Exposure device, image forming device, light receiving device and reading device

Abstract

To make assembly simpler.SOLUTION: An LED head 16 comprises: a substrate 55; a lens array 53; an adhesive 60; and a protective film 58 as a film member covering at least a portion of the substrate 55. The substrate 55 includes: an LED array arrangement surface 55B arranged with an LED array 56; and an electronic component arrangement surface 55A opposite to the LED array arrangement surface 55B. The protective film 58 includes a film substrate adhesive surface 58B in contact with the electronic component arrangement surface 55A. The adhesive 60 is applied to lateral end surfaces 55ES of the substrate 55 and a surface opposite to the film substrate adhesive surface 58B of the protective film 58 to fix the substrate 55 to a holder 51.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an exposure device, an image forming apparatus, a light receiving device, and a reading device, and is suitable for use in an exposure device mounted in, for example, an electrophotographic image forming apparatus. [Background technology]

[0002] Conventionally, as an image forming apparatus, a device that prints an image by irradiating the surface of a photosensitive drum with light from an exposure device that emits light for exposure to form an electrostatic latent image on the surface of the photosensitive drum, and then developing the toner image by attaching toner to the electrostatic latent image has been widely used. As an example of such an exposure device, there is an LED head that uses light emitted from an LED (Light Emitting Diode), which is a light emitting element.

[0003] An LED head, for example, includes a substrate on which an LED array in which multiple LEDs are arranged in a line is mounted, a lens unit in which multiple lenses are aligned to focus the light emitted from each LED, and a holder that holds the substrate and the lens unit. The light emitted from the LED array mounted on the substrate passes through the lens unit and is converged, and is exposed to the surface of a photosensitive drum disposed at the image forming position of the lens unit, thereby forming an electrostatic latent image. In some such LED heads, the substrate is directly bonded to the holder with an adhesive, thereby reducing the number of parts (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2018-52108 A Summary of the Invention [Problem to be solved by the invention]

[0005] In such optical devices, such as exposure devices and light receiving devices, it is desirable to make the assembly easier.

[0006] SUMMARY OF THE PRESENT DISCLOSURE ... The present invention has been made in consideration of the above points, and aims to propose an exposure device, an image forming device, a light receiving device, and a reading device that can be assembled more simply. [Means for solving the problem]

[0007] In order to solve the above problems, the exposure apparatus of the present invention is an exposure apparatus having a substrate on which a plurality of light emitting elements are arranged, a lens member into which light from the light emitting elements is incident, and a holder member for holding the substrate and the lens member, and an adhesive for fixing the substrate to the holder member. , extending from the center side in the short side direction of the substrate toward the outside in the short side direction to a position outside the end portion in the short side direction of the substrate, and a film member covering at least a portion of the substrate. The substrate has a first surface on which a plurality of light emitting elements are arranged and a second surface opposite to the first surface. surface the film member has a contact surface that contacts the second surface, and the adhesive is applied to a side surface of the substrate and a surface of the film member opposite the contact surface to fix the substrate to the holder member.

[0008] The image forming apparatus of the present invention is provided with the above-mentioned exposure device.

[0009] Further, the light receiving device of the present invention includes a substrate on which a plurality of light receiving elements are arranged, a lens member into which light radiated to the light receiving elements is incident, and a holder member for holding the substrate and the lens member, the substrate being fixed to the holder member by an adhesive. , extending from the center side in the short side direction of the substrate toward the outside in the short side direction to a position outside the end portion in the short side direction of the substrate, and a film member covering at least a portion of the substrate. The substrate has a first surface on which a plurality of light receiving elements are arranged and a second surface opposite to the first surface. surface the film member has a contact surface that contacts the second surface, and the adhesive is applied to a side surface of the substrate and a surface of the film member opposite the contact surface to fix the substrate to the holder member.

[0010] Furthermore, the reading device of the present invention is provided with the above-mentioned light receiving device.

[0011] The present invention allows for easy removal of adhesive from the substrate when the substrate is removed from the holder during repair operations in the manufacturing process. Effect of the Invention

[0012] According to the present invention, it is possible to realize an exposure device, an image forming device, a light receiving device, and a reading device that can be assembled more simply. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a left side view showing a configuration of a color printer according to first to fourth embodiments. [Diagram 2] FIG. 1 is a perspective view showing a configuration of an LED head according to first to fourth embodiments. [Diagram 3] 2. FIG. 2 shows the configuration (1) of the LED head according to the first embodiment. [Figure 4] FIG. 2 is a plan view showing the configuration (2) of the LED head according to the first embodiment. [Diagram 5] FIG. 1 is a perspective view showing a configuration (1) of a substrate and a protective film according to a first embodiment. [Figure 6] FIG. 2 is an exploded perspective view showing a configuration (2) of a substrate and a protective film according to the first embodiment. [Figure 7] 7 is a cross-sectional view taken along the line X1-X1 in FIG. 5, showing a configuration (3) of a substrate and a protective film according to the first embodiment. [Figure 8] 7 is a cross-sectional view taken along the line X2-X2 in FIG. 5, showing a configuration (4) of a substrate and a protective film according to the first embodiment. [Figure 9] FIG. 1 is a perspective view showing a configuration (1) of a substrate and a protective film according to a second embodiment. [Figure 10] FIG. 11 is an exploded perspective view showing a configuration (2) of a substrate and a protective film according to a second embodiment. [Figure 11]10 is a cross-sectional view taken along the line X1-X1 in FIG. 9, showing a configuration (3) of a substrate and a protective film according to a second embodiment. [Figure 12] FIG. 11 is a perspective view showing a configuration (1) of a substrate, a protective film, and a jig according to a second embodiment. [Figure 13] FIG. 11 is a plan view showing a configuration (2) of a substrate, a protective film, and a jig according to the second embodiment. [Figure 14] FIG. 11 is a left side view showing a configuration (3) of a substrate, a protective film and a jig according to the second embodiment. [Figure 15] FIG. 11 is a perspective view showing a configuration (1) of a substrate and a protective film according to a third embodiment. [Figure 16] FIG. 11 is an exploded perspective view showing a configuration (2) of a substrate and a protective film according to a third embodiment. [Figure 17] 16 is a cross-sectional view taken along the line X1-X1 in FIG. 15, showing a configuration (3) of a substrate and a protective film according to a third embodiment. [Figure 18] FIG. 13 is a cross-sectional view showing the configuration of a substrate and a protective film according to a fourth embodiment. [Figure 19] FIG. 13 is a side view showing the configuration of a scanner according to a fifth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, modes for carrying out the invention (hereinafter referred to as embodiments) will be described with reference to the drawings.

[0015] 1. First embodiment [1-1. Color printer configuration] As shown in the left side view in FIG. 1, color printer 1 is a color electrophotographic printer that prints a desired color image on paper of, for example, A3 size or A4 size. Color printer 1 has various parts arranged inside printer housing 2 formed in a substantially box shape. In the following description, the right end part in FIG. 1 is the front of color printer 1, and the up-down direction, left-right direction, and front-rear direction are defined when viewed from the front. Color printer 1 is controlled as a whole by a control unit (not shown). This control unit is connected wirelessly or by wire to a host device (not shown) such as a personal computer via a communication processing unit (not shown). When image data representing a color image to be printed is given from the host device and printing of the color image is instructed, the control unit executes a printing process to form a print image on the surface of the paper.

[0016] A paper storage cassette 3 that stores paper is provided at the bottom of the printer housing 2. A pickup roller 5 is located above the front end of the paper storage cassette 3 and pulls out paper from the paper storage cassette 3. A paper feed roller 6 and a separation roller 7 are arranged in a pair in contact with each other in front of the pickup roller 5. For example, when multiple papers are pulled out at the same time, the paper is sequentially fed out one by one to a pair of conveying rollers 8 located downstream of the pair of conveying rollers 6 and 7, and the conveying section 4 has pairs of conveying rollers 8 and 9 arranged in order from upstream to downstream. The pairs of conveying rollers 8 and 9 sandwich and convey the paper fed out from the paper feed roller 6 and the separation roller 7, and at the same time, correct the skew of the paper and convey it along the conveying direction toward the transfer belt 10.

[0017] A transfer belt 10 is provided above the paper storage cassette 3 inside the printer housing 2, and extends across the printer housing 2 from front to back. The transfer belt 10 is stretched so that its central axis faces left to right and goes around rollers arranged one at the front and one at the back. The transfer belt 10 is also formed as an endless belt that is wide in the left to right direction, and by running in conjunction with the rotation of the rollers, it places the paper handed over from the transport roller pair 9 on its top surface and transports it backward.

[0018] On the other hand, above the transfer belt 10, i.e., above the center of the printer housing 2, four image forming units 12C, 12M, 12Y, and 12K (hereinafter collectively referred to as image forming units 12) are arranged in order from the rear side to the front side. That is, the image forming units 12 of each color are arranged in a so-called tandem system. The image forming units 12C, 12M, 12Y, and 12K correspond to the colors of cyan (C), magenta (M), yellow (Y), and black (K), respectively. The image forming units 12C, 12M, 12Y, and 12K are configured similarly to each other, and only the corresponding toner colors are different. The image forming units 12 are formed in a box shape that is relatively long in the left-right direction so as to correspond to the left-right width of the paper.

[0019] Also provided within the printer housing 2 are LED heads 16C, 16M, 16Y, and 16K (hereinafter collectively referred to as LED head 16) corresponding to the image forming units 12C, 12M, 12Y, and 12K, respectively. The LED head 16 is configured as a rectangular parallelepiped elongated in the left-right direction, and has a plurality of LEDs arranged in a row along the left-right direction inside it, causing each LED to emit light in a light emission pattern according to image data supplied from the control unit. When the image forming units 12 are attached to the printer housing 2, they are arranged very close to the LED head 16, and exposure processing is performed using light from the LED head 16.

[0020] Further, toner cartridges 18C, 18M, 18Y, and 18K (hereinafter collectively referred to as toner cartridges 18) are connected to the upper portions of the image forming units 12C, 12M, 12Y, and 12K, respectively. The toner cartridges 18 are hollow containers long in the left-right direction, and contain powdered toners of each color, respectively, and incorporate a predetermined stirring mechanism. Transfer rollers 13C, 13M, 13Y, and 13K (hereinafter collectively referred to as transfer rollers 13) are provided at four positions directly below each image forming unit 12. That is, each image forming unit 12 sandwiches an upper portion of the transfer belt 10 between itself and each transfer roller 13. Incidentally, the transfer rollers 13 are configured to be capable of being charged.

[0021] Color printer 1 supplies toner from toner cartridge 18 to image forming units 12. At the same time, color printer 1 causes LED head 16 to emit light so as to form an emission pattern corresponding to image data supplied from a higher-level device (not shown). In response, each image forming unit 12 uses toner supplied from toner cartridge 18 to form a toner image corresponding to the emission pattern of LED head 16, and transfers this toner image onto paper. As a result, four-color toner images corresponding to the image data are sequentially transferred onto the paper being transported by transfer belt 10.

[0022] A fuser unit 20 is provided behind the transfer belt 10, i.e., near the vertical center near the rear end of the printer housing 2. The fuser unit 20 is made up of a pair of rollers: a heating roller, which is disposed above the conveying section 4 and has an internal heater and whose surface is made of an elastic material, and a pressure roller, which is disposed below the conveying section 4 and presses its upper surface against the heating roller, and applies heat and pressure to the toner image on the paper sent out from the transfer belt 10 to fuse the toner image to the paper. The paper is then conveyed by a pair of discharge rollers 21 and eventually discharged to a discharge tray 2T formed on the top surface of the printer housing 2.

[0023] Further, a double-sided transport unit 22 is provided below the transfer belt 10, that is, below the center of the printer housing 2. The double-sided transport unit 22 inverts the paper and transports the paper to the transport roller pair 8 again.

[0024] [1-2. LED head configuration] Next, a description will be given of the configuration of the LED head 16. As shown in Figures 2 and 3, the LED head 16 is formed into a rectangular parallelepiped shape that is elongated in the left-right direction as a whole, and is configured such that various parts are attached to a holder 51.

[0025] [1-3.Holder configuration] As shown in Figs. 2, 3 and 4, the holder 51 is manufactured to have a predetermined thickness, for example, by pressing a metal plate, and has a shape in which the side surface on the opposite side to the irradiation direction is removed from a hollow rectangular prism having a holder internal space 51IS, which is an internal space formed along the left-right direction, and its cross section is shaped like a capital letter "U". The holder 51 is also configured with a plate-like bottom 51B that is elongated in the left-right direction and thin in the up-down direction as its center. Furthermore, the holder 51 has side parts 51W that are elongated in the left-right direction and thin in the front-back direction extending upward from both front and back sides of the bottom 51B so as to be parallel to each other, and a holder opening 51A that opens at the upper end is formed. A slit-shaped lens array hole 51H that is elongated in the left-right direction and thin in the front-back direction is drilled at approximately the center of the bottom 51B in the front-back direction so as to penetrate in the up-down direction.

[0026] The holder inner wall surface 51WS, which is a flat surface extending along the up-down direction and the left-right direction, is formed on the surface of the pair of front and rear side portions 51W facing the holder internal space 51IS, i.e., the rear surface of the front side portion 51W and the front surface of the rear side portion 51W. The side portions 51W have protrusions 51P protruding from the holder inner wall surface 51WS toward the holder internal space 51IS, i.e., from the holder inner wall surface 51WS of the front side portion 51W toward the rear side and from the holder inner wall surface 51WS of the rear side portion 51W toward the front side. The protrusions 51P are generally frustum-shaped and are formed at a location facing the board short-side end surface 55ES, which is the end surface of the board 55 in the front-back direction, in the front-back direction. The protrusions 51P of the front side portion 51W and the protrusions 51P of the rear side portion 51W are arranged in a pair so that their positions in the left-right direction match. In the LED head 16, a protrusion 51P is formed on the holder 51 only at the same position in the left-right direction as the position where the adhesive 60 is applied.

[0027] Furthermore, the protrusions 51P are provided in pairs on the front and rear side portions 51W at predetermined intervals along the left-right direction from the right end to the left end of the holder inner wall surface 51WS, and have predetermined lengths in the up-down and left-right directions. The protrusions 51P are formed by pushing the side portions 51W from the outer surface side in the front-back direction of the side portions 51W toward the holder internal space 51IS in a die manufacturing process of the holder 51. Specifically, the height of the protrusions 51P in the front-back direction is about one-third of the distance between the holder inner wall surface 51WS and the board short-side end surface 55ES of the board 55.

[0028] On the side of the holder internal space 51IS in the protrusion 51P, a protrusion inner side surface 51PS is formed, which is a circular flat surface extending in the vertical and horizontal directions and serves as a base on which the adhesive 60 is applied. The protrusion inner side surface 51PS is formed from the side opposite the irradiation direction of the protective film 58 adhered to the electronic component arrangement surface 55A, which is the upper surface of the substrate 55, to the side in the irradiation direction of the LED array arrangement surface 55B, which is the lower surface of the substrate 55. The protrusion inner side surface 51PS is formed so as to leave a small gap between it and the substrate short-side end surface 55ES of the substrate 55. The adhesive 60 is applied to this protrusion inner side surface 51PS.

[0029] Further, the lens array 53 is inserted and attached in the lens array hole 51H. In this way, the lens array 53 is supported by the holder 51. The lens array 53 is formed as a rectangular parallelepiped elongated in the left-right direction as a whole, and holds a large number of minute lenses arranged in the left-right direction. The lenses have optical properties that converge the light emitted from the LED array 56 described later. The lens array 53 is fixed to the holder 51 in a position where the incident distance between the upper surface, which is the end surface into which light is incident in the lens array 53, and the lower surface, which is the surface of the LED array 56, is an optimal value in terms of the characteristics of the lens array 53.

[0030] The gap between the bottom 51B of the holder 51 and the lens array 53 is filled with adhesive 62 so as to fill the gap. The adhesive 62 is an ultraviolet-curing adhesive that is cured by irradiation with UV (Ultraviolet) light. The adhesive 62 is also a strong ultraviolet-curing adhesive with strong adhesive strength. With this, the LED head 16 fixes the lens array 53 to the holder 51, seals the gap between the holder 51 and the lens array 53, and almost completely seals the space surrounded by the bottom 51B and front and rear side parts 51W of the holder 51 and the LED array arrangement surface 55B of the substrate 55, thereby preventing the intrusion of light and foreign matter into this space.

[0031] 5, 6, 7 and 8, is attached to the holder 51 above the lens array 53, with its longitudinal direction aligned in the left-right direction so as to be in contact with the adhesive 60. The substrate 55 is made of a so-called glass epoxy substrate, and is formed in a plate shape that is elongated in the left-right direction and thin in the up-down direction, with multiple conductive layers on which a predetermined wiring pattern is formed stacked in the up-down direction. The length of the substrate 55 in the front-rear direction is shorter than the distance between the side portions 51W of the holder 51.

[0032] [1-4. Circuit board configuration] An LED array 56 is mounted on an LED array arrangement surface 55B, which is the underside of the substrate 55, approximately in the center in the front-to-rear direction along the longitudinal direction of the substrate 55 so as to face the lens array 53. This LED array 56 is configured by arranging a plurality of LED chips along the left-to-right direction so that light-emitting points that emit light downward are lined up at predetermined minute intervals along the left-to-right direction.

[0033] A plurality of electronic components 55E such as resistors and capacitors for driving the LED head 16 are mounted on an electronic component arrangement surface 55A which is the upper surface of the substrate 55. The electronic components 55E are arranged side by side in the left-right direction which is the longitudinal direction of the substrate 55, at approximately the center in the front-rear direction which is the short side direction of the substrate 55, with their positions in the front-rear direction being approximately aligned.

[0034] Further, near the right end of electronic component arrangement surface 55A of substrate 55, connector 55C is mounted for connecting cables that connect various electronic components 55E of substrate 55 to a control unit (not shown) of color printer 1 (FIG. 1) and the like. Hereinafter, electronic components 55E and connector 55C are collectively referred to as mounted components 55M. By being mounted on electronic component arrangement surface 55A, these mounted components 55M protrude from electronic component arrangement surface 55A in the opposite direction to the illumination direction.

[0035] Furthermore, at both left and right ends of the substrate 55, fitting holes 55H into which pins (not shown) of the holder 51 fit are formed. The LED head 16 regulates the left-right and front-rear position of the substrate 55 within the holder 51 by fitting the pins (not shown) of the holder 51 into the fitting holes 55H of the substrate 55.

[0036] A protective film 58 is attached to an electronic component mounting surface 55A of the substrate 55, and the entire electronic component mounting surface 55A is covered with the protective film 58, thereby preventing exposure to the outside.

[0037] [1-5. Composition of protective film] The protective film 58 is made of an insulating polyester material such as a PET film, and is formed into a film shape that is thin in the vertical direction with a thickness of about 0.2 mm, slightly wider in the front-to-rear direction (i.e., width) than the substrate 55, and longer in the left-to-right direction.

[0038] Further, the protective film 58 has film holes 58H1 and 58H2 cut out at the same position, shape and size as the electronic component 55E and the connector 55C in accordance with the external shapes of the electronic component 55E and the connector 55C when viewed from the opposite irradiation direction. Therefore, when the protective film 58 is attached to the board 55, the electronic component 55E, the connector 55C and the like are exposed to the opposite irradiation direction of the protective film 58 without covering them. Further, the protective film 58 has film holes 58H3 cut out at the same position, shape and size as the fitting hole 55H in accordance with the shape of the fitting hole 55H when viewed from the opposite irradiation direction. Therefore, when the protective film 58 is attached to the board 55, the fitting hole 55H is exposed to the opposite irradiation direction of the protective film 58 without covering it. Hereinafter, the film holes 58H1, 58H2 and 58H3 are collectively referred to as film holes 58H. In this manner, the protective film 58 has the film holes 58H formed therein independently of one another at positions into which the mounting components 55M are fitted one by one.

[0039] In addition, protective film 58 is fixed to substrate 55 by being adhered to electronic component arrangement surface 55A of substrate 55 by a low-adhesion adhesive layer provided on film substrate adhesive surface 58B, which is the underside opposite electronic component arrangement surface 55A of substrate 55.

[0040] 7, protective film width Wf, which is the length in the short side direction of protective film 58, is set to be equal to or larger than board width Wb, which is the length in the short side direction of board 55 (i.e., Wf≧Wb). Therefore, protective film 58 is formed to be equal to or larger than the length in the short side direction of board 55, so that protective film 58 protrudes beyond the ends in the short side direction of board 55 (i.e., board short side end faces 55ES) to both outsides in the short side direction, and reliably covers the entire surface of electronic component arrangement surface 55A of board 55. Thus, protective film 58 prevents adhesive 60 from adhering to electronic component arrangement surface 55A, and prevents adhesive 60 from penetrating between film board bonding surface 58B and electronic component arrangement surface 55A.

[0041] 3 and 4, adhesive 60 is applied to the film exposed surface 58A, which is the upper surface of the protective film 58, the short-side end surface 55ES of the substrate, and the holder inner wall surface 51WS of the holder 51. Therefore, the adhesive 60 is applied between the film exposed surface 58A and the holder inner wall surface 51WS, and the adhesive 60 is filled in the gap between the short-side end surface 55ES of the substrate and the holder inner wall surface 51WS so as to fill this gap. In this way, the LED head 16 adheres the substrate 55 to which the protective film 58 is fixed to the holder 51.

[0042] In this way, protective film 58 is interposed between electronic component arrangement surface 55A of substrate 55 and adhesive 60, thereby preventing adhesive 60 from adhering to electronic component arrangement surface 55A of substrate 55. Also, protective film 58 is fixed to substrate 55 by an adhesive layer with low adhesion so that protective film 58 can be easily separated and peeled off from substrate 55 during repair work in the manufacturing process of LED head 16. However, adhesive 60 has a relatively high viscosity of 1400 mPa s or more before curing, and therefore does not easily penetrate into the gap between protective film 58 and substrate 55.

[0043] In this manner, the LED head 16 is fixed to the holder 51 by the adhesive 60 with the protective film 58 superimposed so as to cover the entire electronic component mounting surface 55A of the substrate 55.

[0044] [1-6. About adhesives] The adhesive 60 is an ultraviolet-curing adhesive like the adhesive 62. The part of the adhesive 60 on the opposite side of the irradiation direction from the protective film 58 has a shape close to a quarter sphere due to surface tension, and the lower end reaches a position in the vertical direction that is almost the same as the LED array arrangement surface 55B of the substrate 55. The adhesive 60 is applied in a size and amount that ensures adhesive strength between the film exposed surface 58A of the protective film 58, the substrate short-side end surface 55ES of the substrate 55, and the holder inner wall surface 51WS of the holder 51. Therefore, the adhesive 60 is almost contained within the area of ​​the protrusion inner surface 51PS, and does not protrude in the vertical and horizontal directions from the protrusion inner surface 51PS. Furthermore, the length of the adhesive 60 in the front-rear direction is wider than the distance between the protrusion inner surface 51PS and the substrate short-side end surface 55ES. In this way, the substrate 55 is fixed to the holder 51 only by the adhesive 60.

[0045] Hereinafter, when viewed from the counter-illumination direction side toward the illumination direction side, the region of electronic component placement surface 55A of substrate 55 that is inside adhesive 60 relative to the contour of adhesive 60 is also referred to as electronic component placement surface adhesive contour inner region 55A1, which is hatched in Fig. 4. Protective film 58 is attached to substrate 55 so as to cover the entire electronic component placement surface adhesive contour inner region 55A1 from the counter-illumination direction side.

[0046] [1-7. LED head manufacturing] Next, a manufacturing process of the LED head 16 will be described. In this LED head manufacturing process, the lens array 53 is fixed to the holder 51 with an adhesive 62. First, the protective film 58 is attached to the electronic component arrangement surface 55A of the substrate 55 with the film substrate bonding surface 58B of the protective film 58 facing the electronic component arrangement surface 55A of the substrate 55. At this time, the protective film 58 is pressed toward the substrate 55 so that the film holes 58H1 and 58H2 fit into the electronic components 55E and the connector 55C, respectively, thereby positioning the protective film 58 in the front-rear and left-right directions relative to the substrate 55.

[0047] Next, while adjusting the position of the substrate 55 so that the distance between the LED array 56 and the lens array 53 is optimal, the substrate 55 is fixed to the holder 51 with the LED array 56 and the lens array 53 facing each other in the vertical direction. At this time, adhesive 60 is filled into the gap between the substrate short-side end face 55ES of the substrate 55 and the protrusion inner side face 51PS of the holder 51 from the holder opening 51A side, and bonds the substrate short-side end face 55ES of the substrate 55 and the protrusion inner side face 51PS of the holder 51. The adhesive 60 is also applied to the film exposed surface 58A, and bonds the film exposed surface 58A and the holder inner wall surface 51WS.

[0048] In this manner, the LED head 16 is fixed to the holder 51 by applying adhesive 60 between the short-side end face 55ES of the substrate 55 to which the protective film 58 is attached and the holder 51, and between the film exposed surface 58A and the holder 51, and by holding the substrate 55 in place until the adhesive 60 hardens.

[0049] [1-8. Removing the circuit board during LED head manufacturing] Here, a description will be given of an operation in which, in the manufacturing process of the LED head 16, a defect occurs in the substrate 55 fixed to the holder 51, and the substrate 55 is removed from the holder 51 in order to be repaired. First, for example, the blade of an ultrasonic cutter is inserted into the gap between the holder inner wall surface 51WS (FIG. 4) and the front and rear ends of the protective film 58, and the adhesive 60 is cut in the left-right direction at a position between the holder inner wall surface 51WS and the front and rear ends of the protective film 58 in the front-rear direction. As a result, the substrate 55 with the protective film 58 adhered thereto is removed from the holder 51. Next, the protective film 58 is peeled off from the substrate 55, and the adhesive 60 is removed from the substrate 55.

[0050] [1-9. Actions and Effects] In the above configuration, the LED head 16 has a protective film 58 attached to the electronic component arrangement surface 55A of the substrate 55, and adhesive 60 applied to the film exposed surface 58A of the protective film 58, the substrate short-side end surface 55ES of the substrate 55, and the holder inner wall surface 51WS of the holder 51, so that the substrate 55 is fixed to the holder 51 by the adhesive 60.

[0051] Therefore, when a worker removes the substrate 55 from the holder 51 during repair work in the manufacturing process of the LED head 16, the adhesive 60 can be easily removed from the substrate 55 simply by peeling the protective film 58 off the substrate 55, and the adhesive 60 can be reliably prevented from remaining on the substrate 55. As a result, the LED head 16 makes it easy to remove the adhesive 60 from the substrate 55 during repair work in the manufacturing process of the LED head 16, and allows the worker to easily remove the substrate 55 from the holder 51. Thus, the LED head 16 makes the repair work easy and improves manufacturing efficiency and productivity.

[0052] According to the above configuration, the LED head 16 of the color printer 1 is an LED head 16 having a substrate 55 on which an LED array 56 as a plurality of light-emitting elements is arranged, a lens array 53 onto which light from the LED array 56 is incident, and a holder 51 that holds the substrate 55 and the lens array 53, and is provided with an adhesive 60 that fixes the substrate 55 to the holder 51, and a protective film 58 that covers at least a portion of the substrate 55, the substrate 55 having an LED array arrangement surface 55B on which the LED array 56 is arranged and an electronic component arrangement surface 55A that is the opposite surface to the LED array arrangement surface 55B, the protective film 58 having a film substrate bonding surface 58B that contacts the electronic component arrangement surface 55A, and the adhesive 60 is applied to a substrate short-side end surface 55ES as a side surface of the substrate 55 and to a film exposed surface 58A that is the opposite surface to the film substrate bonding surface 58B of the protective film 58, thereby fixing the substrate 55 to the holder 51.

[0053] This allows the adhesive 60 to be easily removed from the substrate 55 when the substrate 55 is removed from the holder 51 during repair work in the manufacturing process.

[0054] 2. Second embodiment [2-1. Color printer configuration] As shown in FIG. 1, color printer 101 according to the second embodiment differs from color printer 1 according to the first embodiment in that it has LED head 116 (LED heads 116C, 116M, 116Y and 116K) instead of LED head 16 (LED heads 16C, 16M, 16Y and 16K), but is otherwise configured similarly.

[0055] [2-2. LED head configuration] As shown in FIG. 2 and FIG. 9, FIG. 10 and FIG. 11 in which the same reference numerals are used for components corresponding to those in FIG. 5, FIG. 6 and FIG. 7, the LED head 116 according to the second embodiment differs from the LED head 16 according to the first embodiment in that it has a protective film 158 instead of the protective film 58, but is otherwise configured in the same manner.

[0056] [2-3. Composition of protective film] The protective film 158 is different from the protective film 58 in that it has a film hole 158H1 instead of the film hole 58H1, but is otherwise configured in the same manner. The film hole 158H1 is an opening that is drilled from the left side of the left fitting hole 55H to the vicinity of the left side of the connector 55C in the left-right direction when the protective film 158 is attached to the board 55. The length of the film hole 158H1 in the front-rear direction is equal to that of the mounted component 55M that has the longest length in the front-rear direction among all the mounted components 55M mounted to the left of the connector 55C. Therefore, the film hole 158H1 has a rectangular shape that includes the multiple film holes 58H1 on the left side of the connector 55C and the left film hole 58H3 in the protective film 58 (FIG. 6). As a result, one film hole 158H1, one film hole 58H2, and a right-side film hole 58H3 are formed in the protective film 58. Hereinafter, the film holes 158H1, 58H2, and the right-side 58H3 are collectively referred to as the film hole 158H.

[0057] In this way, film hole 158H1 is formed in protective film 158 at a position facing multiple mounted components 55M so as to include multiple mounted components 55M within the opening. Therefore, when protective film 158 is attached to electronic component placement surface 55A of board 55, electronic component placement surface 55A inside film hole 158H1 is exposed to the outside, but electronic component placement surface adhesive inner contour area 55A1 (FIG. 4) arranged at the front and rear ends, which are at least a part of electronic component placement surface 55A, is covered by protective film 158, thereby preventing the front and rear ends from being exposed to the outside.

[0058] [2-4. LED head manufacturing] The LED head 116 is different from the LED head 16 in the process of attaching the protective film 158 to the substrate 55, but the other processes are the same.

[0059] [2-5. Attaching the protective film to the board] In the LED head 16 according to the first embodiment, the protective film 58 is positioned in the front-to-back and left-to-right directions relative to the substrate 55 by fitting into the mounted components 55M of the substrate 55, whereby the protective film 58 is positioned in the front-to-back and left-to-right directions relative to the substrate 55.

[0060] In contrast, in the LED head 116, a large film hole 158H1 is drilled in the protective film 158 so that multiple mounted components 55M can be accommodated within the opening, so that even if the mounted components 55M are placed within the film hole 158H, the protective film 158 cannot be accurately aligned with the substrate 55.

[0061] In the LED head 116, a jig 68 as shown in Figs. 12, 13 and 14 is used to align the protective film 158 with respect to the substrate 55 in the front-rear and left-right directions. The jig 68 has a cross section shaped like a capital letter "U" as a whole, and is formed with a substrate mounting surface 68S1, a protective film one end abutment surface 68S2, an LED retraction portion 68L and a jig post 68P. The substrate mounting surface 68S1 is a flat surface along the horizontal direction, and abuts against the LED array arrangement surface 55B of the substrate 55 to mount the substrate 55. The protective film one end abutment surface 68S2 is a flat surface extending from the rear end of the substrate mounting surface 68S1 in the vertical direction so as to be perpendicular to the substrate mounting surface 68S1, and is abutted against the rear end surface of the protective film 58. The LED retraction portion 68L is recessed downward from the substrate mounting surface 68S1, and a space is formed therein to accommodate the LED array 56 so that the jig 68 does not physically interfere with the LED array 56 when the substrate 55 is mounted on the substrate mounting surface 68S1. The jig post 68P is a cylindrical member that stands upward from both left and right ends of the bottom surface of the LED retraction portion 68L. When the substrate 55 is mounted on the substrate mounting surface 68S1, the jig post 68P penetrates and fits into the fitting hole portion 55H of the substrate 55 and protrudes above the film exposed surface 58A of the protective film 58.

[0062] The rear length L1 of the substrate mounting surface 68S1, which is the length in the front-rear direction behind the LED retraction portion 68L, is set to a length that forms a slight gap in the front-rear direction between the rear substrate short-side end face 55ES of the substrate 55 and the protective film one-end abutment face 68S2 when the jig post 68P penetrates the fitting hole portion 55H of the substrate 55. Therefore, in this state, when the rear end face of the protective film 58 is attached to the substrate 55 while abutting against the protective film one-end abutment face 68S2, the rear end of the protective film 58 protrudes rearward from the rear substrate short-side end face 55ES of the substrate 55. In this state, the lengths in the short-side direction of the substrate 55 and the protective film 58 are set so that the front end of the protective film 58 protrudes forward from the front substrate short-side end face 55ES of the substrate 55.

[0063] In this configuration, first, the substrate 55 is placed on the substrate mounting surface 68S1 so that the LED array arrangement surface 55B abuts against the substrate mounting surface 68S1 of the jig 68. At this time, the jig post 68P penetrates the fitting hole 55H of the substrate 55 with a slight gap formed in the front-rear direction between the substrate short-side end surface 55ES on the rear side of the substrate 55 and the protective film one-end abutment surface 68S2, and the substrate 55 is fixed.

[0064] Next, with film substrate adhesive surface 58B of protective film 158 facing electronic component arrangement surface 55A of substrate 55, protective film 158 is attached to electronic component arrangement surface 55A of substrate 55. At this time, with film hole 158H1 including all electronic components 55E to the left of connector 55C inside the opening and film hole 58H2 fitted into connector 55C, protective film 158 is attached to substrate 55 while the rear end face of protective film 158 is abutted against protective film one end abutment surface 68S2, whereby protective film 158 is positioned in the front-rear and left-right directions with respect to substrate 55.

[0065] [2-6. Effects, etc.] In the LED head 16 according to the first embodiment, the film holes 58H are formed independently at positions facing the respective mounted components 55M. Therefore, in the LED head 16, it was necessary to form the film holes 58H in accordance with the position, shape, and size of each mounted component 55M.

[0066] In contrast, the LED head 116 is configured to form a film hole 158H1 in the protective film 158 at a position facing the multiple mounted components 55M so as to include the multiple mounted components 55M within the opening. Therefore, compared to the LED head 16, the LED head 116 can make the shape of the film hole 158H in the protective film 158 simpler than the film hole 58H of the protective film 58, and can reduce the number of film holes 158H compared to the film hole 58H. This makes it possible to reduce the difficulty of manufacturing the protective film 158 in the LED head 116 compared to the LED head 16.

[0067] In addition, the LED head 116 according to the second embodiment can achieve the same effects as the LED head 16 according to the first embodiment.

[0068] 3. Third Embodiment [3-1. Color printer configuration] As shown in FIG. 1, color printer 201 according to the third embodiment differs from color printer 101 according to the second embodiment in that it has LED head 216 (LED heads 216C, 216M, 216Y and 216K) instead of LED head 116 (LED heads 116C, 116M, 116Y and 116K), but is otherwise configured similarly.

[0069] [3-2. LED head configuration] As shown in FIG. 2 and FIG. 15, FIG. 16, and FIG. 17 in which the same reference numerals are used for components corresponding to those in FIG. 9, FIG. 10, and FIG. 11, the LED head 216 according to the third embodiment differs from the LED head 116 according to the second embodiment in that it has a protective film 258 instead of the protective film 158, but is otherwise configured in the same manner.

[0070] [3-3. Composition of protective film] The protective film 258 is divided into a front protective film 258F and a rear protective film 258B, and the protective film 258F and the protective film 258B are formed independently of each other. Therefore, an opening 258H is formed between the rear end of the protective film 258F and the front end of the protective film 258B to expose the mounted component 55M to the opposite irradiation direction. The distance in the front-rear direction between the rear end of the protective film 258F and the front end of the protective film 258B is equal to the longest length in the front-rear direction among all the mounted components 55M mounted on the electronic component arrangement surface 55A of the board 55. Hereinafter, the protective film 258F and the protective film 258B are collectively referred to as the protective film 258.

[0071] [3-4. LED head manufacturing] The LED head 216 is different from the LED head 116 in the process of attaching the protective film 258 to the substrate 55, but the other processes are the same.

[0072] [3-5. Attaching the protective film to the board] First, the substrate 55 is placed on the substrate mounting surface 68S1 of the jig 68 (FIGS. 12, 13, and 14) so ​​that the LED array arrangement surface 55B abuts against the substrate mounting surface 68S1. At this time, the jig post 68P penetrates the fitting hole 55H of the substrate 55 with a slight gap formed in the front-rear direction between the substrate short-side end surface 55ES on the rear side of the substrate 55 and the protective film one end abutment surface 68S2, and the substrate 55 is fixed.

[0073] Next, with the film substrate adhesive surface 58B of the protective film 258B facing the electronic component arrangement surface 55A of the substrate 55, the protective film 258B is attached to the electronic component arrangement surface 55A of the substrate 55. At this time, with the front end portion of the protective film 258B positioned rearward of all the mounted components 55M, the rear end surface of the protective film 258B is abutted against the protective film one end abutment surface 68S2 while being attached to the substrate 55, whereby the position of the protective film 258B in the front-rear and left-right directions relative to the substrate 55 is determined.

[0074] Next, the substrate 55 to which the protective film 258B is attached is rotated 180[°] around the vertical axis, and with the film substrate bonding surface 58B of the protective film 258F facing the electronic component arrangement surface 55A, the protective film 258F is attached to the electronic component arrangement surface 55A of the substrate 55. At this time, with the front end (rear end after manufacture) of the protective film 258F positioned rearward (frontward after manufacture) from all the mounted components 55M, the rear end face (frontward after manufacture) of the protective film 258B is attached to the substrate 55 while being abutted against the protective film one end abutment surface 68S2, whereby the position of the protective film 258F in the front-rear and left-right directions relative to the substrate 55 is determined.

[0075] In comparison with the LED head 16, the LED head 116 can reduce the amount of members using the protective film 258.

[0076] In addition, the LED head 216 according to the third embodiment can achieve the same effects as the LED head 116 according to the second embodiment.

[0077] 4. Fourth Embodiment [4-1. Color printer configuration] As shown in FIG. 1, color printer 301 according to the fourth embodiment differs from color printer 1 according to the first embodiment in that it has LED head 316 (LED heads 316C, 316M, 316Y and 316K) instead of LED head 16 (LED heads 16C, 16M, 16Y and 16K), but is otherwise configured similarly.

[0078] [4-2. LED head configuration] As shown in FIG. 2, the LED head 316 according to the fourth embodiment differs from the LED head 16 according to the first embodiment in that it has a protective film 358 instead of the protective film 58, but is otherwise configured in the same manner.

[0079] [4-3. Composition of protective film] As shown in Figure 18, in which the same symbols are used for components corresponding to those in Figure 8, the protective film 358 according to the fourth embodiment is formed to have a longer short-side length than the protective film 58 according to the first embodiment, and differs in that, when viewed from the center of the short side of the substrate 55, it extends toward the outside in the short side direction, bends downward at a right angle at the front and rear end portions of the substrate 55, and reaches approximately the center in the vertical direction of the substrate short-side end face 55ES, but is otherwise configured in the same way.

[0080] [4-4. Effects, etc.] In the above configuration, the LED head 316 is configured so that both ends of the protective film 358 in the short side direction reach approximately the center in the thickness direction of the board short side end face 55ES. Therefore, compared to the LED head 16, the LED head 316 can cover approximately the upper half of the board short side end face 55ES. Therefore, compared to the LED head 16, the LED head 316 can further prevent the adhesive 60 from entering between the film board bonding surface 58B and the electronic component arrangement surface 55A when the adhesive 60 is applied from the opposite irradiation direction side.

[0081] In addition, the LED head 316 does not have a protective film 358 interposed between the lower half of the short-side end surface 55ES of the substrate and the holder inner wall surface 51WS of the holder 51. The substrate 55 can be directly bonded to the holder inner wall surface 51WS with adhesive 60. This allows the LED head 316 to maintain the adhesive force of the substrate 55 to the holder 51, position and fix the substrate 55 to the holder 51 so that the substrate 55 does not move, and maintain an optimal gap between the LED array 56 on the substrate 55 and the lens array 53.

[0082] In addition, the LED head 316 according to the fourth embodiment can achieve the same effects as the LED head 16 according to the first embodiment.

[0083] [5. Fifth Embodiment] [5-1. Scanner configuration] As shown in a side view in FIG. 19, the scanner 82 is a document reading device, and generates electronic data by reading a document M as a medium having a size such as A3 size or A4 size. The scanner 82 as a reading device is composed of a reading head 83, a lamp 84, a document table 85, a rail 86, a drive belt 87, a motor 88, and the like. The lamp 84 is arranged so that the light emitted by the lamp 84 is reflected by the surface of the document M as a light source and taken into the reading head 83. The document table 85 is formed of a material that transmits visible light, and the document M is placed on it. The rail 86 is arranged below the document table 85, and supports the reading head 83 so that it can move. The reading head 83 as a light receiving device is partly connected to a drive belt 87 stretched by a plurality of pulleys 90, and is configured to be movable on the rail 86 by the drive belt 87 driven by a motor 88. The reading head 83 takes in the light irradiated by the lamp 84 and reflected by the surface of the document M, and converts it into electronic data.

[0084] [5-2. Read head configuration] The reading head 83 is configured such that a line sensor 94, which is a detector, is arranged instead of the LED array 56 (FIG. 3) of the LED head 16, and an original M, which is an object, is arranged instead of the photosensitive drum (FIG. 1). The reading head 83 is configured with a lens unit 92, a mirror 93, and a line sensor 94. The lens unit 92 is configured in the same manner as the lens array 53 (FIG. 3) according to the first embodiment. The mirror 93 bends the optical path of the light reflected by the original M and makes it enter the lens unit 92. The line sensor 94 has a plurality of light receiving elements arranged in a straight line at a predetermined interval, and converts the image of the original image formed by the lens unit 92 into an electrical signal. In this embodiment, the line sensor 94 has a resolution of 600 [dpi], so 600 light receiving elements are arranged per inch. That is, the light receiving elements are arranged at a longitudinal interval of 0.0423 [mm].

[0085] In this configuration, the scanner 82 turns on a lamp 84 to irradiate light onto the surface of the original M, and captures the light reflected from the surface of the original M into the reading head 83. The scanner 82 drives a drive belt 87 with a motor 88 to move the reading head 83 and the lamp 84 in the left-right direction of the paper in FIG.

[0086] At this time, the light reflected by the original M passes through the original table 85, has its optical path bent by a mirror 93, and enters a lens unit 92. An image of the original image formed by the lens unit 92 is formed on a line sensor 94, which converts the formed image of the original image into an electrical signal to generate electronic data.

[0087] In addition, the scanner 82 having the reading head 83 according to the fifth embodiment can achieve substantially the same effects as the color printer 1 having the LED head 16 according to the first embodiment.

[0088] [6. Other embodiments] In the above-mentioned first embodiment, the protective film 58 is described as being made of a PET film. The present invention is not limited to this, and the protective film 58 may be made of various materials other than a PET film, and may be made of a plate-like material having a thickness of more than 0.2 mm. In short, it is sufficient that the protective film 58 is a material that can be easily separated from the substrate 55 and covers the entire area of ​​the adhesive inner area 55A1 of the electronic component placement surface of the substrate 55 from the opposite irradiation direction. The same applies to the second to fifth embodiments.

[0089] In the above-mentioned first embodiment, the protective film 58 is described as protruding beyond the short-side end face 55ES of the substrate 55 to both outer sides in the short-side direction. The present invention is not limited to this, and both outer ends of the protective film 58 in the short-side direction may be positioned in the same position in the short-side direction as the short-side end face 55ES of the substrate 55 when viewed from the center of the substrate 55 in the short-side direction. In short, it is sufficient that the protective film 58 is protruding to the same position as the short-side end face 55ES of the substrate 55 in the short-side direction of the substrate 55 or further outward. The same is true for the second to fifth embodiments.

[0090] Furthermore, in the above-mentioned first embodiment, the film holes 58H1 and 58H2 are cut out in the same shape and size as the external shapes of the electronic component 55E and the connector 55C when viewed from the opposite irradiation direction. The present invention is not limited to this. The film holes 58H1 and 58H2 may be cut out slightly smaller than the external shapes of the electronic component 55E and the connector 55C when viewed from the opposite irradiation direction, so that when the protective film 58 is attached to the board 55, the protective film 58 is pressed into the board 55 so that the film holes 58H1 and 58H2 fit into the electronic component 55E and the connector 55C, respectively, thereby positioning the front-rear and left-right directions of the protective film 58 relative to the board 55. The same applies to the fifth embodiment.

[0091] Furthermore, in the above-mentioned first embodiment, the adhesives 60 and 62 are described as being made of an ultraviolet-curing adhesive. However, the present invention is not limited to this, and the adhesives 60 and 62 may be made of various other materials, such as an adhesive that is cured by an accelerator, an adhesive that is cured over time, an adhesive that is cured by a temperature change, or a mixture of these adhesives. The same applies to the second to fifth embodiments.

[0092] Furthermore, in the above-mentioned first embodiment, the adhesives 60 and 62 are the same material. However, the present invention is not limited to this, and the adhesives 60 and 62 may be different materials. The same applies to the second to fifth embodiments.

[0093] Furthermore, in the above-mentioned first embodiment, the present invention has been described as being applied to the LED heads 16 of each color corresponding to the image forming units 12 of each color arranged in series along the front-to-rear direction in a tandem type color printer 1. However, the present invention is not limited to this, and may be applied to LED heads mounted on color printers of various other types, such as a four-cycle type. The same applies to the second to fourth embodiments.

[0094] Furthermore, in the above-mentioned first embodiment, a case has been described in which four LED heads 16 corresponding to the colors yellow, magenta, cyan, and black are attached to the printer housing 2 of a color printer 1 that performs color printing. The present invention is not limited to this, and for example, three or less or five or more LED heads 16 may be attached to the printer housing 2 depending on the number of colors of toner used in the color printer, and one LED head 16 may be attached to a monochrome printer that performs monochrome printing. The same applies to the second to fourth embodiments.

[0095] Furthermore, in the above-mentioned first embodiment, the present invention has been described as being applied to color printer 1. However, the present invention is not limited to this, and may be applied to devices such as facsimiles, MFPs (Multifunction Printers), and copiers, so long as they have an LED head 16 like color printer 1. The same applies to the second to fourth embodiments.

[0096] Furthermore, in the above-mentioned fifth embodiment, the present invention has been described as being applied to the scanner 82. However, the present invention is not limited to this, and may also be applied to sensors and switches that convert optical signals into electrical signals, as well as input / output devices, biometric authentication devices, communication devices, dimension measuring instruments, and the like that use these sensors and switches.

[0097] Furthermore, the present invention is not limited to the above-mentioned embodiments and other embodiments. In other words, the scope of application of the present invention also extends to embodiments in which the above-mentioned embodiments and part or all of the above-mentioned other embodiments are arbitrarily combined. The scope of application of the present invention also extends to cases in which a part of the configuration described in any of the above-mentioned embodiments and other embodiments is extracted and replaced or diverted with a part of the configuration of any of the above-mentioned embodiments and other embodiments, or a part of the extracted configuration is added to any of the embodiments.

[0098] Furthermore, in the above-mentioned first embodiment, the LED head 16 as an exposure device is constituted by the substrate 55 as a substrate, the lens array 53 as a lens member, and the holder 51 as a holder member, and the color printer 1 as an image forming device having the same is constituted, and further, the adhesive 60 as an adhesive and the protective film 58 as a film member are provided, and the substrate has the LED array arrangement surface 55B as a first surface and the electronic component arrangement surface 55A as a second surface, and the protective film 58 has the film substrate adhesive surface 58B as a contact surface. The present invention is not limited to this, and the exposure device is constituted by the substrate, the lens member, and the holder member having various other configurations, and the image forming device having the same is constituted, and further, the adhesive and the film member having various other configurations are provided, the substrate has the first surface and the second surface having various other configurations, and the film member has a contact surface having various other configurations. [Industrial Applicability]

[0099] The present invention can be used, for example, in an LED head mounted on an electrophotographic printer. [Explanation of symbols]

[0100] 1...color printer, 2...printer housing, 2T...output tray, 3...paper storage cassette, 4...transport section, 5...pickup roller, 6...paper feed roller, 7...separation roller, 8, 9...pair of transport rollers, 10...transfer belt, 12...image forming unit, 16, 116, 216, 316...LED head, 18...toner cartridge, 20...fuser unit, 21...pair of discharge rollers, 22...duplex transport unit, 51...holder, 51IS...holder internal space, 51B...bottom, 51W...side, 51WS...holder inner wall surface, 51H...lens array hole, 51A...holder opening, 51P...projection, 51PS...projection inner surface, 53...lens array, 55...board, 55A...electronic component arrangement surface, 55B...LED array arrangement surface, 55ES...board short side direction End face, 55H... fitting hole portion, 55E... electronic component, 55C... connector, 55A1... electronic component placement surface adhesive outer shape inner area, 56... LED array, 58, 158, 258, 358... protective film, 58A... film exposed surface, 58B... film substrate bonding surface, 58H1, 58H2, 58H3, 158H1... film hole portion, 258H... opening, 60... adhesive, 62... adhesive, 68... jig, 68S1... substrate mounting surface, 68S2... protective film one end abutment surface, 68L... LED retraction portion, 68P... jig post, L1... rear length of substrate mounting surface, 82... scanner, 83... reading head, 84... lamp, 85... manuscript table, 86... rail, 87... drive belt, 88... motor, 90... pulley, 92... lens unit, 93... mirror, 94... line sensor.

Claims

1. An exposure apparatus having a substrate on which a plurality of light-emitting elements are arranged, a lens member onto which light from the light-emitting elements is incident, and a holder member for holding the substrate and the lens member, an adhesive for fixing the substrate to the holder member; a film member that extends from a center side of the substrate in a lateral direction toward an outer side in the lateral direction to an outer side beyond an end portion of the substrate in the lateral direction and covers at least a portion of the substrate; having The substrate is a first surface on which the light emitting elements are arranged and a second surface which is the opposite surface to the first surface; having The film member is A contact surface that contacts the second surface having The adhesive is A coating is applied to a side surface of the substrate and a surface of the film member opposite to the contact surface, and fixes the substrate to the holder member. An exposure apparatus comprising:

2. The substrate is Further, a mounting component is disposed on the second surface. The film member is An opening is provided at a position corresponding to the mounted component.

2. The exposure apparatus according to claim 1, wherein:

3. The film member is detachably attached to the substrate.

3. The exposure apparatus according to claim 2, wherein:

4. The film member covers at least the entire area of ​​the second surface that is inside the outer shape of the adhesive when viewed from the opposite surface side of the contact surface.

3. The exposure apparatus according to claim 2, wherein:

5. The film member is the first surface is bent toward the side surface of the substrate, the first surface being bent toward the side surface of the substrate, and the second surface being bent toward the side surface of the substrate, ... and the second surface being bent toward the side surface of the substrate, and the second surface being bent toward the side surface of the substrate, and the second surface being bent toward the side surface of the substrate, and the second surface being bent toward the side surface of the substrate, and the second surface being bent toward the side surface of the substrate, and the second surface being bent toward the side surface of the substrate, and the second surface being bent toward the side surface of the substrate, and the second surface being bent toward the side surface of the substrate, and the third surface being bent toward the side surface of the substrate, and the second surface being bent toward the side surface of the substrate, and the third surface being bent toward the side surface of the substrate, and the second surface being bent toward the side surface of the substrate.

5. The exposure apparatus according to claim 4, wherein:

6. The openings are individually formed for each of the mounting components.

3. The exposure apparatus according to claim 2, wherein:

7. The opening is formed to include a plurality of the mounting components.

7. The exposure apparatus according to claim 6, wherein:

8. The film member is divided in the short direction of the substrate.

8. The exposure apparatus according to claim 7, wherein:

9. The adhesive has a viscosity of 1400 mPa·s or more before curing.

3. The exposure apparatus according to claim 2, wherein:

10. 10. An image forming apparatus comprising the exposure device according to claim 1.

11. A light receiving device having a substrate on which a plurality of light receiving elements are arranged, a lens member into which light radiated to the light receiving elements is incident, and a holder member for holding the substrate and the lens member, an adhesive for fixing the substrate to the holder member; a film member that extends from a center side of the substrate in a lateral direction toward an outer side in the lateral direction to an outer side beyond an end portion of the substrate in the lateral direction and covers at least a portion of the substrate; having The substrate is a first surface on which a plurality of the light receiving elements are arranged and a second surface which is the opposite surface to the first surface; having The film member is A contact surface that contacts the second surface having The adhesive is A coating is applied to a side surface of the substrate and a surface of the film member opposite to the contact surface, and fixes the substrate to the holder member. A light receiving device characterized by:

12. A reading device comprising the light receiving device of claim 11.

Images