Dual Gate and Single Actuator System

Abstract

A wafer processing system, a dual gate system, and methods for operating these systems are disclosed. The dual gate system can include a first gate, a second gate, a gate connector coupled to the first gate and the second gate, and an actuator coupled to the gate connector. The actuator is configured to seal the first gate against a first slot or open the first slot by vertical movement. The actuator is also configured to seal the second gate against a second slot or open the second slot by a combination of vertical and horizontal movement.

Description

[Technical field]

[0001]

[0001] Embodiments of the present disclosure relate generally to methods and systems for processing wafers. More specifically, the present disclosure relates to a dual gate system in which a single actuator operates two gates. [Background technology]

[0002] In electronic device manufacturing, wafers (e.g., silicon-containing wafers or silicon-containing plates) may be moved around a manufacturing facility and within manufacturing equipment tools, for example, from a factory interface to a load lock chamber, from a load lock chamber to a transfer chamber, from a transfer chamber to a processing chamber, etc. In these moves, the wafers are transported through a port located between adjacent chambers. The port typically houses two gate systems, where each gate is coupled to its designated actuator to operate its corresponding gate. An individual actuator for each gate takes up additional space, uses additional grease, requires individual maintenance, and creates additional contamination compared to a single actuator to operate both gates. Summary of the Invention

[0003] In a particular embodiment, the disclosure is directed to a dual gate system. In an embodiment, the dual gate system includes a first gate, a second gate, a gate connector coupled to the first gate and the second gate, and an actuator coupled to the gate connector. The first gate is configured to form a first seal with a first slot. The second gate is configured to form a seal with a second slot opposite the first slot. In an embodiment, the actuator is configured to seal the first gate with the first slot by moving the gate connector, the first gate, and the second gate together to an intermediate position and then vertically moving the gate connector, the first gate, and the second gate together to a first sealed position. In an embodiment, the actuator is configured to seal the second gate with the second slot by moving the gate connector, the first gate, and the second gate together to an intermediate position and then horizontally moving the gate connector, the first gate, and the second gate together to a second sealed gate position.

[0004] In certain embodiments, the disclosure is directed to a method for operating a dual gate system as disclosed herein. The method includes moving a first gate, a second gate, and a gate connector coupled to the first gate and the second gate together from an open position to an intermediate position. The method then further includes vertically moving the gate connector, the first gate, and the second gate together to a first sealed gate position or horizontally moving the gate connector, the first gate, and the second gate together to a second sealed gate position. The first sealed gate position includes a first seal against a first slot on a first side of the housing including the first gate, the second gate, and the gate connector. The second sealed gate position includes a second seal against a second slot on a second side of the housing opposite the first side of the housing.

[0005] In a particular embodiment, the present disclosure is directed to a wafer processing system including a first station, a second station adjacent to the first station, and a port positioned between the first station and the second station. The port includes a housing and a dual gate system housed within the housing. In an embodiment, the housing has a first side and a second side opposite the first side. The housing further includes a first slot on the first side and a second slot on the second side, and an object is transportable between the first station and the second station through the port via the first slot and the second slot. In an embodiment, the dual gate system includes a first gate, a second gate, a gate connector coupled to the first gate and the second gate, and an actuator coupled to the gate connector. The first gate is configured to form a first seal with the first slot. The second gate is configured to form a seal with the second slot. In an embodiment, the actuator is configured to seal the first gate against the first slot by moving the gate connector, the first gate, and the second gate together to an intermediate position and then vertically moving the gate connector, the first gate, and the second gate together to a first sealed position. In an embodiment, the actuator is configured to seal the second gate against the second slot by moving the gate connector, the first gate, and the second gate together to an intermediate position and then horizontally moving the gate connector, the first gate, and the second gate together to a second sealed gate position.

[0006]

[0006] The present disclosure is described, by way of non-limiting example only, with reference to the accompanying drawings, in which like elements are designated by like reference numerals, and in which:

[0006] It should be noted that references in different places to "an" or "one" embodiment in this disclosure are not necessarily to the same embodiment, but such references mean at least one, and in which: [Brief description of the drawings]

[0007] [Figure 1] 1 is a top schematic view of a wafer processing system according to an embodiment of the present disclosure. [Diagram 2]

[0008] FIG. 1 is a simplified cross-sectional side view of a dual gate system according to an embodiment of the present disclosure. [Diagram 3]

[0009] 1 is a simplified schematic diagram of a method of operation of a dual gate system, according to an embodiment. [Figure 4]

[0010] 1 is a simplified schematic diagram of a method of operation of a dual gate system, according to an embodiment. [Diagram 5]

[0011] FIG. 1 is a flow diagram of a method for operating a dual gate system according to an embodiment of the present disclosure. [Figure 6]

[0012] FIG. 1 is a flow diagram of a method for operating a dual gate system according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008]

[0013] During wafer processing, wafers are transferred between multiple chambers, such as from the factory interface to a load lock chamber, from the load lock chamber to a transfer chamber, and from the transfer chamber to a processing chamber, to name a few. During such transfers, the wafer is moved through a port located between adjacent chambers. The port typically houses a two gate system, where each gate is coupled to a designated actuator that is used to operate its corresponding gate. A design that includes a single actuator to operate both gates can be beneficial in reducing the size and thickness of the port used between the chambers, reducing the amount of grease used and the contamination associated with such use (from grease or particle formation), and improving reliability by operating a reduced number of tools.

[0009]

[0014] Described herein are wafer processing systems, ports (e.g., chamber ports), and methods of operation thereof. In a particular embodiment, the wafer processing system includes a first station and a second station adjacent to the first station. The wafer processing system may further include a port positioned between the first station and the second station.

[0010]

[0015] The port can include a housing and a dual gate system contained within the housing. The housing can have a first side and a second side opposite the first side. The housing can further include a first slot on the first side and a second slot on the second side, where an object can be transported through the port between the first station and the second station via the first slot and the second slot.

[0011]

[0016] The dual gate system may include a first gate, a second gate, a gate connector, and an actuator coupled to the gate connector. The first gate may be configured to form a first seal with the first slot. The second gate may be configured to form a second seal with the second slot. The gate connector may be coupled to the first gate and the second gate. The first gate and the second gate may each be removable from the gate connector. The actuator may include an actuator end effector for manipulating movement of the gate connector, the first gate, and the second gate in response to an input signal to the actuator. The input signal to the actuator may be pneumatic, electrical, or another suitable input signal.

[0012]

[0017] The actuator may be configured to seal the first gate against the first slot by moving the gate connector, the first gate, and the second gate together to an intermediate position and then vertically moving the gate connector, the first gate, and the second gate together to a first sealed position. The actuator may also be configured to seal the second gate against the second slot by moving the gate connector, the first gate, and the second gate together to an intermediate position and then horizontally moving the gate connector, the first gate, and the second gate together to a second sealed gate position.

[0013]

[0018] In an embodiment, the actuator is configured to close the first gate by moving the gate connector, the first gate, and the second gate together in an upward direction to a first sealed gate position. In this embodiment, the upward movement of the first gate to the first sealed gate position causes one or more O-rings on at least one of the first gate or the first side to become compressed between the first gate and the first side. In this embodiment, to open the sealed first gate, the actuator is configured to move the gate connector, the first gate, and the second gate together downward from the first sealed gate position, past the intermediate position, to an open gate position. In the open gate position, both the first gate and the second gate are open, and an object can be transported from the first station to an adjacent second station separated from the port through the first slot and the second slot.

[0014]

[0019] In an embodiment, the actuator is configured to close the second gate by moving the gate connector, the first gate, and the second gate together horizontally toward the second side to a second sealed gate position. In this embodiment, the horizontal movement of the second gate to the second sealed gate position causes one or more O-rings on at least one of the second gate or the second side to become compressed between the second gate and the second side. In this embodiment, to open the sealed second gate, the actuator is configured to move the gate connector, the first gate, and the second gate together horizontally from the second sealed gate position to an intermediate position, and then move the gate connector, the first gate, and the second gate downward to an open gate position. In the open gate position, both the first gate and the second gate are open, and an object can be transported from the first station to an adjacent second station separated from the port through the first slot and the second slot.

[0015]

[0020] In certain embodiments, the methods of operation described herein include moving a first gate, a second gate, and a gate connector coupled to the first gate and the second gate together from an open position to an intermediate position, and then the methods of operation may further include vertically moving the gate connector, the first gate, and the second gate together to a first closed gate position or horizontally moving the gate connector, the first gate, and the second gate together to a second closed gate position.

[0016]

[0021] In an embodiment, the first sealed gate position includes a first seal against a first slot on a first side of the housing including the first gate, the second gate, and the gate connector. In this embodiment, the method of operating may further include compressing one or more O-rings on at least one of the first gate or the first side between the first gate and the first side at the first sealed gate position. In this embodiment, the method of operating may further include moving the gate connector, the first gate, and the second gate together downward from the first sealed gate position, past an intermediate position, to an open gate position, where both the first gate and the second gate are open.

[0017]

[0022] In an embodiment, the second sealed gate position includes a second seal against a second slot on a second side of the housing including the first gate, the second gate, and the gate connector. In this embodiment, the method of operation may further include compressing one or more O-rings on at least one of the second gate or the second side between the second gate and the second side at the second sealed gate position. In this embodiment, the method of operation may further include moving the gate connector, the first gate, and the second gate together horizontally from the second sealed gate position to an intermediate position, and then moving the gate connector, the first gate, and the second gate together downwardly to an open gate position, where both the first gate and the second gate are open.

[0018]

[0023] In an exemplary embodiment, the first station may be a transfer chamber and the second station may be a processing chamber. During routine processing, a wafer may be transferred from the transfer chamber to the processing chamber through a first slot on a first side separating the transfer chamber from the port and through a second slot on a second side separating the processing chamber from the port. During wafer transfer between the transfer chamber and the processing chamber, the gate connector, the first gate, and the second gate may be in an open position. During processing, after the wafer is transferred from the transfer chamber into the processing chamber, the gate connector, the first gate, and the second gate may all move vertically from the open position to an intermediate position. Thereafter, the gate connector, the first gate, and the second gate may all move horizontally to a second closed gate position, where the second gate seals against a second slot on the second side separating the processing chamber from the port. The movement of the gate connector, the first gate, and the second gate may be controlled by an actuator. The second gate in this example may be an L-motion gate. The L-shaped motion gate can be used to seal off the processing chamber during wafer processing. In the second, sealed gate position, the first gate is not in use and can be removed for inspection.

[0019]

[0024] After a certain time of operation of the processing chamber or according to an inspection schedule, the processing chamber may be ready to be inspected. To inspect the processing chamber, the gate connector, the first gate, and the second gate may move together to a first closed gate position, where the first gate seals against a first slot on a first side separating the transfer chamber from the port. The gate connector, the first gate, and the second gate move together vertically from an open position to an intermediate position until the first closed gate position is reached. Then, the gate connector, the first gate, and the second gate move together vertically again from the intermediate position to the first closed gate position. The movement of the gate connector, the first gate, and the second gate may be controlled by an actuator. The first gate in this example may be a vertical motion gate. In the first closed gate position, the second gate is not in use and can be removed for inspection. During this time, the processing chamber may also be inspected.

[0020]

[0025] The above exemplary embodiment is described with respect to a system of processing and transfer chambers, where the processing chambers can be sealed (i.e., isolated from the port) using an L-shaped motion gate, and the transfer chambers can be sealed (i.e., isolated from the port) using a vertical motion gate. However, this exemplary embodiment should not be construed as limiting. The dual gate system can be used at the port between any adjacent stations in the wafer processing system, such as a front-opening unified pod, a side storage pod, a load lock, a transfer chamber, a factory interface, a processing chamber, a vacuum storage buffer, etc.

[0021]

[0026] Additionally, the positioning of gates that are movable in a vertical motion and then horizontal motion (e.g., L-motion type) to seal should not be construed as limiting, so long as one gate is movable in this manner and the other gate is movable in a vertical motion (e.g., without further horizontal motion). In one embodiment, an L-motion type gate may separate a processing chamber from a port, and a vertical motion type gate may separate a transfer chamber from a port. In another embodiment, an L-motion type gate may separate a transfer chamber from a port, and a vertical motion type gate may separate a processing chamber from a port. In general, an L-motion type gate will create less shear when sealing and will be the preferred gate for gates that are utilized more frequently during wafer processing.

[0022]

[0027] Some exemplary actuation mechanisms that may be used to implement vertical and / or horizontal movement of the dual gate system may include, but are not limited to, single stroke pneumatic cylinders, servo or stepper motors, dual stroke pneumatic cylinders, etc.

[0023]

[0028] As used herein, the singular forms "a," "an," and "the" include plural references unless the context clearly indicates otherwise. Thus, for example, reference to a "wafer" includes a single wafer as well as two or more wafers, etc.

[0024]

[0029] As used herein, the term "about" in connection with a measurand refers to normal variation in that measurand that would be expected by one of ordinary skill in the art when making the measurement and exercising a level of care commensurate with the purpose of the measurement and the precision of the measurement device. In certain embodiments, the term "about" includes the recited number ±10%, such as "about 10" including 9 to 11.

[0025]

[0030] As used herein, the term "vertically" in relation to direction of movement refers to upward and / or downward movement along the Y axis as shown in Figures 2-4.

[0026]

[0031] As used herein, the term "horizontally" in relation to direction of movement refers to lateral movement, such as to the right or left along the X-axis shown in Figures 2-4.

[0027]

[0032] As used herein, the term "station" refers to a chamber in which objects, such as wafers, being transported through a wafer processing system may be temporarily stored. A station, as used herein, may be separated from other parts of the wafer processing system with at least one gate. Examples of stations include front-opening unified pods (FOUPs), load locks, load ports, processing chambers, transfer chambers, and factory interfaces.

[0028]

[0033] Ranges of values ​​recited herein are intended to serve as a shorthand way of referring individually to each of the individual values ​​contained within the range, unless otherwise indicated herein, and each of the individual values ​​is incorporated herein as if it were individually recited herein. All methods described herein may be performed in any suitable order, unless otherwise indicated herein or clearly contradicted by context. Any and all examples provided herein, or the use of exemplary language (e.g., "such as"), are intended merely to describe particular materials and methods and are not intended to impose limitations on the scope. No language in the specification should be construed as indicating any non-claimed element as essential to the practice of the disclosed materials and methods.

[0029]

[0034] FIG. 1 illustrates a top schematic view of a wafer processing system 600 according to an embodiment of the present disclosure. The wafer processing system 600 may include a factory interface 662 (also referred to as an “equipment front-end module (EFEM)”), a main frame 648 (also referred to as a transfer chamber), one or more processing chambers 655, and one or more load lock chambers 656 according to embodiments described herein. The main frame 648 may be connected to the factory interface 662 via one or more load lock chambers 656. A wafer carrier 664 may be removably connected to a front wall of the factory interface 662. The factory interface 662 may include a factory interface robot 661 for moving wafers 101 (shown in dotted lines for illustrative purposes) and / or other objects (such as process kit rings, etc.) between the wafer carrier 664 and the load lock chambers 656. For example, the factory interface 662 may include one or more load ports, each of which may receive a wafer carrier 664. An overhead truck (OHT) may drop a front-opening unified pod onto a load port. A factory interface robot 661 may pick up the wafer 101 from the FOUP and, optionally, align the wafer 101 in an aligner (not shown). The factory interface robot 661 may then place the wafer 101 into a load lock chamber 656. A mainframe robot 650 (located in mainframe 648) may then pick up the wafer 101 from at least one of the load lock chambers 656 and transfer the wafer 101 to at least one of the one or more processing chambers 655.

[0030]

[0035] As the manufacturing process progresses, a factory interface robot 661 and a mainframe robot 650 working in tandem move wafers 101 and / or other objects between a wafer carrier 664 and processing chambers 655. Various electronic device manufacturing processes (e.g., semiconductor device manufacturing processes such as oxidation, thin film deposition, etching, thermal treatment, degassing, cooling, etc.) may take place in the processing chambers 655.

[0031]

[0036] After processing in at least one of the one or more processing chambers 655 is completed, the processed wafer 101 can be picked up by the mainframe robot 650 and delivered to at least one of the load lock chambers 656. At least one of the load lock chambers 656 pumps its pressure up to atmospheric pressure, and then the processed wafer 101 can be picked up by the factory interface robot 661 and placed back into the FOUP. After all wafers from the wafer carrier 664 have been processed, an OHT (not shown) can pick up the FOUP and drop it off at another tool, depending on the designed manufacturing process.

[0032]

[0037] Wafers 101 and / or other objects are transported between one station and an adjacent station (e.g., between the transfer chamber 648 and the processing chamber 655, between the load lock chamber 656 and the transfer chamber 648, between the factory interface 662 and the load lock chamber 656, etc.) via a dual gate system housed in port 675 and described in further detail with respect to FIG.

[0033]

[0038] Some ports between two adjacent stations may include a housing and a dual gate and dual actuator system housed within the housing. The dual gate and dual actuator system may include a first gate coupled to a first actuator configured to move the first gate from an open position to a first closed gate position. The dual gate and dual actuator system may further include a separate second gate coupled to a second actuator (separate from the first actuator) configured to move the second gate from an open position to a second closed gate position. In this configuration, each actuator operates its designated gate.

[0034]

[0039] Having two actuators each operating a single gate, as opposed to having a single actuator that can operate both gates, takes up more space, uses more grease, creates more contamination, and involves more maintenance. Thus, some ports in the wafer processing system 600 of FIG. 1 according to embodiments described herein include dual gates actuated by a single actuator. The present disclosure is directed, in certain embodiments, to a dual gate system in which a single actuator operates two gates. Such embodiments are beneficial in reducing the number of actuators used, reducing the amount of grease used, reducing the amount of contamination associated with operating two actuators as opposed to one (e.g., number of particles created by two actuators as opposed to one, amount of grease used by two actuators as opposed to one), improving reliability, and reducing space occupancy since one actuator takes up less space than two actuators.

[0035]

[0040] 2 shows a simplified cross-sectional side view of a dual gate system according to an embodiment of the present disclosure. As shown in FIG. 2, the port 675 includes a housing 350 and a dual gate system housed within the housing 350 according to an embodiment.

[0036]

[0041] In an embodiment, the housing 350 has a first side 312 and a second side 322 opposite the first side. The housing further includes a first slot 314 on the first side 312 and a second slot 324 on the second side 322. Objects can be transported via the first slot 314 and the second slot 324 through a port 675 between the first and second stations (e.g., between the factory interface 662 and the load lock 656, between the load lock 656 and the transfer chamber 648, or between the transfer chamber 648 and the processing chamber 655).

[0037]

[0042] In an embodiment, the dual gate system includes a first gate 310, a second gate 320, a gate connector 330 coupled to the first gate 310 and the second gate 320, and an actuator 340 coupled to the gate connector 330. The actuator 340 may further include an actuator shaft 345 coupled to the gate connector 330. The actuator shaft 345 may also be referred to herein as an actuator end effector configured to operate the first gate 310, the second gate 320, and the gate connector 330 in response to an input signal (e.g., a pneumatic input signal, an electrical input signal, or another input signal) to the actuator 340. Both the first gate 310 and the second gate 320 may be removable from the gate connector 330. The gate connector 330 may be compact in dimensions (i.e., the x-distance between the first gate 310 and the second gate 320 is minimized), while still providing sufficient space for an operator and / or robot to easily access the port 675 and remove at least one of the first gate 310 or the second gate 320 (or place at least one of the first gate 310 or the second gate 320 after it has been replaced and / or cleaned and / or inspected).

[0038]

[0043] The first gate 310 is configured to form a first seal with the first slot 314, as described in more detail with respect to Figure 3. In certain embodiments, the actuator 340 is configured to seal the first gate 310 with the first slot 314 by vertically moving the gate connector 330, the first gate 310, and the second gate 320 together from an open position (e.g., 400A in Figures 3 and 4) to an intermediate position (e.g., 400B in Figures 3 and 4) and then vertically moving the gate connector 330, the first gate 310, and the second gate 320 together to a first sealed position (e.g., 400C in Figure 3).

[0039]

[0044] In an embodiment, the actuator 340 is configured to close the first gate 310 by moving the gate connector 330, the first gate 310, and the second gate 320 together in an upward direction to a first sealed position (e.g., 400C in FIG. 3 ). The upward movement of the first gate 310 to the first sealed position 400C causes an O-ring (not shown) on the first gate 310 and / or an O-ring (not shown) on the first side 312 to become compressed between the first gate 310 and the first side 312.

[0040]

[0045] In an embodiment, to open the sealed first gate 310, the actuator 340 is configured to move the gate connector 330, the first gate 310, and the second gate 320 together in a downward direction from a first sealed position (e.g., 400C), past an intermediate position (e.g., 400B), to an open gate position (e.g., 400A). In the open gate position, both the first gate 310 and the second gate 320 are open, and objects such as wafers can be transferred between adjacent stations separated by ports 675.

[0041]

[0046] The second gate 320 is configured to form a second seal against the second slot 324, as described in further detail with respect to Figure 4. In certain embodiments, the actuator 340 is configured to seal the second gate 320 against the second slot 324 by moving the gate connector 330, the first gate 310, and the second gate 320 together vertically upward from an open position (e.g., 400A in Figures 3 and 4) to an intermediate position (e.g., 400B in Figures 3 and 4) and then moving the gate connector 330, the first gate 310, and the second gate 320 together horizontally to a second closed gate position (e.g., 500C in Figure 4).

[0042]

[0047] In an embodiment, the actuator 340 is configured to close the second gate 320 by moving the gate connector 330, the first gate 310, and the second gate 320 together horizontally toward the second side 322 (shown in FIG. 2) to a second sealed position (e.g., 500C in FIG. 4). The horizontal movement of the second gate 320 to the second sealed position (e.g., 500C) causes an O-ring (not shown) on the second gate 320 and / or an O-ring (not shown) on the second side 322 to become compressed between the second gate 320 and the second side 322.

[0043]

[0048] In an embodiment, to open the sealed second gate 320, the actuator 340 is configured to move the gate connector 330, the first gate 310, and the second gate 320 together horizontally from a second sealed position (e.g., 500C), past an intermediate position (e.g., 400B), and then move the gate connector 330, the first gate 310, and the second gate 320 together vertically downward to an open gate position (e.g., 400A). In the open gate position, both the first gate 310 and the second gate 320 are open, and objects such as wafers can be transferred between adjacent stations separated by ports 675.

[0044]

[0049] Each of the adjacent stations separated by port 675 may be selected from the group consisting of a load lock, a transfer chamber, a processing chamber, a front-opening unified pod, a side storage pod, a factory interface, and a vacuum storage buffer. In one embodiment, the first station is a transfer chamber and the second station is a processing chamber (or vice versa). In one embodiment, the first station is a load lock and the second station is a transfer chamber (or vice versa). In one embodiment, the first station is a FOUP and the second station is a load lock (or vice versa).

[0045]

[0050] In certain embodiments, adjacent stations separated by port 675 are both maintained at a common pressure (i.e., both at the same pressure, such as both vacuum or both at atmospheric pressure). When both adjacent stations are at a common pressure, the first gate 310, the second gate 320, and the gate connector 330 are both in one of the following positions: open gate position 400A, intermediate position 400B, first sealed position 400C, or second sealed position 500C. In other embodiments, adjacent stations separated by port 675 have different pressures. For example, one station can be maintained at vacuum while the other adjacent station can be cycled between vacuum and atmospheric pressure. When two adjacent stations have different pressures, the first gate 310, the second gate 320, and the gate connector 330 are both in one of the following positions: first sealed position 400C or second sealed position 500C.

[0046]

[0051] Figure 3 shows a simplified schematic diagram of a method 400 of operating a dual gate system, according to an embodiment. Figure 5 is a flow diagram of a method 400 for operating a dual gate system, according to an embodiment of the present disclosure.

[0047]

[0052] To seal the first slot with the first gate, the method 400, in certain embodiments, includes moving the first gate 310, the second gate 320, and the gate connector 330 coupled to the first gate 310 and the second gate 320 together from an open gate position 400A to an intermediate position 400B (410 in FIG. 5 ). In embodiments, the movement from the open gate position 400A to the intermediate position 400B is vertically upward.

[0048]

[0053] Thereafter, in certain embodiments, the method 400 includes moving the first gate 310, the second gate 320, and the gate connector 330 together vertically upward from the intermediate position 400B to a first sealed gate position 400C (420 in FIG. 5 ). In embodiments, the first sealed gate position 400C includes a first seal against a first slot 314 on a first side 312 of the housing 350 (including the first gate 310, the second gate 320, and the gate connector 330).

[0049]

[0054] The method 400, in certain embodiments, further includes optionally compressing an O-ring (not shown) on the first gate 310 and / or an O-ring (not shown) on the first side 312 between the first gate 310 and the first side 312 at a first sealed gate position 400C (430 in FIG. 5 ).

[0050]

[0055] To open the gates from the first closed gate position, the method 400, in certain embodiments, further includes moving the gate connector 330, the first gate 310, and the second gate 320 together vertically downward from the first closed gate position 400C, past an intermediate position 400B (450 in FIG. 5 ), to an open gate position 400A (460 in FIG. 5 ), where both the first gate 310 and the second gate 320 are open. In this embodiment, the method 400 may further include optionally depressurizing an O-ring (not shown) on the first gate 310 and / or an O-ring (not shown) on the first side 312 before moving the gate connector 330, the first gate 310, and the second gate 320 downward from the first closed gate position 400C (440 in FIG. 5 ).

[0051]

[0056] In a particular embodiment, in the open position 400A, the horizontal actuator 425 configured to provide horizontal motion to the first gate 310, the second gate 320, and the gate connector 330 is retracted. In the open position 400A, the vertical actuator 445 configured to provide vertical motion to the first gate 310, the second gate 320, and the gate connector 330 is extended. In the intermediate position 400B, the horizontal actuator 425 is still retracted and the vertical actuator 445 is centered (i.e., between the extended and retracted positions). In the first closed gate position 400C, the horizontal actuator 425 is retracted and the vertical actuator 445 is retracted.

[0052]

[0057] Figure 4 shows a simplified schematic diagram of a method 500 of operating a dual gate system, according to an embodiment. Figure 6 is a flow diagram of a method 500 for operating a dual gate system, according to an embodiment of the present disclosure.

[0053]

[0058] To seal the second slot with the second gate, the method 500, in certain embodiments, includes moving the first gate 310, the second gate 320, and the gate connector 330 coupled to the first gate 310 and the second gate 320 together from an open gate position 400A to an intermediate position 400B (510 in FIG. 6 as well as 410 in FIG. 5). In embodiments, the movement from the open gate position 400A to the intermediate position 400B is in a vertical upward direction.

[0054]

[0059] Thereafter, in certain embodiments, the method 500 includes moving the first gate 310, the second gate 320, and the gate connector 330 together horizontally from the intermediate position 400B to a second sealed gate position 500C (520 in FIG. 6 ). In embodiments, the second sealed gate position 500C includes a second seal against a second slot 324 on a second side 322 opposite the first side 312 of the housing 350 (including the first gate 310, the second gate 320, and the gate connector 330).

[0055]

[0060] The method 500, in certain embodiments, further includes compressing an O-ring (not shown) on the second gate 320 and / or an O-ring (not shown) on the second side 322 between the second gate 320 and the second side 322 at a second sealed gate position 500C (530 in FIG. 6 ).

[0056]

[0061] To open the gate from the second closed gate position, the method 500, in certain embodiments, further includes moving the gate connector 330, the first gate 310, and the second gate 320 together horizontally from the second closed gate position 500C to an intermediate position 400B (550 in FIG. 6), and then moving the gate connector 330, the first gate 310, and the second gate 320 together vertically downward to an open gate position 400A (560 in FIG. 6, similar to 460 in FIG. 5), where both the first gate 310 and the second gate 320 are open. In this embodiment, the method 500 may further include depressurizing an O-ring (not shown) on the second gate 320 and / or an O-ring (not shown) on the second side 322 prior to horizontally moving the gate connector 330, the first gate 310, and the second gate 320 from the second sealed gate position 500C (540 in FIG. 6 ).

[0057]

[0062] In a particular embodiment, in the open position 400A, the horizontal actuator 425 configured to provide horizontal motion to the first gate 310, the second gate 320, and the gate connector 330 is retracted. In the open position 400A, the vertical actuator 445 configured to provide vertical motion to the first gate 310, the second gate 320, and the gate connector 330 is extended. In the intermediate position 400B, the horizontal actuator 425 is still retracted and the vertical actuator 445 is centered (i.e., between the extended and retracted positions). In the second closed gate position 500C, the horizontal actuator 425 is extended and the vertical actuator 445 remains centered.

[0058]

[0063] In an exemplary embodiment, the first station is a transfer chamber 648 and the second station is a processing chamber 655. During routine processing, wafers 101 and / or other objects may be transferred from the transfer chamber 648 to the processing chamber 655 through a first slot 314 in a first side 312 that separates the transfer chamber 648 from a port 675 and through a second slot 324 in a second side 322 that separates the processing chamber 655 from the port 675. During wafer transfer between the transfer chamber 648 and the processing chamber 655, the gate connector 330, the first gate 310, and the second gate 320 may be in an open position 400A. During processing, after a wafer is transferred from the transfer chamber 648 into the processing chamber 655, the gate connector 330, the first gate 310, and the second gate 320 may all move vertically upward from the open position 400A to an intermediate position 400B. The gate connector 330, the first gate 310, and the second gate 320 may then move horizontally together to a second sealed gate position 500C, where the second gate 320 seals against a second slot 324 on the second side 322 that separates the processing chamber 655 from the port 675. The movement of the gate connector 330, the first gate 310, and the second gate 320 may be controlled by a single actuator 340 (e.g., as detailed with respect to FIG. 2). The second gate 320 in this example may be an L-motion gate. The L-motion gate may be used to seal the processing chamber 655 during wafer processing. In the second sealed gate position 500C, the first gate 310 is not in use and may be removed, replaced, cleaned, and / or serviced. Inspection may include removing wafer debris from the transfer chamber 648 or port housing, cleaning the sealing surfaces of the ports on the transfer chamber side, cleaning the inside of the transfer chamber 648, removing or replacing or cleaning O-rings on the first gate or on the transfer chamber side used to seal the first gate to the transfer chamber side.

[0059]

[0064] After a certain period of operation of the processing chamber or according to an inspection schedule (e.g., monthly), the processing chamber 655 may be due for inspection and / or maintenance. To inspect and / or maintain the processing chamber 655, the gate connector 330, the first gate 310, and the second gate 320 may move together to a first sealed gate position 400C where the first gate 310 seals against a first slot 314 on a first side 312 that separates the transfer chamber 648 from the port 675. From the open gate position 400A, the gate connector 330, the first gate 310, and the second gate 320 move together vertically upward from the open position 400A to an intermediate position 400B until the first sealed gate position 400C is reached. The gate connector 330, the first gate 310, and the second gate 320 then move vertically upward again from the intermediate position 400B to the first closed gate position 400C. The movement of the gate connector 330, the first gate 310, and the second gate 320 may be controlled by the actuator 340 (e.g., as detailed in relation to FIG. 2). The first gate 310 in this embodiment may be a vertical motion gate. In the first closed gate position 400C, the second gate 320 is not in use and may be removed, replaced, cleaned, and / or serviced. During this time, the process chamber 655 may also be serviced. Service may include removing wafer debris from the process chamber 655 or port housing, cleaning the sealing surfaces of the ports on the process chamber side, cleaning the interior of the process chamber 655, removing or replacing or cleaning the O-rings on the second gate or on the process chamber side used to seal the second gate to the process chamber side.

[0060]

[0065] Being able to maintain and / or service one gate while the other gate is closed is beneficial because it allows routine wafer processing to continue in at least one of the chambers while minimizing downtime of the wafer processing system that would otherwise be associated with pressure adjustments (e.g., pumping down to vacuum) at various stations.

[0061]

[0066] The above exemplary embodiment has been described with respect to a system of a process chamber 655 and a transfer chamber 648, where the process chamber 655 may be sealed using an L-shaped motion gate (having vertical and horizontal motion) and the transfer chamber 648 may be sealed using a vertical-only motion gate (e.g., a vertical motion gate). However, this exemplary embodiment should not be construed as limiting. The dual gate system may be used at the port between any adjacent stations in the wafer processing system, such as a front-opening unified pod, a side storage pod, a load lock, a transfer chamber, a factory interface, a process chamber, a vacuum storage buffer, etc. Additionally, the positioning of the gates that are movable in vertical and horizontal motion to seal should not be construed as limiting, as long as one gate is movable in this manner and the other gate is movable in vertical motion.

[0062]

[0067] In one embodiment, an L-motion gate may seal the process chamber and a vertical motion gate may seal the transfer chamber. In another embodiment, an L-motion gate may seal the transfer chamber and a vertical motion gate may seal the process chamber. In general, an L-motion gate will create less shear when sealing and will be the preferred gate for gates that are utilized more frequently during wafer processing.

[0063]

[0068] Some exemplary actuation mechanisms that may be used to implement vertical and / or horizontal movement of the dual gate system may include, but are not limited to, single stroke pneumatic cylinders, four bar mechanisms, cam-over type motion, servo or stepper motors, dual stroke pneumatic cylinders, to name a few.

[0064]

[0069] The wafer processing system described herein may be computer-controlled by a control unit (not shown). By executing a program (software) for processing the wafer 101 based on a predetermined recipe, various drive units of the substrate processing system are operated to process the wafer 101.

[0065]

[0070] It should further be understood that the methods disclosed herein may be accomplished by providing a storage medium having stored thereon software program code for implementing the functions of the above-described embodiments to a computer (e.g., a control unit), and then having a processor (e.g., a central processing unit (CPU)) of the computer read and execute the program code stored in the storage medium. Alternatively, another type of processing device, such as a programmable logic controller (PLC), a system on a chip (SoC), etc., may execute the program code. The processor or processing device executing the program code may operate an ionizer, open or close a slit valve, start or stop an inert gas flow at a set flow rate, move a wafer between positions by a robot, etc.

[0066]

[0071] In this case, the program code itself read out from the storage medium realizes the functions of the above-described embodiments, so the program code and the storage medium on which the program code is stored are also part of the present disclosure.

[0067]

[0072] Furthermore, the storage medium for providing the program code may be, for example, a RAM, a NV-RAM, a floppy disk, a hard disk, a magneto-optical disk, an optical disk (e.g., CD-ROM, CD-R, CD-RW, DVD (DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), etc.), a magnetic tape, a non-volatile memory card, another ROM, etc. Alternatively, the program code may be provided to the computer by downloading from another computer (not shown), a database (not shown) connected to the Internet, etc., a commercial network, a LAN (Local Area Network), etc.

[0068]

[0073] Furthermore, it should be understood that the functionality of the above-described embodiments may be achieved not only by a computer executing program code read by the computer, but also by having an operating system (OS) running on a processing device execute some or all of the actual operations based on the instructions of the program code.

[0069]

[0074] The program code may be in the form of object code, program code executed by an interpreter, script data supplied to an operating system, etc.

[0070]

[0075] In the preceding description, numerous specific details have been set forth, such as specific materials, dimensions, process parameters, and the like, to provide a thorough understanding of the present disclosure. Particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments. The terms "example" or "exemplary" are used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as "example" or "exemplary" should not necessarily be construed as preferred or advantageous over other aspects or designs. Rather, use of the terms "example" or "exemplary" is merely intended to present a concept in a concrete manner. In this application, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from the context, "X includes A or B" is intended to mean any of the natural inclusive permutations. That is, "X includes A or B" is satisfied when X includes A, when X includes B, or when X includes both A and B. Throughout this specification, references to "an embodiment," "a particular embodiment," or "one embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "an embodiment," "a particular embodiment," or "one embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment.

[0071]

[0076] The embodiments of the present disclosure have been described with reference to certain exemplary embodiments thereof. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. Various modifications of the present disclosure in addition to those shown and described herein will become apparent to those skilled in the art and are intended to fall within the scope of the appended claims. The present application also includes the aspects described below. (Aspect 10) moving a first gate, a second gate, and a gate connector coupled to the first gate and the second gate together from an open gate position to an intermediate position; and moving the gate connector, the first gate, and the second gate together vertically to a first sealed gate position, the first sealed gate position including a first seal against a first slot on a first side of a housing including the first gate, the second gate, and the gate connector; or moving the gate connector, the first gate, and the second gate together horizontally to a second sealed gate position, the second sealed gate position including a second seal against a second slot on a second side of the housing, the second side facing the first side; Either A method comprising: (Aspect 11) 11. The method of embodiment 10, further comprising compressing one or more O-rings on at least one of the first gate or the first side between the first gate and the first side at the first sealed gate position. (Aspect 12) 11. The method of embodiment 10, further comprising compressing one or more O-rings on at least one of the second gate or the second side between the second gate and the second side at the second sealed gate position. (Aspect 13) The method of embodiment 10, further comprising moving the gate connector, the first gate, and the second gate together downward from the first closed gate position, past the intermediate position, to an open gate position, wherein both the first gate and the second gate are open in the open gate position. (Aspect 14) The method of claim 10, further comprising moving the gate connector, the first gate, and the second gate together horizontally from the second closed gate position to the intermediate position, and then moving the gate connector, the first gate, and the second gate together downward to an open gate position, wherein both the first gate and the second gate are open in the open gate position.

Claims

1. 1. A dual gate system comprising: a first gate configured to form a first seal with the first slot; a second gate configured to form a second seal with a second slot opposite the first slot; and a gate connector coupled to the first gate and the second gate; an actuator coupled to the gate connector; The actuator comprises: moving the gate connector, the first gate, and the second gate together to an intermediate position, and then vertically moving the gate connector, the first gate, and the second gate together to a first sealed gate position, thereby sealing the first gate against the first slot; a dual gate system configured to seal the second gate against the second slot by moving the gate connector, the first gate, and the second gate together to the intermediate position and then horizontally moving the gate connector, the first gate, and the second gate together to a second, sealed gate position.

2. 2. The dual gate system of claim 1, wherein said first gate is a vertical motion gate and said second gate is an L-motion gate.

3. 2. The dual gate system of claim 1, wherein the actuator is configured to close the first gate by moving the gate connector, the first gate, and the second gate together in an upward direction to the first closed gate position, and wherein the upward movement of the first gate to the first closed gate position causes one or more O-rings on at least one of the first gate or a first side including the first slot to become compressed between the first gate and the first side.

4. 2. The dual gate system of claim 1, wherein the actuator is configured to close the second gate by moving the gate connector, the first gate, and the second gate together horizontally toward the second closed gate position, and the horizontal movement of the second gate to the second closed gate position causes one or more O-rings on at least one of the second gate or a second side including the second slot to become compressed between the second gate and the second side.

5. To open the sealed first gate, the actuator 2. The dual gate system of claim 1 configured to move said gate connector, said first gate, and said second gate downwardly from said first closed gate position, past said intermediate position, to an open gate position.

6. 6. The dual gate system of claim 5, wherein both said first gate and said second gate are open in said open gate position.

7. To open the sealed second gate, the actuator 2. The dual gate system of claim 1, configured to move the gate connector, the first gate, and the second gate horizontally from the second closed gate position to the intermediate position, and then move the gate connector, the first gate, and the second gate downwardly to an open gate position.

8. 8. The dual gate system of claim 7, wherein both said first gate and said second gate are open in said open gate position.

9. The dual gate system of claim 1 , wherein said first gate and said second gate are both removable from said gate connector.

10. A method in a wafer processing system, comprising: A first station; a second station adjacent to the first station; a port located between the first station and the second station; wherein the port comprises: a housing having a first side and a second side opposite the first side, the housing including a first slot on the first side and a second slot on the second side, an object being transportable through the first slot and the second slot and through the port between the first station and the second station; a dual gate system contained within the housing; wherein the dual gate system comprises: a first gate configured to form a first seal with the first slot; a second gate configured to form a second seal with the second slot; and a gate connector coupled to the first gate and the second gate The method comprises: moving the first gate, the second gate, and the gate connector together from an open gate position to an intermediate position; and then vertically moving the gate connector, the first gate, and the second gate together to a first sealed gate position, the first sealed gate position including a first seal relative to the first slot; A method comprising:

11. 11. The method of claim 10, further comprising compressing one or more O-rings on at least one of the first gate or the first side between the first gate and the first side at the first sealed gate position.

12. 11. The method of claim 10, further comprising moving the gate connector, the first gate, and the second gate together downward from the first closed gate position, past the intermediate position, to an open gate position, wherein both the first gate and the second gate are open in the open gate position.

13. 1. A wafer processing system comprising: A first station; a second station adjacent to the first station; a port located between the first station and the second station; wherein the port comprises: a housing having a first side and a second side opposite the first side, the housing including a first slot on the first side and a second slot on the second side, an object being transportable through the first slot and the second slot and through the port between the first station and the second station; a dual gate system contained within the housing; wherein the dual gate system comprises: a first gate configured to form a first seal with the first slot; a second gate configured to form a second seal with the second slot; a gate connector coupled to the first gate and the second gate; and An actuator coupled to the gate connector The actuator comprises: moving the gate connector, the first gate, and the second gate together to an intermediate position, and then vertically moving the gate connector, the first gate, and the second gate together to a first sealed gate position, thereby sealing the first gate against the first slot; a wafer processing system configured to seal the second gate against the second slot by moving the gate connector, the first gate, and the second gate together to the intermediate position and then horizontally moving the gate connector, the first gate, and the second gate together to a second sealed gate position.

14. 14. The wafer processing system of claim 13, wherein the first gate and the second gate are both detachable from the gate connector, the first gate being a vertical motion gate and the second gate being an L-motion gate.

15. the actuator is configured to close the first gate by moving the gate connector, the first gate, and the second gate together in an upward direction to the first closed gate position, the upward movement of the first gate to the first closed gate position causing one or more O-rings on at least one of the first gate or the first side to become compressed between the first gate and the first side; 14. The wafer processing system of claim 13, wherein the actuator is configured to close the second gate by moving the gate connector, the first gate, and the second gate together horizontally toward the second side to the second closed gate position, and the horizontal movement of the second gate to the second closed gate position causes one or more O-rings on at least one of the second gate or the second side to become compressed between the second gate and the second side.

16. to open a sealed first gate, the actuator is configured to move the gate connector, the first gate, and the second gate together downwardly from the first sealed gate position, past the intermediate position, to an open gate position; to open a sealed second gate, the actuator is configured to move the gate connector, the first gate, and the second gate together horizontally from the second sealed gate position to the intermediate position, and then move the gate connector, the first gate, and the second gate together downwardly to an open gate position; 14. The wafer processing system of claim 13, wherein both the first gate and the second gate are open in the open gate position.

17. 14. The wafer processing system of claim 13, wherein the first station and the second station are independently one of a load lock, a transfer chamber, a processing chamber, a front opening unified pod (FOUP), a lateral storage pod (SSP), and a vacuum storage buffer.

18. 14. The wafer processing system of claim 13, wherein the first station is a transfer chamber and the second station is a processing chamber.

Images