Confined charge trapping layer

Abstract

Selective deposition of a silicon nitride (SiN) trapping layer for forming a memory device is described. A sacrificial layer is used for selective deposition to enable selective trap deposition. The trapping layer is formed by deposition of a mold, including the sacrificial layer, memory hole (MH) patterning, recessing the sacrificial layer from the MH side, forming a deposition-enabling layer (DEL) on the side of the recess, and selective deposition of the trapping layer. After removing the sacrificial layer from the slit pattern opening, the deposition-enabling layer (DEL) is converted to an oxide that is used as a blocking oxide.

Description

[Technical field]

[0001]

[0001] Embodiments of the present disclosure relate to the field of electronic devices and methods and apparatus for manufacturing electronic devices. In particular, embodiments of the present disclosure provide a method for forming a 3D-NAND mold stack. [Background technology]

[0002]

[0002] Semiconductor technology is advancing rapidly, and device dimensions are shrinking with the advancement of technology to provide faster processing and larger storage capacity per unit space. In NAND devices, the string current needs to be high enough to obtain enough current to distinguish between on-cells and off-cells. The string current depends on the carrier mobility that is enhanced by increasing the grain size of the silicon channel.

[0003]

[0003] Existing 3D-NAND memory stacks with alternating oxide and nitride layers have a confined silicon nitride (SiN) charge trapping layer formed by deposition of successive trapping layers. Existing 3D-NAND memory stacks have cell performance degradation in charge trap-based memories due to charge diffusion and cell-to-cell interference that is exacerbated by reducing the cell-to-cell distance.

[0004]

[0004] Therefore, there is a need in the art for a 3D-NAND device having a confined charge trapping layer that reduces performance degradation in charge trap based memories. Further, there is a need in the art for a method and apparatus for forming the 3D-NAND device. Summary of the Invention

[0005]

[0005] One or more embodiments of the present disclosure are directed to a method of forming a memory device. In one embodiment, a method of forming an electronic device includes forming an opening in a memory stack including alternating layers of a first material layer and a second material layer, the memory stack being on a common source line, forming an opening, recessing a second material layer through the opening to form a first recessed region, forming a deposition enabling layer (DEL) on a surface of the first recessed region, recessing the deposition enabling layer (DEL) to form a second recessed region, and selectively depositing a trapping layer in the second recessed region.

[0006]

[0006] Further embodiments of the present disclosure are directed to memory devices. In one embodiment, a non-volatile memory device includes a memory stack including a memory cell and a memory hole. The memory cell includes a gate, a channel layer, and a trap layer trapped between the gate and the channel layer. The memory hole extends through the memory stack and has a first portion and a second portion. The second portion includes a common source layer. The trap layer is on a sidewall of the common source layer.

[0007]

[0007] Further embodiments of the present disclosure are directed to a processing tool. In one embodiment, the processing tool includes a central transfer station with a robot configured to move a wafer, a plurality of process stations, each process station connected to the central transfer station and each process station with a trap layer selective deposition chamber providing a processing area isolated from the processing area of ​​an adjacent process station, and a controller connected to the central transfer station and the plurality of process stations, configured to activate the robot to move the wafer between the plurality of process stations and to control the process performed at each of the plurality of process stations.

[0008]

[0008] In order to understand the features of the present disclosure in detail, a more specific description of the present disclosure briefly summarized above can be obtained by referring to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the attached drawings show only typical embodiments of the present disclosure, and therefore should not be considered as limiting the scope of the present disclosure, since the present disclosure may admit of other equally effective embodiments. The embodiments described herein are described with the attached drawings for illustration and not limitation, in which similar elements are indicated by similar reference numerals. [Brief description of the drawings]

[0009] [Figure 1]

[0009] A process flow diagram of a method for forming a memory device according to several embodiments described herein is shown. [Diagram 2]

[0010] 1 illustrates a cross-sectional view of an electronic device having a memory stack according to one or more embodiments. [Diagram 3]

[0011] 1 illustrates a cross-sectional view of an electronic device after forming a stepped pattern of a memory stack according to one or more embodiments. [Figure 4A]

[0012] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 4B]

[0013] 4B shows an expanded view of region 103 of the substrate of FIG. 4A according to one or more embodiments. [Figure 5A]

[0014] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 5B]

[0015] 1 shows an expanded view of region 103 according to one or more embodiments. [Figure 6A]

[0016] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 6B]

[0017] 1 shows an expanded view of region 103 according to one or more embodiments. [Figure 7A]

[0018] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 7B]

[0019] 1 shows an expanded view of region 103 according to one or more embodiments. [Figure 8A]

[0020] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 8B]

[0021] 1 shows an expanded view of region 103 according to one or more embodiments. [Figure 9A]

[0022] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 9B]

[0023] 1 shows an expanded view of region 103 according to one or more embodiments. [Figure 10A]

[0024] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 10B]

[0025] 1 shows an expanded view of area 165 according to one or more embodiments. [Figure 10C]

[0026] A close-up view of area 167 is shown in accordance with one or more embodiments. [Figure 11]

[0027] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 12]

[0028] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 13]

[0029] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 14]

[0030] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 15]

[0031] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 16]

[0032] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 17]

[0033] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 18]

[0034] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 19]

[0035] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 20A]

[0036] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 20B]

[0037] 1 shows an expanded view of area 185 according to one or more embodiments. [Figure 20C]

[0038] An expanded view of area 187 is shown in accordance with one or more embodiments. [Figure 21]

[0039] 1 illustrates a cross-sectional view of an electronic device according to one or more embodiments. [Figure 22]

[0040] 1 illustrates a cluster tool in accordance with one or more embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010]

[0041] Before describing certain example embodiments of the present disclosure, it is to be understood that the present disclosure is not limited to the details of construction or process steps set forth in the following description as being capable of other embodiments and of being practiced or carried out in various ways.

[0011]

[0042] As used herein and in the appended claims, the terms "precursor," "reactant," "reactant gas," and the like are used interchangeably to refer to any gas species capable of reacting with the substrate surface.

[0012]

[0043] In the following description, numerous specific details are set forth, such as specific materials, chemical properties, dimensions of elements, etc., to enable a detailed understanding of one or more embodiments of the present invention. However, it will be apparent to one of ordinary skill in the art that one or more embodiments of the present disclosure may be practiced without these specific details. In other instances, semiconductor manufacturing processes, techniques, materials, equipment, etc. are not described in detail so as not to unnecessarily obscure the description. Using the description contained herein, one of ordinary skill in the art will be able to implement the appropriate functionality without undue experimentation.

[0013]

[0044] While certain exemplary embodiments of the present disclosure have been described and illustrated in the accompanying drawings, it is to be understood that such embodiments are merely illustrative and do not limit the disclosure, and that the disclosure is not limited to the specific constructions and arrangements shown and described, since modifications may occur to those skilled in the art.

[0014]

[0045] In existing 3D NAND stacks based on charge traps as storage layers, the charge traps are a continuous layer. The continuous charge trapping layer introduces two key challenges that prevent the scaling down of the word line (WL) to the WL insulator: cell-to-cell interference and lateral charge diffusion. In one or more embodiments, the trapping layer under the source and drain (S / D) of each cell is removed (i.e., trap cut or confined structure) to suppress cell-to-cell interference and lateral charge diffusion. The existing trap cut structure is problematic in that it has partial use of the gate area and shape and thickness variations in the silicon nitride (SiN) due to the deposition and removal process. Therefore, one or more embodiments provide a novel structure and method that efficiently places the trapping layer for a given word line thickness and allows suppressed shape and thickness variations of the trapping layer.

[0015]

[0046] One or more embodiments provide selective deposition of a silicon nitride (SiN) trapping layer. In one or more embodiments, a sacrificial layer for selective deposition (also called deposition enabling layer (DEL)) is used to enable selective trapping SiN deposition. In one or more embodiments, the trapping layer is formed by deposition of a mold including a sacrificial layer, memory hole (MH) patterning, recessing the sacrificial layer from the MH side, forming a depositable layer (DEL) on the side of the recess, and selectively depositing the trapping layer. In one or more embodiments, a blocking oxide is formed after removing the sacrificial layer from the slit side. The deposition enabling layer (DEL) can be converted to an oxide to be used as a blocking oxide. In one or more embodiments, a high-k dielectric layer, a barrier layer, and a word line (WL) are then formed.

[0016]

[0047] In one or more embodiments, the trapping layer is advantageously confined only between the tunnel oxide and the wordline. Cell-to-cell interference and lateral diffusion are advantageously suppressed. In one or more embodiments, the selective deposition of the trapping layer advantageously suppresses variations in the shape and thickness of the trapping layer.

[0017]

[0048] In one or more embodiments, metal deposition and other processes may be performed in an isolated environment (e.g., a cluster processing tool). Accordingly, some embodiments of the present disclosure provide an integrated tool system with associated process modules for performing the methods.

[0018]

[0049] FIG. 1 shows a flow chart for an exemplary method 10 for forming a memory device. Those skilled in the art will recognize that the method 10 may include any or all of the illustrated processes. Furthermore, the order of the individual processes may be changed for some parts. The method 10 may begin with any of the listed processes without departing from the present disclosure. With reference to FIG. 1, in operation 15, a memory stack is formed. In operation 20, a word line staircase is formed in the memory stack. In operation 25, a memory hole channel is patterned into the word line staircase. In operation 30, optionally, a first layer, for example, a nitride layer, may be recessed through the memory hole channel. In operation 35, a polysilicon layer is deposited. In operation 40, the polysilicon layer is recessed. In operation 45, a trap layer is deposited. In operation 50, a bit line pad is formed. In operation 55, the memory staircase is slit patterned. In operation 60, the sacrificial layer is removed and replaced. In operation 65, the first layer, e.g., a nitride layer, is removed. In operation 70, the polysilicon layer is oxidized to form a blocking oxide. In operation 75, the wordline material is deposited. In operation 80, the slits are filled, and in operation 85, the wordline contacts are formed.

[0019]

[0050] 2-21 show a portion of memory device 100 following the process flow illustrated for method 10 of FIG.

[0020]

[0051] In Figure 2, an initial or starting memory stack of an electronic device 100 is shown in accordance with one or more embodiments of the present disclosure. In some embodiments, the electronic device 100 shown in Figure 2 is formed on a bare substrate 102 in layers as shown. The electronic device of Figure 2 is comprised of a substrate 102, a common source line 120, and a memory stack 130.

[0021]

[0052] The substrate 102 may be any suitable material known to those of skill in the art. As used herein and in the appended claims, the term "substrate" refers to a surface or portion of a surface on which a process is performed. Those of skill in the art will also understand that a reference to a substrate may refer to only a portion of the substrate, unless the context clearly indicates otherwise. Furthermore, a reference to deposition on a substrate may refer to both a bare substrate and a substrate having one or more films or features deposited or formed on its surface.

[0022]

[0053] As used herein, "substrate" refers to any substrate or material surface formed on a substrate on which a film treatment is performed during a manufacturing process. For example, substrate surfaces on which treatment may be performed include materials such as silicon, silicon oxide, strained silicon, silicon-on-insulator (SOI), carbon-doped silicon oxide, amorphous silicon, doped silicon, germanium, gallium arsenide, glass, sapphire, and any other materials such as metals, metal nitrides, metal alloys, and other conductive materials, depending on the application. Substrates include, but are not limited to, semiconductor wafers. Substrates may be subjected to pretreatment processes to polish, etch, reduce, oxidize, hydroxylate, anneal, and / or bake the substrate surface. In addition to film treatment directly on the surface of the substrate itself, in the present disclosure, any of the disclosed film treatment steps may be performed on an underlayer formed on the substrate as disclosed in more detail below. The term "substrate surface" is intended to include such underlayers as the context indicates. Thus, for example, if a film / layer or partial film / layer is being deposited on a substrate surface, the exposed surface of the newly deposited film / layer becomes the substrate surface.

[0023]

[0054] The common source line 120 is on the substrate 102. The common source line 120 may also be referred to as a semiconductor layer. The common source line 120 may be formed by any suitable technique known to one of ordinary skill in the art and may be made from any suitable material, including, but not limited to, polysilicon (poly-Si). In some embodiments, the common source line 120 includes several different conductive or semiconductor materials. For example, in one or more embodiments, as shown in FIG. 2, the common source line 120 includes a first polysilicon layer 104 on the substrate 102. An oxide layer 106 may be formed on the first polysilicon layer 104.

[0024]

[0055] A sacrificial layer 108 may be formed on the oxide layer 106 and may be made of any suitable material. In some embodiments, the sacrificial layer 108 is removed and replaced in a later process. In some embodiments, the sacrificial layer 108 is not removed and remains in the memory device 100. In this case, the term "sacrificial" has an expanded meaning to include a permanent layer and may be referred to as a conductive layer. In one embodiment shown, the sacrificial layer 108 is removed in operation 60, as described further below. In one or more embodiments, the sacrificial layer 108 comprises a material that may be selectively removed relative to the adjacent oxide layer 106. A second oxide layer 106 may be formed on the top surface of the sacrificial layer 108, after which the second polysilicon layer 104 is formed on the second oxide layer 106.

[0025]

[0056] A memory stack 130 is formed on the common source line 120. The memory stack 130 of one embodiment shown includes a plurality of alternating first layers 106 and second layers 110. In one or more embodiments, the first layers 106 include oxide layers and the second layers 110 include nitride layers. In some embodiments, the memory stack 130 includes a non-replacement gate, such as alternating oxide and polysilicon (OP), or alternating oxide and metal, or alternating oxide and sacrificial layers. The second layers 110 include a material that is etch selective to the first layers 106, such that the second layers 110 may be removed without substantially affecting the first layers 106. In one or more embodiments, the first layers 106 include a silicon oxide (SiO x In one or more embodiments, the second layer 110 comprises silicon nitride (SiN). In one or more embodiments, the first layer 106 and the second layer 110 are deposited by chemical vapor deposition (CVD) or physical vapor deposition (PVD).

[0026]

[0057] The individual alternating layers may be formed to any suitable thickness. In some embodiments, the thickness of each second layer 110 is approximately equal. In one or more embodiments, each second layer 110 has a first second layer thickness. In some embodiments, the thickness of each first layer 106 is approximately equal. As used in this context, approximately equal thicknesses are within + / - 5% of each other. In some embodiments, a silicon layer (not shown) is formed between the second layer 110 and the first layer 106. The thickness of the silicon layer may be relatively thin compared to the thickness of the second layer 110 or the first layer 106. In one or more embodiments, the first layer 106 has a thickness in the range of about 0.5 nm to about 30 nm, including about 1 nm, about 3 nm, about 5 nm, about 7 nm, about 10 nm, about 12 nm, about 15 nm, about 17 nm, about 20 nm, about 22 nm, about 25 nm, about 27 nm, and about 30 nm. In one or more embodiments, the first layer 106 has a thickness in the range of about 0.5 to about 40 nm. In one or more embodiments, the second layer 110 has a thickness in the range of about 0.5 to about 30 nm, including about 1 nm, about 3 nm, about 5 nm, about 7 nm, about 10 nm, about 12 nm, about 15 nm, about 17 nm, about 20 nm, about 22 nm, about 25 nm, about 27 nm, and about 30 nm. In one or more embodiments, the second layer 110 has a thickness in the range of about 0.5 to about 40 nm.

[0027]

[0058] 3, in operation 20 of method 10, staircase structure 131 is created. A mask layer 140 is deposited on the top surface of memory stack 130. Mask layer 140 may comprise any suitable material known to those of skill in the art. In one or more embodiments, mask layer 140 comprises a nitride.

[0028]

[0059] In one or more embodiments, the staircase configuration 131 exposes a top surface 135 of the first layer 106. The top surface 135 may be used to provide a space for word line contacts to be formed, as described below. A suitable fill material 137 may be deposited to occupy the space outside the staircase configuration 131. As will be appreciated by those skilled in the art, the suitable fill material 137 may be any material that prevents electrical shorts between adjacent word lines. In the staircase configuration 131, each word line has a smaller width (shown from left to right in the figure) than the word line below. The use of relative terms such as "top" and "bottom" should not be construed as limiting the scope of the present disclosure to physical orientations in space.

[0029]

[0060] 4A and 4B, in operation 25, a memory hole channel 150 is opened through the memory stack 130. In some embodiments, opening the memory hole channel 150 includes etching through the mask layer 140, the memory stack 130, the common source line 120, and into the substrate 102. Referring to FIG. 4B, which is a close-up of region 103, the memory hole channel 150 has sidewalls that extend through the memory stack 130, exposing a surface 138 of the second layer 110 and a surface 139 of the first layer 106.

[0030]

[0061] The sacrificial layer 108 has an exposed surface 122 as a sidewall of a memory hole channel 150. The memory hole channel 150 extends a distance into the substrate 102 such that a sidewall surface 112 and a lower portion 114 of the memory hole channel 150 are formed in the substrate 102. The lower portion 114 of the memory hole channel 150 may be formed anywhere within the thickness of the substrate 102. In some embodiments, the memory hole channel 150 extends a thickness into the substrate 102 that is in the range of about 10% to about 90%, or in the range of about 20% to about 80%, or in the range of about 30% to about 70%, or in the range of about 40% to about 60% of the thickness of the substrate 102. In some embodiments, the memory hole channel 150 extends a distance into the substrate 102 that is 10%, 20%, 30%, 40%, 50%, 60%, 70%, or 80% or more of the thickness of the substrate 102 .

[0031]

[0062] FIG. 5A illustrates operation 30, in which the second layer 110, e.g., a nitride layer, is selectively recessed through the opening 150 to form a recessed region 152. FIG. 5B illustrates an expanded view of region 103 of FIG. 5A. In one or more embodiments, the second layer 110, e.g., a nitride layer, is recessed through the opening 150 using reactive species generated through a remote plasma from a process gas including oxygen (O2) and nitrogen trifluoride (NF3). In other embodiments, the second layer 110, e.g., a nitride layer, is recessed through the opening 150 using hot phosphorus (HP).

[0032]

[0063] 6A and 6B illustrate operation 35, in which a polysilicon layer 154 is deposited in memory hole 150 to fill recessed region 152. FIG. 6B is an expanded view of region 103. Polysilicon layer 154 may be deposited by any suitable means known to those skilled in the art, including, but not limited to, atomic layer deposition (ALD) or chemical vapor deposition (CVD). In some embodiments, polysilicon layer 154 may also be referred to as a deposition enabling layer (DEL).

[0033]

[0064] 7A and 7B show operation 40, in which polysilicon layer 154 is recessed to form recessed region 155. FIG. 7B shows an enlarged view of region 103. Polysilicon layer 154 is removed from sidewall surfaces 112 and bottom portion 114 of memory hole channel 150.

[0034]

[0065] 8A and 8B illustrate operation 45. In operation 45, a trapping layer 156 is selectively deposited on the polysilicon layer 154 in the recessed region 155, as well as on the sidewall surfaces 112 of the sacrificial layer 108 and oxide layer 104 of the common source line 120, and on the bottom surface 114 of the memory hole 150. FIG. 8B is an expanded view of region 103. In one or more embodiments, the trapping layer 156 may comprise any suitable material known to those of skill in the art. In some embodiments, the trapping layer 156 comprises silicon nitride (SiN). In one or more embodiments, the trapping layer 156 is deposited on the hydrogen-terminated polysilicon layer 154 by selective atomic layer deposition. In one or more embodiments, the trapping layer 156 is deposited by alternating supplies of dichlorosilane (SiH2Cl2) and ammonia (NH3). Without intending to be bound by theory, it is believed that the trapping layer 156 is deposited on the surface of the first layer 106 by selective deposition of Si-H x and N.H. y The absence of bonds is believed to advantageously form only on the hydrogen-terminated surface of polysilicon layer 154 and not on the sidewall surfaces of first layer 106. In one or more embodiments, trapping layer 156 has improved film quality compared to trapping layers formed using an ammonia (NH3) plasma.

[0035]

[0066] 9A and 9B illustrate operation 50, in which a transition layer is conformally deposited in the memory hole channel 150 adjacent to the trapping layer 156. FIG. 9B is an expanded view of region 103. The transistor layer may be formed by any suitable technique known to those skilled in the art. In some embodiments, the transistor layer is formed by a conformal deposition process. In some embodiments, the transistor layer is formed by one or more of atomic layer deposition or chemical vapor deposition.

[0036]

[0067] In one or more embodiments, the deposition of the transistor layer is substantially conformal. As used herein, a "substantially conformal" layer refers to a layer that has approximately the same thickness throughout (e.g., on the upper, middle, and lower sidewalls of the memory hole channel 150, and on the bottom of the memory hole channel 150). A substantially conformal layer varies in thickness by no more than about 5%, 2%, 1%, or 0.5%.

[0037]

[0068] 9B, which is a close-up of region 103, in one or more embodiments the transistor layers include a tunnel oxide layer 158 in the memory hole channel 150 and a polysilicon channel layer 160 on the tunnel oxide 158. In one or more embodiments, the tunnel oxide layer 158 and the polysilicon channel layer 160 are deposited in the memory hole channel 150 on the sidewalls of the memory hole channel 150 or on the trap layer 156.

[0038]

[0069] The tunnel oxide layer 158 and the polysilicon channel layer 160 may have any suitable thickness, depending on, for example, the dimensions of the memory hole channel 150. In some embodiments, the polysilicon layer 160 has a thickness in the range of about 0.5 nm to about 50 nm, or in the range of about 0.75 nm to about 35 nm, or in the range of about 1 nm to about 20 nm. In some embodiments, the polysilicon layer 160 is a continuous film. In one or more embodiments, the polysilicon layer 160 is formed by conformal deposition on the tunnel oxide layer 158, and the polysilicon layer 160 has a thickness in the range of about 1 nm to about 20 nm. In one or more embodiments, the memory hole channel 150 is then filled with a dielectric material 162. The dielectric material 162 may include any suitable dielectric material known to one of ordinary skill in the art. As used herein, the term "dielectric material" refers to an electrical insulator that can be polarized in an electric field. In some embodiments, the dielectric material 162 comprises one or more of an oxide, a carbon doped oxide, silicon dioxide (SiO), porous silicon dioxide (SiO), silicon dioxide (SiO), silicon nitride (SiN), silicon dioxide / silicon nitride, a carbide, an oxycarbide, a nitride, an oxynitride, an oxycarbonitride, a polymer, a phosphosilicate glass, a fluorosilicate (SiOF) glass, or an organosilicate glass (SiOCH).

[0039]

[0070] 10A-10C illustrate operation 55 of method 10. In operation 55, bitline pads 164 are formed in mask layer 140. Bitline pads 164 may be any suitable material known to those of skill in the art, including, but not limited to, polysilicon.

[0040]

[0071] Referring to FIG. 10B, which is an expanded view of region 165, in one or more embodiments, cell 165 includes polysilicon layer 154 and trap layer 156 adjacent to memory hole 150 filled with tunnel oxide layer 158, polysilicon layer 160, and dielectric material 162.

[0041]

[0072] Referring to FIG. 10C, which is an expanded view of region 167, in one or more embodiments, the lower region of the memory hole includes a trapping layer 156 lining the bottom of memory hole 150, a tunnel oxide layer 158 adjacent to trapping layer 156, a polysilicon layer 160 on the tunnel oxide layer, and a dielectric material 162 filling memory hole 150.

[0042]

[0073] FIG. 11 illustrates operation 55 of method 10. In operation 55, an interlayer dielectric 141 is deposited on the upper surface of mask layer 140 and bit line pad 164. Interlayer dielectric (ILD) 141 may be deposited by any suitable technique known to one of skill in the art. Interlayer dielectric 141 may include any suitable material known to one of skill in the art. In one or more embodiments, interlayer dielectric 141 is a low-k dielectric, including, but not limited to, materials such as silicon dioxide, silicon oxide, carbon doped oxide ("CDO"), e.g., carbon doped silicon dioxide, porous silicon dioxide (SiO2), silicon nitride (SiN), or any combination thereof. The term "silicon oxide" may be used to describe interlayer dielectric 141, although one of skill in the art will recognize that the present disclosure is not limited to a particular stoichiometry. For example, the terms "silicon oxide" and "silicon dioxide" may both be used to describe materials having silicon and oxygen in any suitable stoichiometric ratio. The same is true for other materials listed in this disclosure, such as silicon nitride, silicon oxynitride, aluminum oxide, zirconium oxide, and the like.

[0043]

[0074] 11, in act 55 of method 10, memory stack 130 is slit patterned to form slit pattern openings 170 extending from the top surface of interlayer dielectric 141 to sacrificial layer 108 of common source line 120.

[0044]

[0075] 12 shows that a spacer material 172 is deposited within the slit pattern opening 170 and then etched back such that the spacer material 172 is formed on the sidewalls of the slit pattern opening 170. The spacer material 172 may include any suitable material known to one of ordinary skill in the art. In one or more embodiments, the spacer material 172 includes polysilicon.

[0045]

[0076] 13 illustrates operation 60 of method 10. In operation 60, the sacrificial layer 108 and the oxide layer 106 immediately adjacent to the sacrificial layer 108 in the common source line 120 are removed. The sacrificial layer 108 may be removed by any suitable technique known to those skilled in the art, including, but not limited to, selective etching, hot phosphoric acid, etc.

[0046]

[0077] 14 shows the polysilicon channel 160 exposed over the contact of the common source line 120. The polysilicon channel 160 is exposed by removing the trapping layer 156 and the tunnel oxide layer 158 in the contact area of ​​the common source line 120.

[0047]

[0078] 15 illustrates an operation 60 of method 10. In operation 60, the common source line is filled with a polysilicon layer 176. Polysilicon layer 176 may be doped or undoped.

[0048]

[0079] 16 illustrates the removal of spacer material 172 from slit pattern openings 170. Spacer material 172 may be removed by any suitable means known to one of ordinary skill in the art. In one or more embodiments, spacer material 172 is removed by an isotropic etching process (e.g., a wet etch using tetramethylammonium hydroxide (TMAH), or the like).

[0049]

[0080] 17 illustrates an operation 65 of method 10. In operation 65, one or more of second layer (eg, nitride) 110 is removed to form opening 177.

[0050]

[0081] 18 illustrates operation 70. In operation 70, in removing one or more of the second layer 110, e.g., nitride layer, a first side of the second layer 110, e.g., nitride layer, is exposed to a slit pattern opening 170, and the first side of the second layer 110, e.g., nitride layer, is exposed to an oxidizing agent through the slit pattern opening 170 to form a blocking oxide layer 178.

[0051]

[0082] FIG. 19 illustrates operation 75 of method 10. In operation 75, wordlines are formed. The wordlines include one or more of an oxide layer 180, a barrier layer 182, and a wordline metal 184. The oxide layer 180 may include any suitable material known to one of skill in the art. In one or more embodiments, the oxide layer includes aluminum oxide. The barrier layer 182 may include any suitable material known to one of skill in the art. In one or more embodiments, the barrier layer 182 includes one or more of titanium nitride (TiN), tantalum nitride (TaN), and the like. In one or more embodiments, the wordline metal 182 includes a bulk metal including one or more of copper (Cu), cobalt (Co), tungsten (W), aluminum (Al), ruthenium (Ru), iridium (Ir), molybdenum (Mo), platinum (Pt), tantalum (Ta), titanium (Ti), or rhodium (Rh). In one or more embodiments, the wordline metal 184 includes tungsten (W). In another embodiment, the wordline metal 184 comprises ruthenium (Ru).

[0052]

[0083] 20A-20C illustrate operation 80 of method 10. In operation 80, slit pattern openings 170 are filled with a fill material 186. FIG. 20B is a close-up of region 185. FIG. 20C is a close-up of region 187. Fill material 186 may be any suitable material known to one of ordinary skill in the art. In one or more embodiments, fill material 186 includes one or more of a dielectric material or a conductive material. As used herein, the term "dielectric material" refers to a layer of material that is an electrical insulator that can be polarized in an electric field. In one or more embodiments, the dielectric material may be an oxide, a carbon doped oxide, a silicon oxide (SiOx ), porous silicon dioxide (SiO2), silicon nitride (SiN), silicon oxide / nitride, carbide, oxycarbide, nitride, oxynitride, oxycarbonitride, polymer, phosphosilicate glass, fluorosilicate (SiOF) glass, or organosilicate glass (SiOCH).

[0053]

[0084] In one or more embodiments, the trapping layer 156 is advantageously confined only between the blocking oxide 178 and the wordlines. Cell-to-cell interference and lateral diffusion are advantageously suppressed. In one or more embodiments, the selective deposition of the trapping layer 156 advantageously suppresses variations in shape and thickness of the trapping layer 156.

[0054]

[0085] 21 illustrates operation 85 of method 10. In operation 85, a word line (W / L) contact is formed. The word line contact 235 extends through the memory stack 130 a sufficient distance to terminate at one of the word lines. In one or more embodiments, the word line contact 235 may include any suitable material known to one of ordinary skill in the art. In one or more embodiments, the word line contact 235 includes one or more of a metal, a metal silicide, polysilicon, amorphous silicon, or EPI silicon. In one or more embodiments, the word line contact is doped with either an N-type dopant or a P-type dopant to reduce contact resistance. In one or more embodiments, the metal of the word line contact 235 is selected from one or more of copper (Cu), cobalt (Co), tungsten (W), titanium (Ti), molybdenum (Mo), nickel (Ni), ruthenium (Ru), silver (Ag), gold (Au), iridium (Ir), tantalum (Ta), or platinum (Pt).

[0055]

[0086] In one or more embodiments, a method of forming an electronic device includes removing one or more first layers from a film stack including alternating second layers and first layers. The first layers are removed from a first side of the first layers leaving an opening bounded on a second side by one or more films including a polysilicon layer. The opening has a first thickness. The method further includes trimming the second layer adjacent through the opening to increase a thickness of the opening from the first thickness to a second thickness and to reduce a thickness of the second layer to a second oxide layer thickness less than a thickness of the first second layer, and depositing a wordline replacement material in the opening.

[0056]

[0087] A further embodiment of the present disclosure is directed to a processing tool 900 for the formation of memory devices and methods described, as shown in FIG.

[0057]

[0088] The cluster tool 900 includes at least one central transfer station 921, 931 having multiple sides. Robots 925, 935 are disposed within the central transfer stations 921, 931 and configured to move a robot blade and a wafer to each of the multiple sides.

[0058]

[0089] The cluster tool 900 comprises multiple processing chambers 902, 904, 906, 908, 910, 912, 914, 916, and 918, also referred to as process stations, connected to a central transfer station. The various processing chambers provide separate processing regions isolated from adjacent processing stations. The processing chambers may be any suitable chamber, including, but not limited to, a pre-clean chamber, a buffer chamber, a transfer space(s), a wafer orienter / degassing chamber, a cryogenic cooldown chamber, a deposition chamber, an annealing chamber, an etching chamber, a selective oxidation chamber, an oxide layer thinning chamber, or a word line deposition chamber. The particular arrangement of process chambers and components may vary depending on the cluster tool and should not be construed as limiting the scope of the present disclosure.

[0059]

[0090] In some embodiments, the cluster tool 900 includes an oxide layer thinning chamber. In some embodiments, the oxide layer thinning chamber comprises one or more fluorine-based dry cleaning chambers. In some embodiments, the cluster tool 900 includes a pre-clean chamber connected to a central transfer station.

[0060]

[0091] 22, a factory interface 950 is connected to the front of the cluster tool 900. The factory interface 950 includes a loading chamber 954 and an unloading chamber 956 on the front side 951 of the factory interface 950. Although the loading chamber 954 is shown on the left and the unloading chamber 956 is shown on the right, one of ordinary skill in the art will understand that this is merely representative of one possible configuration.

[0061]

[0092] The size and shape of the loading chamber 954 and the unloading chamber 956 can vary depending on, for example, the substrate being processed in the cluster tool 900. In the illustrated embodiment, the loading chamber 954 and the unloading chamber 956 are sized to hold a wafer cassette with multiple wafers disposed within the cassette.

[0062]

[0093] A robot 952 resides in the factory interface 950 and can move between a loading chamber 954 and an unloading chamber 956. The robot 952 can transfer wafers from a cassette in the loading chamber 954 to a load lock chamber 960 through the factory interface 950. The robot 952 can also transfer wafers from the load lock chamber 962 to a cassette in the unloading chamber 956 through the factory interface 950. As will be appreciated by those skilled in the art, the factory interface 950 can include multiple robots 952. For example, the factory interface 950 can include a first robot that transfers wafers between the loading chamber 954 and the load lock chamber 960 and a second robot that transfers wafers between the load lock chamber 962 and the unloading chamber 956.

[0063]

[0094] The illustrated cluster tool 900 has a first section 920 and a second section 930. The first section 920 is connected to a factory interface 950 through load lock chambers 960, 962. The first section 920 includes a first transfer chamber 921 with at least one robot 925 disposed therein. The robot 925 is also referred to as a robotic wafer transfer mechanism. The first transfer chamber 921 is centrally positioned with respect to the load lock chambers 960, 962, the processing chambers 902, 904, 916, 918, and the buffer chambers 922, 924. The robot 925 in some embodiments is a multi-arm robot capable of independently moving multiple wafers at a time. In some embodiments, the first transfer chamber 921 includes multiple robotic wafer transfer mechanisms. The robot 925 in the first transfer chamber 921 is configured to move wafers between chambers around the first transfer chamber 921. Individual wafers are supported on a wafer transport blade positioned at a distal end of the first robotic mechanism.

[0064]

[0095] After processing the wafer in the first section 920, the wafer may move through a pass-through chamber to the second section 930. For example, the chambers 922, 924 may be unidirectional or bidirectional pass-through chambers. The pass-through chambers 922, 924 may be used, for example, to cryo-cool the wafer before processing in the second section 930 or to allow wafer cooling or post-processing before returning to the first section 920.

[0065]

[0096] The system controller 990 communicates with the first robot 925, the second robot 935, the first plurality of processing chambers 902, 904, 916, 918, and the second plurality of processing chambers 906, 908, 910, 912, 914. The system controller 990 may be any suitable component capable of controlling the processing chambers and robots. For example, the system controller 990 may be a computer including a central processing unit, memory, suitable circuitry, and storage.

[0066]

[0097] The processes may generally be stored in the memory of the system controller 990 as software routines that, when executed by a processor, cause the process chamber to perform the processes of the present disclosure. The software routines may also be stored and / or executed by a second processor (not shown) located remotely from the hardware controlled by the processor. Some or all of the methods of the present disclosure may also be performed in hardware. Thus, the processes may be implemented in software and executed in hardware using a computer system, for example, as an application specific integrated circuit or other type of hardware implementation, or as a combination of software and hardware. The software routines, when executed by a processor, transform a general-purpose computer into a special-purpose computer (controller) that controls the chamber operation so that the processes are performed.

[0067]

[0098] In some embodiments, the system controller 990 is configured to control the selective deposition chamber to selectively deposit the trapping layer on the wafer in an atmosphere of hydrogen (H2) gas and oxygen (O2) gas at a temperature ranging from about 400° C. to about 900° C. at atmospheric pressure.

[0068]

[0099] In one embodiment, a processing tool includes a central transfer station with a robot configured to move wafers, a plurality of process stations, each process station connected to the central transfer station and equipped with a trap layer selective deposition chamber providing a processing region isolated from a processing region of an adjacent process station, and a controller connected to the central transfer station and the plurality of process stations, configured to activate the robot to move wafers between the process stations and to control the process performed at each of the process stations.

[0069]

[0100] In the context of describing the materials and methods described herein (particularly in the context of the claims below), the use of the terms "a" and "an" as well as "the" and similar referents are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context. Recitation of ranges of values ​​herein is merely intended to serve as a shorthand method of individually referring to each individual value falling within the range, unless otherwise indicated herein, and each individual value is incorporated into the specification as if it were individually recited herein. All methods described herein may be performed in any suitable order, unless otherwise indicated herein or clearly contradicted by context. The use of any and all examples or exemplary language (e.g., "such as") provided herein is intended merely to better describe the materials and methods and does not limit the scope, unless otherwise claimed. No language in the specification should be construed as indicating any element not claimed as essential to the practice of the disclosed materials and methods.

[0070]

[0101] References throughout this specification to "one embodiment," "certain embodiment," "one or more embodiments," or "an embodiment" mean that a particular feature, structure, material, or characteristic described in connection with an embodiment is included in at least one embodiment of the disclosure. Thus, the appearances of "in one or more embodiments," "in a particular embodiment," "in one embodiment," or "in an embodiment" in various places throughout this specification do not necessarily refer to the same embodiment of the disclosure. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

[0071]

[0102] Although the disclosure herein has been described with reference to specific embodiments, it should be understood that these embodiments are merely illustrative of the principles and applications of the disclosure. It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed method and apparatus without departing from the spirit and scope of the disclosure. Thus, it is intended that the present invention cover modifications and variations that come within the scope of the appended claims and their equivalents.

Claims

1. 1. A method of forming an electronic device, comprising: forming an opening in a memory stack including alternating layers of a first material and a second material, the memory stack overlying a common source line; recessing the second layer of material through the opening to form a first recessed region adjacent a sidewall surface of the second layer of material; forming a deposition enabling layer (DEL) over the first recessed region, the deposition enabling layer (DEL) comprising polysilicon and having a hydrogen-terminated surface; removing a portion of the deposition enabling layer (DEL) to form a second recessed region adjacent the sidewall surface of the second material layer and to expose a sidewall surface of the common source line and a bottom surface of the opening; and selectively depositing a trapping layer in a second recessed region to fill the second recessed region, by alternately supplying dichlorosilane and ammonia, on the hydrogen-terminated surface of the deposition enabling layer (DEL), on the sidewall surface of the common source line, on the bottom surface of the opening of the memory stack, and in the second recessed region, and not depositing a trapping layer on the sidewall surface of the first material layer.

2. The method of claim 1 , wherein the first material layer comprises an oxide layer and the second material layer comprises a nitride layer.

3. The method of claim 2 , wherein the first material layer comprises silicon oxide and the second material layer comprises silicon nitride.

4. The method of claim 1 , wherein the trapping layer comprises silicon nitride.

5. The method of claim 1 , further comprising depositing one or more transistor layers on the trapping layer in the opening.

6. The method of claim 5 , wherein the transistor layer comprises one or more of a tunnel oxide layer, a polysilicon channel layer, and a dielectric material.

7. The method of claim 5 further comprising forming a bitline pad on the transistor layer.

8. The method of claim 5 , further comprising forming a slit pattern opening through the memory stack.

9. The method of claim 8 , further comprising forming a spacer material in the slit pattern openings.

10. The method of claim 9 , wherein the common source line comprises one or more of a sacrificial layer, an oxide layer, and a polysilicon layer.

11. 11. The method of claim 10, further comprising removing the sacrificial layer to form a common source line opening, exposing the polysilicon layer in the common source line opening.

12. filling the common source line opening; removing the spacer material; removing the second layer of material; and 12. The method of claim 11, further comprising oxidizing the polysilicon layer to form a blocking oxide layer.

13. 13. The method of claim 12, further comprising forming word lines and filling the slit pattern openings with a fill material.

14. 14. The method of claim 13, wherein the wordlines include one or more of an oxide layer, a barrier layer, and a wordline metal.

15. 14. The method of claim 13, further comprising forming a word line contact in electrical communication with the word line.

16. 1. A non-volatile memory device, comprising: A memory stack including a memory cell and a memory hole, the memory stack including alternating layers of a first material layer and a second material layer, the memory stack being on a common source line, the memory stack including a deposition enabling layer (DEL) including polysilicon and having a hydrogen-terminated surface formed in a recessed area adjacent a sidewall surface of the second material layer, the memory cell includes a gate, a channel layer, and a trap layer trapped between the gate and the channel layer; the memory hole extends through the memory stack, the trapping layer is on the hydrogen-terminated surface of the deposition enabling layer (DEL), on a sidewall of the common source line, on a bottom surface of the memory hole, but not on a sidewall surface of the first material layer; the trapping layer on the hydrogen-terminated surface of the deposition-enabling layer (DEL) is disposed to fill the recessed region; device.

17. The device of claim 16 , wherein the trapping layer comprises silicon nitride.

18. 20. The device of claim 16, wherein the memory stack includes alternating layers of the first material and wordlines.

19. 20. The device of claim 18, wherein the first material layer comprises an oxide layer and the wordlines comprise one or more of an oxide, a barrier material, and a wordline metal.

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