Cooling module and electronic device

Abstract

To provide a vapor chamber, a cooling module, and electronic equipment, which can improve cooling capacity.SOLUTION: A vapor chamber is a plate-type vapor chamber that comprises a first metal plate part forming one side of a sealed space and a second metal plate part forming the other side of the sealed space, in which working fluid is sealed in the sealed space. The vapor chamber comprises a protruding surface portion formed on a surface of the first metal plate part by bending a portion of the first metal plate part so that it protrudes in one direction, and a recessed surface portion formed on a surface of the second metal plate part by bending a portion of the second metal plate part in the one direction at a position opposite to the protruding surface portion.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a vapor chamber, a cooling module, and an electronic device. [Background technology]

[0002] Electronic devices such as notebook PCs are equipped with heat generating elements such as CPUs. Such electronic devices are equipped with a cooling module in the housing that absorbs heat generated by the heat generating elements and dissipates the heat to the outside. In Patent Document 1, the present applicant has proposed a configuration in which a flat plate-type vapor chamber is used to connect between the CPU and the heat sink. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6934093 Summary of the Invention [Problem to be solved by the invention]

[0004] Since the plate-type vapor chamber has a large surface area, it is difficult to flexibly change the arrangement in the vertical direction of the housing. Therefore, in the configuration of the above-mentioned Patent Document 1, a heat-receiving member made of, for example, a copper block is sandwiched between the vapor chamber and the CPU. The heat-receiving member becomes a thermal resistance between the CPU and the vapor chamber, and is one of the factors that reduce the cooling capacity of the module.

[0005] The present invention has been made in consideration of the problems with the conventional technology described above, and aims to provide a vapor chamber, a cooling module, and an electronic device that can improve cooling capacity. [Means for solving the problem]

[0006] The vapor chamber according to a first aspect of the present invention is a plate-type vapor chamber comprising a first metal plate portion forming one side of a sealed space and a second metal plate portion forming the other side of the sealed space, with a working fluid sealed in the sealed space, and comprising: a protruding surface portion formed on a surface of the first metal plate portion by bending a portion of the first metal plate portion so as to protrude in one direction; and a recessed surface portion formed on the surface of the second metal plate portion by bending a portion of the second metal plate portion in the one direction at a position opposite to the protruding surface portion.

[0007] A cooling module according to a second aspect of the present invention has a plate-type vapor chamber having a first metal plate portion forming one side of an enclosed space and a second metal plate portion forming the other side of the enclosed space, and a working fluid is sealed in the enclosed space, the vapor chamber having a protruding surface portion formed on a surface of the first metal plate portion by bending a portion of the first metal plate portion so as to protrude in one direction, and a recessed surface portion formed on the surface of the second metal plate portion by bending a portion of the second metal plate portion in the one direction at a position opposite to the protruding surface portion.

[0008] An electronic device according to a third aspect of the present invention has a housing, a heating element provided within the housing, a first metal plate portion forming one side of an enclosed space, and a second metal plate portion forming the other side of the enclosed space, and has a plate-type vapor chamber in which a working fluid is sealed in the enclosed space, and a cooling module that absorbs heat generated by the heating element, wherein the vapor chamber has a protruding surface portion formed on a surface of the first metal plate portion by bending a portion of the first metal plate portion so as to protrude in one direction, and a recessed surface portion formed on the surface of the second metal plate portion by bending a portion of the second metal plate portion in the one direction at a position opposite to the protruding surface portion, and the surface of the protruding surface portion is connected to the heating element. Effect of the Invention

[0009] According to the above aspect of the present invention, the cooling capacity can be improved. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic plan view of an electronic device according to an embodiment viewed from above. [Diagram 2] FIG. 2 is a perspective view of the cooling module. [Diagram 3] FIG. 3 is a perspective view of the cooling module as viewed from the opposite side to that in FIG. [Figure 4] FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. [Diagram 5] FIG. 5 is a plan view of a cooling module according to a modified example. [Figure 6] FIG. 6 is a bottom view of the cooling module shown in FIG. 5 as seen from the opposite side. [Figure 7] FIG. 7 is a schematic cross-sectional view taken along line VII-VII in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an electronic device and a cooling module according to the present invention will be described in detail with reference to the accompanying drawings.

[0012] Fig. 1 is a schematic plan view of an electronic device 10 according to an embodiment as viewed from above. As shown in Fig. 1, the electronic device 10 is a clamshell notebook PC in which a cover 12 and a housing 14 are connected by a hinge 16 so as to be relatively rotatable. The electronic device of the present application may be, for example, a desktop PC, a tablet PC, a game machine, or the like, other than a notebook PC.

[0013] The lid body 12 is a thin, flat box body. The lid body 12 is equipped with a display 18. The display 18 is configured, for example, by an organic EL display or a liquid crystal display.

[0014] Hereinafter, the housing 14 and each of the components mounted thereon will be described with reference to the direction as seen by a user who opens the lid 12 from the housing 14 and views the display 18 as shown in Fig. 1, with the left-right direction referred to as the X1 and X2 directions, the front-rear direction referred to as the Y1 and Y2 directions, and the up-down direction (thickness direction of the housing 14) referred to as the Z1 and Z2 directions. The X1 and X2 directions are sometimes collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions are sometimes similarly referred to as the Y direction and the Z direction.

[0015] The housing 14 is a thin, flat box. The housing 14 is composed of a cover member 14A that forms the top surface and the four side surfaces, and a cover member 14B that forms the bottom surface. The cover member 14A on the top side (Z1 side) has a generally bathtub shape with an opening on the bottom surface. The cover member 14B on the bottom side (Z2 side) has a generally flat plate shape and serves as a lid that closes the opening on the bottom surface of the cover member 14A. The cover members 14A and 14B are overlapped in the thickness direction and detachably connected to each other. The cover member 14A may be flat plate shaped, and the cover member 14B may be bathtub shaped. A keyboard 20 and a touch pad 21 are provided on the top surface of the housing 14.

[0016] A cooling module 22 is mounted inside the housing 14. A motherboard 25 (see FIG. 4) on which a CPU (Central Processing Unit) 24 and the like are mounted, a storage device, a battery device, and the like are also mounted inside the housing 14. The cooling module 22 absorbs and diffuses heat generated by the CPU 24 and the like, and further dissipates the heat to the outside of the housing 14.

[0017] Fig. 2 is a perspective view of the cooling module 22 as viewed from the Z2 side. Fig. 3 is a perspective view of the cooling module 22 as viewed from the Z1 side. Fig. 4 is a schematic cross-sectional view taken along line IV-IV in Fig. 2. Fig. 4 shows a schematic view of the vapor chamber 30 constituting the cooling module 22 and the internal structure of the housing 14 in its surrounding area.

[0018] As shown in FIGS. 2 and 3, the cooling module 22 includes fans 26 and 27, a heat sink 28, a vapor chamber 30, a pressing part 32, and a heat conductive plate 34.

[0019] The fans 26 and 27 are for blowing air to the heat sink 28. The fans 26 and 27 are arranged adjacent to each other on the left and right. The fans 26 and 27 do not have to be a pair on the left and right, and may be used alone.

[0020] The fan 26 is a centrifugal fan that rotates an impeller 26b housed inside a fan housing 26a by a motor. A control board, a motor, and the like are also supported in the fan housing 26a. The fan 26 sucks in air from the housing 14 through an intake port 26c that opens on the upper and lower surfaces of the fan housing 26a, and discharges the air from an exhaust port 26d on the rear side. The intake port 26c may be provided on only one of the upper and lower surfaces of the fan housing 26a. The fan housing 26a is composed of a substantially bathtub-shaped cover plate 26a1 that forms the Z1 side surface and the outer peripheral side surface, and a flat cover plate 26a2 that forms the Z2 side surface (see also FIG. 4). The cover plate 26a1 is a metal plate such as aluminum or stainless steel that has a vertical wall formed thereon. The cover plate 26a2 is also used as the vapor chamber 30.

[0021] The other fan 27 may have a basic configuration that is the same as or similar to the above-described fan 26, except for the external size, the shape of the intake port, etc. Therefore, the components of fan 27 are given the same reference numerals in the drawings as the components of fan 26, and detailed descriptions thereof will be omitted.

[0022] The heat sink 28 receives the heat transported by the vapor chamber 30 and dissipates the heat by air blown from the fans 26, 27. The heat sink 28 has a structure in which, for example, a plurality of thin metal fins are arranged at equal intervals in the X direction. The heat sink 28 extends over the entire width of the two fans 26, 27 in the left-right direction. In other words, the heat sink 28 is disposed facing the exhaust ports 26d, 26d of the left and right fans 26, 27. A portion 30e of the vapor chamber 30, which will be described later, is connected to the Z2 side surface of the heat sink 28. The heat sink 28 may be provided individually for each of the fans 26, 27.

[0023] The heat conductive plate 34 is a metal plate having high thermal conductivity such as copper or aluminum. The heat conductive plate 34 is connected to the Y1 side edge of the vapor chamber 30. More specifically, the heat conductive plate 34 is connected to the Y1 side edge of a protruding surface portion 40, which will be described later. The heat conductive plate 34 complements the heat absorption and dissipation by the vapor chamber 30. The heat conductive plate 34 may be omitted.

[0024] Next, a configuration example of the vapor chamber 30 of this embodiment will be described.

[0025] 2 to 4, the vapor chamber 30 is a plate-type heat transport device. The vapor chamber 30 has a sealed space 38 formed between two thin metal plate portions 36 and 37, and a working fluid sealed in the sealed space 38. The thickness of the vapor chamber 30 is, for example, 0.8 mm.

[0026] The metal plate parts 36, 37 are made of a metal with high thermal conductivity, such as aluminum or copper. The first metal plate part 36 forms one side of the sealed space 38. The second metal plate part 37 forms one side of the sealed space 38. The sealed space 38 serves as a flow path through which the enclosed working fluid flows while undergoing a phase change. Examples of the working fluid include water, alternative fluorocarbons, acetone, butane, etc. A wick 39 is disposed within the sealed space 38, which transports the condensed working fluid by capillary action. The wick 39 is made of a porous body, such as a mesh made of thin metal wires woven into a cotton-like shape or a fine flow path.

[0027] The vapor chamber 30 has a protruding surface portion 40 and a recessed surface portion 41 .

[0028] The protruding surface portion 40 is a portion of the flat vapor chamber 30 that bulges in the Z direction. The protruding surface portion 40 is formed on the surface (first surface 30a) of one of the metal plate portions 36 by bending one of the metal plate portions 36 toward the Z1 side. In other words, the surface 40a of the protruding surface portion 40 can be said to be a portion of the first surface 30a that is offset toward the Z1 side.

[0029] More specifically, the vapor chamber 30 has a pair of bent portions 30c, 30d formed by bending parts of two metal plate portions 36, 37 so as to protrude in the Z1 direction. The bent portions 30c, 30d are formed by bending the two metal plate portions 36, 37 in the Z1 direction at a predetermined angle (for example, about 45 degrees) while securing an enclosed space 38. The bent portions 30c, 30d extend, for example, in the Y direction and are parallel to each other at a predetermined distance in the X direction. The bent portions 30c, 30d each form a step on the first surface 30a of the vapor chamber 30 that is one step down toward the Z1 side. The protruding surface portion 40 is formed between these bent portions 30c, 30d.

[0030] The recessed surface portion 41 is a portion of the flat vapor chamber 30 recessed in the Z direction. The recessed surface portion 41 is formed on the surface (second surface 30b) of the other metal plate portion 36 by bending the other metal plate portion 37 toward the Z1 side at a position facing the protruding surface portion 40 in the Z direction. The recessed surface portion 41 and the protruding surface portion 40 are in a one-sided relationship, and overlap with the protruding surface portion 40 in the Z direction. In other words, the recessed surface portion 41 is also formed between the bent portions 30c and 30d. For this reason, it can be said that the surface 41a of the recessed surface portion 41 is a portion of the second surface 30b offset toward the Z1 side.

[0031] As shown in Fig. 4, the surface 40a of the protruding surface portion 40 is connected to the CPU 24 and serves as a heat receiving portion that receives heat from the CPU 24. Reference numeral 44 in Fig. 3 and Fig. 4 denotes thermally conductive grease that is applied between the surface 40a of the protruding surface portion 40 and the CPU 24. In other words, although the thermally conductive grease 44 is interposed between the vapor chamber 30, the surface 40a of the protruding surface portion 40 is in substantial direct contact with the CPU 24.

[0032] The CPU 24 has a configuration in which a die 24b is mounted on the center of the surface of a rectangular package substrate 24a, for example. A capacitor 24c is also mounted on the package substrate 24a around the die 24b. A frame-shaped reinforcing member 24d is provided on the outer edge of the surface of the package substrate 24a. The configuration of the CPU 24 is not limited to this. The connection target of the protruding surface portion 40 may be other heat generating elements such as a GPU (Graphics Processing Unit) in addition to the CPU.

[0033] The pressing part 32 is a part that presses the first surface 30a of the vapor chamber 30, specifically the surface 40a of the protruding surface portion 40, against the CPU 24 (die 24b). The pressing part 32 has three spring parts 32a arranged radially at intervals of 120 degrees, for example. The spring parts 32a are, for example, leaf springs. The pressing part 32 presses the vapor chamber 30 against the CPU 24 by the pressing force of each spring part 32a. One end of each spring part 32a is integrally connected to the pressing part 32b, and presses the vapor chamber 30 via the pressing part 32b. The pressing part 32b is, for example, a frame body formed of a thin plate-like metal, and abuts against the surface 41a of the recessed surface portion 41. The other end of each spring part 32a is fixed to, for example, the motherboard 25. As a result, the pressing part 32 has the pressing part 32b pressing the surface 41a of the recessed surface part 41 toward the CPU 24 by the biasing force of the spring part 32a. The vapor chamber 30 is appropriately formed with a cutout hole in the plate thickness direction into which the spring part 32a is inserted. As shown in Figures 3 and 4, the pressing part 32b is accommodated in the depression of the recessed surface part 41 so that it does not protrude from the second surface 30b or the protrusion height from the second surface 30b is small. This prevents the pressing part 32 from interfering with the thinning of the cooling module 22.

[0034] In the vapor chamber 30, a portion 30e on the opposite side of the protruding surface portion 40 of one bent portion 30c is used also as a cover plate 26a2 for the fans 26, 27. The portion 30e is also connected to the heat sink 28. The portion 30e may also be used as the other cover plate 26a1. The cover plate 26a2 does not have to be used also as the vapor chamber 30, and may be formed of a metal plate or the like separate from the vapor chamber 30.

[0035] In the vapor chamber 30, a portion 30f of the other bent portion 30c on the opposite side to the protruding surface portion 40 covers an electronic component 46 mounted on the motherboard 25. The electronic component 46 is, for example, a DC-DC converter, and generates heat to a certain extent.

[0036] In the cooling module 22 configured as described above, the vapor chamber 30 includes a protruding surface portion 40 formed on a surface (first surface 30a) of the first metal plate portion 36 by bending a part of the first metal plate portion 36 so that the part protrudes in one direction. The vapor chamber 30 further includes a recessed surface portion 41 formed on a surface (second surface 30b) of the second metal plate portion 37 by bending a part of the second metal plate portion 37 in a direction at a position facing the protruding surface portion 40. The surface 40a of the protruding surface portion 40 is in substantial direct contact with the CPU 24 to be cooled.

[0037] In this way, the cooling module 22 does not have a heat-receiving member such as a copper block between the vapor chamber 30 and the CPU 24. This allows the vapor chamber 30 to directly receive heat from the CPU 24, and high thermal efficiency can be achieved without being affected by thermal resistance from the heat-receiving member. This improves the cooling performance of the cooling module 22 in the electronic device 10, and also improves the performance of the CPU 24, etc. The heat transferred to the vapor chamber 30 is diffused and dissipated in the vapor chamber 30, and is simultaneously transferred to the heat sink 28 and efficiently discharged to the outside of the housing 14 by the air blown by the fans 26, 27.

[0038] Here, an experiment will be described in which the cooling performance of a cooling module according to a comparative example in which a vapor chamber of a conventional configuration not provided with a protruding surface portion 40 is connected to the CPU 24 via a heat-receiving member (copper block) having the same thickness as the height of the protruding surface portion 40, and the cooling module 22 of this embodiment are measured. As a result of the experiment, in a state in which the temperature of the CPU 24 is approximately the same, the surface temperature of the cover member 14B of the housing 14 in which the cooling module 22 is mounted was 47.9°C, whereas the surface temperature of the cover member 14B of the housing 14 in which the cooling module of the comparative example is mounted was 49.2°C. The surface temperature of the cover member 14B forming the lower surface of the housing 14 is a particularly important temperature when it is assumed that the user uses the electronic device 10 on his / her lap, for example, and is desirably as low as possible. From this result, it was confirmed that the cooling performance of the cooling module 22 of this embodiment is higher than that of the cooling module of the comparative example.

[0039] However, since the vapor chamber 30 has the bent portions 30c and 30d, the flowability of the working fluid evaporated by the heat from the CPU 24 becomes an issue. In this regard, the vapor chamber 30 of this embodiment has two metal plate portions 36 and 37 bent in the same direction at the same time, so no bottleneck is formed in the sealed space 38. Therefore, the sealed space 38 forms a smooth slope shape within the bent portions 30c and 30d, and does not hinder the smooth flow of the working fluid. As a result, the working fluid evaporated inside the protruding surface portion 40 passes smoothly through the bent portions 30c and 30d, so there is almost no effect on the heat transportability, which is thought to be reflected in the above experimental results.

[0040] Incidentally, the concave surface portion 41 is considered to be another factor that caused the surface temperature of the cover member 14B in the experiment using the cooling module 22 of this embodiment to be significantly lower than that of the comparative example. As shown in FIG. 4, the vapor chamber 30 of this embodiment has the concave surface portion 41 directly above the CPU 24, which becomes hot. In other words, the gap G between the second surface 30b of the vapor chamber 30 and the cover member 14B expands by the amount of the concave at the concave surface portion 41. As a result, the electronic device 10 makes it difficult for heat from the vapor chamber 30 to be transferred to the cover member 14B, and the surface temperature of the cover member 14B can be further suppressed.

[0041] In the cooling module 22, the cover plate 26a2 of the fan housing 26a of the fans 26, 27 is also used as the vapor chamber 30. Therefore, the vapor chamber 30 can also receive the cooling effect from the air swirling inside the fan housing 26a. In this case, the vapor chamber 30 is arranged in a direction in which the first surface 30a faces the inside of the fans 26, 27, that is, in the same direction as the protruding surface portion 40 protrudes from the first surface 30a (see FIG. 4). As a result, the cooling module 22 can install the protruding surface portion 40 in the height range of the fans 26, 27, which have the largest thickness in the Z direction among the components. Therefore, the cooling module 22 can prevent the thickness of the entire module from increasing by providing the protruding surface portion 40.

[0042] In this way, the cooling module 22 is provided with the protruding surface portion 40 on a part thereof. In other words, the first surface 30a of the lateral portions 30e, 30f of the protruding surface portion 40 is offset toward the Z2 side from the surface 40a of the protruding surface portion 40. That is, some of the electronic components mounted on the motherboard 25 are taller than the CPU 24, such as the electronic component 46. In this case, the vapor chamber 30 can receive heat from the electronic component 46 while avoiding interference with the electronic component 46, since the portion 30f is offset toward the Z2 side. A heat-generating electronic component may also be mounted between the portion 30e and the motherboard 25.

[0043] Next, a configuration example of the cooling module 50 according to a modified example will be described.

[0044] Fig. 5 is a plan view of a cooling module 50 according to a modified example, seen from the Z1 side. Fig. 6 is a bottom view of the cooling module 50 shown in Fig. 5, seen from the Z2 side. Fig. 7 is a schematic cross-sectional view taken along line VII-VII in Fig. 5. In the cooling module 50 shown in Figs. 5 to 7, elements having the same or similar functions and effects as those of the cooling module 22 shown in Figs. 1 to 4 described above are designated by the same reference numerals, and detailed description thereof will be omitted.

[0045] 5 to 7 differs from cooling module 22 shown in FIGS. 1 to 4 in that it includes a vapor chamber 51 having a different shape from vapor chamber 30, and a heat pipe 52. Cooling module 22 was configured to absorb and diffuse heat from CPU 24 in vapor chamber 30, while transporting the heat to heat sink 28. On the other hand, cooling module 50 is configured to absorb and diffuse heat from CPU 24 in vapor chamber 51, while transporting the heat to heat sink 28 via heat pipe 52.

[0046] The cooling module 50 has a vapor chamber 51 having a substantially rectangular outer shape disposed between the fans 26, 27 arranged at a distance from each other. The cooling module 50 can cool the GPU 54 in addition to the CPU 24 (see the GPU 54 shown by the two-dot chain line in FIG. 5). Reference numeral 56 in FIG. 5 denotes a thermally conductive grease provided at the connection between the surface 40a of the protruding surface portion 40 and the GPU 54. FIG. 7 illustrates an example of the connection structure between the CPU 24 and the protruding surface portion 40, but the connection structure between the GPU 54 and the protruding surface portion 40 may be similar to that shown in FIG. 7.

[0047] The vapor chamber 51 may have the same or similar basic configuration as the vapor chamber 30 described above, except for differences in the overall shape and the shapes of the protruding surface portion 40 and the recessed surface portion 41. Reference symbol 30g in Fig. 7 denotes an ear-shaped joint formed by crushing the outer peripheries of the metal plate portions 36, 37 together and welding them together. The joint 30g is a portion that firmly fixes the two metal plate portions 36, 37 together and surrounds and seals the enclosed space 38. The joint 30g is also provided in the vapor chamber 30 shown in Figs. 1 to 4.

[0048] The heat pipe 52 is a pipe-type heat transport device. The heat pipe 52 is configured by crushing a metal pipe thin and flat to form an elliptical cross section, and sealing a working fluid in a sealed space formed in the metal pipe. The heat transport in the heat pipe 52 is similar to the heat transport in the vapor chamber 30 described above, in which the working fluid flows while undergoing a phase change, and the condensed working fluid is transported by a wick. In this embodiment, a configuration is illustrated in which two heat pipes are arranged in parallel in a pair in the front and rear, and both ends of these are connected to the left and right heat sinks 28, 28, respectively. One or three or more heat pipes 52 may be used, and the number and paths are not limited.

[0049] The center portion of the heat pipe 52, which serves as a heat receiving portion, is accommodated in the recessed surface portion 41 of the vapor chamber 51 and is connected to the surface 41a of the recessed surface portion 41. In other words, the heat pipe 52 is embedded in the vapor chamber 51. For this reason, it is preferable that the trajectory of the bent portions 30c, 30d of the vapor chamber 51 is formed along the trajectory of the heat pipe 52, for example, extending in the X direction while curving in the Y direction. Both ends of the heat pipe 52, which serve as heat dissipation portions, are connected to the respective heat sinks 28.

[0050] In the cooling module 50, the vapor chamber 51 does not also serve as the fan housing 26a. However, the first surface 30a of the portions 30e and 30f of the vapor chamber 51 is also offset toward the Z2 side from the protruding surface portion 40, similar to the configuration example shown in Fig. 4. Therefore, the portions 30e and 30f of the vapor chamber 51 can also cover and cool the electronic components 46 and the like that are taller than the CPU 24 as shown in Fig. 4.

[0051] In this way, in the cooling module 50, the protruding surface portion 40 of the vapor chamber 51 is in substantial direct contact with the CPU 24 and GPU 54 to be cooled. This allows the vapor chamber 51 to directly receive heat from the CPU 24 and the like, and high thermal efficiency can be obtained without being affected by thermal resistance from the heat-receiving member. This improves the cooling performance of the cooling module 50 in the electronic device 10, and also improves the performance of the CPU 24 and the like.

[0052] Moreover, the cooling module 50 houses the heat pipe 52 in the recessed surface portion 41. Therefore, the cooling module 50 can be made thinner by the thickness of the heat pipe 52 compared to a conventional configuration in which a heat pipe is simply connected to the surface of the vapor chamber 30. The heat pipe 52 contacts the wall surfaces of the bent portions 30c and 30d in addition to the surface 41a within the recessed surface portion 41. Therefore, the cooling module 50 further improves the efficiency of heat transfer from the vapor chamber 51 to the heat pipe 52.

[0053] In addition, in the cooling module 50 shown in Figures 5 to 7, the fans 26 and 27 may be disposed adjacent to each other, similar to the cooling module 22 shown in Figures 1 to 4. Conversely, in the cooling module 22 shown in Figures 1 to 4, the fans 26 and 27 may be disposed separately, similar to the cooling module 50 shown in Figures 5 to 7.

[0054] Incidentally, like the vapor chamber 30 described above, the vapor chamber 51 also has the bent portions 30c and 30d formed by bending two metal plate portions 36 and 37 at the same time. In other words, the vapor chambers 30 and 51 are not formed by simply bending and deforming only the metal plate portion 36 on the CPU 24 side to form the protruding surface portion 40. Therefore, the volume of the vapor chambers 30 and 51 is not reduced even in the portions 30e and 30f on the sides of the protruding surface portion 40, and can be said to be increased. For example, the regions R1 and R2 shown by the dashed lines in FIG. 6 correspond to the portions 30e and 30f, and can be said to be regions in which the thickness of the vapor chamber 51 protruding on the X1 side of the protruding surface portion 40 is increased on the Z2 side. Therefore, the vapor chambers 30 and 51 have improved overall heat transport performance compared to a configuration in which the protruding surface portion is formed by simply bending and deforming only one of the metal plate portions 36.

[0055] The vapor chamber 30, 51 can absorb heat from the CPU 24 with high thermal efficiency without providing a conventional heat receiving member such as a copper block. For this reason, the vapor chamber 30, 51 may cause a shortage of working fluid inside the protruding surface portion 40 that serves as the heat receiving portion, that is, a so-called dry-out. Therefore, it is preferable that the wick 39 (hereinafter, also referred to as "wick 39a") in the sealed space 38 formed in the protruding surface portion 40 is installed more densely than the wick 39 (hereinafter, also referred to as "wick 39b") in the other portions 30e, 30f. This makes it easier for the liquid working fluid to gather in the dense wick 39a by capillary action in the vapor chamber 30, 51, and can suppress dry-out in the wick 39a. The wick 39a may be configured, for example, by having a mesh density higher than that of the wick 39b.

[0056] It should be noted that the present invention is not limited to the above-described embodiment, and can of course be freely modified without departing from the spirit and scope of the present invention.

[0057] The protruding surface portion 40 may have a configuration other than that formed between the two bent portions 30c, 30d, and may be formed in an area surrounded by, for example, three or four bent portions. [Explanation of symbols]

[0058] 10 Electronic equipment 14. Chassis 22,50 Cooling module 24 CPU 26,27 Fans 28 Heat sink 30,51 Vapor chamber 36,37 Metal plate section 38 Closed space 39, 39a, 39b Wick 40 Projecting surface part 41 Concave surface 52 Heat Pipe

Claims

1. A cooling module comprising: The device includes a plate-type vapor chamber having a first metal plate portion forming one side of a sealed space and a second metal plate portion forming the other side of the sealed space, and a working fluid is sealed in the sealed space; The vapor chamber is a protruding surface portion formed on a surface of the first metal plate portion by bending a part of the first metal plate portion so as to protrude in one direction; a recessed surface portion formed on a surface of the second metal plate portion by bending a portion of the second metal plate portion in the one direction at a position facing the protruding surface portion; and a wick that is accommodated in the sealed space and has a portion disposed inside the protruding surface portion that is denser than other portions; having The heat pipe is connected to the surface of the recessed surface and is partially received in the recessed surface. A cooling module comprising:

2. A cooling module, The device includes a plate-type vapor chamber having a first metal plate portion forming one side of a sealed space and a second metal plate portion forming the other side of the sealed space, and a working fluid is sealed in the sealed space; The vapor chamber is a protruding surface portion formed on a surface of the first metal plate portion by bending a part of the first metal plate portion so as to protrude in one direction; a recessed surface portion formed on a surface of the second metal plate portion by bending a portion of the second metal plate portion in the one direction at a position facing the protruding surface portion; and a wick that is accommodated in the sealed space and has a portion disposed inside the protruding surface portion that is denser than other portions; having moreover, A fan having an exhaust port; A heat sink disposed facing an exhaust port of the fan; Equipped with The fan has a cover plate defining an upper surface and a lower surface; The vapor chamber is also used as a cover plate forming one of the upper surface and the lower surface, and the surface of the first metal plate portion is disposed in a direction facing the inside of the fan. A cooling module comprising:

3. An electronic device, A housing and A heating element provided within the housing; a cooling module having a first metal plate portion forming one side of a sealed space and a second metal plate portion forming the other side of the sealed space, a plate-type vapor chamber in which a working fluid is sealed in the sealed space, and absorbing heat generated by the heat generating body; Equipped with The vapor chamber is a protruding surface portion formed on a surface of the first metal plate portion by bending a part of the first metal plate portion so as to protrude in one direction; a recessed surface portion formed on a surface of the second metal plate portion by bending a portion of the second metal plate portion in the one direction at a position facing the protruding surface portion; and a wick that is accommodated in the sealed space and has a portion disposed inside the protruding surface portion that is denser than other portions; having The surface of the protruding surface portion is connected to the heating element, The cooling module further includes a heat pipe, a portion of which is received in the recessed surface portion and connected to a surface of the recessed surface portion.

1. An electronic device comprising:

4. An electronic device, A housing and A heating element provided within the housing; a cooling module having a first metal plate portion forming one side of a sealed space and a second metal plate portion forming the other side of the sealed space, a plate-type vapor chamber in which a working fluid is sealed in the sealed space, and absorbing heat generated by the heat generating body; Equipped with The vapor chamber is a protruding surface portion formed on a surface of the first metal plate portion by bending a part of the first metal plate portion so as to protrude in one direction; a recessed surface portion formed on a surface of the second metal plate portion by bending a portion of the second metal plate portion in the one direction at a position facing the protruding surface portion; and a wick that is accommodated in the sealed space and has a portion disposed inside the protruding surface portion that is denser than other portions; having The surface of the protruding surface portion is connected to the heating element, The cooling module further includes a pressing part for pressing the vapor chamber against the heating element, The pressing part has a pressing part that is accommodated in the recessed surface portion and abuts against a surface of the recessed surface portion to press the vapor chamber toward the heating element.

1. An electronic device comprising:

Images