Liquid ejection head and recording apparatus

Abstract

To increase connection reliability between a discharge member and a flexible substrate.SOLUTION: A liquid discharge head includes a discharge member, a flexible substrate, and a relay substrate. The discharge member includes a plurality of nozzles for discharging a liquid, a plurality of elements for discharging the liquid from the plurality of nozzles, and a plurality of terminals electrically connected to the plurality of elements respectively. The flexible substrate includes a plurality of signal lines corresponding to the plurality of terminals. The relay substrate connects the discharge member and the flexible substrate electrically. The relay substrate includes a plurality of first pads, a plurality of second pads, and a plurality of wiring lines. The plurality of first pads are joined to the plurality of terminals of the discharge member. The plurality of second pads are joined to the plurality of signal lines of the flexible substrate. The plurality of wiring lines connect the plurality of first pads and the plurality of second pads. An area of each of the plurality of second pads is larger than an area of each of the plurality of first pads.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The disclosed embodiments relate to a liquid ejection head and a recording apparatus. [Background technology]

[0002] 2. Description of the Related Art Known printing devices include inkjet printers and inkjet plotters that use an inkjet recording method. Such inkjet printing devices are equipped with a liquid ejection head for ejecting liquid.

[0003] In such a liquid ejection head, for example, a plurality of individual electrodes provided on an ejection member that ejects liquid are respectively joined to a plurality of signal lines of a flexible substrate by an anisotropic conductive bonding material, thereby electrically connecting the ejection member and the flexible substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2005-212238 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in conventional liquid ejection heads, there is still room for improvement in terms of improving the reliability of the connection between the ejection member and the flexible substrate.

[0006] One aspect of the embodiment has been made in consideration of the above, and aims to provide a liquid ejection head and a recording apparatus that can improve the connection reliability between an ejection member and a flexible substrate. [Means for solving the problem]

[0007] A liquid ejection head according to one aspect of the embodiment includes an ejection member, a flexible substrate, and a relay substrate. The ejection member has a plurality of nozzles for ejecting liquid, a plurality of elements for ejecting liquid from the plurality of nozzles, and a plurality of terminals electrically connected to each of the plurality of elements. The flexible substrate has a plurality of signal lines corresponding to the plurality of terminals. The relay substrate electrically connects the ejection member and the flexible substrate. The relay substrate has a plurality of first pads, a plurality of second pads, and a plurality of wirings. The plurality of first pads are bonded to the plurality of terminals of the ejection member. The plurality of second pads are bonded to the plurality of signal lines of the flexible substrate. The plurality of wirings connect the plurality of first pads and the plurality of second pads. The area of ​​each of the plurality of second pads is larger than the area of ​​each of the plurality of first pads. Effect of the Invention

[0008] According to one aspect of the embodiment, it is possible to improve the reliability of the connection between the ejection member and the flexible substrate. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a front view that shows a schematic front view of a printer according to an embodiment. [Diagram 2] FIG. 2 is a plan view that illustrates a schematic plan view of the printer according to the embodiment. [Diagram 3] FIG. 3 is a side view illustrating the internal configuration of the liquid ejection head according to the embodiment. [Figure 4] FIG. 4 is a schematic diagram showing a side cross section of the discharge member and the supporting substrate according to the embodiment. [Diagram 5] FIG. 5 is a side view illustrating the configurations of the ejection member, relay board, and flexible board according to the embodiment. [Figure 6] FIG. 6 is a plan view illustrating an example of the configuration of a connection portion between the relay substrate and the flexible substrate according to the embodiment. [Figure 7] FIG. 7 is a plan view showing another example of the configuration of the connection portion between the relay substrate and the flexible substrate according to the embodiment. [Figure 8] FIG. 8 is a schematic side view showing the configurations of the ejection member, relay board, and flexible board according to Modification 1. As shown in FIG. [Figure 9] FIG. 9 is a schematic side view showing the configurations of the ejection member, relay board, and flexible board according to Modification 2. As shown in FIG. [Figure 10] FIG. 10 is a schematic side view showing the configurations of the ejection member, relay board, and flexible board according to Modification 3. As shown in FIG. [Figure 11] FIG. 11 is a schematic side view showing the configurations of the ejection member, relay board, and flexible board according to Modification 4. As shown in FIG. [Figure 12] FIG. 12 is a schematic side view showing the internal configuration of a liquid ejection head according to the fifth modification. [Figure 13] FIG. 13 is a schematic side view showing the internal configuration of a liquid ejection head according to the sixth modification. [Figure 14] FIG. 14 is a schematic side view showing the internal configuration of a liquid ejection head according to the seventh modification. [Figure 15] FIG. 15 is a schematic plan view showing an example of the arrangement position of the relay board. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of a liquid ejection head and a recording apparatus disclosed in the present application will be described with reference to the attached drawings. Note that the present disclosure is not limited to the embodiments shown below. It should be noted that the drawings are schematic, and the dimensional relationships and ratios of each element may differ from reality. Furthermore, there may be parts in which the dimensional relationships and ratios of each element differ between the drawings.

[0011] In addition, in the embodiments described below, expressions such as "constant", "orthogonal", "vertical" and "parallel" may be used, but these expressions do not necessarily mean "constant", "orthogonal", "vertical" and "parallel" strictly. In other words, each of the above expressions allows for deviations due to, for example, manufacturing accuracy and installation accuracy.

[0012] In addition, the embodiments can be appropriately combined as long as the processing contents are not contradictory. In the following embodiments, the same components are denoted by the same reference numerals, and duplicated descriptions are omitted.

[0013] <Printer configuration> First, an overview of a printer 1, which is an example of a recording apparatus according to an embodiment, will be described with reference to Figures 1 and 2. Figure 1 is a front view that shows a schematic front surface of the printer 1 according to an embodiment. Figure 2 is a plan view that shows a schematic plane surface of the printer 1 according to an embodiment. The printer 1 according to an embodiment is, for example, a color inkjet printer.

[0014] 1, the printer 1 includes a feed roller 2, a guide roller 3, a coater 4, a head case 5, a plurality of transport rollers 6, a plurality of frames 7, a plurality of liquid ejection heads 8, a transport roller 9, a dryer 10, a transport roller 11, a sensor unit 12, and a recovery roller 13. The transport roller 6 is an example of a transport unit.

[0015] Furthermore, the printer 1 has a control unit 14 that controls each part of the printer 1. The control unit 14 controls the operations of the paper feed roller 2, the guide roller 3, the coater 4, the head case 5, the plurality of transport rollers 6, the plurality of frames 7, the plurality of liquid ejection heads 8, the transport roller 9, the dryer 10, the transport roller 11, the sensor unit 12, and the recovery roller 13.

[0016] The printer 1 records images and characters on the printing paper P by causing droplets to land on the printing paper P. The printing paper P is an example of a recording medium. Before use, the printing paper P is wound around a paper feed roller 2. The printer 1 transports the printing paper P from the paper feed roller 2 through a guide roller 3 and a coater 4 into the inside of a head case 5.

[0017] The coater 4 applies the coating agent evenly to the printing paper P. This allows the printing paper P to be surface-treated, thereby improving the printing quality of the printer 1.

[0018] The head case 5 houses a plurality of transport rollers 6, a plurality of frames 7, and a plurality of liquid ejection heads 8. Inside the head case 5, a space is formed that is isolated from the outside, except for a portion that is connected to the outside, such as a portion where the printing paper P enters and exits.

[0019] At least one of control factors such as temperature, humidity, and air pressure of the internal space of the head case 5 is controlled by the control unit 14 as necessary. The transport rollers 6 transport the printing paper P inside the head case 5 to the vicinity of the liquid ejection head 8.

[0020] The frame 7 is a rectangular flat plate, and is positioned adjacent to and above the print paper P transported by the transport rollers 6. As shown in Fig. 2, the frame 7 is positioned so that its longitudinal direction is perpendicular to the transport direction of the print paper P. Inside the head case 5, multiple (for example, four) frames 7 are positioned at predetermined intervals along the transport direction of the print paper P.

[0021] A liquid, such as ink, is supplied from a liquid tank (not shown) to the liquid ejection head 8. The liquid ejection head 8 ejects the liquid supplied from the liquid tank.

[0022] The control unit 14 controls the liquid ejection head 8 based on data such as images and characters to eject liquid toward the printing paper P. The distance between the liquid ejection head 8 and the printing paper P is, for example, about 0.5 to 20 mm.

[0023] The liquid ejection head 8 is fixed to the frame 7. The liquid ejection head 8 is positioned so that its longitudinal direction is perpendicular to the direction in which the printing paper P is transported.

[0024] That is, the printer 1 according to the embodiment is a so-called line printer in which the liquid ejection head 8 is fixed inside the printer 1. Note that the printer 1 according to the embodiment is not limited to a line printer, and may be a so-called serial printer.

[0025] A serial printer is a printer that alternates between recording by moving the liquid ejection head 8 back and forth in a direction intersecting the transport direction of the printing paper P, for example, in a direction approximately perpendicular to the direction of transport, and transporting the printing paper P.

[0026] As shown in Fig. 2, multiple (for example, five) liquid ejection heads 8 are fixed to one frame 7. Fig. 2 shows an example in which three liquid ejection heads 8 are positioned at the front and two at the rear in the transport direction of the print paper P, and the liquid ejection heads 8 are positioned in the transport direction of the print paper P such that the centers of the liquid ejection heads 8 do not overlap.

[0027] A head group 8A is made up of a plurality of liquid ejection heads 8 positioned on one frame 7. The four head groups 8A are positioned along the transport direction of the print paper P. Four colors of ink are supplied to the liquid ejection heads 8 belonging to the same head group 8A. This allows the printer 1 to perform printing with four colors of ink using the four head groups 8A.

[0028] The colors of ink ejected from each liquid ejection head 8 are, for example, magenta (M), yellow (Y), cyan (C) and black (K). The control unit 14 controls each liquid ejection head 8 to eject ink of multiple colors onto the printing paper P, thereby printing a color image on the printing paper P.

[0029] In order to treat the surface of the printing paper P, a coating agent may be ejected onto the printing paper P from the liquid ejection head 8.

[0030] Furthermore, the number of liquid ejection heads 8 included in one head group 8A and the number of head groups 8A mounted on the printer 1 can be changed as appropriate depending on the printing target and printing conditions. For example, if printing is to be performed within an area printable by one liquid ejection head 8, the number of liquid ejection heads 8 mounted on the printer 1 may be one.

[0031] The print paper P that has been printed inside the head case 5 is transported to the outside of the head case 5 by transport rollers 9 and passes through the inside of the dryer 10. The dryer 10 dries the print paper P that has been printed. The print paper P that has been dried in the dryer 10 is transported by transport rollers 11 and collected by collection rollers 13.

[0032] In the printer 1, by drying the printing paper P with the dryer 10, it is possible to prevent the printing paper P that is wound up in an overlapping state from sticking to each other on the recovery roller 13 and to prevent the wet liquid from rubbing against each other.

[0033] The sensor unit 12 is composed of a position sensor, a speed sensor, a temperature sensor, etc. The control unit 14 can determine the state of each part of the printer 1 based on information from the sensor unit 12 and control each part of the printer 1.

[0034] In the printer 1 described so far, printing paper P is used as the printing object (i.e., recording medium), but the printing object in the printer 1 is not limited to printing paper P, and the printing object may also be a roll of cloth, etc.

[0035] Furthermore, the printer 1 may convey the print paper P on a conveyor belt instead of directly conveying the print paper P. By using a conveyor belt, the printer 1 can print on sheets of paper, cut pieces of cloth, wood, tiles, and the like.

[0036] The printer 1 may also print wiring patterns for electronic devices by ejecting liquid containing conductive particles from the liquid ejection head 8. The printer 1 may also prepare chemicals by ejecting a predetermined amount of liquid chemicals or liquid containing chemicals from the liquid ejection head 8 toward a reaction vessel or the like.

[0037] The printer 1 may also include a cleaning unit that cleans the liquid ejection head 8. The cleaning unit cleans the liquid ejection head 8 by, for example, wiping or capping.

[0038] The wiping process is a process of removing liquid adhering to the liquid ejection head 8 by wiping the surface of the portion from which the liquid is ejected with a flexible wiper, for example.

[0039] The capping process is performed, for example, as follows: First, a cap is placed so as to cover the portion from which the liquid is discharged, for example, the second surface 20b (see FIG. 3) of the discharge member 20 (this is called capping). As a result, a substantially sealed space is formed between the second surface 20b and the cap.

[0040] Next, the liquid is repeatedly discharged into such a sealed space, whereby liquid with a higher viscosity than the standard state and foreign matter that have been clogged in the discharge hole (nozzle) 163 (see FIG. 4) can be removed.

[0041] <Configuration of Liquid Ejection Head> Next, the configuration of the liquid ejection head 8 according to the embodiment will be described with reference to Fig. 3. Fig. 3 is a schematic side view showing the internal configuration of the liquid ejection head 8 according to the embodiment. Fig. 3 shows a side surface perpendicular to the longitudinal direction of the liquid ejection head 8.

[0042] The liquid ejection head 8 includes an ejection member 20, a support substrate 30, an intermediate substrate 40, a flexible substrate 50, a driving IC 60, and a liquid supply member (not shown). The ejection member 20, the support substrate 30, the intermediate substrate 40, the flexible substrate 50, the driving IC 60, and the liquid supply member are housed in a housing (not shown).

[0043] In the following description, for convenience, the direction in which the ejection member 20 is provided in the liquid ejection head 8 may be referred to as "downward," and the direction in which the support substrate 30 is provided relative to the ejection member 20 may be referred to as "upward."

[0044] The discharge member 20 has a generally flat plate shape and has a first surface 20a and a second surface 20b located on the opposite side of the first surface 20a. The first surface 20a has an opening (not shown), and liquid is supplied from the support substrate 30 to the inside of the discharge member 20 through the opening.

[0045] The second surface 20b has a plurality of discharge holes 22 (see FIG. 4) that discharge liquid onto the print paper P. The discharge member 20 has therein a flow path that causes liquid to flow from the first surface 20a to the second surface 20b.

[0046] The discharge member 20 has a plurality of displacement elements 23 (see FIG. 4). The plurality of displacement elements 23 are located on the first surface 20a of the discharge member 20.

[0047] The support substrate 30 is located on the first surface 20a of the discharge member 20. The support substrate 30 has a flow path therein, and supplies the liquid supplied from the liquid supply member to the discharge member 20. In addition, the support substrate 30 has a predetermined thickness that is thicker than the discharge member 20, and has the function of reinforcing the discharge member 20.

[0048] A liquid supply member is positioned on the support substrate 30. The liquid supply member is provided with openings (not shown) at both ends in the main scanning direction, which is perpendicular to the sub-scanning direction, which is the transport direction of the printing paper P, and which is parallel to the printing paper P. The liquid supply member has a flow path inside, and liquid is supplied from the outside through the openings. The liquid supply member supplies liquid to the support substrate 30. The liquid supply member also stores the liquid to be supplied to the support substrate 30.

[0049] The relay substrates 40 are located at two positions on the first surface 20a of the discharge member 20, sandwiching the support substrate 30 therebetween. One end of the relay substrate 40 is electrically connected to the discharge member 20, and the other end of the relay substrate 40 is electrically connected to the flexible substrate 50. The relay substrate 40 has a function of relaying a signal transmitted by the flexible substrate 50 to the discharge member 20. The height of the relay substrate 40 from the first surface 20a of the discharge member 20 is lower than that of the support substrate 30. This reduces the possibility of interference between the relay substrate 40 and the liquid supply member when placing the liquid supply member on the support substrate 30, thereby improving the degree of freedom in the layout of the liquid supply member.

[0050] The flexible substrate 50 is a wiring substrate having flexibility, and transmits a signal sent from the outside to the relay substrate 40. One end of the flexible substrate 50 is electrically connected to the relay substrate 40, and the other end of the flexible substrate 50 is pulled out above the support substrate 30 and is electrically connected to a wiring substrate (not shown).

[0051] The driving IC 60 is mounted on the flexible substrate 50. The driving IC 60 drives each of the displacement elements 23 in the discharge member 20 based on a driving signal sent from the control unit 14 (see FIG. 1). In this way, the driving IC 60 can control the driving of the liquid discharge head 8.

[0052] FIG. 3 shows an example of the configuration of the liquid ejection head 8, and the liquid ejection head 8 may further include members other than those shown in FIG.

[0053] <Configuration of the Discharge Member and Support Substrate> Next, the configuration of the discharge member 20 and the support substrate 30 according to the embodiment will be described with reference to Fig. 4. Fig. 4 is a side cross-sectional view of the discharge member 20 and the support substrate 30 according to the embodiment. FIG.

[0054] As shown in FIG. 4, the discharge member 20 has a plurality of pressure chambers 21, a plurality of discharge holes 22, a plurality of displacement elements 23, and a plurality of terminals 24.

[0055] The multiple pressure chambers 21 are connected to the multiple flow paths 31 in the support substrate 30. The multiple discharge holes 22 are connected to the multiple pressure chambers 21. The multiple displacement elements 23 are located on the first surface 20a of the discharge member 20 at multiple positions corresponding to the multiple pressure chambers 21, respectively.

[0056] The multiple terminals 24 are located on the first surface 20a of the discharge member 20 at positions sandwiching the support substrate 30. The multiple terminals 24 are electrically connected to the multiple displacement elements 23 via electrodes and wiring (not shown). The multiple signal lines in the flexible substrate 50 are electrically connected to the multiple terminals 24, respectively. When a signal transmitted by the flexible substrate 50 is input from the terminal 24 to the displacement element 23, the displacement element 23 is displaced.

[0057] The support substrate 30 is located on the first surface 20a of the discharge member 20. The support substrate 30 has a plurality of spaces on the lower surface for respectively accommodating a plurality of displacement elements 23. The support substrate 30 has a plurality of flow paths 31 therein. The plurality of flow paths 31 are connected to the plurality of pressure chambers 21, respectively. The plurality of flow paths 31 open to the upper surface of the support substrate 30. In addition, a liquid supply member (not shown) is located on the upper surface of the support substrate 30. The plurality of flow paths 31 are connected to the liquid supply member.

[0058] Then, when liquid is supplied from the liquid supply member through the flow path 31 to the inside of the discharge member 20, the corresponding displacement element 23 is displaced, whereby the pressure chamber 21 is pressed and the liquid is discharged from the discharge hole 22. In other words, the multiple displacement elements 23 function as multiple elements that discharge the liquid from the multiple discharge holes 22.

[0059] 4, the discharge member 20 has a laminated structure in which a nozzle plate 20A and an actuator plate 20B are laminated. The nozzle plate 20A is provided with a plurality of discharge holes 22. The actuator plate 20B is provided with a plurality of pressure chambers 21, a plurality of displacement elements 23, and a plurality of terminals 24. The nozzle plate 20A and the actuator plate 20B are aligned and laminated, whereby the plurality of pressure chambers 21 and the plurality of discharge holes 22 communicate with each other, thereby forming the discharge member 20.

[0060] <Connection of the Discharge Member, Intermediate Board, and Flexible Board> Next, the connection state of the discharge member 20, relay board 40, and flexible board 50 will be described with reference to Fig. 5 and Fig. 6. Fig. 5 is a side view showing the configuration of the discharge member 20, relay board 40, and flexible board 50 according to the embodiment. Fig. 6 is a plan view showing an example of the configuration of the connection portion between the relay board 40 and flexible board 50 according to the embodiment. Fig. 6 shows the lower surface of the relay board 40 (i.e., the surface facing the discharge member 20).

[0061] As shown in FIG. 5, a plurality of terminals 24 (see FIG. 4) are located on the first surface 20a of the discharge member 20, and a plurality of signal lines 51 (see FIG. 6) corresponding to the plurality of terminals 24 are located on the surface of the flexible substrate 50. One end of the relay substrate 40 is connected to the plurality of terminals 24 of the discharge member 20, and the other end of the relay substrate 40 is connected to the plurality of signal lines 51 of the flexible substrate 50. That is, a plurality of first pads 41 (see FIG. 6) are formed on one end of the relay substrate 40, and these plurality of first pads 41 and the plurality of terminals 24 of the discharge member 20 are bonded by a conductive bonding material 401. In addition, a plurality of second pads 42 (see FIG. 6) are formed on the other end of the relay substrate 40, and these plurality of second pads 42 and the plurality of signal lines 51 of the flexible substrate 50 are bonded by a conductive bonding material 402. The plurality of first pads 41 and the plurality of second pads 42 are connected to each other by a plurality of wirings 43. As the conductive bonding materials 401 and 402, for example, anisotropic conductive films (ACFs) can be used.

[0062] As shown in FIG. 6, in the relay substrate 40, the area of ​​each of the multiple second pads 42 is larger than the area of ​​each of the multiple first pads 41. In this way, by increasing the area of ​​each of the multiple second pads 42 to be joined to the multiple signal lines 51 of the flexible substrate 50, it is possible to suppress poor connection between the flexible substrate 50 and the relay substrate 40. That is, when the flexible substrate 50 is connected to the relay substrate 40, a mechanical load is applied to the signal line 51 from the second pad 42 due to bending of the flexible substrate 50, but by increasing the area of ​​the second pad 42, it is possible to reduce the mechanical load on the signal line 51. In addition, when the flexible substrate 50 is connected to the relay substrate 40, the conductive bonding material 402 is melted by heating, so that thermal expansion of the flexible substrate 50 occurs, and the signal line 51 is likely to be displaced from the second pad 42. Even in such a case, by increasing the area of ​​the second pad 42, it is possible to ensure electrical connection between the second pad 42 and the signal line 51 even if the signal line 51 is displaced. Since connection failure between the flexible substrate 50 and the relay substrate 40 can be suppressed, the relay substrate 40 can stably connect the flexible substrate 50 and the discharge member 20. As a result, the liquid discharge head 8 according to the embodiment can improve the connection reliability between the discharge member 20 and the flexible substrate 50. The areas of the first pads 41 and the second pads 42 are the areas in a plan view of the relay substrate 40.

[0063] Moreover, the second pads 42 are positioned in a plurality of (here, two) regions 421 aligned along a direction from one end toward the other end of the relay substrate 40 on the discharge member 20 side (hereinafter referred to as the "first direction") so as not to be adjacent to one another in a second direction intersecting the first direction. This allows the size of the second pads 42 along the second direction to be increased to an extent that the second pads 42 do not interfere with each other, thereby making it possible to increase the area of ​​the second pads 42.

[0064] 5 and 6, the first pads 41, the second pads 42, and the wirings 43 are located on the lower surface of the relay substrate 40, which faces the discharge member 20. By thus locating the first pads 41, the second pads 42, and the wirings 43 on the same surface, that is, the lower surface of the relay substrate 40, the length of the wirings 43 can be minimized and the electrical resistance in the relay substrate 40 can be reduced.

[0065] In FIG. 6, the area of ​​the second pads 42 is increased by positioning the second pads 42 so as not to be adjacent to each other. However, the structure for increasing the area of ​​the second pads 42 on the relay substrate 40 is not limited to this. For example, as shown in FIG. 7, the area of ​​the second pads 42 may be increased by changing the pitch of the wirings 43 on the relay substrate 40. FIG. 7 is a plan view schematic diagram showing another example of the configuration of the connection portion between the relay substrate 40 and the flexible substrate 50 according to the embodiment. The wirings 43 shown in FIG. 7 are pitch-changed on the relay substrate 40, and the pitch (spacing) between the wirings 43 is small on the side of the first pads 41, but is large on the side of the second pads 42. This allows the size of the second pads 42 along the second direction to be increased within a range in which the second pads 42 do not interfere with each other, and therefore the area of ​​the second pads 42 can be increased.

[0066] <Method of Manufacturing Liquid Ejection Head> Next, a method for manufacturing the liquid ejection head 8 according to the embodiment will be described. First, the support substrate 30 is placed on the first surface 20a of the ejection member 20. Next, the nozzle plate 20A and the actuator plate 20B are aligned and laminated to create a laminated structure of the ejection member 20. Next, the relay substrate 40 and the ejection member 20 are electrically connected by bonding the first pads 41 of the relay substrate 40 to the terminals 24 of the ejection member 20 with a conductive bonding material 401. Next, the relay substrate 40 and the flexible substrate 50 are electrically connected by bonding the second pads 42 of the relay substrate 40 to the signal lines 51 of the flexible substrate 50 with a conductive bonding material 402. After that, a liquid supply member is placed on the support substrate 30, and the ejection member 20 and other members (and other members as necessary) are housed in a housing. This provides the liquid ejection head 8 according to the embodiment.

[0067] <Various modified examples> 8 is a side schematic diagram showing the configuration of the discharge member 20, relay substrate 40, and flexible substrate 50 according to the first modified example. The flexible substrate 50 shown in FIG. 8 does not have the driving IC 60 mounted thereon, and the driving IC 60 is located on the lower surface of the relay substrate 40 (i.e., the surface facing the discharge member 20). By thus positioning the driving IC 60 on the lower surface of the relay substrate 40, the wiring length between the driving IC 60 and the discharge member 20 can be shortened, and thus the resistance loss between the driving IC 60 and the discharge member 20 can be reduced. In addition, the possibility of disconnection between the driving IC 60 and the discharge member 20 can be reduced, and thus the connection reliability between the driving IC 60 and the discharge member 20 can be improved.

[0068] 8, a heat dissipation member may be provided on the upper surface of the relay substrate 40 opposite to the driving IC 60. This improves the heat dissipation performance of the driving IC 60. The heat dissipation member may be a heat dissipation fin, a Peltier element, or the like. The driving IC 60 may also be covered with a protective cover. This prevents the liquid discharged from the discharge member 20 from adhering to the driving IC 60.

[0069] FIG. 9 is a schematic side view showing the configuration of the discharge member 20, relay board 40, and flexible board 50 according to the second modification. In the relay board 40 shown in FIG. 9, the first pads 41 are located on the lower surface of the relay board 40 facing the discharge member 20. The second pads 42 are located on the upper surface of the relay board. The wirings 43 are routed to the upper and lower surfaces of the relay board 40 via the side surfaces of the relay board 40. In this way, the first pads 41 and the second pads 42 are located on the lower and upper surfaces of the relay board 40, so that the discharge member 20 and the flexible board 50 can be electrically connected on different surfaces of the relay board 40. As a result, even if the width from one end to the other end of the relay board 40 on the discharge member 20 side is reduced, interference between the discharge member 20 and the flexible board 50 is avoided, and the liquid discharge head 8 can be made smaller.

[0070] 9, the multiple wirings 43 may be positioned so as to penetrate through the lower surface and the upper surface of the relay substrate 40. This allows the length of the multiple wirings 43 to be shortened, and the electrical resistance in the relay substrate 40 to be reduced.

[0071] Fig. 10 is a schematic side view showing the configurations of the ejection member 20, relay substrate 40, and flexible substrate 50 according to Modification 3. Modification 3 differs from Modification 2 in the structure of the relay substrate 40. In the relay substrate 40 shown in Fig. 10, the second pads 42 are positioned so as to overlap the first pads 41 in a plan view. This makes it possible to minimize the width from one end of the relay substrate 40 on the ejection member 20 side to the other end, further facilitating miniaturization of the liquid ejection head 8.

[0072] 11 is a side schematic diagram showing the configurations of the discharge member 20, relay substrate 40, and flexible substrate 50 according to Modification 4. The flexible substrate 50 shown in FIG. 11 does not have a driving IC 60 mounted thereon, and the driving IC 60 is located on the upper surface of the relay substrate 40 (i.e., the surface opposite to the surface facing the discharge member 20). By positioning the driving IC 60 on the upper surface of the relay substrate 40 in this manner, the driving IC 60 can be protected from the liquid discharged from the discharge member 20.

[0073] FIG. 12 is a schematic side view showing the internal structure of the liquid ejection head 8 according to the fifth modified example. The liquid ejection head 8 shown in FIG. 12 differs from the liquid ejection head 8 shown in FIG. 3 in the structure of the relay substrate 40. As shown in FIG. 12, the relay substrate 40 and the support substrate 30 are located on the ejection member 20, and the height of the relay substrate 40 from the first surface 20a of the ejection member 20 is higher than that of the support substrate 30. In other words, the thickness of the relay substrate 40 is thicker than that of the support substrate 30. By increasing the thickness of the relay substrate 40 in this manner, the strength of the relay substrate 40 can be improved. In addition, when a liquid supply member is placed on the support substrate 30, the relay substrate 40 can be used as a buffer material that relieves the load applied from the liquid supply member to the support substrate 30.

[0074] FIG. 13 is a schematic side view showing the internal configuration of a liquid ejection head 8 according to Modification 6. The liquid ejection head 8 shown in FIG. 13 differs from the liquid ejection head 8 shown in FIG. 3 in that the relay substrate 40 (see FIG. 6) and the support substrate 30 are integrated together. In other words, the relay substrate 40 and the support substrate 30 may be formed from the same material. In the example of the liquid ejection head 8 according to Modification 6, the support substrate 30 having the function of the relay substrate 40 is positioned on the ejection member 20. By integrating the relay substrate 40 and the support substrate 30 in this manner, the gap between the relay substrate 40 and the support substrate 30 is eliminated, which can facilitate miniaturization of the liquid ejection head 8.

[0075] Fig. 14 is a schematic side view showing the internal configuration of a liquid ejection head 8 according to Modification 7. The liquid ejection head 8 shown in Fig. 14 differs from the liquid ejection head 8 shown in Fig. 13 in that the driving IC 60 is located on the lower surface of the support substrate 30 (i.e., the surface facing the ejection member 20). By positioning the driving IC 60 on the lower surface of the support substrate 30 in this way, the wiring length between the driving IC 60 and the ejection member 20 can be shortened, and therefore the resistance loss between the driving IC 60 and the ejection member 20 can be reduced. In addition, the possibility of disconnection between the driving IC 60 and the ejection member 20 can be reduced, and therefore the connection reliability between the driving IC 60 and the ejection member 20 can be improved.

[0076] 14, the driving IC 60 may be located on the upper surface of the support substrate 30 (i.e., the surface opposite to the surface facing the discharge member 20). By thus positioning the driving IC 60 on the upper surface of the support substrate 30, the driving IC 60 can be protected from the liquid discharged from the discharge member 20.

[0077] 14, the driving IC 60 may be formed of a low-temperature polysilicon (LTPS) film, which allows the driving IC 60 to be made smaller.

[0078] <Other Modifications> In the above embodiment, the relay substrate 40 is located at two positions sandwiching the support substrate 30 on the first surface 20a of the discharge member 20, but the position of the relay substrate 40 is not limited to this. For example, the relay substrate 40 may be located at a position surrounding the support substrate 30 on the first surface 20a of the discharge member 20 as shown in FIG. 15. That is, the shape of the relay substrate 40 may be a rectangular frame shape surrounding the support substrate 30 on the first surface 20a of the discharge member 20. This can improve the strength of the relay substrate 40. FIG. 15 is a schematic plan view showing an example of the position of the relay substrate 40. FIG. 15 shows the discharge member 20, the support substrate 30, and the relay substrate 40 viewed from the first surface 20a side.

[0079] As described above, the liquid ejection head according to the embodiment (for example, the liquid ejection head 8) includes an ejection member (for example, the ejection member 20), a flexible substrate (for example, the flexible substrate 50), and a relay substrate (for example, the relay substrate 40). The ejection member has a plurality of nozzles (for example, the ejection holes 22) that eject liquid, a plurality of elements (for example, the displacement elements 23) that eject liquid from the plurality of nozzles, and a plurality of terminals (for example, the terminals 24) electrically connected to each of the plurality of elements. The flexible substrate has a plurality of signal lines (for example, the signal lines 51) corresponding to the plurality of terminals. The relay substrate electrically connects the ejection member and the flexible substrate. The relay substrate has a plurality of first pads (for example, the first pads 41), a plurality of second pads (for example, the second pads 42), and a plurality of wirings (for example, the wirings 43). The plurality of first pads are bonded to a plurality of terminals of the ejection member. The plurality of second pads are bonded to a plurality of signal lines of the flexible substrate. The plurality of wirings connect the plurality of first pads and the plurality of second pads. The area of ​​each of the second pads is greater than the area of ​​each of the first pads, thereby improving the connection reliability between the discharge member and the flexible substrate in the liquid discharge head according to the embodiment.

[0080] Furthermore, the second pads may be positioned in a plurality of regions (e.g., region 421) aligned along a first direction from one end of the relay board toward the other end on the ejection member side, so as not to be adjacent to each other in a second direction intersecting the first direction. This allows the liquid ejection head according to the embodiment to have a larger area for the second pads.

[0081] The relay board may have a plurality of wires that are spaced apart from one another at one end connected to the second pads, compared to the other end connected to the first pads, thereby enabling the liquid ejection head according to the embodiment to have a larger area for the second pads.

[0082] The relay substrate may have a first surface (e.g., a lower surface) facing the ejection member and a second surface (e.g., an upper surface) located on the opposite side of the first surface. The first pads, the second pads, and the wiring may be located on the first surface. As a result, according to the liquid ejection head of the embodiment, the length of the wiring can be minimized, and the electrical resistance in the relay substrate can be reduced.

[0083] The liquid ejection head may further include a driving IC (for example, driving IC 60) that controls the driving of the ejection member. The driving IC may be located on the first surface. As a result, according to the liquid ejection head of the embodiment, it is possible to reduce the resistance loss between the driving IC and the ejection member. It is also possible to improve the connection reliability between the driving IC and the ejection member.

[0084] The relay substrate may have a first surface facing the ejection member, a second surface located on the opposite side of the first surface, and a side surface connecting the first surface and the second surface. The first pads may be located on the first surface. The second pads may be located on the second surface. The wiring may be routed to the first surface and the second surface via the side surface, or may be located penetrating the first surface and the second surface. As a result, according to the liquid ejection head of the embodiment, even if the width from one end to the other end of the relay substrate on the ejection member side is reduced, interference between the ejection member and the flexible substrate is avoided, which can promote miniaturization of the liquid ejection head.

[0085] The second pads may be positioned so as to overlap the first pads in a plan view, which minimizes the width from one end of the relay board to the other end on the discharge member side of the relay board, thereby facilitating miniaturization of the liquid discharge head.

[0086] The liquid ejection head may further include a driving IC (for example, driving IC 60) that controls the driving of the ejection member. The driving IC may be located on the second surface. As a result, according to the liquid ejection head of the embodiment, the driving IC can be protected from the liquid ejected from the ejection member.

[0087] The liquid ejection head may further include a support substrate (e.g., support substrate 30) located above the ejection member and having a flow path (e.g., flow path 31) through which liquid supplied to the ejection member flows. As a result, according to the liquid ejection head of the embodiment, the ejection member can be supplied with liquid while the ejection member is reinforced by the support substrate.

[0088] The relay substrate may be located above the ejection member. The relay substrate may be located lower than the support substrate from the ejection member. As a result, in the liquid ejection head according to the embodiment, the possibility of interference between the relay substrate and the liquid supply member when placing the liquid supply member on the support substrate can be reduced, thereby improving the degree of freedom in the layout of the liquid supply member.

[0089] The relay substrate may be located above the ejection member. The relay substrate may be higher than the support substrate from the ejection member. This allows the liquid ejection head according to the embodiment to have an improved strength of the relay substrate. Furthermore, when the liquid supply member is placed on the support substrate, the relay substrate can be used as a buffer material that reduces the load applied from the liquid supply member to the support substrate.

[0090] The intermediate substrate and the support substrate may be integrated together, which eliminates the gap between the intermediate substrate and the support substrate in the liquid ejection head according to the embodiment, thereby facilitating miniaturization of the liquid ejection head.

[0091] The support substrate may have a first surface (e.g., a lower surface) facing the discharge member, and a second surface (e.g., an upper surface) located on the opposite side to the first surface. The liquid discharge head may further include a driving IC that controls driving of the discharge member. The driving IC may be located on the first surface or the second surface. As a result, according to the liquid discharge head of the embodiment, it is possible to reduce resistance loss between the driving IC and the discharge member. It is also possible to improve the connection reliability between the driving IC and the discharge member. It is also possible to protect the driving IC from liquid discharged from the discharge member.

[0092] The driving IC may be formed of a low-temperature polysilicon film, which makes it possible to reduce the size of the driving IC in the liquid ejection head according to the embodiment.

[0093] Further advantages and modifications may readily occur to those skilled in the art. Thus, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and equivalents thereof. [Explanation of symbols]

[0094] 1. Printer 8 Liquid ejection head 14 Control section 20 Discharge member 21 Pressurized chamber 22 Discharge hole 23 Displacement element 24 terminals 30 Support Board 31 Flow Path 40 Relay board 41 1st Pad 42 2nd Pad 43 Wiring 50 Flexible PCB 51 Signal Line 60 Driver IC 421 area

Claims

1. an ejection member having a plurality of nozzles for ejecting liquid, a plurality of elements for ejecting liquid from the plurality of nozzles, and a plurality of terminals electrically connected to the plurality of elements, a flexible substrate having a plurality of signal lines corresponding to the plurality of terminals; an intermediate substrate that electrically connects the discharge member and the flexible substrate; Equipped with The relay substrate is A plurality of first pads joined to the plurality of terminals of the discharge member; a plurality of second pads joined to the plurality of signal lines of the flexible substrate; a plurality of wirings connecting the plurality of first pads and the plurality of second pads; having an area of ​​each of the second pads is greater than an area of ​​each of the first pads; A liquid ejection head, wherein the second pads are positioned in a plurality of regions aligned along a first direction from one end of the relay substrate on the ejection member side to the other end thereof, so as not to be adjacent to each other in a second direction intersecting the first direction.

2. An ejection member having a plurality of nozzles for ejecting a liquid, a plurality of elements for ejecting the liquid from the plurality of nozzles, and a plurality of terminals electrically connected to each of the plurality of elements; a flexible substrate having a plurality of signal lines corresponding to the plurality of terminals; an intermediate substrate that electrically connects the discharge member and the flexible substrate; Equipped with The relay substrate is A plurality of first pads joined to the plurality of terminals of the discharge member; a plurality of second pads joined to the plurality of signal lines of the flexible substrate; a plurality of wirings connecting the plurality of first pads and the plurality of second pads; having an area of ​​each of the second pads is greater than an area of ​​each of the first pads; The relay substrate is A liquid ejection head comprising a plurality of wirings, the wirings having a larger spacing between the wirings at one end connected to the plurality of second pads than at the other end connected to the plurality of first pads.

3. An ejection member having a plurality of nozzles for ejecting a liquid, a plurality of elements for ejecting the liquid from the plurality of nozzles, and a plurality of terminals electrically connected to each of the plurality of elements; a flexible substrate having a plurality of signal lines corresponding to the plurality of terminals; an intermediate substrate that electrically connects the discharge member and the flexible substrate; Equipped with The relay substrate is A plurality of first pads joined to the plurality of terminals of the discharge member; a plurality of second pads joined to the plurality of signal lines of the flexible substrate; a plurality of wirings connecting the plurality of first pads and the plurality of second pads; having an area of ​​each of the second pads is greater than an area of ​​each of the first pads; the relay substrate has a first surface facing the ejection member and a second surface located opposite to the first surface; The liquid ejection head, wherein the first pads, the second pads, and the wirings are located on the first surface.

4. The liquid ejection head according to claim 3, wherein the second pads are positioned in a plurality of regions aligned along a first direction from one end of the intermediate substrate to the other end of the intermediate substrate on the ejection member side, so as not to be adjacent to each other in a second direction intersecting the first direction.

5. A driving IC for controlling the driving of the ejection member is further provided. The liquid ejection head according to claim 3 , wherein the driving IC is located on the first surface.

6. the relay substrate has a first surface facing the ejection member, a second surface located opposite to the first surface, and a side surface connecting the first surface and the second surface; the first pads are located on the first surface; the second pads are located on the second surface; The liquid ejection head according to claim 3 , wherein the plurality of wirings are positioned by being routed to the first surface and the second surface via the side surfaces, or are positioned by penetrating the first surface and the second surface.

7. The liquid ejection head according to claim 6 , wherein the second pads are positioned so as to overlap the first pads in a plan view.

8. An ejection member having a plurality of nozzles for ejecting a liquid, a plurality of elements for ejecting the liquid from the plurality of nozzles, and a plurality of terminals electrically connected to each of the plurality of elements; a flexible substrate having a plurality of signal lines corresponding to the plurality of terminals; an intermediate substrate that electrically connects the discharge member and the flexible substrate; Equipped with The relay substrate is A plurality of first pads joined to the plurality of terminals of the discharge member; a plurality of second pads joined to the plurality of signal lines of the flexible substrate; a plurality of wirings connecting the plurality of first pads and the plurality of second pads; having an area of ​​each of the second pads is greater than an area of ​​each of the first pads; the relay substrate has a first surface facing the ejection member, a second surface located opposite to the first surface, and a side surface connecting the first surface and the second surface; the first pads are located on the first surface; the second pads are located on the second surface; the plurality of wirings are positioned by being routed to the first surface and the second surface via the side surfaces, or are positioned by penetrating the first surface and the second surface; A driving IC for controlling the driving of the ejection member is further provided. The driving IC is located on the second surface of the liquid ejection head.

9. The liquid ejection head according to claim 3 , further comprising a support substrate located above the ejection member and having a flow path therein through which the liquid supplied to the ejection member flows.

10. the relay board is located on the ejection member, The liquid ejection head according to claim 9 , wherein the intermediate substrate is lower in height from the ejection member than the support substrate.

11. An ejection member having a plurality of nozzles for ejecting a liquid, a plurality of elements for ejecting the liquid from the plurality of nozzles, and a plurality of terminals electrically connected to each of the plurality of elements; a flexible substrate having a plurality of signal lines corresponding to the plurality of terminals; an intermediate substrate that electrically connects the discharge member and the flexible substrate; Equipped with The relay substrate is A plurality of first pads joined to the plurality of terminals of the discharge member; a plurality of second pads joined to the plurality of signal lines of the flexible substrate; a plurality of wirings connecting the plurality of first pads and the plurality of second pads; having an area of ​​each of the second pads is greater than an area of ​​each of the first pads; a support substrate located on the discharge member and having a flow path therein through which the liquid supplied to the discharge member flows; the relay board is located on the ejection member, The liquid ejection head, wherein the intermediate substrate is higher in height from the ejection member than the support substrate.

12. An ejection member having a plurality of nozzles for ejecting a liquid, a plurality of elements for ejecting the liquid from the plurality of nozzles, and a plurality of terminals electrically connected to each of the plurality of elements; a flexible substrate having a plurality of signal lines corresponding to the plurality of terminals; an intermediate substrate that electrically connects the discharge member and the flexible substrate; Equipped with The relay substrate is A plurality of first pads joined to the plurality of terminals of the discharge member; a plurality of second pads joined to the plurality of signal lines of the flexible substrate; a plurality of wirings connecting the plurality of first pads and the plurality of second pads; having an area of ​​each of the second pads is greater than an area of ​​each of the first pads; a support substrate located on the discharge member and having a flow path therein through which the liquid supplied to the discharge member flows; The relay substrate and the support substrate are integrated into one body.

13. the support substrate has a first surface facing the ejection member and a second surface located opposite the first surface; A driving IC for controlling the driving of the ejection member is further provided. The liquid ejection head according to claim 12 , wherein the driving IC is located on the first surface or the second surface.

14. The liquid ejection head according to claim 13 , wherein the driving IC is formed of a low-temperature polysilicon (LTPS) film.

15. A recording apparatus comprising the liquid ejection head according to any one of claims 1 to 14.

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