material as the metallization layer 31, and can be made by the same manufacturing method as the metallization layer 31. The component 41 having the metallization layer 32 provided on the side surface 41a is mounted on the base surface 10a. In this modified example, the metallization layer 32 is provided on the side surface 41a, but is not limited thereto, and may be provided in another location, such as the top surface of the component 41.

[0079] The metallized layer 32 faces the first adhesive layer 23 and the second adhesive layer 223. Therefore, as shown in Fig. 3, a part of the curing light CL reflected by the metallized layer 32 can reach the first adhesive layer 23 and the second adhesive layer 223. At this time, a part of the curing light CL passes through the first support portion 221 and reaches the first adhesive layer 23. That is, the metallized layer 32 reflects the curing light CL so as to be directed toward the first adhesive layer 23 via the first support portion 221.

[0080] The metallized layer 32 also faces the metallized layer 31. For this reason, as shown in FIG. 3 , a part of the curing light CL reflected by the metallized layer 32 is further reflected by the metallized layer 31, enters the first support portion 221, passes through the first support portion 221, and can reach the second adhesive layer 223.

[0081] As described above, in this modified example, the optical device 100C includes the component 41 (another component) mounted on the base surface 10a, and the component 41 is provided with the metallized layer 32 (mirror).

[0082] According to such a configuration, for example, compared to a case where there is no metallized layer 32, the curing light CL can reach the first adhesive layer 23 or the second adhesive layer 223 more easily, and as a result, the first adhesive layer 23 or the second adhesive layer 223 can be cured more easily, more reliably, or the range in which it becomes hardened can be increased. Also, by utilizing the components 41 mounted on the base surface 10a, the metallized layer 32 can be positioned in a more suitable position in some cases.

[0083] Furthermore, in this modified example, the metallized layer 32 reflects the curing light CL toward the first adhesive layer 23 via the first support portion 221 (optical aperture portion).

[0084] According to such a configuration, for example, the curing light CL can more easily reach the first adhesive layer 23, and thus, compared to a case in which the metallized layer 32 and the first support portion 221 are not present, the first adhesive layer 23 can be cured more easily, can be cured more reliably, or the range in which the layer becomes harder can be increased.

[0085] The other component on which the metallized layer 32 is provided may be, for example, (the wall of) a case that houses the optical device 100C, a component attached to the case, or a component that is not mounted on the substrate 10.

[0086] [Third Modification] Fig. 4 is a side view of an optical device 100D according to a third modified example. As shown in Fig. 4, the optical device 100D includes a substrate 10 and an optical component 20D.

[0087] As shown in FIG. 4, the optical component 20D of this modification includes a metallized layer 33 that is adjacent to the second adhesive layer 223 and reflects the curing light CL. The metallized layer 33 is adjacent to the second adhesive layer 223 in the opposite direction to the Z direction. In other words, the metallized layer 33 is provided between the second adhesive layer 223 and the first support portion 221. Thus, a portion of the curing light CL reflected by the metallized layer 33 enters the second adhesive layer 223. The metallized layer 33 can be made of the same material as the metallized layer 31 and can be made by the same manufacturing method as the metallized layer 33. The first support portion 221, on whose top surface 221a the metallized layer 32 is provided, and the second support portion 222 are joined via the second adhesive layer 223.

[0088] Such a configuration has the advantage that, for example, the second adhesive layer 223 hardens more easily, hardens more reliably, or the range in which it hardens is increased, compared to a case in which the metallized layer 33 is not provided.

[0089] [Fourth Variation] 5 is a side view of an optical device 100E according to a fourth modified example. The optical device 100E according to this modified example includes a substrate 10, an optical component 20D having a configuration similar to that of the third modified example, and a component 41 having a configuration similar to that of the second modified example.

[0090] According to this configuration, for example, the same effect as that of the third modified example using the metallized layer 33 and the same effect as that of the second modified example using the metallized layer 32 provided on the component 41 can be obtained.

[0091] [Fifth Modification] 6 is a side view of an optical device 100F of a fifth modified example. The optical device 100F of this modified example includes a substrate 10 having a metallized layer 31 provided on a base surface 10a, an optical component 20F having a metallized layer 34 that reflects the curing light CL, and a component 41 having a configuration similar to that of the second modified example.

[0092] The metallization layer 34 has a rectangular and planar shape and extends across the Z direction. In this embodiment, the metallization layer 34 extends in the X direction and the Y direction and is perpendicular to the Z direction. The metallization layer 34 can be made of the same material as the metallization layer 31 and can be made by the same manufacturing method as the metallization layer 31.

[0093] The metallized layer 34 is adjacent to the second adhesive layer 223. However, in this modification, the metallized layer 34 is adjacent to the second adhesive layer 223 in the Z direction. In other words, the metallized layer 34 is located on the opposite side to the metallized layer 31 with respect to the first support portion 221 and the second adhesive layer 223. Thus, the first adhesive layer 23 and the second adhesive layer 223 sandwich the first support portion 221 in the Z direction, and further, the metallized layer 31 and the metallized layer 34 sandwich the first adhesive layer 23, the second adhesive layer 223, and the first support portion 221 in the Z direction.

[0094] As described above, in this modified example, the optical device 100F includes the metallized layer 31 and the metallized layer 34 that are provided with the first support portion 221 therebetween.

[0095] According to such a configuration, for example, the curing light CL and the residual light can reach a portion of the first adhesive layer 23 and the second adhesive layer 223 that is farther from the side surface 220c1 of the optical component 20F while repeatedly reflecting off the metallized layers 31, 34 and passing through the first support portion 221. This provides advantages such as, for example, the first adhesive layer 23 or the second adhesive layer 223 being more easily cured, being more reliably cured, or the range that becomes harder being increased.

[0096] In addition, in this modified example, since the curing light CL reflected by the metallized layers 31, 32, 34 can easily reach the first adhesive layer 23, the optical component 20F in which the first support portion 221 and the second support portion 222 are integrated in advance via the second adhesive layer 223 may be mounted on the base surface 10a of the substrate 10.

[0097] Furthermore, when mounting optical component 20F in which first support portion 221 and second support portion 222 are integrated in advance via second adhesive layer 223 on base surface 10a of substrate 10, the positions of metallized layer 33 and second adhesive layer 223 may be interchanged. That is, metallized layer 33 may be provided so as to contact first support portion 221 as an optical opening portion.

[0098] [Sixth Modification] 7 is a side view of an optical device 100G according to a sixth modified example. An optical component 20G according to this modified example has a first support portion 221G as a low transmittance portion instead of the first support portion 221 as a high transmittance portion of optical component 20D according to the third modified example.

[0099] However, in this modification, similarly to the third modification, the optical component 20G includes a metallized layer 33 that reflects the curing light CL adjacent to the second adhesive layer 223. Therefore, for example, the curing light CL can more easily reach the second adhesive layer 223, which in turn provides advantages such as the second adhesive layer 223 being more easily cured, being cured more reliably, or the range in which the layer becomes harder being increased, compared to a case in which the metallized layer 33 is not provided.

[0100] In this case, the first support portion 221 having the metallized layer 34 provided thereon may be mounted on the base surface 10a of the substrate 10 via a first adhesive layer 23 that is not photocurable, and the second support portion 222 may be adhered to the metallized layer 34 via a second adhesive layer 223 that is photocurable. In general, the curing light CL emitted from an optical head (not shown) that is farther away from the base surface 10a in the Z direction is less likely to reach a position closer to the base surface 10a due to being blocked by the optical component 20G or other components (not shown). In this respect, according to this modified example, the second adhesive layer 223 that needs to be irradiated with the curing light CL can be moved farther away from the base surface 10a, and therefore, for example, the optical component 20G can be more easily or more reliably mounted on the base surface 10a.

[0101] [Seventh Variation] 8 is a side view of an optical device 100H according to a seventh modified example. An optical component 20H according to this modified example has a first support portion 221H as a low transmittance portion instead of the first support portion 221 as the high transmittance portion of the optical component 20A according to the first embodiment.

[0102] In this modification, similarly to the third modification, a component 41 having a metallized layer 32 is mounted on the base surface 10a. The metallized layer 32 faces the second adhesive layer 223. Therefore, as shown in FIG. 8, a part of the curing light CL reflected by the metallized layer 32 can reach the second adhesive layer 223.

[0103] According to such a configuration, for example, it is possible to obtain an effect similar to that of the sixth modified example, in which the photocurable second adhesive layer 223 is positioned away from the base surface 10a, and an effect similar to that of the second modified example obtained by the metallization layer 32.

[0104] [Eighth Modification] 9 is a side view of an optical device 100I according to an eighth modified example. The optical device 100I according to this modified example includes the optical component 20G according to the sixth modified example instead of the optical component 20H of the optical device 100H according to the seventh modified example.

[0105] According to such a configuration, for example, it is possible to obtain the same effect as the sixth modified example using a metallized layer 34 adjacent to the photocurable second adhesive layer 223, and the same effect as the second modified example using a metallized layer 32 provided on the component 41.

[0106] [Ninth Variation] 10 is a side view of an optical device 100J according to a ninth modified example. The optical device 100J according to this modified example includes an optical component 20J as an array lens instead of the optical component 20F of the optical device 100F according to the fifth modified example.

[0107] The support portion 220 has a plurality of optical element portions 21 as lens portions spaced apart in the Y direction. Even with this configuration, the same effects as those of the fifth modified example can be obtained.

[0108] [Tenth Modification] 11 is a side view of optical device 100K of a tenth modified example. Support 220 of optical component 20K of this modified example is provided with two recesses 224K as optical openings. Recesses 224K are recessed in the Y direction or the opposite direction to the Y direction along base surface 10a from an end of side surface 220c2 of support 220 close to base surface 10a, in other words, an end on the opposite side in the Z direction. In this modified example, the height of recesses 224K in the Z direction is approximately constant.

[0109] According to such a configuration, for example, by providing a recess 224K as an optical opening in the support portion 220, it is possible to prevent the curing light CL from being blocked by the support portion 220 at the portion where the recess 224K is provided, so that the curing light CL can more easily reach the first adhesive layer 23, thereby obtaining advantages such as the first adhesive layer 23 being more easily cured, curing more reliably, or the range in which it becomes harder being increased.

[0110] [Eleventh Modification] 12 is a side view of an optical device 100L of an eleventh modified example. A recess 224L is provided in the support 220 of the optical component 20L of this modified example instead of the recess 224K of the tenth modified example. The height of the recess 224L in the Z direction gradually decreases with increasing distance from the side surface 220c2 of the support 220. Even with this configuration, it is possible to prevent the support 220 from blocking the curing light CL at the portion where the recess 224L is provided, thereby obtaining the same effect as the tenth modified example.

[0111] [Twelfth Modification] 13 is a side view of an optical device 100M of a twelfth modified example. In the optical device 100M of this modified example, a mirror surface area 51a1 is provided on the inner surface 51a of the side wall 51 of the case 50, instead of the metallized layer 32 and the component 41 of the optical device 100C of the second modified example. The mirror surface area 51a1 can reflect the curing light CL toward the first adhesive layer 23 and the second adhesive layer 223, similar to the metallized layer 32. The mirror surface area 51a1 can be realized relatively easily by partially mirror-finishing a part of the inner surface 51a of the side wall 51. The mirror surface area 51a1 is an example of a mirror.

[0112] [13th Variation] 14 is a side view of an optical device 100P according to a thirteenth modified example. As shown in Fig. 14, the optical device 100P according to this modified example includes a substrate 10 and an optical component 20A having the same configurations as those in the first embodiment, and a component 41P (another component).

[0113] However, in this modification, the component 41P is made of a material that transmits the curing light CL, such as glass or acrylic. Therefore, the curing light CL can reach the first adhesive layer 23 or the second adhesive layer 223 by transmitting the component 41P. With such a configuration, for example, the curing light CL may reach the first adhesive layer 23 or the second adhesive layer 223 more easily. The component 41P is an example of a transparent member. Note that in this modification, the entire component 41P is made of a material that transmits the curing light CL, but this is not limited thereto, and it is sufficient that at least a part of the component 41P transmits the curing light CL. In addition, the component 41P may be, for example, (a wall of) a case that houses the optical device 100P, a component such as a window member attached to the case or another component, or a component that is not mounted on the substrate 10. In addition, although not shown, the optical device 100P may be configured such that the curing light CL reaches the first adhesive layer 23 or the second adhesive layer 223 via at least one of the metallized layers 31 to 34 and the component 41P. In this case, the layout of the metallized layers 31-34 and the component 41P, the number of metallized layers 31-34 through which the curing light CL passes, the order in which the curing light CL passes through the metallized layers 31-34 and the component 41P, etc. can be set in various ways.

[0114] [Second embodiment] Fig. 15 is a side view showing the internal configuration of the optical device 100N. As shown in Fig. 15, the optical device 100N includes a case 110, a base 120 housed in the case 110, a waveguide element 131, a lens 132, a light emitting element 141, a lens 142, an optical isolator 151, and a beam splitter 152.

[0115] The base 120 functions as a base for the optical components, and adjusts the temperature of the optical components by heating or cooling the optical components. The base 120 may also be called a Peltier module or a thermoelectric module.

[0116] The light-emitting element 141, which is an optical functional element, is, for example, a wavelength-tunable laser element. The light-emitting element 141 is mounted on the upper surface 120a of the base 120 via a carrier 143. The carrier 143 is made of an insulating material with high thermal conductivity, and transfers heat generated by the light-emitting element 141 to the base 120. The carrier 143 may also be referred to as a submount.

[0117] The light emitting element 141 outputs a laser beam toward the lens 142. The wavelength of the laser beam is, for example, not less than 900 nm and not more than 1650 nm, which is a suitable wavelength for optical communication.

[0118] The lens 142 is attached to a carrier 143. The lens 142 collimates the laser light from the light emitting element 141 by using the refractive index. The laser light output from the lens 142 is input to an optical isolator 151.

[0119] The optical isolator 151 has a magnet 151a and an optical element section 151b including a magneto-optical element and a polarizing plate. The optical isolator 151 polarizes the laser light from the optical element section 151b and exerts a magneto-optical effect on the laser light from the optical element section 151b. The laser light output from the optical isolator 151 is input to the beam splitter 152. The optical isolator 151 prevents the light from the beam splitter 152 from passing toward the light emitting element 141.

[0120] The beam splitter 152 outputs the laser light from the optical isolator 151 to the outside of the optical device 100N, and also splits the laser light from the optical isolator 151 into separate beams and inputs them to a monitor (not shown).

[0121] Furthermore, the light emitting element 141 outputs a backward laser beam having a relatively low power toward the opposite side to the lens 142. The lens 132 collects the backward laser beam and outputs it to the waveguide element 131.

[0122] The waveguide element 131 is, for example, a planar lightwave circuit element, and includes a ring filter whose transmission characteristics change periodically with respect to wavelength. The waveguide element 131 splits the rear laser light, guides one of the beams and outputs it to a monitor (not shown), and transmits the other beam through the ring filter and outputs it to a monitor (not shown).

[0123] In such a configuration, the lenses 132, 142 can be configured as the optical component 20A having the first support portion 221, the second support portion 222, and the optical element portion 21 as in the first embodiment. The base 120 and the carrier 143 are an example of a base. The lenses 132, 142 may be configured as the optical components 20B to 20L of the first to twelfth modified examples.

[0124] Therefore, this embodiment can also provide the same effects as those of the first embodiment and the first to twelfth modified examples using the optical components 20A to 20L.

[0125] Although the embodiment and the modified examples of the present invention have been illustrated above, the above-mentioned embodiment and the modified examples are merely examples and are not intended to limit the scope of the invention. The above-mentioned embodiment and the modified examples can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the gist of the invention. In addition, the specifications of each configuration, shape, and the like (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be appropriately changed and implemented.

[0126] For example, the present invention can be applied to optical devices of different types from the optical devices disclosed in the embodiments and modifications. [Industrial Applicability]

[0127] The present invention can be used in optical devices and optical components. [Explanation of symbols]

[0128] 10...Substrate 10a...Base surface (mounting surface) 20A~20L...Optical components 21...Optical element section 23...First adhesive layer (first adhesive) 31...Metallized layer (mirror) 32...Metallized layer (mirror) 33...Metallized layer (mirror) 34...Metallized layer (mirror) 41...Parts (another parts) 41P…Parts (transparent material) 41a...side 50…case 51...Side wall 51a…Inside 51a1...Mirror area (mirror) 100A~100N,100P…Optical device 110…Case 120…base 120a…Top surface 131...Waveguide element 132...Lens 141...Light emitting element 142...Lens 143…Carrier (base) 151...Optical isolator 151a...Magnet 151b...Optical element section 152…Beam splitter 220...Support part 220a…Bottom surface (first adhered surface) 220b…Top surface 220c…side 220c1…side 220c2…side 221...First support part (high transmission part, optical aperture) 221G, 221H…First support part (low transmission part) 221a...Top surface 222…Second support part (low permeability part) 222a…Bottom surface 223...Second adhesive layer (second adhesive) 224K, 224L…Concave (optical aperture) CL…Curing light X…direction Y...Direction Z...direction (direction intersecting with mounting surface)

Claims

1. a base having a mounting surface; an optical component having an optical element portion and a support portion that supports the optical element portion; the support portion has a first adherend surface that is adhered to the mounting surface via a light-curable first adhesive, a first support portion that is adjacent to the first adherend surface and forms an optical opening through which light that cures the first adhesive can pass, and a second support portion that is integrally molded from the same material as the optical element portion; the first support portion and the second support portion are aligned in a direction intersecting the mounting surface and are bonded to each other via a second photocurable adhesive; An optical device comprising a mirror that reflects light to cure at least one of the first adhesive and the second adhesive.

2. An optical device as described in claim 1, comprising as the mirrors: a mirror provided on the mounting surface and adjacent to the first adhesive, and a mirror provided between the first support portion and the second support portion.

3. An optical device as described in claim 1 or 2, wherein the optical opening is a high-transmittance portion that transmits the light, and the second support portion is a low-transmittance portion having a lower transmittance of the light than the high-transmittance portion.

4. The optical device according to claim 1 , wherein the optical aperture portion includes a recess that is recessed in a direction along the first adhered surface.

5. The optical device of claim 2 , wherein the mirror comprises a mirror adjacent to the first adhesive.

6. 6. The optical device of claim 2 or 5, comprising a mirror that reflects the light through the optical aperture toward the first adhesive.

7. An optical device described in any one of claims 2, 5, or 6, comprising a mirror provided on the mounting surface as the mirror.

8. 8. The optical device according to claim 2, further comprising a mirror disposed adjacent to the optical aperture as the mirror.

9. a component other than the optical component mounted on the mounting surface, 9. The optical device according to claim 2, wherein the mirror is a mirror provided on the separate component.

10. a case for accommodating the base and the optical component; 10. The optical device according to claim 2, wherein the mirror is provided on an inner surface of the case.

11. 11. The optical device according to claim 2, wherein the mirror comprises two mirrors disposed on either side of the optical aperture.

12. 7. The optical device according to claim 1, wherein the optical component is a lens array having a plurality of parallel lens portions as the optical element portion.

13. 7. The optical device according to claim 1, further comprising a transparent member that transmits the light toward the first adhesive, separate from the optical component.

14. a base having a mounting surface; an optical component having an optical element portion and a support portion that supports the optical element portion; the support portion has a first adherend surface that is adhered to the mounting surface via a light-curable first adhesive, a first support portion that is adjacent to the first adherend surface and forms an optical opening through which light that cures the first adhesive can pass, and a second support portion that is integrally molded from silicon, the same material as the optical element portion; the first support portion and the second support portion are aligned in a direction intersecting the mounting surface and are bonded to each other via a second photocurable adhesive; An optical device comprising a mirror that reflects light to cure at least one of the first adhesive and the second adhesive.

15. An optical element portion; a support portion that supports the optical element portion, the support portion has a first adherend surface that is adhered to a mounting surface of a base via a first adhesive, a first support portion that is adjacent to the first adherend surface and forms an optical opening through which light that cures the first adhesive can pass, and a second support portion that is integrally molded from the same material as the optical element portion; the first support portion and the second support portion are aligned in a direction intersecting the mounting surface and are bonded to each other via a second photocurable adhesive; An optical component comprising a mirror that reflects light to cure at least one of the first adhesive and the second adhesive.

16. An optical component as described in claim 15, comprising as the mirrors: a mirror provided on the mounting surface and adjacent to the first adhesive, and a mirror provided between the first support portion and the second support portion.

17. An optical component as described in claim 15 or 16, wherein the optical opening is a high-transmittance portion that transmits the light, and the second support portion is a low-transmittance portion having a lower transmittance for the light than the high-transmittance portion.

18. The optical component according to claim 15 or 16, wherein the optical aperture portion includes a recess that is recessed in a direction along the first adherend surface.

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