Hardening compound, hardening resin composition, hardened product, and laminate

Abstract

Provided are: a compound which, while being a curable resin, can make it possible to easily achieve quick dismantlability, repairability, reformability and the like in a cured product; a curable resin composition prepared using the compound; and a cured product of the composition. More specifically, there are used: a curable compound which is characterized by having a curable functional group at the end of a linear polymer having a flexible structure and further having a conjugated diene structure in a side chain; a curable compound as mentioned above, in which a parent diene compound is reversibly bound to the conjugated diene structure through the Diels-Alder reaction; and a curable resin composition characterized by containing one of the aforementioned compounds and a compound having reactivity with the curable functional group located at the end of the aforementioned curable compound.

Description

[Technical field]

[0001] The present invention relates to a curable compound having a specific structure, a curable resin composition containing the compound, a cured product, and a laminate containing a layer made of the cured product. [Background technology]

[0002] The cured products obtained by thermally curing phenolic resins, epoxy resins, etc., have excellent heat resistance, mechanical strength, electrical properties, adhesive properties, etc., and are indispensable materials in various fields such as electrical and electronics, paints, and adhesives.

[0003] On the other hand, cured products using thermosetting resins have low long-term reliability. For example, when a cured product of an epoxy resin deteriorates due to oxidation, cracks may occur.

[0004] In addition, the cured product obtained by curing the thermosetting resin once cannot be dissolved in a solvent (insoluble) and is also insoluble at high temperatures (infusible), making it difficult to recycle or reuse, and the cured product becomes waste after use, making it an issue to reduce waste and reduce the burden on the environment. Another issue is that the high adhesive performance limits the dismantling and reusability after use.

[0005] Therefore, there is a demand for cured products made from thermosetting resins that have a long life, reduce waste, and are reusable. To achieve this, it is considered effective to give them the ability to repair, reshape, and dismantle.

[0006] Against this background, a method has been disclosed in which a thermally decomposable compound is incorporated into a reactive adhesive component in advance, and then, after use, a certain amount of heat is applied to reduce the adhesive strength, making the product dismantlable (see, for example, Patent Document 1).

[0007] In addition, a method has been disclosed in which, even if cracks or peeling occur in a sealing material using an epoxy resin or the like, the sealing material can be made self-repairable by using microcapsule particles containing a first thermosetting resin and a precursor of a second thermosetting resin (see, for example, Patent Document 2).

[0008] In addition to the above, active research is being conducted on the use of reversible bonds such as dynamic covalent bonds and supramolecular bonds in hardened materials in order to impart repairability and reshapeability. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] JP 2013-256557 A [Patent Document 2] JP 2017-041496 A Summary of the Invention [Problem to be solved by the invention]

[0010] In the technology provided in Patent Document 1, the adhesive after dismantling is discarded, and although the substrate to be bonded can be recycled, there is a problem that the overall recyclability is insufficient. In addition, the technology in Patent Document 2 has a certain degree of self-repairability, but it is not a solution in terms of reuse, and the problem of waste when it becomes unnecessary remains. In addition, since it is necessary to ensure the molecular mobility of the raw materials used in the reversible bond, there is a problem that the raw materials used are limited to gel-like substances with poor mechanical strength, and improvements are currently required in both cases. Therefore, the object of the present invention is to provide a compound that is a curable resin and can easily realize easy dismantling, repairability, remolding, etc. in the cured product, and a curable resin composition and a cured product thereof made using the same. [Means for solving the problem]

[0011] Means for Solving the Problems The present inventors have conducted extensive research and found that the above-mentioned problems can be solved by using a curable compound having a specific structure as a curable resin composition, thereby completing the invention.

[0012] That is, the present invention includes the following aspects. [1] A curable compound having a curable functional group at the end of a linear polymer having a flexible structure and further having a conjugated diene structure in the side chain. [2] The curable compound according to [1], wherein the flexible structure has an alkylene chain or an alkylene ether chain. [3] The curable compound according to [1] or [2], wherein the curable functional group is a hydroxyl group or a glycidyl ether group, and the conjugated diene structure is a furan skeleton. [4] The curable compound according to [2] or [3], wherein the alkylene chain has 4 to 16 carbon atoms. [5] A curable compound represented by the following general formula (1):

[0013] [ka] [In formula (1), R represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group; Z 1 is as follows (Z 1 -1)~(Z 1 -7)

[0014] [ka]

[0015] [Formula(Z 1 -1), (Z 1 -2), (Z 1 -3), (Z 1 -4), (Z 1 -5), (Z 1 -6), (Z 1 -7) Medium, Each Ar independently represents a structure having an unsubstituted or substituted aromatic ring, R 11 , R 12 each independently represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R 13 , R 14 is a hydrogen atom or a methyl group, R 1 , R 2 each independently represents a hydrogen atom, a methyl group, or an ethyl group, R' are each independently a divalent hydrocarbon group having 2 to 12 carbon atoms; n is the average value of the repeating units and is 0.5 to 10; n1 is an integer from 4 to 16, n2 is the average value of the repeating units and is from 2 to 30. Formula(Z 1 X in -1 is represented by the following general formula (Z 1 -1-1), Y is a structural unit represented by the following general formula (Z 1 -1-2) is a structural unit represented by

[0016] [ka]

[0017] 〈Formula(Z 1 -1-1), (Z 1 -1-2) Medium, Ar, R 1 , R 2 , R', n1, and n2 are the same as above; R 3 , R 4 , R 7 , R 8 each independently represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R 5 , R 6 , R 9 , R 10 are each independently a hydrogen atom or a methyl group.

[0018] m1, m2, m3, m4, m5, m6, p1, p2, and q are the average values ​​of the repetitions. m1, m2, m3, m4, m5, and m6 each independently represent 0 to 25, and m1+m2≧1; p1 and p2 each independently represent 0 to 5; q is 0.5 to 5. However, the general formula (Z 1 -1-1 and X represented by the general formula (Z 1 The bonds with Y represented by -1-2) may be random or block, and the total numbers of the structural units X and Y present in one molecule are m1 and m2, respectively.

[0019] Z 2 is represented by the following general formula (Z2)

[0020] [ka] (Z 3 is a structure having a furan skeleton, R 15 , R 16 each independently represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R 17 , R 18 is a hydrogen atom or a methyl group. In each formula, * represents a bonding point. [6] A curable compound (II) containing a reversible bond formed by a Diels-Alder reaction between a conjugated diene structure in the curable compound (I) according to any one of the above [1] to [5] and a parent diene compound. [7] A curable compound (II) containing a reversible bond formed by a Diels-Alder reaction between the conjugated diene structure in the curable compound (I) according to any one of the above [1] to [5] and a parent diene compound; a compound (III) having reactivity with the terminal curable functional group in the curable compound (II); A curable resin composition comprising: [8] The terminal curable functional group in the curable compound (II) is a hydroxyl group, The curable resin composition according to [7], wherein the compound (III) reactive with the terminal curable functional group in the curable compound is an epoxy resin. [9] The terminal curable functional group in the curable compound (II) is a glycidyl ether group, The curable resin composition according to [7], wherein the compound (III) reactive with the terminal curable functional group in the curable compound is a curing agent for epoxy resins.

[10] The curable resin composition according to any one of [7] to [9], wherein a concentration of reversible bonds by Diels-Alder reaction relative to the total mass of the curable components in the curable resin composition is 0.10 mmol / g or more.

[11] The curable resin composition according to any one of [7] to

[10] , which is one or more compositions selected from the group consisting of an easily dismantlable composition, a repairable composition, and a remolding material composition.

[12] A cured product obtained by curing the curable resin composition according to any one of [7] to

[11] .

[13] A laminate having a substrate and a layer containing the cured product according to

[12] .

[14] A heat-resistant member containing the cured product according to

[12] .

[15] A curable compound (I) according to any one of the above [1] to [5], A diene parent compound; A compound (III) having reactivity with the terminal curable functional group in the curable compound; A curable resin composition comprising:

[16] The terminal curable functional group in the curable compound (I) is a hydroxyl group, The curable resin composition according to

[15] , wherein the compound (III) reactive with the terminal curable functional group in the curable compound is an epoxy resin.

[17] The terminal curable functional group in the curable compound (I) is a glycidyl ether group, The curable resin composition according to

[15] , wherein the compound (III) reactive with the terminal curable functional group in the curable compound is a curing agent for an epoxy resin.

[18] The curable resin composition according to any one of

[15] to

[17] , wherein a concentration of reversible bonds formed by a Diels-Alder reaction between a conjugated diene structure and a diene parent compound is 0.10 mmol / g or more relative to the total mass of the curable components in the curable resin composition.

[19] The curable resin composition according to any one of

[15] to

[18] , which is one or more compositions selected from the group consisting of an easily dismantlable composition, a repairable composition, and a remolding material composition.

[20] A cured product obtained by curing the curable resin composition according to any one of

[15] to

[19] .

[21] A laminate having a substrate and a layer containing the cured product according to

[20] .

[22] A heat-resistant member containing the cured product according to

[20] . Effect of the Invention

[0021] According to the present invention, it is possible to impart easy dismantling, repairability and remoldability to a cured product made of a curable resin composition, thereby contributing to extending the life of the cured product itself and reducing waste. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Next, the embodiments for carrying out the present invention will be described in detail. It should be understood that the present invention is not limited to the following embodiments, and that appropriate changes and improvements in the design may be made based on the ordinary knowledge of those skilled in the art without departing from the spirit of the present invention.

[0023] The curable compound according to one embodiment of the present invention is characterized in that it has a curable functional group at the end of a linear polymer having a flexible structure, and further has a conjugated diene structure in a side chain. The conjugated diene structure in the curable compound is a structure that enables reversible bonding by a Diels-Alder reaction with a compound having a diene parent structure described later.

[0024] By having such a structure, the curable compound is incorporated into the crosslinked structure by a curing reaction based on the curable functional group at its end. At this time, if a compound having a dienophilic structure is reversibly bonded to the curable compound in advance, or if a compound having a dienophilic structure is used in combination during the curing reaction, the crosslinked structure has reversibility even after the cured product is formed. For this reason, when the cured product is subjected to an impact, cracks are generated, or the product is crushed, the reversible bond is easily cut at the reversible bond portion, and easy dismantling is exhibited, while the reversible bond is reversibly remolded even in a low temperature range including room temperature, and functions such as repairability and remolding can be exhibited. For example, even if the cured product made using the curable compound of the present invention is crushed, the cured product can be easily repaired based on the reversible bond by placing it in a low temperature including room temperature or in a heated or heated state, and it is also possible to remold the cured product after crushing it.

[0025] Furthermore, the curable compound, which is one embodiment of the present invention, has a flexible structure in its main chain. By making the flexible structure essential, the cured product itself is given flexibility and toughness. Therefore, even in the field of use where cracks are likely to occur, it can absorb the impact, or even when used as an adhesive between substrates with different thermal expansion coefficients, it has the characteristic of excellent substrate followability. In addition, the manifestation of the easy dismantling and repairability due to the reversible bond described above also contributes to the durability of the cured product.

[0026] In addition, the linear polymer in the present invention may have a branched side chain having, for example, about 1 to 3 carbon atoms, or may have a plurality of branched side chains. The term "linear" refers to a skeleton having the longest number of covalently bonded atoms that is linear and is greater than the number of atoms in the branched side chain. In this case, the covalently bonded atoms do not only consist of carbon atoms, but may also contain other atoms that can be covalently bonded. Furthermore, the term "end of the linear polymer in the present invention" refers to the end of the linear structure, and may also include the end of the side chain. The term "having a conjugated diene structure in the side chain" refers to the presence of a conjugated diene structure at a site different from the covalently bonded atoms that form the linear polymer.

[0027] The linear polymer must contain a flexible structure, and examples of such flexible structures include partial structures that do not contain aromatic rings or alicyclic structures, such as alkylene chains and alkylene ether chains. In this case, the alkylene chain preferably has 2 to 30 carbon atoms, and most preferably has 4 to 16 carbon atoms. The alkylene ether chain is not particularly limited, but is preferably an alkylene ether chain having 2 to 12 carbon atoms, and the average number of repetitions is preferably in the range of 2 to 30. Furthermore, the flexible structure may have a plurality of identical or different structures in one molecule.

[0028] The curable compound of the present invention has a curable functional group at its end. This curable functional group can form a permanent crosslinked structure in the cured product by forming a covalent bond with another compound described later. The curable functional group is not particularly limited, and examples thereof include vinyl groups, epoxy groups, hydroxyl groups, isocyanate groups, and carboxyl groups. Among these, from the viewpoint of thermosetting and industrial availability of raw materials, as well as excellent balance of the heat resistance, water resistance, and moist heat resistance of the obtained cured product, a hydroxyl group or a glycidyl ether group which may have a substituent is preferable. In addition, from the viewpoint of industrial availability of raw materials and ease of adjustment of crosslink density when the product is cured, the number of curable functional groups in one molecule is preferably in the range of 1 to 5, more preferably 1 to 3, and most preferably 2.

[0029] In addition, the conjugated diene structure is preferably any structure capable of introducing a reversible bond by the Diels-Alder reaction, and examples thereof include aliphatic hydrocarbon skeletons such as 1,3-butadiene skeletons; aromatic hydrocarbon skeletons such as anthracene; cyclic dienes such as cyclopentadiene and dicyclopentadiene; and heterocyclic skeletons such as imidazole ring, furan ring, triazine ring, thiophene ring, and pyrrole ring. Among these, a structure derived from furan is preferable from the viewpoint of easy availability of raw materials. The number of conjugated diene structural units in one molecule may be single or multiple, and when there are multiple units, they may be the same structure or different structures.

[0030] Furthermore, the molecular weight of the curable compound, which is one embodiment of the present invention, is not particularly limited, and can be appropriately adjusted depending on the application of the curable composition using a dienophilic compound or a compound reactive with a curable functional group, which will be described later. For example, when the obtained curable composition is used for a solventless adhesive application, it is preferable that the composition has fluidity at room temperature, and from this viewpoint, the molecular weight of the curable compound is preferably in the range of 500 to 50,000 as a weight average molecular weight. In addition, from the viewpoint of the cured density of the obtained cured product, it is preferable to adjust the equivalent of the curable functional group, and for example, it is preferable that the epoxy equivalent in the case of having an epoxy group is in the range of 200 to 30,000 g / eq, and the hydroxyl equivalent in the case of having a hydroxyl group is in the range of 200 to 30,000 g / eq, from the viewpoint of ease of handling.

[0031] The curable compound according to one embodiment of the present invention is represented by the following general formula (1).

[0032] [ka]

[0033] [In formula (1), R represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group; Z 1 is as follows (Z 1 -1)~(Z 1 -7)

[0034] [ka]

[0035] [Formula(Z 1 -1), (Z 1 -2), (Z 1 -3), (Z 1 -4), (Z 1 -5), (Z 1 -6), (Z 1 -7) Medium, Each Ar independently represents a structure having an unsubstituted or substituted aromatic ring, R 11 , R 12 each independently represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R 13 , R 14 is a hydrogen atom or a methyl group, R 1 , R 2 each independently represents a hydrogen atom, a methyl group, or an ethyl group, R' are each independently a divalent hydrocarbon group having 2 to 12 carbon atoms; n is the average value of the repeating units and is 0.5 to 10; n1 is an integer from 4 to 16, n2 is the average value of the repeating units and is from 2 to 30. Formula(Z 1 X in -1 is represented by the following general formula (Z 1 -1-1), Y is a structural unit represented by the following general formula (Z 1 -1-2) is a structural unit represented by

[0036] [ka]

[0037] 〈Formula(Z 1 -1-1), (Z 1 -1-2) Medium, Ar, R 1 , R 2 , R', n1, and n2 are the same as above; R 3 , R 4 , R 7 , R 8 each independently represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R 5 , R 6 , R 9 , R 10 are each independently a hydrogen atom or a methyl group.

[0038] m1, m2, m3, m4, m5, m6, p1, p2, and q are the average values ​​of the repetitions. m1, m2, m3, m4, m5, and m6 each independently represent 0 to 25, and m1+m2≧1; p1 and p2 each independently represent 0 to 5; q is 0.5 to 5. However, the general formula (Z 1 -1-1 and X represented by the general formula (Z 1 The bonds with Y represented by -1-2) may be random or block, and the total numbers of the structural units X and Y present in one molecule are m1 and m2, respectively. Z 2 is represented by the following general formula (Z 2 )

[0039] [ka] (Z 3 is a structure having a furan skeleton, R 15 , R 16 each independently represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R 17 , R 18 is a hydrogen atom or a methyl group. In each formula, * represents a bonding point.

[0040] In the general formula, Ar is an aromatic ring which may have a substituent, and is not particularly limited. Examples of the aromatic ring include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. Examples of the substituent include a halogen atom, an alkoxy group, an aralkyloxy group, an aryloxy group, a nitro group, an amide group, an alkyloxycarbonyl group, an aryloxycarbonyl group, a cyano group, an alkyl group, a cycloalkyl group, an aralkyl group, and an aryl group. It is preferable that the substituent on Ar does not cause a curing reaction when used as a curable resin composition later, because the effect of the present invention is more easily expressed.

[0041] Among these, Ar is preferably any of the structures represented by the following structural formulas: In addition, the line in the formula indicates that the link may be at any point on the ring.

[0042] [ka] (The aromatic ring in the formula may be substituted or unsubstituted, and * represents a point of attachment.)

[0043] In addition, the structure represented by the following formula is also included as Ar.

[0044] [ka] (wherein the aromatic ring may be substituted or unsubstituted; n 6 = 1 to 4, and * represents a bonding point.)

[0045] The following structures are particularly preferred for Ar: * represents a bonding point.

[0046] [ka]

[0047] In the general formula, the repeating unit n1 is an integer of 2 to 16. When n1 is 4 or more, the deformation mode of the cured product is likely to be elastic deformation. When n1 is 16 or less, a decrease in crosslink density can be suppressed. It is preferably 4 to 15, and more preferably 6 to 12.

[0048] In the above general formula, R 1 , R 2 R are each independently a hydrogen atom, a methyl group, or an ethyl group, and are preferably a hydrogen atom. 13 , R 14 , R 5 , R 6 , R 9 , R 10 , R17 , R 18 is a hydrogen atom or a methyl group, and is preferably a hydrogen atom.

[0049] In the above general formula, n2 is the average value of the repeating units and is from 2 to 30. This range is preferable because it provides a good balance between the viscosity of the curable compound and the crosslink density of the resulting cured product. It is preferably from 2 to 25, and more preferably from 4 to 20.

[0050] In the above general formula, R' is a divalent hydrocarbon group having 2 to 12 carbon atoms. Within this range, the adhesive strength is improved and the deformation mode of the cured product tends to be elastic. Preferably, R' is a divalent hydrocarbon group having 2 to 6 carbon atoms.

[0051] The divalent hydrocarbon group is not particularly limited, and examples thereof include linear or branched alkylene groups, alkenylene groups, alkynylene groups, cycloalkylene groups, arylene groups, and aralkylene groups (divalent groups having an alkylene group and an arylene group).

[0052] Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, and a hexamethylene group. Examples of the alkenylene group include a vinylene group, a 1-methylvinylene group, a propenylene group, a butenylene group, and a pentenylene group. Examples of the alkynylene group include an ethynylene group, a propynylene group, a butynylene group, a pentynylene group, and a hexynylene group. Examples of the cycloalkylene group include a cyclopropylene group, a cyclobutylene group, a cyclopentylene group, and a cyclohexylene group. Examples of the arylene group include a phenylene group, a tolylene group, a xylylene group, and a naphthylene group.

[0053] Among these, from the viewpoint of the balance between the availability of raw materials, the viscosity of the resulting curable compound, and the flexibility of the cured product, ethylene, propylene, and tetramethylene groups are preferred.

[0054] In the general formula, m1 and m2 are the average values ​​of the repeating structural units X and Y, respectively, and are each independently 0 to 25, and m1+m2≧1. Preferably, m1 and m2 are each in the range of 0.5 to 10. Each of m3 and m4 is independently 0 to 25, and preferably in the range of 0.5 to 10.

[0055] The general formula (Z 2 ) in Z 3 is a structure having a furan skeleton, for example, the following structure can be mentioned. * represents a bonding point.

[0056] [ka]

[0057] Said Z 3 Particularly preferred structures are as follows: * represents a bonding point.

[0058] [ka]

[0059] Examples of the curable compound of the present invention include, but are not limited to, those represented by the following formulae:

[0060] [ka]

[0061] [ka]

[0062] [ka]

[0063] In the above structural formulas, R is a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R' is a divalent hydrocarbon group having 2 to 12 carbon atoms, n1 is an integer of 4 to 16, n, n2, m, p1, p2, and q are average values ​​of repetition, n is 0.5 to 10, n2 is 2 to 30, m is 0.5 to 10, p1 and p2 are each independently 0 to 5, and q is 0.5 to 5.

[0064] The curable compound according to one embodiment of the present invention can be synthesized by a known method. For example, 1. A method in which a glycidyl ether group-containing compound having an alkylene chain or an alkylene ether chain is reacted with aminofuran or the like so that the glycidyl ether group is in excess to obtain a compound in which the curable functional group is a glycidyl ether group. 2. A method in which a diglycidyl ether of an aliphatic dihydroxy compound, an aliphatic divinyl ether or a dihalogenated alkylene compound is reacted with an aromatic hydroxy compound to obtain a compound having a hydroxyl group at the terminal, which is then epoxidized to convert the terminal to a glycidyl ether group, and then reacted with aminofuran or the like so that the glycidyl ether group is in excess, to obtain a compound in which the curable functional group is a glycidyl ether group. 3. A method of reacting the compound having a glycidyl ether group at the end obtained in the above 1 or 2 with a compound having a phenolic hydroxyl group to obtain a curable compound whose curable functional group is a hydroxyl group.

[0065] The glycidyl ether group-containing compound having an alkylene chain or an alkylene ether chain is not particularly limited. For example, diglycidyl ethers having an alkylene chain include 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, 1,9-nonanediol diglycidyl ether, 1,11-undecanediol diglycidyl ether, 1,12-dodecanediol diglycidyl ether, 1,1 Examples of the glycidyl ether group-containing compound having an alkylene ether chain include polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, polytetramethylene glycol diglycidyl ether, polypentamethylene glycol diglycidyl ether, polyhexamethylene glycol diglycidyl ether, and polyheptamethylene glycol diglycidyl ether. These may contain organic chlorine impurities generated during the glycidyl etherification of a hydroxy compound, or may contain organic chlorine such as 1-chloromethyl-2-glycidyl ether (chloromethyl form) represented by the following structure: These glycidyl ether group-containing compounds may be used alone or in combination of two or more kinds.

[0066] [ka]

[0067] Among these, it is preferable to use 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, 1,9-nonanediol diglycidyl ether, 1,12-dodecanediol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, and polytetramethylene glycol diglycidyl ether, because they provide an excellent balance between flexibility and heat resistance of the resulting cured product.

[0068] The above-mentioned glycidyl ether group-containing compound can be reacted with aminofurans, and a conjugated diene structure can be easily introduced as a side chain.

[0069] In particular, aminofurans made from aliphatic amines have high reactivity with glycidyl ethers, and it is easy to introduce a conjugated diene structure as a side chain. Furthermore, the bond made from amines and glycidyl ethers has high heat resistance and moisture resistance, so the resulting cured product has excellent durability.

[0070] In addition, a diglycidyl ether of an aliphatic dihydroxy compound or an aliphatic divinyl ether is reacted with an aromatic hydroxy compound to obtain a compound having a hydroxyl group at the terminal, which is then epoxidized to convert the terminal to a glycidyl ether group, thereby obtaining a glycidyl ether group-containing compound having both the structural unit X and the structural unit Y. This compound can be reacted with aminofuran or the like in the same manner as described above to obtain a curable compound.

[0071] As the diglycidyl ether of the aliphatic dihydroxy compound, those described above as the glycidyl ether group-containing compound having an alkylene chain or an alkylene ether chain can be used in the same manner. The same applies to the preferred compounds.

[0072] The aliphatic divinyl ether is not particularly limited, and examples thereof include divinyl ethers of linear alkylene groups such as polyethylene glycol divinyl ether, polypropylene glycol divinyl ether, polytetramethylene glycol divinyl ether, 1,3-butylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-hexanediol divinyl ether, 1,9-nonanediol divinyl ether, and 1,10-decanediol divinyl ether, and divinyl ethers of branched alkylene groups such as neopentyl glycol divinyl ether, and divinyl ethers containing a cycloalkane structure such as 1,4-cyclohexanediol divinyl ether, 1,4-cyclohexanedimethanol divinyl ether, tricyclodecanediol divinyl ether, tricyclodecane dimethanol divinyl ether, pentacyclopentadecanedimethanol divinyl ether, and pentacyclopentadecanediol divinyl ether. These may be used alone or in combination of two or more kinds.

[0073] Among these, divinyl ethers having a polyether structure or a linear alkylene structure are preferred because they provide an excellent balance between the flexibility and toughness of the resulting cured product, and it is most preferred to use polyethylene glycol divinyl ether, polypropylene glycol divinyl ether, polytetramethylene glycol divinyl ether, 1,3-butylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-hexanediol divinyl ether, 1,9-nonanediol divinyl ether, or 1,10-decanediol divinyl ether.

[0074] The dihalogenated alkylene compound is not particularly limited, and examples thereof include 1,4-dichlorobutane, 1,5-dichloropentane, 1,6-dichlorohexane, 1,7-dichloroheptane, 1,8-dichlorooctane, 1,9-dichlorononane, 1,10-dichlorodecane, 1,11-dichloroundecane, 1,12-dichlorododecane, 1,4-dibromobutane, 1,5-dibromopentane, 1,6-dibromohexane, 1,7-dibromoheptane, 1,8-dibromooctane, 1,9-dibromononane, 1,10-dibromodecane, 1,11-dibromoundecane, and 1,12-dibromododecane. These compounds may be used alone or in combination of two or more.

[0075] The aromatic hydroxy compound is not particularly limited, and examples thereof include dihydroxybenzenes such as hydroquinone, resorcin, and catechol; trihydroxybenzenes such as pyrogallol, 1,2,4-trihydroxybenzene, and 1,3,5-trihydroxybenzene; triphenylmethane-type phenols such as 4,4',4"-trihydroxytriphenylmethane; dihydroxynaphthalenes such as 1,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and 2,6-dihydroxynaphthalene; tetrafunctional phenols such as 1,1'-methylenebis-(2,7-naphthalenediol), 1,1'-binaphthalene-2,2',7,7'-tetraol, and 1,1'-oxybis-(2,7-naphthalenediol) obtained by coupling reaction of dihydroxynaphthalenes; bisphenols such as bis(4-hydroxyphenyl)methane, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(3-methyl-4-hydroxyphenyl)propane, 1,1-bis(4-hydroxyphenyl)cyclohexane, and 1,1-bis(4-hydroxyphenyl)-1-phenylethane, and bis(4-hydroxyphenyl)sulfone, 2,2'-biphenol, 4,4'-biphenol, (1,1'-biphenyl)-3,4-diol, 3,3'-Dimethyl-(1,1'-biphenyl)-4,4'-diol, 3-Methyl-(1,1'-biphenyl)-4,4'-diol, 3,3',5,5'-Tetramethylbiphenyl-2,2'-diol, 3,3',5,5'-Tetramethylbiphenyl-4,4'-diol, 5-Methyl-(1,1'-biphenyl)-3,4'diol, 3'-Methyl-(1,1'-biphenyl)-3,4'diol, 4'-Methyl-(1,1'-biphenyl)-3,Examples of the phenols include biphenols such as 4'-diol, polyaddition products of phenol and dicyclopentadiene, and polyaddition products of phenol and terpene compounds, naphthols such as bis(2-hydroxy-1-naphthyl)methane and bis(2-hydroxy-1-naphthyl)propane, and the so-called Xylok-type phenolic resins which are condensation reaction products of phenol and phenylene dimethyl chloride or biphenylene dimethyl chloride. These may be used alone or in combination of two or more. In addition, bifunctional phenolic compounds having a structure in which the aromatic nucleus of each of the above compounds is substituted with a methyl group, a t-butyl group, or a halogen atom as a substituent may also be used. The phenols containing an alicyclic structure and the Xylok-type phenolic resins may contain not only bifunctional components but also trifunctional or higher components at the same time, and may be used as they are, or may be used by isolating only the bifunctional components after a purification process such as a column.

[0076] Among these, bisphenols are preferred because they provide an excellent balance between flexibility and toughness when cured, and bis(4-hydroxyphenyl)methane and 2,2-bis(4-hydroxyphenyl)propane are particularly preferred because they provide outstanding toughness. In addition, when importance is attached to the moisture resistance of the cured product, it is preferred to use phenols containing an alicyclic structure.

[0077] The reaction ratio of the diglycidyl ether of the aliphatic dihydroxy compound to the aromatic hydroxy compound is preferably in the range of 1 / 1.01 to 1 / 5.0 (molar ratio) of the former / the latter, and from the viewpoint of providing a well-balanced combination of flexibility and heat resistance of the resulting cured product, the reaction ratio is preferably 1 / 1.02 to 1 / 3.0 (molar ratio).

[0078] The reaction between the diglycidyl ether of the aliphatic dihydroxy compound and the aromatic hydroxy compound is preferably carried out in the presence of a catalyst.Various catalysts can be used, such as alkali (earth) metal hydroxides such as sodium hydroxide, potassium hydroxide, lithium hydroxide, and calcium hydroxide, alkali metal carbonates such as sodium carbonate and potassium carbonate, phosphorus compounds such as triphenylphosphine, chlorides such as DMP-30, DMAP, tetramethylammonium, tetraethylammonium, tetrabutylammonium, and benzyltributylammonium, bromides, and iodides, quaternary ammonium salts such as chlorides, bromides, and iodides such as tetramethylphosphonium, tetraethylphosphonium, tetrabutylphosphonium, and benzyltributylphosphonium, tertiary amines such as triethylamine, N,N-dimethylbenzylamine, 1,8-diazabicyclo[5.4.0]undecene, and 1,4-diazabicyclo[2.2.2]octane, and imidazoles such as 2-ethyl-4-methylimidazole and 2-phenylimidazole. These catalysts may be used in combination of two or more kinds. Among them, sodium hydroxide, potassium hydroxide, triphenylphosphine, and DMP-30 are preferred because the reaction proceeds quickly and the amount of impurities is highly reduced. The amount of these catalysts used is not particularly limited, but it is preferable to use 0.0001 to 0.01 moles per mole of the phenolic hydroxyl group of the aromatic hydroxy compound. The form of these catalysts is also not particularly limited, and they may be used in the form of an aqueous solution or in the form of a solid.

[0079] The reaction between the diglycidyl ether of the aliphatic dihydroxy compound and the aromatic hydroxy compound can be carried out without a solvent or in the presence of an organic solvent. Examples of the organic solvent that can be used include methyl cellosolve, ethyl cellosolve, toluene, xylene, methyl isobutyl ketone, dimethyl sulfoxide, propyl alcohol, and butyl alcohol. The amount of the organic solvent used is usually 50 to 300% by mass, preferably 100 to 250% by mass, based on the total mass of the raw materials charged. These organic solvents can be used alone or in combination. In order to carry out the reaction quickly, it is preferable to use no solvent, while it is preferable to use dimethyl sulfoxide in order to reduce impurities in the final product.

[0080] The reaction temperature in carrying out the reaction is usually 50 to 180°C, and the reaction time is usually 1 to 10 hours. The reaction temperature is preferably 100 to 160°C in terms of reducing impurities in the final product. In addition, if the resulting compound is significantly colored, an antioxidant or a reducing agent may be added to suppress the coloration. The antioxidant is not particularly limited, but examples thereof include hindered phenol compounds such as 2,6-dialkylphenol derivatives, divalent sulfur compounds, and phosphorous ester compounds containing a trivalent phosphorus atom. The reducing agent is not particularly limited, but examples thereof include hypophosphorous acid, phosphorous acid, thiosulfuric acid, sulfurous acid, hydrosulfite, or salts thereof.

[0081] After the reaction is completed, the reaction mixture may be neutralized or washed until the pH value is 3 to 7, preferably 5 to 7. The neutralization and washing may be performed according to a conventional method. For example, when a basic catalyst is used, an acidic substance such as hydrochloric acid, sodium dihydrogen phosphate, p-toluenesulfonic acid, or oxalic acid may be used as a neutralizing agent. After the neutralization or washing, the solvent may be distilled off under reduced pressure and heating, if necessary, to concentrate the product, thereby obtaining a compound.

[0082] The reaction between the diglycidyl ether of the aliphatic dihydroxy compound and the aromatic hydroxy compound proceeds sufficiently without using a catalyst, but it can be used appropriately from the viewpoint of selecting raw materials and increasing the reaction rate. Examples of catalysts that can be used here include inorganic acids such as sulfuric acid, hydrochloric acid, nitric acid, and phosphoric acid, organic acids such as toluenesulfonic acid, methanesulfonic acid, xylenesulfonic acid, trifluoromethanesulfonic acid, oxalic acid, formic acid, trichloroacetic acid, and trifluoroacetic acid, and Lewis acids such as aluminum chloride, iron chloride, tin chloride, gallium chloride, titanium chloride, aluminum bromide, gallium bromide, boron trifluoride ether complex, and boron trifluoride phenol complex. The amount of catalyst used is usually in the range of 10 ppm to 1% by weight based on the mass of the divinyl ether compound. In this case, it is preferable to select the type and amount of catalyst used so as not to cause a nuclear addition reaction of the vinyl group to the aromatic ring.

[0083] The reaction ratio of the aliphatic divinyl ether to the aromatic hydroxy compound is preferably in the range of 1 / 1.01 to 1 / 5.0 (molar ratio) of the former / the latter, and from the viewpoint of providing a well-balanced combination of flexibility and heat resistance of the resulting cured product, the reaction ratio is preferably 1 / 1.02 to 1 / 3.0 (molar ratio).

[0084] The reaction between the aliphatic divinyl ether and the aromatic hydroxy compound can be carried out without a solvent or in the presence of an organic solvent. Examples of the organic solvent include aromatic organic solvents such as benzene, toluene, and xylene, ketone organic solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone, and alcohol organic solvents such as methanol, ethanol, isopropyl alcohol, and normal butanol. The amount of the organic solvent used is usually 50 to 300% by mass, preferably 100 to 250% by mass, based on the total mass of the raw materials charged. These organic solvents can be used alone or in combination.

[0085] The reaction temperature when carrying out the above reaction is usually 50 to 150° C., and the reaction time is usually 0.5 to 10 hours. In this case, in order to prevent self-polymerization of the vinyl ether group, the reaction is preferably carried out in an oxygen atmosphere.

[0086] After completion of the reaction, if an organic solvent was used, it is removed under reduced pressure and heating, and if a catalyst was used, it is deactivated with a deactivator or the like as necessary, and then removed by washing with water or filtration, whereby the compound can be obtained.

[0087] The reaction ratio of the dihalogenated alkylene compound to the aromatic hydroxy compound is preferably in the range of 1 / 1.01 to 1 / 5.0 (molar ratio), and from the viewpoint of providing a well-balanced combination of flexibility and heat resistance of the resulting cured product, the reaction ratio is preferably in the range of 1 / 1.1 to 1 / 3.0 (molar ratio).

[0088] The reaction between the aromatic hydroxy compound and the dihalogenated alkylene compound is preferably carried out in the presence of a basic compound. As the basic compound, various compounds can be used, and examples thereof include alkali (earth) metal hydroxides such as sodium hydroxide, potassium hydroxide, lithium hydroxide, and calcium hydroxide, and alkali metal carbonates such as sodium carbonate and potassium carbonate. Two or more of these basic compounds may be used in combination. Among them, sodium hydroxide, potassium hydroxide, and potassium carbonate are preferred because the reaction proceeds quickly and the effect of reducing the amount of impurities is high. The amount of these basic compounds used is not particularly limited, but it is preferable to use 0.0001 to 10 moles per mole of the phenolic hydroxyl group of the aromatic hydroxy compound. The form of these basic compounds is also not particularly limited, and they may be used in the form of an aqueous solution or in the form of a solid. A catalyst can also be used in the reaction. Examples of the catalyst that can be used include quaternary ammonium salts such as tetra-n-butylammonium bromide, benzyltriethylammonium chloride, cetyltrimethylammonium bromide, cetylpyridinium bromide, tetra-n-butylammonium chloride, tetra-n-butylammonium hydroxide, tetra-n-butylammonium iodide, tetra-ethylammonium chloride, benzyltributylammonium bromide, benzyltriethylammonium bromide, hexadecyltriethylammonium chloride, tetramethylammonium chloride, and hexadecyltrimethylammonium chloride, as well as crown ethers and potassium iodide.

[0089] The reaction between the aromatic hydroxy compound and the dihalogenated alkylene compound can be carried out without a solvent or in the presence of an organic solvent. Examples of the organic solvent that can be used include toluene, acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone, acetonitrile, and dimethylformamide. The amount of the organic solvent used is usually 50 to 300% by mass, preferably 100 to 1000% by mass, based on the total mass of the raw materials charged. These organic solvents can be used alone or in combination.

[0090] The reaction temperature when carrying out the above reaction is usually room temperature to 150° C., and the reaction time is usually 1 to 24 hours. The reaction temperature is preferably room temperature to 100° C. in order to reduce impurities in the final product.

[0091] The method of the glycidyl etherification reaction of the precursor (intermediate) hydroxy compound obtained above is not particularly limited, and examples thereof include a method of reacting a phenolic hydroxyl group with epihalohydrin, a method of olefinating the phenolic hydroxyl group and oxidizing the carbon-carbon double bond of the olefin with an oxidizing agent, etc. Among these, the method using epihalohydrin is preferred in terms of easy availability of raw materials and reaction.

[0092] As a method using epihalohydrin, for example, 0.3 to 100 moles of epihalohydrin are added per mole of aromatic hydroxyl group of the hydroxyl compound obtained above, and the mixture is reacted at a temperature of 20 to 120°C for 0.5 to 10 hours while adding 0.9 to 2.0 moles of basic catalyst per mole of aromatic hydroxyl group of the hydroxyl compound all at once or gradually. The amount of epihalohydrin added is such that the more the excess amount of epihalohydrin, the closer the obtained epoxy resin is to the theoretical structure, and the generation of secondary hydroxyl groups caused by the reaction of unreacted aromatic hydroxyl groups with epoxy groups can be suppressed. From this viewpoint, the amount is preferably in the range of 2.5 to 100 equivalents. The basic catalyst may be a solid or an aqueous solution thereof. When an aqueous solution is used, it may be added continuously, and water and epihalohydrin may be continuously distilled from the reaction mixture under reduced pressure or under normal pressure, and then the liquids may be separated to remove water while the epihalohydrin is continuously returned to the reaction mixture.

[0093] When reacting epihalohydrin, a promoter such as a quaternary ammonium salt may be used in combination in order to improve the reaction rate. As the quaternary ammonium salt, various types can be used, such as tetra-n-butylammonium bromide, benzyltriethylammonium chloride, cetyltrimethylammonium bromide, cetylpyridinium bromide, tetra-n-butylammonium chloride, tetra-n-butylammonium hydroxide, tetra-n-butylammonium iodide, tetra-ethylammonium chloride, benzyltributylammonium bromide, benzyltriethylammonium bromide, hexadecyltriethylammonium chloride, tetramethylammonium chloride, and hexadecyltrimethylammonium chloride.

[0094] In industrial production, all of the epihalohydrin charged in the first batch of epoxy resin production is fresh, but from the next batch onwards, it is preferable to use epihalohydrin recovered from the crude reaction product in combination with fresh epihalohydrin equivalent to the amount consumed and lost in the reaction. The epihalohydrin used in this case is not particularly limited, but examples include epichlorohydrin and epibromohydrin. Among these, epichlorohydrin is preferred because of its easy availability.

[0095] The basic catalyst is not particularly limited, and examples thereof include alkaline earth metal hydroxides, alkali metal carbonates, and alkali metal hydroxides. In particular, alkali metal hydroxides are preferred from the viewpoint of excellent catalytic activity in the epoxy resin synthesis reaction, and examples thereof include sodium hydroxide and potassium hydroxide. When used, these alkali metal hydroxides may be used in the form of an aqueous solution of about 10 to 55 mass %, or may be used in the form of a solid.

[0096] In addition, the reaction rate in the synthesis of the epoxy resin can be increased by using an organic solvent in combination. Such organic solvents are not particularly limited, but examples thereof include ketones such as acetone and methyl ethyl ketone, alcohols such as methanol, ethanol, 1-propyl alcohol, isopropyl alcohol, 1-butanol, secondary butanol, and tertiary butanol, cellosolves such as methyl cellosolve and ethyl cellosolve, ethers such as tetrahydrofuran, 1,4-dioxane, 1,3-dioxane, and diethoxyethane, and aprotic polar solvents such as acetonitrile, dimethyl sulfoxide, and dimethylformamide. These organic solvents may be used alone, or two or more of them may be used in combination as appropriate to adjust the polarity.

[0097] After washing the reaction product of these glycidylation reactions with water, the unreacted epihalohydrin and the organic solvent used in combination are distilled off by heating under reduced pressure. Furthermore, in order to obtain an epoxy resin with a smaller amount of hydrolyzable halogen, the obtained epoxy resin can be dissolved again in an organic solvent such as toluene, methyl isobutyl ketone, or methyl ethyl ketone, and an aqueous solution of an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide can be added to carry out further reaction. At this time, a phase transfer catalyst such as a quaternary ammonium salt or a crown ether can be present in order to improve the reaction rate.

[0098] When a phase transfer catalyst is used, the amount of the catalyst used is preferably in the range of 0.1 to 3.0% by mass based on the epoxy resin used. After the reaction is completed, the salt formed is removed by filtration, washing with water, etc., and the solvent such as toluene or methyl isobutyl ketone is distilled off under heating and reduced pressure to obtain a high-purity resin.

[0099] The resin having a glycidyl ether group at the end obtained in this manner can be reacted with aminofuran or the like in the same manner as described above to obtain the curable compound of the present invention.

[0100] In the present invention, when the terminal curable functional group is a hydroxyl group, it can be obtained by reacting the above-mentioned compound having a glycidyl ether group at the terminal and a furan structure in the side chain with a desired phenolic hydroxyl group-containing compound.

[0101] Hereinafter, such a curable compound having a curable functional group at the end of a linear polymer having a flexible structure and further having a conjugated diene structure in a side chain may be referred to as a curable compound (I).

[0102] Another embodiment of the present invention is a compound obtained by introducing a reversible bond of a diene parent compound into the conjugated diene structure in the curable compound (I) by Diels-Alder reaction. Hereinafter, the curable compound into which a reversible bond is introduced may be referred to as a curable compound (II). The diene parent compound may be monofunctional, but is preferably bifunctional or higher in order to impart better performance to the cured product.

[0103] The reversible bond by the Diels-Alder reaction is a reaction in which a conjugated diene and a parent diene undergo an addition reaction to form a six-membered ring. Since the Diels-Alder reaction is an equilibrium reaction, a Retro-Diels-Alder reaction occurs at a certain temperature, resulting in dissociation (decrosslinking). This reversibility is maintained even after the cured product (three-dimensional crosslinked product) is formed, so that when mechanical energy such as scratches or external force is applied to the cured product, the CC bond of the Diels-Alder reaction unit is preferentially broken because the CC bond of the Diels-Alder reaction unit has a lower bond energy than a normal covalent bond. However, in a temperature range lower than the dissociation temperature, the equilibrium of the CC bond of the Diels-Alder reaction unit shifts in the bond direction, so that an adduct (Diels-Alder reaction unit) is formed again, which is considered to enable repair of scratches and remolding.

[0104] The diene parent compound is not particularly limited, and examples thereof include compounds having a maleimide group, an acryloyl group, a vinyl ketone group, an acetylene group, an allyl group, a diazo group, a nitro group, a benzoquinone skeleton, etc. Among these, it is preferable to use a compound having a maleimide group from the viewpoint of the balance between the reactivity when used as a curable resin composition and the ease of dismantling and remolding of the cured product.

[0105] Examples of the compound having a maleimide group include the following compounds.

[0106] [ka]

[0107] The above n3, n5, n6, n7, n8, and n9 are average numbers of repetitions, each of which is 0.5 to 10, n4 is an integer of 1 to 16, and R ” each independently represents a hydrogen atom, a methyl group, or an ethyl group.

[0108] The above-mentioned compounds having a maleimide group include those having, independently of one another, a hydrogen atom, a halogen atom, an alkoxy group, an aralkyloxy group, an aryloxy group, a nitro group, an amide group, an alkyloxycarbonyl group, an aryloxycarbonyl group, a cyano group, an alkyl group, a cycloalkyl group, an aralkyl group, or an aryl group as a substituent. In addition, in the structures of the compounds listed in the above formula, the alkoxy group, the aralkyloxy group, the aryloxy group, the carboxy group, the alkyloxycarbonyl group, the aryloxycarbonyl group, the alkyl group, the cycloalkyl group, the aralkyl group, and the aryl group also include those having various substituents bonded to the carbon atoms they have.

[0109] The Diels-Alder reaction may be carried out by a known method. For example, the conjugated diene structure in the curable compound (I) and the parent diene compound are mixed in equimolar amounts, or one of the components may be mixed in excess, and the mixture is melted by heating or dissolved in a solvent, stirred at room temperature to 110° C. for 1 to 24 hours, and the product is obtained by filtration or solvent distillation without purification, or by a commonly used isolation and purification method such as recrystallization, reprecipitation, or chromatography.

[0110] [ka]

[0111] [ka]

[0112] The curable resin composition according to another embodiment of the present invention essentially contains the curable compound (I) or (II) and includes the following embodiments. 1. A curable resin composition comprising a curable compound (I), a diene parent compound, and a compound (III) having reactivity with the terminal curable functional group in the curable compound (I). 2. A curable resin composition comprising a curable compound (II) and a compound (III) having reactivity with the terminal curable functional group in the curable compound (II).

[0113] In the curable resin composition of the above 1, in the process of obtaining a cured product, a Diels-Alder reaction occurs between the conjugated diene structure in the curable compound (I) and the parent diene compound, that is, the curable compound (II) is formed in-situ. Therefore, there is no difference between the obtained cured products of the above 1 and 2, and both of them are cured products having both a reversible bond by the Diels-Alder reaction and a permanent crosslinked structure (covalent bond) obtained by the reaction of the terminal curable functional group with the compound (III) that can react with it. The parent diene compound that can be used at this time may be any of those listed above, but from the viewpoint of further exerting the effects of the present application, it is preferable that the parent diene compound is bifunctional or more, and in particular, it is preferable that the parent diene compound is a bismaleimide that may have a substituent.

[0114] In the curable resin compositions 1 and 2, the compound (III) having reactivity with the terminal curable functional group is not particularly limited.

[0115] When the terminal curable functional group is a hydroxyl group, examples of the compound (III) include melamine compounds substituted with at least one group selected from a methylol group, an alkoxymethyl group, and an acyloxymethyl group, guanamine compounds, glycoluril compounds, urea compounds, resol resins, epoxy resins, isocyanate compounds, azide compounds, compounds containing double bonds such as alkenyl ether groups, acid anhydrides, hexamethylenetetramine and modified products thereof, oxazoline compounds, etc. Among these, epoxy resins are preferred from the viewpoints of good curability and ease of handling.

[0116] Examples of the melamine compound include hexamethylolmelamine, hexamethoxymethylmelamine, a compound in which 1 to 6 methylol groups of hexamethylolmelamine are methoxymethylated, hexamethoxyethylmelamine, hexaacyloxymethylmelamine, and a compound in which 1 to 6 methylol groups of hexamethylolmelamine are acyloxymethylated.

[0117] Examples of the guanamine compound include tetramethylolguanamine, tetramethoxymethylguanamine, tetramethoxymethylbenzoguanamine, a compound in which 1 to 4 methylol groups of tetramethylolguanamine are methoxymethylated, tetramethoxyethylguanamine, tetraacyloxyguanamine, and a compound in which 1 to 4 methylol groups of tetramethylolguanamine are acyloxymethylated.

[0118] Examples of the glycoluril compound include 1,3,4,6-tetrakis(methoxymethyl)glycoluril, 1,3,4,6-tetrakis(butoxymethyl)glycoluril, and 1,3,4,6-tetrakis(hydroxymethyl)glycoluril.

[0119] Examples of the urea compound include 1,3-bis(hydroxymethyl)urea, 1,1,3,3-tetrakis(butoxymethyl)urea, and 1,1,3,3-tetrakis(methoxymethyl)urea.

[0120] Examples of the resol resin include polymers obtained by reacting a phenolic hydroxyl group-containing compound, such as phenol, alkylphenol such as cresol or xylenol, phenylphenol, resorcinol, biphenyl, bisphenol such as bisphenol A or bisphenol F, naphthol, or dihydroxynaphthalene, with an aldehyde compound under alkaline catalytic conditions.

[0121] Examples of the epoxy resin include liquid epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AD ​​type epoxy resins, polyhydroxybenzene type epoxy resins, polyhydroxynaphthalene type epoxy resins, biphenyl type epoxy resins, and tetramethylbiphenyl type epoxy resins; brominated epoxy resins such as brominated phenol novolac type epoxy resins; solid bisphenol A type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, triphenylmethane type epoxy resins, tetraphenylethane type epoxy resins; Examples of such epoxy resins include dicyclopentadiene-phenol addition reaction type epoxy resins, phenol aralkyl type epoxy resins, phenylene ether type epoxy resins, naphthylene ether type epoxy resins, naphthol novolac type epoxy resins, naphthol aralkyl type epoxy resins, naphthol-phenol co-condensed novolac type epoxy resins, naphthol-cresol co-condensed novolac type epoxy resins, aromatic hydrocarbon formaldehyde resin modified phenolic resin type epoxy resins, biphenyl modified novolac type epoxy resins, and the like. These may be used alone or in combination of two or more kinds, and it is preferable to select and use various types depending on the intended use, the physical properties of the cured product, and the like.

[0122] Examples of the isocyanate compound include tolylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, and cyclohexane diisocyanate.

[0123] Examples of the azide compound include 1,1'-biphenyl-4,4'-bisazide, 4,4'-methylidenebisazide, and 4,4'-oxybisazide.

[0124] Examples of the compound containing a double bond such as an alkenyl ether group include ethylene glycol divinyl ether, triethylene glycol divinyl ether, 1,2-propanediol divinyl ether, 1,4-butanediol divinyl ether, tetramethylene glycol divinyl ether, neopentyl glycol divinyl ether, trimethylolpropane trivinyl ether, hexanediol divinyl ether, 1,4-cyclohexanediol divinyl ether, pentaerythritol trivinyl ether, pentaerythritol tetravinyl ether, sorbitol tetravinyl ether, sorbitol pentavinyl ether, and trimethylolpropane trivinyl ether.

[0125] Examples of the acid anhydride include aromatic acid anhydrides such as phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, 4,4'-(isopropylidene)diphthalic anhydride, and 4,4'-(hexafluoroisopropylidene)diphthalic anhydride; and alicyclic carboxylic acid anhydrides such as tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, dodecenylsuccinic anhydride, and trialkyltetrahydrophthalic anhydride.

[0126] Furthermore, when the curable functional group in the curable compound is a hydroxyl group and this is combined with an epoxy resin to form a curable resin composition, a curing agent for epoxy resin may be blended.

[0127] Examples of the curing agent that can be used herein include various known curing agents for epoxy resins, such as amine compounds, acid anhydrides, amide compounds, phenolic hydroxyl group-containing compounds, carboxylic acid compounds, and thiol compounds.

[0128] Examples of the amine compound include trimethylenediamine, ethylenediamine, N,N,N',N'-tetramethylethylenediamine, pentamethyldiethylenetriamine, triethylenediamine, dipropylenediamine, N,N,N',N'-tetramethylpropylenediamine, tetramethylenediamine, pentanediamine, hexamethylenediamine, trimethylhexamethylenediamine, N,N,N',N'-tetramethylhexamethylenediamine, N,N-dimethylcyclohexylamine, diethylenetriamine, triethylenetetramine, tetramethylhexamethylenediamine ... aliphatic amine compounds such as triethylenepentamine, dimethylaminopropylamine, diethylaminopropylamine, dibutylaminopropylamine, 1,4-diazabicyclo(2,2,2)octane (triethylenediamine), polyoxyethylenediamine, polyoxypropylenediamine, bis(2-dimethylaminoethyl)ether, dimethylaminoethoxyethoxyethanol, triethanolamine, dimethylaminohexanol, benzylmethylamine, dimethylbenzylamine, m-xylenediamine, and α-methylbenzylmethylamine;

[0129] Alicyclic and heterocyclic amine compounds such as piperidine, piperazine, menthanediamine, isophoronediamine, methylmorpholine, ethylmorpholine, N,N',N"-tris(dimethylaminopropyl)hexahydro-s-triazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxyspiro(5,5)undecane adduct, N-aminoethylpiperazine, trimethylaminoethylpiperazine, bis(4-aminocyclohexyl)methane, N,N'-dimethylpiperazine, 1,8-diazabicyclo-[5.4.0]-undecene (DBU);

[0130] Aromatic amine compounds such as o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, pyridine, and picoline;

[0131] Examples of modified amine compounds include epoxy compound-added polyamines, Michael addition polyamines, Mannich addition polyamines, thiourea addition polyamines, ketone-blocked polyamines, dicyandiamide, guanidine, organic acid hydrazides, diaminomaleonitrile, aminimide, boron trifluoride-piperidine complex, and boron trifluoride-monoethylamine complex.

[0132] Examples of the acid anhydride include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, maleic polypropylene glycol anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride, and methylhexahydrophthalic anhydride.

[0133] Examples of the phenolic hydroxyl group-containing compound include bisphenols such as bis(4-hydroxyphenyl)methane, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(3-methyl-4-hydroxyphenyl)propane, 1,1-bis(4-hydroxyphenyl)cyclohexane, and 1,1-bis(4-hydroxyphenyl)-1-phenylethane, and bis(4-hydroxyphenyl)sulfone, phenol novolac resins, cresol novolac resins, aromatic hydrocarbon formaldehyde resin-modified phenolic resins, dicyclopentadiene phenol addition type resins, phenol aralkyl resins (Zylok resins), naphthol aralkyl resins, trimethylolmethane resins, Examples of polyhydric phenol compounds include tetraphenylolethane resin, naphthol novolak resin, naphthol-phenol co-condensed novolak resin, naphthol-cresol co-condensed novolak resin, biphenyl-modified phenol resin (a polyhydric phenol compound in which a phenol nucleus is linked via a bismethylene group), biphenyl-modified naphthol resin (a polyhydric naphthol compound in which a phenol nucleus is linked via a bismethylene group), aminotriazine-modified phenol resin (a polyhydric phenol compound in which a phenol nucleus is linked via melamine, benzoguanamine, or the like), and alkoxy group-containing aromatic ring-modified novolak resin (a polyhydric phenol compound in which a phenol nucleus and an alkoxy group-containing aromatic ring are linked via formaldehyde).

[0134] Examples of the amide-based compound include dicyandiamide and polyamidoamine, etc. Examples of the polyamidoamine include those obtained by reacting an aliphatic dicarboxylic acid such as succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, etc., or a carboxylic acid compound such as a fatty acid or a dimer acid, with an aliphatic polyamine or a polyamine having a polyoxyalkylene chain, etc.

[0135] Examples of the carboxylic acid compound include carboxylic acid polymers such as carboxylic acid-terminated polyesters, polyacrylic acid, and maleic acid-modified polypropylene glycol.

[0136] The thiol compound preferably contains two or more thiol groups in one molecule. For example, 3,3'-dithiodipropionic acid, trimethylolpropane tris(thioglycolate), pentaerythritol tetrakis(thioglycolate), ethylene glycol dithioglycolate, 1,4-bis(3-mercaptobutyryloxy)butane, tris[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), dipentaerythritol hexakis(3-mercaptopropionate), 1,3,4,6-tetrakis(2-mercaptoethyl)glycoluril, 4-butanedithiol, 1,6-hexaneedithiol, 1,10-decanedithiol, and the like.

[0137] When using these curing agents, only one type of curing agent may be used, or two or more types may be mixed. In applications such as underfill materials and general coating applications, it is preferable to use the amine compounds, carboxylic acid compounds, and / or acid anhydride compounds. In applications such as adhesives and flexible wiring boards, amine compounds, particularly dicyandiamide, are preferred in terms of workability, curability, and long-term stability. In applications such as semiconductor encapsulation materials, solid phenol compounds are preferred in terms of the heat resistance of the cured product. In applications such as batteries, aliphatic amines and thiol compounds are preferred in terms of low-temperature curing.

[0138] In addition, when an epoxy resin is used, a curing accelerator may be included. Various types of curing accelerators can be used, including, for example, urea compounds, phosphorus compounds, tertiary amines, imidazole, imidazoline, organic acid metal salts, Lewis acids, and amine complex salts. When used as an adhesive, urea compounds, particularly 3-(3,4-dichlorophenyl)-1,1-dimethylurea (DCMU), are preferred because of their excellent workability and low-temperature curing properties. When used as a semiconductor encapsulation material, triphenylphosphine is preferred as a phosphorus compound, and 1,8-diazabicyclo-[5.4.0]-undecene is preferred as a tertiary amine because of their excellent curing properties, heat resistance, electrical properties, and moisture resistance reliability.

[0139] Examples of the phosphorus compound include alkyl phosphines such as ethylphosphine and butylphosphine, primary phosphines such as phenylphosphine, dialkyl phosphines such as dimethylphosphine and dipropylphosphine, secondary phosphines such as diphenylphosphine and methylethylphosphine, and tertiary phosphines such as trimethylphosphine, triethylphosphine and triphenylphosphine.

[0140] Examples of the imidazole include imidazole, 1-methylimidazole, 2-methylimidazole, 3-methylimidazole, 4-methylimidazole, 5-methylimidazole, 1-ethylimidazole, 2-ethylimidazole, 3-ethylimidazole, 4-ethylimidazole, 5-ethylimidazole, 1-n-propylimidazole, 2-n-propylimidazole, 1-isopropylimidazole, 2-isopropylimidazole, and isopropylimidazole, 1-n-butylimidazole, 2-n-butylimidazole, 1-isobutylimidazole, 2-isobutylimidazole, 2-undecyl-1H-imidazole, 2-heptadecyl-1H-imidazole, 1,2-dimethylimidazole, 1,3-dimethylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 1-phenylimidazole, 2-phenyl-1H-imidazole Midazole, 4-methyl-2-phenyl-1H-imidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-cyanoethyl-2-phenyl-4,5-di(2-cyanoethoxy)methylimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 1-benzyl-2-phenylimidazole hydrochloride, etc.

[0141] Examples of the imidazoline compound include 2-methylimidazoline and 2-phenylimidazoline.

[0142] Examples of the urea compound include p-chlorophenyl-N,N-dimethylurea, 3-phenyl-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-N,N-dimethylurea, and N-(3-chloro-4-methylphenyl)-N',N'-dimethylurea.

[0143] When the terminal curable functional group is a glycidyl ether group, examples of the compound (III) include various known curing agents for epoxy resins, such as amine compounds, acid anhydrides, amide compounds, phenolic hydroxyl group-containing compounds, carboxylic acid compounds, thiol compounds, etc. The curing agent can be appropriately selected depending on the physical properties of the desired cured product, but it is preferable to use a hydroxyl group-containing compound, particularly from the viewpoint of mechanical strength and adhesion to the substrate.

[0144] Examples of the amine compound include trimethylenediamine, ethylenediamine, N,N,N',N'-tetramethylethylenediamine, pentamethyldiethylenetriamine, triethylenediamine, dipropylenediamine, N,N,N',N'-tetramethylpropylenediamine, tetramethylenediamine, pentanediamine, hexamethylenediamine, trimethylhexamethylenediamine, N,N,N',N'-tetramethylhexamethylenediamine, N,N-dimethylcyclohexylamine, diethylenetriamine, triethylenetetramine, tetramethylhexamethylenediamine ... aliphatic amine compounds such as triethylenepentamine, dimethylaminopropylamine, diethylaminopropylamine, dibutylaminopropylamine, 1,4-diazabicyclo(2,2,2)octane (triethylenediamine), polyoxyethylenediamine, polyoxypropylenediamine, bis(2-dimethylaminoethyl)ether, dimethylaminoethoxyethoxyethanol, triethanolamine, dimethylaminohexanol, benzylmethylamine, dimethylbenzylamine, m-xylenediamine, and α-methylbenzylmethylamine;

[0145] Alicyclic and heterocyclic amine compounds such as piperidine, piperazine, menthanediamine, isophoronediamine, methylmorpholine, ethylmorpholine, N,N',N"-tris(dimethylaminopropyl)hexahydro-s-triazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxyspiro(5,5)undecane adduct, N-aminoethylpiperazine, trimethylaminoethylpiperazine, bis(4-aminocyclohexyl)methane, N,N'-dimethylpiperazine, 1,8-diazabicyclo-[5.4.0]-undecene (DBU);

[0146] Aromatic amine compounds such as o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, pyridine, and picoline;

[0147] Examples of modified amine compounds include epoxy compound-added polyamines, Michael addition polyamines, Mannich addition polyamines, thiourea addition polyamines, ketone-blocked polyamines, dicyandiamide, guanidine, organic acid hydrazides, diaminomaleonitrile, aminimide, boron trifluoride-piperidine complex, and boron trifluoride-monoethylamine complex.

[0148] Examples of the acid anhydride include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, maleic polypropylene glycol anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride, and methylhexahydrophthalic anhydride.

[0149] Examples of the phenolic hydroxyl group-containing compound include bisphenols such as bis(4-hydroxyphenyl)methane, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(3-methyl-4-hydroxyphenyl)propane, 1,1-bis(4-hydroxyphenyl)cyclohexane, and 1,1-bis(4-hydroxyphenyl)-1-phenylethane, and bis(4-hydroxyphenyl)sulfone, phenol novolac resins, cresol novolac resins, aromatic hydrocarbon formaldehyde resin-modified phenolic resins, dicyclopentadiene phenol addition type resins, phenol aralkyl resins (Zylok resins), naphthol aralkyl resins, trimethylolmethane resins, Examples of polyhydric phenol compounds include tetraphenylolethane resin, naphthol novolak resin, naphthol-phenol co-condensed novolak resin, naphthol-cresol co-condensed novolak resin, biphenyl-modified phenol resin (a polyhydric phenol compound in which a phenol nucleus is linked via a bismethylene group), biphenyl-modified naphthol resin (a polyhydric naphthol compound in which a phenol nucleus is linked via a bismethylene group), aminotriazine-modified phenol resin (a polyhydric phenol compound in which a phenol nucleus is linked via melamine, benzoguanamine, or the like), and alkoxy group-containing aromatic ring-modified novolak resin (a polyhydric phenol compound in which a phenol nucleus and an alkoxy group-containing aromatic ring are linked via formaldehyde).

[0150] Examples of the amide-based compound include dicyandiamide and polyamidoamine, etc. Examples of the polyamidoamine include those obtained by reacting an aliphatic dicarboxylic acid such as succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, etc., or a carboxylic acid compound such as a fatty acid or a dimer acid, with an aliphatic polyamine or a polyamine having a polyoxyalkylene chain, etc.

[0151] Examples of the carboxylic acid compound include carboxylic acid polymers such as carboxylic acid-terminated polyesters, polyacrylic acid, and maleic acid-modified polypropylene glycol.

[0152] The thiol compound preferably contains two or more thiol groups in two molecules. For example, 3,3'-dithiodipropionic acid, trimethylolpropane tris(thioglycolate), pentaerythritol tetrakis(thioglycolate), ethylene glycol dithioglycolate, 1,4-bis(3-mercaptobutyryloxy)butane, tris[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), dipentaerythritol hexakis(3-mercaptopropionate), 1,3,4,6-tetrakis(2-mercaptoethyl)glycoluril, 4-butanedithiol, 1,6-hexaneedithiol, 1,10-decanedithiol, and the like.

[0153] When using these curing agents, only one type of curing agent may be used, or two or more types may be mixed. In applications such as underfill materials and general coating applications, it is preferable to use the amine compounds, carboxylic acid compounds, and / or acid anhydride compounds. In applications such as adhesives and flexible wiring boards, amine compounds, particularly dicyandiamide, are preferred from the viewpoints of workability, curability, and long-term stability. In applications such as semiconductor encapsulation materials, solid-type phenol compounds are preferred from the viewpoint of heat resistance of the cured product. In applications such as batteries, aliphatic amines and thiol compounds are preferred from the viewpoint of low-temperature curing.

[0154] The concentration of the reversible bond in the curable resin composition of the present invention is preferably 0.10 mmol / g or more relative to the total mass of the curable components in the curable resin composition. According to such a configuration, the cured product obtained from the curable resin composition has better dismantling properties, repairability, and remolding properties. The above-mentioned concentration of the reversible bond is more preferably 0.10 to 3.00 mmol / g, and even more preferably 0.15 to 2.00 mmol / g. The concentration of the reversible bond of the present invention can be appropriately selected based on the glass transition temperature of the target cured product defined by the tan δ peak top of a dynamic viscoelasticity measuring device (DMA). For example, when the glass transition temperature is used as a guideline, if the glass transition temperature of the cured product is near room temperature, sufficient repairability and remolding properties are likely to be expressed even at the low concentration side of the preferred range. On the other hand, if the glass transition temperature of the target cured product exceeds 100 ° C. as a guideline, the functions are likely to be expressed at the high concentration side of the preferred range. However, in the temperature range above the glass transition temperature measured by DMA, molecular mobility is generally high, and sufficient repairability and reshapeability functions are easily expressed even if the concentration of reversible bonds is low, so that, for example, the effect of expressing the repairability and reshapeability functions can be adjusted by appropriately adjusting the aging temperature for repair and the heating temperature for reshaping. Thus, the relationship between the glass transition temperature of the cured product and the concentration of reversible bonds is not limited to these.

[0155] As the curable resin composition of the present invention, an epoxy resin represented by the following formula (2) and having an epoxy equivalent of 500 to 10,000 g / eq may be used, since it is a curable resin composition excellent in curability and in mechanical strength and heat resistance of the cured product. In particular, when the terminal curable functional group is a hydroxyl group, the following epoxy resin may be used as the above-mentioned compound (III).

[0156] [ka] [In formula (2), each Ar independently represents a structure having an unsubstituted or substituted aromatic ring, X is a structural unit represented by the following general formula (2-1), and Y is a structural unit represented by the following general formula (2-2),

[0157] [ka]

[0158] [In the formulas (2-1) and (2-2), Ar is the same as defined above, R 1 , R 2 each independently represents a hydrogen atom, a methyl group, or an ethyl group, R' is a divalent hydrocarbon group having 2 to 12 carbon atoms; R 3 , R 4 , R 7 , R 8 each independently represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R 5 , R 6 , R 9 , R 10 each independently represents a hydrogen atom or a methyl group, n1 is an integer from 2 to 16, n2 is the average number of repeating units and is between 2 and 30. R 21 , R 22 each independently represents a glycidyl ether group or a 2-methylglycidyl ether group; R 11 , R 12 each independently represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R 13 , R 14 is a hydrogen atom or a methyl group, m1, m2, p1, p2, and q are the average values ​​of the repetitions, m1 and m2 each independently represent 0 to 25, and m1+m2≧1; p1 and p2 each independently represent 0 to 5; q is 0.5 to 5. However, the bond between X represented by the general formula (2-2) and Y represented by the general formula (2-3) may be random or block, and the total numbers of the structural units X and Y present in one molecule are m1 and m2, respectively.

[0159] The epoxy resin represented by the general formula (2) may be used alone in combination to form a curable resin composition. However, from the viewpoint of imparting further flexibility to the cured product and making it easier to dismantle, it is also preferable to use an epoxy resin having an epoxy equivalent of 100 to 300 g / eq in combination.

[0160] The epoxy resin that can be used in combination is not limited in structure as long as its epoxy equivalent is in the range of 100 to 300 g / eq. Examples of the epoxy resin include liquid epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD ​​type epoxy resin, polyhydroxybenzene type epoxy resin, polyhydroxynaphthalene type epoxy resin, biphenyl type epoxy resin, and tetramethylbiphenyl type epoxy resin; brominated epoxy resins such as brominated phenol novolac type epoxy resin; solid bisphenol A type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, triphenylmethane type epoxy resin, tetraphenylethane type epoxy resin, dicyclohexyl ether type epoxy resin, and the like. Examples of such epoxy resins include isopropyl alcohol-based epoxy resins, isopropyl alcohol-based epoxy resins, and the like. Examples of such epoxy resins include isopropyl alcohol-based epoxy resins, isopropyl alcohol-based epoxy resins, and the like. Examples of such epoxy resins include isopropyl alcohol-based epoxy resins, isopropyl alcohol-based epoxy resins, and the like. Examples of such epoxy resins include isopropyl alcohol-based epoxy resins, isopropyl alcohol-based epoxy resins, and the like.

[0161] Among these, it is preferable to use liquid epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AD ​​type epoxy resins, polyhydroxybenzene type epoxy resins, polyhydroxynaphthalene type epoxy resins, biphenyl type epoxy resins, and tetramethylbiphenyl type epoxy resins, and it is particularly preferable to use epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, and bisphenol AD ​​... the like, each having an epoxy equivalent of 100 to 300 g / eq.

[0162] The ratio of the epoxy resin represented by the general formula (2) to the epoxy resin having an epoxy equivalent of 100 to 300 g / eq is not particularly limited, but from the viewpoint of facilitating phase separation in the cured product, the mass ratio of the former to the latter is 97:3 to 3:97, preferably 10:90 to 90:10, and particularly preferably 80:20 to 20:80. Phase separation in the cured product results in a sea-island structure, which achieves both adhesiveness and stress relaxation ability of the cured product, exhibits high adhesive strength in a particularly wide temperature range, and has the effect of reducing the molding shrinkage rate before and after heat curing of the resin composition.

[0163] The curable resin composition of the present invention may be used in combination with other thermosetting resins or thermoplastic resins within a range that does not impair the effects of the present invention.

[0164] Examples of other thermosetting resins include cyanate ester resins, resins having a benzoxazine structure, active ester resins, vinylbenzyl compounds, acrylic compounds, copolymers of styrene and maleic anhydride, etc. When the other thermosetting resins described above are used in combination, the amount of use is not particularly limited as long as it does not inhibit the effects of the present invention, but is preferably in the range of 1 to 50 parts by mass in 100 parts by mass of the curable resin composition.

[0165] Examples of the cyanate ester resin include bisphenol A type cyanate ester resin, bisphenol F type cyanate ester resin, bisphenol E type cyanate ester resin, bisphenol S type cyanate ester resin, bisphenol sulfide type cyanate ester resin, phenylene ether type cyanate ester resin, naphthylene ether type cyanate ester resin, biphenyl type cyanate ester resin, tetramethylbiphenyl type cyanate ester resin, polyhydroxynaphthalene type cyanate ester resin, phenol novolac type cyanate ester resin, cresol novolac type cyanate ester resin, triphenyl Examples of the cyanate ester resin include tetraphenylethane type cyanate ester resin, dicyclopentadiene-phenol addition reaction type cyanate ester resin, phenol aralkyl type cyanate ester resin, naphthol novolac type cyanate ester resin, naphthol aralkyl type cyanate ester resin, naphthol-phenol co-condensed novolac type cyanate ester resin, naphthol-cresol co-condensed novolac type cyanate ester resin, aromatic hydrocarbon formaldehyde resin modified phenol resin type cyanate ester resin, biphenyl modified novolac type cyanate ester resin, anthracene type cyanate ester resin, etc. These may be used alone or in combination of two or more.

[0166] Among these cyanate ester resins, it is preferable to use bisphenol A type cyanate ester resin, bisphenol F type cyanate ester resin, bisphenol E type cyanate ester resin, polyhydroxynaphthalene type cyanate ester resin, naphthylene ether type cyanate ester resin, and novolac type cyanate ester resin, in that a cured product having excellent heat resistance can be obtained, and it is preferable to use dicyclopentadiene-phenol addition reaction type cyanate ester resin in that a cured product having excellent dielectric properties can be obtained.

[0167] The resin having a benzoxazine structure is not particularly limited, and examples thereof include a reaction product of bisphenol F, formalin, and aniline (Fa-type benzoxazine resin), a reaction product of diaminodiphenylmethane, formalin, and phenol (Pd-type benzoxazine resin), a reaction product of bisphenol A, formalin, and aniline, a reaction product of dihydroxydiphenyl ether, formalin, and aniline, a reaction product of diaminodiphenyl ether, formalin, and phenol, a reaction product of dicyclopentadiene-phenol addition type resin, formalin, and aniline, a reaction product of phenolphthalein, formalin, and aniline, a reaction product of diphenyl sulfide, formalin, and aniline, etc. Each of these may be used alone, or two or more of them may be used in combination.

[0168] The active ester resin is not particularly limited, but generally, compounds having two or more highly reactive ester groups in one molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, are preferably used. The active ester resin is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester resin obtained from a carboxylic acid compound or its halide and a hydroxy compound is preferred, and an active ester resin obtained from a carboxylic acid compound or its halide and a phenol compound and / or a naphthol compound is more preferred. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid, and the like, or halides thereof. Examples of the phenol compound or naphthol compound include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, dihydroxydiphenyl ether, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, and dicyclopentadiene-phenol adduct resins.

[0169] Specific examples of the active ester resin include active ester resins containing a dicyclopentadiene-phenol addition structure, active ester resins containing a naphthalene structure, active ester resins which are acetylated phenol novolac, and active ester resins which are benzoylated phenol novolac. Of these, the active ester resins containing a dicyclopentadiene-phenol addition structure and the active ester resins containing a naphthalene structure are more preferred in terms of their excellent ability to improve peel strength.

[0170] Furthermore, various novolak resins, addition polymerization resins of alicyclic diene compounds such as dicyclopentadiene and phenol compounds, modified novolak resins of phenolic hydroxyl group-containing compounds and alkoxy group-containing aromatic compounds, phenol aralkyl resins (Zylok resins), naphthol aralkyl resins, trimethylolmethane resins, tetraphenylolethane resins, biphenyl-modified phenol resins, biphenyl-modified naphthol resins, aminotriazine-modified phenol resins, and various vinyl polymers may be used in combination.

[0171] More specifically, the various novolak resins include polymers obtained by reacting a phenolic hydroxyl group-containing compound, such as phenol, phenylphenol, resorcinol, biphenyl, bisphenol such as bisphenol A or bisphenol F, naphthol, or dihydroxynaphthalene, with an aldehyde compound under acid catalyst conditions.

[0172] Examples of the various vinyl polymers include homopolymers of vinyl compounds such as polyhydroxystyrene, polystyrene, polyvinylnaphthalene, polyvinylanthracene, polyvinylcarbazole, polyindene, polyacenaphthylene, polynorbornene, polycyclodecene, polytetracyclododecene, polynortricyclene, and poly(meth)acrylate, or copolymers thereof.

[0173] Thermoplastic resin refers to a resin that can be melt molded by heating. Specific examples thereof include polyethylene resin, polypropylene resin, polystyrene resin, rubber-modified polystyrene resin, acrylonitrile-butadiene-styrene (ABS) resin, acrylonitrile-styrene (AS) resin, polymethyl methacrylate resin, acrylic resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyethylene terephthalate resin, ethylene vinyl alcohol resin, cellulose acetate resin, ionomer resin, polyacrylonitrile resin, polyamide resin, polyacetal resin, polybutylene terephthalate resin, polylactic acid resin, polyphenylene ether resin, modified polyphenylene ether resin, polycarbonate resin, polysulfone resin, polyphenylene sulfide resin, polyetherimide resin, polyethersulfone resin, polyarylate resin, thermoplastic polyimide resin, polyamideimide resin, polyetheretherketone resin, polyketone resin, liquid crystal polyester resin, fluororesin, syndiotactic polystyrene resin, and cyclic polyolefin resin. These thermoplastic resins can be used alone or in combination of two or more.

[0174] When using these other resins, the blending ratio of the curable compound of the present invention to the other resins can be set arbitrarily depending on the application. However, from the viewpoint of not impairing the repairability and remoldability exhibited by the present invention, it is preferable that the other resins be in a ratio of 0.5 to 100 parts by mass per 100 parts by mass of the curable compound of the present invention.

[0175] In addition, the curable resin composition of the present invention may be used in combination with a curing accelerator. Examples of the curing accelerator include tertiary amine compounds such as imidazole and dimethylaminopyridine; phosphorus compounds such as triphenylphosphine; boron trifluoride amine complexes such as boron trifluoride and boron trifluoride monoethylamine complex; organic acid compounds such as thiodipropionic acid; benzoxazine compounds such as thiodiphenolbenzoxazine and sulfonylbenzoxazine; and sulfonyl compounds. These may be used alone or in combination of two or more. The amount of these catalysts added is preferably in the range of 0.001 to 15 parts by mass in 100 parts by mass of the curable resin composition.

[0176] When the curable resin composition of the present invention is used for applications requiring high flame retardancy, a non-halogen flame retardant that contains substantially no halogen atoms may be blended therein.

[0177] Examples of the non-halogen flame retardant include phosphorus-based flame retardants, nitrogen-based flame retardants, silicone-based flame retardants, inorganic flame retardants, and organic metal salt-based flame retardants. There are no limitations on the use of these flame retardants. They may be used alone or in combination with a plurality of flame retardants of the same type. Also, flame retardants of different types may be used in combination.

[0178] The phosphorus-based flame retardant may be either inorganic or organic. Examples of inorganic compounds include red phosphorus, ammonium phosphates such as monoammonium phosphate, diammonium phosphate, triammonium phosphate, and ammonium polyphosphate, and inorganic nitrogen-containing phosphorus compounds such as phosphoric acid amide.

[0179] The red phosphorus is preferably surface-treated for the purpose of preventing hydrolysis and the like. Examples of the surface treatment method include (i) a method of coating with an inorganic compound such as magnesium hydroxide, aluminum hydroxide, zinc hydroxide, titanium hydroxide, bismuth oxide, bismuth hydroxide, bismuth nitrate, or a mixture thereof, (ii) a method of coating with a mixture of an inorganic compound such as magnesium hydroxide, aluminum hydroxide, zinc hydroxide, titanium hydroxide, and a thermosetting resin such as a phenolic resin, and (iii) a method of doubly coating with a thermosetting resin such as a phenolic resin on a coating of an inorganic compound such as magnesium hydroxide, aluminum hydroxide, zinc hydroxide, titanium hydroxide, etc.

[0180] Examples of the organophosphorus compound include general-purpose organophosphorus compounds such as phosphate ester compounds, phosphonic acid compounds, phosphinic acid compounds, phosphine oxide compounds, phosphorane compounds, and organic nitrogen-containing phosphorus compounds, as well as cyclic organophosphorus compounds such as 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, and 10-(2,7-dihydroxynaphthyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, and derivatives thereof reacted with compounds such as epoxy resins and phenol resins.

[0181] The amount of these phosphorus-based flame retardants to be added is appropriately selected depending on the type of phosphorus-based flame retardant, other components of the resin composition, and the desired level of flame retardancy. For example, in 100 parts by mass of a resin composition containing all of the non-halogenated flame retardants and other fillers and additives, when red phosphorus is used as the non-halogenated flame retardant, it is preferably added in a range of 0.1 to 2.0 parts by mass, and when an organic phosphorus compound is used, it is similarly preferably added in a range of 0.1 to 10.0 parts by mass, and more preferably added in a range of 0.5 to 6.0 parts by mass.

[0182] When the phosphorus-based flame retardant is used, hydrotalcite, magnesium hydroxide, a boron compound, zirconium oxide, a black dye, calcium carbonate, zeolite, zinc molybdate, activated carbon, or the like may be used in combination with the phosphorus-based flame retardant.

[0183] Examples of the nitrogen-based flame retardant include triazine compounds, cyanuric acid compounds, isocyanuric acid compounds, and phenothiazines, with triazine compounds, cyanuric acid compounds, and isocyanuric acid compounds being preferred.

[0184] Examples of the triazine compounds include melamine, acetoguanamine, benzoguanamine, melon, melam, succinoguanamine, ethylenedimelamine, melamine polyphosphate, triguanamine, and the like, as well as (1) aminotriazine sulfate compounds such as guanylmelamine sulfate, melem sulfate, and melam sulfate, (2) co-condensates of phenols such as phenol, cresol, xylenol, butylphenol, and nonylphenol with melamines such as melamine, benzoguanamine, acetoguanamine, and formguanamine and formaldehyde, (3) mixtures of the co-condensates of (2) with phenolic resins such as phenol-formaldehyde condensates, and (4) compounds obtained by further modifying (2) and (3) with tung oil, isomerized linseed oil, or the like.

[0185] Examples of the cyanuric acid compound include cyanuric acid and melamine cyanurate.

[0186] The amount of the nitrogen-based flame retardant to be blended is appropriately selected depending on the type of nitrogen-based flame retardant, other components of the resin composition, and the desired level of flame retardancy. For example, it is preferable to blend in an amount of 0.05 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass, per 100 parts by mass of the resin composition containing all of the non-halogen flame retardant and other fillers and additives.

[0187] When the nitrogen-based flame retardant is used, a metal hydroxide, a molybdenum compound, or the like may be used in combination.

[0188] The silicone flame retardant can be used without any particular limitation as long as it is an organic compound containing silicon atoms, and examples thereof include silicone oil, silicone rubber, silicone resin, etc. The amount of the silicone flame retardant is appropriately selected depending on the type of silicone flame retardant, other components of the resin composition, and the desired level of flame retardancy, but it is preferable to mix it in the range of 0.05 to 20 parts by mass in 100 parts by mass of the resin composition containing all of the non-halogen flame retardant and other fillers and additives. When using the silicone flame retardant, a molybdenum compound, alumina, etc. may be used in combination.

[0189] Examples of the inorganic flame retardant include metal hydroxides, metal oxides, metal carbonate compounds, metal powders, boron compounds, and low-melting glass.

[0190] Examples of the metal hydroxide include aluminum hydroxide, magnesium hydroxide, dolomite, hydrotalcite, calcium hydroxide, barium hydroxide, and zirconium hydroxide.

[0191] Examples of the metal oxide include zinc molybdate, molybdenum trioxide, zinc stannate, tin oxide, aluminum oxide, iron oxide, titanium oxide, manganese oxide, zirconium oxide, zinc oxide, molybdenum oxide, cobalt oxide, bismuth oxide, chromium oxide, nickel oxide, copper oxide, and tungsten oxide.

[0192] Examples of the metal carbonate compound include zinc carbonate, magnesium carbonate, calcium carbonate, barium carbonate, basic magnesium carbonate, aluminum carbonate, iron carbonate, cobalt carbonate, and titanium carbonate.

[0193] Examples of the metal powder include aluminum, iron, titanium, manganese, zinc, molybdenum, cobalt, bismuth, chromium, nickel, copper, tungsten, and tin.

[0194] Examples of the boron compound include zinc borate, zinc metaborate, barium metaborate, boric acid, and borax.

[0195] The low melting point glass is, for example, Shepley (Boxy Brown), hydrated glass SiO 2 -MgO-H 2 O, PbO-B 2 O 3 system, ZnO-P 2 O 5 -MgO series, P 2 O 5 -B 2 O 3 -PbO-MgO system, P-Sn-OF system, PbO-V 2 O 5 -TeO 2 Series, Al 2 O 3 -H 2 Examples of the glass-like compounds include lead O-based and lead borosilicate-based glass compounds.

[0196] The amount of the inorganic flame retardant to be blended is appropriately selected depending on the type of inorganic flame retardant, other components of the resin composition, and the desired level of flame retardancy. For example, it is preferable to blend in an amount of 0.05 to 20 parts by mass, and more preferably 0.5 to 15 parts by mass, per 100 parts by mass of the resin composition containing all of the non-halogen flame retardant and other fillers and additives.

[0197] Examples of the organometallic salt flame retardant include ferrocene, acetylacetonate metal complexes, organometallic carbonyl compounds, organocobalt salt compounds, organosulfonic acid metal salts, and compounds in which a metal atom is ionic- or coordinate-bonded to an aromatic compound or a heterocyclic compound.

[0198] The amount of the organometallic salt flame retardant to be blended is appropriately selected depending on the type of organometallic salt flame retardant, the other components of the resin composition, and the desired level of flame retardancy. For example, it is preferable to blend in an amount of 0.005 to 10 parts by mass per 100 parts by mass of the resin composition containing all of the non-halogen flame retardant and other fillers, additives, etc.

[0199] The curable resin composition of the present invention may contain a filler. Examples of the filler include inorganic fillers and organic fillers. Examples of the inorganic filler include inorganic fine particles.

[0200] Examples of inorganic fine particles include those with excellent heat resistance, such as alumina, magnesia, titania, zirconia, and silica (quartz, fumed silica, precipitated silica, silicic anhydride, fused silica, crystalline silica, and ultrafine amorphous silica); those with excellent thermal conductivity, such as boron nitride, aluminum nitride, alumina oxide, titanium oxide, magnesium oxide, zinc oxide, silicon oxide, and diamond; those with excellent electrical conductivity, such as metal fillers and / or metal-coated fillers using simple metals or alloys (e.g., iron, copper, magnesium, aluminum, gold, silver, platinum, zinc, manganese, and stainless steel); and those with excellent barrier properties, such as minerals such as mica, clay, kaolin, talc, zeolite, wollastonite, and smectite, potassium titanate, magnesium sulfate, sepiolite, zonolite, and the like. , aluminum borate, calcium carbonate, titanium oxide, barium sulfate, zinc oxide, magnesium hydroxide; those with a high refractive index include barium titanate, zirconia oxide, titanium oxide, etc.; those exhibiting photocatalytic properties include photocatalytic metals such as titanium, cerium, zinc, copper, aluminum, tin, indium, phosphorus, carbon, sulfur, ruthenium, nickel, iron, cobalt, silver, molybdenum, strontium, chromium, barium, lead, etc., composites of the above metals, and oxides thereof; those with excellent wear resistance include metals such as silica, alumina, zirconia, magnesium oxide, etc., and composites and oxides thereof; those with excellent electrical conductivity include metals such as silver and copper, tin oxide, indium oxide, etc.; those with excellent insulation properties include silica, etc.; those with excellent ultraviolet shielding properties include titanium oxide, zinc oxide, etc. These inorganic fine particles can be selected appropriately depending on the application, and can be used alone or in combination of multiple types. In addition, the above inorganic fine particles have various properties other than those listed as examples, so they can be selected appropriately according to the application.

[0201] For example, when silica is used as inorganic fine particles, known silica fine particles such as powdered silica and colloidal silica can be used without any particular limitation. Commercially available powdered silica fine particles include, for example, Aerosil 50 and 200 manufactured by Nippon Aerosil Co., Ltd., Sildex H31, H32, H51, H52, H121, and H122 manufactured by Asahi Glass Co., Ltd., E220A and E220 manufactured by Nippon Silica Industry Co., Ltd., SYLYSIA470 manufactured by Fuji Silysia Co., Ltd., and SG Flake manufactured by Nippon Sheet Glass Co., Ltd.

[0202] Examples of commercially available colloidal silica include methanol silica sol, IPA-ST, MEK-ST, NBA-ST, XBA-ST, DMAC-ST, ST-UP, ST-OUP, ST-20, ST-40, ST-C, ST-N, ST-O, ST-50, and ST-OL, all of which are manufactured by Nissan Chemical Industries, Ltd.

[0203] Surface-modified silica fine particles may be used, for example, the silica fine particles are surface-treated with a reactive silane coupling agent having a hydrophobic group, or modified with a compound having a (meth)acryloyl group. Commercially available powdered silica modified with a compound having a (meth)acryloyl group includes Aerosil RM50, R711, etc. manufactured by Nippon Aerosil Co., Ltd., and commercially available colloidal silica modified with a compound having a (meth)acryloyl group includes MIBK-SD, etc. manufactured by Nissan Chemical Industries, Ltd.

[0204] The shape of the silica fine particles is not particularly limited, and spherical, hollow, porous, rod-like, plate-like, fibrous, or amorphous shapes can be used. The primary particle size is preferably in the range of 5 to 200 nm.

[0205] As the titanium oxide fine particles, not only extender pigments but also ultraviolet light responsive photocatalysts can be used, for example, anatase type titanium oxide, rutile type titanium oxide, brookite type titanium oxide, etc. can be used. Furthermore, particles designed to respond to visible light by doping different elements into the crystal structure of titanium oxide can also be used. As the element to be doped into titanium oxide, anion elements such as nitrogen, sulfur, carbon, fluorine, phosphorus, etc., and cationic elements such as chromium, iron, cobalt, manganese, etc. are preferably used. In addition, as the form, powder, sol dispersed in an organic solvent or water, or slurry can be used. As commercially available powdered titanium oxide fine particles, for example, Aerosil P-25 manufactured by Nippon Aerosil Co., Ltd., ATM-100 manufactured by Teika Co., Ltd., etc. can be used. In addition, as commercially available slurry-like titanium oxide fine particles, for example, TKD-701 manufactured by Teika Co., Ltd., etc. can be used.

[0206] The curable resin composition of the present invention may further contain a fibrous substrate. The fibrous substrate is not particularly limited, but is preferably one used in fiber-reinforced resins, such as inorganic fibers and organic fibers.

[0207] Examples of inorganic fibers include inorganic fibers such as carbon fibers, glass fibers, boron fibers, alumina fibers, and silicon carbide fibers, as well as carbon fibers, activated carbon fibers, graphite fibers, tungsten carbide fibers, silicon carbide fibers (silicon carbide fibers), ceramic fibers, natural fibers, mineral fibers such as basalt, boron nitride fibers, boron carbide fibers, and metal fibers. Examples of the metal fibers include aluminum fibers, copper fibers, brass fibers, stainless steel fibers, and steel fibers.

[0208] Examples of organic fibers include synthetic fibers made of resin materials such as polybenzazole, aramid, PBO (polyparaphenylene benzoxazole), polyphenylene sulfide, polyester, acrylic, polyamide, polyolefin, polyvinyl alcohol, and polyarylate; natural fibers such as cellulose, pulp, cotton, wool, and silk; and regenerated fibers such as protein, polypeptide, and alginic acid.

[0209] Among these, carbon fiber and glass fiber are preferred because they have a wide range of industrial applications. Of these, only one type may be used, or a plurality of types may be used simultaneously.

[0210] The fibrous substrate may be an assembly of fibers, the fibers may be continuous or discontinuous, and may be in the form of a woven or nonwoven fabric. It may also be a fiber bundle in which the fibers are aligned in one direction, or in the form of a sheet in which fiber bundles are arranged. It may also be a three-dimensional shape in which a fiber assembly has a thickness.

[0211] The curable resin composition of the present invention may contain a dispersion medium for the purpose of adjusting the solid content and viscosity of the resin composition. The dispersion medium may be any liquid medium that does not impair the effects of the present invention, and examples of the dispersion medium include various organic solvents and liquid organic polymers.

[0212] Examples of the organic solvent include ketones such as acetone, methyl ethyl ketone (MEK), and methyl isobutyl ketone (MIBK); cyclic ethers such as tetrahydrofuran (THF), and dioxolane; esters such as methyl acetate, ethyl acetate, and butyl acetate; aromatics such as toluene and xylene; and alcohols such as carbitol, cellosolve, methanol, isopropanol, butanol, and propylene glycol monomethyl ether. These can be used alone or in combination, but of these, methyl ethyl ketone is preferred from the standpoint of volatility during coating and solvent recovery.

[0213] The liquid organic polymer is a liquid organic polymer that does not directly contribute to the curing reaction, and examples thereof include acrylic polymers (Floren WK-20: Kyoeisha), amine salts of special modified phosphate esters (HIPLAAD ED-251: Kusumoto Chemicals), and modified acrylic block copolymers (DISPERBYK2000; BYK-Chemie).

[0214] The resin composition of the present invention may contain other compounds, such as catalysts, polymerization initiators, inorganic pigments, organic pigments, extender pigments, clay minerals, waxes, surfactants, stabilizers, flow control agents, coupling agents, dyes, leveling agents, rheology control agents, ultraviolet absorbers, antioxidants, flame retardants, plasticizers, and reactive diluents.

[0215] The resin composition of the present invention can be cured to obtain a cured product. When curing, the resin composition may be cured at room temperature or by heating. When performing heat curing, the resin composition may be cured by one heating step or may be cured by multiple heating steps.

[0216] The curable resin composition of the present invention can also be cured by active energy rays. In that case, a photocationic polymerization initiator may be used as the polymerization initiator. The active energy rays may be visible light, ultraviolet light, X-rays, electron beams, etc.

[0217] Examples of the photocationic polymerization initiator include aryl-sulfonium salts and aryl-iodonium salts, and specifically, arylsulfonium hexafluorophosphate, arylsulfonium hexafluoroantimonate, arylsulfonium tetrakis(pentafluoro)borate, tri(alkylphenyl)sulfonium hexafluorophosphate, etc. The photocationic polymerization initiator may be used alone or in combination of two or more kinds.

[0218] The curable resin composition of the present invention can be prepared by uniformly mixing the above-mentioned components, and the method is not particularly limited. For example, the composition can be prepared by uniformly mixing the components using a pot mill, a ball mill, a bead mill, a roll mill, a homogenizer, a super mill, a homodisper, a universal mixer, a Banbury mixer, a kneader, or the like.

[0219] The curable resin composition of the present invention is prepared by dissolving the above-mentioned curable compound, the compound (III) capable of reacting therewith, and further the above-mentioned curing agent that can be used in combination, the filler, the fibrous substrate, the dispersion medium, and the resin other than the above-mentioned various compounds in a dispersion medium such as the above-mentioned organic solvent, if necessary. After dissolving, the solvent is distilled off, and the curable resin composition can be obtained by drying under reduced pressure using a vacuum oven or the like. In addition, the curable resin composition of the present invention may be in a state in which the above-mentioned constituent materials are uniformly mixed. At this time, it is preferable to mix uniformly using a mixer or the like. The blending ratio of each constituent material can be appropriately adjusted according to the desired characteristics of the cured product, such as mechanical strength, heat resistance, repairability, and remoldability. In addition, in the preparation of the curable resin composition, the specific order of mixing the constituent materials is not particularly limited.

[0220] The cured product of the present invention is obtained by curing the curable resin composition of the present invention. The curing method can be appropriately selected and adopted from known methods depending on the properties of the composition used.

[0221] The cured product of the present invention can maintain good mechanical strength by exhibiting an appropriate crosslinking density as described above. In addition, when mechanical energy such as scratches or external force is applied to the cured product of the present invention, the reversible bonds are broken, so that the product exhibits easy dismantling. Furthermore, since the equilibrium shifts in the direction of the bonds, an adduct is formed again, which is considered to enable repair of scratches and remolding.

[0222] The structure of the obtained cured product can be confirmed by infrared absorption (IR) spectroscopy using Fourier transform infrared spectroscopy (FT-IR) or the like, elemental analysis, X-ray scattering, or the like.

[0223] The curable resin composition of the present invention and a cured product produced from the curable resin composition are excellent in both ease of dismantling and repairability, and also have remoldability, and are useful for the following applications.

[0224] The curable resin cured product of the present invention can be laminated with a substrate to form a laminate. The substrate of the laminate may be an inorganic material such as metal or glass, or an organic material such as plastic or wood, and may be used as appropriate depending on the application. The substrate may be in the shape of a laminate, a flat plate, a sheet, or a three-dimensional structure, or may be three-dimensional. The substrate may have any shape according to the purpose, such as a substrate having a cured surface or a part thereof. There is no restriction on the hardness, thickness, etc. of the substrate. The first substrate, a layer made of the cured product of the curable resin composition of the present invention, and a second substrate may be laminated in this order to form a multilayer laminate. The curable resin composition of the present embodiment has excellent adhesiveness, and therefore can be suitably used as an adhesive for bonding the first substrate and the second substrate. The curable resin cured product of the present invention may be used as a substrate, and the cured product of the present invention may be further laminated.

[0225] In addition, the cured product of the curable resin of the present invention can relieve stress, and therefore can be suitably used for bonding different materials. For example, even in a laminate in which the substrate is a metal and / or metal oxide and the second substrate is a different material such as a plastic layer, the adhesive strength is maintained due to the stress relaxation ability of the cured product of the present invention.

[0226] In the laminate formed by laminating the cured product of the present invention and the substrate, the layer containing the cured product may be formed by direct coating or molding on the substrate, or an already molded product may be laminated. When directly coating, the coating method is not particularly limited, and examples thereof include spraying, spin coating, dip coating, roll coating, blade coating, doctor roll, doctor blade, curtain coating, slit coating, screen printing, and inkjet. When directly molding, examples include in-mold molding, insert molding, vacuum molding, extrusion lamination molding, and press molding. When laminating a molded composition, an uncured or semi-cured composition layer may be laminated and then cured, or a layer containing a cured product obtained by completely curing the composition may be laminated on the substrate. In addition, a precursor that can be a substrate may be coated on the cured product of the present invention and cured to laminate, or the precursor that can be a substrate or the composition of the present invention may be adhered in an uncured or semi-cured state and then cured. The precursor that can be a substrate is not particularly limited, and examples thereof include various curable resin compositions.

[0227] The cured product obtained by using the curable resin composition of the present invention has particularly high adhesion to metals and / or metal oxides, and can be particularly well used as a primer for metals. Metals include copper, aluminum, gold, silver, iron, platinum, chromium, nickel, tin, titanium, zinc, various alloys, and composite materials thereof, and metal oxides include single oxides and / or composite oxides of these metals. In particular, the cured product has excellent adhesion to iron, copper, and aluminum, and can be particularly well used as an adhesive for iron, copper, and aluminum.

[0228] The curable resin composition of the present invention can be suitably used as an adhesive for structural members in the fields of automobiles, trains, civil engineering and construction, electronics, aircraft, and the space industry. Even when used to bond different materials such as between metals and nonmetals, the adhesive can maintain high adhesion without being affected by changes in temperature environment, and peeling and the like is unlikely to occur. In addition to structural member applications, the adhesive can also be used as an adhesive for general office use, medical use, carbon fiber, storage battery cells, modules, and cases, and can be used as an adhesive for bonding optical components, an adhesive for bonding optical disks, an adhesive for mounting printed wiring boards, a die bonding adhesive, an adhesive for semiconductors such as underfills, an underfill for reinforcing BGAs, an anisotropic conductive film, an anisotropic conductive paste, and other mounting adhesives.

[0229] When the curable resin composition of the present invention has a fibrous substrate, and the fibrous substrate is a reinforcing fiber, the curable resin composition containing the fibrous substrate can be used as a fiber-reinforced resin. The method of adding the fibrous substrate to the composition is not particularly limited as long as it does not impair the effects of the present invention, and includes methods of compounding the fibrous substrate and the composition by kneading, coating, impregnation, injection, pressure bonding, etc., and can be appropriately selected depending on the form of the fiber and the use of the fiber-reinforced resin.

[0230] There is no particular limitation on the method of molding the fiber-reinforced resin. If a plate-shaped product is to be manufactured, an extrusion molding method is generally used, but it can also be manufactured by a flat press. In addition, extrusion molding, blow molding, compression molding, vacuum molding, injection molding, etc. can be used. If a film-shaped product is to be manufactured, in addition to the melt extrusion method, a solution casting method can be used. When a melt molding method is used, examples of the method include inflation film molding, cast molding, extrusion lamination molding, calendar molding, sheet molding, fiber molding, blow molding, injection molding, rotational molding, and coating molding. In addition, in the case of a resin that is cured by active energy rays, a cured product can be manufactured using various curing methods using active energy rays. In particular, when a thermosetting resin is used as the main component of the matrix resin, examples of the molding method include a molding method in which the molding material is made into a prepreg and pressurized and heated by a press or autoclave, and other examples of the molding method include RTM (Resin Transfer Molding) molding, VaRTM (Vacuum assist Resin Transfer Molding) molding, lamination molding, and hand layup molding.

[0231] The curable resin composition of the present invention, when used in a cured product, has good heat resistance and repairability, and is also remoldable, and can therefore be used as a molding material for large cases, motor housings, casting materials for the inside of cases, gears, pulleys, etc. These may be cured products of the resin alone, or may be cured products reinforced with fibers such as glass chips.

[0232] The fiber reinforced resin can form a state called an uncured or semi-cured prepreg. After distributing the product in the prepreg state, final curing may be performed to form a cured product. When forming a laminate, it is preferable to form a prepreg, then laminate other layers and then perform final curing, since this allows the formation of a laminate in which each layer is in close contact with each other. The mass ratio of the composition and the fibrous substrate used at this time is not particularly limited, but it is usually preferable to prepare the resin content in the prepreg to be 20 to 60 mass%.

[0233] The cured product of the present invention has good heat resistance and repairability, and has remoldability, and can be used as a heat-resistant material and an electronic material. In particular, it can be suitably used for semiconductor encapsulation materials, circuit boards, build-up films, build-up boards, adhesives, and resist materials. It can also be suitably used as a matrix resin for fiber-reinforced resins, and is particularly suitable as a highly heat-resistant prepreg. The heat-resistant and electronic components thus obtained can be suitably used for various applications, such as industrial machine parts, general machine parts, automobile, railway, and vehicle parts, space and aviation-related parts, electronic and electrical parts, building materials, containers and packaging materials, daily necessities, sports and leisure goods, and housing members for wind power generation, but are not limited thereto.

[0234] In particular, the adhesive can be suitably used as an adhesive for structural members in the fields of automobiles, trains, civil engineering and construction, electronics, aircraft, and the space industry, taking advantage of the excellent flexibility of the cured product. The adhesive of the present invention can maintain high adhesion without being affected by changes in temperature environment, even when used to bond different materials such as between metal and nonmetal, and peeling is unlikely to occur. In addition to structural member applications, the adhesive of the present invention can also be used as an adhesive for general office use, medical use, carbon fiber, storage battery cells, modules, and cases, and examples thereof include adhesives for bonding optical components, adhesives for bonding optical disks, adhesives for mounting printed wiring boards, die bonding adhesives, adhesives for semiconductors such as underfills, underfills for reinforcing BGAs, and mounting adhesives such as anisotropic conductive films and anisotropic conductive pastes.

[0235] Below, we will explain some representative products by giving examples.

[0236] 1. Semiconductor encapsulation materials As a method for obtaining a semiconductor encapsulating material from the resin composition of the present invention, the resin composition, the curing accelerator, and compounding agents such as inorganic fillers are melt-mixed sufficiently until homogeneous using an extruder, kneader, roll, etc. as necessary. In this case, fused silica is usually used as the inorganic filler, but when used as a high thermal conductivity semiconductor encapsulating material for power transistors and power ICs, it is preferable to use highly filled crystalline silica, alumina, silicon nitride, etc., which have a higher thermal conductivity than fused silica, or fused silica, crystalline silica, alumina, silicon nitride, etc. The filling rate is preferably in the range of 30 to 95 mass% per 100 parts by mass of the curable resin composition, and among them, in order to improve flame retardancy, moisture resistance, and solder crack resistance and to reduce the linear expansion coefficient, it is more preferable that the inorganic filler is 70 parts by mass or more, and even more preferable that the inorganic filler is 80 parts by mass or more.

[0237] 2. Semiconductor Devices The semiconductor package molding for obtaining a semiconductor device from the curable resin composition of the present invention can be carried out by molding the semiconductor encapsulating material using a casting machine, a transfer molding machine, an injection molding machine or the like, and then heating the molded product at 50 to 250°C for 2 to 10 hours.

[0238] 3. Printed Circuit Boards A method for obtaining a printed circuit board from the composition of the present invention includes laminating the above prepreg by a conventional method, appropriately overlaying copper foil, and heat-pressing the laminate under a pressure of 1 to 10 MPa at 170 to 300°C for 10 minutes to 3 hours.

[0239] 4. Flexible board The method for producing a flexible substrate from the crosslinkable resin composition of the present invention includes a method comprising the following three steps: The first step is to apply the crosslinkable resin composition containing a resin component, an organic solvent, etc., to an electrical insulating film using a coater such as a reverse roll coater or a comma coater, the second step is to heat the electrical insulating film to which the crosslinkable resin composition has been applied at 60 to 170°C for 1 to 15 minutes using a heater to volatilize the solvent from the electrical insulating film and to bring the crosslinkable resin composition to a B-stage, and the third step is to thermocompress (preferably a compression pressure of 2 to 200 N / cm and a compression temperature of 40 to 200°C) a metal foil to an adhesive on the electrical insulating film to which the crosslinkable resin composition has been brought to a B-stage using a heating roll or the like. If sufficient adhesive performance is obtained by going through the above three steps, the process may be terminated here, but if complete adhesive performance is required, it is preferable to further post-cure under conditions of 100 to 200° C. for 1 to 24 hours. The thickness of the resin composition layer after final curing is preferably in the range of 5 to 100 μm.

[0240] 5. Build-up board The method for obtaining a build-up board from the composition of the present invention includes, for example, the following steps. First, the above composition, which is appropriately blended with rubber, filler, etc., is applied to a circuit board on which a circuit is formed by using a spray coating method, a curtain coating method, etc., and then cured (step 1). Then, if necessary, a predetermined through-hole portion or the like is drilled, treated with a roughening agent, and the surface is washed with hot water to form unevenness, and a metal such as copper is plated (step 2). These operations are repeated as desired, and a resin insulating layer and a conductor layer of a predetermined circuit pattern are alternately built up to form the build-up (step 3). Note that the through-hole portion is drilled after the formation of the outermost resin insulating layer. In addition, the build-up board of the present invention can also be produced by forming a roughened surface by heating and pressing the resin-coated copper foil, which is obtained by semi-curing the resin composition on the copper foil, on a wiring board on which a circuit is formed, at 170 to 300 ° C., thereby omitting the steps of forming a roughened surface and plating.

[0241] 6. Build-up film A build-up film can be obtained from the composition of the present invention by applying the composition to the surface of a support film (Y) as a substrate, and then drying the organic solvent by heating or blowing hot air or the like to form a layer of the composition (X).

[0242] The organic solvent used here preferably includes, for example, ketones such as acetone, methyl ethyl ketone, cyclohexanone, etc., acetate esters such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, carbitol acetate, etc., carbitols such as cellosolve, butyl carbitol, etc., aromatic hydrocarbons such as toluene, xylene, etc., dimethylformamide, dimethylacetamide, N-methylpyrrolidone, etc., and it is preferable to use the organic solvent in a proportion such that the nonvolatile content is 30 to 60 mass%.

[0243] The thickness of the layer (X) formed is usually equal to or greater than the thickness of the conductor layer. Since the thickness of the conductor layer of the circuit board is usually in the range of 5 to 70 μm, the thickness of the resin composition layer is preferably 10 to 100 μm. The layer (X) of the composition in the present invention may be protected with a protective film described below. By protecting the layer with a protective film, it is possible to prevent the adhesion of dirt and the like to the surface of the resin composition layer and prevent scratches.

[0244] Examples of the support film and protective film include polyolefins such as polyethylene, polypropylene, and polyvinyl chloride, polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate, polycarbonate, polyimide, and even release paper and metal foils such as copper foil and aluminum foil. The support film and protective film may be subjected to a matte treatment, corona treatment, and / or release treatment. The thickness of the support film is not particularly limited, but is usually 10 to 150 μm, and is preferably in the range of 25 to 50 μm. The thickness of the protective film is preferably 1 to 40 μm.

[0245] The support film (Y) is peeled off after laminating it on a circuit board or after forming an insulating layer by heat curing. If the support film (Y) is peeled off after the curable resin composition layer constituting the build-up film is heat cured, adhesion of dust and the like during the curing process can be prevented. When peeling off after curing, the support film is usually subjected to a release treatment in advance.

[0246] A multilayer printed circuit board can be manufactured using the build-up film obtained as described above. For example, when the layer (X) is protected by a protective film, the protective film is peeled off, and then the layer (X) is laminated, for example, by a vacuum lamination method, on one or both sides of the circuit board so as to be in direct contact with the circuit board. The lamination method may be a batch method or a continuous method using a roll. If necessary, the build-up film and the circuit board may be heated (preheated) before lamination. The lamination conditions are preferably a pressure bonding temperature (lamination temperature) of 70 to 140°C and a pressure bonding pressure of 1 to 11 kgf / cm2 (9.8×10 4 ~107.9×10 4 N / m 2 ), and lamination is preferably performed under reduced air pressure of 20 mmHg (26.7 hPa) or less.

[0247] 7.Conductive paste A method for obtaining a conductive paste from the composition of the present invention includes, for example, dispersing conductive particles in the composition. The conductive paste can be a paste resin composition for circuit connection or an anisotropic conductive adhesive depending on the type of conductive particles used. EXAMPLES

[0248] The present invention will now be described in detail with reference to examples and comparative examples, in which "parts" and "%" are by weight unless otherwise specified, and the present invention is not limited thereto.

[0249] 1H and 13 C-NMR, FD-MS spectrum, and GPC were measured under the following conditions.

[0250] 1 H-NMR: “JNM-ECA600” manufactured by JEOL RESONANCE Magnetic field strength: 600MHz Number of times: 32 Solvent: DMSO-d 6 Sample concentration: 30% by mass

[0251] 13 C-NMR: “JNM-ECA600” manufactured by JEOL RESONANCE Magnetic field strength: 150MHz Number of times: 320 Solvent: DMSO-d 6 Sample concentration: 30% by mass

[0252] FD-MS: JEOL Ltd. "JMS-T100GC AccuTOF" Measurement range: m / z=50.00~2000.00 Rate of change: 25.6mA / min Final current value: 40mA Cathode voltage: -10kV

[0253] GPC: Tosoh Corporation "HLC-8320GPC" Column: Tosoh Corporation "TSK-GEL G2000HXL" + "TSK-GEL G3000HXL" + "TSK-GEL G4000HXL" Detector: RI (Differential Refractometer) Measurement conditions: 40℃ Mobile phase: Tetrahydrofuran Flow rate: 1ml / min Standard: Tosoh Corporation "PStQuick A", "PStQuick B", "PStQuick E", "PStQuick F"

[0254] The epoxy equivalent of the synthesized epoxy resin was measured according to JIS K7236, and the epoxy equivalent (g / eq) was calculated.

[0255] The number of repeating units can be calculated, for example, from the results of GPC molecular weight measurement, or various appropriate instrumental analyses such as FD-MS and NMR.

[0256] Synthesis Example 1 A flask equipped with a thermometer, a condenser, and a stirrer was charged with 420 g (2.0 equivalents) of diglycidyl ether of 1,12-dodecanediol (manufactured by Yokkaichi Chemical Co., Ltd.: epoxy equivalent 210 g / eq) and 456 g (4.0 equivalents) of bisphenol A (hydroxyl equivalent 114 g / eq), and the temperature was raised to 140°C for 30 minutes, after which 4.0 g of 4% aqueous sodium hydroxide solution was charged. The temperature was then raised to 150°C for 30 minutes, and the reaction was continued for 6 hours at 150°C. A neutralizing amount of sodium phosphate was then added, and 858 g of hydroxy compound (Ph-1) was obtained. This hydroxy compound (Ph-1) was confirmed to contain the target hydroxy compound, as a peak of M+=771 was obtained in the mass spectrum, which corresponds to the theoretical structure of m=1 in the following structural formula (Ph-1). The hydroxyl equivalent of this hydroxy compound (Ph-1) calculated by GPC was 388 g / eq, and the average value of the repeating unit m was 0.8.

[0257] [ka]

[0258] Synthesis Example 2 The reaction was carried out in the same manner as in Synthesis Example 1, except that 420 g (2.0 equivalents) of diglycidyl ether of 1,12-dodecanediol (epoxy equivalent 210 g / eq) in Synthesis Example 1 was replaced with 962 g (2.0 equivalents) of diglycidyl ether of polypropylene glycol (Nagase ChemteX's "Denacol EX-931": epoxy equivalent 481 g / eq), and 1390 g of hydroxy compound (Ph-2) was obtained. This hydroxy compound (Ph-2) was confirmed to contain the target hydroxy compound, since a peak of M+=1225 corresponding to the theoretical structure of m=1 and n2=10 in the following structural formula (Ph-2) was obtained in the mass spectrum. The hydroxyl group equivalent of this hydroxy compound (Ph-2) calculated by GPC was 593 g / eq, and the average value of the repeating unit m was 0.8.

[0259] [ka]

[0260] Synthesis Example 3 In a flask equipped with a thermometer, a dropping funnel, a condenser, and a stirrer, 388 g (hydroxyl equivalent: 388 g / eq) of the hydroxy compound (Ph-1) obtained in Synthesis Example 1, 1110 g (12.0 mol) of epichlorohydrin, and 300 g of n-butanol were added and dissolved while purging with nitrogen gas into the flask. After that, the temperature was raised to 65°C, and the pressure was reduced to an azeotropic pressure, and 122.4 g (1.5 mol) of a 49% aqueous sodium hydroxide solution was added dropwise over 5 hours. Next, stirring was continued for 0.5 hours under the same conditions. During this time, the distillate distilled by azeotropy was separated using a Dean-Stark trap, the water layer was removed, and the oil layer was returned to the reaction system while the reaction was continued. After that, the unreacted epichlorohydrin was distilled off by vacuum distillation. 1000g of methyl isobutyl ketone and 110g of n-butanol were added to the obtained crude epoxy resin and dissolved. Further, 20.0 g of a 10% aqueous solution of sodium hydroxide was added to this solution, and the mixture was reacted at 80° C. for 2 hours, after which the mixture was washed three times with 300 g of water until the pH of the washing liquid became neutral. Next, the system was dehydrated by azeotropy, and after microfiltration, the solvent was distilled off under reduced pressure to obtain 399 g of epoxy compound (Ep-1). The epoxy equivalent of the obtained epoxy compound (Ep-1) was 488 g / eq. The epoxy resin was confirmed to contain the target epoxy compound (Ep-1) because a peak of M+=883 was obtained in the mass spectrum, which corresponds to the theoretical structure of m=1, q=1, p1=0, and p2=0 in the following structural formula (Ep-1). The obtained epoxy compound (Ep-1) contained a compound with q=0, and when confirmed by GPC, the mixture contained 20.5% of the compound with q=0, and the average value of the repeating unit q was 0.8.

[0261] [ka]

[0262] Synthesis Example 4 The reaction was carried out in the same manner as in Synthesis Example 3, except that 388 g (hydroxyl equivalent 388 g / eq) of the hydroxyl compound (Ph-1) in Synthesis Example 3 was replaced with 593 g (hydroxyl equivalent 593 g / eq) of the hydroxyl compound (Ph-2), and 584 g of the epoxy compound (Ep-2) was obtained. The epoxy equivalent of the obtained epoxy compound (Ep-2) was 714 g / eq. The epoxy compound was confirmed to contain the target epoxy compound (Ep-2) since a peak of M+=1336 corresponding to the theoretical structure of m=1, n2=10, q=1, p1=0, and p2=0 in the following structural formula (Ep-2) was obtained in the mass spectrum. The obtained epoxy compound (Ep-2) contained a compound with q=0, and when confirmed by GPC, the mixture contained 16.8% of the compound with q=0, and the average value of the repeating unit q was 0.8.

[0263] [ka]

[0264] Synthesis Example 5 An epoxy compound (Ep-3) was synthesized according to the method described in J. Network Polym., Jpn., Vol. 29, 208; 2008. The epoxy equivalent of the obtained epoxy compound (Ep-3) was 450 g / eq.

[0265] [ka]

[0266] Synthesis Example 6 In a flask equipped with a thermometer, a condenser, and a stirrer, 840g (4.0 equivalents) of diglycidyl ether of 1,12-dodecanediol (manufactured by Yokkaichi Chemical Co., Ltd.: epoxy equivalent 210g / eq) and 228g (2.0 equivalents) of bisphenol A (hydroxyl equivalent 114g / eq) were charged, and the temperature was raised to 140°C for 30 minutes, after which 4.0g of 4% aqueous sodium hydroxide solution was charged. The temperature was then raised to 150°C for 30 minutes, and the reaction was continued at 150°C for 6 hours. A neutralizing amount of sodium phosphate was then added, and 1047g of epoxy compound (Ep-4) was obtained. This epoxy compound (Ep-4) was confirmed to contain the desired epoxy compound, as a peak of M+=856, which corresponds to the theoretical structure of m=1 in the following structural formula (Ep-4), was obtained in the mass spectrum. The epoxy equivalent of this epoxy compound (Ep-4) was 415 g / eq, and the average value of the repeating unit m was 0.8.

[0267] [ka]

[0268] Synthesis Example 7 The reaction was carried out in the same manner as in Synthesis Example 6, except that 840 g (4.0 equivalents) of diglycidyl ether of 1,12-dodecanediol (manufactured by Yokkaichi Chemical Co., Ltd.: epoxy equivalent 210 g / eq) in Synthesis Example 6 was replaced with 1924 g (4.0 equivalents) of diglycidyl ether of polypropylene glycol ("Denacol EX-931" manufactured by Nagase ChemteX: epoxy equivalent 481 g / eq), to obtain 2109 g of epoxy compound (Ep-5). This epoxy compound (Ep-5) was confirmed to contain the desired epoxy compound, since a peak of M+=1764 was obtained in the mass spectrum, which corresponds to the theoretical structure of m=1 and n2=10 in the following structural formula (Ep-5). The epoxy equivalent of this epoxy compound (Ep-5) was 973 g / eq, and the average value of the repeating unit m was 0.8.

[0269] [ka]

[0270] Example 1 In a flask equipped with a thermometer, a condenser, and a stirrer, 48.8 g (epoxy equivalent 488 g / eq) of the epoxy compound (Ep-1) obtained in Synthesis Example 3 and 2.4 g (0.01 mol) of furfurylamine (Kanto Chemical) were charged, and the temperature was raised to 125°C over 90 minutes, and then the mixture was reacted at 125°C for 18 hours to obtain 46.1 g of furan compound (F-1). The epoxy equivalent of the obtained furan compound (F-1) was 1004 g / eq. This furan compound (F-1) was confirmed to contain the target furan compound (F-1) because a peak of M+=1861, which corresponds to the theoretical structure of m=1 and n=1 in the following structural formula (F-1), was obtained in the mass spectrum.

[0271] [ka]

[0272] Example 2 The same reaction as in Example 1 was carried out, except that 48.8 g (epoxy equivalent 488 g / eq) of the epoxy compound (Ep-1) in Example 1 was changed to 71.4 g (epoxy equivalent 714 g / eq) of the epoxy compound (Ep-2), to obtain 66.4 g of a furan compound (F-2). The epoxy equivalent of the obtained furan compound (F-2) was 1447 g / eq.

[0273] [ka]

[0274] Example 3 The reaction was carried out in the same manner as in Example 1, except that 48.8 g (epoxy equivalent 488 g / eq) of the epoxy compound (Ep-1) in Example 1 was replaced with 45.0 g (epoxy equivalent 450 g / eq) of the epoxy compound (Ep-3), and 42.7 g of the furan compound (F-3) was obtained. The epoxy equivalent of the obtained furan compound (F-3) was 930 g / eq. This furan compound (F-3) was confirmed to contain the target furan compound (F-3) since a peak of M+=1637 corresponding to the theoretical structure of m=1 and n=1 in the following structural formula (F-3) was obtained in the mass spectrum.

[0275] [ka]

[0276] Example 4 The reaction was carried out in the same manner as in Example 1, except that 48.8 g (epoxy equivalent 488 g / eq) of the epoxy compound (Ep-1) in Example 1 was replaced with 21.0 g of diglycidyl ether of 1,12-dodecanediol (manufactured by Yokkaichi Synthetic Co., Ltd.: epoxy equivalent 210 g / eq), and 21.1 g of a furan compound (F-4) was obtained. The epoxy equivalent of the obtained furan compound (F-4) was 459 g / eq. This furan compound (F-4) was confirmed to contain the target furan compound (F-4) because a peak of M+=725 corresponding to the theoretical structure of n=1 in the following structural formula (F-4) was obtained in the mass spectrum.

[0277] [ka]

[0278] Example 5 The reaction was carried out in the same manner as in Example 1, except that 48.8 g (epoxy equivalent 488 g / eq) of the epoxy compound (Ep-1) in Example 1 was replaced with 48.1 g of diglycidyl ether of polypropylene glycol ("Denacol EX-931" manufactured by Nagase ChemteX: epoxy equivalent 481 g / eq), and 45.5 g of a furan compound (F-5) was obtained. The epoxy equivalent of the obtained furan compound (F-5) was 990 g / eq. This furan compound (F-5) was confirmed to contain the target furan compound (F-5) since a peak of M+=1633 corresponding to the theoretical structure of n=1, n2=10 in the following structural formula (F-5) was obtained in the mass spectrum.

[0279] [ka]

[0280] Example 6 The same reaction as in Example 1 was carried out except that 48.8 g (epoxy equivalent: 488 g / eq) of the epoxy compound (Ep-1) in Example 1 was changed to 41.5 g (epoxy equivalent: 415 g / eq) of the epoxy compound (Ep-4), to obtain 39.5 g of a furan compound (F-6). The epoxy equivalent of the obtained furan compound (F-6) was 861 g / eq.

[0281] [ka]

[0282] Example 7 The same reaction as in Example 1 was carried out except that 48.8 g (epoxy equivalent 488 g / eq) of the epoxy compound (Ep-1) in Example 1 was changed to 97.3 g (epoxy equivalent 973 g / eq) of the epoxy compound (Ep-5), to obtain 89.8 g of a furan compound (F-7). The epoxy equivalent of the obtained furan compound (F-7) was 1955 g / eq.

[0283] [ka]

[0284] Example 8 3.4 g of the furan compound (F-1) obtained in Example 1, 0.6 g of 4,4'-diphenylmethane bismaleimide (BMI-1000 manufactured by Daiwa Kasei Kogyo Co., Ltd.), and 13 g of DMF were weighed out, mixed and dissolved uniformly, and then poured onto an aluminum tray covered with a tetrafluoroethylene sheet. This solution was reacted in a dryer at 60°C for 48 hours, and then the DMF was distilled off by vacuum degassing to obtain 3.9 g of Diels-Alder reaction product (D-1). The epoxy equivalent of the obtained furan compound (D-1) was 1181 g / eq.

[0285] Comparative synthesis example 1 The same reaction as in Example 1 was carried out except that 48.8 g (epoxy equivalent 488 g / eq) of the epoxy compound (Ep-1) in Example 1 was changed to 18.8 g (epoxy equivalent 188 g / eq) of a bisphenol A type liquid epoxy resin “E-850S” (manufactured by DIC Corporation), to obtain 19.1 g of a furan compound (F-8).

[0286] [ka]

[0287] Comparative synthesis example 2 A furan compound (F-9) whose main chain is made of a urethane polymer was obtained by referring to a previously reported synthesis method (Express Polymer Letters Vol.7, No.7(2013)636-650).

[0288] [ka]

[0289] Synthesis Example 8 The reaction was carried out in the same manner as in Synthesis Example 1, except that the amount of diglycidyl ether of 1,12-dodecanediol (epoxy equivalent 210g / eq) in Synthesis Example 1 was changed from 420g (2.0 equivalents) to 798g (3.8 equivalents), and 1207g of hydroxy compound (Ph-3) was obtained. This hydroxy compound (Ph-4) was confirmed to contain the target hydroxy compound, since a peak of M+=771 corresponding to the theoretical structure of m=1 in the following structural formula (Ph-3) was obtained in the mass spectrum. The hydroxyl group equivalent of this hydroxy compound (Ph-3) calculated by GPC was 2000g / eq, and the average value of the repeating unit m was 6.9.

[0290] [ka]

[0291] Synthesis Example 9 The reaction was carried out in the same manner as in Synthesis Example 1, except that 420 g (2.0 equivalents) of diglycidyl ether of 1,12-dodecanediol (epoxy equivalent 210 g / eq) in Synthesis Example 1 was replaced with 1603 g (3.3 equivalents) of diglycidyl ether of polypropylene glycol (Nagase ChemteX's "Denacol EX-931": epoxy equivalent 481 g / eq), and 2012 g of hydroxy compound (Ph-4) was obtained. This hydroxy compound (Ph-4) was confirmed to contain the target hydroxy compound, since a peak of M+=1226 corresponding to the theoretical structure of m=1 and n2=10 in the following structural formula (Ph-94) was obtained in the mass spectrum. The hydroxyl group equivalent of this hydroxy compound (Ph-4) calculated by GPC was 1802 g / eq, and the average value of the repeating unit m was 3.4.

[0292] [ka]

[0293] Synthesis Example 10 The reaction was carried out in the same manner as in Synthesis Example 3, except that 388 g (hydroxyl equivalent 388 g / eq) of the hydroxy compound (Ph-1) in Synthesis Example 3 was replaced with 2000 g (hydroxyl equivalent 2000 g / eq) of the hydroxy compound (Ph-3), to obtain 2120 g of an epoxy compound (Ep-6). The epoxy equivalent of the obtained epoxy compound (Ep-6) was 2320 g / eq. The epoxy resin was found by mass spectrometry to have the following structural formula (Ep-6) in which m=1, q=1, p 1 =0, p 2 A peak of M+=883, which corresponds to the theoretical structure of q=0, was obtained, confirming that it contained the target epoxy compound (Ep-6). The obtained epoxy compound (Ep-6) contained a compound with q=0, and when confirmed by GPC, it was found that the mixture contained 0.7% of the compound with q=0, and the average value of the repeating unit q was 6.3.

[0294] [ka]

[0295] Synthesis Example 11 The reaction was carried out in the same manner as in Synthesis Example 3, except that 388 g (hydroxyl equivalent 388 g / eq) of the hydroxyl compound (Ph-1) in Synthesis Example 3 was replaced with 1802 g (hydroxyl equivalent 1802 g / eq) of the hydroxyl compound (Ph-4), and 1851 g of the epoxy compound (Ep-7) was obtained. The epoxy equivalent of the obtained epoxy compound (Ep-7) was 1895 g / eq. The epoxy compound was confirmed to contain the target epoxy compound (Ep-7) since a peak of M+=1336 was obtained in the mass spectrum, which corresponds to the theoretical structure of m=1, n2=11, q=1, p1=0, and p2=0 in the following structural formula (Ep-7). The obtained epoxy compound (Ep-7) contained a compound with q=0, and when confirmed by GPC, the mixture contained a compound with q=0 at a ratio of 2.8%, and the average value of the repeating unit q was 3.1.

[0296] [ka]

[0297] Preparation of composition and cured product Each compound was mixed uniformly in a mixer (Thinky Corporation's "Awatori Rentaro ARV-200") according to the formulations in Tables 1 to 5 (the numbers in the tables are by weight) to obtain a curable resin composition. This curable resin composition was sandwiched between aluminum mirror plates (Engineering Test Service Corporation's "JIS H 4000 A1050P") using a silicon tube as a spacer, and heat cured under specified conditions to obtain a cured product with a thickness of 0.7 mm.

[0298] <Tensile elongation> The resulting cured product was punched out into a dumbbell shape (JIS K 7161-2-1BA) using a punching blade to prepare a test specimen. A tensile test of the test specimen was carried out in accordance with JIS K 7162-2 using a tensile tester (Shimadzu Corporation's "Autograph AG-IS") to evaluate the elongation at break in a measurement environment of 23°C (test speed: 2 mm / min).

[0299] <High temperature and humidity test> The obtained cured product was placed in a constant temperature and humidity tester ("PSL-2J" manufactured by Espec Corporation) and exposed to an environment of 85°C / 85% for 1000 hours, and the appearance of the cured product was evaluated.

[0300] <Remolding test> The cured product was freeze-pulverized. 0.07 g of the pulverized cured product was placed in a 10 mm square, 0.5 mm thick mold and vacuum pressed at 150°C for 4 hours at 10 MPa, followed by aging at 60°C for 24 hours. The appearance of the resulting cured product was visually observed. The evaluation criteria were as follows: A: The seams disappeared and the hardened material became one piece. B: Some of the seams are visible to the naked eye, but the hardened material has become one piece. C: It had a solidified shape and broke apart when light pressure was applied.

[0301] <Repair Test> The cured product was cut with a razor, the resulting fractured surfaces were brought into contact, and then aged in a dryer at 130°C for 30 minutes and 60°C for 24 hours. After removing from the dryer, the cut surfaces of the cured products were visually inspected for adhesion. The criteria for judgment were as follows: A: The bond does not come apart even when the cured product is bent 90 degrees. B: The material is bonded, and when the hardened material is bent, the bond comes apart. C: No bonding.

[0302] <Dismantling test> Each compound was used in the formulation according to Tables 1 to 5 (numbers in the tables are based on mass), and mixed uniformly in a mixer (Thinky Corporation's "Awatori Rentaro ARV-200") to obtain a curable resin composition. This resin composition was applied to one of two cold-rolled steel plates (TP Giken Co., Ltd.'s "SPCC-SD", 1.0 mm x 25 mm x 100 mm), glass beads (Potters Ballotini Co., Ltd.'s "J-80") were added as spacers, and the other SPCC-SD was attached (adhesive area: 25 mm x 12.5 mm). This was heat-cured at temperatures according to Tables 1 to 4 to obtain a test piece. This test piece was hung in a dryer at 120°C, and a weight of 500 g was applied to one side of the substrate. It was left to stand for 30 minutes in this state, and the adhesion state of the substrate was evaluated. The evaluation criteria are as follows. A: The adhesive part shifted, and the adhesive base material on the side to which the load was applied fell. B: The adhesive part became misaligned. C: No change occurred in the substrate.

[0303] [Table 1]

[0304] [Table 2]

[0305] [Table 3]

[0306] [Table 4]

[0307] [Table 5]

[0308] The compositions shown in the table are as follows: E-850S: Bisphenol A type liquid epoxy resin (DIC Corporation, epoxy equivalent 188g / eq) BMI-TMH: 1,6'-bismaleimido-(2,2,4-trimethyl)hexane DICY: Dicyandiamide ("DICY7" manufactured by Mitsubishi Chemical Corporation) DCMU: 3-(3,4-dichlorophenyl)-1,1-dimethylurea (DIC Corporation, "B-605-IM") DTA: Diethylenetriamine (Kanto Chemical)

Claims

1. A curable compound represented by the following general formula (1): 【Chemistry 1】 [In formula (1), R represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group; Z １ is as follows (Z １ -1) to (Z １ -7) 【Chemistry 2】 [Formula (Z １ -1), (Z １ -2), (Z １ -3), (Z １ -4), (Z １ -5), (Z １ -6), (Z １ -7), among Each Ar is independently a structure having an unsubstituted or substituted aromatic ring, R １１ , R １２ each independently represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R １３ , R １４ is a hydrogen atom or a methyl group, R １ , R ２ each independently represents a hydrogen atom, a methyl group, or an ethyl group, Each R' is independently a divalent hydrocarbon group having 2 to 12 carbon atoms; n is the average value of the repeating units and is from 0.5 to 10; n1 is an integer from 4 to 16, n2 is the average value of the repeating units and is from 2 to 30. Expression (Z １ X in formula (Z １ -1-1), and Y is a structural unit represented by the following general formula (Z １ -1-2) is a structural unit represented by 【Chemistry 3】 <Formula (Z １ -1-1), (Z １ -1-2) Middle, Ar, R １ , R ２ , R′, n1, and n2 are the same as above; R ３ , R ４ , R ７ , R ８ each independently represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R ５ , R ６ , R ９ , R １０ are each independently a hydrogen atom or a methyl group. m1, m2, m3, m4, m5, m6, p1, p2, and q are the average values ​​of the repetitions, m1, m2, m3, m4, m5, and m6 each independently represent 0 to 25, and m1+m2≧1; p1 and p2 each independently represent 0 to 5; q is 0.5 to 5. However, the general formula (Z １ -1-1) and X represented by the general formula (Z １ The bonds to Y represented by (1-1-2) may be random or block, and the total numbers of the structural units X and Y present in one molecule are m1 and m2, respectively.] Z ２ is represented by the following general formula (Z2) 【Chemistry 4】 (Z ３ is a structure having a furan skeleton, R １５ , R １６ each independently represents a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R １７ , R １８ is a hydrogen atom or a methyl group. In each formula, * represents a bonding point.

2. A curable compound (II) containing a reversible bond formed by a Diels-Alder reaction between a structure having a furan skeleton and a diene parent compound in the curable compound (I) represented by the general formula (1) of claim 1.

3. A curable compound (II) containing a reversible bond formed by a Diels-Alder reaction between a structure having a furan skeleton and a diene parent compound in the curable compound (I) represented by the general formula (1) of claim 1; a compound (III) having reactivity with a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, which is a terminal curable functional group in the curable compound (II); A curable resin composition comprising:

4. the terminal curable functional group in the curable compound (II) is a hydroxyl group, The curable resin composition according to claim 3, wherein the compound (III) is an epoxy resin.

5. the terminal curable functional group in the curable compound (II) is a glycidyl ether group, The curable resin composition according to claim 3, wherein the compound (III) is a curing agent for epoxy resins.

6. The curable resin composition according to any one of claims 3 to 5, wherein a concentration of reversible bonds by Diels-Alder reaction relative to a total mass of the curable components in the curable resin composition is 0.10 mmol / g or more.

7. The curable resin composition according to claim 3, which is one or more compositions selected from the group consisting of an easily dismantlable composition, a repairable composition, and a remolding material composition.

8. A cured product obtained by curing the curable resin composition according to claim 7.

9. A laminate comprising a substrate and a layer comprising the cured product according to claim 8.

10. A heat-resistant member comprising the cured product according to claim 8.

11. A curable compound (I) represented by the general formula (1) of claim 1, A diene parent compound; a compound (III) having reactivity with a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, which is a terminal curable functional group in the curable compound (I); A curable resin composition comprising:

12. the terminal curable functional group in the curable compound (I) is a hydroxyl group, The curable resin composition according to claim 11, wherein the compound (III) is an epoxy resin.

13. the terminal curable functional group in the curable compound (I) is a glycidyl ether group, The curable resin composition according to claim 11, wherein the compound (III) is a curing agent for an epoxy resin.

14. The curable resin composition according to any one of claims 11 to 13, wherein a concentration of reversible bonds formed by a Diels-Alder reaction between a conjugated diene structure and a diene parent compound relative to a total mass of the curable components in the curable resin composition is 0.10 mmol / g or more.

15. The curable resin composition according to claim 11, which is one or more compositions selected from the group consisting of an easily dismantled composition, a repairable composition, and a remolding material composition.

16. A cured product obtained by curing the curable resin composition according to claim 11.

17. A laminate comprising a substrate and a layer comprising the cured product according to claim 16.

18. A heat-resistant component comprising the cured product according to claim 16.

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