Cantilever structure with intermediate substrate connection - Patents.com

Abstract

To provide: a cantilever structure whose anchor portion has at least one protrusion to make some properties have little change with respect to variations in a fabricating process; and a related device.SOLUTION: A cantilever structure includes an anchor portion and a film structure. The film structure covers a cavity and vibrates within the cavity. A length of the film structure is less than a width of the film structure. The anchor portion includes at least one protrusion protruding toward the cavity, and the film structure is anchored to the anchor portion by the at least one protrusion.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present application relates to cantilever structures and devices, and more particularly to cantilever structures and related devices having characteristics that are less susceptible to manufacturing variations due to the manufacturing process. [Background technology]

[0002] The cantilever structure can be widely used in various electronic components, such as acoustic components, air pulse generating components, sensors, oscillators, or other suitable components. In some cases, the cantilever structure can be miniaturized as a MEMS (Micro Electro Mechanical System) structure, so that the size of the electronic components including the cantilever structure is greatly reduced, and thus the cantilever structure can be widely used in various electronic devices.

[0003] However, some properties of the cantilever structure (e.g., resonance frequency, stiffness, and initial deflection) change due to manufacturing variations caused by the manufacturing process. If the variations of these properties are large, the performance of the cantilever structure will be degraded because these properties are far from their design values. Therefore, it is necessary to improve the structure of the cantilever structure to reduce the variations of its properties caused by manufacturing variations. Summary of the Invention

[0004] Therefore, a primary object of the present invention is to provide a cantilever structure in which an anchor portion of the cantilever structure has at least one protrusion, so that some characteristics (e.g., resonance frequency, stiffness, and initial deflection) are less susceptible to variations in the manufacturing process. The present invention also provides a related device.

[0005] One embodiment of the present invention provides a cantilever structure including an anchor portion and a film structure. The film structure covers a cavity and vibrates within the cavity. The length of the film structure is smaller than the width of the film structure. The anchor portion includes at least one protrusion that protrudes toward the cavity, and the film structure is fixed on the anchor portion by the at least one protrusion.

[0006] Another embodiment of the present invention provides a device including a first cantilever structure and a second cantilever structure. The first cantilever structure includes a first film structure fixed on an anchor portion. The second cantilever structure includes a second film structure fixed on the anchor portion. A cavity is formed in the device. The first film structure and the second film structure cover the cavity and vibrate within the cavity. The length of the first film structure is smaller than the width of the first film structure, and the length of the second film structure is smaller than the width of the second film structure. The anchor portion includes a plurality of protrusions protruding toward the cavity, and the first film structure and the second film structure are fixed on the anchor portion by the plurality of protrusions. The first film structure is adjacent to and facing the second film structure.

[0007] These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings. [Brief description of the drawings]

[0008] [Figure 1] 1 is a schematic diagram showing a cantilever structure according to a first embodiment of the present invention. [Diagram 2] 1 is a schematic diagram showing a cantilever structure according to a first embodiment of the present invention. [Diagram 3] 2 is a schematic cross-sectional view showing the structure when viewed along the cross-sectional line AA′ in FIG. 1. [Figure 4] 2 is a schematic cross-sectional view showing the structure when viewed along the cross-sectional line BB' in FIG. 1. [Diagram 5] FIG. 4 is a schematic diagram showing a cantilever structure according to a second embodiment of the present invention. [Figure 6] 1 is a schematic diagram illustrating an apparatus according to one embodiment of the present invention. [Figure 7] FIG. 7 is a schematic diagram of a top view of the apparatus shown in FIG. 6. [Figure 8] FIG. 7 is a schematic diagram of a bottom view of the apparatus shown in FIG. 6. [Figure 9] FIG. 7 is a schematic diagram showing the apparatus shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In order to provide those skilled in the art with a better understanding of the present invention, the preferred embodiment and typical material or range parameters for important components are detailed in the following description. These preferred embodiments of the present invention are shown in the accompanying drawings with numbered elements to detail the contents and effects to be achieved. Please note that the drawings are simplified schematic diagrams, and the materials and parameter ranges of important components are illustrative based on current technology, and therefore only show the components and combinations associated with the present invention to provide a clearer description of the basic structure, implementation or operation method of the present invention. The components are actually more complex, and the range of parameters or materials used may develop as technology progresses in the future. In addition, for ease of explanation, the components shown in the drawings may not represent their actual number, shape, and dimensions, and details may be adjusted according to design requirements.

[0010] In the following description and claims, the terms "include," "comprise," and "have" are used in an open-ended manner and should therefore be interpreted to mean "include, but not limited to...." Thus, when the terms "include," "comprise," and / or "have" are used in describing the invention, they point to the presence of the corresponding features, areas, steps, operations and / or components, but are not limited to the presence of one or more corresponding features, areas, steps, operations and / or components.

[0011] In the following description and claims, when "the A1 component is formed by / from B1", B1 is present in the formation of the A1 component or B1 is used in the formation of the A1 component, and does not exclude the presence and use of one or more other features, areas, steps, operations and / or components in the formation of the A1 component.

[0012] In the following description and claims, the term "substantially" generally means that there may or may not be a small deviation. For example, the terms "substantially parallel" and "substantially along" mean that the angle between two components may be less than a certain angle threshold, for example, 10 degrees, 5 degrees, 3 degrees, or 1 degree. For example, the term "substantially aligned" means that the deviation between two components may be less than a certain difference threshold, for example, 2 μm or 1 μm. For example, the term "substantially the same" means that the deviation is, for example, within 10% of a given value or range, or within 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0013] In this description and in the following claims, the term "horizontal direction" generally means a direction parallel to a horizontal plane, the term "horizontal plane" generally means a plane parallel to directions X and Y in the drawing (i.e., directions X and Y in the present invention can be considered as horizontal directions), and the terms "vertical direction" and "top-view direction" generally mean a direction parallel to direction Z in the drawing and perpendicular to the horizontal direction, directions X, Y, and Z being perpendicular to each other. In this description and in the following claims, the term "top view" generally means a display result viewed along a vertical direction. In this description and in the following claims, the term "bottom view" generally means a display result viewed along another vertical direction opposite to the vertical direction associated with the top view. In this description and in the following claims, the term "cross-sectional view" generally means a display result viewed along a horizontal direction of a structure cut along a vertical direction.

[0014] Terms such as first, second, third, etc. may be used to describe various components, but such components are not limited by those terms. These terms are used in this specification only to distinguish one component from another, and unless otherwise stated in this specification, these terms do not relate to the order of manufacture. The claims may not use the same terms, but instead may use terms such as first, second, third, etc., with respect to the order in which the elements are claimed. Thus, in the following description, a first component may be a second component in a claim.

[0015] It should be noted that the technical features in the different embodiments described below can be replaced, recombined, or mixed with each other to configure another embodiment without departing from the spirit of the present invention.

[0016] In the present invention, a cantilever structure is provided, which may be used in any suitable component.

[0017] In some embodiments, the cantilever structure may be applied to acoustic components related to acoustic waves (e.g., sound waves and / or ultrasound). In some cases, the cantilever structure of the acoustic component may be directly related to the acoustic waves. For example, the acoustic component (or cantilever structure) may generate or receive acoustic waves, or the acoustic component may be a path through which the acoustic waves pass. For example, the acoustic component (or cantilever structure) may improve the experience of a user using an acoustic device having the acoustic component.

[0018] The acoustic component (or cantilever structure) may be controlled by a signal or may generate a signal in accordance with an acoustic wave, which may be an electrical signal or any other suitable type of signal.

[0019] In some embodiments, the acoustic component may be an acoustic transducer configured to perform acoustic transduction (e.g., a cantilever structure performs acoustic transduction), which may convert a signal (e.g., an electrical signal) into an acoustic wave, or convert an acoustic wave into another suitable type of signal (e.g., an electrical signal), but is not limited to this. For example, the acoustic transducer may be, but is not limited to, a sound generating component, a speaker, a micro-speaker, or other suitable device to convert an electrical signal into an acoustic wave. For example, the acoustic transducer may be, but is not limited to, a sound measuring device, an acoustic pressure sensing device, a microphone, or other suitable device to convert an acoustic wave into an electrical signal.

[0020] In some embodiments, the acoustic component may be a vent component in the acoustic device, and the size of the vent of the vent component may be controlled by an electrical signal (e.g., the vent is provided by a cantilever structure). For example, the vent component may be configured to suppress the occlusion effect during operation of the acoustic device (e.g., an in-ear earphone, an on-ear earphone, or an over-ear earphone, etc.). The occlusion effect is caused by the sealed volume of the ear canal, which increases the sound pressure perceived by the user (i.e., the listener). In some cases, the occlusion effect occurs while the user is using the acoustic device with the ear canal filled while performing certain motion(s) that generate bone-conducted sound (e.g., walking, jogging, talking, eating, touching the acoustic transducer, etc.), and the occlusion effect causes the user to hear occlusion noise, thereby reducing the user's listening quality. Thus, the presence of the ventilation part may reduce the occlusion effect as the volume of the ear canal is not sealed when the vent of the ventilation part is open, thereby improving the performance of the acoustic device and the user's experience of using the acoustic device.

[0021] In some embodiments, the cantilever structure may be, but is not limited to, a MEMS (Micro Electro Mechanical System) structure in a MEMS component. Also, in some embodiments, the acoustic component including the cantilever structure may be, but is not limited to, a MEMS (Micro Electro Mechanical System) component. That is, the above components (e.g., acoustic transducers, ventilation components, or other suitable components related to acoustics) may be formed by semiconductor processes such that the microstructures in the above components may be MEMS structures.

[0022] In some embodiments, the cantilever structure may be packaged in a packaging structure. Thus, an acoustic component including a cantilever structure may be, but is not limited to, a packaging structure.

[0023] In the following, for example, the cantilever structure generates acoustic waves, whereby the acoustic component including the cantilever structure can be an acoustic transducer that generates acoustic waves, and the cantilever structure may be, but is not limited to, a MEMS structure within a MEMS component.

[0024] 1-4, FIG. 1 and FIG. 2 are schematic diagrams showing a cantilever structure according to a first embodiment of the present invention, FIG. 3 is a schematic diagram of a cross-sectional view showing the structure as viewed along the cross-sectional line AA′ in FIG. 1, and FIG. 4 is a schematic diagram of a cross-sectional view showing the structure as viewed along the cross-sectional line BB′ in FIG. 1. As shown in FIG. 1-4, the cantilever structure 100 may include a substrate SB, which may include any suitable material based on the requirement(s). In some embodiments, since the cantilever structure 100 is a MEMS structure in a MEMS component (e.g., a MEMS chip), the material of the substrate SB may be formed and / or etched by a semiconductor process. In this case, for example, the substrate SB may include silicon (e.g., single crystal silicon or polycrystalline silicon), silicon compounds (e.g., silicon carbide, silicon oxide), germanium, germanium compounds, gallium, gallium compounds (e.g., gallium nitride or gallium arsenide), any other suitable material, or a combination thereof. It should be noted that the normal direction of the substrate SB may be parallel to the Z direction.

[0025] As shown in FIG. 1-FIG. 4, the substrate SB is etched to form a cavity CV in the substrate SB (i.e., the cavity CV is formed in the cantilever structure 100), and a film layer FL and a block-like structure BK included in the substrate SB are correspondingly formed, the film layer FL covers the cavity CV (i.e., the film layer FL corresponds to the cavity CV and overlaps with the cavity CV in the direction Z), the block-like structure BK is disposed outside the film layer FL and directly connected to the film layer FL, and the first thickness T1 of the block-like structure BK is greater than the second thickness T2 of the film layer FL. For example, in FIG. 1, the film layer FL and the cavity CV can be surrounded by the block-like structure BK, but are not limited thereto. The film layer FL corresponds to the removed portion of the substrate SB in the direction Z, and the block-like structure BK is the unetched portion of the substrate SB.

[0026] 1 to 4, after forming the cavity CV, the film structure 110 and the anchor portion 120 included in the substrate SB are also formed correspondingly, the film structure 110 is fixed on the anchor portion 120 and covers the cavity CV (i.e., the film structure 110 corresponds to the cavity CV and overlaps with the cavity CV in the direction Z), and the anchor portion 120 is disposed outside the film structure 110. For example, in FIG. 1, the film structure 110 can be surrounded by the anchor portion 120, but is not limited thereto.

[0027] 1 to 4, a portion of the film structure 110 and the anchor portion 120 belong to the film layer FL (i.e., a portion of the film structure 110 and the anchor portion 120 are formed within the film layer FL), and another portion of the anchor portion 120 belongs to the block-shaped structure BK. It should be noted that the anchor portion 120 has a portion that belongs to the film layer FL and another portion that belongs to the block-shaped structure BK, and therefore the anchor portion 120 has two different thicknesses.

[0028] In the operation of the cantilever structure 100, the film structure 110 may be actuated to move and vibrate within the cavity CV, and the anchor portion 120 may be fixed. That is, the anchor portion 120 may be a fixed end (or a fixed edge) relative to the film structure 110 during the operation of the cantilever structure 100. In some embodiments, the film structure 110 may be actuated to move upwards and downwards, but is not limited thereto. In the present invention, the terms "move upwards" and "move downwards" refer to the film structure 110 moving substantially along the direction Z.

[0029] 1, the film structure 110 has only one anchor side 110a for fixing it on the anchor portion 120, and the other side of the film structure 110 is a non-anchor side. That is, the film structure 110 can be one cantilever.

[0030] In Fig. 1, the anchor portion 120 includes an anchor edge 120a, and an anchor side 110a of the film structure 110 is fixed onto the anchor edge 120a of the anchor portion 120, thereby fixing the film structure 110 onto the anchor portion 120. In Fig. 1, the anchor edge 120a of the anchor portion 120 is an edge of a block-shaped structure BK. That is, the anchor edge 120a of the anchor portion 120 is a boundary of the block-shaped structure BK having a first thickness T1.

[0031] As shown in FIGS. 1 to 4, the anchor portion 120 includes a block-shaped portion 122 and at least one protruding portion 124 protruding from the block-shaped portion 122 toward the cavity CV. The block-shaped portion 122 belongs to the block-shaped structure BK and has a first thickness T1. Each protruding portion 124 includes a first portion 124a and a second portion 124b directly connected to each other, the first portion 124a belongs to the block-shaped structure BK and has substantially the first thickness T1, and the second portion 124b belongs to the film layer FL and has a second thickness T2 substantially smaller than the first thickness T1 (i.e., in the film layer FL, the second portion 124b and the film structure 110 have substantially the same thickness). Please note that the anchor edge 120a of the anchor portion 120, which is the boundary of the block-shaped structure BK, is an edge having at least one protruding portion because at least one protrusion 124 is present (i.e., the anchor edge 120a of the anchor portion 120 is formed by the block-shaped portion 122 and the first portion 124a of the protrusion 124).

[0032] As shown in FIG. 1 and FIG. 4, the first portion 124a of the protrusion 124 is between the second portion 124b of the protrusion 124 and the block-shaped portion 122, and the second portion 124b of the protrusion 124 is between the first portion 124a of the protrusion 124 and the film structure 110. As shown in FIG. 1 and FIG. 4, the film structure 110 is directly connected (fixed) to the block-shaped portion 122 and the first portion 124a of the protrusion 124, and the film structure 110 is separated from the second portion 124b of the protrusion 124 so as not to be directly connected (fixed) to the second portion 124b of the protrusion 124. In some embodiments, in FIG. 1, the first portion 124a may project into the second portion 124b in a top view, and the projecting portion 124p of the first portion 124a projecting into the second portion 124b may not be directly connected to the film structure 110, but is not limited thereto.

[0033] Note that the protrusion 124 acts as an intermediate substrate connection that also provides an anchoring function, such that the distance between the cantilever tip and the anchor along the width direction is more uniform than would be the case in the absence of the protrusion 124, the intermediate substrate connection.

[0034] The shape of the protrusion 124 and the shape of the block-like portion 122 may be designed based on the requirement(s). The shape of the block-like portion 122 may be a suitable shape with a suitable hollow to form the cavity CV, and the suitable shape may be a polygon (e.g., rectangular), a shape with curved edges (e.g., circular, elliptical), or other suitable shape. Each of the shapes of the first portion 124a and the second portion 124b of the protrusion 124 may be a polygon (e.g., rectangular), a shape with curved edges (e.g., circular, elliptical), or other suitable shape. For example, in FIG. 1, the block-like portion 122 may be a rectangle with a rectangular hollow, the first portion 124a of the protrusion 124 may be a rectangle, and the combination of the second portion 124b of the protrusion 124 and the protrusion 124p of the first portion 124a may be a shape with two opposing straight edges and two opposing curved edges, but is not limited thereto.

[0035] In the present invention, the number of protrusions 124(s) can be designed based on requirement(s). In Fig. 1 and Fig. 2, the anchor portion 120 includes multiple protrusions 124, and the arrangement of the protrusions 124 can be designed based on requirement(s). For example, in Fig. 1 and Fig. 2, the anchor portion 120 includes, but is not limited to, seven protrusions 124 uniformly distributed on the anchor side 110a (anchor edge 120a of the anchor portion 120) of the film structure 110.

[0036] To form the aforementioned design of the film structure 110, the cantilever structure 100 includes at least one slit SL formed on and through the film layer FL to define the film structure 110 and the second portion 124b of the protrusion 124. In the present invention, the number of slit(s) SL can be adjusted based on the requirement(s), and the slit(s) SL can be located at any suitable position on the film layer FL and have any suitable top view pattern. For example, the slit SL can be a straight slit, a curved slit, a combination of straight slits, a combination of curved slits, or a combination of straight slit(s) and curved slit(s). For example, in this embodiment, the cantilever structure 100 can include multiple slits SL formed on the film layer FL.

[0037] 1, 3, and 4, the slits SL include a plurality of outer slits SL1 surrounding the film structure 110 such that the film structure 110 is separated from the anchor portion 120 on the non-anchor side. In FIG. 1, the film structure 110 is formed due to the presence of the outer slits SL1. For example, in FIG. 1, three outer slits SL1 are formed so as to surround the film structure 110, and each outer slit SL1 is a straight slit, but is not limited thereto.

[0038] In FIG. 1 and FIG. 4, the slit SL includes a plurality of inner slits SL2, and each inner slit SL2 is between the second portion 124b of the protrusion 124 and the film structure 110, such that the film structure 110 is separated from the second portion 124b of the protrusion 124 by the inner slits SL2. In FIG. 1, the second portion 124b of the protrusion 124 is formed due to the existence of the inner slits SL2, and one inner slit SL2 corresponds to one second portion 124b of the protrusion 124. For example, in FIG. 1, seven inner slits SL2 are formed on the film layer FL and penetrate the film layer FL, and each inner slit SL2 is a combination of straight slit(s) and curved slit(s). For example, in FIG. 1, two outer slits SL1 are respectively connected to two inner slits SL2, but this is not limited thereto.

[0039] According to the above configuration, in Fig. 1, the film structure 110 may include multiple sub-portions 112 separated by the protrusions 124 (in Fig. 1, the film structure 110 includes six sub-portions 112) such that one of the protrusions 124 and one of the inner slits SL2 is between adjacent two of the sub-portions 112. In Fig. 1, the sub-portions 112 are connected to each other (i.e., the sub-portions 112 are not separated from each other).

[0040] In the present invention, the size of the film structure 110 can be designed based on the requirement(s). In some embodiments, in FIG. 1, in order to maximize the use of MEMS components (e.g., MEMS chips) configured to form the cantilever structure 100 and formed by semiconductor processes, the length L of the film structure 110 in the direction Y may be smaller than the width W of the film structure 110 in the direction X. For example, but not limited to, the width W of the film structure 110 is greater than twice the length L of the film structure 110. It should be noted that the length L of the film structure 110 is the maximum distance between the anchor side 110a of the film structure 110 (or the anchor edge 120a of the anchor portion 120) and the free side of the film structure 110 in the direction Y (i.e., the distance between the anchor end and the free end of the cantilever), and the width W of the film structure 110 is the size of the film structure 110 perpendicular to the length L.

[0041] With respect to the film structure 110 (i.e., the cantilever), the resonant frequency, stiffness, and initial deflection of the film structure 110 are related to the length L of the film structure 110 (the length of the cantilever). For example, the resonant frequency of the film structure 110 is proportional to the length L of the film structure 110, and the stiffness of the film structure 110 is proportional to the cube of the length L of the film structure 110. In general, the length L of the film structure 110 changes due to manufacturing variations caused by the manufacturing process (e.g., the manufacturing variations are mask variations, alignment variations, etching variations, other variations, or a combination thereof), and the resonant frequency, stiffness, and initial deflection of the film structure 110 change due to the manufacturing variations. Furthermore, if the length L of the film structure 110 is smaller than the width W of the film structure 110, the changes in the resonant frequency, stiffness, and initial deflection of the film structure 110 will be further affected by the changes in the length L of the film structure 110.

[0042] In the present invention, since the protrusion 124 of the anchor portion 120 exists to divide the film structure 110 into a plurality of sub-portions 112, the film structure 110 will have less change in resonance frequency, stiffness, and initial deflection when the length L of the film structure 110 changes due to manufacturing variations. In some cases, the length of the protrusion 124 is increased or decreased accordingly with the increase or decrease in the length L of the film structure 110 (i.e., as the manufacturing variations occur at the anchor side 110a of the film structure 110), to reduce the change in the resonance frequency, stiffness, and initial deflection of the film structure 110 caused by the change in the length L of the film structure 110. Also, since the protrusion 124 has the second portion 124b, when the manufacturing variations cause manufacturing errors (e.g., size errors and / or shift errors) of the first portion 124a of the protrusion 124, the second portion 124b of the protrusion 124 serves as a buffer region to reduce the effect of this manufacturing error on the film structure 110.

[0043] In the film structure 110 of the present invention, the first ratio is the rate of change of the resonant frequency of the film structure 110 with respect to the length L of the film structure 110 (Δf / ΔL). The second ratio is the rate of change of the resonant frequency of the conventional film structure with respect to the length of the conventional film structure (Δf' / ΔL') in a conventional film structure without protrusions (i.e., conventional design). The first ratio is smaller than the second ratio. For example, the first ratio may be less than half of the second ratio, but is not limited thereto.

[0044] For example, in a comparison of a cantilever structure of an embodiment of the present invention (e.g., the cantilever structure 100 shown in Figures 1-4) with a conventional cantilever structure similar to this cantilever structure of the present invention but without the protrusion 124, the first ratio of the film structure 110 of the cantilever structure of the present invention may be 0.79 kHz / μm, the second ratio of the conventional film structure of the conventional cantilever structure may be 1.77 kHz / μm, and the ratio of the first ratio to the second ratio is 0.446 (i.e., the improvement provided by the protrusion(s) 124 of the present invention may be 55.4%), but is not limited thereto. It should be noted that this first ratio and second ratio are experimental data and these ratios are not limiting of the present invention.

[0045] The cantilever structure 100 may further include any suitable structure and / or component. In some embodiments, the acoustic component including the cantilever structure may be an acoustic transducer that generates acoustic waves, so that the cantilever structure 100 includes an actuator disposed on the film structure 110 and configured to actuate the film structure 110. For example, but not limited to, the actuator may be disposed on the film structure 110 in the direction Z.

[0046] The actuator has a monotonic electromechanical transduction function for the movement of the film structure 110 along the Z direction. In some embodiments, the actuator may include, but is not limited to, a piezoelectric actuator, an electrostatic actuator, a nanoscopic electrostatic drive (NED) actuator, an electromagnetic actuator, or any other suitable actuator. For example, in one embodiment, the actuator may include, but is not limited to, a piezoelectric actuator, which may include, for example, two electrodes and a piezoelectric material layer (e.g., lead zirconate titanate, PZT) disposed between the electrodes, which may actuate the film structure 110 based on a drive signal (e.g., a drive voltage and / or a drive voltage difference between the two electrodes) received by the electrodes. For example, in another embodiment, the actuator may include, but is not limited to, an electromagnetic actuator (such as a planar coil), which may actuate the film structure 110 based on a received drive signal (e.g., a drive current) and a magnetic field (i.e., the film structure 110 may be actuated by an electromagnetic force). For example, in yet another embodiment, the actuator may include, but is not limited to, an electrostatic actuator (such as a conductive plate) or an NED actuator, which may actuate the film structure 110 based on a received drive signal (e.g., a drive voltage) and an electrostatic field (i.e., the film structure 110 may be actuated by an electrostatic force).

[0047] The cantilever structure of the present invention is not limited to the above embodiment. Other embodiments of the present invention are described below. For ease of comparison, the same components are labeled with the same symbols below. In the following description, differences between the embodiments are described, and overlapping portions are omitted.

[0048] Referring to Fig. 5, Fig. 5 is a schematic diagram showing a cantilever structure according to a second embodiment of the present invention. As shown in Fig. 5, the slits SL of the cantilever structure 200 further include at least one dividing slit SL3 between two adjacent sub-portions 112 of the film structure 110 to separate the two adjacent sub-portions 112 of the film structure 110. In Fig. 5, the dividing slit SL3 corresponds to one protrusion 124. For example, one dividing slit SL3 is connected between one inner slit SL2 and one outer slit SL1 corresponding to the second portion 124b of one protrusion 124.

[0049] The number of the dividing slit(s) SL3 can be designed based on the requirement(s). For example, the slit SL includes, but is not limited to, five dividing slits SL3 to separate all the sub-portions 112 of the film structure 110 (e.g., six sub-portions 112 in FIG. 5).

[0050] In FIG. 5, the combination of the second portion 124b of the protrusion 124 and the protrusion 124p of the first portion 124a may be peach-shaped, and therefore the inner slit SL2 may be a combination of curved slits, but is not limited to this.

[0051] It should be noted that the cantilever structure of the present invention can be applied to an acoustic transducer, a sound generating device. Specifically, the cantilever structure of the present invention can be applied to an air pulse generating device as disclosed in U.S. Patent Application Nos. 17 / 553,806 and 18 / 321,759 filed by the applicant. The contents of Nos. 17 / 533,806 and 18 / 321,759 are incorporated herein by reference.

[0052] Reference is now made to Figure 6, which is a schematic diagram illustrating a device 60 according to one embodiment of the present invention. Device 60 may be a sound generating device or air pulse generating device, as disclosed in 18 / 321,759, that incorporates therein an intermediate substrate connection, protrusion 124. That is, unlike the device disclosed in 18 / 321,759, protrusion 124 (intermediate substrate connection) is included.

[0053] As shown in Figure 6, the device 60 includes cantilever structures 62a and 62b. The cantilever structures 62a and 62b may have a similar or identical structure to the cantilever structure shown in Figure 5, which is shown from different sides in Figures 7-9. The cantilever structures 62a, 62b include film structures 64a, 64b facing each other and separated by one outer slit SL1. The film structures 64a and 64b of the present invention can be considered as flaps of 18 / 321,759.

[0054] For the operating principle of the device 60, please refer to 17 / 533,806 and 18 / 321,759. As taught in 17 / 533,806 and 18 / 321,759, the film structure in the device 60 generates air waves (or air pressure fluctuations) that are amplitude modulated at an ultrasonic carrier frequency to form openings at an opening rate synchronized with the ultrasonic carrier frequency. The device 60 generates multiple air pulses at a pulse rate of the ultrasonic carrier frequency according to the amplitude modulated ultrasonic air pressure fluctuations. It is noted that the film structures 64a and 64b can be fabricated in a single fabrication layer.

[0055] Further, as taught in 18 / 321759, considering that the film structures 64a and 64b are fabricated in a single fabrication layer, the film structures 64a and 64b are actuated to perform common mode motion and differential mode motion, the common mode motion of the film structures 64a and 64b being to form ultrasonic air pressure fluctuations that are amplitude modulated at the ultrasonic carrier frequency, and the differential mode motion of the film structures 64a and 64b being to form openings at an opening rate synchronized with the ultrasonic carrier frequency.

[0056] For details of the operating principles, please refer to 17 / 533,806 and 18 / 321,759, briefly mentioned herein.

[0057] In the present invention, MEMS components having functions different from acoustic components may also have the cantilever structure of one of the above embodiments or a combination of the above embodiments. In some embodiments, the MEMS components may be oscillators, thermal transducers, optical transducers, inertial transducers, filters, radio frequency (RF) MEMS components, switches, or other suitable MEMS components.

[0058] In summary, the design of the present invention reduces the variation of several properties of the film structure (resonant frequency, stiffness, and initial deflection) as the length of the film structure changes due to manufacturing variations.

[0059] Those skilled in the art will readily recognize that numerous modifications and variations of the apparatus and method may be made while retaining the teachings of the present invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.

Claims

1. A cantilever structure, An anchor portion; A film structure; Including, the film structure covers a cavity and vibrates within the cavity; the length of the film structure is less than the width of the film structure; the anchor portion includes a plurality of protrusions protruding toward the cavity, and the film structure is fixed onto the anchor portion by the plurality of protrusions. Cantilever structure.

2. The cantilever structure of claim 1 further comprising a substrate, the cavity being formed in the substrate.

3. The cantilever structure of claim 2 , wherein the substrate is etched to form the cavity and the anchor portion having the plurality of protrusions.

4. The film structure is formed into a film layer, At least one slit is formed in the film layer so as to surround the film structure. The cantilever structure according to claim 1.

5. the film structure includes an anchor side secured over the anchor portion; The plurality of protrusions are evenly distributed on the anchor side. The cantilever structure according to claim 1.

6. The cantilever structure of claim 1 , wherein the width of the film structure is greater than twice the length of the film structure.

7. The cantilever structure of claim 1 , wherein each of the plurality of protrusions includes a first portion and a second portion, and a first thickness of the first portion is greater than a second thickness of the second portion.

8. The cantilever structure of claim 7 , wherein the film structure is directly connected to the first portion and the film structure is not directly connected to the second portion.

9. The cantilever structure of claim 7 , wherein the film structure is separated from the second portion by an internal slit between the second portion and the film structure.

10. The cantilever structure of claim 7 , wherein the second portion is between the first portion and the film structure.

11. 8. The cantilever structure of claim 7, wherein the anchor portion includes a block-shaped portion, the plurality of protrusions protrude from the block-shaped portion toward the cavity, and the first portion is between the second portion and the block-shaped portion.

12. The cantilever structure of claim 7 , wherein the first portion protrudes into the second portion in a top view.

13. The cantilever structure of claim 7 , wherein the second thickness of the second portion is the same as a thickness of the film structure.

14. The cantilever structure of claim 7, wherein the second portion and the film structure are formed in a film layer, and an inner slit between the second portion and the film structure is formed on the film layer.

15. The cantilever structure of claim 1 , wherein the film structure includes a plurality of sub-portions, and one of the plurality of protrusions is between adjacent two of the plurality of sub-portions.

16. The cantilever structure of claim 1 , wherein the film structure includes a plurality of sub-portions, and a slit is between adjacent two of the plurality of sub-portions, the slit corresponding to one of the plurality of protrusions.

17. An apparatus comprising: a first cantilever structure including a first film structure fixed on the anchor portion; a second cantilever structure including a second film structure fixed onto the anchor portion; Equipped with A cavity is formed in the device; the first film structure and the second film structure cover the cavity and vibrate within the cavity; a length of the first film structure is smaller than a width of the first film structure, and a length of the second film structure is smaller than a width of the second film structure; the anchor portion includes a plurality of protrusions protruding toward the cavity, the first film structure and the second film structure are fixed onto the anchor portion by the plurality of protrusions; the first film structure is adjacent and facing the second film structure; Device.

18. the device generates air pressure fluctuations that are amplitude modulated at an ultrasonic carrier frequency and creates apertures at an aperture rate synchronized with the ultrasonic carrier frequency; the device generating a plurality of air pulses at a pulse rate of the ultrasonic carrier frequency in accordance with the amplitude modulated ultrasonic air pressure fluctuations.

18. The apparatus of claim 17.

19. the first film structure and the second film structure are actuated to provide common mode motion and differential mode motion; the common mode motion is to form ultrasonic air pressure fluctuations that are amplitude modulated at the ultrasonic carrier frequency; the differential mode motion forms the aperture at an aperture rate synchronized with the ultrasonic carrier frequency.

20. The apparatus of claim 18.

20. 18. The device of claim 17, wherein the device is an air pulse generator.

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